TWI805633B - Circuit board processing method, processing device thereof, and circuit board holder used therefor - Google Patents

Abstract

[Problem] An object of the present invention is to improve the processing position accuracy when processing a circuit board such as a printed circuit board on which electronic components such as LSI are mounted. [Solution] In the circuit board processing method for processing the position designated by the processing position designation information of the circuit board carrying the electronic parts, it is characterized in that the overhead image of the electronic parts is read by a camera, and the image from the electronic parts is processed. The image data of the camera is used to obtain a reference position for processing the circuit board, and the position specified by the processing position designation information is processed based on the reference position. In addition, the circuit board processing device for processing a position designated by the processing position designation information of a circuit board on which electronic parts are placed is characterized by comprising: a camera for reading a bird's-eye view image of the electronic part; and an image A processing unit processes image data from the camera to obtain a reference position for processing the circuit board, and uses the reference position as a reference to process the position designated by the processing position designation information.

Description

Circuit board processing method, processing device thereof, and circuit board holder used therefor

The present invention relates to a circuit board processing method, its processing device and a circuit board holder used therefor. The circuit board processing method is used for processing circuit boards such as printed substrates carrying electronic parts such as LSI.

Conventionally, the drilling of a printed circuit board has been carried out by reading an alignment mark provided on a printed circuit board and using it as a reference, for example, by the method disclosed in Patent Document 1. However, in the method of drilling holes based on alignment marks, when drilling holes on a printed circuit board already carrying electronic parts, there is no guarantee that electronic parts will be mounted based on alignment marks. If the position of the hole deviates from the placement position of the electronic component, when the relationship between the actual position of the electronic component and the position of the hole becomes important, there will be a disadvantage that the accuracy of the machining position will deteriorate. [Prior art documents] [Patent documents]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-246660

[Problems to be Solved by the Invention] Therefore, the object of the present invention is to improve the accuracy of processing positions when processing circuit boards such as printed circuit boards on which electronic components such as LSIs are mounted.

[Technical Means to Solve the Problem] A representative substrate processing method disclosed in the present invention is a circuit board processing method for processing a position specified by processing position designation information of a circuit board on which electronic components are placed, and is characterized in that, Reading the overhead image of the electronic parts with a camera, processing the image data from the camera to obtain the reference position for the processing of the circuit board, using the reference position as a reference and specifying the processing position designated by the information position for processing.

In addition, a representative substrate processing apparatus disclosed in the present invention is a circuit board processing apparatus for processing a position designated by processing position designation information of a circuit board on which electronic components are placed, and is characterized in that it includes a camera that Reading the overhead image of the electronic component; and an image processing unit, which processes the image data from the camera and obtains a reference position for processing the circuit board; uses the reference position as a reference and calculates the processing position The position specified by the specified information is processed.

[Advantageous Effects of the Invention] According to the present invention, in the case of processing a circuit board such as a printed circuit board on which electronic components such as LSI are processed, the processing position accuracy can be improved.

Hereinafter, embodiments of the present invention will be described using the drawings.

(Embodiment 1) FIG. 4 is a configuration diagram of a laser drilling device as Embodiment 1 of the present invention. Each component or connection line mainly shows what is necessary for explaining this embodiment, and does not show all elements necessary as a laser drilling device. In the laser drilling device of FIG. 4 , the printed substrate 1 to be drilled is placed on the processing table 22, and the laser emitted by the laser oscillator 23 scans the galvanometer (GALVANO SCANNER) 24 deflected and irradiated onto the printed substrate 1 to open holes. 25 is a CCD camera for optically reading necessary parts from above. 27 is, for example, an overall control unit realized by a program-controlled processing device, which contains an image processing unit for image processing and necessary detection of the read data from the CCD camera 25, and controls the processing table according to the processing program 22. Actions of the laser oscillator 23 and the scanning galvanometer 24. The overall control unit 27 is composed of, for example, a program-controlled processing device, and each component or connection line therein is a logical object. In addition, parts of each component may be provided separately from the overall control unit 27 .

1 is a diagram for explaining processing according to Example 1 of the present invention, (a) is a top view of a printed circuit board after drilling processing, and (b) is an AA cross-sectional view of (a). In FIG. 1, 1 is a printed circuit board as a circuit board on which an electronic wiring network is formed, and an LSI 2 is carried thereon. The shape of this LSI 2 is a square when viewed from above. On the printed substrate 1, holes 4A-4F are drilled by the laser drilling device shown in FIG. And it is used for, for example, electrical connection between the printed substrate 1 and other components.

The machining of the holes 4A to 4F is performed as follows. The coordinates of the approximate placement position of the LSI2 are pre-registered in the laser drilling device, and based on this, the processing table 22 is relatively moved to a position where the CCD camera 25 can read the top view image of the LSI2. Next, the overhead image of the LSI 2 is read by the CCD camera 25 , and the image data is sent to the image processing unit 26 . In the image processing unit 26, the center of gravity of the area is calculated from the image data, and the coordinates of the center 5 of the LSI 2 can be obtained. In addition, although the center 5 of the LSI 2 is obtained from the center of gravity of the area of the bird's-eye view image, it is not limited to this method as long as the center can be obtained.

Processing position specifying information on which position of the printed circuit board 1 should be processed is stored in advance in the overall control unit 27 as processing data. This processing position designation information becomes coordinate information which shows the relative position of the holes 4A-4F with respect to the center 5. As shown in FIG. Then, with the coordinates of the center 5 as a reference, the processing table 22 moves relative to the laser irradiation system based on the coordinate information of the holes 4A-4F, and irradiates lasers at various positions to drill the holes 4A-4F.

According to the first embodiment above, since the holes 4A-4F can be processed based on the actual placement position of the LSI2, when the positional relationship between the actual placement position of the LSI2 and the holes 4A-4F is important, the holes 4A-4F will be raised. machining position accuracy.

(Example 2) FIG. 2 is a diagram for explaining processing according to Example 2 of the present invention, (a) is a plan view of a printed circuit board after drilling, and (b) is a cross-sectional view along line AA of (a). In FIG. 2 , the same symbols as those in FIG. 1 represent the same ones as in FIG. 1 . The difference from Embodiment 1 in FIG. 1 lies in that four LSI2 are carried. When processing the printed substrate 1 , the coordinates of the approximate placement positions of each LSI2 are pre-registered in the laser drilling device, and the top-view images of each LSI2 are read by the CCD camera 25 . In the video processing unit 26, the coordinates of the center 6 of each LSI 2 are obtained, and the coordinates of the center 7 among them are also obtained.

The coordinate information representing the relative positions of the holes 4A to 4F with respect to the center 7 is the same as in the first embodiment, and is stored in advance as processing data in the laser drilling device. Then, with the coordinates of the center 7 as a reference, the processing table 22 moves relative to the laser irradiation system based on the coordinate information of the holes 4A-4F, and irradiates lasers at various positions to drill through the holes 4A-4F.

(Embodiment 3) FIG. 3 is a view for explaining processing according to Embodiment 3 of the present invention, showing a top view of a printed circuit board before contour processing. In FIG. 3 , the same symbols as those in FIG. 1 represent the same ones as in FIG. 1 . 8 is a cutting line for changing the shape of the printed circuit board 1, that is, so-called contouring.

The cutting line 8 is processed as follows. The coordinates of the center 5 of the LSI 2 can be obtained in the same manner as in the embodiment of FIG. 1 . The coordinate information indicating the relative position of the cutting line 8 with respect to the center 5 is the same as that of the first embodiment, and is stored in advance in the laser drilling device as processing data. Then, with the coordinates of the center 5 as a reference, the processing table 22 moves relative to the laser irradiation system based on the coordinate information of the cutting line 8, and irradiates lasers at various positions to cut off the printed material at the position of the cutting line 8. substrate1.

According to the third embodiment above, because the contour processing can be performed based on the actual placement position of the LSI2, when the positional relationship between the actual placement position of the LSI2 and the cutting line 8 is important, the processing position of the cutting line 8 will be raised. Accuracy.

(Embodiment 4) Depending on the electronic components mounted on the substrate, there may be cases where the accuracy is improved when the electronic components are processed for the purpose of being in an operational state, and this case will be described as Embodiment 4 below. As shown in FIG. 5 , a substrate holder 28 on which a plurality of printed substrates 1 carrying electronic components are placed side by side in a planar manner is mounted on the processing table 22 . When the substrate holder 28 processes the printed substrates 1 one by one, the control signal given by the overall control unit 27 only supplies power to the electronic components carried by the printed substrate 1 being processed so that it is in an operating state. And when the processing is finished, the power supply is stopped so that the electronic parts are in a non-operating state.

When the electronic component is a light-emitting element such as an LED, the current supply to the LED carried on the printed circuit board 1 under processing is turned on, and the top-view image in the LED-light-emitting state is read by the CCD camera 25 . In this case, the number of LEDs carried on each printed substrate 1 can be one or more. In the latter case, the image processing unit 26 processes the overall overhead image of these multiple LED groups, for example, can also detect the center position .

As mentioned above, although this invention was concretely demonstrated based on embodiment, this invention is not limited to the said embodiment, It is clear that various changes can be made in the range which does not exceed the gist, and various modification examples are included. For example, although the case of processing with a laser has been described, it is not necessary to use a laser for cutting in drilling or contour processing, and other processing tools such as a drill may also be used. In addition, the positions and numbers of the holes can be arbitrary, and the holes can be used for constructing circuits in the substrate, or for fixing the substrate to other structures, and the usage is not limited.

1‧‧‧Printed substrate 2‧‧‧LSI4A～4F‧‧‧holes 5, 6, 7‧‧‧center 8‧‧‧cutting line 9‧‧‧LED22‧‧‧processing table 23‧‧‧laser oscillation Device 24‧‧‧Scanner 25‧‧‧CCD Camera 26‧‧‧Image Processing Unit 27‧‧‧Overall Control Unit 28‧‧‧Substrate Holder

1 is a diagram for explaining processing according to Example 1 of the present invention, (a) is a top view of a printed circuit board after drilling processing, and (b) is an AA cross-sectional view of (a). 2 is a diagram for explaining processing according to Example 2 of the present invention, (a) is a top view of a printed circuit board after drilling processing, and (b) is a BB sectional view of (a). Fig. 3 is a diagram for explaining processing according to Embodiment 3 of the present invention, showing a top view of a printed substrate before contour processing. Fig. 4 is a structural diagram of a laser drilling device as Embodiment 1 of the present invention. Fig. 5 is a structural diagram of a laser drilling device as Embodiment 4 of the present invention.

1‧‧‧Printed Substrate

2‧‧‧LSI (large scale integration, large integrated circuit)

4A~4F‧‧‧hole

5‧‧‧center

Claims (6)

A circuit board processing method for processing a position designated by the processing position designation information of a circuit board carrying electronic parts, characterized in that a camera is used to read the overhead image of the electronic part, and the image data from the camera is processed and Finding a reference position for processing the circuit board, using the reference position as a reference, and processing the position designated by the processing position designation information, wherein the center of the overhead image of the electronic component is used as the reference position, when a plurality of the electronic components are carried on the same surface of the circuit board, the center of the centers of the individual top-view images of the plurality of electronic components carried on the same surface is used as the reference position . The circuit board processing method described in Claim 1, wherein the electronic component is capable of emitting light, and the camera reads a bird's-eye view image of the electronic component in a luminous state. The circuit board processing method described in claim 2 of the patent application, wherein when processing a plurality of circuit boards sequentially, the electronic components are sequentially turned into a light-emitting state for each circuit board. A circuit board processing device for processing a position designated by processing position designation information of a circuit board carrying electronic parts, characterized by comprising: a camera for reading a bird's-eye view image of the electronic parts; and an image processing unit, It processes the image data from the camera and obtains a reference position for processing the circuit board; uses the reference position as a reference and processes the position specified by the processing position designation information, wherein the image processing The part uses the center of the overhead image of the electronic component as the reference position to detect, and when multiple electronic parts are carried on the same surface of the circuit board, the image processing part is carried on the The center among the centers of individual overhead images of the plurality of electronic components on the same surface is detected as the reference position. The circuit board processing device as described in claim 4 of the patent application, wherein the electronic component is capable of emitting light, and the camera reads a top view image of the electronic component in a luminous state. A circuit board holder used in the circuit board processing device described in item 4 of the scope of the patent application, which is characterized in that a plurality of the circuit boards carrying the electronic components capable of emitting light are placed side by side, and the circuit board The board holder has a power supply control function, and when it is mounted on a processing table of a processing device for processing the circuit boards and sequentially processes each of the circuit boards, the power supply control function is used to make the The electronic components are sequentially brought into a light-emitting state for each circuit board.

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