JP6199585B2 - Laser light irradiation apparatus and optical member bonding body manufacturing apparatus - Google Patents

Description

The present invention relates to a laser beam irradiation apparatus and an apparatus for manufacturing an optical member bonded body.

  Conventionally, in a production system for an optical display device such as a liquid crystal display, an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is formed from a long film into a sheet piece having a size matching the display area of the liquid crystal panel. After being cut out, it is bonded to a liquid crystal panel (for example, see Patent Document 1).

JP 2003-255132 A

  When bonding an optical member to a liquid crystal panel, the positions of the four corners of the liquid crystal panel are detected using an illumination device and a camera, and the liquid crystal panel and the optical member are aligned. Since the size of the liquid crystal panel for television is determined by the standard, the lighting device and the camera are also fixed at a predetermined position according to the size. However, recently, with the widespread use of smartphones and tablet terminals, various liquid crystal panels with different sizes and shapes have been produced, and the demand for producing these liquid crystal panels on the same line has increased. . In that case, it is necessary to replace the lighting device and the camera for each size of the liquid crystal panel, resulting in a decrease in productivity.

  The present invention has been made in view of such circumstances, and a detection device and a laser capable of illuminating an object brightly even when the size of the object changes and suppressing a decrease in productivity It aims at providing the manufacturing apparatus of a light irradiation apparatus and an optical member bonding body.

(1) A laser beam irradiation apparatus according to the first aspect of the present invention includes a table having a holding surface that holds an object, a laser beam oscillator that oscillates laser light, and a plane parallel to the holding surface. A scanner that performs biaxial scanning with the laser light; an illumination device that illuminates the object; a first movement device that relatively moves the table and the illumination device; and a second that relatively moves the table and the scanner. It includes a moving device, an imaging device that images the object, and a third moving device that relatively moves the table and the imaging device .

( 2 ) In the laser beam irradiation apparatus according to (1) , the object is rectangular when viewed from the normal direction of the holding surface, and the table has an opening at a position corresponding to a corner of the object. The lighting device is disposed on the side opposite to the holding surface of the table, and the lighting device opens the corner from the side opposite to the holding surface of the table. You may illuminate through a part.

( 3 ) In the laser beam irradiation apparatus according to ( 2 ), the first moving device is configured such that when the laser beam oscillator is oscillating the laser beam, the illumination device is set to a normal line of the holding surface. You may retract | save to the position which does not overlap with the said opening part seeing from a direction.
(4) The laser beam irradiation apparatus according to the first aspect of the present invention includes a table having a holding surface that holds an object, a laser beam oscillator that oscillates laser light, and a plane parallel to the holding surface. A scanner that performs biaxial scanning with the laser light; an illumination device that illuminates the object; a first movement device that relatively moves the table and the illumination device; and a second that relatively moves the table and the scanner. The object is rectangular when viewed from the normal direction of the holding surface, and an opening is formed in the table at a position corresponding to a corner of the object. The apparatus is arranged on the side opposite to the holding surface of the table, and the lighting device illuminates the corner from the side opposite to the holding surface of the table through the opening. And
(5) In the laser beam irradiation apparatus according to (4), the first moving device is configured such that when the laser beam oscillator is oscillating the laser beam, the illumination device is set to a normal line of the holding surface. You may retract | save to the position which does not overlap with the said opening part seeing from a direction.

( 6 ) In the laser beam irradiation apparatus according to any one of (1) to ( 5 ), the holding surface includes a first holding surface and a first holding surface disposed adjacent to the first holding surface. The lighting device extends in an adjacent direction in which the first holding surface and the second holding surface are adjacent to each other, and the first moving device moves the lighting device to the You may move to the direction orthogonal to an adjacent direction.

( 7 ) In the laser light irradiation device according to ( 6 ), the illumination device includes a first illumination device and a second illumination device arranged alongside the first illumination device in a direction orthogonal to the adjacent direction. And may be included.
(8) The laser beam irradiation apparatus according to the first aspect of the present invention includes a table having a holding surface that holds an object, a laser beam oscillator that oscillates laser light, and a plane parallel to the holding surface. A scanner that performs biaxial scanning with the laser light; an illumination device that illuminates the object; a first movement device that relatively moves the table and the illumination device; and a second that relatively moves the table and the scanner. The holding surface includes a first holding surface and a second holding surface disposed adjacent to the first holding surface, and the lighting device includes the first holding surface. And the second holding surface extend in an adjacent direction, and the first moving device moves the illumination device in a direction orthogonal to the adjacent direction.
(9) In the laser light irradiation device according to (8), the illumination device includes a first illumination device and a second illumination device arranged side by side with the first illumination device in a direction orthogonal to the adjacent direction. And may be included.

( 10 ) The laser light irradiation device according to any one of (1) to ( 9 ) includes a condensing lens that condenses the laser light emitted from the scanner toward the holding surface. May be.

( 11 ) The manufacturing apparatus of the optical member bonding body which concerns on the 1st aspect of this invention is a manufacturing apparatus of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: The said optical display component concerned A bonding apparatus that forms a sheet piece bonded body by bonding a sheet piece of a size that protrudes outside the optical display component, and an end of a bonding surface between the optical display component and the sheet piece of the sheet piece bonded body A cutting device that cuts off the sheet piece of the portion that protrudes from the sheet piece bonding body to the outside of the bonding surface along the edge, and forms the optical member having a size corresponding to the bonding surface; The cutting device is configured by the laser light irradiation device according to any one of (1) to ( 10 ), and the sheet piece that is an object by the laser light irradiated from the laser light irradiation device. Is disconnected It is characterized by that.

ADVANTAGE OF THE INVENTION According to this invention, while the size of a target object changes, while being able to illuminate a target object brightly, the manufacturing apparatus of the laser beam irradiation apparatus and optical member bonding body which can suppress a productivity fall are provided. be able to.

It is a top view which shows the laser beam irradiation apparatus which concerns on one Embodiment of this invention. It is a top view which shows the arrangement | positioning relationship between a laser beam irradiation apparatus and a conveyor. It is a perspective view which shows a laser beam irradiation apparatus. It is a top view which shows a table. It is a top view which shows an illuminating device and a 1st moving apparatus. It is a top view which shows the illumination position of an illuminating device, and the imaging position of an imaging device. It is a top view which shows the evacuation position of an illuminating device and an imaging device. It is a top view which shows the illumination position of an illuminating device in case the size of a target object is large, and the imaging position of an imaging device. It is a top view which shows the evacuation position of an illuminating device and an imaging device in case the size of a target object is large. It is a top view which shows the 1st modification of the table which concerns on this embodiment. It is a schematic diagram which shows the manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention. It is a top view of a liquid crystal panel. It is AA sectional drawing of FIG. It is sectional drawing of an optical sheet. It is a figure which shows operation | movement of a cutting device. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows the control method for a laser beam to draw a desired locus | trajectory.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

  In all the drawings below, the dimensions and ratios of the respective constituent elements are appropriately changed in order to make the drawings easy to see. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

(Laser beam irradiation device)
FIG. 1 is a plan view showing an example of a laser beam irradiation apparatus 100 used as an object cutting apparatus.

  In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the direction parallel to the holding surface that holds the object is defined as the X direction, and the direction orthogonal to the first direction (X direction) in the plane of the holding surface is the Y direction, the X direction, and the Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

  As shown in FIG. 1, a laser beam irradiation apparatus 100 includes a table 101, a laser beam oscillator 102, a scanner 105, an illumination device 103, an imaging device 109, a first moving device 104, and a second moving device. 106 (see FIG. 2), a third moving device 190, and a control device 107 (see FIG. 3) that performs overall control of these devices.

  A plurality of tables 101 (for example, three in this embodiment) are arranged side by side in the Y direction. The table 101 has a holding surface 101 s that holds the object 110. The table 101 is rectangular when viewed from the normal direction of the holding surface 101s. The holding surface 101s is a rectangular first holding surface 101s1 having a length in the first direction (X direction), and a second holding member that is disposed adjacent to the first holding surface 101s1 and has the same shape as the first holding surface 101s1. Surface 101s2.

  The object 110 is rectangular when viewed from the normal direction of the holding surface 101 s, and an opening 113 is formed in the table 101 at a position corresponding to the corner of the object 110. In each of the first holding surface 101s1 and the second holding surface 101s2, openings 113 are formed at positions corresponding to the four corners of the object 110, and four openings 113 are arranged. In the central table 101 among the three tables 101 arranged side by side in the Y direction, the opening 113 is not shown for convenience, and the imaging device 109 and the third moving device 190 above the table 101 are omitted. The illustration is also omitted.

The laser beam oscillator 102 is a member that oscillates the laser beam L. For example, as the laser beam oscillator 102, a CO ₂ laser beam oscillator (carbon dioxide laser beam oscillator), a UV laser beam oscillator, a semiconductor laser beam oscillator, a YAG laser beam oscillator, an excimer laser beam oscillator, etc. Although an oscillator can be used, a specific configuration is not particularly limited. Among the above-described oscillators, a CO ₂ laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for cutting an optical member such as a polarizing film.

  FIG. 2 is a plan view showing the positional relationship between the laser beam irradiation apparatus 100 and the conveyors (the first conveyor 115 and the second conveyor 116). In FIG. 2, for convenience, the table 101 is indicated by a broken line, and the second moving device 106 is indicated by a solid line.

  As shown in FIG. 2, a first conveyor 115 and a second conveyor 116 are provided along the arrangement direction of the plurality of tables 101. The first conveyor 115 and the second conveyor 116 are arranged to face each other across the plurality of tables 101.

  The first conveyor 115 conveys the object 110 from the −Y direction side toward the + Y direction side or from the + Y direction side toward the −Y direction side. The object 110 conveyed by the first conveyor 115 is placed on the holding surface 101s by a delivery mechanism (not shown).

  The object 110 that has been subjected to a predetermined process on the holding surface 101s is placed on the second conveyor 116 by a delivery mechanism (not shown). The second conveyor 116 conveys the object 110 delivered by a delivery mechanism (not shown) from the −Y direction side to the + Y direction side or from the + Y direction side to the −Y direction side. The object 110 conveyed by the second conveyor 116 is led to the next process.

  FIG. 3 is a perspective view showing the laser beam irradiation apparatus 100. In FIG. 3, for convenience, one imaging device 109 among the plurality of imaging devices 109 is illustrated.

  As shown in FIG. 3, the scanner 105 performs biaxial scanning of laser light in a plane parallel to the holding surface 101s (in the XY plane). That is, the scanner 105 moves the laser light relative to the table 101 independently in the X direction and the Y direction. Thereby, it is possible to accurately irradiate the laser beam to an arbitrary position of the object 110 held on the table 101.

  The scanner 105 includes a first irradiation position adjustment device 151 and a second irradiation position adjustment device 154.

  The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 constitute a scanning element that biaxially scans the laser light emitted from the laser light oscillator 102 in a plane parallel to the holding surface 101s. As the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154, for example, a galvano scanner is used. The scanning element is not limited to a galvano scanner, and a gimbal can be used.

  The first irradiation position adjustment device 151 includes a mirror 152 and an actuator 153 that adjusts the installation angle of the mirror 152. The actuator 153 has a rotation axis parallel to the Z direction. The actuator 153 rotates the mirror 152 around the Z axis based on the control of the control device 107.

  The second irradiation position adjustment device 154 includes a mirror 155 and an actuator 156 that adjusts the installation angle of the mirror 155. The actuator 156 has a rotation axis parallel to the Y direction. The actuator 156 rotates the mirror 155 around the Y axis based on the control of the control device 107.

  On the optical path between the scanner 105 and the table 101, a condensing lens 108 that condenses the laser light passing through the scanner 105 toward the holding surface 101s is disposed.

  For example, as the condenser lens 108, an fθ lens is used. Thereby, the laser beam emitted in parallel to the condenser lens 108 from the mirror 155 can be condensed in parallel to the object 110.

  Note that the condensing lens 108 may not be disposed on the optical path between the scanner 105 and the table 101.

  The laser beam L oscillated from the laser beam oscillator 102 is applied to the object 110 held on the table 101 via the mirror 152, the mirror 155, and the condenser lens 108. The first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 are configured to control the laser light emitted from the laser light oscillator 102 toward the object 110 held on the table 101 based on the control of the control device 107. Adjust the irradiation position.

  A laser beam processing region 105s (hereinafter referred to as a scan region) controlled by the scanner 105 is rectangular when viewed from the normal direction of the holding surface 101s. In the present embodiment, the area of the scan region 105s is smaller than the areas of the first holding surface 101s1 and the second holding surface 101s2.

  As shown in FIG. 1, the illumination device 103 is disposed on the opposite side of the holding surface 101 s of the table 101. The illumination device 103 extends in an adjacent direction (Y direction) in which the first holding surface 101s1 and the second holding surface 101s2 are adjacent to each other. The illuminating device 103 illuminates the corner of the object 110 from the side opposite to the holding surface 101 s of the table 101 through the opening 113.

  The imaging device 109 is disposed above the holding surface 101 s of the table 101. A plurality of imaging devices 109 (for example, four in one embodiment, per one first holding surface 101s1 or second holding surface 101s2) are arranged. The imaging device 109 is disposed at a position corresponding to each opening 113 in each of the first holding surface 101s1 and the second holding surface 101s2. The imaging device 109 captures an image of a corner portion of the target object 110.

  The first moving device 104 relatively moves the table 101 and the lighting device 103. The first moving device 104 includes a first slider mechanism 141 that moves the illumination device 103 in a direction (X direction) orthogonal to the adjacent direction of the first holding surface 101s1 and the second holding surface 101s2, a second slider mechanism 144, Have The first moving device 104 operates the motor built in each of the first slider mechanism 141 and the second slider mechanism 144 to move the illumination device 103 in the X direction.

  As shown in FIG. 3, the second moving device 106 moves the table 101 and the scanner 105 relative to each other. The second moving device 106 moves the table 101 in a first direction (X direction) parallel to the holding surface 101s, and the first slider mechanism 161 is parallel to the holding surface 101s and in the first direction. And a second slider mechanism 162 that moves in a second direction (Y direction) orthogonal to the first direction. The second moving device 106 operates the linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162 to move the table 101 in each direction of XY.

  The linear motor that is pulse-driven in the slider mechanism can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Therefore, the position of the table 101 supported by the slider mechanism in each direction of XY can be controlled with high accuracy. Note that the position control of the table 101 is not limited to the position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.

  The third moving device 190 relatively moves the table 101 and the imaging device 109. The third moving device 190 moves the imaging device 109 in each of a first direction (X direction) parallel to the holding surface 101s and a second direction (Y direction) parallel to the holding surface 101s and orthogonal to the first direction. Move in the direction. The third moving device 190 has a built-in motor, and the imaging device 109 is moved in the X direction by operating this motor.

  The control device 107 controls the laser control unit 171 that controls the laser beam oscillator 102, the scanner control unit 172 that controls the scanner 105, the first moving device 104, the second moving device 106, and the third moving device 190. A movement control unit 173.

Specifically, the laser control unit 171 controls ON / OFF of the laser beam oscillator 102 and the output of the laser beam oscillated from the laser beam oscillator 102.
The scanner control unit 172 controls the driving of the actuator 153 of the first irradiation position adjusting device 151 and the driving of the actuator 156 of the second irradiation position adjusting device 154.
The movement control unit 173 operates the motor built in each of the first slider mechanism 141 and the second slider mechanism 144, operates the linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162, and performs the third movement. Each operation of the motor built in the device 190 is controlled.

  The control device 107 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the laser light irradiation device 100, or may be connected to the display device.

  When the initial setting is completed, the motors provided in the slider mechanisms 141 and 144 (see FIG. 1) and the motor provided in the third moving device 190 operate based on the control of the movement control unit 173 of the control device 107. Accordingly, both the illumination device 103 and the imaging device 109 are moved to a position overlapping the opening 113 (see FIG. 1) when viewed from the normal direction of the holding surface 101s. Therefore, both the illumination device 103 and the imaging device 109 are arranged at a position that matches the size of the object 110.

  Next, based on the control of the movement control unit 173 of the control device 107, the motors provided in the slider mechanisms 141 and 144 (see FIG. 1) and the motor provided in the third moving device 190 operate. Thereby, both the illumination device 103 and the imaging device 109 are retracted to a position that does not overlap with the opening 113 (see FIG. 1) when viewed from the normal direction of the holding surface 101s.

  Thereafter, laser light is oscillated from the laser light oscillator 102 based on the control of the laser control unit 171 of the control device 107. At this time, based on the control of the scanner control unit 172 of the control device 107, rotation driving of the mirrors constituting the scanner 105 is started. At the same time, based on the control of the movement control unit 173 of the control device 107, the rotational speed of a drive shaft such as a motor provided in the slider mechanisms 161 and 162 is detected by a sensor such as a rotary encoder.

  The control device 107 corrects each coordinate value in real time so that the laser light is emitted at coordinates that match the machining data, that is, the laser light draws a desired locus on the object 110 (see FIG. 1). As described above, the second moving device 106 and the scanner 105 are controlled. For example, the scanning of the laser beam is mainly performed by the second moving device 106, and an area where the irradiation position of the laser light cannot be controlled with high accuracy by the second moving device 106 is adjusted by the scanner 105.

FIG. 4 is a plan view showing the table 101.
As shown in FIG. 4, the table 101 includes a plate 112 that sucks and holds the object 110 and a base 111 that holds the plate 112.

  The plate 112 is rectangular in plan view, and the size of the plate 112 is the same as the size of the holding surface 101s. The plate 112 is detachably fixed to the base 111. The plate 112 has a suction surface 112 s that sucks the object 110. A plurality of (for example, two in this embodiment) objects 110 are held by suction on the plate 112. For example, the forming material of the plate 112 can be a metal such as aluminum (Al), iron (Fe), stainless steel (SUS).

  A rectangular frame-shaped guide groove 117 is formed in the plate 112 along the outer peripheral edge of the suction surface 112s. The guide groove 117 is a recess that receives the laser light oscillated from the laser light oscillator 102. The outer peripheral edge of the guide groove 117 is larger than the outer peripheral edge of the object 110. The outer peripheral edge of the object 110 is disposed between the outer peripheral edge of the suction surface 112 s and the outer peripheral edge of the guide groove 117. By irradiating the laser beam onto the guide groove 117, it is possible to suppress the irregular reflection of the laser beam on the holding surface 101s.

  The first holding surface 101s1 has four openings 113 (first opening 113a, second opening 113b, third opening 113c, and fourth opening 113d at positions corresponding to the four corners of the object 110. ) Is formed. The first opening 113 a is disposed at the upper right corner of the object 110. The second opening 113b is disposed at the upper left corner of the object 110. The third opening 113 c is disposed at the lower left corner of the object 110. The fourth opening 113 d is disposed at the lower right corner of the object 110.

  Distance Wa1 between the edge on the + Y direction side of the first opening 113a and the edge on the −Y direction side of the second opening 113b (hereinafter, the outermost width of the first opening 113a and the second opening 113b) Is a distance Wa2 between the edge on the −Y direction side of the third opening 113c and the edge on the + Y direction side of the fourth opening 113d (hereinafter referred to as the third opening 113c and the fourth opening). Is generally equal to the outermost width of 113d).

  The second holding surface 101s2 has four openings 113 (fifth opening 113e, sixth opening 113f, seventh opening 113g, and eighth opening 113h) at positions corresponding to the four corners of the object 110. ) Is formed. The fifth opening 113e is disposed at the upper right corner of the object 110. The sixth opening 113 f is disposed at the upper left corner of the object 110. The seventh opening 113g is disposed at the lower left corner of the object 110. The eighth opening 113h is disposed at the lower right corner of the object 110.

  The distance Wa3 between the edge on the + Y direction side of the fifth opening 113e and the edge on the −Y direction side of the sixth opening 113f (hereinafter, the outermost width of the fifth opening 113e and the sixth opening 113f) Is a distance Wa4 between the edge of the seventh opening 113g on the −Y direction side and the edge of the eighth opening 113h on the + Y direction side (hereinafter referred to as the seventh opening 113g and the eighth opening). Is generally equal to the outermost width of 113h).

  The suction surface 112s includes a first suction surface 112s1 formed at the center of the first holding surface 101s1 and a second suction surface 112s2 formed at the center of the second holding surface 101s2. A plurality of suction holes 112h are formed in each of the first suction surface 112s1 and the second suction surface 112s2.

  A suction hole 114 (see FIG. 5) for sucking the object 110 through a plurality of suction holes 112h is formed on the side opposite to the holding surface 101s of the plate 112. Only one suction hole 114 is disposed between the first suction surface 112s1 and the second suction surface 112s2. Note that the number of the suction holes 114 is not limited to one and may be plural.

  Each of the first suction surface 112s1 and the second suction surface 112s2 is rectangular in plan view. The size of each of the first suction surface 112s1 and the second suction surface 112s2 is smaller than the size of the object 110. The four corners of the first suction surface 112s1 are arranged at positions corresponding to the four openings 113 (first opening 113a, second opening 113b, third opening 113c, and fourth opening 113d). Yes. The four corners of the second suction surface 112s2 are arranged at positions corresponding to the four openings 113 (the fifth opening 113e, the sixth opening 113f, the seventh opening 113g, and the eighth opening 113h). Yes.

  The base 111 is rectangular in plan view, and the size of the base 111 is larger than the size of the plate 112. For example, the length of the base 111 in the lateral direction (length in the X direction) is about 350 mm, and the length in the longitudinal direction (length in the Y direction) is about 450 mm. The lighting device 103 and the first moving device 104 are arranged inside the base 111 (see FIG. 5). The arrangement configuration of the illumination device 103 is configured to illuminate an object having a size of 4 inches to 10 inches.

FIG. 5 is a plan view showing the illumination device 103 and the first moving device 104.
As illustrated in FIG. 5, the lighting device 103 includes a first lighting device 131 and a second lighting device 135 arranged alongside the first lighting device 131 in the X direction with the suction hole 114 interposed therebetween. Each of the first lighting device 131 and the second lighting device 135 extends in the Y direction.

  The first lighting device 131 includes a first light source 132, a second light source 133 that is arranged alongside the first light source 132 in the Y direction, and a holding unit 134 that holds the first light source 132 and the second light source 133. Have.

  As shown in FIGS. 4 and 5, the first light source 132 has the first opening 113a and the corner of the object 110 sucked and held on the first suction surface 112s1 from the side opposite to the first holding surface 101s1. Illuminate through the second opening 113b. The length La1 in the longitudinal direction of the first light source 132 is larger than the outermost width Wa1 of the first opening 113a and the second opening 113b. In addition, from the viewpoint of appropriately illuminating the corners of the object 110, the length La1 in the longitudinal direction of the first light source 132 may be approximately equal to the outermost width Wa1 of the first opening 113a and the second opening 113b. Good.

  The second light source 133 illuminates the corner portion of the object 110 sucked and held on the second suction surface 112s2 through the fifth opening 113e and the sixth opening 113f from the side opposite to the second holding surface 101s2. . The length La2 in the longitudinal direction of the second light source 133 is larger than the outermost width Wa3 of the fifth opening 113e and the sixth opening 113f. From the viewpoint of appropriately illuminating the corner of the object 110, the length La2 of the second light source 133 in the longitudinal direction may be approximately equal to the outermost width Wa3 of the fifth opening 113e and the sixth opening 113f. Good.

  As shown in FIG. 5, the second lighting device 135 holds a third light source 136, a fourth light source 137 arranged alongside the third light source 136 in the Y direction, and the third light source 136 and the fourth light source 137. Holding part 138.

  As shown in FIGS. 4 and 5, the third light source 136 has the third opening 113c and the corner of the object 110 sucked and held on the first suction surface 112s1 from the side opposite to the first holding surface 101s1. Illuminate through the fourth opening 113d. The length Lb1 in the longitudinal direction of the third light source 136 is larger than the outermost width Wa2 of the third opening 113c and the fourth opening 113d. From the viewpoint of appropriately illuminating the corner of the object 110, the length Lb1 in the longitudinal direction of the third light source 136 may be approximately equal to the outermost width Wa2 of the third opening 113c and the fourth opening 113d. Good.

  The fourth light source 137 illuminates the corner portion of the object 110 sucked and held on the second suction surface 112s2 via the seventh opening 113g and the eighth opening 113h from the side opposite to the second holding surface 101s2. . The length Lb2 in the longitudinal direction of the fourth light source 137 is larger than the outermost width Wa4 of the seventh opening 113g and the eighth opening 113h. From the viewpoint of appropriately illuminating the corner of the object 110, the length Lb2 of the fourth light source 137 in the longitudinal direction may be approximately equal to the outermost width Wa4 of the seventh opening 113g and the eighth opening 113h. Good.

  As shown in FIG. 5, the first moving device 104 includes a first slider mechanism 141 and a second slider mechanism 144 arranged side by side with the first slider mechanism 141 in the Y direction across the suction hole 114. .

  The first slider mechanism 141 is disposed on the side opposite to the first holding surface 101s1. The first slider mechanism 141 includes a first guide rail 142 and a first linear motor 143 arranged alongside the first guide rail 142 in the Y direction.

  The first guide rail 142 extends along one side of the base 111 (the side 111a on the + Y direction side). For example, the length of the first guide rail 142 is 270 mm.

  The first guide rail 142 is disposed at a position that partially overlaps the + Y direction side ends of the holding portion 134 and the holding portion 138. The first guide rail 142 guides the holding part 134 and the holding part 138 to move in the X direction.

  The first linear motor 143 extends in a direction parallel to the first guide rail 142. The length of the first linear motor 143 is shorter than the length of the first guide rail 142. For example, the length of the first linear motor 143 is 72 mm (Stroke).

  The first linear motor 143 is disposed at a position that partially overlaps the end portion on the −Y direction side of the third light source 136 held by the holding unit 138. The holding unit 138 is moved in the X direction by the first linear motor 143.

  The second slider mechanism 144 is disposed on the side opposite to the second holding surface 101s2. The second slider mechanism 144 includes a second guide rail 145 and a second linear motor 146 disposed alongside the second guide rail 145 in the Y direction.

  The second guide rail 145 extends along one side of the base 111 (the side 111b on the −Y direction side). The length of the second guide rail 145 is substantially equal to the length of the first guide rail 142.

  The second guide rail 145 is disposed at a position that partially overlaps the ends of the holding portion 134 and the holding portion 138 on the −Y direction side. The second guide rail 145 guides the holding part 134 and the holding part 138 to move in the X direction.

  The second linear motor 146 extends in a direction parallel to the second guide rail 145. The length of the second linear motor 146 is substantially equal to the length of the first linear motor 143.

  The second linear motor 146 is disposed at a position that partially overlaps the + Y direction end of the second light source 133 held by the holding unit 134. The holding part 134 is moved in the X direction by the second linear motor 146.

  For example, by operating the first linear motor 143 and the second linear motor 146 in synchronization, the holding unit 134 and the holding unit 138 can be moved in synchronization in the X direction. In the present embodiment, the retraction movement (movement in the −X direction) of the first lighting device 131 and the retraction movement (movement in the + X direction) of the second lighting device 135 are performed in synchronization.

  Hereinafter, the operation of the first moving device 104 and the third moving device 190 will be described with reference to FIGS.

FIG. 6 shows the arrangement position of the illumination device 103 when the object 110 is illuminated (hereinafter referred to as the illumination position of the illumination device 103) and the arrangement position of the imaging device 109 when the object 110 is imaged (hereinafter referred to as the imaging device). 109 is referred to as an imaging position).
In FIG. 6, the illumination position of the illumination device 103 and the imaging position of the imaging device 109 will be described with respect to the positional relationship of the illumination device 103 and the imaging device 109 with respect to the openings 113a to 113h. For convenience, the first moving device 104, the third moving device 190, the suction hole 114, and the like are not shown.

  As shown in FIG. 6, the first lighting device 131 is disposed at a position that partially overlaps the first opening 113a, the second opening 113b, the fifth opening 113e, and the sixth opening 113f. The first illumination device 131 illuminates the corners on the −X direction side of each object 110 through the first opening 113a, the second opening 113b, the fifth opening 113e, and the sixth opening 113f.

  The second lighting device 135 is disposed at a position that partially overlaps the third opening 113c, the fourth opening 113d, the seventh opening 113g, and the eighth opening 113h. The second illumination device 135 illuminates the corners on the + X direction side of each object 110 through the third opening 113c, the fourth opening 113d, the seventh opening 113g, and the eighth opening 113h.

  The imaging device 109 includes a first opening 113a, a second opening 113b, a third opening 113c, a fourth opening 113d, a fifth opening 113e, a sixth opening 113f, a seventh opening 113g, and an eighth opening. It is arranged at a position that partially overlaps the portion 113h. The imaging device 109 captures an image of the corner of each object 110 in a state where the corner of each object 110 is illuminated by the illumination device 103.

FIG. 7 shows the arrangement position of the illumination device 103 (hereinafter referred to as the retracted position of the illumination device 103) and imaging when the laser beam oscillator 102 is oscillating the laser beam, that is, when the object 110 is cut. 4 is a plan view showing an arrangement position of the device 109 (hereinafter referred to as a retracted position of the imaging device 109). FIG.
In FIG. 7, the retracted position of the illumination device 103 and the retracted position of the imaging device 109 will be described with respect to the arrangement relationship of the illumination device 103 and the imaging device 109 with respect to the openings 113a to 113h. For convenience, the first moving device 104, the third moving device 190, the suction hole 114, and the like are not shown.

  As shown in FIG. 7, the first lighting device 131 has a position where it does not overlap the first opening 113a, the second opening 113b, the fifth opening 113e, and the sixth opening 113f, that is, the first opening 113a. The second opening 113b, the fifth opening 113e, and the sixth opening 113f are arranged on the −X direction side with respect to the −X direction side edges of the respective openings. In this case, the light emitted from the first lighting device 131 is blocked by the plate 112 (see FIG. 4) and the base 111. The first lighting device 131 may be turned off.

  The second lighting device 135 is positioned so as not to overlap the third opening 113c, the fourth opening 113d, the seventh opening 113g, and the eighth opening 113h, that is, the third opening 113c, the fourth opening 113d, Each of the seventh opening 113g and the eighth opening 113h is disposed on the + X direction side from the + X direction side edge. In this case, the light emitted from the second illumination device 135 is blocked by the plate 112 (see FIG. 4) and the base 111. Note that the second lighting device 135 may be turned off.

  The imaging device 109 includes a first opening 113a, a second opening 113b, a third opening 113c, a fourth opening 113d, a fifth opening 113e, a sixth opening 113f, a seventh opening 113g, and an eighth opening. It arrange | positions in the position which does not overlap with the part 113h. Specifically, among the eight imaging devices 109, the four imaging devices 109 on the −X direction side are each of the first opening 113a, the second opening 113b, the fifth opening 113e, and the sixth opening 113f. It is arranged on the −X direction side with respect to the end edge on the −X direction side. Of the eight imaging devices 109, the four imaging devices 109 on the + X direction side are the + X direction side edges of the third opening 113c, the fourth opening 113d, the seventh opening 113g, and the eighth opening 113h. Is arranged on the + X direction side.

  FIG. 8 shows a case where the size of the object 210 is larger than the size of the object 110, that is, the plate 112 holding the object 110 having a relatively small size is replaced with a plate holding the object 210 having a relatively large size. It is a top view which shows the illumination position of the illuminating device 103 and the imaging position of the imaging device 109 when it replaces | exchanges (after plate replacement | exchange).

  In this embodiment, the case where the plate 112 that holds the relatively small size object 110 is replaced with a plate that holds the relatively large size object 210 before and after replacing the plate is taken as an example. Explain, but not limited to this. For example, the present invention can be applied even when a plate holding a relatively large object is replaced with a plate holding a relatively small object before and after replacing the plate.

As shown in FIG. 8, the plate that holds the object 210 includes a first opening 213a, a second opening 213b, a third opening 213c, a fourth opening 213d, a fifth opening 213e, and a sixth opening. A portion 213f, a seventh opening 213g, and an eighth opening 213h are formed. Each of the openings 213a to 213h includes the first opening 113a, the second opening 113b, the third opening 113c, the fourth opening 113d, the fifth opening 113e, the sixth opening 113f, and the seventh opening described above. It corresponds to each of 113g and the 8th opening part 113h. However, the sizes and arrangement positions of the openings 213a to 213h are adapted to the size of the object 210.
In FIG. 8, the illumination position of the illumination device 103 and the imaging position of the imaging device 109 will be described with respect to the arrangement relationship of the illumination device 103 and the imaging device 109 with respect to the openings 213a to 213h. For convenience, the first moving device 104, the third moving device 190, the suction hole 114, and the like are not shown.

  As shown in FIG. 8, the first lighting device 131 is disposed at a position that partially overlaps the first opening 213a, the second opening 213b, the fifth opening 213e, and the sixth opening 213f. The first illumination device 131 illuminates the corners on the −X direction side of each object 210 via the first opening 213a, the second opening 213b, the fifth opening 213e, and the sixth opening 213f.

  The second lighting device 135 is disposed at a position that partially overlaps the third opening 213c, the fourth opening 213d, the seventh opening 213g, and the eighth opening 213h. The second illumination device 135 illuminates the corners on the + X direction side of each object 210 through the third opening 213c, the fourth opening 213d, the seventh opening 213g, and the eighth opening 213h.

  The imaging device 109 includes a first opening 213a, a second opening 213b, a third opening 213c, a fourth opening 213d, a fifth opening 213e, a sixth opening 213f, a seventh opening 213g, and an eighth opening. It arrange | positions in the position which overlaps with the part 213h. The imaging device 109 captures an image of the corner of each object 210 in a state where the corner of each object 210 is illuminated by the illumination device 103.

  As shown in FIGS. 6 and 8, the distance between the edge on the + X direction side of the first lighting device 131 and the edge on the −X direction side of the second lighting device 135 (hereinafter referred to as the first lighting device 131 and The distance between the second illumination devices 135 is different before and after the plate replacement. Specifically, the distance Hb1 between the first lighting device 131 and the second lighting device 135 after the plate replacement (when the plate for the object 210 having a relatively large size is installed) is the same as that before the plate replacement (the relatively small size). It is larger than the interval Ha1 between the first illumination device 131 and the second illumination device 135 (when the plate 112 for the small object 110 is installed).

FIG. 9 is a plan view showing the retracted position of the illumination device 103 and the retracted position of the imaging device 109 after the plate replacement.
In FIG. 9, the retracted position of the illumination device 103 and the retracted position of the imaging device 109 will be described with respect to the positional relationship of the illumination device 103 and the imaging device 109 with respect to the openings 213a to 213h. For convenience, the first moving device 104, the third moving device 190, the suction hole 114, and the like are not shown.

  As shown in FIG. 9, the first lighting device 131 has a position where it does not overlap with the first opening 213a, the second opening 213b, the fifth opening 213e, and the sixth opening 213f, that is, the first opening 213a. The second opening 213b, the fifth opening 213e, and the sixth opening 213f are arranged on the −X direction side from the −X direction side edge of each. In this case, the light emitted from the first lighting device 131 is blocked by the plate (not shown) and the base 111. The first lighting device 131 may be turned off.

  The second lighting device 135 has a position that does not overlap with the third opening 213c, the fourth opening 213d, the seventh opening 213g, and the eighth opening 213h, that is, the third opening 213c, the fourth opening 213d, The seventh opening 213g and the eighth opening 213h are arranged on the + X direction side of the + X direction side edge of each. In this case, the light emitted from the second illumination device 135 is blocked by the plate (not shown) and the base 111. Note that the second lighting device 135 may be turned off.

  The imaging device 109 includes a first opening 213a, a second opening 213b, a third opening 213c, a fourth opening 213d, a fifth opening 213e, a sixth opening 213f, a seventh opening 213g, and an eighth opening. It arrange | positions in the position which does not overlap with the part 213h. Specifically, among the eight imaging devices 109, the four imaging devices 109 on the −X direction side include the first opening 213a, the second opening 213b, the fifth opening 213e, and the sixth opening 213f. It is arranged on the −X direction side with respect to the end edge on the −X direction side. Among the eight imaging devices 109, the four imaging devices 109 on the + X direction side are the + X direction side edges of the third opening 213c, the fourth opening 213d, the seventh opening 213g, and the eighth opening 213h. Is arranged on the + X direction side.

  As shown in FIGS. 7 and 9, the distance between the first lighting device 131 and the second lighting device 135 is substantially the same before and after the plate replacement. Specifically, the interval Hb2 between the first illumination device 131 and the second illumination device 135 after the plate replacement is substantially equal to the interval Ha2 between the first illumination device 131 and the second illumination device 135 before the plate replacement.

  As shown in FIGS. 6 to 9, by moving the illumination device 103 in the X direction by the first moving device 104, an appropriate amount of light is emitted for each size of the objects 110 and 210 before and after the plate replacement. Can be irradiated. Furthermore, it is not necessary to replace the lighting device 103 according to the size of the objects 110 and 210 before and after the plate replacement, and the lighting device 103 can be shared.

  In addition, by moving the imaging device 109 in the X direction by the third moving device 190, the objects 110 and 210 can be imaged at appropriate positions for each size of the objects 110 and 210 before and after the plate replacement. . Furthermore, it is not necessary to replace the imaging device 109 in accordance with the size of the objects 110 and 210 before and after the replacement of the plate, and the imaging device 109 can be shared.

  As described above, according to the laser beam irradiation apparatus 100 according to the present embodiment, the object 110 can be brightly illuminated even when the size of the object 110 changes, and a reduction in productivity can be suppressed. .

  Moreover, even if the size of the target object 110 changes, the target object 110 can be imaged at an appropriate position, and a decrease in productivity can be suppressed.

  In addition, when the laser beam oscillator 102 is oscillating the laser beam by the first moving device 104, the illumination device 103 is retracted to a position where it does not overlap the opening 113, so that the illumination device 103 is irradiated with the laser beam. It can be suppressed. Therefore, damage to the illumination device 103 due to laser light irradiation can be avoided.

  In addition, since the lighting device 103 extends in the direction (Y direction) in which the first holding surface 101s1 and the second holding surface 101s2 are adjacent to each other, the first moving device 104 moves the lighting device 103 in the X direction. The object 110 held on each of the first holding surface 101s1 and the second holding surface 101s2 can be efficiently illuminated in a wide range. Therefore, even if the size of the object 110 held on each of the first holding surface 101s1 and the second holding surface 101s2 changes, the object 110 can be easily illuminated.

  Moreover, since the illuminating device 103 has the 1st illuminating device 131 and the 2nd illuminating device 135 which were mutually arranged in the X direction, the target object 110 hold | maintained at 101 s of holding surfaces can be illuminated efficiently in a wide range. Can do. Therefore, the object 110 can be easily illuminated even if the size of the object 110 held on the holding surface 101s changes.

  In addition, since the condensing lens 108 is disposed on the optical path between the scanner 105 and the table 101, the laser light that has passed through the scanner 105 can be condensed in parallel to the object 110. Therefore, the object 110 can be cut with high accuracy.

  Further, in the laser beam irradiation apparatus 100 of the present embodiment, the laser beam scanning is mainly performed by the second moving device 106, and an area where the laser beam irradiation position cannot be accurately controlled by the second moving device 106 is adjusted by the scanner 105. . Therefore, it is possible to accurately control the irradiation position of the laser light over a wide range as compared with the case where the laser light is scanned only by the second moving device 106 or the scanner 105.

  In this embodiment, as an example, the table 101, the laser light oscillator 102, the scanner 105, the illumination device 103, the imaging device 109, the first moving device 104, the second moving device 106, and the first Although the laser beam irradiation apparatus 100 including the three moving apparatuses 190 has been described, the present invention is not limited thereto. For example, the laser light irradiation device does not include the imaging device 109 and the third moving device 190, that is, the table 101, the laser light oscillator 102, the scanner 105, the illumination device 103, and the first moving device 104. And the second moving device 106 may be included.

In the present embodiment, the laser light irradiation device has been described, but the present invention is not limited to this. For example, a table that holds an object, an illumination device that illuminates the object, an imaging device that images the object, a first moving device that relatively moves the table and the illumination device, and a relative relationship between the table and the imaging device The present invention can also be applied to a detection device including a second moving device that moves.
Further, the detection device may include a configuration that does not include the imaging device and the second moving device, that is, a configuration that includes a table, a lighting device, and the first moving device.

(First variation of table)
FIG. 10 is a plan view showing a first modification of the table according to the present embodiment.

  In the above-described embodiment, as illustrated in FIG. 4, the table 101 has been described as an example having the plate 112 that sucks and holds the two objects 110. On the other hand, the table 301 according to this modification has a plate 312 that sucks and holds one object 310 as shown in FIG. The size of the object 310 according to this modification is larger than the size of the object 110 according to the above embodiment.

  A rectangular frame-shaped guide groove 317 is formed in the plate 312 that holds the object 310 along the outer peripheral edge of the suction surface 312s. The plate 312 is formed with a first opening 313a, a second opening 313b, a third opening 313c, and a fourth opening 313d. The sizes and arrangement positions of the openings 313 a to 313 d are adapted to the size of the object 310.

  Even in the table 301 according to this modification, the object 310 can be illuminated brightly even if the size of the object 310 changes, and a reduction in productivity can be suppressed.

(Manufacturing device for optical member bonded body)
Hereinafter, the film bonding system 1 which is a manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention is demonstrated with reference to drawings. The film bonding system 1 which concerns on this embodiment is comprised by the laser beam irradiation apparatus 100 which the cutting device mentioned above.

FIG. 11 is a diagram illustrating a schematic configuration of the film bonding system 1 of the present embodiment.
The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, an antireflection film, and a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.

  In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the transport direction of the liquid crystal panel, which is an optical display component, is the X direction, and the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, X direction, and Y direction The direction orthogonal to the Z direction is taken as the Z direction.

  As shown in FIG. 11, the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by the control part 40 as an electronic control apparatus.

  FIG. 12 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 that has a rectangular shape in plan view, a second substrate P2 that has a relatively small rectangular shape that is disposed to face the first substrate P1, a first substrate P1, and a second substrate. And a liquid crystal layer P3 sealed between the substrate P2. The liquid crystal panel P has a rectangular shape that follows the outer shape of the first substrate P1 in a plan view, and a region that fits inside the outer periphery of the liquid crystal layer P3 in a plan view is a display region P4.

  13 is a cross-sectional view taken along line AA in FIG. On the front and back surfaces of the liquid crystal panel P, a first optical member cut out from each of a long strip-shaped first optical sheet F1 and second optical sheet F2 (see FIG. 11, hereinafter may be collectively referred to as an optical sheet FX). F11 and the second optical member F12 (hereinafter may be collectively referred to as an optical member F1X) are appropriately bonded. In the present embodiment, the first optical member F11 and the second optical member F12 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively.

  Outside the display region P4, a frame portion G having a predetermined width for arranging a sealant or the like for joining the first and second substrates of the liquid crystal panel P is provided.

  In addition, the 1st optical member F11 and the 2nd optical member F12 are respectively the bonding surface from the 1st sheet piece F1m and the 2nd sheet piece F2m (henceforth a sheet piece FXm) mentioned later. It is formed by cutting off the excess part on the outside. The bonding surface will be described later.

  FIG. 14 is a partial cross-sectional view of the optical sheet FX bonded to the liquid crystal panel P. The optical sheet FX includes a film-like optical member main body F1a, an adhesive layer F2a provided on one surface (upper surface in FIG. 14) of the optical member main body F1a, and one of the optical member main bodies F1a via the adhesive layer F2a. Separator F3a laminated | stacked on the surface so that isolation | separation was possible, and the surface protection film F4a laminated | stacked on the other surface (FIG. 14 lower surface) of the optical member main body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and its peripheral area. For convenience of illustration, hatching of each layer in FIG. 14 is omitted.

  The optical member body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface thereof. Hereinafter, the part remove | excluding the separator F3a from the optical sheet FX is called the bonding sheet | seat F5.

  The separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical sheet FX may be configured not to include the surface protective film F4a, or the surface protective film F4a may be configured not to be separated from the optical member body F1a.

  The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. And a second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

  The optical member main body F1a may have a single-layer structure composed of one optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancement film, or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.
As shown in FIG. 11, the film bonding system 1 of the present embodiment has a downstream side (− in the transport direction of the liquid crystal panel P on the left side in the figure from the upstream side in the transport direction (+ X direction side) of the liquid crystal panel P on the right side in the figure. X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.

  The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary. On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P <b> 4 is along the transport direction. On the other hand, on the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P <b> 4 along the transport direction. On the front and back surfaces of the liquid crystal panel P, a sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical sheet FX is bonded.

  In addition, the upstream conveyor 6 is provided with the independent free roller conveyor 24 in the downstream in the 1st adsorption | suction apparatus 11 mentioned later. On the other hand, the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.

  The film bonding system 1 of this embodiment is the 1st adsorption | suction apparatus 11, the 1st dust collector 12, the 1st bonding apparatus 13, the 1st detection apparatus 41, the 1st cutting device 31, the inversion apparatus 15, and 2nd collection. The dust device 16, the 2nd bonding apparatus 17, the 2nd detection apparatus 42, the 2nd cutting device 32, and the control part 40 are provided.

  The first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P. The first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P. The panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P. When the conveyance is finished, the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.

In the alignment camera 11b, the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state. Image data obtained by the alignment camera 11b is transmitted to the control unit 40. Based on the image data, the panel holding unit 11a is operated to align the liquid crystal panel P with the free roller conveyor 24 as a transport destination. In other words, the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the deviation in the turning direction around the vertical axis of the liquid crystal panel P. .
Here, the liquid crystal panel P conveyed on the rail R by the panel holding unit 11a is nipped by the pressure roll 23 together with the sheet piece FXm while being adsorbed by the adsorption pad 26.

  The 1st dust collector 12 is provided in the conveyance upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13. FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.

  The 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption | suction apparatus 11. FIG. The 1st bonding apparatus 13 bonds the bonding sheet | seat F5 (equivalent to 1st sheet piece F1m) cut into the predetermined size with respect to the lower surface of liquid crystal panel P introduced into the bonding position.

  The first bonding device 13 includes a transport device 22 and a pinching roll 23.

  The conveyance device 22 conveys the optical sheet FX along its longitudinal direction while unwinding the optical sheet FX from the original roll R1 around which the optical sheet FX is wound. The conveying apparatus 22 conveys the bonding sheet | seat F5 by using separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding unit 22a holds the original roll R1 around which the belt-shaped optical sheet FX is wound and feeds the optical sheet FX along the longitudinal direction thereof.
The plurality of guide rollers 22b wind the optical sheet FX so as to guide the optical sheet FX unwound from the original roll R1 along a predetermined conveyance path.
The cutting device 22c performs a half cut on the optical sheet FX on the conveyance path.
The knife edge 22d supplies the bonding sheet F5 to the bonding position while separating the bonding sheet F5 from the separator F3a by winding the optical sheet FX subjected to the half cut at an acute angle.
The winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.

  The roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example. Thereby, the winding unit 22e winds the separator F3a having passed through the knife edge 22d while the roll holding unit 22a feeds the optical sheet FX in the transport direction. Hereinafter, the upstream side in the transport direction of the optical sheet FX (separator F3a) in the transport device 22 is referred to as a sheet transport upstream side, and the downstream side in the transport direction is referred to as a sheet transport downstream side.

  Each guide roller 22b changes the traveling direction of the optical sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b is movable so as to adjust the tension of the optical sheet FX being conveyed.

  A dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical sheet FX conveyed from the roll holding unit 22a while the optical sheet FX is cut by the cutting device 22c.

FIG. 15 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
As shown in FIG. 15, when the optical sheet FX is fed out by a predetermined length, the cutting device 22c applies a part in the thickness direction of the optical sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical sheet FX. Make a half-cut to cut. The cutting device 22c of the present embodiment is provided so as to be able to advance and retreat toward the optical sheet FX from the side opposite to the separator F3a with respect to the optical sheet FX.

  The cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical sheet FX (so that a predetermined thickness remains in the separator F3a), Half-cut to the vicinity of the interface between the adhesive layer F2a and the separator F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

  In the optical sheet FX after the half cut, the optical member main body F1a and the surface protection film F4a are cut in the thickness direction, thereby forming cut lines L1 and L2 extending over the entire width in the width direction of the optical sheet FX. . The cut lines L1 and L2 are formed so as to be aligned in the longitudinal direction of the belt-shaped optical sheet FX. For example, in the case of the bonding process which conveys the liquid crystal panel P of the same size, the plurality of cut lines L1 and L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX. The optical sheet FX is divided into a plurality of sections in the longitudinal direction by a plurality of cut lines L1, L2. A section sandwiched between a pair of cutting lines L1 and L2 adjacent in the longitudinal direction in the optical sheet FX is a sheet piece FXm in the bonding sheet F5. The sheet piece FXm is a sheet piece of the optical sheet FX having a size that protrudes outside the liquid crystal panel P.

  Returning to FIG. 11, the knife edge 22 d is arranged below the upstream conveyor 6 and extends at least over the entire width in the width direction of the optical sheet FX. The knife edge 22d is wound so as to be in sliding contact with the separator F3a side of the optical sheet FX after the half cut.

  The knife edge 22d is seen from the width direction of the optical sheet FX above the first surface, and the first surface arranged in an inclined position when viewed from the width direction of the optical sheet FX (width direction of the upstream conveyor 6). It has the 2nd surface arrange | positioned at an acute angle with respect to a 1st surface, and the front-end | tip part where a 1st surface and a 2nd surface cross.

  In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical sheet F1 to an acute angle at the front-end | tip part. The first optical sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d is introduced between the pair of bonding rollers 23a of the pinching roll 23 while overlapping the lower surface of the liquid crystal panel P in a state of being sucked by the first suction device 11. Is done. The first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size that protrudes outside the liquid crystal panel P.

  On the other hand, the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d. The winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.

  The pinching roll 23 bonds the first sheet piece F1m separated from the first optical sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6.

  The pinching roll 23 has a pair of bonding rollers 23a and 23a arranged in parallel with each other in the axial direction (the upper bonding roller 23a moves up and down). A predetermined gap is formed between the pair of bonding rollers 23 a and 23 a, and the inside of this gap is the bonding position of the first bonding apparatus 13.

  In the gap, the liquid crystal panel P and the first sheet piece F1m are introduced overlapping each other. These liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being clamped by each bonding roller 23a. In this embodiment, 1st optical member bonding body PA1 is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG.

  The 1st detection apparatus 41 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m. The edge data detected by the first detection device 41 is stored in a storage unit (not shown).

  The cutting position of the 1st sheet piece F1m is adjusted based on the detection result of the edge of a 1st bonding surface. The control part 40 (refer FIG. 11) acquires the data of the edge of the 1st bonding surface memorize | stored in the memory | storage part, and the 1st optical member F11 is the outer side of the liquid crystal panel P (outside of a 1st bonding surface). The cut position of the first sheet piece F1m is determined so as not to protrude. The first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control unit 40.

  The 1st cutting device 31 is provided in the panel conveyance downstream rather than the 1st detection apparatus 41. FIG. The 1st cutting device 31 performs the laser cut along an edge, and is the 1st sheet piece F1m (1st sheet piece F1m) of the part which protruded from the 1st optical member bonding body PA1 to the outer side of the 1st bonding surface. ) And an optical member having a size corresponding to the first bonding surface (first optical member F11) is formed. Here, the 1st cutting device 31 is corresponded to the cutting device as described in a claim.

  Here, “the size corresponding to the first bonding surface” indicates the size of the outer shape of the first substrate P1. However, it includes a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and that avoids a functional part such as an electrical component mounting portion.

  The 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P by cutting off the surplus part of the 1st sheet piece F1m from the 1st optical member bonding body PA1 by the 1st cutting device 31. 2 optical member bonding body PA2 is formed. The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

  The reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.

  The reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11. The reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.

  The reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce | transduced into the bonding position of the 2nd bonding apparatus 17. FIG.

  Since the 2nd adsorption | suction apparatus 20 is equipped with the structure similar to the 1st adsorption | suction apparatus 11, it attaches | subjects and demonstrates the same code | symbol to the same part. The 2nd adsorption | suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2. The second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2. Do. The panel holding | maintenance part 11a adsorbs and hold | maintains the upper surface of 2nd optical member bonding body PA2 contact | abutted to the stopper S by vacuum suction. The panel holding | maintenance part 11a moves on the rail R in the state which adsorbed and hold | maintained 2nd optical member bonding body PA2, and conveys 2nd optical member bonding body PA2. When the conveyance is finished, the panel holding unit 11a releases the suction holding and transfers the second optical member bonding body PA2 to the free roller conveyor 24.

  In the alignment camera 11b, the panel holding unit 11a holds the second optical member bonding body PA2 in contact with the stopper S, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state. Imaging data from the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with respect to the free roller conveyor 24 as the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.

  The 2nd dust collector 16 is arrange | positioned in the conveyance direction upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 2nd bonding apparatus 17. FIG. The second dust collecting device 16 performs static electricity removal and dust collection in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side.

  The 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16. FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position. Do. The 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13. FIG.

  In the gap between the pair of bonding rollers 23a of the pinching roll 23 (the bonding position of the second bonding device 17), the second optical member bonding body PA2 and the second sheet piece F2m are overlapped and introduced. The second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

  These 2nd optical member bonding body PA2 and 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by each bonding roller 23a. In this embodiment, it is a 2nd sheet | seat on the surface (surface on the opposite side to the surface where the 1st optical member F11 of 2nd optical member bonding body PA2 was bonded) of the liquid crystal panel P by the pinching roll 23. By bonding the piece F2m, the third optical member bonding body PA3 is formed.

  The 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

  The cut position of the 2nd sheet piece F2m is adjusted based on the detection result of the edge of the 2nd bonding surface. The control part 40 (refer FIG. 11) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 2nd optical member F12 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the second sheet piece F2m is determined so as not to protrude. The second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control unit 40.

  The second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42. The 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) of the magnitude | size corresponding to a 2nd bonding surface is formed.

  The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and The 4th optical member bonding body PA4 (optical member bonding body) by which the 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P is formed. The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

  Here, the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus 100 mentioned above. The 1st cutting device 31 and the 2nd cutting device 32 cut | disconnect endlessly the sheet piece FXm bonded by liquid crystal panel P along the outer periphery of the bonding surface.

  A bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17. The bonding inspection apparatus is an inspection (not shown whether the position of the optical member F1X is appropriate (whether the position deviation is within the tolerance range)) by the inspection apparatus (not shown) of the workpiece (liquid crystal panel P) on which the film is bonded. Etc.). The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

  In addition, in this embodiment, the control part 40 as an electronic control apparatus which carries out overall control of each part of the film bonding system 1 is comprised including the computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk. The control unit 40 of the present embodiment includes an interface that can execute communication with an external device of the computer system. An input device that can input an input signal may be connected to the control unit 40. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control unit 40 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the film bonding system 1 or may be connected to the display device.

  An operating system (OS) that controls the computer system is installed in the storage unit of the control unit 40. The storage unit of the control unit 40 includes a program that causes the arithmetic processing unit to control each unit of the film bonding system 1 to execute processing for causing each unit of the film bonding system 1 to accurately convey the optical sheet F. It is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each unit of the film bonding system 1.

  The storage unit is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. The storage unit functionally includes the first adsorption device 11, the first dust collector 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the reversing device 15, and the second adsorption device 20. , Second dust collector 16, second bonding device 17, second detection device 42, storage area for storing program software in which the control procedure of the operation of second cutting device 32 is described, and other various storage areas are set Is done.

  Hereinafter, with reference to FIG. 16, an example of the determination method of the bonding position (relative bonding position) of the sheet piece FXm with respect to liquid crystal panel P is demonstrated.

  First, as shown in FIG. 16A, a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the direction of the optical axis of the optical sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical sheet FX is stored in a storage device (not shown) in association with the position of the optical sheet FX (position in the longitudinal direction and position in the width direction of the optical sheet FX).

  The control unit 40 acquires the optical axis data (inspection data on the in-plane distribution of the optical axis) of each inspection point CP from the storage device, and partitions the optical sheet FX (cut line CL) into the portion where the sheet piece FXm is cut out. The direction of the average optical axis of the region to be detected is detected.

  For example, as shown in FIG. 16B, the angle (deviation angle) formed by the direction of the optical axis and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest of the deviation angles (maximum) When the deviation angle is θmax and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is detected as the average deviation angle. To do. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical sheet FX is detected as the direction of the average optical axis of the optical sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical sheet FX and the clockwise direction being negative.

  And the direction of the average optical axis of the optical sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis of the optical sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

  The above-described cutting devices 31 and 32 detect the outer peripheral edge of the display area P4 of the liquid crystal panel P by a detection unit such as a camera, and the sheet piece FXm bonded to the liquid crystal panel P is aligned along the outer peripheral edge of the bonding surface. Cut endlessly. The outer peripheral edge of the bonding surface is detected by imaging the edge of the bonding surface. In this embodiment, the laser cutting by each cutting device 31 and 32 is made along the outer periphery of the bonding surface.

  The runout width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in this embodiment, compared with the case of cutting the optical sheet FX using the cutting blade, the outer peripheral edge of the bonding surface The liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

  In addition, when the optical sheet FX is cut into a sheet piece that matches the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the relative bonding positions thereof Since the dimensional tolerances overlap, it becomes difficult to reduce the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

  On the other hand, when cutting out the sheet piece FXm of the optical sheet FX of a size protruding from the optical sheet FX to the outside of the liquid crystal panel P, and pasting the cut sheet piece FXm on the liquid crystal panel P, the sheet piece FXm is cut according to the bonding surface. Only the run-out tolerance of the cutting line needs to be considered, and the tolerance of the width of the frame G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

  Further, by cutting the sheet piece FXm with a laser instead of a blade, the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion.

  FIG. 17 shows a control for scanning a laser beam in a rectangular shape on the sheet piece FXm when the sheet piece FXm is cut into an optical member F1X having a predetermined size using the laser beam irradiation apparatus 100 shown in FIG. 1 as a cutting device. It is a figure which shows a method.

  In FIG. 17, reference symbol Tr denotes a target laser beam movement locus (desired locus; hereinafter referred to as laser beam movement locus), and reference symbol Tr <b> 1 denotes movement due to relative movement between the table 101 and the scanner 105. This is a trajectory obtained by projecting the trajectory onto the sheet piece FXm (hereinafter also referred to as a light source movement trajectory). The light source movement trajectory Tr1 is a shape obtained by curving four corners of the laser light movement trajectory Tr having a rectangular shape, the symbol SA1 is a straight section other than the corner, and the symbol SA2 is a bent section of the corner. Reference numeral Tr2 indicates that the irradiation position of the laser beam is perpendicular to the light source movement locus Tr1 by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 when the scanner 105 is relatively moving on the light source movement locus Tr1. It is a curve (hereinafter also referred to as an adjustment curve) indicating how much is shifted (adjusted). The deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.

  As shown in FIG. 17, the light source movement locus Tr1 is a substantially rectangular movement locus with curved corners. The light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area. If the light source movement locus Tr1 has a rectangular shape, the moving speed of the scanner 105 is slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser light. Therefore, in FIG. 17, the corner of the light source movement locus Tr1 is curved so that the moving speed of the scanner 105 is substantially constant over the entire light source movement locus Tr1.

  Since the light source movement locus Tr1 and the laser beam movement locus Tr coincide with each other when the scanner 105 is moving in the straight section SA1, the control device 107 sets the irradiation position of the laser beam to the first irradiation position adjusting device 151. And without adjusting by the 2nd irradiation position adjustment apparatus 154, a laser beam is irradiated to the sheet piece FXm from the scanner 105 as it is. On the other hand, when the scanner 105 is moving in the bending section SA2, the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so that the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 perform laser light. The irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr. For example, when the scanner 105 is moving at the position indicated by the symbol M1, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 move the laser beam irradiation position in the direction N1 perpendicular to the light source movement locus Tr1. Shifted by W1. The distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1. The light source movement trajectory Tr1 is arranged inside the laser light movement trajectory Tr, but the irradiation position of the laser light is outside the laser light movement trajectory Tr by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. Therefore, these deviations cancel out, and the irradiation position of the laser beam is arranged on the laser beam movement locus Tr.

  As described above, according to the film bonding system 1 of the present embodiment of the present embodiment, the first cutting device 31 and the second cutting device 32 are configured by the laser light irradiation device described above, and thus the sheet piece. F1m and F2m can be cut sharply, and deterioration of cut quality can be suppressed.

  Further, under the control of the control device 107, the second moving device 106 and the scanner 105 are controlled so as to draw a desired trajectory Tr in the sheet piece FXm. In this configuration, the laser beam irradiation section to be adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only the narrow bending section SA2. In the other wide straight section SA1, the laser beam is scanned on the sheet piece FXm by the movement of the table 101 by the second moving device 106. In the present embodiment, the laser beam scanning is mainly performed by the second moving device 106, and the first irradiation position adjusting device 151 and the second irradiation position adjustment are performed only in an area where the laser beam irradiation position cannot be accurately controlled by the second moving device 106. Adjustment is performed by the device 154. Therefore, it is possible to accurately control the irradiation position of the laser light over a wide range as compared with the case where the laser light is scanned only by the second moving device 106 or the scanner 105.

  Moreover, after bonding the sheet pieces F1m and F2m of a size that protrudes outside the liquid crystal panel P to the liquid crystal panel P, the excess part of the sheet pieces F1m and F2m is cut off, whereby the optical member F11 having a size corresponding to the bonding surface. , F12 can be formed on the surface of the liquid crystal panel P. Thereby, the optical members F11 and F12 can be accurately provided up to the bonding surface, and the frame area outside the display area P4 can be narrowed to enlarge the display area and downsize the device.

  Even if the optical axis direction of the sheet pieces F1m and F2m changes depending on the position of the sheet pieces F1m and F2m by bonding the sheet pieces F1m and F2m of a size protruding outside the liquid crystal panel P to the liquid crystal panel P. The liquid crystal panel P can be aligned and bonded in accordance with the direction. Thereby, the precision of the optical axis direction of the optical members F11 and F12 with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be increased.

  In addition, the cutting devices 31 and 32 laser cut the sheet pieces F1m and F2m, so that the force is not exerted on the liquid crystal panel P as compared with the case where the sheet pieces F1m and F2m are cut with a blade, and cracks and chips occur. It becomes difficult, and the stable durability of the liquid crystal panel P can be obtained.

  In the present embodiment, the configuration in which the sheet piece is cut is described as an example of the configuration in which the object is irradiated with the laser light and the predetermined processing is performed, but the configuration is not limited thereto. For example, in addition to dividing the sheet piece into at least two parts, it also includes making a cut through the sheet piece and forming a groove (cut) of a predetermined depth in the sheet piece. To do. More specifically, for example, cutting (cutting off) an end portion of a sheet piece, half cutting, marking processing, and the like are included.

  Further, in the present embodiment, the case where the drawing locus of the laser light emitted from the laser light irradiation device has a rectangular shape (square shape) in plan view has been described as an example, but the present invention is not limited thereto. For example, the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape that is a pentagon or more in plan view. Moreover, not only this but a planar-view star shape and planar-view geometric shape may be sufficient. The present invention can also be applied to such a drawing trajectory.

  In the present embodiment, the optical sheet FX is pulled out from the original roll, and a sheet piece FXm of a size that protrudes outside the liquid crystal panel P is bonded to the liquid crystal panel P, and then the liquid crystal panel P is bonded from the sheet piece FXm. Although the case where it cut out to the optical member F1X of the magnitude | size corresponding to a surface was mentioned and demonstrated was demonstrated, it is not restricted to this. For example, the present invention can also be applied to the case where a sheet-like optical film chip cut out to the outside of the liquid crystal panel P is bonded to the liquid crystal panel without using the roll.

  As mentioned above, although the suitable embodiment example which concerns on this embodiment was demonstrated referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (manufacturing apparatus of an optical member bonding body), 23 ... Cinch roll (bonding apparatus), 31 ... 1st cutting device, 32 ... 2nd cutting device, 100 ... Laser beam irradiation apparatus, 101, DESCRIPTION OF SYMBOLS 301 ... Table, 101s ... Holding surface, 101s1 ... First holding surface, 101s2 ... Second holding surface, 102 ... Laser oscillator, 103 ... Illuminating device, 104 ... First moving device, 105 ... Scanner, 106 ... Second Moving device, 108 ... Condensing lens, 109 ... Imaging device, 113, 113a, 113b, 113c, 113d, 113e, 113f, 113g, 113h ... Opening, 131 ... First illumination device, 135 ... Second illumination device, 190 ... 3rd moving device, P ... Liquid crystal panel (optical display component), FX ... Optical sheet, FXm ... Sheet piece, F1X ... Optical member, PA1 ... 1st optical member bonding body (sheet) Sheet piece bonding body), PA4 ... fourth optical member bonding body (optical member bonding body)

Claims (11)

A table having a holding surface for holding an object;
A laser beam oscillator that oscillates the laser beam;
A scanner that biaxially scans the laser beam in a plane parallel to the holding surface;
An illumination device for illuminating the object;
A first moving device for relatively moving the table and the lighting device;
A second moving device for relatively moving the table and the scanner;
An imaging device for imaging the object;
A third moving device for relatively moving the table and the imaging device;
Including laser beam irradiation device. The object is rectangular when viewed from the normal direction of the holding surface,
The table has an opening formed at a position corresponding to a corner of the object,
The lighting device is disposed on the opposite side of the holding surface of the table,
The laser light irradiation apparatus according to claim 1 , wherein the illumination device illuminates the corner portion from the side opposite to the holding surface of the table through the opening. When the laser beam oscillator is oscillating the laser beam, the first moving device,
The laser beam irradiation apparatus according to claim 2 , wherein the illumination device is retracted to a position that does not overlap the opening when viewed from the normal direction of the holding surface. A table having a holding surface for holding an object;
A laser beam oscillator that oscillates the laser beam;
A scanner that biaxially scans the laser beam in a plane parallel to the holding surface;
An illumination device for illuminating the object;
A first moving device for relatively moving the table and the lighting device;
Look including a second moving device for relatively moving the said and the table scanner,
The object is rectangular when viewed from the normal direction of the holding surface,
The table has an opening formed at a position corresponding to a corner of the object,
The lighting device is disposed on the opposite side of the holding surface of the table,
The said illuminating device is a laser beam irradiation apparatus which illuminates the said corner | angular part through the said opening part from the opposite side to the said holding surface of the said table .   When the laser beam oscillator is oscillating the laser beam, the first moving device,
The laser beam irradiation apparatus according to claim 4, wherein the illumination device is retracted to a position that does not overlap the opening when viewed from the normal direction of the holding surface. The holding surface has a first holding surface and a second holding surface disposed adjacent to the first holding surface;
The lighting device extends in an adjacent direction in which the first holding surface and the second holding surface are adjacent to each other,
The laser beam irradiation device according to any one of claims 1 to 5 , wherein the first moving device moves the illumination device in a direction orthogonal to the adjacent direction. The said illumination device is a laser beam irradiation apparatus of Claim 6 containing the 1st illumination device and the 2nd illumination device arrange | positioned along with the said 1st illumination device in the direction orthogonal to the said adjacent direction. A table having a holding surface for holding an object;
A laser beam oscillator that oscillates the laser beam;
A scanner that biaxially scans the laser beam in a plane parallel to the holding surface;
An illumination device for illuminating the object;
A first moving device for relatively moving the table and the lighting device;
Look including a second moving device for relatively moving the said and the table scanner,
The holding surface has a first holding surface and a second holding surface disposed adjacent to the first holding surface;
The lighting device extends in an adjacent direction in which the first holding surface and the second holding surface are adjacent to each other,
The first moving device is a laser beam irradiation device that moves the illumination device in a direction orthogonal to the adjacent direction .   The laser light irradiation device according to claim 8, wherein the lighting device includes a first lighting device and a second lighting device arranged in parallel with the first lighting device in a direction orthogonal to the adjacent direction. Laser light irradiation apparatus according to any one of claims 1 to 9 comprising a condenser lens for condensing light toward the laser beam emitted from the scanner to the holding surface. It is a manufacturing apparatus of an optical member bonding body formed by bonding an optical member to an optical display component,
A bonding apparatus that forms a sheet piece bonded body by bonding a sheet piece of a size that protrudes outside the optical display component to the optical display component;
Along the edge of the bonding surface between the optical display component of the sheet piece bonded body and the sheet piece, the sheet piece of the portion protruding from the sheet surface bonded body to the outside of the bonding surface is cut off, A cutting device for forming the optical member having a size corresponding to the bonding surface,
The cutting device is constituted by laser light irradiation apparatus according to any one of claims 1 to 10, wherein the sheet piece is cut as an object by the irradiated laser beam from the laser beam illumination device The manufacturing apparatus of an optical member bonding body.

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