TWI640804B - Device for manufacturing optical member bonded body - Google Patents

Abstract

An optical member bonding body manufacturing apparatus, wherein an optical display unit is laminated with one or more optical members, wherein: a cleaning device for cleaning an optical display assembly; and a bonding means for optical The display component is respectively attached to one or a plurality of sheets of the optical member sheets corresponding to one or more optical members; and the cutting means is cut out from one or a plurality of sheets attached to the optical display unit, and one cut out Or a plurality of optical members; and a transport mechanism that transports the optical display assembly or the optical member assembly in which the optical display member is bonded to the optical member; the transport mechanism performs the optical display assembly at least in the cleaning device After the cleaning, all of the one or a plurality of sheets are bonded to the conveyance path of the optical display unit by the bonding means, and the optical display is carried out without using the contact portion of the optical display unit or the optical member bonding body. The handling mechanism of the component or optical component bonding body.

Description

Optical member bonding body manufacturing device

The present invention relates to a manufacturing apparatus for an optical member bonding body.

The present application claims priority based on Japanese Patent Application No. 2013-250206, filed on Dec.

In the production system of an optical display device such as a liquid crystal display device, an optical member such as a polarizing plate of a liquid crystal panel (optical display unit) is cut out from a long film to form a sheet sized to match the display area of the liquid crystal panel. Thereafter, it is bonded to a liquid crystal panel (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-255132

Here, in the production system of the optical display device of the prior art, various dimensional errors of the liquid crystal panel and the sheet, and the fitting error (positional deviation) of the sheet to the liquid crystal panel are cut out, and the ratio of the display area is cut out. A slightly larger sheet. Therefore, the area (frame portion) in which the excess portion is formed in the peripheral portion of the display region has a problem that the size of the device is prevented from being reduced.

The present invention has been made in view of the above problems, and provides an apparatus for manufacturing an optical member bonding body which can reduce the frame portion around the display area, thereby achieving enlargement of the display area and miniaturization of the machine.

In order to achieve the above object, the present invention employs the following means.

(1) That is, the manufacturing apparatus of the optical member bonding body of the first aspect of the present invention is constituted by laminating one or a plurality of optical members to an optical display unit, and includes: a cleaning device which washes the above An optical display unit; the bonding means, wherein the optical display unit is respectively attached to one or a plurality of sheets of the optical member sheets corresponding to the one or more optical members; and the cutting means is attached to the optical member And the one or more optical sheets of the optical display unit are cut out from the one or more optical members; and the transport mechanism is configured to transport the optical display unit or the optical member is bonded to the optical display unit. The optical member bonding body; wherein the transporting means performs at least the cleaning of the optical display unit by the cleaning device, and the bonding of the one or more of the plurality of sheets is performed by the bonding means In the conveyance path of the optical display unit, the contact portion with the optical display unit or the optical member is not used. The optical display assembly or operation of the optical member attached to the body conveying means.

In addition, the "optical display group" described in this specification The contact portion of the member or the optical member bonding body is a portion where the conveying mechanism is in contact with the optical display unit or the optical member bonding body when the optical display unit or the optical member bonding body is conveyed.

In addition, the "transport mechanism that does not use the optical display unit or the optical member bonding body to be moved and the optical display unit or the optical member bonding body is not changed" as described in the present specification means The optical display unit or the contact portion of the optical member bonding body is changed, and the optical display unit or the optical member bonding body transport mechanism is transported.

(2) The apparatus for manufacturing an optical member bonding body according to (1), wherein the bonding means includes: a winding portion having a width larger than a long side and a short side of a display area of the optical display unit; a strip-shaped optical member sheet having a length of either side is unwound from the raw material roller together with the separator sheet; the cutting portion is configured to leave the partition sheet remaining while being longer than any of the long side and the short side of the display area Further, the length of one side is cut to form the sheet, and the bonding portion is formed by bonding the sheet to the holding surface while holding the sheet held by the holding surface on the optical sheet. Display component.

(3) The apparatus for manufacturing an optical member bonded body according to the above (1) or (2), wherein the transport mechanism may include a table that holds the optical display unit, and a slider mechanism that allows the table to be Moving; and absorbing the arm, which is carried by the optical display unit held by the table.

(4) The apparatus for manufacturing an optical member bonded body according to the above (1) or (2), wherein the transport mechanism may include a transport conveyor belt that is held thereon The optical display unit is transported, and the arm is sucked and held by the optical display unit held by the transport conveyor.

(5) The apparatus for manufacturing an optical member bonding body according to a second aspect of the present invention comprises the optical display unit in which one or a plurality of optical members are bonded together, and further comprising: a cleaning device for cleaning the optical display And a bonding means for bonding the one or more optical members to the optical display unit; and a transport mechanism for transporting the optical display unit or the optical member for bonding the optical member The optical member bonding body; wherein the transporting means performs cleaning of the optical display unit by at least the cleaning device, and then bonding all of the one or more sheets by the bonding means to complete the optical display In the conveyance path of the assembly, the conveyance mechanism that conveys the optical display unit or the optical member bonding body without using the contact portion of the optical display unit or the optical member bonding body is not used.

(6) The apparatus for manufacturing an optical member bonding body according to (5), wherein the bonding means includes: a winding portion that corresponds to a width larger than a long side and a short side of a display area of the optical display unit; a strip-shaped optical member sheet having a length of either side is wound out from the original material roller together with the separator sheet; the cutting portion is configured to leave the partition sheet remaining while having a length corresponding to the long side and the short side of the display area The optical member sheet is cut to form the optical member, and the bonding portion holds the optical member on the holding surface, and the optical member held by the holding surface is attached to the optical member. The above optical display assembly.

According to the present invention, it is possible to provide a manufacturing apparatus for an optical member bonding body which can reduce the frame portion around the display area, and can expand the display area and reduce the size of the machine.

1, 1001, 4001, 5001‧‧‧ film bonding system (optical member bonding body) Manufacturing device)

10, 1010, 5010‧‧‧Porting agencies

11a to 11m, 1011a to 1011j, 5011a, 5011b‧‧‧ carry conveyor belt

Tables 12a to 12c, 1012a to 1012g‧‧‧

13a to 13c, 1013a to 1013g‧‧‧ slider mechanism

14a to 14f, 1014a to 1014e‧‧‧ absorbing arms

15a, 15m, 15k‧‧‧ bracket

101‧‧‧Processing room

20‧‧‧cleaning device

31‧‧‧First detection device

32‧‧‧Second detection device

41‧‧‧First defect inspection device

42‧‧‧Second defect inspection device

50‧‧‧Means of fitting

51‧‧‧First bonding device

52‧‧‧Second bonding device

53‧‧‧ Third bonding device

60‧‧‧cutting means

61‧‧‧First cutting device

62‧‧‧Second cutting device

71‧‧‧First stripping device

72‧‧‧Separate stripping device

81‧‧‧First reversal device

82‧‧‧second reversal device

91‧‧‧Control device

92‧‧‧ memory device

100‧‧‧ autoclave treatment unit

510a‧‧‧Departs

510b‧‧‧Cutting device (cutting department)

521‧‧‧Fitting Drum (Fitting Department)

521a‧‧‧ Keep face

541‧‧‧First matching table

542‧‧‧Second fitting table

543‧‧‧Recycling table

571‧‧‧First inspection camera

572‧‧‧Second detection camera

573‧‧‧ Third detection camera

611‧‧‧First table

611a‧‧‧ Keep face

612‧‧‧Second table

612a‧‧‧ Keep face

660‧‧‧Mobile devices

661‧‧‧First slider mechanism

662‧‧‧Second slider mechanism

FX‧‧‧ optical member sheet

F1‧‧‧First optical member sheet

F2‧‧‧Second optical member sheet

F3‧‧‧ Third optical member sheet

F3a‧‧‧ separated sheets

FXm‧‧‧Flakes

F1m‧‧‧ first sheet

F2m‧‧‧second sheet

F3m‧‧‧ third sheet

F1X‧‧‧Optical components

F11‧‧‧First optical component

F12‧‧‧Second optical component

F13‧‧‧ Third optical component

P‧‧‧LCD panel (optical display unit)

P4‧‧‧ display area

PA‧‧‧Optical member fit

PA1‧‧‧Sheet fit

PA2‧‧‧First optical component fit

PA3‧‧‧Second sheet laminate

PA4‧‧‧ third sheet conformer

Fig. 1 is a schematic view showing a film bonding system of the first embodiment.

Fig. 2 is a plan view of a liquid crystal panel.

Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2.

Figure 4 is a cross-sectional view of the optical member sheet.

Figure 5 is a plan view of the cleaning device.

Fig. 6 is a side view showing the defect inspection device.

Figure 7 is a side view showing the first bonding apparatus.

Figure 8 is a perspective view showing the first bonding apparatus.

Fig. 9 is a side view showing the first bonding apparatus when the liquid crystal panel is supplied.

Figure 10 is a plan view showing the first bonding apparatus.

Figure 11 is a front elevational view of the first bonding apparatus.

Fig. 12A is an explanatory view showing a method of determining the bonding position of the sheet to the liquid crystal panel.

Fig. 12B is an explanatory view showing a method of determining the bonding position of the sheet to the liquid crystal panel.

Fig. 13A is a schematic view showing the handling robot.

Fig. 13B is a schematic view showing the handling robot.

Fig. 14A is a schematic view showing a handling robot.

Fig. 14B is a schematic view showing the handling robot.

Fig. 15 is a plan view showing the detecting step of the edge of the bonding surface.

Fig. 16 is a schematic view showing the detecting device of the first embodiment.

Fig. 17 is a perspective view for explaining the action of the detecting device of the comparative example.

Figure 18 is a cross-sectional view for explaining the action of the detecting device of the comparative example.

Fig. 19 is a perspective view for explaining the action of the detecting device of the first embodiment.

Figure 20 is a cross-sectional view for explaining the action of the detecting device of the first embodiment.

Fig. 21 is a cross-sectional view for explaining the action of the detecting device of the first embodiment when a modification of the liquid crystal panel is applied.

Figure 22 is a perspective view showing the first cutting device.

Fig. 23 is a view showing the configuration of EBS (Electricl Beam Shaping).

Fig. 24 is a perspective view showing the internal structure of an IOR (Imaging Optics Rail).

Fig. 25 is a side cross-sectional view showing the arrangement of the first collecting lens, the diaphragm member, and the collimator lens.

Figures (a) to (d) of Figure 26 are used to illustrate the role of EBS.

(a) to (d) of Fig. 27 are diagrams focusing on one pulse wave of laser light.

Figure 28 is used to illustrate the role of the IOR.

Fig. 29 is an enlarged view of a cut surface when a polarizing plate of an object is cut using a laser light irradiation device of a comparative example.

Figure 30 is a view showing the use of the laser light irradiation device of the present embodiment, the cutting pair An enlarged view of the cut surface of the polarizer of the object.

Fig. 31 is a view showing a control method for the desired trajectory of laser light drawing.

Fig. 32 is an explanatory view showing a method of manufacturing the optical member bonded body of the first embodiment.

Figure 33 is a schematic view showing a film bonding system of the second embodiment.

Figure 34 is a schematic diagram of the detection device.

Fig. 35A is a view showing a state in which a liquid crystal panel is photographed using a photographing device.

Fig. 35B is a schematic view showing a state in which a liquid crystal panel is photographed using a photographing device.

Figure 36 is a schematic view showing the vicinity of a corner portion of an image captured by a photographing device.

Figure 37 is a diagram showing an approximate straight line obtained from a complex point on the contour line.

Figure 38 is a schematic diagram of the approximate contour line.

Fig. 39 is an explanatory view showing a method of determining the cutting position by cutting and positioning means.

Fig. 40 is a perspective view showing a state in which the second sheet and the third sheet are cut using the scanner constituting the first cutting device.

Fig. 41 is a side view showing a state in which the second sheet and the third sheet are cut using the scanner constituting the first cutting device.

Fig. 42 is a perspective view showing a state in which the first sheet is cut using a scanner constituting the second cutting device.

Figure 43 is a side view showing a state in which the first sheet is cut using a scanner constituting the second cutting device.

Fig. 44 is a perspective view showing a state in which a liquid crystal panel sheet is photographed using the photographing apparatus of the third embodiment.

Figure 45 is a diagram showing the imaginary point obtained in the image taken by the photographing device.

Figure 46A is a schematic diagram of the approximate contour line.

Figure 46B is a schematic diagram of the approximate contour line.

Figure 46C is a schematic diagram of the approximate contour line.

Fig. 47 is a perspective view showing a state in which a liquid crystal panel is photographed by using the photographing apparatus of the fourth embodiment.

Fig. 48 is a cross-sectional view showing the outer periphery of the bonding surface of the photographic liquid crystal panel and the sheet from the side to which the sheet is bonded.

Figure 49A is a schematic diagram of the approximate contour line.

Figure 49B is a schematic diagram of the approximate contour line.

Figure 49C is a schematic diagram of the approximate contour line.

Fig. 50 is a plan view showing the detecting step of the edge of the bonding surface.

Figure 51 is a schematic view showing a detecting device of a fifth embodiment.

Figure 52 is a perspective view for explaining the action of the detecting device of the comparative example.

Figure 53 is a cross-sectional view showing the action of the detecting device of the comparative example.

Fig. 54 is a perspective view showing the action of the detecting device of the fifth embodiment.

Figure 55 is a cross-sectional view for explaining the action of the detecting device of the fifth embodiment.

Figure 56 is a cross-sectional view for explaining the action of the detecting device of the fifth embodiment when a modification of the liquid crystal panel is applied.

Fig. 57 is an explanatory view showing a method of manufacturing the optical member bonded body of the sixth embodiment.

Fig. 58 is a view showing the light transmittance of the polarizing film in the cross-Nicol state and the sensitivity characteristic of the CCD (Charge Coupled Device).

Figure 59 is a schematic view showing a film bonding system of an eighth embodiment.

Figure 60 is a schematic view showing a film bonding system of a ninth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments described below.

In addition, in all of the following drawings, the size, the ratio, and the like of the respective constituent elements are appropriately changed in order to facilitate the viewing of the drawing. In the following description and drawings, the same or equivalent components are denoted by the same reference numerals, and the description thereof will be omitted.

In the present embodiment, a film bonding system relating to a manufacturing apparatus including an optical member bonding body will be described.

[First Embodiment]

Fig. 1 is a schematic configuration diagram of a film bonding system 1 of the first embodiment.

The film bonding system 1 is, for example, a panel-shaped optical display unit such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and is bonded to a film-like optical member such as a polarizing film or a retardation film or a brightness enhancement film. The film bonding system 1 is configured to produce an optical display assembly and an optical body including the optical member A part of the production system of the display device. In the film bonding system 1, a liquid crystal panel P is used as an optical display unit.

As shown in Fig. 1, the film bonding system 1 of the present embodiment is a step of manufacturing a liquid crystal panel P. Each part of the film bonding system 1 is controlled by a control device 91 as an electronic control unit.

Fig. 2 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P.

As shown in FIG. 2, the liquid crystal panel P includes a first substrate P1 which is formed in a rectangular shape in plan view, and a second substrate P2 which is disposed to face the first substrate P1 and has a small rectangular shape: And, the liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. The liquid crystal panel P is formed in a rectangular shape along the outer shape of the first substrate P1 in plan view. In the liquid crystal panel P, a region which is contracted to the inner side of the outer periphery of the liquid crystal layer P3 is referred to as a display region P4 in plan view. On the outer peripheral portion of the first substrate P1 of the liquid crystal panel P, a positioning mark Am (alignment mark) for forming a wiring pattern (including a TFT: Thin Film Transistor, etc.) is formed on the first substrate P1. Or various electrodes such as a pixel electrode and an external terminal).

Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2.

As shown in FIG. 3, the first optical member F11, the second optical member F12, and the third optical member F13 (hereinafter collectively referred to as an optical member F1X) are appropriately bonded to the front and back surfaces of the liquid crystal panel P, respectively. The strip-shaped first optical member sheet F1, the second optical member sheet F2, and the third optical member sheet F3 (refer to FIGS. 7 and 8 and hereinafter collectively referred to as an optical member sheet FX) are cut out.

In the present embodiment, the first optical member F11 and the second optical member F12 of the polarizing film are bonded to each other on both the display surface side and the backlight side of the liquid crystal panel P. On the surface on the backlight side of the liquid crystal panel P, the third optical member F13 which is a film-like film which is superimposed on the second optical member F12 as a brightness enhancement film is further bonded. A frame portion G having a predetermined width is provided on the outer side of the display region P4 for arranging a sealant or the like for bonding the first and second substrates of the liquid crystal panel P.

Further, the first optical member F11, the second optical member F12, and the third optical member F13 are cut out from the first sheet F1m, the second sheet F2m, and the third sheet F3m (hereinafter collectively referred to as a sheet FXm) which will be described later. The remainder of the outer side of the face is formed. Here, the "bonding surface" described in the present specification means a surface of the liquid crystal panel P facing the sheet FXm.

Fig. 4 is a partial cross-sectional view of the optical member sheet FX bonded to the liquid crystal panel P. The optical member sheet FX has a film-shaped optical member body F1a, an adhesive layer F2a which is provided on one side of the optical member body F1a (upper side in FIG. 4), and a separation sheet F3a which is detachably stacked The surface of the optical member body F1a is sandwiched between the adhesive layer F2a and the surface protective film F4a is laminated on the other side of the optical member body F1a (the lower side in FIG. 4). The optical member body F1a has a function as a polarizing plate. The optical member body F1a covers the entire area of the display region P4 of the liquid crystal panel P and its peripheral region, and is bonded. In addition, for convenience of illustration, the display of each layer of FIG. 4 is omitted.

The optical member main body F1a is bonded to the liquid crystal in a state in which the adhesive layer F2a remains on one surface and the separation sheet F3a is separated. The panel P sandwiches the adhesive layer F2a therebetween. Hereinafter, a portion from which the separator sheet F3a is removed from the optical member sheet CF is referred to as a bonding sheet F5.

The separator sheet F3a is protected from the adhesive layer F2a to protect the adhesive layer F2a and the optical member body F1a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member main body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical member body F1a, and protects the optical member body F1a. The surface protective film F4a is separated from the optical member body F1a at a predetermined timing. Further, the optical member sheet FX may have a configuration in which the surface protective film F4a is not included, or the surface protective film F4a may be separated from the optical member body F1a.

The optical member body F1a has a sheet-like polarizing member F6, a first film F7 joined to one side of the polarizing member F6 by an adhesive, and a second film F8 bonded to the polarizing member F6 by an adhesive. The other side. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.

Further, the optical member body F1a may have a single layer structure composed of one layer of optical layers, or may have a laminated structure in which optical layers of a plurality of layers are laminated to each other. The optical layer may be a retardation film, a brightness enhancement film, or the like in addition to the polarizer F6. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment for protecting the outermost hard coat layer of the liquid crystal display element, or an effect of preventing glare by an anti-glare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the optical member One of the faces of the main body F1a is bonded to the partition sheet F3a to sandwich the adhesive layer F2a therebetween.

(film bonding system)

Next, the film bonding system 1 of the present embodiment will be described in detail.

In the first diagram, the left side of the figure indicates the upstream side of the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side), and the right side of the figure indicates the downstream side of the transport direction of the liquid crystal panel P (hereinafter referred to as panel transport). Downstream side).

As shown in Fig. 1, the film bonding system 1 of the present embodiment includes a transport mechanism 10, a cleaning device 20, a first defect inspection device 41, a second defect inspection device 42, a bonding means 50, and a first detecting device. 31. The second detecting device 32, the cutting device 60, the first peeling device 71, the second peeling device 72, the first inverting device 81, the second inverting device 82, the autoclave processing device 100, the control device 91, and Memory device 92.

The cleaning device 20 cleans the liquid crystal panel P to remove foreign matter adhering to or fixed to the outer surface of the liquid crystal panel P. The "foreign matter or the like" is, for example, a paste or cullet (waste glass) fixed to the liquid crystal panel P in addition to foreign matter such as dust adhering to the liquid crystal panel P. By removing foreign matter or the like from the liquid crystal panel P, it is possible to suppress the bonding defect when the sheet FXm is bonded to the liquid crystal panel P.

The first defect inspection device 41 checks for defects of the liquid crystal panel P. The defect inspection of the first defect inspection device 41 is a defect inspection performed before the optical member is attached to the liquid crystal panel P, so the defect inspection is performed. When checking the defects inherent in the liquid crystal panel P. The defects inherent in the liquid crystal panel P include, for example, damage of bubbles or alignment films in the liquid crystal layer.

The second defect inspection device 42 checks for defects in the liquid crystal panel P (optical member bonding body) after bonding the optical member to the liquid crystal panel P. The second defect inspection device 42 can inspect both the defects in the liquid crystal panel P and the defects generated by bonding the sheet FXm to the liquid crystal panel P. The defects caused by bonding the sheet FXm to the liquid crystal panel P include, for example, a defect of foreign matter sandwiched between the liquid crystal panel P and the sheet FXm, or a stress due to bonding the sheet FXm to the liquid crystal panel P. The bubble defects generated inside the sheet FXm include, in addition to the bubble defects and unevenness defects of the sheet FXm itself.

By using the inspection result of the first defect inspection device 41 and the inspection result of the second defect inspection device 42, it is possible to distinguish between the defects inherent in the liquid crystal panel P and the defects caused by bonding the sheet FXm to the liquid crystal panel P.

The bonding means 50 bonds the sheet Fxm to the liquid crystal panel P. The bonding means 50 includes a first bonding device 51 for bonding the first sheet F1m of the first optical member sheet F1 larger than the first optical member F11 to the first surface of the liquid crystal panel P; The bonding device 52 is formed by bonding the second sheet F2m of the second optical member sheet F2 larger than the second optical member F12 to the second surface of the liquid crystal panel P; and the third bonding device 53 is The third sheet F3m of the third optical member sheet F3, which is the third optical member F13, is bonded to the second surface of the liquid crystal panel P.

The first detecting device 31 detects the liquid crystal panel P and the first thin The edge of the bonding surface of the sheet F1m (hereinafter referred to as the first bonding surface).

The second detecting device 32 detects the edge of the bonding surface of the liquid crystal panel P and the second sheet F2m (hereinafter referred to as the second bonding surface).

The cutting means 60 is cut and attached to the liquid crystal panel P by cutting the sheet FXm based on the detection result of the edge of the bonding surface (the first bonding surface and the second bonding surface) of the liquid crystal panel P and the sheet FXm. The corresponding portion of the optical member F1X of the sheet FXm and the remaining portion of the outer side thereof. The cutting means 60 includes a first cutting device 61 which cuts off the first sheet F1m and cuts off the first sheet attached to the first side of the liquid crystal panel P according to the detection result of the edge of the first bonding surface. The corresponding portion of the first optical member F11 of F1m and the remaining portion of the outer side thereof. In addition, the cutting means 60 includes a second cutting device 62 which is formed by cutting the second sheet F2m and the third sheet disposed on the second sheet F2m by the entire detection result of the edge of the second bonding surface. F3m, the corresponding portion of the second optical member F12 of the second sheet F2m bonded to the second surface of the liquid crystal panel P, and the remaining portion of the outer side thereof, and the third optical member F13 cut away from the third sheet F3m The corresponding part, and the remaining part of the outer side.

The first peeling device 71 is peeled off from the liquid crystal panel P by the remaining portion of the first sheet F1m cut away from the first optical member F11 by the first cutting device 61. The second peeling device 72 is peeled off from the liquid crystal panel P by the remaining portions of the second sheet F2m and the third sheet F3m which are cut away from the second optical member F12 and the third optical member F13 by the second cutting device 62.

The first inverting means 81 and the second inverting means 82 reverse the front and back of the liquid crystal panel P. In the first inverting device 81 and the second inverting device In the case of 82, the liquid crystal panel P is rotated by 90° as needed so that the longitudinal direction and the short side direction of the liquid crystal panel P are interchanged with respect to the conveyance direction of the liquid crystal panel P. This rotation action can be performed simultaneously with the reversal action or separately from the reversal action.

In the autoclave processing apparatus 100, the optical member bonding body PA in which the first optical member F11, the second optical member F12, and the third optical member F13 are bonded to the liquid crystal panel P is subjected to heat and pressure treatment, and the sheet FXm is removed. The bubble defects generated when the liquid crystal panel P is combined and the bubble defects existing inside the sheet FXm are removed.

The cleaning device 20, the first defect inspection device 41, the second defect inspection device 42, the bonding means 50, the cutting means 60, the first peeling means 71, the second peeling means 72, and the first inversion as various processing means The device 81, the second inverting device 82, and the high-pressure processing device 100 are connected by a continuous transport mechanism 10 to transport the liquid crystal panel P, or the optical member in which the liquid crystal panel P is bonded to the sheet FXm or the optical member F1X. Fit.

In the film bonding system 1 of the present embodiment, in order to suppress the occurrence of the bonding defect of the bonding means 50, the conveying mechanism 10 is at least at the completion position from the cleaning step of the liquid crystal panel P to the liquid crystal panel P. In the conveyance path of the liquid crystal panel P (study member bonding body), the conveyance mechanism which conveys the liquid crystal panel P in the conveyance path of the liquid crystal panel P is not used. In other words, in the present embodiment, the transport mechanism 10 is disposed between at least the completion position of the cleaning step of the liquid crystal panel P and the completion of the bonding step of the sheet FXm of the liquid crystal panel P. Handling mechanism, use and liquid A transport mechanism in which the contact portion of the crystal panel P does not change during transport of the liquid crystal panel P.

Here, the "finished position of the cleaning step of the liquid crystal panel P" described in the present specification means that the cleaning device 20 is configured to remove foreign matter or the like due to the cause of the bonding defect (the liquid crystal panel P is directed from the cleaning step toward the lower side). The position where one step is discharged, that is, the position discharged from the cleaning device 20). In addition, the "finished position of the bonding step of the sheet FXm" described in the present specification means a position at which the bonding of all the sheets FXm is completed. For example, in the film bonding system 1 shown in Fig. 1, The position at which the third bonding device 53 is ejected does not indicate the position at which the remaining portion of the dicing sheet FXm is completed.

In addition, the "contact portion with the liquid crystal panel P" described in the present specification means a portion where the transport mechanism 10 and the liquid crystal panel P are in contact when the liquid crystal panel P is transported. The "transport mechanism that does not change the contact portion of the liquid crystal panel P during transport of the liquid crystal panel P" means, for example, a transport mechanism that includes a table that holds the liquid crystal panel P and a slider mechanism that can move the table; A suction arm that sucks and holds the liquid crystal panel P and transports it, and a conveyance belt (belt conveyor belt) that conveys the liquid crystal panel P on the endless belt and conveys it are cut out. In other words, the above-mentioned "the contact portion with the liquid crystal panel P does not change during the conveyance of the liquid crystal panel P" means that, for example, the contact portion does not slide between the liquid crystal panel P and the transport mechanism.

A mechanism for transporting the liquid crystal panel P by changing the contact portion with the liquid crystal panel P, for example, a roller conveyor belt in which a plurality of conveyance rollers are in contact with the liquid crystal panel P and rotated. The above-mentioned carrying roller Since the contact portion with the liquid crystal panel P sequentially changes with the rotation, when foreign matter adheres to any position of the conveyance roller, the foreign matter is conveyed to the position facing the liquid crystal panel P by the rotation of the conveyance roller, and adheres to the liquid crystal panel. P. Therefore, when the contact belt with the liquid crystal panel P is not changed, the above-mentioned roller conveyor belt or the like is likely to adhere to the liquid crystal panel P during transportation.

In the film bonding system 1 of the present embodiment, the transport mechanism 10 is at least from the completion position of the cleaning step of the liquid crystal panel P to the completion position of the bonding step of the sheet FXm of the liquid crystal panel P, that is, In the conveyance path of the liquid crystal panel P from the "position where the liquid crystal panel P is discharged from the cleaning device 20" to the "position where the liquid crystal panel P is discharged from the third bonding device 53," the contact with the liquid crystal panel P is not used. The department will change the transport mechanism that transports the liquid crystal panel P. Therefore, when compared with the case where the conveyance mechanism which changes the contact part of the liquid crystal panel P sequentially is used, the adhesion of a foreign material to the liquid crystal panel P can be suppressed, and the film bonding system with few bonding defects can be provided.

In addition, if the adhesion of the foreign matter to the liquid crystal panel P can be suppressed, the liquid crystal panel may be discharged from the position where the liquid crystal panel P is discharged from the cleaning device 20 to the position where the liquid crystal panel P is discharged from the third bonding device 53. A part of the conveyance path of P is a conveyance mechanism that conveys the liquid crystal panel P by changing the contact portion with the liquid crystal panel P. However, from the viewpoint of suppressing the adhesion of the foreign matter to the liquid crystal panel P, the conveyance path of the liquid crystal panel P at the position where the liquid crystal panel P is discharged from the cleaning device 20 to the position where the liquid crystal panel P is discharged from the third bonding device 53 is removed. All, preferably used and liquid A transport mechanism in which the contact portion of the crystal panel P does not change during transport of the liquid crystal panel P. That is, in the position where the liquid crystal panel P is discharged from the cleaning device 20, the position at which the liquid crystal panel P is discharged from the third bonding device 53, and the transport mechanism for transporting the liquid crystal panel P is preferably used only in contact with the liquid crystal panel P. A transport mechanism that does not change during transport of the liquid crystal panel P.

Further, a sheet member on which the liquid crystal panel P is placed is disposed on the roller conveyor, and the liquid crystal panel P is placed on the sheet member, and the belt conveyance belt of the liquid crystal panel P is transported, and the contact portion with the roller conveyor belt is The changer is a sheet member, and since the contact portion between the liquid crystal panel P and the sheet member does not fluctuate, it is included in the "portion mechanism in which the contact portion with the liquid crystal panel P does not change during transport of the liquid crystal panel P".

In the film bonding system 1 of the present embodiment, the liquid crystal panel P is loaded into the film bonding system 1 (hereinafter referred to as a loading position), and the liquid crystal panel P (optical member bonding body) is bonded from the film. Between the unloading positions where the system 1 is carried out (hereinafter referred to as the unloading position), all of the transport mechanisms of the liquid crystal panel P are "transport mechanisms that do not change during the conveyance of the liquid crystal panel P by the contact portion with the liquid crystal panel P".

The film bonding system 1 transports the liquid crystal panel P from the loading position to the unloading position, and sequentially applies the predetermined process to the liquid crystal panel P. The liquid crystal panel P is horizontally placed on the front and back sides thereof, and is transported by the transport mechanism 10.

In the following description, the entire processing of the liquid crystal panel P by the flow operation is referred to as a "manufacturing line" from the loading position to the unloading position. The manufacturing line mainly refers to a transportation path that is disposed in the transport mechanism 10 The operation performed by the processing device of a plurality of (also referred to as a conveyance line) refers to the operation performed on the manufacturing line as the operation within the "manufacturing line".

Further, the liquid crystal panel P transported by the transport mechanism 10 may be taken out from the processing device from the loading position to the unloading position, and the liquid crystal panel P may be processed at a position different from the processing device, and then the processed liquid crystal panel P may be returned. On the transport path to the transport mechanism 10, if the process does not cause a malfunction, it can be used as part of the manufacturing line.

In addition, the above-described process operation is referred to as "work outside the manufacturing line". Outside the manufacturing line, regardless of the conveying speed of the transport mechanism 10, it is possible to perform work in a necessary time.

Hereinafter, an example of the configuration of the film bonding system 1 will be described in detail.

(handling mechanism)

The transport mechanism 10 of the present embodiment includes transport conveyance belts 11a to 11m (belt conveyor belt), table tables 12a to 12c, slider mechanisms 13a to 13c, and suction arms 14a to 14f.

The transport conveyor belt 11a is disposed at the loading position. The conveyance conveyor belt 11a forms a linear shape in planar view. The conveyance belt 11a is conveyed while holding the bracket 15a. The holder 15a can accommodate a plurality of liquid crystal panels P. In the present embodiment, two liquid crystal panels P are housed in the holder 15a. Thereby, the liquid crystal panel P is configured to move along the conveyance belt 11a.

In addition, in the present embodiment, the conveyance belt 11a is not limited to the conveyance of the holder 15a, and the conveyance belt 11a may directly hold the liquid crystal panel P and be conveyed.

The suction arm 14a is disposed between the conveyance belt 11a and the conveyance belt 11b on the downstream side of the panel conveyance when compared with the conveyance belt 11a. The suction arm 14a sucks and holds the liquid crystal panel P held by the conveyance belt 11a, and is freely conveyed in the vertical direction and the horizontal direction. For example, the suction arm 14a conveys the liquid crystal panel P that has been adsorbed and held to the transport conveyance belt 11b in a horizontal state, and at this position, the liquid crystal panel P is transferred to the conveyance conveyance belt 11b.

The conveyance conveyor belt 11b forms a linear shape in planar view. The conveyance belt 11b holds the crystal panel P and carries it. In the liquid crystal panel P, the conveyance belt 11b is conveyed, and the short side of the liquid crystal panel P is conveyed along the conveyance direction. The liquid crystal panel P is transferred to the cleaning device 20 by the conveyance belt 11b.

(cleaning device)

Fig. 5 is a plan view of the cleaning device 20. The cleaning device 20 is provided on the upstream side of the film bonding system 1. The cleaning device 20 conveys the liquid crystal panel P using the conveyance belt 201, and sequentially applies a predetermined cleaning process to the liquid crystal panel P. The liquid crystal panel P is conveyed to the conveyance belt 201 with its front and back sides horizontal. For example, the transport conveyor 201 is a belt conveyor belt. In addition, in the fifth figure, the left side of the figure is used as the panel conveyance upstream side, and the right side of the figure is used as the panel conveyance downstream side.

As shown in Fig. 5, the cleaning device 20 is provided, for example, from the upstream side of the panel conveyance, and is provided with a panel input unit 202, which can carry a liquid crystal panel P of a cassette unit (about 40 sheets); 203, which is a study of the front and back surfaces of the liquid crystal panel P sent from the panel input unit 202 a brushing portion 204 for brushing the front and back surfaces of the liquid crystal panel P passing through the polishing portion 203, and a jet cleaning portion 205 for removing foreign matter from the front and back surfaces of the liquid crystal panel P via the brushing portion 204; The cleansing portion 206 cleans the front and back surfaces of the liquid crystal panel P passing through the jet cleaning unit 205, and the liquid removing portion 207 removes water droplets from the front and back surfaces of the liquid crystal panel P via the pure water washing unit 206; And the discharge portion 208 is transferred to the carry-out position 209a via the liquid crystal panel P of the liquid removing portion 207.

In the panel input unit 202, the liquid crystal panel P is received in a state in which the short side of the liquid crystal panel P is substantially along the conveyance direction. On the panel transport downstream side of the panel input unit 202, a pair of positioning rollers 202a are provided in the horizontal direction (the component width direction) orthogonal to the conveyance direction, and are located on both sides of the conveyance belt 201. Each of the positioning rollers 202a is transferred to the both sides of the width direction of the component of the liquid crystal panel P when the liquid crystal panel P is sent to the downstream side of the panel conveyance. In this way, the center reference of the liquid crystal panel P in the width direction of the part is positioned (aligned).

The polishing unit 203 has, for example, a polishing apparatus 203a having a pair of upper and lower driving belts 203c for driving the liquid crystal panel P (for convenience of display, only the polishing apparatus 203a above the liquid crystal panel P is shown in FIG. 5). The polishing apparatus 203a drives the polishing belt 203c to be driven by the drive rollers 203b disposed on both sides of the conveyance belt 201 in the width direction of the component. On the surface of the polishing belt 203c facing the liquid crystal panel P, for example, a plurality of pieces of the abrasive material are fixed in a lattice shape. On the back side of the polishing belt 203c facing the surface facing the liquid crystal panel P, the circulating water is sprayed to press the polishing belt 203c against the liquid crystal panel P. Introduced between the upper and lower grinding devices 203a The liquid crystal panel P is driven by the polishing belt 203c to polish the front and back surfaces thereof.

Further, the polishing belt 203c may have, for example, a belt width of about 30 to 60 mm, a belt abrasion management of a gap measurement type (automatically correctable), and a grinding pressure which can be controlled by water pressure and water amount. The polishing apparatus 203a shown in Fig. 5 is arranged such that the driving direction of the polishing belt 203c is slightly inclined to the width direction of the component in a plan view, but may be arranged such that the driving direction of the polishing belt 203c is along the width of the part. direction.

The brushing portion 204 has a brush pair 204a that is arranged in a plurality of (for example, two in the present embodiment) arranged in the conveyance direction. Each of the pair of brushes 204a has a pair of upper and lower rotating brushes 204b for sandwiching the liquid crystal panel P, extending across the two sides of the conveying conveyor 201 in the width direction of the part (for the convenience of display, only the liquid crystal panel P is shown in FIG. Above the rotating brush 204b). The liquid crystal panel P introduced between the respective brush pairs 204a and the lower rotating brush 204b is brushed by the rotation of the upper and lower rotating brushes 204b.

In addition, the rotating brush 204b can be, for example, rotated at a speed of 100 to 600 rpm, and the rotation direction can be reversed and independently rotated. The brush wire is a polyamide resin, the brush wire diameter is 400 to 600 μm, and the implantation amount is 2000 to 3000. Root / cm ² . The number of the brush pairs 204a can be appropriately changed in accordance with the size of the liquid crystal panel P or the like. The rotating brush 204b can also be configured to tilt the width direction of the part.

The jet cleaning unit 205 has a plurality of pressure tube pairs 205a arranged in the transport direction (for example, two in the present embodiment). Each of the pressure tube pairs 205a has a pair of upper and lower sandwich LCD panels P The pair of pressure tubes 205b extend in the width direction of the part (for convenience of display, only the pressure tube 205b above the liquid crystal panel P is shown in Fig. 5). The upper and lower pressure pipes 205b are provided with a plurality of nozzles 205c arranged in the width direction of the parts. Each of the nozzles 205c uses the air pressure of the pressure tube 205b to eject two fluids in which liquid and gas are mixed at a high pressure/high speed. The liquid crystal panel P introduced between the upper and lower pressure tubes 205b is ejected from the respective nozzles 205c to remove foreign matter adhering to the front and back surfaces.

Further, the jet cleaning unit 205 has, for example, a discharge amount of 1100 to 1200 ml/min and a discharge pressure of 8 to 12 MPa. The discharge pattern of each of the nozzles 205c may be a flat fan shape having a discharge angle of 85 to 95, and the arrangement of the respective nozzles 205c may be staggered in plan view. Further, the nozzle 205c is constructed such that the pure water or the washing functional water pressurized and pressure-fed in the pressure tube 205b is ejected at a high pressure/high speed in a minute droplet.

The pure water washing unit 206 has a pair of pressure pipes 206a arranged in a plurality of (for example, two in the present embodiment) arranged in the conveying direction. Each pressure tube pair 206a has a pair of upper and lower pressure tube pairs 206b sandwiching the liquid crystal panel P, extending along the width direction of the part (for the convenience of display, only the pressure above the liquid crystal panel P is shown in FIG. Tube 206b). The upper and lower pressure pipes 206b are provided with a plurality of nozzles 206c arranged in the width direction of the parts. Each of the nozzles 206 ejects pure water that is pressurized and pressurized in the pressure tube 206b. The liquid crystal panel P introduced between the upper and lower pressure pipes 206b is washed by the jets from the respective nozzles 206c to clean the front and back surfaces.

Further, the pure water washing unit 206 can adopt, for example, the thickness (the size of the mesh) of the filter provided in the water supply path to the pressure pipe 206b. The discharge pattern of each nozzle 206c is a flat fan shape having a discharge angle of 85 to 95°, and the arrangement of the respective nozzles 206c is staggered in plan view.

The liquid removing unit 207 has an air knife pair 207a arranged in a plurality (for example, two in the present embodiment) arranged in the conveying direction. Each air knife pair 207a has a pair of upper and lower air knives 207b enclosing the liquid crystal panel P, and is arranged to be inclined to the width direction of the part (for the convenience of display, only the air knife above the liquid crystal panel P is shown in FIG. 207b). The slit-shaped air outlet 207c of the upper and lower air knife 207b is provided to face the front and back surfaces of the liquid crystal panel P. The liquid crystal panel P introduced between the upper and lower air knives 207b removes the water droplets on the front and back surfaces by the jet air of the respective air knives 207b.

Further, for the liquid removing portion 207, for example, the main body of the air knife 207b may be made of stainless steel, and the width of the slit of the air outlet 207c may be 0.15 to 0.25 mm (adjustable slit), and the angle of the air knife 207b to the width direction of the part is The range of the reference ±15° can be adjusted (with scale), and the elevation angle of the air jet direction of the air knife 207b can also be adjusted within the range of ±15° of the reference. The gap between the air knife 207b and the liquid crystal panel P is also within the reference ±3mm. The range can be adjusted. Each air knife 207b is connected to a CDA (clean dry air) type air supply device. Alternatively, the air knife pair 207a may be single.

The discharge unit 208 has a conveyance belt 209 that conveys the liquid crystal panel P at a faster speed than the liquid removal unit 207 or the like. For example, the transport conveyor 209 is a belt conveyor belt. The carrying-out position 209a of the conveyance belt 209 for transporting the liquid crystal panel P is a buffer that can hold the cleaned liquid crystal panel P region. The liquid crystal panel P conveyed to the carry-out position 209a is sequentially transported to the first defect inspection device 41 on the downstream side of the panel conveyance of the cleaning device 20 (see FIG. 1). The conveyance belt 201 and the conveyance belt 209 form the line (transportation path) of the film bonding system 1 of this embodiment.

The liquid crystal panel P of the cleaning device 20 removes foreign matter such as dust adhering to the front and back surfaces of the liquid crystal panel P, and removes paste or cullet (waste glass) adhered to the front and back surfaces of the liquid crystal panel P by the polishing unit 203. . In this manner, the occurrence of defective products due to the bonding of foreign matter in the film bonding system 1 is reliably suppressed.

(first defect inspection device)

Fig. 6 is a side view showing the first defect inspection device 41. In the sixth drawing, the defect inspection device will be described by taking the first defect inspection device 41 of the first defect inspection device 41 and the second defect inspection device 42 as an example. Since the second defect inspection device 42 has substantially the same configuration as the first defect inspection device 41, detailed description thereof will be omitted. In Fig. 6, reference numeral Sf1 is a lower surface of the liquid crystal panel P, and in the present embodiment, is a surface on the backlight side. The symbol Sf2 is the upper surface of the liquid crystal panel P, and is the surface on the display surface side in this embodiment.

As shown in Fig. 6, the first defect inspection device 41 of the present embodiment includes a light source 411 disposed on the side of the lower surface Sf1 of the liquid crystal panel P, and a photographing device 412 disposed on the side of the upper surface Sf2 of the liquid crystal panel P. . The first defect inspection device 41 performs inspection of defects of the liquid crystal panel P before bonding the sheet FXm to the liquid crystal panel P. Therefore, a polarizing member (not shown) is provided between the light source 411 and the liquid crystal panel P, and the photographing device is provided. A light detecting member (not shown) is provided between the 412 and the liquid crystal panel P. The polarizer and the light detecting member are arranged such that the polarizing axes are at 90° to each other, which becomes a relationship of crossed Nicols.

Further, since the second defect inspection device 42 performs the defect inspection after bonding the optical member (polarizing plate) to both surfaces of the liquid crystal panel P, the second defect inspection device 42 is not provided with the above-described polarizer and the light detecting member. Further, unlike the first defect inspection device 41, the second defect inspection device 42 needs to check for defects caused by the bonding of the sheets FXm. The defects caused by the bonding of the sheet FXm include various defects such as foreign matter defects and uneven defects, and the arrangement of the light source and the photographing device for improving the inspection accuracy of the defects is different for each defect. Therefore, in the first defect inspection device 41 and the second defect inspection device 42, the arrangement of the light source and the photographing device may be different.

The first defect inspection device 41 is an automatic inspection device that performs an AOI inspection (Automatic Optical Inspection) on the liquid crystal panel P on the display surface side via the cleaning device 20. In the present embodiment, the first defect inspection device 41 irradiates light from the lower surface Sf1 side (backlight side) of the liquid crystal panel P with the light source 411, and photographs the image by the photographing device 412 from the upper surface Sf2 side (display surface side), according to the photographing thereof. The data is automatically checked for the presence or absence of defects in the liquid crystal panel P. The first defect inspection device 41 may be configured to use other than the above as long as the defect can be automatically and optically checked.

Here, the "defect" of the inspection target of the first defect inspection device 41 refers to a defect that can be optically inspected in the display region of the liquid crystal panel P, and causes display failure in the display device manufactured using the liquid crystal panel P. .

The defect is "the defect that the liquid crystal panel P itself has." The "deficiency of the liquid crystal panel P itself" means that, for example, the liquid crystal alignment film of the liquid crystal panel P is disordered, and the liquid crystal of the liquid crystal panel P cannot be oriented as designed. When such a defect is present, for example, a pair of polarizing plates are correctly attached to the crossed Nicols, and even if the liquid crystal panel P is designed to be a normally black type, when light is irradiated from one of the optical member bonding bodies PA, light is generated. Leak, so it can be confirmed as a bright spot. In addition, the liquid crystal panel P is damaged during transportation, and is also "a defect that the liquid crystal panel P itself has."

The light source 411 vertically illuminates the lower surface Sf1 of the liquid crystal panel P.

Further, not limited to this, the light source 411 may obliquely illuminate the lower surface Sf1 of the liquid crystal panel P. In this case, for example, the angle (illumination angle) θ of the optical axis CL of the light emitted from the light source 411 and the lower surface Sf1 is set to an angle ranging from 0° to 90°. Further, the illumination angle θ is set to an angle preferably in the range of 45 to 75, more preferably 70.

The photographing device 412 is disposed on the optical axis CL of the light emitted from the light source 411. The photographing device 412 photographs the transmitted light image of the light transmitted through the liquid crystal panel P.

The light exit surface 411a of the light source 411 is disposed on the long side in the width direction orthogonal to the conveyance direction of the liquid crystal panel P. The light exit surface 411a of the light source 411 is formed to span the liquid crystal panel P in the width direction. For example, the light source 411 can use an LED line source.

Similarly to the light source 411, the photographing device 412 is disposed on the long side in the width direction orthogonal to the conveyance direction of the liquid crystal panel P. For example, the photographing device 412 can use a line camera.

With this configuration, the first defect inspection device 41 irradiates light to the liquid crystal panel P from the lower side Sf1 side, and the photographing device 412 photographs the light transmitted through the liquid crystal panel P, and checks the presence or absence of defects of the liquid crystal panel P based on the photographed data. The inspection data obtained by the first defect inspection device 41 is stored in the memory device 92 (see Fig. 1).

The control device 91 (see Fig. 1) confirms the type of the defect that is detected by the first defect inspection device 41 stored in the memory device 92, and performs (1) OK determination based on the preset reference (indicating good product) (2) NG determination (determining the determination of defective products). The result of the determination by the control device 91 is stored in the memory device 92 (see Fig. 1). In addition, the basis for the determination is set to a value different depending on the structure of the liquid crystal panel P, etc., and the experiment can be appropriately prepared and set.

The above-described OK determination is a case where the liquid crystal panel P does not see a defect or a defect in which there is no problem in actual use. The above NG determination is a case where the liquid crystal panel P sees a defect.

The liquid crystal panel P judged by OK is carried out to the next step. On the other hand, the liquid crystal panel P determined by NG is discarded by a discarding device (not shown).

Returning to Fig. 1, the liquid crystal panel P that has passed through the first defect inspection device 41 is transferred to the transport conveyor belt 11c by, for example, a transport mechanism such as a belt conveyor.

The conveyance conveyor belt 11c forms a linear shape in planar view. The transport conveyor belt 11c holds the liquid crystal panel that passes through the first defect inspection device 41 P, carry it. The liquid crystal panel P conveys the conveyance belt 11c, and conveys the short side of the liquid crystal surface sheet P along the conveyance direction.

The suction arm 14b is disposed on the downstream side of the panel conveyance belt 11c, and is disposed between the conveyance belt 11c and the first bonding apparatus 51.

The suction arm 14b sucks and holds the liquid crystal panel P held by the conveyance belt 11c, and is freely conveyed in the vertical direction and the horizontal direction. For example, the suction arm 14b conveys the liquid crystal panel P that has been adsorbed and held to the front of the bonding table (the first bonding table 541, the second bonding table 542) constituting the first bonding device 51. In this state, the suction is released at this position to transfer the liquid crystal panel P to the bonding table. The liquid crystal panel P is handed over to the first bonding device 51 by the adsorption arm 14b.

(first bonding device)

Hereinafter, the contents of the first bonding apparatus 51 will be described with reference to FIGS. 7 to 11. Fig. 7 is a schematic side view of the first bonding apparatus 51. Fig. 8 is a schematic perspective view of the first bonding apparatus 51. Fig. 9 is a schematic side view showing the first bonding apparatus 51 when the liquid crystal panel P is supplied. Fig. 10 is a schematic plan view of the first bonding apparatus 51. Fig. 11 is a schematic front view of the first bonding apparatus 51. In addition, since the second bonding apparatus 52 and the third bonding apparatus 53 have the same configuration, detailed description thereof will be omitted.

The first bonding apparatus 51 is a sheet (first sheet F1m) of the bonding sheet F5 cut into a predetermined size of the first optical member sheet F1 on the upper surface of the liquid crystal panel P.

As shown in Figures 7 and 8, the first bonding device 51 has A sheet conveying device 510, a defect detecting device 530, a marking device 533, a marking detecting device 534, a first bonding table 541, a second bonding table 542, a recycling table 543, a bonding portion 520, and a moving device 550 The first rotating device 561 and the second rotating device 562.

The bonding unit 520 of the present embodiment includes a first bonding head 521A and a second bonding head 521B. Hereinafter, the first bonding head 521A and the second bonding head 521B may be collectively referred to as a bonding head 521.

The sheet conveying device 510 includes a supply line 510L that winds the first optical member sheet F1 together with the separation sheet F1 and the separation sheet F3a, and causes the separation sheet F3 to remain and cuts the first optical member sheet F1 to form a bonding sheet F5. The sheet F5 is supplied.

The sheet conveying device 510 conveys the bonding sheet F5 with the separator sheet F3a as a carrier, and includes a winding portion 510a that holds the raw material roller R1 around which the strip-shaped first optical member sheet F1 is wound, and the first optical The member sheet F1 is wound up along its longitudinal direction; a cutting device (cutting portion) 510b that applies a half cut to the first optical member sheet F1 taken up from the raw material roll R1; a knife edge 510c which is applied at an acute angle The half-cut first optical member sheet F1 is separated from the separation sheet F3a; the winding portion 510d holds the separation roller R2, and the separation roller R2 is taken up as a separate separation sheet F3a via the knife edge 510c; The plurality of rollers (for example, in the present embodiment, there are six rollers 511, 512, 513, 514, 515, 516), and between the unwinding portion 510a and the winding portion 510d, a first partitioning sheet F3a is formed. The transport path; the length measuring device 517 is provided in at least one of a plurality of rollers (for example, the roller 511 in the present embodiment).

The first optical member sheet F1 has a width larger than the width of the liquid crystal panel P (in the present embodiment, corresponds to the length of the short side of the liquid crystal panel P) in the horizontal direction (the sheet width direction) orthogonal to the conveyance direction. width.

The take-up portion 510a at the starting point of the sheet conveying device 510 and the take-up portion 510d at the end of the sheet conveying device 510 are driven in synchronization with each other, for example. Thereby, the unwinding portion 510a winds up the first optical member sheet F1 toward the conveyance direction thereof, and the winding portion 510d winds up the separation sheet F3a passing through the knife edge 510c. Hereinafter, the upstream side in the conveyance direction of the first optical member sheet F1 (the partition sheet F3a) of the sheet conveying device 510 is referred to as the sheet conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.

The plurality of rollers form a conveyance path by hanging at least the partition sheet F3a of the first optical member sheets F1. The configuration of the plurality of rollers may be selected from a roller that changes the traveling direction of the first optical member sheet F1 during conveyance, a roller that can adjust the tension of the first optical member sheet F1 being conveyed, and the like.

The length measuring device 517 measures the distance (transport distance) at which the first optical member sheet F1 is conveyed based on the rotation angle of the roller 511 attached to the length measuring device 517 and the length of the outer circumference. The measurement result of the length measuring device 517 is output to the control device 91. The control device 91 generates sheet position information based on the measurement result of the length measuring device 517, which indicates that there is a conveyance path at each point in the longitudinal direction of the first optical member sheet F1 at any time between the conveyance of the first optical member sheet F1. Any position.

The defect detecting device 530 detects the first optical in the transport Defects inherent in the member sheet F1. The defect detecting device 530 detects the defect of the first optical member sheet F1 by performing inspection processing such as reflection inspection, transmission inspection, oblique transmission inspection, and cross-Nichol transmission inspection on the first optical member sheet F1 being conveyed.

The defect detecting device 530 includes an illuminating unit 531 that can illuminate the first optical member sheet F1 and a photodetector 532 that can detect the irradiation from the illuminating unit 531 via the first optical member sheet F1 (reflection) And the light passing through one or both of them has a defect in the optical member sheet F1. a defect of the optical member sheet F1, for example, a portion of a foreign matter constituted by at least one of a solid, a liquid, and a gas inside the optical member sheet F1; or a portion having irregularities or damage on the surface of the optical member sheet F1; The deformation of the sheet F1, the material deviation, etc., become a part of a bright spot.

The illumination unit 531 irradiates the adjusted light such as the light intensity, the wavelength, and the polarization state in accordance with the type of inspection performed by the defect detecting device 530. The photodetector 532 is configured by an imaging element such as a CCD, and images the optical member sheet F1 that is irradiated with light by the illumination unit 531. The detection result (photographing result) of the photodetector 532 is output to the control device 91.

The control device 91 analyzes the image captured by the photodetector 532 and determines the presence or absence of a defect in the first optical member sheet F1. When the control device 91 determines that the first optical member sheet F1 is defective, it refers to the measurement result of the length measuring device 517 to generate defect position information indicating the position of the defect on the first optical member sheet F1.

In addition, the configuration of the defect detecting device 530 can also be appropriately The ground is changed to detect the defect of the first optical member sheet F1. For example, the defect detecting device 530 may be configured to include a determining unit that determines the presence or absence of a defect based on the detection result of the photodetector 532, and outputs the determination result of the determining unit to the control device 91. Further, the defect detecting device 53 may output the determination result of the determination unit to the control device 91, and the control device 91 does not determine the presence or absence of the defect.

The marking device 533 adds a mark to a portion of the defect of the first optical member sheet F1 based on the determination result of the determination unit. The defective portion of the first optical member sheet F1 is identified via an additional mark. For example, the marking device 533 is marked at the defect position found by the first optical member sheet F1 by inkjet or the like from the side of the surface protective film F4a. Further, instead of marking with the marking device 533, the operator may perform marking using a universal pen or the like.

The mark of the defect position by the marking device 533 is performed during the conveyance of the first optical member sheet F1. In addition, the marking of the defect position may also stop the marking of the first optical member sheet F1.

The mark detecting device 534 detects a mark in which the defect position of the first optical member sheet F1 being conveyed is marked. The mark detecting device 534 performs inspection processing such as transmission inspection on the first optical member sheet F1 being conveyed, and detects the mark of the first optical member sheet F1.

The mark detecting device 534 includes an illuminating unit 535 that can illuminate the first optical member sheet F1, and an imaging device 536 that can photograph the mark formed on the first optical member sheet F1.

For example, the illumination unit 535 is provided with: a fluorescent lamp; and a diffusion thin A sheet that diffuses light emitted from a fluorescent lamp. The photographing device 536 is configured by a photographing element such as a CCD, and photographs the first optical member sheet F1 that is irradiated with light by the illumination unit 535. The detection result (photographing result) of the photographing device 536 is output to the control device 91.

The control device 91 analyzes the image captured by the photographing device 536 and determines the presence or absence of the mark. When the control device 91 determines that there is a mark on the first optical member sheet F1, referring to the measurement result of the length measuring device 517, the mark position information indicating the position marked on the first optical member sheet F1 is generated.

The cutting device 510b cuts a full portion of the first optical member sheet F1 in the thickness direction across the full width of the first optical member sheet F1 (application of a half cut).

The cutting device 510b adjusts the tension of the first optical member sheet F1 so as not to break the first optical member sheet F1 (the separation sheet F3a) (the predetermined thickness remains on the separation sheet F3a), and adjusts the advance and retreat of the cutting blade. At the position, a half cut is applied to the vicinity of the interface between the adhesive layer F2a and the separation sheet F3a. Alternatively, a laser device can be used instead of the above-described cutting blade.

The first optical member sheet F1 after the half-cut is cut in the thickness direction thereof by cutting the optical member body F1a and the surface protective film F4a (refer to FIG. 4) to form a full-width sheet covering the sheet direction of the first optical member sheet F1. Cut into the line. The first optical member sheet F1 is divided into sections by a cut line in the longitudinal direction, and the section has a length larger than the length of the long side of the display area P4. The division is respectively a thin sheet of the bonding sheet F5 (first sheet F1m). In addition, the configuration of the cutting device 510b can be appropriately changed to control the size (depth) of the incision line in the thickness direction of the first optical member sheet F1 and the position of the incision line in the sheet conveyance direction.

The control device 91 refers to the mark position information, and determines whether or not the section corresponding to the unit length in the longitudinal direction of the first sheet F1m (hereinafter referred to as the section of the next sheet) is formed from the first incision line formed by the cutting device 510b. There is a defect in the first sheet F1m. The control device 91 determines the position of the next formed incision line in accordance with whether or not there is a defect in the section of the next sheet, and generates incision line position information indicating the position at which the incision line is formed on the first optical member sheet F1.

The cutting device 510b cuts off the partition sheet F3a according to the determination result of the determination unit, and cuts the first optical member sheet F1 into a good sheet (not equivalent to the good optical member (first sheet F1m)) or contains the defect. Defective defective sheet (corresponding to defective optical member).

The knife edge 510c is located below the first optical member sheet F1 that is conveyed substantially horizontally from the left side to the right side of Fig. 7, and extends in the sheet web direction of the first optical member sheet F1 so as to cover at least the full width thereof. The knife edge 510c is configured to be slid to the side of the partition sheet F3a of the first optical member sheet F1 after the half-cut, and to wind up the first optical member sheet F1.

The knife edge 510c winds the first optical member sheet F1 at an acute angled front end portion thereof at an acute angle. When the first optical member sheet F1 is folded back at an acute angle before the edge of the knife edge 510c, the separator sheet F3a is peeled off from the bonding sheet F5. At this time, the adhesive layer F2a of the bonding sheet F5 (the bonding surface with the liquid crystal surface sheet P) becomes downward. Immediately below the front end of the knife edge 510c becomes a point The holding surface 521a of each of the first bonding head 521A and the second bonding head 521B is joined to the front end of the blade edge 510c from above so as to be attached to the sheet 510c (first sheet F1m). The surface protective film F4a (the surface on the opposite side to the bonding surface) is bonded to each of the holding faces 521a of the first bonding head 521A and the second bonding head 521B.

The first bonding table 541 has an adsorption surface 541a that sucks and holds the liquid crystal surface sheet P to which the first bonding head 521A is attached. The second bonding table 542 has an adsorption surface 542a that sucks and holds the liquid crystal panel P to which the second bonding head 521B is attached.

As shown in Fig. 9, the first bonding table 541 and the second bonding table 542 are respectively movable in the second direction VC2 parallel to the sheet conveying direction. For example, the first bonding table 541 and the second bonding table 542 are respectively moved along the second direction VC2 when the liquid crystal panel P is supplied.

Here, the first direction V1, the second direction V2, and the third direction V3 of the coordinate axes shown in FIG. 9 are referred to in the following descriptions in FIGS. 10, 11, 13A, and 13B. The same applies to the 14A and 14B drawings, which will be described in detail below.

As shown in Fig. 8, the recovery table 543 is disposed at a position that does not interfere with the first bonding table 541 and the second bonding table 542. The recycling table 543 collects defective sheets. The recovery table 543 has a support surface 543a that supports a defective sheet.

On the support surface 543a of the recovery table 543, a defective sheet peeled off from the separation sheet F3a by the bonding head 521 is bonded. For example, a scrap sheet or the like is placed on the support surface 543a, so that the defective sheets of the plurality of sheets are heavy. Stacked in scrap material. After laminating a certain amount of defective sheets, the defective sheets are collected and discarded. At this time, the defective product sheet may be discarded after being peeled off from the waste material sheet, or may be discarded together with the waste material sheet.

In the present embodiment, the adsorption surface 541a of the first bonding table 541, the adsorption surface 542a of the second bonding table 542, and the support surface 543a of the recovery table 543 are respectively present in the same plane.

The recovery table 543 of this embodiment is disposed on the extension line 510La of the supply line 510L. The first bonding table 541 and the second bonding table 542 are disposed at positions facing each other to form a collapsing recovery table 543.

In addition, the arrangement positions of the first bonding table 541, the second bonding table 542, and the recycling table 543 are not limited to this manner. The arrangement positions of the first bonding table 541, the second bonding table 542, and the recycling table 543 are not disposed on each other if the first bonding table 541, the second bonding table 542, and the recycling table 543 are disposed. When the position of the interference is changed, it can be appropriately changed as needed.

The first bonding head 521A and the second bonding head 521B are respectively adhered and held by the bonding sheet F5 supplied from one supply line 510L, and are respectively held by the holding surface 521a, and the bonding sheets F5 held by the holding surface 521a are respectively It is bonded to each liquid crystal panel P. Specifically, the first bonding head 521A holds the bonding sheet F5 held on the holding surface 521a, and is bonded to the liquid crystal panel P held by the adsorption surface 541a of the first bonding table 541, and the second bonding head. 521B is a bonding sheet F5 held by the holding surface 521a, and is bonded to the liquid crystal panel P held by the adsorption surface 542a of the second bonding table 542.

The bonding head 521 is attached to the recovery table 543 while holding the good sheet peeled off from the separator sheet F3a and bonding it to the liquid crystal panel P while holding the defective sheet peeled off from the separator sheet F3a.

The bonding head 521 has an arc-shaped holding surface 521a that is parallel to the sheet web direction and protrudes downward. The holding surface 521a has a weak contact force with respect to the bonding surface of the bonding sheet F5 (the adhesion layer F2c is shown in FIG. 4), and the surface protection film 4c of the bonding sheet F5 can be repeatedly adhered and peeled off (refer FIG. 4). .

The bonding head 521 is tilted along the axis of the sheet web direction, parallel to the sheet web direction, and curved along the holding surface 521a, above the knife edge 510c. When the bonding sheet F5 is adhered to the holding sheet, and when the bonding sheet F5 is adhered to the liquid crystal panel P, the tilting of the bonding head 521 is appropriately performed.

The bonding head 521 is such that the holding surface 521a is downward, and one end of the bending of the holding surface 521a (the right side of FIG. 7) is the lower side. In this inclined state, one end of the bending of the holding surface 521a is crimped from above. At the front end of the knife edge 510c, the front end portion of the bonding sheet F5 which separates the peeling position 510e is adhered to the holding surface 521a. Then, the bonding sheet F5 is taken up, and the bonding head 521 is tilted (the other end of the curved end of the holding surface 521a (the left side of FIG. 7 is inclined to the lower side))) so that the sheet of the bonding sheet F5 (the The entire sheet F1m) is attached to the holding surface 521a.

The bonding head 521 can be lifted and lowered in a predetermined amount above the separation and peeling position 510 and the bonding position, and is appropriately moved between the separation and peeling position 510 and the bonding position. Here, the bonding position is the first bonding device The fitting position of 51 is, for example, the position of the first bonding table 541 or the second bonding table 542 of the first bonding device 51. The bonding head 521 is coupled to the arm portion 551b as a driving device (which can be driven when moving up and down, and during movement and tilting) (see Fig. 8).

When the first sheet F1m is placed on the holding surface 521a, for example, the front end of the first sheet F1m is attached to the holding surface 521a, and then the cutting portion is engaged with the arm portion 551b to be freely tilted. From this state, as the first sheet F1m is unwound, it is passively tilted. When the bonding head 521 is tilted until the entire first sheet F1m is placed on the holding surface 521a, the tilting posture is locked by tilting with the arm portion 551b, for example, and moved to the bonding position in this state. Above.

When the first holding sheet F1m is adhered to the liquid crystal panel P, the bonding head 521 is tilted by the movement of the arm portion 551b, for example, and the first sheet F1m is crimped along the holding surface 521a. The upper surface of the liquid crystal panel P is surely attached.

In the present embodiment, both the bonding head 521 and the bonding table are provided for each of the supply lines 510L, but they are not limited to this. For example, three or more of the bonding head 521 and the bonding table may be provided corresponding to the sheet conveying device 510, or only one of the bonding table units may be provided corresponding to the sheet conveying device 510. However, from the viewpoint that the supply line suppresses the stagnant supply of the first sheet F1m, it is preferable that at least one of the bonding heads 521 is provided for one of the supply lines 510L. However, from the viewpoint of simplification of the device configuration, it is preferable that both the bonding head 521 and the bonding table are provided for each of the supply lines 510L. One.

The moving device 550 moves the bonding head 521 between the knife edge 510c and the liquid crystal panel P, or between the knife edge 510c and the recovery table 543. Specifically, when the first bonding head 521A bonds the bonding sheet F5 to the liquid crystal panel P of the first bonding table 541, the moving device 550 moves the second bonding head 521B to the cutting edge 510c, and When the second bonding head 521B bonds the bonding sheet F5 to the liquid crystal panel P of the second bonding table 542, the first bonding head 521A is moved to the knife edge 510c.

As shown in Figs. 8, 10, and 11, the mobile device 550 is provided with a first mobile device 550A and a second mobile device 550B that are disposed adjacent to each other.

The first moving device 550A moves the first bonding head 521A between the blade edge 510c and the liquid crystal panel P held by the first bonding table 541, or between the blade edge 510c and the recovery table 543. The second moving device 550B moves the second bonding head 521B between the blade edge 510c and the liquid crystal panel P held by the second bonding table 542, or between the blade edge 510c and the recovery table 543. The first mobile device 550A and the second mobile device 550B are collectively referred to as a mobile device 550 hereinafter.

The moving device 550 includes a first moving portion 551, two second moving portions 552, and a third moving portion 553.

The first moving portion 551 moves the bonding head 521 in the first direction VC1 parallel to the normal direction of the adsorption surface 541a. The first moving portion 551 has a power portion 551a such as an actuator, an arm portion 551b that can be moved in the first direction VC1 by the power portion 551a, and a support arm portion 551b. Support portion 551c.

The first bonding head 521A is attached to the front end of the arm portion 551b of the first moving device 550A. The second bonding head 521B is attached to the front end of the arm portion 551b of the second moving device 550B.

The second moving portion 552 moves the bonding head 521 between the knife edge 510c and the liquid crystal panel P in the second direction VC2 parallel to the sheet conveying direction. The second moving portion 552 has a guide rail 552a extending along the second direction VC2, and a slider 552b movable along the guide rail 552a.

The third moving portion 553 is such that the bonding head 521 is between the knife edge 510c and the liquid crystal panel P, or between the knife edge 510c and the recovery table 543, in a third direction VC3 parallel to the direction orthogonal to the sheet conveying direction. mobile. The third moving portion 553 has a guide rail 553a extending along the third direction VC3, and a slider 553b movable along the guide rail 553a.

The guide rail 553a is mounted on the side of the slider 552b opposite to the side of the guide rail 552a. The support portion 551c is attached to the side of the slider 553b opposite to the side of the guide rail 553a.

In the first moving device 550A, the power unit 551a and the slider 553b are disposed offset from the first direction VC1 by the first bonding head 521A on the extension line 510La side, and are disposed to be eccentric to each other. Specifically, the power unit 551a is attached to one end of the support portion 551c (on the extension line 510La side), and the slider 553b is attached to the other end of the support portion 551c (opposite side of the extension line 510La).

In the second mobile device 550B, the power portion 551a and the slide The actuator 553b is disposed on the extension line 510La side as viewed from the first direction VC1, and is disposed to be eccentric to each other. Specifically, the power unit 551a is attached to one end of the support portion 551c (on the extension line 510La side), and the slider 553b is attached to the other end of the support portion 551c (the side opposite to the extension line 510La).

According to this configuration, even if the first moving device 550A and the second moving device 550B are disposed to be separated from the extension cord 510La, the first bonding head 521A and the second bonding head 521B can be moved to the knife edge 510c and recycled. Each of the tables 543.

The first rotating device 561 rotates the first bonding table 541 in a horizontal plane, and adjusts the relative relationship between the liquid crystal panel P held by the first bonding table 541 and the bonding sheet F5 held by the first bonding head 521A. Fit the position. For example, the first rotating device 561 has a motor having a rotating shaft parallel to the normal direction of the adsorption surface 541a of the first bonding table 541, and a transmitting mechanism that transmits the rotational force of the motor to the first Fit the table 541. The first bonding table 541 is mounted on the communication mechanism.

The second rotating device 562 rotates the second bonding table 542 in a horizontal plane, and adjusts the relative relationship between the liquid crystal panel P held by the second bonding table 542 and the bonding sheet F5 held by the second bonding head 521B. Fit the position. For example, the second rotating device 562 has a motor having a rotating shaft parallel to the normal direction of the adsorption surface 542a of the second bonding table 542, and a transmitting mechanism that transmits the rotational force of the motor to the second Fit the table 542. The second bonding table 542 is mounted on the communication mechanism.

The second moving portion 552 moves the bonding head 521 to the separation The front end of the blade edge 510c of the peeling position of the sheet F3a. In the first moving portion 551, the bonding head 521 is lowered from above the separation and peeling position 510e, and the holding surface 521a is pressed against the front end of the cutting edge 510c from above, and the front end portion of the bonding sheet F5 which separates the peeling position 510e is attached. On the holding surface 521a.

As shown in Fig. 7, in the present embodiment, a first detecting camera 571 which detects the sheet conveying of the sheet (the first sheet F1m) of the bonded sheet F5 at the portion below the edge portion of the cutting edge 510c is provided. The front side of the downstream side. The detection data of the first detecting camera 571 is sent to the control device 91. For example, when the first detecting camera 571 detects the downstream end of the bonding sheet F5, the control device 91 temporarily stops the sheet conveying device 510, and then lowers the bonding head 521 to stick the front end of the bonding sheet F5. It holds the surface 521a.

The control device 91 performs the cutting of the bonding sheet F5 of the cutting device 510b when the first detecting camera 571 detects the downstream end of the bonding sheet F5 and temporarily stops the sheet conveying device 510. That is, along the sheet conveyance path between the detection position of the first detection camera 571 (the position of the optical axis of the first detection camera 571) and the cutting position of the cutting device 510b (the cutting edge of the cutting device 510b) The distance corresponds to the length of the sheet (first sheet F1m) to which the sheet F5 is bonded.

The cutting device 510b is movable along the sheet conveying path by which the distance along the sheet conveying path between the detecting position of the first detecting camera 571 and the cutting position of the cutting device 510b is changed. The movement of the cutting device 510b is controlled by the control device 91, for example, after the cutting sheet F5 is cut by the cutting device 510b, when it is rolled When a portion of the sheet (the first sheet F1m) of the sheet F5 is pasted, the deviation is corrected by the movement of the cutting device 510b when the cutting end thereof deviates from the predetermined reference position. Further, the movement by the cutting device 510b may correspond to the cutting of the bonding sheet F5 having a different length. Further, the movement by the cutting device 510b can correspond to the cutting of defective sheets having different lengths.

In the present embodiment, when the bonding head 521 of the first sheet F1m is sucked and held and moved from the separation/disengagement position 510e to the bonding position, for example, the front end portion of the first sheet F1m held by the holding surface 521a is held. The two corners of the base end are respectively photographed by a pair of second detection cameras 572. The detection data of each of the second detection cameras 572 is sent to the control device 91. The control device 91 confirms the horizontal direction of the first sheet F1m of the bonding head 521 (the moving direction of the bonding head 521 and the orthogonal direction and the rotation direction of the vertical axis center), for example, based on the photographic data of each of the second detecting cameras 572. The location. When the relative positions of the bonding head 521 and the first sheet F1m are deviated, the bonding head 521 is aligned so that the position of the first sheet F1m is set to a predetermined reference position.

For the alignment of the liquid crystal panel P and the first sheet F1m by the first bonding device 51, the control device 91 determines the data according to the detection signals of the first detection camera 571, the second detection camera 572, and the third detection camera 573. The relative bonding position of the first sheet F1m to the liquid crystal panel P is determined such that the arrangement direction of the pixel columns of the liquid crystal panel P coincides with the polarization direction of the first sheet F1m (polarizing film).

In the present embodiment, the top of the first bonding table 541 and the second bonding table 542 at the bonding position are provided for advancement. A pair of third detection cameras 573 that align the horizontal direction of the liquid crystal panel P. Each of the third detecting cameras 573, for example, photographs respective corners of the glass-based sheet (first base sheet P1) of the liquid crystal panel P. The detection data of the first detection camera 571, the second detection camera 572, and the third detection camera 573 are transmitted to the control device 91. In addition, other sensors may be used instead of the first detecting camera 571, the second detecting camera 572, and the third detecting camera 573.

The bonding head 521 has, for example, a weaker adhesive force than the bonding surface (adhesive layer F2a) of the first sheet F1m, and the surface protective film F4a of the first sheet F1m may be repeatedly adhered and peeled off (refer to FIG. 4), so that it is adhered. The layer F2a side is pressure-bonded to the first sheet F1m of the liquid crystal panel P, peeled off from the holding surface 521a, and bonded to the liquid crystal panel P. In the present embodiment, the liquid crystal panel P is bonded to the first sheet F1m on the surface on the display surface side of the liquid crystal panel P by the first bonding apparatus 51.

In the present embodiment, the first bonding apparatus 51 cuts out the first sheet F1m larger than the first optical member F11 from the first optical member sheet F1, and tilts the bonding head 521 to adhere to the holding surface 521a. The first bonding apparatus 51 tilts the bonding head 521 on the liquid crystal panel P on the first bonding table 541 or the second bonding table 542 to perform bonding of the first sheet F1m.

Each of the first bonding table 541 and the second bonding table 542, each of the first rotating device 561 and the second rotating device 562, according to the first detecting camera 571, the second detecting camera 572, and the third detecting camera 573 detection data, driven by the control device 91, in the water Rotate in the plane. In this manner, the liquid crystal panel P is aligned at each of the bonding positions.

In the liquid crystal panel P, the sheet (sheet FXm) of the bonding sheet F5 to which the bonding head 521 is aligned is bonded to suppress the bonding error of the sheet FXm, and the accuracy of the optical axis direction of the liquid crystal panel P by the sheet FXm is improved. To make the chroma and contrast of the optical display device high.

Here, the polarizer film constituting the optical member sheet FX is formed, for example, by stretching a PVA film dyed with a dichroic dye on one axis, but the thickness of the PVA film during stretching is uneven or the dye of the dichroic dye is formed. Inequality may cause an error in the direction of the optical axis in the plane of the optical member sheet FX.

Therefore, in the present embodiment, the control device 91 determines the sticker of the liquid crystal panel P to the sheet FXm based on the inspection data distributed in advance in the plane of the optical axis of each portion of the sheet FXm of the memory device 92 (see Fig. 1). Position (relative fit position). Then, the bonding means 50 conforms to the bonding position, and the liquid crystal panel P is aligned with the sheet FXm cut out from the optical member sheet FX, and the sheet FX is bonded to the liquid crystal panel P.

The method of determining the bonding position (relative bonding position) of the sheet FXm to the liquid crystal panel P is as shown in FIGS. 12A and 12B.

First, as shown in FIG. 12A, a plurality of inspection points CP are set in the width direction of the optical member sheet FX, and the direction of the optical axis of the optical member sheet FX is detected at each inspection point CP. The time at which the optical axis is detected may be when the raw material roller R1 is manufactured, or may be wound between the half cut of the optical member sheet FX from the raw material roller R1. Optical member sheet FX optical axis The direction information is related to the position of the optical member sheet FX (the position of the optical member sheet FX in the longitudinal direction and the position in the width direction), and is stored in the memory device 92 (see Fig. 1).

The control device 91 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each of the inspection points CP from the memory device 92 (see FIG. 1), and detects the optical member sheet FX of the portion where the sheet FXm is cut out. The direction of the average optical axis of the area cut into the line CL.

As shown in FIG. 12B, the angle (offset angle) formed by the optical axis direction of each of the inspection points CP and the edge line EL of the sheet FXm is detected, so that the maximum angle (maximum deviation angle) among the deviation angles becomes θ max, so that When the minimum angle (minimum deviation angle) becomes θ min , the average value of the maximum deviation angle θ max and the minimum deviation angle θ min θ mid (= (θ max + θ min) / 2) is taken as the average deviation angle. Then, the direction in which the edge line EL of the sheet FXm is formed to form an average deviation angle θ mid is detected as the average optical axis direction of the sheet FXm. Further, in the calculation of the above-described deviation angle, for example, the edge line EL of the sheet FXm is positive in the left turn direction and negative in the right turn direction.

Further, the optical axis direction of the optical member sheet FX detected by the above-described method is determined such that the long side or the short side of the liquid crystal panel P forms a desired angle, and the bonding position of the sheet FXm to the liquid crystal panel P is determined ( Relatively fitting position). For example, according to the design specifications, when the optical axis direction of the optical member F1X is set to 90° with respect to the long side or the short side of the liquid crystal panel P, the optical axis of the optical member sheet FX is the average optical axis direction of the optical member sheet FX. The side or short side forms 90°, and the sheet FXm is attached to Liquid crystal panel P.

Further, the method of detecting the average optical axis direction in the plane of the optical member sheet FX is not limited to the above method. For example, one or a plurality of checkpoints CP may be selected from a plurality of checkpoints CP (see FIG. 12A) set in the width direction of the optical member sheet FX, for each selected checkpoint CP, The angle (offset angle) formed by the optical axis direction and the edge line EL of the optical member sheet FX is detected. Further, it is also possible to detect the average value of the deviation angles of the optical axis directions of the selected one or a plurality of checkpoints CP, and to detect the direction of the average deviation angle formed by the edge line EL of the optical member sheet FX as the average deviation angle. The average optical axis direction of the optical member sheet FX.

Further, in the present embodiment, a transport robot may be used as the transport mechanism for transporting the liquid crystal panel P to the first bonding table 541 and the second bonding table 542 of the first bonding apparatus 51. Hereinafter, an example of a handling robot will be described using Figs. 13A and 13B, and Figs. 14A and 14B. In addition, in FIGS. 13A and 13B, and FIGS. 14A and 14B, the first bonding table 541 for transporting the liquid crystal panel P to the first bonding table 541 and the second bonding table 542 will be described. An example.

First, an example in which the liquid crystal panel P is disposed on the first bonding table 541 in a posture in which the long side of the liquid crystal panel P is along the second direction VC2 will be described using FIG. 13A and FIG. 13B.

FIGS. 13A and 13B are schematic views showing the transfer robot 580. Figure 13A is a plan view of the transport robot 580, and Figure 13B is a transporter. Side view of the person 580.

As shown in FIGS. 13A and 13B, the transport robot 580 includes a first arm portion 581a, a second arm portion 581b, a suction arm portion 582, a first shaft portion 583a, a second shaft portion 583b, and a third shaft portion 583c. .

One end of the first arm portion 581a is attached to one end of the first shaft portion 583a having a long side along the first direction VC1. The other end portion of the first arm portion 581a is attached to one end portion (lower end portion) of the second shaft portion 583b having a long side along the first direction VC1. The first arm portion 581a is rotatable in the first direction VC1 with the first shaft portion 583a as a reference.

One end of the second arm portion 581b is attached to the other end (upper end portion) of the second shaft portion 583b. The other end portion of the second arm portion 581b is attached to one end portion (upper end portion) of the third shaft portion 583c having a long side along the first direction VC1. The second arm portion 581b is rotatable in the first direction VC1 with the second shaft portion 583b as a reference.

The center portion of the adsorption arm portion 582 having the long side in one direction is attached to the other end portion (lower end portion) of the third shaft portion 583c. The adsorption arm portion 582 can be rotated in the first direction VC1 with the third shaft portion 583c as a reference. The adsorption arm portion 582 can adsorb and hold the liquid crystal panel P.

The transport robot 580 is constructed such that the first arm portion 581a, the second arm portion 581ba, and the adsorption arm portion 582 can be rotated in the first direction VC1 by the control of the control device 91.

In FIGS. 13A and 13B, the liquid crystal panel P having the long side of the liquid crystal panel P along the second direction VC2 is adsorbed and held by one end of the adsorption arm portion 582, and is disposed along the second direction VC2. The arm portion 581a and the second arm portion 581b are disposed, and the adsorption arm portion 582 is disposed along the third direction VC3, and the liquid crystal panel P is transported to the first bonding table 541 in this state. In this manner, the liquid crystal panel P is placed on the first bonding table 541 in a posture in which the long side of the liquid crystal panel P is along the second direction VC2.

Next, an example in which the liquid crystal panel P is disposed on the first bonding table 541 in a posture in which the long side of the liquid crystal panel P is along the third direction VC3 will be described using FIGS. 14A and 14B.

14A and 14B are schematic views showing the handling robot 580. 14A is a plan view of the transfer robot 580, and FIG. 14B is a side view of the transfer robot 580.

In the transfer robot 580 shown in FIGS. 14A and 14B, the same reference numerals are attached to the same components as those in FIGS. 13A and 13B, and detailed description thereof will be omitted. In addition, in FIGS. 14A and 14B, the first arm portion 581a and the second arm portion 581b are disposed along the second direction VC2 in the postures shown in FIGS. 13A and 13B. Further, the posture of the adsorption arm portion 582 is arranged along the three directions VC3 as a reference posture.

As shown in FIGS. 14A and 14B, the liquid crystal panel P in which the long side of the liquid crystal panel P is along the third direction VC3 is adsorbed and held at the other end portion of the adsorption arm portion 582, and the first arm portion 581a is caused. The second arm portion 581ba and the suction arm portion 582 are both quantitatively rotated in the basic posture. Specifically, the first arm portion 581a is turned left in the first direction VC1 with reference to the first shaft portion 583a, and the second arm portion 581b is caused to be the second shaft portion. The 583b reference is turned right in the first direction VC1, and the adsorption arm portion 582 is rotated leftward in the first direction VC1 with reference to the third shaft portion 583c. In this manner, the first arm portion 581a is tilted to the lower side shown in FIG. 14A for the second direction VC2, and the second arm portion 581b is tilted to the right side shown in FIG. 14A for the third direction VC3, and The adsorption arm portion 582 is disposed along the third direction VC3. In this state, the liquid crystal panel P is transported to the first bonding table 541. In this manner, the liquid crystal panel P is placed on the first bonding table 541 in a posture in which the long side of the liquid crystal panel P is along the third direction VC3.

In the present embodiment, the first sheet F1m is bonded to the display surface side of the liquid crystal panel P by the first bonding apparatus 51 to form the first sheet bonding body PA1. The first sheet bonding body PA1 formed by the first bonding apparatus 51 is transferred to the conveyance belt 11c by the suction arm 14b (refer to Fig. 1).

Further, since the first bonding apparatus 51 includes a plurality of bonding heads 521, it is possible to suppress the supply of the first sheet F1m from being stagnant when the bonding process of the first sheet F1m takes a long time. Therefore, it is possible to suppress a decrease in the production efficiency of the first sheet bonding body PA1.

Returning to Fig. 1, the first sheet bonding body PA1 is transferred to the first detecting device 31 by the conveyance conveyor belt 11c.

(first detecting device)

The first detecting device 31 is provided on the sheet conveying downstream side of the first bonding device 51. The first detecting device 31 detects the edge of the bonding surface (first bonding surface) of the liquid crystal panel P and the first sheet F1m.

Fig. 15 is a plan view showing the detecting step of the edge ED of the first bonding surface SA1.

As shown in Fig. 15, the first detecting device 31 detects the edge ED of the first bonding surface SA1 in the inspection area CA at four positions on the conveyance path of the conveyance conveyor 11c. Each of the inspection areas CA is disposed at a position corresponding to four corner portions of the first bonding surface SA1 having a rectangular shape. The end edge ED is detected for each of the liquid crystal panels P carried on the line. The edge ED detected by the first detecting device 31 is stored in the memory device 92 (see Fig. 1).

In addition, the arrangement position of the inspection area CA is not limited to this. For example, each of the inspection areas CA may be disposed at a position corresponding to one of the sides of the first bonding surface SA1 (for example, the central portion of each side).

Fig. 16 is a schematic view of the first detecting device 31.

In Fig. 16, the detecting means is explained by the first detecting means 31 and the first detecting means 31 of the second detecting means 32. Since the second detecting device 32 has substantially the same configuration as that of the first detecting device 31, detailed description thereof will be omitted.

As shown in Fig. 16, the first detecting device 31 includes an illumination light source 311 which is an illumination edge ED, and a photographing device 312 which is disposed in a normal direction to the first bonding surface SA1, and a peripheral edge The ED is inclined further to the inner side of the first bonding surface SA1, and the image of the edge ED is photographed from the side of the first sheet F1m to which the first sheet bonding body PA1 is bonded.

The illumination light source 311 and the photographing device 312 are respectively disposed in the inspection area CA at four positions shown in Fig. 15 (corresponding to the first bonding surface) The position of the four corners of SA1).

The angle θ formed by the normal line of the first bonding surface SA1 and the normal line of the imaging surface 312a of the photographing device 312 (hereinafter referred to as the tilt angle θ of the photographing device 312) is preferably set to be a deviation when the panel is broken or The burrs or the like do not enter the photographic field of view of the photographing device 312. For example, when the end surface of the second substrate P2 is deviated to the outer side of the end surface of the first substrate P1, the inclination angle θ of the photographing device 312 is set such that the end surface of the second substrate P2 does not enter the photographing field of view of the photographing device 312.

The inclination angle θ of the photographing device 312 is preferably set to a distance H between the center of the first bonding surface SA1 and the photographing surface 312a of the photographing device 312 (hereinafter referred to as the height of the photographing device 312). For example, when the height H of the photographing device 312 is 50 mm or more and 100 mm or less, the tilt angle θ of the photographing device 312 is preferably set in a range of 5° or more and 20° or less. However, when the amount of deviation is known empirically, the height H of the photographing device 312 and the tilt angle θ of the photographing device 312 can be obtained from the amount of deviation. In the present embodiment, for example, the height H of the photographing device 312 can be set to 78 mm, and the tilt angle θ of the photographing device 312 can be set to 10° as a condition.

The illumination light source 311 and the photographing device 312 are fixedly disposed in each of the inspection areas CA.

In addition, the illumination light source 311 and the photographing device 312 may be disposed to be movable along the edge ED of the first bonding surface SA1. At the time, one illumination light source 311 and the photographing device 312 may be provided. Further, in this manner, the illumination light source 311 and the photographing device 312 can be moved to a position where the edge ED of the first bonding surface SA1 is easily photographed.

The illumination light source 311 is disposed on the side opposite to the side on which the first sheet F1m of the first sheet bonding body PA1 is bonded. The illumination light source 311 is disposed at a position inclined to the outside of the first bonding surface SA1 from the edge ED in the normal direction to the first bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 311 and the normal line of the imaging surface 312a of the imaging device 312 are parallel.

Further, the illumination light source may be disposed on the side of the first sheet F1m to which the first sheet bonding body PA1 is bonded.

The optical axis of the illumination source 311 and the normal to the photographic surface 312a of the imaging device 312 may also intersect slightly obliquely.

The cutting position of the first sheet F1m is adjusted in accordance with the detection result of the edge ED of the first bonding surface SA1. The control device 91 (see FIG. 1) acquires the data of the edge ED of the first bonding surface SA1 stored in the memory device 92 (see FIG. 1) so that the first optical member F11 does not protrude to the liquid crystal panel P. The cutting position (first cutting device) of the first sheet F1m is determined in such a manner that the outer side (the outer side of the first bonding surface SA1) is large.

Fig. 17 is a perspective view for explaining the action of the detecting device of the comparative example.

Figure 18 is a cross-sectional view for explaining the function of the detecting device of the comparative example.

Fig. 19 is a perspective view for explaining the action of the detecting device of the embodiment.

Fig. 20 is a cross-sectional view for explaining the action of the detecting device of the embodiment.

In the case of the first substrate P1, when the end surface of the second substrate P2 is offset to the outer side of the end surface of the first substrate P1, the first sheet F1m to which the first sheet bonding body PA1 is bonded is photographed. The edge ED of the bonding surface SA1 will be described as an example. In Figs. 17 to 20, the symbol VL indicates the photographing direction of the photographing device (the normal direction of the photographing surface of the photographing device). In addition, in FIGS. 17 to 20, illustrations of the illumination light source and the imaging device constituting the detecting device are omitted for convenience of explanation.

As shown in Fig. 17, in the detecting device of the comparative example, the photographing direction VL of the photographing device is perpendicular to the first bonding surface SA1. At the time, as shown in Fig. 18, the edge of the second substrate P2 enters the photographic field of view of the photographing device. As a result, beyond the first sheet F1m, when the edge ED of the first bonding surface SA1 is detected, the edge of the second substrate P2 is erroneously detected. That is, the photographing apparatus does not photograph the edge ED of the first bonding surface SA1, but photographs the image of the edge of the second substrate P2. As a result, the end edge ED of the first bonding surface SA1 cannot be detected with good precision.

On the other hand, as shown in Fig. 19, in the detecting device of the present embodiment, the imaging direction VL of the imaging device obliquely intersects the normal direction of the first bonding surface SA1. Specifically, as shown in Fig. 20, the photographing direction VL of the photographing device is inclined to the inner side of the end edge ED. That is, the photographing direction VL of the photographing device is set such that the end edge of the second substrate P2 does not enter the photographing field of view of the photographing device. Therefore, when the edge ED of the first bonding surface SA1 is detected beyond the first sheet F1m, the edge of the second substrate P2 is not erroneously detected, and only the edge ED of the first bonding surface SA1 can be detected. Therefore, the end edge ED of the first bonding surface SA1 can be detected with good precision.

Further, in FIGS. 17 to 20, when the end surface of the second substrate P2 is displaced to the end surface of the first substrate P1, the first image is taken from the side of the first sheet F1m to which the first sheet bonding body PA1 is bonded. The edge ED of the bonding surface SA1 will be described as an example, but it is not limited to this.

Fig. 21 is a cross-sectional view for explaining the action of the detecting device of the embodiment when a modification of the first sheet bonding body is applied.

For example, as shown in Fig. 21, when there is a burr at the end of the panel division on the end face of the liquid crystal panel P ^' , the first sheet F1m is overtaken from the side of the first sheet F1m to which the first sheet-fitting body PA1 ^' is bonded, In the example of photographing the end edge ED of the first bonding surface SA1, the detecting device of this embodiment can also be applied to this example.

Returning to Fig. 1, the table 12a and the slider mechanism 13a are disposed on the downstream side of the panel conveyance of the conveyance conveyor 11c. The slider mechanism 13a is formed in a straight line in plan view. The slider mechanism 13a can move the table 12a holding the first sheet bonding body PA1 in the longitudinal direction of the slider mechanism 13a. The first sheet bonding body PA1 is transferred to the first cutting device 61 by the conveyance belt 11c, the table 12a, and the slider mechanism 13a.

(first cutting device)

Fig. 22 is a perspective view showing the first cutting device 61. Further, the second cutting device 62 has the same configuration, and a detailed description thereof will be omitted.

The first cutting device 61 cuts the first sheet bonding body PA1 as a cutting target, and cuts off the remaining portion of the first sheet F1m to form a first optical having a size corresponding to the bonding surface on the display surface side of the liquid crystal panel P. Member F11. The first cutting device 61 is, for example, a laser light irradiation device.

As shown in Fig. 22, the first cutting device 61 includes a first table 611, a second table 612 (see Fig. 1), a laser oscillating machine 620, and an EBS (Electrical Beam Shaping) 630 (see the 23rd). An acoustic optical component 631, an IOR (Imaging Optics Rail) 640, a scanner 650, a mobile device 660, and a control device 670 that collectively controls such devices.

The first table 611 has a holding surface 611a that holds the first sheet bonding body PA1 to which the cutting process is applied. The first table 611 has a rectangular shape when viewed from the normal direction of the holding surface 611a. The holding surface 611a has a rectangular first holding surface 611a1 having a long side in a first direction (X direction), and a second holding surface 611a2 disposed adjacent to the first holding surface 611a1, and is firstly held The face 611a1 has the same shape. That is, the first table 611 has the first holding surface 611a1 and the second holding surface 611a2, and can hold the two first sheet bonding bodies PA1 at the same time.

Similarly to the first table 611, the second table 612 (see FIG. 1) has a holding surface 612a that holds the first sheet bonding body PA1. By providing the first table 611 and the second table 612, a plurality of first sheet bonding bodies PA1 can be held.

The laser oscillating machine 620 is a member that oscillates the laser light L. For example, the laser oscillating machine 620 can use an oscillation of a CO ₂ laser oscillating machine (carbon dioxide laser oscillating machine), a UV laser oscillating machine, a semiconductor laser oscillating machine, a YAG laser oscillating machine, an excimer laser oscillating machine, or the like. Machine, but the specific constitution is not particularly limited. In the oscillating machine exemplified above, the CO ₂ laser oscillating machine is preferably oscillated, for example, to illuminate a high-output laser light suitable for cutting processing of a polarizing film or the like.

Figure 23 shows the structure of the EBS 630.

As shown in Fig. 23, the EBS 630 has an acoustic optical element 631 disposed on the optical path of the laser light oscillated from the laser oscillating machine 620, and a driver 632 electrically connected to the acoustic optical element 631; The control device 670 (corresponding to the laser portion 671 described later) controls the timing at which the laser light passes through the acoustic optical element 631.

The EBS630 is shielded from laser light to stable output of laser light.

The acoustic optical element 631 is an optical element for shielding the laser light oscillated from the laser oscillating machine 620. Acoustic optical element 631, for example, the piezoelectric element in the acoustic optical medium followed by a tellurium dioxide (TeO _2), or lead molybdate (PbMoO ₄₎ of the single crystal or the like composed of glass. The electrical signal is applied to the piezoelectric element to generate an ultrasonic wave, and the ultrasonic wave is transmitted in the acoustic optical medium to control the passage and non-passing (shadowing) of the laser light.

Further, in the present embodiment, the acoustic optical element 631 is used as a constituent member of the EBS 630, but it is not limited to this. Other optical components can be used as long as the laser light oscillated from the laser oscillating machine 620 can be shielded.

The driver 632 supplies a signal signal for generating an ultrasonic signal (control signal) at the acoustic optical element 631 according to the control of the control device 670, and adjusts the shielding time of the laser light by the acoustic optical element 631.

The control device 670 controls, for example, in such a manner as to remove the rising portion and the falling portion of the laser light oscillated from the laser oscillating machine 620. The point at which the laser light passes through the acoustic optical element 631.

In addition, the time point control by the control device 670 is not limited to this mode. For example, the timing at which the laser light passes through the acoustic optical element 631 can be controlled in such a manner as to selectively remove the rising portion and the falling portion of the laser light oscillated from the laser oscillating machine 620. In particular, when the width (time) of the falling portion of the laser light oscillated from the laser oscillating machine 620 is much smaller than the width (time) of the rising portion of the laser light, the benefit of removing the falling portion of the laser light is small. . Therefore, at this time, it is possible to selectively remove only the rising portion of the laser light oscillated from the laser oscillating machine 620.

With such a configuration, the EBS 630 emits the laser light oscillated from the laser oscillating machine 620 in a state where the output is stable in accordance with the control of the control device 670. In addition, the IOR 640 removes the downstream portion of the intensity distribution of the laser light that does not contribute to the cutting of the first sheet conforming body PA1.

Figure 24 is a perspective view showing the internal structure of the IOR 640.

As shown in Fig. 24, the IOR 640 has a first collecting lens 641 that collects the laser light emitted from the EBS 630, a first holding frame 642 that holds the first collecting lens 641, and a diaphragm member 643. The laser light condensed by the first condensing lens 641 is concentrated; the holding member 644 holds the aperture member 643; the collimator lens 645 is configured to parallelize the laser light concentrated by the aperture member 643; the second holding frame 646, It holds the collimating lens 645; and a moving mechanism 647 that moves the holding member 644 and the second holding frame 646 relatively.

Figure 25 is a side cross-sectional view showing the first spotlight transmission The mirror 641, the aperture member 643, and the collimator lens 645 are configured.

As shown in Fig. 25, a pinhole 643h for concentrating the laser light collected by the first condensing lens 641 is formed in the aperture member 643. The center of each of the first condensing lens 641, the diaphragm member 643, and the collimator lens 645 is disposed at a position overlapping the optical axis CL of the laser light emitted from the EBS 630.

The aperture member 643 is preferably disposed in the vicinity of the rear focus of the first condensing lens 641.

Here, the "near focus of the rear side focus of the first condensing lens 641" described in the present specification means the arrangement position of the diaphragm member 643, and the position of the side focus after the first condensing lens 641 is not largely displaced, and the arrangement position is There can be a slight difference. For example, the distance K ₁ from the center of the first collecting lens 641 to the rear focal point of the first collecting lens 641 and the distance K ₂ from the center of the first collecting lens 641 to the center of the pinhole 643h of the diaphragm member 643 If the ratio K ₁ /K _{2 is} in the range of 0.9/1 or more and 1.1/1 or less, the diaphragm member 643 is disposed in the vicinity of the rear focus of the first collecting lens 641. In such a range, it is possible to effectively concentrate the laser light collected by the first collecting lens 641.

Further, the diaphragm member 643 is preferably disposed in the vicinity of the rear focus of the first condensing lens 641, but the arrangement position of the diaphragm member 643 is not limited to this position. The arrangement position of the diaphragm member 643 is not limited to the vicinity of the focus of the rear side of the first condensing lens 641 as long as it is in the optical path between the first condensing lens 641 and the collimator lens 645.

Returning to Fig. 24, the moving mechanism 647 has a slider mechanism 648 that causes the first holding frame 642, the holding member 644, and the Each of the two holding frames 646 moves in a direction parallel to the direction of travel of the laser light; and a table 649 is held which holds the slider mechanism 648.

For example, in a state where the holding member 644 is disposed at a certain position, the first holding frame 642 and the second holding frame 646 are moved in a direction parallel to the traveling direction of the laser light, and the first holding frame 642 and the holding member 644 are performed. The second retention frames 646 are positioned relative to each other. Specifically, the diaphragm member 643 is disposed at the position of the front focus of the collimator lens 645 and the position of the rear focus of the first condensing lens 641.

Returning to Fig. 22, the scanner 650 causes the laser light to perform 2-axis scanning in a plane parallel to the holding surface 611a. That is, the scanner 650 is paired with the first table 611 such that the laser light is in a first direction (X direction) parallel to the holding surface 611a and a second direction orthogonal to the first direction parallel to the holding surface 611a ( Y direction), moving independently relative to each other. Thereby, the laser light can be irradiated to any position of the first sheet bonding body PA1 held by the first table 611 with good precision.

The scanner 650 includes a first irradiation position adjusting device 651 and a second irradiation position adjusting device 654.

The first irradiation position adjusting device 651 and the second irradiation position adjusting device 654 constitute a scanning element that scans the laser light emitted from the IOR 640 in two planes in a plane parallel to the holding surface 611a. The first irradiation position adjusting device 651 and the second irradiation position adjusting device 654 use, for example, a current (galvano) scanner. In addition, the scanning element is not limited to a current scanner, and a gimbal can also be used.

The first irradiation position adjusting device 651 is provided with a plane mirror 652 and an actuator 653 that adjusts the set angle of the mirror 652. The actuator 653 has a rotation axis parallel to a third direction (Z direction) orthogonal to the first direction and the second direction. Actuator 653 rotates plane mirror 652 about the Z axis in accordance with control of control device 670.

The second irradiation position adjusting device 654 is provided with an actuator 656 having a plane mirror 655 and an angle at which the plane mirror 655 is adjusted. The actuator 656 has a rotational axis that is parallel to the Y direction. Actuator 656 rotates plane mirror 655 about the Y axis in accordance with control of control device 670.

On the optical path between the scanner 650 and the first table 611, a second condensing lens 680 is disposed which condenses the laser light passing through the scanner 650 toward the holding surface 611a. For example, the second concentrating lens 680 uses an f θ lens. Take this. The laser light emitted from the plane mirror 655 parallel to the second condensing lens 680 can be condensed in parallel on the first sheet bonding body PA1.

In addition, the second condensing lens 680 may not be disposed on the optical path between the scanner 650 and the first table 611.

The laser light L oscillated from the laser oscillating machine 620 is irradiated onto the first sheet bonding body PA1 held by the first table 611 via the acoustic optical element 631, the IOR 640, the plane mirror 652, the plane mirror 655, and the second condensing lens 680. . The first irradiation position adjusting device 651 and the second irradiation position adjusting device 654 adjust the laser light irradiated from the laser light oscillating machine 620 toward the first sheet bonding body PA1 held by the first table 611 in accordance with the control of the control device 670. Irradiation position.

The laser processing region (hereinafter referred to as the scanning region 610s) controlled by the scanner 650 is viewed as a moment from the normal line of the holding surface 611a. shape. In the present embodiment, the area of the scanning area 610s is smaller than the area of each of the first holding surface 611a1 and the second holding surface 611a2.

Figure 26 is used to illustrate the role of EBS630.

(a) shown in Fig. 26 shows a control signal of the laser light oscillated from the laser oscillating machine 620.

(b) shown in Fig. 26 shows the output characteristics of the laser light oscillated from the laser oscillating machine 620, that is, the laser light oscillated from the laser oscillating machine 620, before passing through the acoustic optical element 631. The output characteristics of laser light.

(c) shown in Fig. 26 shows the control signal of the acoustic optical element 631.

(d) shown in Fig. 26 shows the output characteristics of the laser light oscillated from the laser oscillating machine 620 after passing through the acoustic optical element 631.

In each of (b) and (d) shown in Fig. 26, the horizontal axis represents time and the vertical axis represents the intensity of the laser light.

In (a) to (d) shown in Fig. 27, in (a) to (d) shown in Fig. 26, one pulse of the laser light is focused.

In addition, in the following description, "the control signal of the laser light oscillated from the laser oscillating machine 620" is called "the control signal of the laser light". The "output characteristics of the laser light oscillated from the laser oscillating machine 620 before the acoustic optical element 631 passes" is referred to as "the output characteristic of the laser light before the acoustic optical element 631 passes". "Laser light oscillated from the laser oscillating machine 620, after the laser light passing through the acoustic optical element 631 The output characteristic is referred to as "the output characteristic of the laser light after the acoustic optical element 631 passes."

As shown in (a) of Fig. 26 and (a) of Fig. 27, the pulse wave Ps1 of the control signal of the laser light is a rectangular pulse wave. As shown in (a) of Fig. 26, the control signal of the laser light is a so-called clock pulse, and the ON/OFF signal to the laser oscillating machine 620 is periodically changed to generate a complex pulse wave Ps1.

In (a) shown in Fig. 26 and (a) shown in Fig. 27, the portion of the mountain of the pulse wave Ps1 is a state in which the ON signal is transmitted to the laser oscillating machine 620, that is, from the thunder. The illuminating oscillating machine 620 oscillates the ON state of the laser light. The portion of the valley of the pulse wave Ps1 is a state in which the laser beam 620 transmits an OFF signal, that is, the OFF state of the laser light is not oscillated from the laser oscillating machine 620.

As shown in (a) of Fig. 26, three pulse waves Ps1 are arranged at short intervals to form one set pulse wave PL1. The three sets of pulse waves PL1 are arranged in comparison with three pulse waves Ps1. Configured at longer intervals. For example, the interval between two adjacent pulse waves Ps1 is 1 ms, and the interval between two adjacent set pulse waves PL1 is 10 ms.

In the present embodiment, the three pulse waves Ps1 are arranged at short intervals to form one set pulse wave PL1. However, the present invention is not limited to this. For example, two or more complex pulse waves may be arranged at short intervals to form one set pulse wave PL1.

Further, it is not limited to the periodic formation of a plurality of pulse waves, and it is also possible to form a pulse wave which is formed in a long length. That is, it can also constitute a pair of laser light The ON signal of the oscillator is turned to the OFF signal, and only the laser light of a certain intensity is oscillated for a predetermined time.

As shown in (b) of FIG. 26 and (b) of FIG. 27, the pulse wave Ps2 of the output characteristic of the laser light passing through the acoustic optical element 631 is a waveform having a rising portion G1 and a falling portion G2. Pulse wave.

Here, the rising portion G1 refers to a portion of the period of the intensity of the laser light in the pulse wave Ps2 from zero to the intensity of the cut of the object. The descending portion G2 is a portion of the pulse wave Ps2 of the output characteristic of the laser light from the intensity of the laser light to the intensity of the cutting of the object, and to the period of zero. The strength of the object to be cut is different depending on the material, thickness, and output value of the laser light. An example of this is the peak intensity of the laser light as shown in (b) of Fig. 27 (100). 50% of the strength of %).

As shown in (b) of Fig. 26 and (b) of Fig. 27, the width of the rising portion G1 in the pulse wave Ps2 is longer than the width of the falling portion G2. That is, the time from the rising portion G1 of the laser light oscillated from the laser oscillating machine 620 is longer than the time from the falling portion G2 of the laser light oscillated from the laser oscillating machine 620. For example, the width of the rising portion G1 is 45 μs, and the width of the falling portion G2 is 25 μs.

Further, in the present embodiment, the width of the rising portion G1 of the pulse wave Ps2 is longer than the width of the falling portion G2, but the present invention is not limited to this. For example, the width of the rising portion G1 of the pulse wave Ps2 may be substantially equal to the width of the falling portion G2, or the width of the rising portion G1 of the pulse wave Ps2 may be shorter than the width of the falling portion G2. The present invention is applicable to all cases.

As shown in (c) of Fig. 26 and (c) of Fig. 27, the pulse wave Ps3 of the control signal of the acoustic optical element 631 is a rectangular pulse wave. As shown in (c) of FIG. 26, the control signal of the acoustic optical element 631 periodically changes the timing at which the laser light passes through the acoustic optical element 631, and periodically changes the control signal to the driver 632 to generate a complex pulse. Wave Ps3, the so-called clock pulse.

In (c) shown in Fig. 26 and (c) shown in Fig. 27, the portion of the mountain of the pulse wave Ps3 is a state in which the laser light passes through, that is, a light transmitting state through which the laser light passes. The portion of the valley of the pulse wave Ps3 is a state in which the laser light does not pass, that is, the shading state of the laser light is blocked.

As shown in (c) of Fig. 27, the valleys of the respective pulse waves Ps3 are overlapped and arranged in the rising portion G1 and the falling portion G2 of the respective pulse waves Ps2 shown in (b) of Fig. 27; By.

As shown in (c) of Fig. 27, when focusing on one pulse wave Ps3, the width of the portion V1 of the valley on the front side of the pulse wave Ps3 is larger than the width of the rising portion G1 of the pulse wave Ps2, and the pulse The width of the portion V2 of the valley on the rear side of the wave Ps3 is substantially equal to the width of the falling portion G2 of the pulse wave Ps2. For example, the width V1 of the valley on the front side of the pulse wave Ps3 is 45 μs, and the width V2 of the valley on the rear side of the pulse wave Ps3 is 25 μs. In this way, the EBS630 has a switching function that responds quickly.

In this manner, by removing the laser light rising portion G1 and the falling portion G2, the intensity of the laser light in the pulse wave Ps2 of the output characteristic of the laser light can be selectively extracted to contribute to the cutting of the object.

As a result, as shown in (d) of FIG. 26 and (d) of FIG. 27, the pulse wave Ps4 of the output characteristic of the laser light passing through the acoustic optical element 631 does not have the rising portion G1 and the falling portion G2. Become a sharp and prominent pulse wave.

Further, in the present embodiment, the width of the portion V1 of the valley on the front side of the pulse wave Ps3 is larger than the width of the rising portion G1 of the pulse wave Ps2, and the portion V2 of the valley on the rear side of the pulse wave Ps3 is exemplified. The width is approximately equal to the width of the falling portion G2 of the pulse wave Ps2, but is not limited to this manner. For example, the width of the portion V1 of the valley on the front side of the pulse wave Ps3 may be made substantially equal to the width of the rising portion G1 of the pulse wave Ps2 or the width of the portion V2 of the valley on the rear side of the pulse wave Ps3, which is larger than the pulse wave. The width of the descending portion G2 of Ps2, etc., is appropriately adjusted as needed.

Figure 28 illustrates the role of the IOR640.

The diagram on the left side of Fig. 28 shows the intensity distribution of the laser light passing through the pinhole 643h. The upper left side view of Fig. 28 is a plan view, the left middle section of Fig. 28 is a perspective view, and the left lower part of Fig. 28 is a view showing the horizontal axis as the position and the vertical axis as the intensity.

The figure on the right side of Fig. 28 shows the intensity distribution of the laser light after passing through the pinhole 643h, the upper right side view of Fig. 28 is a plan view, the right middle side view of Fig. 28 is a perspective view, and the right side lower part of Fig. 28 is a view. Indicates that the horizontal axis is the position and the vertical axis is the intensity.

Fig. 29 is an enlarged view of a cut surface when a polarizing plate of an object is cut using a laser light irradiation device of a comparative example.

Here, the laser light irradiation device of the comparative example is used directly through the needle The laser light irradiation device of the laser light before the hole 643h, that is, the laser light irradiation device having the IOR640 is not provided.

Fig. 30 is an enlarged view of the cut surface when the polarizing plate of the object is cut by the laser light irradiation device (first cutting device 61) of the embodiment.

As shown in the diagram on the left side of Fig. 28, the intensity distribution of the laser light passing through the pinhole 643h is such that the intensity of the center portion of the beam is strong and the intensity of the outer portion of the beam is weak. When the intensity of the laser light outside the beam becomes small, the outer periphery of the beam does not contribute to the cutting of the object.

At this time, as shown in Fig. 29, in the laser light irradiation apparatus of the comparative example, it was confirmed that the cut surface of the polarizing plate was inclined. When cutting the polarizing plate, it is necessary to take into consideration the peripheral portion of the beam path of the laser light, which is partially affected by heat along the cutting line, and causes the portion other than the cutting region of the polarizing plate to be melted.

On the other hand, as shown in the right side of Fig. 28, the intensity distribution of the laser light after passing through the pinhole 643h is improved by removing the downstream portion of the intensity distribution of the laser light which does not contribute to the cutting of the polarizing plate. The intensity distribution of the light is an ideal Gaussian distribution. The half width value of the intensity distribution of the laser light after passing through the pinhole 643h becomes smaller than the half width value of the intensity distribution of the laser light before passing through the pinhole 643h.

At this time, as shown in Fig. 30, in the laser light irradiation apparatus including the IOR 640 of the present embodiment, it was confirmed that the cut surface of the polarizing plate was perpendicular to the holding surface. When cutting the polarizing plate, it is considered that the portion of the intensity distribution of the laser light that contributes to the cutting of the polarizing plate is irradiated on the polarizing plate to selectively melt the cutting region of the polarizing plate.

Returning to Fig. 22, the mobile device 660 relatively moves each of the first table 611 and the second table 612 (see Fig. 1) and the scanner 650. The mobile device 660 includes a first slider mechanism 661 and a second slider mechanism 662. The first slider mechanism 661 is configured to move each of the first table 611 and the second table 612 in a first direction (X direction). The second slider mechanism 662 is configured to move the first slider mechanism 661 in the second direction (Y direction).

According to this configuration, the moving device 660 operates the linear motor (not shown) incorporated in each of the first slider mechanism 661 and the second slider mechanism 662 to cause the first slider mechanism 661 and the second slider mechanism 662. Each of them can move in each of the first direction and the second direction.

The linear motor driven by the pulse wave in the first slider mechanism 661 and the second slider mechanism 662 can finely control the rotation angle of the output shaft in accordance with the pulse wave signal supplied to the linear motor. Therefore, the positions in the respective directions of the first direction and the second direction of each of the first table 611 and the second table 612 supported by the first slider mechanism 661 can be controlled with high precision. In addition, the position control of the first table 611 and the second table 612 (refer to FIG. 1) is not limited to the position control using the pulse motor, and for example, the feedback control of the servo motor or other control methods may be utilized. achieve.

The control device 670 includes a laser control unit 671 that controls the laser oscillator 620 and the acoustic optical element 631 (driver 632), a scan control unit 672 that controls the scanner 650, and a slider control unit 673 that is The mobile device 660 is controlled.

Specifically, the laser control unit 671 controls the ON/OFF of the laser oscillating machine 620, the output of the laser light oscillated from the laser oscillating machine 620, and the laser oscillated from the laser oscillating machine 620. Control by the timing of the acoustic optical element 631 and the driver 632.

The scan control unit 672 controls the respective driving of the actuator 653 of the first irradiation position adjusting device 651 and the actuator 656 of the second irradiation position adjusting device 654.

The slider control unit 673 performs control of a linear motor incorporated in each of the first slider mechanism 661 and the second slider mechanism 662.

The scanner 650 cuts the first sheet F1m at the first cutting position determined by the control device 91. According to the first cutting position, by cutting the first sheet F1m, the corresponding portion of the first optical member F11 of the first sheet F1m which is bonded to the surface on the display surface side of the liquid crystal panel P, and the remaining portion of the outer side thereof are cut away. Thereby, an optical member (first optical member F11) corresponding to the size of the first bonding surface SA1 is formed.

Here, the "size corresponding to the first bonding surface SA1" described in the present specification means the size of the shape other than the second substrate P2. For example, when the portion corresponding to the first bonding surface SA1 is the bonding surface of the CF substrate, since there is no portion corresponding to the functional portion such as the electrical component mounting portion, the liquid crystal panel P is along the liquid crystal panel. Cutting outside the periphery of P.

Returning to Fig. 1, the remaining portion of the first sheet F1m is cut away from the first sheet bonding body PA1 by the first cutting device 61 to form the first optical member F11 on the surface on the display surface side of the liquid crystal panel P. It The first optical member is bonded to the body PA2. The first optical member bonding body PA2 formed by the first cutting device 61 is transferred to the first peeling device 71 by, for example, a conveying mechanism such as a belt conveyor.

(first peeling device)

The first peeling device 71 is disposed on the downstream side of the panel conveyance of the first cutting device 61. The remaining portion of the first peeling device 71 cut away from the first sheet F1m is peeled off. The remaining portion peeled off by the first peeling device 71 is recovered by a recovery device (not shown).

The table 12b and the slider mechanism 13b are disposed on the downstream side of the panel conveyance of the first peeling device 71. The slider mechanism 13b is formed in a straight shape in plan view. The slider mechanism 13b can move the table 12b holding the first optical member bonding body PA2 along the longitudinal direction of the slider mechanism 13b. The first optical member bonding body PA2 is transferred to the first inverting device 81 by the table 12b and the slider mechanism 13b.

(first inversion device)

The first reversing device 81 is disposed on the downstream side of the panel conveyance of the first peeling device 71. The first reversing device 81 holds the first optical member bonding body PA2 that is transferred to the table 12b via the first bonding device 51 by suction or holding, and the front surface of the first optical member bonding body PA2 is reversed, for example, converted. The first optical member bonding body PA2 that is conveyed in parallel with the short side of the liquid crystal panel P is conveyed in parallel with the long side of the liquid crystal panel P.

The above-described inversion is performed so that the respective optical members F1X bonded to the front and back surfaces of the liquid crystal panel P are arranged such that the directions of the polarization axes are at right angles to each other.

In addition, when only the front and back of the liquid crystal panel P are reversed, For example, an inversion device having a reversing arm having a rotation axis parallel to the conveying direction may also be used. In this case, if the sheet conveyance direction of the first bonding apparatus 51 and the sheet conveyance direction of the second bonding apparatus 52 are arranged at right angles in a plan view, the direction of the polarization axis can be adhered to the front and back surfaces of the liquid crystal panel P. Sheet FXm at right angles to each other.

The first inverting device 81 reverses the front and back of the first optical member bonding body PA2 on the display surface side of the liquid crystal panel P, and sets the backlight side of the liquid crystal panel P to the upper surface. The first optical member bonding body PA that has passed through the first inverting device 81 is transferred to the transport conveyor belt 11d by the reversing mechanism that constitutes the first inverting device 81.

Returning to Fig. 1, the conveyance belt 11d is formed in a straight line in plan view. The conveyance belt 11d is conveyed by the 1st optical member bonding body PA2, and the conveyance belt 11d conveys the 1st optical member bonding body PA2 in the conveyance direction of the long side of the liquid crystal panel P.

The suction arm 14c is disposed between the conveyance belt 11d and the second bonding device 52 on the side of the conveyance belt 11d.

The adsorption arm 14c sucks and holds the first optical member bonding body PA2 held by the conveyance belt 11d, and is freely transported in the vertical direction and the horizontal direction. For example, the adsorption arm 14c transports the first optical member bonding body PA2 that is adsorbed and held to the bonding table (the first bonding table 541 and the second bonding table 542) that constitute the second bonding device 52 in a horizontal state. Immediately above, the adsorption is released at this position, and the first optical member bonding body PA2 is transferred to the bonding table. The first optical member bonding body PA2 is handed over to the second bonding device 52 by the adsorption arm 14c.

(second bonding device)

The second bonding apparatus 52 bonds the second sheet F2m to the surface on the backlight side of the liquid crystal panel P in the first optical member bonding body PA2. The second sheet F2m is a sheet of the second optical member sheet F2 that is larger in size than the second optical member F12. The second sheet F2m is bonded to the surface opposite to the first optical member F11 of the first optical member bonding body PA2 by the second bonding apparatus 52 to form the second sheet bonding body PA3. The second sheet bonding body PA3 formed by the second bonding device 52 is transferred to the conveyance belt 11d by the suction arm 14c.

Further, since the second bonding apparatus 52 is provided with a plurality of bonding heads 521 (see FIG. 7), even if the bonding process of the second sheet F2m takes a long time, the supply of the second sheet F2m can be suppressed from being stagnant. Therefore, it is possible to suppress a decrease in the production efficiency of the second sheet bonding body PA3.

The adsorption arm 14c adsorbs and holds the second sheet bonding body PA3 held by the bonding table, and is freely transported in the vertical direction and the horizontal direction. For example, the adsorption arm 14c conveys the second sheet bonding body PA3 that is adsorbed and held in a horizontal state directly above the conveyance belt 11d, and at this position, the suction is released, and the second sheet bonding body PA3 is transferred to the conveyance belt 11d. The second sheet bonding body PA3 is conveyed in the conveyance belt 11d so that the long side of the liquid crystal panel P is along the conveyance direction.

The suction arm 14d is disposed between the conveyance belt 11d and the conveyance belt 11e on the downstream side of the conveyance belt 11d. The transport conveyor belt 11d and the transport conveyor belt 11e are configured to face the suction arm 14d face to face. The conveyance belt 11e forms a linear shape in plan view.

The adsorption arm 14d is adsorbed and held by the transport belt 11d The held second sheet bonding body PA3 is freely transported in the vertical direction and the horizontal direction. For example, the adsorption arm 14d conveys the two sheet bonding bodies PA3 that are adsorbed and held directly above the conveyance belt 11e, and at this position, the suction is released, and the second sheet bonding body PA3 is transferred to the conveyance belt 11e. The conveyance belt 11e is conveyed by the 2nd sheet bonding body PA3. The conveyance belt 11e conveys the second sheet bonding body PA3 so that the long side of the liquid crystal panel P is along the conveyance direction.

The suction arm 14e is disposed between the conveyance belt 11e and the third bonding device 53 on the side of the conveyance belt 11e.

The suction arm 14e sucks and holds the second sheet bonding body PA3 held by the conveyance belt 11e, and is freely conveyed in the vertical direction and the horizontal direction. For example, the adsorption arm 14e conveys the second sheet bonding body PA3 that is adsorbed and held in a horizontal state to the bonding table (the first bonding table 541 and the second bonding table 542) constituting the third bonding device 53. Immediately above, the suction is released at this position, and the second sheet bonding body PA3 is transferred to the bonding table. The second sheet bonding body PA3 is transferred to the third bonding device 53 by the adsorption arm 14e.

(third bonding device)

The third bonding apparatus 53 is attached to the second sheet bonding body PA3, and the third sheet F3m is bonded to the surface of the liquid crystal panel P on the backlight side. The third sheet F3m is a sheet of the third optical member sheet F3 which is larger in size than the third optical member F13. The third sheet F3m is bonded to the surface of the second sheet F2m side of the second sheet bonding body PA3 by the third bonding apparatus 53, so that the third sheet bonding body PA4 is formed. Third sheet bonding body formed by the third bonding device 53 The PA 4 is transferred to the conveyance conveyor belt 11e by the suction arm 14e.

Further, since the third bonding apparatus 53 includes a plurality of bonding heads 521 (see FIG. 7), even if the bonding process of the third sheet F3m takes a long time, the supply of the third sheet F3m can be suppressed from being stagnant. Therefore, it is possible to suppress a decrease in the production efficiency of the third sheet bonding body PA3.

The adsorption arm 14e adsorbs and holds the first sheet bonding body PA4 held by the bonding table, and is freely transported in the vertical direction and the horizontal direction. For example, the adsorption arm 14e conveys the third sheet bonding body PA4 that is adsorbed and held in a horizontal state directly above the conveyance belt 11e, and at this position, the suction is released, and the third sheet bonding body PA4 is transferred to the conveyance belt 11e. The conveyance belt 11e is conveyed, and the 3rd sheet bonding body PA4 is conveyed so that the long side of the liquid crystal panel P may advance along a conveyance direction.

The third optical member bonding body PA4 is handed over to the second detecting device 32 by the conveyance conveyor belt 11e.

(second detection device)

The second detecting device 32 is disposed downstream of the panel conveyance of the third bonding device 53. The second detecting device 32 detects the edge of the bonding surface (first bonding surface) of the liquid crystal panel P and the second sheet F2m.

The second detecting device 32 detects the edge of the second bonding surface, for example, at an inspection area CA (see FIG. 15) provided at four positions on the conveyance path of the conveyance conveyor 11e. Each of the inspection areas CA is disposed at a position corresponding to four corner portions of the second bonding surface having a rectangular shape. For each liquid crystal panel P that is transported on the line, its end edge is detected. The data detected by the second detecting device 32 is memorized in the memory device 92 (see According to Figure 1).

The cutting positions of the second sheet F2m and the third sheet F3m are adjusted according to the detection result of the second bonding surface. The control device 91 (see Fig. 1) acquires data of the edge ED of the second bonding surface stored in the memory device 92 (see Fig. 1), so that the second optical member F12 and the third optical member F13 do not. The cutting position (second cutting position) of the second sheet F2m and the third sheet F3m is determined so as to protrude the outer side of the liquid crystal panel P (the outer side of the second bonding surface).

The table 12c and the slider mechanism 13c are disposed on the lower side of the panel conveyance of the conveyance conveyor 11e. The slider mechanism 13c forms a linear shape in plan view. The slider mechanism 13c can move the table 12c holding the third sheet bonding body PA4 in the longitudinal direction of the slider mechanism 13c. The third sheet bonding body PA4 is transferred to the second cutting device 62 by the conveyance belt 11e, the table 12c, and the slider mechanism 13c.

(second cutting device)

The second cutting device 62 is disposed on the panel transport downstream side of the second detecting device 32.

Further, the configuration of the second cutting device 62 is the same as that of the first cutting device 61, and thus detailed description thereof will be omitted.

The scanner 650 cuts the second sheet F2m and the third sheet F3m according to the second cutting position, and cuts off a corresponding portion of the second optical member F12 of the second sheet F2m that is attached to the backlight side of the liquid crystal panel P, and a remaining portion of the outer side, and a third optical member of the third sheet F3m which is cut away from the surface opposite to the liquid crystal panel P of the second sheet F2m The corresponding part of F13 and the remainder of its outer side. In this manner, the optical members (the second optical member F12 and the third optical member F13) having a size corresponding to the second bonding surface are formed.

Therefore, the "size corresponding to the second bonding surface" described in the present specification means the size of the shape other than the first substrate P1. However, it includes an area equal to or larger than the size of the display region P4 and a size other than the shape of the liquid crystal panel P, and avoids a functional portion such as an electrical component mounting portion. In the present embodiment, the liquid crystal panel P having a rectangular shape in plan view is laser-cut along the outer periphery of the liquid crystal panel P on the three sides except the functional portion, and is adjacent to the functional portion. The remaining portion of the liquid crystal panel P is appropriately cut into the display region P4 side, and the laser cuts the remaining portion. For example, when the portion corresponding to the second bonding surface is the bonding surface of the TFT substrate, the functional portion is removed from one side of the functional portion, and the cutting is deviated from the outer periphery of the liquid crystal panel P toward the display region P4 side. The location of the quantity.

Further, the liquid crystal panel P is not limited to being bonded to a region including the above-described functional portion (for example, the entire liquid crystal panel P). For example, it is also possible to adhere to the area of the liquid crystal panel P that avoids the above-described functional portion, and then, in a plan view, the rectangular liquid crystal panel P is removed from the periphery of the liquid crystal panel P and is laser-arranged along the outer periphery of the liquid crystal panel P. Cut the rest.

The remaining portion of each of the second sheet F2m and the third sheet F3m is cut away from the third sheet bonding body PA4 by the second cutting device 62 to bond the second optical member F12 and the third optical member F13 to the liquid crystal panel P The side of the backlight side, and formed on the display of the liquid crystal panel P The optical member bonding body PA of the first optical member F11 is bonded to the surface side. The optical member bonding body PA formed by the second cutting device 62 is transferred to the second peeling device 72 by, for example, a conveying mechanism such as a belt conveyor.

(second peeling device)

The second peeling device 72 is disposed on the panel conveyance downstream side of the second cutting device 62. The second peeling device 72 peels off the remaining portion cut away from each of the second sheet F2m and the third sheet F3m. The remaining portion peeled off by the second peeling device 72 is recovered by a recovery device (not shown). The optical member bonding body PA that has passed through the second peeling device 72 is transferred to the transport conveyor belt 11f by, for example, a transport mechanism such as a belt conveyor.

Further, the size of the remaining portion of the sheet FXm (the size of the portion protruding to the outer side of the liquid crystal panel P) is appropriately set in accordance with the size of the liquid crystal panel P. For example, when the sheet FXm is applied to a liquid crystal panel P of a small size of 5 吋 to 10 ,, the interval between one side of the sheet FXm and one side of the liquid crystal panel P is set to 2 mm on each side of the sheet FXm. The length of the range of 5mm.

Fig. 31 shows a control method of scanning the laser light in a rectangular shape on the sheet FXm when the sheet FXm is cut into the optical member F1X of a predetermined size by using the first cutting device 61 and the second cutting device 62.

Further, in Fig. 31, the symbol Tr is a moving trajectory of the target laser light (a desired trajectory, hereinafter referred to as a laser light moving trajectory), and the symbol Tr1 is a relative movement using the first table 611 and the scanner 650. The movement trajectory is projected on the trajectory of the sheet FXm (hereinafter referred to as a light source movement trajectory). The light source moving track Tr1 becomes a moving laser light having a rectangular shape The shape of the corners of the four corners of the track Tr is curved, the symbol K1 is a straight line section other than the corner portion, and the symbol K2 is a flexion section of the corner portion. The symbol Tr2 is a curve (hereinafter referred to as an adjustment curve) which indicates that when the scanner 650 is relatively moved on the light source moving locus Tr1, the irradiation position of the laser light utilizes the first irradiation position adjusting device 651 and the second irradiation position adjusting device. 654, to what extent is deviated (adjusted) from the direction orthogonal to the light source moving trajectory Tr1. The amount of deviation (adjustment amount) of the laser irradiation position indicates the distance between the adjustment curve Tr2 and the laser light moving locus Tr in the direction orthogonal to the light source movement locus Tr1.

As shown in Fig. 31, the light source movement locus Tr1 becomes a substantially rectangular movement locus where the corner portion is curved. The light source movement trajectory Tr1 and the laser light movement trajectory Tr are substantially identical, and only the narrow region of the corner portion is different in shape. When the light source moving locus Tr1 has a rectangular shape, the moving speed of the scanner 650 becomes slow at the corner portion of the rectangle, and the corner portion expands and waves due to the heat of the laser light. Therefore, in Fig. 31, the corner portion of the light source moving locus Tr1 is curved, and the moving speed of the scanner 650 is substantially constant throughout the light source moving locus Tr1.

The control device 670 is configured such that when the scanner 650 moves in the linear section K1, the light source movement trajectory Tr1 and the laser light movement trajectory Tr substantially coincide, the irradiation position of the laser light is not adjusted by the first illumination position adjustment device 651 and the second illumination position. The device 654 is adjusted to illuminate the sheet FXm directly from the scanner 650 with laser light. On the other hand, when the scanner 650 moves in the flexing section K2, since the light source moving locus Tr1 and the laser light moving locus Tr do not coincide, the first irradiation position adjusting means 651 and the second irradiation position adjusting means 654 are used to control the irradiation of the laser light. Position, laser The light irradiation position is arranged on the laser light moving locus Tr. For example, when the scanner 650 moves to the position indicated by the symbol M, the first irradiation position adjusting means 651 and the second irradiation position adjusting means 654 are used to make the irradiation position of the laser light in the orthogonal direction N1 of the light source moving locus Tr1. Deviation from the distance W1. The distance W2 between the distance W1 and the adjustment direction Tr2 in the orthogonal direction N1 of the light source movement locus Tr1 is the same as the distance W2 of the laser light movement locus Tr. The light source movement trajectory Tr1 is disposed inside the laser light movement trajectory Tr, but since the irradiation position of the laser light is deviated to the outside of the laser light movement trajectory Tr due to the first irradiation position adjusting device 651 and the second irradiation position adjusting device 654, Therefore, the deviations cancel each other out, and the irradiation position of the laser light is arranged on the laser light trajectory Tr.

Returning to Fig. 1, the conveyance belt 11f has a linear shape in plan view. The conveyance belt 11f carries the second peeling device 72 while holding the optical member bonding body PA. The conveyance belt 11f conveys the optical member bonding body PA with the short side of the liquid crystal panel P along the conveyance direction. The optical member bonding body PA is transferred to the second inverting device 82 by the conveyance belt 11f.

(second reversal device)

The second inverting device 82 is disposed on the panel conveyance downstream side of the second peeling device 72. The second inverting device 82 reverses the front and back of the optical member bonding body PA on the backlight side of the liquid crystal panel P, and sets the display surface side of the liquid crystal panel P to the upper surface. The autoclave device 100 is disposed on the downstream side of the panel conveyance of the second reversing device 82. The optical member bonding body PA that has passed through the second inverting device 82 is transferred to the autoclave device 100 by, for example, a transport mechanism such as a belt conveyor.

(autoclave device)

The autoclave device 100 applies autoclave treatment (first autoclave treatment) to the optical member bonding body PA that has passed through the second inverting device 82 by applying heat and pressure treatment. The autoclave device 100 has a processing chamber 101 in which a plurality of optical member bonding bodies PA stacked thereon are carried together, and a plurality of optical member bonding bodies PA are subjected to heat and pressure treatment.

The "autoclave treatment" described in the present specification means that the defective product of the treated product is exposed to a temperature higher than room temperature in a pressurized environment higher than atmospheric pressure for a certain period of time. An example of the processing conditions is a pressure condition of 0.294 MPa or more and 0.785 MPa or less (3 kgf/cm ² or more and 8 kgf/cm ² or less), and a holding time of 30 seconds or more and 25 minutes or less is maintained at a temperature of 40 ° C or more and 80 ° C or less. . Further, depending on the holding time, generally, when the temperature exceeds 80 ° C, the dimensional change of the polarizing film occurs.

The pressure condition is preferably 0.392 MPa or more (4 kgf/cm ² or more) or 0.588 MPa or less (6 kgf/cm ² or less).

The temperature condition is preferably 50 ° C or more and 70 ° C or less.

The holding time is preferably from 1 minute to 5 minutes.

The upper limit and the lower limit of the treatment conditions can be arbitrarily combined.

In addition, the "holding time" described in the present specification means a time until one of the pressure and the temperature is less than the set value after the pressure in the processing chamber 101 is equal to or higher than the set value of the pressure and the temperature. Therefore, even if either or both of the pressure and the temperature fluctuate, if the pressure and the temperature are above the set value, the processing time of the condition is included in the holding time.

In addition, when processing in the first autoclave, it is also possible to enter only One of pressurization or heating may be performed centering on either one of pressurization or heating. For example, when the pressurization is performed as the center, the pressure is 0.5 MPa, the pressurization time is 20 minutes (however, it varies according to specifications), the temperature is 23 ° C (normal temperature), or about 60 ° C.

In the autoclave processing apparatus 100, first, the optical member bonding body PA that has been sequentially transferred is stacked on a stack (not shown) (the position indicated by the symbol 102 on the upstream side of the processing chamber 101). . During the autoclave treatment in the processing chamber 101 in the upper portion of the stack, a predetermined number of sheets are stacked. Therefore, the upper portion of the stack has a function as a buffer which prevents the conveyance of the optical member bonding body PA in the autoclave processing from stagnating.

Next, the optical member bonding body PA in which a plurality of sheets are stacked is carried into the processing chamber 101, and autoclave processing is performed.

The maximum time that the autoclave treatment can be performed is defined by the conveyance speed of the optical member bonding body PA on the manufacturing line and the number of stacked sheets on the upper stack. For example, when the optical member bonding body PA is carried into the upper portion of the stack every 10 seconds, and 20 pieces of the optical member bonding body PA are stacked on the upper side of the stack, 20 pieces of the optical member bonding body are carried in every 200 seconds from the upper portion toward the processing chamber 101. PA. In such a case, the processing chamber 101 can perform an autoclave treatment including a temperature increase or a decrease in temperature drop for a maximum of 200 seconds.

The optical member bonding body PA of a plurality of sheets which are carried out from the processing chamber 101 is stacked one at a time in a stacked lower portion (position shown by the reference numeral 103 on the downstream side of the processing chamber 101) (not shown). Move to the downstream side. In the lower portion of the stack, the optical member bonding body PA is stacked at a speed equal to or higher than the stack of the optical member bonding body PA on the upper portion, so that The handling of the optical member bonding body PA does not stagnate.

Further, the manufacturing line may be branched into a plurality on the downstream side of the second inverting device 82, and the autoclave processing apparatus 100 may be disposed in a manufacturing line disposed in each branch, and the autoclave processing may be performed in parallel. When the autoclave treatment is performed in parallel, it is preferred to make the treatable time of each autoclave processing apparatus long.

By the autoclave treatment of the autoclave processing apparatus 100, the optical member bonding body PA carried into the autoclave processing apparatus 100 can cause the defect to disappear in the optical member bonding body PA including a part of the defect, and the detailed part thereof is as follows. As described later. The defect which cannot be eliminated by the autoclave processing is detected by the second defect inspection device 42.

Here, the "defect" of the object to be inspected by the second defect inspection device 42 is a defect that can be optically inspected in the display region P4 of the optical member bonding body PA, and the display device manufactured using the optical member bonding body PA is used. Causes poor display.

Such defects include, for example, (1) defects in the liquid crystal panel P itself, (2) defects in the optical member itself, and (3) defects in bonding of the liquid crystal panel P and the optical member.

"(1) The liquid crystal panel P itself has defects", for example, due to the disorder of the liquid crystal alignment film of the liquid crystal panel P, the liquid crystal of the liquid crystal panel P cannot be oriented as designed. In the case of such a defect, for example, even if a pair of polarizing plates are correctly bonded to the crossed Nicols, the liquid crystal panel P is designed to be normally black, and when light is irradiated from one side of the optical member bonding body PA, Light leakage is generated and can be confirmed as a bright spot. In addition, the liquid crystal panel P is in transit In the case of damage, it becomes "(1) defects in the liquid crystal panel P itself."

"(2) Defects of the optical member itself", for example, deformation such as damage or depression formed on the surface of the optical member F1X can be exemplified. In the case of such a defect, since the light emitted through the liquid crystal panel P is inflected or scattered in the deformed portion, it is different from the luminance of the other portion which is not deformed, so that it can be inspected by the difference in luminance.

(3) A defect in the bonding of the liquid crystal panel P and the optical member, for example, a defect in which the dust is caught by a dust (hereinafter referred to as "foreign matter") on the bonding surface of the liquid crystal panel P and the optical member. Or forming a defect in the air bubble trapped on the bonding surface. The bonding surface is a bonding surface of the liquid crystal panel P and the first optical member F11 shown in FIG. 3, and a bonding surface of the liquid crystal panel P and the second optical member F12. In the case of such a defect, since the light emitted through the liquid crystal panel P is inflected or scattered in the defective portion, it is different from the luminance of the other portion having no defect, and therefore, it can be inspected by using the luminance difference.

When the autoclave treatment is applied to the optical member bonding body PA, the optical member bonding body PA has a defect, and in "(2) defects in the optical member itself, the optical member itself is slightly deformed, or "(3) In the defect in which the liquid crystal panel P and the optical member are bonded together, when the air bubble trapped in the liquid crystal panel P and the optical member is a fine object, the defect can be expected to disappear.

That is, when the defect is a small deformation of the optical member itself, when the autoclave treatment is applied, the optical member is easily deformed by softening due to heat. Thereby, it is expected that the small deformation which is the cause of the defect disappears.

Further, when the defect is that air is trapped in the bonding surface, air bubbles are formed by the heat and the pressure, because the saturated solubility of the air of the sheet of the adhesive layer F2a (refer to Fig. 4) of the optical member is increased. The sheet into the adhesive layer F2a. Therefore, it is expected that the bubble disappears.

Further, since the air dissolved in the sheet of the adhesive layer F2a is diffused in the sheet of the adhesive layer F2a, even if the defective product is returned to the atmospheric pressure at normal temperature after the autoclave treatment, it is expected that the bubble disappears and does not reappear. The air is agglomerated to regenerate the bubbles.

It is expected that the defect that disappears by the autoclave treatment is more difficult than the second defect inspection device 42. Therefore, when the optical member bonding body PA having such fine defects is introduced into the inspection step, false reports or omissions are likely to occur. Therefore, such defects are eliminated by the autoclave treatment, so that the inspection results of the inspection steps described later are easily stabilized.

On the other hand, the optical member bonding body PA has a defect, and the optical member itself is large in the "(1) the defect of the liquid crystal panel P itself" and the "(2) the defect of the optical member itself" in the damage of the liquid crystal panel P. Deformation, or "(3) Defects caused by bonding of the liquid crystal panel P and the optical member", on the bonding surface of the liquid crystal panel P and the optical member, the air bubbles generated by the air entrapment are large, or are bonded. When the surface is caught by a foreign matter, the defect can be expected to disappear by autoclaving.

However, in the case of the defect that the autoclave treatment does not disappear, since it is easy to appear in the inspection step, it is not easy to cause a false report or omission of the inspection step. Therefore, it is easy to make the inspection steps described later The inspection results are stable.

The optical member bonding body PA that has passed through the autoclave processing apparatus 100 is transferred to the second defect inspection device 42 by, for example, a transport mechanism of a belt conveyor.

(second defect inspection device)

The second defect inspection device 42 performs inspection of defects of the optical member bonding body PA after bonding the optical member F1X to the liquid crystal panel P. The second defect inspection device 42 is an automatic inspection device that performs an AOI inspection (Automatic Optical Inspection) on the optical member bonding body PA that faces up through the autoclave processing device 100. In the present embodiment, the second defect inspection device 42 is configured to emit light from the lower surface side (backlight side) of the optical member bonding body PA by the light source 411 (see FIG. 6), and from the upper surface side (display surface side). The photographing device 412 (see Fig. 6) photographs, and automatically checks for the presence or absence of a defect of the optical member bonding body PA based on the photographing data. The second defect inspection device 42 may have other configurations as long as it is capable of optically automatically checking for defects. The inspection data of the second defect inspection device 42 is stored in the memory device 92 (see Fig. 1).

In the optical member bonding body PA inspected in the second defect inspection device 42, since the autoclave processing is performed by the autoclave processing apparatus 100 in the manufacturing line, it is possible to reduce fine defects which are likely to cause false alarms or omissions. Therefore, the inspection result of the second defect inspection device 42 can be stabilized.

In addition, in the second defect inspection device 42, because Only the large defects which have not disappeared by the autoclave treatment are used as the inspection object, so that the detection of the defects of the second defect inspection device 42 becomes easy, and the inspection result of the defects is stabilized.

Further, since the second defect inspection device 42 is disposed on the manufacturing line, the optical member bonding body PA can be inspected at all in the manufacturing line at all times. Therefore, when a defective product is found, the manufacturing line is stopped before the production of more defective products, and the specific position of the defective product and the countermeasure against the occurrence of the defective product can be implemented as early as possible.

The control device 91 (see Fig. 1) confirms the type and state of the defect found by the second defect inspection device 42 stored in the memory device 92, and performs (1) OK determination based on a predetermined standard. (Determining the determination of a good product), (2) GRAY determination (determination that the case of either the good or defective product is unknown), and (3) NG determination (determining the determination of the defective product). The result of the determination by the control device 91 is stored in the memory device 92 (see Fig. 1). In addition, the criterion for the determination by the control device 91 can be set according to the type of the optical member F1X to be bonded or the structure of the liquid crystal panel P, and the like, and can be set by an appropriate preliminary experiment.

The OK judgment is a case where no defect is found in the optical member bonding body PA, or it is judged that the defective problem is not used. GRAY judged that a defect was found in the optical member bonding body PA, but it was impossible to judge whether it was a defect in which the actual use was defective. The NG determination is a case where a defect is found in the optical member bonding body PA.

The optical member is pasted by the second defect inspection device 42 The body PA is transferred to the conveyance conveyor 11g, the conveyance conveyor 11h, and the conveyance conveyor 11i, respectively. The conveyance conveyor belt 11g, the conveyance conveyance belt 11h, and the conveyance conveyance belt 11i are arrange|positioned in the position of the downstream of the panel conveyance of the 2nd defect inspection apparatus 42.

The conveyance belt 11g hold|maintains and conveys the optical member bonding body PA OK by OK. The conveyance belt 11h holds and conveys the optical member bonding body PA judged by GRAY. The conveyance belt 11i holds and conveys the optical member bonding body PA determined by NG. In the conveyance belt 11g, the conveyance belt 11h, and the conveyance belt 11i, the optical member bonding body PA is conveyed so that the short side of the liquid crystal panel P may follow the conveyance direction. The optical member bonding body PA that has passed through the conveyance belt 11g is transferred to the conveyance belt 11j.

The suction arm 14f is disposed on the downstream side of the panel conveyance belt 11g and the conveyance belt 11h, and between the conveyance belt 11j and the conveyance belt 11k. The adsorption arm 14f adsorbs and holds the optical member bonding body PA held by each of the conveyance conveyance belt 11g and the conveyance conveyance belt 11h, and is conveyed freely in the vertical direction and the horizontal direction. For example, the adsorption arm 14f directly conveys the optical member bonding body PA that is adsorbed and held to the conveyance belt 11j or the conveyance belt 11k in a horizontal state, and releases the suction at this position, and transfers the optical member bonding body PA to the conveyance and conveyance. Belt 11j or carrying conveyor belt 11k. The adsorption arm 14f transfers the optical member bonding body PA determined by the OK to the conveyance belt 11j, and transfers the optical member bonding body PA determined by GRAY to the conveyance belt 11k.

The transport conveyor 11j holds the bracket 15j and carries it. support 15j can accommodate a plurality of optical member bonding bodies PA (two in the present embodiment). Thereby, the optical member bonding body PA constructed to be OK is moved along the conveyance belt 11j. The optical member bonding body PA determined by the OK is conveyed to the downstream side by the conveyance conveyor 11j, and is carried out from the manufacturing line of the film bonding system 1.

The conveyance belt 11k is conveyed while holding the bracket 15k. The holder 15k can accommodate a plurality of optical member bonding bodies PA (two in the present embodiment). Thereby, the optical member bonding body PA judged by GRAY is constructed and moved along the conveyance belt 11k. The optical member bonding body PA determined by GRAY is transferred to the next step by the conveyance conveyor 11k.

The conveyance belt 11m is conveyed while holding the bracket 15m. The holder 15m can accommodate a plurality of optical member bonding bodies PA (two in the present embodiment). In this manner, the optical member bonding body PA constructed as NG is moved along the conveyance belt 11m. The optical member bonding body PA judged by NG is transferred to the next step by the conveyance conveyor belt 11m.

In addition, it is not limited to the configuration in which the conveyance belt 11j, the conveyance belt 11k, the conveyance belt 11m are held by the bracket 15j, the bracket 15k, and the bracket 15m, respectively, and the conveyance belt 11j and the conveyance belt 11k may be configured. The conveyance belt 11m is directly conveyed by holding the optical member bonding body PA.

In the present embodiment, the optical member bonding body PA judged by GRAY or NG is removed from the manufacturing line and visually inspected (offline) (first visual inspection step).

For optical structures where no defects are found in the visual inspection The part bonding body PA is carried out as an optical member bonding body PA of the finished product, and is carried out to the next step.

Next, the following regeneration treatment can be applied to the optical member bonding body PA (defective product) which is found to be defective in visual inspection. Here, in the present embodiment, since the autoclave treatment is applied to the optical member bonding body PA, the number of defective products is reduced as compared with the case where the autoclave treatment is not applied. Therefore, the number of defective products to be subjected to the regeneration processing is reduced, and the reproduction processing with a margin can be performed. In the following description, the defective product determined by visual inspection is referred to as "first visual inspection defective product".

(regeneration treatment)

For the first visual inspection of defective products, first, the type or state of the defect found is confirmed, and it is judged whether or not the defect can be eliminated by the treatment of the subsequent stage. Next, in accordance with the state of the defect, any one of the following two processes is selected, and the process is applied.

The defect is a case where the optical member itself is smallly deformed in "(2) a defect in the optical member itself, or in the liquid crystal panel P in "(3) defects occurring in the bonding surface of the liquid crystal panel P and the optical member" When the bonding surface of the optical member is a bubble which is trapped in the air and is a fine object, it is judged that it can be removed by the autoclave treatment, and the autoclave treatment (second autoclave treatment) is applied to the first visual inspection defective product.

The first autoclave treatment has been applied to the autoclave processing apparatus 100 in the manufacturing line for detecting the defective first visual inspection defective product. Therefore, when the processing conditions of the second autoclave treatment are looser than the processing conditions of the first autoclave treatment, it is considered that the defect does not easily disappear.

Therefore, the second autoclave treatment can be carried out under more stringent conditions than the processing conditions of the first autoclave treatment. In the second autoclave treatment, the set value of the temperature or the pressure may be set higher than the set value of the first autoclave treatment, but if the set value is increased, the liquid crystal panel P may be damaged. Therefore, in the second autoclave treatment, the holding time of the autoclave treatment can be set to be longer than the first autoclave treatment, and the conditions are more strict than the processing conditions of the first autoclave treatment.

The processing conditions of the second autoclave treatment can be, for example, a pressure condition of 0.294 MPa or more and 0.785 MPa or less (3 kgf/cm ² or more and 8 kgf/cm ² or less), and the temperature is maintained at 40 ° C or higher and 80 ° C or lower for 30 seconds or more and 25 minutes or less. Time. Further, depending on the holding time, generally, if the temperature condition of the autoclave treatment exceeds 80 ° C, the dimensional change of the polarizing film occurs.

The pressure conditions described above are preferably 0.392 MPa or more (4 kgf/cm ² or more) and 0.588 MPa or less (6 kgf/cm ² or less).

The above temperature conditions are preferably 50 ° C or more and 70 ° C or less.

The above holding time is preferably from 1 minute to 5 minutes.

The upper limit and the lower limit of the treatment conditions can be arbitrarily combined, respectively.

Further, in the second autoclave treatment, only one of pressurization or heating may be performed, or either pressurization or heating may be performed as a center. For example, when the pressurization is performed as the center, the treatment conditions are a pressure of 0.4 to 0.6 MPa, a pressurization time of 18 to 22 minutes (however, according to specifications), a temperature of 23 ° C (normal temperature), or about 60 ° C.

In addition, the first visual inspection of defective products has defects, In the "(2) defects in the optical member itself", the optical member itself is largely deformed, or in "(3) defects occurring in the bonding surface of the liquid crystal panel P and the optical member" in the liquid crystal panel P and the optical member When the bonding surface is such that a bubble trapped in the air is large, or when a defect caused by foreign matter is caught in the bonding surface, it is expected that the defect does not disappear by treatment with an autoclave.

At this time, the optical member is peeled off from the first visual inspection defective product, the liquid crystal panel P is exposed, a new sheet is bonded to the exposed liquid crystal panel P, and a refurbishing process is applied to form a new optical member bonding body PA.

In addition, the first visual inspection defective product has defects such as "(1) defects in the liquid crystal panel P itself" in the damage of the liquid crystal panel P, and when it is determined that the autoclave treatment and the refurbishing treatment described above cannot be regenerated, The first visual inspection of defective products was abandoned.

Such a regeneration processing step is performed separately from the above-described manufacturing line (offline processing). Therefore, there is sufficient time for each process, and reduction of waste products can be expected.

The optical member bonding body PA subjected to the regeneration processing step is inspected for visual inspection (second visual inspection step) separated from the above-described manufacturing line to check for the presence or absence of defects. If the defect is not found, the optical member as the finished product is bonded to the body PA, and is carried out to the next step.

Further, in the case where the defective product is determined to be defective in the second visual inspection step, the process returns to the above-described reproduction processing step again, and the reproduction is attempted. Here, the second visual inspection defective product in which the defect is found in the second visual inspection step corresponds to the "second visual inspection defective product" of the present invention.

(Method of Manufacturing Optical Member Bonding Body)

Fig. 32 is an explanatory view showing a method of manufacturing the optical member bonded body of the embodiment, and shows a flow chart of the above-described manufacturing steps. Hereinafter, the manufacturing flow will be described using the symbols shown in Fig. 1 as appropriate.

In the flowchart, the processing shown by symbol S1 indicates processing performed in the manufacturing line, and the processing indicated by symbol S2 indicates processing performed outside the manufacturing line.

(Optical member bonding body forming step)

First, in the manufacture of the optical member bonding body PA, the liquid crystal panel P is carried into the manufacturing line (step S11), and contaminants such as dust adhering to the surface of the liquid crystal panel P are washed (step S12).

Then, in the film bonding system 1 described above, the first sheet F1m is bonded to the surface on the display surface side of the liquid crystal panel P to form the first sheet bonding body PA1. Next, the first sheet bonding body PA1 is cut into the first sheet member F1m according to the first cutting position to form the first optical member F11 to form the first optical member bonding body PA2. Next, the second sheet F2m is bonded to the surface of the liquid crystal panel P on the backlight side of the first optical member bonding body PA2 to form the second sheet bonding body PA3. Next, in the second sheet bonding body PA3, the third sheet F3m is bonded to the surface on the opposite side of the liquid crystal panel P of the second sheet F2m to form the third sheet bonding body PA4. Next, for the third sheet bonding body PA4, the second sheet F2m and the third sheet F3m are cut according to the second cutting position to form the second optical member F12 and the third optical member F13 to form the optical member bonding body PA (step S13). ).

(first autoclave treatment)

Next, the obtained optical member bonding body PA is subjected to autoclave processing in the manufacturing line (in-line) (step S14).

(automatic check step)

Next, the second member inspection device 42 disposed in the manufacturing line (in-line) is used to perform defect inspection on the optical member bonding body PA subjected to the autoclave processing (step S15).

As a result of the inspection, for the optical member bonding body PA determined by the OK, for example, after collecting a plurality of sheets, the processing proceeds to the next step (step S16).

(first visual inspection step)

On the other hand, as a result of the defect inspection, visual inspection of the defect is performed outside the manufacturing line (offline) on the optical member bonding body PA judged by GRAY or NG (step S21).

As a result of the visual observation, the optical member bonding body PA determined by the OK is carried out in the next step (step S16).

(regeneration process step)

On the other hand, as a result of the visual inspection, the optical member bonding body PA which is determined to have a defective product (the first visual inspection defective product) is confirmed by the type of the defect or the state of the defect, and is judged by the application of the subsequent processing. Whether or not the defect can be eliminated (step S22).

In the first visual inspection of the defect of the defective product, the small deformation of the optical member itself or the bonding surface of the liquid crystal panel P and the optical member is a small object when the air bubble is trapped (in the flowchart, "defect/small" In other words, autoclave treatment is applied (step S23).

On the other hand, in the first visual inspection of the defect of the defective product, the deformation of the optical member itself is large, or when the bubble generated by the air is sandwiched between the liquid crystal panel P and the optical member, the bubble generated by the air is large (in the flowchart) The "repair/middle" is applied, and the refurbishing process is applied (step S24).

In addition, when the first visual inspection has a defect in the defective product, it is determined that the liquid crystal panel P is damaged or the like, and the autoclave processing or the refurbishing processing described above cannot be regenerated (indicated by "defect/large" in the flowchart). Discard.

Next, the optical member bonding body PA to which the autoclave treatment or the refurbishing treatment has been applied is subjected to visual inspection of the defect (second visual inspection, step S25).

If no defect is found, the optical member bonding body PA as a finished product is carried out to the next step. When it is determined that the defective product is a defective product (second visual inspection defective product), the process returns to step S22 again, and the regeneration is attempted via the regeneration processing step.

The method for producing an optical member bonded body of the present embodiment is carried out in the above manner.

As described above, the optical member bonding body manufacturing apparatus of the present embodiment is configured by bonding the optical member F1X to the liquid crystal panel P, and includes a cleaning device 20 for cleaning the liquid crystal panel P; The means 50, wherein the liquid crystal panel P is bonded to the sheet FXm of the optical member sheet FX corresponding to the optical member F1X, and the cutting means 60 is formed by cutting the optical member F1X from the sheet FXm bonded to the liquid crystal panel P; And the transport mechanism 10, which transports the liquid crystal panel P; the transport mechanism is at least After the cleaning of the liquid crystal panel P is completed by the cleaning device 20, the bonding path 50 is used to bond all of the sheets FXm to the liquid crystal panel P, and the contact portion with the liquid crystal panel P is not used. The transport mechanism for transporting the liquid crystal panel P. In other words, in the present embodiment, the transport mechanism of the liquid crystal panel P in the above-described range is used, and the transport mechanism of the liquid crystal panel P is transported without changing the contact portion of the liquid crystal panel P.

According to this configuration, the optical member R1X can be set with good precision at the time of the display region P4. Therefore, the frame portion G outside the display region P4 can be sandwiched (see FIG. 3), and the display region can be enlarged and the size of the device can be reduced.

In addition, before the first sheet F1m, the second sheet F2m, and the third sheet F3m are bonded to the liquid crystal panel P, the liquid crystal panel P can be suppressed by using a transport mechanism that sequentially changes the contact portion of the liquid crystal panel P. Adhesion of foreign bodies. Therefore, the film bonding system 1 with few bonding defects is provided.

In addition, the bonding means 50 includes a winding-out portion 510a which is a strip-shaped optical member sheet FX having a width larger than a side of one of the long side and the short side of the display region P4 of the liquid crystal panel P, and a separator sheet The optical member sheet FX is cut out from the original material roller; the cutting device (cutting portion) 510b is formed to leave the optical member sheet FX while the length is longer than either the long side and the short side of the display area P4. The sheet FXm is formed, and the bonding head 521 is held by bonding the sheet FXm to the holding surface 521a, and the sheet FXm held by the holding surface 521a is bonded to the liquid crystal panel P.

If the liquid crystal panel P is performed by a bonding mechanism such as a pinch roller In the bonding process of the sheet FXm, the nip roller rotates the contact portion with the liquid crystal panel P in order by rotation, so that if foreign matter adheres to any portion of the nip roller, the foreign matter is transported by the rotation of the nip roller to The liquid crystal panel P faces the position and adheres to the liquid crystal panel P. Therefore, when the contact portion of the liquid crystal panel P is not changed, it is likely that foreign matter adheres to the liquid crystal panel P during the bonding process.

On the other hand, according to this configuration, since the bonding head 521 performs the bonding process of the liquid crystal panel P and the sheet FXm, the bonding mechanism in which the contact portion with the liquid crystal panel P is sequentially changed is used. The adhesion of the foreign matter to the liquid crystal panel P can be suppressed. Therefore, the film bonding system 1 with less bonding defects can be provided.

The transport mechanism 10 includes a table that holds the liquid crystal panel P, a slider mechanism that moves the table, and a suction arm that sucks and holds the liquid crystal panel P held by the table. Further, the transport mechanism 10 includes a transport conveyor that holds the liquid crystal panel P and carries it, and a suction arm that holds the liquid crystal panel P held by the transport conveyor. According to this configuration, it is possible to suppress the foreign matter from adhering to the liquid crystal panel P as compared with the case of using the transport mechanism in which the contact portion with the liquid crystal panel P is sequentially changed. Therefore, the effect of providing the film bonding system 1 with few bonding defects in a simple configuration can be achieved.

Further, the first defect inspection device 41 is configured to perform inspection of defects of the liquid crystal panel P before the liquid crystal panel P is bonded to the first sheet F1m, the second sheet F2m, and the third sheet F3m, and the second defect inspection device 42, It is attached to the first sheet F1m and the second sheet F2m in the liquid crystal panel P. After the third sheet F3m, the defect of the optical member bonding body PA is inspected. According to this configuration, by the difference between the inspection data of the first defect inspection device 41 and the inspection data by the second defect inspection device 42, it is possible to calculate that only the first sheet F1m and the second sheet F2m are bonded to the liquid crystal panel P. Defects generated after the third sheet F3m.

Further, the control device 91 determines whether one of the OK determination, the GRAY determination, and the NG determination is based on the predetermined reference data for the inspection data by the second defect inspection device 42. Therefore, the accuracy of the determination can be improved as compared with the determination of either the OK determination or the NG determination, and in the vicinity of the realm between the OK determination and the NG determination, it is possible to suppress the processor that should be judged by the OK, and become NG. Judgment processing.

Further, in the present embodiment, all of the optical member bonded bodies that are constructed to be transported on the wire are processed by the autoclave. Therefore, there is a fine defect that is difficult for a person to pay attention to, and for an optical member bonding body having a disappearance by autoclaving, the defect can be eliminated and become a good product, and the yield can be improved.

In addition, in the automatic inspection using the automatic inspection device, false detection is likely to occur. However, in the present embodiment, the optical member bonding body PA to be inspected is subjected to autoclave processing by the autoclave processing apparatus 100 in the manufacturing line, so that it can be reduced. It is easy to become a micro defect of the cause of false report or omission. Therefore, even when the second defect inspection device 42 is used, the inspection result can be stabilized and the advantage of inspection automation can be enjoyed.

Further, in the present embodiment, it is constructed such that after the autoclave treatment, the automatic inspection device sequentially and automatically checks the line to be moved. The optical member is bonded to the body. According to this aspect, by sequentially inspecting the manufactured product on the manufacturing line, it is possible to detect the occurrence of defective products on the manufacturing line in a short period of time in which the defective product occurs. Therefore, it is possible to suppress the occurrence of defective products and increase the yield.

Further, in the present embodiment, visual inspection is performed outside the manufacturing line for defective products in which defects are detected by the automatic inspection device on the manufacturing line. If a commercially available optical automatic inspection device is used, the optical member bonding body that determines the defective product by automatic inspection may also contain a good product that is determined to have no problem in actual use, but the visual inspection is repeated. Inspection, less than the specification, can keep the accuracy of defect inspection at an appropriate level for practical use.

Further, since the fine defects are eliminated by the autoclave treatment, the number of defective products having defects is reduced, and the burden of the visual inspection step can be reduced.

In addition, the fine defects are eliminated by the autoclave treatment, and it is only necessary to perform the detection of the large defects which are easy to determine in the visual inspection, and it is easy to detect the defects which are not excessively or insufficiently accurate in practical use.

Therefore, according to the method for producing an optical member bonding body according to the present embodiment, it is possible to perform defect detection without excessive or insufficient precision in practical use, and to stably manufacture without impairing the manufacturing yield.

Further, the present invention is not limited to the above embodiment. For example, in the above, the description is directed to attaching a polarizing film to a liquid crystal panel. However, the optical display unit to which the optical member is attached is not limited to the liquid crystal panel. For example, the optical member may be applied to the organic EL panel. The bonded optical member is not limited to the polarizing film, and may be, for example, a reflective film. Light diffusing film, etc.

Further, in the present embodiment, the transport mechanism exemplified is such that after the cleaning of the liquid crystal panel P is completed, all the sheets of the first sheet F1m, the second sheet F2m, and the third sheet F3m are bonded to the liquid crystal panel P. In the transport path, the transport mechanism that transports the liquid crystal panel P without changing the contact portion of the liquid crystal panel P is not used, but the present invention is not limited to this. For example, the transport mechanism may not be used in the transport path after the cleaning of the liquid crystal panel P is completed, and only the two sheets of the first sheet F1m and the second sheet F2m are bonded to the liquid crystal panel P, and the liquid crystal panel may not be used. The conveyance mechanism of the liquid crystal panel P is conveyed when the contact portion of P changes. However, from the viewpoint of suppressing adhesion of foreign matter to the liquid crystal panel P and suppressing adhesion of foreign matter to the second sheet F2m, it is preferable to laminate the first sheet to the liquid crystal panel P after the cleaning of the liquid crystal panel P is completed. In the conveyance path in which all of the F1m, the second sheet F2m, and the third sheet F3m are completed, the conveyance mechanism that conveys the liquid crystal panel P without using the contact portion with the liquid crystal panel P is used.

In the present embodiment, the manufacturing apparatus of the optical member bonding body PA in which the plurality of optical members F1X (three in the present embodiment) are bonded to the liquid crystal panel P is exemplified, but the invention is not limited thereto. . For example, the manufacturing apparatus described in the present embodiment can be applied to a manufacturing apparatus in which one or two or four or more optical members F1X are bonded to the optical member bonding body PA constituted by the liquid crystal panel P.

Further, in the present embodiment, the second defect inspection device 42 is disposed on the manufacturing line, and the defect is automatically inspected in the manufacturing line. However, the present invention is limited to such a configuration, and the inspection may be disposed at a position where the second defect inspection device 42 is disposed. Member, inspected by an inspector.

At this time, since the inspector performs the visual inspection, the false report (determination of a good product as a defective product) or omission (the determination of a defective product as a good product) is reduced as compared with the case of automation using the measuring device, and the result of the defect inspection is stabilized. When the visual inspection is performed in the manufacturing line, the visual inspection (step S21 in Fig. 32) which is performed again after the inspection can be omitted.

When the visual inspection is performed in the manufacturing line, the inspector usually takes a long time to visually inspect the optical member bonding body PA of one piece, and the wire conveying speed of the optical member bonding body PA is often fast. Therefore, it is preferable to arrange a plurality of inspectors at the defect inspection position and perform visual inspection in a shared manner.

The plurality of inspectors may also set an inspection line, which is arranged in a row in the direction in which the inspection line extends, and may also set a plurality of inspection lines, and an inspection inspector is arranged on the plurality of inspection lines to transport the optical components. The bonding body PA is distributed to each inspection line and is inspected on each inspection line.

In this way, when the manufacturing line is visually inspected by the inspector, compared with the case where the defect inspection is performed by using the commercially available optical automatic inspection device, the number of defects exceeding the specification is reduced, and the accuracy of the defect inspection is kept in accordance with the actual situation. Use the appropriate level.

In addition, in the present embodiment, it is for the second visual inspection. In the inspection step, the defective product is re-applied to the defective product. However, if the number of the thermal processing is increased by the number of times of the regeneration processing, the quality of the optical member bonded body is likely to be lowered. Therefore, the defective product detected in the second visual inspection step may be used. Discarded.

However, from the viewpoint of improving the yield, it is preferable that the waste product is less. For example, it is possible to apply a predetermined amount of the upper limit of the regeneration treatment step, and the defective product of the regeneration processing step by only setting the number of times can also be discarded. use.

Further, in the present embodiment, the bonding means 50 exemplified is configured such that the bonding head 521 performs the bonding process of the liquid crystal panel P and the sheet FXm. However, the present invention is not limited to this. For example, the bonding means may be such that the sheet FXm peeled off from the separator is temporarily attached to the bonding portion of the bonding drum or the like which is a transfer body, and the bonding portion is aligned with the liquid crystal panel P so as to be attached thereto. The sheet FXm of the bonding portion is bonded to the liquid crystal panel P. Further, the bonding means may be constructed such that the bonding process of the liquid crystal panel P and the sheet FXm is performed by a pressure roller.

Further, in the present embodiment, the detection of the edge of the bonding surface (the first bonding surface SA1 and the second bonding surface) detected by the detecting device (the first detecting device 31 and the second detecting device 32) is performed. As a result, the cutting position (the first cutting position and the second cutting position) of the sheet FXm is determined, but is not limited to this. The determination of the cutting position of the sheet FXm can also be carried out by various methods other than the above.

(Second embodiment)

Figure 33 is a schematic view of a film bonding system 1001 of the second embodiment. Make up the picture. In the third embodiment, the same components as those of the film bonding system 1 described in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in Fig. 33, the film bonding system 1001 of the present embodiment is provided in one of the manufacturing lines of the liquid crystal panel P. The respective portions of the film bonding system 1001 are collectively controlled by a control device 91 as an electronic control device.

(film bonding system)

Next, the film bonding system 1001 of the present embodiment will be described in detail.

In the 33rd drawing, the left side of the figure shows the upstream side of the conveyance direction of the liquid crystal panel P (hereinafter referred to as the panel conveyance upstream side), and the right side of the figure shows the downstream side of the conveyance direction of the liquid crystal panel P (hereinafter referred to as The panel transports the downstream side).

As shown in FIG. 33, the film bonding system 1001 of the present embodiment includes a transport mechanism 1010, a cleaning device 20, a detecting device 30, a first defect inspecting device 41, a second defect inspecting device 42, and a bonding means 50. The cutting means 60, the first peeling means 71, the second peeling means 72, the first inverting means 81, the second inverting means 82, the cutting position positioning means 90, the autoclave processing means 100, the control means 91 and the memory means 92 .

The cleaning device 20 cleans the liquid crystal panel P, and removes foreign matter adhering to or fixed to the outer surface of the liquid crystal panel P. The foreign matter or the like is, for example, a paste or cullet (waste glass) fixed to the liquid crystal panel P in addition to foreign matter such as dust adhering to the liquid crystal panel P. By using the liquid crystal panel P By removing foreign matter or the like, it is possible to suppress the bonding defect when the liquid crystal panel P is bonded to the sheet FXm.

The detecting device 30 detects the shape of the liquid crystal panel P before attaching the sheet FXm to the liquid crystal panel P. As described later, in the film bonding system 1001 of the present embodiment, the error of the size of each liquid crystal panel P is considered, and the liquid crystal panel P is bonded to the sheet FXm which is slightly larger than the intended optical member F1X, from the sheet FXm. On the side, the liquid crystal panel P is photographed by a camera or the like, and the sheet FXm is cut along the shape of the liquid crystal panel P. At this time, since the liquid crystal panel P of the sheet FXm is photographed, the shape of the liquid crystal panel P (the portion concealed by the sheet FXm) cannot be detected with good precision. Therefore, in the film bonding system 1001 of the present embodiment, the shape of each liquid crystal panel P is measured by the detecting device 30 before the sheet FXm is bonded, and the sheet FXm is cut using the measurement data. Thereby, the cutting position of the sheet FXm can be determined with good precision. Further, the measurement data obtained by the detecting device 30 is supplied to the cutting position positioning means 90, and the cutting position positioning means 90 determines the cutting position of the sheet FXm.

The first defect inspection device 41 checks for defects of the liquid crystal panel P. The defect inspection in the first defect inspection device 41 is a defect inspection performed before the optical member is attached to the liquid crystal panel P. Therefore, in the defect inspection, defects existing in the liquid crystal panel P are inspected. The defects inherent in the liquid crystal panel P include, for example, damage of bubbles or alignment films in the liquid crystal layer.

The second defect inspection device 42 checks for defects in the liquid crystal panel P (optical member bonding body) after bonding the optical member to the liquid crystal panel P. In the first The second defect inspection device 42 can inspect both the defects in the liquid crystal panel P and the defects generated by bonding the sheet FXm to the liquid crystal panel P. The defect in which the sheet FXm is bonded to the liquid crystal panel P is exemplified by a defect such as foreign matter sandwiched between the liquid crystal panel P and the sheet FXm, or when the sheet FXm is attached to the liquid crystal panel P due to stress Bubble defects generated inside the sheet FXm, in addition to the bubble defects or uneven defects of the sheet FXm itself.

By using the inspection result of the first defect inspection device 41 and the inspection result of the second defect inspection device 42, the defects inherent in the liquid crystal panel P and the defects generated by bonding the sheet FXm to the liquid crystal panel P can be detected differently.

The bonding means 50 bonds the sheet FXm to the liquid crystal panel P. The bonding means 50 includes a first bonding device 51 for bonding the first sheet F1m of the first optical member sheet F1 larger than the first optical member F11 to the first surface of the liquid crystal panel P; The second device F2m of the second optical member sheet F2 which is larger than the second optical member F12 is attached to the second surface of the liquid crystal panel P; and the third bonding device 53 The third sheet F3m of the third optical member sheet F3 larger than the third optical member F13 is bonded to the second surface of the liquid crystal panel P.

The cutting means 60 cuts the sheet FXm in accordance with the cutting position (the first cutting position and the second cutting position) determined by the cutting position positioning means 90, and cuts off the portion corresponding to the optical member F1X2 of the sheet FXm of the liquid crystal panel P. And the rest of its outer side. The cutting means 60 comprises: a first cutting device 61 which cuts the first thin according to the first cutting position a sheet F1m for cutting away a corresponding portion of the first optical member F11 of the first sheet F1m bonded to the first surface of the liquid crystal panel P and a remaining portion thereof; and a second cutting device 62 according to the second Cutting position, cutting the second sheet F2m together, and overlapping the third sheet F3m disposed on the second sheet F2m to cut off the second optical member F12 of the second sheet F2m attached to the second surface of the liquid crystal panel P The corresponding portion, and the remaining portion of the outer side thereof, and the corresponding portion of the third optical member F13 of the third sheet F3m and the remaining portion of the outer side thereof are cut.

The first peeling device 71 peels off the remaining portions of the second sheet F2m and the third sheet F3m which are cut away from the second optical member F12 and the third optical member F13 by the second cutting device 62, and is peeled off from the liquid crystal panel P. The second peeling device 72 peels off the remaining portion of the first sheet F1m which is cut away from the first optical member F11 by the first cutting device 61, and is peeled off from the liquid crystal panel P.

The first inverting means 81 and the second inverting means 82 reverse the front and back of the liquid crystal panel P. In the first inverting device 81 and the second inverting device 82, the liquid crystal panel P is rotated by 90° as needed so that the longitudinal direction and the short side direction of the liquid crystal panel P are interchanged with respect to the conveyance direction of the liquid crystal panel P. This rotation operation may be performed simultaneously with the reversal operation or separately from the reversal operation.

In the autoclave processing apparatus 100, the optical member bonding body PA in which the first optical member F11, the second optical member F12, and the third optical member F13 are bonded to the liquid crystal panel P is subjected to heat and pressure treatment, and the sheet FXm is removed. The bubble defect generated in the liquid crystal panel P or the bubble defect in the sheet FXm.

Cleaning device 20, detection device 30, first defect inspection device 41, second defect inspection device 42, bonding means 50, cutting means 60, first peeling means 71, second peeling means 72, and The inverting device 81, the second inverting device 82, and the autoclave processing device 100 are connected by a continuous transport mechanism 1010 to transport the liquid crystal panel P and attach the sheet FX or the optical member F1X to the liquid crystal panel P. The formed optical member is bonded to the body.

In the film bonding system 1001 of the present embodiment, the liquid crystal panel P is carried into the loading position of the film bonding system 1001 (hereinafter referred to as the loading position), and the liquid crystal panel P (optical member bonding body) is bonded from the film bonding system. All of the transport mechanisms of the liquid crystal panel P between the carry-out positions (hereinafter referred to as the unloading positions) of the 1001 are "transport mechanisms that do not change during the conveyance of the liquid crystal panel P by the contact portion with the liquid crystal panel P".

The film bonding system 1001 transports the liquid crystal panel P from the loading position to the unloading position, and applies a specific process to the liquid crystal panel P in order. The liquid crystal panel P is conveyed by the transport mechanism 1010 in a state where the front and back sides thereof are horizontal.

In the following description, the entire processing of the liquid crystal panel P by the flow operation from the loading position to the unloading position may be referred to as a "manufacturing line". The manufacturing line mainly refers to a flow operation performed by a plurality of processing devices disposed on a conveyance path (also referred to as a conveyance line) of the conveyance mechanism 1010, and the operation performed on the manufacturing line is referred to as "in-line manufacturing".

Further, from the loading position to the unloading position, the processing device is taken out of the liquid crystal panel P transported by the transport mechanism 1010, and is different from the processing device. After the liquid crystal panel P is processed, the processed liquid crystal panel P is returned to the transport path of the transport mechanism 1010, and can be processed as a part of the manufacturing line as long as the flow operation does not cause a malfunction.

In addition, the work performed separately from the above-described process operation is referred to as "manufacturing off-line work". Regardless of the conveyance speed of the conveyance mechanism 1010, it is possible to take the necessary time to perform work.

Hereinafter, an example of the configuration of the film bonding system 1001 will be described in detail.

(handling mechanism)

The transport mechanism 1010 of the present embodiment includes transport conveyors 1011a to 1011j (belt conveyor belts), tables 1012a to 1012g, slider mechanisms 1013a to 1013g, and suction arms 1014a to 1014e.

The transport conveyor belt 1011a is disposed at the loading position. The conveyance belt 1011a forms a U shape in plan view. The conveyance belt 1011a holds the holder 1015a and carries it. The holder 1015a can accommodate a plurality of liquid crystal panels P. In the present embodiment, two liquid crystal panels P are housed in the holder 1015a. Thereby, the liquid crystal panel P is constructed to move along the conveyance belt 1011a.

Further, in the present embodiment, the configuration in which the conveyance belt 1011a holds the holder 1015a for transportation is not limited, and the conveyance belt 1011a may be directly held by the holder 1015a.

The suction arm 1014a is disposed on the downstream side of the panel conveyance belt 1011a, and is disposed between the curved portion of the conveyance conveyor 1011a and the conveyance belt 1011b. Adsorption arm 1014a is adsorbed and kept The liquid crystal panel P held by the conveyance belt 1011a is freely conveyed in the vertical direction and the horizontal direction. For example, the adsorption arm 1014a directly conveys the liquid crystal panel P that has been adsorbed and held in a horizontal state directly above the conveyance belt 1011b, and at this position, the suction is released, and the liquid crystal panel P is transferred to the conveyance belt 1011b.

The conveyance belt 1011b forms a linear shape in plan view. The conveyance belt 1011b holds the crystal panel P and carries it. The liquid crystal panel P is attached to the conveyance belt 1011b, and the short side of the liquid crystal panel P is conveyed along the conveyance direction. The liquid crystal panel P is transferred to the cleaning device 20 by transporting the conveyor belt 1011b.

(cleaning device)

The cleaning device 20 is arranged upstream of the film bonding system 1001. In the cleaning device 20, the liquid crystal panel P is transported by using the transport conveyance belt 201 (see FIG. 5), and a predetermined washing process is sequentially applied to the liquid crystal panel P. The liquid crystal panel P is conveyed to the conveyance belt 201 in a state in which the front and back surfaces thereof are horizontal.

The liquid crystal panel P of the cleaning device 20 removes foreign matter such as dust adhering to the front and back surfaces thereof, and removes the paste adhered to the front and back surfaces of the liquid crystal panel P by the polishing unit 203 (see FIG. 5). Broken glass (waste glass), etc. Thereby, the defective product produced by bonding the foreign matter to the film bonding system 1001 is reliably suppressed.

(detection device)

Figure 34 is a schematic illustration of the detection device 30.

As shown in FIG. 34, the detecting device 30 includes: a photographing device 302, This is an image of the photographic liquid crystal panel P; and an illuminating device 301 that encloses the liquid crystal panel P and illuminates the liquid crystal panel P from the side opposite to the photographing device 302. In the detecting device 30 of the present embodiment, the shape of the liquid crystal panel P is detected before the sheet FXm is bonded to the liquid crystal panel P in the manufacturing line. Further, the detecting device detects the mark Am (see FIG. 2) provided on the outer peripheral portion of the first substrate P1 of the liquid crystal panel P.

In addition, the shape of the liquid crystal panel P is not limited to being detected in the manufacturing line, and may be detected outside the manufacturing line. That is, it is also possible to construct a shape in which the liquid crystal panel P is shaped before the sheet FXm is attached to the liquid crystal panel P.

35A and 35B are schematic views showing the case where the liquid crystal panel P is photographed using the photographing device 302. First, as shown in Fig. 35A, the periphery of the liquid crystal panel P is imaged using the photographing device 302.

The liquid crystal panel P has a liquid crystal layer P3 sandwiched between the second substrate P2 and the first substrate P1 (see FIG. 2). Further, the liquid crystal panel P has an area in a plan view, and the second substrate P2 is smaller than the first substrate P1. When the two are overlapped, one end of the first substrate P1 is exposed in a plan view. The terminal portion P6 is provided in a region P5 where the first substrate P1 is exposed.

Fig. 35B is a partial plan view showing the liquid crystal panel P. In Fig. 35B, it is expedient to display the side EA of the four sides EA, EB, EC, ED of the second substrate P2. The liquid crystal panel P of the present embodiment is manufactured with a plurality of chamfers. Therefore, as shown in FIG. 3, EA1 and EA2 in the vicinity of the corner portion of the second substrate P2 (for example, the corner portions C1 and C2 at both ends of the side EA) are compared with the center EA3 of the side EA, and burrs or defects are generated. Can't be linear. The length of the nearby EA1 and EA2 is, for example, about 5 mm in the liquid crystal panel P for a 4-inch display.

With respect to such a liquid crystal panel P, the photographing device 302 is used to photograph the photographing region AR including the second substrate P2. The photographing device 302 is a line camera including a plurality of photographing elements arranged in parallel with the side EC (or the side EA) of the terminal portion P6 among the four sides EA, EB, EC, and ED of the second substrate P2. Direction (first direction). For example, the photographic element is a CCD (Charge Coupled Device). The photographing device 302 moves in a direction (second direction) parallel to the side EB (or the side ED) of the adjacent side EC, and photographs an image including the second substrate P2 (hereinafter referred to as a facing substrate image) in a plan view.

In addition, the moving direction of the photographing device 302 is not limited. For example, the photographing device 302 may include a plurality of photographing elements arranged in a direction parallel to the side EB (or the side ED), and move in a direction parallel to the side EC (or the side EA) of the adjacent side EB to perform a photographing surface. For the substrate image. That is, the photographing device 302 may be configured to include a plurality of photographic elements arranged in the first direction as viewed in the normal direction of the surface of the second substrate P2, and move in a second direction orthogonal to the first direction to perform photographing. Facing the substrate image.

The image data of the image captured by the photographing device 302 is input to the control device 91 (see FIG. 33), and the next processing (image processing, calculation) is performed.

(first treatment)

First, the first processing is processing for emphasizing the outline of the second substrate P2 from the image data, from the side of the second substrate P2 shown in FIGS. 35A and 35B, when the liquid crystal panel P is viewed from above.

For example, when the liquid crystal panel P is viewed in a plan view, in the region where the liquid crystal panel P is present (the first region) and the region where the liquid crystal panel P is not present (the second region), the light transmittance is different, so that the image is captured. The second area is brighter than the first area. Therefore, when the captured image is binarized, the first region becomes a bright region (white), the second region becomes a dark region (black), and the outline of the second substrate P2 serves as a boundary between light and dark.

Further, since the threshold value of the tone value at the time of binarization is an appropriate value depending on the configuration of the liquid crystal panel P at the photographing position, etc., it can also be set by an appropriate preliminary experiment.

(second treatment)

Figure 36 is a schematic view showing the vicinity of the corners of the image captured by the photographing device 302 of Figs. 35A and 35B. In Fig. 36, it is expedient to indicate the vicinity of the corner including the side EA and the side EB. In Fig. 36, the first area is indicated by the symbol AR1 and the second area is represented by the symbol AR2. As shown in Fig. 36, the second processing detects the coordinates of the point D of the complex number which is repeated with the outline of the second substrate P2, based on the binarized image data (hereinafter referred to as binarized data) in the first processing.

First, in the outline of the second substrate P2 obtained by the photographing device 302 to face the substrate image, the first portion that does not satisfy the preset reference is removed. Specifically, in the vicinity of the corner portions EA1, EB1 (first portion) shown in Fig. 36, burrs or defects are generated on the second substrate P2, and each side (the sides EA, EB in Fig. 36) is not It becomes a straight line. Therefore, at the time of detection at point D, it is set so that the detection range does not include the nearby EA1, EB1 (predetermined range near the corner). From the vicinity of the detection range, EA1 The range of EB1 can be appropriately set according to the value obtained by experience or experiment.

Next, in each side (the side EA, the side EB in Fig. 36), in the outline of the second substrate P2, except for the central portions EA3 and EB3 (second portion) other than the nearby EA1, EB1, the detection and the The coordinates of the point D of the complex number of the two substrates P2 overlapping.

For the coordinate axis of the detected coordinate, for example, the left upper end of the binarized data is used as the origin, and the X-axis with the + direction to the right of the image is set, and the Y-axis with the + direction below the image. Further, in the image captured by the photographing device 302, the two sides (outlines) of the corner portion of the second substrate P2 may be sandwiched, and may be constructed so as not to be substantially parallel to the periphery of the image to be photographed. Perform processing (trimming processing) for cutting out any area suitable for analysis from appropriate image data (or binarized data), and perform second processing on the processed image.

When detecting the coordinates of the point D, for example, according to the binarized data, at any position (x1) in the X-axis direction of the image, when the color tone is detected from the upper end in the +Y direction, it can be blackened from the confession (first region) ( The position (y1) of the position of the second region) in the Y direction is obtained as the coordinate (x1, y1) of the point D. This processing is performed on each of the four sides EA, EB, EC, and ED of the second substrate P2, and the coordinates of the point D overlapping the plurality of sides can be detected on each side.

Further, the number of detection points D is preferably large, but it may be set so as not to overload the processing of the arithmetic processing described later. For example, 100 points D can be detected on each of the four sides EA, EB, EC, and ED.

(third treatment)

The third process is a coordinate of the point D of the complex number detected by the second process, and a straight line corresponding to the side overlapping the point D is approximately obtained. The approximation can use conventional statistical methods, for example, an approximation method of finding a regression line (approximating line) using the least squares method.

Fig. 37 is a graph showing the approximate straight line L1 obtained by the third processing, and is a graph in which the approximate straight line L1 is represented by Y=0. In Fig. 37, for convenience, the approximate straight line L1 obtained at the side EA is shown.

Here, in Fig. 37, the point D1 drawn on the +y side or the point D2 drawn on the -y side is considered, and when compared with the other point D, the departure distance from the approximate straight line L1 becomes larger, and the approximation is approximated. The calculation result of the straight line L1 has a large influence. In such a case, it is also possible to use an additional point other than the point D1 and the point D2 to obtain an approximate straight line again.

In addition, it is not limited to two as shown in FIG. 37 except for the point D. For the distance between the approximate straight line L1 and the point D (the absolute value of the Y coordinate of point D in Fig. 37), it can also be constructed to determine the threshold value, except for the point D where the absolute value of the Y coordinate is greater than the threshold value. Find an approximate straight line. The threshold value can be appropriately set according to empirical or experimental values.

For each of the four sides EA, EB, EC, and ED included in the captured image, the approximate straight line obtained in this way is obtained. In the following description, the approximate straight line obtained by the side EA is referred to as L1, the approximate straight line obtained by the side EB is referred to as L2, the approximate straight line obtained by the side EC is referred to as L3, and the approximated line obtained by the edge ED is approximated. The line is called L4.

(fourth processing)

The fourth processing is assumed to be obtained by using the approximate straight lines L1, L2, L3, and L4 obtained by the imaging device 302 to face the four sides of the substrate image, and obtaining the approximate straight lines L1, L2, L3, and L4. The figure is taken as the outline of the second substrate P2 (approximate outline).

Figure 38 is a schematic diagram of the approximate contour line OL.

As shown in Fig. 38, the approximate contour line OL can be obtained by connecting the approximate straight lines L1, L2, L3, and L4 obtained by the third processing. Further, the data of the approximate outline OL is memorized in the memory device 92 (refer to Fig. 33).

Returning to Fig. 33, the liquid crystal panel P passing through the detecting device 30 is transferred to the first defect inspection device 41 by, for example, a transport mechanism such as a belt conveyor.

(first defect inspection device)

The first defect inspection device 41 is an automatic inspection device that performs an AOI inspection (Automatic Optical Inspection) on the liquid crystal panel P on the display surface side through the detection device 30. In the present embodiment, the first defect inspection device 41 irradiates light from the lower surface Sf1 side (backlight side) of the liquid crystal panel P with the light source 411 (see FIG. 6), and photographs from the upper surface Sf2 side (display surface side). The device 412 photographs and automatically checks for the presence or absence of defects of the liquid crystal panel P based on the photographic data. The first defect inspection device 41 may have other configurations as long as it can perform optical automatic inspection of the defect. The inspection data of the first defect inspection device 41 is stored in the memory device 92 (see Fig. 33).

The control device 91 (refer to FIG. 33) confirms the inspection data of the first defect inspection device 41 that is stored in the memory device 92. The type or state of the defect that has arrived is determined based on the preset criteria (1) OK determination (determining good product), and (2) NG determination (determining defective product). The result of the determination by the control device 91 is stored in the memory device 92 (see Fig. 33). In addition, the criterion for the determination can be set to an appropriate value depending on the structure of the liquid crystal panel P, etc., and therefore can be set by an appropriate preliminary experiment.

The OK determination is a case where no defect is found in the liquid crystal panel P, or it is judged that there is no defect in actual use. The NG determination is a case where a defect is found in the liquid crystal panel P.

The liquid crystal panel P judged by the OK is carried out to the next step. On the other hand, the liquid crystal panel P determined by NG is discarded by a discarding device (not shown).

The liquid crystal panel P that has passed through the first defect inspection device 41 is transferred to the transport conveyor 1011c by, for example, a transport mechanism such as a belt conveyor.

The conveyance belt 1011c forms a linear shape in plan view. The conveyance belt 1011c is conveyed while passing through the liquid crystal panel P of the first defect inspection device 41. In the conveyance belt 1011c, the liquid crystal panel P is conveyed so that the short side of the liquid crystal panel P may follow the conveyance direction.

The adsorption arm 1014b is disposed on the downstream side of the panel conveyance of the conveyance belt 1011c, and is disposed between the conveyance belt 1011c and the slider mechanism 1013a. The slider mechanism 1013a forms a linear shape in plan view. The slider mechanism 1013a can move the table 1012a holding the liquid crystal panel P in the longitudinal direction of the slider mechanism 1013a.

The suction arm 1014b sucks and holds the liquid crystal panel P held by the conveyance conveyor 1011c, and is freely conveyed in the vertical direction and the horizontal direction. For example, the suction arm 1014b directly conveys the liquid crystal panel P that is adsorbed and held to the directly above the table 1012a in a horizontal state, and at this position, the suction is released, and the liquid crystal panel P is transferred to the table 1012a. The liquid crystal panel P is handed over to the first bonding device 51 by the table 1012a and the slider mechanism 1013a.

(first bonding device)

In the first bonding apparatus 51, a sheet (first sheet F1m) of the bonding sheet F5 which has been cut into a predetermined size in the first optical member sheet F1 is bonded to the upper surface (surface on the display surface side) of the liquid crystal panel P. The first sheet F1m is bonded to the surface on the display surface side of the liquid crystal panel P by the first bonding apparatus 51 to form the first sheet bonding body PA1. The first sheet bonding body PA1 formed by the first bonding device 51 is transferred to the table 1012a.

Further, since the first bonding apparatus 51 includes a plurality of bonding heads 521, even if the bonding process of the first sheet F1m takes a long time, the supply of the first sheet F1m can be suppressed from being stagnant. Therefore, the decrease in the production efficiency of the first sheet bonding body PA1 can be suppressed.

The table 1012b and the slider mechanism 1013b enclose the suction arm 1014b and are configured to face the table 1012a and the slider mechanism 1013a. The slider mechanism 1013b forms a linear shape in plan view. The slider mechanism 1013b can move the table 1012b holding the first sheet bonding body PA1 in the longitudinal direction of the slider mechanism 1013b.

The adsorption arm 1014b adsorbs and holds the first sheet conforming body PA1 held by the table 1012a, and is freely moved in the vertical direction and the horizontal direction. Shipped. For example, the first sheet bonding body PA1 that is adsorbed and held by the adsorption arm 1014b is directly conveyed to the upper side of the table 1012b in a horizontal state, and the suction is released at this position, and the first sheet bonding body PA1 is transferred to the table 1012b. The first sheet bonding body PA1 is transferred to the first inverting device 81 by the table 1012b and the slider mechanism 1013b.

(first inversion device)

The first reversing device 81 is held by the first bonding device 51 and held by the first bonding device 51 to the first sheet bonding body PA1 of the table 1012b, so that the front and back of the first sheet bonding body PA1 are reversed, and for example, The first sheet bonding body PA1 conveyed in parallel with the short side of the liquid crystal panel P is conveyed in a direction parallel to the long side of the liquid crystal panel P.

The first inverting device 81 reverses the front and back of the first sheet bonding body PA1 on the display surface side of the liquid crystal panel P, and sets the backlight side of the liquid crystal panel P to the upper surface. The first sheet bonding body PA1 of the first inverting device 81 is transferred to the conveyance belt 1011d.

The conveyance belt 1011d holds the first sheet bonding body PA1 and carries it. The conveyance belt 1011d is conveyed, and the long side of the liquid crystal panel P is conveyed along the conveyance direction, and the 1st sheet bonding body PA1 is conveyed.

The suction arm 1014c is disposed between the conveyance belt 1011d and the slider mechanism 1013c on the side of the conveyance belt 1011d. The slider mechanism 1013c has a linear shape in plan view. The slider mechanism 1013c can move the table 1012c holding the first sheet bonding body PA1 in the longitudinal direction of the slider mechanism 1013c.

Adsorption arm 1014c is adsorbed and held by the conveyor belt The first sheet bonding body PA1 held by 1011d is freely transported in the vertical direction and the horizontal direction. For example, the adsorption arm 1014c directly conveys the first sheet bonding body PA1 adsorbed and held to the directly above the table 1012c in a horizontal state, and at this position, the suction is released, and the first sheet bonding body PA1 is transferred to the table 1012c. The first sheet bonding body PA1 is handed over to the second bonding device 52 by the table 1012c and the slider mechanism 1013c.

(second bonding device)

The second bonding apparatus 52 bonds the second sheet F2m to the surface on the backlight side of the liquid crystal panel P of the first sheet bonding body PA1. The second sheet F2m is bonded to the surface opposite to the first sheet F1m of the first sheet bonding body PA1 by the second bonding apparatus 52 to form the second sheet bonding body PA2. The second sheet bonding body PA2 formed by the second bonding device 52 is transferred to the table 1012c.

Further, since the second bonding apparatus 52 includes a plurality of bonding heads 521, even when the bonding process of the second sheet F2m takes a long time, the supply of the second sheet F2m can be suppressed from being stagnant. Therefore, it is possible to suppress a decrease in the production efficiency of the second sheet bonding body PA2.

The adsorption arm 1014c adsorbs and holds the second sheet bonding body PA2 held by the table 1012c, and is freely transported in the vertical direction and the horizontal direction. For example, the adsorption arm 1014c directly conveys the second sheet bonding body PA2 that is adsorbed and held in a horizontal state directly above the conveyance belt 1011d, and at this position, the suction is released, and the second sheet bonding body PA2 is transferred to the table 1012b. The conveyance belt 1011d is conveyed, and the long side of the liquid crystal panel P is conveyed along the conveyance direction, and the 2nd sheet bonding body PA2 is conveyed.

The adsorption arm 1014c is disposed on the side of the conveyance belt 1011d, and is disposed between the slider mechanism 1013d and the slider mechanism 1013e. The slider mechanism 1013d and the slider mechanism 1013e are configured to face and sandwich the adsorption arm 1014d therebetween. The slider mechanism 1013d and the slider mechanism 1013e each have a linear shape in plan view. The slider mechanism 1013d can move the table 1012d holding the second sheet bonding body PA2 in the longitudinal direction of the slider mechanism 1013d. The slider mechanism 1013e can move the table 1012e holding the second sheet bonding body PA2 along the longitudinal direction of the slider mechanism 1013e.

The adsorption arm 1014d sucks and holds the second sheet bonding body PA2 held by the conveyance belt 1011d, and is freely conveyed in the vertical direction and the horizontal direction. For example, the adsorption arm 1014d directly conveys the second sheet bonding body PA2 that is adsorbed and held to the directly above the table 1012d in a horizontal state, and at this position, the adsorption is released, and the second sheet bonding body PA2 is transferred to the table 1012d. The second sheet bonding body PA2 is handed over to the third bonding device 53 by the table 1012d and the slider mechanism 1013d.

The adsorption arm 1014d can also convey the second sheet bonding body PA2 that is adsorbed and held directly to the upper side of the table 1012e in a horizontal state, and at this position, the adsorption is released, and the second sheet bonding body PA2 is transferred to the table 1012e. At this time, the second sheet bonding body PA2 is transferred to the third bonding device 53 by the table 1012e and the slider mechanism 1013e.

(third bonding device)

The third bonding apparatus 53 bonds the third sheet F3m on the surface of the backlight panel side of the liquid crystal panel P of the second sheet bonding body PA2. By the third bonding device 53 The third sheet F3m is bonded to the surface of the second sheet F2m side of the second sheet bonding body PA2 to form a third sheet bonding body PA3. The third sheet bonding body PA3 formed by the third bonding device 53 is transferred to the table 1012e.

Further, since the third bonding apparatus 53 includes a plurality of bonding heads 521, even when the bonding process of the third sheet F3m takes a long time, the supply of the third sheet F3m can be suppressed from being stagnant. Therefore, it is possible to suppress a decrease in the production efficiency of the third sheet bonding body PA3.

The adsorption arm 1014d adsorbs and holds the third sheet bonding body PA3 held by the table 1012e, and is freely transported in the vertical direction and the horizontal direction. For example, the adsorption arm 1014d directly conveys the third sheet bonding body PA3 that is adsorbed and held to the directly above the conveyance belt 1011d in a horizontal state, and at this position, the suction is released, and the third sheet bonding body PA3 is transferred to the table 1012b. The conveyance belt 1011d is conveyed, and the long side of the liquid crystal panel P is conveyed along the conveyance direction, and the 3rd sheet bonding body PA3 is conveyed.

The slider mechanism 1013f is disposed on the downstream side of the panel conveyance of the conveyance conveyor 1011d. The slider mechanism 1013f forms a linear shape in plan view. The slider mechanism 1013f can move the table 1012f holding the third sheet bonding body PA3 along the longitudinal direction of the slider mechanism 1013f. The third sheet bonding body PA3 is handed over to the first cutting device 61 by the table 1012f and the slider mechanism 1013f.

(first cutting device)

The first cutting device 61 performs a dicing process by cutting the remaining portion of the second sheet F2m and the third sheet F3m with the third sheet bonding body PA3 as a cutting target, and forms a backlight side with the liquid crystal panel P. paste The second optical member F12 and the third optical member F13 are of a size corresponding to the face. The first cutting device 61 is, for example, a laser light irradiation device.

(cutting and positioning means)

Fig. 39 is an explanatory diagram of a method of determining the cutting position by the cutting positioning means 90.

The cutting and positioning means 90 determines the cutting of the second sheet F2m and the third sheet F3m to which the liquid crystal panel P is attached, based on the detection data of the shape of the liquid crystal panel P detected before the sheet FXm is attached to the liquid crystal panel P. The position (first cutting position FC1) and the cutting position (second cutting position FC2) of the first sheet F1m to which the liquid crystal panel P is attached. Further, the cutting positioning means 90 includes the same configuration (lighting device and imaging device) as the detecting device 30 (see FIG. 34).

As shown in Fig. 39, the third sheet bonding body PA3 is provided with a plurality of positioning reference marks Am for detecting the first cutting position FC1 and the second cutting position FC2. The mark Am is a mark (alignment mark) for positioning when the liquid crystal panel P forms a wiring pattern. In the present embodiment, the mark Am is used as a structure for positioning reference for detecting the first cutting position FC1 and the second cutting position FC2.

The mark Am is formed in the liquid crystal panel P in addition to the wiring pattern, and is formed at a position where no trouble occurs. For example, in the liquid crystal panel P, a part of a portion outside the portion where the wiring pattern is patterned (for example, the display region P4) is processed into a predetermined shape by a photolithography process to form the mark Am.

In the present embodiment, the mark Am is, for example, in a liquid crystal panel Four are formed and formed on the four corners of the first substrate P1 of the liquid crystal panel P, respectively. In the four marks Am1, the mark Am2, the mark Am3, the mark Am4, the mark Am3, and the mark Am4 are provided at positions where the second sheet F2m and the third sheet F3m of the liquid crystal panel P are exposed. Specifically, the mark Am3 and the mark Am4 are provided in a portion where the terminal portion P6 is provided, that is, in the exposed region P5 of the first substrate P1.

Further, the number of the marks Am is not limited to four. For example, three marks Am may be formed on the liquid crystal panel P, and three corners of the four corners of the first substrate P1 of the liquid crystal panel P may be formed.

In the present embodiment, the planar shape of the mark Am is an arbitrary shape. The planar shape of the mark Am may be a circular or elliptical shape, and the three lines may be arranged in parallel in a zigzag shape, and the elements in which the two lines intersect in a cross shape form one mark Am. The planar shape of the mark Am can be suitably employed as long as it is generally usable as an alignment mark. The method of forming the mark Am is not limited to the above method, and a conventional method can be employed as a method of forming the alignment mark. Further, in Fig. 39, it is expedient to make the planar shape of the mark Am circular.

In the present embodiment, the cutting positioning means 90 is exposed from the second mark Am2 and the third mark Am3 of the liquid crystal panel P in the four marks Am1, the mark Am2, the mark Am3, and the mark Am4 which are provided in the liquid crystal panel P. The mark Am3 and the mark Am4 provided at the position are used as positioning standards, and the first cutting position FC1 and the second cutting position FC2 are determined based on the detected detection data of the shape of the liquid crystal panel P.

The mark Am is used to form a wiring pattern of the liquid crystal panel P. The structure of the positioning reference. Therefore, by setting the correspondence between the position of the mark Am and the shape of the liquid crystal panel P in advance, if the position of the mark Am is detected, the pattern obtained by connecting the approximate lines L1, L2, L3, and L4 is obtained, that is, the bird's-eye view and The cutting line which is approximated by the outline OL (refer to Fig. 38) is overlapped, and the cutting position of the sheet FXm can be accurately known.

The cutting positioning means 90 detects the position of the mark Am3 and the mark Am4 provided at positions exposed from the second sheet F2m and the third sheet F3m of the liquid crystal panel P. For example, in the front and back surfaces of the liquid crystal panel P, the respective absorption axes are arranged to be orthogonal (cross-Nicol arrangement), and even if the sheet FXm is bonded, the mark Am3 and the mark Am4 overlap each other in a plan view, and the cross-Nico is not crossed. Ear configuration. Therefore, in the region where the mark Am3 and the mark Am4 overlap in a plan view, the illumination light can be transmitted, and the image of the mark Am3 and the mark Am4 can be photographed. Therefore, by detecting the position of the mark Am3 and the mark Am4, the first cutting position FC1 for cutting the second sheet F2m and the third sheet F3m can be correctly known.

The position information of the mark Am3 and the mark Am4 is input to the control device 91 (refer to Fig. 33). As described above, the data of the mark Am and the approximate outline OL detected by the detecting device 30 (refer to Fig. 33) is memorized by the memory device 92 (refer to Fig. 33). Therefore, the first cutting position FC1 can be immediately determined by the control device 91 taking out the data of the approximate contour line OL corresponding to the position information of the mark Am3 and the mark Am4 from the memory device 92.

In the present embodiment, the cutting positioning means 90 determines the contour of the first substrate P1 in the second sheet F2m and the third sheet F3m. The position of the first sheet F1m and the second substrate P2 (the surface of the display surface side of the liquid crystal panel P) is determined as the first cutting position FC1 at a position facing the first cutting position FC1. The outer peripheral edge faces the position as the second cutting position FC2.

Fig. 40 is a perspective view showing a state in which the second sheet F2m and the third sheet F3m are cut using the scanner 650 constituting the first cutting device 61.

Fig. 41 is a side view showing the state in which the second sheet F2m and the third sheet F3m are cut using the scanner 650 constituting the first cutting device 61.

As shown in FIGS. 40 and 41, the scanner 650 cuts the second sheet F2m and the third sheet F3m according to the first cutting position FC1 to cut away from the second surface of the liquid crystal panel P. The portion corresponding to the second optical member F12 of the sheet F2m and the remaining portion FY on the outer side thereof. Along with this, the scanner 650 cuts off a portion corresponding to the third optical member F13 of the third sheet F3m to which the surface opposite to the liquid crystal panel P of the second sheet F2m is attached, and the remaining portion FY of the outer side thereof . Thereby, an optical member (the second optical member F12 and the third optical member F13) having a size corresponding to the first bonding surface SA1 is formed.

Here, the "size corresponding to the first bonding surface SA1" described in the present specification is a size indicating the shape of the first substrate P1, and is included in the size of the display region P4 or more, and is smaller than the size of the liquid crystal panel P. And avoid the area of the functional part such as the electrical component mounting part. In the present embodiment, the liquid crystal panel P which is rectangular in plan view is in addition to The three sides of the functional portion are laser-cut along the outer periphery of the liquid crystal panel P, and the laser beam is cut from the periphery of the liquid crystal panel P to the display region P4 side at a position corresponding to the above-mentioned functional portion. Cut the rest. For example, when the portion corresponding to the first bonding surface SA1 is the bonding surface of the TFT substrate, the peripheral edge of the liquid crystal panel P is displayed on the side corresponding to the functional portion so as to remove the functional portion. The region P4 side is deviated from the quantitative position for cutting.

In the region of the liquid crystal panel P including the functional portion (for example, the entire liquid crystal panel P), the sheet is bonded, but the invention is not limited thereto. For example, in the region of the liquid crystal panel P that avoids the above-described functional portion, the sheet is bonded, and then, the liquid crystal panel P having a rectangular shape in plan view, on the three sides except the above functional portion, along the periphery of the liquid crystal panel P The laser cuts the rest.

The remaining portion of each of the second sheet F2m and the third sheet F3m is cut away from the third sheet bonding body PA3 by the first cutting device 61 to adhere the second optical member F12 on the backlight side of the liquid crystal panel P and The third optical member F13 is a fourth sheet bonding body PA4 in which a first sheet F1m is bonded to a surface of the liquid crystal panel P on the display surface side. The fourth sheet bonding body PA4 formed by the first cutting device 61 is transferred to the first peeling device 71 by, for example, a conveying mechanism such as a belt conveyor.

(first peeling device)

The first peeling device 71 is disposed on the downstream side of the panel conveyance of the first cutting device 61. The first peeling device 71 is peeled off from the second sheet F2m and The third sheet F3m is respectively cut away from the remaining portion. The remaining portion peeled off by the first peeling device 71 is recovered by a recovery device (not shown). The fourth sheet bonding body PA4 that has passed through the first peeling device 71 is transferred to the second inverting device 82 by, for example, a conveying mechanism such as a belt conveyor.

(second reversal device)

The second inverting device 82 is disposed on the panel conveyance downstream side of the first peeling device 71. The second inverting device 82 reverses the front and back of the fourth sheet bonding body PA4 on the backlight side of the liquid crystal panel P, and the display surface side of the liquid crystal panel P is the upper surface. The fourth sheet bonding body PA4 that has passed through the second inverting device 82 is transferred to the second cutting device 62 by, for example, a conveying mechanism such as a belt conveyor.

(second cutting device)

The second cutting device 62 is disposed on the downstream side of the panel conveyance of the second inverting device 82.

In addition, the configuration of the second cutting device 62 is the same as that of the first cutting device 61, and thus detailed description thereof will be omitted.

Fig. 42 is a perspective view showing a state in which the first sheet F1m is cut using the scanner 614 constituting the second cutting device 62.

Fig. 43 is a side view showing the state in which the first sheet F1m is cut using the scanner 614 constituting the second cutting device 62.

As shown in FIGS. 42 and 43, the scanner 614 cuts the first sheet F1m according to the second cutting position FC2 to cut off the first sheet F1m attached to the surface on the display surface side of the liquid crystal panel P. The portion corresponding to the first optical member F11 and the remaining portion FY on the outer side thereof. With this, An optical member (first optical member F11) having a size corresponding to the second bonding surface SA2 is formed.

Here, the "size corresponding to the second bonding surface" described in the present specification means the size of the liquid crystal panel P other than the size of the outer shape (the outline shape in a plan view). In the present embodiment, the remaining portions are laser-cut along the outer periphery of the liquid crystal panel P on the four sides of the rectangular liquid crystal panel P in plan view. For example, when the portion corresponding to the second bonding surface is the bonding surface of the CF substrate, since there is no portion corresponding to the above-described functional portion, the liquid crystal panel P is cut along the outer periphery of the liquid crystal panel P.

The remaining portion of the first sheet F1m is cut away from the fourth sheet bonding body PA4 by the second cutting device 62 to form the second optical member F12 and the third optical member F13 on the surface of the backlight side of the liquid crystal panel P. Further, the optical member bonding body PA of the first optical member F11 is bonded to the surface on the display surface side of the liquid crystal panel P. The optical member bonding body PA formed by the second cutting device 62 is transferred to the second peeling device 72 by, for example, a conveying mechanism such as a belt conveyor.

(second peeling device)

Returning to Fig. 33, the second peeling device 72 is disposed on the downstream side of the panel conveyance of the second cutting device 62. The second peeling device 72 peels off the remaining portion cut away from the first sheet F1m. The remaining portion peeled off by the second peeling device 72 is recovered by a recovery device not shown. The optical member bonding body PA that has passed through the second peeling device 72 is transferred to the table 1012g by, for example, a transport mechanism such as a belt conveyor.

In addition, the size of the remaining portion FY of the sheet FXm The size of the portion that goes out to the outer side of the liquid crystal panel P is appropriately set in accordance with the size of the liquid crystal panel P. For example, when the sheet FXm is applied to a medium-sized and small-sized liquid crystal panel P of 5 吋 to 10 ,, the interval between one side of the sheet FXm and one side of the liquid crystal panel P is set in the range of 2 mm to 5 mm on each side of the sheet FXm. The length.

The slider mechanism 1013g is disposed on the panel conveyance downstream side of the second peeling device 72. The slider mechanism 1013g forms a linear shape in plan view. The slider mechanism 1013g can move the table 1012g holding the optical member bonding body PA in the longitudinal direction of the slider mechanism 1013g. The autoclave processing apparatus 100 is disposed on the downstream side of the panel transport 1012g and the slider mechanism 1013g. The optical member bonding body PA is transferred to the autoclave processing apparatus 100 by the table 1012g and the slider mechanism 1013g.

(autoclave processing unit)

The autoclave processing apparatus 100 is an autoclave treatment (first autoclave treatment) in which the optical member bonding body PA passing through the second peeling device 72 is subjected to heat and pressure treatment. The optical member bonding body PA that has passed through the autoclave device 100 is transferred to the second defect inspection device 42 by, for example, a conveying mechanism such as a belt conveyor.

(second defect inspection device)

After bonding the optical member F1X to the liquid crystal panel P, the second defect inspection device 42 performs inspection of defects of the optical member bonding body PA. The second defect inspection device 42 is an automatic inspection device that performs AOI inspection on the optical member bonding body PA on the display surface side through the autoclave processing device 100 (optical automatic visual inspection: Automatic Optical Inspection). The second defect inspection device 42 may be configured to be used as long as it can optically and automatically check for defects. The inspection data of the second defect inspection device 42 is memorized in the memory device 92.

The control device 91 checks the data of the defect detected by the second defect inspection device 42 stored in the memory device 92, and confirms the type or state of the defect found, and performs (1) OK determination based on a predetermined standard (indicating good product) (3) GRAY judgment (determination that one of the good or bad products is unknown), and (3) NG determination (determining the defective product). The result of the determination by the control device 91 is stored in the memory device 92. In addition, the criterion for the determination can be set to an appropriate value depending on the type of the optical member F1X to be bonded or the structure of the liquid crystal panel P, and the like.

The OK determination is a case where no defect is found in the optical member bonding body PA or a defect in which there is no problem in actual use. The GRAY judgment was found to be defective in the optical member bonding body PA, but it was not possible to judge whether or not the problematic defect was actually used. The NG determination was found to be defective in the optical member bonding body PA.

The optical member bonding body PA that has passed through the second defect inspection device 42 is transferred to the conveyance conveyor 1011e, the conveyance conveyor 1011f, and the conveyance belt 1011g, respectively. The conveyance conveyance belt 1011e, the conveyance conveyance belt 1011f, and the conveyance conveyance belt 1011g are arrange|positioned in the position of the downstream of the panel conveyance downstream side of the 2nd defect inspection apparatus 42.

The conveyance belt 1011e is conveyed by the optical member bonding body PA which hold|determined OK. Carrying conveyor belt 1011f keeps GRAY judgment The optical member is bonded to the body PA and transported. The conveyance belt 1011g is conveyed by the optical member bonding body PA which hold|maintains NG determination. In each of the conveyance belt 1011g, the conveyance belt 1011h, and the conveyance belt 1011i, the optical member bonding body PA is conveyed so that the short side of the liquid crystal panel P may be along the conveyance direction. The optical member bonding body PA which has passed through the conveyance belt 1011g is handed over to the conveyance conveyor 1011j.

The suction arm 1014e is disposed on the downstream side of the panel conveyance belt 1011e and the conveyance belt 1011f, and is disposed between the conveyance belt 1011h and the conveyance belt 1011i. The adsorption arm 1014e sucks and holds the optical member bonding body PA held by each of the conveyance conveyor 1011e and the conveyance belt 1011f, and is conveyed freely in the vertical direction and the horizontal direction. For example, the adsorption arm 1014e directly conveys the optical member bonding body PA that is adsorbed and held in a horizontal state to the conveyance belt 1011h or directly above the conveyance belt 1011j, and at this position, the suction is released, and the optical member bonding body PA is handed over to the conveyance. Conveyor belt 1011h and carrying conveyor belt 1011j. In the adsorption arm 1014e, the optical member bonding body PA determined by OK is transferred to the conveyance conveyor 1011h, and the optical member bonding body PA determined by GRAY is transferred to the conveyance conveyor 1011i.

The conveyance belt 1011h is conveyed by holding the bracket 1015h. The holder 1015h can accommodate a plurality of optical member bonding bodies PA (two in the present embodiment). Thereby, the optical member bonding body PA constructed to be OK is moved along the conveyance belt 1011h. The optical member bonding body PA judged by the OK is conveyed to the downstream side by the conveyance conveyor 1011h, and is carried out from the manufacturing line of the film bonding system 1001.

The conveyance belt 1011i holds the holder 1015i and carries it. The holder 1015i can accommodate a plurality of optical member bonding bodies PA (two in the present embodiment). Thereby, the optical member bonding body PA judged by GRAY is constructed and moved along the conveyance conveyor 1011i. The optical member bonding body PA judged by GRAY is handed over to the next step by the conveyance belt 1011i.

The conveyance belt 1011j holds the holder 1015j and carries it. The holder 1015j can accommodate a plurality of optical member bonding bodies PA (two in the present embodiment). Thereby, the optical member bonding body PA determined by NG is constructed and moved along the conveyance belt 1011jk. The optical member bonding body PA judged by NG is handed over to the next step by the conveyance conveyor belt 1011j.

Further, the conveyance belt 1011h, the conveyance belt 1011i, and the conveyance belt 1011j are not limited to the configuration in which the holder 1015h, the holder 1015i, and the holder 1015j are respectively held, and the conveyance belt 1011h, the conveyance belt 1011i, and the conveyance conveyance are also configured. Each of the belts 1011j directly holds the optical member bonding body PA and is carried.

In the present embodiment, the optical member bonding body PA judged by GRAY or NG is removed from the manufacturing line and visually inspected (offline) (first visual inspection step).

In the optical member bonding body PA which is inspected and visually inspected and no defect is found, the optical member bonding body PA which is a finished product is carried out to the next step.

In addition, the optical member bonding body PA (defective product) which is found to be defective by visual inspection can be subjected to the same regeneration processing as that of the first embodiment.

(Method of Manufacturing Optical Member Bonding Body)

Hereinafter, the manufacturing flow of the manufacturing method of the optical member bonding body of this embodiment is demonstrated using the symbol shown in FIG. 33 suitably, and FIG.

(Optical member bonding body forming step)

First, at the time of manufacture of the optical member bonding body PA, the liquid crystal panel P is carried in the manufacturing line (step S11), and dirt such as dust adhering to the surface of the liquid crystal panel P is washed (step S12).

Then, in the film bonding system 1001 described above, the first sheet F1m is bonded to the surface on the display surface side of the liquid crystal panel P, and the second sheet F2m and the third layer are bonded to the surface on the backlight side of the liquid crystal panel P. The sheet F3m is formed to form a third sheet bonding body PA3. Next, for the third sheet bonding body PA3, the second sheet F2m and the third sheet F3m are cut according to the first cutting position FC1 to form the second optical member F12 and the third optical member F13 to form the fourth optical member bonding body PA4. . Next, the first optical member F11 is formed by cutting the first sheet F1m according to the second cutting position FC2 to form the optical member bonding body PA (step S13).

(first autoclave treatment)

Next, the obtained optical member bonding body PA is subjected to autoclave processing in the manufacturing line (in-line) (step S14).

(automatic check step)

Next, the second member inspection device 42 disposed in the manufacturing line (in-line) is used to perform defect inspection on the optical member bonding body PA subjected to the autoclave processing (step S15).

As a result of the inspection, for example, after collecting the plural number of the optical member bonding body PA determined by the OK, the process proceeds to the next step (step S16).

(first visual inspection step)

On the other hand, as a result of the defect inspection, visual inspection of the defect is performed outside the manufacturing line (offline) for the optical member bonding body PA judged by GRAY or NG (step S21).

As a result of the visual observation, the optical member bonding body PA determined by the OK is carried out in the next step (step S16).

(regeneration process step)

On the other hand, as a result of the visual inspection, the optical member bonding body PA of the defective product (the first visual inspection defective product) is determined to have the type or state of the defect found, and the subsequent processing is applied to determine whether or not the defect can be made. The defect disappears (step S22).

In the first visual inspection, the defect of the defective product is a small deformation of the optical member itself or when air is trapped in the bonding surface of the liquid crystal panel P and the optical member to generate a small object (indicated by "defect/small" in the flowchart) The autoclave treatment is applied (step S23).

On the other hand, the defect of the first visual inspection defective product is a large deformation of the optical member itself or a large bubble is formed when the air is generated in the bonding surface between the liquid crystal panel P and the optical member (in the flowchart, "defect / In the middle, the refurbishing process is applied (step S24).

In addition, in the first visual inspection of the defective product, it is determined that the damage of the liquid crystal panel P or the like is in the above-described autoclave treatment or refurbishment. When it is impossible to reproduce (indicated by "defect/large" in the flowchart), it is discarded.

Next, visual inspection of the defect is performed on the optical member bonding body PA to which the autoclave treatment or the refurbishing treatment has been applied (second visual inspection, step S25).

If no defect is found, the optical member bonding body PA as a finished product is carried out to the next step. When it is determined that the defect is found as a defective product (second visual inspection defective product), the process returns to step S22 again, and the regeneration is attempted via the regeneration processing step.

The method for producing the optical member bonded body of the present embodiment is carried out by the above method.

As described above, in such a configuration, the optical member F1X can be set with good precision to the display region P4. Therefore, the frame portion G outside the display region P4 can be sandwiched (see FIG. 3), and the display region can be enlarged and the size of the device can be reduced.

If, after the liquid crystal panel P is attached to the first sheet F1m, the second sheet F2m, and the third sheet F3m, if the shape of the liquid crystal panel P is to be detected, the first sheet F1m and the second sheet F2m are crossed by the Nicols. It is impossible to transmit the illumination light, and it is not possible to photograph the substrate image. Therefore, the shape of the liquid crystal panel P cannot be detected, and there is a case where the cutting position cannot be correctly determined.

On the other hand, according to the configuration, before the liquid crystal panel P is bonded to the first sheet F1m, the second sheet F2m, and the third sheet F3m, the cutting position is determined based on the detection data of the shape of the liquid crystal panel P. The first sheet F1m and the second sheet F2m are not arranged in a crossed Nicols, and the illumination light can be transmitted to photograph the substrate image. Therefore, the shape of the liquid crystal panel P can be correctly detected, and the cutting position can be correctly determined.

The cutting positioning means 90 detects the mark Am3 and the mark Am4 which are provided from the mark Am of the liquid crystal panel P, and the position where the second sheet F2m and the third sheet F3m of the liquid crystal panel P are exposed as a positioning reference, according to the detected liquid crystal panel The detection data of the outer shape of the P determines the first cutting position FC1 and the second cutting position FC2. According to this configuration, at least the liquid crystal panel P can reliably detect the mark Am located in the exposed region P5 of the first substrate P1 by the photographing device 302, so that the detection of the cutting position is facilitated.

Further, in the second sheet F2m and the third sheet F3m, the cutting positioning means 90 determines the position facing the outline of the first base sheet P1 (the outer periphery of the backlight side of the liquid crystal panel P) as the first cutting position. In the first sheet F1m, the FC1 determines a position facing the outline of the second substrate P2 (the outer periphery of the surface on the display surface side of the liquid crystal panel P) as the second cutting position FC2.

According to this configuration, since each of the first cutting position FC1 and the second cutting position FC2 is individually determined, the outer shape of the first optical member F11 formed on the surface on the display surface side of the liquid crystal panel P can be accurately detected. The shape and the outer shape of the second optical member F12 and the third optical member F13 formed on the backlight side of the liquid crystal panel P can accurately determine the cutting position.

In addition, after the cleaning of the liquid crystal panel P is completed, the transport mechanism of the liquid crystal panel P that is completed between the first sheet F1m, the second sheet F2m, and the third sheet F3m is completed, and the liquid crystal panel is not used. The conveyance mechanism of the liquid crystal panel P is conveyed when the contact portion of P changes.

According to this configuration, before the liquid crystal panel P is bonded to the first sheet F1m, the second sheet F2m, and the third sheet F3m, the foreign matter can be suppressed as compared with the case where the contact portion with the liquid crystal panel P is sequentially changed. The liquid crystal panel P is attached. Therefore, the film bonding system 1001 with few bonding defects can be provided.

Further, the transport mechanism 1010 includes a table that holds the liquid crystal panel P, a slider mechanism that moves the table, and a suction arm that sucks and holds the liquid crystal panel P held by the table. Further, the transport mechanism 1010 includes a transport conveyor that carries and holds the liquid crystal panel P, and a suction arm that holds the liquid crystal panel P held by the conveyor. According to this configuration, it is possible to suppress foreign matter from adhering to the liquid crystal panel P as compared with the case of using a transport mechanism in which the contact portion with the liquid crystal panel P is sequentially changed. Therefore, the effect of providing the film bonding system 1001 with less bonding defects can be realized in a simple configuration.

Further, the transport mechanism 1010 includes a detecting device 30 that detects the shape of the liquid crystal panel P before the liquid crystal panel P is bonded to the first sheet F1m, the second sheet F2m, and the third sheet F3m. If, after the liquid crystal panel P is attached to the first sheet F1m, the second sheet F2m, and the third sheet F3m, if the shape of the liquid crystal panel P is to be detected, the first sheet F1m and the second sheet F2m are arranged to cross the Nicols. Can't pass the illumination light, It is not possible to photograph the surface of the substrate. On the other hand, according to this configuration, before the liquid crystal panel P is bonded to the first sheet F1m, the second sheet F2m, and the third sheet F3m, the shape of the liquid crystal panel P is detected, and the first sheet F1m and the second sheet F2m are formed. Does not become a cross-Nicol configuration. Therefore, the illumination light can be transmitted, and the substrate image can be photographed. Therefore, the shape of the liquid crystal panel P can be correctly known.

Further, according to this configuration, since the detecting device 30 is provided in the manufacturing line (in-line), the device can be assembled and the manufacturing line can be formed as compared with the case where the detecting device 30 is disposed outside the manufacturing line (offline). Chemical.

Further, in the transport mechanism of the liquid crystal panel P exemplified in the present embodiment, after the cleaning of the liquid crystal panel P is completed, the first sheet F1m, the second sheet F2m, and the third sheet are bonded to the liquid crystal panel P. The liquid crystal panel P is conveyed by changing the contact portion with the liquid crystal panel P between all the sheets of the F3m, but the liquid crystal panel P is not limited thereto. For example, between the completion of the cleaning of the liquid crystal panel P and the completion of the bonding of the liquid crystal panel P to the sheets of the first sheet F1m and the second sheet F2m, the transport mechanism of the liquid crystal panel P may not be used. The conveying mechanism of the liquid crystal panel P is changed by the contact portion of the liquid crystal panel P. However, not only the adhesion of the foreign matter to the liquid crystal panel P but also the adhesion of the foreign matter to the second sheet F2m is suppressed, and after the cleaning of the liquid crystal panel P is completed, the liquid crystal panel P is bonded to the first sheet F1m and the second sheet. It is preferable that the transport mechanism of the liquid crystal panel P during the period from the completion of all the sheets of the F2m and the third sheet F3m is a transport mechanism that transports the liquid crystal panel P without using a contact portion with the liquid crystal panel P.

In the embodiment of the present invention, the liquid crystal panel P is bonded to the optical member F1X of the plurality of optical members F1X, which is an optical member F1X, and is not limited to this. the way. For example, a manufacturing apparatus of the optical member bonding body PA which is formed by laminating one or two or four or more optical members F1X to the liquid crystal panel P may be used.

In addition, in the present embodiment, the alignment mark of the liquid crystal panel P is used as the structure for determining the positioning reference for the cutting position, but the invention is not limited thereto. For example, a new structure in place of the alignment mark may be additionally provided on the liquid crystal panel P.

In the present embodiment, the markings Am provided in the liquid crystal panel P are exposed in the liquid crystal panel P from the second sheet F2m and the third sheet F3m. The mark Am3 and the mark Am4 are used as a positioning reference for determining the cutting position. However, on the front and back surfaces of the liquid crystal panel P, when the first sheet F1m and the second sheet F2m are arranged to cross the Nicols, the light emitted from the illumination device passes through the two pieces by the wavelength of the light emitted from the illumination device. The sheet is injected into the photographing device. Therefore, if light of such a wavelength is used, the sheet FXm can be disposed at the overlapping position of the mark Am provided on the outer peripheral portion of the liquid crystal panel P. In this case, for example, the size of the sheet FXm is slightly larger than that of the liquid crystal panel P. When the size of the liquid crystal panel P fluctuates due to manufacturing errors, the optical member F1X of a desired size may not be pasted or insufficiently adhered. Fitted on the LCD panel P.

In addition, in the present embodiment, the imaging device 302 is used. The four sides of the substrate image are photographed, and the approximate straight lines L1, L2, L3, and L4 are obtained, and the pattern obtained by connecting the approximate straight lines L1, L2, L3, and L4 is assumed to be obtained as the second substrate. The outline of P2 (approximate outline), but is not limited to this method. In the present embodiment, various methods can be employed to determine the approximate contour line OL.

(Third embodiment)

Hereinafter, a method of determining the approximate contour line OL of the third embodiment will be described using Figs. 44 to 46. The same processes as those for the method of determining the approximate contour line OL of the second embodiment will be omitted.

Fig. 44 is a perspective view showing a state in which a liquid crystal panel is photographed using the photographing apparatus of the third embodiment.

First, as shown in Fig. 44, a plurality of (four in the figure) imaging devices 1302 are used to photograph the periphery of the corner portion of the liquid crystal panel P.

Specifically, the photographing area AR including the corner portion of the second substrate P2 is imaged using the photographing device 1302. At this time, using the illumination device 301 shown in FIG. 34, the liquid crystal panel P is sandwiched from the side opposite to the imaging device 1302, and the light L is irradiated to illuminate the liquid crystal panel P.

The image data of the image captured by the photographing device 1302 is input to the control device 91, and the next processing (image processing, calculation) is performed.

(first treatment)

First, in the first processing, the liquid crystal panel P is made to emphasize the second base when viewed from the side of the second substrate P2 shown in FIG. 2 from the image data. Processing of the outline of the board P2.

(second treatment)

For the second processing, as shown in FIG. 36, the contour line (edge) with the second substrate P2 is detected based on the binarized image data (hereinafter referred to as binarized data) in the first image processing. The coordinates of the point D of the overlapping plural.

When the coordinates of the point D are detected, for example, according to the binarized data, in any position (x1) of the X-axis direction of the image, when the color tone is detected from the upper end in the +Y direction, the white (first region) can be obtained. The position (y1) in the Y direction is changed to the position of the black (second region), and the coordinates (x1, y1) of the point D are obtained. The two sides of the corner portion C1 of the second substrate P2 are respectively subjected to the same processing, and the coordinates of the plurality of points superimposed on each side are detected.

Further, the number of points D to be detected is preferably large, but it may be set to a number that does not overload the processing of the arithmetic processing described later. For example, 100 points D can be detected on 2 sides.

Further, as shown in Fig. 36, in the vicinity EA1, burrs or defects are generated in the second substrate P2, and since the sides are not linear, when the point D is detected, it can be set to the vicinity of EA1 (near the corner) The predetermined range) is not included in the detection range. The range of EA1 in the vicinity from the detection range can be appropriately set according to the value obtained by experience or experiment.

(third treatment)

In the third processing, the coordinates of the point D of the complex number detected by the second processing are obtained by approximating the straight line corresponding to the side where the point D overlaps. The approximation can use the commonly used statistical methods, for example, using the least flat The method approximates the regression line (approximating line).

An approximate straight line obtained as shown in FIG. 37 is performed on the two sides included in the captured image, and an approximate straight line is obtained for each of the images captured by the four imaging devices 1302.

(fourth processing)

In the fourth processing, the intersection of the approximated straight lines obtained for each of the two sides included in one image is the coordinates of the imaginary point corresponding to the corner of the second substrate P2 sandwiched by the two sides. And ask for it.

Fig. 45 is a view showing the imaginary point CX obtained by the intersection of the two approximate straight lines L1 and L2 obtained as the fourth processing in the image captured by the photographing device 1302. The coordinates of the points D used to obtain the approximate straight lines L1, L2 are known, so that the approximate straight lines L1, L2 and the imaginary point CX can be reflected on the image captured by the photographing device 1302.

(Fifth processing)

The fifth processing is to use the imaginary point CX obtained by the image captured by the four imaging devices 1302, and the pattern obtained by connecting the imaginary point CX is assumed to be the outline of the second substrate P2 (approximate outline). And ask for it.

Fig. 46A, Fig. 46B and Fig. 46C are schematic diagrams for obtaining an approximate contour line OL. Since the relative real positions of the four photographing devices 1302 are known, the relative positions of the photographing regions AR of the four photographing devices 1302 are also known. Therefore, when the four imaging devices 1302 are imaged in the image capturing area AR (FIG. 46A) in FIG. 44 and arranged in one coordinate system of the common reality, the coordinates of the four imaginary points CX can be calculated. When looking down the liquid crystal panel P, the coordinates of the imaginary point CX can be obtained (the 46B)). By connecting the four imaginary points CX obtained in this way, an approximate contour line can be obtained (Fig. 46C).

According to this configuration, the outer peripheral shape of the liquid crystal panel P discarded due to the influence of the burrs or defects of the peripheral portion is detected, and the optical member F1X conforming to the outer peripheral shape can be processed.

(Fourth embodiment)

Hereinafter, a method of determining the approximate contour line OL of the fourth embodiment will be described using Figs. 47 to 48. In addition, the detailed description of the process similar to the method of determining the approximate contour line OL of the above embodiment will be omitted. In the description, the sheet FXm is not displayed. However, in FIGS. 47 to 48, since the steps before the sheet FXm is bonded to the liquid crystal panel P are described, the illustration of the sheet FXm is omitted.

In the present embodiment, the light shielding plate 2303 is disposed between the illumination device 2301 and the liquid crystal panel P, and the liquid crystal panel P shields the region inside the bonding surface of the second substrate P2 and the sheet FXm.

Here, the "region on the inner side of the bonding surface" described in the present specification means an area on the inner side of the contour line of the bonding surface (the central portion side of the region surrounded by the contour line). The "inside area of the light-shielding surface" means an area on the inner side of the outline of the light-shielding surface, and at least a part of the area in the vicinity of the light-shielding line.

Fig. 47 is a perspective view showing the state in which the liquid crystal panel is photographed using the photographing apparatus of the embodiment.

First, as shown in Fig. 47, a plurality of (four in the figure) imaging device 2302 is used to photograph the periphery of the corner portion of the liquid crystal panel P (the thick line in the figure) The part shown). The photographing devices 2302 are respectively disposed at corresponding positions of the four corner portions of the second substrate P2 having a rectangular shape.

Specifically, the imaging device 2302 is used to image the imaging region AR including the corner portion of the second substrate P2 (see FIG. 49A and the like). At this time, the illumination device 2301 shown in Fig. 48 is used, and the liquid crystal panel P is sandwiched, and the light L is irradiated from the side opposite to the imaging device 2302, and the liquid crystal panel P is illuminated. Further, the illumination device 2301 uses, for example, a blue LED.

The image data of the image captured by the photographing device 2302 is input to the control device 91 (see Fig. 33), and the next processing (image processing, calculation) is performed.

Fig. 48 is a cross-sectional view showing a state in which the peripheral edge ED of the bonding surface SA of the liquid crystal panel P and the sheet FXm is photographed from the side where the sheet FXm is bonded to the corner portion K of the liquid crystal panel P. Here, the "bonding surface" described in the present specification refers to the surface of the liquid crystal panel P facing the sheet FXm, "the outer periphery of the bonding surface", specifically, the liquid crystal panel P The periphery of the substrate (the second substrate P2 in Fig. 48) on the side of the sheet FXm is bonded.

The liquid crystal panel P of the present embodiment is manufactured by multi-angle removal. Therefore, in the vicinity of the corner portion K of the liquid crystal panel P, burrs or deviations in the position of the end faces between the first substrate P1 and the second substrate P2 may occur. As shown in FIG. 48, when the outer periphery of the first substrate P1 is offset to the outer side of the outer periphery of the second substrate P2, the outer periphery of the first substrate P1 and the outer periphery of the second substrate P2 may be passed through the photographing device 2302. Detection.

From the side of the liquid crystal panel P to which the sheet is attached, the second is detected When the peripheral surface ED of the bonding surface SA of the substrate P2 is outside, it is preferable to align the lens of the photographing device 2302 on the upper surface of the second substrate P2. Thereby, the outer periphery of the second substrate P2 can be photographed more clearly than the outer periphery of the first substrate P1, and the detection of the outer periphery ED of the bonding surface SA can be facilitated. However, when the liquid crystal panel P is photographed, the outer periphery of the second substrate P2 may be slightly blurred, and the outer periphery of the first substrate P1 different from the original bonding surface SA may be regarded as the bonding surface SA. In one, its realm becomes unrecognizable.

Therefore, in the present embodiment, a light shielding plate 2303 for shielding the inner side of the bonding surface SA of the second substrate P2 between the illumination device 2301 and the liquid crystal panel P is provided so that the light L is only irradiated on the surface. The vicinity of the periphery ED outside the face SA. According to this configuration, only the light L that is emitted substantially perpendicularly from the immediately below the peripheral edge ED of the bonding surface SA is incident on the imaging device 2302. Therefore, the light L which contributes to photography can be approximated by the straight light incident perpendicularly to the liquid crystal panel P, which contributes to improvement of the contrast of the image of the outer periphery of the second substrate P2.

The reason why the outer periphery of the second substrate P2 is blurred is not determined. However, according to the study by the inventors, it is presumed that the light L obliquely incident on the liquid crystal panel P affects the blur of the outer periphery. That is, the light L incident on the end surface of the second substrate P2 obliquely causes a shadow of the end surface, and the shadow is affected by a change in polarization characteristics or the like, and blurring occurs. Therefore, in the present embodiment, the light L obliquely incident on the end surface of the second substrate P2 is cut by the light shielding plate 2303, and the occurrence of the shadow of the end surface is suppressed. Thereby, the outer periphery of the second substrate P2 is photographed as a sharp line, and the outer periphery ED of the bonding surface SA can be accurately detected.

The light-shielding area BA which is shielded by the light shielding plate 2303 is preferably in the imaging area of the photographing device 1302 as close as possible to the outer peripheral edge of the second substrate P2. The light shielding plate 2303 may be disposed so as not to be in the vicinity of the peripheral edge ED except for the bonding surface SA, and to be attached to the outer periphery ED of the bonding surface SA without the entire range of the light-shielding image area. In the present embodiment, the light shielding plate 2303 is formed as a rectangular plate (for example, an aluminum plate) which is slightly smaller than the second substrate P2. The distance d1 between the outer periphery of the second substrate P2 and the outer periphery of the first substrate P1 is, for example, 0.08 to 0.12 mm, and the distance d2 between the outer periphery of the first substrate P1 and the outer periphery of the light shielding plate 2303 is, for example, 0.9 to 1.1 mm, the distance d3 between the outer periphery of the visor 2303 and the outer periphery of the second substrate P2 is, for example, 0.8 to 1.0 mm.

The distance d3 between the outer periphery of the light shielding plate 2303 and the outer periphery of the second substrate P2 is preferably, for example, 0.3 mm or more and 2 mm or less. If the above-described distance d3 is larger than 2 mm, the directivity of the light L cannot be sufficiently improved, and the detection accuracy of the outer peripheral edge ED of the bonding surface SA is lowered. Further, when d3 is less than 0.3 mm, the amount of light L of the light lining ED outside the illumination bonding surface SA becomes small, and becomes a dark image. Therefore, at this time, the detection accuracy of the outer periphery ED of the bonding surface SA is also lowered. By setting the above-described distance d3 to 0.3 mm or more and 2 mm or less, the outer peripheral edge of the second substrate P2 can be imaged as a sharp line, and the detection accuracy of the outer peripheral edge ED of the bonding surface SA can be improved.

In addition, in FIG. 48, the position of the outer periphery of the first substrate P1 and the second substrate P2 (upper and lower substrates) is deviated, but the same phenomenon occurs when the positions of the outer periphery of the upper and lower substrates are the same. At this time, the area inside the bonding surface SA is shielded by the light shielding plate 2303, whereby the directivity of the light L incident on the peripheral edge ED of the bonding surface SA can be improved, and the periphery of the bonding surface SA can be suppressed. The outline of the ED is blurred.

Fig. 49A, Fig. 49B and Fig. 49C are schematic diagrams for obtaining an approximate contour line OL.

First, as shown in Fig. 49A, coordinates of a plurality of points D overlapping with the outline (edge) of the substrate are detected from the image data of the photographing area AR of each photographing device. The detection of the coordinates of the point D is performed on the two sides of the corner portion CX of the substrate facing the substrate. Preferably, the coordinates of the complex points overlapping at the sides in each side are detected. The coordinate axis of the detected coordinate can be set, for example, such that the predetermined position in the photographing area AR is used as the origin, and the image is turned to the right as the +X direction, and the downward direction of the image is taken as the +Y direction.

Next, as shown in Fig. 49B, the coordinates of the point D of the complex number are approximated by the straight line corresponding to the side overlapping the point D. The approximation can use a conventional statistical method, for example, an approximation method of obtaining a regression line (approximate straight line) using the least squares method. At this time, by the influence of the burrs formed at the corner portion CX, the error of the coordinates of the point D near the corner portion CX becomes large, which may adversely affect the calculation result of the approximate straight line. In such a case, an approximate straight line may be obtained using the remaining point D in addition to the point D near the corner CX.

Next, as shown in Fig. 49C, the approximate contour line OL facing the substrate is obtained from the approximate straight line obtained for each side. In the present embodiment, the approximate contour line OL is approximated to face the outer periphery of the substrate (outer periphery of the bonding surface).

According to this configuration, the sheet FXm can be cut substantially along the outer peripheral edge ED of the bonding surface SA shown in FIG. 48, and the optical member can be appropriately bonded to the narrow-framed liquid crystal panel P. Therefore, the influence of the deviation of the position of the end face between the burrs or the upper and lower substrates can be eliminated, and the outer peripheral edge ED of the bonding surface SA of the liquid crystal panel P can be accurately detected, and the outer edge ED which conforms to the bonding surface SA can be processed. Optical member.

Further, in the above-described embodiment, the sheet FXm is cut along the approximate contour line OL. However, the sheet FXm is not limited thereto. For example, it may be an area inside the outline OL, and is located at the frame portion of the liquid crystal panel P. The portion on the outer side of the display area is overlapped at the position to cut the sheet FXm. In such a case, the control device 91 may control the cutting means 60 to calculate a shape having a predetermined size smaller than the shape drawn by the approximate contour line OL based on the calculated approximate contour line OL. The cut portion is then cut along the true cut portion, and the sheet FXm is cut.

In other words, "cutting the sheet FXm along the outer periphery ED of the bonding surface SA" as described in the present specification means cutting the sheet FXm along the outer periphery ED detected from the photographing material, but is not limited thereto. Alternatively, the sheet FXm may be cut along the approximate contour line OL obtained from the outer periphery ED, or the sheet may be cut along other cutting lines formed on the frame portion according to the approximate contour line OL. The situation of FXm, etc.

Further, in the above-described embodiment, the imaging direction VL of the imaging device is perpendicular to the first bonding surface SA1, but the present invention is not limited to this. For example, the photographic direction of the photographic device can also be VL The normal direction of the first bonding surface SA1 is obliquely intersected.

(Fifth Embodiment)

Fig. 50 is a plan view showing the detecting step of the edge ED of the first bonding surface SA1.

As shown in FIG. 50, the detecting device 3030 detects the edge ED of the first bonding surface SA1 in the inspection area CA provided at four positions on the conveyance path of the conveyance conveyor 3011. For example, the transport conveyor belt 3011 is a belt conveyor belt. Each of the inspection areas CA is disposed at a corresponding position of the four corner portions of the first bonding surface SA1 having a rectangular shape. For each of the liquid crystal panels P that are transported on the line, the end edge ED is detected. The data of the edge ED detected by the detecting device 3030 is memorized in the memory device 92 (refer to Fig. 33).

In addition, the arrangement position of the inspection area CA is not limited to this manner. For example, each of the inspection areas CA may be disposed at a position corresponding to one of the sides of the first bonding surface SA1 (for example, the central portion of each side).

Fig. 51 is a schematic view of the detecting device 3030.

As shown in Fig. 51, the detecting device 3030 includes an illumination light source 3301 which is an illumination edge ED, and a photographing device 3302 which is disposed more than the end edge ED with respect to the normal direction of the first bonding surface SA1. The image is tilted to the inner side of the first bonding surface SA1, and the image of the edge ED is photographed from the side of the second substrate P2 of the liquid crystal panel P.

The illumination light source 3301 and the photographing device 3302 are respectively disposed in the four inspection areas CA as shown in FIG. 50 (the first bonding surface SA1) Corresponding position of the four corners).

The angle θ between the normal line of the first bonding surface SA1 and the normal line of the imaging surface 3302a of the imaging device 3302 (hereinafter referred to as the inclination angle of the imaging device 3302) is preferably set to be a deviation or a burr when the panel is divided. It will enter the photographic field of view of the photographing device 3302. For example, when the end surface of the first substrate P1 is more outwardly offset from the end surface of the second substrate P2, the tilt angle θ of the photographing device 3302 is preferably set such that the end edge of the first substrate P1 does not enter the photographing device 3302. Within the field of view.

The inclination angle θ of the photographing device 3302 is preferably set to a distance H between the first bonding surface SA1 and the center of the photographing surface 3302a of the photographing device 3302 (hereinafter referred to as the height of the photographing device 3302). For example, when the height H of the photographing device 3302 is 50 mm or more and 100 mm or less, the tilt angle θ of the photographing device 3302 is preferably set at an angle of a range of 5° or more and 20° or less. However, when the amount of deviation is known empirically, the height H of the photographing device 3302 and the tilt angle θ of the photographing device 3302 can be obtained from the amount of deviation. In the present embodiment, for example, the height H of the imaging device 3302 is set to be 78 mm, and the inclination angle θ of the imaging device 3302 is set to 10°.

The illumination light source 3301 and the photographing device 3302 are fixed and disposed in each of the inspection areas CA.

Further, the illumination light source 3301 and the imaging device 3302 may be arranged to move along the edge ED of the first bonding surface SA1. At this time, the illumination light source 3301 and the photographing device 3302 may be disposed one by one. In addition, by this, the illumination light source 3301 and the photographing device 3302 can be moved to be able to accommodate It is easy to photograph the position of the edge ED of the first bonding surface SA1.

The illumination light source 3301 is disposed on the first substrate P1 side of the liquid crystal panel P. The illumination light source 3301 is disposed at a position inclined to the outer side of the first bonding surface SA1 from the edge ED with respect to the normal direction of the first bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 3301 and the normal line of the imaging surface 3302a of the imaging device 3302 are parallel.

In addition, the illumination light source may be disposed on the side of the second substrate P2 of the liquid crystal panel P.

Further, the optical axis of the illumination light source 3301 and the normal line of the imaging surface 3302a of the imaging device 3302 may also cross slightly obliquely.

The cutting position of the sheet FXm is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control device 91 (see FIG. 33) acquires the data of the edge ED of the first bonding surface SA1 stored by the memory device 92 so that the optical member F1X does not protrude to the outside of the liquid crystal panel P (the first bonding surface SA1) The way of the outer side) determines the cutting position of the sheet FXm.

Fig. 52 is a perspective view for explaining the action of the detecting device of the comparative example.

Figure 53 is a cross-sectional view for explaining the action of the detecting device of the comparative example.

Fig. 54 is a perspective view for explaining the action of the detecting device of the embodiment.

Figure 55 is a cross-sectional view for explaining the action of the detecting device of the embodiment.

In FIGS. 52 to 55, when the end surface of the first substrate P1 is displaced to the outside of the end surface of the second substrate P2, the liquid crystal is bonded from the liquid crystal. The side (the upper side) of the sheet FXm of the panel P and the edge ED of the first bonding surface SA1 are taken as an example for description. In Figs. 52 to 55, the symbol VL indicates the photographing direction of the photographing device (the normal direction of the photographing surface of the photographing device). In addition, in the 52nd to 55th drawings, the illustration of the illumination light source and the imaging device constituting the detecting device is omitted.

As shown in Fig. 52, in the detecting device of the comparative example, the photographing direction VL of the photographing device is perpendicular to the first bonding surface SA1. In such a case, as shown in Fig. 53, the edge of the first substrate P1 enters the photographic field of view of the photographing device. As a result, when the edge ED of the first bonding surface SA1 is detected, the edge of the first substrate P1 is erroneously detected. That is, the photographing apparatus may photograph the end edge ED of the first bonding surface SA1 and photograph the image of the edge of the first substrate P1. As a result, the end edge ED of the first bonding surface SA1 cannot be detected with good precision.

On the other hand, as shown in Fig. 54, in the detecting device of the present embodiment, the imaging direction VL of the imaging device intersects obliquely with respect to the normal direction of the first bonding surface SA1. Specifically, as shown in Fig. 55, the photographing direction VL of the photographing device is inclined to the inner side of the end edge ED. That is, the photographing direction VL of the photographing device is set such that the end edge of the first substrate P1 does not enter the photographing field of view of the photographing device. Therefore, when the edge ED of the first bonding surface SA1 is detected, the edge of the first substrate P1 is not erroneously detected, and only the edge ED of the first bonding surface SA1 can be detected. Therefore, the edge ED of the first bonding surface SA1 can be detected with good precision.

Further, in FIGS. 52 to 55, when the end surface of the first substrate P1 is displaced to the outside of the end surface of the second substrate P2, the bonding is performed. The side of the sheet FXm of the liquid crystal panel P and the edge ED of the first bonding surface SA1 are described as an example, but the invention is not limited thereto.

Fig. 56 is a cross-sectional view for explaining the operation of the detecting device of the embodiment in the case where a modification of the liquid crystal panel P is applied.

For example, as shown in FIG. 56, when the burr is present when the panel is divided at the end face of the liquid crystal panel P ^{`,</sup> is bonded from the side of the liquid crystal panel <sup>P`} FXm the sheet (upper side), a first abutment surface SA1 photography The detection device of this embodiment can also be applied to the example of the end edge ED.

(Sixth embodiment)

(Method of Manufacturing Optical Member Bonding Body)

Fig. 57 is an explanatory view showing a method of manufacturing the optical member bonded body of the embodiment, and shows a flow chart of the above-described manufacturing steps. In the first embodiment, the obtained optical member bonding body PA is subjected to autoclave treatment in the manufacturing line (in-line). On the other hand, in the present embodiment, the obtained optical member bonding body PA is subjected to autoclave treatment only outside the manufacturing line (offline). Hereinafter, the manufacturing flow will be described by appropriately using the symbols shown in FIG. 1 . In addition, detailed description of steps similar to those of the first embodiment will be omitted.

In the flowchart, the processing shown by the symbol S100 indicates the processing performed in the manufacturing line, and the processing shown by the symbol S200 is performed outside the manufacturing line.

(Optical member bonding body forming step)

First, in the manufacture of the optical member bonding body, the liquid crystal panel P is carried into the manufacturing line (step S101), and the dust adhering to the liquid crystal panel P is washed. The dirt (step S102). Next, the optical member bonding body PA is formed (step S103).

(automatic check step)

Then, with respect to the obtained optical member bonding body PA, the defect inspection is performed using the second defect inspection device 42 disposed in the manufacturing line (in-line) (step S104).

As a result of the inspection, for the optical member bonding body PA determined by the OK, for example, after collecting a plurality of sheets, the processing proceeds to the next step (step S105).

(first visual inspection step)

On the other hand, as a result of the visual inspection, visual inspection of the defect is performed outside the manufacturing line (offline) for the optical member bonding body PA judged by GRAY or NG (step S201).

As a result of the inspection, the optical member bonding body PA determined by the OK is carried out toward the next step (step S105).

(regeneration process step)

On the other hand, as a result of the visual inspection, it is determined whether or not the type or state of the defect found is determined by the optical member bonding body PA which is determined to be defective (the first visual inspection defective product), and the subsequent processing is performed to determine whether or not The defect can be made to disappear (step S202).

In the first visual inspection, the defect of the defective product is a small deformation of the optical member itself, or when air is trapped in the bonding surface of the liquid crystal panel P and the optical member to generate a small object (in the flowchart, "the defect is small" The autoclave treatment is applied (step S203).

On the other hand, the defect of the first visual inspection defective product is a large deformation of the optical member itself, or when air is trapped in the bonding surface of the liquid crystal panel P and the optical member to generate a large object (in the flowchart, " The defect/medium is indicated), and the refurbishing process is applied (step S204).

In addition, when the first visual inspection defective product has a defect, it is judged that the liquid crystal panel P is damaged or the like, and the autoclave processing or the refurbishing processing cannot be reproduced (indicated by "defect/large" in the flowchart). Discarded.

Next, the optical member bonding body PA to which the autoclave treatment or the refurbishing treatment has been applied is subjected to visual inspection of the defect (second visual inspection, step S205).

If no defect is found, the optical member bonding body PA as a finished product is carried out to the next step. When it is determined that the defect is found and the defective product (the second visual inspection defective product) is determined, the process returns to step S202 again, and the regeneration is attempted via the regeneration processing step.

The method for producing an optical member bonded body of the present embodiment is carried out by the above method.

According to the manufacturing method of the optical member bonding body of the above aspect, the optical member bonding body conveyed on the line is automatically and sequentially inspected by the automatic inspection apparatus. Since the manufactured product is sequentially inspected on the manufacturing line, the occurrence of defective products in the manufacturing line can be checked in a short period of time from the occurrence of the defective product. Therefore, it is possible to suppress the occurrence of defective products and increase the manufacturing yield.

In addition, in the visual inspection outside the manufacturing line, because only Since the person who is judged to be defective by the automatic inspection is the object to be inspected, the inspector necessary for the visual inspection can be reduced as compared with the case where all the inspections are performed by the visual inspection.

In addition, among the persons who are judged to be defective by visual inspection, a good product is detected, and the number of defective products can be reduced. Therefore, the manufacturing yield can be increased.

Therefore, according to the method for producing an optical member bonded body of the present embodiment, the defect can be detected without excessive or insufficient precision in practical use, and the manufacturing can be stably performed without impairing the manufacturing yield.

(Seventh embodiment)

In the above-described embodiment, the cutting and positioning means 90 determines the cutting position of the sheet FXm bonded to the liquid crystal panel P based on the detection data of the shape of the liquid crystal panel P detected before the liquid crystal panel P is bonded to the sheet FXm. On the other hand, the cutting positioning means of the present embodiment determines the cutting position of the sheet FXm attached to the P liquid crystal panel P based on the detection data of the shape of the liquid crystal panel P detected after the liquid crystal panel P is bonded to the sheet FXm. . Specifically, the detecting device of the present embodiment detects a structure provided at a position where the liquid crystal panel P is exposed from the sheet FXm, and detects a structure provided at a position where the liquid crystal panel P overlaps with the sheet FXm. In the present embodiment, the structure is a black matrix provided on the liquid crystal panel P.

In the present embodiment, the detection device is applied to the liquid crystal panel P to which the sheet FXm is bonded (for example, in the present embodiment, the sheet laminate to which the first sheet F1m, the second sheet F2m, and the third sheet F3m are bonded). The near infrared ray is irradiated while the black matrix is detected.

For example, a light source emitting near infrared rays can be exemplified by a halogen lamp. E.g. A halogen lamp having a color temperature of 3,500 °K emits visible light of 300 nm to 780 nm and near infrared rays of 780 nm to 200 nm at a wavelength of about 700 nm.

Fig. 58 is a graph showing the light transmittance of the polarizing film in the crossed Nicols state and the sensitivity characteristics of the CCD.

In Fig. 58, the symbol GL1 (solid line) is the light transmission amount when light is incident on the polarizing film in the intersecting state (hereinafter, simply referred to as light transmission amount), and the symbol GL2 (two-point chain line) is a CCD camera. Sensitivity characteristics (hereinafter, simply referred to as CCD sensitivity characteristics).

Further, the horizontal axis represents the wavelength of light incident on the polarizing film in the crossed Nicols state (injection light wavelength λ (nm)), and the vertical axis represents light transmission amount and CCD specific sensitivity. Further, in the vertical axis of Fig. 58, for the light transmission amount, it is expedient that the light which is incident on the polarizing film of the crossed Nicols is transmitted by 1 and is incident on the polarizing film of the crossed Nicols state. When all the light is blocked, it is represented by 0.

As shown in Fig. 58, when the polarizing film is in the crossed Nicols state, the visible light is substantially not transmitted, but the near infrared rays are mostly transmitted. For example, a camera that detects transmitted light is a CCD camera. The CCD camera is not only visible light, but also sensitive to near infrared rays. The CCD camera is based on a grid-like pattern of black substrates. For example, the outer periphery of the liquid crystal panel P is detected by photographing the outermost edge of the black substrate. In addition, the photographic element of the CCD camera can also be a line sensor or a zone sensor.

According to this embodiment, the cutting position FC1 can be determined according to the position of the black substrate provided at the position overlapping the sheet FXm. FC2. Therefore, by making the sheet FXm slightly larger than the liquid crystal panel P, even when the size of the liquid crystal panel P varies due to manufacturing errors, the optical member F1X of a desired size can be prevented from being excessive or insufficient. The ground does fit on the liquid crystal panel P.

Further, in the present embodiment, the illustrated example is that the structure is a black matrix provided on the liquid crystal panel P, but it is not limited to this. For example, the structure may be an alignment mark provided on the liquid crystal panel P, or may have a shape other than the liquid crystal panel P.

(Eighth embodiment)

Fig. 59 is a schematic configuration diagram of a film bonding system 4001 of the eighth embodiment.

As shown in Fig. 59, in the film bonding system 4001 of the present embodiment, a device for forming a plurality of liquid crystal panels P from a large panel (large optical display unit) is provided on the upstream side of the manufacturing line. The large panel has the size of a plurality of portions of the liquid crystal panel P.

In the film bonding system 1 of the first embodiment, the conveyance belt 11a, the suction arm 14a, and the conveyance belt 11b are provided on the upstream side of the panel conveyance of the cleaning apparatus 20. On the other hand, in the film bonding system 4001 of the present embodiment, a plurality of liquid crystal panels P are formed by dividing a large panel on a conveyance line that conveys a large panel, the liquid crystal panel P, and one of the optical member bonding bodies PA. A panel manufacturing apparatus 4002 (optical display unit manufacturing apparatus), a cleaning apparatus 4003 for cleaning the liquid crystal panel P of a large panel, and a defect inspection apparatus 4004 for performing inspection of defects of the liquid crystal panel P of the cleaning apparatus 4003, Instead of moving The belt 11a, the suction arm 14a, and the conveyance belt 11b are provided.

The panel manufacturing apparatus 4002 applies a so-called multi-corner treatment to a large panel, that is, a plurality of liquid crystal panels are cut out by forming a scribe line on a large panel. Thereby, a plurality of liquid crystal panels P can be obtained from a large panel. The liquid crystal panel P that has passed through the panel manufacturing apparatus 4002 is transferred to the cleaning apparatus 4003 by, for example, a transport mechanism such as a belt conveyor.

The cleaning device 4003 sequentially applies a predetermined cleaning process to the liquid crystal panel P. The cleaning device 4003 performs a coarser cleaning process on the liquid crystal panel P than the cleaning device 20 on the downstream side of the panel conveyance. For example, the cleaning device 4003 removes chips or the like remaining on the liquid crystal panel P which are generated at a plurality of corners. The liquid crystal panel P that has passed through the cleaning device 4003 is transferred to the defect inspection device 4004 by, for example, a transport mechanism such as a belt conveyor.

The defect inspection device 4004 is an automatic inspection device that performs an AOI inspection (Automatic Optical Inspection) on the liquid crystal panel P. The defect inspection device 400 performs a coarser inspection process on the liquid crystal panel P than the first cleaning defect inspection device 41 on the downstream side of the panel conveyance. For example, the defect inspection device 4004 checks for appearance defects such as cracks or defects of the liquid crystal panel P which are generated at a plurality of corners. The liquid crystal panel P which is determined to have no problem in appearance is not transferred to the cleaning device 20 in the liquid crystal panel P. On the other hand, in the liquid crystal panel P, there is a large crack or defect, and the liquid crystal panel P which is determined to have a problem in appearance is discarded by a discarding device (not shown).

According to this configuration, since the panel manufacturing apparatus 4002 is provided in the manufacturing line (in-line), the surface is disposed outside the manufacturing line (offline). In the case of the board manufacturing apparatus 4002, it can be set as a collecting apparatus, and the manufacturing line can be integrated.

Further, in the present embodiment, an example exemplified is that the cleaning device 4003 and the defect inspection device 4004 are provided in the manufacturing line (in-line), but the invention is not limited thereto. For example, the cleaning device 4003 and the defect inspection device 4004 may not be provided in the manufacturing line (in-line). At this time, the same processing is performed in the cleaning device 20 and the first defect inspection device 41 which are disposed on the downstream side of the panel conveyance device 4002. Therefore, the cleaning process and the inspection process of the liquid crystal panel P can be common.

(ninth embodiment)

Fig. 60 is a schematic configuration diagram of a film bonding system 5001 of the ninth embodiment. In the figure, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted (refer to Figs. 2 to 8 and the like as appropriate).

In the first embodiment, the exemplified example is provided with a cutting means 60 which is formed by laminating a sheet FXm which is larger (width and length) than the display area P to the liquid crystal panel P, and cuts off the sheet. The rest of FXm. On the other hand, in the present embodiment, the width and length of the optical member F1X bonded by the bonding means 50 are the same as those of the display area of the liquid crystal panel P, which is largely different from the first embodiment. .

As shown in Fig. 60, the film bonding system 5001 of the present embodiment includes a transport mechanism 5010, a cleaning device 20, a first defect inspection device 41, a second defect inspection device 42, a bonding means 50, and a first inversion. Device 81, second inverting device 82, autoclave processing device 100, control device 91 and memory device 92 are placed. In the present embodiment, the first detecting device 31, the second detecting device 32, the cutting means 60, the first peeling device 71, and the second peeling device 72 are not provided.

The transport mechanism 5010 of the present embodiment includes transporting belts 11a to 11m, tables 12a to 12c, slider mechanisms 13a to 13c, and suction arms 14a to 14f, and is provided with a conveyance belt 5011a and a conveyance belt 5011b. .

The transport conveyor 5011a is disposed between the slider mechanism 13a and the slider mechanism 13b. The conveyance belt 5011a has a linear shape in plan view. The conveyance belt 5011a is conveyed by the first optical member bonding body PA1 of the first bonding apparatus 51. The first optical member bonding body PA1 transports the transport belt 5011a so that the long side of the liquid crystal panel P is transported along the transport direction.

The conveyance conveyor 5011b is disposed between the slider mechanism 13c and the conveyance belt 11f. The conveyance belt 5011b forms a linear shape in plan view. The conveyance belt 5011b is conveyed by the optical member bonding body PA of the 3rd bonding apparatus 53. The optical member bonding body PA conveys the conveyance belt 5011b so that the long side of the liquid crystal panel P can be conveyed along the conveyance direction.

In the present embodiment, the bonding means 50 bonds the optical member F1X to the liquid crystal panel P. The bonding means 50 includes a first bonding device 51 that bonds the first optical member F11 to the first surface of the liquid crystal panel P, and a second bonding device 52 that bonds the second optical member F12 to a second surface of the liquid crystal panel P; and a third bonding device 53, which is a third optical The member F13 is attached to the second surface of the liquid crystal panel P.

The first optical member F11 is bonded to the surface on the display surface side of the liquid crystal panel P by the first bonding apparatus 51 to form the first optical member bonding body PA1. Next, the second optical member F12 is bonded to the surface opposite to the first optical member F11 of the first optical member bonding body PA1 (the surface on the backlight side of the liquid crystal panel P) by the second bonding device 52, The second optical member bonding body PA2 is formed. The third optical member F13 is bonded to the surface on the second optical member F12 side of the second optical member bonding body PA2 (the surface on the backlight side of the liquid crystal panel P) by the third bonding apparatus 53 to form an optical member bonding body. PA.

In the present embodiment, the first bonding apparatus 51 includes a sheet conveying device 510 that winds the first optical member sheet F1 from the raw material roller R around which the first optical member sheet F1 is wound, and along the same The first optical member sheet F1 is conveyed in the longitudinal direction; the bonding portion 520 holds the sheet (the first optical member F11) of the bonding sheet F5 cut out from the first optical member sheet F1 by the sheet conveying device 510, and The sheet is attached to the upper surface of the liquid crystal panel P; the first bonding table 541 is a liquid crystal panel P for holding the bonding; the second bonding table 542; and the recycling table 543 for recovering defective sheets .

In the present embodiment, the first optical member sheet F1 has a width wider than the liquid crystal panel P in the horizontal direction (sheet direction) orthogonal to the conveyance (in the present embodiment, it corresponds to the short side of the liquid crystal panel P). The length is equal to the width.

In this embodiment, the cutting device 510b is first The optical member sheet F1 is wound up in the longitudinal direction orthogonal to the sheet width direction, and the length of the liquid crystal panel P is equal to the length of the liquid crystal panel P (in the present embodiment, the length corresponding to the long side of the liquid crystal panel P). The sheet width direction covers a full width and cuts a part of the thickness direction of the first optical member sheet F1 (application of a half cut). The cut first optical member F11 is held by the holding surface 521a of the bonding head 521.

In the present embodiment, the control device 91 is laid so that the end portion of the first optical member F11 that is adhered to the holding surface 521a and the end portion of the liquid crystal panel P that is held by the first bonding table 541 are laid. The alignment of the bonding head 521 and the first bonding table 541 is performed in a manner of becoming coincident.

The control device 91 lowers the bonding head 521 at the time of bonding, and adheres to the end portion of the first optical member F11 of the holding surface 521a, and overlaps the end portion of the liquid crystal panel P in a plan view to make the first optical The member F11 is in a state of being pressed against the liquid crystal panel P from above. The bonding head 521 is lowered to a state in which the first optical member F11 is pressed against the liquid crystal panel P. At this time, the bonding head 521 is rotated by pressing the bonding sheet F5 held by the holding surface 521a against the liquid crystal panel P, so that the first optical member F11 is bonded to the liquid crystal panel P.

In the same manner, in the same manner, the bonding process of the second optical member F12 and the third optical member F13 of the liquid crystal panel P is performed at each bonding position of the second bonding apparatus 52 and the third bonding apparatus 53.

As described above, the optical member bonding body manufacturing apparatus of the present embodiment is such that the liquid crystal panel P is bonded to the optical member F1X. The manufacturing apparatus of the optical member bonding body PA which consists of the cleaning apparatus 20 which wash|cleans the liquid crystal panel P, and the bonding means 50 which bonded the optical member corresponding to the optical member F1X in the liquid crystal panel P respectively. a sheet FXm of the sheet FX; and a transport mechanism 5010 for transporting the liquid crystal panel P; at least after the cleaning of the liquid crystal panel P is completed by the cleaning device, the bonding of the optical member F1X is completed by the bonding means 50. In the transport mechanism 5010 of the liquid crystal panel P between the liquid crystal panels P, the transport mechanism that transports the liquid crystal panel P by changing the contact portion with the liquid crystal panel P is not used.

According to this configuration, the optical member F1X can be provided with good precision to the display region P4. Therefore, the frame portion G (see FIG. 3) outside the display region P4 can be narrowed, and the display region can be enlarged and the size of the device can be reduced.

In addition, before the first optical member F11, the second optical member F12, and the third optical member F13 are bonded to the liquid crystal panel P, foreign matter adhesion can be suppressed as compared with a transport mechanism in which the contact portion with the liquid crystal panel P is sequentially changed. Go to the LCD panel P. Therefore, the film bonding system 5001 with less bonding defects can be provided.

Further, the bonding means 50 includes a winding-out portion 510a that winds out a strip-shaped optical member sheet FX having a width corresponding to a short side of the display region P4 of the liquid crystal panel P from the original material roller and the separation sheet; The device 510b is configured such that the partition sheet remains and cuts the optical member sheet FX by a length corresponding to the long side of the display region P4 to form the optical member F1X; and the bonding head 521 which holds the optical member F1X on the holding surface 521a, At the same time, the optical member F1X held by the holding surface 521a is attached to the liquid. Crystal panel P.

When the bonding process of the liquid crystal panel P and the optical member F1X is performed by a bonding mechanism such as a pinch roller, the contact roller is sequentially changed by the contact portion with the liquid crystal panel P, so that foreign matter adheres to the pinch. The roller is transported to the position facing the liquid crystal panel P by the rotation of the pinch roller, and adheres to the liquid crystal panel P. Therefore, the foreign matter adheres to the liquid crystal panel P in the bonding process as compared with the case where the contact portion with the liquid crystal panel P does not change.

On the other hand, according to this configuration, since the bonding head 521 performs the bonding process of the liquid crystal panel P and the optical member F1X, the bonding mechanism that does not sequentially change in contact with the liquid crystal panel P is used. In this case, adhesion of foreign matter to the liquid crystal panel P can be suppressed. Therefore, the film bonding system 5001 with less bonding defects can be provided.

The form of the preferred embodiment of the present invention has been described above with reference to the drawings, but is not limited thereto. The various shapes, combinations, and the like of the respective constituent members shown in the above examples are merely examples, and various modifications can be made according to design requirements and the like without departing from the gist of the invention.

(industrial availability)

In the manufacturing apparatus of the optical member bonding body of the present invention, it is possible to provide a manufacturing apparatus for an optical member bonding body in which the frame portion around the display region is reduced, and the display region is enlarged and the size of the device is reduced.

Claims (5)

An apparatus for manufacturing an optical member bonding body, wherein the optical display unit is formed by laminating one or a plurality of optical members, the manufacturing apparatus comprising: a cleaning device for cleaning the optical display unit; The method of bonding the one or a plurality of sheets of the optical member sheets corresponding to the one or more optical members to the optical display unit; and the cutting means for adhering to the optical display unit One or more optical sheets, and one or more optical members are cut out; and a transport mechanism that transports the optical member assembly or the optical display unit to which the optical member is bonded; The transport mechanism is configured such that at least the cleaning of the optical display unit is completed by the cleaning device, and all of the one or more sheets are bonded to the transport path of the optical display unit by the bonding means, Transmitting the optical display using a contact portion with the optical display unit or the optical member bonding body The optical member or assembly attached to the body conveying means. The apparatus for manufacturing an optical member bonding body according to the first aspect of the invention, wherein the bonding means comprises: a winding portion that is larger than a long side and a short side of a display area of the optical display unit; a strip-shaped optical member sheet having a length of one side is taken up from the raw material roller together with the separator; and the cutting portion is made to have the length of the sheet being left longer than any of the long side and the short side of the display area Further, the optical member sheet is cut to form the sheet, and the bonding portion is formed by bonding the sheet to the holding surface and holding the sheet held by the holding surface. Optical display assembly. The apparatus for manufacturing an optical member bonding body according to claim 1 or 2, wherein the transporting mechanism includes: a table holding the optical display unit; and a slider mechanism for moving the table; and adsorbing An arm that adsorbs and holds the optical display assembly held by the table. The apparatus for manufacturing an optical member bonded body according to the first or second aspect of the invention, wherein the transporting means includes: a transporting conveyor that holds and transports the optical display unit; and an adsorption arm that adsorbs and holds the transporting The optical display assembly held by the conveyor belt is transported. An optical member bonding body manufacturing apparatus comprising: an optical display unit in which one or a plurality of optical members are bonded, wherein: a cleaning device for cleaning the optical display unit; and a bonding means; The optical display unit is bonded to the one or more optical members; and the transport mechanism is configured to transport the optical member assembly or the optical member assembly in which the optical member is bonded to the optical display unit; The transport mechanism is configured to complete the cleaning of the optical display unit by the cleaning device, and to bond all of the one or more sheets to the transport path of the optical display unit by the bonding means, without using a conveyance mechanism that conveys the optical display unit or the optical member bonding body with a contact portion of the optical display unit or the optical member bonding body; wherein the bonding means includes a winding portion corresponding to the optical display unit a strip-shaped optical structure having a width of either one of a long side and a short side of the display area The sheet is wound out from the raw material roll together with the separator sheet; the cutting portion is formed by cutting the above-mentioned partitioning sheet and cutting the optical member with a length corresponding to the length of either one of the long side and the short side of the display area The sheet member is formed to form the above-described member; and the bonding portion holds the above-described member on the holding surface, and the optical member held by the holding surface is bonded to the optical display unit.