TW201510511A - Defect inspection apparatus and optical display device production system - Google Patents

Abstract

A defect inspection apparatus of an optical member includes: a light source provided on one side of the optical member; and an imaging device provided on the other side of the optical member, wherein the light source obliquely irradiates a surface of one side of the optical member with light, and the imaging device is provided on an optical axis of light emitted from the light source and captures a transmitted light image of light that is obliquely transmitted through the optical member.

Description

Defect inspection device and production system of optical display device

The present invention relates to a defect inspection apparatus and a production system of an optical display apparatus.

The present invention claims priority based on Japanese Patent Application No. 2013-114634, filed on Jan.

Conventionally, in a production system for producing an optical display device such as a liquid crystal display, a production system described in Patent Document 1 is known. The optical display device is formed by bonding an optical component such as a polarizing plate to an optical display member such as a liquid crystal panel. On the upstream side of the bonding apparatus that bonds the optical display member and the optical component, a defect inspection device that performs defect inspection of the optical component is provided.

It is known that the defect inspection device of the optical component injects light from directly under the optical component, and captures the transmitted transmitted light image directly above the optical component. The defect of the optical component means a foreign matter defect or a concave-convex defect or the like. Foreign matter defect refers to a dark spot detected by scattering of light incident directly underneath.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent No. 4307510.

However, the unevenness defect causes only slight protrusions (or depressions) on the surface of the optical component, so that light incident from directly below is less likely to be refracted or scattered. Therefore, it is difficult to detect dark spots such as unevenness defects. As a result, there is a problem that the defect inspection with good accuracy cannot be performed.

In view of the foregoing, it is an object of the present invention to provide a defect inspection apparatus and a production system of an optical display apparatus capable of performing defect inspection with good precision.

In order to achieve the above object, the production system of the defect inspection device and the optical display device according to the aspect of the present invention has the following configuration.

(1) A defect inspection device according to a first aspect of the present invention is a defect inspection device for an optical component, comprising: a light source disposed on one side of the optical component; and a photographing device disposed on the other of the optical component a side surface; wherein the light source obliquely illuminates light on a side of the optical component; and the imaging device is disposed on an optical axis of the light emitted from the light source to capture light obliquely penetrating the optical component Transmitted light image.

(2) The defect inspection device according to (1) above, wherein an adjustment unit is preferably disposed between the light source and the optical component to adjust an incident angle of light incident from the light source to the optical component. distributed.

(3) The defect inspection device according to (2) above, wherein the adjustment unit is preferably a focusing unit that focuses the light from outside the optical axis.

(4) The defect inspection device according to any one of (1) to (3) above, wherein a defect device is preferably provided with a moving device for relatively moving the light-emitting device with respect to the light source so that the camera device is relatively The optical axis of the light emitted by the light source is offset and disposed at an offset position.

(5) A defect inspection device according to a second aspect of the present invention is a defect inspection of an optical component The device includes: a light source disposed on one side of the optical component; and a photographing device disposed on the other side of the optical component; wherein the light source obliquely illuminates light on a side of the optical component; The imaging device is disposed at an offset position with respect to an optical axis of the light emitted from the light source, and images the position of the optical component that is irradiated with the light from an oblique direction.

(6) A production system for an optical display device according to a third aspect of the present invention is a production system for an optical display device formed by bonding an optical component to an optical display member, and is provided with: a transport device for transporting the optical a bonding device that attaches an optical component carried by the conveying device to the optical display member to produce the optical display device; and the defect inspection according to any one of (1) to (5) above The apparatus checks whether or not the optical component transported from the transport apparatus to the bonding apparatus is defective.

According to the aspect of the invention, it is possible to provide a defect inspection device and a production system of an optical display device capable of performing good-accuracy defect inspection.

1‧‧‧Film bonding system

2‧‧‧Control Department

3‧‧‧Roller conveyor

7‧‧‧First supply device

8‧‧‧First transport device

8a‧‧‧Roller retention department

8b‧‧‧Clamping roller

8c‧‧‧Guide roller

8d‧‧‧Storage Department

8e, 18b‧‧‧Winding Department

9,109‧‧‧First defect inspection device

10‧‧‧First cut-off device

11‧‧‧First bonding device

11a, 18a‧‧‧ Blade

11b, 19b‧‧‧ pinch roller

18‧‧‧ before peeling device

19‧‧‧After inspection inspection device

19a‧‧‧Roller Holder

20‧‧‧Light source

20a‧‧‧Light exit surface

21‧‧‧Photographing device

22‧‧ ‧ visor

23‧‧‧ Focus components

23h‧‧‧slit

24‧‧‧Mobile devices

209,309‧‧‧First defect inspection device

CL, CL1‧‧‧ optical axis

F‧‧‧Optical component layer

F1‧‧‧ optical components

F2‧‧‧Adhesive layer

F3‧‧‧Separation layer

F4‧‧‧Surface protection film

F5‧‧‧Fitting layer

F6‧‧‧ polarizer

F7‧‧‧ first film

F8‧‧‧second film

H1‧‧‧ first separation layer

H2‧‧‧Second separation layer

L1‧‧‧Light

L2‧‧‧scattered light

R1‧‧‧ Roller

R2‧‧‧First Separation Layer Roller

R3, R4‧‧‧Second separate layer roller

Sf1‧‧‧ Fitted under the side of the layer

Sf2‧‧‧Fitting layer above the side

P‧‧‧ LCD panel

P1‧‧‧ first substrate

P2‧‧‧second substrate

P3‧‧‧ liquid crystal layer

P4‧‧‧ display area

P11‧‧‧Single-sided fitting panel

Ps‧‧ position

Θ‧‧‧ illumination angle

Θ1‧‧‧ configuration angle

Fig. 1 is a side view showing the structure of a film bonding system apparatus according to a first embodiment of the present invention.

Figure 2 is a side view showing the structure of the film bonding system device.

Fig. 3 is a plan view of a liquid crystal panel.

Figure 4 is a cross-sectional view of a polarizing film layer.

Fig. 5 is a side view showing the defect inspection device according to the first embodiment of the present invention.

Figure 6 is a plan view of the defect inspection device.

Fig. 7A is a schematic view showing the action of the defect inspection device.

Fig. 7B is a schematic view showing the action of the defect inspection device.

Fig. 8A is a schematic view showing the action of the defect inspection device.

Fig. 8B is a schematic view showing the action of the defect inspection device.

Fig. 9 is a side view showing the defect inspection device of the second embodiment of the present invention.

Figure 10 is a plan view of the defect inspection device.

Figure 11 is a side view showing a defect inspection device according to a third embodiment of the present invention.

Fig. 12 is a side view showing the defect inspection device of the fourth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

In addition, in the following drawings, the dimensions and proportions of the respective structural elements are appropriately changed for the sake of clarity of the drawings. In the following description and the drawings, the same or corresponding components are denoted by the same reference numerals, and the description thereof will not be repeated.

In the following description, the XYZ orthogonal coordinate system is set corresponding to the demand, and the positional relationship of each component is described with reference to the XYZ orthogonal coordinate system. In the present embodiment, the X direction is the transport direction of the liquid crystal panel of the optical display member, and the Y direction is the direction orthogonal to the X direction in the plane of the liquid crystal panel (the width direction of the liquid crystal panel), and the Z direction is the X direction and the Y direction. Orthogonal direction.

(First embodiment)

Hereinafter, a film bonding system which constitutes a part of the production system of the optical display device according to the first embodiment of the present invention will be described.

Fig. 1 and Fig. 2 are side views showing the structure of the apparatus of the film bonding system 1 of the present embodiment.

In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, an antireflection film, or a light diffusing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel.

In the present embodiment, the liquid crystal panel P is exemplified as an optical display member, and a double-sided bonding panel formed by bonding the bonding layer sheet F5 to the front/rear surfaces of the liquid crystal panel P is exemplified as an optical component bonding body. The present invention is not limited to this.

As shown in FIGS. 1 and 2, the film bonding system 1 of the present embodiment is provided as a process for manufacturing a production line of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by the control unit 2 of the electronic control unit.

In the film bonding system 1 of the present embodiment, the orientation of the liquid crystal panel P is reversed by 90° in the middle of the conveyance direction of the liquid crystal panel P. The film bonding system 1 is a film in which a polarizing film whose polarization axis directions are orthogonal to each other is bonded to the front/rear surface of the liquid crystal panel P. Hereinafter, the polarizing film is referred to as an optical component F1.

Fig. 3 is a plan view of the liquid crystal panel P as viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1 and the second substrate. Between P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view, and a region located inside the outer periphery of the liquid crystal layer P3 in plan view is the display region P4.

Fig. 4 is a cross-sectional view showing the optical component layer F including the optical component F1 attached to the liquid crystal panel P. Further, in Fig. 4, the hatching of each layer in the cross-sectional view is omitted for the sake of convenience.

As shown in Fig. 4, the optical component layer F has a film-like optical component F1, an adhesive layer F2 provided on one side of the optical component F1 (upper side in the drawing), and can be separated via the adhesive layer F2. A separation layer F3 which is laminated on the side of one side of the optical component F1; and a surface protection film F4 laminated on the other side (the lower side in the drawing) of the optical component F1. The optical module F1 has a function as a polarizing plate, and is disposed across the entire area of the display area P4 of the liquid crystal panel P and the peripheral area of the liquid crystal panel P.

The optical module F1 is bonded to the liquid crystal panel P via the adhesive layer F2 in a state where the adhesive layer F2 remains on the surface on one side of the optical module F1 and is separated from the separation layer F3. Following, will be from optics The portion of the component layer F after the separation layer F3 is removed is referred to as a bonding layer sheet F5.

The separation layer F3 protects the adhesive layer F2 and the optical component F1 during the period from the separation of the adhesive layer F2. The surface protective film F4 is bonded to the liquid crystal panel P together with the optical component F1. The surface protective film F4 is disposed on the opposite side of the liquid crystal panel P with respect to the optical component F1 to protect the optical component F1 and is separated from the optical component F1 at a specific time point. Further, the optical component layer F may be a structure not including the surface protective film F4. Further, the surface protective film F4 may be a structure that cannot be separated from the optical module F1.

The optical module F1 has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and an adhesive or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 are protective films that protect the polarizing mirror F6, for example.

Further, the optical component F1 may be a single layer structure composed of one layer of optical layers, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical component F1 may not include at least one of the first film F7 and the second film F8. For example, in the case where the first film F7 is omitted, the separation layer sheet F3 may be bonded to the surface on one side of the optical module body F1 via the adhesive layer F2.

Next, the film bonding system 1 of the present embodiment will be described in detail.

As shown in FIG. 1 and FIG. 2, the film bonding system 1 of the present embodiment includes the liquid crystal panel P on the upstream side (+X direction side) in the transport direction of the liquid crystal panel P on the right side in the drawing to the left side in the drawing. The drive roller conveyor 3 that transports the liquid crystal panel P in a horizontal state until the downstream side (the -X direction side) of the conveyance direction.

The roller conveyor 3 is divided into an upstream device by a reversing device (not shown). Machine and downstream side conveyor. In the upstream conveyor, the liquid crystal panel P is conveyed along the long side of the display region P4. On the other hand, in the downstream conveyor, the liquid crystal panel P is conveyed along the short side of the display region P4. The bonding layer sheet F5 of a specific length cut from the strip-shaped optical component layer F is bonded to the front/reverse surface of the liquid crystal panel P.

The film bonding system 1 of the present embodiment includes a first supply device 7, a first bonding device 11, a reversing device, a second supply device, a second bonding device, an inspection device, and a control unit 2.

In the first embodiment, the device configuration of the film bonding system 1 will be described by taking the first supply device 7 of the first supply device and the second supply device as an example. Since the second supply device has the same configuration as the first supply device 7, a detailed description thereof will be omitted.

As shown in Fig. 1, the first supply device 7 winds up the optical component layer F from the roll drum R1 around which the strip-shaped optical component layer F is wound, cuts it into a specific size, and supplies it. The first supply device 7 includes a first transfer device 8 , a pre-inspection peeling device 18 , a first defect inspection device 9 , a post-inspection bonding device 19 , and a first cutting device 10 .

The first conveying device 8 is a conveying mechanism that conveys the optical module layer F in the longitudinal direction of the optical module layer F. The first conveying device 8 includes a drum holding portion 8a, a holding roller 8b, a guide roller 8c, a storage portion 8d, and a winding portion 8e (refer to Fig. 2).

The roller holding portion 8a holds the roll drum R1 around which the strip-shaped optical component layer F is wound, and winds up the optical component layer F in the longitudinal direction of the optical component layer F.

The nip roller 8b grips the optical component layer F for guiding the optical component layer F unwound from the take-up reel R1 along a specific transport route.

The guide roller 8c changes the direction in which the optical component layer F is conveyed along the transport path. At least one of the plurality of guide rollers 8c has the function of a tension roller.

That is, at least one of the plurality of guide rollers 8c is movable, and the tension of the optical component layer F during conveyance can be adjusted.

The storage unit 8d can absorb the amount of winding of the optical component layer F conveyed by the roller holding portion 8a while the optical module layer F is being cut by the first cutting device 10. In other words, the storage portion 8d adjusts the amount of winding up to the optical component layer F of the first cutting device 10.

The roller holding portion 8a located at the beginning of the first conveying device 8 and the winding portion 8e (refer to FIG. 2) located at the end of the first conveying device 8 are driven in synchronization with each other, for example. Thereby, the roller holding portion 8a winds up the optical component layer F in the conveying direction of the optical component layer F, and the winding portion 8e winds up the separation layer sheet F3 that has passed through the first bonding device 11. In the first transfer device 8, the upstream side in the transport direction of the optical module layer F (separation layer sheet F3) is referred to as the layer transport upstream side, and the downstream side in the transport direction is referred to as the layer transport downstream side.

The pre-inspection peeling device 18 is configured such that the first separation layer sheet H1 (corresponding to the separation layer sheet F3) is peeled off from the optical component layer F conveyed from the upstream side of the layer sheet conveyance, and is wound into a drum. The peeling device 18 before inspection has a blade edge 18a and a winding portion 18b.

The blade 18a is formed by extending at least the entire width of the optical component layer F in the width direction of the optical component layer F. The blade 18a causes the first separation layer H1 side of the optical component layer F taken up by the take-up reel R1 to be in sliding contact, and the optical component layer F is wound up. The blade 18a is wound around the end portion of the blade 18a at an acute angle to the optical component layer F. The blade 18a separates the bonding layer sheet F5 from the first separation layer sheet H1 when the optical component layer F is folded back at an acute front end of the blade edge 18a. The blade 18a supplies the bonding layer sheet F5 to the first defect inspection device 9.

The take-up portion 18b holds the first separation ply roll R2 of the first separation layer sheet H1 that is individually wound after being passed through the blade 18a.

The first defect inspection device 9 performs defect inspection of the optical component layer F (that is, the bonding layer sheet F5) after the first separation layer sheet H1 is peeled off. The first defect inspection device 9 analyzes image data captured by a CCD (charge-coupled device) camera and checks for defects. In the case of a defect, the position coordinates are calculated. Providing the position coordinates of the defect to the first cutting device 10 to The first cutting device 10 performs information of "avoidance cutting". Further, details of the first defect inspection device 9 will be described later.

After the inspection, the bonding apparatus 19 bonds the second separation layer sheet H2 (corresponding to the separation layer sheet F3) to the bonding layer sheet F5 after the defect inspection via the adhesive layer F2. The post-inspection bonding device 19 has a roller holding portion 19a and a pinch roller 19b.

The roller holding portion 19a holds the second separation ply roll R3 around which the strip-shaped second separation layer sheet H2 is wound, and winds up the second separation layer sheet H2 in the longitudinal direction of the second separation layer sheet H2.

The nip roller 19b bonds the second separation layer sheet H2 wound by the second separation layer roll R3 to the lower side of the bonding layer sheet F5 after the defect inspection carried out from the upstream side of the layer sheet conveyance (adhesive layer F2 side) The face). The nip roller 19b has a pair of bonding drums arranged in parallel with each other in the axial direction. The upper bonding roller of the pair of bonding rollers can move up and down. A predetermined gap is formed between the pair of bonding rolls, and the gap is the bonding position of the post-inspection bonding device 19. The bonding layer sheet F5 and the second separation layer sheet H2 are superposed and introduced into the gap. The bonding layer sheet F5 and the second separation layer sheet H2 are pinched at the pinch roller 19b and sent to the downstream side of the layer sheet conveyance. Thereby, the second separation layer sheet H2 is bonded to the lower side surface of the bonding layer sheet F5 after the defect inspection to form the optical component layer F.

When the optical component layer F of a specific length is wound up, the first cutting device 10 cuts off one of the thickness directions of the optical component layer F across the entire width in the width direction orthogonal to the longitudinal direction of the optical component layer F. Half cut off.

The first cutting device 10 is half-cut, and the optical component layer F is not broken or broken (the specific thickness separation layer F3 remains) by the tension in the optical component layer F. Next, the advance and retraction position of the cutting blade is adjusted, and the cutting is performed until the position near the interface between the adhesive layer F2 and the separation layer F3. In addition, a laser device can be used instead of cutting the blade.

In the optical component layer F after the half-cut, the optical component F1 and the surface protective film F4 are cut in the thickness direction of the optical component layer F to form a whole across the width direction of the optical component layer F. The cutting line of the body width. The cutting line is formed in a plurality of side by side in the longitudinal direction of the strip-shaped optical component layer F. For example, in the case of a bonding step of transporting the liquid crystal panel P of the same size, a plurality of cutting lines are formed at equal intervals in the longitudinal direction of the optical component layer F. The optical component layer F is divided into a plurality of sections in the longitudinal direction by a plurality of cutting lines. In the longitudinal direction of the optical component layer F, the partitioned portions sandwiched by the adjacent pair of cutting lines are each one of the laminated plies F5.

The first cutting device 10 is cut into a specific size (avoidance cut) by avoiding the defective portion based on the position coordinates of the defect calculated by the first defect inspection device 9. The cut product containing the defective portion is regarded as a defective product and is excluded in subsequent works. Further, the first cutting device 10 may continuously cut the optical component layer F into a specific size regardless of the defective portion. In this case, in the bonding step of the bonding layer sheet F5 and the liquid crystal panel P, the cut product including the defective portion is not attached to the liquid crystal panel P, and is removed.

In the second embodiment, the apparatus configuration of the film bonding system 1 is described by taking the first bonding apparatus 11 and the first bonding apparatus 11 of the second bonding apparatus as an example. Since the second bonding apparatus has the same structure as the first bonding apparatus 11, the detailed description thereof will be omitted.

As shown in FIG. 2, the first bonding apparatus 11 performs bonding of the bonding layer sheet F5 cut into a specific size with respect to the upper surface of the liquid crystal panel P introduced to the bonding position. The first bonding apparatus 11 has a blade 11a and a nip roller 11b.

The blade 11a winds the half-cut optical component layer F at an acute angle so that the bonding layer sheet F5 is separated from the separation layer sheet F3, and the bonding layer sheet F5 is supplied to the bonding position.

The nip roller 11b bonds the bonding layer sheet F5 of a specific length separated from the optical module layer F by the blade edge 11a to the liquid crystal panel P conveyed by the upstream conveyor. The nip roller 11b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the first bonding device 11. The liquid crystal panel P and the bonding layer sheet F5 are superposed and introduced into the gap. The liquid crystal panel P and the bonding layer sheet F5 are pinched at the pinch roller 11b. And sent to the upstream side conveyor panel to transport the downstream side. Thereby, the bonding layer sheet F5 is bonded to the upper side surface of the liquid crystal panel P to be integrated. Hereinafter, the panel after bonding is referred to as a single-sided bonding panel P11.

The winding portion 8e holds the second separation ply roller R4 that winds up the second separation layer sheet H2 that is uniquely passed through the blade 11a.

The inverting device (not shown) is provided on the downstream side of the panel conveyance of the first bonding apparatus 11, and the liquid crystal panel P that has reached the final position of the upstream conveyor is conveyed to the starting position of the downstream conveyor.

The reversing device holds the single-sided bonding panel P11 that passes through the first bonding device 11 and reaches the final position of the upstream conveyor by suction, clamping, or the like. The inverting device reverses the front/back surface of the single-sided bonding panel P11. The inverting device converts the single-sided bonding panel P11 that is conveyed in parallel with the long side of the display region P4 so as to change its direction in parallel with the short side of the display region P4.

The above-described inversion step is performed in order to arrange the polarization axes of the optical components F1 bonded to the front/rear surfaces of the liquid crystal panel P at right angles to each other.

Further, in the case where the liquid crystal panel P is simply reversed in the forward/reverse direction, it is also possible to use only an inverting device having an inversion arm having a rotation axis parallel to the conveyance direction. In this case, when the layer conveyance direction of the first supply device 7 and the layer conveyance direction of the second supply device are disposed at right angles to each other in plan view, the optical component F1 having the polarization axis directions at right angles to each other can be attached to the liquid crystal. The front/back side of panel P.

Since the second supply device has the same configuration as the first supply device 7, a detailed description thereof will be omitted. The second supply device winds up the optical component layer F from the roll drum around which the strip-shaped optical component layer F is wound, cuts it into a specific size, and supplies it. Although not shown in the drawings, the second supply device includes a second transfer device, a pre-inspection peeling device, a second defect inspecting device, a post-inspection bonding device, and a second cutting device.

The second bonding device is for the upper side of the liquid crystal panel P that is introduced to the bonding position. The bonding of the bonding layer sheet F5 cut into a specific size is performed. The second bonding device has the same blade and nip roller as the first bonding device 11.

The single-sided bonding panel P11 and the bonding layer sheet F5 are introduced into a gap between the pair of bonding rollers in the nip roller in a superposed state (the bonding position of the second bonding device), and the bonding layer is laminated. The F5 is attached to the upper side of the single-sided bonding panel P11 and integrated. Hereinafter, the bonded panel is referred to as a double-sided bonding panel (optical component bonding body).

The inspection device is provided on the downstream side of the panel conveyance of the second bonding device. The inspection device checks whether the double-sided bonding panel is defective (poor bonding, etc.). The defects to be identified in the inspection target include defects such as foreign matter or air bubbles mixed in the liquid crystal panel and the laminated layer, damage to the surface of the bonded layer, and poor alignment in the liquid crystal panel.

Further, in the present embodiment, the control unit 2 of the electronic control unit that integrally controls each part of the film bonding system 1 is included in the computer system. The computer system includes an arithmetic processing unit such as a central processing unit (CPU) and a memory unit such as a memory or a hard disk. The control unit 2 of the present embodiment includes an interface that can communicate with an external device of the computer system. At the control unit 2, an input device capable of inputting an input signal can be connected. The above input device includes an input device such as a keyboard or a mouse, or a communication device that can input data from an external device of the computer system. The control unit 2 may include a display device such as a liquid crystal display that displays the operation state of each part of the film bonding system 1, and may be connected to the display device.

An operating system (OS, operating system) that controls the computer system is installed in the memory unit of the control unit 2. In the memory unit of the control unit 2, the arithmetic processing unit controls each part of the film bonding system 1 to store a program for transferring the optical component layer F with good precision in each part of the film bonding system 1. Various pieces of information including a program stored in the memory unit can be read by the arithmetic processing unit of the control unit 2. The control unit 2 may include logic such as an application specific integrated circuit (ASIC) that performs various processes required for control of each part of the film bonding system 1. Circuit.

The memory system includes: semiconductor memory such as random access memory (RAM), read only memory (ROM), or hard disk, CD-ROM read (CD-ROM) External storage devices such as devices and disc-type memory media. In terms of functionality, the memory unit is configured to store a control sequence in which the first supply device 7, the first bonding device 11, the inverting device, the second supply device, the second bonding device, and the inspection device are stored. The memory area of the program software; and various other memory areas.

(defect inspection device)

Next, the defect inspection device of this embodiment will be described in detail.

Fig. 5 is a side view showing the defect inspection device of the embodiment. In Fig. 5, the first defect inspection device 9 and the first defect inspection device 9 in the second defect inspection device are described as a defect inspection device. Since the second defect inspection device has the same configuration as the first defect inspection device 9, detailed description thereof will be omitted. In Fig. 5, the symbol Sf1 is attached to the lower side of the layer F5 (the side on the side of the optical member), and is shown as the surface on the side of the adhesive layer F2. The symbol Sf2 is applied to the upper surface of the layer F5 (the other side of the optical component) and is shown as the surface of the surface protective film F4 side.

As shown in Fig. 5, the first defect inspection device 9 of the present embodiment includes a light source 20 disposed on the side of the lower surface Sf1 of the bonding layer sheet F5, and a side surface Sf2 disposed on the upper surface Sf2 of the bonding layer sheet F5. Photographing device 21.

The light source 20 is irradiated with light obliquely with respect to the lower side Sf1 of the bonding layer F5. For example, the angle (illumination angle θ) between the optical axis CL of the light emitted from the light source 20 and the lower side surface Sf1 is set within an angle range of 0° to 90°. In addition, the illumination angle θ can be set within an angle range of 45° to 75°. Preferably, the illumination angle θ is set to 70°.

The imaging device 21 is disposed on the optical axis CL of the light emitted from the light source 20 to capture a transmitted light image of the light obliquely penetrating through the bonding layer F5.

An adjustment unit is disposed between the light source 20 and the bonding layer F5 to adjust the incident angle distribution of the light incident from the light source 20 to the bonding layer F5. In the present embodiment, a light shielding plate that can block light from one side of the optical axis CL is used as the adjustment light for the light emitted from the light source 20. Hereinafter, the adjustment component will be referred to as a light shielding plate 22.

Fig. 6 is a plan view of the first defect inspection device 9. For the sake of convenience, in the sixth drawing, the illustration of the imaging device 21 is omitted.

As shown in Fig. 6, the light source 20 has a rectangular shape and has a long side in the Y direction. The light exit surface 20a of the light source 20 also has a long side in the Y direction. In the present embodiment, the light-emitting surface 20a of the light source 20 has a long side in the width direction orthogonal to the direction in which the bonding layer sheet F5 is transported. The light exit surface 20a of the light source 20 is formed across the width direction with respect to the bonding layer sheet F5. For example, an LED line source can be used as the light source 20.

The light shielding plate 22 is configured to substantially overlap the light emitting surface 20a of the light source 20 by 50% (the portion of the light source 20 on the +X direction side). The light shielding plate 22 is disposed, for example, so as to overlap the light emitting surface 20a of the light source 20 by about 40% to 60%. For example, the visor 22 overlaps the light exit surface 20a of the light source 20 by about 40%, 45%, 50%, 55%, or 60%. The visor 22 has a long side in the Y direction similarly to the light source 20. The length of the visor 22 is longer in the Y direction than the light source 20.

Thereby, among the light beams emitted from the light source 20, the light emitted to the +X direction side of the optical axis CL is shielded by the light shielding plate 22. On the other hand, among the light beams emitted from the light source 20, the light emitted to the -X direction side of the optical axis CL does not enter the imaging device 21. Therefore, among the light beams emitted from the light source 20, only the light along the optical axis CL penetrates the bonding layer F5, and is selectively incident on the imaging device 21.

Although not shown in FIG. 6, the imaging device 21 has a long side in the Y direction similarly to the light source 20. For example, a line type camera can be used as the photographing device 21.

With the foregoing structure, the first defect inspection device 9 is directed to the bonding layer sheet F5, from the bottom The side surface Sf1 is irradiated with light through the light shielding plate 22, and the light passing through the bonding layer sheet F5 is imaged by the imaging device 21, and the bonding layer sheet F5 is inspected for defects based on the photographing data.

7A, 7B, 8A, and 8B are views showing the action of the first defect inspection device 9 of the present embodiment. Fig. 7A and Fig. 7B show a slightly convex and concave defect on the surface of the laminated layer as a schematic view of the defect of the laminated layer. Fig. 8A and Fig. 8B show a concave-convex defect in which the surface of the laminated layer is slightly recessed as a schematic view of the defect of the laminated layer. Figs. 7A and 8A are views showing the action of the defect inspection device of the comparative example, and Figs. 7B and 8B are views showing the action of the first defect inspection device 9 of the present embodiment.

As shown in FIGS. 7A and 8A, the defect inspection apparatus of the comparative example directly injects light from directly under the bonding layer to capture a configuration of a transmitted light image directly above the bonding layer. In this case, the light incident directly from the bottom of the bonding layer is less likely to be refracted or scattered. Therefore, it is difficult to detect the dark spots of the unevenness defects. As a result, defect inspection with good accuracy cannot be performed.

On the other hand, as shown in FIGS. 7B and 8B, the first defect inspection device 9 of the present embodiment obliquely injects light onto the laminated layer to capture a transmitted light image obliquely penetrating from the laminated layer. The composition. In this case, among the light rays penetrating the bonding layer, the light path (dotted line portion) in the bonding layer which obliquely penetrates the light of the end portion of the concave-convex portion is a bonding layer which obliquely penetrates the light of the portion other than the above-mentioned portion The light path (solid line portion) in the slice is longer. Therefore, in the light penetrating the bonding layer, the light obliquely penetrating the end portion of the concave portion may be darker than the light obliquely penetrating the portion other than the above. Regarding the transmitted light image obliquely penetrating from the self-adhesive layer, in the light penetrating the laminated layer, light obliquely penetrating the end portion of the concave portion (lighter light) and light obliquely penetrating the portion other than the above Between (lighter light), it is easy to produce differences in brightness and darkness, and improve contrast. Thereby, the end portion of the uneven portion can be shaded. Therefore, by detecting the shaded portion, the unevenness defect can be detected. Therefore, according to the present embodiment, it is possible to perform defect inspection with good accuracy.

Moreover, since the light shielding plate 22 is disposed between the light source 20 and the bonding layer sheet F5, The directivity of the light incident on the bonding layer F5 is increased. Therefore, the unevenness defect can be detected with good precision.

Further, in the present embodiment, the defect inspection device and the bonding line are disposed on the same production line as an example, but the invention is not limited thereto. For example, in the case where the defect inspection device and the bonding line are separately disposed on separate production lines (production lines of optical components), the above configuration can also be applied.

(Second embodiment)

Fig. 9 is a side view showing a defect inspection apparatus according to a second embodiment of the present invention, corresponding to Fig. 5.

In Fig. 9, the first defect inspection device 109 and the first defect inspection device 109 in the second defect inspection device are described as a defect inspection device. Since the second defect inspection device has the same configuration as the first defect inspection device 109, detailed description thereof will be omitted. In Fig. 9, the symbol Sf1 is attached to the lower side of the layer F5 (the side on the side of the optical member), that is, the surface on the side of the adhesive layer F2. The symbol Sf2 is applied to the upper surface of the layer F5 (the other side of the optical component), that is, the surface of the surface protective film F4 side.

As shown in Fig. 9, the first defect inspection device 109 of the present embodiment differs from the first embodiment in that a focusing unit is used instead of the light shielding plate as an adjustment unit, and the light source 20 can be made from the outside of the optical axis CL. The light that is emitted is focused. In the ninth embodiment, the same components as those in the fifth embodiment are denoted by the same reference numerals, and the detailed description is omitted. Hereinafter, the focusing component 23 is referred to as an adjustment component.

At the focusing unit 23, a slit 23h is provided at a position overlapping the optical axis CL of the light emitted from the light source 20.

Fig. 10 is a plan view of the first defect inspection device 109 corresponding to Fig. 6. For the sake of convenience, in FIG. 10, the illustration of the imaging device 21 is omitted. In the tenth embodiment, the same components as those in the sixth embodiment are denoted by the same reference numerals, and the detailed description is omitted.

As shown in Fig. 10, the focusing unit 23 is disposed to overlap the outer peripheral portion of the light emitting surface 20a of the light source 20. The focusing unit 23 has the same long side in the Y direction as the light source 20. The slit 23h also has a long side in the Y direction. The length of the focusing assembly 23 is longer in the Y direction than the light source 20. The length of the slit 23h is shorter in the Y direction than the light exit surface 20a of the light source 20.

Thereby, among the light rays emitted from the light source 20, only the light that penetrates the slit 23h, that is, the light along the optical axis CL penetrates the bonding layer F5, and is selectively injected into the imaging device 21. .

According to the present embodiment, since the focusing unit 23 is provided between the light source 20 and the bonding layer sheet F5, the directivity of the light incident on the bonding layer sheet F5 can be improved. Therefore, the unevenness defect can be detected with good precision.

(Third embodiment)

Fig. 11 is a side view showing a defect inspection apparatus according to a third embodiment of the present invention, corresponding to Fig. 5. In Fig. 11, the first defect inspection device 209 and the first defect inspection device 209 in the second defect inspection device are described as a defect inspection device. Since the second defect inspection device has the same configuration as the first defect inspection device 209, a detailed description thereof will be omitted. In Fig. 11, the symbol Sf1 is attached to the lower side of the layer F5 (the side on the side of the optical member), that is, the surface on the side of the adhesive layer F2. The symbol Sf2 is applied to the upper surface of the layer F5 (the other side of the optical component), that is, the surface of the surface protective film F4 side.

As shown in Fig. 11, the first defect inspection device 209 of the present embodiment differs from the first embodiment in that a moving device 24 is provided to allow the imaging device 21 to move relative to the light source 20 so that the imaging device 21 is caused. The arrangement is shifted to the offset position with respect to the optical axis CL of the light emitted from the light source 20. In the eleventh embodiment, the same components as those in the fifth embodiment are denoted by the same reference numerals, and the detailed description is omitted.

In the moving device 24 of the present embodiment, the imaging device 21 is fixed at a fixed position, and both the light source 20 and the light shielding plate 22 are integrally moved, whereby the imaging device 21 is shifted with respect to the optical axis of the light emitted from the light source 20. Configured at the offset position.

According to the present embodiment, since the imaging device 21 is disposed offset from the optical axis CL of the light source 20 at the offset position, the light emitted from the light source 20 is not directly incident on the imaging device 21. With this, The scattered light due to the unevenness can be selectively photographed, so that the defect can be detected with good precision.

Further, in the present embodiment, the imaging device 21 is fixed to a fixed position, and both the light source 20 and the light shielding plate 22 are integrally moved. However, the present invention is not limited thereto. For example, both the light source 20 and the light shielding plate 22 may be fixed to a fixed position and move the imaging device 21, and both the light source 20 and the light shielding plate 22 may be integrally moved while moving the imaging device 21.

(Fourth embodiment)

Fig. 12 is a side view showing a defect inspection apparatus according to a fourth embodiment of the present invention, corresponding to Fig. 5. In Fig. 12, the first defect inspection device 309 and the first defect inspection device 309 in the second defect inspection device are described as a defect inspection device. Since the second defect inspection device has the same configuration as the first defect inspection device 309, a detailed description thereof will be omitted. In Fig. 12, the symbol Sf1 is attached to the lower side of the layer F5 (the side on the side of the optical member), that is, the surface on the side of the adhesive layer F2. The symbol Sf2 is applied to the upper surface of the layer F5 (the other side of the optical component), that is, the surface of the surface protective film F4 side.

As shown in Fig. 12, the first defect inspection device 309 of the present embodiment differs from the first embodiment in that the imaging device 21 is offset from the optical axis CL of the light emitted from the light source 20 by a bias. The position is shifted, and the position Ps of the bonding layer F5 that is irradiated with light is imaged from the oblique direction. In the ninth embodiment, the same components as those in the fifth embodiment are denoted by the same reference numerals, and the detailed description is omitted.

The first defect inspection device 309 detects the transmittance distribution in the plane parallel to the upper surface Sf2 of the bonding layer sheet F5 when the optical axis CL is viewed from the oblique direction, based on the imaging result of the imaging device 21, and detects the transmittance distribution. The portion with a higher penetration rate is the defective portion. When the bonding layer sheet F5 has a foreign matter or a bubble, the light emitted from the light source 20 is scattered by foreign matter or bubbles, and a portion L2 of the scattered light is incident on the imaging device 21. On the other hand, in the case where there is no foreign matter or air bubbles, since the scattered light is not generated, the photographed image of the photographing device 21 is darkened. Therefore, as long as the transmittance distribution when viewed from the oblique direction with respect to the optical axis CL is detected, it is possible to detect whether or not there is a defect.

The arrangement angle θ1 of the imaging device 21 with respect to the optical axis CL of the light source 20 (the angle between the optical axis CL of the light source 20 and the optical axis CL1 of the light L2 incident on the imaging device 21) is set to allow the imaging device 21 to be fully charged. The angle at which the scattered light L2 is received. Considering that the contrast of the photographing device 21 when the scattered light L2 is captured becomes large, the photographing device 21 can be disposed at the dark field. When the arrangement angle θ1 is too small, the light L1 traveling along the optical axis CL of the light source 20 in the light penetrating the bonding layer F5 is mixed with the scattered light L2, so that the contrast becomes small, and the scattering cannot be detected with good precision. Light L2. On the other hand, when the arrangement angle θ1 is excessively large, it is difficult for the scattered light to be incident on the imaging device 21. From the foregoing point of view, the arrangement angle θ1 can be set within an angle range of 0° to 90°. Preferably, the angle θ1 is set within an angle range of 2° to 20°.

According to the present embodiment, the imaging device 21 is disposed at an offset position with respect to the optical axis CL of the light source 20, and the position Ps of the bonding layer F5 that is irradiated with light is imaged from the oblique direction, so that it is emitted from the light source 20. The light is not directly incident on the photographing device 21. Thereby, the scattered light due to the unevenness can be selectively photographed, and the defect can be detected with good precision.

Although the preferred embodiment of the embodiment has been described above with reference to the attached drawings, the present invention is not limited to the examples. The outer shape and the combination of the constituent elements shown in the above examples are merely examples, and various modifications can be made according to design requirements and the like without departing from the scope of the invention.

9‧‧‧First defect inspection device

20‧‧‧Light source

20a‧‧‧Light exit surface

21‧‧‧Photographing device

22‧‧ ‧ visor

CL‧‧‧ optical axis

F5‧‧‧Fitting layer

Sf1‧‧‧ Fitted under the side of the layer

Sf2‧‧‧Fitting layer above the side

Θ‧‧‧ illumination angle

Claims (6)

A defect inspection device is a defect inspection device for an optical component, comprising: a light source disposed on one side of the optical component; and an imaging device disposed on the other side of the optical component; wherein the light source is The side of one side of the optical component illuminates the light obliquely; and the imaging device is disposed on an optical axis of the light emitted from the light source to capture a transmitted light image of the light obliquely penetrating the optical component. The defect inspection device of claim 1, wherein an adjustment component is disposed between the light source and the optical component to adjust an incident angle distribution of light incident from the light source to the optical component. The defect inspection device of claim 2, wherein the adjustment component is a focusing component that focuses the light from outside the optical axis. The defect inspection device according to any one of claims 1 to 3, further comprising a moving device for moving the imaging device relative to the light source such that the imaging device is emitted from the light source The optical axis of the light is offset and disposed at the offset position. A defect inspection device is a defect inspection device for an optical component, comprising: a light source disposed on one side of the optical component; and an imaging device disposed on the other side of the optical component; wherein the light source is The side of one side of the optical component illuminates the light obliquely; and the imaging device is offset from the optical axis of the light emitted from the light source at an offset position, and the position of the optical component illuminated by the light from the oblique direction Take a picture. A production system for an optical display device is a production system for an optical display device formed by bonding an optical component to an optical display component, comprising: a transport device for transporting the optical component; and a bonding device The optical component transported by the transport device is attached to the optical display component to produce the optical display device, and the defect inspection device according to any one of claims 1 to 5, The device is transported to the optical assembly of the bonding device for inspection of defects.