TWI600544B - Optical display device production system - Google Patents

Description

Optical display device production system

The present invention relates to a production system for an optical display device.

The present invention claims its priority based on Japanese Patent Application No. 2013-037565, filed on Jan. 27, 2013, and the Japanese Patent Application No. 2013-104407, filed on Jan. Its content.

Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate attached to a liquid crystal panel (optical display member) is cut out from a long film to form a layer conforming to the size of a display region of the liquid crystal panel. After packaging and transporting to another production line, it is attached to a liquid crystal panel (for example, refer to Patent Document 1).

An apparatus for eliminating an optical component (defective optical component) containing a defect is known as a device used in a production system of an optical display device (for example, refer to Patent Document 2). The exclusion device of Patent Document 2 is a structure in which the removal roller is attached to the defective optical member via the adhesive layer and is taken up to the film for removal.

Patent Document 1: Japanese Patent Laid-Open No. 2003-255132.

Patent Document 2: Japanese Patent No. 4551477.

However, in the configuration of Patent Document 2, since another exclusion film different from the separation element is required to be recovered together with the defective optical component, the film for disposal is discarded each time the defective optical component is removed. Further, in this configuration, in addition to the means for collecting the separation element, a device for recovering the film for removal is required, which may cause a complicated structure of the device.

The present invention has been made in view of the foregoing, and an object thereof is to provide a production system of an optical display device capable of efficiently recovering defective optical components.

In order to achieve the above object, the present invention employs the following means.

(1) That is, the production system of the optical display device according to the first aspect of the present invention is a production system for bonding an optical component to an optical display device formed by an optical display member, which comprises: a bonding device, which is a roll The roller winds out a strip optical component layer corresponding to the width of the display area of the optical display component, and cuts the optical component layer as the optical component corresponding to the length of the display area, and then attaches the optical component to the An optical display unit, wherein the bonding apparatus includes: a winding portion that winds the optical component layer together from the roll drum and the separation layer; and a determination unit that is an optical component that is unwound from the winding portion The layer determines whether or not the defect is included; and the cutting portion cuts the optical component layer by leaving the separation layer according to the determination result of the determination unit to form a good optical component that does not contain the defect or contains the defect. a good optical component; a peeling part, wherein the good optical component or the defective optical component is peeled off from the separation layer; and the adsorption stage has adsorption to hold the optical display component The recovery stage is disposed at a position that does not overlap the adsorption stage when viewed from the normal direction of the adsorption surface, and collects the defective optical component; the bonding portion is kept away from the separation layer a good optical component attached to the optical display member, and holding the defective optical component peeled off from the separation layer to be attached to the recovery stage; and a moving device for allowing the bonding portion to be in the peeling portion The optical display members move between the separation portion and the recovery stage.

(2) The production system of an optical display device according to (1), wherein the peeling portion and the adsorption stage are disposed adjacent to each other in a direction in which the optical unit is conveyed, and the recycling stage is along The optical component layer is disposed in a position adjacent to the adsorption stage in the vertical direction of the transport direction.

(3) The production system of the optical display device according to the above (1), wherein the peeling portion, the adsorption stage, and the recovery stage are arranged linearly along the optical component layer conveying direction.

(4) The production system of the optical display device according to the above (3), wherein the recovery stage is disposed at a position opposite to the peeling portion via the adsorption stage.

(5) The production system of the optical display device according to (3) above, wherein the recovery stage is disposed between the peeling portion and the adsorption stage.

(6) The production system of the optical display device according to any one of the above (1), wherein the marking device further includes a defect of the optical component layer based on a determination result of the determining portion. Partially labeled; and the cut portion cuts the subsequent side portion of the mark end edge on the upstream side in the transport direction of the optical component layer to form the defective optical component.

(7) A production system of an optical display device according to a second aspect of the present invention is a production system for attaching an optical component to an optical display device formed of an optical display member, comprising: a laminating device which is wider from a roll drum The strip-shaped optical component layer having a longer length on either side of the long side or the short side of the display portion of the optical display member is unwound, and the optical length is longer than the length of the other side of the long side or the short side of the display area The component layer is cut to form a ply, and then the ply is attached to the optical display member; and the cutting device is disposed from the opposite portion of the display region to the ply from the optical display member The remaining portion of the outer side is cut to form an optical component corresponding to the size of the display area; wherein the bonding device comprises: a take-up portion, the optical component layer is rolled out from the roll roller and the separation layer The determination unit determines whether or not the optical component layer that is wound up by the winding unit contains a defect, and the cutting unit cuts the optical component layer by leaving the separation layer according to the determination result of the determination unit. Take a good quality layer sheet containing the defect or a defective product layer sheet containing the defect; the peeling portion is to peel off the good quality layer sheet or the defective product layer sheet from the separation layer sheet; and the adsorption stage has adsorption holding An adsorption surface of the optical display member; the recovery stage is disposed not to be viewed from the normal direction of the adsorption surface The defective layer is recovered at the overlapping position; the bonding portion holds the good layer peeled off from the separation layer and is bonded to the optical display member, and is kept peeled off from the separation layer The defective layer is bonded to the recovery stage; and the moving device moves the bonding portion between the separation portion and the optical display member or between the separation portion and the recovery stage.

(8) A production system of an optical display device according to a third aspect of the present invention is a production system for attaching an optical component to an optical display device formed by an optical display member, comprising: a laminating device, which is to be wide from the roll of the roll a strip-shaped optical component layer having a wider length than either one of a long side or a short side of the display portion of the optical display member is rolled out and has a length longer than a length of the other side of the long side or the short side of the display area The optical component layer is cut to form a ply, and then the ply is attached to the optical display component; and the detecting device detects the outer periphery of the bonding surface of the optical display component to which the ply is bonded and the ply And a cutting device that cuts off the remaining portion disposed outside the portion corresponding to the bonding surface from the layer bonded to the optical display member to form an optical component corresponding to the size of the bonding surface; The bonding apparatus includes: a winding portion for winding the optical component layer together with the separation layer sheet; and a determining unit for determining whether the optical component layer wound by the winding portion contains a defect; Cutting section According to the determination result of the determination unit, the optical component layer is cut by leaving the separation layer to form a good layer sheet containing the defect or a defective product layer sheet containing the defect; and the peeling portion is the good product The layer or the defective layer is peeled off from the separation layer; the adsorption stage has an adsorption surface for adsorbing and holding the optical display member; and the recovery stage is disposed not to be observed from the normal direction of the adsorption surface The defective layer is recovered at a position where the stage overlaps; the bonding portion holds the good layer peeled off from the separated layer and adheres to the optical display member, and holds the separation layer from the separation layer And peeling the defective layer to the recycling table; and moving the device to move the bonding portion between the peeling portion and the optical display member or between the peeling portion and the recycling table And the cutting device cuts the layer along the outer peripheral edge of the bonding surface of the optical display member and the layer detected by the detecting device.

In addition, in the above structure, "the bonding surface of the optical display member and the ply" means the optical display part. The surface of the layer opposite to the layer, specifically, the "outer periphery of the bonding surface" refers to the outer periphery of the substrate on the side where the layer is bonded to the optical display member.

Further, the "corresponding to the portion of the bonding surface" of the layer means that the display area of the optical display member opposite to the layer is larger in the layer sheet and smaller than the outer shape of the optical display member (the contour shape in the plan view). The area is a region that avoids functional parts such as an electronic component mounting portion of the optical display member. Similarly, the "size of the corresponding bonding surface" means a size larger than the display area of the optical display member and smaller than the outer shape of the optical display member (the outline shape in the plan view).

According to the present invention, it is possible to provide a production system of an optical display device capable of efficiently recovering defective optical components.

1,2‧‧" film lamination system

5‧‧‧Main conveying equipment

5a‧‧‧ starting point

5b‧‧‧end point

5c‧‧‧ rack

6‧‧‧First delivery equipment

6a‧‧‧First starting position

6b‧‧‧first end position

7‧‧‧Second secondary conveyor

7a‧‧‧second starting position

7b‧‧‧second end position

8‧‧‧First transport device

9‧‧‧cleaning device

11‧‧‧First rotary machine tool

11a‧‧‧Starting position of the first turntable

11b‧‧‧First turntable end position

11c‧‧‧First fit out/loading position

11d‧‧‧Second fit moving out/moving position

11e‧‧‧film stripping position

12‧‧‧Second transport device

13‧‧‧First bonding device

14‧‧‧film stripping device

15‧‧‧Second laminating device

16‧‧‧Second rotary machine tool

16a‧‧‧Starting position of the second turntable

16b‧‧‧second turntable end position

16c‧‧‧ Third fit out/loading position

16d‧‧‧Finished inspection position

16e‧‧‧Second cut position

17‧‧‧ Third transport device

18‧‧‧ Third bonding device

19‧‧‧Checking device

21‧‧‧fourth transport device

22‧‧‧ fifth transport device

24‧‧‧Storage device

25‧‧‧Control device

31‧‧‧Ply conveying device

31a‧‧‧Departure

31b‧‧‧cutting device

31c‧‧‧ Blade

31d‧‧‧Winding Department

31e‧‧‧Separation layer peeling position

32‧‧‧Fitting head

32a‧‧‧ Keep face

33‧‧‧ Length measuring device

34‧‧‧First inspection camera

35‧‧‧Second detection camera

36‧‧‧ Third detection camera

37‧‧‧Fourth detection camera

38‧‧‧ Fifth detection camera

41‧‧‧Adsorption station

41a‧‧‧Adsorption surface

42‧‧‧Recycling station

42a‧‧‧Support surface

51‧‧‧First cutting device

52‧‧‧Second cutting device

53‧‧‧Laser output device

60‧‧‧ Defect inspection device

61‧‧‧Lighting Department

62‧‧‧Photodetector

63‧‧‧Marking device

64‧‧‧Marking detection device

65‧‧‧Lighting Department

66‧‧‧Photographing device

70‧‧‧Mobile devices

71‧‧‧First mobile device

71a‧‧ Power Department

71b‧‧‧ Arms

72‧‧‧Second mobile device

72a‧‧‧rail

72b‧‧‧Mobile Department

73‧‧‧ Third mobile device

73a‧‧‧rail

73b‧‧‧Mobile Department

80‧‧‧Rotary device

91‧‧‧First detection device

92‧‧‧Second detection device

93‧‧‧Photographing device

93a‧‧‧Photographing surface

94‧‧‧Light source

113,213‧‧‧First bonding device

311-316‧‧‧Roller

CA‧‧‧ inspection area

CL‧‧‧ transverse line

CP‧‧‧ checkpoint

ED‧‧‧ edge

EL‧‧‧ edge line

F‧‧‧Transfer direction

F1‧‧‧First optical component layer

F2‧‧‧Second optical component layer

F3‧‧‧ third optical component layer

F5‧‧‧Fitting layer

F6‧‧‧ polarizer

F7‧‧‧ first film

F8‧‧‧second film

F11‧‧‧First optical component

F12‧‧‧Second optical component

F13‧‧‧ Third optical component

F1a‧‧‧Optical component body

F2a‧‧‧Adhesive layer

F3a‧‧‧Separation layer

F4a‧‧‧Surface protection film

F20‧‧‧ good layer

F21, F22, F23‧‧‧ Defective layer

F1X‧‧‧ optical components

F1m‧‧‧ first layer

F2m‧‧‧Second layer

F3m‧‧‧ third layer film

FX‧‧‧ optical component layer

FXm‧‧‧ layer

G‧‧‧Border Department

H, H1‧‧‧ height

L1‧‧‧ first transverse line

L2‧‧‧second transverse line

L3‧‧‧ third transverse line

M‧‧‧ mark

M1‧‧‧ first mark

M2‧‧‧ second mark

M3‧‧‧ third mark

SA1‧‧‧ first fit surface

P‧‧‧ LCD panel

P1‧‧‧ first substrate

P2‧‧‧second substrate

P3‧‧‧ liquid crystal layer

P4‧‧‧ display area

PA1‧‧‧First optical component fit

PA2‧‧‧Second optical component fit

PA3‧‧‧The third optical component fit

PA4‧‧‧Four optical component bonding body

PA5‧‧‧Fix optical component fit

R1‧‧‧ Roller

R2‧‧‧Separation roller

S1-S8‧‧‧ steps

V1‧‧‧ first direction

V2‧‧‧ second direction

V3‧‧‧ third direction

WCL‧‧‧ cut line

Θ‧‧‧ tilt angle

Maxmax‧‧‧maximum offset angle

Θmin‧‧‧minimum offset angle

Midmid‧‧‧average offset angle

Fig. 1 is a schematic configuration diagram of a film bonding system of a first embodiment.

Fig. 2 is a plan view of a liquid crystal panel.

Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2.

Fig. 4 is a cross-sectional view showing the optical component layer of the first embodiment.

Fig. 5 is a plan view showing the film bonding system of the first embodiment.

Fig. 6 is a schematic side view of the first bonding apparatus of the first embodiment.

Fig. 7 is a schematic perspective view of the first bonding apparatus of the first embodiment.

Figure 8 is a schematic plan view of the marking of the optical component layer.

Fig. 9 is a diagram for explaining the cutting position for forming a good layer.

Fig. 10 is a view for explaining the cutting position of the defective layer in order to form one mark.

Fig. 11 is a view for explaining the cutting position of the defective layer in order to form a plurality of marks.

Figure 12 is a cut of a defective layer in order to form a seam marked at the seam of two adjacent plies. The description of the location is shown in the figure.

Figure 13 is a flow chart for the recovery of defective laminates.

Figure 14 is a schematic side view of the first bonding apparatus of the second embodiment.

Fig. 15 is a schematic side view of the first bonding apparatus of the third embodiment.

Fig. 16 is a schematic structural view showing a film bonding system of a fourth embodiment.

Figure 17 is a plan view showing a film bonding system of a fourth embodiment.

Fig. 18A is a view showing an example of a method of determining the bonding position of the layer of the liquid crystal panel.

Fig. 18B is a schematic view showing an example of a method of determining the bonding position of the layer of the liquid crystal panel.

Figure 19 is a plan view showing the detecting step of the edge of the bonding surface.

Figure 20 is a schematic view of the detecting device.

Fig. 21 is a schematic view showing a modification of the detecting device.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings, and in the present embodiment, a film bonding system which is a part of a production system of an optical display device will be described.

Fig. 1 is a schematic configuration diagram of a film bonding system 1 of the present embodiment. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (EL) panel. It is therefore part of a production system that produces optical display devices that include the optical display components and optical components. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. In the first drawing, the film bonding system 1 is divided into two layers in order to facilitate the drawing.

Fig. 2 is a plan view of the liquid crystal panel P seen from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P is provided with a first substrate P1 having a rectangular shape in plan view, and a second substrate P2 facing the first substrate A small rectangle disposed on one substrate P1; and a liquid crystal layer P3 sealed between the first substrate P1 and the second substrate P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view, and a region inside the outer periphery of the liquid crystal layer P3 in plan view is the display region P4.

Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2. The first optical component layer F1, the second optical component layer F2, and the third optical component layer F3 of the elongated strip are appropriately bonded to the front/rear surface of the liquid crystal panel P (refer to FIG. 1 , hereinafter collectively referred to as an optical component The layer FX) is cut out of the first optical component F11, the second optical component F12, and the third optical component F13 (hereinafter, collectively referred to as optical component F1X). In the present embodiment, the first optical component F11 and the third optical component F13 which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P, and the backlight side of the liquid crystal panel P is further bonded to each other. The second optical component F12 as a luminance increasing film is overlapped with the first optical component F11.

Fig. 4 is a partial cross-sectional view of the optical component layer FX attached to the liquid crystal panel P. The optical component layer FX has a film-like optical module body F1a, an adhesive layer F2a provided on one side of the optical component body F1a (upper side of FIG. 4), and a layer detachably laminated to the optical layer via the adhesive layer F2a. A separation sheet F3a on the one side of the module body F1a; and a surface protection film F4a laminated on the other side (the lower side of FIG. 4) of the optical unit body F1a. The optical module body F1a has a function of a polarizing plate across the entire area of the display area P4 of the liquid crystal panel P and its peripheral area. In addition, the hatching of each layer in Fig. 4 is omitted for convenience of the drawing.

The optical module main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer sheet F5.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. Surface protection film F4a will be from the optical group at a specific point in time The body body F1a is separated. Further, the optical component layer FX may be a structure that does not include the surface protective film F4a, and the surface protective film F4a may be a structure that cannot be separated from the optical component body F1a.

The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and a bonding agent or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.

Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.

Fig. 5 is a plan view (top view) of the film bonding system 1. Hereinafter, the film bonding system 1 will be described with reference to Figs. 1 and 5 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, the upstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport upstream side, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport downstream side.

The film bonding system 1 uses the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding step. The film bonding system 1 is provided with a first sub-conveying device 6 and a second sub-conveying device 7 extending from the main conveying device 5 in the right-angle direction from the starting point 5a; from the starting point 5a toward the first starting position 6a of the first sub-conveying device 6 a first transfer device 8 that transports the liquid crystal panel P, a cleaning device 9 that is disposed on the first sub-transport device 6, and a first rotary machine tool 11 that is disposed on the downstream side of the panel transport of the first sub-conveying device 6; The first end position 6b of the sub-conveying device 6 transports the second conveying device 12 of the liquid crystal panel P toward the first turret starting position 11a of the first rotary machine tool 11; and is disposed on the first rotary table The first bonding device 13 around the machine tool 11, the second bonding device 15, and the film peeling device 14.

Further, the film bonding system 1 includes a second rotary machine tool 16 provided on the downstream side of the panel transfer of the first rotary machine tool 11; and the first rotary machine tool 11 from the first turntable end position 11b to the second rotary machine tool a third transfer device 17 for transporting the liquid crystal panel P at the second turntable start position 16a; a third bonding device 18 and an inspection device 19 disposed around the second rotary machine tool 16, and a second rotary machine tool 16 The second transport device 7 on the downstream side of the panel transport; the fourth transport device 21 that transports the liquid crystal panel P from the second turret end position 16b of the second rotary machine tool 16 toward the second home position 7a of the second sub transport device 7 And a fifth conveying device 22 that conveys the liquid crystal panel P from the second end position 7b of the second sub-conveying device 7 toward the end point 5b of the main conveying device 5.

The film bonding system 1 uses a driven main conveying device 5, each auxiliary conveying device (the first auxiliary conveying device 6 and the second auxiliary conveying device 7), and each rotary machine tool (the first rotary machine tool 11 and the second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and the liquid crystal panel P is sequentially subjected to a specific process. The liquid crystal panel P is transported on the production line with its front/reverse surfaces horizontal.

The liquid crystal panel P is, for example, in the main transport device 5, and transports the short side of the display region P4 toward the transport direction; each of the sub transport devices (the first sub transport device 6 and the second sub transport device that are perpendicular to the main transport device 5) 7), the long side of the display area P4 is conveyed toward the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display area P4 is turned toward each turn The desktop machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) is transported radially. The symbol 5c in the figure corresponds to the liquid crystal panel P, and displays the rack transported along the main transport device 5.

The layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by a control device 25 as an electronic control unit.

The first conveying device 8 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction.

The first transfer device 8 directly transports the liquid crystal panel P held by the adsorption to the first start position 6a (the left end portion of the fifth drawing) of the first sub-transport device 6 in a horizontal state, at which position The adsorption is released, and the liquid crystal panel P is transferred to the first sub-conveying device 6.

The cleaning device 9 is washed, for example, in a water-washing manner, and the front/rear surface of the liquid crystal panel P is brushed and washed with water, and then the liquid on the front/rear surface of the liquid crystal panel P is removed. Further, the cleaning device 9 may be dry-cleaned to perform static elimination and dust collection on the front/rear surfaces of the liquid crystal panel P.

The second transfer device 12 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The second transfer device 12 directly transports the liquid crystal panel P held by the adsorption to the first turntable start position 11a of the first rotary machine tool 11 in a horizontal state, and at this position, the adsorption action is released. The liquid crystal panel P is delivered to the first rotary machine tool 11.

The first rotary machine tool 11 has a disk-shaped turntable having a rotation axis in the vertical direction, and the left end portion of Fig. 5 (plan view) serves as the first turntable start position 11a, and is rotationally driven in the clockwise direction. The first rotary machine tool 11 is a first bonding/unloading position 11c at a position (the upper end portion in Fig. 5) that is rotated 90° clockwise from the first turret starting position 11a.

At the first bonding loading/unloading position 11c, the liquid crystal panel P is carried into the first bonding apparatus 13 by a transfer robot not shown. The liquid crystal panel P is bonded to the first optical unit F11 on the backlight side by the first bonding apparatus 13. The liquid crystal panel P to which the first optical unit F11 is bonded is carried from the first bonding apparatus 13 to the first bonding/unloading/receiving position 11c of the first rotary machine tool 11 by a transport robot not shown.

The first rotary machine tool 11 is a film peeling position 11e at a position (the upper right end portion of FIG. 5) that is rotated by 45° in the clockwise direction from the first bonding/unloading/receiving position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first optical component F11 is performed by the film peeling device 14.

The first rotary machine tool 11 is rotated 45° clockwise from the film peeling position 11e. (the position at the right end of Fig. 5) serves as the second bonding carry-out/loading position 11d.

At the second bonding carry-out/loading position 11d, the liquid crystal panel P is carried into the second bonding apparatus 15 by a transport robot not shown. The liquid crystal panel P is bonded to the second optical component F12 on the backlight side by the second bonding apparatus 15. The liquid crystal panel P to which the second optical unit F12 is bonded is carried from the second bonding apparatus 15 to the second bonding loading/unloading position 11d of the first rotary machine tool 11 by a transport robot not shown.

The first rotary table machine 11 is a first turntable end position 11b at a position (the lower end portion in the fifth drawing) that is rotated by 90° in the clockwise direction from the second bonding carry-out/loading position 11d. At the first turntable end position 11b, the carry-out operation is performed by the third transfer device 17.

The third transport device 17 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The third transfer device 17 transports the liquid crystal panel P held by the adsorption to the second turntable start position 16a of the second rotary machine tool 16, and performs the front/back side of the liquid crystal panel P at the time of the transfer. Inverting, the adsorption is released at the second turntable start position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.

The second rotary machine tool 16 has a disk-shaped turntable having a rotary axis in the vertical direction, and the upper end portion of Fig. 5 (plan view) is used as the second turntable start position 16a, and is rotationally driven in the clockwise direction. The second rotary machine tool 16 is a third bonding carry-out/loading position 16c at a position (the right end portion of the fifth drawing) that is rotated 90° clockwise from the second turret starting position 16a.

At the third bonding carry-out/loading position 16c, the liquid crystal panel P is carried into the third bonding apparatus 18 by a transport robot not shown. The liquid crystal panel P is bonded to the third optical component F13 on the display surface side by the third bonding apparatus 18. The liquid crystal panel P to which the third optical unit F13 is bonded is carried from the third bonding apparatus 18 to the third bonding loading/unloading position 16c of the second rotary machine tool 16 by a transport robot not shown.

The second rotary machine tool 16 is clockwise from the third attachment loading/unloading position 16c The position where the direction is rotated by 90 (the lower end portion in Fig. 5) is taken as the bonding inspection position 16d. At the bonding inspection position 16d, the inspection device 19 inspects the workpiece (liquid crystal panel P) to which the film is bonded (inspection of whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like).

When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

The second rotary machine tool 16 is a second turntable end position 16b at a position (left end of Fig. 5) that is rotated 90° clockwise from the bonding inspection position 16d. At the second turntable end position 16b, the carry-out operation is performed by the fourth transfer device 21.

The fourth conveying device 21 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fourth transport device 21 transports the liquid crystal panel P held by the adsorption to the second home position 7a of the second sub-transport device 7, for example, and releases the adsorption at the second home position 7a to liquidize the liquid crystal panel P. The panel P is delivered to the second sub-conveying device 7.

The fifth conveying device 22 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fifth transport device 22 transports the liquid crystal panel P held by the adsorption to the end point 5b of the main transport device 5, and releases the suction at the end point 5b to transfer the liquid crystal panel P to the main transport device 5. The bonding step of the film bonding system 1 is completed via the above.

Hereinafter, the first bonding apparatus 13 will be described in detail with reference to FIGS. 6 to 13. Figure 6 shows a schematic side view of the first bonding device 13. Fig. 7 is a schematic perspective view of the first bonding device 13. In addition, the second bonding apparatus 15 and the third bonding apparatus 18 have the same configuration, and detailed description thereof will be omitted.

The first bonding apparatus 13 is bonded to the upper surface of the liquid crystal panel P by a layer (first optical component F11) of the bonding layer sheet F5 cut into a specific size in the first optical component layer F1.

As shown in FIGS. 6 and 7, the first bonding apparatus 13 is provided with a layer sheet conveying device 31 for winding the first optical component layer F1 from the winding roller R1 around which the first optical component layer F1 is wound. And transporting the first optical component layer F1 along the longitudinal direction of the first optical component layer F1; the defect inspection device 60; the marking device 63; the mark detecting device 64; the adsorption table 41; the recovery table 42; a bonding unit); a moving device 70; and a turning device 80.

In the layer sheet conveying device 31, the bonding layer sheet F5 is conveyed by using the separation layer sheet F3a as a carrier, and the winding portion 31a is provided to hold the roll drum R1 around which the strip-shaped first optical unit layer F1 is wound, and The first optical component layer F1 is wound up along the longitudinal direction of the first optical component layer F1; the cutting device 31b (cutting portion) applies a half cut to the first optical component layer F1 that is unwound from the roll drum R1. The blade 31c (peeling portion) is such that the first optical component layer F1 after half-cutting is wound at an acute angle to separate the bonding layer sheet F5 from the separation layer sheet F3a; the winding portion 31d is kept wound The separation roller R2 of the separation layer F3a which is separately present after passing through the blade 31c; the plurality of rollers (for example, the six rollers 311, 312, 313, 314, 315, 316 in the present embodiment) form a separation layer between the winding portion 31a and the winding portion 31d. The transport path of F3a; and the length measuring device 33 are provided at at least one of a plurality of rollers (for example, the drum 311 in the present embodiment).

The first optical module layer F1 has a width equal to the width of the display region P4 of the liquid crystal panel P (corresponding to the short side length of the display region P4 in the present embodiment) in the horizontal direction (ply width direction) perpendicular to the conveyance direction. .

The winding portion 31a located at the beginning of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are, for example, driven in synchronization with each other. Thereby, the unwinding portion 31a winds up the first optical component layer F1 in the conveyance direction of the first optical component layer F1, and the winding portion 31d winds up the separation layer F3a which passes through the blade 31c. In the layer conveyance device 31, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.

At least the separation layer F3a of the first optical component layer F1 spans a plurality of rollers to form a transport path. A plurality of rollers are carried out from the first optical component layer F1 capable of changing the transport The roller in the direction or the roller selected to adjust the tension of the first optical component layer F1 during conveyance is formed.

The length measuring device 33 measures the distance (transport distance) that the first optical component layer F1 has been transported based on the rotation angle and the outer circumferential length of the drum 311 to which the length measuring device 33 is attached. The measurement result of the length measuring device 33 is output to the control device 25. The control device 25 generates the layer position information based on the measurement result of the length measuring device 33, which can indicate that the first optical component layer F1 is transported at any point in the longitudinal direction at any time during the conveyance of the first optical component layer F1. The location on the route.

The defect inspection device 60 detects defects existing in the first optical component layer F1 during transportation. The defect inspection device 60 performs inspection processing such as reflection inspection, penetration inspection, oblique penetration inspection, and crossed nichol prism penetration inspection on the first optical component layer F11 during transportation to detect Defect of the first optical component layer F1.

The defect inspection device 60 includes an illumination portion 61 that can illuminate the first optical component layer F1, and a photodetector 62 that can be illuminated for the illumination portion 61 and via the first optical component layer F1 (reflection and penetration) The light of either or both of them is detected as to whether or not the optical component layer F1 changes due to the presence/absence of defects. The defect of the optical component layer F1 is, for example, the presence of a foreign matter portion of at least one of a solid, a liquid, and a gas inside the optical component layer F1, or a portion having irregularities or scratches on the surface of the optical component layer F1, or an optical component layer. The highlight portion of the F1 twisted material deviation, etc.

The illumination unit 61 is irradiated with light having an adjusted light intensity, a wavelength, a polarization state, or the like in accordance with the type of inspection performed by the defect inspection device 60. The photodetector 62 is constituted by an imaging element such as a charge-coupled device (CCD) for capturing a portion of the first optical component layer F1 illuminated by the illumination portion 61 with light. The detection result (photographing result) of the photodetector 62 is output to the control device 25.

The control device 25 analyzes the image captured by the photodetector 62 to determine whether there is a defect. trap. When the control device 25 determines whether or not there is a defect at the first optical component layer F1, the measurement result of the reference length measuring device 33 generates defect position information indicating the position of the defect on the first optical component layer F1.

Further, the structure of the defect inspection device 60 can be appropriately changed to detect the defect of the first optical component layer F1. For example, the defect inspection device 60 may include a determination unit that determines whether or not there is a defect based on the detection result of the photodetector 62, and can output the determination result of the determination unit to the control device 25. The defect inspection device 60 may determine whether or not there is a defect by the control device 25 without outputting the determination result of the determination unit to the control device 25.

The marking device 63 attaches a mark to the defective portion of the first optical component layer F1 based on the determination result of the determination unit. The defective portion of the first optical component layer F1 is identified by an additional mark. For example, the marking device 63 is attached to the defect position of the first optical component layer F1, and is marked by inkjet or the like from the side of the surface protective film F4a. Alternatively, the marking device 63 may be used instead of the marking operation to allow the operator to mark by a magic ink or the like.

The mark attached to the defect position by the marking device 63 is performed in the conveyance of the first optical component layer F1. In addition, the mark attached to the defect position can be performed again when the first optical component layer F1 is stopped.

Fig. 8 is a schematic plan view of the mark M of the optical component layer F1.

As shown in Fig. 8, a complex mark M is attached to the defect position of the first optical component layer F1 during transport. The plurality of marks M are unevenly distributed in the transport direction (arrow direction) of the first optical component layer F1. The plane shape of the mark M is a rectangle, and one side of the rectangle has a length of about 10 mm. At least a portion of the mark M contains defects. In order to be able to surround the defect, the mark M is marked on a wider area than the defective portion. Further, the planar shape of the mark M is not limited to a rectangle, and may be circular or linear.

Returning to Fig. 6 and Fig. 7, the mark detecting means 64 detects the mark which is marked at the defect position of the first optical component layer F1 during conveyance. The mark detecting device 64 is the first one for the transport The optical component layer F1 is inspected by a penetration inspection or the like to detect the mark of the first optical component layer F1.

The mark detecting device 64 includes an illuminating unit 65 that emits light to the first optical component layer F1, and a photographing device 66 that can capture a mark formed on the first optical component layer F1.

For example, the illumination unit 65 includes: a fluorescent lamp; and a diffusing plate that diffuses the fluorescent lamp

The light that is emitted. The photographing device 66 is constituted by an imaging element such as a CCD, and is used to photograph the first optical component layer F1 that irradiates the light portion with the illumination portion 65. The detection result (photographing result) of the photographing device 66 is output to the control device 25.

The control device 25 analyzes the image captured by the imaging device 66 and determines whether or not there is a mark. The control device 25 generates the mark position information indicating the position on the first optical component layer F1 by determining the measurement result of the reference length measuring device 33 when it is judged that the mark is present at the first optical component layer F1.

The cutting device 31b crosses the entire width of the first optical component layer F1 in the sheet width direction, and cuts (semi-cuts) one of the thickness portions of the first optical component layer F1.

The cutting device 31b transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken or broken (the separation layer F3a having a specific thickness remains). The front and rear positions of the blade are cut, and the half cut is applied to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

In the first optical component layer F1 after the half-cut, the optical module body F1a and the surface protective film F4a are cut in the thickness direction thereof to form a transverse line across the entire width of the first optical component layer F1 in the layer width direction. The first optical component layer F1 is divided into sections having a length corresponding to the long side of the display region P4 in the longitudinal direction by the transverse line. The partitions are each one of the laminated plies F5. Further, the configuration of the cutting device 31b can be appropriately changed to control the cross-sectional line size (depth) in the thickness direction of the first optical module layer F1 and the position of the transverse line in the layer conveying direction.

The control device 25 refers to the mark position information in a section (hereinafter referred to as a sub-layer section) corresponding to a unit length in the longitudinal direction of the first optical component F11 from the first transverse line formed by the cutting device 31b. It is judged whether or not there is a defect of the first optical component F11. The control device 25 determines whether or not there is a defect in the next layer interval, and determines the formation position of the next transverse line to generate the transverse line position information to indicate the position where the transverse line is formed on the first optical component layer F1.

The cutting device 31b cuts the first optical component layer F1 by remaining the separation layer F3a as a result of the determination by the determination unit, and serves as a good layer (without a good optical component (first optical component F11)). Or as a defective layer containing defects (corresponding to defective optical components).

Fig. 9 is a diagram for explaining the cutting position when forming a good layer.

As shown in Fig. 9, when the control device 25 determines that there is no mark in the next layer interval, the control device 25 determines the formation position of the second transverse line L2, and forms the transverse line formed by the previous (hereinafter referred to as the first transverse line L1). The distance to the first optical component layer F1 up to the formation of the next transverse line (hereinafter referred to as the second transverse line L2) is set to the above unit length.

When the first optical module layer F1 transports the unit length (for example, 200 mm) from the position where the first transverse line L1 is formed, the control device 25 controls the cutting device 31b so that the cutting device 31b forms the second transverse line L2.

The cutting device 31b cuts off the first optical module layer F1 when the first optical module layer F1 is transported by the unit length. Thereby, a good ply F20 containing no defects is formed in the first optical component layer F1 from the first transverse line L1 to the second transverse line L2.

Fig. 10 to Fig. 12 are diagrams for explaining the cutting position of the defective layer.

Fig. 10 is a view for explaining the cutting position of the defective layer in order to form one mark M.

As shown in Fig. 10, when the control device 25 determines that only one mark M exists in the next layer interval, the formation position of the transverse line (hereinafter referred to as the third transverse line L3) is determined by the mark M. The upstream side of the transfer route.

Further, from the viewpoint of improving the productivity of the optical component of the first optical component layer F1, the control device 25 determines the position at which the third transverse line is formed to be close to the edge of the mark M on the upstream side in the transport direction of the first optical component layer F1. Preferably, the position is preferably determined by the position at which the third transverse line is formed at the edge of the contact mark M.

The control device 25 controls the cutting device 31b to form the third transverse line L3 on the upstream side of the conveying path of the mark M by the cutting device 31b. The cutting device 31b cuts the subsequent side portion of the edge of the mark M on the upstream side in the conveyance direction of the first optical module layer F1. Thereby, in the first optical component layer F1, a defective layer P21 containing a defect (one mark M) is formed in a section from the first transverse line L1 to the third transverse line L3.

Fig. 11 is a view for explaining the cutting position of the defective layer in order to form a plurality of marks M (for example, three in the present embodiment).

As shown in FIG. 11, when the control device 25 determines that there are three markers M (the first marker M1, the second marker M2, and the third marker M3) in the next layer interval, the control unit 25 will cross the line (hereinafter referred to as the third). The position at which the transverse line L3) is formed is determined by the upstream side of the transport path of the third mark M3 on the most upstream side in the layer transport direction among the three marks M.

Further, from the viewpoint of improving the productivity of the optical component of the first optical component layer F1, the control device 25 determines the position at which the third transverse line is formed on the third mark M3 on the upstream side in the transport direction of the first optical component layer F1. Preferably, the position of the end edge is preferably determined by the position at which the third transverse line is formed at the edge of the contact mark M.

The control device 25 controls the cutting device 31b to form the third transverse line L3 on the upstream side of the transport path of the third mark M3. The cutting device 31b cuts the subsequent side portion of the edge of the third mark M3 on the upstream side in the transport direction of the first optical module layer F1. Thereby, in the first optical component layer F1, from the first transverse line L1 to the third transverse line L3, defects are formed (three The defect layer P22 of the mark M).

Fig. 12 is a view for explaining the cutting position of the defective layer in order to form the mark M at the joint between the adjacent two layers (the position at which the transverse line is formed).

As shown in Fig. 12, when the control device 25 determines that there is a mark M at the joint between the adjacent two plies, the position at which the third transverse line L3 is formed is determined on the upstream side of the transport direction of the first optical component layer F1. The position of the contact mark M end edge.

The control device 25 controls the cutting device 31b to form the third transverse line L3 on the upstream side of the conveying path of the mark M by the cutting device 31b. The cutting device 31b cuts the subsequent side portion of the edge of the mark M on the upstream side in the conveyance direction of the first optical module layer F1. In the first optical component layer F1, a defective layer P23 containing a defect (one mark M) is formed in a section from the first transverse line L1 to the third transverse line L3.

Returning to Fig. 6, the blade 31c is located below the first optical component layer F1 which is conveyed slightly horizontally from the left side to the right side of Fig. 6, and extends at least across the entire width direction of the first optical component layer F1. Formed in width. The blade 31c is wound in such a manner that it is wound in a sliding contact with the side of the separation layer F3a of the first optical component layer F1 after the half cutting.

The blade 31c winds the first optical component layer F1 at an acute angle to its sharp-angled front end. When the first optical component layer F1 is folded back at an acute angle at the front end of the blade 31c, the separation layer F3a is peeled off from the bonding layer F5. At this time, the adhesive layer F2a of the bonding layer sheet F5 (the bonding surface with the liquid crystal panel P) faces downward. Immediately below the front end portion of the blade 31c is a separation layer peeling position 31e, and the holding surface 32a of the bonding head 32 comes into contact with the front end portion of the blade edge 31c from above, so that the surface protective film F4a of the layer sheet of the bonding layer sheet F5 is attached. The opposite side of the facing surface is adhered to the holding surface 32a of the fitting head 32.

As shown in FIGS. 6 and 7, the adsorption stage 41 is disposed adjacent to the blade 31c in the layer conveyance direction. The adsorption stage 41 sucks and holds the liquid crystal panel P at the time of bonding. The adsorption stage 41 has an adsorption surface 41a that adsorbs and holds the liquid crystal panel P.

The recovery stage 42 is disposed at a position overlapping the adsorption stage 41 as viewed from the normal direction of the adsorption surface 41a. Specifically, the recovery stage 42 is disposed adjacent to the adsorption stage 41 in the vertical direction of the layer conveyance direction. In other words, the recovery stage 42 is disposed on the side of the layer transport line. The recovery stage 42 collects defective laminates. The recovery stage 42 has a support surface 42a that supports the defective layer.

The bonding head 32 holds the good layer sheet peeled off from the separation layer sheet F3a, adheres to the liquid crystal panel P, and holds the defective layer sheet peeled off from the separation layer sheet F3a, and bonds it to the collection stage 42.

The bonding head 32 is parallel to the layer width direction and has a convex arc-shaped holding surface 32a below. The holding surface 32a has a weaker adhesive force than the bonding surface (adhesive layer F2a) of the bonding layer sheet F5, for example, and the surface protective film F4a of the bonding layer sheet F5 can be repeatedly adhered and peeled off.

The bonding head 32 is attached to the blade 31c so as to be inclined along the axis of the layer in the width direction of the layer, and is inclined to move along the bending of the holding surface 32a. When the bonding layer sheet F5 is adhered and adhered, and when the bonding layer sheet F5 having the adhesion is adhered to the liquid crystal panel P, the tilting movement of the bonding head 32 is appropriately performed.

The bonding head 32 is attached to the blade at the curved end side of the holding surface 32a from above with the holding surface 32a facing downward and the curved end side of the holding surface 32a (the right side of FIG. 6) being the lower side. The front end portion of 31c is adhered to the front end portion of the bonding layer sheet F5 at the separation layer peeling position 31e to the holding surface 32a. Thereafter, the bonding layer sheet F5 is continuously unwound and the bonding head 32 is tilted (the other end side of the bending surface of the holding surface 32a (the left side of FIG. 6 is inclined) as the lower side), whereby the bonding layer sheet F5 is attached. The layer is integrally adhered to the holding surface 32a.

The bonding head 32 can perform a lifting operation of a specific distance above the separation layer peeling position 31e and the first bonding loading/unloading position 11c, and can be between the separation layer peeling position 31e and the first bonding loading/unloading position 11c. Move as appropriate. The bonding head 32 is coupled to the arm portion 71b as a driving device (refer to FIG. 7), and can be driven during the lifting, the moving, and the tilting movement.

When the bonding head 32 adheres the bonding layer sheet F5 to the holding surface 32a, for example, After the end portion of the bonding layer sheet F5 is adhered to the holding surface 32a, the arm portion 71b is cut and engaged with the arm portion 71b to be freely tilted, and from this state, the bonding layer sheet F5 is passively moved and tilted. When the bonding head 32 is tilted to move until the bonding layer F5 is entirely adhered to the holding surface 32a, the tilting movement is locked in the inclined state by, for example, engagement with the arm portion 71b, and the first direction is reached in the state. The attachment/moving/moving position 11c moves upward.

When the bonding layer 32 adheres to the liquid crystal panel P, the bonding head 32 actively moves obliquely by, for example, the movement of the arm portion 71b, and the laminated layer F5 is bent along the holding surface 32a. Attached to the upper side of the liquid crystal panel P to be surely attached.

The moving device 70 moves the bonding head 32 between the blade 31c and the liquid crystal panel P or between the blade 31c and the recovery stage 42. As shown in FIG. 7, the mobile device 70 includes a first mobile device 71, a second mobile device 72, and a third mobile device 73.

The first moving device 71 moves the bonding head 32 in the first direction V1 parallel to the normal direction of the adsorption surface 41a. The first moving device 71 includes a power portion 71a such as a brake and an arm portion 71b that is movable in the first direction V1 by the power portion 71a. The bonding head 32 is attached to the front end of the arm portion 71b.

The second moving device 72 moves the bonding head 32 between the blade 31c and the liquid crystal panel P in the second direction V2 parallel to the layer conveying direction. The second moving device 72 has a guide rail 72a extending along the second direction V2, and a moving portion 72b movable along the guide rail 72a.

The third moving device 73 moves the bonding head 32 between the blade edge 31c and the recovery stage 42 in the third direction V3 parallel to the direction perpendicular to the layer conveying direction. The third moving device 73 has a guide rail 73a extending along the third direction V3, and a moving portion 73b movable along the guide rail 73a.

The guide rail 73a is attached to the opposite side of the side of the guide rail 72a of the moving portion 72b. The power unit 71a is attached to the side opposite to the side of the guide rail 73a of the moving portion 73b.

The slewing device 80 rotates the suction table 41 in the horizontal plane in accordance with the result of the second detection camera 35 to adjust the liquid crystal panel P held by the suction stage 41 and the bonding layer F5 held by the bonding head 32. Relatively fitting position. For example, the turning device 80 includes a motor having a rotary shaft parallel to the normal direction of the adsorption surface 41a of the adsorption stage 41, and a conduction mechanism that conducts the rotational force of the motor to the adsorption stage 41. The adsorption stage 41 is attached to the transmission mechanism.

The second moving device 72 moves the bonding head 32 to the front end of the blade 31c at the peeling position of the separation layer F3a. The first moving device 71 lowers the bonding head 32 from the separation layer peeling position 31e, and attaches the holding surface 32a from the upper side to the front end of the blade 31c for attaching the layer at the separation layer peeling position 31e. The front end of F5 is adhered to the holding surface 32a.

In the present embodiment, the first detecting camera 34 that detects the leading end of the layer transport downstream side of the layer of the bonding layer sheet F5 is provided below the end portion of the blade 31c. The detection data of the first detection camera 34 is transmitted to the control device 25. When the first detecting camera 34 detects the downstream end of the bonding layer sheet F5, for example, the control device 25 temporarily stops the layer sheet conveying device 31, and thereafter lowers the bonding head 32 to bond the front end portion of the layer sheet F5. Adhered to the retaining surface 32.

When the first detecting camera 34 detects the downstream side end of the bonding layer sheet F5 and temporarily stops the layer sheet conveying device 31, the control device 25 performs the cutting of the bonding layer sheet F5 by the cutting device 31b. That is, the layer between the detection position of the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cutting position along the cutting device 31b (the position before and after the cutting blade of the cutting device 31b) The distance of the transport route corresponds to the length of the layer of the laminated layer F5.

The cutting device 31b is movable along the layer transport path, and the distance between the detection position of the first detecting camera 34 and the cutting conveyance path between the cutting positions of the cutting device 31b is changed by the movement. The movement of the cutting device 31b is controlled by the control device 25, and when the bonding layer sheet F5 is cut by, for example, the cutting device 31b, the distance of the layer of the laminated layer sheet F5 is rolled up, and when it is cut, In the case where there is a deviation between the broken end and the specific reference position, the movement of the cutting device 31b is used to compensate The deviation is correct. Further, the cutting of the bonding layer sheet F5 having a different length may be performed by the movement of the cutting device 31b. Further, the cutting of the defective product layer having different lengths can be performed by the movement of the cutting device 31b.

When the bonding layer sheet F5 moves from the separation layer peeling position 31e toward the first bonding loading/unloading position 11c, the bonding layer sheet F5 adhered to the holding surface 32a is, for example, at the corners of the proximal end portion of the front end portion. Each of the cameras is photographed by a pair of second detecting cameras 35. The detection data of each of the second detecting cameras 35 is transmitted to the control device 25. The control device 25 confirms the horizontal direction of the bonding layer sheet F5 with respect to the bonding head 32 (the moving direction of the bonding head 32, the vertical direction thereof, and the rotation direction of the vertical axis center), for example, based on the imaging data of each of the second detecting cameras 35. position. In the case where the relative positions of the bonding head 32 and the bonding layer sheet F5 are different, the bonding head 32 performs position alignment by using the position of the bonding layer sheet F5 (first optical unit F11) as a specific reference position.

In the position alignment of the liquid crystal panel P and the bonding layer F5 (first optical component F11) performed by the first bonding apparatus 13, the control device 25 as the first calibration device is based on the first detecting camera 34 to the first 5. Detecting the detection data of the camera 38, determining the relative bonding position with respect to the first optical component F11 of the liquid crystal panel P, so that the direction of the parallel arrangement of the P pixel columns of the liquid crystal panel and the polarization direction of the first optical component F11 (polarizing film) are identical to each other. .

Specifically, at the first bonding loading/unloading position 11c of the first rotary machine tool 11, one of the positional alignments in the horizontal direction of the liquid crystal panel P on the first bonding/unloading position 11c is provided. Three detection cameras 36. At the second bonding carry-out/loading position 11d of the first rotary machine tool 11, one of the position detections in the horizontal direction for performing the second bonding/unloading/retracting position 11d of the same liquid crystal panel P is provided to the fourth detecting camera. 37. Each of the third detecting cameras 36 captures, for example, the two corners on the left side in the fifth drawing of the glass substrate (first substrate P1) of the liquid crystal panel P, and each of the fourth detecting cameras 37 respectively photographs a glass substrate such as the liquid crystal panel P. The two corners on the left side in Figure 5 of the figure.

At the third attachment loading/unloading position 16c of the second rotary machine tool 16, there is provided One of the position detections in the horizontal direction on the third bonding/unloading/retracting position 16c of the liquid crystal panel P is performed on the fifth detecting camera 38. Each of the fifth detecting cameras 38 captures, for example, the two corner portions on the left side in the fifth drawing of the glass substrate of the liquid crystal panel P. The detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38) is transmitted to the control device 25. Alternatively, a sensor may be used instead of each of the detecting cameras (the first detecting camera 34 to the fifth detecting camera 38).

A position alignment table 39 on which the liquid crystal panel P is placed and whose positional alignment in the horizontal direction can be performed is provided on each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16). The position calibration table 39 is driven and controlled by the control device 25 based on the detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38). Thereby, it is possible to perform the respective rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16) (the respective bonding positions (the first bonding carry-out/loading position 11c and the third bonding carry-out/loading position 16c) )) Position calibration of the liquid crystal panel P.

The laminated layer F5 which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the adhesion deviation of the layer FXm is suppressed, and the optical axis direction of the optical component F1X of the liquid crystal panel P can be improved. Accuracy, improve the color and contrast of optical display devices. Further, it is possible to design the optical unit F1X to correspond to the display area P4 with better precision, and to reduce the frame portion G outside the display area P4 (refer to FIG. 3), thereby achieving the purpose of expanding the display area and miniaturizing the device.

Further, in the present embodiment, the first bonding apparatus 13 is disposed above the adsorption stage 41 at the bonding position, and is provided with one of the positional calibrations for performing the horizontal direction of the liquid crystal panel P to the third detection camera 36 (refer to the fifth Figure, Figure 6).

In the second bonding apparatus 15, a position detector for performing horizontal alignment in the horizontal direction of the liquid crystal panel P is provided above the adsorption stage 41 at the bonding position (see FIG. 5). Each of the third detecting cameras 36 captures, for example, the two corners on the left side in the fifth drawing of the glass substrate (first substrate P1) of the liquid crystal panel P, and each of the fourth detecting cameras 37 respectively photographs a glass substrate such as the liquid crystal panel P. The two corners on the left side in Figure 5 of the figure.

In the third bonding apparatus 18, one of the positional alignments for performing the horizontal direction of the liquid crystal panel P is provided above the adsorption stage 41 at the bonding position, and the fifth detection camera 38 is referred to FIG. 5). Each of the fifth detecting cameras 38 captures, for example, the two corner portions on the left side in the fifth drawing of the glass substrate of the liquid crystal panel P. The detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38) is transmitted to the control device 25. Alternatively, a sensor may be used instead of each of the detecting cameras (the first detecting camera 34 to the fifth detecting camera 38).

The adsorption stage 41 of each of the bonding devices (the first bonding device 13, the second bonding device 15, and the third bonding device 18) is detected by each of the detecting cameras (the first detecting camera 34 to the fifth detecting camera 38). The data is driven and controlled by the control device 25. Thereby, the position alignment of the liquid crystal panel P with respect to the bonding head 32 is performed at each bonding position.

The laminated layer F5 which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the deviation of the optical component F1X is suppressed, and the optical axis direction of the optical component F1X of the liquid crystal panel P can be improved. Accuracy, improve the color and contrast of optical display devices.

The control device 25 of the present embodiment is included in a computer system. The computer system includes an arithmetic processing unit such as a central processing unit (CPU) and a memory unit such as a memory or a hard disk. The control device 25 of the present embodiment includes an interface that can communicate with an external device of the computer system. At the control device 25, an input device capable of inputting an input signal can be connected. The above input device includes an input device such as a keyboard or a mouse, or a communication device that can input data from an external device of the computer system. The control device 25 may include a display device such as a liquid crystal display that displays the operation state of each part of the film bonding system 1, and may be connected to the display device.

An operating system (OS, operating system) that controls the computer system is installed in the memory unit of the control device 25. At the memory unit of the control device 25, the arithmetic processing unit controls each part of the film bonding system 1 to store a program for executing the process of removing the defective optical component in each part of the film bonding system 1. Various information including a program stored in the memory unit can be carried by the control device 25. The calculation unit reads. The control device 25 may include a logic circuit such as an application specific integrated circuit (ASIC) that performs various processes required for controlling the respective portions of the film bonding system 1.

Next, in the recycling process of the defective layer of the present embodiment, the bonding process of the good layer is described. Figure 13 is a flow chart for the recovery of defective laminates.

As shown in Fig. 13, the determination unit determines whether or not the first optical component layer F1 is defective (step S1 shown in Fig. 13).

When the determination unit determines that there is "no defect", the first optical component layer F1 is rolled up to the length of the display region P4 in the layer conveyance direction by the cutting device 31b (refer to Fig. 6). (corresponding to the length of the long side of the display region P4 in the present embodiment), a half cut is performed across the entire width in the layer width direction to form a good layer (step S2 shown in Fig. 13).

Next, the bonding layer 32 of the bonding layer sheet F5 is entirely adhered to the holding surface 32a by the bonding head 32 (refer to Fig. 6) (step S3 shown in Fig. 13).

Next, the bonding head 32 is moved between the blade 31c and the liquid crystal panel P by the moving device 70 (refer to Fig. 6) (step S4 shown in Fig. 13). Further, the bonding layer 32 is bonded to the liquid crystal panel P by the bonding head 32.

On the other hand, when the determination unit determines that "there is a defect", the defect position is marked by the marking device 63 (refer to Fig. 6) (step S5 shown in Fig. 13). Next, the mark is detected by the mark detecting means 64 (refer to Fig. 6). Next, the control device 25 determines the position at which the transverse line is formed on the upstream side of the transport path of the mark M.

Then, by the cutting device 31b, the subsequent side portion of the edge M of the mark M on the upstream side in the transport direction of the first optical module layer F1 is half-cut across the entire width in the layer width direction to form a defective layer. (Step S6 shown in Fig. 13).

Next, by bonding the head 32, the defective layer of the bonded layer sheet F5 is entirely adhered to The surface 32a is held (step S7 shown in Fig. 13).

Next, the bonding head 32 is moved between the blade 31c and the recovery table 42 by the moving device 70 (step S8 shown in Fig. 13). Further, the defective product layer peeled off from the separation layer sheet F3a by the bonding head 32 is bonded to the support surface 42a of the recovery stage 42. For example, a waste layer sheet or the like is disposed on the support surface 42a, and a plurality of defective layer sheets can be laminated and bonded to the waste layer sheet. After stratifying a certain amount of defective layer, the defective layer is discarded. In this case, the defective layer sheet can be peeled off from the waste layer sheet and discarded, and can be discarded together with the waste layer sheet.

As described above, the film bonding system 1 of the above embodiment bonds the optical module F1X to the liquid crystal panel P, and includes a bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding). The device 18) winds out the strip-shaped optical component layer FX corresponding to the width of the liquid crystal panel P display region P4 from the roll reel R1, and cuts the optical component layer FX as the optical component F1X corresponding to the length of the display region P4, and then The optical component F1X is bonded to the liquid crystal panel P. The bonding device (the first bonding device 13, the second bonding device 15, and the third bonding device 18) includes a winding portion 31a. The optical module layer FX is unwound from the roll drum R1 and the separation layer sheet F3a. The determination unit determines whether or not the optical component layer FX that is wound up by the winding portion 31a contains a defect. The cutting device 31b is based on the determination unit. As a result of the determination, the optical component layer FX is cut by the residual separation layer F3a to form a good layer sheet containing no defects or a defective product layer sheet containing defects; the blade edge 31c is a good layer or a defective layer The separation layer F3a is peeled off; the adsorption stage 41 has suction The adsorption surface 41a for holding the liquid crystal panel P is attached; the recovery stage 42 is disposed at a position where the adsorption surface 41a does not overlap the adsorption stage 41, and the defective layer is recovered; the bonding head 32 is held. The good layer sheet peeled off from the separation layer sheet F3a is bonded to the liquid crystal panel P, and the defective layer sheet peeled off from the separation layer sheet F3a is held and bonded to the recovery stage 42; and the moving device 70 is attached The closing head 32 moves between the blade 31c and the liquid crystal panel P or between the blade 31c and the recovery stage 42. Further, the blade 31c and the adsorption stage 41 are disposed adjacent to each other in the optical component layer FX transport direction, and the recovery stage 42 is attached to the optical component layer FX transport direction. In the vertical direction, it is disposed adjacent to the adsorption stage 41. Further, the marking device 63 that marks the defective portion of the optical module layer FX according to the determination result of the determination unit is included; wherein the cutting device 31b cuts the mark M on the upstream side in the optical component layer FX transport direction The subsequent side portion of the end edge forms a defective layer.

According to this configuration, the defective layer sheets can be bonded together and discarded to the recovery stage 42.

Therefore, it is possible to remove the defective layer without using another film for removal or the like which is different from the separation layer. Further, compared with the structure in which the defective layer is recovered by using another thin film different from the separating element, the film for elimination can be omitted, and the cost required for the film for elimination can be saved. Further, since the defective layer can be recovered by the recovery stage 42, it is not necessary to additionally provide a means for collecting the film for rejection, and the structure of the apparatus can be simplified. Further, the defective layer sheet can be simultaneously removed, and the good layer sheet can be attached to the liquid crystal panel P. Therefore, the defective layer can be efficiently recovered.

In addition, since the collection stage 42 is disposed at a position that does not overlap the adsorption stage 41 in plan view, it is possible to prevent foreign matter or the like from adhering to the surface of the liquid crystal panel P.

Further, since the recovery stage 42 is disposed on the side of the layer transfer line, when the defective layer deposited on the recovery stage 42 is discarded, the operator does not need to extend into the layer transfer line, and the defective layer can be easily discarded. Moreover, the manufacturing line can be shortened, and the manufacturing cycle can be shortened.

Further, in the film bonding system 1, the strip-shaped optical component layer FX corresponding to the width of the display region P4 is cut to a specific length as the optical component F1X, and the optical component F1X is held by the bonding head 32. The holding surface 32a is bonded to the liquid crystal panel P, whereby the dimensional deviation or the bonding deviation of the optical unit F1X is suppressed, and the frame portion G around the display area P4 can be reduced, and the display area can be enlarged and the machine can be miniaturized. purpose.

Further, since the optical module F1X is attached to the bonding head 32 and bonded to the liquid crystal panel P, the position of the bonding head 32 and the liquid crystal panel P can be determined with good precision.

Therefore, the bonding precision of the optical component F1X and the liquid crystal panel P can be improved.

Further, in the film bonding system 1, the continuous bonding of the layer sheets FXm can be facilitated, and the production efficiency of the optical display device can be improved. Further, since the arc-shaped holding surface 32a is used as the bonding head 32, the optical module F1X can be smoothly held by the oblique movement of the arc-shaped holding surface 32a, and the same arc-shaped holding surface 32a is held. The tilting movement can positively attach the optical component F1X to the liquid crystal panel P.

Further, in the film bonding system 1, the blade 31c is directed downward from the bonding surface of the liquid crystal panel P, and the optical module F1X is peeled off from the separation layer F3a, and the bonding head 32 is a bonding surface and an opposite side. The upper side surface is attached and held by the holding surface 32a, and the bonding surface is moved downward, and the peeling position and the bonding position are moved. Therefore, the optical component layer FX is transported downward by the bonding surface on the side of the adhesive layer F2a, and scratching of the bonding surface of the optical component layer FX, adhesion of foreign matter, and the like can be suppressed, and occurrence of poor bonding can be suppressed.

Further, the film bonding system 1 is configured to move the liquid crystal panel P to a loading position (each turntable start position (first turntable start position 11a and second turntable start position 16a)), and the bonding position (each adsorption position) The rotary machine tool (the first rotary table machine 11 and the second rotary machine tool 16) of the table 41) and the carry-out position (the first turntable end position 11b and the second turntable end position 16b) make the liquid crystal panel P can efficiently switch the conveying direction, and the rotary machine tool (the first rotary machine 11 and the second rotary machine 16) can also be used as part of the production line to suppress the length of the production line, and the degree of freedom in setting the system can be improved.

(Second embodiment)

Next, the structure of the first bonding apparatus of the second embodiment will be described. Fig. 14 is a schematic side view of the first bonding apparatus 113 of the present embodiment. In addition, the second bonding apparatus and the third bonding apparatus have the same configuration, and detailed description thereof will be omitted. In Fig. 14, the drawings of the first detecting camera 34, the second detecting camera 35, and the third detecting camera 36 are omitted for convenience of the drawing. In the following description, structural elements that are the same as those in the first embodiment are denoted by the same reference numerals, and their detailed description is omitted.

As shown in Fig. 14, the blade 31c, the suction stage 41, and the recovery stage 42 are arranged linearly in the layer conveying direction. The recovery stage 42 is disposed at an opposite position of the blade 31c via the adsorption stage 41.

In this configuration, it is possible to prevent foreign matter or the like from adhering to the surface of the liquid crystal panel P and the like, and it is possible to achieve the same effects as those of the first embodiment. Further, since the blade 31c, the suction stage 41, and the recovery stage 42 are arranged linearly in the layer conveying direction, the movement of the bonding head 32 by the moving device 70 is also linear. Therefore, as compared with the configuration in which the recovery stage 42 is disposed on the side of the layer transfer line, the movement axis of the bonding head 32 of the moving device 70 can be reduced, and the defective layer can be smoothly collected.

(Third embodiment)

Next, the structure of the first bonding apparatus of the third embodiment will be described. Fig. 15 is a schematic side view of the first bonding apparatus 213 of the present embodiment. In addition, the second bonding apparatus and the third bonding apparatus have the same configuration, and detailed description thereof will be omitted. In Fig. 15, for the sake of convenience of the drawings, the drawings of the first detecting camera 34, the second detecting camera 35, and the third detecting camera 36 are omitted. In the following description, structural elements that are the same as those in the first embodiment are denoted by the same reference numerals, and their detailed description is omitted.

As shown in Fig. 15, the blade 31c, the adsorption stage 41, and the recovery stage 42 are arranged linearly in the layer conveying direction. The recovery stage 42 is disposed between the blade 31c and the suction stage 41.

In this configuration, it is possible to prevent foreign matter or the like from adhering to the surface of the liquid crystal panel P and the like, and it is possible to achieve the same effects as those of the first embodiment. Further, since the blade 31c, the suction stage 41, and the recovery stage 42 are arranged linearly in the layer conveying direction, the movement of the bonding head 32 by the moving device 70 is also linear. Therefore, as compared with the configuration in which the recovery stage 42 is disposed on the side of the layer transfer line, the movement axis of the bonding head 32 of the moving device 70 can be reduced, and the defective layer can be smoothly collected.

(Fourth embodiment)

Next, the structure of the film bonding system of the fourth embodiment will be described. Fig. 16 is a schematic configuration diagram of the film bonding system 2 of the present embodiment. In Figure 16, for the convenience of the drawing, the film is attached. System 2 is divided into upper and lower layers. In the following, structural elements that are the same as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the first embodiment, the case where the width and length of the optical module F1X to which the bonding head 32 is bonded is the same as the display area P4 of the liquid crystal panel P is exemplified. On the other hand, in the present embodiment, a cutting device that laminates a layer sheet larger than the display region P4 (larger in width and length) to the liquid crystal panel P and cuts off the remaining portion of the layer sheet is provided. It is greatly different from the first embodiment.

In the present embodiment, as shown in FIG. 16, the film bonding system 2 is attached to the front/rear surface of the liquid crystal panel P, and the first optical component layer F1 and the second optical component layer F2 are bonded to each other. The first optical component F11, the second optical component F12, and the third optical component F13 cut by the third optical component layer F3 (optical component layer FX) (refer to FIG. 3, optical component F1X).

Further, in the present embodiment, the first layer sheet F1m, the second layer sheet F2m, and the third layer sheet F3m (hereinafter collectively referred to as the layer sheet FXm), which will be described later, are cut by the remaining portion outside the display area. The first optical component F11, the second optical component F12, and the third optical component F13 are formed.

Fig. 17 is a plan view (plan view) of the film bonding system 2. Hereinafter, the film bonding system 2 will be described with reference to Figs. 16 and 17 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, similarly to the first embodiment, the upstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport upstream side, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport downstream side.

The film bonding system 2 sets the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding step. The film bonding system 2 includes: a first sub-transporting device 6 and a second sub-conveying device 7; a first conveying device 8; a cleaning device 9, a first rotary machine tool 11, a second conveying device 12, and a first bonding device 13 and a second bonding device 15; a film peeling device 14; and a first cutting device 51.

Further, the film bonding system 2 includes a second rotary machine tool 16 provided on the downstream side of the panel transfer of the first rotary machine tool 11, a third transfer device 17, a third bonding device 18, and a second cutting device 52. a second sub-conveying device 7; a fourth conveying device 21; and a fifth conveying device 22.

The film bonding system 2 uses the driven main conveying device 5, each auxiliary conveying device (the first auxiliary conveying device 6 and the second auxiliary conveying device 7), and each rotary machine tool (the first rotary machine tool 11 and the second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and the liquid crystal panel P is sequentially subjected to a specific process. The liquid crystal panel P is, for example, in the main transport device 5, and transports the short side of the display region P4 toward the transport direction; each of the sub transport devices (the first sub transport device 6 and the second sub transport device that are perpendicular to the main transport device 5) 7), the long side of the display area P4 is conveyed toward the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display area P4 is turned toward each turn The desktop machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) is transported radially.

The film bonding system 2 is formed by laminating a layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P.

The first rotary machine tool 11 is used as a first turntable start position 11a at a loading position from the second transfer device 12 (the left end portion in plan view of Fig. 17), and is rotationally driven in a clockwise direction. The first rotary machine tool 11 is a first bonding/unloading position 11c at a position (the upper end portion of FIG. 17) that is rotated 90° clockwise from the first turret starting position 11a.

At the first bonding loading/unloading position 11c, the liquid crystal panel P is carried into the first bonding apparatus 13 by a transfer robot not shown. In the present embodiment, the first bonding apparatus 13 performs bonding of the first layer sheet F1m on the backlight side of the liquid crystal panel P. The first layer F1m is a layer of the first optical component layer F1 having a larger size than the display region P4 of the liquid crystal panel P. By the first bonding apparatus 13, the first layer sheet F1m can be bonded to the side of one of the front/rear surfaces of the liquid crystal panel P to form the first optical component bonding body PA1. The first optical component bonding body PA1 is carried from the first bonding apparatus 13 to the first bonding loading/unloading position 11c of the first rotary machine tool 11 by a transfer robot arm (not shown).

The first rotary machine tool 11 is a film peeling position 11e at a position (the upper right end portion of FIG. 17) that is rotated by 45° in the clockwise direction from the first bonding/unloading position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first layer sheet F1m is performed by the film peeling device 14.

The first rotary machine tool 11 is a position (the right end position in FIG. 17) that is rotated by 45 degrees in the clockwise direction from the film peeling position 11e as the second bonding carry-out/loading position 11d.

At the second bonding carry-out/loading position 11d, the liquid crystal panel P is carried into the second bonding apparatus 15 by a transport robot not shown. In the present embodiment, the second bonding apparatus 15 is used to bond the second layer sheet F2m on the backlight side of the liquid crystal panel P. The second layer F2m is a layer of the second optical component layer F2 having a larger size than the display area of the liquid crystal panel P. The second layer F2m can be bonded to the surface of the first layer F1m side of the first optical component bonding body PA1 by the second bonding device 15, to form the second optical component bonding body PA2.

The second optical component bonding body PA2 is carried from the second bonding apparatus 15 to the second bonding loading/unloading position 11d of the first rotary machine tool 11 by a transfer robot not shown.

The first rotary table machine 11 is a first turntable end position 11b (first cut position) at a position (the lower end portion in FIG. 17) that is rotated by 90° in the clockwise direction from the second bonding carry-out/loading position 11d.

In the present embodiment, the first turret end position 11b is a first cutting position at which the first layer F1m and the second layer F2m are cut by the first cutting device 51. The first cutting device 51 cuts off the remaining portion of the first layer sheet F1m and the second layer sheet F2m that are bonded to the liquid crystal panel P, respectively, on the outer side of the opposite portion of the display portion of the liquid crystal panel P. The first optical component F11 composed of the first optical component layer F1 and the second optical component F12 composed of the second optical component layer F2 are formed as optical components corresponding to the size of the display region of the liquid crystal panel P.

In addition, in the present specification, the "opposing portion with the display region P4" means a region larger than the display region P4 and smaller than the outer shape of the optical display member (the liquid crystal panel P), and avoids the electrons. The area of the functional part such as the component mounting part. In other words, "the remaining portion outside the opposing portion of the display region P4 is cut" includes the case where the remaining portion is cut along the outer periphery of the optical display member (liquid crystal panel P).

After the first layer F1m and the second layer F2m are attached to the liquid crystal panel P, the first optical component F11 and the second optical component F12 are not separated, so as to obtain a peripheral edge of the display region P4. The shape corresponds to the first optical component F11 and the second optical component F12. Moreover, the cutting step of the first layer F1m and the second layer F2m is also simplified.

The remaining portions of the first layer F1m and the second layer F2m are cut from the second optical component bonding body PA2 by the first cutting device 51 to form the first optical component F11 and the second optical component F12. The third optical component is bonded to the surface of one of the front/reverse sides of the liquid crystal panel P. The remaining portion cut from the first layer sheet F1m and the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings. The third optical component bonding body PA3 is attached to the first turntable end position 11b, and is carried out by the third transfer device 17.

The third transport device 17 can hold the liquid crystal panel P (the third optical component bonding body PA3) and can be freely transported in the vertical direction and the horizontal direction. The third transport device 17 transports the liquid crystal panel P held by the adsorption to the second turntable start position 16a of the second rotary machine tool 16, for example, and performs the front/reverse reverse of the liquid crystal panel P at the time of the transfer. In turn, the adsorption is released at the second turntable start position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.

The second rotary machine tool 16 is used as a second turntable start position 16a from the loading position (the upper end portion in the plan view of Fig. 17) from the third transfer device 17, and is rotationally driven in the clockwise direction. The second rotary machine tool 16 is a third bonding carry-out/loading position 16c at a position (right end of FIG. 17) that is rotated 90° clockwise from the second turntable start position 16a.

At the third bonding carry-out/loading position 16c, the liquid crystal panel P is carried into the third bonding apparatus 18 by a transport robot not shown. In the present embodiment, the third bonding apparatus 18 is used to bond the display surface side third layer sheet F3m. The third layer F3m is larger in size than the LCD surface. A layer of the third optical component layer F3 having a larger display area of the board P. By the third bonding device 18, the third layer F3m can be bonded to the other side of the front/reverse side of the liquid crystal panel P (the first optical component F11 and the second optical component bonding body PA3) The surface opposite to the surface to which the optical module F12 is bonded is formed to form the fourth optical component bonding body PA4. The fourth optical component bonding body PA4 is carried from the third bonding apparatus 18 to the third bonding loading/unloading position 16c of the second rotary machine tool 16 by a transfer robot not shown.

In the present embodiment, the second rotary machine tool 16 is a second cutting position 16e at a position (the lower end portion in FIG. 17) that is rotated 90° clockwise from the third bonding carry-in/place position 16c. At the second cutting position 16e, the cutting of the third ply F3m is performed by the second cutting device 52. The second cutting device 52 cuts off the remaining portion disposed outside the opposing portion of the display region P4 of the liquid crystal panel P from the third layer sheet F3m bonded to the liquid crystal panel P to form a display region corresponding to the liquid crystal panel P. P4 size optical component (third optical component F13).

The remaining portion of the third layer sheet F3m is cut from the fourth optical component bonding body PA4 by the second cutting device 52, and the third optical component F13 is bonded to the other side of the front/rear surface of the liquid crystal panel P. The first optical component F11 and the second optical component F12 are bonded to one side of the front/rear surface of the liquid crystal panel P to form a fifth optical component bonding body PA5. The remaining portion cut from the third layer sheet F3m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the first cutting device 51 and the second cutting device 52 are, for example, a carbon dioxide (CO ₂ ) laser cutting machine. Further, the configurations of the first cutting device 51 and the second cutting device 52 are not limited thereto, and for example, other cutting mechanisms such as a cutting blade may be used.

The first cutting device 51 and the second cutting device 52 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the outer periphery of the display region P4. The first cutting device 51 and the second cutting device 52 are connected to the same laser output device 53. The cutting mechanism is configured by the first cutting device 51, the second cutting device 52, and the laser output device 53, and is disposed in the display region P4 from the layer FXm. The remaining portion on the outer side of the opposing portion is cut to form an optical component F1X corresponding to the size of the display region P4. Since the laser output required for cutting each layer (the first layer F1m, the second layer F2m, and the third layer F3m) is not large, the high output laser output from the laser output device 53 can also be used. The light is divided into two, and is supplied to the first cutting device 51 and the second cutting device 52.

In the present embodiment, the second rotary machine tool 16 is rotated at a position 90° clockwise from the second cutting position 16e (the left end portion of Fig. 17) as the second turret end position 16b. At the second turntable end position 16b, the fifth optical unit bonding body PA5 is carried out by the fourth transfer device 21.

The fourth transfer device 21 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fourth transport device 21 transports the liquid crystal panel P held by the adsorption to the second home position 7a of the second sub-transport device 7, for example, and releases the adsorption at the second home position 7a to liquidize the liquid crystal panel P. The panel P is delivered to the second sub-conveying device 7.

The fifth transport device 22 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fifth transport device 22 transports the liquid crystal panel P held by the adsorption to the end point 5b of the main transport device 5, and releases the suction at the end point 5b to transfer the liquid crystal panel P to the main transport device 5.

The bonding inspection position omitted in the drawing is provided on the transport path of the liquid crystal panel P (fifth optical component bonding body PA5) after the second turntable end position 16b, and is omitted in the drawing at the bonding inspection position. The inspection device inspects the workpiece (liquid crystal panel P) to which the film is attached (check whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

The bonding step of the film bonding system 2 is completed via the above.

Hereinafter, the laminated layer F5 is introduced into the liquid crystal panel P by the first bonding apparatus 13 The step of bonding is illustrated as an example. In addition, the description of the bonding procedure of the second bonding apparatus 15 and the third bonding apparatus 18 having the same configuration as that of the first bonding apparatus 13 will be omitted.

In the present embodiment, the first bonding apparatus 13 cuts a layer (first layer sheet F1m) of the bonding layer sheet F5 larger than the display area P4 of the liquid crystal panel P from the first optical component layer F1, and The layer sheet (the first layer sheet F1m) of the bonding layer sheet F5 is held by the holding surface 32a of the bonding head 32, and the layer sheet (the first layer sheet F1m) of the bonding layer sheet F5 is attached to the liquid crystal panel. P to fit.

The adsorption stage 41 is driven and controlled by the control device 25 based on the detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38). Thereby, the positional alignment of the liquid crystal panel P with respect to the bonding head 32 at each bonding position can be performed.

The laminated layer F5 (layer sheet FXm) which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the bonding deviation of the optical component F1X is suppressed, and the optical component F1X of the liquid crystal panel P can be improved. The accuracy of the optical axis direction improves the color and contrast of the optical display device.

Here, the polarizing film constituting the optical component layer FX is formed by stretching a film of a polyvinyl alcohol (PVA) dyed by a dichroic dye toward a single axis, and the thickness of the PVA film is uneven or dichroic due to stretching. There is a problem that the dyeing is uneven, and the optical axis direction in the FX plane of the optical component layer may be deviated.

Therefore, in the present embodiment, the control device 25 determines the liquid crystal panel of the optical component layer FX based on the inspection data distributed in the optical axis plane of each part of the optical component layer FX stored in the storage device 24 (refer to FIG. 16). P fit position (relative fit position). Further, each of the bonding apparatuses (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) performs the layer FXm cut out from the optical component layer FX in accordance with the bonding position. The liquid crystal panel P is positionally aligned, and the liquid crystal panel P is attached to the layer FXm.

The method of determining the bonding position (relative bonding position) of the layer FXm with respect to the liquid crystal panel P can be as follows.

First, as shown in FIG. 18A, a plurality of checkpoints CP are set in the width direction of the optical component layer FX, and the optical axis direction of the optical component layer FX is detected at each checkpoint CP. The time at which the optical axis is detected may be the time when the roll drum R1 is manufactured, or may be the period before the half of the optical unit layer FX is unwound from the roll drum R1. The data in the optical axis direction of the optical component layer FX and the optical component layer FX position (the longitudinal direction position and the width direction position of the optical component layer FX) are stored in association with each other (omitted in the drawing).

The control device 25 acquires the optical axis data (inspection data distributed in the in-plane of the optical axis) of each of the inspection points CP from the storage device (omitted from the drawing) to detect the optical component layer FX of the portion in which the layer FXm is cut out (in the horizontal direction) The average optical axis direction of the area divided by the tangent CL).

For example, as shown in FIG. 18B, the angle (offset angle) between the optical axis direction and the edge line EL of the optical component layer FX is detected at the checkpoint CP each time to offset the maximum angle (maximum offset angle). As θmax, when the minimum angle (minimum offset angle) is θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Further, the average offset angle θmid direction of the edge line EL of the optical component layer FX is detected as the average optical axis direction of the optical component layer FX. Further, the offset angle is calculated, for example, by the edge line EL of the optical component layer FX, the counterclockwise direction being a positive angle, and the clockwise direction being a negative angle.

Next, the bonding position (relative bonding position) of the layer FXm with respect to the liquid crystal panel P is determined according to the average optical axis direction of the optical component layer FX detected by the above method, so that the long side of the display region P4 of the liquid crystal panel P is opposed. Or the short side is at the target angle. For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis direction of the optical component layer FX is longer than the display region P4. The layer FXm is bonded to the liquid crystal panel P with the side or the short side at 90°.

The cutting device (the first cutting device 51 and the second cutting device 52) detects the outer periphery of the display region P4 of the liquid crystal panel P by a detecting mechanism such as a camera, and does not follow the outer periphery of the display region P4. The ply FXm bonded to the liquid crystal panel P is intermittently cut. The outer peripheral edge of the display region P4 is detected by photographing the end portion of the liquid crystal panel P, the alignment mark provided on the liquid crystal panel P, or the outermost edge of the black matrix provided on the display region P4. A frame portion G (refer to FIG. 3) having a specific width is disposed on the outer side of the display region P4, and is used for arranging a sealant or the like for bonding the first substrate and the second substrate of the liquid crystal panel P within the width of the frame portion G The cutting of the layer sheet FXm is performed by the cutting device (the first cutting device 51 and the second cutting device 52).

In addition, the method of detecting the in-plane average optical axis direction of the optical component layer FX is not limited to this. For example, one or a plurality of checkpoints CP are selected from a plurality of checkpoints CP (refer to FIG. 18A) set in the width direction of the optical component layer FX, and the optical axis direction and the optical direction are detected for each of the selected checkpoints CP. The angle (offset angle) of the edge line EL of the component layer FX. And detecting an average value of the offset angles of the selected one or more checkpoints CP in the optical axis direction as the average offset angle, and detecting the edge line EL of the relative optical component layer FX and the average offset angle The direction is the average optical axis direction of the optical component layer FX.

As described above, the film bonding system 2 of the present embodiment bonds the optical module F1X to the liquid crystal panel P, and includes a bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding). The device 18) is rolled out from the roll drum R1 by a strip-shaped optical component layer FX having a width wider than either one of the long side or the short side of the display area P4 of the liquid crystal panel P, and has a longer length than the display area P4. Or the other side of the short side is longer to cut the optical component layer FX as the layer FXm, and then the layer FXm is bonded to the liquid crystal panel P; and the cutting device (the first cutting device 51 and the second The cutting device 52) cuts off the remaining portion disposed on the outer side of the facing portion of the display region P4 from the layer sheet FXm bonded to the liquid crystal panel P to form an optical component F1X corresponding to the size of the display region P4; The joining device (the first bonding device 13, the second bonding device 15, and the third bonding device 18) has a winding portion 31a that rolls the optical component layer FX from the roll cylinder R1 and the separation layer F3a. The determination unit determines whether or not the optical component layer FX that is wound up by the winding unit 31a contains a defect. ; Cutting means 31b, according to the judgment based As a result of the determination of the fixed portion, the optical component layer FX is cut by the residual separation layer sheet F3a to form a good quality layer sheet containing no defects or a defective product layer sheet containing defects; the blade edge 31c is a good layer or defective product The layer is peeled off from the separation layer sheet F3a; the adsorption stage 41 has an adsorption surface 41a for adsorbing and holding the liquid crystal panel P; and the recovery stage 42 is disposed at a position where the adsorption surface 41a does not overlap the adsorption stage 41 as viewed in the normal direction. The defective product layer is recovered; the bonding head 32 holds the good layer sheet peeled off from the separation layer sheet F3a and is bonded to the liquid crystal panel P, and holds the defective product layer sheet peeled off from the separation layer sheet F3a. The bonding to the recovery table 42 and the moving device 70 move the bonding head 32 between the blade 31c and the liquid crystal panel P or between the blade 31c and the recovery table 42.

According to this configuration, the defective layer sheets can be bonded together and discarded to the recovery stage 42.

Therefore, it is possible to remove the defective layer without using another film for removal or the like which is different from the separation layer. Further, compared with the structure in which the defective layer is recovered by using another thin film different from the separating element, the film for elimination can be omitted, and the cost required for the film for elimination can be saved. Further, since the defective layer can be recovered by the recovery stage 42, it is not necessary to additionally provide a means for collecting the film for rejection, and the structure of the apparatus can be simplified. Further, the defective layer sheet can be simultaneously removed, and the good layer sheet can be attached to the liquid crystal panel P. Therefore, the defective layer can be efficiently recovered.

Further, in the film bonding system 2, it is possible to design the optical unit F1X to correspond to the display area P4 with better precision, and to reduce the frame portion G outside the display area P4 (refer to FIG. 3), thereby achieving an enlargement of the display area and the machine. The purpose of miniaturization.

Further, in the film bonding system 2, the first cutting device 51 and the second cutting device 52 are laser cutting machines, and the first cutting device 51 and the second cutting device 52 are connected to the same laser output. The device 53 may also divide the laser light output from the laser output device 53 into two, and supply it to the first cutting device 51 and the second cutting device 52. In this case, compared with the case where each of the first cutting device 51 and the second cutting device 52 is connected to each of the laser output devices, the production system of the optical display device can be miniaturized.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the invention, including the component configuration, the structure, the shape, the size, the number, the arrangement, and the like.

Further, the size of the remaining portion of the layer sheet FXm (the size beyond the outer portion of the liquid crystal panel P) can be appropriately set in accordance with the size of the liquid crystal panel P. For example, in the case where the layer FXm is applied to a medium-sized and small-sized liquid crystal panel P of 5 inches to 10 inches, the interval between one side of the layer FXm and one side of the liquid crystal panel P is formed on each side of the layer FXm. Set in the range of 2mm~5mm in length.

Hereinafter, a film bonding system according to a fifth embodiment of the present invention will be described with reference to Figs. 19 to 21 . In addition, in the 19th to 21st drawings, for the sake of convenience of the drawings, the pattern of the second layer sheet F2m is omitted. In the present embodiment, the same components as those of the film bonding system 2 described in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. Further, in the present embodiment, the remaining portion outside the bonding surface is cut from the layer sheet FXm bonded to the liquid crystal panel P to form the optical module F1X.

The film bonding system of the present embodiment includes a first detecting device 91 (refer to Fig. 20). The first detecting device 91 is provided on the panel transport downstream side of the second bonding carry-in/place position 11d. The first detecting device 91 detects the edge of the bonding surface of the liquid crystal panel P and the first layer sheet F1m (hereinafter referred to as the first bonding surface).

For example, as shown in Fig. 19, the first detecting device 91 detects the end edge ED of the first bonding surface SA1 in the four inspection areas CA provided on the transport path of the first sub-conveying device 6 (the outer periphery of the bonding surface) edge). Each of the inspection regions CA is disposed at a position corresponding to the four corner portions of the first bonding surface SA1 having a rectangular outer shape. The edge ED is detected for each liquid crystal panel P conveyed on the production line. The edge ED data detected by the first detecting means 91 is stored in the memory section (refer to Fig. 16).

In addition, the arrangement position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side). Set.

Figure 20 is a schematic view of the first detecting device 91.

As shown in Fig. 20, the first detecting device 91 includes an illumination light source 94 that illuminates the bright edge ED, and an imaging device 93 that is disposed such that the normal direction of the first bonding surface SA1 is closer to the edge ED. In a state in which the inside of the first bonding surface SA1 is inclined, a screen on which the edge ED is imaged from the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded is attached.

The illumination light source 94 and the imaging device 93 are disposed in each of the four inspection areas CA (corresponding to the four corners of the first bonding surface SA1) shown in FIG.

Preferably, the angle θ between the normal line of the first bonding surface SA1 and the normal line of the imaging surface 93a of the photographing device 93 (hereinafter referred to as the tilt angle θ of the photographing device 93) can be set as a deviation when the panel is broken apart. Or the burrs or the like do not enter the shooting field of the photographing device 93. For example, in the case where the end surface of the second substrate P2 is shifted to the outside of the end surface of the first substrate P1, the inclination angle θ of the photographing device 93 can be set so as not to enter the end edge of the second substrate P2 into the photographing field of view of the photographing device 93.

Preferably, the inclination angle θ of the photographing device 93 can be set in accordance with the distance H between the first bonding surface SA1 and the center of the imaging surface 93a of the photographing device 93 (hereinafter referred to as the height H of the photographing device 93). For example, when the height H of the imaging device 93 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 93 can be preferably set to an angle in the range of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 93 and the tilt angle θ of the photographing device 93 can be obtained from the amount of deviation. In the present embodiment, the height H of the imaging device 93 is set to 78 mm, and the inclination angle θ of the imaging device 93 is set to 10°.

The illumination light source 94 is fixed to the imaging device 93 and disposed in each of the inspection areas CA.

Further, the illumination light source 94 and the imaging device 93 may be arranged to be movable along the edge ED of the first bonding surface SA1. In this case, one set of the illumination light source 94 and the photographing device 93 may be provided. Moreover, by this, the illumination source 94 and the photographing device 93 can easily capture the edge ED of the first bonding surface SA1. Move at the location.

The illumination light source 94 is disposed on the opposite side to the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded. The illumination light source 94 is disposed in a state in which the normal direction of the first bonding surface SA1 is inclined toward the outside of the first bonding surface SA1 from the edge ED. In the present embodiment, the optical axis of the illumination source 94 is parallel to the normal line of the imaging surface 93a of the imaging device 93.

In addition, the illumination light source may be disposed on the side of the first optical component bonding body PA1 to which the first layer F1m is bonded.

Further, the optical axis of the illumination light source 94 and the normal line of the imaging surface 93a of the imaging device 93 may also intersect each other with a slight inclination.

Further, as shown in Fig. 21, the imaging device 93 and the illumination light source 94 may be disposed at positions overlapping the edge ED along the normal direction of the first bonding surface SA1. The distance H1 between the first bonding surface SA1 and the center of the imaging surface 93a of the imaging device 93 (hereinafter referred to as the height H1 of the imaging device 93) can preferably be set to easily detect the edge ED of the first bonding surface SA1. s position. For example, it is preferable that the height H1 of the photographing device 93 can be set in a range of 50 mm or more and 150 mm or less.

The cutting position of the first layer sheet F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control device 25 (refer to FIG. 16) acquires the edge ED data of the first bonding surface SA1 stored in the storage device 24 (refer to FIG. 16) to determine the cutting position of the first layer F1m, so that the first The optical module F11 does not exceed the size of the outer side of the liquid crystal panel P (outside of the first bonding surface SA1). The first cutting device 51 cuts the first layer sheet F1m at the cutting position determined by the control device 25.

Returning to Fig. 16 and Fig. 17, the first cutting device 51 is provided on the downstream side of the panel conveyance of the first detecting device 91. The first cutting device 51 cuts off the remaining portions disposed on the outer side of the portion corresponding to the first bonding surface SA1 from the first layer F1m and the second layer sheet F2m bonded to the liquid crystal panel P, respectively. The first optical component F11 composed of the first optical component layer F1 and the second optical component F12 composed of the second optical component layer F2 are formed as light corresponding to the size of the first bonding surface SA1. Learning components.

Here, "the size corresponding to the first bonding surface SA1" is displayed as an area larger than the display area P4 and smaller than the outer shape of the liquid crystal panel P (the outline shape in the plan view), and the electronic component mounting portion is avoided. The size of the area of the functional part.

After the first layer F1m and the second layer F2m are attached to the liquid crystal panel P, the first optical component F11 and the second optical component F12 are not separated, so as to obtain the first bonding surface SA1. The outer peripheral shape conforms to the first optical component F11 and the second optical component F12. Moreover, the cutting step of the first layer F1m and the second layer F2m is also simplified.

The remaining portions of the first layer F1m and the second layer F2m are cut from the second optical component bonding body PA2 by the first cutting device 51 to form the first optical component F11 and the second optical component F12. The third optical component is bonded to the surface of one of the front/reverse sides of the liquid crystal panel P. At this time, the third optical component bonding body PA3 and the portion corresponding to the first bonding surface SA1 (each optical component (the first optical component F11 and the second optical component F12)) are left in a frame-like layer ( The remaining portions of the first layer F1m and the second layer F2m) are separated. The remaining portion cut from the first layer sheet F1m and the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the "portion corresponding to the first bonding surface SA1" is a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region that avoids a functional portion such as an electronic component mounting portion. In this embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portions are cut off by laser along the outer periphery of the liquid crystal panel P at three sides other than the functional portion, which is equivalent to the functional portion. On one side, the remaining portion is cut by laser from a position outside the liquid crystal panel P to the display region P4 side. For example, in the case of a bonding surface of a thin film transistor (TFT) substrate corresponding to the first bonding surface SA1, it may be from the side of the liquid crystal panel P at the side corresponding to the functional portion. At the edge (except for the functional portion), the cutting is performed at a position shifted by a certain distance toward the display region P4 side.

Further, the area of the liquid crystal panel P including the functional portion (for example, the entire liquid crystal panel P) is not limited to being bonded to the layer. For example, the layer sheet may be attached to the liquid crystal panel P in advance to avoid the area of the functional portion, and thereafter, at three sides of the liquid crystal panel P having a rectangular outer shape in plan view except for the functional portion The remaining portion is cut by laser along the periphery of the liquid crystal panel P.

Further, the film bonding system is provided with a second detecting device 92 (refer to Fig. 20). The second detecting device 92 is provided on the panel transport downstream side of the third bonding carry-in/place position 16c. The second detecting device 92 detects the edge of the bonding surface of the liquid crystal panel P and the third layer sheet F3m (hereinafter referred to as a second bonding surface). The edge data detected by the second detecting device 92 is stored in the storage device 24 (refer to Fig. 16).

The cutting position of the third layer sheet F3m is adjusted based on the detection result of the edge of the second bonding surface. The control device 25 (refer to FIG. 16) obtains the edge edge data of the second bonding surface stored in the storage device 24 (refer to FIG. 16) to determine the cutting position of the third layer F3m, so that the third optical component F13 does not exceed the size of the outer side of the liquid crystal panel P (outside of the second bonding surface). The second cutting device 52 cuts the third layer sheet F3m at the cutting position determined by the control device 25.

The second cutting device 52 is provided on the downstream side of the panel conveyance of the second detecting device 92. The second cutting device 52 cuts off the remaining portion disposed outside the portion corresponding to the second bonding surface from the third layer sheet F3m bonded to the liquid crystal panel P to form a size corresponding to the second bonding surface. Optical component (third optical component F13).

Here, the "corresponding to the size of the second bonding surface" is displayed as an area larger than the display area P4 and smaller than the outer shape of the liquid crystal panel P (the contour shape in the plan view), and the function of the electronic component mounting portion is avoided. Part of the area size. In the present embodiment, the size of the second substrate P2 is outside.

The remaining portion of the third ply F3m is cut from the fourth optical component bonding body PA4 by the second cutting device 52 to form the third optical component F13 to be bonded to the other side of the front/rear surface of the liquid crystal panel P. The first optical component F11 and the second optical component F12 are bonded to the fifth optical component bonding body PA5 on the side of the front/rear side of the liquid crystal panel P. At this time, the fifth optical component bonding body The PA5 system is separated from the remaining portion of the third layer sheet F3m which remains in a frame shape after the portion corresponding to the second bonding surface (the third optical component F13) is cut. The remaining portion cut from the third layer sheet F3m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the "portion corresponding to the second bonding surface" is a region which is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region in which the functional portion such as the electronic component mounting portion is avoided. In the present embodiment, the remaining portions are cut by laser along the outer periphery of the liquid crystal panel P at four side edges of the liquid crystal panel P having a rectangular outer shape in plan view. For example, in the case where the portion corresponding to the second bonding surface is the bonding surface of the CF substrate, since it is not a portion corresponding to the functional portion, the periphery of the liquid crystal panel P is formed at the four sides of the liquid crystal panel P. Cut off.

In the present embodiment, the first cutting device 51 is along the outer peripheral edge of the bonding surface (first bonding surface SA1) of the liquid crystal panel P and the first layer sheet F1m captured by the imaging device 93, and the first layer F1m is used. And the second layer sheet F2m is cut off. The second cutting device 52 cuts the third layer sheet F3m along the outer peripheral edge of the bonding surface (second bonding surface) of the liquid crystal panel P and the third layer sheet F3m which are imaged by the image capturing device 93.

As described above, according to the film bonding system of the present embodiment, the layer sheet FXm larger than the display region P4 is bonded to the liquid crystal panel P, and the liquid crystal panel P and the layer sheet FXm to which the layer sheet FXm is bonded are detected. The outer peripheral edge of the joint surface is cut from the remaining portion disposed on the outer side of the portion corresponding to the bonding surface from the layer FXm bonded to the liquid crystal panel P, whereby the size corresponding to the bonding surface can be formed on one surface of the liquid crystal panel P. Optical component F1X. Thereby, it is possible to design the optical unit F1X to correspond to the display area P4 with better precision, and to reduce the frame portion G outside the display area P4, thereby achieving the purpose of expanding the display area and miniaturizing the device.

Further, in the film bonding system of the above-described embodiment, the periphery of the bonding surface is detected for each of the plurality of liquid crystal panels P by using the detecting means, and each of the liquid crystals is individually attached to each of the liquid crystals based on the detected outer periphery. The cutting position of the ply of the panel P. Thereby, the optical component can be cut according to the required size without considering the individual difference in the size of the liquid crystal panel P or the layer, so there is no liquid crystal panel P. The quality deviation caused by the individual difference in the size of the layer can reduce the frame portion around the display area P4, and achieve the purpose of expanding the display area and miniaturizing the machine.

The preferred embodiments of the present invention have been described above, but are not limited to the examples of the present invention, and should not be construed as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Therefore, the invention should not be limited by the foregoing description, but by the scope of the claims.

1‧‧‧Film bonding system

5‧‧‧Main conveying equipment

5a‧‧‧ starting point

5b‧‧‧end point

6‧‧‧First delivery equipment

6a‧‧‧First starting position

6b‧‧‧first end position

7‧‧‧Second secondary conveyor

7a‧‧‧second starting position

7b‧‧‧second end position

8‧‧‧First transport device

9‧‧‧cleaning device

11‧‧‧First rotary machine tool

11a‧‧‧Starting position of the first turntable

11b‧‧‧First turntable end position

11c‧‧‧First fit out/loading position

11d‧‧‧Second fit moving out/moving position

11e‧‧‧film stripping position

12‧‧‧Second transport device

13‧‧‧First bonding device

14‧‧‧film stripping device

15‧‧‧Second laminating device

16‧‧‧Second rotary machine tool

16a‧‧‧Starting position of the second turntable

16b‧‧‧second turntable end position

16c‧‧‧ Third fit out/loading position

16d‧‧‧Finished inspection position

17‧‧‧ Third transport device

18‧‧‧ Third bonding device

19‧‧‧Checking device

21‧‧‧fourth transport device

22‧‧‧ fifth transport device

25‧‧‧Control device

31‧‧‧Ply conveying device

31c‧‧‧ Blade

F‧‧‧Transfer direction

F1‧‧‧First optical component layer

F2‧‧‧Second optical component layer

F3‧‧‧ third optical component layer

R1‧‧‧ Roller

R2‧‧‧Separation roller

P‧‧‧ LCD panel

Claims (8)

A production system for an optical display device, which is a production system for attaching an optical component to an optical display device formed by an optical display component, comprising: a bonding device, which is to correspond to a display area of the optical display component from the roll roller a strip of strip-shaped optical component layer is rolled out, and the optical component layer is cut as the optical component corresponding to the length of the display area, and then the optical component is attached to the optical display component; wherein the bonding device The winding unit includes: the optical component layer is unwound from the roll drum and the separation layer; and the determining unit determines whether the optical component layer rolled up by the winding part contains a defect; the cutting part According to the determination result of the determination unit, the optical component layer is cut by leaving the separation layer to form a good optical component that does not contain the defect or a defective optical component that contains the defect; the peeling part is The good optical component or the defective optical component is peeled off from the separation layer; the adsorption stage has an adsorption surface for adsorbing and holding the optical display component; The defective optical component is collected at a position that does not overlap the adsorption stage when viewed from the normal direction of the adsorption surface, and the bonding portion holds the good optical component after being peeled off from the separation layer. And connecting to the optical display member, holding the defective optical component peeled off from the separation layer to be attached to the recovery table; and moving the device to the bonding portion and the optical display member Move between the stripping unit and the recovery stage. The production system of the optical display device according to claim 1, wherein the peeling portion and the adsorption stage are disposed adjacent to each other along the optical component layer conveying direction; The recovery stage is disposed adjacent to the adsorption stage in the vertical direction of the optical component layer transport direction. The production system of an optical display device according to claim 1, wherein the peeling portion, the adsorption stage, and the recovery stage are arranged linearly along the optical component layer conveying direction. The production system of an optical display device according to claim 3, wherein the recovery stage is disposed at an opposite position of the peeling portion via the adsorption stage. The production system of an optical display device according to claim 3, wherein the recovery stage is disposed between the peeling portion and the adsorption stage. The production system of the optical display device according to any one of the preceding claims, wherein the marking device further includes a defective portion of the optical component layer according to the judgment result of the determining portion. The cutting portion is cut by the subsequent side portion of the mark end edge on the upstream side in the transport direction of the optical module layer to form the defective optical component. A production system for an optical display device, which is a production system for attaching an optical component to an optical display device formed by an optical display component, comprising: a bonding device that has a width from a roll cylinder that is wider than a display area of the optical display component A strip-shaped optical component layer having a longer length on either side of the long side or the short side is rolled out, and the optical component layer is cut as a layer with a length longer than the other of the long side or the short side of the display area a sheet, and then the layer is bonded to the optical display member; and the cutting device cuts off the remaining portion disposed outside the opposite portion of the display region from the layer bonded to the optical display member. Forming an optical component corresponding to the size of the display area; wherein the bonding apparatus includes: a winding-out portion, the optical component layer is unwound from the roll drum and the separation layer; the determining unit is The optical component layer rolled out by the winding portion determines whether or not there is a defect; The cutting unit cuts the optical component layer by leaving the separation layer according to the determination result of the determination unit to form a good layer sheet containing the defect or a defective layer sheet containing the defect; The good product layer or the defective product layer is peeled off from the separation layer; the adsorption stage has an adsorption surface for adsorbing and holding the optical display member; and the recovery stage is disposed in a normal direction from the adsorption surface. The defective layer is recovered at a position that does not overlap the adsorption stage; the bonding part holds the good layer peeled off from the separation layer and is bonded to the optical display member, and is held a defective layer layer peeled off from the separation layer sheet and bonded to the recovery stage; and a moving device for allowing the bonding portion between the peeling portion and the optical display member, or the peeling portion and the recycling portion Move between stations. A production system for an optical display device, which is a production system for attaching an optical component to an optical display device formed by an optical display component, comprising: a bonding device that has a width from a roll cylinder that is wider than a display area of the optical display component A strip-shaped optical component layer having a longer length on either side of the long side or the short side is rolled out, and the optical component layer is cut as a layer with a length longer than the other of the long side or the short side of the display area a sheet, and then the layer is attached to the optical display member; the detecting device detects the outer peripheral edge of the bonding surface of the optical display member to which the layer is bonded and the layer; and the cutting device is attached The layer formed on the optical display member is cut off to the remaining portion disposed outside the corresponding portion of the bonding surface to form an optical component corresponding to the size of the bonding surface; wherein the bonding device includes: a winding portion, Rolling out the optical component layer from the roll drum together with the separation layer; The determination unit determines whether or not the optical component layer that is wound up by the winding unit contains a defect, and the cutting unit cuts the optical component layer by leaving the separation layer according to the determination result of the determination unit. Forming a good layer sheet containing the defect or a defective product layer sheet containing the defect; the peeling portion is separating the good product layer sheet or the defective product layer sheet from the separation layer sheet; and the adsorption stage has adsorption holding The adsorption surface of the optical display member; the recovery stage is disposed at a position that does not overlap the adsorption stage when viewed from the normal direction of the adsorption surface, and collects the defective layer; the bonding portion is held from the Separating the good layer sheet after peeling off the layer sheet, bonding to the optical display member, holding the defective product layer peeled off from the separation layer sheet, and bonding to the recovery table; and moving the device to allow the bonding Moving between the stripping portion and the optical display member, or between the stripping portion and the recovery station; and the cutting device is along the optical display member and the layer of the layer detected by the detecting device Fit the outer circumference of the face, cut The ply.