JP5793821B2 - Detecting device, optical member bonded body manufacturing apparatus, and optical member bonded body manufacturing method - Google Patents

Description

The present invention relates to a detection apparatus, an optical member bonding body manufacturing apparatus, and an optical member bonding body manufacturing method.
This application claims priority based on Japanese Patent Application No. 2012-227074 for which it applied to Japan on October 12, 2012, and uses the content here.

  Conventionally, in a production system for an optical display device such as a liquid crystal display, an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is formed from a long film into a sheet piece having a size matching the display area of the liquid crystal panel. After being cut out, it is bonded to a liquid crystal panel (for example, see Patent Document 1).

  However, in this method, work such as packing of sheet pieces and release of packing occurs, and problems such as generation of defective products occur in association with these work. Therefore, in order to solve such a problem, a method described in Patent Document 2 has been proposed. The method of patent document 2 unwinds the long film of the width | variety corresponded to the length of the long side or short side of a liquid crystal panel from an original fabric roll, and bonds this long film to a liquid crystal panel, Then, It cuts by the length of a short side or a long side.

Japanese Unexamined Patent Publication No. 2003-255132 Japanese Patent No. 4628488

  The liquid crystal panel is formed by bonding two substrates with a liquid crystal layer interposed therebetween. As a method of manufacturing a liquid crystal panel, a method of manufacturing a liquid crystal panel by dividing a mother panel with scribed lines is known. The mother panel is obtained by bonding two mother substrates each having a size corresponding to a plurality of liquid crystal panels with a liquid crystal layer interposed therebetween. A scribe line is formed on each of the two mother substrates, and the two mother substrates are sequentially divided along the scribe line. In this case, the end face of the liquid crystal panel may cause burrs when the panel is divided, deviation of the edge position between the upper and lower substrates (divergence of division position), and the like.

  When bonding a film to a liquid crystal panel using the method of patent document 2, the edge of the bonding surface of a liquid crystal panel is detected through a film, and a film will be cut | disconnected along the edge of a bonding surface. . In this case, if there are burrs or misalignment of the edge between the upper and lower substrates on the end surface of the liquid crystal panel, when the bonding surface is viewed through the film, the burr or lower substrate (the bonding substrate different from the original bonding surface) The edge of the substrate opposite to the mating side) is visually recognized as a unit with the bonding surface, and the edge of the original bonding surface may not be recognized. For this reason, when detecting the bonding surface through the film, there has been a demand for means capable of accurately detecting only the bonding surface while eliminating the influence of burrs and the shift of the edge position between the upper and lower substrates.

  The aspect of this invention is made in view of such a situation, Comprising: Providing the manufacturing apparatus of the detection apparatus and optical member bonding body which can detect the edge of a bonding surface accurately. Objective.

In order to achieve the above object, the detection apparatus and the optical member bonding body manufacturing apparatus according to an aspect of the present invention employ the following configurations.
(1) The optical display of the sheet piece bonding body comprised by bonding the sheet piece which has the size which protrudes on the outer side of the said optical display component with respect to an optical display component with the detection apparatus which concerns on 1 aspect of this invention. It is a detection apparatus which detects the edge of the bonding surface of components and the said sheet piece, Comprising: The lighting light source which illuminates the said edge, and the said bonding rather than the said edge with respect to the normal line direction of the said bonding surface An image pickup device that is arranged at a position inclined to the inside of the joint surface and picks up an image of the edge from the side of the sheet piece bonded body on which the sheet piece is bonded.

  (2) In the detection apparatus according to (1) above, the illumination light source may be disposed on the opposite side of the sheet piece bonded body from which the sheet piece is bonded.

  (3) In the detection apparatus according to (2), the illumination light source is disposed at a position inclined to the outside of the bonding surface with respect to the normal direction of the bonding surface rather than the edge. Also good.

  (4) In the detection device according to any one of (1) to (3), the illumination light source and the imaging device correspond to four corners of the bonding surface having a rectangular shape. It may be arranged at each position.

  (5) In the detection device according to any one of (1) to (4), the optical display component may be formed by bonding two substrates.

  (6) The manufacturing apparatus of the optical member bonding body which concerns on the other aspect of this invention is a manufacturing apparatus of the optical member bonding body comprised by bonding an optical member to an optical display component, Comprising: On the other hand, the bonding apparatus which forms a sheet piece bonding body by bonding the sheet piece which has the size which protrudes on the outside of the optical display component, and the optical display component and the sheet piece of the sheet piece bonding body The detection apparatus according to any one of (1) to (5) above, which detects the edge of the bonding surface, and laser cutting along the edge, whereby the sheet piece bonded body is A cutting device that cuts off the sheet piece protruding from the outside of the bonding surface and forms the optical member having a size corresponding to the bonding surface.

  According to the aspect of the present invention, the edge of the bonding surface can be detected with high accuracy.

It is a schematic diagram which shows the manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention. It is a top view of a liquid crystal panel. It is AA sectional drawing of FIG. It is sectional drawing of an optical sheet. It is a figure which shows operation | movement of a cutting device. It is a top view which shows the detection process of the edge of a bonding surface. It is a schematic diagram of a detection apparatus. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a perspective view for demonstrating the effect | action of the detection apparatus which concerns on a comparative example. It is sectional drawing for demonstrating the effect | action of the detection apparatus which concerns on a comparative example. It is a perspective view for demonstrating the effect | action of the detection apparatus which concerns on one Embodiment of this invention. It is sectional drawing for demonstrating the effect | action of the detection apparatus which concerns on one Embodiment of this invention. It is sectional drawing for demonstrating the effect | action of the detection apparatus which concerns on one Embodiment of this invention at the time of applying the modification of a sheet piece bonding body.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

  In all the drawings below, the dimensions and ratios of the respective constituent elements are appropriately changed in order to make the drawings easy to see. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

  In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the transport direction of the liquid crystal panel, which is an optical display component, is the X direction, and the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

Hereinafter, the film bonding system 1 which is a manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention is demonstrated with reference to drawings.
Drawing 1 is a figure showing the schematic structure of film pasting system 1 of this embodiment.
The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, an antireflection film, and a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.

  As shown in FIG. 1, the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by the control part 40 as an electronic control apparatus.

  FIG. 2 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a relatively small rectangular shape disposed opposite to the first substrate P1, a first substrate P1, and a second substrate. And a liquid crystal layer P3 sealed between the substrate P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view. In the liquid crystal panel P, an area that fits inside the outer periphery of the liquid crystal layer P3 in plan view is defined as a display area P4.

  3 is a cross-sectional view taken along the line AA in FIG. On the front and back surfaces of the liquid crystal panel P, a first optical member cut out from the first optical sheet F1 and the second optical sheet F2 having a long strip shape (see FIG. 1, hereinafter may be collectively referred to as an optical sheet FX). F11 and the second optical member F12 (hereinafter may be collectively referred to as an optical member F1X) are appropriately bonded. In the present embodiment, the first optical member F11 and the second optical member F12 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively.

  Outside the display area P4, a frame portion G having a predetermined width for arranging a sealant or the like for joining the first substrate P1 and the second substrate P2 of the liquid crystal panel P is provided.

  The first optical member F11 and the second optical member F12 are respectively a liquid crystal panel P and a sheet from a first sheet piece F1m and a second sheet piece F2m (hereinafter sometimes referred to as a sheet piece FXm), which will be described later. It is formed by cutting off the excess part on the outside of the bonding surface with the piece FXm. The bonding surface will be described later.

The liquid crystal panel P according to this embodiment is manufactured by a method of manufacturing a liquid crystal panel by dividing a mother panel with scribe lines. The mother panel is obtained by bonding two mother substrates each having a size corresponding to a plurality of liquid crystal panels with a liquid crystal layer interposed therebetween. A scribe line is formed on each of the two mother substrates, and the two mother substrates are sequentially divided along the scribe line. In this case, the end face of the liquid crystal panel may cause burrs when the panel is divided, deviation of the edge position between the upper and lower substrates (divergence of division position), and the like.
Such displacement between substrates and burr at the time of panel division will be described later.

  FIG. 4 is a partial cross-sectional view of the optical sheet FX bonded to the liquid crystal panel P. The optical sheet FX includes a film-like optical member main body F1a, an adhesive layer F2a provided on one surface (the upper surface in FIG. 4) of the optical member main body F1a, and one of the optical member main bodies F1a via the adhesive layer F2a. Separator F3a laminated | stacked on the surface so that isolation | separation was possible, and the surface protection film F4a laminated | stacked on the other surface (FIG. 4 lower surface) of the optical member main body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and the peripheral area of the display area P4. For convenience of illustration, hatching of each layer in FIG. 4 is omitted.

  The optical member body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface of the optical member body F1a. Hereinafter, the part remove | excluding the separator F3a from the optical sheet FX may be called the bonding sheet | seat F5.

  The separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical sheet FX may be configured not to include the surface protective film F4a, or the surface protective film F4a may be configured not to be separated from the optical member body F1a.

  The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. A second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

  The optical member main body F1a may have a single-layer structure composed of one optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancement film, or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.
As shown in FIG. 1, the film bonding system 1 of the present embodiment has a downstream side (− in the transport direction of the liquid crystal panel P on the left side in the figure from the upstream side in the transport direction (+ X direction side) of the liquid crystal panel P on the right side in the figure. X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.
Hereinafter, the upstream side in the transport direction of the liquid crystal panel P (or optical member bonding body described later) in the film bonding system 1 may be referred to as the upstream side of the panel transport, and the downstream side in the transport direction may be referred to as the downstream side of the panel transport.

  The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary. On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P <b> 4 is along the transport direction. On the other hand, on the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P <b> 4 along the transport direction. On the front and back surfaces of the liquid crystal panel P, a sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical sheet FX is bonded.

  In addition, the upstream conveyor 6 is provided with the independent free roller conveyor 24 in the downstream in the 1st adsorption | suction apparatus 11 mentioned later. On the other hand, the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.

  The film bonding system 1 of this embodiment is the 1st adsorption | suction apparatus 11, the 1st dust collector 12, the 1st bonding apparatus 13, the 1st detection apparatus 41, the 1st cutting device 31, the inversion apparatus 15, and 2nd collection. The dust device 16, the 2nd bonding apparatus 17, the 2nd detection apparatus 42, the 2nd cutting device 32, and the control part 40 are provided.

  The first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P. The first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P. The panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P. When the conveyance is finished, the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.

In the alignment camera 11b, the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state. Image data obtained by the alignment camera 11b is transmitted to the control unit 40. Based on the image data, the panel holding unit 11a is operated to align the liquid crystal panel P with the free roller conveyor 24 as a transport destination. In other words, the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the deviation in the turning direction around the vertical axis of the liquid crystal panel P. .
Here, the liquid crystal panel P conveyed on the rail R by the panel holding unit 11a is nipped by the pressure roll 23 together with the sheet piece FXm while being adsorbed by the adsorption pad 26.

  The 1st dust collector 12 is provided in the panel conveyance upstream of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13. FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.

  The 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption | suction apparatus 11. FIG. The 1st bonding apparatus 13 bonds the bonding sheet | seat F5 (equivalent to 1st sheet piece F1m) cut into the predetermined size with respect to the lower surface of liquid crystal panel P introduced into the bonding position.

  The first bonding device 13 includes a transport device 22 and a pinching roll 23.

  The conveyance device 22 conveys the optical sheet FX along its longitudinal direction while unwinding the optical sheet FX from the original roll R1 around which the optical sheet FX is wound. The conveying apparatus 22 conveys the bonding sheet | seat F5 by using separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding unit 22a holds the original roll R1 around which the belt-shaped optical sheet FX is wound and feeds the optical sheet FX along the longitudinal direction thereof.
The plurality of guide rollers 22b wind the optical sheet FX so as to guide the optical sheet FX unwound from the original roll R1 along a predetermined conveyance path.
The cutting device 22c performs a half cut on the optical sheet FX on the conveyance path.
The knife edge 22d supplies the bonding sheet | seat F5 isolate | separated from the separator F3a to the bonding position, winding the optical sheet FX which gave the half cut at an acute angle, and separating the bonding sheet | seat F5 from the separator F3a.
The winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.

  The roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example. Thereby, the winding unit 22e winds up the separator F3a that has passed through the knife edge 22d while the roll holding unit 22a feeds the optical sheet FX in the conveyance direction of the optical sheet FX. Hereinafter, the upstream side in the transport direction of the optical sheet FX (separator F3a) in the transport device 22 may be referred to as the upstream side of the sheet transport, and the downstream side in the transport direction may be referred to as the downstream side of the sheet transport.

  Each guide roller 22b changes the traveling direction of the optical sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b is movable so as to adjust the tension of the optical sheet FX being conveyed.

  A dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical sheet FX conveyed from the roll holding unit 22a while the optical sheet FX is cut by the cutting device 22c.

FIG. 5 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
As shown in FIG. 5, when the optical sheet FX is fed out by a predetermined length, the cutting device 22c applies a part in the thickness direction of the optical sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical sheet FX. Make a half-cut to cut. The cutting device 22c of the present embodiment is provided so as to be able to advance and retreat toward the optical sheet FX from the side opposite to the separator F3a with respect to the optical sheet FX.

  The cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical sheet FX (so that a predetermined thickness remains in the separator F3a), Half-cut to the vicinity of the interface between the adhesive layer F2 and the separator F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

  The optical sheet FX after half-cutting is formed by cutting the optical member main body F1a and the surface protective film F4a in the thickness direction of the optical sheet FX, so that the cut line L1 extends across the entire width of the optical sheet FX. A line L2 is formed. A plurality of the cut lines L1 and the cut lines L2 are formed so as to be arranged in the longitudinal direction of the belt-shaped optical sheet FX. For example, in the case of the bonding process which conveys liquid crystal panel P which has the same size, the some cutting line L1 and the cutting line L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX. The optical sheet FX is divided into a plurality of sections in the longitudinal direction by the plurality of cut lines L1 and the cut lines L2. A section sandwiched between a pair of cut lines L1 and L2 adjacent in the longitudinal direction in the optical sheet FX is a sheet piece FXm in the bonding sheet F5. The sheet piece FXm is a sheet piece of the optical sheet FX having a size that protrudes outside the liquid crystal panel P.

  Returning to FIG. 1, the knife edge 22 d is arranged below the upstream conveyor 6 and extends at least over the entire width in the width direction of the optical sheet FX. The knife edge 22d winds the half-cut optical sheet FX so as to be in sliding contact with the separator F3a side of the half-cut optical sheet FX.

  The knife edge 22d is seen from the width direction of the optical sheet FX above the first surface, and the first surface arranged in an inclined position when viewed from the width direction of the optical sheet FX (width direction of the upstream conveyor 6). It has the 2nd surface arrange | positioned at an acute angle with respect to a 1st surface, and the front-end | tip part where a 1st surface and a 2nd surface cross.

  In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical sheet F1 at an acute angle around the front-end | tip part of the knife edge 22d. The first optical sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d is introduced between the pair of bonding rollers 23a of the pinching roll 23 while overlapping the lower surface of the liquid crystal panel P in a state of being sucked by the first suction device 11. Is done. The first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size that protrudes outside the liquid crystal panel P.

  On the other hand, the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d. The winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.

  The pinching roll 23 bonds the first sheet F1m separated from the first optical sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6. Here, the pinching roll 23 is equivalent to the bonding apparatus as described in a claim.

  The pinching roll 23 includes a pair of bonding rollers 23a and a bonding roller 23a that are arranged in parallel with each other in the axial direction (the upper bonding roller 23a moves up and down). A predetermined gap is formed between the pair of bonding rollers 23 a and the bonding roller 23 a, and the inside of this gap is the bonding position of the first bonding device 13.

  In the gap, the liquid crystal panel P and the first sheet piece F1m are introduced overlapping each other. These liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being clamped by each bonding roller 23a. In this embodiment, 1st optical member bonding body PA1 is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG. Here, 1st optical member bonding body PA1 is corresponded to the sheet piece bonding body as described in a claim.

  The 1st detection apparatus 41 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st detection apparatus 41 detects the edge (edge part) of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m.

FIG. 6 is a plan view showing a step of detecting the edge ED of the first bonding surface SA1.
For example, as illustrated in FIG. 6, the first detection device 41 detects the edge ED of the first bonding surface SA <b> 1 in the four inspection areas CA installed on the transport path of the upstream conveyor 6. Each inspection area | region CA is arrange | positioned in the position corresponding to four corner | angular parts of 1st bonding surface SA1 which has a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The data of the edge ED detected by the first detection device 41 is stored in a storage unit (not shown).

  The arrangement position of the inspection area CA is not limited to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1.

FIG. 7 is a schematic diagram of the first detection device 41.
In FIG. 7, for the sake of convenience, the configuration of the first detection device 41 is shown upside down with the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded as the upper side.

As shown in FIG. 7, the first detection device 41 has an illumination light source 44 that illuminates the edge ED and the first bonding surface SA1 rather than the edge ED with respect to the normal direction of the first bonding surface SA1. The image pickup device 43 is disposed at a position inclined inward and picks up an image of the edge ED from the side where the first sheet piece F1m of the first optical member bonding body PA1 is bonded.
In other words, the imaging device 43 is disposed in a space inside the edge ED on the first sheet piece F1m side, and captures an image of the edge ED.

  The illumination light source 44 and the imaging device 43 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.

  An angle θ between the normal line of the first bonding surface SA1 and the normal line of the image pickup surface 43a of the image pickup device 43 (hereinafter referred to as an inclination angle θ of the image pickup device 43) is divided into panels within the image pickup field of the image pickup device 43. You may set so that a time gap, a burr | flash, etc. may not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle θ of the imaging device 43 is such that the edge of the second substrate P2 enters the imaging field of the imaging device 43. Set to not.

  The inclination angle θ of the imaging device 43 is set to match the distance H (hereinafter referred to as the height H of the imaging device 43) between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43. May be. For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 may be set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 43 and the inclination angle θ of the imaging device 43 may be obtained based on the empirically known deviation amount. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10 °.

  The illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.

  In addition, the illumination light source 44 and the imaging device 43 may be arrange | positioned so that a movement is possible along the edge ED of 1st bonding surface SA1. In this case, the illumination light source 44 and the imaging device 43 should each be provided one each. Thereby, the illumination light source 44 and the imaging device 43 can be moved to a position where the edge ED of the first bonding surface SA1 can be easily imaged.

  The illumination light source 44 is arrange | positioned on the opposite side to the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded. The illumination light source 44 is arrange | positioned in the position which inclined outside the 1st bonding surface SA1 rather than the edge ED with respect to the normal line direction of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.

  In addition, the illumination light source may be arrange | positioned at the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded.

  In addition, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may slightly cross each other.

  The cutting position of the first sheet piece F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control part 40 (refer FIG. 1) acquires the data of the edge ED of 1st bonding surface SA1 memorize | stored in the memory | storage part, and the 1st optical member F11 is outside the liquid crystal panel P (1st bonding surface SA1). The cutting position of the first sheet piece F1m is determined so as not to protrude beyond the outer side. The first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control unit 40.

  Returning to FIG. 1, the first cutting device 31 is provided on the downstream side of the panel conveyance with respect to the first detection device 41. The 1st cutting device 31 performs the laser cut along edge ED, and is the 1st sheet piece F1m (1st sheet | seat) of the part which protruded outside 1st bonding surface SA1 from 1st optical member bonding body PA1. The surplus portion of the piece F1m) is cut off, and an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1 is formed. Here, the 1st cutting device 31 is corresponded to the cutting device as described in a claim.

  Here, the “size corresponding to the first bonding surface SA1” indicates the size of the outer shape of the first substrate P1. However, it includes a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and that avoids a functional part such as an electrical component mounting portion.

  The 1st optical member F11 is bonded by the surface of the backlight side of liquid crystal panel P, and the 1st optical member bonding body PA1 is cut | disconnected from 1st optical member bonding body PA1 by the 1st cutting device 31, and is comprised. 2nd optical member bonding body PA2 is formed. The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

  The reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.

  The reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11. The reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.

  The reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce | transduced into the bonding position of the 2nd bonding apparatus 17. FIG.

  Since the 2nd adsorption | suction apparatus 20 is equipped with the structure similar to the 1st adsorption | suction apparatus 11, it attaches | subjects and demonstrates the same code | symbol to the same part. The 2nd adsorption | suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2. The second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

  The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2. Do. The panel holding | maintenance part 11a adsorbs and hold | maintains the upper surface of 2nd optical member bonding body PA2 contact | abutted to the stopper S by vacuum suction. The panel holding | maintenance part 11a moves on the rail R in the state which adsorbed and hold | maintained 2nd optical member bonding body PA2, and conveys 2nd optical member bonding body PA2. When the conveyance is finished, the panel holding unit 11a releases the suction holding and transfers the second optical member bonding body PA2 to the free roller conveyor 24.

  In the alignment camera 11b, the panel holding unit 11a holds the second optical member bonding body PA2 in contact with the stopper S, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state. Imaging data from the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with respect to the free roller conveyor 24 as the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.

  The 2nd dust collector 16 is arrange | positioned in the panel conveyance upstream of the pinching roll 23 which is the bonding position of the 2nd bonding apparatus 17. FIG. The second dust collecting device 16 performs static electricity removal and dust collection in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side.

  The 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16. FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position. Do. The 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13. FIG.

  In the gap between the pair of bonding rollers 23a of the pinching roll 23 (the bonding position of the second bonding device 17), the second optical member bonding body PA2 and the second sheet piece F2m are overlapped and introduced. The second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

  These 2nd optical member bonding body PA2 and 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by each bonding roller 23a. In this embodiment, it is a 2nd sheet | seat on the surface (surface on the opposite side to the surface where the 1st optical member F11 of 2nd optical member bonding body PA2 was bonded) of the liquid crystal panel P by the pinching roll 23. By bonding the piece F2m, the third optical member bonding body PA3 is formed.

  The 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

  The cut position of the 2nd sheet piece F2m is adjusted based on the detection result of the edge of the 2nd bonding surface. The control part 40 (refer FIG. 1) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 2nd optical member F12 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the second sheet piece F2m is determined so as not to protrude. The second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control unit 40.

  The second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42. The 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) which has a magnitude | size corresponding to a 2nd bonding surface is formed.

  The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and The 4th optical member bonding body PA4 (optical member bonding body) comprised by bonding the 1st optical member F11 to the surface at the side of the backlight of liquid crystal panel P is formed. The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

  Here, the 1st cutting device 31 and the 2nd cutting device 32 are CO2 laser cutters, for example. The 1st cutting device 31 and the 2nd cutting device 32 cut | disconnect endlessly the sheet piece FXm bonded by liquid crystal panel P along the outer periphery of the bonding surface.

  A bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17. The bonding inspection apparatus is an inspection (not shown whether the position of the optical member F1X is appropriate (whether the position deviation is within the tolerance range)) by the inspection apparatus (not shown) of the workpiece (liquid crystal panel P) on which the film is bonded. Etc.). The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

In addition, in this embodiment, the control part 40 as an electronic control apparatus which carries out overall control of each part of the film bonding system 1 is comprised including the computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk.
The control unit 40 of the present embodiment includes an interface that can execute communication with an external device of the computer system. An input device that can input an input signal may be connected to the control unit 40. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control unit 40 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the film bonding system 1 or may be connected to the display device.

  An operating system (OS) that controls the computer system is installed in the storage unit of the control unit 40. The storage unit of the control unit 40 includes a program that causes the arithmetic processing unit to control each unit of the film bonding system 1 to execute processing for causing each unit of the film bonding system 1 to accurately convey the optical sheet F. It is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each unit of the film bonding system 1.

  The storage unit is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. The storage unit functionally includes the first adsorption device 11, the first dust collector 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the reversing device 15, and the second adsorption device 20. , Second dust collector 16, second bonding device 17, second detection device 42, storage area for storing program software in which the control procedure of the operation of second cutting device 32 is described, and other various storage areas are set Is done.

  Hereinafter, with reference to FIG. 8A and FIG. 8B, an example of the determination method of the bonding position (relative bonding position) of the sheet piece FXm with respect to liquid crystal panel P is demonstrated.

  First, as shown in FIG. 8A, a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the direction of the optical axis of the optical sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical sheet FX is stored in a storage unit (not shown) in association with the position of the optical sheet FX (position in the longitudinal direction and position in the width direction of the optical sheet FX).

  The control unit 40 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each inspection point CP from the storage unit, and partitions the optical sheet FX (cut line CL) of the portion from which the sheet piece FXm is cut out. The direction of the average optical axis of the region to be detected is detected.

  For example, as shown in FIG. 8B, an angle (deviation angle) formed between the direction of the optical axis and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest angle (maximum deviation angle) among the deviation angles. Is θmax and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is detected as the average deviation angle. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical sheet FX is detected as the direction of the average optical axis of the optical sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical sheet FX and the clockwise direction being negative.

  And the direction of the average optical axis of the optical sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis of the optical sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

  The above-described cutting devices 31 and 32 detect the outer peripheral edge of the display area P4 of the liquid crystal panel P by a detection unit such as a camera, and the sheet piece FXm bonded to the liquid crystal panel P is aligned along the outer peripheral edge of the bonding surface. Cut endlessly. The outer peripheral edge of the bonding surface is detected by imaging the edge of the bonding surface. In this embodiment, the laser cutting by each cutting device 31 and 32 is made along the outer periphery of the bonding surface.

  The deflection width (tolerance) of the cutting line of the laser processing machine is smaller than the deflection width (tolerance) of the cutting line of the cutting blade. Therefore, in this embodiment, compared with the case where the optical sheet FX is cut using a cutting blade, it can be easily cut along the outer peripheral edge of the bonding surface, and the liquid crystal panel P can be downsized and / or ) The display area P4 can be enlarged. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

  Further, when the optical sheet FX is cut into a sheet piece that matches the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the sheet piece and the liquid crystal panel P Since the dimensional tolerances of the relative bonding positions overlap, it becomes difficult to narrow the width of the frame part G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

  On the other hand, when the sheet piece FXm of the optical sheet FX having a size that protrudes from the optical sheet FX to the outside of the liquid crystal panel P is cut out, and the cut sheet piece FXm is bonded to the liquid crystal panel P and then cut according to the bonding surface. Only the run-out tolerance of the cutting line needs to be considered, and the tolerance of the width of the frame G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

  Further, by cutting the sheet piece FXm with a laser instead of a blade, the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion.

FIG. 9 is a perspective view for explaining the operation of the detection device according to the comparative example.
FIG. 10 is a cross-sectional view for explaining the operation of the detection device according to the comparative example.
FIG. 11 is a perspective view for explaining the operation of the detection device according to the present embodiment.
FIG. 12 is a cross-sectional view for explaining the operation of the detection device according to the present embodiment.
9 to 12, for convenience, the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded is shown as the upper side.

  9 to 12, when the end surface of the second substrate P2 is shifted to the outside from the end surface of the first substrate P1, the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded is shown. An example of imaging the edge ED of the first bonding surface SA1 will be described. 9 to 12, reference numeral VL indicates the imaging direction of the imaging device (the normal direction of the imaging surface of the imaging device). 9 to 12, illustration of the illumination light source and the imaging device constituting the detection device is omitted for convenience.

  As shown in FIG. 9, in the detection device according to the comparative example, the imaging direction VL of the imaging device is perpendicular to the first bonding surface SA1. In this case, as shown in FIG. 10, the edge of the second substrate P2 enters the imaging field of the imaging device. Then, when the edge ED of the first bonding surface SA1 is detected over the first sheet piece F1m, the edge of the second substrate P2 is erroneously detected. That is, the imaging device may capture an image of the edge of the second substrate P2 instead of the edge ED of the first bonding surface SA1. As a result, the edge ED of the first bonding surface SA1 cannot be detected with high accuracy.

  On the other hand, as shown in FIG. 11, in the detection apparatus according to the present embodiment, the imaging direction VL of the imaging apparatus crosses obliquely with respect to the normal direction of the first bonding surface SA1. Specifically, as shown in FIG. 12, the imaging direction VL of the imaging device is inclined inward from the edge ED. That is, the imaging direction VL of the imaging device is set so that the edge of the second substrate P2 does not enter the imaging field of view of the imaging device. Therefore, when the edge ED of the first bonding surface SA1 is detected over the first sheet piece F1m, the edge of the second substrate P2 is not erroneously detected, and the first bonding surface SA1 is not detected. Only the edge ED can be detected. Therefore, the edge ED of the first bonding surface SA1 can be detected with high accuracy.

  In addition, in FIGS. 9-12, when the end surface of the 2nd board | substrate P2 has shifted | deviated outside the end surface of the 1st board | substrate P1, the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded. Although the example which images the edge ED of 1st bonding surface SA1 from the side was imaged and demonstrated, it is not restricted to this.

FIG. 13: is sectional drawing for demonstrating the effect | action of the detection apparatus which concerns on this embodiment at the time of applying the modification of a 1st optical member bonding body.
In FIG. 13, for convenience, the side on which the first sheet piece F1m of the first optical member bonding body PA1 ′ is bonded is shown as the upper side.

  For example, as shown in FIG. 13, when there are burrs at the time of panel division on the end face of the liquid crystal panel P ′, the first sheet piece F1m of the first optical member bonded body PA1 ′ is bonded from the side where the first sheet piece F1m is bonded. The detection apparatus according to the present embodiment can be applied to an example in which the edge ED of the first bonding surface SA1 is imaged through one sheet piece F1m.

  Moreover, according to the film bonding system 1 of this embodiment, after bonding each of the sheet piece F1m and the sheet piece F2m which have the size which protrudes on the outer side of liquid crystal panel P to liquid crystal panel P, sheet piece F1m and sheet piece Each of the optical member F11 and the optical member F12 having a size corresponding to the bonding surface can be formed on the surface of the liquid crystal panel P by cutting off the surplus portions of F2m. Thereby, each of the optical member F11 and the optical member F12 can be accurately provided up to the bonding surface, and the frame portion outside the display region P4 can be narrowed to enlarge the display area and downsize the device. .

  Further, by sticking each of the sheet piece F1m and the sheet piece F2m having a size protruding outside the liquid crystal panel P to the liquid crystal panel P, the sheet piece F1m and the sheet piece F2m according to the respective positions of the sheet piece F2m, Even when the optical axis direction of each of the sheet pieces F2m changes, the liquid crystal panel P can be aligned and bonded in accordance with the optical axis direction. Thereby, the precision of the optical axis direction of each of the optical member F11 and the optical member F12 with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be increased.

  Further, the cutting device 31 and the cutting device 32 cut the sheet piece F1m and the sheet piece F2m, respectively, so that the force is exerted on the liquid crystal panel P as compared with the case of cutting the sheet piece F1m and the sheet piece F2m with a blade. Accordingly, cracks and chips are less likely to occur, and the liquid crystal panel P can have a stable durability.

  As mentioned above, although the suitable embodiment example which concerns on this embodiment was demonstrated referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Film bonding system (manufacturing apparatus of an optical member bonding body), 23 ... Cinch roll (bonding apparatus), 31 ... 1st cutting device, 32 ... 2nd cutting device, 41 ... 1st detection apparatus, 42 ... Second detector 43, imaging device 44, illumination light source, P ... liquid crystal panel (optical display component), P1 ... first substrate, P2 ... second substrate, FX ... optical sheet, FXm ... sheet piece, F1X ... optical Member, PA1 ... 1st optical member bonding body (sheet piece bonding body), PA4 ... 4th optical member bonding body (optical member bonding body), SA1 ... 1st bonding surface, ED ... Edge

Claims (7)

The edge of the bonding surface of the optical display component and the sheet piece of a sheet piece bonded body configured by bonding a sheet piece having a size protruding outside the optical display component to the optical display component A detection device for detecting,
An illumination light source for illuminating the edge;
It arrange | positions in the position which inclined inside the said bonding surface rather than the said edge with respect to the normal line direction of the said bonding surface, and the edge of the said edge from the side by which the said sheet piece of the said sheet piece bonding body was bonded. An imaging device for capturing an image;
A detection device comprising:   The said illumination light source is a detection apparatus of Claim 1 arrange | positioned on the opposite side to the side by which the said sheet piece of the said sheet piece bonding body was bonded.   The said illumination light source is a detection apparatus of Claim 2 arrange | positioned in the position which inclined outside the said bonding surface rather than the said edge with respect to the normal line direction of the said bonding surface.   The detection device according to any one of claims 1 to 3, wherein the illumination light source and the imaging device are respectively arranged at positions corresponding to four corners of the bonding surface having a rectangular shape.   The detection device according to any one of claims 1 to 4, wherein the optical display component is formed by bonding two substrates together. It is a manufacturing apparatus of an optical member bonding body configured by bonding an optical member to an optical display component,
A bonding apparatus that forms a sheet piece bonded body by bonding a sheet piece having a size that protrudes outside the optical display component with respect to the optical display component;
The detection apparatus as described in any one of Claim 1 to 5 which detects the edge of the bonding surface of the said optical piece and the said sheet piece of the said sheet piece bonding body,
The optical member having a size corresponding to the bonding surface by cutting off the sheet piece of the portion protruding outside the bonding surface from the sheet piece bonding body by performing laser cutting along the edge. A cutting device forming,
The manufacturing apparatus of the optical member bonding body containing this. It is a method of manufacturing an optical member bonded body by bonding an optical member to an optical display component,
A bonding step of forming a sheet piece bonded body by bonding a sheet piece having a size protruding to the outside of the optical display component with respect to the optical display component,
While illuminating the edge of the bonding surface of the optical display component and the sheet piece of the sheet piece bonding body, the inner side of the bonding surface with respect to the normal direction of the bonding surface rather than the edge. An image of the edge is obtained from the side of the sheet piece bonded body in the direction inclined to the side where the sheet piece is bonded, and a bonding surface between the optical display component and the sheet piece is detected from the obtained image. Detecting step to
The optical member having a size corresponding to the bonding surface by cutting off the sheet piece of the portion protruding outside the bonding surface from the sheet piece bonding body by performing laser cutting along the edge. Cutting step to form,
The manufacturing method of the optical member bonding body containing this.

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