JP5733547B2 - Equipment for manufacturing optical member laminate - Google Patents

Description

The present invention relates to an apparatus for manufacturing an optical member bonded body.
This application claims priority based on Japanese Patent Application No. 2012-197453 filed in Japan on September 7, 2012 and Japanese Patent Application No. 2013-104148 filed in Japan on May 16, 2013, The contents are incorporated here.

  Conventionally, in a production system for an optical display device such as a liquid crystal display, an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is formed from a long film into a sheet piece having a size matching the display area of the liquid crystal panel. After being cut out, it is bonded to a liquid crystal panel (for example, see Patent Document 1).

Japanese Unexamined Patent Publication No. 2003-255132

  In the conventional configuration, a sheet piece slightly larger than the display area is cut out in consideration of the dimensional variation of the liquid crystal panel and the sheet piece and the bonding variation (positional deviation) of the sheet piece to the liquid crystal panel. Therefore, an extra area (frame part) is formed in the peripheral part of the display area, and there is a problem that downsizing of the device is hindered.

  The aspect of this invention aims at providing the manufacturing apparatus of the optical member bonding body which can aim at expansion of a display area and size reduction of an apparatus by reducing the frame part around a display area.

  In order to achieve the above object, one embodiment of the present invention is an apparatus for manufacturing an optical member bonded body configured by bonding an optical member to an optical display component, and one of the optical member and the optical member A separator that is detachably stacked on the surface of the optical display component, and conveys a belt-shaped optical sheet having a width that is larger than either one of the long side and the short side of the display region of the optical display component The optical member is cut from the separator constituting the optical sheet conveyed from the conveying unit and the conveying unit to a length larger than the other one of the long side and the short side of the display region, and the sheet Separating the sheet pieces separated into pieces and supplying the separated sheet pieces to a bonding position where the sheet pieces are bonded to the optical display component; and the sheet pieces supplied from the separation unit to the optical display component Paste The excess part arrange | positioned on the outer side of the opposing part which opposes the said display area from the said sheet | seat piece bonded to the optical display component by laser cutting, and the magnitude | size corresponding to the said display area And a cutting device for forming the optical member.

  The “opposite part facing the display area” in the above configuration is an area that is not less than the size of the display area and not more than the size of the outer shape of the optical display component, and avoids a functional part such as an electrical component mounting part. Indicates the area. That is, the said structure includes the case where the surplus part is laser-cut along the outer periphery of an optical display component.

  Another aspect of the present invention is an apparatus for manufacturing an optical member bonded body configured by bonding an optical member to an optical display component, and is stacked on the optical member and one surface of the optical member in a separable manner. A separator, and a transport unit that transports a strip-shaped optical sheet having a width larger than either one of the long side and the short side of the display region of the optical display component, and the transport unit The optical member from the separator constituting the optical sheet conveyed from the sheet is cut into a length larger than the other of the long side and the short side of the display region and separated as a sheet piece, and separated. A separation unit that supplies the sheet piece to a bonding position where the sheet piece is bonded to the optical display component; and a bonding unit that bonds the sheet piece supplied from the separation unit to the optical display component; The above Corresponding to the bonding surface from the detection device for detecting the outer peripheral edge of the bonding surface of the optical display component and the sheet piece bonded to the optical display component, and the sheet piece bonded to the optical display component A cutting device that cuts off an excess portion disposed outside the portion by laser cutting and forms the optical member having a size corresponding to the bonding surface, the cutting device detected by the detection device The said sheet piece is cut | disconnected along the outer periphery of the said bonding surface of the said optical display component and the said sheet piece.

In addition, the "bonding surface of an optical member sheet | seat and an optical display component" in the said structure points out the surface facing the optical member sheet | seat of an optical display component. The “outer peripheral edge of the bonding surface” specifically refers to the outer peripheral edge of the substrate on the side where the optical member sheet is bonded in the optical display component.
In addition, the “part corresponding to the bonding surface” of the optical member sheet means that the optical member sheet has an outer shape (in plan view) that is equal to or larger than the size of the display area of the optical display component facing the optical member sheet. It is a region that is equal to or smaller than the size of the (contour shape) and that avoids a functional part such as an electrical component mounting portion in the optical display component. Similarly, the “size corresponding to the bonding surface” refers to a size not less than the size of the display area of the optical display component and not more than the size of the outer shape (contour shape in plan view) of the optical display component.

  According to the aspect of the present invention, the frame portion around the display area can be reduced to enlarge the display area and downsize the device.

It is a schematic diagram which shows the manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention. It is a top view of a liquid crystal panel. It is AA sectional drawing of FIG. It is sectional drawing of an optical sheet. It is a figure which shows operation | movement of a cutting device. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is sectional drawing which shows the cutting end by the laser of the sheet piece bonded by the liquid crystal panel. It is sectional drawing which shows the cutting end by the laser of a sheet piece single-piece | unit. It is a top view which shows the detection process of the edge of a bonding surface. It is a schematic diagram of a detection apparatus. It is a schematic diagram which shows the modification of a detection apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

  In all the drawings below, the dimensions and ratios of the respective constituent elements are appropriately changed in order to make the drawings easy to see. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

  In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the transport direction of the liquid crystal panel, which is an optical display component, is the X direction, and the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, X direction, and Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

Hereinafter, the film bonding system 1 which is a manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention is demonstrated with reference to drawings.
Drawing 1 is a figure showing the schematic structure of film pasting system 1 of this embodiment.
The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, an antireflection film, and a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.

  As shown in FIG. 1, the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by the control part 40 as an electronic control apparatus.

  FIG. 2 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. FIG. The liquid crystal panel P includes a rectangular first substrate P1 in a plan view, a relatively small rectangular second substrate P2 disposed to face the first substrate P1, and a first substrate P1 and a second substrate P2. And a liquid crystal layer P3 encapsulated therebetween. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view. In the liquid crystal panel P, an area that fits inside the outer periphery of the liquid crystal layer P3 in plan view is defined as a display area P4.

  3 is a cross-sectional view taken along the line AA in FIG. On the front and back surfaces of the liquid crystal panel P, a first optical member cut out from the first optical sheet F1 and the second optical sheet F2 having a long strip shape (see FIG. 1, hereinafter may be collectively referred to as an optical sheet FX). F11 and the second optical member F12 (hereinafter may be collectively referred to as an optical member F1X) are appropriately bonded. In the present embodiment, the first optical member F11 and the second optical member F12 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively.

  Note that the first optical member F11 and the second optical member F12 are formed from a first sheet piece F1m and a second sheet piece F2m (hereinafter, collectively referred to as a sheet piece FXm), respectively, of the liquid crystal panel P. It is formed by cutting off the excess portions outside the facing portion facing the display area P4.

  FIG. 4 is a partial cross-sectional view of the optical sheet FX bonded to the liquid crystal panel P. The optical sheet FX includes a film-like optical member main body F1a, an adhesive layer F2a provided on one surface (the upper surface in FIG. 4) of the optical member main body F1a, and one of the optical member main bodies F1a via the adhesive layer F2a. Separator F3a laminated | stacked on the surface so that isolation | separation was possible, and the surface protection film F4a laminated | stacked on the other surface (lower surface in FIG. 4) of the optical member main body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and the peripheral area of the liquid crystal panel P. For convenience of illustration, hatching of each layer in FIG. 4 is omitted.

  The optical member body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface of the optical member body F1a. Hereinafter, the part remove | excluding the separator F3a from the optical sheet FX is called the bonding sheet | seat F5.

  The separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical sheet FX may be configured not to include the surface protective film F4a, or the surface protective film F4a may be configured not to be separated from the optical member body F1a.

  The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. A second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

  The optical member main body F1a may have a single-layer structure composed of one optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancement film, or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.
As shown in FIG. 1, the film bonding system 1 of the present embodiment has a downstream side (− in the transport direction of the liquid crystal panel P on the left side in the figure from the upstream side in the transport direction (+ X direction side) of the liquid crystal panel P on the right side in the figure. X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.

  The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary. On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P <b> 4 is along the transport direction. On the other hand, on the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P <b> 4 along the transport direction. On the front and back surfaces of the liquid crystal panel P, a sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical sheet FX is bonded.

  In addition, the upstream conveyor 6 is provided with the independent free roller conveyor 24 in the downstream in the 1st adsorption | suction apparatus 11 mentioned later. On the other hand, the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.

  The film bonding system 1 of this embodiment is the 1st adsorption | suction apparatus 11, the 1st dust collector 12, the 1st bonding apparatus 13, the 1st cutting device 31, the inversion apparatus 15, the 2nd dust collector 16, 2nd. A bonding device 17, a second cutting device 32, and a control unit 40 are provided.

  The first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P. The first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P. The panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P. When the conveyance is finished, the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.

In the alignment camera 11b, the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state. Image data obtained by the alignment camera 11b is transmitted to the control unit 40. Based on the image data, the panel holding unit 11a is operated to align the liquid crystal panel P with the free roller conveyor 24 as a transport destination. In other words, the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the deviation in the turning direction around the vertical axis of the liquid crystal panel P. .
Here, the liquid crystal panel P conveyed on the rail R by the panel holding unit 11a is nipped by the pressure roll 23 together with the sheet piece FXm while being adsorbed by the adsorption pad 26.

  The 1st dust collector 12 is provided in the conveyance upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13. FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side of the liquid crystal panel P.

  The 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption | suction apparatus 11. FIG. The 1st bonding apparatus 13 bonds the bonding sheet | seat F5 (equivalent to 1st sheet piece F1m) cut into the predetermined size with respect to the lower surface of liquid crystal panel P introduced into the bonding position.

  The first bonding device 13 includes a transport device 22 and a pinching roll 23.

  The transport device 22 transports the optical sheet FX along the longitudinal direction of the optical sheet FX while unwinding the optical sheet FX from the original roll R1 around which the optical sheet FX is wound. The conveying apparatus 22 conveys the bonding sheet | seat F5 by using separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e. Here, the roll holding unit 22a and the plurality of guide rollers 22b correspond to a conveyance unit described in the claims. The cutting device 22c and the knife edge 22d correspond to a separation unit described in the claims.

The roll holding unit 22a holds the original roll R1 around which the belt-shaped optical sheet FX is wound and feeds the optical sheet FX along the longitudinal direction of the optical sheet FX.
The plurality of guide rollers 22b wind the optical sheet FX so as to guide the optical sheet FX unwound from the original roll R1 along a predetermined conveyance path.
The cutting device 22c performs a half cut on the optical sheet FX on the conveyance path.
The knife edge 22d supplies the bonding sheet F5 to the bonding position while separating the bonding sheet F5 from the separator F3a by winding the optical sheet FX subjected to the half cut at an acute angle.
The winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.

  The roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example. Thereby, the winding unit 22e winds up the separator F3a that has passed through the knife edge 22d while the roll holding unit 22a feeds the optical sheet FX in the conveyance direction of the optical sheet FX. Hereinafter, the upstream side in the transport direction of the optical sheet FX (separator F3a) in the transport device 22 is referred to as a sheet transport upstream side, and the downstream side in the transport direction is referred to as a sheet transport downstream side.

  Each guide roller 22b changes the traveling direction of the optical sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b is movable so as to adjust the tension of the optical sheet FX being conveyed.

  A dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical sheet FX conveyed from the roll holding unit 22a while the optical sheet FX is cut by the cutting device 22c.

FIG. 5 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
As shown in FIG. 5, when the optical sheet FX is fed out by a predetermined length, the cutting device 22c applies a part in the thickness direction of the optical sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical sheet FX. Make a half-cut to cut. The cutting device 22c of the present embodiment is provided so as to be able to advance and retreat toward the optical sheet FX from the side opposite to the separator F3a with respect to the optical sheet FX.

  The cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical sheet FX (so that a predetermined thickness remains in the separator F3a), Half-cut to the vicinity of the interface between the adhesive layer F2 and the separator F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

  The optical sheet FX after half-cutting is formed by cutting the optical member main body F1a and the surface protective film F4a in the thickness direction of the optical sheet FX, so that the cut line L1 extends across the entire width of the optical sheet FX. A line L2 is formed. A plurality of the cut lines L1 and the cut lines L2 are formed so as to be arranged in the longitudinal direction of the belt-shaped optical sheet FX. For example, in the case of the bonding process which conveys the liquid crystal panel P of the same size, the plurality of cut lines L1 and cut lines L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX. The optical sheet FX is divided into a plurality of sections in the longitudinal direction by the plurality of cut lines L1 and the cut lines L2. A section sandwiched between a pair of cut lines L1 and L2 adjacent in the longitudinal direction in the optical sheet FX is a sheet piece FXm in the bonding sheet F5. The sheet piece FXm is a sheet piece of the optical sheet FX having a size larger than the display area P4 of the liquid crystal panel P.

  Returning to FIG. 1, the knife edge 22 d is arranged below the upstream conveyor 6 and extends at least over the entire width of the optical sheet FX in the width direction of the optical sheet FX. The knife edge 22d winds the optical sheet FX so as to be in sliding contact with the separator F3a side of the optical sheet FX after the half cut.

  The knife edge 22d is seen from the width direction of the optical sheet FX above the first surface, and the first surface arranged in an inclined position when viewed from the width direction of the optical sheet FX (width direction of the upstream conveyor 6). It has the 2nd surface arrange | positioned at an acute angle with respect to a 1st surface, and the front-end | tip part where a 1st surface and a 2nd surface cross.

  In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical sheet F1 at an acute angle around the front-end | tip part of the knife edge 22d. The first optical sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d is introduced between the pair of bonding rollers 23a of the pinching roll 23 while overlapping the lower surface of the liquid crystal panel P in a state of being sucked by the first suction device 11. Is done. The first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size larger than the display area P4 of the liquid crystal panel P.

  On the other hand, the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d. The winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.

  The pinching roll 23 bonds the first sheet F1m separated from the first optical sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6. Here, the pinching roll 23 is equivalent to the bonding part as described in a claim.

  The pinching roll 23 includes a pair of bonding rollers 23a and a bonding roller 23a that are arranged in parallel with each other in the axial direction (the upper bonding roller 23a moves up and down). A predetermined gap is formed between the pair of bonding rollers 23 a and the bonding roller 23 a, and the inside of this gap is the bonding position of the first bonding device 13.

  In the gap between the pair of bonding rollers 23a and the bonding rollers 23a, the liquid crystal panel P and the first sheet piece F1m are overlapped and introduced. These liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being clamped by each bonding roller 23a. In this embodiment, 1st optical member bonding body PA1 is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG.

  The 1st cutting device 31 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st cutting device 31 cut | disconnects the excess part arrange | positioned outside the part facing the display area P4 of liquid crystal panel P from the 1st sheet piece F1m bonded by liquid crystal panel P, and displays area P4 of liquid crystal panel P An optical member having a size corresponding to (first optical member F11) is formed.

  Here, the “portion facing the display area P4” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and avoids a functional part such as an electrical component mounting portion. Indicates. That is, the case where the excess part is laser-cut along the outer periphery of the liquid crystal panel P is included.

  The 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P by cutting off the surplus part of the 1st sheet piece F1m from the 1st optical member bonding body PA1 by the 1st cutting device 31. 2 optical member bonding body PA2 is formed. The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

  The reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.

  The reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11. The reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.

  The reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce | transduced into the bonding position of the 2nd bonding apparatus 17. FIG.

  Since the 2nd adsorption | suction apparatus 20 is equipped with the structure similar to the 1st adsorption | suction apparatus 11, it attaches | subjects and demonstrates the same code | symbol to the same part. The 2nd adsorption | suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2. The second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2. Do. The panel holding | maintenance part 11a adsorbs and hold | maintains the upper surface of 2nd optical member bonding body PA2 contact | abutted to the stopper S by vacuum suction. The panel holding | maintenance part 11a moves on the rail R in the state which adsorbed and hold | maintained 2nd optical member bonding body PA2, and conveys 2nd optical member bonding body PA2. When this conveyance is finished, the panel holding unit 11a releases the suction holding of the second optical member bonding body PA2 and delivers the second optical member bonding body PA2 to the free roller conveyor 24.

  In the alignment camera 11b, the panel holding unit 11a holds the second optical member bonding body PA2 in contact with the stopper S, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state. Imaging data from the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with respect to the free roller conveyor 24 as the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.

  The 2nd dust collector 16 is arrange | positioned in the conveyance direction upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 2nd bonding apparatus 17. FIG. The second dust collector 16 removes static electricity in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side of the second optical member bonding body PA2. And collect dust.

  The 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16. FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position. Do. The 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13. FIG.

  In the gap between the pair of bonding rollers 23a of the pinching roll 23 (the bonding position of the second bonding device 17), the second optical member bonding body PA2 and the second sheet piece F2m are overlapped and introduced. The second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

  These 2nd optical member bonding body PA2 and 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by each bonding roller 23a. In this embodiment, it is a 2nd sheet | seat on the surface (surface on the opposite side to the surface where the 1st optical member F11 of 2nd optical member bonding body PA2 was bonded) of the liquid crystal panel P by the pinching roll 23. By bonding the piece F2m, the third optical member bonding body PA3 is formed.

  The 2nd cutting device 32 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd cutting device 32 cuts off the surplus part arranged outside the part which counters display area P4 of liquid crystal panel P from the 2nd sheet piece F2m bonded to liquid crystal panel P, and displays area P4 of liquid crystal panel P An optical member having a size corresponding to (second optical member F12) is formed.

  The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and 4th optical member bonding body PA4 (optical member bonding body) formed by bonding the 1st optical member F11 to the surface at the side of the backlight of liquid crystal panel P is formed. The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

Here, the first cutting device 31 and second cutting device 32 is, for example, CO ₂ laser cutter. The 1st cutting device 31 and the 2nd cutting device 32 cut | disconnect endlessly the sheet piece FXm bonded by liquid crystal panel P along the outer periphery of the display area P4.

  A bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17. The bonding inspection apparatus is inspected by an unillustrated inspection apparatus for a workpiece (liquid crystal panel P) on which film bonding is performed. For example, the inspection by this inspection apparatus is an inspection such as whether or not the position of the optical member F1X is appropriate (whether or not the positional deviation is within a tolerance range). The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

In addition, in this embodiment, the control part 40 as an electronic control apparatus which carries out overall control of each part of the film bonding system 1 is comprised including the computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk.
The control unit 40 of the present embodiment includes an interface that can execute communication with an external device of the computer system. An input device that can input an input signal may be connected to the control unit 40. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control unit 40 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the film bonding system 1 or may be connected to the display device.

  An operating system (OS) that controls the computer system is installed in the storage unit of the control unit 40. The storage unit of the control unit 40 includes a program that causes the arithmetic processing unit to control each unit of the film bonding system 1 to execute processing for causing each unit of the film bonding system 1 to accurately convey the optical sheet F. It is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each unit of the film bonding system 1.

  The storage unit is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. The storage unit functionally includes a first suction device 11, a first dust collector 12, a first bonding device 13, a first cutting device 31, a reversing device 15, a second suction device 20, and a second dust collector. 16, the storage area which stores the program software in which the control procedure of the operation | movement of the 2nd bonding apparatus 17 and the 2nd cutting device 32 was described, and other various storage areas are set.

  Hereinafter, with reference to FIG. 6A and FIG. 6B, an example of the determination method of the bonding position (relative bonding position) of the sheet piece FXm with respect to liquid crystal panel P is demonstrated.

  First, as shown in FIG. 6A, a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the direction of the optical axis of the optical sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical sheet FX is stored in a storage unit (not shown) in association with the position of the optical sheet FX (position in the longitudinal direction and position in the width direction of the optical sheet FX).

  The control unit 40 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each inspection point CP from the storage unit, and partitions the optical sheet FX (cut line CL) of the portion from which the sheet piece FXm is cut out. The direction of the average optical axis of the region to be detected is detected.

  For example, as shown in FIG. 6B, an angle (deviation angle) formed between the direction of the optical axis and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest angle (maximum deviation angle) among the deviation angles. Is θmax and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is detected as the average deviation angle. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical sheet FX is detected as the direction of the average optical axis of the optical sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical sheet FX and the clockwise direction being negative.

  And the direction of the average optical axis of the optical sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis of the optical sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

  The first cutting device 31 and the second cutting device 32 described above detect the outer peripheral edge of the display area P4 of the liquid crystal panel P by a detecting means such as a camera, and the sheet piece FXm bonded to the liquid crystal panel P is displayed in the display area P4. Cut endlessly along the outer periphery. The outer peripheral edge of the display area P4 is detected by imaging the edge of the liquid crystal panel P, the alignment mark provided on the liquid crystal panel P, or the outermost edge of the black matrix provided in the display area P4. Outside the display area P4, a frame portion G (see FIG. 3) having a predetermined width for arranging a sealant or the like for joining the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P is provided. Within the width of the frame portion G, the sheet piece FXm is cut (cut line: WCL) by the first cutting device 31 and the second cutting device 32. In the present embodiment, laser cutting is performed by the cutting devices 31 and 32 within the width of the frame portion G.

  As shown in FIG. 8, when the resin optical sheet FZ is laser-cut alone, the cut end t may swell or wave due to thermal deformation. For this reason, when the optical sheet FZ after laser cutting is bonded to an optical display component, bonding failure such as air mixing and distortion is likely to occur in the optical sheet FZ.

  On the other hand, as shown in FIG. 7, in this embodiment in which the sheet piece FXm is laser-cut after the sheet piece FXm cut out from the optical sheet FX is bonded to the liquid crystal panel P, the cut end t of the sheet piece FXm is the liquid crystal panel P. Backed up on the glass surface. Therefore, the cut end t of the sheet piece FXm does not bulge, undulate, or the like, and since it is after bonding to the liquid crystal panel P, bonding failure cannot occur.

  The deflection width (tolerance) of the cutting line of the laser processing machine is smaller than the deflection width (tolerance) of the cutting blade. Therefore, in this embodiment, it is possible to reduce the width of the frame portion G compared to the case where the optical sheet FX is cut using a cutting blade, and the liquid crystal panel P is downsized and / or the display area P4 is large. Is possible. Therefore, it is effective for application to a high-function mobile device that requires an enlargement of the display screen while the size of the housing is limited, such as a recent smartphone or tablet terminal.

  In addition, when the optical sheet FX is cut into a sheet piece that matches the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the relative bonding positions thereof Since the dimensional tolerances overlap, it becomes difficult to reduce the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

  On the other hand, a sheet piece FXm of the optical sheet FX having a size larger than the display area P4 of the liquid crystal panel P is cut out from the optical sheet FX, and the cut sheet piece FXm is bonded to the liquid crystal panel P and then cut in accordance with the display area P4. In this case, it is only necessary to consider the runout tolerance of the cutting line, and the tolerance of the width of the frame portion G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

  Further, by cutting the sheet piece FXm with a laser instead of a blade, the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion.

  As explained above, according to the film bonding system 1 of this embodiment, after bonding each of the 1st sheet piece F1m larger than the display area P4 and the 2nd sheet piece F2m to liquid crystal panel P, it is 1st. Each of the first optical member F11 and the second optical member F12 having a size corresponding to the display area P4 is formed on the surface of the liquid crystal panel P by cutting off the excess portions of the sheet piece F1m and the second sheet piece F2m. be able to. As a result, each of the first optical member F11 and the second optical member F12 can be accurately provided up to the display region P4, and the frame portion G outside the display region P4 is narrowed to enlarge the display area and downsize the device. Can be achieved.

  Moreover, according to each position of the 1st sheet piece F1m and the 2nd sheet piece F2m by bonding each of the 1st sheet piece F1m and the 2nd sheet piece F2m larger than the display area P4 to the liquid crystal panel P. Even when the optical axis direction changes, the liquid crystal panel P can be aligned and bonded in accordance with the optical axis direction. Thereby, the precision of each optical axis direction of the 1st optical member F11 and the 2nd optical member F12 with respect to liquid crystal panel P can be improved, and the color and contrast of an optical display device can be improved.

  Moreover, each of the 1st cutting device 31 and the 2nd cutting device 32 carries out laser cutting of the 1st sheet piece F1m and the 2nd sheet piece F2m, respectively, and each of the 1st sheet piece F1m and the 2nd sheet piece F2m Compared with the case of cutting with a blade, the liquid crystal panel P is not exerted with force, cracks and chips are hardly generated, and stable durability of the liquid crystal panel P can be obtained. Moreover, generation | occurrence | production of a bonding defect can be prevented compared with the case where each of the 1st sheet piece F1m before bonding and the 2nd sheet piece F2m is laser-cut alone.

  As mentioned above, although the suitable embodiment example which concerns on this embodiment was demonstrated referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  The size of the surplus portion of the sheet piece FXm (the size of the portion that protrudes outside the liquid crystal panel P) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece FXm is applied to a medium-to-small size liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece FXm and one side of the liquid crystal panel P is 2 mm on each side of the sheet piece FXm. Set to a length in the range of ~ 5 mm.

  Hereinafter, the film bonding system which concerns on 2nd embodiment of this invention is demonstrated with reference to FIGS. In this embodiment, the same code | symbol is attached | subjected to the structure similar to the film bonding system 1 demonstrated in the said embodiment, and detailed description is abbreviate | omitted. In addition, the optical member F1X in this embodiment is formed by separating the excess part of the outer side of the bonding surface of the sheet piece FX from the sheet piece FXm bonded to the liquid crystal panel P.

  The film bonding system which concerns on this embodiment is provided with the 1st detection apparatus 41 (refer FIG. 10). The 1st detection apparatus 41 is provided in a panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m.

  For example, as shown in FIG. 9, the first detection device 41 has an edge ED (outside of the bonding surface) of the first bonding surface SA <b> 1 in the four inspection areas CA installed on the transport path of the upstream conveyor 6. Edge). Each inspection area | region CA is arrange | positioned in the position corresponding to four corner | angular parts of 1st bonding surface SA1 which has a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The edge ED data detected by the first detection device 41 is stored in a storage unit (not shown).

  The arrangement position of the inspection area CA is not limited to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1.

FIG. 10 is a schematic diagram of the first detection device 41.
10, for the sake of convenience, the configuration of the first detection device 41 is shown upside down with the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded as the upper side.

  As shown in FIG. 10, the first detection device 41 includes an illumination light source 44 that illuminates the edge ED, and the first bonding surface SA1 rather than the edge ED with respect to the normal direction of the first bonding surface SA1. The image pickup device 43 is arranged in an inwardly inclined posture and picks up an image of the edge ED from the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded.

  The illumination light source 44 and the imaging device 43 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.

  An angle θ between the normal line of the first bonding surface SA1 and the normal line of the image pickup surface 43a of the image pickup device 43 (hereinafter referred to as an inclination angle θ of the image pickup device 43) is divided into panels within the image pickup field of the image pickup device 43. You may set so that a time gap, a burr | flash, etc. may not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle θ of the imaging device 43 is such that the edge of the second substrate P2 enters the imaging field of the imaging device 43. Set to not.

  The inclination angle θ of the imaging device 43 is set to match the distance H (hereinafter referred to as the height H of the imaging device 43) between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43. May be. For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 may be set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 43 and the inclination angle θ of the imaging device 43 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10 °.

  The illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.

  In addition, the illumination light source 44 and the imaging device 43 may be arrange | positioned so that a movement is possible along the edge ED of 1st bonding surface SA1. In this case, the illumination light source 44 and the imaging device 43 should each be provided one each. Thereby, the illumination light source 44 and the imaging device 43 can be moved to a position where the edge ED of the first bonding surface SA1 can be easily imaged.

  The illumination light source 44 is arrange | positioned on the opposite side to the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded. The illumination light source 44 is arrange | positioned with the attitude | position which inclined outside the 1st bonding surface SA1 rather than the edge ED with respect to the normal line direction of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.

  In addition, the illumination light source 44 may be arrange | positioned at the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded.

  In addition, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may slightly cross each other.

  Moreover, as shown in FIG. 11, each of the imaging device 43 and the illumination light source 44 may be arrange | positioned in the position which overlaps with edge ED along the normal line direction of 1st bonding surface SA1. A distance H1 between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as a height H1 of the imaging device 43) detects the edge ED of the first bonding surface SA1. It may be set at an easy position. For example, the height H1 of the imaging device 43 may be set in a range of 50 mm to 150 mm.

  The cutting position of the first sheet piece F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control part 40 (refer FIG. 1) acquires the data of the edge ED of 1st bonding surface SA1 memorize | stored in the memory | storage part, and the 1st optical member F11 is outside the liquid crystal panel P (1st bonding surface SA1). The cutting position of the first sheet piece F1m is determined so as not to protrude beyond the outer side. The first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control unit 40.

  Returning to FIG. 1, the first cutting device 31 is provided on the downstream side of the panel conveyance with respect to the first detection device 41. The 1st cutting device 31 performs the laser cut along edge ED, and is the 1st sheet piece F1m (1st sheet | seat) of the part which protruded outside 1st bonding surface SA1 from 1st optical member bonding body PA1. The surplus portion of the piece F1m) is cut off, and an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1 is formed. Here, the 1st cutting device 31 is corresponded to the cutting device as described in a claim.

  Here, the “size corresponding to the first bonding surface SA1” is not less than the size of the display region P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. It points to.

  The 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P by cutting off the surplus part of the 1st sheet piece F1m from the 1st optical member bonding body PA1 by the 1st cutting device 31. 2 optical member bonding body PA2 is formed. At this time, 2nd optical member bonding body PA2 and the part (1st optical member F11) corresponding to 1st bonding surface SA1 are cut off, and the excess part of the 1st sheet piece F1m which remains in frame shape is isolate | separated. The The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

  Here, the “part corresponding to the first bonding surface SA1” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and a functional part such as an electrical component mounting portion. Indicates an area that avoids. In the present embodiment, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P at three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, and the liquid crystal panel P at one side corresponding to the functional portion. The surplus portion is laser-cut at a position that appropriately enters the display area P4 side from the outer peripheral edge of. For example, when the part corresponding to 1st bonding surface SA1 is the bonding surface of a TFT substrate, it shifted | deviated predetermined amount from the outer periphery of liquid crystal panel P to the display area P4 side so that a functional part may be excluded in the one side corresponding to a functional part. Cut at position.

  Moreover, a film bonding system is provided with the 2nd detection apparatus 42 (refer FIG. 10). The 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

  The cut position of the 2nd sheet piece F2m is adjusted based on the detection result of the edge of the 2nd bonding surface. The control part 40 (refer FIG. 1) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 2nd optical member F12 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the second sheet piece F2m is determined so as not to protrude. The second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control unit 40.

  The second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42. The 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) of the magnitude | size corresponding to a 2nd bonding surface is formed.

  Here, the “size corresponding to the second bonding surface” is not less than the size of the display area P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. Point to.

  The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and 4th optical member bonding body PA4 (optical member bonding body) formed by bonding the 1st optical member F11 to the surface at the side of the backlight of liquid crystal panel P is formed. At this time, 4th optical member bonding body PA4 and the part (2nd optical member F12) corresponding to a 2nd bonding surface are cut off, and the excess part of 2nd sheet piece F2m which remains in frame shape is isolate | separated. The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

  Here, the “part corresponding to the second bonding surface” is a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and a functional part such as an electrical component mounting portion. Indicates the area that was avoided. In the present embodiment, the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P having a rectangular shape in plan view. For example, when the portion corresponding to the second bonding surface is the bonding surface of the CF substrate, there is no portion corresponding to the functional portion, so that the four sides of the liquid crystal panel P are cut along the outer peripheral edge of the liquid crystal panel P.

  In this embodiment, the 1st cutting device 31 is 1st along the outer periphery of the bonding surface (1st bonding surface SA1) of liquid crystal panel P and the 1st sheet piece F1m which the 1st detection apparatus 41 detected. One sheet piece F1m is cut. The 2nd cutting device 32 cut | disconnects the 2nd sheet piece F2m along the outer periphery of the bonding surface (2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m which the 2nd detection apparatus 42 detected. To do.

  As explained above, according to the film bonding system of the present embodiment, the first sheet piece F1m and the second sheet piece F2m larger than the display region P4 are bonded to the liquid crystal panel P, and then the first sheet. The outer peripheral edge of the bonding surface between the liquid crystal panel P on which the piece F1m and the second sheet piece F2m were bonded and the first sheet piece F1m and the second sheet piece F2m was detected, and the liquid crystal panel P was bonded. The first optical member F11 having a size corresponding to the bonding surface and the first are separated from each of the first sheet piece F1m and the second sheet piece F2m by cutting off the excess portion disposed outside the portion corresponding to the bonding surface. Each of the two optical members F12 can be formed on the surface of the liquid crystal panel P. As a result, each of the first optical member F11 and the second optical member F12 can be accurately provided up to the display region P4, and the frame portion G outside the display region P4 is narrowed to enlarge the display area and downsize the device. Can be achieved.

  In addition, in the film bonding system of the said embodiment, the outer periphery of the bonding surface is detected for every some liquid crystal panel P using a detection apparatus, and it pastes for every liquid crystal panel P based on the detected outer periphery. You may set the cutting position of the joined sheet piece. Thereby, the optical member having a desired size can be separated regardless of individual differences in the sizes of the liquid crystal panel P and the sheet pieces. Therefore, quality variations due to individual differences in the sizes of the liquid crystal panel P and the sheet pieces can be eliminated, and the frame area around the display area can be reduced to enlarge the display area and downsize the device.

  While preferred embodiments of the present invention have been described and described above, it should be understood that these are exemplary of the invention and are not to be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is limited by the scope of the claims.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (manufacturing apparatus of an optical member bonding body), 23 ... Cinch roll (bonding part), 31 ... 1st cutting device, 32 ... 2nd cutting device, 41 ... 1st detection apparatus (detection device) ), 42 ... second detection device (detection device), P ... liquid crystal panel (optical display component), P4 ... display region, FX ... optical sheet, FXm ... sheet piece, F1X ... optical member, F3a ... separator, PA4 ... first 4 Optical member bonding body (optical member bonding body), SA1 ... 1st bonding surface (bonding surface), ED ... Edge of 1st bonding surface (outer periphery of bonding surface)

Claims (2)

It is a manufacturing apparatus of an optical member bonding body configured by bonding an optical member to an optical display component,
Including the optical member and a separator laminated on one surface of the optical member in a separable manner, and longer than either one of the long side and the short side of the display region of the optical display component A transport unit for transporting a belt-shaped optical sheet having a width;
The optical member is cut from the separator constituting the optical sheet conveyed from the conveying unit into a length larger than either one of the long side and the short side of the display region and separated as a sheet piece. A separating unit that supplies the separated sheet piece to a bonding position where the sheet piece is bonded to the optical display component;
A bonding unit that bonds the sheet piece supplied from the separation unit to the optical display component;
A surplus portion arranged outside the facing portion facing the display region is separated from the sheet piece bonded to the optical display component by laser cutting, and the optical member having a size corresponding to the display region is formed. A cutting device to perform,
The manufacturing apparatus of the optical member bonding body characterized by including. It is a manufacturing apparatus of an optical member bonding body configured by bonding an optical member to an optical display component,
Including the optical member and a separator laminated on one surface of the optical member in a separable manner, and longer than either one of the long side and the short side of the display region of the optical display component A transport unit for transporting a belt-shaped optical sheet having a width;
The optical member is cut from the separator constituting the optical sheet conveyed from the conveying unit into a length larger than either one of the long side and the short side of the display region and separated as a sheet piece. A separating unit that supplies the separated sheet piece to a bonding position where the sheet piece is bonded to the optical display component;
A bonding unit that bonds the sheet piece supplied from the separation unit to the optical display component;
A detection device for detecting an outer peripheral edge of a bonding surface of the optical display component and the sheet piece on which the sheet piece is bonded;
The excess member disposed outside the portion corresponding to the bonding surface is cut off from the sheet piece bonded to the optical display component by laser cutting, and the optical member having a size corresponding to the bonding surface is provided. A cutting device to form,
The said cutting device cut | disconnects the said sheet piece along the outer periphery of the said bonding surface of the said optical display component and the said sheet piece which the said detection apparatus detected, The manufacturing apparatus of the optical member bonding body characterized by the above-mentioned. .

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