TWI441703B - Manufacturing system of optical component pasted material, manufacturing method and computer-readable recording medium - Google Patents

Manufacturing system of optical component pasted material, manufacturing method and computer-readable recording medium Download PDF

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Publication number
TWI441703B
TWI441703B TW101143432A TW101143432A TWI441703B TW I441703 B TWI441703 B TW I441703B TW 101143432 A TW101143432 A TW 101143432A TW 101143432 A TW101143432 A TW 101143432A TW I441703 B TWI441703 B TW I441703B
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TW
Taiwan
Prior art keywords
optical component
optical
bonding
component layer
region
Prior art date
Application number
TW101143432A
Other languages
Chinese (zh)
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TW201325793A (en
Inventor
Mikio Fujii
Tatsuya Tsuchioka
Original Assignee
Sumitomo Chemical Co
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Priority to JP2011253887 priority Critical
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW201325793A publication Critical patent/TW201325793A/en
Application granted granted Critical
Publication of TWI441703B publication Critical patent/TWI441703B/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors

Description

Manufacturing system, manufacturing method and recording medium of optical component bonding body
The present invention relates to a manufacturing system, a manufacturing method, and a recording medium of an optical component bonding body in which an optical component is bonded to an optical display component.
Conventionally, a production system of an optical display device such as a liquid crystal display is known. This production system is an optical component such as a polarizing plate that is bonded to a liquid crystal panel (optical display member), and cuts a laminate that conforms to the size of the display region of the liquid crystal panel from the long film. Then, the optical component is attached to the liquid crystal panel (for example, refer to Patent Document 1).
[Previous Technical Literature] [Patent Literature]
[Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-255132.
However, in the above-described conventional structure, in consideration of variations in the dimensions of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) with respect to the ply of the liquid crystal panel, a ply which is slightly larger than the display region is cut. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, and there is a problem that the size of the device is prevented from being reduced.
The present invention has been made in view of the above matters, and provides a side that can narrow the periphery of a display area. The frame portion is a manufacturing system, a manufacturing method, and a recording medium for an optical component bonding body for the purpose of expanding the display area and miniaturizing the device.
A first aspect of the present invention is a manufacturing system of an optical component bonding body, comprising: a first bonding device that bonds a first optical component layer larger than a display area of the optical display component to an optical display component a side surface; and a cutting device, the first bonding device is attached to the first region of the first optical component layer region facing the display region of the optical display component, and the first optical component layer The second region of the outer region of the first region is severed.
However, the "first region (opposing portion with the display region)" in the above-described configuration means an area which is larger than the display area and which is smaller than the outer shape of the optical display member, and is an area which avoids a functional portion such as an electronic component mounting portion. . That is, the above structure includes a case where the remaining portion is cut by laser along the outer periphery of the optical display member.
In a first aspect of the invention, the cutting device is capable of laser cutting the first optical component layer.
In a first aspect of the invention, the cutting device is capable of laser cutting the first optical component layer using a carbon dioxide (CO 2 ) laser cutter.
In a first aspect of the present invention, the cutting device can cut a first optical component layer corresponding to the size of the display area from the first optical component layer, thereby cutting the optical display component and the first The optical component of the optical component layer is bonded to the body.
In a first aspect of the invention, the first bonding device can be the first region that is larger than the display area and smaller than the outer shape of the optical display member.
In a first aspect of the invention, the first bonding device can engage the lower side of the first optical component layer with the upper side of the optical display component.
In a first aspect of the invention, the imaging device may be further provided to capture the optical display member to detect the outer periphery of the display area of the optical display member.
In a first aspect of the invention, the cutting device is capable of cutting the first optical component layer along an outer circumference of a display region of the optical display member detected by the imaging device.
In a first aspect of the present invention, the first transport device may be further provided, and the optical display member is transported in the order of the first bonding device and the cutting device.
In a first aspect of the invention, it may further comprise a second delivery device for transporting the first optical component layer to the first bonding device.
In a first aspect of the present invention, the second transport device may include a recovery unit for recovering the second region of the first optical component layer cut by the cutting device.
In a first aspect of the invention, the second bonding device can be further provided with a second optical component layer that is larger than the display area of the optical display component to the other side of the optical display component.
In a first aspect of the present invention, the cutting device can be used to cut the first region and the second region, and the second bonding device is attached to the second optical component layer region. The third region of the display region of the optical display member and the fourth region of the outer region of the third region of the second optical component layer are cut.
A second aspect of the present invention is a method of manufacturing an optical component bonding body, wherein a first optical component layer larger than a display area of the optical display component is attached to a side of one side of the optical display component; A first region of the first optical component layer region that is aligned with the first region of the first region of the first optical component layer is cut off from the first optical component layer region.
The third aspect of the present invention is a computer readable recording medium, which is stored and executed. a program for attaching a first optical component layer larger than a display area of the optical display component to a side of one side of the optical display component; and facing the first optical component layer region to be bonded A first region of the display region of the optical display member is disconnected from a second region of the outer region of the first region of the first optical component layer.
In the above apparatus for manufacturing an optical component bonding body, the cutting device preferably cuts the optical component layer by laser.
Moreover, the present invention provides a method of manufacturing an optical component bonding body in which an optical component is bonded to an optical display component, comprising: bonding an optical component layer larger than a display area of the optical display component to the optical display component as a step of bonding the layer; the portion of the optical component layer facing the display region is cut off from the remaining portion of the display region, and an optical component corresponding to the size of the display region is cut out from the optical component layer, thereby bonding from the optical component layer The layer cuts the step of splicing the optical component comprising a single optical component and the optical component overlapping the optical component.
According to the present invention, after the optical component layer larger than the display area is attached to the optical display member, the remaining portion of the optical component layer is cut. Therefore, an optical component corresponding to the size of the display area can be formed on the surface of the optical display portion. Thereby, the display area of the optical component can be provided with better precision, and the outer frame portion of the display area can be narrowed to achieve the purpose of expanding the display area and miniaturizing the machine.
Further, the optical display member is attached to the optical component layer which is larger than the display area, and even if the optical axis direction is changed by the position of the optical component layer, the optical display component can be aligned and bonded according to the optical axis direction. . Thereby, the accuracy with respect to the optical axis direction of the optical component of the optical display member can be improved, and the color and contrast of the optical display device can be improved.
5‧‧‧Roller conveyor
11‧‧‧First calibration device
12,12’‧‧‧First bonding device
12a, 12a’‧‧‧ delivery device
12b‧‧‧ pinch roller
12c‧‧‧Roller Keeping Department
12d‧‧‧Protective film recycling department
12e‧‧‧First Recycling Department
13,13'‧‧‧First cut-off device
14‧‧‧Second calibration device
15‧‧‧Second laminating device
15a‧‧‧Conveyor
15b‧‧‧ pinch roller
15c‧‧‧Roller Keeping Department
15d‧‧‧Second Recycling Department
16‧‧‧Second cutting device
C, 16a, 19a‧‧‧ camera
17,17'‧‧‧ third calibration device
18,18’‧‧‧ Third bonding device
18a‧‧‧Transportation device
18b‧‧‧ pinch roller
18c‧‧‧Roller Keeping Department
18d‧‧‧ Third Recycling Department
19‧‧‧ Third cutting device
20‧‧‧Control device
F1‧‧‧First optical component layer
F1S‧‧‧ layer
F11‧‧‧First optical component
F12‧‧‧Second optical component
F13‧‧‧ Third optical component
F2‧‧‧Second optical component layer
F3‧‧‧ third optical component layer
F21‧‧‧ first bonding layer
F22‧‧‧Second bonding layer
F23‧‧‧ third bonding layer
FX‧‧‧ optical component layer
G‧‧‧Border Department
R1‧‧‧First roll drum
R2‧‧‧second roll drum
R3‧‧‧ third roll
T‧‧‧ cut end
P‧‧‧ LCD panel
P1‧‧‧ first substrate
P2‧‧‧second substrate
P3‧‧‧ liquid crystal layer
P4‧‧‧ display area
P5‧‧‧Electronic Component Installation Department
P11‧‧‧First single-sided fitting panel
P12‧‧‧Second single-sided fitting panel
P13‧‧‧ double-sided fitting panel
Pf‧‧‧protective film
Starting point of pt1‧‧
End point of pt2‧‧
PX‧‧‧Optical display components
Fig. 1 is a schematic configuration diagram of a film bonding system of an optical display device in an embodiment of the present invention.
Fig. 2 is a perspective view showing the periphery of a second bonding apparatus of the above film bonding system.
Fig. 3 is a perspective view showing an optical display member in which the optical axis direction of the optical component layer of the film bonding system is bonded thereto.
Figure 4 is a cross-sectional view of the first bonding layer in the above film bonding system.
Fig. 5 is a cross-sectional view showing a second bonding layer in the second cutting device of the film bonding system.
Fig. 6 is a plan view showing a third bonding layer in the third cutting device of the above film bonding system.
Figure 7 is a cross-sectional view taken along line A-A of Figure 6.
Figure 8 is a cross-sectional view of the double-sided bonding panel through the above film bonding system.
Fig. 9 is a cross-sectional view showing the laser cut end of the optical component layer which has been bonded to the liquid crystal panel.
Figure 10 is a cross-sectional view showing the laser cut end of the optical component layer unit.
Fig. 11 is a schematic structural view showing a modification of the periphery of the first bonding apparatus of the above film bonding system.
Fig. 12 is a schematic structural view showing a modification of the periphery of the third bonding apparatus of the above film bonding system.
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a film bonding system including a manufacturing apparatus of an optical component bonding body will be described.
Fig. 1 is a view showing a schematic configuration of a film bonding system 1 of the present embodiment. In the film bonding system 1 , a film-shaped optical component such as a polarizing film, a retardation film, or a brightness increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic EL panel. The film bonding system manufactures an optical component bonding body including the optical display member and the optical component. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. Each part of the film bonding system 1 is transmitted as an electronic control The control device 20 of the device performs overall control.
The film bonding system 1 transports the liquid crystal panel P from the start position to the final position of the bonding step, for example, using a driving type roller conveyor 5, and sequentially applies specific processing to the liquid crystal panel P. The liquid crystal panel P is conveyed on the roller conveyor 5 with its front/reverse surface in a horizontal state.
However, the left side of the paper surface of the first drawing shows the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the upstream side of the panel transport). The right side of the paper surface of Fig. 1 shows the downstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the downstream side of the panel transport).
The description will be made with reference to Figs. 6 to 8. However, in the seventh and eighth figures, the upper side of the paper surface of the liquid crystal panel P is the display side, and the lower side of the paper surface is the backlight side. The plan view of the liquid crystal panel P is rectangular (refer to Fig. 6). A display region P4 having a shape along the outer periphery is formed from the inner periphery of the liquid crystal panel P at a certain width from the outer periphery (refer to FIG. 6). When the panel of the second calibration device 14 is transported to the upstream side as will be described later, the short side of the display region P4 is caused to convey the liquid crystal panel P approximately in the direction of the transport direction. When the panel of the second calibration device 14 conveys the downstream side, the long side of the display region P4 is caused to convey the liquid crystal panel P approximately in the direction of the conveyance direction.
The first optical component F11 and the second optical component F12 cut by the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3, which are formed on the front/back side of the liquid crystal panel P, The third optical component F13 is appropriately attached to the liquid crystal panel P (refer to FIG. 8). In the present embodiment, the first optical unit F11 and the third optical unit F13 which are polarizing films are bonded to each other on the backlight side and the display side of the liquid crystal panel P (refer to FIG. 8). On the side of the backlight side of the liquid crystal panel P, a second optical component F12 as a luminance increasing film which is overlapped with the first optical component F11 is further bonded (refer to FIG. 8).
As shown in FIG. 1, the film bonding system 1 includes a first calibration device 11 and a first The bonding device 12, the first cutting device 13, and the second calibration device 14.
The first calibration device 11 transports the liquid crystal panel P from the upstream step to the upstream side of the panel conveyance of the roller conveyor 5 while performing calibration of the liquid crystal panel P. The first bonding device 12 is disposed on the downstream side of the panel conveyance of the first calibration device 11. The first cutting device 13 is disposed adjacent to the first bonding device 12. The second calibration device 14 is disposed on the downstream side of the panel transport of the first bonding device 12 and the first cutting device 13.
Further, the film bonding system 1 includes a second bonding device 15, a second cutting device 16, a third calibration device 17, a third bonding device 18, and a third cutting device 19.
The second bonding device 15 is disposed on the downstream side of the panel conveyance of the second calibration device 14. The second cutting device 16 is disposed adjacent to the second bonding device 15. The third calibration device 17 is provided on the downstream side of the panel transport of the second bonding device 15 and the second cutting device 16. The third bonding device 18 is disposed on the downstream side of the panel conveyance of the third calibration device 17. The third cutting device 19 is disposed adjacent to the third bonding device 18.
The first calibration device 11 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. Further, the first calibration device 11 has a pair of cameras C that capture the end portions of the upstream and downstream sides of the panel transport of the liquid crystal panel P (refer to FIG. 3). The photographic data of the camera C is transmitted to the control device 20.
The control device 20 activates the first calibration device 11 based on the photographic data and the inspection data in the optical axis direction stored in advance. However, the second calibration device 14 and the third calibration device 17 described later also have the camera C, and the photographic data of the camera C is used for calibration.
The first calibration device 11 is controlled by the control device 20 to calibrate the liquid crystal panel P with respect to the first bonding device 12. At this time, the horizontal direction of the liquid crystal panel P in the vertical conveying direction is determined. The position on the rotation direction of the vertical axis (hereinafter referred to as the rotation direction) (hereinafter referred to as the member width direction). In this state, the liquid crystal panel P is guided to the bonding position of the first bonding apparatus 12.
The first bonding apparatus 12 is attached to the lower side surface (backlight side) of the liquid crystal panel P that is transported along the upper side of the long first optical component layer F1 that is guided to the bonding position. The first bonding apparatus 12 is provided with a conveying device 12a and a nip roller 12b.
The conveying device 12a winds up the first optical component layer F1 from the first roll drum R1 around which the first optical component layer F1 is wound, and conveys the first optical component layer F1 in the longitudinal direction thereof. The nip roller 12b bonds the lower side surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the upper side surface of the first optical component layer F1 conveyed by the conveyance device 12a.
The conveying device 12a includes a drum holding portion 12c and a protective film collecting portion 12d. The roller holding portion 12c supports the first roll drum R1 around which the first optical component layer F1 is wound, and winds up the first optical component layer F1 in the longitudinal direction thereof. The protective film collecting portion 12d collects the protective film pf which is superposed on the lower side surface of the first optical component layer F1 and is unwound with the first optical component layer F1, and is collected on the downstream side of the panel transport of the first bonding apparatus 12.
The nip roller 12b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the first bonding device 12. The liquid crystal panel P and the first optical component layer F1 are superposed into the gap. The liquid crystal panel P and the first optical component layer F1 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. Thereby, the first bonding layer F21 in which a plurality of liquid crystal panels P are continuously bonded to the upper surface of the elongated first optical component layer F1 at a predetermined interval can be formed.
The description will be made with reference to Fig. 4 and Fig. 5 together. However, Figure 4 and Figure 5 In the figure, the upper side of the paper surface of the liquid crystal panel P is the backlight side, and the lower side of the paper surface is the display side. The first cutting device 13 is located on the downstream side of the panel conveyance of the protective film collecting portion 12d. The first cutting device 13 is cut at a designated portion of the first optical component layer F1 (between the liquid crystal panels P juxtaposed in the transport direction), and the entire width is cut along the width direction of the member. Thereby, the first cutting device 13 cuts the first optical component layer F1 of the first bonding layer F21 to form a layer F1S larger than the display region P4 (more in the present embodiment than the liquid crystal panel P). . However, the first cutting device 13 may use a cutting blade or a laser cutting machine. Through the cutting step, the first single-sided bonding panel P11 having the layer F1S larger than the display region P4 is bonded to the lower surface of the liquid crystal panel P.
This will be described with reference to Fig. 1. The second calibration device 14 is, for example, capable of gripping the first single-sided conforming panel P11 on the roller conveyor 5 and rotating 90° about the vertical axis. Thereby, the first single-sided bonding panel P11 conveyed in a direction slightly parallel to the short side of the display region P4 is conveyed in a direction slightly parallel to the long side of the display region P4. However, the above-described turning step is a case where the optical axis direction of the other optical component layers bonded to the liquid crystal panel P is disposed at a right angle with respect to the optical axis direction of the first optical component layer F1.
The second calibration device 14 performs the same calibration as the first calibration device 11. That is, the second calibration device 14 determines the component width direction of the first single-sided bonding panel P11 with respect to the second bonding device 15 based on the inspection data stored in the optical axis direction of the control device 20 and the imaging data of the camera C. And the position of the direction of rotation. In this state, the first single-sided bonding panel P11 is guided to the bonding position of the second bonding apparatus 15.
The second bonding device 15 is directed to the upper side of the elongated second optical component layer F2 that is guided to the bonding position, and the first single-sided bonding panel P11 is transported along the upper side thereof (the backlight of the liquid crystal panel P) Side) for fitting. The second bonding apparatus 15 is provided with a conveying device 15a and a nip roller 15b.
The conveying device 15a is to take the second light from the second roll drum R2 around which the second optical component layer F2 is wound. The component layer F2 is rolled out and transports the second optical component layer F2 along its longitudinal direction. The nip roller 15b bonds the lower side surface of the first single-sided bonding panel P11 conveyed by the roller conveyor 5 to the upper side surface of the second optical component layer F2 conveyed by the conveying device 15a.
The conveying device 15a includes a drum holding portion 15c and a second collecting portion 15d. The roller holding portion 15c supports the second roll drum R2 around which the second optical component layer F2 is wound, and winds up the second optical component layer F2 in the longitudinal direction thereof. The second recovery portion 15d collects the remaining portion of the second optical module layer F2 after passing through the second cutting device 16 on the downstream side of the panel of the nip roller 15b.
The nip roller 15b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the second bonding device 15. The first single-sided bonding panel P11 and the second optical component layer F2 are superposed and introduced into the gap. The first single-sided bonding panel P11 and the second optical component layer F2 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. Thereby, the second bonding layer F22 in which the plurality of first single-sided bonding panels P11 are continuously bonded to the upper surface of the long second optical component layer F2 at a predetermined interval can be formed.
The description will be made with reference to Fig. 2 and Fig. 5 together. The second cutting device 16 is located on the downstream side of the panel conveyance of the nip roller 15b. The second cutting device 16 simultaneously cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 of the first single-sided bonding panel P11 attached to the upper side thereof. The second cutting device 16 is, for example, a carbon dioxide (CO 2 ) laser cutting machine. The second cutting device 16 cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 without interruption along the outer periphery of the display region P4 (in the present embodiment, along the outer periphery of the liquid crystal panel P). After bonding each optical component layer (the first optical component layer F1 and the second optical component layer F2) to the liquid crystal panel P and then cutting together, the optical component layers (the first optical component layer F1 and the second optical component) can be improved. The accuracy of the optical axis direction of layer F2). Moreover, the deviation of the optical axis direction between each optical component layer (the first optical component layer F1 and the second optical component layer F2) can be eliminated. Moreover, the cutting step in the first cutting device 13 can be simplified.
The second single-sided bonding panel P12 in which the first optical component F11 and the second optical component F12 are bonded to the lower surface of the liquid crystal panel P is formed by the cutting step of the second cutting device 16 (refer to FIG. 7). . At this time, each of the optical component layers (the first optical component) in which the second single-sided bonding panel P12 can be removed from the opposite portions (the first optical component F11 and the second optical component F12) of the display region P4 The remaining portions of the layer F1 and the second optical component layer F2) are separated from each other. The remaining portion of the second optical component layer F2 may be in the form of a plurality of ladders connected. The remaining portion is taken up to the second recovery portion 15d together with the remaining portion of the first optical component layer F1.
Here, the "opposing portion with the display region P4" refers to a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region that avoids a functional portion such as an electronic component mounting portion. In the present embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portions are cut off by laser along the outer periphery of the liquid crystal panel P at three sides except the functional portion, which is equivalent to the function. On one side of the portion, the remaining portion is cut by laser from a position outside the outer periphery of the liquid crystal panel P toward the display region P4 side.
This will be described with reference to Fig. 1. The third calibration device 17 reverses the front/reverse side of the second single-sided bonding panel P12 on the display side of the liquid crystal panel P toward the upper side such that the backlight side of the liquid crystal panel P faces the upper side. The third calibration device 17 performs the same calibration of the first calibration device 11 and the second calibration device 14. That is, the third calibration device 17 determines the component width direction of the second single-sided bonding panel P12 with respect to the third bonding device 18 based on the optical axis direction inspection data stored in the control device 20 and the imaging data of the camera C. And the position in the direction of rotation. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding device 18.
The third bonding device 18 is for the upper side of the elongated third optical component layer F3 that is guided to the bonding position, and the second single-sided bonding panel P12 that is transported along the upper side thereof is attached to the lower side of the panel P12 (the liquid crystal panel P Display side) for bonding. The third bonding apparatus 18 is provided with a conveying device 18a and a nip roller 18b.
The conveying device 18a winds up the third optical component layer F3 from the third roll drum R3 around which the third optical component layer F3 is wound, and conveys the third optical component layer F3 in the longitudinal direction thereof. The nip roller 18b bonds the lower side surface of the second single-sided bonding panel P12 conveyed by the roller conveyor 5 to the upper side surface of the third optical component layer F3 conveyed by the conveying device 18a.
The conveying device 18a includes a drum holding portion 18c and a third collecting portion 18d. The roller holding portion 18c supports the third roll drum R3 around which the third optical component layer F3 is wound, and winds up the third optical component layer F3 in the longitudinal direction thereof. The third recovery portion 18d collects the remaining portion of the third optical module layer F3 after passing through the third cutting device 19 on the downstream side of the panel conveyance roller 18b.
The nip roller 18b has a pair of bonding rollers arranged parallel to each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18. The second single-sided bonding panel P12 and the third optical component layer F3 are superposed into the gap. The second single-sided bonding panel P12 and the third optical component layer F3 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. Thereby, the third bonding layer F23 in which the plurality of second single-sided bonding panels P12 are continuously bonded to the upper surface of the elongated third optical component layer F3 at a predetermined interval can be formed.
The third cutting device 19 is located on the downstream side of the panel conveyance of the nip roller 18b for cutting the third optical component layer F3. The third cutting device 19 has the same laser processing machine as the second cutting device 16, and cuts the third optical component layer F3 continuously along the outer periphery of the display region P4 (for example, along the outer periphery of the liquid crystal panel P). .
The double-sided bonding panel P13 in which the third optical component F13 is bonded to the lower surface of the second single-sided bonding panel P12 is formed by the cutting step of the third cutting device 19 (refer to FIG. 8). At this time, the double-sided bonding panel P13 can be separated from the remaining portion of the third optical component layer F3 which remains in a frame shape after the opposite portion (third optical component F13) of the cut-off display region P4. Like the rest of the second optical component layer F2, the remaining portion of the third optical component layer F3 may be in the form of a plurality of ladders (refer to Fig. 2). This remaining portion is taken up to the third recovery portion 18d.
The double-sided bonding panel P13 passes through the defect inspection device not shown in the drawing to check whether there is a defect (poor bonding or the like), and then conveys it to the downstream step for other processing.
Here, the general elongated optical film (corresponding to the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) is a resin film which is dyed by a dichroic dye and which is extended toward one axis. In the manufacturing, the optical axis direction of the optical film is substantially the same as the extending direction of the resin film. However, regarding the optical axis of the optical film, the entire optical film is not the same, and there is a slight difference in the width direction of the optical film.
Therefore, in the case where a plurality of optical display members are to be bonded to the optical film in the width direction thereof, the alignment of the optical display member should preferably be performed in accordance with the optical axis direction of the optical film.
This is effective for suppressing the optical axis deviation of the optical display device unit, improving the color and contrast.
The optical film as a polarizing film is dyed with, for example, iodine or a dichroic dye in order to block light other than the light that vibrates in one direction. However, a peeling film or a protective film may be further laminated on the optical film.
The inspection device for inspecting the optical axis direction of the optical film is provided with a light source and an analyzer. The light source is disposed on one side of the front/back side of the optical film. The analyzer is placed on the other side of the front/back of the optical film. The analyzer receives the light that is irradiated from the light source and transmitted through the optical film to detect the light. The intensity by which the optical axis of the optical film is detected. The analyzer can be moved, for example, in the width direction of the optical film, and the optical axis can be inspected at any position in the width direction of the optical film.
In the case of the present embodiment, the optical axis direction inspection data system and each optical component of each optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) obtained by the inspection apparatus The positions in the longitudinal direction and the width direction of the layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) are stored in the memory of the control device 20 in a data-separated manner. After the inspection, each of the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) is taken up to form each of the roll rolls (the first roll roll R1, the second roll) Roller drum R2 and third roll drum R3). Hereinafter, each of the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) may be collectively referred to as an optical component layer FX, and is bonded to each optical component layer (first optical component layer F1) The liquid crystal panel P, the first single-sided bonding panel P11, and the second single-sided bonding panel P12 of the second optical component layer F2 and the third optical component layer F3) may be collectively referred to as an optical display component PX.
Here, the polarizing film constituting the optical component layer FX is formed, for example, by a PVA film dyed with a dichroic dye and extended toward one axis. The problem that the thickness of the PVA film is uneven or the dyeing of the dichroic dye is uneven during the stretching of the polarizing film causes a problem that the optical axis direction of the optical component layer FX in the width direction and the width direction are different.
In this embodiment, the inspection data is distributed in accordance with the optical axis plane stored in each of the optical component layers FX of the control device 20, and the optical display member PX bonded thereto is calibrated. Next, the optical display member PX is bonded to the optical component layer FX.
Specifically, in the plane of the portion where the optical display member PX is bonded to the optical component layer FX, for example, the optical axis having the largest angle and the smallest optical axis with respect to the designated reference axis (longitudinal axis, etc.) are found. Then, the axis obtained by halving the angle generated by each optical axis is taken as the average optical axis of the portion The alignment of the optical display unit PX is performed based on the axis.
Thereby, even when the optical display member PX is bonded to the position different from the width direction of the optical component layer FX, the optical axis direction deviation of the optical component layer FX with respect to the reference position of the optical display component PX can be suppressed. Also, the optical axis tolerance is almost 0° (allowable tolerance is ±0.25°).
However, the optical axis direction can also be detected while the optical component layer FX is being unwound, and the optical display component PX can be calibrated based on the detected data. Further, the above various calibration methods are not limited to the case where the optical axis direction of the optical component layer FX is 0° and 90°, and may be applied to any angle.
Fig. 3 is a view showing an example in which three optical display members PX are juxtaposed in the width direction of the relatively wide optical component layer FX. However, the present invention is not limited thereto, and two or less or four or more optical display members PX may be laminated in parallel in the width direction of the optical module layer FX. Further, a plurality of relatively narrow optical component layers FX may be arranged in the width direction, and each of the optical display members PX may be attached.
This will be explained with reference to Fig. 4. The liquid crystal panel P includes a first substrate P1, a second substrate P2, and a liquid crystal layer P3.
The first substrate P1 is a rectangular substrate made of, for example, a TFT substrate. The second substrate P2 is a rectangular substrate that is disposed on the first substrate P1. The liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. However, for convenience of illustration, the cross-sectional lines of the respective layers in the cross-sectional view are omitted.
Description will be made with reference to Fig. 6 and Fig. 7. The three sides of the outer periphery of the first substrate P1 are disposed along three sides corresponding to the second substrate P2, and one of the remaining sides of the outer periphery extends to the outer side of one side of the second substrate P2. Thereby, an electronic component mounting portion P5 that extends to the outside of the second substrate P2 is provided at one side of the first substrate P1.
Description will be made with reference to Fig. 5 and Fig. 7. The second cutting device 16 is a camera 16a The detecting means detects the outer periphery of the display region P4, and cuts the first optical component layer F1 and the second optical component layer F2 along the outer periphery of the display region P4 or the like. Further, the third cutting device 19 detects the outer periphery of the display region P4 by a detecting tool such as the camera 19a, and cuts the third optical component layer F3 along the outer periphery of the display region P4 or the like. A frame portion G having a specific width for providing a sealant or the like for joining the first substrate P1 and the second substrate P2 is provided on the outer side of the display region P4. The laser cutting is performed by the second cutting device 16 and the third cutting device 19 within the width of the frame portion G.
As shown in Fig. 10, when the optical component layer FX made of resin is subjected to laser cutting alone, the cut end t may be expanded or wavy due to thermal deformation. Therefore, in the case where the laser-cut optical component layer FX is bonded to the optical display member PX, the optical component layer FX is liable to cause a problem of poor adhesion such as air incorporation or deformation.
On the other hand, in the present embodiment, as shown in FIG. 9, after the optical component layer FX is bonded to the liquid crystal panel P, the optical component layer FX is cut by laser. In the present embodiment, the cut end t of the optical component layer FX is supported by the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical component layer FX does not swell or wavy, and after the liquid crystal panel P is bonded, the bonding failure does not occur.
The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in the present embodiment, the width of the frame portion G can be made narrower than in the case where the optical module layer FX is cut by the dicing blade. Moreover, the miniaturization of the liquid crystal panel P and/or the enlargement of the display area P4 can be achieved. This can be applied to a high-performance mobile device that needs to enlarge a display screen under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.
Further, in the case where the optical component layer FX is integrated into the display region P4 of the liquid crystal panel P and then cut into the liquid crystal panel P, the respective layers of the laminate and the liquid crystal panel P are used. Inch tolerances, as well as dimensional tolerances for these relative fit positions, are superimposed. Therefore, it is difficult to reduce the width of the frame portion G of the liquid crystal panel P. In other words, it is difficult to enlarge the display area.
On the other hand, in the case where the optical component layer FX is bonded to the liquid crystal panel P and the cutting is performed in accordance with the display region P4, only the vibration tolerance of the cutting line is considered. Therefore, the tolerance (±0.1 mm or less) of the width of the frame portion G can be reduced. This feature also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).
In addition, the optical component layer FX is cut by a non-profit laser, and no force is applied to the liquid crystal panel P during the cutting, so that the edge of the substrate of the liquid crystal panel P is less likely to be cracked or broken, and the thermal cycle is improved. Durability. Similarly, since the liquid crystal panel P is not touched, damage to the electronic component mounting portion P5 is also small.
However, in the case where the optical component layer FX is cut by laser, the energy per unit length of the laser irradiation is preferably determined in consideration of the thickness structure of the liquid crystal panel P or the optical component layer FX.
In the present embodiment, in the case where the optical component layer FX is cut by laser, the energy per unit length is preferably laser-irradiated in the range of 0.01 to 0.11 (J/mm). In the case of laser irradiation, when the energy per unit length is excessively large, the optical component layer FX is damaged by the laser, and the optical component layer FX is damaged. However, since the energy per unit length is laser-irradiated in the range of 0.01 to 0.11 (J/mm), the optical component layer FX can be prevented from being damaged.
As shown in FIG. 6, when the optical component layer FX (the third optical component layer F3 in FIG. 6) is cut by laser, for example, the extension of one of the long sides of the display region P4 is set to laser cutting. Starting point pt1. Next, the cutting operation of the long side is started from the starting point pt1. The end point pt2 of the laser cutting is designed to reach the position on the extension of the short side of the starting side of the display area P4 after the laser surrounds the display area P4 one turn. The starting point pt1 and the end point pt2 are designed so that the rest of the optical component layer FX will still The remaining joint portion remains, and can withstand the tension when the optical component layer FX is taken up.
As described above, in the manufacturing system of the optical component bonding body in the above embodiment, the manufacturing of the second single-sided bonding panel P12 in which the optical component (the first optical component F11 and the second optical component F12) is bonded to the liquid crystal panel P is manufactured. The system includes: a bonding device (the first bonding device 12 and the second bonding device 15), which is an optical component layer (the first optical component layer F1 and the display region P4 of the liquid crystal panel P) The second optical component layer F2) is bonded to the surface of one side of the liquid crystal panel P (optical display member); and the second cutting device 16 is a bonding device (the first bonding device 12 and the second bonding device) 15) a first region facing the display region P4 of the liquid crystal panel P in the region of the bonded optical component layer (the first optical component layer F1 and the second optical component layer F2), and the optical component layer (first optical The second region of the outer region of the first region of the component layer F1 and the second optical component layer F2) is cut.
Similarly, in the manufacturing system of the optical component bonding body in the above-described embodiment, in the manufacturing system of the double-sided bonding panel P13 in which the third optical component F13 is bonded to the second single-sided bonding panel P12, the third manufacturing system includes: The bonding device 18 is configured to attach a third optical component layer F3 larger than the display area P4 of the liquid crystal panel P to the optical component of the second single-sided bonding panel P12 (the first optical component F11 and the second optical component) The opposite side of the module F12) is referred to as a third bonding layer F23; and the third cutting device 19 is formed by cutting the opposite portion of the display region P4 of the third optical component layer F3 with the remaining portion thereof Breaking, the third optical component F13 corresponding to the size of the display area P4 is cut out from the third optical component layer F3, thereby cutting out a single optical component panel P and overlapping optical components thereof from the third bonding layer F23. F13 double-sided fitting panel P13.
In the present embodiment, as described above, the third cutting device 19 can laser-cut the optical component layer (the first optical component layer F1 and the second optical component layer F2).
Further, in the present embodiment, as described above, the third cutting device 19 can cut the first optical component layer by laser using a carbon dioxide (CO 2 ) laser cutting machine.
Further, in the present embodiment, as described above, the third cutting device 19 can cut the optical size corresponding to the display region P4 from the optical component layer (the first optical component layer F1 and the second optical component layer F2). a component layer (a first optical component layer F1 and a second optical component layer F2) for cutting a second sticker including the liquid crystal panel P and the optical component layer (the first optical component layer F1 and the second optical component layer F2) Laminated layer F22 (optical component bonding body).
Further, in the present embodiment, as described above, the bonding apparatus (the first bonding apparatus 12 and the second bonding apparatus 15) may be larger than the display area and smaller than the outer shape of the liquid crystal panel P. An area.
Further, in the present embodiment, as described above, the bonding apparatus (the first bonding apparatus 12 and the second bonding apparatus 15) can apply the optical component layer (the first optical component layer F1 and the second optical component layer F2) The lower side is joined to the upper side of the liquid crystal panel P.
Further, in the present embodiment, as described above, the camera C (photographing device) that images the liquid crystal panel P to detect the outer periphery of the display region P4 of the liquid crystal panel P can be further provided.
Further, in the present embodiment, as described above, the third cutting device 19 can separate the optical component layer (the first optical component layer F1 and the outer peripheral edge of the display region P4 of the liquid crystal panel P detected by the camera C. The second optical component layer F2) is cut.
Further, in the present embodiment, as described above, the liquid crystal panel P may be further conveyed in the order of the bonding apparatus (the first bonding apparatus 12 and the second bonding apparatus 15) and the third cutting apparatus 19. Roller conveyor 5 (first conveyor).
Further, in the present embodiment, as described above, the optical component layer (the first optical component layer F1 and the second optical component layer F2) may be further transported to the bonding apparatus (the first bonding apparatus 12 and the second The conveying device 12a (second conveying device) of the bonding device 15).
Further, in the present embodiment, as described above, the transport device 12a may include the second optical component layer (the first optical component layer F1 and the second optical component layer F2) that is cut by the third cutting device 19. The second recovery unit 15d (recycling unit) that is recovered in the area.
Further, in the present embodiment, as described above, it is possible to further provide bonding of the optical component layer (third optical component layer F3) larger than the display region of the liquid crystal panel P to the other side surface of the liquid crystal panel P. Device (second bonding device 18).
Further, in the present embodiment, as described above, the third cutting device 19 can bond the second bonding device 18 to the third optical component layer while cutting the first region and the second region. In the F3 region, the third region facing the display region P4 of the liquid crystal panel P and the fourth region of the third region outside the third optical component layer F3 are cut off.
In this configuration, after the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) larger than the display region P4 are attached to the liquid crystal panel P, the optical component layer is bonded. The remaining portions (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) are cut. Thereby, optical members (the first optical component F11, the second optical component F12, and the third optical component F13) corresponding to the size of the display region P4 can be formed on the surface of the liquid crystal panel P. Thereby, the optical components (the first optical component F11, the second optical component F12, and the third optical component F13) can be provided with better precision in the display area P4, and the outer frame portion G of the display region P4 can be narrowed to Achieve the expansion of the display area and the miniaturization of the machine.
Further, the liquid crystal panel P is bonded to the optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) which is larger than the display region P4. Therefore, even in the case of the optical axis direction corresponding to the position change of the optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3), the liquid crystal panel P can be calibrated according to the optical axis direction. And fit it together. With this, you can mention The accuracy of the optical axis direction of the optical components (the first optical component F11, the second optical component F12, and the third optical component F13) of the liquid crystal panel P can be improved to improve the color and contrast of the optical display device.
Further, the optical component bonding body manufacturing apparatus uses the second cutting device 16 and the third cutting device 19 to cut the optical component layer by laser (first optical component layer F1, second optical component layer F2) And a third optical component layer F3). Therefore, compared with the case where the optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) is cut by the sharp edge, no force is applied to the liquid crystal panel P, and cracks or cracks are less likely to occur. The cracking allows the liquid crystal panel P to obtain stable durability. Moreover, compared with the case where the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) before the bonding is separately cut by the laser, the poor bonding can be prevented. The situation happened.
Here, in the manufacturing method of the optical component bonding body in the above embodiment, the optical component layer (the first optical component layer F1 and the second optical component layer F2) which is larger than the display region P4 of the liquid crystal panel P is bonded to One side of the liquid crystal panel P (optical display member) faces the display region P4 of the liquid crystal panel P in the region of the bonded optical component layer (the first optical component layer F1 and the second optical component layer F2) The first region is cut off from the second region of the outer region of the first region of the optical component layer (the first optical component layer F1 and the second optical component layer F2).
Similarly, in the manufacturing method of the optical component bonding body of the above embodiment, the third optical component layer F3 larger than the display region P4 of the second single-sided bonding panel P12 is bonded to the second single-sided surface. a step of bonding the opposite side of the optical component (the first optical component F11 and the second optical component F12) of the panel P12 as a third bonding layer F23; and displaying the display area P4 of the third optical component layer F3 The opposing portion is cut off from the remaining portion of the outer portion thereof, and the third optical component F13 corresponding to the size of the display region P4 is cut from the third optical component layer F3, thereby cutting out the single bonding layer F23 to include a single one. The liquid crystal panel P and the double-sided bonding panel P13 of the third optical component F13 overlapping therewith.
However, Fig. 11 shows a modification of the film bonding system 1. Compared with the structure of FIG. 1, this is different from the first bonding device 12', and the first cutting device 13' is replaced by the first cutting device 13'. . In the other portions, the same components as those in the above-described embodiments are denoted by the same reference numerals, and their detailed description is omitted.
The first bonding device 12' is provided with a conveying device 12a' in place of the conveying device 12a. The conveying device 12a' has a first collecting portion 12e in addition to the roller holding portion 12c and the protective film collecting portion 12d as compared with the conveying device 12a. The first collecting portion 12e winds up the remaining portion of the first optical component layer F1 which is cut by the first cutting device 13' and which is cut into a ladder shape.
The first cutting device 13' is located on the downstream side of the panel conveyance of the protective film collecting portion 12d, and on the upstream side of the panel conveying of the first collecting portion 12e. The first cutting device 13' should cut a larger layer from the first optical component layer F1 than the display region P4 to cut the first optical component layer F1. The first cutting device 13' has the same laser processing machine as the second cutting device 16 and the third cutting device 19. The first cutting device 13' cuts the first optical component layer F1 uninterrupted along a predetermined side line outside the display region P4.
The first single-sided bonding panel P11 of the first optical component layer F1 which is formed on the lower side of the liquid crystal panel P and which is larger than the display region P4 is formed by the cutting step of the first cutting device 13'. '. At this time, the first single-sided bonding panel P11' is separated from the remaining portion of the first optical component layer F1 which is left in a ladder shape after cutting, and the remaining portion of the first optical component layer F1 is taken up to the first recovery portion 12e.
Fig. 12 shows another modification of the film bonding system 1. This is in contrast to the configuration of Fig. 1 in that the third calibration device 17' and the third bonding device 18' are provided instead of the third calibration device 17 and the third bonding device 18. In the other portions, the same components as those in the above-described embodiments are denoted by the same reference numerals, and their detailed description is omitted.
Compared with the third calibration device 17, the third calibration device 17' has a simpler structure, has no panel forward/reverse inversion function, and has only the same calibration function as the first calibration device 11 and the second calibration device 14. . That is, the third calibration device 17' determines the components of the second single-sided bonding panel P12 with respect to the third bonding device 18' based on the optical axis direction inspection data stored in the control device 20 and the photographic data of the camera C. Position in the width direction and the direction of rotation. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding device 18'.
Compared with the third bonding device 18, the third bonding device 18' is a second single-sided sticker that is conveyed along the lower side of the elongated third optical component layer F3 that is guided to the bonding position. The upper side of the panel P12 (the display side of the liquid crystal panel P) is bonded. The third bonding device 18' has a structure in which the conveying device 18a and the nip roller 18b are turned upside down. Thereby, the bonding surface of the third optical component layer F3 is bonded downward, and adhesion of foreign matter such as scratches or dust on the bonding surface can be suppressed.
However, the present invention is not limited to the above-described embodiments and modifications. For example, like the third bonding device 18', the first bonding device 12 and the second bonding device 15 may be turned upside down. Further, each of the above-described bonding devices that are upside down may be appropriately combined with the first bonding device 12' and the first cutting device 13'.
Further, in addition to the structure in which the optical display member is bonded to the optical component layer which is wound out from the take-up reel, a structure in which a plurality of optical display members are appropriately bonded to the large-sized optical component layer may be employed.
The configurations of the above-described embodiments and modifications are merely examples of the invention, and various changes are possible without departing from the scope of the invention.
The control device 20 described above has a computer system inside. Next, the operation of each of the above devices is stored in a computer-readable recording medium in the form of a program, and the read program is executed by the computer to perform the above processing. Here, the computer readable recording medium refers to a magnetic disk, a magneto-optical disk, a CD-ROM. DVD-ROM, semiconductor memory, etc. Alternatively, the computer program can be transmitted to the computer via the communication line, and the program can be executed by the computer that receives the data.
Moreover, the above program may be used to implement some of the aforementioned functions.
Furthermore, the aforementioned functions can be achieved by combining programs stored in a computer system, a so-called difference file (difference file).
The present invention is applicable to a manufacturing system, a manufacturing method, and a recording medium of an optical component bonding body which can reduce the frame portion around the display area and achieve the purpose of expanding the display area and miniaturizing the device.
5‧‧‧Roller conveyor
11‧‧‧First calibration device
12‧‧‧First bonding device
12a‧‧‧Transporting device
12b‧‧‧ pinch roller
12c‧‧‧Roller Keeping Department
12d‧‧‧Protective film recycling department
13‧‧‧First cutting device
14‧‧‧Second calibration device
15‧‧‧Second laminating device
15a‧‧‧Conveyor
15b‧‧‧ pinch roller
15c‧‧‧Roller Keeping Department
15d‧‧‧Second Recycling Department
16‧‧‧Second cutting device
17‧‧‧ Third calibration device
18‧‧‧ Third bonding device
18a‧‧‧Transportation device
18b‧‧‧ pinch roller
18c‧‧‧Roller Keeping Department
18d‧‧‧ Third Recycling Department
19‧‧‧ Third cutting device
20‧‧‧Control device
F1‧‧‧First optical component layer
F2‧‧‧Second optical component layer
F3‧‧‧ third optical component layer
F21‧‧‧ first bonding layer
F22‧‧‧Second bonding layer
F23‧‧‧ third bonding layer
R1‧‧‧First roll drum
R2‧‧‧second roll drum
R3‧‧‧ third roll
P‧‧‧ LCD panel
P11‧‧‧First single-sided fitting panel
P12‧‧‧Second single-sided fitting panel
P13‧‧‧ double-sided fitting panel
Pf‧‧‧protective film

Claims (15)

  1. A manufacturing system for an optical component bonding body, comprising: a first bonding device for bonding a first optical component layer larger than a display area of an optical display component to a side of one side of the optical display component; And photographing the optical display unit; and cutting the device, by cutting the first optical component layer according to the photographic data of the optical display component of the imaging device, bonding the first bonding device to the first optical component The first region of the layer region facing the display region of the optical display member and the second region of the region outside the first region of the first optical component layer are cut.
  2. The manufacturing system of the optical component bonding body according to claim 1, wherein the cutting device cuts the first optical component layer by laser.
  3. The manufacturing system of the optical component bonding body according to claim 2, wherein the cutting device cuts the first optical component layer by laser using a carbon dioxide (CO 2 ) laser cutting machine.
  4. The manufacturing system of the optical component bonding body according to claim 1, wherein the cutting device cuts the first optical component layer corresponding to the size of the display area from the first optical component layer, thereby cutting out the inclusion The optical display member and the optical component of the first optical component layer are bonded to each other.
  5. The manufacturing system of claim 1, wherein the first bonding device is the first region in a region larger than the display region and smaller than an outer shape of the optical display member.
  6. The manufacturing system of claim 1, wherein the first bonding device engages a lower side of the first optical component layer with an upper side of the optical display component.
  7. The manufacturing system of claim 1, wherein the photographing device photographs the optical display unit to detect an outer circumference of a display area of the optical display unit.
  8. The optical component bonding body manufacturing system according to claim 7, wherein the imaging device photographs the optical display component for each of the plurality of optical display components conveyed on the conveying line.
  9. The manufacturing system according to claim 1, further comprising a first conveying device that conveys the optical display member in the order of the first bonding device and the cutting device.
  10. The manufacturing system of claim 1, further comprising a second conveying device that conveys the first optical component layer to the first bonding device.
  11. The manufacturing system according to claim 10, wherein the second conveying device is provided with a collecting portion for recovering the second region of the first optical component layer cut by the cutting device.
  12. The manufacturing system of claim 1, further comprising a second bonding device for bonding a second optical component layer larger than a display area of the optical display component to another of the optical display component side.
  13. The manufacturing system of claim 12, wherein the cutting device is configured to bond the second bonding device to the second optical component layer while cutting the first region and the second region In the region, the third region facing the display region of the optical display member and the fourth region of the third region outside the second optical component layer are cut off.
  14. A manufacturing method of an optical component bonding body, comprising: a step of bonding a first optical component layer larger than a display area of an optical display component to a surface of one side of the optical display component; and a step of photographing the optical display component; And cutting the first optical component layer according to the photographic data of the optical display component, so as to bond the first region of the first optical component layer region facing the display region of the optical display component to the first region A step of cutting the second region of the outer region of the first region of the optical component layer.
  15. A computer-readable recording medium storing a program for performing an action of bonding a first optical component layer larger than a display area of an optical display component to a side of one side of the optical display component; Actuating the optical display member; and, according to the photographic data of the optical display member, cutting the first optical component layer to face the display region of the optical display component in the bonded first optical component layer region The first region is disconnected from the second region of the outer region of the first region of the first optical component layer.
TW101143432A 2011-11-21 2012-11-21 Manufacturing system of optical component pasted material, manufacturing method and computer-readable recording medium TWI441703B (en)

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