JP6037564B2 - Optical display device production system - Google Patents

Description

  The present invention relates to an optical display device production system.

  Conventionally, in a production system of an optical display device such as a liquid crystal display, a mother panel is formed by sandwiching and bonding a liquid crystal layer between two mother glasses, and then the mother panel is divided into a plurality of liquid crystal panels (optical display components). ) Is used (so-called multi-chamfering). The mother panel can be divided into a plurality of liquid crystal panels by, for example, imprinting a scribe line on the mother glass, then pressurizing and dividing along the scribe line (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 11-90900

  In a liquid crystal panel, optical members such as a polarizing film, a retardation film, and a brightness enhancement film are formed on a sheet piece having a size including a surplus part that protrudes not only to the display area of the liquid crystal panel but also to the peripheral part (frame part) of the display area. It is pasted after being cut out. Thereby, the surplus part is arrange | positioned in a frame part, covering the display area reliably. Conventionally, the edges of the optical member are bonded so as to be arranged in the frame portion of the liquid crystal panel.

  In recent years, however, optical display components have been studied to reduce the peripheral portion of the display area on the display surface to increase the display area and reduce the size of the device (hereinafter, the frame portion of the optical display component is reduced). This is sometimes referred to as “narrowing the frame”). The optical member is cut into a sheet piece having a size that matches the shape of the liquid crystal panel in plan view, and the edge of the sheet piece is bonded to the outer periphery of the liquid crystal panel.

  Thus, when bonding the sheet piece of an optical member, the outer periphery shape of a liquid crystal panel is detected and operation which cuts out a sheet piece to the magnitude | size and shape match | combined with this outer periphery shape is performed. As a method for detecting the outer shape, it is conceivable to detect the four corners (corner portions) of the liquid crystal panel in a plan view and to make a rectangle connecting the four corners into the outer peripheral shape of the liquid crystal panel.

  However, when a liquid crystal panel is manufactured by multi-chamfering by the above-described method, a burr or a chip tends to occur at a corner in a liquid crystal panel having a rectangular shape. Therefore, the liquid crystal panel manufactured by multi-chamfering is easily affected by burrs and chips when detecting the outer peripheral shape of the liquid crystal panel, and is larger or smaller than the outer peripheral shape of the liquid crystal panel, and is likely to be defective.

  The present invention has been made in view of such circumstances, and can detect the outer peripheral shape of a liquid crystal panel that eliminates the influence of burrs and chips on the peripheral edge and can process an optical member in accordance with the outer peripheral shape. It is an object of the present invention to provide an optical display device production system.

In order to achieve the above object, the present invention employs the following means.
(1) That is, the optical display device production system according to the first aspect of the present invention is an optical display device production system in which an optical member is bonded to an optical display component, and the optical display component has the optical display device production system. The optical display component includes an imaging device that captures an image including the substrate in a plan view of a laminated body in which an optical member sheet wider than the surface is bonded to the surface of the substrate, and the optical member sheet. Based on the image, an approximate contour line that approximates the contour line in a plan view of the substrate, based on the image, the optical member that is a portion facing the display region, a cutting device that cuts off the excess portion outside the optical member, and the image And a control device that controls the cutting device to cut the optical member sheet based on the approximate contour line, and the control device is imaged by the imaging device. A plurality of points overlapping the contour line with respect to a second portion excluding the first portion of the contour line, excluding a first portion that does not satisfy a predetermined criterion among the contour line obtained by the recorded image. Coordinates are detected, a line corresponding to the contour line is approximated from the coordinates of the plurality of points, a figure obtained by the approximated line is obtained as the approximate contour line, and the optical member sheet based on the approximate contour line The cutting device is controlled so as to cut the wire.

  In the present specification, the “part facing the display area” is an area that is not less than the size of the display area and not more than the size of the outer shape of the optical display component, and avoids a functional part such as an electrical component mounting portion. Indicates the area. That is, the optical member may be formed by being separated from the surplus portion along the outer peripheral edge of the optical display component, and is formed by being separated from the surplus portion at the frame portion that is the peripheral portion of the display area. It may be a thing.

  Further, in the present specification, “cutting the optical member sheet based on the approximate contour line” means an area inside the approximate contour line along the approximate contour line to be calculated or larger than the size of the display region. The mode which cut | disconnects an optical member sheet | seat is shown. That is, the cutting position of the optical member sheet may be a position along the approximate contour line, or may be a position overlapping with a frame portion that is a peripheral portion of the display area.

  (2) In the optical display device production system according to (1), the imaging apparatus includes a plurality of imaging elements arranged in a first direction, and a second direction orthogonal to the first direction. It may be a line camera that moves to and picks up the image.

  (3) The optical display device production system according to (1) or (2) may include an illumination device that illuminates the stacked body from the side opposite to the imaging device with the stacked body interposed therebetween. Good.

  (4) In the optical display device production system according to any one of (1) to (3), the first portion is a portion predetermined as a vicinity of a corner of the substrate in plan view. And the control device may detect the coordinates of the plurality of points on each of two sides sandwiching the corner portion, excluding the first portion.

  (5) In the production system for an optical display device according to any one of (1) to (4) above, the optical member sheet is bonded to the surface of the optical display component conveyed on a line. The laminating apparatus which forms the said laminated body may be included.

  According to the present invention, there is provided an optical display device production system that detects the outer peripheral shape of a liquid crystal panel that is free from the influence of burrs and chips on the peripheral portion, and enables processing of optical members that match the outer peripheral shape. be able to.

It is a figure which shows schematic structure of the film bonding system of this embodiment. It is a top view of a liquid crystal panel. It is AA sectional drawing of FIG. It is a fragmentary sectional view of the optical member sheet bonded to a liquid crystal panel. It is a figure which shows operation | movement of a cutting device. It is a top view which shows the detection process of a bonding surface. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a perspective view which shows an example of the laser beam irradiation apparatus of this embodiment. It is a figure which shows the structure of EBS. It is a perspective view which shows the internal structure of IOR. It is a sectional side view which shows the arrangement configuration of a 1st condensing lens, an aperture member, and a collimating lens. (A)-(d) It is a figure for demonstrating the effect | action of EBS. (A)-(d) is the figure which paid its attention to one pulse of a laser beam. It is a figure for demonstrating the effect | action of IOR. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut | disconnected using the laser beam irradiation apparatus which concerns on a comparative example. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut | disconnected using the laser beam irradiation apparatus of this embodiment. It is a figure which shows the structure of a control system. It is a figure for demonstrating operation | movement of a table. It is a figure which shows the operation | movement flow of the cutting process by a laser beam irradiation apparatus. It is the figure which showed notionally the operation | movement of the cutting process. It is a schematic diagram of a detection apparatus. (A), (b) It is a schematic diagram which shows a mode that a target object is imaged using an imaging device. It is a schematic diagram which shows the vicinity of a corner | angular part among the images imaged with the imaging device. It is a graph which shows the approximate straight line calculated | required from several points on an outline. It is the schematic diagram which calculated | required the approximate outline. It is a schematic diagram which shows a mode that the sheet piece of a laminated body is cut | disconnected using a cutting device. It is a figure which shows the operation | movement flow of a cutting process. It is a figure which shows the control method for a laser beam to draw a desired locus | trajectory. (A), (b) It is explanatory drawing of the cutting process which concerns on a comparative example. (A), (b) It is explanatory drawing of the cutting process which concerns on this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments. In all the drawings below, the dimensions and ratios of the respective constituent elements are appropriately changed in order to make the drawings easy to see. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

(Optical display device production system)
Hereinafter, the film bonding system 1 which is a production system of the optical display device which concerns on one Embodiment of this invention is demonstrated with reference to drawings. The film bonding system 1 which concerns on this embodiment is comprised by the laser beam irradiation apparatus (refer FIG. 8) which a cutting device mentions later.

Drawing 1 is a figure showing the schematic structure of film pasting system 1 of this embodiment.
The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, an antireflection film, and a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.

  In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the transport direction of the liquid crystal panel, which is an optical display component, is the X direction, and the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

  As shown in FIG. 1, the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by a control device 40 as an electronic control device.

  FIG. 2 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 (element substrate) having a rectangular shape in plan view, and a second substrate P2 (counter substrate) having a relatively small rectangular shape disposed to face the first substrate P1. And a liquid crystal layer P3 sealed between the first substrate P1 and the second substrate P2. The liquid crystal panel P has a rectangular shape that follows the outer shape of the first substrate P1 in a plan view, and a region that fits inside the outer periphery of the liquid crystal layer P3 in a plan view is a display region P4.

  3 is a cross-sectional view taken along the line AA in FIG. First and second optical member sheets F1 and F2 (refer to FIG. 1, hereinafter may be collectively referred to as an optical member sheet FX), which are long strips, are respectively cut out on the front and back surfaces of the liquid crystal panel P. 1 optical member F11 and 2nd optical member F12 (henceforth abbreviated as optical member F1X) may be pasted suitably. In the present embodiment, the first optical member F11 and the second optical member F12 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively.

  Outside the display region P4, a frame portion G having a predetermined width for arranging a sealant or the like for joining the first and second substrates of the liquid crystal panel P is provided.

  In addition, the 1st optical member F11 and the 2nd optical member F12 are respectively the bonding surface from the 1st sheet piece F1m and the 2nd sheet piece F2m (henceforth a sheet piece FXm) mentioned later. It is formed by cutting off the excess part on the outside. The bonding surface will be described later.

  FIG. 4 is a partial cross-sectional view of the optical member sheet FX bonded to the liquid crystal panel P. The optical member sheet FX includes a film-shaped optical member main body F1a, an adhesive layer F2a provided on one surface (the upper surface in FIG. 4) of the optical member main body F1a, and one of the optical member main bodies F1a via the adhesive layer F2a. The separator F3a is detachably stacked on the other surface, and the surface protection film F4a is stacked on the other surface (lower surface in FIG. 4) of the optical member body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and its peripheral area. For convenience of illustration, hatching of each layer in FIG. 4 is omitted.

  The optical member body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface thereof. Hereinafter, the part remove | excluding the separator F3a from the optical member sheet | seat FX is called the bonding sheet | seat F5.

  The separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical member sheet FX may be configured not to include the surface protective film F4a, or the surface protective film F4a may be configured not to be separated from the optical member main body F1a.

  The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. And a second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

  The optical member main body F1a may have a single-layer structure composed of one optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancement film, or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.
As shown in FIG. 1, the film bonding system 1 of the present embodiment has a downstream side (− in the conveyance direction of the liquid crystal panel P on the left side in the drawing from the upstream side in the conveyance direction (+ X direction side) of the liquid crystal panel P on the right side in the drawing (−). X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.

  The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary. On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P <b> 4 is along the transport direction. On the other hand, on the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P <b> 4 along the transport direction. A sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical member sheet FX is bonded to the front and back surfaces of the liquid crystal panel P.

  In addition, the upstream conveyor 6 is provided with the independent free roller conveyor 24 in the downstream in the 1st adsorption | suction apparatus 11 mentioned later. On the other hand, the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.

  The film bonding system 1 of this embodiment is the 1st adsorption | suction apparatus 11, the 1st dust collector 12, the 1st bonding apparatus 13, the 1st detection apparatus 41, the 1st cutting device 31, the inversion apparatus 15, and 2nd collection. A dust device 16, a second bonding device 17, a second detection device 42, a second cutting device 32, and a control device 40 are provided.

  The first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P. The first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P. The panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P. When the conveyance is finished, the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.

In the alignment camera 11b, the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state. Image data obtained by the alignment camera 11b is transmitted to the control device 40. Based on the image data, the panel holding unit 11a is operated to align the liquid crystal panel P with the free roller conveyor 24 as the transport destination. In other words, the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the deviation in the turning direction around the vertical axis of the liquid crystal panel P. .
Here, the liquid crystal panel P conveyed on the rail R by the panel holding unit 11a is nipped by the pressure roll 23 together with the sheet piece FXm while being adsorbed by the adsorption pad 26.

  The 1st dust collector 12 is provided in the conveyance upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13. FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.

  The 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption | suction apparatus 11. FIG. The 1st bonding apparatus 13 bonds the bonding sheet | seat F5 (equivalent to 1st sheet piece F1m) cut into the predetermined size with respect to the lower surface of liquid crystal panel P introduced into the bonding position.

  The first bonding device 13 includes a transport device 22 and a pinching roll 23.

  The conveying device 22 conveys the optical member sheet FX along its longitudinal direction while unwinding the optical member sheet FX from the original roll R1 around which the optical member sheet FX is wound. The conveying apparatus 22 conveys the bonding sheet | seat F5 by using separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding unit 22a holds the original roll R1 around which the belt-shaped optical member sheet FX is wound, and feeds the optical member sheet FX along its longitudinal direction.
The plurality of guide rollers 22b wind the optical member sheet FX so as to guide the optical member sheet FX unwound from the original fabric roll R1 along a predetermined conveyance path.
The cutting device 22c performs a half cut on the optical member sheet FX on the transport path.
The knife edge 22d supplies the bonding sheet F5 to the bonding position while winding the optical member sheet FX subjected to the half cut at an acute angle to separate the bonding sheet F5 from the separator F3a.
The winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.

  The roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example. Thereby, the winding part 22e winds up the separator F3a that has passed through the knife edge 22d while the roll holding part 22a feeds the optical member sheet FX in the transport direction. Hereinafter, the upstream side in the transport direction of the optical member sheet FX (separator F3a) in the transport device 22 is referred to as a sheet transport upstream side, and the downstream side in the transport direction is referred to as a sheet transport downstream side.

  Each guide roller 22b changes the traveling direction of the optical member sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b is movable so as to adjust the tension of the optical member sheet FX being conveyed. To do.

  A dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical member sheet FX conveyed from the roll holding unit 22a while the optical member sheet FX is cut by the cutting device 22c.

FIG. 5 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
As shown in FIG. 5, when the optical member sheet FX is fed out by a predetermined length, the cutting device 22c extends in the thickness direction of the optical member sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical member sheet FX. Perform half cut to cut a part. The cutting device 22c of the present embodiment is provided so as to be able to advance and retreat toward the optical member sheet FX from the side opposite to the separator F3a with respect to the optical member sheet FX.

  The cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical member sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical member sheet FX (so that a predetermined thickness remains in the separator F3a). Then, half-cut is performed to the vicinity of the interface between the adhesive layer F2a and the separator F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

  In the optical member sheet FX after half-cutting, the optical member main body F1a and the surface protection film F4a are cut in the thickness direction, thereby forming cut lines L1 and L2 over the entire width in the width direction of the optical member sheet FX. Is done. The cut lines L1 and L2 are formed so as to be aligned in the longitudinal direction of the belt-shaped optical member sheet FX. For example, in the case of the bonding process which conveys the liquid crystal panel P of the same size, the plurality of cut lines L1 and L2 are formed at equal intervals in the longitudinal direction of the optical member sheet FX. The optical member sheet FX is divided into a plurality of sections in the longitudinal direction by a plurality of cut lines L1, L2. The section between the pair of cut lines L1 and L2 adjacent in the longitudinal direction in the optical member sheet FX is a sheet piece FXm in the bonding sheet F5. The sheet piece FXm is a sheet piece of the optical member sheet FX having a size that protrudes outside the liquid crystal panel P.

  Returning to FIG. 1, the knife edge 22 d is disposed below the upstream conveyor 6 and extends at least over the entire width in the width direction of the optical member sheet FX. The knife edge 22d is wound so as to be in sliding contact with the separator F3a side of the optical member sheet FX after the half cut.

  The knife edge 22d is arranged from the width direction of the optical member sheet FX above the first surface, and the first surface is disposed in an inclined position when viewed from the width direction of the optical member sheet FX (the width direction of the upstream conveyor 6). It has a second surface arranged at an acute angle with respect to the first surface as viewed, and a tip portion where the first surface and the second surface intersect.

  In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical member sheet | seat F1 at an acute angle at the front-end | tip part. The first optical member sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d is introduced between the pair of bonding rollers 23a of the pinching roll 23 while overlapping the lower surface of the liquid crystal panel P in a state of being sucked by the first suction device 11. Is done. The first sheet piece F1m is a sheet piece of the first optical member sheet F1 having a size that protrudes outside the liquid crystal panel P.

  On the other hand, the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d. The winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.

  The pinching roll 23 bonds the first sheet piece F1m separated from the first optical member sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6. The pinching roll 23 bonds the first sheet piece F1m to the lower surface of the liquid crystal panel P conveyed on the line to form a laminate described later. Here, the pinching roll 23 is equivalent to the bonding apparatus as described in a claim.

  The pinching roll 23 has a pair of bonding rollers 23a and 23a arranged in parallel with each other in the axial direction (the upper bonding roller 23a moves up and down). A predetermined gap is formed between the pair of bonding rollers 23 a and 23 a, and the inside of this gap is the bonding position of the first bonding apparatus 13.

  In the gap, the liquid crystal panel P and the first sheet piece F1m are introduced overlapping each other. These liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being clamped by each bonding roller 23a. In this embodiment, 1st optical member bonding body PA1 is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG. Here, 1st optical member bonding body PA1 is corresponded to the laminated body as described in a claim.

  The 1st detection apparatus 41 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m.

FIG. 6 is a plan view showing a step of detecting the edge ED of the first bonding surface SA1.
For example, as illustrated in FIG. 6, the first detection device 41 detects the edge ED of the first bonding surface SA <b> 1 in the inspection area CA installed on the transport path of the upstream conveyor 6. Inspection area | region CA is an area | region containing 1st bonding surface SA1 which has a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The data of the edge ED detected by the first detection device 41 is stored in a storage unit (not shown). The configuration of the first detection device 41 will be described later (see FIG. 21).

  The cutting position of the first sheet piece F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control apparatus 40 (refer FIG. 1) acquires the data of the edge ED of 1st bonding surface SA1 memorize | stored in the memory | storage part, and the 1st optical member F11 is outside the liquid crystal panel P (1st bonding surface SA1). The cutting position of the first sheet piece F1m is determined so as not to protrude beyond the outer side. The first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control device 40.

  Returning to FIG. 1, the first cutting device 31 is provided on the downstream side of the panel conveyance with respect to the first detection device 41. The 1st cutting device 31 performs the laser cut along edge ED, and is the 1st sheet piece F1m (1st sheet | seat) of the part which protruded outside 1st bonding surface SA1 from 1st optical member bonding body PA1. The surplus portion of the piece F1m) is cut off, and an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1 is formed. Here, the 1st cutting device 31 is corresponded to the cutting device as described in a claim.

Here, the “size corresponding to the first bonding surface SA1” indicates the size of the outer shape of the first substrate P1. However, it includes a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and that avoids a functional part such as an electrical component mounting portion. In the present embodiment, in the three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P, and in one side corresponding to the functional portion, the liquid crystal The surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge of the panel P. For example, when the portion corresponding to the first bonding surface SA1 is the bonding surface of the TFT substrate, a predetermined amount from the outer peripheral edge of the liquid crystal panel P to the display region P4 side so as to exclude the functional portion on one side corresponding to the functional portion. Cut at the shifted position.
In addition, it is not restricted to bonding a sheet piece to the area | region (for example, whole liquid crystal panel P) containing the said functional part in liquid crystal panel P. FIG. For example, a sheet piece is pasted in a region avoiding the functional portion in the liquid crystal panel P in advance, and then along the outer peripheral edge of the liquid crystal panel P on three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view. The excess portion may be laser cut.

  The 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P by cutting off the surplus part of the 1st sheet piece F1m from the 1st optical member bonding body PA1 by the 1st cutting device 31. 2 optical member bonding body PA2 is formed. The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

  The reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.

  The reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11. The reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.

  The reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control device 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce | transduced into the bonding position of the 2nd bonding apparatus 17. FIG.

  Since the 2nd adsorption | suction apparatus 20 is equipped with the structure similar to the 1st adsorption | suction apparatus 11, it attaches | subjects and demonstrates the same code | symbol to the same part. The 2nd adsorption | suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2. The second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2. Do. The panel holding | maintenance part 11a adsorbs and hold | maintains the upper surface of 2nd optical member bonding body PA2 contact | abutted to the stopper S by vacuum suction. The panel holding | maintenance part 11a moves on the rail R in the state which adsorbed and hold | maintained 2nd optical member bonding body PA2, and conveys 2nd optical member bonding body PA2. When the conveyance is finished, the panel holding unit 11a releases the suction holding and transfers the second optical member bonding body PA2 to the free roller conveyor 24.

  In the alignment camera 11b, the panel holding unit 11a holds the second optical member bonding body PA2 in contact with the stopper S, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state. Imaging data from the alignment camera 11b is transmitted to the control device 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with the free roller conveyor 24 as the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.

  The 2nd dust collector 16 is arrange | positioned in the conveyance direction upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 2nd bonding apparatus 17. FIG. The second dust collecting device 16 performs static electricity removal and dust collection in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side.

  The 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16. FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position. Do. The 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13. FIG.

  In the gap between the pair of bonding rollers 23a of the pinching roll 23 (the bonding position of the second bonding device 17), the second optical member bonding body PA2 and the second sheet piece F2m are overlapped and introduced. The second sheet piece F2m is a sheet piece of the second optical member sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

  These 2nd optical member bonding body PA2 and 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by each bonding roller 23a. In this embodiment, it is a 2nd sheet | seat on the surface (surface on the opposite side to the surface where the 1st optical member F11 of 2nd optical member bonding body PA2 was bonded) of the liquid crystal panel P by the pinching roll 23. By bonding the piece F2m, the third optical member bonding body PA3 is formed. Here, 3rd optical member bonding body PA3 is corresponded to the laminated body as described in a claim.

  The 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

  The cut position of the 2nd sheet piece F2m is adjusted based on the detection result of the edge of the 2nd bonding surface. The control apparatus 40 (refer FIG. 1) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 2nd optical member F12 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the second sheet piece F2m is determined so as not to protrude. The second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control device 40. Here, the 2nd cutting device 32 is corresponded to the cutting device as described in a claim.

  The second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42. The 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) of the magnitude | size corresponding to a 2nd bonding surface is formed.

  Here, the “size corresponding to the second bonding surface” is not less than the size of the display area P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. Point to. In the present embodiment, the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P having a rectangular shape in plan view. For example, when the portion corresponding to the second bonding surface is the bonding surface of the CF substrate, there is no portion corresponding to the functional portion, and therefore the four sides of the liquid crystal panel P are cut along the outer peripheral edge of the liquid crystal panel P. .

  The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and The 4th optical member bonding body PA4 (optical display device) by which the 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P is formed. The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

  Here, the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus 100 (refer FIG. 8). The 1st cutting device 31 and the 2nd cutting device 32 cut | disconnect endlessly the sheet piece FXm bonded by liquid crystal panel P along the outer periphery of the bonding surface.

  A bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17. The bonding inspection apparatus is an inspection (not shown whether the position of the optical member F1X is appropriate (whether the position deviation is within the tolerance range)) by the inspection apparatus (not shown) of the workpiece (liquid crystal panel P) on which the film is bonded. Etc.). The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

  In addition, in this embodiment, the control apparatus 40 as an electronic control apparatus which performs overall control of each part of the film bonding system 1 is comprised including the computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk. The control device 40 of the present embodiment includes an interface capable of executing communication with a device external to the computer system. An input device that can input an input signal may be connected to the control device 40. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control device 40 may include a display device such as a liquid crystal display that indicates the operation status of each part of the film bonding system 1, or may be connected to the display device.

  An operating system (OS) that controls the computer system is installed in the storage unit of the control device 40. A program that causes the storage unit of the control device 40 to execute processing for causing each unit of the film bonding system 1 to accurately convey the optical member sheet F by causing the arithmetic processing unit to control each unit of the film bonding system 1. Is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control device 40. The control device 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each part of the film bonding system 1.

  The storage unit is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. The storage unit functionally includes the first adsorption device 11, the first dust collector 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the reversing device 15, and the second adsorption device 20. , Second dust collector 16, second bonding device 17, second detection device 42, storage area for storing program software in which the control procedure of the operation of second cutting device 32 is described, and other various storage areas are set Is done.

  Hereinafter, with reference to FIG. 7, an example of the determination method of the bonding position (relative bonding position) of the sheet piece FXm with respect to liquid crystal panel P is demonstrated.

  First, as shown in FIG. 7A, a plurality of inspection points CP are set in the width direction of the optical member sheet FX, and the direction of the optical axis of the optical member sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical member sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical member sheet FX is stored in a storage unit (not shown) in association with the position of the optical member sheet FX (position in the longitudinal direction and position in the width direction of the optical member sheet FX).

  The control device 40 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each inspection point CP from the storage unit, and the optical member sheet FX (by the cut line CL) of the portion where the sheet piece FXm is cut out. The direction of the average optical axis of the sectioned area) is detected.

  For example, as shown in FIG. 7B, the angle (deviation angle) formed by the direction of the optical axis and the edge line EL of the optical member sheet FX is detected for each inspection point CP, and the largest angle ( When the maximum deviation angle) is θmax and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is defined as the average deviation angle. To detect. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical member sheet FX is detected as the average direction of the optical axis of the optical member sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical member sheet FX and the clockwise direction being negative.

  Then, the direction of the average optical axis of the optical member sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specifications, the average optical axis of the optical member sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

  The first cutting device 31 and the second cutting device 32 described above detect the outer peripheral edge of the display area P4 of the liquid crystal panel P with a detection means such as a camera, and paste the sheet piece FXm bonded to the liquid crystal panel P to the bonding surface. Cut endlessly along the outer periphery. The outer periphery of the bonding surface is detected by capturing an image including the bonding surface. In this embodiment, the laser cutting by each cutting device 31 and 32 is made along the outer periphery of the bonding surface.

  The runout width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in this embodiment, the outer peripheral edge of the bonding surface is compared with the case where the optical member sheet FX is cut using the cutting blade. The liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

  When the optical member sheet FX is cut into a sheet piece that matches the display area P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and their relative bonding positions Therefore, it becomes difficult to reduce the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

  On the other hand, after cutting out the sheet piece FXm of the optical member sheet FX having a size that protrudes outside the liquid crystal panel P from the optical member sheet FX, the cut sheet piece FXm is bonded to the liquid crystal panel P, and then cut according to the bonding surface. In this case, it is only necessary to consider the runout tolerance of the cutting line, and the tolerance of the width of the frame portion G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

  Further, by cutting the sheet piece FXm with a laser instead of a blade, the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion.

(Cutting device)
FIG. 8 is a perspective view showing an example of a laser beam irradiation device 100 used as a cutting device (first cutting device 31 and second cutting device 32). The laser light irradiation apparatus 100 uses the laminated body (1st optical member bonding body PA1 or 3rd optical member bonding body PA3) containing the sheet piece FXm as the target object 110, cuts off the excess part of the sheet piece FXm, and bonded surface ( The cutting process which forms the optical member F1X of the magnitude | size corresponding to a 1st bonding surface or a 2nd bonding surface) is performed.

  As shown in FIG. 8, a laser beam irradiation apparatus 100 includes a table 101, a laser beam oscillator 102, an acoustooptic device 103 that constitutes an EBS 130 (Electrical Beam Shaping: see FIG. 9), and an IOR 104 (Imaging Optics Rail). A scanner 105, a moving device 106, and a control device 107 that performs overall control of these devices.

  The table 101 has a holding surface 101s that holds an object 110 to be cut. The table 101 is rectangular when viewed from the normal direction of the holding surface 101s. The holding surface 101s is a rectangular first holding surface 101s1 having a length in the first direction (X direction), and a second holding member that is disposed adjacent to the first holding surface 101s1 and has the same shape as the first holding surface 101s1. Surface 101s2. That is, the table 101 has the first holding surface 101s1 and the second holding surface 101s2, so that the two objects 110 can be held simultaneously.

The laser beam oscillator 102 is a member that oscillates the laser beam L. For example, as the laser beam oscillator 102, a CO ₂ laser beam oscillator (carbon dioxide laser beam oscillator), a UV laser beam oscillator, a semiconductor laser beam oscillator, a YAG laser beam oscillator, an excimer laser beam oscillator, etc. Although an oscillator can be used, a specific configuration is not particularly limited. Among the above-described oscillators, a CO ₂ laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for cutting an optical member such as a polarizing film.

FIG. 9 is a diagram illustrating a configuration of the EBS 130.
As shown in FIG. 9, the EBS 130 includes an acousto-optic element 103 disposed on the optical path of laser light oscillated from the laser light oscillator 102, a drive driver 131 electrically connected to the acousto-optic element 103, And a control device 107 (corresponding to a laser control unit 171 to be described later) that controls the timing at which the laser light passes through the acoustooptic device 103.
The EBS 130 shields the laser light until the output of the laser light is stabilized.

  The acousto-optic element 103 is an optical element for shielding the laser light oscillated from the laser light oscillator 102.

The acoustooptic element 103 is obtained by bonding a piezoelectric element to an acoustooptic medium made of single crystal or glass such as tellurium dioxide (TeO ₂ ) or lead molybdate (PbMoO ₄ ). By applying an electrical signal to the piezoelectric element to generate an ultrasonic wave and propagating the ultrasonic wave into the acousto-optic medium, the passage and non-passing (shielding) of the laser light can be controlled.

  In this embodiment, the acousto-optic element 103 is used as a constituent member of the EBS 130, but the present invention is not limited to this. Other optical elements may be used as long as the laser light oscillated from the laser light oscillator 102 can be shielded.

  The drive driver 131 supplies an electrical signal (control signal) for generating an ultrasonic wave to the acoustooptic device 103 based on the control of the control device 107 and adjusts the shielding time of the laser light by the acoustooptic device 103.

  For example, the control device 107 controls the timing at which the laser light passes through the acoustooptic device 103 so that the rising and falling portions of the laser light oscillated from the laser light oscillator 102 are removed.

  The timing control by the control device 107 is not limited to this. For example, the control device 107 may control the timing at which the laser light passes through the acousto-optic element 103 so that the rising portion of the laser light oscillated from the laser light oscillator 102 is selectively removed. In particular, when the width (time) of the falling portion of the laser light oscillated from the laser light oscillator 102 is sufficiently shorter than the width (time) of the rising portion of the laser light, the falling portion of the laser light is removed. The profit to do is small. Therefore, in such a case, only the rising portion of the laser beam oscillated from the laser beam oscillator 102 may be selectively removed.

  With such a configuration, the EBS 130 emits the laser light oscillated from the laser light oscillator 102 with a stable output based on the control of the control device 107.

  The IOR 104 removes a skirt portion that does not contribute to the cutting of the object 110 in the intensity distribution of the laser light.

FIG. 10 is a perspective view showing the internal configuration of the IOR 104.
As shown in FIG. 10, the IOR 104 includes a first condenser lens 141 that condenses the laser light emitted from the EBS 130, a first holding frame 142 that holds the first condenser lens 141, and a first condenser lens. A diaphragm member 143 that squeezes the laser light condensed by the lens 141, a holding member 144 that holds the diaphragm member 143, a collimator lens 145 that collimates the laser light squeezed by the diaphragm member 143, and a collimator lens 145 are held. A second holding frame 146 and a moving mechanism 147 for relatively moving the first holding frame 142, the holding member 144, and the second holding frame 146 are included.

  FIG. 11 is a side sectional view showing an arrangement configuration of the first condenser lens 141, the diaphragm member 143, and the collimator lens 145.

  As shown in FIG. 11, the aperture member 143 is formed with a pinhole 143 h for condensing the laser beam condensed by the first condenser lens 141. The centers of the first condenser lens 141, the pinhole 143 h and the collimator lens 145 are arranged at positions overlapping the optical axis C of the laser light emitted from the EBS 130.

  The diaphragm member 143 is preferably disposed in the vicinity of the rear focal point of the first condenser lens 141.

Here, “near the rear focal point of the first condenser lens 141” means that the arrangement position of the diaphragm member 143 is slightly different from the rear focal point of the first condenser lens 141 so that the arrangement position is slightly different. It means that it may be allowed. For example, the distance K ₁ from the center of the first condenser lens 141 to the rear focal point of the first condenser lens 141 and the distance K ₂ from the center of the first condenser lens 141 to the center of the pinhole 143 h of the aperture member 143. If the ratio K ₁ / K ₂ is in the range of 0.9 / 1 to 1.1 / 1, it can be said that the diaphragm member 143 is disposed in the vicinity of the rear focal point of the first condenser lens 141. . If it is such a range, the laser beam condensed by the 1st condensing lens 141 can be narrowed down effectively.

  The diaphragm member 143 is preferably disposed in the vicinity of the rear focal point of the first condenser lens 141, but the arrangement position of the diaphragm member 143 is not necessarily limited to this position. The arrangement position of the aperture member 143 may be on the optical path between the first condenser lens 141 and the collimator lens 145, and is not limited to the vicinity of the rear focal point of the first condenser lens 141.

  Returning to FIG. 10, the moving mechanism 147 moves the first holding frame 142, the holding member 144, and the second holding frame 146 in a direction parallel to the traveling direction of the laser light, and the slider mechanism 148. Holding base 149 for holding.

  For example, the first holding frame 142 and the holding member 144 are moved by moving the first holding frame 142 and the second holding frame 146 in a direction parallel to the traveling direction of the laser beam in a state where the holding member 144 is arranged at a fixed position. And the mutual positioning of the 2nd holding frame 146 is performed. Specifically, the diaphragm member 143 is disposed at the position of the front focal point of the collimating lens 145 and at the position of the rear focal point of the first condenser lens 141.

  Returning to FIG. 8, the scanner 105 performs biaxial scanning of the laser light in a plane parallel to the holding surface 101 s (in the XY plane). That is, the scanner 105 moves the laser light relative to the table 101 independently in the X direction and the Y direction. Thereby, it is possible to accurately irradiate the laser beam to an arbitrary position of the object 110 held on the table 101.

  The scanner 105 includes a first irradiation position adjustment device 151 and a second irradiation position adjustment device 154.

  The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 constitute a scanning element that biaxially scans the laser light emitted from the IOR 104 in a plane parallel to the holding surface 101s. As the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154, for example, a galvano scanner is used. The scanning element is not limited to a galvano scanner, and a gimbal can be used.

  The first irradiation position adjustment device 151 includes a mirror 152 and an actuator 153 that adjusts the installation angle of the mirror 152. The actuator 153 has a rotation axis parallel to the Z direction. The actuator 153 rotates the mirror 152 around the Z axis based on the control of the control device 107.

  The second irradiation position adjustment device 154 includes a mirror 155 and an actuator 156 that adjusts the installation angle of the mirror 155. The actuator 156 has a rotation axis parallel to the Y direction. The actuator 156 rotates the mirror 155 around the Y axis based on the control of the control device 107.

  On the optical path between the scanner 105 and the table 101, a second condenser lens 108 that condenses the laser light that has passed through the scanner 105 toward the holding surface 101s is disposed.

  For example, an fθ lens is used as the second condenser lens 108. Thereby, the laser beam emitted in parallel to the second condenser lens 108 from the mirror 155 can be condensed in parallel to the object 110.

  Note that the second condenser lens 108 may not be disposed on the optical path between the scanner 105 and the table 101.

  The laser beam L oscillated from the laser beam oscillator 102 is applied to the object 110 held on the table 101 via the acoustooptic device 103, the IOR 104, the mirror 152, the mirror 155, and the second condenser lens. . The first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 are configured to control the laser light emitted from the laser light oscillator 102 toward the object 110 held on the table 101 based on the control of the control device 107. Adjust the irradiation position.

  A laser beam processing region 105s (hereinafter referred to as a scan region) controlled by the scanner 105 is rectangular when viewed from the normal direction of the holding surface 101s. In the present embodiment, the area of the scan region 105s is smaller than the areas of the first holding surface 101s1 and the second holding surface 101s2.

12A to 12D are diagrams for explaining the operation of the EBS 130. FIG.
FIG. 12A shows a control signal for the laser beam oscillated from the laser beam oscillator 102.
FIG. 12B shows the output characteristics of the laser light itself oscillated from the laser light oscillator 102, that is, the output characteristics of the laser light before the laser light oscillated from the laser light oscillator 102 passes through the acoustooptic device 103. Is shown.
FIG. 12C shows a control signal for the acousto-optic element 103.
FIG. 12D shows the output characteristics of the laser light after the laser light oscillated from the laser light oscillator 102 passes through the acoustooptic device 103.
In each of FIGS. 12B and 12D, the horizontal axis represents time, and the vertical axis represents laser light intensity.
FIGS. 13A to 13D are diagrams focusing on one pulse of laser light in FIGS. 12A to 12D.
In the following description, the “control signal for laser light oscillated from the laser light oscillator 102” is referred to as “control signal for laser light”. “Output characteristics of laser light before the laser light oscillated from the laser light oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light before passing through the acousto-optic element 103”. “Output characteristics of laser light after the laser light oscillated from the laser light oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light after passing through the acousto-optic element 103”.

  As shown in FIGS. 12A and 13A, the pulse Ps1 of the laser light control signal is a rectangular pulse. As shown in FIG. 12A, the laser light control signal is a so-called clock pulse that generates a plurality of pulses Ps1 by periodically switching the ON / OFF signal to the laser light oscillator 102.

  12A and 13A, a peak portion of the pulse Ps1 is in a state where an ON signal is sent to the laser beam oscillator 102, that is, an ON state in which laser light is oscillated from the laser beam oscillator 102. It is. The valley portion of the pulse Ps1 is a state where an OFF signal is sent to the laser beam oscillator 102, that is, an OFF state where no laser beam is oscillated from the laser beam oscillator 102.

  As shown in FIG. 12A, one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals. The three collective pulses PL1 are arranged at intervals longer than the arrangement interval of the three pulses Ps1. For example, the interval between two adjacent pulses Ps1 is 1 ms, and the interval between two adjacent collective pulses PL1 is 10 ms.

In the present embodiment, an example in which one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals is described, but the present invention is not limited to this. For example, one collective pulse may be formed by arranging a plurality of two or four or more pulses at short intervals.
Further, the configuration is not limited to the plurality of pulses being periodically formed, and one pulse may be formed with a long width. That is, a configuration in which laser light having a certain intensity from an ON signal to an OFF signal to the laser light oscillator is oscillated for a predetermined time may be employed.

  As shown in FIGS. 12B and 13B, the pulse Ps2 of the output characteristic of the laser light before passing through the acoustooptic device 103 is a waveform pulse having a rising portion G1 and a falling portion G2.

  Here, the rising portion G1 means a portion of the pulse Ps2 in a period from when the intensity of the laser beam reaches zero to an intensity that contributes to the cutting of the object. The falling portion G2 means a portion in the period from the intensity at which the intensity of the laser light contributes to the cutting of the object to zero, among the pulses Ps2 of the output characteristics of the laser light. The intensity that contributes to the cutting of the object varies depending on the material and thickness of the object and the output value of the laser beam. As an example, as shown in FIG. 13B, 50% of the peak intensity (100%) of the laser beam. % Strength.

  As shown in FIGS. 12B and 13B, the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2. That is, the time of the rising portion G1 of the laser light oscillated from the laser light oscillator 102 is longer than the time of the falling portion G2 of the laser light. For example, the width of the rising portion G1 is 45 μs, and the width of the falling portion G2 is 25 μs.

  In the present embodiment, an example is described in which the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2, but this is not limitative. For example, when the width of the rising portion G1 of the pulse Ps2 is substantially equal to the width of the falling portion G2, the present invention can be applied even when the width of the rising portion G1 of the pulse Ps2 is shorter than the width of the falling portion G2. is there.

  As shown in FIG. 12B, one collective pulse PL2 is formed by arranging the three pulses Ps2 at positions corresponding to the three pulses Ps1 shown in FIG. The three collective pulses PL2 are arranged at positions corresponding to the three collective pulses PL1 shown in FIG.

  As shown in FIGS. 12 (c) and 13 (c), the control signal pulse Ps3 of the acoustooptic device 103 is a rectangular pulse. As shown in FIG. 12C, the control signal for the acoustooptic device 103 is periodically switched so that the timing at which the laser light passes through the acoustooptic device 103 is periodically switched. This is a so-called clock pulse that generates a plurality of pulses Ps3.

  In FIG. 12C and FIG. 13C, the peak portion of the pulse Ps3 is in a state where laser light is transmitted, that is, a light-transmitting state where laser light is transmitted. The valley portion of the pulse Ps3 is in a state where laser light is not passed, that is, in a light shielding state where the laser light is shielded.

  As shown in FIG. 13C, the valley portion of each pulse Ps3 is arranged so as to overlap both the rising portion G1 and the falling portion G2 of each pulse Ps2 shown in FIG.

  As shown in FIG. 13C, when focusing on one pulse Ps3, the width of the valley portion V1 on the front side of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the rear side of the pulse Ps3 The width of the valley portion V2 is substantially equal to the width of the falling portion of the pulse Ps2. For example, the width of the valley portion V1 on the front side of the pulse Ps3 is 45 μs, and the width of the valley portion V2 on the rear side of the pulse Ps3 is 25 μs. As described above, the EBS 130 has a switch function having a quick response characteristic.

  As a result, the rising portion G1 and the falling portion G2 of the laser beam can be removed, and the portion of the laser beam output characteristic pulse Ps2 in which the intensity of the laser beam contributes to the cutting of the object can be selectively extracted. .

  As a result, as shown in FIGS. 12D and 13D, the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic device 103 does not have a rising portion G1 and a falling portion G2. It becomes a pulse protruding to

  In the present embodiment, the width of the front valley portion V1 of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the width of the rear valley portion V2 of the pulse Ps3 is the rising edge of the pulse Ps2. Although an example that is substantially equal to the width of the falling portion is described, the present invention is not limited to this. For example, the width of the valley portion V1 on the front side of the pulse Ps3 is made substantially equal to the width of the rising portion G1 of the pulse Ps2, or the width of the valley portion V2 on the rear side of the pulse Ps3 is made larger than the width of the falling portion of the pulse Ps2. It can be appropriately adjusted as necessary, for example, by increasing the size.

FIG. 14 is a diagram for explaining the operation of the IOR 104.
The diagram on the left side of FIG. 14 is a diagram showing the intensity distribution of the laser light before passing through the pinhole 143h. The upper left diagram in FIG. 14 is a plan view, the middle left diagram in FIG. 14 is a perspective view, and the lower left diagram in FIG. 14 is a diagram in which the horizontal axis indicates the position and the vertical axis indicates the strength. is there.
The diagram on the right side of FIG. 14 shows the intensity distribution of the laser light after passing through the pinhole 143h. The upper right diagram in FIG. 14 is a plan view, the right middle diagram in FIG. 14 is a perspective view, and the lower right diagram in FIG. 14 is a diagram in which the horizontal axis indicates the position and the vertical axis indicates the strength. is there.
FIG. 15 is an enlarged view of a cut surface when a polarizing plate, which is an object, is cut using the laser light irradiation apparatus according to the comparative example.
Here, the laser beam irradiation apparatus according to the comparative example is a laser beam irradiation apparatus that uses the laser beam before passing through the pinhole 143h as it is, that is, a laser beam irradiation apparatus that does not include the IOR 104.
FIG. 16 is an enlarged view of a cut surface when a polarizing plate that is an object is cut using the laser beam irradiation apparatus 100 according to the present embodiment.

  As shown in the diagram on the left side of FIG. 14, the intensity distribution of the laser light before passing through the pinhole 143h has a strong intensity distribution at the center of the beam and a low intensity distribution at the outer periphery of the beam. . When the intensity of the laser beam at the outer periphery of the beam is reduced, the outer periphery of the beam does not contribute to the cutting of the object.

  In this case, as shown in FIG. 15, in the laser beam irradiation apparatus according to the comparative example, it is confirmed that the cut surface of the polarizing plate has a tapered shape. This is considered to be due to the fact that when the polarizing plate was cut, the outer peripheral portion of the laser beam diameter affected the portion along the cut line, thereby dissolving the portion other than the polarizing plate cut region. .

  On the other hand, as shown in the diagram on the right side of FIG. 14, the intensity distribution of the laser light after passing through the pinhole 143h has a skirt portion that does not contribute to the cutting of the polarizing plate in the intensity distribution of the laser light. By being removed, the intensity distribution of the laser light becomes an ideal Gaussian distribution. The half width of the intensity distribution of the laser light after passing through the pinhole 143h is narrower than the half width of the intensity distribution of the laser light before passing through the pinhole 143h.

  In this case, as shown in FIG. 16, in the laser beam irradiation apparatus 100 including the IOR 104 according to the present embodiment, it is confirmed that the cut surface of the polarizing plate is perpendicular to the holding surface. This is because when the polarizing plate is cut, the portion of the laser light intensity distribution that contributes to the cutting of the polarizing plate is irradiated to the polarizing plate, so that the cut region of the polarizing plate can be selectively fused. Conceivable.

  Returning to FIG. 8, the moving device 106 relatively moves the table 101 and the scanner 105. The moving device 106 includes a first slider mechanism 161 and a second slider mechanism 162. The first slider mechanism 161 is for moving the table 101 in a first direction (X direction) parallel to the holding surface 101s. The second slider mechanism 162 is for moving the first slider mechanism 161 in a second direction (Y direction) parallel to the holding surface 101s and perpendicular to the first direction.

  Based on such a configuration, the moving device 106 includes a linear motor (hereinafter referred to as slider mechanism 161 or 162) incorporated in each of the first slider mechanism 161 and the second slider mechanism 162. It is possible to move the table 101 in each of XY directions by actuating (not shown).

  The linear motor pulse-driven in the slider mechanisms 161 and 162 can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Accordingly, the position of the table 101 supported by the slider mechanism 161 in each direction of XY can be controlled with high accuracy. Note that the position control of the table 101 is not limited to the position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.

  The control device 107 includes a laser control unit 171 that controls the laser light oscillator 102 and the acoustooptic device 103 (drive driver 131), a scanner control unit 172 that controls the scanner 105, and a slider control unit 173 that controls the moving device 106. And having.

Specifically, the laser controller 171 turns on / off the laser beam oscillator 102, the output of the laser beam oscillated from the laser beam oscillator 102, and the laser beam L oscillated from the laser beam oscillator 102 is acousto-optic. The timing of passing through the element 103 and the drive driver 131 are controlled.
The scanner control unit 172 controls driving of the actuator 153 of the first irradiation position adjustment device 151 and the actuator 156 of the second irradiation position adjustment device 154.
The slider control unit 173 controls the operation of the linear motor built in each of the slider mechanisms 161 and 162.

FIG. 17 is a diagram illustrating a configuration of a control system of the laser light irradiation apparatus 100.
As shown in FIG. 17, an input device 109 capable of inputting an input signal is connected to the control device 107. The input device 109 includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. The control device 107 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the laser light irradiation device 100, or may be connected to the display device.

  When the initial setting is completed by the user inputting processing data to the input device 109, laser light is oscillated from the laser light oscillator 102 based on the control of the laser control unit 171 of the control device 107. At this time, based on the control of the scanner control unit 172 of the control device 107, rotation driving of the mirrors constituting the scanner 105 is started. At the same time, based on the control of the slider control unit 173 of the control device 107, the rotational speed of a drive shaft such as a motor provided in the slider mechanisms 161 and 162 is detected by a sensor such as a rotary encoder.

  The control device 107 corrects each coordinate value in real time so that the laser beam is emitted to the coordinate that matches the machining data, that is, the laser beam draws a desired locus on the object 110 (see FIG. 8). Thus, the moving device 106 and the scanner 105 are controlled. For example, the scanning of the laser beam is mainly performed by the moving device 106, and an area where the irradiation position of the laser light cannot be controlled with the moving device 106 is adjusted by the scanner 105.

FIG. 18 is a diagram for explaining the operation of the table 101 by the moving device 106.
As shown in FIG. 18, the table 101 is moved in the second direction (Y by the second slider mechanism 162 between the standby position WP1 and the cutting position WP2 where the laser beam is cut by the control of the scanner 105. Direction). Here, the standby position WP1 refers to a loading standby position when the object 110 to be cut from the outside is carried onto the holding surface 101s of the table 101, or a holding surface for the object 110 that has been subjected to the cutting process. Also serves as an unloading standby position for unloading from the top of 101s.

  Note that the cutting position WP2 refers to at least a part of the object 110 held on the holding surface 101s and at least a part of the scan region 105s (see FIG. 8) by the scanner 105 when viewed in plan from the Z direction. This is the position in the second direction (Y direction) of the table 101 in an overlapping state.

  Based on such a configuration, after the two objects 110 are carried into the holding surface 101s (the first holding surface 101s1 and the second holding surface 101s2) at the standby position WP1, as shown in FIG. The two objects 110 held on the holding surface 101s are moved to the cutting position WP2. The table 101 moves the object 110 that has been subjected to the predetermined cutting process at the cutting position WP2 to the standby position WP1, and then carries the object 110 to the outside at the standby position WP1.

  The cutting process using the table 101 includes a carry-in step for carrying the object 110 at the standby position WP1, a forward movement step for moving the object 110 carried at the standby position WP1 to the cutting position WP2, and a cutting position WP2. A cutting step for performing a predetermined cutting process, a return path moving step for moving the object 110 from the cutting position WP2 to the standby position WP1 after the cutting step, and an unloading for discharging the object 110 from the standby position WP1 after the return path moving step Steps.

  FIG. 19 is a diagram illustrating an operation flow of a cutting process using the table 101 as a cutting process performed by the laser beam irradiation apparatus 100. FIG. 20 is a diagram conceptually showing the operation of the cutting process using the table 101.

  First, the table 101 carries the object 110 from the carry-in device 115 (see FIGS. 18 and 20) at the standby position WP1 (carry-in step S1 shown in FIG. 19). Note that the carry-in device 115 may be a part of the constituent elements of the laser light irradiation apparatus 100 or may be a part of the constituent elements of the apparatus other than the laser light irradiation apparatus 100.

  In the present embodiment, before the table 101 moves from the standby position WP1 to the cutting position WP2, an alignment process is performed in which the relative position of the object 110 with respect to the cutting position WP2 is detected and the relative position is corrected based on the detection result. (Alignment step S2 shown in FIG. 19).

After the alignment, the table 101 moves the object 110 carried in at the standby position WP1 to the cutting position WP2 (cutting position movement step (outward movement step) S3 shown in FIG. 19).
After the movement to the cutting position WP2, a predetermined cutting process as described later is performed on the object 110 on the holding surface 101s (cutting step S4 shown in FIG. 19). After the cutting process, the table 101 moves to the standby position WP1 where the object 110 that has been subjected to the cutting process is carried out by the carrying-out device 116 (see FIGS. 18 and 20) (the carrying-out position moving step (return path moving step shown in FIG. 19)). ) S5). The carry-out device 116 may be a part of the constituent elements of the laser light irradiation apparatus 100 or may be a part of the constituent elements of the apparatus other than the laser light irradiation apparatus 100.

  After moving to the standby position WP1, the object 110 is unloaded from the holding surface 101s of the table 101 by the unloading device 116 (unloading step S6 shown in FIG. 19).

  In the carry-in step S1, as shown in FIG. 20 (a), the carry-in device 115 carries the object 110 onto the holding surface 101s of the table 101 at the standby position WP1. The carry-in device 115 includes a carry-in conveyor unit 115b and a holding unit 115a that sucks and holds the object 110 on the carry-in conveyor unit 115b. The holding part 115a can be transferred to the holding surface 101s (the first holding surface 101s1 and the second holding surface 101s2) while holding the two objects 110 at the same time. The carry-in conveyor unit 115b is configured by, for example, a belt conveyor.

  After the carry-in step S1, in the alignment step S2, as shown in FIG. 20B, the target object 110 is detected before the target object detection device 117 moves from the standby position WP1 to the cutting position WP2. The object detection device 117 includes a detection camera 117a that images the object 110, and detects the relative position of the object 110 with respect to the cutting position WP2 by using the detection camera 117a. Note that the alignment step S2 is not necessarily required, for example, when the carry-in device 115 has a very high carry-in accuracy onto the holding surface 101s, and may be omitted. According to this, the object detection device 117 is not necessary. As a result, simplification of the device configuration and cost reduction can be realized.

  First, the detection camera 117a detects the object 110 held on the first holding surface 101s1 on the cutting position WP2 side in the holding surface 101s. The object detection device 117 transmits the detection result of the detection camera 117a to the control device 107 (see FIG. 17). Based on the detection result from the detection camera 117a, the control device 107 performs an alignment process for correcting the position of the object 110 when the object 110 is displaced from the cutting position WP2 (scanner 105). The control device 107 drives the position correction unit to correct the position of the object 110 held on the holding surface 101s. For example, the position correction unit corrects the position of the object 110 held on the holding surface 101 s by bringing a plurality of pins into contact with at least three side surfaces of the object 110. Note that when the position of the object 110 is corrected, the table 101 stops moving.

  After the alignment of the object 110 held on the first holding surface 101s1 on the cutting position WP2 side is completed, the table 101 moves to the cutting position WP2 side. The detection camera 117a detects the object 110 held on the second holding surface 101s2 opposite to the cutting position WP3, and transmits the detection result to the control device 107. Based on the detection result from the detection camera 117a, the control device 107 performs an alignment process for correcting the position of the object 110 when the object 110 is displaced from the cutting position WP2 (scanner 105). Similarly, the control device 107 drives a position correction unit (not shown) to correct the position of the object 110 held on the holding surface 101s.

  In the present embodiment, the case where the alignment step S2 is performed when the table 101 is positioned at the standby position WP1 has been described as an example. However, the present invention is not limited to this, and the alignment step S2 is performed when the table 101 is disconnected from the standby position WP1. You may make it perform in the middle before moving to position WP2.

  After the alignment step S2, in the cutting position moving step S3, the table 101 moves to the cutting position WP3 as shown in FIG. 20 (c). Thereafter, in a cutting step S4, a predetermined cutting process as described later is performed on the object 110 on the holding surface 101s by irradiating the laser beam through the scanner 105. In the cutting step S4, the table 101 moves so that the cutting process is performed in the order of the object 110 held on the first holding surface 101s1 and the object 110 held on the second holding surface 101s2.

  After the cutting step S4, in the carry-out position moving step S5, the table 101 moves to the standby position WP1 as shown in FIG. Thereafter, in the unloading step S6, as shown in FIG. 20 (e), the unloading device 116 unloads the object 110 from the holding surface 101s of the table 101 at the standby position WP1. The carry-out device 116 includes a holding unit 116a that sucks, holds, and conveys the object 110, and a receiving unit 116b that receives the object 110 carried out from the holding surface 101s by the holding unit 116a. The holding unit 116a can be carried out from the holding surface 101s (the first holding surface 101s1 and the second holding surface 101s2) while holding the two objects 110 at the same time. The receiving unit 116b is configured by a belt conveyor or the like, for example, and can transport the object 110 received from the holding unit 116a in a predetermined direction.

FIG. 21 is a schematic diagram of the first detection device 41.
As illustrated in FIG. 21, the first detection device 41 includes an imaging device 43 that captures an image of the object 110 and an illumination device 44 that illuminates the object 110 from the opposite side of the imaging device 43 with the object 110 interposed therebetween. And.

  FIG. 22 is a schematic diagram showing how the object 110 is imaged using the imaging device 43. First, as shown in FIG. 22A, the periphery of the liquid crystal panel P in the object 110 is imaged using the imaging device 43.

  The scanner 105 (cutting device) cuts the sheet piece FXm of the object 110 into an optical member F that is a portion facing the display area of the liquid crystal panel P and a surplus portion outside the optical member F. The control device 107 (see FIG. 17) controls the scanner 105 based on the image captured by the imaging device 43.

  The object 110 has a liquid crystal panel P and a sheet piece FXm bonded to the liquid crystal panel P. The liquid crystal panel P has a liquid crystal layer P3 (see FIG. 2) sandwiched between the second substrate P2 and the first substrate P1. Further, in the liquid crystal panel P, the second substrate P2 has a smaller area in plan view than the first substrate P1, and one end side of the first substrate P1 is exposed in plan view when the two are overlapped. A terminal portion P6 is provided in the exposed region P5 of the first substrate P1.

  FIG. 22B is a partial plan view of the liquid crystal panel P. In FIG. 2B, for convenience, the side EA is shown among the four sides EA, EB, EC, ED of the second substrate P2. The liquid crystal panel P of this embodiment is manufactured by multi-chamfering. Therefore, as shown in FIG. 22B, the corners of the second substrate P2 (for example, corners C1 and C2 at both ends of the side EA) and the vicinity EA1 and EA2 are smaller than the central part EA3 of the side EA. Chipping occurs and is not linear. The lengths of the neighborhoods EA1 and EA2 are empirically about 5 mm in a liquid crystal panel for a 4-inch display, for example.

  The sheet piece FXm is bonded to the surface of the second substrate P2. In the object 110 shown in the drawing, the sheet piece FXm has a rectangular shape in plan view, and has a larger plan view area than the second substrate P2.

  With respect to such an object 110, the imaging device 43 is used to image the imaging area AR including the second substrate P2. The imaging device 43 has a plurality of arrays arranged in a direction (first direction) parallel to the side EC (or side EA) along the terminal portion P6 among the four sides EA, EB, EC, ED of the second substrate P2. A line camera including an image sensor. For example, the imaging device is a CCD (Charge Coupled Device). The imaging device 43 moves in a direction (second direction) parallel to the side EB (or side ED) adjacent to the side EC and includes an image including the second substrate P2 in plan view (hereinafter referred to as a counter substrate image). ).

  The moving direction of the imaging device 43 is not limited to this. For example, the imaging device 43 includes a plurality of imaging elements arranged in a direction parallel to the side EB (or side ED), and moves and faces in a direction parallel to the side EC (or side EA) adjacent to the side EB. A substrate image may be taken. That is, the imaging device 43 includes a plurality of imaging elements arranged in the first direction when viewed from the normal direction of the surface of the second substrate P2, and moves in the second direction orthogonal to the first direction. It is sufficient that the counter substrate image is captured.

  At that time, the illumination device 44 shown in FIG. 21 is used to illuminate the object 110 by irradiating the object 110 with light L from the side opposite to the imaging device 43. Thereby, compared with the case where the target object 110 is illuminated from the same side as the imaging device 43, the halation caused by the reflected light generated in the sheet piece FXm can be suppressed, and an image suitable for analysis described later can be captured.

  The image data of the image captured by the imaging device 43 is input to the control device 40, and the next processing (image processing, calculation) is performed.

(First process)
First, as a first process, a process of emphasizing the outline of the second substrate P2 when the liquid crystal panel P of the object 110 is viewed from the second substrate P2 side shown in FIG. Do.

  For example, when the object 110 is viewed in plan, the area where the second substrate P2 and the sheet piece FXm overlap (first area) and the area of only the sheet piece FXm protruding from the second substrate P2 (second area) ) And have different light transmittances, and in the captured image, the second region is brighter than the first region. Therefore, when the captured image is binarized, the first area becomes a bright area (white), the second area becomes a dark area (black), and the outline of the second substrate P2 becomes clear as a light / dark boundary.

  Note that the threshold value of the gradation value for binarization varies depending on the type of sheet piece FXm to be bonded, the structure of the liquid crystal panel P at the position to be imaged, etc. To set.

(Second process)
FIG. 23 is a schematic diagram showing the vicinity of the corner of the image captured by the imaging device 43 in FIG. In FIG. 23, for the sake of convenience, the vicinity of the corner including the side EA and the side EB is shown. In FIG. 23, the first area is indicated by a symbol AR1, and the second area is indicated by a symbol AR2. As the second processing, as shown in FIG. 23, based on the image data binarized in the first image processing (hereinafter referred to as binarized data), the outline (side) of the second substrate P2 and The coordinates of a plurality of overlapping points D are detected.

  First, a first portion that does not satisfy a preset criterion is excluded from the outline of the second substrate P2 obtained from the counter substrate image captured by the imaging device 43. Specifically, near the corners EA1 and EB1 (first portion) shown in FIG. 23, the second substrate P2 is burred or chipped, and each side (sides EA and EB in FIG. 23) is linear. is not. Therefore, when the point D is detected, the vicinity EA1, EB1 (a range predetermined as the vicinity of the corner) is set not to be included in the detection range. The ranges of the neighborhoods EA1 and EB1 to be excluded from the detection range can be appropriately set according to values obtained empirically or experimentally.

  Next, in each of the sides (sides EA and EB in FIG. 23), the second substrate is used for the central portions EA3 and EB3 (second portion) excluding the vicinity EA1 and EB1 in the outline of the second substrate P2. The coordinates of a plurality of points D overlapping the contour line of P2 are detected.

  As the coordinate axes of the coordinates to be detected, for example, an X axis with the upper left end of the binarized data as the origin, an X axis with the right direction of the image as the + direction, and a Y axis with the down direction of the image as the + direction is set. In addition, in the image imaged by the imaging device 43, if the two sides (contour lines) sandwiching the corner of the second substrate P2 are not substantially parallel to the outer peripheral side of the imaged image, the image is appropriately selected. A process (trimming process) for cutting out an arbitrary area suitable for analysis from data (or binarized data) may be performed, and the second process may be performed on the processed image.

  When detecting the coordinates of the point D, for example, when the gradation is detected in the + Y direction from the upper end at an arbitrary position (x1) in the X-axis direction of the image based on the binarized data, the white (first The coordinates (x1, y1) of the point D can be obtained from the position (y1) in the Y direction of the position changing from black (second area) to black (second area). Such processing is performed on each of the four sides EA, EB, EC, and ED of the second substrate P2, and the coordinates of a plurality of points D that overlap the sides are detected on each side.

  Although it is desirable that the number of points D to be detected be large, it is preferable to set the number so that the processing load of the arithmetic processing described later does not become excessive. For example, 100 points D may be detected in each of four sides EA, EB, EC, and ED.

(Third process)
As a third process, a straight line corresponding to the side overlapping the point D is approximated from the coordinates of the plurality of points D detected in the second process. As the approximation, a generally known statistical method can be used. For example, an approximation method for obtaining a regression line (approximate line) using the least square method can be given.

  FIG. 24 is a graph showing the approximate straight line L1 obtained in the third process, and shows the approximate straight line L1 as Y = 0. In FIG. 24, for convenience, an approximate straight line L1 obtained at the side EA is shown.

  Here, in the figure, the point D1 plotted on the + y side and the point D2 plotted on the -y side have a larger separation distance from the approximate line L1 than the other points D, and the calculation result of the approximate line L1 It is thought that it has had a big influence on. In such a case, the approximate straight line may be obtained again using the remaining points excluding the points D1 and D2.

  Further, the number of points D to be excluded is not limited to two as shown in FIG. A threshold is determined for the distance between the approximate line L1 and the point D (absolute value of the Y coordinate with the point D in FIG. 24), and the approximate line is obtained again by excluding the point D whose absolute value of the Y coordinate is greater than the threshold. It doesn't matter. About a threshold value, it can set suitably according to the value calculated | required empirically or experimentally.

  The approximate straight line thus obtained is performed for each of the four sides EA, EB, EC, and ED included in the captured image. In the following description, the approximate straight line obtained at the side EA may be referred to as L1, the approximate straight line obtained at the side EB as L2, the approximate straight line obtained at the side EC as L3, and the approximate straight line obtained at the side ED as L4.

(Fourth process)
As a fourth process, the approximate straight lines L1, L2, L3, and L4 are obtained by connecting the approximate straight lines L1, L2, L3, and L4 obtained for the four sides included in the counter substrate image captured by the imaging device 43, respectively. The figure to be obtained is assumed as the contour line (approximate contour line) of the second substrate P2.

FIG. 25 is a schematic diagram showing the approximate contour OL.
As shown in FIG. 25, the approximate contour OL can be obtained by connecting the approximate straight lines L1, L2, L3, and L4 obtained in the third process.

  FIG. 26 is a schematic diagram illustrating a state in which the sheet piece FXm of the object 110 is cut using the scanner 105. The control device 40 controls the scanner 105, emits the laser beam LB based on the approximate contour OL obtained as described above, cuts the sheet piece FXm, and separates the optical member F1X and the surplus portion FY.

  The size of the surplus portion FY of the sheet piece FXm (the size of the portion that protrudes outside the liquid crystal panel P) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece FXm is applied to a medium-to-small size liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece FXm and one side of the liquid crystal panel P is 2 mm on each side of the sheet piece FXm. Set to a length in the range of ~ 5 mm.

  FIG. 27 is a diagram illustrating an operation flow of a cutting process using the scanner 105 and the table 101 as a cutting process. In addition, the operation | movement flow shown in FIG. 27 is a specific operation | movement flow of cutting | disconnection step S4 among the operation | movement flows shown in FIG.

  First, the object 110 is fixed to the holding surface 101s (step S41 shown in FIG. 27). Next, a counter substrate image is taken for the object 110 on the holding surface 101s (step S42 shown in FIG. 27). Next, an approximate contour OL is created based on the captured counter substrate image (step S43 shown in FIG. 27). Next, cutting processing is performed based on the approximate contour OL (step S44 shown in FIG. 27). The cutting process is performed in conjunction with the scanner 105 and the table 101. That is, while controlling the scanner 105 (step S441 shown in FIG. 27) and controlling the table 101 (step S442 shown in FIG. 27), the cutting process of the sheet piece FXm in the object 110 is performed.

  FIG. 28 is a diagram illustrating a control method for scanning a laser beam in a rectangular shape on the sheet piece FXm when the sheet piece FXm is cut into an optical member F1X having a predetermined size using the laser beam irradiation apparatus 100 as a cutting device. It is.

  In FIG. 28, reference numeral Tr denotes a target laser beam movement locus (desired locus; hereinafter referred to as laser light movement locus), and reference numeral Tr1 denotes movement due to relative movement between the table 101 and the scanner 105. This is a trajectory obtained by projecting the trajectory onto the sheet piece FXm (hereinafter also referred to as a light source movement trajectory). The light source movement trajectory Tr1 has a shape in which four corners of the laser light movement trajectory Tr having a rectangular shape are curved, the symbol K1 is a straight section other than the corner, and the symbol K2 is a bent section of the corner. Reference numeral Tr2 indicates that the irradiation position of the laser beam is perpendicular to the light source movement locus Tr1 by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 when the scanner 105 is relatively moving on the light source movement locus Tr1. It is a curve (hereinafter also referred to as an adjustment curve) indicating how much is shifted (adjusted). The deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.

  As shown in FIG. 28, the light source movement locus Tr1 is a substantially rectangular movement locus with curved corners. The light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area. If the light source movement locus Tr1 has a rectangular shape, the moving speed of the scanner 105 is slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser light. Therefore, in FIG. 28, the corners of the light source movement locus Tr1 are curved so that the moving speed of the scanner 105 is substantially constant over the entire light source movement locus Tr1.

  Since the light source movement locus Tr1 and the laser beam movement locus Tr coincide with each other when the scanner 105 moves in the straight section K1, the control device 107 sets the irradiation position of the laser beam to the first irradiation position adjusting device 151. And without adjusting by the 2nd irradiation position adjustment apparatus 154, a laser beam is irradiated to the sheet piece FXm from the scanner 105 as it is. On the other hand, when the scanner 105 is moving in the bending section K2, the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so that the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 perform laser light. The irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr. For example, when the scanner 105 is moving at the position indicated by the symbol M1, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 move the laser beam irradiation position in the direction N1 perpendicular to the light source movement locus Tr1. Shifted by W1. The distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1. The light source movement trajectory Tr1 is arranged inside the laser light movement trajectory Tr, but the irradiation position of the laser light is outside the laser light movement trajectory Tr by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. Therefore, these deviations cancel out, and the irradiation position of the laser beam is arranged on the laser beam movement locus Tr.

Hereinafter, the effect of the cutting process according to the present embodiment will be described with reference to FIGS. 29 (a) and 29 (b) and FIGS. 30 (a) and 30 (b).
FIGS. 29A and 29B are explanatory diagrams of the cutting process according to the comparative example. FIGS. 30A and 30B are explanatory diagrams of the cutting process according to the present embodiment.
29 (a), (b) and FIGS. 30 (a), (b), for convenience, the illustration of the sheet piece FXm constituting the object 110 is omitted, and only the liquid crystal panel P is illustrated. .

As shown in FIG. 29A, in the comparative example, first, as a method for detecting the outer shape, each of the areas CA1, CA2, CA3, CA4 including the four corners (corner portions) of the liquid crystal panel P in plan view is used. Take an image. Next, as shown in FIG. 29 (b), the four corners of the liquid crystal panel P are obtained based on the imaging result, and a rectangle connecting the obtained four corners is defined as the outer peripheral shape of the liquid crystal panel P.
Therefore, if burrs or chips are generated at the corners of the liquid crystal panel P, the liquid crystal panel P is easily affected by burrs or chips when detecting the outer peripheral shape of the liquid crystal panel P. As a result, as shown in FIG. 29B, the cut line greatly deviates from the actual contour line. For example, if burrs are remarkably generated in the areas CA1 and CA3, the burrs may be recognized as corners of the liquid crystal panel P in the areas CA1 and CA3. In this case, the trapezoid connecting the obtained four corners is the outer peripheral shape of the liquid crystal panel P.

On the other hand, in this embodiment, as shown in FIG. 30A, a line camera is used as the imaging device 43, and the imaging device 43 is moved in the direction V to capture the counter substrate image. Next, a first portion (corner portion where a burr or chipped portion) that does not satisfy a preset criterion is excluded from the contour line of the second substrate P2 obtained from the counter substrate image captured by the imaging device 43. Next, in each of the sides, the coordinates of a plurality of points overlapping the outline of the second substrate P2 are detected for the second portion (the central portion where no burr or chipping occurs). Next, approximate straight lines L1, L2, L3, and L4 are obtained from the detected coordinates of the plurality of points. Then, as shown in FIG. 30B, the approximate contour OL is obtained by connecting the approximate straight lines L1, L2, L3, and L4.
Therefore, even if burrs or chips are generated at the corners of the liquid crystal panel P, the liquid crystal panel P is not easily affected by the burrs or chips when detecting the outer peripheral shape of the liquid crystal panel P. As a result, as shown in FIG. 30 (b), it is possible to suppress the shift of the cut line from the actual contour line.

As described above, according to the film bonding system 1 of the present embodiment of the present embodiment, the cut line (approximate contour) is based on the portion of the contour line of the second substrate P2 excluding the portion that does not satisfy the standard in advance. Since the line OL) is created, it is possible to suppress the shift of the cut line from the actual contour line. As a result, it is possible to detect the outer peripheral shape of the liquid crystal panel P excluding the influence of burrs and chips on the peripheral edge, and to process the optical member F1X in accordance with the outer peripheral shape.
Further, it is possible to easily produce a narrow frame optical display device.

  Moreover, since the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus mentioned above, the sheet pieces F1m and F2m can be cut | disconnected sharply and the fall of cut quality can be suppressed.

  Further, under the control of the control device 107, the movement device 106 and the scanner 105 are controlled so as to draw a desired laser beam movement locus Tr in the sheet piece FXm. In this configuration, the laser beam irradiation section to be adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only a narrow bending section K2. In the other wide straight section K1, the laser beam is scanned on the sheet piece FXm by the movement of the table 101 by the moving device 106. In the present embodiment, the scanning of the laser light is mainly performed by the moving device 106, and only the region where the moving position of the moving position of the laser beam cannot be accurately controlled by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is adjusted. doing. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.

  Moreover, after bonding the sheet pieces F1m and F2m of a size that protrudes outside the liquid crystal panel P to the liquid crystal panel P, the excess part of the sheet pieces F1m and F2m is cut off, whereby the optical member F11 having a size corresponding to the bonding surface. , F12 can be formed on the surface of the liquid crystal panel P. Thereby, the optical members F11 and F12 can be accurately provided up to the bonding surface, and the frame area outside the display area P4 can be narrowed to enlarge the display area and downsize the device.

  Even if the optical axis direction of the sheet pieces F1m and F2m changes depending on the position of the sheet pieces F1m and F2m by bonding the sheet pieces F1m and F2m of a size protruding outside the liquid crystal panel P to the liquid crystal panel P. The liquid crystal panel P can be aligned and bonded in accordance with the direction. Thereby, the precision of the optical axis direction of the optical members F11 and F12 with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be increased.

  In addition, the cutting devices 31 and 32 laser cut the sheet pieces F1m and F2m, so that the force is not exerted on the liquid crystal panel P as compared with the case where the sheet pieces F1m and F2m are cut with a blade, and cracks and chips occur. It becomes difficult, and the stable durability of the liquid crystal panel P can be obtained.

  Further, the sheet piece FXm can be cut substantially along the edge of the second substrate P2, and the optical member F can be suitably bonded to the narrowed liquid crystal panel P. Furthermore, if necessary, an optical display device in which a plurality of types of optical members are bonded to the liquid crystal panel P using the above-described apparatus and the optical members are bonded to the liquid crystal panel P can be obtained.

  Moreover, since the structure which hold | maintains the several target object 110 on the holding surface 101s of the table 101 (two in this embodiment) is employ | adopted, the several target object 110 can be sequentially supplied to the cutting position WP2. Thereby, the cutting process with respect to the target object 110 can be performed efficiently, and a processing amount can be increased.

  In the present embodiment, the sheet piece FXm is cut along the approximate contour line OL. However, the present invention is not limited to this, and is, for example, a region inside the approximate contour OL and the frame of the liquid crystal panel P. The sheet piece FXm may be cut at a position overlapping the portion. In that case, the control device 40 calculates, based on the calculated approximate contour, a shape that is smaller than the shape drawn by the approximate contour as a true cut portion, The scanner 105 may be controlled so as to cut the sheet piece FXm along.

  The shape showing the true cut portion may be a similar shape obtained by reducing the shape drawn by the approximate contour OL at a predetermined scale, and only a predetermined width from the shape drawn by the approximate contour OL. The shape shrunk inward may be sufficient.

  In the present embodiment, the imaging device 43 is used to illustrate and explain that the liquid crystal panel P included in the object 110 is taken as a plan view from the second substrate P2 side. However, the present invention is not limited thereto. Absent.

  When the liquid crystal panel P is formed by multi-chamfering, the position of the end portion may be displaced between the upper and lower substrates constituting the liquid crystal panel P. When the liquid crystal panel P shown in FIG. 3 has such a shift and the edge of the first substrate P1 farther from the image pickup device 43 than the edge of the second substrate P2 close to the image pickup device 43 is arranged outside. When a plane view image is captured using the imaging device 43, the edge of the first substrate P1 is mistaken as the edge of the second substrate P2, and it is difficult to obtain an approximate contour line along the contour line of the second substrate P2. It becomes.

  In such a case, the imaging device 43 may be inclined to the inside of the second substrate P2 with respect to the normal line of the second substrate P2, and an image of the second substrate P2 may be taken from the inside of the second substrate P2. . When imaging is performed in this way, the first substrate P1 is imaged in a state of being hidden by the second substrate P2, so that the edge of the first substrate P1 is not mistaken as the edge of the second substrate P2, and the second substrate P2 An image can be reliably captured.

  The inclination angle of the imaging device 43 may be changed each time according to the amount of deviation between the second substrate P2 and the first substrate P1 in each liquid crystal panel P. In addition, when the maximum value of the deviation amount is empirically known, an inclination angle that can hide the first substrate P1 by the second substrate P2 is obtained even if the maximum deviation occurs, and the obtained inclination angle is obtained. It is preferable that the image pickup device 43 be tilted to take an image.

Moreover, in this embodiment, although demonstrated as an example the structure which cut | disconnects a sheet piece as a structure which irradiates a laser beam to a target object and performs a predetermined process, it is not restricted to this. For example, in addition to dividing the sheet piece into at least two parts, it also includes making a cut through the sheet piece and forming a groove (cut) of a predetermined depth in the sheet piece. To do.
More specifically, for example, cutting (cutting off) an end portion of a sheet piece, half cutting, marking processing, and the like are included.

  In the present embodiment, the optical member sheet FX is pulled out from the roll, and a sheet piece FXm of a size that protrudes outside the liquid crystal panel P is bonded to the liquid crystal panel P, and then the liquid crystal panel P is pasted from the sheet piece FXm. Although the case where it cut out to the optical member F1X of the magnitude | size corresponding to a mating surface was mentioned and demonstrated was demonstrated, it is not restricted to this. For example, the present invention can also be applied to the case where a sheet-like optical film chip cut out to the outside of the liquid crystal panel P is bonded to the liquid crystal panel without using the roll.

  Further, in the present embodiment, the case where the drawing locus of the laser light emitted from the laser light irradiation device has a rectangular shape (square shape) in plan view has been described as an example, but the present invention is not limited thereto. For example, the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape that is a pentagon or more in plan view. Moreover, not only this but a planar-view star shape and planar-view geometric shape may be sufficient. Further, the shape may include a curve such as a circular shape or an elliptical shape in plan view. The present invention can also be applied to such a drawing trajectory.

  Further, in the present embodiment, the example in which the table 101 holds the two objects 110 has been described, but the present invention is not limited to this. For example, the structure which can hold | maintain the one target object 110 may be sufficient as a table, and the structure which can hold | maintain the three or more target objects 110 may be sufficient.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (production system of an optical display device), 23 ... Cinch roll (bonding device), 31 ... 1st cutting device (cutting device), 32 ... 2nd cutting device (cutting device), 43 ... Imaging device 44 ... illumination device 100 ... laser light irradiation device (cutting device) 107 ... control device 110 ... object (laminated body) D ... point overlapping outline, EA1, EB1 ... near (first) Part), EA3, EB3 ... center part (second part), P ... liquid crystal panel (optical display component), P1 ... first substrate (substrate), P2 ... second substrate (substrate), P4 ... display region, FX ... Optical member sheet, FXm ... Sheet piece, F1X ... Optical member, FY ... Surplus part, OL ... Approximate contour line, PA1 ... First optical member bonding body (laminate), PA3 ... Third optical member bonding body (laminate) ), PA4 ... fourth optical member bonded body (optical display) Vice)

Claims (5)

An optical display device production system in which an optical member is bonded to an optical display component,
An imaging device that captures an image including the substrate in a plan view of a laminate in which an optical member sheet wider than the surface is bonded to the surface of the substrate included in the optical display component;
A cutting device for separating the optical member sheet into the optical member that is a portion facing the display area of the optical display component, and an excess portion outside the optical member;
A control device that obtains an approximate contour line that approximates a contour line in plan view of the substrate based on the image and controls the cutting device to cut the optical member sheet based on the approximate contour line; Including
The control device excludes a first portion that does not satisfy a preset criterion from among the contour lines obtained from the image captured by the imaging device, and excludes the first portion from the contour lines. Detecting coordinates of a plurality of points that overlap the contour line for part 2, approximating a line corresponding to the contour line from the coordinates of the plurality of points, and obtaining a figure obtained by the approximated line as the approximate contour line An optical display device production system for controlling the cutting device so as to cut the optical member sheet based on the approximate contour line.   2. The line imaging apparatus according to claim 1, wherein the imaging device is a line camera that includes a plurality of imaging elements arranged in a first direction and moves in a second direction orthogonal to the first direction to capture the image. Optical display device production system.   3. The optical display device production system according to claim 1, further comprising an illuminating device that illuminates the multilayer body from a side opposite to the imaging device across the multilayer body.   The first portion is a predetermined portion as a vicinity of a corner portion of the substrate in a plan view, and the control device excludes the first portion in each of two sides sandwiching the corner portion. The optical display device production system according to claim 1, wherein coordinates of the plurality of points are detected.   The optical display device as described in any one of Claim 1 to 4 including the bonding apparatus which bonds the said optical member sheet | seat on the surface of the said optical display component conveyed on a line, and forms the said laminated body. Production system.