WO2011132332A1 - Lamination device of polarizing film, and system for producing liquid crystal display device provided with same - Google Patents

Lamination device of polarizing film, and system for producing liquid crystal display device provided with same Download PDF

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Publication number
WO2011132332A1
WO2011132332A1 PCT/JP2010/063579 JP2010063579W WO2011132332A1 WO 2011132332 A1 WO2011132332 A1 WO 2011132332A1 JP 2010063579 W JP2010063579 W JP 2010063579W WO 2011132332 A1 WO2011132332 A1 WO 2011132332A1
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WO
WIPO (PCT)
Prior art keywords
substrate
polarizing film
film
bonding
transport mechanism
Prior art date
Application number
PCT/JP2010/063579
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French (fr)
Japanese (ja)
Inventor
力也 松本
幸治 植田
和範 岸▲崎▼
Original Assignee
住友化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 住友化学株式会社 filed Critical 住友化学株式会社
Priority to CN201080006598.5A priority Critical patent/CN102395918B/en
Priority to KR1020117018258A priority patent/KR20120131087A/en
Priority to KR1020117018215A priority patent/KR101108405B1/en
Publication of WO2011132332A1 publication Critical patent/WO2011132332A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • G02B5/3025Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528Polarisers

Definitions

  • the present invention relates to a polarizing film laminating apparatus and a liquid crystal display manufacturing system including the same.
  • liquid crystal display devices have been widely manufactured.
  • a polarizing film is bonded to a substrate (liquid crystal panel) used in a liquid crystal display device in order to control transmission or blocking of light.
  • the polarizing film is bonded so that the absorption axes thereof are orthogonal.
  • Patent Document 1 discloses an optical display device manufacturing system.
  • the said manufacturing system rotates a board
  • optical film polarizing film
  • Patent No. 4307510 (issued on Aug. 5, 2009)
  • the conventional apparatus has the following problems.
  • the work is usually performed in a clean room in order to prevent foreign matters such as dust from entering the bonding surface.
  • air is rectified. This is because it is necessary to bond the polarizing film in a state in which rectification is performed on the substrate in a downflow in order to suppress the yield reduction due to the foreign matter.
  • the manufacturing system of Patent Document 1 has a configuration in which a polarizing film is bonded to the substrate from the upper surface and the lower surface.
  • a demerit that the airflow (downflow) is hindered by the polarizing film and the rectification environment to the substrate is deteriorated.
  • FIGS. 14 (a) and 14 (b) show air velocity vectors in the top-paste type manufacturing system. In FIG.
  • a region A is a region where an unwinding unit and the like for unwinding the polarizing film are installed, a region B is a region through which the polarizing film mainly passes, and a region C is a peeling removed from the polarizing film. This is an area in which a take-up unit or the like for winding the film is installed.
  • clean air is supplied from a HEPA (High Efficiency Particulate Air) filter 40.
  • HEPA High Efficiency Particulate Air
  • FIG. 14A since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41.
  • FIG. 14B since the grating 41 is not installed, the airflow moves along the floor after contacting the floor at the bottom of FIG. 14B.
  • the areas A to C are arranged on the 2F (second floor) portion, and the clean air from the HEPA filter 40 is blocked by the polarizing film. Therefore, it is difficult to generate an airflow in the vertical direction with respect to the substrate passing through the 2F portion.
  • the airflow vector in the horizontal direction is large (vector density is high). That is, it can be said that the rectification environment has deteriorated.
  • the objective is to provide the manufacturing system of a polarizing film bonding apparatus and a liquid crystal display device provided with the same which do not disturb a rectification environment. is there.
  • the polarizing film laminating apparatus of the present invention transports a rectangular substrate with a long side or a short side along the transport direction, and the first substrate.
  • a first bonding unit that bonds a polarizing film to the lower surface of the substrate in the transport mechanism;
  • a reversing mechanism that reverses the substrate transported by the first substrate transport mechanism and places the substrate in the second substrate transport mechanism;
  • a second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction, and a second bonding unit for bonding a polarizing film to the lower surface of the substrate in the second substrate transport mechanism;
  • the first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction, and the long side or the transported by the first substrate transport mechanism.
  • a substrate with a short side along the transport direction A reversing mechanism for reversing a short side or a long side to a state along the substrate transport direction of the second substrate transport mechanism, wherein the reversing mechanism includes a substrate support portion and a substrate reversing portion connected to the substrate support portion.
  • the substrate support unit can place the substrate transported by the first substrate transport mechanism, and can sandwich the placed substrate.
  • the substrate reversing unit rotates about the reversing axis.
  • the first substrate transport mechanism includes a straight line that passes through the center of the substrate before reversal in the first substrate transport mechanism and has a 45 ° inclination with respect to a straight line that is perpendicular to the transport direction of the substrate.
  • the reversal axis is located in a plane including the substrate before reversal in the substrate transport mechanism, and a pair of the substrate support portions are provided in line symmetry with respect to the reversal axis.
  • a polarizing film can be bonded to the lower surface of a board
  • the operation of the reversing mechanism is a simple operation centered on the reversing axis, the tact time is short.
  • the bonding apparatus according to the present invention is very simple to install and is excellent in area efficiency.
  • the reversing mechanism includes a substrate support portion and a substrate reversing portion connected to the substrate support portion, and the substrate support portion is a first support.
  • the substrate transported by the substrate transport mechanism can be placed, and the placed substrate can be sandwiched.
  • the substrate reversing unit is configured to invert the substrate by rotating about the reversal axis.
  • the reversing axis is located, and a pair of the substrate support portions are provided symmetrically with respect to the reversing axis.
  • the polarizing film is bonded to the lower surface of the substrate by the first bonding portion, and the substrate is rotated by rotation along the reversing axis of the substrate reversing portion in the reversing mechanism. While reversing, the long side and short side with respect to the conveyance direction can be changed. Then, a polarizing film can be bonded to the lower surface of a board
  • the tact time is short. Therefore, it is possible to realize bonding with a short tact time including a reversing operation.
  • the first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and has an effect of being excellent in area efficiency.
  • the manufacturing system includes a bonding apparatus according to the present invention.
  • FIG. 1 is a cross-sectional view showing a manufacturing system.
  • the manufacturing system 100 has a two-stage structure, the 1F (first floor) portion is a film transport mechanism 50, and the 2F (second floor) portion is a substrate transport mechanism (first substrate transport mechanism and It becomes the bonding apparatus 60 containing a 2nd board
  • the film transport mechanism 50 plays the role of unwinding the polarizing film (polarizing plate) and transporting it to the nip rolls 6 ⁇ 6a and 16 ⁇ 16a and winding up the peeling film that is no longer needed.
  • the bonding device 60 plays a role of bonding the polarizing film unwound by the film transport mechanism 50 to the substrate (liquid crystal panel) 5.
  • the film transport mechanism 50 includes a first film transport mechanism 51 and a second film transport mechanism 52.
  • the 1st film conveyance mechanism 51 conveys a polarizing film to the nip roll 6 * 6a which bonds a polarizing film to the lower surface of the board
  • the substrate 5 has a rectangular shape.
  • the second film transport mechanism 52 transports the polarizing film to the bottom surface of the inverted substrate 5.
  • the first film transport mechanism 51 includes a first unwinding unit 1, a second unwinding unit 1a, a first winding unit 2, a second winding unit 2a, a half cutter 3, a knife edge 4, and a defect film winding roller. 7 ⁇ 7a.
  • the first unwinding unit 1 is provided with a polarizing film original, and the polarizing film is unwound.
  • a known polarizing film may be used as the polarizing film. Specifically, a polyvinyl alcohol film is dyed with iodine or the like, and a film stretched in a uniaxial direction can be used. Although it does not specifically limit as thickness of the said polarizing film, A polarizing film 5 micrometers or more and 400 micrometers or less can be used preferably.
  • the polarizing film has a pressure-sensitive adhesive layer protected by a release film.
  • a release film also referred to as a protective film or a separator
  • a polyester film, a polyethylene terephthalate film, or the like can be used.
  • the peeling film of 5 micrometers or more and 100 micrometers or less can be used preferably.
  • the manufacturing system 100 includes two unwinding portions and two unwinding portions corresponding to the unwinding portions, the first unwinding portion 1 has a low remaining amount of raw material. It is possible to connect the original fabric provided in the two unwinding portions 1 a to the original fabric of the first unwinding portion 1. As a result, it is possible to continue the operation without stopping the unwinding of the polarizing film. With this configuration, production efficiency can be increased.
  • a plurality of unwinding sections and winding sections may be provided, and three or more winding sections may be provided.
  • the 1st unwinding part 1 and the 2nd unwinding part 1a shown in FIG. 1 have a structure which can replace a mutual position with a turret.
  • the first unwinding portion 1 and the second unwinding portion 1a move while drawing a circular trajectory, automatically cut the polarizing film of the first unwinding portion 1, and then the second winding.
  • the polarizing film of the protruding portion 1a can be automatically connected.
  • the first unwinding part 11 and the second unwinding part 11a are also configured to rotate by a turret. According to the structure of the turret, the unwinding portions or the winding portions can be easily replaced with each other, and it is excellent in that the polarizing films can be easily connected.
  • the structure shown in FIG. 2 is mentioned as a modification of an unwinding part and a winding part.
  • the 1st unwinding part 1b and the 2nd unwinding part 1c of FIG. 2 have a structure which can move along a horizontal with respect to the direction of the core 1d of a polarizing film.
  • the 1st unwinding part 1b and the 2nd unwinding part 1c have a structure which can move to the width direction of a polarizing film.
  • the structure is movable in at least one of both directions along the core 1d (the back side direction in the drawing (marked with a cross in the circle) and the front side of the drawing. It can move in at least one of the lateral directions (marked with a circle in the circle).
  • the 1st unwinding part 1b and the 2nd unwinding part 1c are arranged mutually in parallel.
  • the bonding device 60 is provided on the upper part of the first unwinding portion 1b and the second unwinding portion 1c.
  • the first unwinding portion 1b and the second unwinding portion are provided. Since the portion 1c is structured to move horizontally in the direction of the core 1d, it is not necessary to secure a space for the unwinding portion to move upward. Therefore, the space between the conveyor roll 15 provided at the upper portion and the unwinding portion can be saved. As a result, it is possible to provide a downsized bonding apparatus, and thus a manufacturing system.
  • the present invention is greatly different from a conventional manufacturing system having a turret in that such downsizing can be achieved.
  • a manufacturing system having a turret is disclosed, for example, in Japanese Patent Laid-Open No. Hei 8-208083.
  • the roll remaining amount of the polarizing film provided in the 1st unwinding part 1b decreases, it connects with the polarizing film of the 2nd unwinding part 1c by an operator.
  • the conveyance speed of the polarizing film is 0 m / min.
  • the operator cuts the polarizing film on the first unwinding portion 1b side.
  • polarizing films are connected using a single-sided adhesive tape, for example.
  • the first winding unit 2 the second winding unit 2a, the first winding unit 12 and the second winding unit 12a in FIG. 1, as in the unwinding unit in FIG. It can be set as the structure which can move horizontally with respect to this direction.
  • the point that the 1st unwinding part 2 and the 2nd unwinding part 2a are arranged in parallel is also the same.
  • the structure of the winding unit (the first winding unit and the second winding unit can move horizontally with respect to the direction of the core of the release film, and the first winding unit and the second winding unit).
  • Half cutter (cutting unit) 3 half-cuts a polarizing film (a film laminate composed of a polarizing film, a pressure-sensitive adhesive layer and a peeling film) protected by a peeling film, and cuts the polarizing film and the pressure-sensitive adhesive layer.
  • a polarizing film a film laminate composed of a polarizing film, a pressure-sensitive adhesive layer and a peeling film
  • the half cutter 3 a known member may be used. Specifically, a cutter, a laser cutter, etc. can be mentioned. After the polarizing film and the pressure-sensitive adhesive layer are cut by the half cutter 3, the release film is removed from the polarizing film by the knife edge (removal part) 4.
  • the pressure-sensitive adhesive layer is not particularly limited, and examples thereof include acrylic, epoxy, and polyurethane pressure-sensitive adhesive layers.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually 5 to 40 ⁇ m.
  • the 2nd film conveyance mechanism 52 is the structure similar to the 1st film conveyance mechanism 51, and is the 1st unwinding part 11, the 2nd unwinding part 11a, the 1st winding part 12, and the 2nd winding part 12a. , Half cutter 13, knife edge 14 and defect film winding rollers 17 and 17 a. About the member which attached
  • the manufacturing system 100 includes a cleaning unit 71.
  • the cleaning unit 71 cleans the substrate 5 before the polarizing film is bonded to the lower surface of the substrate 5 by the nip rolls 6 and 6a.
  • a known cleaning unit composed of a nozzle and a brush for injecting a cleaning liquid may be used. By cleaning the substrate 5 immediately before the bonding by the cleaning unit 71, the bonding can be performed in a state where there are few adhered foreign substances on the substrate 5.
  • FIG. 3 is a cross-sectional view showing a peripheral portion of the nip rolls 6 and 6a in the manufacturing system 100.
  • FIG. FIG. 3 shows a situation in which the substrate 5 is transported from the left direction and the polarizing film 10a having an adhesive layer (not shown, the same hereinafter) is transported from the lower left direction.
  • the polarizing film 10a is provided with a release film 10b, and the polarizing film 10a and the pressure-sensitive adhesive layer are cut by the half cutter 3, and the release film 10b is not cut (half cut).
  • the knife edge 4 is installed on the peeling film 10b side.
  • the knife edge 4 is an edge-shaped member for peeling the peeling film 10 b, and the polarizing film 10 a and the peeling film 10 b having a low adhesive force are peeled off along the knife edge 4.
  • the release film 10b is wound around the first winding portion 2 of FIG.
  • it can replace with a knife edge and can also use the structure which winds up a peeling film using an adhesion roller.
  • the winding efficiency of a peeling film can be improved by providing an adhesive roller in two places similarly to a winding part.
  • the bonding apparatus 60 conveys the board
  • the bonding apparatus 60 is provided on the upper part of the film transport mechanism 50. Thereby, space saving of the manufacturing system 100 can be achieved.
  • a substrate transport mechanism including a conveyor roll is installed in the laminating apparatus 60, whereby the substrate 5 is transported in the transport direction (first substrate transport mechanism 61 and second described later in FIG. 10).
  • the substrate transport mechanism 62 corresponds to the substrate transport mechanism).
  • the substrate 5 is transported from the left side, and then transported from the right side in the drawing, that is, from the top of the first film transport mechanism 51 to the top of the second film transport mechanism 52.
  • the nip rolls 6 * 6a (1st bonding part) and the nip rolls 16 * 16a (2nd bonding part) which are bonding parts are each provided.
  • the nip rolls 6, 6 a and 16, 16 a are members that serve to bond the polarizing film from which the release film has been removed to the lower surface of the substrate 5.
  • the substrate 5 is reversed by the reversing mechanism 65 after being bonded by the nip rolls 6 and 6a.
  • the reversing mechanism 65 will be described later.
  • the polarizing film conveyed to the nip rolls 6 and 6a is bonded to the lower surface of the substrate 5 through an adhesive layer.
  • known configurations such as a pressure roll and a pressure roll can be employed.
  • what is necessary is just to adjust the pressure and temperature at the time of bonding in the nip rolls 6 and 6a suitably.
  • the configuration of the nip rolls 16 and 16a is the same.
  • a defect display (mark) detection unit is provided between the first unwinding units 1 and 11 and the half cutter, and a polarizing film having a defect is detected. It becomes the composition which is done.
  • the said defect display is provided at the time of the 1st unwinding part 1 and / or the 1st unwinding part 11 side rather than a defect display detection part by detecting at the time of the original production of a polarizing film, and providing a defect display. It attaches
  • the defect display imparting unit includes a camera, an image processing device, and a defect display forming unit. First, a polarizing film is imaged by the camera, and the presence or absence of a defect can be inspected by processing the imaging information. Specific examples of the drawback include foreign matters such as dust and fish eyes. When a defect is detected, a defect display is formed on the polarizing film by the defect display forming unit. A mark such as ink is used as the defect display.
  • a bonding avoiding unit discriminates the mark with a camera and transmits a stop signal to the bonding apparatus 60 to stop the conveyance of the substrate 5. Thereafter, the polarizing film in which the defect is detected is not used for pasting by the nip rolls 6 and 6a, and is wound by the defect film winding roller (collecting unit) 7 and 7a. Thereby, pasting with substrate 5 and a polarizing film which has a fault can be avoided. If such a series of structures is provided, it is possible to avoid the bonding between the polarizing film having a defect and the substrate 5, so that the yield can be increased, which is preferable.
  • a publicly known inspection sensor can be used suitably as a fault detection part and a pasting avoidance part.
  • the substrate 5 is conveyed to the nip rolls 16 and 16a. Then, a polarizing film is bonded to the lower surface of the substrate 5. As a result, the polarizing film is bonded to both surfaces of the substrate 5, and the two polarizing films are bonded to both surfaces of the substrate 5 with different absorption axes. Thereafter, if necessary, the both sides of the substrate 5 are inspected for misalignment. For the inspection, it is possible to adopt a configuration that is usually made by an inspection unit equipped with a camera.
  • the bonding is performed from the lower surface of the substrate 5, and the rectifying environment to the substrate 5 is not hindered. For this reason, foreign matter mixing into the bonding surface of the substrate 5 can also be prevented, and more accurate bonding becomes possible.
  • FIG. 4 (a) and FIG. 4 (b) show the velocity vector of the airflow in the under-paste type manufacturing system similar to the present invention.
  • the area A is an area where the unwinding part is installed
  • the area B is an area where the polarizing film mainly passes
  • the area C is an area where the winding part is installed. It is.
  • clean air is supplied from the HEPA filter 40.
  • FIG. 4A since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41.
  • FIG.4 (b) since the grating 41 is not installed, after an airflow contacts a floor, it will move along a floor.
  • FIGS. 4 (a) and 4 (b) Since the manufacturing system shown in FIGS. 4 (a) and 4 (b) is a bottom-attached type, the air current from the HEPA filter 40 is not hindered by the polarizing film as shown in FIGS. 14 (a) and 14 (b). For this reason, the direction of the airflow vector is almost directed toward the substrate, and it can be said that a preferable rectification environment is realized in the clean room.
  • the grating 41 is installed and not installed in FIG. 4B, but the same preferable state is shown in both figures.
  • the substrate transport mechanism is formed horizontally, but is not installed as a series of structures. For this reason, the airflow can pass between the substrate transport mechanisms. After the substrate is held by a reversing mechanism to be described later, the substrate is transferred between the substrate transport mechanisms.
  • substrate 5 is first conveyed by a long side opening (a long side is orthogonal to a conveyance direction), and is conveyed by a short side opening (a short side is orthogonal to a conveyance direction) after that. It has become.
  • FIG. 5 is a cross-sectional view showing a modification of the bonding apparatus 60 according to the present invention.
  • the 1st unwinding part 1b and the 2nd unwinding part 1c in the 1st film conveyance mechanism 51 which concern on FIG. 5 are the structures which can move along a horizontal with respect to the direction of the core 1d of a polarizing film similarly to FIG. It has become.
  • the 1st film conveyance mechanism 51 is provided with the film connection part (1st film connection part) 83 and the film connection part (2nd film connection part) 93, and can connect the polarizing films 10 and 20 by these. .
  • FIG. 6 is a perspective view showing the film connecting portion 83 and the cutting machine 87.
  • the film connecting portion 83 includes suction portions 84 and 84 a and a cutting and bonding portion 85.
  • the adsorption portions 84 and 84a are members for adsorbing and fixing the polarizing film.
  • the suction portions 84 and 84a have a flat plate shape and include a plurality of suction mechanisms 89 on the surface thereof.
  • the adsorption mechanism 89 is not particularly limited as long as the polarizing film can be adsorbed, and a configuration in which the polarizing film is adsorbed by sucking air with a pump can be adopted.
  • the cutting and bonding part 85 is rotatable and has a plurality of surfaces. Specifically, the cut bonding part 85 has a polygonal shape. Moreover, it arrange
  • the cutting and bonding part 85 is in a direction perpendicular to the polarizing film 10 and can be moved in a direction close to the polarizing film 10 to return to the original position. Thereby, it is possible to avoid reliably that the corner
  • lamination bonding part 85 is a polygonal shape and is also provided with the cutting
  • a mating surface may be further provided.
  • the cut bonding part 85 of FIG. 6 between the bonding surfaces and between the cutting support surface and the bonding surface are chamfered, and the corner part is formed, the cutting bonding part 85 and the polarizing film.
  • the size of the cut and bonded portion 85 may be appropriately determined depending on the width of the polarizing film 10 and is not particularly limited.
  • the length is 200 mm or more and 2000 mm or less, and the width is 10 mm or more and 300 mm or less. can do.
  • FIG. 7 is a perspective view showing the cutting and bonding part 85.
  • FIG. 7 shows a state in which the cutting and bonding portion 85 of FIG. 6 is rotated by 1/3 turn clockwise.
  • the cutting and bonding unit 85 includes a cutting support surface 85 a that supports the polarizing film 10 along the width direction of the polarizing film 10. Moreover, it has the bonding surfaces 85b and 85c provided with the adsorption
  • a groove-shaped opening 86 is formed in the cutting support surface 85a, and the blade portion of the cutting machine 87 provided in the cutting bonding portion 85 shown in FIG. By forming the opening 86, the cutting machine 87 can be reliably passed along the width direction of the polarizing film 10, and the polarizing films 10 and 20 can be more accurately connected.
  • the cutting machine 87 As the cutting machine 87, a known cutter can be adopted, and the polarizing film 10 can be easily cut. Further, the cutting machine 87 is supported by a base portion 88 that can be driven in the width direction of the polarizing film 10.
  • the bonding surfaces 85b and 85c have the same configuration as each other, and include a plurality of suction mechanisms 89 in the same manner as the suction portions 84 and 84a.
  • the single-sided adhesive tape (connection material) 85d is arrange
  • the above single-sided adhesive tape 85d only needs to be able to bond polarizing films together, and a known single-sided adhesive tape can be used.
  • the film material of the single-sided adhesive tape 85d include polyethylene terephthalate film (PET film), cellulose, Japanese paper, aluminum, non-woven fabric, polytetrafluoroethylene, polyvinyl chloride, polyvinylidene chloride, polycarbonate, polyurethane, ABS resin, polyester, Examples thereof include polystyrene, polyethylene, polypropylene, polyacetal resin, polylactic acid, polyimide, and polyamide.
  • the pressure-sensitive adhesive used in the pressure-sensitive adhesive layer includes acrylic, epoxy, polyurethane, synthetic rubber, EVA, silicone, vinyl chloride, chloroprene rubber, cyanoacrylate, isocyanate, and polyvinyl alcohol. And pressure sensitive adhesives such as melamine resin.
  • the film connecting portion 83 is disposed so as to face the polarizing film 10. For this reason, in FIG. 5, since the polarizing film 10 is arrange
  • the film connecting portion 93 has the same structure as the film connecting portion 83. As shown in FIG. 5, the film connecting portions 83 and 93 are arranged so that the suction mechanisms of the suction portions provided in the film connecting portions 83 and 93 face each other. Moreover, the film connection parts 83 and 93 are arranged with the passage positions of the polarizing film 10 and the polarizing film 20 interposed therebetween. In addition, the manufacturing system 100 provided with the film connection part 83 * 93 is a preferable form in this Embodiment, and it is also possible to set it as the form which is not provided with the film connection part 83 * 93.
  • the polarizing film 10 is unwound from the 1st unwinding part 1 (unwinding process). Then, as shown in FIG. 3, only the polarizing film 10a is half-cut with a half cutter (not shown), and the release film 10b is peeled off with the knife edge 4 (peeling step). Further, the polarizing film 10a from which the release film 10b has been peeled and the substrate 5 are bonded together by pressure bonding with the nip rolls 6 and 6a (bonding step). The peeled release film 10b is wound up and collected by a winder (not shown). Through the series of steps, the substrate 5 and the polarizing film 10a are bonded to obtain an optical display device.
  • the polarizing film 10 of the first unwinding part 1 (11, 1b) and the polarizing film 20 of the second unwinding part 1a (11a, 1c) are cut. And among the polarizing film 10 of the 1st unwinding part 1 (11, 1b) and the polarizing film 20 of the 2nd unwinding part 1a (11a, 1c), the line side of the 1st unwinding part 1 (11, 1b) The polarizing film 10 or the second unwinding part 1a (11a, 1c) of the line side polarizing film 20 and the unwinding part of the second unwinding part 1a (11a, 1c) of the polarizing film 20 or first unwinding The polarizing film 10 on the unwinding part side of the part 1 (11, 1b) is connected. In other words, the “line side” indicates a direction in which the polarizing film is unwound. Examples of the connecting step include (1) a technique by an operator and (2) a technique using the
  • the conveyance speed of the polarizing film 10 is set to 0 m / min. After the above (after stopping the polarizing film 10), the operator cuts the polarizing film 10. Next, after unwinding the polarizing film 20 from the 1st unwinding part 11 and cut
  • the two unwinding portions of the first unwinding portions 1 and 11 are provided, so that the polarizing film 10. 20, the film can be immediately connected, and the polarizing film 20 can be unwound quickly. Therefore, unlike the conventional manufacturing system in which the unwinding unit is installed only at one place, the original roll roll can be replaced at the unwinding unit that is vacant during operation. Can be reduced. As a result, it is possible to shorten the manufacturing time of the optical display device.
  • the roll of the polarizing film 10 of the first unwinding unit 1 is replaced with a new roll while the polarizing film 20 is unwound.
  • the remaining amount of the polarizing film 20 decreases, it is of course possible to connect the polarizing film 20 and the polarizing film 10 in the same manner.
  • FIG. 8 is a process diagram illustrating a connection process by a manufacturing system including a film connection part.
  • the conveyance speed of the polarizing film 10 is set to 0 m / min.
  • the suction portions 84 and 84a and the cutting and bonding portion 85 are moved in the vertical direction with respect to the polarizing film 10.
  • the polarizing film 10 is sucked and fixed by the suction mechanism 89 of the suction portions 84 and 84a (suction process).
  • the cutting support surface 85a is in contact with the polarizing film 10 in the cutting and bonding unit 85.
  • the polarizing film 10 is cut by moving a cutting machine (not shown) along the opening 86 (cutting step).
  • the cutting and bonding part 85 is moved in the direction perpendicular to the polarizing film 10 and away from the polarizing film 10 (right side in the figure), rotated counterclockwise by 1/3 turn, and the polarizing film 10 In the direction perpendicular to the polarizing film 10 (the left side in the figure).
  • the single-sided adhesive tape 85d of the bonding surface 85b is bonded together so that the cutting line of the polarizing film 10 which opposes the single-sided adhesive tape 85d (not shown) may be covered. Joint process).
  • the said cutting line shows the edge
  • the single-sided adhesive tape 85d is disposed so as to cover the cutting line, that is, the polarizing film 10 is also disposed on a portion where the polarizing film 10 does not exist beyond the cutting line.
  • the single-sided adhesive tape 95d is adhered to the polarizing film 20 in the same manner as in FIGS. 8A to 8C.
  • the same members as those described above are given the same names, and the description thereof is omitted.
  • a cutting machine (not shown) is formed on the cutting support surface 95a.
  • the polarizing film 20 is cut by moving along the opening 96.
  • the cut and bonded portion 95 is moved in a direction perpendicular to the polarizing film 20 and away from the polarizing film 20 (left side in the figure), and rotated clockwise by 1/3 turn to the polarizing film 20 On the other hand, it is moved in a direction perpendicular to the polarizing film 20 (right side in the figure).
  • the single-sided adhesive tape 95d can be affixed so that the cutting line of the polarizing film 20 facing the single-sided adhesive tape 95d of the bonding surface 95b may be covered.
  • the adsorbing portions 84 and 84a and the cutting and bonding portion 85 are brought close to the adsorbing portions 94 and 94a and the cutting and bonding portion 95 (film connecting portion 93).
  • the cut surfaces of the polarizing film 10 and the polarizing film 20 are matched with each other (proximity step). Thereby, among the single-sided adhesive tapes 85d and 95d that cover the cutting line of the polarizing film 10/20, the part beyond the cutting line (the part not bonded to the polarizing film 10/20) is the other polarizing film 20/20.
  • the polarizing films 10 and 20 are connected to each other.
  • the film connecting part 83 is brought close to the film connecting part 93, but the film connecting part 93 may be made close to the film connecting part 83, and the film connecting parts 83 and 93 are made close to each other. May be.
  • the cutting and bonding parts 85 and 95 are perpendicular to the polarizing films 10 and 20, respectively, and are moved away.
  • the cutting and bonding part 85 is rotated clockwise by 1/3 turn, and the cutting and bonding part 95 is rotated counterclockwise by 1/3 turn. Then, the cutting and bonding parts 85 and 95 are moved in the direction perpendicular to the polarizing films 10 and 20 and in the adjacent directions.
  • the adsorbing portions 84 and 84a and the cutting and bonding portion 85 are returned to the positions shown in FIG. 8A, and the series of steps is completed.
  • the single-sided adhesive tapes 85d and 95d are preliminarily adsorbed on the bonding surfaces 85c and 95c, after a new roll of the polarizing film 10 is installed on the second unwinding portion 1c. 8 (a) to (c) are performed on the polarizing film 20, and the steps of FIGS. 8 (d) to (e) are performed on the polarizing film 10.
  • FIGS. The polarizing films 20 and 10 can be connected through the step h). Of course, it is also possible to continuously connect the polarizing films by supplementing the used single-sided adhesive tapes 85d and 95d.
  • the polarizing film is adsorbed, cut, and bonded in a shorter time and more accurately than the connecting step by the operator. Is preferable.
  • the manufacturing system when only the first unwinding portion 1 is used, the first unwinding portion 11 is not used, and further, the film connecting portions 83 and 93 are not used, the operator can move to the first unwinding portion 1. Since it is necessary to replace the polarizing film 10 after replacing a new polarizing film, the connecting step requires about 30 minutes. For this reason, it is clear that the manufacturing system according to the present embodiment is useful.
  • the reversing mechanism 65 reverses the substrate 5 whose short side or long side is along the transport direction into a state where the long side or short side is along the transport direction of the second substrate transport mechanism. That is, the front surface and the back surface of the substrate 5 are reversed, and the long side and the short side of the substrate 5 along the transport direction are switched.
  • the structure of the reversing mechanism 65 will be described with reference to FIG.
  • FIG. 9 is a perspective view showing the reversing mechanism 65 and shows the operation of the reversing mechanism 65 in the process of reversing the substrate 5.
  • the reversing mechanism 65 includes substrate support portions 66a and 66b, a substrate reversing portion 67, and a rotating shaft portion 68. Each member will be described below.
  • the substrate support portion 66a is a member that supports the substrate 5, and can hold the placed substrate 5. Further, the substrate support portion 66a includes an adsorbing means for adsorbing the substrate 5 as a preferable form. A well-known thing can be used as an adsorption means, for example, an air suction type adsorption means can be used.
  • the substrate support portion 66a is composed of a pipe-shaped arm and suction means, and the air sucked by the suction means passes through the arm.
  • the shape of the arm and suction means is as follows. It is not limited to the said structure.
  • the substrate support portion 66a has a structure in which two suction means are provided on the arm, and includes a pair of arm groups each including three arms. Further, four suction means are arranged on the diagonal line of the substrate 5, and two further suction means are arranged between the suction means in the length direction of the substrate 5.
  • the number of arms and the number of suction means are merely examples. For example, when a large substrate is reversed, the number of arms and the number of suction means may be increased as appropriate. Further, it is of course possible to make changes such as concentrating the installation location of the suction means on the central portion of the substrate 5 or changing it around the edge of the substrate 5.
  • the substrate support portion 66a When the substrate support portion 66a does not place the substrate 5, the distance between the arm groups is widened so that the substrate 5 can be received (hereinafter, this state is referred to as a “standby state”).
  • the substrate support portion 66b has a structure in which the distance between the arms of the substrate 5 is also increased, and has the same structure as the substrate support portion 66a. Further, since the pair of arm groups sandwich the substrate 5, the distance between the arm groups can be reduced. As described above, the distance between the arm groups can be changed.
  • the substrate support portions 66a and 66b have motors, and the distance between the arm groups is changed by changing the rotational motion of the motors to a linear motion. It has become. In addition, if it is the structure which can change the distance between arm groups, you may change and use for the structure provided with a motor.
  • the substrate reversing unit 67 is connected to the substrate supporting units 66a and 66b, and reverses the substrate 5 by rotating around the reversing axis M.
  • the substrate reversing part 67 is connected to each arm, and has a pipe-like structure as a preferable structure from the viewpoint of reducing the weight and reducing the air resistance during rotation.
  • a plate shape may be used instead of a pipe shape.
  • the substrate reversing unit 67 rotates around the reversing axis M.
  • the member that rotates the substrate reversing unit 67 include driving means using a motor.
  • the substrate reversing unit 67 includes a rotation shaft unit 68 as a preferred form. Since the rotation shaft portion 68 is disposed along the reversal axis M, it can be stably rotated along the reversal axis M.
  • the substrate reversing portion 67 is structured to rotate together with the rotating shaft portion 68, and the substrate reversing portion 67 is configured to easily rotate stably around the reversing axis M.
  • the substrate reversing part 67 including the rotating shaft part 68 can rotate more stably along the reversing axis M. Therefore, the substrate 5 can be reversed more stably.
  • the rotating shaft portion 68 can rotate toward the front surface with respect to the substrate 5 before reversing, or conversely, rotate toward the back surface.
  • the reversal axis M has an inclination of 45 ° with respect to a straight line passing through the center of the substrate 5 before reversal in the first substrate transport mechanism and perpendicular to the transport direction D1 of the substrate 5.
  • the straight line having an inclination of 45 ° is a straight line along the inversion axis M in FIG.
  • the “surface including the substrate 5 before inversion in the first substrate transport mechanism” means the same plane as the substrate 5 before inversion, and in FIG. 9A, refers to a surface located on the XY plane.
  • FIG. 9 illustrates an example in which the substrate support portions 66a and 66b, the substrate reversing portion 67, and the rotating shaft portion 68 are separately configured. However, as long as each member has a function, it is configured as an integral member. Of course it is good.
  • the short side of the substrate 5 is along the transfer direction D1 of the first substrate transfer mechanism, and the long side of the substrate 5 is along the transfer direction D2 of the second substrate transfer mechanism.
  • a case of inversion will be described.
  • FIG. 9 (w1) is a perspective view showing the reversing mechanism 65 in a standby state.
  • the substrate support portion 66a is in a state where the distance between the pair of arm groups is widened so that the substrate 5 can be received.
  • the substrate support portion 66b is disposed at a position where the substrate 5 is inverted, and the distance between the pair of arm groups provided in the substrate support portion 66b is increased in order to release the inverted substrate 5. ing.
  • the substrate 5 When the substrate 5 is transported to the substrate support portion 66a along the transport direction D1 on the XY plane, the substrate 5 is placed on the substrate support portion 66a. Specifically, the substrate 5 moves between the arm groups, and the substrate 5 is placed on the arm group below the substrate support portion 66a. Whether or not the substrate 5 is placed on the arm group is determined by a substrate confirmation sensor.
  • the substrate check sensor is provided in each of the substrate support portion 66a and the substrate support portion 66b. However, the substrate check sensor only needs to be provided at a position where the placement of the substrate 5 can be confirmed. It may be provided other than.
  • the arm groups approach each other and the substrate 5 is sandwiched. Further, the surface of the substrate 5 is adsorbed by the adsorbing means, and the substrate 5 is further fixed. In this way, the substrate 5 can be further fixed by the suction by the suction means, as compared with the case where the substrate 5 is held only by the arm group. Thereby, it can avoid that the board
  • FIG. 9B shows a state in which the substrate reversing unit 67 has rotated 90 ° about the reversing axis M from the state of FIG. 9A.
  • the substrate 5 is located along the Z-axis direction.
  • the substrate support portion 66 b does not sandwich the substrate 5 and is rotated 90 ° downward along with the rotation of the substrate inversion portion 67.
  • the substrate reversing portion 67 and the rotating shaft portion 68 are rotated by 90 ° about the reversing axis M, whereby the substrate 5 is reversed to a position symmetrical with respect to the reversing axis M.
  • substrate 5 by the side of the conveyance direction D2 is located in the conveyor roll of a 2nd board
  • the polarizing film can be bonded from the lower surface by the nip rolls 16 and 16a so that the absorption axes thereof are orthogonal to each other.
  • the operation of the reversing mechanism 65 draws a 180 ° semicircular orbit about the reversing axis M, and does not require a complicated operation. Therefore, one substrate 5 can be reversed with a short tact time.
  • a pair of substrate support portions 66a and 66b are provided in line symmetry with respect to the inversion axis M. Therefore, when the substrate 5 is inverted by the substrate support portion 66a, the other substrate support portion 66b is moved to the position where the substrate 5 before the inversion in FIG.
  • the substrate 5 is placed on the lower arm group of the pair of arm groups. . Thereafter, as shown in FIG. 9 (w2), the substrate 5 is transported in the transport direction D2 with the rotation of the conveyor roll provided in the second substrate transport mechanism.
  • the substrate support portion 66b has moved to the position of the substrate 5 before inversion.
  • the next substrate 5 'to be transported can be quickly reversed without waiting for the movement of the substrate support 66a. That is, according to the bonding apparatus 60, not only can a single substrate be reversed, but also the time can be shortened until the next substrate is placed after the substrate is reversed. As a result, a plurality of substrates can be sequentially processed with a short tact time.
  • FIGS. 9 (a) to (c) are plan views showing the rotation process of the substrate 5 corresponding to FIGS. 9 (a) to (c).
  • FIG. 10 illustrates the first substrate transport mechanism 61 and the second substrate transport mechanism 62.
  • a plurality of conveyor rolls that transport the substrate 5 are provided orthogonal to the transport direction of the substrate 5.
  • the means for transporting the substrate 5 is not limited to the conveyor roll, and other alternative means may be used.
  • the first substrate transport mechanism 61 and the second substrate transport mechanism 62 transport the substrate 5 in the same direction. That is, the transport directions D1 and D2 are in the same direction. For this reason, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 have linear shapes along the transport directions D1 and D2, respectively. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus 60 according to the present invention is very simple to install and has a structure with excellent area efficiency.
  • the substrate 5 is transported along the transport direction D1, and is placed on the substrate support portion 66a from the end of the first substrate transport mechanism 61 by the rotational force of the conveyor roll. Then, after the placed substrate 5 is sandwiched between the pair of arm groups of the substrate support portion 66a, the surface of the substrate is adsorbed and fixed by the adsorbing means.
  • the state of the reversing mechanism 65 is shown in FIG.
  • FIG. 10B shows a state in which the substrate reversing portion 67 has rotated 90 ° about the reversing axis M from FIG. 10A.
  • the substrate support portion 66b does not sandwich the substrate 5, but is rotated 90 ° downward along with the rotation of the substrate inversion portion 67.
  • the substrate 5 is reversed by rotating the substrate reversing portion 67 by 90 ° about the reversing axis M together with the rotating shaft 68.
  • FIG. 10C shows the state of the reversing mechanism 65 when the substrate 5 is reversed.
  • the substrate 5 is inverted at a position symmetrical with respect to the inversion axis M.
  • the end of the substrate 5 is positioned in the second substrate transport mechanism 62. As described with reference to FIG. 9C, thereafter, the suction of the substrate 5 is released, and the distance between the arm groups is increased. Thereafter, the substrate 5 is placed on the lower arm group of the pair of arm groups. Furthermore, it will be conveyed to the board
  • the substrate support portions 66a and 66b are configured to include the suction means.
  • the substrate 5 may be fixed only by the arm group. In that case, the operation
  • FIG. 11 is a block diagram illustrating a configuration of the reversing mechanism 65 and the interface unit 165 coupled to the reversing mechanism 65.
  • the configuration shown in FIG. 11 is merely an example, and the reversing mechanism 65 is not limited to this example.
  • the reversing mechanism 65 is further connected to the interface unit 165.
  • the interface unit 165 receives an operation input from an operator and transmits input data to the display and inversion mechanism 65.
  • the reversing mechanism 65 includes substrate support portions 66a and 66b, a substrate reversing portion 67, and a rotating shaft portion 68, and these are connected to the control portion 70 in the interface portion.
  • the interface unit 165 includes an input unit 166, a display unit 167, a storage unit 168, and a control unit 70.
  • the input unit 166 transmits information on the substrate 5 and the like to the storage unit 168. As each information of the board
  • Other information includes the positions of the first substrate transport mechanism 61 and the second substrate transport mechanism 62 and the positions of the conveyor rolls included in these, the transport directions D1 and D2, the position of the reversal axis M, the rotational speed of the substrate 5, and the like. Can be mentioned.
  • the interface unit 165 includes an input device (not shown).
  • the input device may be any device that allows an operator to input various types of information, and may be configured with, for example, an input key or a touch panel.
  • the display unit 167 displays the contents of various information input by the input unit 166, and can be configured by a known liquid crystal display or the like.
  • the storage unit 168 is connected to the control unit 70 and the input unit 166.
  • the storage unit 168 stores information input from the input unit.
  • the storage unit 168 includes a storage device such as a RAM (random access memory) or an HDD (hard disk drive), and stores various data and various programs. Is.
  • the control unit 70 controls the substrate support units 66a and 66b, the suction means included therein, the substrate reversing unit 67, and the rotating shaft unit 68 based on the information received from the storage unit 168.
  • the control unit 70 stores rotation information for controlling the rotation of the substrate 5.
  • the rotation information for controlling the rotation of the substrate 5 is rotation information for controlling the reversing mechanism 65. (1)
  • the substrate 5 arrives at the substrate support portion 66a (or 66b), and (2) the sensor senses the substrate 5. (Sensor ON), (3) the substrate 5 is held by the arm group of the substrate support portion 66a, (4) the substrate 5 is inverted, and (5) the substrate inversion portion 67 is inverted after the substrate 5 is released. This is information (or a program) for controlling a series of operations of the reversing mechanism 65.
  • the control unit 70 includes a CPU (central processing unit), a ROM (read only memory) that stores the program, a RAM that expands the program, a storage device (recording medium) such as a memory that stores the program and various data, and the like. It can be set as the structure provided.
  • the manufacturing system 100 includes a control unit 70, a cleaning unit 71, a misalignment inspection device 72, a bonded foreign matter automatic inspection device 73, and a sorting and conveying device 74.
  • the bonding deviation inspection device 72, the bonded foreign substance automatic inspection device 73, and the sorting and conveying device 74 perform processing such as inspection on the substrate 5 after bonding, that is, the liquid crystal display device.
  • FIG. 12 is a block diagram showing the relationship of each member included in the above-described liquid crystal display device manufacturing system
  • FIG. 13 is a flowchart showing the operation of the liquid crystal display device manufacturing system.
  • the operation of the liquid crystal display device will be described together with the description of each member.
  • the control unit 70 is connected to the cleaning unit 71, the misalignment inspection device 72, the bonded foreign matter automatic inspection device 73, and the sorting and conveying device 74, and controls them by transmitting control signals thereto.
  • the control unit 70 is mainly configured by a CPU (Central Processing Unit) and includes a memory or the like as necessary.
  • CPU Central Processing Unit
  • the cleaning unit 71 In the case where the cleaning unit 71 is provided in the manufacturing system 100, the substrate 5 in the first substrate transport mechanism 61 is transported to the cleaning unit 71 at the front edge of the long side in order to reduce the tact time in the cleaning unit 71. Is preferred. Usually, since the cleaning in the cleaning unit 71 takes a long time, this configuration is very effective from the viewpoint of shortening the tact time.
  • a bonding step (including a reversing operation of the substrate 5) for bonding the polarizing film to both surfaces of the substrate 5 is performed (S2 in FIG. 13). This step will be described with reference to FIGS. That's right.
  • the sticking deviation inspection device 72 is for inspecting the presence or absence of sticking deviation of the polarizing film on the bonded substrate 5.
  • the sticking deviation inspection device 72 is constituted by a camera and an image processing device, and the camera is installed at the bonding position of the substrate 5 on which the polarizing film is bonded by the nip rolls 16 and 16a.
  • the substrate 5 is photographed by the camera, and by processing the photographed image information, the substrate 5 can be inspected for the presence or absence of sticking (sticking slip inspection step, S3 in FIG. 13).
  • the misalignment inspection apparatus 72 a conventionally known misalignment inspection apparatus can be used as the misalignment inspection apparatus 72.
  • the bonded foreign matter automatic inspection device 73 inspects the presence or absence of foreign matter on the bonded substrate 5.
  • the bonded foreign matter automatic inspection device 73 is configured by a camera and an image processing device, like the misalignment inspection device 72, and transports the second substrate of the substrate 5 after the polarizing film is bonded by the nip rolls 16 and 16a.
  • the camera is installed in the mechanism (bonding device 60).
  • substrate 5 is image
  • the foreign matter include foreign matters such as dust, fish eyes, and the like.
  • a conventionally well-known bonding foreign material inspection apparatus can be used as the bonding foreign material automatic inspection apparatus 73.
  • S3 and S4 may be performed in the reverse order or simultaneously. One step can be omitted.
  • the sorting and conveying device 74 determines the presence or absence of sticking misalignment and foreign matter based on the inspection results from the sticking misalignment inspection device 72 and the bonded foreign matter automatic inspection device 73.
  • the sorting and conveying device 74 only needs to receive an output signal based on the inspection result from the sticking misalignment inspection device 72 and the bonding foreign matter automatic inspection device 73 and can sort the bonded substrates 5 into non-defective products or defective products. . Therefore, a conventionally known sorting and conveying system can be used.
  • both the misalignment and foreign matter are detected.
  • the bonded substrate 5 is not used. Sorted as good (S7).
  • the bonded substrates 5 are classified as non-defective products (S6).
  • the non-defective product and the defective product can be quickly sorted, and the tact time can be shortened.
  • the sorting and conveying device 74 may be configured to determine the presence / absence of only one of the sticking misalignment and the foreign matter.
  • the present invention also includes the following aspects.
  • the substrate support part includes an adsorption unit that adsorbs the substrate.
  • the substrate can be further fixed as compared with the case where the substrate is held only by the substrate support portion.
  • the substrate reversing portion is provided with a rotating shaft portion that rotates together with the substrate reversing portion, and the rotating shaft portion is disposed along the reversing axis. Is preferred.
  • the substrate reversing portion including the rotating shaft portion can rotate more stably along the reversing axis. Therefore, the substrate can be reversed more stably.
  • the 1st film conveyance mechanism and 2nd film conveyance mechanism which convey a polarizing film are provided, and the said 1st film conveyance mechanism was protected by the peeling film.
  • a plurality of unwinding sections for unwinding the polarizing film, a cutting section for cutting the polarizing film, a removing section for removing the release film from the polarizing film, and a plurality of winding sections for winding the removed release film are provided.
  • the second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the peeling film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film.
  • the first bonding unit is provided on the top of the structure and the second film transport mechanism, and bonds the polarizing film from which the release film has been removed to the substrate.
  • the unwinding part and the winding part are provided in plural, when the remaining amount of the original film of the polarizing film in one unwinding part decreases, the other unwinding part is provided in the original film. It is possible to connect raw materials. As a result, the operation can be continued without stopping the unwinding of the polarizing film, and the production efficiency can be increased.
  • the unwinding part can move horizontally with respect to the core direction of the polarizing film, and the first unwinding part and the second unwinding are the unwinding parts. It is preferable that the parts are arranged side by side.
  • the 1st film connection part and 2nd which connect the polarizing film unwound from the 1st unwinding part, and the polarizing film unwound from the 2nd unwinding part.
  • the film connecting part is interposed between the passage positions of both the polarizing films, and the first film connecting part is disposed to face the polarizing film unwound from the first unwinding part, and the second film connecting part is It arrange
  • the said 1st film connection part and 2nd film connection part are two adsorption
  • the plurality of surfaces of the cutting and bonding unit includes a cutting support surface that supports the polarizing film along the width direction of the polarizing film, and an adsorption mechanism that adsorbs and holds the connecting material that connects the polarizing films to each other. It has at least the above bonding surface, and it is preferable that the first film connecting portion and the second film connecting portion can be close to each other.
  • the polarizing film can be adsorbed by the adsorbing portion, and the adsorbing polarizing film can be cut by the cutting machine while being supported by the cutting support surface. Then, the cutting bonding part can be rotated and the connection material of a bonding surface can be bonded with respect to the cut
  • an opening through which the cutting machine can pass is formed in the cutting support surface along the width direction of the polarizing film.
  • the cutting machine can be reliably passed along the width direction of the polarizing film, and the polarizing films can be more accurately connected later.
  • the cutting machine has a round blade shape.
  • the cutting and bonding part is movable in the vertical direction with respect to the polarizing film adsorbed by the adsorption part.
  • the cutting and bonding part when the cutting and bonding part rotates, the cutting and bonding part can move in a direction perpendicular to the polarizing film and away from the polarizing film, and then rotate. Thereby, when a cutting bonding part rotates, it can avoid reliably contacting a polarizing film.
  • the first film transport mechanism and the second film transport mechanism detect a defect display attached to the polarizing film unwound from the first unwinding section. It is preferable to have a defect detection unit, a bonding avoidance unit that discriminates the defect display and stops the conveyance of the substrate, and a recovery unit that recovers the polarizing film from which bonding with the substrate is avoided.
  • the yield can be increased.
  • the first film transporting mechanism before the polarizing film is bonded to the lower surface of the substrate by the first bonding portion, the first film transporting mechanism includes a cleaning unit for cleaning the substrate. It is preferable to transport the substrate with the short side of the substrate along the transport direction.
  • the substrate can be cleaned by the cleaning unit in a state where the long sides of the substrate are orthogonal to the substrate transport direction. That is, since the distance of the substrate along the transport direction can be reduced, the tact time required for cleaning can be further shortened. As a result, it is possible to provide a polarizing film laminating apparatus that is further excellent in production efficiency.
  • substrate with which the polarizing film was bonded by the said 2nd bonding part are provided. It is preferable.
  • the presence / absence of sticking misalignment is determined based on the inspection result of the sticking misalignment inspection apparatus, and the substrate on which the polarizing film is bonded is classified based on the determination result. It is preferable to provide a transport device.
  • inspects the foreign material in the board
  • the presence or absence of a foreign material is determined based on the inspection result by the said bonded foreign material automatic test
  • the manufacturing system of the liquid crystal display device of this invention has the bonding foreign material automatic test
  • a determination is made as to whether there is a sticking deviation and a foreign matter, and based on the determination result, a sorting and conveying device is provided that sorts the substrate on which the polarizing film is bonded. It is preferable.
  • the polarizing film bonding apparatus according to the present invention can be used in the field of bonding a polarizing film to a substrate.

Abstract

The disclosed lamination device contains: a first substrate transport mechanism (61); a nip roll that laminates a polarizing film to the bottom surface of a substrate (5) at the first substrate transport mechanism (61); an inverting mechanism (65) that inverts the substrate (5) and disposes the substrate (5) at a second substrate transport mechanism (62); the second substrate transport mechanism (62) that transports the substrate (5); and a nip roll that laminates the polarizing film to the bottom surface of the substrate (5) at the second substrate transport mechanism (62); and the substrate inverting unit (67) of the inverting mechanism (65) causes the inversion of the substrate (5) by rotating around an inversion axis (M). A pair of substrate holding units (66a, 66b) are provided linearly symmetrically with respect to the inversion axis (M) and contain a line having a 45° inclination with respect to a line that passes through the center of the substrate (5) before inversion at the first substrate transport mechanism (61) and that is perpendicular to the direction of transport of the substrate (5), and the inversion axis (M) is positioned in a plane that contains the substrate (5) before inversion at the first substrate transport mechanism (61).

Description

偏光フィルムの貼合装置およびこれを備える液晶表示装置の製造システムPolarizing film laminating apparatus and liquid crystal display manufacturing system having the same
 本発明は、偏光フィルムの貼合装置およびこれを備える液晶表示装置の製造システムに関するものである。 The present invention relates to a polarizing film laminating apparatus and a liquid crystal display manufacturing system including the same.
 従来、液晶表示装置が広く製造されている。液晶表示装置に用いられる基板(液晶パネル)には、光の透過または遮断を制御するために、偏光フィルムが貼合されることが通常である。偏光フィルムはその吸収軸が直交するように貼合されている。 Conventionally, liquid crystal display devices have been widely manufactured. In general, a polarizing film is bonded to a substrate (liquid crystal panel) used in a liquid crystal display device in order to control transmission or blocking of light. The polarizing film is bonded so that the absorption axes thereof are orthogonal.
 基板に偏光フィルムを貼合する方法としては、偏光フィルムを基板に応じたサイズにカットした後に貼合する所謂 chip to panel 方式が挙げられる。しかしながら、この方式では、基板に対して、一枚ずつ偏光フィルムを貼合するため、生産効率が低いという欠点がある。一方、他の方式として、偏光フィルムをコンベアーロールに供給し、連続的に基板に貼合する所謂 roll to panel 方式が挙げられる。当該方法によれば、高い生産効率にて貼合が可能となる。 As a method for bonding the polarizing film to the substrate, there is a so-called “chip-to-panel” method in which the polarizing film is bonded after being cut into a size corresponding to the substrate. However, this method has a disadvantage that the production efficiency is low because the polarizing films are bonded to the substrate one by one. On the other hand, as another method, there is a so-called “roll-to-panel” method in which a polarizing film is supplied to a conveyor roll and continuously bonded to a substrate. According to this method, bonding can be performed with high production efficiency.
 roll to panel 方式の例として、特許文献1に光学表示装置の製造システムが開示されている。上記製造システムは、基板の上面に光学フィルム(偏光フィルム)を貼合した後に基板を旋回させ、下面から偏光フィルムを貼合するものである。 As an example of a roll-to-panel method, Patent Document 1 discloses an optical display device manufacturing system. The said manufacturing system rotates a board | substrate after bonding an optical film (polarizing film) on the upper surface of a board | substrate, and bonds a polarizing film from a lower surface.
日本国公開特許公報「特許第4307510号公報(2009年8月5日発行)」Japanese Patent Publication “Patent No. 4307510 (issued on Aug. 5, 2009)”
 しかしながら、上記従来の装置では以下の問題がある。 However, the conventional apparatus has the following problems.
 まず、基板に対して偏光フィルムを貼合する場合、埃などの異物が貼合面へ混入することを回避するため、クリーンルームにて作業がなされるのが通常である。そして、クリーンルームでは、空気の整流がなされている。基板に対してダウンフローにて整流がなされた状態にて偏光フィルムの貼合がなされることが、異物による歩留低下を抑制するために必要だからである。 First, when a polarizing film is bonded to a substrate, the work is usually performed in a clean room in order to prevent foreign matters such as dust from entering the bonding surface. In the clean room, air is rectified. This is because it is necessary to bond the polarizing film in a state in which rectification is performed on the substrate in a downflow in order to suppress the yield reduction due to the foreign matter.
 この点に関して、特許文献1の製造システムは、基板に対して上面および下面から偏光フィルムを貼合する構成となっている。しかし、偏光フィルムの上面から貼合を行う場合、気流(ダウンフロー)が偏光フィルムによって妨げられ、基板への整流環境が悪化してしまうというデメリットが挙げられる。偏光フィルムの上面から貼合を行う場合の例として、図14(a)および図14(b)に上貼り型の製造システムにおける気流の速度ベクトルを示す。図14における、領域Aは、偏光フィルムを巻出す巻出部等が設置される領域であり、領域Bは主に偏光フィルムが通過する領域、および、領域Cは、偏光フィルムから除去された剥離フィルムを巻き取る巻取部等が設置される領域である。 In this regard, the manufacturing system of Patent Document 1 has a configuration in which a polarizing film is bonded to the substrate from the upper surface and the lower surface. However, when bonding is performed from the upper surface of the polarizing film, there is a demerit that the airflow (downflow) is hindered by the polarizing film and the rectification environment to the substrate is deteriorated. As an example of pasting from the upper surface of the polarizing film, FIGS. 14 (a) and 14 (b) show air velocity vectors in the top-paste type manufacturing system. In FIG. 14, a region A is a region where an unwinding unit and the like for unwinding the polarizing film are installed, a region B is a region through which the polarizing film mainly passes, and a region C is a peeling removed from the polarizing film. This is an area in which a take-up unit or the like for winding the film is installed.
 また、HEPA(High Efficiency Particulate Air)フィルター40からはクリーンエアーが供給される。なお、図14(a)では、クリーンエアーが通過可能なグレーチング41が設置されているためグレーチング41を介して気流が垂直方向に移動することが可能である。一方、図14(b)では、グレーチング41が設置されていないため、気流は図14(b)最下部の床に接触した後、床に沿って移動することとなる。 Also, clean air is supplied from a HEPA (High Efficiency Particulate Air) filter 40. In FIG. 14A, since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41. On the other hand, in FIG. 14B, since the grating 41 is not installed, the airflow moves along the floor after contacting the floor at the bottom of FIG. 14B.
 図14(a)・(b)には、領域A~Cが2F(2階)部分に配置されており、HEPAフィルター40からのクリーンエアーが偏光フィルムによって妨げられる。したがって、2F部分を通過する基板に対して垂直方向に向う気流が生じ難い。これに対して、水平方向の気流ベクトルは大きな(ベクトルの密度が濃い)状態となっている。すなわち、整流環境が悪化した状態であるといえる。 14A and 14B, the areas A to C are arranged on the 2F (second floor) portion, and the clean air from the HEPA filter 40 is blocked by the polarizing film. Therefore, it is difficult to generate an airflow in the vertical direction with respect to the substrate passing through the 2F portion. On the other hand, the airflow vector in the horizontal direction is large (vector density is high). That is, it can be said that the rectification environment has deteriorated.
 本発明は、上記従来の問題点に鑑みなされたものであって、その目的は、整流環境を妨げることのない偏光フィルムの貼合装置およびこれを備える液晶表示装置の製造システムを提供することにある。 This invention is made | formed in view of the said conventional problem, Comprising: The objective is to provide the manufacturing system of a polarizing film bonding apparatus and a liquid crystal display device provided with the same which do not disturb a rectification environment. is there.
 本発明の偏光フィルムの貼合装置は、上記課題を解決するために、長方形の基板を長辺または短辺が搬送方向に沿った状態にて搬送する第1基板搬送機構と、上記第1基板搬送機構における上記基板の下面に偏光フィルムを貼合する第1貼合部と、上記第1基板搬送機構にて搬送された上記基板を反転させて第2基板搬送機構に配置する反転機構と、上記基板を短辺または長辺が搬送方向に沿った状態にて搬送する第2基板搬送機構と、上記第2基板搬送機構における上記基板の下面に偏光フィルムを貼合する第2貼合部とを含む偏光フィルムの貼合装置であって、上記第1基板搬送機構および第2基板搬送機構は、基板を同一方向に搬送するものであり、第1基板搬送機構によって搬送された、長辺または短辺が搬送方向に沿った基板を、短辺または長辺が第2基板搬送機構の基板の搬送方向に沿った状態に反転させる反転機構を備え、上記反転機構は基板支持部と、上記基板支持部に連結された基板反転部とを備えており、上記基板支持部は、第1基板搬送機構によって搬送された基板を載置可能であり、さらに載置された基板を挟持可能であり、上記基板反転部は反転軸を中心として回転することによって基板を反転させるものであり、第1基板搬送機構における反転前の基板の中心を通り、上記基板の搬送方向と垂直な直線に対して45°の傾きを有する直線を含み、第1基板搬送機構における反転前の基板を含む面内に上記反転軸が位置しており、上記基板支持部は、上記反転軸に対して線対称に一対備えられている。 In order to solve the above problems, the polarizing film laminating apparatus of the present invention transports a rectangular substrate with a long side or a short side along the transport direction, and the first substrate. A first bonding unit that bonds a polarizing film to the lower surface of the substrate in the transport mechanism; a reversing mechanism that reverses the substrate transported by the first substrate transport mechanism and places the substrate in the second substrate transport mechanism; A second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction, and a second bonding unit for bonding a polarizing film to the lower surface of the substrate in the second substrate transport mechanism; The first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction, and the long side or the transported by the first substrate transport mechanism. A substrate with a short side along the transport direction A reversing mechanism for reversing a short side or a long side to a state along the substrate transport direction of the second substrate transport mechanism, wherein the reversing mechanism includes a substrate support portion and a substrate reversing portion connected to the substrate support portion. The substrate support unit can place the substrate transported by the first substrate transport mechanism, and can sandwich the placed substrate. The substrate reversing unit rotates about the reversing axis. The first substrate transport mechanism includes a straight line that passes through the center of the substrate before reversal in the first substrate transport mechanism and has a 45 ° inclination with respect to a straight line that is perpendicular to the transport direction of the substrate. The reversal axis is located in a plane including the substrate before reversal in the substrate transport mechanism, and a pair of the substrate support portions are provided in line symmetry with respect to the reversal axis.
 上記の発明によれば、第1貼合部によって基板の下面に偏光フィルムを貼合し、反転機構における基板反転部の反転軸に沿った回転によって、基板を反転させると共に、搬送方向に対する長辺および短辺を変更することができる。その後、第2貼合部によって基板の下面に偏光フィルムを貼合することができる。すなわち、基板の両面に対して、下面から偏光フィルムを貼合することができるため、整流環境を妨げることがない。また、反転機構の動作は反転軸を中心とする単純な1動作であるため、タクトタイムが短い。したがって、反転動作を含めた、タクトタイムの短い貼合を実現できる。さらに、上記第1基板搬送機構と第2基板搬送機構とは基板を同一方向に搬送するものである。すなわち、L字型形状などの複雑な構造を有していない。したがって、本発明に係る貼合装置は、設置が非常に簡便であり、面積効率に優れる。 According to said invention, while sticking a polarizing film to the lower surface of a board | substrate by the 1st bonding part and rotating along the inversion axis | shaft of the board inversion part in a inversion mechanism, while reversing a board | substrate, the long side with respect to a conveyance direction And the short side can be changed. Then, a polarizing film can be bonded to the lower surface of a board | substrate by a 2nd bonding part. That is, since a polarizing film can be bonded from the lower surface to both surfaces of the substrate, the rectifying environment is not hindered. In addition, since the operation of the reversing mechanism is a simple operation centered on the reversing axis, the tact time is short. Therefore, it is possible to realize bonding with a short tact time including a reversing operation. Further, the first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and is excellent in area efficiency.
 本発明の偏光フィルムの貼合装置は、以上のように、上記反転機構は基板支持部と、上記基板支持部に連結された基板反転部とを備えており、上記基板支持部は、第1基板搬送機構によって搬送された基板を載置可能であり、さらに載置された基板を挟持可能であり、上記基板反転部は反転軸を中心として回転することによって基板を反転させるものであり、第1基板搬送機構における反転前の基板の中心を通り、上記基板の搬送方向と垂直な直線に対して45°の傾きを有する直線を含み、第1基板搬送機構における反転前の基板を含む面内に上記反転軸が位置しており、上記基板支持部は、上記反転軸に対して線対称に一対備えられているものである。 In the polarizing film laminating apparatus of the present invention, as described above, the reversing mechanism includes a substrate support portion and a substrate reversing portion connected to the substrate support portion, and the substrate support portion is a first support. The substrate transported by the substrate transport mechanism can be placed, and the placed substrate can be sandwiched. The substrate reversing unit is configured to invert the substrate by rotating about the reversal axis. An in-plane including a straight line that passes through the center of the substrate before reversal in the one substrate transport mechanism and has an inclination of 45 ° with respect to a straight line perpendicular to the transport direction of the substrate, and includes the substrate before reversal in the first substrate transport mechanism The reversing axis is located, and a pair of the substrate support portions are provided symmetrically with respect to the reversing axis.
 それゆえ、本発明の偏光フィルムの貼合装置によれば、第1貼合部によって基板の下面に偏光フィルムを貼合し、反転機構における基板反転部の反転軸に沿った回転によって、基板を反転させると共に、搬送方向に対する長辺および短辺を変更することができる。その後、第2貼合部によって基板の下面に偏光フィルムを貼合することができる。すなわち、基板の両面に対して、下面から偏光フィルムを貼合することができるため、整流環境を妨げることがない。また、反転機構の動作は反転軸を中心とする単純な1動作であるため、タクトタイムが短い。したがって、反転動作を含めた、タクトタイムの短い貼合を実現できる。さらに、上記第1基板搬送機構と第2基板搬送機構とは基板を同一方向に搬送するものである。すなわち、L字型形状などの複雑な構造を有していない。したがって、本発明に係る貼合装置は、設置が非常に簡便であり、面積効率に優れるという効果を奏する。 Therefore, according to the polarizing film bonding apparatus of the present invention, the polarizing film is bonded to the lower surface of the substrate by the first bonding portion, and the substrate is rotated by rotation along the reversing axis of the substrate reversing portion in the reversing mechanism. While reversing, the long side and short side with respect to the conveyance direction can be changed. Then, a polarizing film can be bonded to the lower surface of a board | substrate by a 2nd bonding part. That is, since a polarizing film can be bonded from the lower surface to both surfaces of the substrate, the rectifying environment is not hindered. In addition, since the operation of the reversing mechanism is a simple operation centered on the reversing axis, the tact time is short. Therefore, it is possible to realize bonding with a short tact time including a reversing operation. Further, the first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and has an effect of being excellent in area efficiency.
 本発明の他の目的、特徴、および優れた点は、以下に示す記載によって十分分かるであろう。また、本発明の利点は、添付図面を参照した次の説明によって明白になるであろう。 Other objects, features, and superior points of the present invention will be fully understood from the following description. The advantages of the present invention will become apparent from the following description with reference to the accompanying drawings.
本発明に係る製造システムの実施の一形態を示す断面図である。It is sectional drawing which shows one Embodiment of the manufacturing system which concerns on this invention. 本発明における巻出部の変形例を示す断面図である。It is sectional drawing which shows the modification of the unwinding part in this invention. 図1の製造システムにおけるニップロールの周辺部分を示す断面図である。It is sectional drawing which shows the peripheral part of the nip roll in the manufacturing system of FIG. 本発明と同様の下貼り型の製造システムにおける気流の速度ベクトルを示す断面図である。It is sectional drawing which shows the velocity vector of the airflow in the underlay type manufacturing system similar to this invention. 本発明に係る貼合装置の変形例を示す断面図である。It is sectional drawing which shows the modification of the bonding apparatus which concerns on this invention. 本発明に係るフィルム連結部および切断機を示す斜視図である。It is a perspective view which shows the film connection part and cutting machine which concern on this invention. 本発明に係る切断貼合部を示す斜視図である。It is a perspective view which shows the cutting bonding part which concerns on this invention. 本発明に係る製造システムによる連結工程を示す工程図である。It is process drawing which shows the connection process by the manufacturing system which concerns on this invention. 本発明に係る反転機構によって基板を反転させる過程を示す斜視図である。It is a perspective view which shows the process in which a board | substrate is reversed by the inversion mechanism which concerns on this invention. 本発明に係る反転機構によって基板を反転させる過程を示す平面図である。It is a top view which shows the process in which a board | substrate is reversed by the inversion mechanism based on this invention. 反転機構の構成を示すブロック図である。It is a block diagram which shows the structure of a reversing mechanism. 本発明に係る液晶表示装置の製造システムが備える各部材の関連を示すブロック図である。It is a block diagram which shows the relationship of each member with which the manufacturing system of the liquid crystal display device which concerns on this invention is provided. 本発明に係る液晶表示装置の製造システムの動作を示すフローチャートである。It is a flowchart which shows operation | movement of the manufacturing system of the liquid crystal display device which concerns on this invention. 上貼り型の製造システムにおける気流の速度ベクトルを示す断面図である。It is sectional drawing which shows the velocity vector of the airflow in an upper sticking type manufacturing system.
 本発明の一実施形態について図1~図13に基づいて説明すれば以下の通りであるが、本発明はこれに限定されるものではない。まず、本発明に係る製造システム(液晶表示装置の製造システム)の構成について以下に説明する。製造システムは、本発明に係る貼合装置を含んでいる。 The following will describe one embodiment of the present invention with reference to FIGS. 1 to 13, but the present invention is not limited to this. First, the structure of the manufacturing system (liquid crystal display device manufacturing system) according to the present invention will be described below. The manufacturing system includes a bonding apparatus according to the present invention.
 図1は、製造システムを示す断面図である。同図に示すように、製造システム100は2段構造となっており、1F(1階)部分はフィルム搬送機構50であり、2F(2階)部分は基板搬送機構(第1基板搬送機構および第2基板搬送機構)を含む貼合装置60となっている。 FIG. 1 is a cross-sectional view showing a manufacturing system. As shown in the figure, the manufacturing system 100 has a two-stage structure, the 1F (first floor) portion is a film transport mechanism 50, and the 2F (second floor) portion is a substrate transport mechanism (first substrate transport mechanism and It becomes the bonding apparatus 60 containing a 2nd board | substrate conveyance mechanism).
 <フィルム搬送機構>
 まず、フィルム搬送機構50について説明する。フィルム搬送機構50は、偏光フィルム(偏光板)を巻出してニップロール6・6aおよび16・16aまで搬送し、不要となった剥離フィルムを巻き取る役割を果たす。一方、貼合装置60はフィルム搬送機構50によって巻出された偏光フィルムを基板(液晶パネル)5に対して貼合する役割を果たすものである。
<Film transport mechanism>
First, the film transport mechanism 50 will be described. The film transport mechanism 50 plays the role of unwinding the polarizing film (polarizing plate) and transporting it to the nip rolls 6 · 6a and 16 · 16a and winding up the peeling film that is no longer needed. On the other hand, the bonding device 60 plays a role of bonding the polarizing film unwound by the film transport mechanism 50 to the substrate (liquid crystal panel) 5.
 フィルム搬送機構50は、第1フィルム搬送機構51および第2フィルム搬送機構52を備えている。第1フィルム搬送機構51は、基板5の下面に最初に偏光フィルムを貼合するニップロール6・6aに偏光フィルムを搬送するものである。なお、基板5は長方形形状を有している。一方、第2フィルム搬送機構52は、反転された基板5の下面に偏光フィルムを搬送するものである。 The film transport mechanism 50 includes a first film transport mechanism 51 and a second film transport mechanism 52. The 1st film conveyance mechanism 51 conveys a polarizing film to the nip roll 6 * 6a which bonds a polarizing film to the lower surface of the board | substrate 5 first. The substrate 5 has a rectangular shape. On the other hand, the second film transport mechanism 52 transports the polarizing film to the bottom surface of the inverted substrate 5.
 第1フィルム搬送機構51は、第1巻出部1、第2巻出部1a、第1巻取部2、第2巻取部2a、ハーフカッター3、ナイフエッジ4、および欠点フィルム巻取ローラー7・7aを備えている。第1巻出部1には偏光フィルムの原反が設置されており、偏光フィルムが巻出される。上記偏光フィルムとしては公知の偏光フィルムを用いればよい。具体的には、ポリビニルアルコールフィルムにヨウ素等によって染色がなされており、1軸方向に延伸されたフィルム等を用いることができる。上記偏光フィルムの厚さとしては、特に限定されないが、5μm以上、400μm以下の偏光フィルムを好ましく用いることができる。 The first film transport mechanism 51 includes a first unwinding unit 1, a second unwinding unit 1a, a first winding unit 2, a second winding unit 2a, a half cutter 3, a knife edge 4, and a defect film winding roller. 7 · 7a. The first unwinding unit 1 is provided with a polarizing film original, and the polarizing film is unwound. A known polarizing film may be used as the polarizing film. Specifically, a polyvinyl alcohol film is dyed with iodine or the like, and a film stretched in a uniaxial direction can be used. Although it does not specifically limit as thickness of the said polarizing film, A polarizing film 5 micrometers or more and 400 micrometers or less can be used preferably.
 上記偏光フィルムの原反では、流れ方向(MD方向)に吸収軸の方向が位置している。上記偏光フィルムは剥離フィルムによって粘着剤層が保護されている。上記剥離フィルム(保護フィルムまたはセパレーターともいう)としては、ポリエステルフィルム、ポリエチレンテレフタラートフィルムなどを用いることができる。上記剥離フィルムの厚さとしては、特に限定されないが、5μm以上、100μm以下の剥離フィルムを好ましく用いることができる。 In the original film of the polarizing film, the direction of the absorption axis is located in the flow direction (MD direction). The polarizing film has a pressure-sensitive adhesive layer protected by a release film. As the release film (also referred to as a protective film or a separator), a polyester film, a polyethylene terephthalate film, or the like can be used. Although it does not specifically limit as thickness of the said peeling film, The peeling film of 5 micrometers or more and 100 micrometers or less can be used preferably.
 製造システム100には、巻出部が2つ、巻出部に対応する巻取部が2つ備えられているため、第1巻出部1の原反の残量が少なくなった場合、第2巻出部1aに備えられた原反を第1巻出部1の原反に連結させることが可能である。その結果、偏光フィルムの巻出しを停止させることなく、作業を続行することが可能である。本構成により、生産効率を高めることができる。なお、上記巻出部および巻取部はそれぞれ複数備えられていればよく、3つ以上備えられていてももちろんよい。 Since the manufacturing system 100 includes two unwinding portions and two unwinding portions corresponding to the unwinding portions, the first unwinding portion 1 has a low remaining amount of raw material. It is possible to connect the original fabric provided in the two unwinding portions 1 a to the original fabric of the first unwinding portion 1. As a result, it is possible to continue the operation without stopping the unwinding of the polarizing film. With this configuration, production efficiency can be increased. Of course, a plurality of unwinding sections and winding sections may be provided, and three or more winding sections may be provided.
 図1に示す第1巻出部1・第2巻出部1aは、ターレットにより互いの位置を入れ替えることが可能な構造となっている。位置が入れ替わる際には、第1巻出部1・第2巻出部1aが円の軌道を描きながら移動し、自動的に第1巻出部1の偏光フィルムを切断した後、第2巻出部1aの偏光フィルムとを自動的に連結することができる。第1巻出部11・第2巻出部11aも同様である。また、第1巻取部2・第2巻取部2a・第1巻取部12・第2巻取部12aについてもターレットにより回転する構造となっている。ターレットによる当該構造によれば、巻出部同士または巻取部同士を容易に入れ替えることができ、偏光フィルム同士の連結を容易に行える点で優れている。 The 1st unwinding part 1 and the 2nd unwinding part 1a shown in FIG. 1 have a structure which can replace a mutual position with a turret. When the positions are switched, the first unwinding portion 1 and the second unwinding portion 1a move while drawing a circular trajectory, automatically cut the polarizing film of the first unwinding portion 1, and then the second winding. The polarizing film of the protruding portion 1a can be automatically connected. The same applies to the first unwinding part 11 and the second unwinding part 11a. Further, the first winding unit 2, the second winding unit 2a, the first winding unit 12, and the second winding unit 12a are also configured to rotate by a turret. According to the structure of the turret, the unwinding portions or the winding portions can be easily replaced with each other, and it is excellent in that the polarizing films can be easily connected.
 また、巻出部および巻取部の変形例として図2に示す構造が挙げられる。図2の第1巻出部1b・第2巻出部1cは偏光フィルムの巻芯1dの方向に対して水平に沿って移動可能な構造となっている。換言すると、第1巻出部1b・第2巻出部1cは、偏光フィルムの幅方向に移動可能な構造となっている。具体的には、図2の右部に示すように、巻芯1dに沿った両方向の少なくとも一方に移動可能な構となっている(図面奥側方向(○中に×のマーク)および図面手前側方向(○中に・のマーク)の少なくとも一方に移動可能)。また、第1巻出部1b・第2巻出部1cは互いに並設されている。 Moreover, the structure shown in FIG. 2 is mentioned as a modification of an unwinding part and a winding part. The 1st unwinding part 1b and the 2nd unwinding part 1c of FIG. 2 have a structure which can move along a horizontal with respect to the direction of the core 1d of a polarizing film. In other words, the 1st unwinding part 1b and the 2nd unwinding part 1c have a structure which can move to the width direction of a polarizing film. Specifically, as shown in the right part of FIG. 2, the structure is movable in at least one of both directions along the core 1d (the back side direction in the drawing (marked with a cross in the circle) and the front side of the drawing. It can move in at least one of the lateral directions (marked with a circle in the circle). Moreover, the 1st unwinding part 1b and the 2nd unwinding part 1c are arranged mutually in parallel.
 本構成によれば、偏光フィルムのロールを交換する場合、巻芯1dの方向に水平に移動された第1巻出部1bまたは第2巻出部1cに対して新たな偏光フィルムのロールを設置することができる。したがって、ターレットを有する構成とは異なり、第1巻出部1b・第2巻出部1cは上方に向かって移動しない。 According to this structure, when exchanging the polarizing film roll, a new polarizing film roll is installed on the first unwinding section 1b or the second unwinding section 1c moved in the direction of the core 1d. can do. Therefore, unlike the configuration having a turret, the first unwinding portion 1b and the second unwinding portion 1c do not move upward.
 図2に示すように第1巻出部1b・第2巻出部1cの上部に貼合装置60が備えられているが、本構造によれば、第1巻出部1b・第2巻出部1cは巻芯1dの方向に水平に移動する構造であるため、巻出部が上方へ移動する空間を確保する必要がない。したがって、上部に備えられたコンベアーロール15と巻出部との空間を省スペースとすることができる。その結果、小型化された貼合装置、ひいては製造システムを提供することができる。本願発明は、このような小型化が達成できる点でターレットを有する従来の製造システムと大きく異なっている。ターレットを有する製造システムは、例えば、特開平8-208083号公報に開示されている。 As shown in FIG. 2, the bonding device 60 is provided on the upper part of the first unwinding portion 1b and the second unwinding portion 1c. According to this structure, the first unwinding portion 1b and the second unwinding portion are provided. Since the portion 1c is structured to move horizontally in the direction of the core 1d, it is not necessary to secure a space for the unwinding portion to move upward. Therefore, the space between the conveyor roll 15 provided at the upper portion and the unwinding portion can be saved. As a result, it is possible to provide a downsized bonding apparatus, and thus a manufacturing system. The present invention is greatly different from a conventional manufacturing system having a turret in that such downsizing can be achieved. A manufacturing system having a turret is disclosed, for example, in Japanese Patent Laid-Open No. Hei 8-208083.
 なお、第1巻出部1bに備えられた偏光フィルムのロール残量が少なくなった場合、オペレーターにより第2巻出部1cの偏光フィルムと連結を行う。この場合、偏光フィルムの搬送速度を0m/min.とした後に、オペレーターが第1巻出部1b側の偏光フィルムを切断する。次に、第2巻出部1cから偏光フィルムを巻き出し、端部を切断した後に、例えば、片面粘着テープを用いて偏光フィルム同士を連結する。 In addition, when the roll remaining amount of the polarizing film provided in the 1st unwinding part 1b decreases, it connects with the polarizing film of the 2nd unwinding part 1c by an operator. In this case, the conveyance speed of the polarizing film is 0 m / min. Then, the operator cuts the polarizing film on the first unwinding portion 1b side. Next, after unwinding a polarizing film from the 2nd unwinding part 1c and cut | disconnecting an edge part, polarizing films are connected using a single-sided adhesive tape, for example.
 また、図1の第1巻取部2・第2巻取部2a・第1巻取部12・第2巻取部12aに関しても、図2の巻出部と同様に、剥離フィルムの巻芯の方向に対して水平に移動可能な構造とすることができる。また、第1巻出部2と第2巻出部2aとが並設されている点も同様である。さらに、巻取部についても当該構成(第1巻取部・第2巻取部が剥離フィルムの巻芯の方向に対して水平に移動可能な構造であり、第1巻取部と第2巻取部とが並設されている構成)とすることによって、コンベアーロール15と巻取部との空間を省スペースとすることができ、より小型化された貼合装置、ひいては製造システムを提供することが可能である。 Further, with respect to the first winding unit 2, the second winding unit 2a, the first winding unit 12 and the second winding unit 12a in FIG. 1, as in the unwinding unit in FIG. It can be set as the structure which can move horizontally with respect to this direction. Moreover, the point that the 1st unwinding part 2 and the 2nd unwinding part 2a are arranged in parallel is also the same. Furthermore, the structure of the winding unit (the first winding unit and the second winding unit can move horizontally with respect to the direction of the core of the release film, and the first winding unit and the second winding unit). By adopting a configuration in which the take-up part is arranged in parallel, the space between the conveyor roll 15 and the take-up part can be saved, and a more compact bonding apparatus and thus a manufacturing system is provided. It is possible.
 ハーフカッター(切断部)3は、剥離フィルムに保護された偏光フィルム(偏光フィルム、粘着剤層および剥離フィルムから構成されるフィルム積層体)をハーフカットし、偏光フィルムおよび粘着剤層を切断する。ハーフカッター3としては、公知の部材を用いればよい。具体的には、刃物、レーザカッターなどを挙げることができる。ハーフカッター3によって偏光フィルムおよび粘着剤層が切断された後に、ナイフエッジ(除去部)4によって剥離フィルムが偏光フィルムから除去される。 Half cutter (cutting unit) 3 half-cuts a polarizing film (a film laminate composed of a polarizing film, a pressure-sensitive adhesive layer and a peeling film) protected by a peeling film, and cuts the polarizing film and the pressure-sensitive adhesive layer. As the half cutter 3, a known member may be used. Specifically, a cutter, a laser cutter, etc. can be mentioned. After the polarizing film and the pressure-sensitive adhesive layer are cut by the half cutter 3, the release film is removed from the polarizing film by the knife edge (removal part) 4.
 偏光フィルムと剥離フィルムとの間には粘着剤層が塗布されており、剥離フィルムが除去された後、粘着剤層は偏光フィルム側に残存する。上記粘着剤層としては、特に限定されるものではなく、アクリル系、エポキシ系、ポリウレタン系などの粘着剤層を挙げることができる。粘着剤層の厚さは特に制限されないが、通常5~40μmである。 An adhesive layer is applied between the polarizing film and the release film. After the release film is removed, the adhesive layer remains on the polarizing film side. The pressure-sensitive adhesive layer is not particularly limited, and examples thereof include acrylic, epoxy, and polyurethane pressure-sensitive adhesive layers. The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually 5 to 40 μm.
 一方、第2フィルム搬送機構52は、第1フィルム搬送機構51と同様の構成であり、第1巻出部11、第2巻出部11a、第1巻取部12、第2巻取部12a、ハーフカッター13、ナイフエッジ14および欠点フィルム巻取ローラー17・17aを備えている。同一の部材名を付した部材については第1フィルム搬送機構51における部材と同一の作用を示す。 On the other hand, the 2nd film conveyance mechanism 52 is the structure similar to the 1st film conveyance mechanism 51, and is the 1st unwinding part 11, the 2nd unwinding part 11a, the 1st winding part 12, and the 2nd winding part 12a. , Half cutter 13, knife edge 14 and defect film winding rollers 17 and 17 a. About the member which attached | subjected the same member name, the effect | action same as the member in the 1st film conveyance mechanism 51 is shown.
 好ましい形態として製造システム100は、洗浄部71を備えている。洗浄部71はニップロール6・6aによって基板5の下面に偏光フィルムを貼合する前に、基板5を洗浄するものである。洗浄部71としては、洗浄液を噴射するノズルおよびブラシなどから構成される公知の洗浄部を用いればよい。洗浄部71によって貼合の直前に基板5を洗浄することによって、基板5の付着異物が少ない状態にて貼合を行うことができる。 As a preferred embodiment, the manufacturing system 100 includes a cleaning unit 71. The cleaning unit 71 cleans the substrate 5 before the polarizing film is bonded to the lower surface of the substrate 5 by the nip rolls 6 and 6a. As the cleaning unit 71, a known cleaning unit composed of a nozzle and a brush for injecting a cleaning liquid may be used. By cleaning the substrate 5 immediately before the bonding by the cleaning unit 71, the bonding can be performed in a state where there are few adhered foreign substances on the substrate 5.
 次に、図3を用いて、ナイフエッジ4について説明する。図3は、製造システム100におけるニップロール6・6aの周辺部分を示す断面図である。図3は、基板5が左方向から搬送され、左下方向から粘着剤層を有する(図示せず、以降同じ)偏光フィルム10aが搬送される状況を示している。偏光フィルム10aには剥離フィルム10bが備えられており、ハーフカッター3によって偏光フィルム10aおよび粘着剤層が切断され、剥離フィルム10bは切断されていない(ハーフカット)。 Next, the knife edge 4 will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a peripheral portion of the nip rolls 6 and 6a in the manufacturing system 100. FIG. FIG. 3 shows a situation in which the substrate 5 is transported from the left direction and the polarizing film 10a having an adhesive layer (not shown, the same hereinafter) is transported from the lower left direction. The polarizing film 10a is provided with a release film 10b, and the polarizing film 10a and the pressure-sensitive adhesive layer are cut by the half cutter 3, and the release film 10b is not cut (half cut).
 剥離フィルム10b側には、ナイフエッジ4が設置されている。ナイフエッジ4は、剥離フィルム10bを剥離させるためのエッジ状部材であり、偏光フィルム10aと接着力が低い剥離フィルム10bがナイフエッジ4を伝って剥離されることとなる。 The knife edge 4 is installed on the peeling film 10b side. The knife edge 4 is an edge-shaped member for peeling the peeling film 10 b, and the polarizing film 10 a and the peeling film 10 b having a low adhesive force are peeled off along the knife edge 4.
 その後、剥離フィルム10bは、図1の第1巻取部2に巻き取られることとなる。なお、ナイフエッジに代えて、粘着ローラーを用いて剥離フィルムを巻き取る構成を用いることも可能である。その場合、巻取部と同様に、粘着ローラーを2箇所に備えることによって、剥離フィルムの巻取効率を高めることができる。 Thereafter, the release film 10b is wound around the first winding portion 2 of FIG. In addition, it can replace with a knife edge and can also use the structure which winds up a peeling film using an adhesion roller. In that case, the winding efficiency of a peeling film can be improved by providing an adhesive roller in two places similarly to a winding part.
 <貼合装置>
 次に、貼合装置60について説明する。貼合装置60は基板5を搬送し、フィルム搬送機構50によって搬送された偏光フィルムを基板に貼合するものである。図示しないが、貼合装置60では基板5の上面に対して、クリーンエアーが供給されている。すなわち、ダウンフローの整流が行われている。これによって、基板5の搬送および貼合を安定した状態にて行うことが可能である。
<Bonding device>
Next, the bonding apparatus 60 will be described. The bonding apparatus 60 conveys the board | substrate 5, and bonds the polarizing film conveyed by the film conveyance mechanism 50 to a board | substrate. Although not shown, clean air is supplied to the upper surface of the substrate 5 in the bonding apparatus 60. That is, downflow rectification is performed. Thereby, it is possible to perform conveyance and bonding of the substrate 5 in a stable state.
 貼合装置60はフィルム搬送機構50の上部に備えられている。これにより、製造システム100の省スペース化を図ることができる。図示しないが、貼合装置60にはコンベアーロールを備える基板搬送機構が設置されており、これにより基板5が搬送方向へ搬送される(図10にて後述する第1基板搬送機構61・第2基板搬送機構62が基板搬送機構に該当する)。 The bonding apparatus 60 is provided on the upper part of the film transport mechanism 50. Thereby, space saving of the manufacturing system 100 can be achieved. Although not shown, a substrate transport mechanism including a conveyor roll is installed in the laminating apparatus 60, whereby the substrate 5 is transported in the transport direction (first substrate transport mechanism 61 and second described later in FIG. 10). The substrate transport mechanism 62 corresponds to the substrate transport mechanism).
 製造システム100では、左側から基板5が搬送され、その後、図中右側、つまり、第1フィルム搬送機構51の上部から第2フィルム搬送機構52の上部へと搬送される。フィルム搬送機構50と貼合装置60との間には、貼合部であるニップロール6・6a(第1貼合部)およびニップロール16・16a(第2貼合部)がそれぞれ備えられている。ニップロール6・6aおよび16・16aは、基板5の下面に剥離フィルムが除去された偏光フィルムを貼合わせる役割を果たす部材である。なお、基板5の両面には下面から偏光フィルムが貼合されるため、ニップロール6・6aにて貼合された後に、基板5は反転機構65によって反転される。反転機構65については後述する。 In the manufacturing system 100, the substrate 5 is transported from the left side, and then transported from the right side in the drawing, that is, from the top of the first film transport mechanism 51 to the top of the second film transport mechanism 52. Between the film conveyance mechanism 50 and the bonding apparatus 60, the nip rolls 6 * 6a (1st bonding part) and the nip rolls 16 * 16a (2nd bonding part) which are bonding parts are each provided. The nip rolls 6, 6 a and 16, 16 a are members that serve to bond the polarizing film from which the release film has been removed to the lower surface of the substrate 5. In addition, since a polarizing film is bonded to both surfaces of the substrate 5 from the lower surface, the substrate 5 is reversed by the reversing mechanism 65 after being bonded by the nip rolls 6 and 6a. The reversing mechanism 65 will be described later.
 ニップロール6・6aへ搬送された偏光フィルムは、粘着剤層を介して基板5の下面に貼合される。ニップロール6・6aとしては、それぞれ圧着ロール、加圧ロールなどの公知の構成を採用することができる。また、ニップロール6・6aにおける貼合時の圧力および温度は適宜調整すればよい。ニップロール16・16aの構成も同様である。なお、図示しないが、製造システム100では、好ましい構成として、第1巻出部1・11からハーフカッターまでの間に欠点表示(マーク)検出部が備えられており、欠点を有する偏光フィルムが検出される構成となっている。 The polarizing film conveyed to the nip rolls 6 and 6a is bonded to the lower surface of the substrate 5 through an adhesive layer. As the nip rolls 6 and 6a, known configurations such as a pressure roll and a pressure roll can be employed. Moreover, what is necessary is just to adjust the pressure and temperature at the time of bonding in the nip rolls 6 and 6a suitably. The configuration of the nip rolls 16 and 16a is the same. Although not shown, in the manufacturing system 100, as a preferable configuration, a defect display (mark) detection unit is provided between the first unwinding units 1 and 11 and the half cutter, and a polarizing film having a defect is detected. It becomes the composition which is done.
 なお、上記欠点表示は、偏光フィルムの原反作成時に検出を行って欠点表示を付与する、または、欠点表示検出部よりも第1巻出部1および/または第1巻出部11側に備えられた欠点表示付与部によって偏光フィルムに付される。欠点表示付与部は、カメラ、画像処理装置および欠点表示形成部によって構成されている。まず、上記カメラによって偏光フィルムの撮影がなされ、当該撮影情報を処理することによって、欠点の有無を検査することができる。上記欠点としては、具体的には、埃などの異物、フィッシュアイなどが挙げられる。欠点が検出された場合、欠点表示形成部によって偏光フィルムに欠点表示が形成される。欠点表示としてはインクなどのマークが用いられる。 In addition, the said defect display is provided at the time of the 1st unwinding part 1 and / or the 1st unwinding part 11 side rather than a defect display detection part by detecting at the time of the original production of a polarizing film, and providing a defect display. It attaches | subjects to a polarizing film by the produced defect display provision part. The defect display imparting unit includes a camera, an image processing device, and a defect display forming unit. First, a polarizing film is imaged by the camera, and the presence or absence of a defect can be inspected by processing the imaging information. Specific examples of the drawback include foreign matters such as dust and fish eyes. When a defect is detected, a defect display is formed on the polarizing film by the defect display forming unit. A mark such as ink is used as the defect display.
 さらに、図示しない貼合回避部は、上記マークをカメラにより判別して、貼合装置60に停止信号を送信して基板5の搬送を停止させる。その後、欠点が検出された偏光フィルムは、ニップロール6・6aによって貼合に用いられず、欠点フィルム巻取ローラー(回収部)7・7aにて巻き取られる。これにより、基板5と、欠点を有する偏光フィルムとの貼合わせを回避することができる。当該一連の構成が備えられていれば、欠点を有する偏光フィルムと基板5との貼合わせを回避できるため、歩留まりを高めることができ好ましい。欠点検出部および貼合回避部としては、公知の検査センサーを適宜用いることができる。 Further, a bonding avoiding unit (not shown) discriminates the mark with a camera and transmits a stop signal to the bonding apparatus 60 to stop the conveyance of the substrate 5. Thereafter, the polarizing film in which the defect is detected is not used for pasting by the nip rolls 6 and 6a, and is wound by the defect film winding roller (collecting unit) 7 and 7a. Thereby, pasting with substrate 5 and a polarizing film which has a fault can be avoided. If such a series of structures is provided, it is possible to avoid the bonding between the polarizing film having a defect and the substrate 5, so that the yield can be increased, which is preferable. A publicly known inspection sensor can be used suitably as a fault detection part and a pasting avoidance part.
 図1に示すように、反転機構65によって基板5が反転状態となった後、基板5はニップロール16・16aに搬送される。そして、基板5の下面に偏光フィルムが貼合される。その結果、基板5の両面に偏光フィルムが貼合わされることとなり、基板5の両面に2枚の偏光フィルムが互いに異なる吸収軸にて貼合された状態となる。その後、必要に応じて、貼りずれが生じていないか、基板5の両面について検査がなされる。当該検査は、通常、カメラを備える検査部等によってなされる構成を採用することができる。 As shown in FIG. 1, after the substrate 5 is reversed by the reversing mechanism 65, the substrate 5 is conveyed to the nip rolls 16 and 16a. Then, a polarizing film is bonded to the lower surface of the substrate 5. As a result, the polarizing film is bonded to both surfaces of the substrate 5, and the two polarizing films are bonded to both surfaces of the substrate 5 with different absorption axes. Thereafter, if necessary, the both sides of the substrate 5 are inspected for misalignment. For the inspection, it is possible to adopt a configuration that is usually made by an inspection unit equipped with a camera.
 このように製造システム100では、基板5へ偏光フィルムを貼合わせる際、基板5の下面から貼合を行う構成となっており、基板5への整流環境を妨げることがない。このため、基板5の貼合面への異物混入も防止することができ、より正確な貼合わせが可能となる。 Thus, in the manufacturing system 100, when the polarizing film is bonded to the substrate 5, the bonding is performed from the lower surface of the substrate 5, and the rectifying environment to the substrate 5 is not hindered. For this reason, foreign matter mixing into the bonding surface of the substrate 5 can also be prevented, and more accurate bonding becomes possible.
 図4(a)および図4(b)に本発明と同様の下貼り型の製造システムにおける気流の速度ベクトルを示す。図4(a)・(b)における領域Aは巻出部が設置される領域であり、領域Bは主に偏光フィルムが通過する領域、および、領域Cは巻取部等が設置される領域である。また、HEPAフィルター40からはクリーンエアーが供給される。なお、図4(a)では、クリーンエアーが通過可能なグレーチング41が設置されているため、グレーチング41を介して、気流が垂直方向に移動することが可能である。一方、図4(b)では、グレーチング41が設置されていないため、気流は床に接触した後、床に沿って移動することとなる。 FIG. 4 (a) and FIG. 4 (b) show the velocity vector of the airflow in the under-paste type manufacturing system similar to the present invention. 4A and 4B, the area A is an area where the unwinding part is installed, the area B is an area where the polarizing film mainly passes, and the area C is an area where the winding part is installed. It is. Further, clean air is supplied from the HEPA filter 40. In FIG. 4A, since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41. On the other hand, in FIG.4 (b), since the grating 41 is not installed, after an airflow contacts a floor, it will move along a floor.
 図4(a)・(b)に示す製造システムは下貼り型であるため、図14(a)・(b)で示したように、偏光フィルムによってHEPAフィルター40からの気流が妨げられない。このため、気流ベクトルの方向はほとんど基板に向う方向となっており、クリーンルームにて好ましい整流環境が実現されているといえる。図4(a)では、グレーチング41が設置され、図4(b)では設置されていないが、両図とも同様の好ましい状態が示されている。なお、図4および図14では、基板搬送機構は水平に形成されているが、一連の構造としては設置されていない。このため、基板搬送機構間を気流が通過可能な構成となっている。基板は後述する反転機構によって保持された後、基板搬送機構間を移送される構成となっている。 Since the manufacturing system shown in FIGS. 4 (a) and 4 (b) is a bottom-attached type, the air current from the HEPA filter 40 is not hindered by the polarizing film as shown in FIGS. 14 (a) and 14 (b). For this reason, the direction of the airflow vector is almost directed toward the substrate, and it can be said that a preferable rectification environment is realized in the clean room. In FIG. 4A, the grating 41 is installed and not installed in FIG. 4B, but the same preferable state is shown in both figures. In FIGS. 4 and 14, the substrate transport mechanism is formed horizontally, but is not installed as a series of structures. For this reason, the airflow can pass between the substrate transport mechanisms. After the substrate is held by a reversing mechanism to be described later, the substrate is transferred between the substrate transport mechanisms.
 また、製造システム100では、まず、基板5を長辺間口(長辺が搬送方向と直交する)にて搬送し、その後、短辺間口(短辺が搬送方向と直交する)にて搬送する構成となっている。 Moreover, in the manufacturing system 100, the board | substrate 5 is first conveyed by a long side opening (a long side is orthogonal to a conveyance direction), and is conveyed by a short side opening (a short side is orthogonal to a conveyance direction) after that. It has become.
 〔フィルム連結部の構成〕
 さらに、本発明に係る貼合装置のさらなる変形例について説明する。図5は本発明に係る貼合装置60の変形例を示す断面図である。図5に係る第1フィルム搬送機構51における第1巻出部1b・第2巻出部1cは、図2と同様に偏光フィルムの巻芯1dの方向に対して水平に沿って移動可能な構造となっている。
[Structure of film connecting part]
Furthermore, the further modification of the bonding apparatus which concerns on this invention is demonstrated. FIG. 5 is a cross-sectional view showing a modification of the bonding apparatus 60 according to the present invention. The 1st unwinding part 1b and the 2nd unwinding part 1c in the 1st film conveyance mechanism 51 which concern on FIG. 5 are the structures which can move along a horizontal with respect to the direction of the core 1d of a polarizing film similarly to FIG. It has become.
 第1フィルム搬送機構51は、フィルム連結部(第1フィルム連結部)83およびフィルム連結部(第2フィルム連結部)93を備えており、これらにより偏光フィルム10・20の連結を行うことができる。 The 1st film conveyance mechanism 51 is provided with the film connection part (1st film connection part) 83 and the film connection part (2nd film connection part) 93, and can connect the polarizing films 10 and 20 by these. .
 図6は、フィルム連結部83および切断機87を示す斜視図である。図6に示すように、フィルム連結部83は、吸着部84・84aおよび切断貼合部85を備えている。 FIG. 6 is a perspective view showing the film connecting portion 83 and the cutting machine 87. As shown in FIG. 6, the film connecting portion 83 includes suction portions 84 and 84 a and a cutting and bonding portion 85.
 吸着部84・84aは、偏光フィルムを吸着して固定するための部材である。吸着部84・84aは、平板形状を有しており、その表面に複数の吸着機構89を備えている。吸着機構89は偏光フィルムを吸着することができれば特に限定されるものではなく、ポンプによって空気を吸引して偏光フィルムを吸着する構成を採用することができる。 The adsorption portions 84 and 84a are members for adsorbing and fixing the polarizing film. The suction portions 84 and 84a have a flat plate shape and include a plurality of suction mechanisms 89 on the surface thereof. The adsorption mechanism 89 is not particularly limited as long as the polarizing film can be adsorbed, and a configuration in which the polarizing film is adsorbed by sucking air with a pump can be adopted.
 切断貼合部85は回転可能であり、複数面を有する。具体的には、切断貼合部85は多角形形状を有している。また、回転可能に配置されている。さらに、好ましい形態として、偏光フィルム10に対して垂直方向に移動可能となっている。偏光フィルム10に対して垂直方向に移動可能であることによって、切断貼合部85が回転する際、切断貼合部85は偏光フィルム10に対して垂直方向であって、偏光フィルム10から遠ざかる方向に移動でき、その後、回転することができる。その後、切断貼合部85は偏光フィルム10に対して垂直方向であって、偏光フィルム10に近接する方向に移動して元の位置に戻ることができる。これにより、切断貼合部85の角部(貼合面85bと貼合面85cとの間に隣接する狭面を含む部分)が偏光フィルム10に接触することを確実に回避することが可能であり、非常に好ましい。 The cutting and bonding part 85 is rotatable and has a plurality of surfaces. Specifically, the cut bonding part 85 has a polygonal shape. Moreover, it arrange | positions so that rotation is possible. Furthermore, as a preferable form, it is movable in the vertical direction with respect to the polarizing film 10. By being movable in the vertical direction with respect to the polarizing film 10, when the cutting and bonding unit 85 rotates, the cutting and bonding unit 85 is in a direction perpendicular to the polarizing film 10 and away from the polarizing film 10. Can then be moved and then rotated. Thereafter, the cutting and bonding part 85 is in a direction perpendicular to the polarizing film 10 and can be moved in a direction close to the polarizing film 10 to return to the original position. Thereby, it is possible to avoid reliably that the corner | angular part (part containing the narrow surface adjacent between the bonding surface 85b and the bonding surface 85c) of the cutting bonding part 85 contacts the polarizing film 10. FIG. Yes, very preferable.
 なお、切断貼合部85は多角形形状であり、図7にも示すように、その3面に切断支持面85a、貼合面85b・85cを備えているが、切断支持面および/または貼合面をさらに備えていてもよい。例えば、切断支持面を1面に、貼合面を3面または4面に備えている構成および切断支持面を2面に、貼合面を3面または4面に備えている構成を挙げることができる。なお、図6の切断貼合部85のように、貼合面間および切断支持面・貼合面間が面取りされており、角部が形成されていれば、切断貼合部85と偏光フィルムとの接触を回避できる観点から好ましい。切断貼合部85の大きさは、偏光フィルム10の幅によって適宜決定すればよく、特に限定されるものではないが、例えば、200mm以上、2000mm以下の長さ、10mm以上、300mm以下の幅とすることができる。 In addition, although the cutting | lamination bonding part 85 is a polygonal shape and is also provided with the cutting | disconnection support surface 85a and the bonding surfaces 85b * 85c in 3 surfaces as shown also in FIG. A mating surface may be further provided. For example, a configuration in which the cutting support surface is provided on one surface, a bonding surface is provided on three or four surfaces, and a cutting support surface is provided on two surfaces, and a configuration in which a bonding surface is provided on three or four surfaces are given. Can do. In addition, like the cut bonding part 85 of FIG. 6, between the bonding surfaces and between the cutting support surface and the bonding surface are chamfered, and the corner part is formed, the cutting bonding part 85 and the polarizing film. It is preferable from the viewpoint of avoiding contact with. The size of the cut and bonded portion 85 may be appropriately determined depending on the width of the polarizing film 10 and is not particularly limited. For example, the length is 200 mm or more and 2000 mm or less, and the width is 10 mm or more and 300 mm or less. can do.
 図7は切断貼合部85を示す斜視図である。図7は、図6の切断貼合部85を時計回りに1/3周回転させた状態を示している。図7に示すように、切断貼合部85は、偏光フィルム10の幅方向に沿って偏光フィルム10を支持する切断支持面85aを備えている。また、切断された偏光フィルム10の切断線を覆うように偏光フィルム10・20を連結する連結材を吸着する吸着機構89を備える貼合面85b・85cを有している。貼合面は2以上備えられた構成とすることもできる。 FIG. 7 is a perspective view showing the cutting and bonding part 85. FIG. 7 shows a state in which the cutting and bonding portion 85 of FIG. 6 is rotated by 1/3 turn clockwise. As shown in FIG. 7, the cutting and bonding unit 85 includes a cutting support surface 85 a that supports the polarizing film 10 along the width direction of the polarizing film 10. Moreover, it has the bonding surfaces 85b and 85c provided with the adsorption | suction mechanism 89 which adsorb | sucks the connection material which connects the polarizing films 10 and 20 so that the cutting line of the cut | disconnected polarizing film 10 may be covered. Two or more bonding surfaces may be provided.
 切断支持面85aには溝状の開口86が形成されており、図6に示す切断貼合部85が備える切断機87の刃の部分が通過できる構造となっている。開口86が形成されていることによって、切断機87の通過を、偏光フィルム10の幅方向に沿って確実に行うことができ、偏光フィルム10・20の連結をより正確に行うことができる。 A groove-shaped opening 86 is formed in the cutting support surface 85a, and the blade portion of the cutting machine 87 provided in the cutting bonding portion 85 shown in FIG. By forming the opening 86, the cutting machine 87 can be reliably passed along the width direction of the polarizing film 10, and the polarizing films 10 and 20 can be more accurately connected.
 切断機87は公知のカッターを採用することができ、偏光フィルム10を容易に切断できることから、丸刃状であることが好ましい。また、切断機87は偏光フィルム10の幅方向に駆動可能な台部88によって支持されている。 As the cutting machine 87, a known cutter can be adopted, and the polarizing film 10 can be easily cut. Further, the cutting machine 87 is supported by a base portion 88 that can be driven in the width direction of the polarizing film 10.
 貼合面85b・85cは互いに同様の構成であり、吸着部84・84aと同様に複数の吸着機構89を備えている。また、貼合面85b・85cには片面粘着テープ(連結材)85dが配置されており、片面粘着テープ85dの非粘着面が吸着機構89によって保持され、片面粘着テープ85dの粘着面が貼合面85b・85cと反対面となるように配置されている。 The bonding surfaces 85b and 85c have the same configuration as each other, and include a plurality of suction mechanisms 89 in the same manner as the suction portions 84 and 84a. Moreover, the single-sided adhesive tape (connection material) 85d is arrange | positioned at the bonding surfaces 85b and 85c, the non-adhesive surface of the single-sided adhesive tape 85d is hold | maintained by the adsorption mechanism 89, and the adhesive surface of the single-sided adhesive tape 85d is bonded. It arrange | positions so that it may become a surface opposite surface 85b * 85c.
 上記片面粘着テープ85dは偏光フィルム同士を貼合できればよく、公知の片面粘着テープを用いることができる。片面粘着テープ85dのフィルム材料としては例えば、ポリエチレンテレフタラートフィルム(PETフィルム)、セルロース、和紙、アルミ、不織布、ポリテトラフルオロエチレン、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリカーボネート、ポリウレタン、ABS樹脂、ポリエステル、ポリスチレン、ポリエチレン、ポリプロピレン、ポリアセタール樹脂、ポリ乳酸、ポリイミド、ポリアミドなどを挙げることができる。また、粘着剤層に用いられる粘着剤としては、アクリル系、エポキシ系、ポリウレタン系、合成ゴム系、EVA系、シリコーン系、塩化ビニル系、クロロプレンゴム系、シアノアクリレート系、イソシアネート系、ポリビニルアルコール系、メラミン樹脂系などの粘着剤を挙げることができる。 The above single-sided adhesive tape 85d only needs to be able to bond polarizing films together, and a known single-sided adhesive tape can be used. Examples of the film material of the single-sided adhesive tape 85d include polyethylene terephthalate film (PET film), cellulose, Japanese paper, aluminum, non-woven fabric, polytetrafluoroethylene, polyvinyl chloride, polyvinylidene chloride, polycarbonate, polyurethane, ABS resin, polyester, Examples thereof include polystyrene, polyethylene, polypropylene, polyacetal resin, polylactic acid, polyimide, and polyamide. The pressure-sensitive adhesive used in the pressure-sensitive adhesive layer includes acrylic, epoxy, polyurethane, synthetic rubber, EVA, silicone, vinyl chloride, chloroprene rubber, cyanoacrylate, isocyanate, and polyvinyl alcohol. And pressure sensitive adhesives such as melamine resin.
 フィルム連結部83は、偏光フィルム10に対して対向するように配置される。このため、図5では、偏光フィルム10が垂直に配置されていることから、フィルム連結部83も垂直に配置されている。一方、偏光フィルム10が例えば斜め方向(または水平方向など)に配置されている場合、フィルム連結部83と偏光フィルム10とが対向するように、フィルム連結部83も斜め方向(または水平方向など)に配置される構造とすればよい。 The film connecting portion 83 is disposed so as to face the polarizing film 10. For this reason, in FIG. 5, since the polarizing film 10 is arrange | positioned perpendicularly, the film connection part 83 is also arrange | positioned perpendicularly. On the other hand, when the polarizing film 10 is disposed, for example, in an oblique direction (or horizontal direction), the film connecting portion 83 is also in an oblique direction (or horizontal direction) so that the film connecting portion 83 and the polarizing film 10 face each other. What is necessary is just to set it as the structure arrange | positioned.
 フィルム連結部93はフィルム連結部83と同様の構造である。図5に示すように、フィルム連結部83・93は、フィルム連結部83・93に備えられた吸着部の吸着機構同士が対向するように配置されている。また、フィルム連結部83・93は、偏光フィルム10および偏光フィルム20の通過位置を介在させて配置されている。なお、フィルム連結部83・93を備える製造システム100は、本実施の形態における好ましい形態であり、フィルム連結部83・93を備えない形態とすることも可能である。 The film connecting portion 93 has the same structure as the film connecting portion 83. As shown in FIG. 5, the film connecting portions 83 and 93 are arranged so that the suction mechanisms of the suction portions provided in the film connecting portions 83 and 93 face each other. Moreover, the film connection parts 83 and 93 are arranged with the passage positions of the polarizing film 10 and the polarizing film 20 interposed therebetween. In addition, the manufacturing system 100 provided with the film connection part 83 * 93 is a preferable form in this Embodiment, and it is also possible to set it as the form which is not provided with the film connection part 83 * 93.
 〔フィルム連結部の動作〕
 以下に、本実施の形態に係る製造システムの動作について説明する。なお、当該動作に係る説明は、光学表示装置の製造方法の説明を兼ねている。
[Operation of film connecting part]
Hereinafter, the operation of the manufacturing system according to the present embodiment will be described. Note that the description related to the operation also serves as a description of a method of manufacturing the optical display device.
 まず、図1に示すように、第1巻出部1から偏光フィルム10を巻き出す(巻出工程)。その後、図3に示すように、図示しないハーフカッターによって偏光フィルム10aのみをハーフカットし、剥離フィルム10bをナイフエッジ4によって剥離する(剥離工程)。さらに、剥離フィルム10bが剥離された偏光フィルム10aと基板5とをニップロール6・6aによって圧着することによって貼合する(貼合工程)。なお、剥離された剥離フィルム10bは図示しない巻取部によって巻き取られ、回収される。上記一連の工程によって、基板5と偏光フィルム10aとが貼合されて光学表示装置を得ることができる。 First, as shown in FIG. 1, the polarizing film 10 is unwound from the 1st unwinding part 1 (unwinding process). Then, as shown in FIG. 3, only the polarizing film 10a is half-cut with a half cutter (not shown), and the release film 10b is peeled off with the knife edge 4 (peeling step). Further, the polarizing film 10a from which the release film 10b has been peeled and the substrate 5 are bonded together by pressure bonding with the nip rolls 6 and 6a (bonding step). The peeled release film 10b is wound up and collected by a winder (not shown). Through the series of steps, the substrate 5 and the polarizing film 10a are bonded to obtain an optical display device.
 上記一連の工程において偏光フィルム10を巻き出すにつれ、第1巻出部1に保持された偏光フィルム10のロールの残量は減少していくこととなる。以下に偏光フィルム同士を連結させる連結工程について説明する。 As the polarizing film 10 is unwound in the series of steps described above, the remaining amount of the roll of the polarizing film 10 held by the first unwinding unit 1 decreases. Below, the connection process which connects polarizing films is demonstrated.
 連結工程では、上記第1巻出部1(11、1b)の偏光フィルム10および第2巻出部1a(11a、1c)の偏光フィルム20を切断する。そして、第1巻出部1(11、1b)の偏光フィルム10および第2巻出部1a(11a、1c)の偏光フィルム20のうち、第1巻出部1(11、1b)のライン側の偏光フィルム10または第2巻出部1a(11a、1c)のライン側の偏光フィルム20と、第2巻出部1a(11a、1c)の巻出部側の偏光フィルム20または第1巻出部1(11、1b)の巻出部側の偏光フィルム10とを連結する。上記「ライン側」とは、換言すると、偏光フィルムが巻き出される方向を示す。上記連結工程としては、(1)オペレーターによる手法と、(2)フィルム連結部83・93を用いる手法とを挙げることができる。 In the connecting step, the polarizing film 10 of the first unwinding part 1 (11, 1b) and the polarizing film 20 of the second unwinding part 1a (11a, 1c) are cut. And among the polarizing film 10 of the 1st unwinding part 1 (11, 1b) and the polarizing film 20 of the 2nd unwinding part 1a (11a, 1c), the line side of the 1st unwinding part 1 (11, 1b) The polarizing film 10 or the second unwinding part 1a (11a, 1c) of the line side polarizing film 20 and the unwinding part of the second unwinding part 1a (11a, 1c) of the polarizing film 20 or first unwinding The polarizing film 10 on the unwinding part side of the part 1 (11, 1b) is connected. In other words, the “line side” indicates a direction in which the polarizing film is unwound. Examples of the connecting step include (1) a technique by an operator and (2) a technique using the film connecting portions 83 and 93.
 まず、(1)のオペレーターによる手法について具体的に説明する。オペレーターにより偏光フィルム同士を連結させる場合、偏光フィルム10の搬送速度を0m/min.とした後(偏光フィルム10を停止させた後)に、オペレーターが偏光フィルム10を切断する。次に、第1巻出部11から偏光フィルム20を巻き出し、端部を切断した後に、例えば、上述した片面粘着テープ85dを用いて連結する手法が挙げられる。 First, the method by the operator of (1) will be explained specifically. When the polarizing films are connected by an operator, the conveyance speed of the polarizing film 10 is set to 0 m / min. After the above (after stopping the polarizing film 10), the operator cuts the polarizing film 10. Next, after unwinding the polarizing film 20 from the 1st unwinding part 11 and cut | disconnecting an edge part, the method connected using the single-sided adhesive tape 85d mentioned above is mentioned, for example.
 このように、本発明に係る製造システムでは、第1巻出部1・11の2つの巻出部が備えられており、偏光フィルムのロールを新たなロールに交換せずとも、偏光フィルム10・20を用いて即座にフィルムを連結させることができ、速やかに偏光フィルム20を巻き出すことができる。したがって、従来の巻出部が1箇所にのみ設置された製造システムとは異なり、運転中に空いている方の巻出部において、原反ロールの交換作業が行える為、交換作業に必要な時間を削減することができる。その結果、光学表示装置の製造時間を短縮することが可能である。製造システムでは、偏光フィルム10・20の連結を終えた後、偏光フィルム20を巻き出す間に、第1巻出部1の偏光フィルム10のロールを新たなロールに交換する。偏光フィルム20の残量が減少した場合、同様に偏光フィルム20および偏光フィルム10を連結することももちろん可能である。 Thus, in the manufacturing system according to the present invention, the two unwinding portions of the first unwinding portions 1 and 11 are provided, so that the polarizing film 10. 20, the film can be immediately connected, and the polarizing film 20 can be unwound quickly. Therefore, unlike the conventional manufacturing system in which the unwinding unit is installed only at one place, the original roll roll can be replaced at the unwinding unit that is vacant during operation. Can be reduced. As a result, it is possible to shorten the manufacturing time of the optical display device. In the manufacturing system, after the connection of the polarizing films 10 and 20 is finished, the roll of the polarizing film 10 of the first unwinding unit 1 is replaced with a new roll while the polarizing film 20 is unwound. When the remaining amount of the polarizing film 20 decreases, it is of course possible to connect the polarizing film 20 and the polarizing film 10 in the same manner.
 次に、フィルム連結部83・93を用いる場合について図8を用いて具体的に説明する。図8は、フィルム連結部を備えた製造システムによる連結工程を示す工程図である。偏光フィルム10の残量が減少すると、偏光フィルム10の図8(a)に示すように、偏光フィルム10の搬送速度を0m/min.とした後に、吸着部84・84aおよび切断貼合部85(フィルム連結部83)を偏光フィルム10に対して垂直方向に移動させる。次に、吸着部84・84aの吸着機構89によって、偏光フィルム10を吸着して固定する(吸着工程)。 Next, the case where the film connecting portions 83 and 93 are used will be specifically described with reference to FIG. FIG. 8 is a process diagram illustrating a connection process by a manufacturing system including a film connection part. When the remaining amount of the polarizing film 10 decreases, as shown in FIG. 8A of the polarizing film 10, the conveyance speed of the polarizing film 10 is set to 0 m / min. Then, the suction portions 84 and 84a and the cutting and bonding portion 85 (film connecting portion 83) are moved in the vertical direction with respect to the polarizing film 10. Next, the polarizing film 10 is sucked and fixed by the suction mechanism 89 of the suction portions 84 and 84a (suction process).
 この際、切断貼合部85では、切断支持面85aが偏光フィルム10に接触している。その後、図8(b)に示すように、図示しない切断機を開口86に沿って移動させて偏光フィルム10を切断する(切断工程)。切断後、切断貼合部85を偏光フィルム10に対して垂直方向であって、偏光フィルム10から遠ざかる方向(図中右側)に移動し、反時計回りに1/3周回転させ、偏光フィルム10に対して垂直方向であって、偏光フィルム10から接近する方向(図中左側)に移動させる。これにより、図8(c)に示すように、片面粘着テープ85d(図示せず)と対向する偏光フィルム10の切断線を覆うように、貼合面85bの片面粘着テープ85dを貼り合わせる(貼合工程)。上記切断線とは、切断工程によって、偏光フィルム10に生じた切断面のうち、貼合面85bと対向する辺を示す。貼合工程では、片面粘着テープ85dは上記切断線を覆うように配置される、すなわち、偏光フィルム10が上記切断線を越えて、偏光フィルム10が存在しない部分についても配置される。 At this time, the cutting support surface 85a is in contact with the polarizing film 10 in the cutting and bonding unit 85. Thereafter, as shown in FIG. 8B, the polarizing film 10 is cut by moving a cutting machine (not shown) along the opening 86 (cutting step). After cutting, the cutting and bonding part 85 is moved in the direction perpendicular to the polarizing film 10 and away from the polarizing film 10 (right side in the figure), rotated counterclockwise by 1/3 turn, and the polarizing film 10 In the direction perpendicular to the polarizing film 10 (the left side in the figure). Thereby, as shown in FIG.8 (c), the single-sided adhesive tape 85d of the bonding surface 85b is bonded together so that the cutting line of the polarizing film 10 which opposes the single-sided adhesive tape 85d (not shown) may be covered. Joint process). The said cutting line shows the edge | side which opposes the bonding surface 85b among the cut surfaces produced in the polarizing film 10 by the cutting process. In the bonding step, the single-sided adhesive tape 85d is disposed so as to cover the cutting line, that is, the polarizing film 10 is also disposed on a portion where the polarizing film 10 does not exist beyond the cutting line.
 さらに、偏光フィルム20に対しても、図8(a)~(c)と同様にして、偏光フィルム20の切断支持面95aに片面粘着テープ95dを粘着する。上述した部材と同様の部材には同一の名称を付し、その説明を省略する。 Furthermore, the single-sided adhesive tape 95d is adhered to the polarizing film 20 in the same manner as in FIGS. 8A to 8C. The same members as those described above are given the same names, and the description thereof is omitted.
 まず、偏光フィルム20を第1巻出部11から巻き出して、図8(a)と同様に、偏光フィルム20の端部を切断した後、図示しない切断機を、切断支持面95aに形成された開口96に沿って移動させて偏光フィルム20を切断する。切断後、切断貼合部95を偏光フィルム20に対して垂直方向であって、偏光フィルム20から遠ざかる方向(図中左側)に移動し、時計回りに1/3周回転させ、偏光フィルム20に対して垂直方向であって、偏光フィルム20から近接する方向(図中右側)に移動させる。これにより、図8(e)に示すように、貼合面95bの片面粘着テープ95dと対向する偏光フィルム20の切断線を覆うように、片面粘着テープ95dを貼り付けることができる。 First, after the polarizing film 20 is unwound from the first unwinding portion 11 and the end portion of the polarizing film 20 is cut as in FIG. 8A, a cutting machine (not shown) is formed on the cutting support surface 95a. The polarizing film 20 is cut by moving along the opening 96. After cutting, the cut and bonded portion 95 is moved in a direction perpendicular to the polarizing film 20 and away from the polarizing film 20 (left side in the figure), and rotated clockwise by 1/3 turn to the polarizing film 20 On the other hand, it is moved in a direction perpendicular to the polarizing film 20 (right side in the figure). Thereby, as shown in FIG.8 (e), the single-sided adhesive tape 95d can be affixed so that the cutting line of the polarizing film 20 facing the single-sided adhesive tape 95d of the bonding surface 95b may be covered.
 次に、図8(f)に示すように、吸着部84・84aおよび切断貼合部85(フィルム連結装置3)を吸着部94・94aおよび切断貼合部95(フィルム連結部93)に近接させ、偏光フィルム10および偏光フィルム20の切断面同士を合わせる(近接工程)。これにより、偏光フィルム10・20の切断線を覆う片面粘着テープ85d・95dのうち、切断線を越えた部分(偏光フィルム10・20に貼合していない部分)が、他方の偏光フィルム20・10に貼合することによって、偏光フィルム10・20が連結される。図8(f)では、フィルム連結部83をフィルム連結部93へ近接させたが、フィルム連結部93をフィルム連結部83へ近接させてもよく、また、フィルム連結部83・93を互いに近接させてもよい。 Next, as shown in FIG. 8 (f), the adsorbing portions 84 and 84a and the cutting and bonding portion 85 (film connecting device 3) are brought close to the adsorbing portions 94 and 94a and the cutting and bonding portion 95 (film connecting portion 93). The cut surfaces of the polarizing film 10 and the polarizing film 20 are matched with each other (proximity step). Thereby, among the single-sided adhesive tapes 85d and 95d that cover the cutting line of the polarizing film 10/20, the part beyond the cutting line (the part not bonded to the polarizing film 10/20) is the other polarizing film 20/20. The polarizing films 10 and 20 are connected to each other. In FIG. 8 (f), the film connecting part 83 is brought close to the film connecting part 93, but the film connecting part 93 may be made close to the film connecting part 83, and the film connecting parts 83 and 93 are made close to each other. May be.
 偏光フィルム10・20を連結させた後には、準備工程として、図8(g)に示すように、切断貼合部85・95をそれぞれ偏光フィルム10・20に対して垂直方向であって、遠ざかる方向へ移動させ、切断貼合部85を時計回りに1/3周回転させ、切断貼合部95を反時計回りに1/3周回転させる。そして、切断貼合部85・95をそれぞれ偏光フィルム10・20に対して垂直方向であって、近接する方向へ移動させる。 After connecting the polarizing films 10 and 20, as a preparatory step, as shown in FIG. 8 (g), the cutting and bonding parts 85 and 95 are perpendicular to the polarizing films 10 and 20, respectively, and are moved away. The cutting and bonding part 85 is rotated clockwise by 1/3 turn, and the cutting and bonding part 95 is rotated counterclockwise by 1/3 turn. Then, the cutting and bonding parts 85 and 95 are moved in the direction perpendicular to the polarizing films 10 and 20 and in the adjacent directions.
 最後に、吸着部84・84aおよび切断貼合部85(フィルム連結部83)を図8(a)の位置に戻し、一連の工程が終了する。なお、貼合面85c・95cには、片面粘着テープ85d・95dが予め吸着された状態にて備えられているため、第2巻出部1cに新たな偏光フィルム10のロールが設置された後に、偏光フィルム20に対して図8(a)~(c)の工程、偏光フィルム10に対して図8(d)~(e)の工程を行い、上述したように図8(f)~(h)の工程を経て、偏光フィルム20・10を連結させることができる。また、使用した片面粘着テープ85d・95dを補充することによって、連続して偏光フィルムを連結することももちろん可能である。 Finally, the adsorbing portions 84 and 84a and the cutting and bonding portion 85 (film connecting portion 83) are returned to the positions shown in FIG. 8A, and the series of steps is completed. In addition, since the single-sided adhesive tapes 85d and 95d are preliminarily adsorbed on the bonding surfaces 85c and 95c, after a new roll of the polarizing film 10 is installed on the second unwinding portion 1c. 8 (a) to (c) are performed on the polarizing film 20, and the steps of FIGS. 8 (d) to (e) are performed on the polarizing film 10. As described above, FIGS. The polarizing films 20 and 10 can be connected through the step h). Of course, it is also possible to continuously connect the polarizing films by supplementing the used single-sided adhesive tapes 85d and 95d.
 上述のように、フィルム連結部83・93を用いた連結工程の場合、オペレーターによる連結工程と比較して、偏光フィルムの吸着、切断、貼合をより短時間に、また、より正確に行うことが可能となるため好ましい。 As described above, in the case of the connecting step using the film connecting portions 83 and 93, the polarizing film is adsorbed, cut, and bonded in a shorter time and more accurately than the connecting step by the operator. Is preferable.
 具体的には、当該製造システムにおいて、オペレーターによる連結工程の場合、10分程度必要であったが、フィルム連結部83・93を用いた場合、1分以下とすることができた。 Specifically, in the manufacturing system, about 10 minutes were required in the case of the connecting step by the operator, but when the film connecting portions 83 and 93 were used, the time could be reduced to 1 minute or less.
 なお、当該製造システムにおいて、第1巻出部1のみを使用し、第1巻出部11を使用せず、さらにフィルム連結部83・93も使用しない場合、オペレーターは第1巻出部1に新たな偏光フィルムを交換した後に偏光フィルム10を交換する必要があることから、連結工程には30分程度必要である。このため、本実施の形態に係る製造システムが有益であることは明らかである。 In the manufacturing system, when only the first unwinding portion 1 is used, the first unwinding portion 11 is not used, and further, the film connecting portions 83 and 93 are not used, the operator can move to the first unwinding portion 1. Since it is necessary to replace the polarizing film 10 after replacing a new polarizing film, the connecting step requires about 30 minutes. For this reason, it is clear that the manufacturing system according to the present embodiment is useful.
 <反転機構>
 反転機構65は、短辺または長辺が搬送方向に沿った基板5を、長辺または短辺が第2基板搬送機構の搬送方向に沿った状態に反転させるものである。つまり、基板5の表面と裏面とを反転させ、搬送方向に沿った基板5の長辺および短辺を入れ替えるものである。まず、図9を用いて反転機構65の構造について説明する。
<Reversing mechanism>
The reversing mechanism 65 reverses the substrate 5 whose short side or long side is along the transport direction into a state where the long side or short side is along the transport direction of the second substrate transport mechanism. That is, the front surface and the back surface of the substrate 5 are reversed, and the long side and the short side of the substrate 5 along the transport direction are switched. First, the structure of the reversing mechanism 65 will be described with reference to FIG.
 図9は、反転機構65を示す斜視図であり、基板5を反転させる過程における反転機構65の動作を示している。反転機構65は、基板支持部66a・66b、基板反転部67および回転軸部68を備えている。以下各部材について説明する。 FIG. 9 is a perspective view showing the reversing mechanism 65 and shows the operation of the reversing mechanism 65 in the process of reversing the substrate 5. The reversing mechanism 65 includes substrate support portions 66a and 66b, a substrate reversing portion 67, and a rotating shaft portion 68. Each member will be described below.
 基板支持部66aは、基板5を支持する部材であり、載置した基板5を挟持可能である。また、基板支持部66aは基板5を吸着する吸着手段を好ましい形態として備えている。吸着手段としては、公知のものを用いることができ、例えば、空気吸引方式の吸着手段を用いることができる。図9では、基板支持部66aはパイプ状のアームおよび吸着手段から構成されており、吸着手段にて吸引された空気がアーム中を通過する構成となっているが、アームおよび吸着手段の形状は当該構成に限定されるものではない。 The substrate support portion 66a is a member that supports the substrate 5, and can hold the placed substrate 5. Further, the substrate support portion 66a includes an adsorbing means for adsorbing the substrate 5 as a preferable form. A well-known thing can be used as an adsorption means, for example, an air suction type adsorption means can be used. In FIG. 9, the substrate support portion 66a is composed of a pipe-shaped arm and suction means, and the air sucked by the suction means passes through the arm. The shape of the arm and suction means is as follows. It is not limited to the said structure.
 また、基板支持部66aはアームに吸着手段が2つ備えられた構造となっており、3本のアームからなるアーム群を1対備えている。また、吸着手段は基板5の対角線上に4つ配置されており、基板5の長さ方向において、上記吸着手段間にさらに吸着手段が2つ配置されている。当該アームの本数および吸着手段の設置数はあくまで一例であり、例えば、大きな基板を反転させる場合には、アームの本数および吸着手段の数を増加させるなど適宜変更すればよい。また、吸着手段の設置場所を基板5の中心部分に集中させる、または、基板5の端部周辺に変更するなどの変更ももちろん可能である。 The substrate support portion 66a has a structure in which two suction means are provided on the arm, and includes a pair of arm groups each including three arms. Further, four suction means are arranged on the diagonal line of the substrate 5, and two further suction means are arranged between the suction means in the length direction of the substrate 5. The number of arms and the number of suction means are merely examples. For example, when a large substrate is reversed, the number of arms and the number of suction means may be increased as appropriate. Further, it is of course possible to make changes such as concentrating the installation location of the suction means on the central portion of the substrate 5 or changing it around the edge of the substrate 5.
 基板支持部66aが基板5を載置していない場合、基板5を受け入れ可能なようにアーム群間の距離が広がった状態となっている(以下、この状態を「待機状態」と称する)。一方、基板支持部66bは基板5もアーム群間の距離が広がった状態となっており、基板支持部66aと同様の構造を有している。また、1対のアーム群は基板5を挟持するため、アーム群間の距離を狭めることもできる。このようにアーム群間の距離は変更可能であり、そのために基板支持部66a・66bは、モーターを有しており、モーターの回転運動を直線運動に変えてアーム群間の距離を変更する構成となっている。なお、アーム群間の距離を変更できる構成であれば、モーターを備える構成に変えて用いてもよい。 When the substrate support portion 66a does not place the substrate 5, the distance between the arm groups is widened so that the substrate 5 can be received (hereinafter, this state is referred to as a “standby state”). On the other hand, the substrate support portion 66b has a structure in which the distance between the arms of the substrate 5 is also increased, and has the same structure as the substrate support portion 66a. Further, since the pair of arm groups sandwich the substrate 5, the distance between the arm groups can be reduced. As described above, the distance between the arm groups can be changed. For this purpose, the substrate support portions 66a and 66b have motors, and the distance between the arm groups is changed by changing the rotational motion of the motors to a linear motion. It has become. In addition, if it is the structure which can change the distance between arm groups, you may change and use for the structure provided with a motor.
 基板反転部67は基板支持部66a・66bに連結されており、反転軸Mを中心として回転することによって基板5を反転させるものである。図9において基板反転部67はそれぞれのアームに連結されており、軽量化および回転時の空気抵抗を軽減する観点から好ましい構造としてパイプ状の構造となっている。しかしながら、当該構造に限定されるものではない。例えば、パイプ状に代えて板状であってもよい。 The substrate reversing unit 67 is connected to the substrate supporting units 66a and 66b, and reverses the substrate 5 by rotating around the reversing axis M. In FIG. 9, the substrate reversing part 67 is connected to each arm, and has a pipe-like structure as a preferable structure from the viewpoint of reducing the weight and reducing the air resistance during rotation. However, it is not limited to the structure. For example, a plate shape may be used instead of a pipe shape.
 基板反転部67は反転軸Mを中心として回転するものである。基板反転部67を回転させる部材としてはモーターによる駆動手段が挙げられる。図9(a)において、好ましい形態として基板反転部67は回転軸部68を備えている。回転軸部68は反転軸Mに沿って配置されているため、反転軸Mに沿って安定して回転可能である。本実施の形態では、基板反転部67は回転軸部68と共に回転する構造となっており、反転軸Mを中心として基板反転部67が安定して回転し易い構造となっている。このため、回転軸部68を備える基板反転部67は反転軸Mに沿ってより安定して回転可能である。したがって、基板5の反転をより安定して行うことが可能となる。なお、回転軸部68は反転前の基板5に対して表面方向に向かって回転することも、逆に裏面方向に向かって回転することも可能である。 The substrate reversing unit 67 rotates around the reversing axis M. Examples of the member that rotates the substrate reversing unit 67 include driving means using a motor. In FIG. 9A, the substrate reversing unit 67 includes a rotation shaft unit 68 as a preferred form. Since the rotation shaft portion 68 is disposed along the reversal axis M, it can be stably rotated along the reversal axis M. In the present embodiment, the substrate reversing portion 67 is structured to rotate together with the rotating shaft portion 68, and the substrate reversing portion 67 is configured to easily rotate stably around the reversing axis M. For this reason, the substrate reversing part 67 including the rotating shaft part 68 can rotate more stably along the reversing axis M. Therefore, the substrate 5 can be reversed more stably. Note that the rotating shaft portion 68 can rotate toward the front surface with respect to the substrate 5 before reversing, or conversely, rotate toward the back surface.
 反転軸Mは、図9(a)に示すように「第1基板搬送機構における反転前の基板5の中心を通り、上記基板5の搬送方向D1と垂直な直線に対して45°の傾きを有する直線を含み、第1基板搬送機構における反転前の基板5を含む面内」に位置している。上記45°の傾きを有する直線は、図9(a)の反転軸Mに沿った直線である。また、「第1基板搬送機構における反転前の基板5を含む面」とは反転前の基板5と同一平面を意味し、図9(a)ではX‐Y面に位置する面をいう。 As shown in FIG. 9A, the reversal axis M has an inclination of 45 ° with respect to a straight line passing through the center of the substrate 5 before reversal in the first substrate transport mechanism and perpendicular to the transport direction D1 of the substrate 5. In the plane including the substrate 5 before inversion in the first substrate transport mechanism. The straight line having an inclination of 45 ° is a straight line along the inversion axis M in FIG. In addition, the “surface including the substrate 5 before inversion in the first substrate transport mechanism” means the same plane as the substrate 5 before inversion, and in FIG. 9A, refers to a surface located on the XY plane.
 図9では、基板支持部66a・66b、基板反転部67および回転軸部68が別個に構成された例について説明するが、各部材の機能を有していれば一体の部材として構成されていてももちろんよい。 FIG. 9 illustrates an example in which the substrate support portions 66a and 66b, the substrate reversing portion 67, and the rotating shaft portion 68 are separately configured. However, as long as each member has a function, it is configured as an integral member. Of course it is good.
 次に、反転機構65の動作について説明する。図9では、第1基板搬送機構の搬送方向D1に基板5の短辺が沿っており、第2基板搬送機構の搬送方向D2に基板5の長辺が沿った状態となるように基板5を反転させる場合について説明する。しかしながら、搬送方向D1に基板5の長辺が沿っており、搬送方向D2に基板5の短辺が沿った状態に反転することも同様に可能である。 Next, the operation of the reversing mechanism 65 will be described. In FIG. 9, the short side of the substrate 5 is along the transfer direction D1 of the first substrate transfer mechanism, and the long side of the substrate 5 is along the transfer direction D2 of the second substrate transfer mechanism. A case of inversion will be described. However, it is also possible to reverse the state in which the long side of the substrate 5 is along the transport direction D1 and the short side of the substrate 5 is along the transport direction D2.
 図9(w1)は待機状態の反転機構65を示す斜視図である。同図に示すように、基板支持部66aは基板5を受け入れられるように1対のアーム群間の距離が広がった状態となっている。一方、基板支持部66bは基板5が反転される位置に配置されており、反転させた基板5を解放するため、基板支持部66bが備える1対のアーム群間の距離も広がった状態となっている。 FIG. 9 (w1) is a perspective view showing the reversing mechanism 65 in a standby state. As shown in the figure, the substrate support portion 66a is in a state where the distance between the pair of arm groups is widened so that the substrate 5 can be received. On the other hand, the substrate support portion 66b is disposed at a position where the substrate 5 is inverted, and the distance between the pair of arm groups provided in the substrate support portion 66b is increased in order to release the inverted substrate 5. ing.
 X‐Y平面における搬送方向D1に沿って基板支持部66aへ基板5が搬送されると、基板支持部66aに基板5が載置される。具体的には、アーム群間に基板5が移動し、基板支持部66aの下方のアーム群上に基板5が載置される。アーム群上に基板5が載置されたか否かは、基板確認センサーによって判断される。本実施形態において、基板確認センサーは基板支持部66aおよび基板支持部66bのそれぞれに備えられた構成となっているが、基板5の載置を確認できる位置に備えられていればよく、当該位置以外に備えられていてもよい。 When the substrate 5 is transported to the substrate support portion 66a along the transport direction D1 on the XY plane, the substrate 5 is placed on the substrate support portion 66a. Specifically, the substrate 5 moves between the arm groups, and the substrate 5 is placed on the arm group below the substrate support portion 66a. Whether or not the substrate 5 is placed on the arm group is determined by a substrate confirmation sensor. In the present embodiment, the substrate check sensor is provided in each of the substrate support portion 66a and the substrate support portion 66b. However, the substrate check sensor only needs to be provided at a position where the placement of the substrate 5 can be confirmed. It may be provided other than.
 その後、基板確認センサーから基板5の確認信号がアーム群に送信されると、図9(a)に示すように、アーム群同士が近付いて基板5が挟持される。さらに、吸着手段によって基板5の表面が吸着されて基板5がより固定される。このように吸着手段による吸着によって、アーム群だけで基板5を挟持する場合よりも、さらに基板5を固定することができる。これによって、基板5が回転時に脱着することを回避できる。 Thereafter, when a confirmation signal of the substrate 5 is transmitted from the substrate confirmation sensor to the arm group, as shown in FIG. 9A, the arm groups approach each other and the substrate 5 is sandwiched. Further, the surface of the substrate 5 is adsorbed by the adsorbing means, and the substrate 5 is further fixed. In this way, the substrate 5 can be further fixed by the suction by the suction means, as compared with the case where the substrate 5 is held only by the arm group. Thereby, it can avoid that the board | substrate 5 remove | desorbs at the time of rotation.
 次に、回転軸部68が反転軸Mを中心に回転することによって、共に基板反転部67も基板5の表面方向に回転する。図9(b)は図9(a)の状態から基板反転部67が反転軸Mを中心として90°回転した状態を示している。図9(b)では基板5はZ軸方向に沿って位置している。このとき、基板支持部66bは、基板5を挟持しておらず、基板反転部67の回転に伴って下方に90°回転されている。 Next, when the rotation shaft portion 68 rotates around the reversal axis M, the substrate reversal portion 67 also rotates in the surface direction of the substrate 5. FIG. 9B shows a state in which the substrate reversing unit 67 has rotated 90 ° about the reversing axis M from the state of FIG. 9A. In FIG. 9B, the substrate 5 is located along the Z-axis direction. At this time, the substrate support portion 66 b does not sandwich the substrate 5 and is rotated 90 ° downward along with the rotation of the substrate inversion portion 67.
 さらに、回転軸部68と共に基板反転部67が反転軸Mを中心として90°回転することによって、反転軸Mに対して線対称の位置に基板5が反転される。なお、図示しないが、搬送方向D2側の基板5の端部は第2基板搬送機構のコンベアーロールに位置している。当該状態を図9(c)に示す。このように、図9(a)~(c)に示すように、基板5の長辺および短辺が基板の搬送方向に沿って反対となると共に、基板の表面および裏面の反転がなされている。このため、ニップロール16・16aによって下面から偏光フィルムをその吸収軸が直交するように貼合することができる。また、反転機構65の動作は反転軸Mを中心とした180°の半円軌道を描くものであり、複雑な動作を必要としない。したがって、短いタクトタイムにて1枚の基板5を反転させることができる。 Further, the substrate reversing portion 67 and the rotating shaft portion 68 are rotated by 90 ° about the reversing axis M, whereby the substrate 5 is reversed to a position symmetrical with respect to the reversing axis M. In addition, although not shown in figure, the edge part of the board | substrate 5 by the side of the conveyance direction D2 is located in the conveyor roll of a 2nd board | substrate conveyance mechanism. This state is shown in FIG. In this way, as shown in FIGS. 9A to 9C, the long side and the short side of the substrate 5 are opposite to each other along the substrate transport direction, and the front and back surfaces of the substrate are reversed. . For this reason, the polarizing film can be bonded from the lower surface by the nip rolls 16 and 16a so that the absorption axes thereof are orthogonal to each other. The operation of the reversing mechanism 65 draws a 180 ° semicircular orbit about the reversing axis M, and does not require a complicated operation. Therefore, one substrate 5 can be reversed with a short tact time.
 さらに、基板支持部66a・66bは反転軸Mに対して線対称に一対備えられている。このため、基板支持部66aによって基板5が反転されると、他方の基板支持部66bは図9(a)での反転前の基板5のあった位置に移動される。 Furthermore, a pair of substrate support portions 66a and 66b are provided in line symmetry with respect to the inversion axis M. Therefore, when the substrate 5 is inverted by the substrate support portion 66a, the other substrate support portion 66b is moved to the position where the substrate 5 before the inversion in FIG.
 図9(c)の状態から基板支持部66aの吸着手段による吸着が解除され、アーム群間の距離が広げられると基板5は一対のアーム群のうち、下方のアーム群上に載置される。その後、図9(w2)に示すように、第2基板搬送機構が備えるコンベアーロールの回転に伴って基板5は搬送方向D2へ搬送される。 When the suction by the suction means of the substrate support portion 66a is released from the state of FIG. 9C and the distance between the arm groups is increased, the substrate 5 is placed on the lower arm group of the pair of arm groups. . Thereafter, as shown in FIG. 9 (w2), the substrate 5 is transported in the transport direction D2 with the rotation of the conveyor roll provided in the second substrate transport mechanism.
 ここで、基板支持部66bは反転前の基板5の位置に移動している。これにより、基板支持部66aの移動を待つことなく、次に搬送される基板5’を速やかに反転させることができる。つまり、貼合装置60によれば1枚の基板の反転はもちろん、基板を反転させた後に、次の基板を載置するまでに時間を短縮することができる。その結果、複数の基板を短いタクトタイムにて順次処理することができる。 Here, the substrate support portion 66b has moved to the position of the substrate 5 before inversion. Thus, the next substrate 5 'to be transported can be quickly reversed without waiting for the movement of the substrate support 66a. That is, according to the bonding apparatus 60, not only can a single substrate be reversed, but also the time can be shortened until the next substrate is placed after the substrate is reversed. As a result, a plurality of substrates can be sequentially processed with a short tact time.
 図10(a)~(c)は、図9(a)~(c)に対応する基板5の回転過程を示す平面図である。図10では、第1基板搬送機構61および第2基板搬送機構62を図示している。第1基板搬送機構61および第2基板搬送機構62には図示しないが、基板5を搬送する複数のコンベアーロールが、基板5の搬送方向に対して直交して備えられている。なお、基板5の搬送する手段はコンベアーロールに限定されるものではなく、他の代替手段を用いてもよい。 10 (a) to 10 (c) are plan views showing the rotation process of the substrate 5 corresponding to FIGS. 9 (a) to (c). FIG. 10 illustrates the first substrate transport mechanism 61 and the second substrate transport mechanism 62. Although not illustrated in the first substrate transport mechanism 61 and the second substrate transport mechanism 62, a plurality of conveyor rolls that transport the substrate 5 are provided orthogonal to the transport direction of the substrate 5. The means for transporting the substrate 5 is not limited to the conveyor roll, and other alternative means may be used.
 第1基板搬送機構61および第2基板搬送機構62は、基板5を同一方向に搬送するものである。すなわち、搬送方向D1・D2は同一方向に向かっている。このため、第1基板搬送機構61および第2基板搬送機構62は、搬送方向D1・D2にそれぞれ沿った直線状の形状となっている。すなわち、L字型形状などの複雑な構造を有していない。したがって、本発明に係る貼合装置60は、設置が非常に簡便であり、面積効率に優れる構造となっている。 The first substrate transport mechanism 61 and the second substrate transport mechanism 62 transport the substrate 5 in the same direction. That is, the transport directions D1 and D2 are in the same direction. For this reason, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 have linear shapes along the transport directions D1 and D2, respectively. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus 60 according to the present invention is very simple to install and has a structure with excellent area efficiency.
 まず、図9(w1)にて説明したように、基板5が搬送方向D1に沿って搬送され、第1基板搬送機構61の端部からコンベアーロールの回転力によって基板支持部66aに載置される。そして、載置された基板5が基板支持部66aの一対のアーム群によって挟持された後、吸着手段によって基板の表面が吸着されて固定される。当該反転機構65の状態を図10(a)に示す。 First, as described in FIG. 9 (w1), the substrate 5 is transported along the transport direction D1, and is placed on the substrate support portion 66a from the end of the first substrate transport mechanism 61 by the rotational force of the conveyor roll. The Then, after the placed substrate 5 is sandwiched between the pair of arm groups of the substrate support portion 66a, the surface of the substrate is adsorbed and fixed by the adsorbing means. The state of the reversing mechanism 65 is shown in FIG.
 その後、回転軸部68が基板5の表面方向へ反転軸Mを中心として90°回転すると共に、基板反転部67も回転する。図10(b)は図10(a)から基板反転部67が反転軸Mを中心として90°回転した状態を示している。このとき、基板支持部66bは、基板5を挟持していないが基板反転部67の回転に伴って下方に90°回転されている。さらに、回転軸部68と共に反転軸Mを中心として基板反転部67が90°回転することによって基板5が反転される。基板5が反転されたときの反転機構65の状態を図10(c)に示す。基板5は反転軸Mに対して線対称の位置に反転されている。 Thereafter, the rotating shaft portion 68 rotates 90 ° about the reversing axis M toward the surface of the substrate 5 and the substrate reversing portion 67 also rotates. FIG. 10B shows a state in which the substrate reversing portion 67 has rotated 90 ° about the reversing axis M from FIG. 10A. At this time, the substrate support portion 66b does not sandwich the substrate 5, but is rotated 90 ° downward along with the rotation of the substrate inversion portion 67. Further, the substrate 5 is reversed by rotating the substrate reversing portion 67 by 90 ° about the reversing axis M together with the rotating shaft 68. FIG. 10C shows the state of the reversing mechanism 65 when the substrate 5 is reversed. The substrate 5 is inverted at a position symmetrical with respect to the inversion axis M.
 図10(c)では、基板5の端部が第2基板搬送機構62に位置している。図9(c)について説明したように、その後、基板5の吸着が解除され、アーム群間の距離が広げられる。その後、基板5は一対のアーム群のうち、下方のアーム群上に載置される。さらに第2基板搬送機構が備えるコンベアーロールの回転に伴って基板5へ搬送されることとなる。その後、基板支持部66bによって基板5が反転される。このように、基板支持部66a・66bによって順次搬送される基板が効率良く反転される。 In FIG. 10C, the end of the substrate 5 is positioned in the second substrate transport mechanism 62. As described with reference to FIG. 9C, thereafter, the suction of the substrate 5 is released, and the distance between the arm groups is increased. Thereafter, the substrate 5 is placed on the lower arm group of the pair of arm groups. Furthermore, it will be conveyed to the board | substrate 5 with rotation of the conveyor roll with which a 2nd board | substrate conveyance mechanism is provided. Thereafter, the substrate 5 is inverted by the substrate support portion 66b. In this way, the substrates sequentially conveyed by the substrate support portions 66a and 66b are efficiently reversed.
 なお、図9および図10では、基板支持部66a・66bが吸着手段を備える構成としているが、アーム群のみによって基板5を固定する構成であってもよい。その場合、吸着手段によって基板5を吸着および脱着する動作が不要となる。 9 and 10, the substrate support portions 66a and 66b are configured to include the suction means. However, the substrate 5 may be fixed only by the arm group. In that case, the operation | movement which adsorb | sucks and remove | desorbs the board | substrate 5 by an adsorption | suction means becomes unnecessary.
 反転機構65の構成例を図11に示す。図11は反転機構65および反転機構65に連結されたインターフェイス部165の構成を示すブロック図である。図11に示す構成はあくまで一例であって反転機構65はこの一例に限定されるものではない。図11に示すように、さらに、反転機構65は、インターフェイス部165に接続されている。インターフェイス部165は、オペレーターからの操作入力を受け付け、入力データを表示および反転機構65へと送信するものである。 A configuration example of the reversing mechanism 65 is shown in FIG. FIG. 11 is a block diagram illustrating a configuration of the reversing mechanism 65 and the interface unit 165 coupled to the reversing mechanism 65. The configuration shown in FIG. 11 is merely an example, and the reversing mechanism 65 is not limited to this example. As shown in FIG. 11, the reversing mechanism 65 is further connected to the interface unit 165. The interface unit 165 receives an operation input from an operator and transmits input data to the display and inversion mechanism 65.
 反転機構65では、基板支持部66a・66b、基板反転部67および回転軸部68が備えられており、これらはインターフェイス部における制御部70に接続されている。一方、インターフェイス部165は、入力部166、表示部167、記憶部168および制御部70を備えている。入力部166は、基板5の情報等を記憶部168に送信するものである。基板5の各情報としては、基板5の長辺および短辺の長さ、厚さ、搬送速度、単位時間当たりの搬送枚数が挙げられる。その他の情報としては、第1基板搬送機構61および第2基板搬送機構62の位置およびこれらが備えるコンベアーロールの位置、搬送方向D1・D2、反転軸Mの位置、基板5の回転速度、などが挙げられる。 The reversing mechanism 65 includes substrate support portions 66a and 66b, a substrate reversing portion 67, and a rotating shaft portion 68, and these are connected to the control portion 70 in the interface portion. On the other hand, the interface unit 165 includes an input unit 166, a display unit 167, a storage unit 168, and a control unit 70. The input unit 166 transmits information on the substrate 5 and the like to the storage unit 168. As each information of the board | substrate 5, the length of the long side and the short side of the board | substrate 5, thickness, a conveyance speed, and the conveyance number of sheets per unit time are mentioned. Other information includes the positions of the first substrate transport mechanism 61 and the second substrate transport mechanism 62 and the positions of the conveyor rolls included in these, the transport directions D1 and D2, the position of the reversal axis M, the rotational speed of the substrate 5, and the like. Can be mentioned.
 また、インターフェイス部165は、図示しない入力装置を備えている。上記入力装置はオペレーターが各種情報を入力できるものであればよく、例えば、入力キーやタッチパネルで構成することができる。表示部167は、入力部166によって入力された各種情報の内容を表示するものであり、公知の液晶ディスプレイ等で構成することができる。 Further, the interface unit 165 includes an input device (not shown). The input device may be any device that allows an operator to input various types of information, and may be configured with, for example, an input key or a touch panel. The display unit 167 displays the contents of various information input by the input unit 166, and can be configured by a known liquid crystal display or the like.
 記憶部168は、制御部70および入力部166に接続されている。記憶部168は、入力部から入力された情報を記憶するものであり、例えば、例えばRAM(random access memory)、HDD(ハードディスクドライブ)などの記憶装置を備えて、各種データおよび各種プログラムを記憶するものである。 The storage unit 168 is connected to the control unit 70 and the input unit 166. The storage unit 168 stores information input from the input unit. For example, the storage unit 168 includes a storage device such as a RAM (random access memory) or an HDD (hard disk drive), and stores various data and various programs. Is.
 制御部70は、記憶部168から受信した情報に基づき基板支持部66a・66b、これらが備える吸着手段、基板反転部67および回転軸部68を制御する。制御部70には、基板5の回転を制御する回転情報が記憶されている。基板5の回転を制御する回転情報とは、反転機構65を制御する回転情報であり、(1)基板5が基板支持部66a(または66b)に到着し、(2)センサーが基板5を感知し(センサーON)、(3)基板支持部66aのアーム群によって基板5が挟持され、(4)基板5が反転され、(5)基板5が解放された後に基板反転部67を反転させるという反転機構65の一連の動作を制御する情報(またはプログラム)である。 The control unit 70 controls the substrate support units 66a and 66b, the suction means included therein, the substrate reversing unit 67, and the rotating shaft unit 68 based on the information received from the storage unit 168. The control unit 70 stores rotation information for controlling the rotation of the substrate 5. The rotation information for controlling the rotation of the substrate 5 is rotation information for controlling the reversing mechanism 65. (1) The substrate 5 arrives at the substrate support portion 66a (or 66b), and (2) the sensor senses the substrate 5. (Sensor ON), (3) the substrate 5 is held by the arm group of the substrate support portion 66a, (4) the substrate 5 is inverted, and (5) the substrate inversion portion 67 is inverted after the substrate 5 is released. This is information (or a program) for controlling a series of operations of the reversing mechanism 65.
 当該構成によれば、例えば、基板5の搬送速度(または、搬送方向D1・D2、反転軸Mの位置、基板5の回転速度)の変更情報を入力部166から記憶部168へ送信し、容易に反転機構65の動作に反映させることが可能である。制御部70は、CPU(central processing unit)、上記プログラムを記憶したROM(read only memory)、上記プログラムを展開するRAM、上記プログラムおよび各種データを記憶するメモリ等の記憶装置(記録媒体)などを備えた構成とすることができる。 According to this configuration, for example, change information on the conveyance speed of the substrate 5 (or the conveyance direction D1, D2, the position of the reversing axis M, the rotation speed of the substrate 5) is transmitted from the input unit 166 to the storage unit 168 for easy This can be reflected in the operation of the reversing mechanism 65. The control unit 70 includes a CPU (central processing unit), a ROM (read only memory) that stores the program, a RAM that expands the program, a storage device (recording medium) such as a memory that stores the program and various data, and the like. It can be set as the structure provided.
 <その他の付帯的構成>
 さらに、好ましい形態として、製造システム100は、制御部70、洗浄部71、貼りずれ検査装置72および貼合異物自動検査装置73および仕分け搬送装置74を備えている。貼りずれ検査装置72、貼合異物自動検査装置73および仕分け搬送装置74は、貼合後の基板5、すなわち、液晶表示装置に対して検査等の処理を行うものである。
<Other incidental configurations>
Furthermore, as a preferable form, the manufacturing system 100 includes a control unit 70, a cleaning unit 71, a misalignment inspection device 72, a bonded foreign matter automatic inspection device 73, and a sorting and conveying device 74. The bonding deviation inspection device 72, the bonded foreign substance automatic inspection device 73, and the sorting and conveying device 74 perform processing such as inspection on the substrate 5 after bonding, that is, the liquid crystal display device.
 図12は上記液晶表示装置の製造システムが備える各部材の関連を示すブロック図であり、図13は液晶表示装置の製造システムの動作を示すフローチャートである。以下、液晶表示装置が備える各部材の説明と共にその動作について説明する。 FIG. 12 is a block diagram showing the relationship of each member included in the above-described liquid crystal display device manufacturing system, and FIG. 13 is a flowchart showing the operation of the liquid crystal display device manufacturing system. Hereinafter, the operation of the liquid crystal display device will be described together with the description of each member.
 制御部70は、洗浄部71、貼りずれ検査装置72、貼合異物自動検査装置73および仕分け搬送装置74と接続されており、これらに制御信号を送信して制御するものである。制御部70は、主としてCPU(Central Processing Unit)により構成され、必要に応じてメモリ等を備える。 The control unit 70 is connected to the cleaning unit 71, the misalignment inspection device 72, the bonded foreign matter automatic inspection device 73, and the sorting and conveying device 74, and controls them by transmitting control signals thereto. The control unit 70 is mainly configured by a CPU (Central Processing Unit) and includes a memory or the like as necessary.
 製造システム100に洗浄部71が備えられている場合、洗浄部71でのタクトタイムを短縮するため、第1基板搬送機構61における基板5は、長辺間口にて洗浄部71に搬送されることが好ましい。通常、洗浄部71での洗浄は長時間を要するため、タクトタイムを短縮する観点から当該構成は非常に有効である。 In the case where the cleaning unit 71 is provided in the manufacturing system 100, the substrate 5 in the first substrate transport mechanism 61 is transported to the cleaning unit 71 at the front edge of the long side in order to reduce the tact time in the cleaning unit 71. Is preferred. Usually, since the cleaning in the cleaning unit 71 takes a long time, this configuration is very effective from the viewpoint of shortening the tact time.
 次に、偏光フィルムを基板5の両面に貼合する貼合工程(基板5の反転動作を含む)を行うが(図13のS2)、本工程については、図1~図10を用いて説明した通りである。 Next, a bonding step (including a reversing operation of the substrate 5) for bonding the polarizing film to both surfaces of the substrate 5 is performed (S2 in FIG. 13). This step will be described with reference to FIGS. That's right.
 貼りずれ検査装置72は、貼合された基板5における偏光フィルムの貼りずれの有無を検査するものである。貼りずれ検査装置72は、カメラおよび画像処理装置によって構成されており、ニップロール16・16aによって偏光フィルムが貼合された基板5の貼合位置に上記カメラが設置されている。上記カメラにて基板5の撮影が行われ、撮影された画像情報を処理することによって、基板5に貼りずれの有無を検査することができる(貼りずれ検査工程、図13のS3)。なお、貼りずれ検査装置72としては、従来公知の貼りずれ検査装置を使用可能である。 The sticking deviation inspection device 72 is for inspecting the presence or absence of sticking deviation of the polarizing film on the bonded substrate 5. The sticking deviation inspection device 72 is constituted by a camera and an image processing device, and the camera is installed at the bonding position of the substrate 5 on which the polarizing film is bonded by the nip rolls 16 and 16a. The substrate 5 is photographed by the camera, and by processing the photographed image information, the substrate 5 can be inspected for the presence or absence of sticking (sticking slip inspection step, S3 in FIG. 13). Note that as the misalignment inspection apparatus 72, a conventionally known misalignment inspection apparatus can be used.
 貼合異物自動検査装置73は、貼合された基板5における異物の有無を検査するものである。貼合異物自動検査装置73は、貼りずれ検査装置72と同様に、カメラおよび画像処理装置によって構成されており、ニップロール16・16aによって偏光フィルムが貼合された後の基板5の第2基板搬送機構(貼合装置60)に上記カメラが設置されている。上記カメラにて基板5の撮影が行われ、撮影された画像情報を処理することによって、基板5に貼合異物の有無を検査することができる(貼合異物検査工程、S4)。上記異物としては、埃などの異物、フィッシュアイなどが挙げられる。なお、貼合異物自動検査装置73としては、従来公知の貼合異物検査装置を使用可能である。 The bonded foreign matter automatic inspection device 73 inspects the presence or absence of foreign matter on the bonded substrate 5. The bonded foreign matter automatic inspection device 73 is configured by a camera and an image processing device, like the misalignment inspection device 72, and transports the second substrate of the substrate 5 after the polarizing film is bonded by the nip rolls 16 and 16a. The camera is installed in the mechanism (bonding device 60). The board | substrate 5 is image | photographed with the said camera, and the presence or absence of the bonding foreign material to the board | substrate 5 can be test | inspected by processing the image | photographed image information (bonding foreign material inspection process, S4). Examples of the foreign matter include foreign matters such as dust, fish eyes, and the like. In addition, as the bonding foreign material automatic inspection apparatus 73, a conventionally well-known bonding foreign material inspection apparatus can be used.
 S3およびS4は逆の順序でなされてもよいし、同時になされてもよい。また、一方の工程を省略することも可能である。 S3 and S4 may be performed in the reverse order or simultaneously. One step can be omitted.
 仕分け搬送装置74は、貼りずれ検査装置72および貼合異物自動検査装置73からの検査結果に基づき、貼りずれおよび異物の有無を判定する。仕分け搬送装置74は、貼りずれ検査装置72および貼合異物自動検査装置73から検査結果に基づく出力信号を受信して、貼合された基板5を良品または不良品に仕分けできるものであればよい。したがって、従来公知の仕分け搬送システムを用いることができる。 The sorting and conveying device 74 determines the presence or absence of sticking misalignment and foreign matter based on the inspection results from the sticking misalignment inspection device 72 and the bonded foreign matter automatic inspection device 73. The sorting and conveying device 74 only needs to receive an output signal based on the inspection result from the sticking misalignment inspection device 72 and the bonding foreign matter automatic inspection device 73 and can sort the bonded substrates 5 into non-defective products or defective products. . Therefore, a conventionally known sorting and conveying system can be used.
 当該液晶表示装置の製造システムでは好ましい態様として貼りずれおよび異物の両方を検出する構成となっており、貼りずれまたは異物が検査されたと判定された場合(YES)、貼合された基板5は不良品として仕分けされる(S7)。一方、貼りずれおよび異物のいずれもが検知されなかったと判定された場合(NO)、貼合された基板5は良品として仕分けされる(S6)。 In the manufacturing system of the liquid crystal display device, as a preferred mode, both the misalignment and foreign matter are detected. When it is determined that the misalignment or foreign matter has been inspected (YES), the bonded substrate 5 is not used. Sorted as good (S7). On the other hand, when it is determined that neither sticking deviation nor foreign matter is detected (NO), the bonded substrates 5 are classified as non-defective products (S6).
 仕分け搬送装置74を備える液晶表示装置の製造システムによれば、良品および不良品の仕分けを速やかに行うことができ、タクトタイムを短縮することが可能である。貼りずれ検査装置72または貼合異物自動検査装置73のみが備えられている場合、仕分け搬送装置74は、貼りずれおよび異物の一方のみ有無を判定する構成であってもよい。 According to the manufacturing system of the liquid crystal display device provided with the sorting and conveying device 74, the non-defective product and the defective product can be quickly sorted, and the tact time can be shortened. When only the sticking misalignment inspection device 72 or the bonded foreign matter automatic inspection device 73 is provided, the sorting and conveying device 74 may be configured to determine the presence / absence of only one of the sticking misalignment and the foreign matter.
 なお、発明の詳細な説明の項においてなされた具体的な実施形態は、あくまでも、本発明の技術内容を明らかにするものであって、そのような具体例にのみ限定して狭義に解釈されるべきものではなく、本発明の精神と次に記載する請求の範囲内において、いろいろと変更して実施することができるものである。 It should be noted that the specific embodiments made in the detailed description of the invention are merely to clarify the technical contents of the present invention, and are limited to such specific examples and are interpreted narrowly. It should be understood that the invention can be practiced with various modifications within the spirit of the invention and within the scope of the following claims.
 また、本発明には以下の態様も含まれる。 The present invention also includes the following aspects.
 また、上記基板支持部は基板を吸着する吸着手段を備えることが好ましい。 In addition, it is preferable that the substrate support part includes an adsorption unit that adsorbs the substrate.
 これにより、基板支持部だけで基板を挟持する場合よりも、さらに基板を固定することができる。 Thereby, the substrate can be further fixed as compared with the case where the substrate is held only by the substrate support portion.
 また、本発明の偏光フィルムの貼合装置では、上記基板反転部に基板反転部と共に回転する回転軸部が備えられており、上記回転軸部は、上記反転軸に沿って配置されていることが好ましい。 Moreover, in the polarizing film bonding apparatus of the present invention, the substrate reversing portion is provided with a rotating shaft portion that rotates together with the substrate reversing portion, and the rotating shaft portion is disposed along the reversing axis. Is preferred.
 回転軸部は反転軸に沿って配置されているため、回転軸部を備える基板反転部は反転軸に沿ってより安定して回転可能である。したがって、基板の反転をより安定して行うことが可能となる。 Since the rotating shaft portion is disposed along the reversing axis, the substrate reversing portion including the rotating shaft portion can rotate more stably along the reversing axis. Therefore, the substrate can be reversed more stably.
 また、本発明の偏光フィルムの貼合装置では、偏光フィルムを搬送する第1フィルム搬送機構および第2フィルム搬送機構が備えられており、上記第1フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、上記第2フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、上記第1基板搬送機構および第2基板搬送機構は上記第1フィルム搬送機構および第2フィルム搬送機構の上部に備えられており、上記剥離フィルムが除去された偏光フィルムを基板に貼合する上記第1貼合部が上記第1フィルム搬送機構と第1基板搬送機構との間に、上記剥離フィルムが除去された偏光フィルムを基板に貼合する第2貼合部が上記第2フィルム搬送機構と第2基板搬送機構との間にそれぞれ備えられていることが好ましい。 Moreover, in the bonding apparatus of the polarizing film of this invention, the 1st film conveyance mechanism and 2nd film conveyance mechanism which convey a polarizing film are provided, and the said 1st film conveyance mechanism was protected by the peeling film. A plurality of unwinding sections for unwinding the polarizing film, a cutting section for cutting the polarizing film, a removing section for removing the release film from the polarizing film, and a plurality of winding sections for winding the removed release film are provided. The second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the peeling film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding units for winding the removed release film, wherein the first substrate transport mechanism and the second substrate transport mechanism are the first film transport. The first bonding unit is provided on the top of the structure and the second film transport mechanism, and bonds the polarizing film from which the release film has been removed to the substrate. The first film transport mechanism, the first substrate transport mechanism, It is preferable that the 2nd bonding part which bonds the polarizing film from which the said peeling film was removed to between a board | substrate is provided between the said 2nd film conveyance mechanism and the 2nd board | substrate conveyance mechanism.
 これにより、巻出部および巻取部が複数備えられているため、一方の巻出部における偏光フィルムの原反の残量が少なくなった場合、その原反に他方の巻出部に備えられた原反を連結させることが可能である。その結果、偏光フィルムの巻出しを停止させることなく、作業を続行することができ、生産効率を高めることができる。 Thereby, since the unwinding part and the winding part are provided in plural, when the remaining amount of the original film of the polarizing film in one unwinding part decreases, the other unwinding part is provided in the original film. It is possible to connect raw materials. As a result, the operation can be continued without stopping the unwinding of the polarizing film, and the production efficiency can be increased.
 また、本発明の偏光フィルムの貼合装置では、上記巻出部は偏光フィルムの巻芯方向に対して水平に移動可能であり、上記巻出部である第1巻出部および第2巻出部が並設されていることが好ましい。 In the polarizing film laminating apparatus of the present invention, the unwinding part can move horizontally with respect to the core direction of the polarizing film, and the first unwinding part and the second unwinding are the unwinding parts. It is preferable that the parts are arranged side by side.
 これにより、巻出部は巻芯方向に水平に移動するため、巻出部が上方へ移動する空間を確保する必要がない。したがって、上部に備えられた第1基板搬送機構および第2基板搬送機構と、下部の上記第1フィルム搬送機構および第2フィルム搬送機構が備える巻出部との空間を省スペースとすることができる。その結果、小型化された貼合装置を提供することができる。 Thereby, since the unwinding part moves horizontally in the core direction, it is not necessary to secure a space for the unwinding part to move upward. Therefore, the space between the first substrate transport mechanism and the second substrate transport mechanism provided in the upper part and the unwinding part provided in the first film transport mechanism and the second film transport mechanism in the lower part can be saved. . As a result, a miniaturized bonding apparatus can be provided.
 また、本発明の偏光フィルムの貼合装置では、第1巻出部から巻出された偏光フィルムおよび第2巻出部から巻出された偏光フィルムを連結させる、第1フィルム連結部および第2フィルム連結部が、上記の両偏光フィルムの通過位置を介在し、かつ、第1フィルム連結部は第1巻出部から巻出された偏光フィルムに対向して配置され、第2フィルム連結部は第2巻出部から巻出された偏光フィルムに対向して配置されており、上記第1フィルム連結部および第2フィルム連結部は、偏光フィルムを吸着可能な吸着機構を備える2つの吸着部と、上記2つの吸着部の間であり、かつ、偏光フィルムの幅方向に沿って回転可能に配置された、切断貼合部とを備えており、上記切断貼合部は、偏光フィルムを切断する切断機を備えていると共に、切断貼合部が有する複数面は、偏光フィルムの幅方向に沿って偏光フィルムを支持する切断支持面と、上記偏光フィルム同士を連結する連結材を吸着して保持する吸着機構を備えた、2以上の貼合面とを少なくとも有しており、上記第1フィルム連結部および第2フィルム連結部は、互いに近接可能であることが好ましい。 Moreover, in the bonding apparatus of the polarizing film of this invention, the 1st film connection part and 2nd which connect the polarizing film unwound from the 1st unwinding part, and the polarizing film unwound from the 2nd unwinding part. The film connecting part is interposed between the passage positions of both the polarizing films, and the first film connecting part is disposed to face the polarizing film unwound from the first unwinding part, and the second film connecting part is It arrange | positions facing the polarizing film unwound from the 2nd unwinding part, The said 1st film connection part and 2nd film connection part are two adsorption | suction parts provided with the adsorption | suction mechanism which can adsorb | suck a polarizing film, and And a cutting and bonding part that is disposed between the two adsorbing parts and is rotatably arranged along the width direction of the polarizing film. The cutting and bonding part cuts the polarizing film. With a cutting machine The plurality of surfaces of the cutting and bonding unit includes a cutting support surface that supports the polarizing film along the width direction of the polarizing film, and an adsorption mechanism that adsorbs and holds the connecting material that connects the polarizing films to each other. It has at least the above bonding surface, and it is preferable that the first film connecting portion and the second film connecting portion can be close to each other.
 これにより、上記吸着部によって偏光フィルムを吸着し、吸着した偏光フィルムを切断支持面にて支持した状態にて切断機によって切断することができる。その後、切断貼合部を回転させて、切断した偏光フィルムに対して、貼合面の連結材を貼合することができる。さらに、第1フィルム連結部および第2フィルム連結部を互いに近接させ、連結材が貼合された2枚の偏光フィルムを接触させて容易に連結することができる。 Thereby, the polarizing film can be adsorbed by the adsorbing portion, and the adsorbing polarizing film can be cut by the cutting machine while being supported by the cutting support surface. Then, the cutting bonding part can be rotated and the connection material of a bonding surface can be bonded with respect to the cut | disconnected polarizing film. Furthermore, the 1st film connection part and the 2nd film connection part can mutually be brought close, and the two polarizing films with which the connection material was bonded can be contacted and can be connected easily.
 また、本発明の偏光フィルムの貼合装置では、上記切断支持面には、上記偏光フィルムの幅方向に沿って上記切断機が通過可能な開口が形成されていることが好ましい。 In the polarizing film laminating apparatus of the present invention, it is preferable that an opening through which the cutting machine can pass is formed in the cutting support surface along the width direction of the polarizing film.
 これにより、切断機の通過を、偏光フィルムの幅方向に沿って確実に行うことができ、後に偏光フィルム同士の連結をより正確に行うことができる。 Thereby, the cutting machine can be reliably passed along the width direction of the polarizing film, and the polarizing films can be more accurately connected later.
 また、本発明の偏光フィルムの貼合装置では、上記切断機が丸刃状であることが好ましい。 Moreover, in the polarizing film laminating apparatus of the present invention, it is preferable that the cutting machine has a round blade shape.
 これにより、偏光フィルムの切断をより容易に行うことが可能となる。 This makes it possible to cut the polarizing film more easily.
 また、本発明の偏光フィルムの貼合装置では、上記切断貼合部は、吸着部によって吸着された偏光フィルムに対して垂直方向に移動可能であることが好ましい。 Moreover, in the polarizing film bonding apparatus of the present invention, it is preferable that the cutting and bonding part is movable in the vertical direction with respect to the polarizing film adsorbed by the adsorption part.
 これにより、切断貼合部が回転する際、切断貼合部は偏光フィルムに対して垂直方向であって、偏光フィルムに遠ざかる方向に移動でき、その後、回転することができる。これにより、切断貼合部が回転する際、偏光フィルムに接触することを確実に回避することができる。 Thereby, when the cutting and bonding part rotates, the cutting and bonding part can move in a direction perpendicular to the polarizing film and away from the polarizing film, and then rotate. Thereby, when a cutting bonding part rotates, it can avoid reliably contacting a polarizing film.
 また、本発明の偏光フィルムの貼合装置では、上記第1フィルム搬送機構および上記第2フィルム搬送機構には、第1巻出部から巻出された偏光フィルムに付された欠点表示を検出する欠点検出部と、上記欠点表示を判別して、上記基板の搬送を停止させる貼合回避部と、基板との貼合が回避された偏光フィルムを回収する回収部とを有することが好ましい。 Moreover, in the polarizing film bonding apparatus of the present invention, the first film transport mechanism and the second film transport mechanism detect a defect display attached to the polarizing film unwound from the first unwinding section. It is preferable to have a defect detection unit, a bonding avoidance unit that discriminates the defect display and stops the conveyance of the substrate, and a recovery unit that recovers the polarizing film from which bonding with the substrate is avoided.
 上記欠点検出部、貼合回避部および回収部によれば、欠点を有する偏光フィルムと基板との貼合わせを回避できるため、歩留まりを高めることができる。 According to the defect detection unit, the bonding avoidance unit, and the recovery unit, since it is possible to avoid the bonding between the polarizing film having a defect and the substrate, the yield can be increased.
 また、本発明の偏光フィルムの貼合装置では、上記第1貼合部によって基板の下面に偏光フィルムを貼合する前に、基板を洗浄する洗浄部を備え、上記第1基板搬送機構は、基板の短辺が搬送方向に沿った状態にて基板を搬送することが好ましい。 Moreover, in the polarizing film bonding apparatus of the present invention, before the polarizing film is bonded to the lower surface of the substrate by the first bonding portion, the first film transporting mechanism includes a cleaning unit for cleaning the substrate. It is preferable to transport the substrate with the short side of the substrate along the transport direction.
 これにより、基板の搬送方向に対して基板の長辺が直交する状態にて、洗浄部による基板の洗浄を行うことができる。すなわち、搬送方向に沿った基板の距離を小さくすることができるため、洗浄に必要なタクトタイムをより短縮することができる。その結果、さらに生産効率に優れた偏光フィルムの貼合装置を提供することができる。 Thereby, the substrate can be cleaned by the cleaning unit in a state where the long sides of the substrate are orthogonal to the substrate transport direction. That is, since the distance of the substrate along the transport direction can be reduced, the tact time required for cleaning can be further shortened. As a result, it is possible to provide a polarizing film laminating apparatus that is further excellent in production efficiency.
 また、本発明の液晶表示装置の製造システムでは、上記偏光フィルムの貼合装置と、上記第2貼合部によって偏光フィルムの貼合がなされた基板における貼りずれを検査する貼りずれ検査装置を備えることが好ましい。 Moreover, in the manufacturing system of the liquid crystal display device of this invention, the bonding apparatus of the said polarizing film and the sticking | shift detection apparatus which test | inspects the sticking gap in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part are provided. It is preferable.
 これにより、偏光フィルムを貼合した基板に生じた貼りずれを検査することが可能である。 This makes it possible to inspect for misalignment occurring on the substrate to which the polarizing film is bonded.
 また、本発明の液晶表示装置の製造システムでは、上記貼りずれ検査装置による検査結果に基づき貼りずれの有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備えることが好ましい。 Further, in the liquid crystal display manufacturing system of the present invention, the presence / absence of sticking misalignment is determined based on the inspection result of the sticking misalignment inspection apparatus, and the substrate on which the polarizing film is bonded is classified based on the determination result. It is preferable to provide a transport device.
 これにより、偏光フィルムが貼合された基板に貼りずれが生じている場合、速やかに不良品の仕分けを行うことができ、タクトタイムを短縮することが可能である。 Thereby, when there is a sticking error on the substrate on which the polarizing film is bonded, it is possible to quickly sort defective products and shorten the tact time.
 また、本発明の液晶表示装置の製造システムでは、偏光フィルムの貼合装置と、上記貼合装置における第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置とを備えることが好ましい。 Moreover, in the manufacturing system of the liquid crystal display device of this invention, the bonding foreign material automatic which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the bonding apparatus of a polarizing film and the 2nd bonding part in the said bonding apparatus. It is preferable to provide an inspection device.
 これにより、偏光フィルムを貼合した液晶パネルに混入した異物を検査することが可能である。 This makes it possible to inspect foreign matter mixed in the liquid crystal panel to which the polarizing film is bonded.
 また、本発明の液晶表示装置の製造システムでは、上記貼合異物自動検査装置による検査結果に基づき異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備えることが好ましい。 Moreover, in the manufacturing system of the liquid crystal display device of this invention, the presence or absence of a foreign material is determined based on the inspection result by the said bonded foreign material automatic test | inspection apparatus, and the board | substrate with which the polarizing film was bonded is performed based on the said determination result. It is preferable to provide a sorting and conveying device.
 これにより、偏光フィルムを貼合した液晶パネルに異物が混入している場合、速やかに不良品の仕分けを行うことができ、タクトタイムを短縮することが可能である。 Thus, when foreign matter is mixed in the liquid crystal panel bonded with the polarizing film, it is possible to quickly sort defective products and shorten the tact time.
 また、本発明の液晶表示装置の製造システムでは、上記第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置を備え、上記貼りずれ検査装置による検査結果、および、上記貼合異物自動検査装置による検査結果に基づき、貼りずれおよび異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備えることが好ましい。 Moreover, in the manufacturing system of the liquid crystal display device of this invention, it has the bonding foreign material automatic test | inspection apparatus which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part, and test | inspected by the said sticking | shift detection apparatus Based on the result and an inspection result by the bonded foreign matter automatic inspection device, a determination is made as to whether there is a sticking deviation and a foreign matter, and based on the determination result, a sorting and conveying device is provided that sorts the substrate on which the polarizing film is bonded. It is preferable.
 これにより、偏光フィルムを貼合した液晶パネルに貼りずれまたは異物の混入が生じている場合、速やかに不良品の仕分けを行うことができ、タクトタイムを短縮することが可能である。 Thus, when the liquid crystal panel on which the polarizing film is bonded is stuck or mixed with foreign matter, defective products can be quickly sorted and the tact time can be shortened.
 本発明に係る偏光フィルムの貼合装置は、偏光フィルムを基板に貼合する分野にて利用可能である。 The polarizing film bonding apparatus according to the present invention can be used in the field of bonding a polarizing film to a substrate.
 1・1b  第1巻出部
 1a・1c 第2巻出部
 1d    巻芯
 2     第1巻取部
 2a    第2巻取部
 3     ハーフカッター
 4     ナイフエッジ
 5・5’  基板
 6・6a  ニップロール(第1貼合部)
 7・7a  欠点フィルム巻取ローラー
 10・20 偏光フィルム
 10a   偏光フィルム
 10b   剥離フィルム
 11    第1巻出部
 11a   第2巻出部
 12    第1巻取部
 12a   第2巻取部
 13    ハーフカッター
 14    ナイフエッジ
 15    コンベアーロール
 16・16a    ニップロール(第2貼合部)
 17・17a    欠点フィルム巻取ローラー
 40    HEPAフィルター
 41    グレーチング
 50    フィルム搬送機構
 51    第1フィルム搬送機構
 52    第2フィルム搬送機構
 60    貼合装置(偏光フィルムの貼合装置)
 61    第1基板搬送機構
 62    第2基板搬送機構
 65    反転機構
 66a・66b   基板支持部
 67    基板反転部
 68    回転軸部
 70    制御部
 71    洗浄部
 72    検査装置
 73    貼合異物自動検査装置
 74    搬送装置
 83・93 フィルム連結部
 84・84a・94・94a   吸着部
 85・95 切断貼合部
 85a・95a   切断支持面
 85b・85c・95b・95c   貼合面
 85d・95d   片面粘着テープ
 86・96 開口
 87    切断機
 88    台部
 89    吸着機構
 100   製造システム(液晶表示装置の製造システム)
 165   インターフェイス部
 166   入力部
 167   表示部
 168   記憶部
 D1    搬送方向
 D2    搬送方向
 M     反転軸
1 · 1b 1st unwinding portion 1a · 1c 2nd unwinding portion 1d winding core 2 1st winding portion 2a 2nd winding portion 3 half cutter 4 knife edge 5 · 5 ′ substrate 6 · 6a nip roll (first sticking) Joint)
7.7a Defect film winding roller 10.20 Polarizing film 10a Polarizing film 10b Peeling film 11 First unwinding part 11a Second unwinding part 12 First winding part 12a Second winding part 13 Half cutter 14 Knife edge 15 Conveyor roll 16.16a Nip roll (second bonding part)
17.17a Defect film winding roller 40 HEPA filter 41 Grating 50 Film transport mechanism 51 First film transport mechanism 52 Second film transport mechanism 60 Bonding device (polarizing film bonding device)
61 First substrate transport mechanism 62 Second substrate transport mechanism 65 Reversing mechanism 66a / 66b Substrate support portion 67 Substrate reversing portion 68 Rotating shaft portion 70 Control portion 71 Cleaning portion 72 Inspection device 73 Bonding foreign matter automatic inspection device 74 Conveyance device 83 93 Film connecting part 84 / 84a / 94 / 94a Adsorbing part 85/95 Cutting and bonding part 85a / 95a Cutting support surface 85b / 85c / 95b / 95c Bonding surface 85d / 95d Single-sided adhesive tape 86/96 Opening 87 Cutting machine 88 Stand 89 Adsorption mechanism 100 Manufacturing system (Liquid crystal display manufacturing system)
165 Interface unit 166 Input unit 167 Display unit 168 Storage unit D1 Transport direction D2 Transport direction M Reverse axis

Claims (16)

  1.  長方形の基板を長辺または短辺が搬送方向に沿った状態にて搬送する第1基板搬送機構と、
     上記第1基板搬送機構における上記基板の下面に偏光フィルムを貼合する第1貼合部と、
     上記第1基板搬送機構にて搬送された上記基板を反転させて第2基板搬送機構に配置する反転機構と、
     上記基板を短辺または長辺が搬送方向に沿った状態にて搬送する第2基板搬送機構と、
     上記第2基板搬送機構における上記基板の下面に偏光フィルムを貼合する第2貼合部とを含む偏光フィルムの貼合装置であって、
     上記第1基板搬送機構および第2基板搬送機構は、基板を同一方向に搬送するものであり、
     第1基板搬送機構によって搬送された、長辺または短辺が搬送方向に沿った基板を、短辺または長辺が第2基板搬送機構の基板の搬送方向に沿った状態に反転させる反転機構を備え、
     上記反転機構は基板支持部と、上記基板支持部に連結された基板反転部とを備えており、
     上記基板支持部は、第1基板搬送機構によって搬送された基板を載置可能であり、さらに載置された基板を挟持可能であり、
     上記基板反転部は反転軸を中心として回転することによって基板を反転させるものであり、
     第1基板搬送機構における反転前の基板の中心を通り、上記基板の搬送方向と垂直な直線に対して45°の傾きを有する直線を含み、第1基板搬送機構における反転前の基板を含む面内に上記反転軸が位置しており、
     上記基板支持部は、上記反転軸に対して線対称に一対備えられている偏光フィルムの貼合装置。
    A first substrate transport mechanism for transporting a rectangular substrate with a long side or a short side along the transport direction;
    A first bonding unit for bonding a polarizing film to the lower surface of the substrate in the first substrate transport mechanism;
    A reversing mechanism for inverting the substrate transported by the first substrate transporting mechanism and placing it on the second substrate transporting mechanism;
    A second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction;
    A polarizing film laminating apparatus comprising: a second laminating unit for laminating a polarizing film on the lower surface of the substrate in the second substrate transport mechanism,
    The first substrate transport mechanism and the second substrate transport mechanism transport substrates in the same direction,
    A reversing mechanism for reversing a substrate having a long side or a short side along the transport direction, which has been transported by the first substrate transport mechanism, to a state where the short side or the long side is along the substrate transport direction of the second substrate transport mechanism; Prepared,
    The reversing mechanism includes a substrate supporting portion and a substrate reversing portion connected to the substrate supporting portion,
    The substrate support unit can place the substrate transported by the first substrate transport mechanism, and can sandwich the placed substrate.
    The substrate reversing part is for reversing the substrate by rotating around the reversing axis,
    A surface including a straight line that passes through the center of the substrate before reversal in the first substrate transport mechanism and has an inclination of 45 ° with respect to a straight line perpendicular to the transport direction of the substrate, and includes the substrate before reversal in the first substrate transport mechanism The reversing axis is located inside,
    The said board | substrate support part is a bonding apparatus of the polarizing film with which a pair is provided with line symmetry with respect to the said inversion axis | shaft.
  2.  上記基板支持部が基板を吸着する吸着手段を備える請求項1に記載の偏光フィルムの貼合装置。 The polarizing film laminating apparatus according to claim 1, wherein the substrate support unit includes an adsorption unit that adsorbs the substrate.
  3.  上記基板反転部に基板反転部と共に回転する回転軸部が備えられており、
     上記回転軸部は、上記反転軸に沿って配置されている請求項1または2に記載の偏光フィルムの貼合装置。
    The substrate reversing portion is provided with a rotating shaft portion that rotates together with the substrate reversing portion,
    The polarizing film bonding apparatus according to claim 1, wherein the rotation shaft portion is disposed along the reversal axis.
  4.  偏光フィルムを搬送する第1フィルム搬送機構および第2フィルム搬送機構が備えられており、
     上記第1フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、
     上記第2フィルム搬送機構には、剥離フィルムに保護された偏光フィルムを巻出す複数の巻出部と、偏光フィルムを切断する切断部と、偏光フィルムから剥離フィルムを除去する除去部と、除去された上記剥離フィルムを巻取る複数の巻取部とが備えられており、
     上記第1基板搬送機構および第2基板搬送機構は上記第1フィルム搬送機構および第2フィルム搬送機構の上部に備えられており、
     上記剥離フィルムが除去された偏光フィルムを基板に貼合する上記第1貼合部が上記第1フィルム搬送機構と第1基板搬送機構との間に、上記剥離フィルムが除去された偏光フィルムを基板に貼合する第2貼合部が上記第2フィルム搬送機構と第2基板搬送機構との間にそれぞれ備えられている請求項1~3の何れか1項に記載の偏光フィルムの貼合装置。
    A first film transport mechanism and a second film transport mechanism for transporting the polarizing film;
    The first film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the release film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding sections for winding the release film,
    The second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the release film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding sections for winding the release film,
    The first substrate transport mechanism and the second substrate transport mechanism are provided above the first film transport mechanism and the second film transport mechanism,
    The first bonding portion for bonding the polarizing film from which the release film has been removed to the substrate is between the first film transport mechanism and the first substrate transport mechanism, and the polarizing film from which the release film has been removed is the substrate. The polarizing film laminating device according to any one of claims 1 to 3, wherein a second laminating portion for laminating is provided between the second film conveying mechanism and the second substrate conveying mechanism. .
  5.  上記巻出部は偏光フィルムの巻芯方向に対して水平に移動可能であり、
     上記巻出部である第1巻出部および第2巻出部が並設されている請求項4に記載の偏光フィルムの貼合装置。
    The unwinding part is movable horizontally with respect to the core direction of the polarizing film,
    The bonding apparatus of the polarizing film of Claim 4 with which the 1st unwinding part and 2nd unwinding part which are the said unwinding parts are arranged in parallel.
  6.  第1巻出部から巻出された偏光フィルムおよび第2巻出部から巻出された偏光フィルムを連結させる、第1フィルム連結部および第2フィルム連結部が、上記の両偏光フィルムの通過位置を介在し、かつ、第1フィルム連結部は第1巻出部から巻出された偏光フィルムに対向して配置され、第2フィルム連結部は第2巻出部から巻出された偏光フィルムに対向して配置されており、
     上記第1フィルム連結部および第2フィルム連結部は、偏光フィルムを吸着可能な吸着機構を備える2つの吸着部と、上記2つの吸着部の間であり、かつ、偏光フィルムの幅方向に沿って回転可能に配置された、切断貼合部とを備えており、
     上記切断貼合部は、偏光フィルムを切断する切断機を備えていると共に、切断貼合部が有する複数面は、偏光フィルムの幅方向に沿って偏光フィルムを支持する切断支持面と、上記偏光フィルム同士を連結する連結材を吸着して保持する吸着機構を備えた、2以上の貼合面とを少なくとも有しており、
     上記第1フィルム連結部および第2フィルム連結部は、互いに近接可能である請求項5に記載の偏光フィルムの貼合装置。
    The first film connecting part and the second film connecting part for connecting the polarizing film unwound from the first unwinding part and the polarizing film unwound from the second unwinding part pass through the both polarizing films. And the first film connecting part is disposed opposite to the polarizing film unwound from the first unwinding part, and the second film connecting part is disposed on the polarizing film unwound from the second unwinding part. Are placed opposite each other,
    The first film connecting part and the second film connecting part are between two adsorbing parts having an adsorbing mechanism capable of adsorbing a polarizing film, and the two adsorbing parts, and along the width direction of the polarizing film. It is equipped with a cutting and pasting part arranged so as to be rotatable,
    The cutting and bonding unit includes a cutting machine that cuts the polarizing film, and the plurality of surfaces that the cutting and bonding unit has include a cutting support surface that supports the polarizing film along the width direction of the polarizing film, and the polarized light. It has at least two or more bonding surfaces provided with an adsorption mechanism that adsorbs and holds a coupling material that couples the films,
    The polarizing film laminating apparatus according to claim 5, wherein the first film connecting portion and the second film connecting portion are close to each other.
  7.  上記切断支持面には、上記偏光フィルムの幅方向に沿って、上記切断機が通過可能な開口が形成されている請求項6に記載の偏光フィルムの貼合装置。 The polarizing film laminating apparatus according to claim 6, wherein an opening through which the cutting machine can pass is formed along the width direction of the polarizing film on the cutting support surface.
  8.  上記切断機が丸刃状である請求項7に記載の偏光フィルムの貼合装置。 The polarizing film laminating apparatus according to claim 7, wherein the cutting machine has a round blade shape.
  9.  上記切断貼合部は、吸着部によって吸着された偏光フィルムに対して垂直方向に移動可能である請求項6~8の何れか1項に記載の偏光フィルムの貼合装置。 The polarizing film bonding apparatus according to any one of claims 6 to 8, wherein the cutting and bonding part is movable in a direction perpendicular to the polarizing film adsorbed by the adsorption part.
  10.  上記第1フィルム搬送機構および上記第2フィルム搬送機構には、第1巻出部から巻出された偏光フィルムに付された欠点表示を検出する欠点検出部と、
     上記欠点表示を判別して、上記基板の搬送を停止させる貼合回避部と、
     基板との貼合が回避された偏光フィルムを回収する回収部とを有する請求項4~9の何れか1項に記載の偏光フィルムの貼合装置。
    In the first film transport mechanism and the second film transport mechanism, a defect detection unit that detects a defect display attached to the polarizing film unwound from the first unwinding unit;
    A bonding avoidance unit that determines the defect display and stops the conveyance of the substrate;
    The polarizing film laminating apparatus according to any one of claims 4 to 9, further comprising a recovery unit that recovers the polarizing film from which the pasting with the substrate is avoided.
  11.  上記第1貼合部によって基板の下面に偏光フィルムを貼合する前に、基板を洗浄する洗浄部を備え、
     上記第1基板搬送機構は、基板の短辺が搬送方向に沿った状態にて基板を搬送する請求項1~10の何れか1項に記載の偏光フィルムの貼合装置。
    Before the polarizing film is bonded to the lower surface of the substrate by the first bonding unit, a cleaning unit for cleaning the substrate is provided,
    The polarizing film laminating apparatus according to any one of claims 1 to 10, wherein the first substrate transport mechanism transports the substrate with a short side of the substrate along the transport direction.
  12.  請求項1~11の何れか1項に記載の偏光フィルムの貼合装置と、
     上記第2貼合部によって偏光フィルムの貼合がなされた基板における貼りずれを検査する貼りずれ検査装置を備える液晶表示装置の製造システム。
    A polarizing film laminating device according to any one of claims 1 to 11,
    The manufacturing system of a liquid crystal display device provided with the sticking | shift detection apparatus which test | inspects the sticking gap in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part.
  13.  上記貼りずれ検査装置による検査結果に基づき貼りずれの有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備える請求項12に記載の液晶表示装置の製造システム。 The liquid crystal display device according to claim 12, further comprising a sorting and conveying device that determines the presence or absence of sticking misalignment based on an inspection result by the sticking misalignment inspection device and sorts a substrate on which a polarizing film is bonded based on the determination result. Manufacturing system.
  14.  請求項1~11の何れか1項に記載の偏光フィルムの貼合装置と、
     上記貼合装置における第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置とを備える液晶表示装置の製造システム。
    A polarizing film laminating device according to any one of claims 1 to 11,
    The manufacturing system of a liquid crystal display device provided with the bonded foreign material automatic test | inspection apparatus which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the 2nd bonding part in the said bonding apparatus.
  15.  上記貼合異物自動検査装置による検査結果に基づき異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備える請求項14に記載の液晶表示装置の製造システム。 The liquid crystal display according to claim 14, further comprising a sorting and conveying device that determines the presence or absence of foreign matter based on an inspection result by the bonded foreign matter automatic inspection apparatus, and sorts a substrate on which a polarizing film is bonded based on the determination result. Equipment manufacturing system.
  16.  上記第2貼合部によって偏光フィルムの貼合がなされた基板における異物を検査する貼合異物自動検査装置を備え、
     上記貼りずれ検査装置による検査結果、および、上記貼合異物自動検査装置による検査結果に基づき、貼りずれおよび異物の有無を判定し、当該判定結果に基づき、偏光フィルムが貼合された基板の仕分けを行う仕分け搬送装置を備える請求項12に記載の液晶表示装置の製造システム。
    It is equipped with a bonded foreign matter automatic inspection device that inspects foreign matters on the substrate on which the polarizing film has been bonded by the second bonding portion,
    Based on the inspection result by the above-mentioned pasting inspection device and the inspection result by the above-mentioned pasted foreign matter automatic inspection device, the presence or absence of pasting misalignment and foreign matter is determined, and the substrate on which the polarizing film is pasted is determined based on the determination result. The manufacturing system of the liquid crystal display device of Claim 12 provided with the sorting conveyance apparatus which performs.
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