TW201350988A - Production system of optical display device - Google Patents

Production system of optical display device Download PDF

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Publication number
TW201350988A
TW201350988A TW102112200A TW102112200A TW201350988A TW 201350988 A TW201350988 A TW 201350988A TW 102112200 A TW102112200 A TW 102112200A TW 102112200 A TW102112200 A TW 102112200A TW 201350988 A TW201350988 A TW 201350988A
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TW
Taiwan
Prior art keywords
layer
bonding
optical
optical component
liquid crystal
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TW102112200A
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Chinese (zh)
Inventor
Mikio Fujii
Hiromitsu Tanaka
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Sumitomo Chemical Co
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Publication of TW201350988A publication Critical patent/TW201350988A/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • G02B5/3025Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • G02B5/3041Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid comprising multiple thin layers, e.g. multilayer stacks
    • G02B5/305Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid comprising multiple thin layers, e.g. multilayer stacks including organic materials, e.g. polymeric layers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

Abstract

A production system of an optical display device, includes: an attachment portion attaching a sheet piece to each of a first surface and a second surface of an optical display component, the sheet piece being cut from an optical member sheet, the optical member sheet having a width greater than that of a displaying region of the optical display component; a cutting portion cutting off an excess portion located outside a facing portion of the sheet piece corresponding to the displaying region from the sheet piece attached to each of the first surface and the second surface of the optical display component, the cutting portion forming an optical member having a size corresponding to the displaying region on each of the first surface and the second surface of the optical display component.

Description

光學顯示設備之生產系統 Optical display device production system

本發明係關於一種光學顯示設備之生產系統。 The present invention relates to a production system for an optical display device.

日本專利特開第2003-255132號公報係揭示,傳統上,於液晶顯示器等光學顯示設備之生產系統中,要貼合至液晶面板(光學顯示部件)的偏光板等光學組件,係從長條薄膜切割出符合液晶面板之顯示區域尺寸的層片,包裝並運送至另一生產線後,貼合至液晶面板。 Japanese Laid-Open Patent Publication No. 2003-255132 discloses that, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate to be attached to a liquid crystal panel (optical display member) is a long strip. The film is cut into layers corresponding to the size of the display area of the liquid crystal panel, packaged and transported to another production line, and bonded to the liquid crystal panel.

但是,上述習知結構中,考慮到液晶面板及層片的各尺寸偏差,以及相對於液晶面板的層片之貼合偏差(位置偏差),會切割出較顯示區域略大的光學組件之層片。因此,於顯示區域之周邊部分形成有多餘區域(邊框部),有阻礙機器之小型化的問題。 However, in the above-mentioned conventional structure, in consideration of the dimensional deviation of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) with respect to the ply of the liquid crystal panel, the layer of the optical component slightly larger than the display area is cut. sheet. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, which may hinder the miniaturization of the device.

本發明之目的係提供一種縮小顯示區域周邊之邊框部,以達成顯示區域之擴大及機器之小型化目的之光學顯示設備之生產系統。 SUMMARY OF THE INVENTION An object of the present invention is to provide a production system of an optical display device which reduces the frame portion around the display area to achieve the expansion of the display area and the miniaturization of the machine.

關於本發明之第一態樣的光學顯示設備之生產系統,在光學顯示設備之生產系統中,係具備有:貼合部,係將從較該光學顯示部件之顯示區域寬度更寬之光學組件層所切出之層片各自貼合至光學顯示部件之第一面及第二面;以及切斷部,係從各自貼合至該光學顯示部件之第一面及第二面的層片,將配置於對應該顯示區域之層片對向部分外側的剩餘部分切斷,以於該光學顯 示部件之第一面及第二面各自形成對應於該顯示區域大小的光學組件。不過,上述的「對應顯示區域之層片對向部分(顯示區域之對向部分)」係指較顯示區域大,並較光學顯示部件外形小之區域,且為避開了電子部件安裝部等功能部分的區域。即,上述結構係包含沿光學顯示部件外周緣以雷射切斷剩餘部分的情況。 A production system for an optical display device according to a first aspect of the present invention, in a production system of an optical display device, comprising: a bonding portion which is an optical component which is wider from a display region than the optical display member; The layer cut out of the layer is bonded to the first surface and the second surface of the optical display member; and the cut portion is bonded from the first surface and the second surface of the optical display member. Cutting off the remaining portion disposed outside the opposing portion of the layer corresponding to the display area for the optical display The first side and the second side of the display member each form an optical component corresponding to the size of the display area. However, the above-mentioned "opposing portion of the layer corresponding to the display area (opposing portion of the display region)" means an area larger than the display area and smaller than the outer shape of the optical display member, and avoiding the mounting portion of the electronic component, etc. The area of the functional part. That is, the above structure includes a case where the remaining portion is cut by laser along the outer periphery of the optical display member.

亦可具備有根據該光學組件層之光軸方向檢查資料來決定該光學顯示部件與該層片之相對貼合位置的控制裝置,該貼合部係根據該控制裝置所決定之相對貼合位置來將該層片貼合至該光學顯示部件。 The control device for determining the relative bonding position between the optical display member and the layer according to the optical axis direction inspection data of the optical component layer may be provided, and the bonding portion is determined according to the relative bonding position determined by the control device. The ply is attached to the optical display member.

該貼合部亦可具有:捲出部,係從料捲滾筒將光學組件層與分離層片一同捲出;切斷部,係將殘留有該分離層片的光學組件層切斷以獲得層片;剝離部,係將該層片從該分離層片處剝離;以及貼合頭,係將該層片貼合於保持面藉以保持該層片,並將由該保持面所保持之層片貼合至該光學顯示部件。 The bonding portion may have a winding portion for winding the optical component layer together with the separation layer sheet from the roll drum, and cutting the optical component layer leaving the separation layer sheet to obtain a layer. a peeling portion for peeling the layer from the separating layer; and a bonding head for attaching the layer to the holding surface to hold the layer, and to stick the layer held by the holding surface Join the optical display unit.

亦可將從貼合至該光學顯示部件的第一面之層片所切斷的第一剩餘部分、與從貼合至該光學顯示部件的第二面之層片所切斷的第二剩餘部分,一併從該光學顯示部件處剝離。 A second remaining portion cut from a ply bonded to the first side of the optical display member and a second remaining portion cut from a ply attached to the second side of the optical display member Partly, it is peeled off from the optical display member.

該切斷部亦可具有:從貼合至該光學顯示部件的第一面之層片將第一剩餘部分切斷的第一切斷裝置;以及從貼合至該光學顯示部件的第二面之層片將第二剩餘部分切斷的第二切斷裝置;且該第一切斷裝置及該第二切斷裝置係雷射切割機,該第一切斷裝置及該第二切斷裝置係連接至同一台雷射輸出裝置,從該雷射輸出裝置所輸出之雷射係分岐而供給至該第一切斷裝置及該第二切斷裝置。 The cutting portion may further include: a first cutting device that cuts the first remaining portion from the layer laminated to the first surface of the optical display member; and a second surface that is bonded to the optical display member a second cutting device that cuts the second remaining portion; and the first cutting device and the second cutting device are laser cutting machines, the first cutting device and the second cutting device The laser output device is connected to the same laser output device, and the laser output from the laser output device is branched and supplied to the first cutting device and the second cutting device.

根據上述本發明之態樣,可提供一種縮小顯示區域周邊之邊框部,以達成顯示區域之擴大及機器之小型化目的之光學顯示設備之生產系統。 According to the aspect of the invention described above, it is possible to provide a production system of an optical display device that reduces the frame portion around the display area to achieve the expansion of the display area and the miniaturization of the machine.

1‧‧‧薄膜貼合系統 1‧‧‧Film bonding system

11‧‧‧第一轉台式機床 11‧‧‧First rotary machine tool

11a‧‧‧第一轉台起始位置 11a‧‧‧Starting position of the first turntable

11b‧‧‧第一轉台終點位置 11b‧‧‧First turntable end position

11c‧‧‧第一貼合位置 11c‧‧‧First fit position

11d‧‧‧第二貼合位置 11d‧‧‧Second fitting position

11e‧‧‧薄膜剝離位置 11e‧‧‧film stripping position

12‧‧‧搬送裝置 12‧‧‧Transporting device

13‧‧‧第一貼合裝置 13‧‧‧First bonding device

14‧‧‧薄膜剝離裝置 14‧‧‧film stripping device

15‧‧‧第二貼合裝置 15‧‧‧Second laminating device

16a‧‧‧第二轉台起始位置 16a‧‧‧Starting position of the second turntable

16b‧‧‧第二轉台終點位置 16b‧‧‧second turntable end position

16c‧‧‧第三貼合位置 16c‧‧‧ third fit position

17‧‧‧搬送裝置 17‧‧‧Transporting device

18‧‧‧第三貼合裝置 18‧‧‧ Third bonding device

21‧‧‧搬送裝置 21‧‧‧Transporting device

22‧‧‧搬送裝置 22‧‧‧Transporting device

24‧‧‧儲存裝置 24‧‧‧Storage device

25‧‧‧控制裝置 25‧‧‧Control device

27‧‧‧輸送帶 27‧‧‧Conveyor belt

27a‧‧‧起始位置 27a‧‧‧ starting position

27b‧‧‧第一切斷位置 27b‧‧‧First cut position

27c‧‧‧終點位置 27c‧‧‧End position

28‧‧‧輸送帶 28‧‧‧Conveyor belt

28a‧‧‧起始位置 28a‧‧‧ starting position

28b‧‧‧第二切斷位置 28b‧‧‧Second cut position

31‧‧‧層片搬送裝置 31‧‧‧Ply conveying device

31a‧‧‧捲出部 31a‧‧‧Departure

31b‧‧‧切斷部 31b‧‧‧cutting department

31c‧‧‧刀刃 31c‧‧‧ Blade

31d‧‧‧捲取部 31d‧‧‧Winding Department

31e‧‧‧分離層剝離位置 31e‧‧‧Separation layer peeling position

32‧‧‧貼合頭 32‧‧‧Fitting head

32a‧‧‧保持面 32a‧‧‧ Keep face

33‧‧‧驅動裝置 33‧‧‧ drive

34‧‧‧第一檢測攝影機 34‧‧‧First inspection camera

35‧‧‧第二檢測攝影機 35‧‧‧Second detection camera

36‧‧‧第三檢測攝影機 36‧‧‧ Third detection camera

39‧‧‧位置校準台 39‧‧‧Location Calibration Table

40‧‧‧切斷部 40‧‧‧cutting department

41‧‧‧第一切斷裝置 41‧‧‧First cutting device

41a‧‧‧攝影機 41a‧‧‧ camera

42‧‧‧第二切斷裝置 42‧‧‧Second cutting device

42a‧‧‧攝影機 42a‧‧‧ camera

43‧‧‧雷射輸出裝置 43‧‧‧Laser output device

60‧‧‧貼合頭 60‧‧‧Fitting head

60a‧‧‧保持面 60a‧‧‧ Keep face

61‧‧‧導桿 61‧‧‧Guide bars

62‧‧‧貼合滾筒 62‧‧‧Finishing roller

63‧‧‧驅動裝置 63‧‧‧ drive

CL‧‧‧橫切線 CL‧‧‧ transverse line

CP‧‧‧檢查點 CP‧‧‧ checkpoint

EL‧‧‧邊緣線 EL‧‧‧ edge line

F‧‧‧搬送方向 F‧‧‧Transfer direction

F1‧‧‧第一光學組件層 F1‧‧‧First optical component layer

F2‧‧‧第二光學組件層 F2‧‧‧Second optical component layer

F3‧‧‧第三光學組件層 F3‧‧‧ third optical component layer

F5‧‧‧貼合層片 F5‧‧‧Fitting layer

F6‧‧‧偏光鏡 F6‧‧‧ polarizer

F7‧‧‧第一薄膜 F7‧‧‧ first film

F8‧‧‧第二薄膜 F8‧‧‧second film

F11‧‧‧第一光學組件 F11‧‧‧First optical component

F12‧‧‧第二光學組件 F12‧‧‧Second optical component

F13‧‧‧第三光學組件 F13‧‧‧ Third optical component

F1m‧‧‧第一層片 F1m‧‧‧ first layer

F2m‧‧‧第二層片 F2m‧‧‧Second layer

F3m‧‧‧第三層片 F3m‧‧‧ third layer film

F1a‧‧‧光學組件本體 F1a‧‧‧Optical component body

F2a‧‧‧黏著層 F2a‧‧‧Adhesive layer

F3a‧‧‧分離層片 F3a‧‧‧Separation layer

F4a‧‧‧表面保護薄膜 F4a‧‧‧Surface protection film

F1X‧‧‧光學組件 F1X‧‧‧ optical components

FXm‧‧‧層片 FXm‧‧‧ layer

FX‧‧‧光學組件層 FX‧‧‧ optical component layer

G‧‧‧邊框部 G‧‧‧Border Department

P‧‧‧液晶面板 P‧‧‧ LCD panel

P1‧‧‧第一基板 P1‧‧‧ first substrate

P2‧‧‧第二基板 P2‧‧‧second substrate

P3‧‧‧液晶層 P3‧‧‧ liquid crystal layer

P4‧‧‧顯示區域 P4‧‧‧ display area

PA1‧‧‧第一光學組件貼合體 PA1‧‧‧First optical component fit

PA2‧‧‧第二光學組件貼合體 PA2‧‧‧Second optical component fit

PA3‧‧‧第三光學組件貼合體 PA3‧‧‧The third optical component fit

PA4‧‧‧第四光學組件貼合體 PA4‧‧‧Four optical component bonding body

R1‧‧‧料捲滾筒 R1‧‧‧ Roller

R2‧‧‧分離滾筒 R2‧‧‧Separation roller

WCL‧‧‧切斷線 WCL‧‧‧ cut line

θmax‧‧‧最大偏移角 θ max ‧‧‧maximum offset angle

θmin‧‧‧最小偏移角 θ min ‧‧‧minimum offset angle

θmid‧‧‧平均偏移角 θ mid ‧‧‧average offset angle

第1圖係本發明之第一實施態樣中薄膜貼合系統的示意側視圖。 Figure 1 is a schematic side view of a film bonding system in a first embodiment of the present invention.

第2圖係作為光學顯示部件之組成例的液晶面板之平面圖。 Fig. 2 is a plan view showing a liquid crystal panel as a configuration example of an optical display member.

第3圖係第2圖之A-A線的剖面圖。 Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2.

第4圖係光學組件層的剖面圖。 Figure 4 is a cross-sectional view of the optical component layer.

第5圖係薄膜貼合系統之貼合裝置的示意側視圖。 Fig. 5 is a schematic side view of a laminating device of a film bonding system.

第6A圖係顯示相對液晶面板決定層片貼合位置之方法的一範例圖。 Fig. 6A is a view showing an example of a method of determining a bonding position of a layer with respect to a liquid crystal panel.

第6B圖係顯示相對液晶面板決定層片貼合位置之方法的一範例圖。 Fig. 6B is a view showing an example of a method of determining a bonding position of a layer with respect to a liquid crystal panel.

第7圖係顯示以第一切斷裝置進行層片之切斷步驟的側視圖。 Fig. 7 is a side view showing the step of cutting the layer by the first cutting device.

第8圖係顯示以第二切斷裝置進行層片之切斷步驟的側視圖。 Fig. 8 is a side view showing the step of cutting the layer by the second cutting device.

第9A圖係適用於本發明第二實施態樣之薄膜貼合系統的貼合裝置之示意圖。 Fig. 9A is a schematic view of a laminating apparatus applied to a film laminating system according to a second embodiment of the present invention.

第9B圖係適用於本發明第二實施態樣之薄膜貼合系統的貼合裝置之示意圖。 Fig. 9B is a schematic view of a laminating apparatus applicable to the film lamination system of the second embodiment of the present invention.

第10圖係顯示層片剩餘部分之切斷方法的平面圖。 Fig. 10 is a plan view showing a cutting method of the remaining portion of the layer.

以下,參考圖面說明本發明之第一實施態樣。本發明之第一實施態樣中,係說明作為光學顯示設備之生產系統,構成其一部分的薄膜貼合系統。 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. In the first embodiment of the present invention, a film bonding system which is a part of a production system of an optical display device will be described.

(第一實施態樣) (first embodiment)

第1圖係本發明之第一實施態樣中薄膜貼合系統1的示意側視圖。薄膜貼合系統1係以例如將偏光薄膜或相位差薄膜、輝度增加薄膜等薄膜狀光學組件貼合至液晶面板或有機電致發光(OEL,Organic Electro-Luminescence)面板等面板狀光學顯示部件的系統,構成生產包含該光學顯示部件及光學組件之光學顯示設備的生產系統之一部分。薄膜貼合系統1中,使用液晶面板P作為該光學顯示部件。第1圖中,為了圖示方便起見,將薄膜貼合系統1分為上下二層來繪製。 Fig. 1 is a schematic side view of a film bonding system 1 in a first embodiment of the present invention. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel. The system forms part of a production system for producing an optical display device comprising the optical display component and the optical component. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. In the first drawing, for convenience of illustration, the film bonding system 1 is divided into upper and lower layers to draw.

第2圖從該液晶層P3厚度方向所見之液晶面板P的平面圖。液晶面板P具備有:第一基板P1,平面視圖呈長方形;第二基板P2,係對向第一基板P1來配置的較小長方形;以及液晶層P3,係封入第一基板P1與第二基板P2之間。液晶面板P於俯視(平面視圖)時,具有沿第一基板P1外形的長方形狀,於液晶層P3外周緣之內側的區域為顯示區域P4。 Fig. 2 is a plan view of the liquid crystal panel P as seen from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1 and the second substrate. Between P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view (plan view), and a region inside the outer periphery of the liquid crystal layer P3 is the display region P4.

第3圖係第2圖之A-A線的剖面圖。於液晶面板P之正面(第一面)與反面(第二面),適當地貼合有從長條形之第一光學組件層F1、第二光學組件層F2及第三光學組件層F3(參考第1圖,以下總稱為光學組件層FX)切割出的第一光學組件F11、第二光學組件F12及第三光學組件F13(以下,總稱為光學組件F1X)。本實施態樣中,液晶面板P之面向背光側及面向顯示面側的雙面係各自貼合有作為偏光薄膜的第一光學組件F11及第三光學組件F13,面向液晶面板P的背光側之一面進一步貼合有重疊於第一光學組件F11之作為輝度增加薄膜的第二光學組件F12。 Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2. On the front surface (first surface) and the reverse surface (second surface) of the liquid crystal panel P, a first optical component layer F1, a second optical component layer F2, and a third optical component layer F3 are formed as follows. Referring to Fig. 1, hereinafter, collectively referred to as optical component layer FX), first optical component F11, second optical component F12, and third optical component F13 (hereinafter collectively referred to as optical component F1X). In the present embodiment, the first optical component F11 and the third optical component F13 as polarizing films are bonded to the double-sided side of the liquid crystal panel P facing the backlight side and the display surface side, and the backlight side of the liquid crystal panel P is faced. A second optical component F12 as a luminance increasing film which is overlapped with the first optical component F11 is further attached to one side.

另外,第一光學組件F11、第二光學組件F12及第三光學組件 F13係從後述之第一層片F1m、第二層片F2m及第三層片F3m(以下,總稱為層片FXm)藉由將層片FXm之顯示區域外側的剩餘部分切斷所形成。 In addition, the first optical component F11, the second optical component F12, and the third optical component The F13 is formed by cutting the remaining portion outside the display region of the layer FXm from the first layer sheet F1m, the second layer sheet F2m, and the third layer sheet F3m (hereinafter collectively referred to as the layer sheet FXm) which will be described later.

第4圖係貼合至液晶面板P之光學組件層FX的部分剖面圖。光學組件層FX係具有:薄膜狀的光學組件本體F1a;設置於光學組件本體F1a之一側之面(第4圖的上側面、第一面)的黏著層F2a;隔著黏著層F2a而能分離地層積於光學組件本體F1a之一側之面的分離層片F3a;以及層積於光學組件本體F1a之另一側之面(第4圖的下側面、第二面)的表面保護薄膜F4a。光學組件本體F1a具有偏光板之功能,橫跨貼合於液晶面板P之顯示區域P4全區與顯示區域之周邊區域。另外,為了圖示方便起見,省略第4圖中各層之剖面線。 Fig. 4 is a partial cross-sectional view of the optical component layer FX attached to the liquid crystal panel P. The optical component layer FX has a film-shaped optical module body F1a, an adhesive layer F2a provided on one surface side (the upper side and the first surface of FIG. 4) of the optical module body F1a, and an adhesive layer F2a interposed therebetween. a separation layer F3a that is layered on the side of one side of the optical module body F1a; and a surface protection film F4a that is laminated on the other side of the optical module body F1a (the lower side and the second side of FIG. 4) . The optical module body F1a has a function of a polarizing plate, and is disposed across a peripheral region of the display region P4 of the liquid crystal panel P and the display region. In addition, for convenience of illustration, the hatching of each layer in Fig. 4 is omitted.

光學組件本體F1a係於其一側之面殘留有黏著層F2a且與分離層片F3a分離之狀態下,隔著黏著層F2a而貼合至液晶面板P。以下,將從光學組件層FX去除分離層片F3a後的部分稱作貼合層片F5。 The optical module main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state in which the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer sheet F5.

從黏著層F2a處分離前之期間,分離層片F3a係可保護黏著層F2a及光學組件本體F1a。表面保護薄膜F4a係與光學組件本體F1a一同貼合至液晶面板P。表面保護薄膜F4a係相對光學組件本體F1a而配置於液晶面板P之反對側,以保護光學組件本體F1a。表面保護薄膜F4a會在特定時點從光學組件本體F1a處分離。另外,光學組件層FX亦可為不包含表面保護薄膜F4a之結構。又,表面保護薄膜F4a亦可為無法從光學組件本體F1a處分離之結構。 The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point. Further, the optical component layer FX may be a structure that does not include the surface protective film F4a. Further, the surface protective film F4a may be a structure that cannot be separated from the optical module body F1a.

光學組件本體F1a具有:層片狀之偏光鏡F6;於偏光鏡F6之一側之面(第一面)以接著劑等接合的第一薄膜F7;以及於偏光鏡F6之另一側之面(第二面)以接著劑等接合的第二薄膜F8。第一薄膜F7及第二薄膜F8係保護例如偏光鏡F6的保護薄膜。 The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on a surface (first surface) on one side of the polarizing mirror F6, and a surface on the other side of the polarizing mirror F6. (Second surface) The second film F8 joined by an adhesive or the like. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.

另外,光學組件本體F1a可由一層之光學層所構成的單層構造,亦可為由複數個光學層相互層積的層積構造。除了偏光鏡F6之外,該光學層亦可為相位差薄膜或輝度增加薄膜等。第一薄膜F7與第二薄膜F8中至少任一者亦可施以表面處理,以獲得包含保護液晶顯示單元最外層之硬塗層處理或防眩光處理之防眩等效果。光學組件本體F1a亦可不包含有第一薄膜F7與第二薄膜F8中至少任一者。例如省略第一薄膜F7之情況,亦可將分離層片F3a隔著黏著層F2a而貼合至光學組件本體F1a之一側之面。 Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.

以下,參考第1圖說明薄膜貼合系統1。另外,圖中箭頭F係顯示液晶面板P之搬送方向。以下說明中,液晶面板P之搬送方向上游側稱為面板搬送上游側,液晶面板P之搬送方向下游側則稱為面板搬送下游側。 Hereinafter, the film bonding system 1 will be described with reference to Fig. 1 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, the upstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport upstream side, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport downstream side.

薄膜貼合系統1具備:第一轉台式機床11;朝第一轉台式機床11之第一轉台起始位置11a搬送液晶面板P的搬送裝置12;設置於第一轉台式機床11周圍的第一貼合裝置13、第二貼合裝置15以及薄膜剝離裝置14;設置於第一轉台式機床11之面板搬送下游側附近位置的第二轉台式機床16;從第一轉台式機床11之第一轉台終點位置11b朝第二轉台式機床16之第二轉台起始位置16a搬送且進行液晶面板P之正/反面反轉的搬送裝置17;以及設置於第二轉台式機床16周圍的第三貼合裝置18。 The film bonding system 1 includes: a first rotary machine tool 11; a conveying device 12 that conveys the liquid crystal panel P toward the first turret starting position 11a of the first rotary machine tool 11; and a first one disposed around the first rotary machine tool 11 The bonding device 13, the second bonding device 15, and the film peeling device 14; the second rotary machine tool 16 disposed at a position near the downstream side of the panel transfer of the first rotary machine tool 11; the first from the first rotary machine tool 11 a transfer device 17 that transports the turntable end position 11b toward the second turntable start position 16a of the second rotary machine tool 16 and performs reverse/reverse rotation of the liquid crystal panel P; and a third sticker disposed around the second rotary machine tool 16 Unit 18 is incorporated.

又,薄膜貼合系統1係具備:設置於第二轉台式機床16之面板搬送下游側附近位置的輸送帶27;從第二轉台式機床16之第二轉台終點位置16b朝輸送帶27之起始位置27a搬送液晶面板P的搬送裝置21;設置於輸送帶27之搬送路線上的第一切斷裝置41;設置於輸送帶27之搬送下游附近位置的輸送帶28;從輸送帶27之終點位置27c朝輸送帶28之起始位置28a搬送液晶 面板P的搬送裝置22;以及設置於輸送帶28之搬送路線上的第二切斷裝置42。 Further, the film bonding system 1 includes a conveyance belt 27 provided at a position near the downstream side of the panel conveyance of the second rotary machine tool 16, and from the second turntable end position 16b of the second rotary machine tool 16 toward the conveyance belt 27 The transfer device 21 that transports the liquid crystal panel P at the start position 27a, the first cutting device 41 that is disposed on the transport path of the transport belt 27, the transport belt 28 that is disposed at a position near the downstream of the transport belt 27, and the end of the transport belt 27 Position 27c conveys liquid crystal toward the starting position 28a of the conveyor belt 28. The conveying device 22 of the panel P; and the second cutting device 42 provided on the conveying path of the conveyor belt 28.

第一貼合裝置13、第二貼合裝置15及第三貼合裝置18係構成將較液晶面板P之顯示區域P4更大的光學組件層FX之層片FXm各自貼合至液晶面板P之正/反面的貼合機構。又,第一切斷裝置41及第二切斷裝置42係構成,從各自貼合至液晶面板P之正/反面的層片FXm,將配置於顯示區域P4對向部分外側的剩餘部分切斷,以於液晶面板P之正/反面各自形成對應於顯示區域P4大小之光學組件F1X的切斷機構。 The first bonding device 13 , the second bonding device 15 , and the third bonding device 18 each constitute a layer FXm of the optical component layer FX that is larger than the display region P4 of the liquid crystal panel P, and is bonded to the liquid crystal panel P. Positive/negative bonding mechanism. In addition, the first cutting device 41 and the second cutting device 42 are configured to cut off the remaining portion disposed on the outer side of the facing portion of the display region P4 from the layer FXm that is bonded to the front/rear surface of the liquid crystal panel P. The cutting mechanism of the optical unit F1X corresponding to the size of the display area P4 is formed in each of the front/rear surfaces of the liquid crystal panel P.

薄膜貼合系統1係使用由各轉台式機床(第一轉台式機床11與第二轉台式機床16)及輸送帶27,28所形成之生產線搬送液晶面板P,且對液晶面板P依序施以特定處理。液晶面板P係以其正/反面呈水平狀態下於生產線上進行搬送,相對於正/反面,將從條狀的光學組件層FX切割出特定長度的貼合層片F5之層片(相當於光學組件F1X)進行貼合。薄膜貼合系統1之各部位係透過作為電子控制裝置的控制裝置25進行整體控制。 The film bonding system 1 transports the liquid crystal panel P using a production line formed by each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16) and the conveyor belts 27, 28, and applies the liquid crystal panel P sequentially. Treated with specificity. The liquid crystal panel P is conveyed on the production line with the front/reverse surface in a horizontal state, and the layer of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical component layer FX with respect to the front/reverse surface (equivalent to The optical component F1X) is bonded. Each part of the film bonding system 1 is integrally controlled by a control device 25 as an electronic control unit.

搬送裝置12可保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。搬送裝置12係例如將藉由吸附作用所保持之液晶面板P朝第一轉台式機床11之第一轉台起始位置11a直接以水平狀態進行搬送,於第一轉台起始位置11a處解除該吸附作用,將液晶面板P傳遞給第一轉台式機床11。 The transport device 12 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The transport device 12 transports the liquid crystal panel P held by the adsorption to the first turntable start position 11a of the first rotary machine tool 11 in a horizontal state, for example, and releases the adsorption at the first turntable start position 11a. Acting, the liquid crystal panel P is transmitted to the first rotary machine tool 11.

第一轉台式機床11係具有沿垂直方向之迴轉軸的圓盤狀迴轉台,將搬送裝置12之搬入位置作為第一轉台起始位置11a,並朝順時針方向進行迴轉驅動。第一轉台式機床11具有第一貼合位置11c,位於從第一轉台起始位置11a朝順時針方向僅迴轉特定角度的位置。於該第一貼合位置11c處,以第一貼合裝置13將第一層片F1m貼合至面向液晶面板的背光側之面。第一層片 F1m係較液晶面板P之顯示區域更大尺寸的第一光學組件層F1之層片。藉由第一貼合裝置13將第一層片F1m貼合至液晶面板P之正/反面中任一側之面,以形成第一光學組件貼合體PA1。 The first rotary machine tool 11 has a disk-shaped turntable having a rotation axis in the vertical direction, and the conveyance position of the conveyance device 12 is the first turntable start position 11a, and is rotationally driven in the clockwise direction. The first rotary machine tool 11 has a first bonding position 11c at a position that is rotated by a specific angle from the first turntable start position 11a in the clockwise direction. At the first bonding position 11c, the first layer sheet F1m is bonded to the surface facing the backlight side of the liquid crystal panel by the first bonding device 13. First layer F1m is a layer of the first optical component layer F1 that is larger than the display area of the liquid crystal panel P. The first layer sheet F1m is bonded to the surface on either side of the front/rear surface of the liquid crystal panel P by the first bonding apparatus 13 to form the first optical component bonding body PA1.

第一轉台式機床11具有薄膜剝離位置11e,位於從第一貼合位置11c朝順時針方向僅迴轉特定角度的位置。於該薄膜剝離位置11e處,以薄膜剝離裝置14進行第一層片F1m之表面保護薄膜F4a的剝離。 The first rotary machine tool 11 has a film peeling position 11e at a position that is rotated by a specific angle from the first bonding position 11c in the clockwise direction. At the film peeling position 11e, peeling of the surface protective film F4a of the first layer sheet F1m is performed by the film peeling device 14.

第一轉台式機床11具有第二貼合位置11d,位於從薄膜剝離位置11e順時針方向僅迴轉特定角度的位置。於第二貼合位置11d處,以第二貼合裝置15貼合背光側之第二層片F2m。第二層片F2m係較液晶面板P之顯示區域更大尺寸的第二光學組件層F2之層片。藉由第二貼合裝置15將第二層片F2m貼合至第一光學組件貼合體PA1之第一層片F1m側之面,以形成第二光學組件貼合體PA2。 The first rotary table machine 11 has a second bonding position 11d at a position that is rotated by a specific angle in the clockwise direction from the film peeling position 11e. At the second bonding position 11d, the second layer F2m on the backlight side is bonded to the second bonding device 15. The second layer F2m is a layer of the second optical component layer F2 that is larger in size than the display area of the liquid crystal panel P. The second layer sheet F2m is bonded to the surface of the first layer F1m side of the first optical component bonding body PA1 by the second bonding device 15 to form the second optical component bonding body PA2.

第一轉台式機床11具有第一轉台終點位置11b,位於從第二貼合位置11d順時針方向僅迴轉特定角度的位置。於該第一轉台終點位置11b處,藉由搬送裝置17將第二光學組件貼合體PA2搬出。 The first rotary table machine 11 has a first turntable end position 11b located at a position that is rotated by a specific angle in the clockwise direction from the second bonding position 11d. At the first turntable end position 11b, the second optical component bonding body PA2 is carried out by the transport device 17.

搬送裝置17係可保持液晶面板P(第二光學組件貼合體PA2)而自由地朝垂直方向及水平方向進行搬送。搬送裝置17係例如將藉由吸附作用所保持之液晶面板P朝第二轉台式機床16之第二轉台起始位置16a進行搬送,且於該搬送時進行液晶面板P之正/反面反轉,於第二轉台起始位置16a處解除該吸附作用,將液晶面板P傳遞給第二轉台式機床16。 The transport device 17 can hold the liquid crystal panel P (the second optical component bonding body PA2) and can be freely transported in the vertical direction and the horizontal direction. The transport device 17 transports the liquid crystal panel P held by the adsorption to the second turntable start position 16a of the second rotary machine tool 16, for example, and reverses the front/back surface of the liquid crystal panel P during the transfer. The adsorption is released at the second turntable start position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.

第二轉台式機床16係具有沿垂直方向之迴轉軸的圓盤狀迴轉台,將搬送裝置17之搬入位置作為第二轉台起始位置16a,並朝順時針方向進 行迴轉驅動。第二轉台式機床16具有第三貼合位置16c,位於從第二轉台起始位置16a朝順時針方向僅迴轉特定角度的位置。於該第三貼合位置16c處,將第三層片F3m貼合至面向顯示面之面。第三層片F3m係較液晶面板P之顯示區域更大尺寸的第三光學組件層F3之層片。藉由第三貼合裝置18將第三層片F3m貼合至液晶面板P之正/反面中另一面(第二光學組件貼合體PA2之第一層片F1m及第二層片F2m所貼合之面的反對側之面),以形成第三光學組件貼合體PA3。 The second rotary machine tool 16 is a disk-shaped turntable having a rotary axis in the vertical direction, and the loading position of the conveying device 17 is taken as the second turntable start position 16a, and is clockwise Line rotary drive. The second rotary machine tool 16 has a third bonding position 16c located at a position that is rotated by a specific angle from the second turntable start position 16a in the clockwise direction. At the third bonding position 16c, the third layer sheet F3m is attached to the surface facing the display surface. The third layer sheet F3m is a layer of the third optical component layer F3 having a larger size than the display area of the liquid crystal panel P. The third layer sheet F3m is bonded to the other side of the front/rear surface of the liquid crystal panel P by the third bonding apparatus 18 (the first layer sheet F1m and the second layer sheet F2m of the second optical component bonding body PA2 are bonded together) The opposite side of the face) to form the third optical component bonding body PA3.

第二轉台式機床16具有第二轉台終點位置16b,位於從第三貼合位置16c順時針方向僅迴轉特定角度的位置。於該第二轉台終點位置16b處,以搬送裝置21將第三光學組件貼合體PA3搬出。 The second rotary table machine 16 has a second turntable end position 16b located at a position that is only rotated by a specific angle in the clockwise direction from the third bonding position 16c. At the second turntable end position 16b, the third optical component bonding body PA3 is carried out by the transport device 21.

搬送裝置21係可保持液晶面板P(第三光學組件貼合體PA3)而自由地朝垂直方向及水平方向進行搬送。搬送裝置21係例如將藉由吸附作用所保持之液晶面板P朝輸送帶27之起始位置27a進行搬送,於起始位置27a處解除該吸附作用,將液晶面板P傳遞給輸送帶27。 The transport device 21 can hold the liquid crystal panel P (the third optical component bonding body PA3) and can be freely transported in the vertical direction and the horizontal direction. The transport device 21 transports the liquid crystal panel P held by the adsorption to the starting position 27a of the transport belt 27, for example, and releases the suction at the start position 27a to transfer the liquid crystal panel P to the transport belt 27.

輸送帶27之起始位置27a以後的搬送路線上設置有第一切斷位置27b。於該第一切斷位置27b處,以第一切斷裝置41將第三層片F3m切斷。第一切斷裝置41係從貼合至液晶面板P之第三層片F3m,將配置於液晶面板P之顯示區域對向部分外側的剩餘部分(第一剩餘部分)切斷,以形成對應於液晶面板P之顯示區域大小的光學組件(第三光學組件F13)。 The first cutting position 27b is provided on the conveyance path after the start position 27a of the conveyor belt 27. At the first cutting position 27b, the third layer sheet F3m is cut by the first cutting device 41. The first cutting device 41 cuts off the remaining portion (first remaining portion) disposed on the outer side of the facing portion of the display region of the liquid crystal panel P from the third layer sheet F3m bonded to the liquid crystal panel P to form a corresponding portion An optical component (third optical component F13) of a display area size of the liquid crystal panel P.

藉由第一切斷裝置41從第三光學組件貼合體PA3將第三層片F3m之剩餘部分切斷,於液晶面板P之正/反面中另一面貼合有第三光學組件F13,且於液晶面板P之正/反面中一側之面貼合有第一層片F1m及第二層片F2m,而形成第四光學組件貼合體PA4。從第三層片F3m所切斷之剩餘部分係 透過圖式中省略之剝離裝置,從液晶面板P進行剝離回收。 The remaining portion of the third layer sheet F3m is cut from the third optical component bonding body PA3 by the first cutting device 41, and the third optical component F13 is bonded to the other side of the front/rear surface of the liquid crystal panel P, and The first layer F1m and the second layer F2m are bonded to one side of the front/rear surface of the liquid crystal panel P to form a fourth optical component bonding body PA4. The remaining part cut from the third layer F3m The liquid crystal panel P is peeled and recovered by a peeling device omitted from the drawing.

搬送裝置22係可保持液晶面板P(第四光學組件貼合體PA4)而自由地朝垂直方向及水平方向進行搬送。搬送裝置22係例如將藉由吸附作用所保持之液晶面板P朝輸送帶28之起始位置28a進行搬送,於起始位置28a處解除該吸附作用,將液晶面板P傳遞給輸送帶28。 The transport device 22 can hold the liquid crystal panel P (the fourth optical component bonding body PA4) and can be freely transported in the vertical direction and the horizontal direction. The transport device 22 transports the liquid crystal panel P held by the adsorption to the starting position 28a of the transport belt 28, for example, and releases the suction at the start position 28a to transfer the liquid crystal panel P to the transport belt 28.

輸送帶28之起始位置28a以後的搬送路線上設置有第二切斷位置28b。於該第二切斷位置28b處,以第二切斷裝置42將第一層片F1m及第二層片F2m切斷。第二切斷裝置42係從各自貼合至液晶面板P之第一層片F1m及第二層片F2m,將配置於液晶面板P之顯示區域對向部分外側的剩餘部分(第二剩餘部分)一併切斷,使得由第一光學組件層F1組成之第一光學組件F11及由第二光學組件層F2組成之第二光學組件F12,形成作為對應於液晶面板P之顯示區域大小的光學組件。 A second cutting position 28b is provided on the conveyance path after the starting position 28a of the conveyor belt 28. At the second cutting position 28b, the first layer sheet F1m and the second layer sheet F2m are cut by the second cutting device 42. The second cutting device 42 is attached to the first layer F1m and the second layer F2m of the liquid crystal panel P, and the remaining portion (second remaining portion) disposed on the outer side of the facing portion of the display region of the liquid crystal panel P The first optical component F11 composed of the first optical component layer F1 and the second optical component F12 composed of the second optical component layer F2 are formed as optical components corresponding to the size of the display area of the liquid crystal panel P. .

將第一層片F1m與第二層片F2m貼合至液晶面板P後一併切斷,使得第一光學組件F11與第二光學組件F12之位置無偏差,藉以獲得與顯示區域P4之外周緣形狀相符的第一光學組件F11及第二光學組件F12。又,亦簡化了第一層片F1m與第二層片F2m之切斷步驟。 After the first layer F1m and the second layer F2m are attached to the liquid crystal panel P, the first optical component F11 and the second optical component F12 are not separated, so as to obtain a peripheral edge of the display region P4. The shape corresponds to the first optical component F11 and the second optical component F12. Moreover, the cutting step of the first layer F1m and the second layer F2m is also simplified.

藉由第二切斷裝置42從第四光學組件貼合體PA4將第一層片F1m及第二層片F2m之剩餘部分切斷,於液晶面板P之正/反面中一側之面貼合有第一光學組件F11及第二光學組件F12,且於液晶面板P之正/反面中另一面貼合有第三光學組件F13,而形成第五光學組件貼合體。從第一層片FX1及第二層片F2m所切斷之剩餘部分係透過圖式中省略之剝離裝置,從液晶面板P進行剝離回收。 The remaining portion of the first layer F1m and the second layer F2m is cut from the fourth optical component bonding body PA4 by the second cutting device 42, and the surface of the front/rear surface of the liquid crystal panel P is bonded to the surface The first optical component F11 and the second optical component F12 are bonded to the other side of the front/back surface of the liquid crystal panel P to form a fifth optical component bonding body. The remaining portion cut from the first layer sheet FX1 and the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

此處,第一切斷裝置41及第二切斷裝置42例如為二氧化碳(CO2)雷射切割機。第一切斷裝置41及第二切斷裝置42係沿顯示區域P4之外周緣不間斷地切斷貼合至液晶面板P之層片FXm。第一切斷裝置41與第二切斷裝置42係連接至同一雷射輸出裝置43。藉由第一切斷裝置41、第二切斷裝置42及雷射輸出裝置43而構成切斷機構40,以從層片FXm將配置於顯示區域P4之對向部分外側的剩餘部分切斷,形成對應於顯示區域P4大小的光學組件FX。由於各層片(第一層片F1m、第二層片F2m及第三層片F3m)之切斷所需雷射輸出並不大,本實施態樣中,將雷射輸出裝置43所輸出之高輸出雷射光線分歧為二,供給至第一切斷裝置41與第二切斷裝置42。 Here, the first cutting device 41 and the second cutting device 42 are, for example, carbon dioxide (CO 2 ) laser cutting machines. The first cutting device 41 and the second cutting device 42 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the outer periphery of the display region P4. The first cutting device 41 and the second cutting device 42 are connected to the same laser output device 43. The cutting mechanism 40 is configured by the first cutting device 41, the second cutting device 42, and the laser output device 43, and the remaining portion disposed outside the opposing portion of the display region P4 is cut off from the layer FXm. An optical component FX corresponding to the size of the display area P4 is formed. Since the laser output required for cutting each of the layers (the first layer F1m, the second layer F2m, and the third layer F3m) is not large, in the present embodiment, the output of the laser output device 43 is high. The output laser light is divided into two and supplied to the first cutting device 41 and the second cutting device 42.

第二切斷位置28b以後的液晶面板P(第五光學組件貼合體)之搬送路線上設置有圖式中省略之貼合檢查位置,於該貼合檢查位置處,以圖式中省略之檢查裝置對貼合有薄膜之加工件(液晶面板P)進行檢查(光學組件F1X之位置是否適當(位置偏差是否在公差範圍內)等檢查)。相對液晶面板P之光學組件F1X的位置被判斷為不正確的加工件,便透過圖中未顯示之排除部而送出系統外。 The bonding inspection position omitted in the drawing is provided on the conveyance path of the liquid crystal panel P (the fifth optical component bonding body) after the second cutting position 28b, and the inspection is omitted in the drawing at the bonding inspection position. The device inspects the workpiece (liquid crystal panel P) to which the film is attached (check whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

經由以上完成薄膜貼合系統1之貼合步驟。 The bonding step of the film bonding system 1 is completed via the above.

以下,參考第5圖詳細說明第一貼合裝置13。另外,第二貼合裝置15及第三貼合裝置18亦具有相同結構而省略其詳細說明。 Hereinafter, the first bonding apparatus 13 will be described in detail with reference to FIG. In addition, the second bonding apparatus 15 and the third bonding apparatus 18 have the same configuration, and detailed description thereof will be omitted.

第一貼合裝置13係針對搬送至第一貼合位置11c的液晶面板P之上側面,將第一光學組件層F1中切斷成特定尺寸的貼合層片F5之層片(第一層片F1m)進行貼合。 The first bonding apparatus 13 is a layer (the first layer) of the bonding layer sheet F5 cut into a specific size in the first optical component layer F1 with respect to the upper surface of the liquid crystal panel P conveyed to the first bonding position 11c. Sheet F1m) is attached.

第一貼合裝置13係具有:層片搬送裝置31,係從捲取有第一光 學組件層F1之料捲滾筒R1將該第一光學組件層F1捲出,且沿其長邊方向搬送該第一光學組件層F1;以及貼合頭32,使層片搬送裝置31保持從第一光學組件層F1切割出的貼合層片F5之層片(第一層片F1m),並將該層片貼合至搬送到第一貼合位置11c的液晶面板P之上側面。 The first bonding apparatus 13 has a layer sheet conveying device 31 that takes the first light from the coil The roll drum R1 of the component layer F1 winds up the first optical component layer F1, and conveys the first optical component layer F1 along the longitudinal direction thereof; and the bonding head 32 to keep the layer conveying device 31 from the first A layer (first layer sheet F1m) of the bonding layer sheet F5 cut by the optical component layer F1 is bonded to the upper surface of the liquid crystal panel P conveyed to the first bonding position 11c.

層片搬送裝置31係以分離層片F3a作為載件來搬送貼合層片F5,其具有:捲出部31a,係保持捲取有條狀第一光學組件層F1之料捲滾筒R1,且沿其長邊方向將第一光學組件層F1捲出;切斷部31b,對從料捲滾筒R1捲出之第一光學組件層F1施以半切斷;刀刃31c(剝離部),將施以半切斷後之第一光學組件層F1於銳角處捲繞,以使貼合層片F5從分離層片F3a處分離;以及捲取部31d,保持捲取通過刀刃31c後獨自存在之分離層片F3a的分離滾筒R2。 The layer sheet conveying device 31 conveys the bonding layer sheet F5 by using the separation layer sheet F3a as a carrier, and has a winding portion 31a for holding the roll drum R1 in which the strip-shaped first optical unit layer F1 is wound, and The first optical component layer F1 is wound up along the longitudinal direction thereof; the cutting portion 31b applies a half cut to the first optical component layer F1 taken up from the roll drum R1; the blade 31c (peeling portion) is applied The first optical component layer F1 after the half cut is wound at an acute angle to separate the bonding layer sheet F5 from the separation layer sheet F3a; and the winding portion 31d is kept separated by the separation layer sheet F3a which is separately wound after passing through the blade edge 31c. Separation roller R2.

另外,雖然圖式中省略,但層片搬送裝置31具有沿特定搬送路線捲繞第一光學組件層F1的複數個導引滾筒。第一光學組件層F1在與其搬送方向垂直之水平方向(層片寬度方向)上,具有寬度較液晶面板P之顯示區域P4(顯示區域P4之長邊與短邊中任一邊的長度,相當於本實施態樣中顯示區域P4之長邊長度)更寬的寬度。 Further, although omitted from the drawings, the layer sheet conveying device 31 has a plurality of guide rollers that wind the first optical module layer F1 along a specific conveyance path. The first optical component layer F1 has a width in a horizontal direction (ply width direction) perpendicular to the conveyance direction, and has a width corresponding to the display region P4 of the liquid crystal panel P (the length of either the long side and the short side of the display region P4 is equivalent to In the present embodiment, the length of the long side of the region P4 is displayed to be wider.

位於層片搬送裝置31起點之捲出部31a與位於層片搬送裝置31終點之捲取部31d係例如為相互同步驅動。藉此,捲出部31a係朝其搬送方向捲出第一光學組件層F1,且捲取部31d則捲取通過刀刃31c後的分離層片F3a。以下,於層片搬送裝置31中,第一光學組件層F1(分離層片F3a)之搬送方向上游側稱作層片搬送上游側,搬送方向下游側稱作層片搬送下游側。 The winding portion 31a located at the beginning of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are, for example, driven in synchronization with each other. Thereby, the unwinding portion 31a winds up the first optical component layer F1 in the conveyance direction, and the winding portion 31d winds up the separation layer sheet F3a that has passed through the blade 31c. In the layer conveyance device 31, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.

每當切斷部31b在與該層片寬度方向垂直之長度方向上將第一光學組件層F1捲出達顯示區域P4之長度(顯示區域P4之長邊與短邊任一邊的 長度,相當於本實施態樣中顯示區域P4之短邊長度)更長之長度時,沿該層片寬度方向橫跨整體寬度切斷第一光學組件層F1厚度方向之一部分(施以半切斷)。藉此,從第一光學組件層F1切割出較液晶面板P之顯示區域P4更大的貼合層片F5之層片(第一層片F1m)。 The first optical component layer F1 is wound up to the length of the display region P4 in the longitudinal direction perpendicular to the width direction of the layer (the long side and the short side of the display area P4) When the length is equal to the length of the short side of the display region P4 in the present embodiment, a part of the thickness direction of the first optical component layer F1 is cut across the entire width in the width direction of the layer (half cut) ). Thereby, the layer (first layer sheet F1m) of the bonding layer sheet F5 which is larger than the display region P4 of the liquid crystal panel P is cut out from the first optical component layer F1.

切斷部31b係透過第一光學組件層F1搬送中的張力,在不使得第一光學組件層F1(分離層片F3a)斷裂的情況下(殘留有特定厚度之分離層片F3a),調整切斷刀片的前後位置,施以該半切斷,其深至黏著層F2a與分離層片F3a交界面附近。另外,亦可使用雷射裝置代替切斷刀片。 The cutting portion 31b transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken (the separation layer F3a having a specific thickness remains). The front and rear positions of the broken blade are subjected to the half cut, which is deep to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

於半切斷後之第一光學組件層F1中,依其厚度方向切斷光學組件本體F1a及表面保護薄膜F4a,以形成橫跨第一光學組件層F1之層片寬度方向上整體寬度的橫切線。第一光學組件層F1係藉由該橫切線,在長邊方向上劃分出具有相當於顯示區域P4之短邊長度的分區。該分區係各自為貼合層片F5中的一個層片(第一層片F1m)。 In the first optical component layer F1 after the half cutting, the optical module body F1a and the surface protective film F4a are cut in the thickness direction thereof to form a transverse line across the entire width of the first optical component layer F1 in the layer width direction. The first optical component layer F1 is divided into sections having a length corresponding to the short side of the display region P4 in the longitudinal direction by the transverse line. The partitions are each one of the plies (first ply F1m) of the ply F5.

刀刃31c係讓第一光學組件層F1於銳角處捲繞過其銳角狀之前端部。第一光學組件層F1於刀刃31c之前端部呈銳角處折返時,分離層片F3a會從第一層片F1m處剝離。此時,第一層片F1m之黏著層F2a(與液晶面板P之貼合面)係朝向下方。刀刃31c之前端部正上方為分離層剝離位置31e,貼合頭32之圓弧狀的保持面32a從上方接觸到該刀刃31c之前端部,使得第一層片F1m的表面保護薄膜F4a(與貼合面的反對側之面)黏著至貼合頭32之保持面32a。 The blade 31c is such that the first optical component layer F1 is wound at its acute angle at its acute angle. When the first optical component layer F1 is folded back at an acute front end of the blade 31c, the separation layer F3a is peeled off from the first layer F1m. At this time, the adhesive layer F2a of the first layer sheet F1m (the bonding surface with the liquid crystal panel P) faces downward. Immediately above the front end portion of the blade 31c is a separation layer peeling position 31e, and the arc-shaped holding surface 32a of the bonding head 32 comes into contact with the front end portion of the blade edge 31c from above, so that the surface protective film F4a of the first layer sheet F1m (and The opposite side of the bonding surface is adhered to the holding surface 32a of the fitting head 32.

貼合頭32係與該層片寬度方向平行,且於下方具有凸形圓弧狀的保持面32a。保持面32a具有例如較貼合層片F5之貼合面(黏著層F2a)更弱的黏著力,可將第一層片F1m之表面保護薄膜F4a重複進行黏著、剝離。 The bonding head 32 is parallel to the width direction of the layer, and has a convex arc-shaped holding surface 32a below. The holding surface 32a has a weaker adhesive force than the bonding surface (adhesive layer F2a) of the bonding layer F5, for example, and the surface protective film F4a of the first layer F1m can be repeatedly adhered and peeled off.

貼合頭32係以刀刃31c上方,沿該層片寬度方向之軸作為中心,與該長度方向平行,且沿保持面32a之彎曲傾斜移動。於黏著保持第一層片F1m時,及將黏著保持好之第一層片F1m貼合至液晶面板P時,適當地進行貼合頭32之傾斜移動。 The bonding head 32 is formed above the blade 31c and has an axis along the width direction of the layer as a center, and is parallel to the longitudinal direction and is inclined to move along the curved surface of the holding surface 32a. When the first layer sheet F1m is adhered and adhered to the liquid crystal panel P, the tilting movement of the bonding head 32 is appropriately performed.

貼合頭32係使保持面32a朝向下方,且保持面32a之彎曲一端側(第5圖之右側)為下側的傾斜狀態下,從上方將保持面32a之彎曲一端側貼附至刀刃31c之前端部,而將分離層剝離位置31e的第一層片F1m之前端部黏著至保持面32a。其後,捲出第一層片F1m且使貼合頭32傾斜移動,藉以將第一層片F1m之整體黏著至保持面32a。 The bonding head 32 is such that the holding surface 32a faces downward, and the curved one end side (the right side in FIG. 5) of the holding surface 32a is in the inclined state on the lower side, and the curved one end side of the holding surface 32a is attached to the blade edge 31c from above. At the front end portion, the front end portion of the first ply F1m of the separation layer peeling position 31e is adhered to the holding surface 32a. Thereafter, the first layer sheet F1m is taken up and the bonding head 32 is tilted to move, thereby bonding the entire first layer sheet F1m to the holding surface 32a.

貼合頭32可於分離層剝離位置31e及第一貼合位置11c之上方進行特定距離的昇降動作,且可於分離層剝離位置31e與第一貼合位置11c之間適當地進行移動。貼合頭32係連結至驅動裝置,而可進行該昇降時、該移動時和該傾斜移動時之驅動。 The bonding head 32 can perform a lifting operation of a specific distance above the separation layer peeling position 31e and the first bonding position 11c, and can appropriately move between the separation layer peeling position 31e and the first bonding position 11c. The bonding head 32 is coupled to the driving device, and can be driven during the lifting, the moving, and the tilting movement.

貼合頭32在將第一層片F1m黏著至保持面32a時,係例如在將第一層片F1m之前端部黏著至保持面32a後,切斷與驅動裝置33的銜接而自由地傾斜移動,從該狀態被動地伴隨第一層片F1m之捲出而傾斜移動。當貼合頭32傾斜移動直到第一層片F1m整體黏著至保持面32a時,於該傾斜狀態下藉由例如與驅動裝置33之銜接等來鎖死該傾斜移動,並於該狀態下朝第一貼合位置11c上方移動。 When the first layer sheet F1m is adhered to the holding surface 32a, the bonding head 32 is detached from the driving device 33, for example, after the end portion of the first layer sheet F1m is adhered to the holding surface 32a. From this state, the tilting movement is passively accompanied by the unwinding of the first layer sheet F1m. When the bonding head 32 is tilted to move until the first layer F1m is entirely adhered to the holding surface 32a, the tilting movement is locked in the tilted state by, for example, engagement with the driving device 33, and in this state Moves over a fitting position 11c.

貼合頭32在將黏著保持好之第一層片F1m貼合至液晶面板P時,藉由例如驅動裝置33之作動而主動地傾斜移動,沿保持面32a之彎曲將第一層片F1m貼附至液晶面板P之上側面以確實地進行貼合。 When the first layer F1m which is adhered and adhered to the liquid crystal panel P is attached, the bonding head 32 actively moves obliquely by, for example, the driving device 33, and the first layer F1m is attached along the bending of the holding surface 32a. Attached to the upper side of the liquid crystal panel P to be surely bonded.

於刀刃31c之前端部下方處,設置有第一檢測攝影機34,檢測在刀刃31c前端部之貼合層片F5的層片搬送下游側附近的前端。第一檢測攝影機34之檢測資料係傳送至控制裝置25。控制裝置25於例如第一檢測攝影機34檢測出貼合層片F5之下游側近端的時點時,係暫時停止層片搬送裝置31,其後,降下貼合頭32以將貼合層片F5之前端部黏著至該保持面32a。 A first detecting camera 34 is provided below the end portion of the cutting edge 31c, and the leading end in the vicinity of the layer transport downstream side of the bonding layer sheet F5 at the tip end portion of the blade edge 31c is detected. The detection data of the first detection camera 34 is transmitted to the control device 25. When the first detecting camera 34 detects the near end of the downstream side of the bonding layer sheet F5, for example, the control device 25 temporarily stops the layer sheet conveying device 31, and thereafter lowers the bonding head 32 to fix the front end of the bonding layer sheet F5. The portion is adhered to the holding surface 32a.

第一檢測攝影機34檢測出貼合層片F5之下游側附近的前端並暫時停止層片搬送裝置31時,控制裝置25係藉由切斷部31b實施貼合層片F5之切斷。即,沿第一檢測攝影機34之檢出位置(第一檢測攝影機34之光軸延長位置)與沿切斷部31b之切斷位置(切斷部31b之切斷刀片之進退刀位置)間的層片搬送路線之距離係相當於貼合層片F5之層片(第一層片F1m)的長度。 When the first detecting camera 34 detects the leading end in the vicinity of the downstream side of the bonding layer sheet F5 and temporarily stops the layer sheet conveying device 31, the control device 25 performs the cutting of the bonding layer sheet F5 by the cutting portion 31b. That is, along the detection position of the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cutting position along the cutting portion 31b (the cutting edge position of the cutting blade of the cutting portion 31b) The distance of the layer transport route corresponds to the length of the layer sheet (first layer sheet F1m) to which the layer sheet F5 is bonded.

切斷部31b可沿層片搬送路線移動,藉由該移動使得沿第一檢測攝影機34之檢出位置與切斷部31b之切斷位置間的層片搬送路線之距離產生改變。切斷部31b之移動係透過控制裝置25所控制,在以例如切斷部31b進行貼合層片F5的切斷之後,捲出一個貼合層片F5之層片(第一層片F1m)的距離時,當其切斷端與特定之基準位置間有偏差的情況中,便藉由切斷部31b之移動來補正該偏差。另外,亦可藉由切斷部31b的移動來對應長度相異之貼合層片F5的切斷。 The cutting portion 31b is movable along the layer transport path, and the distance between the detection position of the first detecting camera 34 and the cutting position between the cutting positions of the cutting portion 31b is changed by the movement. The movement of the cutting portion 31b is controlled by the transmission control device 25, and after the cutting layer sheet F5 is cut by, for example, the cutting portion 31b, the layer sheet (the first layer sheet F1m) of one bonding layer sheet F5 is wound up. In the case of a distance, when there is a deviation between the cut end and the specific reference position, the deviation is corrected by the movement of the cut portion 31b. Further, the cutting of the bonding layer sheet F5 having a different length may be performed by the movement of the cutting portion 31b.

第一檢測攝影機34亦可檢測出印於貼合層片F5之缺陷標誌。該缺陷標誌在料捲滾筒R1製造時,係對於第一光學組件層F1發現缺陷部位處,從該表面保護薄膜F4a側藉由噴墨等加以標記。檢測出該缺陷標誌之貼合層片F5(包含缺陷之第一層片F1m)在黏著至貼合頭32之後,不貼合至液晶面板P,而是移動至避開第一貼合位置11c的捨棄位置(廢棄位置),重疊貼合至廢料層片 等處。另外,在檢測出缺陷標誌時,亦可設計將包含貼合層片F5之缺陷部分以最小寬度切斷而捨棄的步驟。 The first detecting camera 34 can also detect the defect mark printed on the bonding layer F5. This defect mark is marked by the ink jet or the like from the side of the surface protective film F4a when the defect roll is found in the first optical component layer F1 at the time of manufacture of the roll reel R1. The bonding layer sheet F5 (the first layer sheet F1m including the defect) on which the defect mark is detected does not adhere to the liquid crystal panel P after being adhered to the bonding head 32, but moves to avoid the first bonding position 11c. Discard position (discarded position), overlapping to the scrap layer Wait. Further, when the defect mark is detected, the step of cutting off the defective portion including the bonding layer sheet F5 with a minimum width may be designed.

另外,光學組件層FX之缺陷係例如於光學組件層FX內部處存在由固體與液體與氣體至少一者組成之異物的部分,或於光學組件層FX表面處存在凹凸或傷痕的部分,因光學組件層FX歪斜或材質偏差等導致之亮點的部分等。 In addition, the defect of the optical component layer FX is, for example, a portion where the solid matter is composed of a foreign matter composed of at least one of a liquid and a gas, or a portion where the surface of the optical component layer FX has irregularities or scratches due to the optical portion. The part of the component layer FX skew or material deviation, etc., which causes bright spots.

貼合頭32從分離層剝離位置31e朝第一貼合位置11c移動時,黏著保持於保持面32a的第一層片F1m之兩角部(例如相對該前端部的近端部之兩角部),係各自以一對第二檢測攝影機35進行拍攝。各第二檢測攝影機35之檢測資料係傳送至控制裝置25。控制裝置25係例如根據各第二檢測攝影機35之攝影資料,確認相對貼合頭32的第一層片F1m之水平方向(貼合頭32的移動方向及其垂直方向以及垂直軸中心之迴轉方向)位置。在貼合頭32及第一層片F1m之相對位置具有偏差的情況中,貼合頭32係以第一層片F1m之位置作為特定之基準位置來進行位置校準。 When the bonding head 32 moves from the separation layer peeling position 31e toward the first bonding position 11c, it is adhered and held at both corners of the first layer sheet F1m of the holding surface 32a (for example, at the corners of the proximal end portion of the front end portion) Each of the cameras is photographed by a pair of second detecting cameras 35. The detection data of each of the second detecting cameras 35 is transmitted to the control device 25. The control device 25 confirms, for example, the horizontal direction of the first layer sheet F1m with respect to the bonding head 32 based on the photographic data of each of the second detecting cameras 35 (the moving direction of the bonding head 32 and its vertical direction and the direction of rotation of the vertical axis center). )position. In the case where the relative positions of the bonding head 32 and the first layer sheet F1m are different, the bonding head 32 performs position alignment by using the position of the first layer sheet F1m as a specific reference position.

於第一轉台式機床11之第一貼合位置11c處,設置有一對第三檢測攝影機36,其係用於進行第一貼合位置11c上液晶面板P之水平方向的位置校準。於第一轉台式機床11之第二貼合位置11d處,設置有一對第四檢測攝影機(圖式中省略),其係用於進行同一第二貼合位置11d上液晶面板P之水平方向的位置校準。於第二轉台式機床16之第三貼合位置16c處,設置有一對第五檢測攝影機(圖式中省略),其係用於進行同一第三貼合位置16c上液晶面板P之水平方向的位置校準。各檢測攝影機之檢測資料係傳送至控制裝置25)。另外,亦可使用感測器代替各檢測攝影機。 At the first bonding position 11c of the first rotary machine tool 11, a pair of third detecting cameras 36 for performing positional alignment of the liquid crystal panel P in the horizontal direction at the first bonding position 11c are provided. At a second bonding position 11d of the first rotary machine tool 11, a pair of fourth detecting cameras (omitted in the drawings) for performing the horizontal direction of the liquid crystal panel P on the same second bonding position 11d are provided. Position calibration. At a third bonding position 16c of the second rotary machine tool 16, a pair of fifth detecting cameras (omitted in the drawings) for performing the horizontal direction of the liquid crystal panel P on the same third bonding position 16c are provided. Position calibration. The detection data of each detection camera is transmitted to the control device 25). In addition, a sensor can be used instead of each detection camera.

於各轉台式機床(第一轉台式機床11與第二轉台式機床16)上,設置有載置液晶面板P且可進行液晶面板P水平方向之位置校準的位置校準台39。位置校準台39係根據各檢測攝影機之檢測資料,經由控制裝置25所驅動控制。 A position alignment table 39 on which the liquid crystal panel P is placed and in which the liquid crystal panel P is horizontally aligned is provided on each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16). The position calibration table 39 is driven and controlled by the control device 25 based on the detection data of each detection camera.

藉此,可進行相對第一轉台式機床11與第二轉台式機床16(各貼合位置(第一貼合位置11c、第二貼合位置11d、第三貼合位置16c)的液晶面板P之位置校準。 Thereby, the liquid crystal panel P with respect to the first rotary machine tool 11 and the second rotary machine tool 16 (the respective bonding positions (the first bonding position 11c, the second bonding position 11d, and the third bonding position 16c) can be performed. Position calibration.

相對該液晶面板P,將經貼合頭32位置校準後的貼合層片F5(層片FXm)進行貼合,藉以抑制光學組件F1X之貼合偏差,可改善相對液晶面板P的光學組件F1X之光軸方向的精度,提高光學顯示設備之色彩度及對比。 With respect to the liquid crystal panel P, the bonding layer sheet F5 (layer sheet FXm) which has been aligned by the bonding head 32 is bonded to each other, thereby suppressing the misalignment of the optical unit F1X, and the optical component F1X of the liquid crystal panel P can be improved. The accuracy of the optical axis direction improves the color and contrast of the optical display device.

此處,構成光學組件層FX之偏光鏡薄膜係例如經二色性染料進行染色之聚乙烯醇(PVA)薄膜朝一軸延伸地形成。由於延伸時會有聚乙烯醇(PVA)薄膜厚度之不均勻或二色性染料染色不均勻等,易造成於光學組件層FX面內產生光軸方向偏差的情況。 Here, the polarizing film constituting the optical component layer FX is formed, for example, by a polyvinyl alcohol (PVA) film dyed with a dichroic dye toward one axis. There is a case where the thickness of the polyvinyl alcohol (PVA) film is uneven or the dyeing of the dichroic dye is uneven, which may cause a deviation in the optical axis direction in the surface of the optical component layer FX.

該處,本實施態樣中,係根據預先儲存於儲存裝置24(參考第1圖)的光學組件層FX各部位中光軸面內分佈之檢查資料,使控制裝置25決定相對光學組件層FX的液晶面板P之貼合位置(相對貼合位置)。接著,各貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)係配合該貼合位置,相對從光學組件層FX切割出之層片FXm進行液晶面板P之位置校準,將液晶面板P貼合至層片FXm。 In this embodiment, the control device 25 determines the relative optical component layer FX based on the inspection data distributed in the optical axis plane in each portion of the optical component layer FX stored in the storage device 24 (refer to FIG. 1). The bonding position of the liquid crystal panel P (relatively pasting position). Next, each of the bonding apparatuses (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) is fitted to the bonding position, and the liquid crystal panel is formed on the layer FXm cut out from the optical component layer FX. Position calibration of P, and the liquid crystal panel P is attached to the layer FXm.

相對液晶面板P之層片FXm的貼合位置(相對貼合位置)之決定方法係例如以下說明。 The method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P is as follows.

首先,如第6A圖所示,設定有光學組件層FX之寬度方向上的複數個檢查點CP,於各檢查點CP處檢測出光學組件層FX之光軸方向。檢測光軸的時點為料捲滾筒R1製造時;亦可為從料捲滾筒R1捲出光學組件層FX進行半切斷前之期間。光學組件層FX之光軸方向的資料係與光學組件層FX位置(光學組件層FX之長邊方向位置及寬度方向位置)資料連結地儲存於儲存裝置24(參考第1圖)。 First, as shown in FIG. 6A, a plurality of checkpoints CP in the width direction of the optical component layer FX are set, and the optical axis direction of the optical component layer FX is detected at each checkpoint CP. The time when the optical axis is detected is the time when the roll drum R1 is manufactured, or may be the period before the half of the optical component layer FX is unwound from the roll drum R1. The data in the optical axis direction of the optical component layer FX is stored in the storage device 24 in association with the position of the optical component layer FX (the position in the longitudinal direction and the width direction of the optical component layer FX) (refer to FIG. 1).

控制裝置25係從儲存裝置24取得各檢查點CP之光軸資料(光軸面內分佈之檢查資料),以檢測出切割出層片FXm之部分的光學組件層FX(以橫切線CL所劃分之區域)之平均光軸方向。 The control device 25 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each of the inspection points CP from the storage device 24 to detect the optical component layer FX (which is divided by the transverse line CL) of the portion in which the slice FXm is cut out. The average optical axis direction of the area).

例如,如第6B圖所示,每次於檢查點CP檢測出光軸方向與光學組件層FX之邊緣線EL所夾角度(偏移角),以該偏移角中最大角度(最大偏移角)作為θmax,最小角度(最小偏移角)作為θmin時,檢測出最大偏移角θmax與最小偏移角θmin的平均值θmid(=(θmaxmin)/2)作為平均偏移角。接著,檢測出相對光學組件層FX之邊緣線EL的平均偏移角θmid方向作為光學組件層FX之平均光軸方向。另外,該偏移角係例如以相對光學組件層FX之邊緣線EL的逆時針方向為正角度,順時針方向為負角度而加以算出。 For example, as shown in FIG. 6B, the angle (offset angle) between the optical axis direction and the edge line EL of the optical component layer FX is detected at the checkpoint CP each time, and the maximum angle (maximum offset angle) among the offset angles When θ max and the minimum angle (minimum offset angle) are taken as θ min , the average value θ mid (=(θ maxmin )/2) of the maximum offset angle θ max and the minimum offset angle θ min is detected. As the average offset angle. Next, the average offset angle θ mid direction of the edge line EL with respect to the optical component layer FX is detected as the average optical axis direction of the optical component layer FX. Further, the offset angle is calculated, for example, by a counterclockwise direction with respect to the edge line EL of the optical component layer FX being a positive angle and a clockwise direction being a negative angle.

接著,依前述方法所檢測出之光學組件層FX的平均光軸方向,決定相對液晶面板P之層片FXm的貼合位置(相對貼合位置),使得相對液晶面板P之顯示區域P4的長邊或短邊呈目標角度。例如,根據設計規格將光學組件F1X之光軸方向設定為相對顯示區域P4的長邊或短邊呈90°之方向的情況中,光學組件層FX之平均光軸方向係相對顯示區域P4的長邊或短邊呈90°地,將層片FXm貼合液晶面板P。 Next, the bonding position (relative bonding position) of the layer sheet FXm with respect to the liquid crystal panel P is determined according to the average optical axis direction of the optical component layer FX detected by the above method, so that the display area P4 of the liquid crystal panel P is long. The edge or short side is at the target angle. For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis direction of the optical component layer FX is longer than the display region P4. The layer FXm is bonded to the liquid crystal panel P with the side or the short side at 90°.

如第7圖及第8圖所示,第一切斷裝置41與第二切斷裝置42係以攝影機41a,42a等檢測部檢測出液晶面板P之顯示區域P4的外周緣,沿顯示區域P4的外周緣不間斷地切斷貼合至液晶面板P之層片FXm。透過拍攝液晶面板P之端部、設置於液晶面板P之位置校準標誌、或設置於顯示區域P4之黑色矩陣最外緣等,來檢測出顯示區域P4之外周緣。 As shown in FIGS. 7 and 8, the first cutting device 41 and the second cutting device 42 detect the outer peripheral edge of the display region P4 of the liquid crystal panel P by the detecting portions such as the cameras 41a and 42a, along the display region P4. The outer periphery of the liquid crystal panel P is cut off to the layer FXm of the liquid crystal panel P without interruption. The outer periphery of the display region P4 is detected by photographing the end portion of the liquid crystal panel P, the position alignment mark provided on the liquid crystal panel P, or the outermost edge of the black matrix provided in the display region P4.

於顯示區域P4之外側處,設置有特定寬度的邊框部G,其係用於設置將液晶面板P之第一及第二基板接合之密封劑等,於該邊框部G之寬度內以切斷裝置(第一切斷裝置41與第二切斷裝置42)進行層片FXm之切斷(切斷線:WCL,參考第6B圖)。 A frame portion G having a specific width is provided on the outer side of the display region P4 for providing a sealant or the like for bonding the first and second substrates of the liquid crystal panel P to be cut within the width of the frame portion G. The apparatus (the first cutting device 41 and the second cutting device 42) cuts the layer FXm (cut line: WCL, see Fig. 6B).

如以上說明,關於本發明之第一實施態樣的薄膜貼合系統1,係具備有:貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18),係將較液晶面板P之顯示區域P4更大的光學組件層FX之層片FXm各自貼合至液晶面板P之正/反面;以及切斷裝置(第一切斷裝置41與第二切斷裝置42),係從各自貼合至液晶面板P之正/反面的層片,將配置於顯示區域P4之對向部分外側的剩餘部分切斷,以於液晶面板P之正/反面各自形成對應於該顯示區域P4大小的光學組件F1X。因此,可設計使得光學組件F1X對應顯示區域P4時的精度較佳,縮小顯示區域P4外側之邊框部G(參考第3圖),以達成顯示區域之擴大及機器之小型化的目的。 As described above, the film bonding system 1 according to the first embodiment of the present invention includes a bonding device (the first bonding device 13, the second bonding device 15, and the third bonding device 18). The layer FXm of the optical component layer FX which is larger than the display area P4 of the liquid crystal panel P is attached to the front/rear surface of the liquid crystal panel P, respectively; and the cutting device (the first cutting device 41 and the second cutting device) 42), the remaining portions disposed on the outer side of the opposite portion of the display region P4 are cut from the layers that are respectively bonded to the front/rear surfaces of the liquid crystal panel P, so that the front/rear surfaces of the liquid crystal panel P are respectively formed corresponding to The optical component F1X of the display area P4 size. Therefore, it is possible to design the optical unit F1X to correspond to the display area P4 with better precision, and to reduce the frame portion G outside the display area P4 (refer to FIG. 3), thereby achieving the purpose of expanding the display area and miniaturizing the device.

又,前述薄膜貼合系統1具有控制裝置25,係根據光學組件層FX之光軸方向的檢查資料,決定液晶面板P與層片FXm的相對貼合位置,貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)係根據控制裝置25所決定之相對貼合位置,將層片FXm貼合至液晶面板P。因此,即使是在光 學組件層FX的面內存在有光軸方向之偏差的情況中,可對應該光軸方向之偏差,適當地調整層片FXm與液晶面板P的相對貼合位置。藉此,可改善相對液晶面板P的光學組件F1X之光軸方向精度,提高光學顯示設備之色彩度及對比。 Further, the film bonding system 1 includes a control device 25 that determines the relative bonding position of the liquid crystal panel P and the layer sheet FXm based on the inspection data of the optical axis direction of the optical component layer FX, and the bonding device (the first bonding device) 13. The second bonding device 15 and the third bonding device 18) are bonded to the liquid crystal panel P by the layer FXm according to the relative bonding position determined by the control device 25. So even in the light In the case where there is a deviation in the direction of the optical axis in the plane of the component layer FX, the relative bonding position of the layer FXm and the liquid crystal panel P can be appropriately adjusted in accordance with the deviation of the optical axis direction. Thereby, the optical axis direction accuracy of the optical component F1X with respect to the liquid crystal panel P can be improved, and the color degree and contrast of the optical display device can be improved.

又,前述薄膜貼合系統1中,貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)具有:捲出部31a,係從料捲滾筒R1將光學組件層FX與分離層片F3a一同捲出;切斷部31b,係將殘留有分離層片F3a的光學組件層FX切成層片FXm;刀刃31c,係將層片FXm從分離層片F3a處剝離;以及貼合頭32,係將層片FXm貼合而保持於保持面32a處,且將保持於保持面32a之層片FXm貼合至液晶面板P。因此,易於進行層片FXm之連續貼合,可提高光學顯示設備之生產效率。又,使用具有圓弧狀的保持面32a之貼合頭32,藉由圓弧狀的保持面32a之傾斜移動可平滑地保持層片FXm,且藉由同一圓弧狀的保持面32a之傾斜移動可將層片FXm確實地貼合至液晶面板P。 Further, in the film bonding system 1, the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) has a winding portion 31a which is optical from the roll drum R1. The component layer FX is unwound together with the separation layer sheet F3a; the cutting portion 31b cuts the optical component layer FX in which the separation layer sheet F3a remains, into a layer sheet FXm; and the blade edge 31c, which is the layer sheet FXm from the separation layer sheet F3a. The bonding head 32 is bonded to the holding surface 32a by bonding the layer sheet FXm, and the layer sheet FXm held by the holding surface 32a is bonded to the liquid crystal panel P. Therefore, the continuous bonding of the layer sheets FXm is facilitated, and the production efficiency of the optical display device can be improved. Further, by using the bonding head 32 having the arc-shaped holding surface 32a, the layer FXm can be smoothly held by the oblique movement of the arc-shaped holding surface 32a, and the same circular arc-shaped holding surface 32a is inclined. The movement can positively bond the layer FXm to the liquid crystal panel P.

又,前述薄膜貼合系統1中,第一切斷裝置41及第二切斷裝置42係雷射切割機,第一切斷裝置41及第二切斷裝置42係連接至同一雷射輸出裝置40,從雷射輸出裝置40所輸出之雷射係分岐而供給至第一切斷裝置41及第二切斷裝置42。因此,與第一切斷裝置41和第二切斷裝置42各自連接至各別雷射輸出裝置的情況相比,可達成光學顯示設備之生產系統小型化的目的。 Further, in the film bonding system 1, the first cutting device 41 and the second cutting device 42 are laser cutting machines, and the first cutting device 41 and the second cutting device 42 are connected to the same laser output device. 40. The laser system output from the laser output device 40 is branched and supplied to the first cutting device 41 and the second cutting device 42. Therefore, compared with the case where the first cutting device 41 and the second cutting device 42 are respectively connected to the respective laser output devices, the purpose of miniaturizing the production system of the optical display device can be achieved.

(第二實施態樣) (Second embodiment)

第9A圖及第9B圖係顯示適用於本發明第二實施態樣之薄膜貼合系統的貼合裝置之示意圖。 Fig. 9A and Fig. 9B are schematic views showing a bonding apparatus suitable for the film bonding system of the second embodiment of the present invention.

第9A圖係顯示將層片FXm保持於貼合頭60之狀態的示意圖,第9B係顯示將層片FXm貼合至液晶面板P之狀態的示意圖。 Fig. 9A is a schematic view showing a state in which the layer sheet FXm is held by the bonding head 60, and a pattern showing the state in which the layer sheet FXm is bonded to the liquid crystal panel P.

本實施態樣與第一實施態樣相異之處為,相對於第一實施態樣之貼合裝置所使用之具有圓弧狀的保持面32a之貼合頭32,本實施態樣之貼合裝置係使用具有平面狀的保持面60a之貼合頭60。因此,此處係以貼合頭60之結構為主進行說明,與第一實施態樣共通之結構元件賦予相同元件符號並省略詳細說明。 The present embodiment differs from the first embodiment in that the bonding head 32 having the arc-shaped holding surface 32a used in the bonding apparatus of the first embodiment is attached to the embodiment. For the device, a bonding head 60 having a planar holding surface 60a is used. Therefore, the structure of the bonding head 60 will be mainly described here, and structural elements common to the first embodiment will be denoted by the same reference numerals, and detailed description will be omitted.

本實施態樣之貼合裝置具有:貼合頭60;貼合滾筒62;支撐貼合頭60及貼合滾筒62的導桿61;以及相對液晶面板P使導桿61呈傾斜移動之狀態下進行水平移動的驅動裝置63。雖然圖式中未顯示,但於本實施態樣之貼合裝置處,設置有與第5圖所示相同的捲出部、切斷部及刀刃(剝離部)。 The bonding apparatus of this embodiment has a bonding head 60, a bonding roller 62, a guide rod 61 that supports the bonding head 60 and the bonding roller 62, and a state in which the guiding rod 61 is tilted relative to the liquid crystal panel P. A drive unit 63 that moves horizontally is performed. Although not shown in the drawings, in the bonding apparatus of the present embodiment, the winding portion, the cutting portion, and the blade (peeling portion) which are the same as those shown in Fig. 5 are provided.

貼合頭60係具有保持從分離層片處剝離之層片FXm的平面狀之保持面60a。保持面60a係透過導桿61之傾斜移動,而相對液晶面板P呈傾斜。層片FXm之一端部突出於保持面60a外側地進行定位,以吸附於保持面60a。層片FXm之吸附力較弱,因此層片FXm在保持於保持面60a之狀態下,可平滑地在保持面60a上進行水平方向移動。 The bonding head 60 has a planar holding surface 60a that holds the layer sheet FXm peeled off from the separation layer sheet. The holding surface 60a is inclined by the guide rod 61 and inclined with respect to the liquid crystal panel P. One end of the layer FXm protrudes outside the holding surface 60a to be positioned to be adsorbed to the holding surface 60a. Since the adsorption force of the layer sheet FXm is weak, the layer sheet FXm can smoothly move in the horizontal direction on the holding surface 60a while being held by the holding surface 60a.

貼合滾筒62係配置於貼合頭60之側面,貼附液晶面板P並黏著從貼合頭60之保持面60a突出的層片FXm。該狀態下,藉由驅動裝置63使導桿61在水平方向上移動時,在層片FXm之一端部黏著於液晶面板P之狀態下,貼合頭60及貼合滾筒62係從層片FXm之一端部側朝向另一端部側進行水平移動。藉此,層片FXm係藉由貼合滾筒62從一端部側緩緩地貼合至液晶面板P。 The bonding roller 62 is disposed on the side surface of the bonding head 60, and the liquid crystal panel P is attached thereto and adheres to the layer FXm protruding from the holding surface 60a of the bonding head 60. In this state, when the guide 61 is moved in the horizontal direction by the driving device 63, the bonding head 60 and the bonding roller 62 are separated from the layer FXm in a state where one end of the layer FXm is adhered to the liquid crystal panel P. One of the end sides is horizontally moved toward the other end side. Thereby, the layer sheet FXm is gradually bonded to the liquid crystal panel P from the one end side by the bonding roll 62.

貼合頭60係將保持於保持面60a之層片FXm,藉由水平方向之貼合頭之移動方向及其垂直方向、以及迴轉方向上進行位置校準。層片FXm與 液晶面板P之貼合位置(相對貼合位置)係與第一實施態樣同樣地,根據光學組件層FX之光軸方向的檢查資料,由控制裝置25(參考第1圖)進行決定。貼合頭60係根據控制裝置25所決定之相對貼合位置,將保持於保持面60a之層片FXm貼合至液晶面板P。 The bonding head 60 is held by the layer FXm of the holding surface 60a, and is aligned by the moving direction of the bonding head in the horizontal direction, the vertical direction thereof, and the rotation direction. Layer FXm and The bonding position (relative bonding position) of the liquid crystal panel P is determined by the control device 25 (refer to FIG. 1) based on the inspection data of the optical axis direction of the optical component layer FX, similarly to the first embodiment. The bonding head 60 is bonded to the liquid crystal panel P by the layer sheet FXm held by the holding surface 60a in accordance with the relative bonding position determined by the control device 25.

因此,本實施態樣中,可提供一種顯示縮小區域周邊之邊框部,達成顯示區域之擴大及機器之小型化的目的之光學顯示設備之生產系統。 Therefore, in the present embodiment, it is possible to provide a production system of an optical display device which displays the frame portion around the reduced area and achieves the expansion of the display area and the miniaturization of the machine.

(第一變化態樣) (first change aspect)

前述實施態樣中,雖使用二氧化碳(CO2)雷射切斷機作為切斷裝置(第一切斷裝置41與第二切斷裝置42)之一範例,但切斷裝置(第一切斷裝置41與第二切斷裝置42)並不限定於此。亦可使用切斷刀片等其它切斷部作為切斷裝置(第一切斷裝置41與第二切斷裝置42)。 In the above embodiment, a carbon dioxide (CO 2 ) laser cutting machine is used as an example of the cutting device (the first cutting device 41 and the second cutting device 42), but the cutting device (first cutting) The device 41 and the second cutting device 42) are not limited thereto. Other cutting portions such as a cutting blade may be used as the cutting device (the first cutting device 41 and the second cutting device 42).

例如,如第10圖所示,第一基板P1的外周緣之三個側邊沿著相對應之第二基板P2之三邊的同時,其外周緣剩餘之一邊則較相對應的第二基板P2之一邊朝外側延伸的情況,第二基板P2之大小係與顯示區域P4之大小概略一致。因此,只要切斷刀片沿第二基板P2外周緣進行移動,便可讓接合至第二基板P2之層片F3m形成對應於顯示區域P4大小的光學組件F13。 For example, as shown in FIG. 10, the three sides of the outer periphery of the first substrate P1 are along the three sides of the corresponding second substrate P2, and the remaining side of the outer periphery is the corresponding second substrate. When one of the sides of P2 extends outward, the size of the second substrate P2 is substantially the same as the size of the display area P4. Therefore, as long as the cutting blade moves along the outer periphery of the second substrate P2, the layer F3m joined to the second substrate P2 can be formed into the optical component F13 corresponding to the size of the display region P4.

該情況,層片F3m之剩餘部分幾乎沒有黏著於液晶面板P之面,光學組件F13與其周邊之剩餘部分係概略地僅以黏著層F2a之黏著力進行黏合。因此,將層片F3m之剩餘部分從液晶面板P處進行剝離回收的裝置,亦只需為夾住剩餘部分之端部並拉出的簡單結構即可,裝置結構簡單。又,前述實施態樣中,層片F1m,F2m之剩餘部分與層片F3m之剩餘部分係以不同機構從液晶面板P處進行剝離回收。但是層片F3m之剩餘部分的回收係非常地容易, 因此在將層片F1m,F2m之剩餘部分從液晶面板P處進行剝離回收時,亦可將層片F3m之剩餘部分從液晶面板P處一併剝離回收。該情況,由於不需在二個部位設置剩餘部分之剝離裝置,因此可使得光學顯示設備之生產系統小型化。 In this case, the remaining portion of the layer F3m hardly adheres to the surface of the liquid crystal panel P, and the optical component F13 and the remaining portion of the periphery thereof are roughly bonded only by the adhesive force of the adhesive layer F2a. Therefore, the apparatus for peeling and recovering the remaining portion of the layer sheet F3m from the liquid crystal panel P only needs to be a simple structure in which the end portion of the remaining portion is sandwiched and pulled out, and the apparatus has a simple structure. Further, in the above embodiment, the remaining portions of the plies F1m, F2m and the remaining portions of the ply F3m are peeled off from the liquid crystal panel P by a different mechanism. However, the recycling of the rest of the layer F3m is very easy. Therefore, when the remaining portions of the layer sheets F1m and F2m are peeled off from the liquid crystal panel P, the remaining portion of the layer sheet F3m can be collectively peeled off from the liquid crystal panel P. In this case, since the peeling means of the remaining portion is not required to be provided at two places, the production system of the optical display device can be miniaturized.

(第二變化態樣) (second variation)

前述實施態樣中,相對液晶面板P之層片FXm的貼合位置(相對貼合位置)之決定方法,係說明了使用光學組件層FX之面內平均光軸方向的方法。前述實施態樣中,以光學組件層FX之面內最大偏移角θmax與最小偏移角θmin的平均值θmid作為平均偏移角的情況中,係檢測出相對光學組件層FX邊緣線與平均偏移角θmid所夾方向,作為光學組件層FX之面內平均光軸方向,但是光學組件層FX之面內平均光軸方向的檢出方法並不限定於此。 In the above-described embodiment, a method of determining the in-plane average optical axis direction of the optical component layer FX is described with respect to the method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P. In the foregoing embodiment, in the case where the in-plane maximum offset angle θ max of the optical component layer FX and the average value θ mid of the minimum offset angle θ min are taken as the average offset angle, the relative optical component layer FX edge is detected. The direction in which the line and the average offset angle θ mid are sandwiched is the in-plane average optical axis direction of the optical component layer FX, but the method of detecting the in-plane average optical axis direction of the optical component layer FX is not limited thereto.

例如,從光學組件層FX之寬度方向上設定的複數個檢查點CP(參考第6A圖)中選擇一個或複數個檢查點CP,對每一個所選擇之檢查點CP,檢測出光軸方向與光學組件層FX之邊緣線EL所夾角度(偏移角)。接著,檢測出所選擇之一個或複數個檢查點CP之光軸方向的偏移角平均值,作為平均偏移角,亦可檢測出相對光學組件層FX之邊緣線EL與該平均偏移角所夾方向,作為光學組件層FX之平均光軸方向。 For example, one or a plurality of checkpoints CP are selected from a plurality of checkpoints CP (refer to FIG. 6A) set in the width direction of the optical component layer FX, and the optical axis direction and the optical are detected for each of the selected checkpoints CP. The angle (offset angle) of the edge line EL of the component layer FX. Then, an average value of the offset angles of the selected one or a plurality of checkpoints CP in the optical axis direction is detected. As the average offset angle, the edge line EL of the optical component layer FX and the average offset angle can also be detected. The direction of the clip is the average optical axis direction of the optical component layer FX.

(第三變化態樣) (third variation)

前述實施態樣中,係說明了使用貼合頭32,60作為將層片FXm貼合至液晶面板P之方法,但本發明不限定於該方法。亦可不透過貼合頭32,60,而使用將以刀刃31c從分離層片F3a處剝離之層片FXm利用貼合滾筒等直接貼合至液晶面板P的方法。 In the above embodiment, the bonding heads 32 and 60 are used as a method of bonding the layer sheets FXm to the liquid crystal panel P, but the present invention is not limited to this method. It is also possible to use a method in which the layer sheet FXm peeled off from the separation layer sheet F3a by the blade 31c is directly bonded to the liquid crystal panel P by a bonding roll or the like without passing through the bonding heads 32 and 60.

另外,本發明之上述實施態樣中,係說明了液晶面板P之正面 為第一面,反面為第二面的情況,但液晶面板P之正面亦可為第二面,而反面為第一面。 In addition, in the above embodiment of the present invention, the front side of the liquid crystal panel P is explained. The first side and the reverse side are the second side, but the front side of the liquid crystal panel P may be the second side, and the reverse side is the first side.

1‧‧‧薄膜貼合系統 1‧‧‧Film bonding system

11‧‧‧第一轉台式機床 11‧‧‧First rotary machine tool

11a‧‧‧第一轉台起始位置 11a‧‧‧Starting position of the first turntable

11b‧‧‧第一轉台終點位置 11b‧‧‧First turntable end position

11c‧‧‧第一貼合位置 11c‧‧‧First fit position

11d‧‧‧第二貼合位置 11d‧‧‧Second fitting position

11e‧‧‧薄膜剝離位置 11e‧‧‧film stripping position

12‧‧‧搬送裝置 12‧‧‧Transporting device

13‧‧‧第一貼合裝置 13‧‧‧First bonding device

14‧‧‧薄膜剝離裝置 14‧‧‧film stripping device

15‧‧‧第二貼合裝置 15‧‧‧Second laminating device

16a‧‧‧第二轉台起始位置 16a‧‧‧Starting position of the second turntable

16b‧‧‧第二轉台終點位置 16b‧‧‧second turntable end position

16c‧‧‧第三貼合位置 16c‧‧‧ third fit position

17‧‧‧搬送裝置 17‧‧‧Transporting device

18‧‧‧第三貼合裝置 18‧‧‧ Third bonding device

21‧‧‧搬送裝置 21‧‧‧Transporting device

22‧‧‧搬送裝置 22‧‧‧Transporting device

24‧‧‧儲存裝置 24‧‧‧Storage device

25‧‧‧控制裝置 25‧‧‧Control device

27‧‧‧輸送帶 27‧‧‧Conveyor belt

27a‧‧‧起始位置 27a‧‧‧ starting position

27b‧‧‧第一切斷位置 27b‧‧‧First cut position

27c‧‧‧終點位置 27c‧‧‧End position

28‧‧‧輸送帶 28‧‧‧Conveyor belt

28a‧‧‧起始位置 28a‧‧‧ starting position

28b‧‧‧第二切斷位置 28b‧‧‧Second cut position

31‧‧‧層片搬送裝置 31‧‧‧Ply conveying device

31c‧‧‧刀刃 31c‧‧‧ Blade

32‧‧‧貼合頭 32‧‧‧Fitting head

33‧‧‧驅動裝置 33‧‧‧ drive

40‧‧‧切斷部 40‧‧‧cutting department

41‧‧‧第一切斷裝置 41‧‧‧First cutting device

42‧‧‧第二切斷裝置 42‧‧‧Second cutting device

43‧‧‧雷射輸出裝置 43‧‧‧Laser output device

F‧‧‧搬送方向 F‧‧‧Transfer direction

F1‧‧‧第一光學組件層 F1‧‧‧First optical component layer

F2‧‧‧第二光學組件層 F2‧‧‧Second optical component layer

F3‧‧‧第三光學組件層 F3‧‧‧ third optical component layer

F1m‧‧‧第一層片 F1m‧‧‧ first layer

F2m‧‧‧第二層片 F2m‧‧‧Second layer

F3m‧‧‧第三層片 F3m‧‧‧ third layer film

P‧‧‧液晶面板 P‧‧‧ LCD panel

PA1‧‧‧第一光學組件貼合體 PA1‧‧‧First optical component fit

PA2‧‧‧第二光學組件貼合體 PA2‧‧‧Second optical component fit

PA3‧‧‧第三光學組件貼合體 PA3‧‧‧The third optical component fit

PA4‧‧‧第四光學組件貼合體 PA4‧‧‧Four optical component bonding body

R1‧‧‧料捲滾筒 R1‧‧‧ Roller

R2‧‧‧分離滾筒 R2‧‧‧Separation roller

Claims (5)

一種光學顯示設備之生產系統,係具備有:貼合部,係將從較該光學顯示部件之顯示區域寬度更寬之光學組件層所切出之層片各自貼合至光學顯示部件之第一面及第二面;以及切斷部,係從各自貼合至該光學顯示部件之第一面及第二面的層片,將配置於對應該顯示區域之層片對向部分外側的剩餘部分切斷,以於該光學顯示部件之第一面及第二面各自形成對應該顯示區域大小的光學組件。 A production system for an optical display device comprising: a bonding portion for bonding a layer cut from an optical component layer having a wider width than a display region of the optical display member to the optical display member And the cut surface is formed from the plies of the first surface and the second surface of the optical display member, and the remaining portion disposed outside the opposing portion of the ply corresponding to the display region The cutting is performed such that the first surface and the second surface of the optical display member each form an optical component corresponding to the size of the display region. 如申請專利範圍第1項所述之光學顯示設備之生產系統,其具備有根據該光學組件層之光軸方向的檢查資料來決定該光學顯示部件與該層片之相對貼合位置的控制裝置,該貼合部係根據該控制裝置所決定之相對貼合位置來將該層片貼合至該光學顯示部件。 The production system for an optical display device according to claim 1, comprising: a control device for determining a relative position of the optical display member and the layer according to inspection data of an optical axis direction of the optical component layer; The bonding unit bonds the layer to the optical display member according to the relative bonding position determined by the control device. 如申請專利範圍第1項或第2項所述之光學顯示設備之生產系統,其中,該貼合部具有:捲出部,係從料捲滾筒將光學組件層與分離層片一同捲出;切斷部,係將殘留有該分離層片的光學組件層切斷以獲得層片;剝離部,係將該層片從該分離層片處剝離;以及貼合頭,係將該層片貼合於保持面藉以保持該層片,並將由該保持面所保持之層片貼合至該光學顯示部件。 The production system of the optical display device according to the first or the second aspect of the invention, wherein the bonding portion has a winding portion for winding the optical component layer together with the separation layer sheet from the roll drum; The cutting portion cuts the optical component layer from which the separation layer is left to obtain a layer; the peeling portion peels the layer from the separation layer; and the bonding head is attached to the layer The retaining surface is engaged to hold the ply and the plies held by the retaining surface are attached to the optical display member. 如申請專利範圍第1項所述之光學顯示設備之生產系統,其係將從貼合至該光學顯示部件的第一面之層片所切斷的第一剩餘部分、與從貼合至該光學顯示部件的第二面之層片所切斷的第二剩餘部分,一併從該光學顯示部件處剝離。 The production system of the optical display device according to claim 1, wherein the first remaining portion cut from the layer laminated to the first side of the optical display member is bonded to the slave The second remaining portion cut by the ply of the second side of the optical display member is also peeled off from the optical display member. 如申請專利範圍第1項所述之光學顯示設備之生產系統,其中,該切斷部具有:從貼合至該光學顯示部件的第一面之層片將第一剩餘部分切斷的第一切 斷裝置;以及從貼合至該光學顯示部件的第二面之層片將第二剩餘部分切斷的第二切斷裝置;且該第一切斷裝置及該第二切斷裝置係雷射切割機,該第一切斷裝置及該第二切斷裝置係連接至同一台雷射輸出裝置,從該雷射輸出裝置所輸出之雷射係分岐而供給至該第一切斷裝置及該第二切斷裝置。 The production system of an optical display device according to claim 1, wherein the cutting portion has a first portion that cuts the first remaining portion from a layer attached to the first surface of the optical display member cut a breaking device; and a second cutting device that cuts the second remaining portion from the ply that is attached to the second side of the optical display member; and the first cutting device and the second cutting device are laser a cutting machine, the first cutting device and the second cutting device are connected to the same laser output device, and the laser output from the laser output device is branched and supplied to the first cutting device and Second cutting device.
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