TWI630115B - Production system for optical display device and production method for optical display device - Google Patents

Abstract

The production system of the optical display device comprises: a pedestal (39) supporting the liquid crystal panel (P); a winding-out portion (31a) that winds up the optical component layer (F1); and an in-plane distribution of the optical axis of the optical component layer (F1) A control device for adjusting the cutting direction; a first cutting device (31b) that cuts the optical component layer (F1) by a larger size than the display region (P4); and a layer (F1m) from the separation layer a peeling portion (31c) that is peeled off at (F3a); a bonding head (32) that holds the layer sheet (F1m) and moves obliquely; and the relative movement of the bonding head (32) and the pedestal (39) to make a layer sheet (F1m) a driving device in which the cutting edge is aligned or parallel with one side of the liquid crystal panel (P); a detecting device for detecting the outer peripheral edge of the bonding surface of the layer (F1m) and the liquid crystal panel (P); and a layer (F1m) a second cutting device (50) that is cut off from the opposite portion of the display region (P) and the remaining portion of the opposite portion of the opposite portion.

Description

Production system of optical display device and production method of optical display device

The present invention relates to a production system of an optical display device and a method of producing the optical display device. The present invention claims priority based on Japanese Patent Application No. 2013-105587, filed on Jan.

Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate attached to a liquid crystal panel (optical display member) is cut out from a long film to form a layer conforming to the size of a display region of the liquid crystal panel. After being packaged and transported to another production line, it is attached to a liquid crystal panel (for example, refer to Patent Document 1).

For example, the layer is obtained by using a long optical film as a starting material and cutting it into a rectangular shape with a cutter.

Fig. 15 is a schematic view showing a method of cutting out a conventional optical film slice.

First, as shown in Fig. 15(a), the optical film 101 is sent out by the transport device 100.

Next, as shown in Fig. 15(b), the optical film 101 sent from the conveying device 100 is cut at an oblique angle by a cutting device not shown. Thereby, the optical film intermediate (first intermediate film 102) is cut. In the bevel cutting process, the first intermediate film 102 is cut from the optical film 101 at a specific angle so that the target optical axis direction in the optical film slice is oriented in a direction suitable for the target liquid crystal display device.

Next, as shown in Fig. 15(c), the sheet-like assembly is laminated on the first intermediate film 102 by the film stacking device 110. The film laminating apparatus 110 has a pair of rolls 111, 112 and a roll 113 for feeding the sheet-like unit. The layered sheet member fed from the drum 113 and the first intermediate film 102 cut at a specific angle are stacked by a pair of rolls 111, 112 and sent to the next stage.

Next, as shown in Fig. 15(d), the laminated film laminated from the roll sheet 113 and the first intermediate film 102 cut at a specific angle is cut by a not shown in the figure. The breaking device is cut in half. Thereby, the second intermediate film 103 is cut out.

Next, as shown in Fig. 15(e), the quality of the cut second intermediate film 103 is visually inspected.

Next, as shown in Fig. 15(f), the second intermediate film 103 is placed on the pedestal 120. The pedestal 120 is provided with a mark 121 for positioning the second intermediate film 103. When the second intermediate film 103 is placed on the pedestal 120, the side cut at an oblique angle in the construction shown in Fig. 15(d) is used as a reference, and is positioned at the mark 121.

Further, a plurality of optical film slices 104 are cut out from the second intermediate film 103 by a cutting device not shown. In the cutting device, arranged in a checkered manner in plan view, the plurality of cutters arranged at intervals of the long side length of the optical film slice 104 and the intervals of the short side lengths of the corresponding optical film slices 104 are arranged. The plurality of cutters, the area cut by the four cutters in a rectangular shape, is the cut-out area of the optical film slice 104.

The cutting direction of the second intermediate film 103 by the cutting device (for example, the extending direction of the cutter arranged corresponding to the interval of the long side length of the optical film slice 104) is such that the longitudinal direction of the optical film 101 is at a target angle ( Configure according to the angle set by the design specifications. For example, in the case where the optical axis of the optical film slice 104 is designed to be 7° with respect to the long side of the optical film slice 104, the cutting direction of the cutting device is set to 7° with respect to the longitudinal direction of the optical film 101.

Patent Document 1: Japanese Patent Laid-Open No. 2003-255132.

Problem to be solved by the invention

In the drawing process of the fifteenth (f), the cutting direction of the second intermediate film 103 is set based on the longitudinal direction of the optical film 101, because generally, the elongated optical film 101 is used. The resin film dyed with the dichroic dye is produced by stretching on one axis, and the optical axis direction of the optical film 101 is substantially consistent with the extending direction of the resin film. However, regarding the optical axis of the optical film 101, the entire optical film 101 is not the same, and there is a slight difference in the width direction of the optical film 101. For example, in the case where the resin film dyed by the dichroic dye is stretched toward one axis to produce the optical film 101, the central portion of the optical film 101 is caused by problems such as uneven thickness of the resin film or uneven dyeing of the dichroic dye. A deviation occurs between a portion of the optical axis direction and an optical axis direction of a portion (edge portion) near the end of the optical film 101. Therefore, when a plurality of optical film slices 104 are cut out from the optical film 101, the optical axis deviation is reflected, and a deviation of the optical axis occurs between the optical film slices 104.

As described above, in the conventional method of cutting an optical film slice, there is a problem that the optical axis direction is deviated between the plurality of cut optical film slices. When the optical axis direction deviation occurs between a plurality of optical film slices, the optical axis direction deviation also occurs in the optical display device produced by the production system of the optical display device. Recently, the high contrast of display devices has evolved, requiring more stringent optical axis accuracy than in the past. For example, in a conventional mobile phone, the tolerance of the optical axis is ±1°, but the smart phone or tablet type message terminal device requires an optical axis tolerance of ±0.25°, and it is also expected that the precision required in the future will be more stringent.

The present invention has been made in view of the foregoing problems, and an object thereof is to provide a production system of an optical display device and a method of producing an optical display device capable of suppressing generation of an optical axis deviation in an optical display device.

Further, in the above-described conventional structure, in consideration of variations in the dimensions of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) of the ply of the liquid crystal panel, a ply which is slightly larger than the display region is cut. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, which has a problem that the size of the device is prevented from being reduced.

Another object of the present invention is to provide a production system of an optical display device capable of reducing the frame portion around the display area to achieve enlargement of the display area and miniaturization of the machine.

That is, an object of the aspect of the present invention is to provide a production system of a high-quality optical display device and a method of producing the optical display device which can reduce the influence of manufacturing variations. Technical means of solving problems

In order to achieve the above object, the present invention adopts the following aspects. (1) A production system of an optical display device according to an aspect of the present invention is a production system of an optical display device formed by bonding an optical component to an optical display component, comprising: a pedestal supporting the optical display component; The winding-out portion winds out the strip-shaped optical component layer together with the separation layer from the roll drum; the control device obtains the in-plane distribution data of the optical component layer, and according to the optical axis of the optical component layer Internally distributing data, calculating an in-plane average optical axis direction of the optical component layer, and adjusting a cutting direction of the optical component layer such that an in-plane average optical axis direction of the optical component layer is opposite to a cutting direction of the optical component layer At a target angle; the first cutting device is in a cutting direction adjusted by the control device, and the separation layer remains in the state of the optical component layer, and the optical is larger than the display region. The component layer is cut to obtain a ply; the peeling portion is peeled off from the separating ply; the bonding head is held against the holding surface and held on the holding surface Patch The optical display unit; the driving device moves the bonding head relative to the pedestal, and drives the bonding head for holding and bonding the layer; the detecting device is attached to the layer The outer peripheral edge of the bonding surface of the layer and the optical display member is detected on the bonding body of the optical display member; and the second cutting device is attached to the bonding body, and the layer is matched to the bonding surface The portion and the remaining portion corresponding to the outer side of the fitting surface portion are cut along the outer periphery to cut an optical component corresponding to the size of the bonding surface from the layer.

Here, "the bonding surface of the layer and the optical display member" means the surface of the optical display member facing the layer, and the "outer surface of the bonding surface" means that the optical display member is bonded to the optical display member. The outer periphery of the substrate on the side of the ply.

Moreover, the "part of the corresponding bonding surface" of the layer means that the display area of the optical display part opposite to the layer is larger in the layer, and is larger than the shape of the optical display part (contour shape in plan view) A small area is an area that avoids functional parts such as an electronic component mounting portion of the optical display unit. Similarly, "corresponding to the size of the bonding surface" means a size larger than the display area of the optical display part and smaller than the outer shape of the optical display part (the outline shape in the plan view), and avoids the optical display part. The size of the functional part such as the electronic component mounting portion.

(2) In the aspect of (1) above, wherein the control device detects two optical axes intersecting each other at a maximum angle in the plane of the optical component, and calculates that the angles of the two optical axes can be halved The axis is used as the in-plane average optical axis of the optical component layer.

(3) In the aspect of the above (1) or (2), further comprising a photographing device for taking a state of holding the layer on the holding surface; and the driving device is based on a photographing result of the photographing device, The mating head is moved relative to the pedestal such that the cut edge of the ply is aligned or parallel with one of the sides of the optical display member.

(4) In any one of the above (1) to (3), further comprising a memory device storing in-plane distribution data of an optical axis of the optical component layer.

(5) In any one of the above (1) to (4), further comprising an inspection device for inspecting an optical axis of the optical component layer at a plurality of inspection positions in a width direction of the optical component layer.

(6) The aspect of the above (5), wherein the inspection device has a light detecting element movable along a width direction of the optical component layer; and the inspection device is configured to cause the light detecting component along the optical component The optical axis of the optical component layer is detected by the light detecting element while moving in the layer width direction, whereby the optical axis of the optical component layer is inspected at a plurality of inspection positions in the width direction of the optical component layer.

(7) In any one of the above aspects (1) to (6), wherein the bonding head holds the layer held by the holding surface, and the moving direction of the bonding head and the vertical direction thereof are performed in the horizontal direction and Calibration of the direction of rotation.

(8) In any one of the above aspects (1) to (7), further comprising a detecting portion that detects a defect mark printed on the optical component layer; and the bonding head is the optical component layer The portion where the defect mark is detected is held on the bonding surface and transported to the disposal position.

(9) In any one of the above aspects (1) to (8), further comprising a turntable for moving the optical display member to a carry-in position, a bonding position of the layer to the optical display member, and Move out of the location.

(10) A method of producing an optical display device according to another aspect of the present invention is a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a first project, a slave roll The roller unwinds the strip optical component layer together with the separation layer; the second project is to obtain the in-plane distribution data of the optical component layer, and calculate the data according to the optical axis in-plane distribution data of the optical component layer The in-plane average optical axis direction of the optical component layer is adjusted to cut the optical component layer such that the in-plane average optical axis direction of the optical component layer is at a target angle with respect to the cutting direction of the optical component layer; Engineering, in the adjusted cutting direction, leaving the separation layer in the state of the optical component layer, cutting the optical component layer to a larger size than the display area to obtain a layer; Engineering, the layer is peeled off from the separation layer; the fifth project is to hold the layer on the holding surface of the bonding head, and to adhere the layer held on the holding surface to the optical Display part; sixth The project is to move the bonding head relative to the pedestal supporting the optical display component, and to drive the bonding head for holding and bonding the layer; and the seventh project is to The outer peripheral edge of the bonding surface of the layer and the optical display member is detected on the bonded body of the optical display member, and the portion of the laminated sheet corresponding to the bonding surface and the corresponding surface are bonded to the bonded body. The remaining portion of the outer side of the face portion is cut along the outer periphery to cut an optical component corresponding to the size of the abutment face from the ply.

(11) In the aspect of the above (10), wherein two optical axes intersecting each other at a maximum angle in the plane of the optical component are detected, and an axis capable of halving the angles of the two optical axes is calculated. It is used as the in-plane average optical axis of the optical component layer.

(12) A production system of an optical display device according to another aspect of the present invention is a production system of an optical display device formed by bonding an optical component to an optical display member, comprising: a bonding device, and a winding device Rolling the strip-shaped optical component layer, and cutting the optical component layer to a larger size than the display area of the optical display component, and bonding the layer to the optical display component; The device is configured to detect an outer peripheral edge of the bonding surface of the layer and the optical display member on the bonding body between the layer and the optical display member, and a cutting device attached to the bonding body from the layer And remaining the outer portion disposed on the outer side of the corresponding portion of the bonding surface along the outer periphery to form an optical component corresponding to the size of the bonding surface; wherein the bonding device has a winding portion and a winding The roller unwinds the optical component layer together with the separation layer; the cutting part is such that the separation layer remains in the state of the optical component layer, and the optical component layer is cut to obtain a layer; the peeling part is Layer from the separation layer And peeling; and bonding the head, the layer is held against the holding surface, and the layer held on the holding surface is attached to the optical display member.

(13) The aspect of the above (12), further comprising: a control device for determining a relative bonding position of the optical display member and the layer according to an optical axis direction inspection data of the optical component layer; and The bonding head is attached to the optical display member by the layer held by the holding surface according to the relative bonding position determined by the control device.

(14) The aspect of the above (13), wherein the bonding head allows the layer held by the holding surface to align the moving direction of the bonding head with the vertical direction and the rotation direction in the horizontal direction.

(15) In any one of the above (12) to (14), wherein the bonding device further has a detecting portion that detects a defect mark printed on the optical component layer, and the optical component layer is The portion where the defect mark is detected is held by the bonding head and transported to the disposal position.

(16) In any one of (12) to (15), further comprising a turntable for moving the optical display member to a carry-in position, a bonding position of the layer to the optical display member, and Move out of the location.

(17) In any one of the above (12) to (16), wherein the bonding head holds the layer sheet against the arc-shaped holding surface and is tiltable along the bending surface of the holding surface And bonding the layer held by the holding surface to the optical display member.

(18) A production system of an optical display device according to another aspect of the present invention is a production system of an optical display device formed by bonding an optical component to an optical display component, comprising: a first bonding device; The first roll cylinder unwinds the strip-shaped first optical component layer, and cuts the first optical component layer to a larger size than the display area of the optical display component, and then serves as the first layer. a layer of a sheet attached to a side of one of the front/rear sides of the optical display member as an optical component bonding body; and a second bonding device for unwinding the strip-shaped second optical component layer from the second roll cylinder, and After the second optical component layer is cut into a larger size than the display area to form a second layer, the second layer is bonded to the surface of the first layer side of the optical component bonding body; a detecting device is disposed on the bonding body of the second layer sheet and the optical component bonding body, and detects an outer peripheral edge of the first bonding surface which is a bonding surface of the first layer sheet and the optical display member; a cutting device attached to the second layer and the optical component On the body bonding body, the first layer and the second layer sheet bonded to the optical display member are respectively disposed on the outer periphery of the corresponding portion of the first bonding surface, along the outer periphery of the first bonding surface And cutting together, so that the first optical component composed of the first optical component layer and the second optical component composed of the second optical component layer are formed as optical components corresponding to the size of the first bonding surface; The first bonding device has a first winding portion that winds the first optical component layer together with the first separation layer from the first roll drum; the first cutting portion allows the first Separating the ply remains in the state of the first optical component layer, cutting the first optical component layer to obtain a first ply; and first peeling off the first ply from the first separating ply And peeling off; and the first bonding head is configured to hold the first layer sheet against the first holding surface, and to adhere the first layer sheet held on the first holding surface to the front/back surface of the optical display member a side of the one side; and the second bonding device has a second winding portion, which is from the first Roller roller unwinds the second optical component layer together with the second separation layer; the second cutting portion is configured to leave the second separation layer in a state of the second optical component layer, the second optical Cutting the component layer to obtain a second ply; the second peeling portion is to peel the second ply from the second separating ply; and the second bonding head is to hold the second ply And contacting the second layer held on the second holding surface to the surface of the first layer side of the optical component bonding body.

(19) The aspect of the above (18), further comprising a control device for determining a first relative of the optical display component and the first layer according to an optical axis direction inspection data of the first optical component layer Aligning the position, and determining the second relative bonding position of the optical component bonding body and the second layer according to the optical axis direction inspection data of the second optical component layer; the first bonding device of the first bonding device And closing the first layer of the first holding surface to the side of the positive/negative side of the optical display member according to the first relative bonding position determined by the control device; and the The second bonding head of the second bonding device attaches the second layer held by the second holding surface to the first layer of the optical component bonding body according to the second relative bonding position determined by the control device On the side of the sheet.

(20) The aspect of the above (19), wherein the first bonding head of the first bonding device causes the first layer held by the first holding surface to perform the bonding head in the horizontal direction The movement direction is aligned with the vertical direction and the rotation direction; and the second bonding head of the second bonding device allows the second layer held by the second holding surface to perform the moving direction of the bonding head in the horizontal direction Calibration with its vertical and swivel directions.

(21) In any one of the above (18) to (20), wherein the first bonding device further has a first detecting portion that detects a defect mark printed on the first optical component layer, and And the second bonding device further has a second detecting portion, and the second bonding device further detects the portion The defect mark printed on the second optical component layer, and the portion of the second optical component layer that detects the defect mark is held by the second bonding head and transported to the second disposal position.

(22) In any one of the above (18) to (21), further comprising a turntable for moving the optical display member to the carry-in position as a bonding of the first layer to the optical display member The first bonding position of the position, the second bonding position as the bonding position of the second layer sheet to the optical component bonding body, and the carrying-out position.

(23) In any one of the above (18) to (22), wherein the first bonding apparatus further has a first layer sheet conveying device, the first side from which the first optical component layer is wound The roll drum rolls the first optical component layer and transports the first optical component layer along the longitudinal direction thereof; the second bonding device further has a second layer conveyance device, which is wound from the side a second roll of the second optical component layer unwinds the second optical component layer and transports the second optical component layer along a longitudinal direction thereof; and a transport direction of the first optical component layer and the second The transport directions of the optical component layers are parallel to each other.

(24) In any one of the above (18) to (23), further comprising: a third bonding device that winds out the strip-shaped third optical component layer from the third roll cylinder, and After the third optical component layer is cut to a larger size than the display area and is used as the third layer, the third layer is attached to the other side of the front/reverse side of the optical display component; the second detecting device, Attached to the bonding layer of the second layer sheet and the third layer sheet and the optical component bonding body, and detecting the outer peripheral edge of the second bonding surface as the bonding surface of the third layer sheet and the optical display member; The second cutting device is disposed on the bonding layer of the second layer sheet and the third layer sheet and the optical component bonding body, and the third layer sheet bonded to the optical display member is disposed on the second layer a remaining portion of the outer side of the facing portion is cut along the outer periphery of the second bonding surface to form an optical component corresponding to the size of the second bonding surface; wherein the third bonding device has: a third winding out The third optical component layer and the third separation layer are rolled out together from the third roll drum; the third cutting part And leaving the third separation layer in a state of the third optical component layer, cutting the third optical component layer to obtain a third layer; and the third peeling portion, the third layer is from the The third separation layer is peeled off; and the third bonding head holds the third layer sheet against the third holding surface, and the third layer sheet held on the third holding surface is attached to the optical The other side of the front/back side of the display is displayed.

(25) The aspect of (24), wherein the control device determines the third relative fit of the optical display member to the third layer according to the optical axis direction inspection data of the third optical component layer. a third bonding head of the third bonding device, according to the third relative bonding position determined by the control device, bonding the third layer held by the third holding surface to the optical display component The other side of the positive/negative side.

(26) The aspect of the above (24) or (25), wherein the third bonding device further has a third detecting portion that detects a defect mark printed on the third optical component layer, and The portion of the third optical component layer that detects the defect mark is held by the third bonding head and transported to the third disposal position.

(27) In any one of (24) to (26), wherein the third bonding apparatus further has a third layer sheet conveying device, the third side from which the third optical component layer is wound Roller roller unwinds the third optical component layer and transports the third optical component layer along the longitudinal direction thereof; and the conveying direction of the first optical component layer and the conveying direction of the second optical component layer The conveying directions of the third optical component layers are parallel to each other.

(28) In any one of the above (24) to (27), wherein the remaining portions cut from the first layer sheet, the second layer sheet, and the third layer sheet are collectively from the optical Peel off at the display part.

(29) In any one of (24) to (28), wherein the first cutting device and the second cutting device are laser cutting machines, the first cutting device and the second The cutting device is connected to the same laser output device, and the laser output from the laser output device is branched and supplied to the first cutting device and the second cutting device.

(30) In any one of (24) to (29), wherein at least one of the first bonding head, the second bonding head, and the third bonding head is attached to the head system At least one of the first layer, the second layer, and the third layer is held against at least one of the first holding surface, the second holding surface, and the third holding surface And tilting along the bending of the holding surface to adhere the layer held by the holding surface to the optical display member or the optical component bonding body. Effect of invention

According to the present invention, it is possible to provide a production system of a high-quality optical display device and a method of producing an optical display device which can reduce the influence of manufacturing variations.

According to an aspect of the present invention, a production system of an optical display device capable of suppressing generation of an optical axis deviation in an optical display device and a method of producing the optical display device can be provided.

Moreover, according to another aspect of the present invention, it is possible to provide a production system of an optical display device which can reduce the frame portion around the display area and achieve the purpose of expanding the display area and miniaturizing the device.

(First embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a film bonding system which is a part of a production system of an optical display device will be described.

Fig. 1 is a schematic configuration diagram of a film bonding system 1 of the present embodiment. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel. The film bonding system 1 is part of a production system for producing an optical display device including the optical display member and the optical assembly. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. In Fig. 1, for the sake of convenience of the drawing, the film bonding system 1 is divided into upper and lower layers to draw.

Fig. 2 is a plan view of the liquid crystal panel P seen from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1 and the second substrate. Between P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view, and a region inside the outer periphery of the liquid crystal layer P3 is a display region P4 in plan view.

Figure 3 is a cross-sectional view taken along line A-A of Figure 2. The first optical component layer F1, the second optical component layer F2, and the third optical component layer F3 of the elongated strip are appropriately bonded to the front/rear surface of the liquid crystal panel P (refer to FIG. 1 , hereinafter collectively referred to as an optical component The layer FX) is cut out of the first optical component F11, the second optical component F12, and the third optical component F13 (hereinafter, collectively referred to as optical component F1X). In the present embodiment, the first optical unit F11 and the third optical unit F13 which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P. Further, a surface on the backlight side of the liquid crystal panel P is further bonded to a second optical component F12 as a luminance increasing film which is overlapped with the first optical component F11. Further, the first optical module F11, the second optical component F12, and the third optical component F13 are from the first layer F1m, the second layer F2m, and the third layer F3m (hereinafter, collectively referred to as a layer FXm) which will be described later. Cut out (window cut).

Fig. 4 is a partial cross-sectional view of the optical component layer FX attached to the liquid crystal panel P. The optical component layer FX has a film-shaped optical module body F1a, an adhesive layer F2a provided on one surface side (the upper side of FIG. 4) of the optical module body F1a, and a layer 15b that can be separated and separated by the adhesive layer F2a. A separation layer F3a on the one side of the optical module body F1a; and a surface protection film F4a laminated on the other side of the optical module body F1a (the lower side of FIG. 4). The optical module body F1a has a function of a polarizing plate across the entire area of the display area P4 of the liquid crystal panel P and its peripheral area. In addition, the hatching of each layer in Fig. 4 is omitted for convenience of the drawing.

The optical module main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer sheet F5.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before being separated from the adhesive layer F2a.

The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point.

Further, the optical component layer FX may be a structure that does not include the surface protective film F4a, and the surface protective film F4a may be a structure that cannot be separated from the optical component body F1a.

The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and a bonding agent or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.

Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.

Fig. 5 is a plan view (top view) of the film bonding system 1. Hereinafter, the film bonding system 1 will be described with reference to Figs. 1 and 5 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, the upstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport upstream side, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport downstream side.

The film bonding system 1 uses the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding process. The film bonding system 1 is provided with a first sub-conveying device 6 and a second sub-conveying device 7 extending from the main conveying device 5 in the right-angle direction from the starting point 5a; from the starting point 5a toward the first starting position 6a of the first sub-conveying device 6 a first transfer device 8 that transports the liquid crystal panel P, a cleaning device 9 that is disposed on the first sub-transport device 6, and a first rotary machine tool 11 that is disposed on the downstream side of the panel transport of the first sub-conveying device 6; a first transfer position 6b of the sub-conveying device 6 transports the second transfer device 12 of the liquid crystal panel P toward the first turntable start position 11a of the first rotary machine tool 11; and a first sticker disposed around the first rotary machine tool 11 The bonding device 13, the second bonding device 15, and the film peeling device 14.

Further, the film bonding system 1 includes a second rotary machine tool 16 provided on the downstream side of the panel transfer of the first rotary machine tool 11; and the first rotary machine tool 11 from the first turntable end position 11b to the second rotary machine tool a third transfer device 17 for transporting the liquid crystal panel P at the second turntable start position 16a; a third bonding device 18 and an inspection device 19 disposed around the second rotary machine tool 16, and a second rotary machine tool 16 The second transport device 7 on the downstream side of the panel transport; the fourth transport device 21 that transports the liquid crystal panel P from the second turret end position 16b of the second rotary machine tool 16 toward the second home position 7a of the second sub transport device 7 And a fifth conveying device 22 that conveys the liquid crystal panel P from the second end position 7b of the second sub-conveying device 7 toward the end point 5b of the main conveying device 5.

The film laminating system 1 uses a driven main conveying device 5, each sub conveying device (first sub conveying device 6, second sub conveying device 7) and each rotary machine tool (first rotary machine tool 11, second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and the liquid crystal panel P is sequentially subjected to a specific process. The liquid crystal panel P is transported on the production line with its front/reverse surfaces horizontal.

The liquid crystal panel P is, for example, in the main transport device 5, and transports the short side of the display region P4 toward the transport direction; each of the sub transport devices (the first sub transport device 6 and the second sub transport device that are perpendicular to the main transport device 5) 7), the long side of the display area P4 is transported in the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display area P4 is oriented toward each of the rotary tables. The machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) is transported in the radial direction. The symbol 5c in the figure corresponds to the liquid crystal panel P, and displays the rack transported along the main transport device 5.

The layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by a control device 25 as an electronic control unit.

The first conveying device 8 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The first transfer device 8 directly transports the liquid crystal panel P held by the adsorption to the first start position 6a (the left end portion of the fifth drawing) of the first sub-transport device 6 in a horizontal state, at which position The adsorption is released, and the liquid crystal panel P is transferred to the first sub-conveying device 6.

The cleaning device 9 is, for example, washed by water, brushed and washed with respect to the front/reverse surface of the liquid crystal panel P, and thereafter, the liquid on the front/rear surface of the liquid crystal panel P is removed. Further, the cleaning device 9 may be dry-cleaned to perform static elimination and dust collection on the front/rear surfaces of the liquid crystal panel P.

The second transfer device 12 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The second transfer device 12 directly transports the liquid crystal panel P held by the adsorption to the first turntable start position 11a of the first rotary machine tool 11 in a horizontal state, and at this position, the adsorption action is released. The liquid crystal panel P is delivered to the first rotary machine tool 11.

The first rotary machine tool 11 is a disk-shaped turntable having a rotary axis in the vertical direction, and the left end portion of Fig. 5 (plan view) is used as the first turntable start position 11a, and is rotationally driven in the clockwise direction. The first rotary machine tool 11 is a first bonding position 11c at a position (the upper end portion in Fig. 5) that is rotated 90° in the clockwise direction from the first turret starting position 11a. At the first bonding position 11c, the bonding of the first optical component F11 on the backlight side is performed by the first bonding apparatus 13.

The first rotary machine tool 11 is a film peeling position 11e at a position (the upper right end portion of Fig. 5) which is rotated by 45° in the clockwise direction from the first bonding position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first optical component F11 is performed by the film peeling device 14.

The first rotary machine tool 11 is a second attachment position 11d at a position (right end position in Fig. 5) that is rotated by 45° in the clockwise direction from the film peeling position 11e. At the second bonding position 11d, the bonding of the second optical component F12 on the backlight side is performed by the second bonding apparatus 15.

The first rotary table machine 11 is a first turntable end position 11b at a position (the lower end portion in Fig. 5) which is rotated 90° clockwise from the second bonding position 11d. At the first turntable end position 11b, the carry-out operation is performed by the third transfer device 17.

The third transport device 17 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The third transfer device 17 transports the liquid crystal panel P held by the adsorption to the second turntable start position 16a of the second rotary machine tool 16, and performs the front/back side of the liquid crystal panel P at the time of the transfer. Inverting, the adsorption is released at the second turntable start position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.

The second rotary machine tool 16 is a disk-shaped turntable having a rotary axis in the vertical direction, and the upper end portion of Fig. 5 (plan view) is used as the second turntable start position 16a, and is rotationally driven in the clockwise direction. The second rotary machine tool 16 is a third bonding position 16c at a position (right end portion of Fig. 5) that is rotated 90° clockwise from the second turret starting position 16a. At the third bonding position 16c, the third bonding apparatus 18 performs bonding of the third optical component F13 on the display surface side.

The second rotary machine tool 16 is a position (the lower end portion in Fig. 5) which is rotated 90° clockwise from the third bonding position 16c as the bonding inspection position 16d. At the bonding inspection position 16d, the inspection device 19 inspects the workpiece (liquid crystal panel P) to which the film is bonded (inspection of whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

The second rotary machine tool 16 is a second turntable end position 16b at a position (left end of Fig. 5) that is rotated 90° clockwise from the bonding inspection position 16d. At the second turntable end position 16b, the carry-out operation is performed by the fourth transfer device 21.

The fourth conveying device 21 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fourth transport device 21 transports the liquid crystal panel P held by the adsorption to the second home position 7a of the second sub-transport device 7, for example, and releases the adsorption at the second home position 7a to liquidize the liquid crystal panel P. The panel P is delivered to the second sub-conveying device 7.

The fifth conveying device 22 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fifth transport device 22 transports the liquid crystal panel P held by the adsorption to the end point 5b of the main transport device 5, and releases the suction at the end point 5b to transfer the liquid crystal panel P to the main transport device 5. The bonding work of the film bonding system 1 is completed through the above.

Hereinafter, the first bonding device 13 and the second cutting device 50 will be described in detail with reference to FIG. Fig. 6 is a side view showing main parts of the first bonding device 13 and the second cutting device 50. In addition, the second bonding apparatus 15 and the third bonding apparatus 18 have the same configuration, and detailed description thereof will be omitted. Further, the second cutting device 50 is provided corresponding to each of the first bonding device, the second bonding device, and the third bonding device. In Fig. 6, for the sake of convenience of the drawings, the main portions of the first bonding device 13 and the second cutting device 50 are described as being divided into upper and lower layers. In Fig. 6, the upper layer shows the case where the bonding head is driven, and the lower layer is displayed on the backlight side of the optical display member, and the remaining portion of the layer is cut.

The first bonding apparatus 13 performs the first layer sheet F1m of the bonding layer sheet F5 cut into a specific size in the first optical component layer F1 with respect to the upper surface of the liquid crystal panel P conveyed to the first bonding position 11c. fit. Thereafter, the outer peripheral edge of the bonding surface of the first layer sheet F1m and the liquid crystal panel P is detected by the first detecting device 81 on the bonded body of the liquid crystal panel P and the first layer sheet F1m. Further, the second cutting device 50 cuts the portion of the first layer sheet F1m corresponding to the bonding surface and the remaining portion of the corresponding bonding surface portion along the detected outer peripheral edge on the bonded body. The first optical component F11 corresponding to the size of the bonding surface is cut out from the first layer F1m.

The first bonding apparatus 13 includes a layer sheet conveying device 31 that winds the first optical module layer F1 from the roll drum R1 around which the first optical component layer F1 is wound, and conveys the first optical component layer F1 along the longitudinal direction thereof. The first optical component layer F1; and the bonding head 32, the layer conveying device 31 holds the first layer F1m of the bonding layer sheet F5 cut out from the first optical component layer F1, and the first layer sheet F1m It is bonded to the upper side surface of the liquid crystal panel P conveyed to the 1st bonding position 11c. Further, the film bonding system 1 includes a first detecting device 81 (described later) that is attached to the bonding body of the liquid crystal panel P and the first layer sheet F1m, and detects the bonding surface of the first layer sheet F1m and the liquid crystal panel P. The outer peripheral edge; and the second cutting device 50 are attached to the bonded body, and the portion corresponding to the bonding surface of the first layer sheet F1m and the remaining portion of the corresponding bonding surface portion are cut along the detected outer peripheral edge. The first optical component F11 corresponding to the size of the bonding surface is cut out from the first layer F1m.

The layer sheet conveying device 31 conveys the bonding layer sheet F5 with the separation layer sheet F3a as a carrier. The sheet conveying device 31 has a winding portion 31a that holds the roll drum R1 around which the strip-shaped first optical component layer F1 is wound, and winds up the first optical component layer F1 along the longitudinal direction thereof; The cutting device 31b applies a half cut to the first optical component layer F1 that is unwound from the roll drum R1, and a blade 31c (peeling portion) that winds the first optical component layer F1 half-cut by an acute angle. The separation layer sheet F5 is separated from the separation layer sheet F3a; and the winding portion 31d holds the separation drum R2 of the separation layer sheet F3a which is wound by the blade edge 31c.

Further, although omitted from the drawings, the layer sheet conveying device 31 has a plurality of guide rollers that wind the first optical module layer F1 along a specific conveyance path. The first optical component layer F1 has a width wider than the display region P4 of the liquid crystal panel P (corresponding to the short side length of the display region P4 in the present embodiment) in the horizontal direction (ply width direction) perpendicular to the conveyance direction. width.

The winding portion 31a located at the beginning of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are, for example, driven in synchronization with each other. Thereby, the unwinding portion 31a continuously winds up the first optical component layer F1 in the conveyance direction, and the winding portion 31d winds up the separation layer sheet F3a which passes through the blade 31c. In the layer conveyance device 31, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.

The first cutting device 31b is disposed above the first optical component layer F1. For example, the first cutting device 31b is provided with a circular cutting blade. Further, the cutting blade is configured to be movable in the direction of the leading side in one direction by a driving mechanism not shown. Further, the length of the guiding portion is longer than the length of the first optical component layer F1 in the width direction. The guide portion is rotationally driven in a plane parallel to the first optical module layer F1 in accordance with the cutting direction adjusted by the control device 25.

Each time the first cutting device 31b winds up the first optical component layer F1 in the longitudinal direction perpendicular to the layer width direction up to the length of the display region P4 (corresponding to the long side length of the display region P4 in the present embodiment) When the length is longer, one part of the thickness direction of the first optical component layer F1 is cut across the entire width in the width direction of the layer (half-cut).

The first cutting device 31b transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken (the separation layer F3a having a specific thickness remains). The position of the cutting blade of the cutting blade is adjusted, and the half cutting is applied to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

In the half-cut first optical component layer F1, the optical module body F1a and the surface protective film F4a are cut in the thickness direction thereof to form a transverse line across the entire width of the first optical component layer F1 in the layer width direction. The first optical component layer F1 is divided into sections having a length corresponding to the long side of the display region P4 in the longitudinal direction by the transverse line. The partitions are each one of the plies (first ply F1m) of the ply F5.

The size or shape of the first layer sheet F1m can be arbitrarily set in accordance with the shape of the optical component or the optical axis setting direction in the optical component. In the present embodiment, the first optical component layer F1 is half-cut (beveled) in a direction crossing the longitudinal direction thereof, and a transverse line is formed at a predetermined interval from the first optical component layer F1 to obtain a first layer. Slice F1m.

In the present embodiment, the strip-shaped first optical component layer F1 forming the roll drum R1 is made of the optical component layer manufacturing apparatus 40. Hereinafter, the manufacturing apparatus 40 of the optical component layer will be described in detail with reference to FIGS. 7 to 10.

Fig. 7 is a side view showing a manufacturing apparatus 40 for manufacturing an optical component layer of the optical component layer FX. Further, the manufacturing apparatus 40 of the optical component layer constitutes a part of a production system for producing an optical display device.

The optical device layer manufacturing apparatus 40 has a winding-out portion 41a that holds a base paper roll wound with a strip-shaped optical component layer (hereinafter, referred to as a mother sheet F0) having a wider width than the first optical component layer F1. R0, and the mother piece F0 is wound up along the longitudinal direction thereof; the inspection device 42 checks the optical axis of the mother piece F0 unwound from the original paper roll R0 at a plurality of inspection positions in the width direction of the mother piece F0; the winding portion 41b, the post-inspection reel R0A of the post-inspection layer F0A that has been taken up by the inspection device 42; the unwinding portion 41c holds the post-inspection reel R0A and rolls the post-inspection layer F0A along its longitudinal direction a cutter 45 for cutting a plurality of optical component layers FX from the post-inspection layer F0A taken up by the inspection reel R0A; and a winding portion 41d for winding the optical component layer cut by the cutter 45 FX, and keep the roll drum R1.

The base paper roll R0 has a wider width than the roll drum R1. For example, the width of the base paper roll R0 is about 1300 mm. The take-up reel R1 is taken up by a plurality of optical component layers FX cut by the mother sheet F0 wound out from the original paper roll R0 by the take-up portion 41d. For example, a plurality of optical component layers FX cut from a mother piece F0 having a width of about 1300 mm. Thereby, the width of the optical component layer FX is approximately 200 mm to 300 mm.

The inspection device 42 includes a light source 43 disposed above the mother sheet F0, and a light detecting element 44 disposed below the mother sheet F0. The light detecting element 44 is provided with a light receiving element (not shown in the drawings) that receives light that is emitted from the light source 43 and penetrates through the mother sheet F0. In the inspection device 42, the optical axis passing through the mother sheet F0 and the light detecting element 44 is detected by the light receiving element to detect the optical axis of the mother sheet F0. The light detecting element 44 is configured to be movable in the width direction of the mother sheet F0. The inspection device 42 is configured to move the light detecting element 44 in the width direction of the mother sheet F0 and to check the optical axis of the mother sheet F0 detected by the light detecting unit 44 at a plurality of inspection positions in the width direction of the mother sheet F0. The optical axis of the master F0.

Further, the inspection device 42 is not limited to a configuration in which the light detecting element 44 can be moved in the width direction of the mother sheet F0, and a configuration in which a plurality of light detecting elements are provided in the width direction of the mother sheet F0.

Fig. 8 is a plan view showing the main part of the manufacturing apparatus 40 of the optical component layer. As shown in Fig. 8, a plurality of checkpoints CP are provided in the width direction of the mother piece F0. The light detecting element 44 is movable in the direction in which the plurality of check points CP are arranged. Thereby, the direction of the optical axis on each of the inspection points CP is detected in the width direction of the mother piece F0.

The optical axis data of the mother piece F0 detected by the inspection device 42 and the position of the mother piece F0 (the position in the longitudinal direction of the mother piece F0 and the position in the width direction) are stored in the memory shown in FIG. Device 24.

Figs. 9A to 9C are diagrams showing the in-plane distribution of the optical axis of the mother sheet F0. In addition, in the case of FIG. 9A to FIG. 9C, the case where the mother sheet F0 is conveyed from the winding portion 41a in the longitudinal direction of the mother sheet F0 is shown.

As shown in Figs. 9A to 9C, various distributions exist in the in-plane distribution of the optical axis of the mother piece F0. The optical axis of the mother piece F0 is roughly arranged along the longitudinal direction of the mother piece F0.

However, it is visible in the optical axis plane of the mother piece F0 shown in Fig. 9A, and the optical axis direction slightly points to the lower right side with respect to the longitudinal direction of the mother piece F0. The distribution in the optical axis plane of the mother piece F0 shown in Fig. 9B is visible, and the optical axis direction pointing to the upper right direction and the lower right direction is alternately arranged in the width direction of the mother piece F0 with respect to the longitudinal direction of the mother piece F0. The distribution in the optical axis plane of the mother sheet F0 shown in Fig. 9C is seen, and the optical axis directions are slightly shifted inward from the central portion of the mother sheet F0 at both end portions in the width direction of the mother sheet F0.

The reason why the optical axis in the plane of Fig. 9C is distributed is as follows. In the case where the polarizing film constituting the mother sheet F0 is, for example, a polyvinyl alcohol (PVA) film dyed by a dichroic dye and formed by stretching toward one axis, When the stretching is performed, the thickness of the PVA film is uneven or the dyeing of the dichroic dye is uneven, and the optical axis direction of the central portion of the mother sheet F0 and the optical axis direction of the portion (edge portion) close to the end portion of the mother sheet F0 are deviated. The problem. Hereinafter, a mother sheet F0 having an in-plane distribution of the optical axis shown in FIG. 9C will be described as an example. The mother sheet F0 taken up from the base paper roll R0 passes through the inspection device 42 and is taken up as a post-inspection layer sheet F0A to the winding unit 41b.

Fig. 10 is a perspective view showing a state in which a plurality of optical component layers FX are cut after the inspection layer F0A is unrolled from the inspection roll R0A. Further, in Fig. 10, the drawings of the take-up reel R1 and the take-up portion 41d are omitted for the sake of convenience.

As shown in Fig. 10, a plurality of predetermined intervals are arranged in the width direction of the post-inspection layer F0A from above the post-inspection layer sheet F0A which is taken up by the unwinding roll ROA held by the unwinding portion 41c. A cutter 45. For example, a laser device or a cutting blade can be used as the cutter 45. A plurality of optical component layers FX are cut out from the post-inspection layer F0A which is unwound from the post-inspection reel R0A through a plurality of cutters 45.

In the case where the optical component layer FX is cut out from the post-inspection layer F0A, the optical axis deviation in the optical component layer FX is also generated in accordance with the optical axis deviation in the post-inspection layer F0A. In the present embodiment, the optical component layer FX is formed by cutting one of the widthwise directions of the layer F0A after inspection. That is, the inspected layer sheet F0A is divided in the width direction to form a plurality of optical component layers, and one optical component layer is used as the optical component layer FX. Therefore, the degree of deviation of the optical axis in the optical component layer FX is smaller than the degree of deviation of the optical axis in the layer F0A after inspection.

Incidentally, in the case where the optical component is cut out from the optical component layer FX, an optical axis deviation is generated in the optical component corresponding to the optical axis deviation. Therefore, the optical display device in which the optical component is mounted also has a deviation in the optical axis direction. In the case where the deviation is large, the optical display device is defective and cannot be used, and the number of optical display devices is reduced.

Therefore, in the present embodiment, the in-plane average optical axis direction of the optical component layer FX is calculated based on the data distributed in the optical axis plane of the optical component layer FX stored in advance in the memory device 24, and the optical component layer FX is cut. The direction is such that the in-plane average optical axis direction of the optical component layer FX is at a target angle with respect to the cutting direction of the optical component layer FX. Thereby, the optical axis deviation generated in the optical display device can be reduced.

Fig. 11 is an explanatory view showing a method of cutting the first layer sheet FXm from the optical component layer FX. In Fig. 11, a method of cutting the first ply F1m from the first optical component layer F1 of one example of the optical component layer FX is shown. However, the method of cutting the second ply F2m from the second optical component layer F2 and the method of cutting the third ply F3m from the third optical component layer F3 are also the same.

Here, the size of each of the layer sheets FXm (the first layer sheet F1m, the second layer sheet F2m, and the third layer sheet F3m) may be larger than, for example, the liquid crystal panel P. Further, in the layer sheet FXm, the size of the portion protruding toward the outside of the liquid crystal panel P (the size of the remaining portion of the layer sheet FXm) can be appropriately set in accordance with the size of the liquid crystal panel P. For example, when the layer FXm is applied to a small-sized and small-sized liquid crystal panel P of 5 吋 to 10 ,, the interval between one side of the layer FXm and one side of the liquid crystal panel P at each side of the layer FXm. It can be set to a length ranging from 2 mm to 5 mm.

In the present embodiment, the first optical component layer F1 conveyed from the winding portion 31a is cut at an oblique angle by the first cutting device 31b. Thereby, a plurality of first layer sheets F1m are cut out. Although not shown in the drawings, the first layer sheet F1m has an in-plane distribution of the optical axis. When the first layer sheet F1m is cut out from the first optical component layer F1, the cutting direction of the first optical component layer F1 of the first cutting device is adjusted in accordance with the in-plane distribution of the optical axis of the first layer sheet F1m. Hereinafter, an example of a method of cutting the first layer sheet F1m from the first optical module layer F1 will be described.

12A and 12B are explanatory views of a method of adjusting the cutting direction of the first optical component layer F1. Fig. 12A is a view showing the in-plane distribution of the optical axis of the first optical component layer F1. Fig. 12B is a view showing a state in which the first cutting device 31b is adjusted after the cutting direction of the first optical module layer F1 is adjusted.

Further, in FIGS. 12A and 12B, the symbol L1 is a specific axis (the axis along the edge line (width edge) of the first optical component layer F1). The symbol L2 and the symbol L3 are axes parallel to each other with respect to the axis L1. The symbol V1 is an optical axis (hereinafter referred to as a first optical axis) having a maximum offset angle with the axis L1. The symbol V2 is an optical axis (hereinafter referred to as a second optical axis) having a minimum offset angle with the axis L2. The symbol V3 is an axis of halving of the angle between the first optical axis V1 and the second optical axis V2 (hereinafter referred to as an average optical axis). Θmax is an angle between the specific axis L1 and the first optical axis V1 (hereinafter referred to as a maximum offset angle). Θmin is an angle between the specific axis L2 and the second optical axis V2 (hereinafter referred to as a minimum offset angle). Θmid is an angle between the specific axis L3 and the average optical axis V3 (hereinafter referred to as an average offset angle).

Here, the "offset angle" in FIGS. 12A and 12B is a positive angle with respect to a specific axis in a clockwise direction, and a negative angle with respect to a specific axis in a counterclockwise direction.

In the present embodiment, the control device 25 detects the first optical axis V1 and the second optical axis V2 that intersect each other at the maximum angle in the plane of the first optical component layer F1, and calculates the first optical axis V1 and the second optical axis V2. The angle of the sandwiched angle is divided as the in-plane average optical axis (average optical axis V3) of the first optical component layer F1.

In the present embodiment, the angular difference between the maximum offset angle θmax and the minimum offset angle θmin is Δα. In this case, when the minimum offset angle θmin is 0, as shown in Fig. 12A, the maximum offset angle θmax is expressed as an angle (Δα). Further, the average offset angle θmid is expressed as an angle (Δα/2).

For example, in order to manufacture the first optical component F11 (refer to FIG. 13), the cutting is performed at a specific angle so that the in-plane average optical axis direction of the first optical component F11 is adapted to the direction of the target liquid crystal display device. For example, in the case of the absorption axis of the polarizing plate, the specific angle is 7°.

Here, a case where the axis L1 along the edge line of the first optical component layer F1 is taken as the target optical axis direction in the first optical component is considered. In this case, when the minimum offset angle θmin is 0, since the second optical axis V2 has a minimum offset angle with the axis L2, it is slightly aligned with the target optical axis direction in the first optical component. On the other hand, since the first optical axis V1 and the axis L1 have the largest offset angle, they are significantly deviated from the target optical axis direction in the first optical component. The first optical axis V1 is offset from the target optical axis direction in the first optical component by an angle Δα.

On the other hand, in the present embodiment, the control device 25 is configured to be able to rotate the first cutting device 31b such that the in-plane average optical axis direction of the first optical component layer F1 is opposite to the cutting direction Vc of the first optical component layer F1. The structure at the target angle. In the present embodiment, as shown in Fig. 12B, the first cutting device 31b is rotated to adjust the cutting direction of the first optical component layer F1 so that the axis formed by the specific angle γ with respect to the average optical axis V3 (axis L4) As a reference when the first optical component F11 is cut out from the first optical component layer F1.

For example, in the case where the cutting direction of the first cutting device 31b is set to a direction perpendicular to the axis L1 along the edge line of the first optical component layer F1 in the initial state, the first cutting device 31b is moved from the initial state position toward Only the angle of rotation (γ + Δα/2) is clockwise. Thereby, the cutting direction Vc has an angle (γ+Δα/2) with respect to the cutting direction of the initial state.

In this way, the shaft L4 is a reference when the first optical component F11 is cut out from the first layer F1m. In other words, the direction perpendicular to the cutting direction Vc is the reference when the first optical component F11 is cut out from the first ply F1m. Further, the average optical axis V3 corresponds to the optical axis direction as the target in the first optical component F11.

In this case, the second optical axis V2 is only shifted by an angle (γ - Δα/2) with respect to the axis L4. On the other hand, the first optical axis V1 is shifted by an angle (γ + Δα/2) with respect to the axis L4. That is, the second optical axis V2 is shifted by only an angle (-Δα/2) with respect to the target optical axis direction in the first optical component F11. On the other hand, the first optical axis V1 is shifted by only an angle (Δα/2) with respect to the target optical axis direction in the first optical component F11.

As described above, according to the present embodiment, since the average optical axis V3 corresponds to the target optical axis direction in the first optical component F11, compared with the case where the axis L1 along the edge line of the first optical component layer F1 is used as the target optical axis direction in the optical component. The offset angle of both the first optical axis V1 and the second optical axis V2 can be reduced to half (offset angle Δα → Δα/2).

Returning to Fig. 6, the blade 31c is located below the first optical component layer F1 which is conveyed slightly horizontally from the left side to the right side of Fig. 6, and extends at least across the entire width direction of the first optical component layer F1. Formed by the width. The blade 31c is wound in such a manner that it is wound in a sliding contact with the side of the separation layer F3a of the first optical component layer F1 after the half cutting.

The blade 31c winds the first optical component layer F1 at an acute angle to its sharp-angled front end. When the first optical component layer F1 is folded back at an acute angle at the front end of the blade 31c, the separation layer F3a is peeled off from the bonding layer F5. At this time, the adhesive layer F2a of the bonding layer sheet F5 (the bonding surface with the liquid crystal panel P) faces downward. Immediately above the front end portion of the blade 31c is a separation layer peeling position 31e, and the arc-shaped holding surface 32a of the bonding head 32 comes into contact with the front end portion of the blade edge 31c from above, so that the surface of the layer of the bonding layer sheet F5 is protected. The film F4a (the side opposite to the opposing side of the bonding surface) is adhered to the holding surface 32a of the bonding head 32.

The bonding head 32 is a holding surface 32a having a convex arc shape in parallel with the width direction of the layer. The holding surface 32a has a weaker adhesive force than the bonding surface (adhesive layer F2a) of the bonding layer sheet F5, for example, and the surface protective film F4a of the bonding layer sheet F5 can be repeatedly adhered and peeled off.

The bonding head 32 is attached to the blade 31c, and has an axis along the width direction of the layer as a center, is parallel to the longitudinal direction, and is inclined to move along the curved surface of the holding surface 32a. When the bonding layer sheet F5 is adhered and adhered, and the bonding layer sheet F5 which is adhered and adhered is bonded to the liquid crystal panel P, the tilting movement of the bonding head 32 is appropriately performed.

The bonding head 32 is in a state in which the holding surface 32a faces downward, and the curved end side (the right side of FIG. 6) of the holding surface 32a is inclined downward, and the curved end side of the holding surface 32a is abutted against the blade from above. The front end portion of 31c is adhered to the front end portion of the bonding layer sheet F5 at the separation layer sheet peeling position 31e to the holding surface 32a. Thereafter, the bonding layer sheet F5 is continuously wound up and the bonding head 32 is tilted and moved, whereby the layer sheets of the bonding layer sheet F5 are entirely adhered to the holding surface 32a.

The bonding head 32 can perform a lifting operation of a specific distance above the separation layer peeling position 31e and the first bonding position 11c, and can appropriately move between the separation layer peeling position 31e and the first bonding position 11c. . The bonding head 32 is coupled to the driving device, and can be driven during the lifting, the moving, and the tilting movement.

When the bonding layer sheet F5 is adhered to the holding surface 32a, the bonding head 32 is detached from the driving device 33, for example, after the end portion of the bonding layer sheet F5 is adhered to the holding surface 32a. From this state, the tilting movement is passively accompanied by the unwinding of the bonding layer sheet F5. When the bonding head 32 is tilted to move until the bonding layer F5 is entirely adhered to the holding surface 32a, the tilting movement is locked in the inclined state by, for example, engagement with the driving device 33, and in this state, the tilting movement is performed. Moves over a fitting position 11c.

When the bonding head sheet F5 is adhered to the liquid crystal panel P, the bonding head 32 is actively tilted by, for example, the driving device 33, and the bonding layer sheet F5 is pressed along the bending of the holding surface 32a. It is attached to the upper side of the liquid crystal panel P to be surely bonded.

A first detecting camera 34 is disposed below the end portion before the blade 31c, and the layer end of the layer of the bonding layer sheet F5 at the portion is conveyed to the downstream end portion. The detection data of the first detection camera 34 is transmitted to the control device 25. When the first detecting camera 34 detects the downstream end of the bonding layer sheet F5, for example, the control device 25 temporarily stops the layer sheet conveying device 31, and thereafter lowers the bonding head 32 to fix the front end of the bonding layer sheet F5. The portion is adhered to the holding surface 32a.

When the first detecting camera 34 detects the downstream side end of the bonding layer sheet F5 and temporarily stops the layer sheet conveying device 31, the control device 25 performs the cutting of the bonding layer sheet F5 by the first cutting device 31b. That is, along the detection position of the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cutting position along the first cutting device 31b (the advance and retraction position of the cutting blade of the first cutting device 31b) The distance between the layer transport routes is equivalent to the length of the layer sheet (first layer sheet F1m) to which the layer sheet F5 is bonded.

The first cutting device 31b is movable along the layer transport path, and the distance between the detection position of the first detecting camera 34 and the cutting path between the cutting positions of the first cutting device 31b is changed by the movement. The movement of the first cutting device 31b is controlled by the control device 25, and after the cutting of the bonded layer sheet F5 by, for example, the first cutting device 31b, a layer of the laminated layer sheet F5 is wound up (first In the case of the distance of the layer F1m), when there is a deviation between the cut end and the specific reference position, the deviation is corrected by the movement of the first cutting device 31b. Further, the cutting of the bonding layer sheet F5 having a different length may be performed by the movement of the first cutting device 31b.

The first detecting camera 34 can also detect the defect mark printed on the bonding layer F5. This defect mark is marked by inkjet or the like from the side of the surface protective film F4a when the defect roll is found in the first optical component layer F1 at the time of manufacture of the roll reel R1. The bonding layer sheet F5 on which the defect mark is detected does not adhere to the liquid crystal panel P after being adhered to the bonding head 32, but moves to the discarded position (discarded position) avoiding the first bonding position 11c, and overlaps Close to the waste layer and so on. Further, when the defect mark is detected, a process of cutting the laminated layer sheet F5 with a minimum width and discarding it may be designed.

When the bonding layer sheet F5 moves from the separation layer sheet peeling position 31e toward the first bonding position 11c, it adheres to the two corner portions of the bonding layer sheet F5 of the holding surface 32a (for example, two of the proximal end portions of the front end portion) The corners are each photographed by a pair of second detection cameras 35. In other words, the holding state on the holding surface 32a of the first layer sheet F1m is imaged by the pair of second detecting cameras 35. The detection data of each of the second detecting cameras 35 is transmitted to the control device 25. The control device 25 confirms, for example, the horizontal direction of the bonding layer sheet F5 of the bonding head 32 (the moving direction of the bonding head 32 and its vertical direction and the rotation direction of the center of the vertical axis) based on the imaging data of each of the second detecting cameras 35. position. In the case where the relative positions of the bonding head 32 and the bonding layer sheet F5 are different, the bonding head 32 performs (position) alignment by using the position of the bonding layer sheet F5 as a specific reference position.

At a first bonding position 11c of the first rotary machine tool 11, a pair of third detecting cameras 36 are provided for performing positional alignment of the liquid crystal panel P in the horizontal direction at the first bonding position 11c. At a second bonding position 11d of the first rotary machine tool 11, a pair of fourth detecting cameras 37 for performing positional alignment in the horizontal direction on the second bonding position 11d of the same liquid crystal panel P are provided. Each of the third detecting cameras 36 captures, for example, the two corner portions on the left side in the first drawing of the glass substrate (first substrate P1) of the liquid crystal panel P. Each of the fourth detecting cameras 37 captures, for example, the two corner portions on the left side in the first drawing of the glass substrate of the liquid crystal panel P.

At a third bonding position 16c of the second rotary machine tool 16, a pair of fifth detecting cameras 38 are provided for performing positional alignment in the horizontal direction on the third bonding position 16c of the liquid crystal panel P. Each of the fifth detecting cameras 38 captures, for example, the two corner portions on the left side in the first drawing of the glass substrate of the liquid crystal panel P. The detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38) is transmitted to the control device 25. Further, instead of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38), a sensor may be used.

A position calibration table 39 (position calibration platform) is provided on each of the rotary machine tools (the first rotary machine tool 11 and the fifth rotary table machine 16), and the liquid crystal panel P is placed and the positional alignment in the horizontal direction can be performed. The position calibration table 39 is driven and controlled by the control device 25 based on the detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38). Thereby, it is possible to perform the respective rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16 (each of the bonding positions (the first bonding position 11c, the second bonding position 11d, and the third bonding position 16c). )) Position calibration of the liquid crystal panel P.

The laminated layer F5 which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the bonding deviation of the layer FXm is suppressed, and the optical axis direction of the optical component F1X of the liquid crystal panel P can be improved. Accuracy, improve the color and contrast of optical display devices.

Fig. 13 is an explanatory view showing a method of bonding the first layer sheet F1m with respect to the liquid crystal panel P.

Further, in Fig. 13, the symbol Lc is the cut edge of the first layer sheet F1m. Further, the symbol Lp is one side of the optical display member. Further, the symbol Lp1 is a part of the cutting line when the first optical component F11 is cut out from the first ply F1m along the outer peripheral edge of the bonding surface of the liquid crystal panel P and the first ply F1m and the second ply F2m (rectangular cutting) One side of the line).

The drive unit 33 can cause the mating head 32 to move relative to the position calibration stage 39. The driving device 33 transmits the control signal of the control device 25 to move the bonding head 32 and the position calibration table 39 so that the cutting edge Lc of the first layer F1m and the liquid crystal panel are cut by the first cutting device 31b. Lp on one side of P is uniform or parallel. For example, the driving device 33 is disposed in the first direction parallel to the mounting surface 39a of the liquid crystal panel P in the position alignment table 39, parallel to the mounting surface 39a and perpendicular to the first direction, and the mounting surface 39a. The aligning head 32 and the position aligning table 39 are relatively moved in the θ direction in which the third direction of the normal direction is rotated in the direction of the axis in the third direction. In the present embodiment, the drive unit 33 does not move the position calibration table 39, and only the movement of the bonding head 32 is performed.

In addition, the form of the relative movement of the drive unit 33 is not limited thereto. For example, by moving the position calibration table 39 or moving both the bonding head 32 and the position calibration table 39 without moving the bonding head 32, the bonding head 32 of the present invention and the position calibration table 39 can be used for relative movement. form.

In the present embodiment, the axis Lp1 (L4) formed at a specific angle γ with respect to the average optical axis V3 is used as a reference when the first optical module F11 is cut out from the first layer F1m.

Further, a second cutting device 50 for providing a corresponding portion of the bonding surface of the liquid crystal panel P and the first layer sheet F1m from the first layer sheet F1m is provided on the downstream side in the conveying direction of the first cutting device 31b. , and the remaining part of the outside is cut off.

As shown in Fig. 6, the second cutting device 50 is continuously cut along the outer peripheral edge of the bonding surface of the liquid crystal panel P detected by the detecting device described later and the first layer sheet F1m bonded to the liquid crystal panel P. Break the first layer F1m.

A frame portion G having a specific width for providing a sealant or the like for joining the first substrate P1 and the second substrate P2 is provided on the outer side of the display region P4, and a second cutting device is disposed within the width of the frame portion G. 50 laser cutting.

Thus, the detection of the outer periphery of the bonding surface and the cutting of the cutting device are performed as follows.

Fig. 23 is a schematic view showing the first detecting means (detecting means) 81 for detecting the outer periphery of the bonding surface. The first detecting device 81 included in the film bonding system 1 of the present embodiment includes an imaging device 83 that captures a bonding surface of the liquid crystal panel P and the first layer F1m in the first optical component bonding body PA1 (hereinafter, The first bonding surface (bonding surface) SA1) is a screen of the outer peripheral edge ED; the illumination light source 84 illuminates the outer peripheral edge ED; and the control unit 85 stores the image captured by the imaging device 83, and is detected based on the screen. The calculation of the outer circumference ED.

In the case where the cutting of the first layer sheet F1m is performed on the position aligning table 39, the first detecting means 81 is disposed in the vicinity of the position aligning table 39.

The photographing device 83 is fixed and disposed inside the first bonding surface SA1 of the outer peripheral edge ED. The photographing device 83 is inclined, and the normal line of the first bonding surface SA1 is at an angle θ with the normal line of the imaging surface 83a of the imaging device 83 (hereinafter referred to as the tilt angle θ of the imaging device 83). The photographing device 83 faces the outer peripheral edge ED of the photographing surface 83a, and photographs the outer peripheral edge ED from the side where the first layer sheet F1m is bonded to the bonded body (first optical component bonded body PA1) of the first layer sheet F1m and the liquid crystal panel P. Picture.

The inclination angle θ of the photographing device 83 is preferably set so as to reliably capture the outer periphery of the first substrate P1 constituting the first bonding surface SA1. For example, when the main panel is divided into a plurality of liquid crystal panels, and the liquid crystal panel P is formed by a so-called multi-layer panel, deviation may occur at the outer periphery of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P, and second The end surface of the substrate P2 is offset to the outside of the end surface of the first substrate P1. In the above case, the inclination angle θ of the photographing device 83 is preferably set such that the outer periphery of the second substrate P2 does not enter the photographing field of view of the photographing device 83.

In the above case, the inclination angle θ of the photographing device 83 is preferably performed in accordance with the distance H between the first bonding surface SA1 and the center of the imaging surface 83a of the photographing device 83 (hereinafter referred to as the height H of the photographing device 83). set up. For example, when the height H of the imaging device 83 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 83 can be set to an angle within a range of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 83 and the tilt angle θ of the photographing device 83 can be obtained from the amount of deviation. In the present embodiment, the height H of the imaging device 83 is set to 78 mm, and the inclination angle θ of the imaging device 83 is set to 10°.

The tilt angle θ of the photographing device 83 may also be 0°. Fig. 24 is a view showing a modification of the first detecting device 81, and is an example in which the inclination angle θ of the photographing device 83 is 0°. In this case, the imaging device 83 and the illumination light source 84 may be disposed at positions overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.

The distance H1 between the first bonding surface SA1 and the center of the imaging surface 83a of the imaging device 83 (hereinafter referred to as the height H1 of the imaging device 83) is preferably set to easily detect the periphery of the first bonding surface SA1. The location of the ED. For example, it is preferable that the height H1 of the photographing device 83 can be set in a range of 50 mm or more and 150 mm or less.

The illumination light source 84 is fixed and disposed on the opposite side of the side of the first optical component bonding body PA1 to which the first layer sheet F1m is bonded. The illumination light source 84 is disposed outside the first bonding surface SA1 of the outer peripheral edge ED. In the present embodiment, the optical axis of the illumination light source 84 is parallel to the normal line of the imaging surface 83a of the imaging device 83.

Further, the illumination light source 84 may be disposed on the side of the first optical component bonding body PA1 to which the first layer sheet F1m is bonded (that is, on the same side as the photographing device 83).

Further, as long as the illumination light emitted from the illumination light source 84 can illuminate the outer periphery ED of the imaging device 83, the optical axis of the illumination light source 84 and the normal line of the imaging surface 83a of the imaging device 83 can also intersect each other.

Fig. 25 is a plan view showing the position at which the outer periphery of the bonding surface is detected. An inspection area CA is set at a position where the first optical component bonding body PA1 is placed as shown. The inspection area CA is set on the first optical component bonding body PA1 to be placed, and corresponds to the position of the outer periphery ED of the first bonding surface SA1. In the figure, the inspection area CA is set at four positions corresponding to the four corner portions of the first bonding surface SA1 having a rectangular shape in plan view to detect the structure of the outer periphery ED of the first bonding surface SA1. In the figure, in the outer periphery of the first bonding surface SA1, the hook portion of the corresponding corner portion is represented as the outer peripheral edge ED.

The first detecting device 81 of Fig. 23 detects the outer peripheral edge ED in the inspection area CA at four positions. Specifically, each of the inspection areas CA is provided with an imaging device 83 and an illumination light source 84, and the first detection device 81 captures a corner portion of the first bonding surface SA1 of each of the liquid crystal panels P that are sequentially transported, according to photography. The data detected the peripheral ED. The data on which the outer periphery ED is detected is stored in the control unit 85 shown in Fig. 23.

In addition, as long as the outer periphery of the first bonding surface SA1 can be detected, the setting position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side). In this case, the structure of each side (four sides) of the first bonding surface SA1 as the outer periphery is detected.

Further, the imaging device 83 and the illumination light source 84 are not limited to being disposed in each of the inspection regions CA, and may be configured to move along a movement route set along the outer periphery ED of the first bonding surface SA1. In this case, since the photographing device 83 and the illumination light source 84 are configured to detect the outer peripheral edge ED when they are located in the respective inspection areas CA, it is possible to detect the outer circumference by providing each of the imaging devices 83 and the illumination light source 84. Edge ED.

Further, the photographing device 83 and the illumination light source 84 can be configured to be movable to the vicinity of the position calibration table 39 and away from the position calibration table 39 in response to the work demand.

The cutting position of the first layer sheet F1m of the second cutting device 50 is set based on the detection result of the outer periphery ED of the first bonding surface SA1.

For example, the control unit 85 shown in FIG. 23 can set the cutting position of the first layer F1m based on the stored data of the outer periphery ED of the first bonding surface SA1, so that the first optical component F11 is formed without protruding. The size of the outer side of the liquid crystal panel P (outside of the first bonding surface SA1). Further, the setting of the cutting position does not have to be performed by the control unit 85 of the first detecting device 81, and the setting of the cutting position can be performed by using the first detecting device 81 to detect the data of the outer periphery ED, and calculation using an additional setting. Institutions to carry out.

The second cutting device 50 is cut at the cutting position set by the control unit 85, and the first layer sheet F1m is cut.

Returning to Fig. 6, the second cutting device 50 cuts off the first bonding surface SA1 of the first layer sheet F1m bonded to the liquid crystal panel P according to the detection of the outer peripheral edge ED and along the set cutting position. The corresponding portion and the remaining portion on the outer side thereof cut out the first optical component F11 corresponding to the size of the first bonding surface SA1 (refer to FIG. 3). Thereby, a bonded body in which the first optical component F11 is bonded to the liquid crystal panel P is formed.

Here, the "part corresponding to the first bonding surface SA1" means that the display area of the first layer sheet F1m is larger than that of the liquid crystal panel P, and is larger than the outer shape of the liquid crystal panel P (contour shape in plan view). A small area and an area that avoids functional parts such as an electronic component mounting portion.

In this embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portions are cut off by laser along the outer periphery of the liquid crystal panel P at three sides other than the functional portion, which is equivalent to the functional portion. On one side, the remaining portion is cut by laser from a position outside the liquid crystal panel P to the display region P4 side. For example, in the case where the first substrate P1 is a bonding surface of a thin film transistor (TFT) substrate, the one side corresponding to the functional portion is outside the liquid crystal panel P except for the functional portion. The edge is shifted to a certain amount by the side of the display area P4 side.

Further, the first layer sheet F1m may be bonded to the area of the liquid crystal panel P in which the functional portion is avoided, and thereafter, three of the liquid crystal panels P having a rectangular outer shape in plan view other than the functional portion may be used. At the side, the remaining portion is cut by laser along the outer periphery of the liquid crystal panel P.

The second bonding device and the third bonding device also perform the same work. That is, the second layer sheet F2m is cut out (beveled) from the second optical component layer F2, and after the second layer sheet F2m is attached to the liquid crystal panel P, the liquid crystal panel P and the second layer sheet are detected by the detecting device. F2m fits the outer periphery of the face. Further, the second cutting device 50 cuts off the liquid crystal panel P and the second layer F2m in the second ply F2m bonded to the liquid crystal panel P by detecting the outer peripheral edge and along the set cutting position. A corresponding portion of the bonding surface, and a remaining portion of the outer side thereof, to cut out the second optical component F12 corresponding to the size of the bonding surface.

Similarly, the third layer sheet F3m is cut out (beveled) from the third optical component layer F3, and after the third layer sheet F3m is attached to the liquid crystal panel P, the detecting device and the second cutting device 50 are used according to The outer peripheral edge is detected and along the set cutting position, the corresponding portion of the bonding surface bonded to the third layer sheet F3m of the liquid crystal panel P is cut, and the remaining portion of the outer surface is cut to correspond to the size of the bonding surface The third optical component F13.

Through the above work, an optical display device in which the liquid crystal panel P and the optical component F1X overlapping the liquid crystal panel P are bonded can be obtained.

(Production Method of Optical Display Device) The production method of the optical display device according to the present embodiment includes the first project of strip-shaped optical component layers having a width wider than the display region P4 of the liquid crystal panel P from the roll drum R1. The FX is rolled out together with the separation layer F3a. The second project is to obtain the in-plane distribution data of the optical component layer FX, and calculate the in-plane of the optical component layer FX according to the in-plane distribution data of the optical component layer FX. In the average optical axis direction, the cutting direction of the optical component layer FX is adjusted so that the in-plane average optical axis direction of the optical component layer FX is at a target angle with respect to the cutting direction of the optical component layer FX; the third engineering is adjusted. In the cutting direction, the separation layer F3a remains in the state of the optical component layer FX, and the optical component layer FX is cut to a larger size than the display region P4 to obtain the layer FXm; FXm is peeled off from the separation layer F3a; in the fifth process, the bonding head 32 is tilted and moved along the bending of the holding surface 32a, so that the layer FXm is held against the arc-shaped holding surface 32a of the bonding head 32, and Layer FX held on holding surface 32a m is bonded to the liquid crystal panel P; the sixth project is to move the bonding head 32 and the position alignment table 39 so that the cut edge Lc of the cut layer FXm is aligned or parallel with the side Lp of the liquid crystal panel P. And driving the bonding head 32 for holding and bonding the layer FXm for tilting movement; and the seventh project is for bonding the layer FXm and the liquid crystal panel P to detect the layer FXm and The outer peripheral edge of the bonding surface of the liquid crystal panel P is placed on the bonding body, and the portion of the corresponding bonding surface of the layer and the remaining portion of the corresponding bonding surface portion are cut along the outer periphery to be cut from the layer FXm. An optical component F1X corresponding to the size of the bonding surface is provided. Hereinafter, specific description will be given using FIG.

Figure 14 is a flow chart showing a method of producing an optical display device.

First, the first engineering system winds out the strip-shaped first optical component layer F1 having a wider width than the display region P4 of the liquid crystal panel P and the separation layer F3a from the roll reel R1 (step S1 shown in FIG. 14). .

Next, in the second engineering, the control device 25 acquires the data distributed in the optical axis plane of the first optical component layer F1 stored in the memory device 24, and adjusts the cutting direction of the first optical component layer F1 (steps shown in FIG. 14). S2).

Specifically, the in-plane average optical axis direction of the first optical component layer F1 is calculated based on the in-plane distribution data of the optical axis of the first optical component layer F1. Next, the cutting direction of the first optical component layer F1 is adjusted such that the in-plane average optical axis direction of the first optical component layer F1 is at a target angle with respect to the cutting direction of the first optical component layer F1.

For example, by the control device 25, the in-plane average optical axis direction of the first optical component layer F1 is calculated based on the in-plane distribution data of the first optical component layer F1, and the first cutting device 31b is rotated to make the first The in-plane average optical axis direction of the optical component layer F1 is at a target angle with respect to the cutting direction Vc of the first optical component layer F1. In the present embodiment, as shown in Fig. 12B, the first cutting device 31b is rotated, and the axis (axis L4) formed at a specific angle γ with respect to the average optical axis V3 is cut out from the first optical component layer F1. A reference for an optical component F11.

Here, the in-plane average optical axis direction of the first optical component layer F1 is calculated based on the optical axis distribution in the width direction of the first optical component layer F1 detected by the inspection device 42. In the case where the first optical component F11 is cut out from the first optical component layer F1, the optical axis data for calculation can use a part of the optical axis data from which the first optical component F11 is cut. Further, the optical axis data for calculation can be cut out as the optical axis data of the more upstream side of the portion of the first optical component F11. Since the optical axis direction does not change much in the longitudinal direction of the first optical component layer F1, if the optical axis direction at a position in the longitudinal direction of the first optical component layer F1 is obtained, the optical axis direction can be used. The optical axis direction is an arbitrary position in the longitudinal direction of the first optical component layer F1. In this case, the average optical axis direction in the width direction of the first optical component layer F1 can be calculated at a plurality of positions in the longitudinal direction of the first optical component layer F1, and the average optical axis direction calculated at each position is the plurality of The optical axis direction obtained by averaging the positions is taken as the in-plane average optical axis direction of the first optical component layer F1.

Next, in the third cutting direction, the separation layer F3a remains in the optical component layer FX, and the optical component layer FX is cut to a larger size than the display area P4 to obtain the first layer. F1m (step S3 shown in Fig. 14).

Next, the fourth engineering system peels the first layer sheet F1m from the separation layer sheet F3a (step S4 shown in Fig. 14).

Next, in the fifth engineering, the bonding head 32 is tilted and moved along the bending of the holding surface 32a, and the first layer sheet F1m is held against the arc-shaped holding surface 32a of the bonding head 32, and is held by the holding surface 32a. The first layer F1m is bonded to the liquid crystal panel P (step S5 shown in Fig. 14).

Next, in the sixth engineering, the bonding head 32 and the position aligning table 39 are relatively moved so that the cut edge Lc of the cut first layer piece F1m and the one side Lp of the liquid crystal panel P are aligned or parallel. Further, the bonding head 32 is driven to perform the holding and bonding of the first layer sheet F1m by the tilting movement (step S6 shown in Fig. 14).

For example, the relative movement of the bonding head 32 and the position calibration table 39 may not move the position calibration table 39, only the movement of the bonding head 32. Specifically, in the first direction of the mounting surface 39a of the parallel liquid crystal panel P in the position alignment table 39, parallel to the mounting surface 39a and perpendicular to the first direction, the normal direction of the mounting surface 39a The third member moves relative to the bonding head 32 in the θ direction of the axis rotation in the third direction.

Thereafter, the seventh engineering system detects the outer peripheral edge of the bonding surface of the first layer F1m and the liquid crystal panel P, and adheres to the first of the liquid crystal panel P along the cutting position set according to the detected outer circumference. The corresponding portion of the bonding surface of the liquid crystal panel P and the first layer F1m in the layer F1m and the remaining portion of the outer layer thereof are cut to cut the first optical corresponding to the size of the bonding surface from the first layer F1m. The component F11 (window type cut) (step S7 shown in Fig. 14).

The second layer F2m and the third layer F3m are subjected to the same work to respectively cut out the second optical component F12 corresponding to the size of the bonding surface of the liquid crystal panel P and the second layer F2m, and the third layer F3m. The third optical component F13 (window type cut).

Through the above work, an optical display device in which the liquid crystal panel P and the optical component F1X overlapping the liquid crystal panel P are bonded can be obtained.

The film bonding system 1 of the present embodiment adjusts the first optical component layer F1 according to a method of producing an optical display device by distributing data in accordance with an optical axis plane of the first optical component layer F1 stored in advance in the memory device 24. Cut the direction. In this adjustment, the cutting direction of the first optical component layer F1 is adjusted such that the in-plane average optical axis direction of the first optical component layer F1 is at a target angle with respect to the cutting direction of the first optical component layer F1. Further, the first layer sheet F1m is cut out from the first optical component layer F1 in the above-described adjusted cutting direction. Further, the bonding head 32 is moved relative to the position aligning table 39 so that the cut edge Lc of the cut first layer sheet F1m and the one side Lp of the liquid crystal panel P are aligned or parallel. Further, the outer peripheral edge of the bonding surface of the liquid crystal panel P and the first layer sheet F1m is detected, and the liquid crystal is bonded to the first layer sheet F1m of the liquid crystal panel P along the cutting position set according to the detected outer circumference. The corresponding portion of the bonding surface of the panel P and the first layer sheet F1m, and the remaining portion of the outer layer thereof are cut off, for cutting the first optical component F11 corresponding to the size of the bonding surface from the first layer sheet F1m, that is, performing The so-called window cut. Similarly, the second optical component F12 and the third optical component F13 corresponding to the size of the bonding surface of the liquid crystal panel P are also cut out from the second layer F2m and the third layer F3m, respectively. Thereby, an optical display device in which the liquid crystal panel P is attached and the optical component F1X overlapping the liquid crystal panel P is bonded is obtained. Therefore, the optical axis deviation generated in the optical display device can be reduced.

According to this configuration, the strip-shaped optical component layer FX corresponding to the width of the display region P4 is cut into a specific length as the layer FXm, and the layer FXm is held in an arc shape by the tilting movement of the bonding head 32. At the surface 32a, the layer sheet FXm is bonded to the liquid crystal panel P by the tilting movement of the same bonding head 32, and then the window type is cut to suppress the dimensional deviation or the fitting deviation of the layer sheet FXm, and the display can be reduced. The frame portion G around the region P4 achieves the purpose of expanding the display area and miniaturizing the machine.

Moreover, the continuous bonding of the layer sheets FXm can be facilitated, and the production efficiency of the optical display device can be improved.

Moreover, the layer sheet FXm can be smoothly held by the tilting movement of the arc-shaped holding surface 32a, and the layer sheet FXm can be surely bonded to the liquid crystal panel P by the tilting movement of the same arc-shaped holding surface 32a.

Further, in the film bonding system 1, the blade 31c is formed such that the bonding surface of the liquid crystal panel P faces downward, and the layer FXm is peeled off from the separation layer F3a. The bonding surface and the upper surface of the opposing side are held by the holding surface 32a, and the bonding surface is moved downward, and the peeling position and the bonding position are moved so that the adhesive layer F2a side When the bonding surface is conveyed downward toward the optical component layer FX, scratches on the bonding surface of the optical component layer FX, adhesion of foreign matter, and the like can be suppressed, and occurrence of poor bonding can be suppressed.

Further, the film bonding system 1 is configured to move the liquid crystal panel P to a loading position (each turntable start position (first turntable start position 11a, second turntable start position 16a)), and the bonding position (each Bonding position (first bonding position 11c, second bonding position 11d, third bonding position 16c)) and carrying-out position (each turntable end position (first turntable end position 11b, second turntable end position 16b)) The rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) enables the liquid crystal panel P to efficiently switch the transport direction, and the rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) ) It can also be used as part of the production line to suppress the length of the production line and increase the freedom of installation of the system.

Further, the present invention is not limited to the above embodiment, and for example, the relative positional alignment of the liquid crystal panel P and the bonding layer sheet F5 may be performed through one of the bonding head 32 or the position alignment table 39. Further, the configuration of the above-described embodiment is an example of the present invention, and various changes are possible without departing from the gist of the invention, including component structure or configuration, shape, size, number, configuration, and the like.

(Second embodiment) Hereinafter, another embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a film bonding system which is a part of a production system of an optical display device will be described.

Fig. 16 is a schematic structural view showing a film bonding system 1A of the second embodiment. In the sixteenth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted. In addition, the contents of the second embodiment to the fourth embodiment of the first embodiment are not described in the same manner in the present embodiment.

In the present embodiment, the first optical module F11, the second optical component F12, and the third optical component F13 are mainly composed of a first layer F1m, a second layer F2m, and a third layer F3m (hereinafter, collectively referred to as The layer FXm.) cuts off the formation of the remaining portion of the outside of the display area.

Fig. 17 is a plan view (top view) of the film bonding system 1A. Hereinafter, the film bonding system 1A will be described with reference to Figs. 16 and 17 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, the upstream side of the liquid crystal panel P in the transport direction is referred to as the panel transport upstream side, and the downstream side of the liquid crystal panel P in the transport direction is referred to as the panel transport downstream side.

The film bonding system 1A uses the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding process. The film bonding system 1A includes: a first sub-conveying device 6 and a second sub-conveying device 7 extending from the main conveying device 5 in the right-angle direction from the starting point 5a; from the starting point 5a toward the first starting position 6a of the first sub-conveying device 6 a first transfer device 8 that transports the liquid crystal panel P, a cleaning device 9 that is disposed on the first sub-transport device 6, and a first rotary machine tool 11 that is disposed on the downstream side of the panel transport of the first sub-conveying device 6; a first transfer position 6b of the sub-conveying device 6 transports the second transfer device 12 of the liquid crystal panel P toward the first turntable start position 11a of the first rotary machine tool 11; and a first sticker disposed around the first rotary machine tool 11 The bonding device 13 and the second bonding device 15, the film peeling device 14, and the first cutting device 51.

Further, the film bonding system 1A includes: a second rotary machine tool 16 provided on the downstream side of the panel transfer of the first rotary machine tool 11; and a first rotary table end position 11b of the first rotary machine tool 11 toward the second rotary machine tool a third transfer device 17 that transports the liquid crystal panel P at the second turntable start position 16a; a third bonding device 18 and a second cutting device 52 that are disposed around the second rotary machine tool 16; and is disposed on the second rotary table The panel of the machine tool 16 transports the second sub-conveying device 7 on the downstream side; the fourth liquid crystal panel P is transported from the second turret end position 16b of the second rotary machine tool 16 toward the second starting position 7a of the second sub-conveying device 7 The conveying device 21; and the fifth conveying device 22 that conveys the liquid crystal panel P from the second end position 7b of the second sub-conveying device 7 toward the end point 5b of the main conveying device 5.

The film bonding system 1A uses a driven main conveying device 5, each sub conveying device (first sub conveying device 6, second sub conveying device 7), and each rotary machine tool (first rotary machine tool 11, second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and sequentially applies specific processing to the liquid crystal panel P. The liquid crystal panel P is transported on the production line with its front/reverse surfaces horizontal.

The liquid crystal panel P is, for example, in the main transport device 5, and transports the short side of the display region P4 in the transport direction; each of the sub transport devices (the first sub transport device 6 and the second sub transport) that are perpendicular to the main transport device 5 In the device 7), the long side of the display region P4 is transported in the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display region P4 is oriented. The rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16) are transported in the radial direction. The symbol 5c in the figure corresponds to the liquid crystal panel P, and displays the rack transported along the main transport device 5.

The layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P. Each part of the film bonding system 1A is integrally controlled by a control device 25 as an electronic control unit.

The first conveying device 8 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The first transport device 8 directly transports the liquid crystal panel P held by the adsorption to the first home position 6a (the left end portion of the FIG. 17) of the first sub-transport device 6 in a horizontal state, at which position The adsorption is released, and the liquid crystal panel P is transferred to the first sub-conveying device 6.

The cleaning device 9 is, for example, washed by water, and is brushed and washed on the front/rear surface of the liquid crystal panel P, and then the liquid on the front/rear surface of the liquid crystal panel P is removed. Further, the cleaning device 9 may be dry-cleaned to perform static elimination and dust collection on the front/rear surfaces of the liquid crystal panel P.

The second transfer device 12 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The second transfer device 12 directly transports the liquid crystal panel P held by the adsorption to the first turntable start position 11a of the first rotary machine tool 11 in a horizontal state, and at this position, the adsorption action is released. The liquid crystal panel P is delivered to the first rotary machine tool 11.

The first rotary table machine 11 is a disk-shaped turntable having a rotary axis in the vertical direction, and the loading position from the second transfer device 12 (the left end portion in the plan view of Fig. 17) serves as the first turntable start position 11a. Rotate the drive clockwise. The first rotary machine tool 11 is a first bonding position 11c at a position (the upper end portion of FIG. 17) that is rotated 90° in the clockwise direction from the first turret starting position 11a. At the first bonding position 11c, the bonding of the first optical component F11 on the backlight side is performed by the first bonding apparatus 13.

The first layer F1m is a layer of the first optical component layer F1 having a larger size than the display area of the liquid crystal panel P. The first layer sheet F1m is bonded to one of the front/reverse sides of the liquid crystal panel P by the first bonding device 13 to form the first optical component bonding body PA1.

The first rotary machine tool 11 is a film peeling position 11e at a position (the upper right end portion of FIG. 17) that is rotated by 45° in the clockwise direction from the first bonding position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first layer sheet F1m is performed by the film peeling device 14.

The first rotary machine tool 11 is a second bonding position 11d at a position (right end position in FIG. 17) that is rotated by 45° in the clockwise direction from the film peeling position 11e. At the second bonding position 11d, the second bonding apparatus 15 performs bonding of the second layer sheet F2m on the backlight side.

The second layer F2m is a layer of the second optical component layer F2 that is larger in size than the display area of the liquid crystal panel P. The second layer sheet F2m is bonded to the surface of the first layer F1m side of the first optical component bonding body PA1 by the second bonding device 15 to form the second optical component bonding body PA2.

The first rotary table machine 11 is a first turntable end position 11b (first cut position) at a position (the lower end portion in FIG. 17) that is rotated 90° clockwise from the second bonding position 11d.

The first turret end position 11b is a first cutting position at which the first layer F1m and the second layer F2m are cut by the first cutting device 51. The first cutting device 51 is formed by bonding the first layer sheet F1m and the second layer sheet F2m of the liquid crystal panel P to the bonding surface of the first layer sheet F1m and the second layer sheet F2m. The corresponding portion and the remaining portion disposed on the outer side thereof are cut together so that the first optical component F11 composed of the first optical component layer F1 and the second optical component F12 composed of the second optical component layer F2 are formed as corresponding An optical component sized to the display area of the liquid crystal panel P.

After the first layer F1m and the second layer F2m are attached to the liquid crystal panel P, the first optical component F11 and the second optical component F12 are not separated, so that the display area P4 and the first layer are obtained. The first optical component F11 and the second optical component F12 whose outer peripheral shape conforms to the sheet F1m and the second layer F2m. Moreover, the cutting work of the first layer F1m and the second layer F2m is also simplified.

The remaining portions of the first layer F1m and the second layer F2m are cut from the second optical component bonding body PA2 by the first cutting device 51 to form the first optical component F11 and the second optical component F12. The third optical component is bonded to the surface of one of the front/reverse sides of the liquid crystal panel P. The remaining portion cut from the first layer sheet F1m and the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings. The third optical component bonding body PA3 is attached to the first turntable end position 11b, and is carried out by the third transfer device 17.

The third transport device 17 can hold the liquid crystal panel P (the third optical component bonding body PA3) and can be freely transported in the vertical direction and the horizontal direction. The third transport device 17 transports the liquid crystal panel P held by the adsorption to the second turntable start position 16a of the second rotary machine tool 16, for example, and performs the front/reverse reverse of the liquid crystal panel P at the time of the transfer. In turn, the adsorption is released at the second turntable start position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.

The second rotary machine tool 16 is a disk-shaped turntable having a rotary axis in the vertical direction, and is moved from the third transfer device 17 (the upper end portion in the plan view of Fig. 17) as the second turntable start position 16a. Rotary drive in a clockwise direction. The second rotary machine tool 16 is a third bonding position 16c at a position (right end portion of Fig. 17) that is rotated 90° clockwise from the second turret starting position 16a. At the third bonding position 16c, the third bonding apparatus 18 performs bonding of the third layer sheet F3m on the display surface side.

The third layer sheet F3m is a layer of the third optical component layer F3 having a larger size than the display area of the liquid crystal panel P. The third layer sheet F3m is bonded to the other of the front/rear surfaces of the liquid crystal panel P by the third bonding device 18 (the first optical component F11 and the second optical component F12 of the third optical component bonding body PA3 are attached to each other). The opposite side of the face) to form the fourth optical component bonding body PA4.

The second rotary machine tool 16 is a second cutting position 16d at a position (the lower end portion in Fig. 17) that is rotated 90° clockwise from the third bonding position 16c. At the second cutting position 16d, the third layer piece F3m is cut by the second cutting device 52. The second cutting device 52 is formed by bonding the third layer sheet F3m of the liquid crystal panel P to the corresponding portion of the bonding surface of the liquid crystal panel P and the third layer sheet F3m, and the remaining portion disposed on the outer side thereof to form a remaining portion. An optical component (third optical component F13) corresponding to the size of the bonding surface of the liquid crystal panel P and the third layer F3m.

The remaining portion of the third layer sheet F3m is cut from the fourth optical component bonding body PA4 by the second cutting device 52, and the third optical component F13 is bonded to the other side of the front/rear surface of the liquid crystal panel P, and The first optical component F11 and the second optical component F12 are bonded to one side of the front/rear surface of the liquid crystal panel P to form a fifth optical component bonding body PA5. The remaining portion cut from the third layer sheet F3m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the first cutting device 51 and the second cutting device 52 are, for example, a carbon dioxide (CO ₂ ) laser cutting machine. The first cutting device 51 and the second cutting device 52 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the periphery of the liquid crystal panel P and the layer sheet FXm. The first cutting device 51 and the second cutting device 52 are connected to the same laser output device 53. The first cutting device 51, the second cutting device 52, and the laser output device 53 constitute a cutting portion, and the corresponding portion of the bonding surface of the liquid crystal panel P and the layer FXm is cut and arranged from the layer FXm. An optical component FX corresponding to the size of the bonding surface of the liquid crystal panel P and the layer FXm is formed on the remaining portion on the outer side. Since the laser output required for cutting each of the layers (the first layer F1m, the second layer F2m, and the third layer F3m) is not large, in the present embodiment, the output of the laser output device 53 is high. The laser light is divided into two and supplied to the first cutting device 51 and the second cutting device 52.

The second rotary machine tool 16 is a second turntable end position 16b at a position (left end portion of Fig. 17) that is rotated 90° clockwise from the second cutting position 16d. At the second turntable end position 16b, the fifth optical unit bonding body PA5 is carried out by the fourth transfer device 21.

The fourth transfer device 21 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fourth transport device 21 transports the liquid crystal panel P held by the adsorption to the second home position 7a of the second sub-transport device 7, for example, and releases the adsorption at the second home position 7a to liquidize the liquid crystal panel P. The panel P is delivered to the second sub-conveying device 7.

The fifth transport device 22 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fifth transport device 22 transports the liquid crystal panel P held by the adsorption to the end point 5b of the main transport device 5, and releases the suction at the end point 5b to transfer the liquid crystal panel P to the main transport device 5.

The conveyance route of the liquid crystal panel P (the fifth optical component bonding body PA5) after the second turntable end position 16b is provided with a bonding inspection position omitted in the drawing, and at the bonding inspection position, the inspection device (pattern) (Omit omitted) Check the workpiece (liquid crystal panel P) to which the film is bonded (check whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

The bonding work of the film bonding system 1A is completed through the above.

Hereinafter, the first bonding apparatus 13 will be described in detail with reference to FIG. 18. In addition, the second bonding apparatus 15 and the third bonding apparatus 18 have the same configuration, and detailed description thereof will be omitted.

The first bonding apparatus 13 is a layer (the first layer) of the bonding layer sheet F5 cut into a specific size in the first optical component layer F1 with respect to the upper surface of the liquid crystal panel P conveyed to the first bonding position 11c. Sheet F1m) is attached.

The first bonding apparatus 13 includes a layer sheet conveying device 31 that winds the first optical module layer F1 from the roll drum R1 that has taken up the first optical component layer F1, and transports the first optical component layer F1 along the longitudinal direction thereof. The first optical component layer F1; and the bonding head 32, so that the layer conveying device 31 holds the layer (first layer sheet F1m) of the bonding layer sheet F5 cut out from the first optical component layer F1, and the layer The sheet is bonded to the upper surface of the liquid crystal panel P that is conveyed to the first bonding position 11c.

The layer sheet conveying device 31 conveys the bonding layer sheet F5 by using the separation layer sheet F3a as a carrier, and has a winding portion 31a for holding the roll drum R1 around which the strip-shaped first optical unit layer F1 is wound, and The first optical component layer F1 is wound up along the longitudinal direction thereof; the cutting portion 131b applies a half cut to the first optical component layer F1 taken up from the roll drum R1; the blade 31c (peeling portion) is applied The first optical component layer F1 after the half cutting is wound at an acute angle to separate the bonding layer sheet F5 from the separation layer sheet F3a; and the winding portion 31d is kept separated by the separation layer sheet which is wound by the blade edge 31c. Separation roller R2 of F3a.

Further, although omitted from the drawings, the layer sheet conveying device 31 has a plurality of guide rollers that wind the first optical module layer F1 along a specific conveyance path. The first optical component layer F1 has a width in a horizontal direction (ply width direction) perpendicular to the conveyance direction, and has a width corresponding to the display region P4 of the liquid crystal panel P (the length of either the long side and the short side of the display region P4 is equivalent to In the present embodiment, the length of the long side of the display region P4 is wider.

The winding portion 31a located at the beginning of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are, for example, driven in synchronization with each other. Thereby, the unwinding portion 31a continuously winds up the first optical component layer F1 in the conveyance direction, and the winding portion 31d winds up the separation layer sheet F3a which passes through the blade 31c. In the layer conveyance device 31, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.

Each time the cutting portion 131b winds the first optical component layer F1 in the longitudinal direction perpendicular to the layer width direction up to the length of the display region P4 (the length of the other side of the long side and the short side of the display region P4 is equivalent to In the present embodiment, when the length of the short side of the display region P4 is longer, one of the thickness directions of the first optical component layer F1 is cut across the entire width in the width direction of the layer (half-cut). Thereby, the layer (first layer sheet F1m) of the bonding layer sheet F5 which is larger than the display region P4 of the liquid crystal panel P is cut out from the first optical component layer F1.

The cutting portion 131b transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken (the separation layer F3a having a specific thickness remains). The position of the blade is advanced and retracted, and the half cut is applied to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

In the first optical component layer F1 after the half cutting, the optical module body F1a and the surface protective film F4a are cut in the thickness direction thereof to form a transverse line across the entire width of the first optical component layer F1 in the layer width direction. The first optical component layer F1 is divided into sections having a length corresponding to the short side of the display region P4 in the longitudinal direction by the transverse line. The partitions are each one of the plies (first ply F1m) of the ply F5.

The blade 31c is formed below the first optical component layer F1 which is conveyed slightly horizontally from the left side to the right side of the 18th drawing, and extends at least across the entire width of the first optical component layer F1 in the layer width direction. The blade 31c is wound in such a manner that it is wound in a sliding contact with the side of the separation layer F3a of the first optical component layer F1 after the half cutting.

The blade 31c winds the first optical component layer F1 at an acute angle to its sharp-angled front end. When the first optical component layer F1 is folded back at an acute angle at the front end of the blade 31c, the separation layer F3a is peeled off from the first layer F1m. At this time, the adhesive layer F2a of the first layer sheet F1m (the bonding surface with the liquid crystal panel P) faces downward. Immediately above the front end portion of the blade 31c is a separation layer peeling position 31e, and the arc-shaped holding surface 32a of the bonding head 32 comes into contact with the front end portion of the blade edge 31c from above, so that the surface protection film F4a of the first layer sheet F1m ( Adhesive surface 32a of the fitting head 32 is adhered to the opposite side of the bonding surface.

The bonding head 32 is a holding surface 32a having a convex arc shape in parallel with the width direction of the layer. The holding surface 32a has a weaker adhesive force than the bonding surface (adhesive layer F2a) of the bonding layer F5, for example, and the surface protective film F4a of the first layer F1m can be repeatedly adhered and peeled off.

The bonding head 32 is formed so that the upper side of the blade 31c is along the axis in the width direction of the layer, and is parallel to the longitudinal direction and is inclined to move along the bending of the holding surface 32a. When the first layer sheet F1m is adhered and adhered to the liquid crystal panel P, the tilting movement of the bonding head 32 is appropriately performed.

The bonding head 32 is such that the holding surface 32a faces downward, and the curved one end side (the right side of FIG. 18) of the holding surface 32a is inclined downward, and the curved end side of the holding surface 32a is abutted against the blade 31c from above. At the front end portion, the front end portion of the first ply F1m separating the ply peeling position 31e is adhered to the holding surface 32a. Thereafter, the first layer sheet F1m is continuously unwound and the bonding head 32 is tilted to move, thereby adhering the entire first layer sheet F1m to the holding surface 32a.

The bonding head 32 can perform a lifting operation of a specific distance above the separation layer peeling position 31e and the first bonding position 11c, and can appropriately move between the separation layer peeling position 31e and the first bonding position 11c. . The bonding head 32 is coupled to the driving device, and can be driven during the lifting, the moving, and the tilting movement.

When the first layer sheet F1m is adhered to the holding surface 32a, the bonding head 32 is detached from the driving device 33, for example, after the end portion of the first layer sheet F1m is adhered to the holding surface 32a. From this state, the tilting movement is passively accompanied by the unwinding of the first layer sheet F1m. When the bonding head 32 is tilted to move until the first layer F1m is entirely adhered to the holding surface 32a, the tilting movement is locked in the tilted state by, for example, engagement with the driving device 33, and in this state Moves over a fitting position 11c.

When the first layer sheet F1m which is adhered and adhered to the liquid crystal panel P is attached, the bonding head 32 actively moves obliquely by, for example, the driving device 33, and the first layer sheet F1m is pressed along the bending of the holding surface 32a. It is attached to the upper side of the liquid crystal panel P to be surely bonded.

A first detecting camera 34 is disposed below the front end of the blade 31c, and the front end portion of the laminated layer F5 at the portion where the layer is conveyed downstream is detected. The detection data of the first detection camera 34 is transmitted to the control device 25. When the first detecting camera 34 detects the downstream end of the bonding layer sheet F5, for example, the control device 25 temporarily stops the layer sheet conveying device 31, and thereafter lowers the bonding head 32 to fix the front end of the bonding layer sheet F5. The portion is adhered to the holding surface 32a.

When the first detecting camera 34 detects the downstream side end of the bonding layer sheet F5 and temporarily stops the layer sheet conveying device 31, the control device 25 performs the cutting of the bonding layer sheet F5 by the cutting portion 131b. That is, the detection position between the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cutting position along the cutting portion 131b (the cutting blade retraction position of the cutting portion 131b) The distance of the sheet conveying path corresponds to the length of the layer sheet (first layer sheet F1m) to which the layer sheet F5 is bonded.

The cutting portion 131b is movable along the layer transport path, and the distance between the detection position of the first detecting camera 34 and the cutting position between the cutting positions of the cutting portion 131b is changed by the movement. The movement of the cutting portion 131b is controlled by the transmission control device 25, and after the cutting layer sheet F5 is cut by, for example, the cutting portion 131b, the layer sheet (the first layer sheet F1m) of one bonding layer sheet F5 is wound up. In the case of a distance, when there is a deviation between the cut end and the specific reference position, the deviation is corrected by the movement of the cut portion 131b. Further, the cutting of the bonding layer sheet F5 having a different length may be performed by the movement of the cutting portion 131b.

The first detecting camera 34 can also detect the defect mark printed on the bonding layer F5. This defect mark is marked by the ink jet or the like from the side of the surface protective film F4a when the defect roll is found in the first optical component layer F1 at the time of manufacture of the roll reel R1. The bonding layer sheet F5 (the first layer sheet F1m including the defect) on which the defect mark is detected does not adhere to the liquid crystal panel P after being adhered to the bonding head 32, but moves to avoid the first bonding position 11c. The discarded position (discarded position), overlapped to the waste layer and the like. Further, when the defect mark is detected, a process of cutting off the defective portion including the bonding layer sheet F5 with a minimum width may be designed.

In addition, the defect of the optical component layer FX is, for example, a portion where the solid matter is composed of a foreign matter composed of at least one of a liquid and a gas, or a portion where the surface of the optical component layer FX has irregularities or scratches due to the optical portion. The part of the component layer FX skew or material deviation, etc., which causes bright spots.

When the bonding head 32 moves from the separation layer peeling position 31e toward the first bonding position 11c, it is adhered and held at the two corners of the first layer sheet F1m of the holding surface 32a (for example, at the two corners of the proximal end portion of the front end portion) The respective units are photographed by a pair of second detection cameras 35. The detection data of each of the second detecting cameras 35 is transmitted to the control device 25. The control device 25 confirms, for example, the horizontal direction of the first layer sheet F1m with respect to the bonding head 32 based on the photographic data of each of the second detecting cameras 35 (the moving direction of the bonding head 32 and its vertical direction and the direction of rotation of the vertical axis center). )position. In the case where the relative positions of the bonding head 32 and the first layer sheet F1m are different, the bonding head 32 performs position alignment by using the position of the first layer sheet F1m as a specific reference position.

At a first bonding position 11c of the first rotary machine tool 11, a pair of third detecting cameras 36 are provided for performing positional alignment of the liquid crystal panel P in the horizontal direction at the first bonding position 11c. At a second bonding position 11d of the first rotary machine tool 11, a pair of fourth detecting cameras 37 for performing positional alignment in the horizontal direction on the second bonding position 11d of the same liquid crystal panel P are provided. Each of the third detecting cameras 36 captures, for example, the two corner portions on the left side in the seventeenth image of the glass substrate (first substrate P1) of the liquid crystal panel P. Each of the fourth detecting cameras 37 captures, for example, the two corner portions on the left side in Fig. 17 of the glass substrate of the liquid crystal panel P.

At the third bonding position 16c of the second rotary machine tool 16, a pair of fifth detection cameras 38 for performing positional alignment in the horizontal direction on the third bonding position 16c of the liquid crystal panel P are provided. Each of the fifth detecting cameras 38 captures, for example, the two corner portions on the left side in Fig. 17 of the glass substrate of the liquid crystal panel P. The detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38) is transmitted to the control device 25. Further, instead of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38), a sensor may be used.

On each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), a position calibration table 39 is provided, and the liquid crystal panel P is placed and the positional alignment in the horizontal direction can be performed. The position calibration table 39 is driven and controlled by the control device 25 based on the detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38). Thereby, it is possible to perform the respective rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16 (each of the bonding positions (the first bonding position 11c, the second bonding position 11d, and the third bonding position 16c). ))) Position calibration of the liquid crystal panel P.

The laminated layer F5 (layer sheet FXm) which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the bonding deviation of the optical component F1X is suppressed, and the optical component F1X of the liquid crystal panel P can be improved. The accuracy of the optical axis direction improves the color and contrast of the optical display device.

Here, the polarizing film constituting the optical component layer FX is formed, for example, by stretching a PVA film dyed with a dichroic dye toward one axis. At this time, there is a case where the thickness of the PVA film is uneven or the dyeing of the dichroic dye is uneven, which may cause a deviation in the optical axis direction in the surface of the optical component layer FX.

Therefore, in the present embodiment, the control device 25 determines the liquid crystal relative to the optical component layer FX based on the inspection data distributed in the optical axis plane in each portion of the optical component layer FX stored in the memory device 24 (refer to Fig. 16). The bonding position of the panel P (relatively fitting position). Further, each of the bonding devices (the first bonding device 13, the second bonding device 15, and the third bonding device 18) is attached to the bonding position, and the liquid crystal panel is formed on the layer FXm cut out from the optical component layer FX. Position calibration of P, and the liquid crystal panel P is attached to the layer FXm.

The method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P is as follows.

First, as shown in FIG. 19A, a plurality of checkpoints CP in the width direction of the optical component layer FX are set, and the optical axis direction of the optical component layer FX is detected at each checkpoint CP. The time when the optical axis is detected is the time when the roll drum R1 is manufactured, or may be the period before the half of the optical component layer FX is unwound from the roll drum R1. The data in the optical axis direction of the optical component layer FX is stored in the memory device 24 in association with the position of the optical component layer FX (the position in the longitudinal direction and the width direction of the optical component layer FX) (refer to FIG. 16).

The control device 25 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each of the inspection points CP from the memory device 24, and detects the optical component layer FX of the portion in which the layer FXm is cut out (divided by the transverse line CL) The average optical axis direction of the area).

For example, as shown in FIG. 19B, the angle (offset angle) between the optical axis direction and the edge line EL of the optical component layer FX is detected at the checkpoint CP each time, and the maximum angle (maximum offset angle) among the offset angles When θmax and the minimum angle (minimum offset angle) are θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Further, the average offset angle θmid direction of the edge line EL with respect to the optical component layer FX is detected as the average optical axis direction of the optical component layer FX.

Further, the offset angle is calculated, for example, by a counterclockwise direction with respect to the edge line EL of the optical component layer FX being a positive angle and a clockwise direction being a negative angle.

Further, the average optical axis direction of the optical component layer FX detected by the above method determines the bonding position (relative bonding position) of the layer FXm with respect to the liquid crystal panel P so as to be longer than the display region P4 of the liquid crystal panel P. The side or short side is at the desired angle. For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis direction of the optical component layer FX is longer than the display region P4. The layer FXm is bonded to the liquid crystal panel P with the side or the short side at 90°.

The first cutting device 51 is based on the liquid crystal panel P and the first layer F1m and the second layer detected by the detecting device having the same structure as the first detecting device 81 shown in FIGS. 23 to 25 The outer peripheral edge of the bonding surface of the sheet F2m is cut along the outer peripheral edge of the bonding surface of the liquid crystal panel P and the first layer F1m and the second layer F2m, and the first layer F1m bonded to the liquid crystal panel P is continuously cut and The second layer F2m. The detecting device is disposed between the second bonding position 11d and the first cutting device 51 in the panel transport upstream side of the first cutting device 51 in Fig. 16 .

Similarly, the second cutting device 52 is based on the bonding surface of the liquid crystal panel P and the third layer F3m detected by the detecting device having the same configuration as the second detecting device 82 shown in FIG. Hereinafter, it is referred to as a second bonding surface SA2 (bonding surface). The outer peripheral edge ED is cut and bonded to the liquid crystal panel P without interruption along the outer peripheral edge of the bonding surface of the liquid crystal panel P and the third layer sheet F3m. The third layer F3m. The detecting device is disposed between the third bonding position 16c and the second cutting device 52 in the panel transport upstream side of the second cutting device 52 in FIG.

A frame portion G (refer to FIG. 3) having a specific width for providing a sealant for bonding the first substrate and the second substrate of the liquid crystal panel P is provided on the outer side of the display region P4, and the frame portion G is provided. The cutting piece FXm is cut (cut line: WCL) by the cutting device (the first cutting device 51 and the second cutting device 52) in the width.

As described above, the film bonding system 1A of the present embodiment includes a bonding device (the first bonding device 13, the second bonding device 15, and the third bonding device 18), and has a wider width than the liquid crystal panel P. The strip-shaped optical component layer FX having a longer length of either one of the long side and the short side of the display area P4 is unwound from the roll drum R1, and is longer than the other side of the longer side and the shorter side of the display area P4. After the optical component layer FX is cut to form the layer sheet FXm, the layer sheet FXm is bonded to the liquid crystal panel P as an optical component bonding body; and the cutting device (the first cutting device 51 and the second cutting device) 52), from the layer FXm bonded to the liquid crystal panel P, the corresponding portion of the bonding surface of the liquid crystal panel P and the layer FXm is cut, and the remaining portion disposed on the outer side thereof is formed to correspond to the liquid crystal panel P and The optical component F1X of the laminated surface size of the layer FXm. Therefore, it is possible to design the optical unit F1X to correspond to the display area P4 with better precision, and to reduce the frame portion G outside the display area P4 (refer to FIG. 3), thereby achieving the purpose of expanding the display area and miniaturizing the device.

Further, the film bonding system 1A includes a control device 25 for determining the relative bonding position of the liquid crystal panel P and the layer sheet FXm based on the inspection data of the optical axis direction of the optical component layer FX, and the bonding head 32 is controlled by the control device 25. The layer FXm held on the holding surface 32a is bonded to the liquid crystal panel P at the determined relative bonding position. Therefore, even when there is a deviation in the optical axis direction in the FX surface of the optical component layer, the relative bonding position of the layer FXm and the liquid crystal panel P can be appropriately adjusted in accordance with the deviation of the optical axis direction. Thereby, the optical axis direction accuracy of the optical component F1X with respect to the liquid crystal panel P can be improved, and the color degree and contrast of the optical display device can be improved.

Further, in the film bonding system 1A, the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) has a winding portion 31a for taking the optical component layer FX from the roll The roller R1 is unwound together with the separation layer sheet F3a; the cutting portion 131b is such that the separation layer sheet F3a remains in the optical module layer FX, and the optical component layer FX is cut to form the layer sheet FXm; the blade edge 31c is The layer sheet FXm is peeled off from the separation layer sheet F3a; and the bonding head 32 holds the layer sheet FXm against the holding surface 32a, and bonds the layer sheet FXm held on the holding surface 32a to the liquid crystal panel P. Therefore, the continuous bonding of the layer sheets FXm is facilitated, and the production efficiency of the optical display device can be improved. Further, a holding surface 32a having an arc shape is used as the bonding head 32. Therefore, the layer sheet FXm can be smoothly held by the tilting movement of the arc-shaped holding surface 32a, and the layer sheet FXm can be surely bonded to the liquid crystal panel P by the tilting movement of the same arc-shaped holding surface 32a.

Further, in the film bonding system 1A, the blade 31c is directed downward from the bonding surface of the liquid crystal panel P, and the optical module F1X is peeled off from the separation layer F3a, and the bonding head 32 is a bonding surface and an opposing side. The upper side surface is held by the holding surface 32a, and the bonding surface is directed downward, and is moved between the peeling position and the bonding position. Therefore, the optical component layer FX is conveyed downward by the bonding surface of the adhesive layer F2a side, and the scratch of the bonding surface of the optical component layer FX, the adhesion of a foreign material, etc. can be suppressed, and the occurrence of a bonding defect can be suppressed.

Moreover, the film bonding system 1A is equipped with a rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16), and the liquid crystal panel P is moved to the carry-in position (the start position of each turntable (the first turntable start position 11a) Second turret starting position 16a)), bonding position (each bonding position (first bonding position 11c, second bonding position 11d, third bonding position 16c)) and carrying out position (end position of each turntable) (first turntable end position 11b, second turntable end position 16b)). Therefore, the liquid crystal panel P can efficiently switch the transport direction, and the rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) can also be used as part of the production line to suppress the length of the production line, thereby improving the freedom of installation of the system. degree.

Further, in the film bonding system 1A, the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) has a detecting unit that detects a defect mark printed on the optical component layer FX (No. Upon detecting the camera 34), the portion where the defect mark of the optical component layer FX is detected is held by the bonding head 32 and transported to the discarded position (discarded position). Therefore, it is possible to provide a production system of an optical display device which improves the yield ratio of an optical display device and which is excellent in productivity.

Further, in the film bonding system 1A, the first cutting device 51 and the second cutting device 52 are laser cutting machines, and the first cutting device 51 and the second cutting device 52 are connected to the same laser output device 53. The laser beams output from the laser output device 53 are supplied to the first cutting device 51 and the second cutting device 52 in a divergent manner. Therefore, compared with the case where the first cutting device 51 and the second cutting device 52 are each connected to the respective laser output devices, the purpose of miniaturizing the production system of the optical display device can be achieved.

(Third Embodiment) Fig. 20 is a schematic configuration view showing a film bonding system 2 of a third embodiment.

The present embodiment differs from the second embodiment in that the transport direction of the first optical component layer F1, the transport direction of the second optical component layer F2, and the transport direction of the third optical component layer F3 are parallel to each other. Therefore, in the embodiment, the same components as those in the second embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.

In addition, in FIG. 20, the rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) and the bonding device disposed on the peripheral portion thereof (the first bonding device 13 and the second bonding device 15) are shown. The schematic structure of the third bonding device 18). In the 20th drawing, the main conveying device 5, the sub conveying device (the first sub conveying device 6, the second sub conveying device 7), the film peeling device 14, and the like shown in Fig. 17 are omitted. In Fig. 20, the arrows indicated by the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3 show the optical component layers (the first optical component layer F1 and the second optical component layer F2). The average optical axis direction of the third optical component layer F3), and reference numeral 140, shows the discarded position (discarded position) in which the bonded laminated sheet containing the defect is discarded.

In the film bonding system 1A of the second embodiment shown in Fig. 17, two bonding apparatuses (the first bonding apparatus 13 and the second bonding apparatus 15) having the same configuration are provided on the first rotary machine tool. 11 positions on the circumference at an angle of 90°. Therefore, the conveyance directions of the layer conveyance apparatuses provided with the respective bonding apparatuses (the first bonding apparatus 13 and the second bonding apparatus 15) are perpendicular to each other, and the long layer sheet conveying production line is formed in both directions.

On the other hand, in the film bonding system 2 of the present embodiment shown in FIG. 20, the conveying direction of the layer conveying device of the first bonding device 13 and the conveying direction of the layer conveying device of the second bonding device 15 are The conveying direction of the layer conveying device of the third bonding device 18 is a parallel structure. Therefore, the conveying direction of the layer conveying apparatus including each of the bonding apparatuses (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) is parallel to each other, and only a long layer is formed in one direction. The film is transported to the production line.

For example, in the example of Fig. 20, the first optical component layer F1 is transported in the joining direction of the center of rotation of the vertical first rotary machine tool 11 and the first bonding position 11c. The first layer sheet F1 m cut by the cutting portion 131 b is conveyed to the liquid crystal panel P at the first bonding position 11 c by the bonding head 32 in a direction perpendicular to the conveying direction of the first optical module layer F1. The side of the side of the positive/negative side.

The second optical component layer F2 is transported in a direction in which the center of rotation of the first rotary table machine 11 and the second bonding position 11e are coupled. The second layer sheet F2 m cut by the cutting portion 131b is conveyed by the bonding head 32 in a direction parallel to the direction of the second optical component layer F2, and bonded to the first optical component at the second bonding position 11e. The surface of the first layer sheet F1m side of the bonded body PA1 is bonded.

The third optical component layer F3 is conveyed in a joining direction of the center of rotation of the parallel second rotary machine tool 16 and the third bonding position 16c. The third layer piece F3 m cut by the cutting portion 131b is conveyed to the liquid crystal panel at the third bonding position 16c by the bonding head 32 in the direction parallel to the conveying direction of the third optical component layer F3. The other side of P.

In the film bonding system 2 of the present embodiment, each of the opticals transported by the layer transfer device 31 of each of the bonding devices (the first bonding device 13, the second bonding device 15, and the third bonding device 18) The conveying directions of the component layers FX are parallel to each other. Therefore, the purpose of miniaturizing the production system of the optical display device can be achieved as compared with the case where the transport direction of each optical component layer FX is set to be scattered.

(Fourth embodiment) Fig. 21 is a schematic view of a bonding apparatus applied to a film bonding system of a fourth embodiment. Fig. 21(a) is a schematic view showing a state in which the layer sheet FXm is held by the bonding head 60, and Fig. 21(b) is a view showing a state in which the layer sheet FXm is bonded to the liquid crystal panel P.

The present embodiment differs from the second embodiment in that the bonding head 32 having the arc-shaped holding surface 32a used in the bonding apparatus of the second embodiment is used in the bonding apparatus of the present embodiment. A bonding head 60 having a planar holding surface 60a. Therefore, the structure of the bonding head 60 is mainly described here, and the same components as those of the second embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The bonding apparatus of the present embodiment includes a bonding head 60, a bonding roller 62, a guide bar 61 that supports the bonding head 60 and the bonding roller 62, and a state in which the guiding rod 61 is tilted with respect to the liquid crystal panel P. Horizontally moving drive (not shown). Although not shown in the drawings, the unwinding portion, the cutting portion, and the blade (peeling portion) which are the same as those shown in Fig. 18 are provided in the bonding apparatus of the present embodiment.

The bonding head 60 has a planar holding surface 60a that holds the layer sheet FXm peeled off from the separation layer sheet. The holding surface 60a is inclined by the guide rod 61 and inclined with respect to the liquid crystal panel P. One end of the layer FXm protrudes outside the holding surface 60a to be positioned to be attracted to the holding surface 60a. Since the adsorption force of the layer sheet FXm is weak, the layer sheet FXm can smoothly move in the horizontal direction on the holding surface 60a while being held by the holding surface 60a.

The bonding roller 62 is disposed on the side surface of the bonding head 60, and the layer sheet FXm protruding from the holding surface 60a of the bonding head 60 abuts against the liquid crystal panel P. In this state, when the guide rod 61 is moved in the horizontal direction by a driving device (not shown), the bonding head 60 and the bonding roller 62 are adhered to the liquid crystal panel P in a state where one end portion of the layer FXm is adhered to the liquid crystal panel P. The horizontal movement is performed from one end side of the layer FXm toward the other end side. Thereby, the layer sheet FXm is gradually bonded to the liquid crystal panel P from the one end side by the bonding roll 62.

The bonding head 60 is held by the layer FXm of the holding surface 60a, and is aligned by the moving direction of the bonding head in the horizontal direction, the vertical direction thereof, and the rotation direction. The bonding position (relative bonding position) of the layer FXm and the liquid crystal panel P is performed by the control device 25 (refer to Fig. 16) based on the inspection data in the optical axis direction of the optical module layer FX as in the second embodiment. Decide. The bonding head 60 is bonded to the liquid crystal panel P by the layer sheet FXm held by the holding surface 60a in accordance with the relative bonding position determined by the control device 25.

Therefore, in the present embodiment, it is possible to provide a production system of an optical display device which is intended to display a frame portion around the reduced area, and to achieve an enlargement of the display area and miniaturization of the device.

(First Modification) In the above embodiment, a CO ₂ laser cutting machine is used as an example of the cutting device (the first cutting device 51 and the second cutting device 52), but the cutting device (first The cutting device 51 and the second cutting device 52) are not limited thereto. Other cutting portions such as a cutting blade may be used as the cutting device (the first cutting device 51 and the second cutting device 52).

For example, as shown in FIG. 22, while the three sides of the outer periphery of the first substrate P1 are along the three sides of the corresponding second substrate P2, one of the remaining edges of the outer periphery is corresponding to the second substrate. When one of the sides of P2 extends outward, the size of the second substrate P2 is substantially the same as the size of the display area P4. Therefore, as long as the cutting blade moves along the outer periphery of the second substrate P2, the third layer F3m joined to the second substrate P2 can be formed to correspond to the size of the bonding surface of the liquid crystal panel P and the third layer F3m. Three optical components F13.

In this case, the remaining portion of the layer F3m hardly adheres to the surface of the liquid crystal panel P, and the remaining portion of the third optical component F13 and its periphery is roughly bonded only by the adhesive force of the adhesive layer F2a. Therefore, the means for peeling off the remaining portion of the third layer sheet F3m from the liquid crystal panel P can be simply a structure that clamps the end portion of the remaining portion and is pulled out, and the device has a simple structure. Further, in the above embodiment, the remaining portions of the plies (the first ply F1m and the second ply Fm) and the remaining portions of the third ply F3m are peeled off from the liquid crystal panel P in different processes. However, in the present embodiment, the recovery of the remaining portion of the third layer sheet F3m is extremely easy. Therefore, the remaining portions of the layer sheets (the first layer sheet F1m and the second layer sheet F2m) are made from the liquid crystal panel P. In the case of peeling and recycling, the remaining portion of the layer F3m may be peeled off from the liquid crystal panel P at the same time. In this case, since the peeling means of the remaining portion is not required to be provided at two places, the production system of the optical display device can be miniaturized.

(Second Modification) In the above embodiment, the method of determining the in-plane average optical axis direction of the optical component layer FX is described in the method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P. . In the above embodiment, in the case where the in-plane maximum offset angle θmax of the optical component layer FX and the average value θmid of the minimum offset angle θmin are taken as the average offset angle, the edge line and the average bias of the relative optical component layer FX are detected. The direction in which the angle of shift θmid is sandwiched is the in-plane average optical axis direction of the optical component layer FX. However, the method of detecting the in-plane average optical axis direction of the optical component layer FX is not limited to this.

For example, one or a plurality of checkpoints CP are selected from a plurality of checkpoints CP (refer to FIG. 19A) set in the width direction of the optical component layer FX, and the optical axis direction and the optical are detected for each of the selected checkpoints CP. The angle (offset angle) of the edge line EL of the component layer FX. Then, an average value of the offset angles of the selected one or a plurality of checkpoints CP in the optical axis direction is detected. As the average offset angle, the edge line EL of the optical component layer FX and the average offset angle can also be detected. The direction of the clip is the average optical axis direction of the optical component layer FX.

In the film bonding system of the above-described embodiment, the outer peripheral edge of the bonding surface is detected for each of the plurality of liquid crystal panels P by using the detecting means, and the bonding is applied to each of the liquid crystal panels P according to the detected outer periphery. The cutting position of the layer FXm. Thereby, regardless of the individual difference in the size of the liquid crystal panel P or the layer FXm, the optical component of the required size can be cut, and therefore, there is no difference in quality due to individual differences in the size of the liquid crystal panel P or the layer FXm, which can be reduced. The frame portion around the display area is displayed to achieve the expansion of the display area and the miniaturization of the machine.

The above description of the preferred embodiment of the present embodiment has been described with reference to the accompanying drawings, and the present invention is not limited thereto. The various shapes and combinations of the various structural components shown in the above are exemplified, and various modifications may be made in accordance with the design requirements and the like without departing from the spirit of the invention.

1, 1A, 2‧‧‧ film bonding system
5‧‧‧Main conveying equipment
5a‧‧‧ starting point
5b‧‧‧end point
5c‧‧‧ rack
6‧‧‧First delivery equipment
6a‧‧‧First starting position
6b‧‧‧first end position
7‧‧‧Second secondary conveyor
7a‧‧‧second starting position
7b‧‧‧second end position
8‧‧‧First transport device
9‧‧‧cleaning device
11‧‧‧First rotary machine tool
11a‧‧‧Starting position of the first turntable
11b‧‧‧First turntable end position
11c‧‧‧First fit position
11d‧‧‧Second fitting position
11e‧‧‧film stripping position
12‧‧‧Second transport device
13‧‧‧First bonding device
14‧‧‧film stripping device
15‧‧‧Second laminating device
16‧‧‧Second rotary machine tool
16a‧‧‧Starting position of the second turntable
16b‧‧‧second turntable end position
16c‧‧‧ third fit position
16d‧‧‧Finished inspection position
17‧‧‧ Third transport device
18‧‧‧ Third bonding device
19‧‧‧Checking device
21‧‧‧fourth transport device
22‧‧‧ fifth transport device
24‧‧‧ memory device
25‧‧‧Control device
31‧‧‧Ply conveying device
31a‧‧‧Departure
31b‧‧‧First cutting device
31c‧‧‧ Blade
31d‧‧‧Winding Department
31e‧‧‧Separation layer peeling position
32‧‧‧Fitting head
32a‧‧‧ Keep face
33‧‧‧ drive
34‧‧‧First inspection camera
35‧‧‧Second detection camera
36‧‧‧ Third detection camera
37‧‧‧Fourth detection camera
38‧‧‧ Fifth detection camera
39‧‧‧Location Calibration Table
39a‧‧‧Loading surface
40‧‧‧Manufacture of equipment
41a, 41c‧‧‧Extracted
41b, 41d‧‧‧Winding Department
42‧‧‧Checking device
43‧‧‧Light source
44‧‧‧Lighting elements
45‧‧‧Cutter
50‧‧‧Second cutting device
51‧‧‧First cutting device
52‧‧‧Second cutting device
53‧‧‧Laser output device
60‧‧‧Fitting head
60a‧‧‧ Keep face
61‧‧‧Guide bars
62‧‧‧Finishing roller
81‧‧‧First detection device
82‧‧‧Second detection device
83‧‧‧Photographing device
83a‧‧‧Photographing surface
84‧‧‧Light source
85‧‧‧Control Department
100‧‧‧Transporting device
101‧‧‧Optical film
102‧‧‧First intermediate film
103‧‧‧Second intermediate film
104‧‧‧ Optical film sectioning
110‧‧‧film stratification device
111, 112‧‧‧ Rolls
113‧‧‧Roller
120‧‧‧ pedestal
121‧‧‧ sign
131b‧‧‧cutting department
140‧‧‧Discarded location
CA‧‧‧ inspection area
CL‧‧‧ transverse line
CP‧‧‧ checkpoint
ED‧‧‧ outer periphery
EL‧‧‧ edge line
F‧‧‧Transfer direction
F0A‧‧‧ layer
F0‧‧‧ mother piece
F1‧‧‧First optical component layer
F2‧‧‧Second optical component layer
F3‧‧‧ third optical component layer
F1a‧‧‧Optical component body
F2a‧‧‧Adhesive layer
F3a‧‧‧Separation layer
F4a‧‧‧Surface protection film
F5‧‧‧Fitting layer
FX‧‧‧ optical component layer
F11‧‧‧First optical component
F12‧‧‧Second optical component
F13‧‧‧ Third optical component
F1X‧‧‧ optical components
F1m‧‧‧ first layer
F2m‧‧‧Second layer
F3m‧‧‧ third layer film
FXm‧‧‧ layer
F6‧‧‧ polarizer
F7‧‧‧ first film
F8‧‧‧second film
G‧‧‧Border Department
H, H1‧‧‧ height
L1‧‧‧ axis
L2, L3‧‧‧ axis
L4‧‧‧ axis
Lc‧‧‧ cut edge
Lp‧‧‧ side
Lp1‧‧‧ side
P‧‧‧ LCD panel
P1‧‧‧ first substrate
P2‧‧‧second substrate
P3‧‧‧ liquid crystal layer
P4‧‧‧ display area
PA1‧‧‧First optical component fit
PA1‧‧‧First optical component fit
PA2‧‧‧Second optical component fit
PA3‧‧‧The third optical component fit
PA4‧‧‧Four optical component bonding body
PA5‧‧‧Fix optical component fit
R0A‧‧‧ reel
R0‧‧‧original paper reel
R1‧‧‧ Roller
R2‧‧‧Separation roller
SA1‧‧‧ first fit surface
SA2‧‧‧ second fit surface
S1-S7‧‧‧ steps
V1‧‧‧first optical axis
V2‧‧‧second optical axis
V3‧‧‧ average optical axis
Vc‧‧‧ cut direction
WCL‧‧‧ cut line γ‧‧‧specific angle θmax‧‧‧maximum offset angle θmid‧‧‧mean offset angle θmin‧‧‧minimum offset angle

Fig. 1 is a schematic plan view showing a film bonding system in a first embodiment of the present invention. Fig. 2 is a plan view showing a liquid crystal panel of the embodiment. Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2, showing a plan view of a main part of a cutting apparatus for optical film slicing. Fig. 4 is a cross-sectional view showing the optical component layer of the embodiment. Figure 5 is a plan view of the above film bonding system. Fig. 6 is a side view showing the main part of the above film bonding system. Fig. 7 is a side view showing a manufacturing apparatus of the optical component layer. Fig. 8 is a plan view showing the main part of the manufacturing apparatus of the optical component layer. Fig. 9A is a view showing the in-plane distribution of the optical axis of the mother sheet. Figure 9B shows the in-plane distribution of the optical axis of the master. Figure 9C shows the in-plane distribution of the optical axis of the master. Fig. 10 is a perspective view showing a state in which a plurality of optical component layers are cut out from the layer after inspection. Figure 11 is an explanatory view of a method of cutting a layer from an optical component layer. Fig. 12A is an explanatory view showing a method of adjusting the cutting direction of the optical component layer. Fig. 12B is an explanatory view showing a method of adjusting the cutting direction of the optical component layer. Fig. 13 is an explanatory view showing a method of laminating the layers with respect to the optical display member. Figure 14 is a flow chart of a method of producing an optical display device. Fig. 15 is a schematic view showing a cutting method of a conventional optical film section. Fig. 16 is a schematic side view showing the film bonding system of the second embodiment. Figure 17 is a plan view of a film bonding system. Figure 18 is a schematic side view of a laminating device of a film bonding system. Fig. 19A is a view showing an example of a method of determining a bonding position of a layer with respect to a liquid crystal panel. Fig. 19B is a view showing an example of a method of determining a bonding position of a layer with respect to a liquid crystal panel. Fig. 20 is a schematic side view showing the film bonding system of the third embodiment. Fig. 21 is a schematic view of a bonding apparatus applied to the film bonding system of the fourth embodiment. Fig. 22 is a plan view showing a cutting method of the remaining portion of the ply. Figure 23 is a schematic view of the first detecting device for detecting the outer periphery of the bonding surface. Fig. 24 is a view showing a modification of the first detecting means for detecting the outer periphery of the bonding surface. Fig. 25 is a plan view showing the position at which the outer periphery of the bonding surface is detected. Figure 26 is a schematic illustration of a second detecting device that detects the outer periphery of the mating face.

Claims (30)

A production system for an optical display device is a production system for an optical display device formed by bonding an optical component to an optical display component, comprising: a pedestal supporting the optical display component; and a winding-out portion from the roll roller Rolling the strip optical component layer together with the separating layer sheet; the control device obtains the in-plane distribution data of the optical component layer, and calculates the optical component layer according to the in-plane distribution data of the optical component layer Adjusting the direction of the optical component layer in the plane of the optical axis, so that the in-plane average optical axis direction of the optical component layer is at a target angle with respect to the cutting direction of the optical component layer; , in a cutting direction adjusted by the control device, leaving the separation layer in a state of the optical component layer, and cutting the optical component layer to a larger size than the display area of the optical display component Obtaining a layer; peeling the part, peeling the layer from the separating layer; bonding the head, holding the layer against the holding surface, and sticking the layer held on the holding surface The optical display unit; the driving device moves the bonding head relative to the pedestal, and drives the bonding head for holding and bonding the layer; the detecting device is attached to the layer The outer peripheral edge of the bonding surface of the layer and the optical display member is detected on the bonding body of the optical display member; and the second cutting device is attached to the bonding body, and the layer is matched to the bonding surface And a portion corresponding to the outer side of the facing surface portion, cut along the outer periphery to cut an optical component corresponding to the size of the bonding surface from the layer; wherein the detecting device comprises: The bonding surface imaging device is configured to capture a picture of the outer peripheral edge of the optical display member on the side of the laminated body, and to illuminate the outer peripheral edge of the bonded body; the control unit The operation for detecting the outer circumference is performed based on the screen of the outer circumference photographed by the bonding surface photographing device; and the bonding surface photographing device is disposed inside the bonding surface of the outer peripheral edge, and The normal line of the imaging surface of the bonding surface photographing device is inclined with respect to the normal line of the bonding surface. The production system of an optical display device according to claim 1, wherein the control device detects two optical axes intersecting each other at a maximum angle in the layer of the optical component, and calculates the two optical axes. An axis that is halved in angle is used as the in-plane average optical axis of the optical component layer. The production system of the optical display device according to claim 1, wherein the imaging device further has a photographing device for taking a state of holding the layer on the holding surface; and the driving device is based on the photographing result of the photographing device. The mating head is moved relative to the pedestal such that the cut edge of the ply is aligned or parallel with one of the sides of the optical display member. A production system for an optical display device according to claim 1, further comprising a memory device storing in-plane distribution data of an optical axis of the optical component layer. The production system of an optical display device according to claim 1, further comprising an inspection device for inspecting an optical axis of the optical component layer at a plurality of inspection positions in a width direction of the optical component layer. The production system of an optical display device according to claim 5, wherein the inspection device has a light detecting element movable along a width direction of the optical component layer; and the inspection device is configured to perform the light detecting component The optical axis of the optical component layer is detected by the light detecting element while moving in the width direction of the optical component layer, whereby the optical axis of the optical component layer is inspected at a plurality of inspection positions in the width direction of the optical component layer. The production system of the optical display device according to the first aspect of the invention, wherein the bonding head is configured to allow the layer to be held by the holding surface to perform the moving direction of the bonding head and the vertical direction and the turning direction in the horizontal direction. Calibration. The production system of the optical display device according to claim 1, further comprising a detecting portion that detects a defect mark printed on the optical component layer; and the bonding head detects the optical component layer The portion where the defect mark is present is held on the bonding surface and transported to the disposal position. The production system of the optical display device according to claim 1, further comprising a turntable for moving the optical display member to the loading position, the bonding position of the layer to the optical display member, and the carrying position . A method for producing an optical display device, which is a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a first project, wherein a strip-shaped optical component layer and a separation layer are formed from a roll drum The second project is to obtain the in-plane distribution data of the optical component layer, and calculate the in-plane average optical axis direction of the optical component layer according to the in-plane distribution data of the optical component layer. Adjusting the cutting direction of the optical component layer such that the in-plane average optical axis direction of the optical component layer is at a target angle with respect to the cutting direction of the optical component layer; In the direction, the separation layer remains in the state of the optical component layer, and the optical component layer is cut to be larger than the display area of the optical display component to obtain a layer; the fourth engineering is to layer the layer The sheet is peeled off from the separation layer; the fifth step is to hold the layer sheet against the holding surface of the bonding head, and to adhere the layer sheet held on the holding surface to the optical display member; The sixth project is to move the bonding head relative to the pedestal supporting the optical display component, and to drive the bonding head for holding and bonding the layer; and the seventh project is attached to the layer The outer peripheral edge of the bonding surface of the layer and the optical display member is detected on the bonding body between the sheet and the optical display member, and the portion corresponding to the bonding surface of the layer and the corresponding layer is corresponding to the bonding body a remaining portion outside the fitting surface portion, cut along the outer periphery to cut an optical component corresponding to the size of the bonding surface from the layer; wherein, in the seventh project, the side of the bonding body is illuminated The outer peripheral edge of the bonding body is attached to the side of the layer of the optical display member and the inner side of the bonding surface of the outer peripheral edge is inclined in a state of being inclined with respect to a normal line of the bonding surface. The screen on the outer periphery is taken, and the calculation for the outer circumference is detected based on the image of the outer circumference photographed. The method for producing an optical display device according to claim 10, wherein the two optical axes intersecting each other at a maximum angle in the layer of the optical component are detected, and the angles of the two optical axes are calculated. An aliquot of the axis serves as the in-plane average optical axis of the optical component layer. A production system for an optical display device is a production system for an optical display device formed by bonding an optical component to an optical display component, and is provided with a bonding device for winding a strip-shaped optical component layer from a roll roller. After the optical component layer is cut into a larger size than the display area of the optical display component as a layer, the layer is bonded to the optical display component; the detecting device is attached to the layer and the optical The outer peripheral edge of the bonding surface of the layer and the optical display member is detected on the bonding body of the display member; and the cutting device is attached to the bonding body, and the layer is disposed outside the corresponding portion of the bonding surface The remaining portion is cut along the outer periphery to form an optical component corresponding to the size of the bonding surface; wherein the bonding device has a winding-out portion, the optical component layer is separated from the separation layer by the roll roller Roll out The cutting portion is configured to leave the separation layer in a state of the optical component layer, to cut the optical component layer to obtain a layer; the peeling portion is to peel the layer from the separation layer; and to laminate The head is held against the holding surface, and the layer held on the holding surface is attached to the optical display member; wherein the detecting device comprises: a bonding surface detecting device, from the sticker In the fit, the optical display member is attached to the side of the layer to capture the image of the outer periphery; the illumination source illuminates the outer periphery of the bonded body; and the control unit is based on the bonding surface. The image of the outer periphery of the image is captured for the calculation of the outer periphery; and the bonding surface imaging device is disposed inside the bonding surface of the outer periphery and is opposite to the normal of the bonding surface. The normal line of the imaging surface of the bonding surface photographing device is inclined. The production system for an optical display device according to claim 12, further comprising a control device for determining a relative fit of the optical display member to the layer according to an optical axis direction inspection data of the optical component layer. a position; and the bonding head is attached to the optical display member by the layer held by the holding surface according to the relative bonding position determined by the control device. The production system of the optical display device according to claim 13, wherein the bonding head is configured to allow the layer held by the holding surface to perform the moving direction of the bonding head and the vertical direction and the turning direction in the horizontal direction. Calibration. The production system of an optical display device according to claim 12, wherein the bonding device further has a detecting portion that detects a defect mark printed on the optical component layer and detects the optical component layer The portion having the defect mark is held by the bonding head and transported to the disposal position. The production system of an optical display device according to claim 12, further comprising a turntable for moving the optical display member to a loading position, a bonding position of the layer to the optical display member, and a carrying position . The production system of an optical display device according to claim 12, wherein the bonding head holds the layer on the arc-shaped holding surface and can be tilted and moved along the bending of the holding surface to The layer held by the holding surface is attached to the optical display member. A production system for an optical display device is a production system for an optical display device formed by bonding an optical component to an optical display component, and is provided with: a first bonding device, which is strip-shaped from the first roll roller The optical component layer is rolled out, and the first optical component layer is cut into a larger size than the display area of the optical display component, and the first layer is bonded to the optical display component. a side of one side of the front/back surface serves as an optical component bonding body; a second bonding apparatus winds out the strip-shaped second optical component layer from the second roll cylinder, and the second optical component layer is After the display area is cut to a larger size and is used as the second layer, the second layer is attached to the surface of the first layer side of the optical component bonding body; the first detecting device is attached to the second layer The outer peripheral edge of the first bonding surface as the bonding surface of the first layer sheet and the optical display member is detected on the bonding body of the sheet and the optical component bonding body; the first cutting device is attached to the second layer a sheet and a bonded body of the optical component, The first layer and the second layer of the optical display member are respectively disposed on the outer side of the corresponding portion of the first bonding surface, and are cut along the outer periphery of the first bonding surface, so that a first optical component composed of the first optical component layer and a second optical component composed of the second optical component layer formed as an optical component corresponding to the size of the first bonding surface; wherein the first bonding device have: a first winding portion, the first optical component layer is unwound together with the first separation layer from the first roll; the first cutting portion is such that the first separation layer remains in the first optical a state of the component layer, the first optical component layer is cut to obtain a first ply; a first peeling portion is used to peel the first ply from the first separating ply; and a first bonding head, Holding the first layer sheet against the first holding surface, and bonding the first layer sheet held on the first holding surface to the side of the positive/negative side of the optical display member; The second bonding device has a second winding portion that winds out the second optical component layer together with the second separation layer from the second roll drum, and the second cutting portion allows the second separation layer to be Remaining in the state of the second optical component layer, cutting the second optical component layer to obtain a second ply; the second peeling portion is peeling the second ply from the second separation ply; The second bonding head holds the second layer sheet against the second holding surface and allows the second layer to be held on the second holding surface Bonding to the surface of the first layer side of the optical component bonding body; wherein the first detecting device comprises: a first bonding surface detecting device, wherein the optical display component is attached to the bonding body a side of the first layer, capturing a picture of the outer periphery of the first bonding surface; an illumination source illuminating the outer periphery of the first bonding surface; and a control unit for photographing the first bonding surface a screen for detecting a periphery of the first bonding surface on a peripheral image of the first bonding surface captured by the device; and The first bonding surface imaging device is disposed on the inner side of the first bonding surface of the outer peripheral surface, and the normal of the imaging surface of the first bonding surface imaging device with respect to a normal line of the first bonding surface The system is tilted. The production system of the optical display device of claim 18, further comprising a control device for determining the optical display component and the first layer according to the optical axis direction inspection data of the first optical component layer a first relative bonding position, and determining a second relative bonding position of the optical component bonding body and the second layer according to the optical axis direction of the second optical component layer; the first bonding device The first bonding head is attached to the first layer of the front/back surface of the optical display member according to the first relative bonding position determined by the control device And the second bonding head of the second bonding device attaches the second layer held by the second holding surface to the optical component bonding body according to the second relative bonding position determined by the control device At the side of the first layer side. The production system of the optical display device of claim 19, wherein the first bonding head of the first bonding device allows the first layer to be held by the first holding surface in a horizontal direction, Aligning the moving direction of the bonding head with the vertical direction and the rotating direction; and the second bonding head of the second bonding device allows the second layer held by the second holding surface to be attached in the horizontal direction Calibration of the direction of the head movement and its vertical direction and direction of rotation. The production system of the optical display device of claim 18, wherein the first bonding device further has a first detecting portion that detects a defect mark printed on the first optical component layer, and a portion of the first optical component layer that detects the defect mark is held by the first bonding head and transported to the first disposal position; The second bonding device further includes a second detecting unit that detects a defect mark printed on the second optical component layer, and holds a portion of the second optical component layer that detects the defect mark in the first The second head is attached to the second disposal position. The production system of an optical display device according to claim 18, further comprising a turntable for moving the optical display member to the loading position as a bonding position of the first layer to the optical display member The first bonding position, the second bonding position as the bonding position of the second layer sheet to the optical component bonding body, and the carrying-out position. The production system of an optical display device according to claim 18, wherein the first bonding device further has a first layer sheet conveying device, and the first roll is wound from the first optical component layer Rolling the first optical component layer and transporting the first optical component layer along the longitudinal direction thereof; the second bonding device further has a second layer conveying device, and the second layer is wound from the second a second roll of the optical component layer unwinds the second optical component layer and transports the second optical component layer along a longitudinal direction thereof; and a transport direction of the first optical component layer and the second optical component The transport directions of the layers are parallel to each other. The production system of the optical display device of claim 18, further comprising: a third bonding device that winds out the strip-shaped third optical component layer from the third roll drum, and the third After the optical component layer is cut to a larger size than the display area and is used as the third layer, the third layer is attached to the other side of the front/back surface of the optical display component; the second detecting device is attached to The second layer sheet and the bonding layer of the third layer sheet and the optical component bonding body detect an outer peripheral edge of the second bonding surface which is a bonding surface of the third layer sheet and the optical display member; The cutting device is disposed on the bonding layer of the second layer sheet and the third layer sheet and the optical component bonding body, and the third layer sheet bonded to the optical display member is disposed on the second bonding surface Corresponding part The remaining portion of the outer side is cut along the outer periphery of the second bonding surface to form an optical component corresponding to the size of the second bonding surface; wherein the third bonding device has a third winding portion And ejecting the third optical component layer together with the third separation layer from the third roll; the third cutting part is configured to leave the third separation layer in the state of the third optical component layer, The third optical component layer is cut to obtain a third ply; the third peeling portion is peeled off from the third separating ply; and the third bonding head is the third ply Holding the third holding sheet on the third holding surface and bonding the third layer held on the third holding surface to the other side of the front/rear surface of the optical display member; wherein the second detecting device comprises: The bonding surface photographing device is configured to photograph a side of the optical display member to which the third layer sheet is bonded, and to photograph a peripheral edge of the second bonding surface; and to illuminate the second light The outer peripheral edge of the bonding surface; the control unit is based on the photographing device of the second bonding surface The screen on the outer periphery of the second bonding surface is used to detect the peripheral edge of the second bonding surface. The production system of an optical display device according to claim 24, wherein the control device determines the optical display component and the third layer according to the optical axis direction inspection data of the third optical component layer. And a third bonding head of the third bonding device, according to the third relative bonding position determined by the control device, bonding the third layer held by the third holding surface to The other side of the optical display member is in the front/back side. The production system of the optical display device of claim 24, wherein the third bonding device further has a third detecting portion for detecting a defect mark printed on the third optical component layer, and The portion of the third optical component layer that detects the defect mark is held by the third bonding head and transported to the third disposal position. The production system of the optical display device according to claim 24, wherein the third bonding device further has a third layer conveying device, which is a third winding from which the third optical component layer is wound. Rolling the third optical component layer and transporting the third optical component layer along the longitudinal direction thereof; and the transport direction of the first optical component layer and the transport direction of the second optical component layer and the third The transport directions of the optical component layers are parallel to each other. The production system of an optical display device according to claim 24, wherein the remaining portions cut from the first layer, the second layer, and the third layer are collectively removed from the optical display member Stripped. The production system of an optical display device according to claim 24, wherein the first cutting device and the second cutting device are laser cutting machines, the first cutting device and the second cutting device The device is connected to the same laser output device, and the laser output from the laser output device is branched and supplied to the first cutting device and the second cutting device. The production system of the optical display device of claim 24, wherein at least one of the first bonding head, the second bonding head, and the third bonding head is attached to the first At least one of the ply piece, the second ply piece, and the third ply piece is held against at least one of the first holding surface, the second holding surface, and the third holding surface in an arc shape, and The sheet may be tilted and moved along the bending of the holding surface to adhere the layer held by the holding surface to the optical display member or the optical member bonding body.