WO2014208526A1

WO2014208526A1 - Production system for optical display device

Info

Publication number: WO2014208526A1
Application number: PCT/JP2014/066639
Authority: WO
Inventors: 幹士藤井; 盛旭蔡
Original assignee: 住友化学株式会社
Priority date: 2013-06-24
Filing date: 2014-06-24
Publication date: 2014-12-31
Also published as: CN105209965B; JP6037564B2; JP2015006699A; CN105209965A; KR20160022297A; KR102159417B1

Abstract

A production system for an optical display device comprises: an image capturing device which captures an image of a laminate of an optical display component and an optical member sheet, the image including a substrate in plan view; a cutting device which cuts the optical member sheet into an optical member and a surplus portion; and a control device which acquires an approximate contour line on the basis of the image and controls the cutting device. The control device determines a first portion that does not meet a preset standard in a contour line acquired on the basis of the image captured by the image capturing device, detects the coordinates of a plurality of points overlapping the contour line in a second portion other than the first portion in the contour line, approximates a line corresponding to the contour line from the coordinates of the plurality of points, and controls the cutting device such that the cutting device cuts the optical member sheet on the basis of the approximate contour line acquired from the approximated line.

Description

Optical display device production system

The present invention relates to an optical display device production system.
This application claims priority based on the Japan patent application 2013-131945 for which it applied on June 24, 2013, and uses the content here.

Conventionally, in a production system for an optical display device such as a liquid crystal display, a mother panel is created by sandwiching a liquid crystal layer between two mother glasses, and then the mother panel is divided into a plurality of liquid crystal panels (optical display components). A method of dividing into two (so-called multiple chamfering) is employed. The mother panel can be divided into a plurality of liquid crystal panels by, for example, imprinting a scribe line on the mother glass, then pressurizing and dividing along the scribe line (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 11-90900

In a liquid crystal panel, optical members such as a polarizing film, a retardation film, and a brightness enhancement film are formed on a sheet piece having a size including a surplus part that protrudes not only to the display area of the liquid crystal panel but also to the peripheral part (frame part) of the display area. It is pasted after being cut out. Thereby, the surplus part is arrange | positioned in a frame part, covering the display area reliably. Conventionally, the edges of the optical member are bonded so as to be arranged in the frame portion of the liquid crystal panel.

In recent years, however, optical display components have been studied to reduce the peripheral portion of the display area on the display surface to increase the display area and reduce the size of the device (hereinafter, the frame portion of the optical display component is reduced). This is sometimes referred to as “narrowing the frame”). The optical member is cut into a sheet piece having a size that matches the shape of the liquid crystal panel in plan view, and the edge of the sheet piece is bonded to the outer periphery of the liquid crystal panel.

Thus, when bonding the sheet piece of an optical member, the outer periphery shape of a liquid crystal panel is detected, and the operation which cuts out a sheet piece in the magnitude | size and shape match | combined with this outer periphery shape is performed. As a method for detecting the outer peripheral shape, a method of detecting the four corners (corner portions) of the liquid crystal panel in a plan view and making a rectangle connecting the four corners into the outer peripheral shape of the liquid crystal panel can be considered.

However, when the liquid crystal panel is manufactured by multi-chamfering by the above-described method, a burr or a chip is likely to occur at the corners in a liquid crystal panel having a rectangular shape. Therefore, the liquid crystal panel manufactured by multi-chamfering is easily affected by burrs and chips when detecting the outer peripheral shape of the liquid crystal panel, and is larger or smaller than the outer peripheral shape of the liquid crystal panel, and is likely to be defective.

The aspect of the present invention has been made in view of such circumstances, and detects the outer peripheral shape of a liquid crystal panel that eliminates the influence of burrs and chips on the peripheral edge, and processes the optical member according to the outer peripheral shape. An object of the present invention is to provide an optical display device production system that enables the above.

In order to achieve the above object, the optical display device production system according to an aspect of the present invention employs the following configuration.
(1) The optical display device production system according to the first aspect of the present invention is an optical display device production system formed by bonding an optical member to an optical display component, the optical display component having An imaging device that captures an image including the substrate in a plan view of a laminate formed by laminating an optical member sheet wider than the surface on the surface of the substrate, the optical member sheet, and the optical display component An approximate contour approximating a contour line in plan view of the substrate based on the image, the cutting device for cutting off the optical member that is a portion facing the display area of the optical member, a surplus portion outside the optical member, and the image And a control device that controls the cutting device so as to cut the optical member sheet based on the approximate contour, and the control device is imaged by the imaging device. A first portion that does not satisfy a predetermined criterion is determined from the contour lines obtained based on the image, and a second portion of the contour lines excluding the first portion overlaps the contour lines. Detecting the coordinates of a plurality of points, approximating a line corresponding to the contour line from the coordinates of the plurality of points, obtaining a figure obtained by the approximated line as the approximate contour line, based on the approximate contour line The cutting device is controlled to cut the optical member sheet.

The “opposite part of the display area” is an area that is not less than the size of the display area and not more than the size of the outer peripheral shape of the optical display component, and that avoids a functional part such as an electrical component mounting portion. That is, the optical member may be formed by being separated from the surplus portion along the outer peripheral edge of the optical display component, and is formed by being separated from the surplus portion at the frame portion that is the peripheral portion of the display area. It may be a thing.

Further, “cutting the optical member sheet based on the approximate contour line” means that the optical member sheet is along the approximate contour to be calculated or in a region that is not less than the size of the display region and inside the approximate contour line. The aspect which cut | disconnects is shown. That is, the cutting position of the optical member sheet may be a position along the approximate contour line, or may be a position overlapping with a frame portion that is a peripheral portion of the display area.

(2) In the production system for an optical display device according to (1), the imaging apparatus includes a plurality of imaging elements arranged in a first direction, and a second direction orthogonal to the first direction. It may be a line camera that moves to and picks up the image.

(3) The optical display device production system according to (1) or (2) may include an illumination device that illuminates the stacked body from the side opposite to the imaging device with the stacked body interposed therebetween. Good.

(4) In the optical display device production system according to any one of (1) to (3), the first portion is a portion predetermined as a vicinity of a corner of the substrate in plan view. And the control device may detect the coordinates of the plurality of points on each of two sides sandwiching the corner portion, excluding the first portion.

(5) In the production system for an optical display device according to any one of (1) to (4) above, the optical member sheet is bonded to the surface of the optical display component conveyed on a line. The laminating apparatus which forms the said laminated body may be included.

According to an aspect of the present invention, there is provided an optical display device production system that detects the outer peripheral shape of a liquid crystal panel that eliminates the influence of burrs and chips on the peripheral edge, and enables processing of optical members in accordance with the outer peripheral shape. Can be provided.

It is a figure which shows schematic structure of the film bonding system of this embodiment. It is a top view of a liquid crystal panel. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. It is a fragmentary sectional view of an optical member sheet pasted on a liquid crystal panel. It is a figure which shows operation | movement of a cutting device. It is a top view which shows the detection process of a bonding surface. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a perspective view which shows an example of the laser beam irradiation apparatus of this embodiment. It is a figure which shows the structure of EBS. It is a perspective view which shows the internal structure of IOR. It is a sectional side view which shows the arrangement configuration of a 1st condensing lens, an aperture member, and a collimating lens. (A)-(d) is a figure for demonstrating the effect | action of EBS. (A) to (d) are diagrams focusing on one pulse of laser light. It is a figure for demonstrating the effect | action of IOR. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut | disconnected using the laser beam irradiation apparatus which concerns on a comparative example. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut | disconnected using the laser beam irradiation apparatus of this embodiment. It is a figure which shows the structure of a control system. It is a figure for demonstrating operation | movement of a table. It is a figure which shows the operation | movement flow of the cutting process by a laser beam irradiation apparatus. It is the figure which showed notionally the operation | movement of the cutting process. It is a schematic diagram of a detection apparatus. It is a schematic diagram which shows a mode that a target object is imaged using an imaging device. It is a schematic diagram which shows a mode that a target object is imaged using an imaging device. It is a schematic diagram which shows the vicinity of a corner | angular part among the images imaged with the imaging device. It is a graph which shows the approximate straight line calculated | required from several points on an outline. It is the schematic diagram which calculated | required the approximate outline. It is a schematic diagram which shows a mode that the sheet piece of a laminated body is cut | disconnected using a cutting device. It is a figure which shows the operation | movement flow of a cutting process. It is a figure which shows the control method for a laser beam to draw a desired locus | trajectory. (A), (b) is explanatory drawing of the cutting process which concerns on a comparative example. (A), (b) is explanatory drawing of the cutting process which concerns on this embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments. In all the drawings below, the dimensions and ratios of the respective constituent elements are appropriately changed in order to make the drawings easy to see. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

(Optical display device production system)
Hereinafter, the film bonding system 1 which is a production system of the optical display device which concerns on one Embodiment of this invention is demonstrated with reference to drawings. As for the film bonding system 1 which concerns on this embodiment, the cutting device is comprised by the laser beam irradiation apparatus (refer FIG. 8) mentioned later.

Drawing 1 is a figure showing the schematic structure of film pasting system 1 of this embodiment.
The film bonding system 1 is a system for bonding a film-shaped optical member such as a polarizing film, an antireflection film, or a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.

In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the transport direction of the liquid crystal panel, which is an optical display component, is the X direction, and the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

As shown in FIG. 1, the film bonding system 1 of this embodiment is provided as one process of the production line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by a control device 40 as an electronic control device.

FIG. 2 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. The liquid crystal panel P includes a first substrate P1 (element substrate) having a rectangular shape in plan view, and a second substrate P2 (counter substrate) having a relatively small rectangular shape disposed to face the first substrate P1. And a liquid crystal layer P3 sealed between the first substrate P1 and the second substrate P2. The liquid crystal panel P has a rectangular shape that follows the outer peripheral shape of the first substrate P1 in a plan view, and has a display region P4 that is an area that fits inside the outer periphery of the liquid crystal layer P3 in a plan view.

FIG. 3 is a cross-sectional view taken along the line AA in FIG. On the front surface of the liquid crystal panel P and the back surface of the liquid crystal panel P, a long belt-shaped first optical member sheet F1 and a long belt-shaped second optical member sheet F2 (refer to FIG. 1, hereinafter collectively referred to as an optical member sheet FX). The first optical member F11 and the second optical member F12 (hereinafter sometimes collectively referred to as the optical member F1X) cut out from the above are appropriately bonded together. In the present embodiment, the first optical member F11 as the polarizing film and the second optical member F12 as the polarizing film are bonded to the backlight side surface of the liquid crystal panel P and the display surface side surface of the liquid crystal panel P, respectively. Is done.

Outside the display area P4, a frame portion G having a predetermined width for arranging a sealant or the like for joining the first substrate P1 and the second substrate P2 of the liquid crystal panel P is provided.

The first optical member F11 and the second optical member F12 are attached to the first sheet piece F1m from a first sheet piece F1m and a second sheet piece F2m (hereinafter sometimes collectively referred to as a sheet piece FXm), which will be described later. It is formed by cutting off the surplus portion outside the mating surface and the surplus portion outside the bonding surface of the second sheet piece F2m. The bonding surface will be described later.

FIG. 4 is a partial cross-sectional view of the optical member sheet FX bonded to the liquid crystal panel P. The optical member sheet FX includes a film-shaped optical member main body F1a, an adhesive layer F2a provided on one surface (the upper surface in FIG. 4) of the optical member main body F1a, and one of the optical member main bodies F1a via the adhesive layer F2a. The separator F3a is detachably stacked on the other surface, and the surface protection film F4a is stacked on the other surface (lower surface in FIG. 4) of the optical member body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and the peripheral area of the display area P4. For convenience of illustration, hatching of each layer in FIG. 4 is omitted.

The optical member main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface of the optical member main body F1a. Hereinafter, the part remove | excluding the separator F3a from the optical member sheet | seat FX is called the bonding sheet | seat F5.

The separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical member sheet FX may not include the surface protective film F4a. Moreover, the structure which is not isolate | separated from the optical member main body F1a may be sufficient as the surface protection film F4a.

The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. And a second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

The optical member body F1a may have a single-layer structure composed of a single optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancement film, or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.
As shown in FIG. 1, the film laminating system 1 according to the present embodiment includes a liquid crystal panel P on the right side in the transport direction (+ X direction side) from the upstream side in the transport direction (+ X direction side) of the liquid crystal panel P on the left side in the figure (− X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.

The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary. On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P <b> 4 is along the transport direction. On the other hand, on the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P <b> 4 along the transport direction. A sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical member sheet FX is bonded to the front and back surfaces of the liquid crystal panel P.

The upstream conveyor 6 includes an independent free roller conveyor 24 on the downstream side in the first suction device 11 described later. On the other hand, the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.

The film bonding system 1 of this embodiment is the 1st adsorption | suction apparatus 11, the 1st dust collector 12, the 1st bonding apparatus 13, the 1st detection apparatus 41, the 1st cutting device 31, the inversion apparatus 15, and 2nd adsorption | suction. The apparatus 20, the second dust collecting device 16, the second bonding device 17, the second detection device 42, the second cutting device 32, and the control device 40 are provided.

The first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P. The first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

The panel holding unit 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P. The panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P. When the conveyance is finished, the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.

In the alignment camera 11b, the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state. Imaging data from the alignment camera 11b is transmitted to the control device 40, and based on this imaging data, the panel holding unit 11a is operated to align the liquid crystal panel P with the free roller conveyor 24 at the transport destination. In other words, the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the shift in the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the turning direction about the vertical axis of the liquid crystal panel P. .
The liquid crystal panel P conveyed on the rail R by the panel holding part 11a is supported by being sandwiched by the pressure roll 23 with the sheet piece FXm in a state of being sucked by the suction pad 26.

The 1st dust collector 12 is provided in the conveyance upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13. FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.

The 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption | suction apparatus 11. FIG. The 1st bonding apparatus 13 bonds the bonding sheet | seat F5 (equivalent to 1st sheet piece F1m) cut into the predetermined size with respect to the lower surface of liquid crystal panel P introduced into the bonding position.

The 1st bonding apparatus 13 is provided with the conveying apparatus 22 and the pinching roll 23. FIG.

The conveying device 22 conveys the optical member sheet FX along the longitudinal direction of the optical member sheet FX while unwinding the optical member sheet FX from the original roll R1 around which the optical member sheet FX is wound. The conveying apparatus 22 conveys the bonding sheet | seat F5 by using separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding unit 22a holds the original roll R1 around which the belt-shaped optical member sheet FX is wound and feeds the optical member sheet FX along the longitudinal direction of the optical member sheet FX.
The plurality of guide rollers 22b wind the optical member sheet FX so as to guide the optical member sheet FX unwound from the original fabric roll R1 along a predetermined conveyance path.
The cutting device 22c performs a half cut on the optical member sheet FX on the transport path.
The knife edge 22d feeds the bonding sheet F5 to the bonding position while winding the optical member sheet FX subjected to the half cut at an acute angle to separate the bonding sheet F5 from the separator F3a.
The winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.

The roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example. Thereby, the winding part 22e winds up the separator F3a which passed through the knife edge 22d, while the roll holding part 22a feeds the optical member sheet FX in the transport direction of the optical member sheet FX. Hereinafter, the upstream side in the transport direction of the optical member sheet FX (separator F3a) in the transport device 22 is referred to as a sheet transport upstream side, and the downstream side in the transport direction is referred to as a sheet transport downstream side.

Each guide roller 22b changes the traveling direction of the optical member sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b adjusts the tension of the optical member sheet FX being conveyed. Move.

A dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical member sheet FX conveyed from the roll holding unit 22a while the optical member sheet FX is cut by the cutting device 22c.

FIG. 5 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
As shown in FIG. 5, when the optical member sheet FX is fed out by a predetermined length, the cutting device 22c extends in the thickness direction of the optical member sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical member sheet FX. Perform half cut to cut a part. The cutting device 22c of the present embodiment is provided so as to be able to advance and retreat toward the optical member sheet FX from the side opposite to the separator F3a with respect to the optical member sheet FX.

The cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical member sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical member sheet FX (so that a predetermined thickness remains in the separator F3a). Then, half-cut is performed to the vicinity of the interface between the adhesive layer F2a and the separator F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

The optical member sheet FX after half-cutting is cut along the entire width in the width direction of the optical member sheet FX by cutting the optical member body F1a and the surface protection film F4a in the thickness direction of the optical member sheet FX. , CL2 are formed. The cut lines CL1 and CL2 are formed so as to be aligned in the longitudinal direction of the belt-shaped optical member sheet FX. For example, in the case of the bonding process which conveys the liquid crystal panel P of the same size, the plurality of cut lines CL1 and CL2 are formed at equal intervals in the longitudinal direction of the optical member sheet FX. The optical member sheet FX is divided into a plurality of sections in the longitudinal direction by a plurality of cut lines CL1, CL2. A section sandwiched between a pair of cut lines CL1 and CL2 adjacent in the longitudinal direction in the optical member sheet FX is a sheet piece FXm in the bonding sheet F5. The sheet piece FXm is a sheet piece of the optical member sheet FX having a size that protrudes outside the liquid crystal panel P.

1, the knife edge 22d is disposed below the upstream conveyor 6 and extends over at least the entire width in the width direction of the optical member sheet FX. The knife edge 22d is wound so as to be in sliding contact with the separator F3a side of the optical member sheet FX after the half cut.

The knife edge 22d is arranged in an inclined position as viewed from the width direction of the optical member sheet FX (the width direction of the upstream conveyor 6) (that is, to have a predetermined angle with respect to the transport direction of the liquid crystal panel P). A first surface above the first surface, a second surface disposed at an acute angle with respect to the first surface when viewed from the width direction of the optical member sheet FX, and a tip portion where the first surface and the second surface intersect Have

In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical member sheet | seat F1 at an acute angle around the front-end | tip part of the knife edge 22d. The first optical member sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d overlaps the lower surface of the liquid crystal panel P in a state of being adsorbed by the first adsorbing device 11, and between the pair of bonding rollers 23a of the pinching roll 23. be introduced. The first sheet piece F1m is a sheet piece of the first optical member sheet F1 having a size that protrudes outside the liquid crystal panel P.

On the other hand, the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d. The winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.

The pinching roll 23 bonds the first sheet piece F1m separated from the first optical member sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6. The pinching roll 23 bonds the first sheet piece F1m to the lower surface of the liquid crystal panel P conveyed on the line to form a laminate described later. Here, the pinching roll 23 corresponds to a bonding apparatus.

The pinching roll 23 has a pair of

bonding rollers

23a and 23a arranged in parallel with each other in the axial direction (the upper bonding roller 23a is movable up and down). A predetermined gap is formed between the pair of

bonding rollers

23 a and 23 a, and the inside of this gap is the bonding position of the first bonding apparatus 13.

In the gap, the liquid crystal panel P and the first sheet piece F1m are overlapped and introduced. Liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being pinched by a pair of bonding roller 23a. In this embodiment, 1st optical member bonding body PA1 is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG. Here, 1st optical member bonding body PA1 is corresponded to a laminated body.

The 1st detection apparatus 41 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m.

FIG. 6 is a plan view showing a process for detecting the edge EG of the first bonding surface SA1.
For example, as illustrated in FIG. 6, the first detection device 41 detects the edge EG of the first bonding surface SA <b> 1 in the inspection area CA installed on the transport path of the upstream conveyor 6. Inspection area | region CA is an area | region containing 1st bonding surface SA1 which has a rectangular shape. The edge EG is detected for each liquid crystal panel P conveyed on the line. The data of the edge EG detected by the first detection device 41 is stored in a storage unit (not shown). The configuration of the first detection device 41 will be described later (see FIG. 21).

The cutting position of the first sheet piece F1m is adjusted based on the detection result of the edge EG of the first bonding surface SA1. The control apparatus 40 (refer FIG. 1) acquires the data of the edge EG of 1st bonding surface SA1 memorize | stored in the memory | storage part, and the 1st optical member F11 is outside the liquid crystal panel P (1st bonding surface SA1). The cutting position of the first sheet piece F1m is determined so as not to protrude beyond the outer side. The first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control device 40.

1, the first cutting device 31 is provided on the downstream side of the panel transport with respect to the first detection device 41. The 1st cutting device 31 performs the laser cut along the edge EG, and is the 1st sheet piece F1m (1st sheet | seat) of the part which protruded from the 1st optical member bonding body PA1 to the outer side of 1st bonding surface SA1. The surplus portion of the piece F1m) is cut off, and an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1 is formed. Here, the first cutting device 31 corresponds to a cutting device.

Here, the “size corresponding to the first bonding surface SA1” indicates the size of the outer peripheral shape of the first substrate P1. However, it includes a region that is not less than the size of the display region P4 and not more than the size of the outer peripheral shape of the liquid crystal panel P and that avoids a functional part such as an electrical component mounting portion. In the present embodiment, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P at three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, and the liquid crystal panel P at one side corresponding to the functional portion. The surplus portion is laser-cut at a position that appropriately enters the display area P4 side from the outer peripheral edge of.
For example, when the part corresponding to 1st bonding surface SA1 is the bonding surface of a TFT substrate, it shifted | deviated predetermined amount from the outer periphery of liquid crystal panel P to the display area P4 side so that a functional part may be excluded in one side corresponding to a functional part. Cut at position.
In addition, it is not restricted to bonding a sheet piece to the area | region (for example, the whole liquid crystal panel P) including the functional part in liquid crystal panel P. For example, a sheet piece is pasted in a region that avoids the functional part in the liquid crystal panel P in advance, and then surplus along the outer peripheral edge of the liquid crystal panel P on the three sides excluding the functional part in the rectangular liquid crystal panel P in plan view The part may be laser cut.

The 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P by cutting off the surplus part of the 1st sheet piece F1m from the 1st optical member bonding body PA1 by the 1st cutting device 31. 2 optical member bonding body PA2 is formed. The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

The reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.

The reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11. The reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.

The reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control device 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce | transduced into the bonding position of the 2nd bonding apparatus 17. FIG.

Since the second adsorption device 20 has the same configuration as the first adsorption device 11, the same parts are denoted by the same reference numerals and described. The 2nd adsorption | suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2. The second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2. Do. The panel holding | maintenance part 11a adsorbs and hold | maintains the upper surface of 2nd optical member bonding body PA2 contact | abutted to the stopper S by vacuum suction. The panel holding | maintenance part 11a moves on the rail R in the state which adsorbed and hold | maintained 2nd optical member bonding body PA2, and conveys 2nd optical member bonding body PA2. When the conveyance is finished, the panel holding unit 11a releases the suction holding and transfers the second optical member bonding body PA2 to the free roller conveyor 24.

The alignment camera 11b holds the second optical member bonding body PA2 in contact with the stopper S by the panel holding portion 11a, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state. Imaging data from the alignment camera 11b is transmitted to the control device 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with respect to the free roller conveyor 24 at the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.

The 2nd dust collector 16 is arrange | positioned in the conveyance direction upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 2nd bonding apparatus 17. FIG. The second dust collecting device 16 performs static electricity removal and dust collection in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side.

The 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16. FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position. Do. The 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13. FIG.

2nd optical member bonding body PA2 and 2nd sheet piece F2m are overlapped and introduce | transduced in the clearance gap (bonding position of the 2nd bonding apparatus 17) between a pair of bonding rollers 23a of the pinching roll 23. FIG. The second sheet piece F2m is a sheet piece of the second optical member sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

2nd optical member bonding body PA2 and 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by a pair of bonding roller 23a. In this embodiment, it is a 2nd sheet | seat on the surface (surface on the opposite side to the surface where the 1st optical member F11 of 2nd optical member bonding body PA2 was bonded) of the liquid crystal panel P by the pinching roll 23. By bonding the piece F2m, the third optical member bonding body PA3 is formed. Here, 3rd optical member bonding body PA3 is corresponded to a laminated body.

The 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

The cut position of the second sheet piece F2m is adjusted based on the detection result of the edge of the second bonding surface. The control apparatus 40 (refer FIG. 1) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 2nd optical member F12 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the second sheet piece F2m is determined so as not to protrude. The second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control device 40. Here, the second cutting device 32 corresponds to a cutting device.

The second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42. The 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) of the magnitude | size corresponding to a 2nd bonding surface is formed.

Here, the “size corresponding to the second bonding surface” is not less than the size of the display area P4 of the liquid crystal panel P and not more than the size of the outer peripheral shape (contour shape in plan view) of the liquid crystal panel P. Point to.
In the present embodiment, the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P having a rectangular shape in plan view. For example, when the portion corresponding to the second bonding surface is the bonding surface of the CF substrate, since there is no portion corresponding to the above-described functional portion, it is cut along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P. The

The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and The 4th optical member bonding body PA4 (optical display device) by which the 1st optical member F11 is bonded to the surface by the side of the backlight of liquid crystal panel P is formed. The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

The 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus 100 (refer FIG. 8). The 1st cutting device 31 and the 2nd cutting device 32 cut | disconnect endlessly the sheet piece FXm bonded by liquid crystal panel P along the outer periphery of the bonding surface.

A bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17. The bonding inspection device is an inspection (not shown whether the position of the optical member F1X is within the tolerance range) by the inspection device (not shown) of the workpiece (liquid crystal panel P) on which the film is bonded. ) Etc.) is performed. The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

In the present embodiment, the control device 40 as an electronic control device that performs overall control of each part of the film bonding system 1 includes a computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk. The control device 40 of the present embodiment includes an interface capable of executing communication with a device external to the computer system. An input device that can input an input signal may be connected to the control device 40. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control device 40 may include a display device such as a liquid crystal display that indicates the operation status of each part of the film bonding system 1, or may be connected to the display device.

An operating system (OS) that controls the computer system is installed in the storage unit of the control device 40. A program that causes the storage unit of the control device 40 to execute processing for causing each unit of the film bonding system 1 to accurately convey the optical member sheet F by causing the arithmetic processing unit to control each unit of the film bonding system 1. Is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control device 40. The control device 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each part of the film bonding system 1.

The storage unit includes a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. The storage unit functionally includes the first adsorption device 11, the first dust collector 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the reversing device 15, and the second adsorption device 20. , Second dust collector 16, second bonding device 17, second detection device 42, storage area for storing program software in which the control procedure of the operation of second cutting device 32 is described, and other various storage areas are set Is done.

Hereinafter, an example of a method for determining the bonding position (relative bonding position) of the sheet piece FXm with respect to the liquid crystal panel P will be described with reference to FIGS. 7A and 7B.

First, as shown in FIG. 7A, a plurality of inspection points CP are set in the width direction of the optical member sheet FX, and the direction of the optical axis of the optical member sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical member sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical member sheet FX is stored in a storage unit (not shown) in association with the position of the optical member sheet FX (position in the longitudinal direction and position in the width direction of the optical member sheet FX).

The control device 40 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each inspection point CP from the storage unit, and the optical member sheet FX (by the cut line CL) of the portion where the sheet piece FXm is cut out. The direction of the average optical axis of the sectioned area) is detected.

For example, as shown in FIG. 7B, the angle (deviation angle) formed between the direction of the optical axis and the edge line EL of the optical member sheet FX is detected for each inspection point CP, and the largest of the deviation angles (maximum deviation angle). ) Is θmax, and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is detected as the average deviation angle. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical member sheet FX is detected as the average direction of the optical axis of the optical member sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical member sheet FX and the clockwise direction being negative.

Then, the direction of the average optical axis of the optical member sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specifications, the average optical axis of the optical member sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

The first cutting device 31 and the second cutting device 32 described above detect the outer peripheral edge of the display area P4 of the liquid crystal panel P with a detection means such as a camera, and paste the sheet piece FXm bonded to the liquid crystal panel P to the bonding surface. Cut endlessly along the outer periphery. The outer periphery of the bonding surface is detected by capturing an image including the bonding surface. In the present embodiment, laser cutting by the first cutting device 31 and the second cutting device 32 is performed along the outer peripheral edge of the bonding surface.

¡The runout width (tolerance) of the cutting line of the laser processing machine is smaller than the runout width of the cutting blade. Therefore, in this embodiment, compared with the case where the optical member sheet | seat FX is cut | disconnected using a cutting blade, it can cut | disconnect easily along the outer periphery of the bonding surface, and size reduction of liquid crystal panel P and ( Or) The display area P4 can be enlarged. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

Further, when the optical member sheet FX is cut into a sheet piece aligned with the display area P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerance of the sheet piece, the dimensional tolerance of the liquid crystal panel P, and the sheet piece and the liquid crystal Since the dimensional tolerance of the relative bonding position with the panel P overlaps, it becomes difficult to narrow the width of the frame part G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

On the other hand, when cutting out the sheet piece FXm of the optical member sheet FX of a size that protrudes from the optical member sheet FX to the outside of the liquid crystal panel P, and bonding the cut sheet piece FXm to the liquid crystal panel P and then cutting it according to the bonding surface Only the run-out tolerance of the cutting line needs to be considered, and the tolerance of the width of the frame G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

Further, by cutting the sheet piece FXm with a laser instead of a blade, the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since laser cutting is a non-contact cutting method with respect to the liquid crystal panel P, there is little damage to the electrical component mounting portion.

(Cutting device)
FIG. 8 is a perspective view showing an example of a laser beam irradiation device 100 used as a cutting device (first cutting device 31 and second cutting device 32). The laser light irradiation apparatus 100 uses the laminated body (1st optical member bonding body PA1 or 3rd optical member bonding body PA3) containing the sheet piece FXm as the target object 110, cuts off the excess part of the sheet piece FXm, and bonded surface ( The cutting process which forms the optical member F1X of the magnitude | size corresponding to a 1st bonding surface or a 2nd bonding surface) is performed.

As shown in FIG. 8, a laser beam irradiation apparatus 100 includes a table 101, a laser beam oscillator 102, an acoustooptic device 103 that constitutes an EBS 130 (Electrical Beam Shaping: see FIG. 9), an IOR 104 (Imaging Opticals Rail), and , A scanner 105, a moving device 106, and a control device 107 that performs overall control of these devices.

The table 101 has a holding surface 101s that holds an object 110 to be cut. The table 101 is rectangular when viewed from the normal direction of the holding surface 101s. The holding surface 101s is a rectangular first holding surface 101s1 having a length in the first direction (X direction), and a second holding member that is disposed adjacent to the first holding surface 101s1 and has the same shape as the first holding surface 101s1. Surface 101s2. That is, the table 101 includes the first holding surface 101s1 and the second holding surface 101s2, and is configured to be able to hold the two objects 110 at the same time.

The laser light oscillator 102 is a member that emits laser light LB. For example, as the laser oscillator 102, an oscillator such as a CO ₂ laser oscillator (carbon dioxide laser oscillator), a UV laser oscillator, a semiconductor laser oscillator, a YAG laser oscillator, or an excimer laser oscillator can be used. The specific configuration is not particularly limited. Among the exemplified oscillators, the CO ₂ laser light oscillator can emit a high-power laser beam that can easily cut an optical member such as a polarizing film.

FIG. 9 is a diagram illustrating a configuration of the EBS 130.
As shown in FIG. 9, the EBS 130 includes an acoustooptic element 103 disposed on the optical path of laser light emitted from the laser beam oscillator 102, a drive driver 131 electrically connected to the acoustooptic element 103, a laser And a control device 107 (corresponding to a laser control unit 171 to be described later) that controls the timing at which the light passes through the acousto-optic element 103.
The EBS 130 shields the laser light until the output of the laser light is stabilized.

Acousto-optic element 103 is an optical element for shielding the laser beam emitted from laser beam oscillator 102.

The acoustooptic element 103 is an element formed by adhering a piezoelectric element to an acoustooptic medium made of single crystal or glass such as tellurium dioxide (TeO ₂ ) or lead molybdate (PbMoO ₄ ). By applying an electrical signal to the piezoelectric element to generate an ultrasonic wave and propagating the ultrasonic wave into the acousto-optic medium, the passage and non-passing (shielding) of the laser light can be controlled.

In this embodiment, the acousto-optic element 103 is used as a constituent member of the EBS 130, but the present invention is not limited to this. Other optical elements may be used as long as the laser light emitted from the laser light oscillator 102 can be shielded.

The drive driver 131 supplies an electrical signal (control signal) for generating an ultrasonic wave to the acoustooptic device 103 based on the control of the control device 107, and adjusts the shielding time of the laser beam by the acoustooptic device 103.

The control device 107 controls the timing at which the laser light passes through the acousto-optic device 103 so that, for example, the rising and falling portions of the laser light emitted from the laser light oscillator 102 are removed.

The timing control by the control device 107 is not limited to this. For example, the control device 107 may control the timing at which the laser light passes through the acoustooptic device 103 so that the rising portion of the laser light emitted from the laser light oscillator 102 is selectively removed.
In particular, when the width (time) of the falling portion of the laser light emitted from the laser light oscillator 102 is sufficiently shorter than the width (time) of the rising portion of the laser light, the falling portion of the laser light is removed. The profit is small. Therefore, in such a case, only the rising portion of the laser light emitted from the laser light oscillator 102 may be selectively removed.

With such a configuration, the EBS 130 emits the laser light emitted from the laser light oscillator 102 in a state where the output is stable based on the control of the control device 107.

The IOR 104 removes the skirt portion that does not contribute to the cutting of the object 110 in the intensity distribution of the laser light.

FIG. 10 is a perspective view showing the internal configuration of the IOR 104.
As shown in FIG. 10, the IOR 104 includes a first condenser lens 141 that condenses the laser light emitted from the EBS 130, a first holding frame 142 that holds the first condenser lens 141, and a first condenser lens. A diaphragm member 143 that squeezes the laser beam condensed by the lens 141, a holding member 144 that holds the diaphragm member 143, a collimator lens 145 that collimates the laser beam focused by the diaphragm member 143, and a collimator lens 145 are held. A second holding frame 146 and a moving mechanism 147 for relatively moving the first holding frame 142, the holding member 144, and the second holding frame 146 are included.

FIG. 11 is a side sectional view showing an arrangement configuration of the first condenser lens 141, the diaphragm member 143, and the collimator lens 145.

As shown in FIG. 11, the aperture member 143 is formed with a pinhole 143h for focusing the laser beam condensed by the first condenser lens 141. The centers of the first condenser lens 141, the pinhole 143 h and the collimator lens 145 are arranged at positions overlapping the optical axis C of the laser light emitted from the EBS 130.

The diaphragm member 143 can be disposed in the vicinity of the rear focal point of the first condenser lens 141.

Here, “near the rear focal point of the first condenser lens 141” means that the arrangement position of the diaphragm member 143 is slightly different from the rear focal point of the first condenser lens 141 so that the arrangement position is slightly different. It means that it may be allowed. For example, the distance K ₁ from the center of the first condenser lens 141 to the rear focal point of the first condenser lens 141 and the distance K ₂ from the center of the first condenser lens 141 to the center of the pinhole 143 h of the aperture member 143. If the ratio K ₁ / K ₂ is in the range of 0.9 / 1 to 1.1 / 1, it can be said that the diaphragm member 143 is disposed in the vicinity of the rear focal point of the first condenser lens 141. . If it is such a range, the laser beam condensed by the 1st condensing lens 141 can be narrowed down effectively.

The diaphragm member 143 can be arranged in the vicinity of the rear focal point of the first condenser lens 141, but the arrangement position of the diaphragm member 143 is not necessarily limited to this position. The arrangement position of the aperture member 143 may be on the optical path between the first condenser lens 141 and the collimator lens 145, and is not limited to the vicinity of the rear focal point of the first condenser lens 141.

Returning to FIG. 10, the moving mechanism 147 moves the first holding frame 142, the holding member 144, and the second holding frame 146 in a direction parallel to the traveling direction of the laser light, and the slider mechanism 148. Holding base 149 for holding.

For example, the first holding frame 142 and the holding member 144 are moved by moving the first holding frame 142 and the second holding frame 146 in a direction parallel to the traveling direction of the laser beam in a state where the holding member 144 is arranged at a fixed position. And the mutual positioning of the 2nd holding frame 146 is performed. Specifically, the diaphragm member 143 is disposed at the position of the front focal point of the collimating lens 145 and at the position of the rear focal point of the first condenser lens 141.

Referring back to FIG. 8, the scanner 105 scans the laser beam biaxially in a plane parallel to the holding surface 101s (in the XY plane). That is, the scanner 105 moves the laser light relative to the table 101 independently in the X direction and the Y direction. Thereby, it is possible to accurately irradiate the laser beam to an arbitrary position of the object 110 held on the table 101.

The scanner 105 includes a first irradiation position adjustment device 151 and a second irradiation position adjustment device 154.

The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 constitute a scanning element that biaxially scans the laser light emitted from the IOR 104 in a plane parallel to the holding surface 101s. As the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154, for example, a galvano scanner is used. The scanning element is not limited to a galvano scanner, and a gimbal can be used.

The first irradiation position adjusting device 151 includes a mirror 152 and an actuator 153 that adjusts the installation angle of the mirror 152. The actuator 153 has a rotation axis parallel to the Z direction. The actuator 153 rotates the mirror 152 around the Z axis based on the control of the control device 107.

The second irradiation position adjusting device 154 includes a mirror 155 and an actuator 156 that adjusts the installation angle of the mirror 155. The actuator 156 has a rotation axis parallel to the Y direction. The actuator 156 rotates the mirror 155 around the Y axis based on the control of the control device 107.

On the optical path between the scanner 105 and the table 101, a second condenser lens 108 that condenses the laser light passing through the scanner 105 toward the holding surface 101s is disposed.

For example, an fθ lens is used as the second condenser lens 108. Thereby, the laser beam emitted in parallel to the second condenser lens 108 from the mirror 155 can be condensed in parallel to the object 110.

Note that the second condenser lens 108 may not be disposed on the optical path between the scanner 105 and the table 101.

The laser beam LB emitted from the laser beam oscillator 102 is applied to the object 110 held on the table 101 via the acoustooptic device 103, the IOR 104, the mirror 152, the mirror 155, and the second condenser lens. The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 are configured to irradiate laser light emitted from the laser light oscillator 102 toward the object 110 held on the table 101 based on the control of the control device 107. Adjust the position.

A laser beam processing region 105s (hereinafter referred to as a scan region) controlled by the scanner 105 is rectangular when viewed from the normal direction of the holding surface 101s. In the present embodiment, the area of the scan region 105s is smaller than the areas of the first holding surface 101s1 and the second holding surface 101s2.

12 (a) to 12 (d) are diagrams for explaining the operation of the EBS 130. FIG.
FIG. 12A shows a control signal of laser light emitted from the laser light oscillator 102.
FIG. 12B shows the output characteristics of the laser light itself emitted from the laser light oscillator 102, that is, the output characteristics of the laser light before the laser light emitted from the laser light oscillator 102 passes through the acoustooptic device 103. ing.
FIG. 12C shows a control signal for the acousto-optic element 103.
FIG. 12D shows the output characteristics of the laser light after the laser light emitted from the laser light oscillator 102 passes through the acoustooptic device 103.
In each of FIGS. 12B and 12D, the horizontal axis represents time, and the vertical axis represents laser light intensity.
FIGS. 13A to 13D are diagrams focusing on one pulse of laser light in FIGS. 12A to 12D.
In the following description, the “control signal for laser light emitted from the laser light oscillator 102” is referred to as “control signal for laser light”. “Output characteristics of laser light before the laser light emitted from the laser light oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light before passing through the acousto-optic element 103”. “Output characteristics of laser light after the laser light emitted from the laser light oscillator 102 passes through the acoustooptic element 103” is referred to as “output characteristics of laser light after passing through the acoustooptic element 103”.

As shown in FIGS. 12A and 13A, the pulse Ps1 of the laser light control signal is a rectangular pulse. As shown in FIG. 12A, the laser light control signal is a so-called clock pulse that generates a plurality of pulses Ps1 by periodically switching the ON / OFF signal to the laser light oscillator 102.

12A and 13A, the peak portion of the pulse Ps1 is in a state where an ON signal is sent to the laser light oscillator 102, that is, in an ON state where laser light is emitted from the laser light oscillator 102. . The valley portion of the pulse Ps1 is a state in which an OFF signal is sent to the laser light oscillator 102, that is, an OFF state in which laser light is not emitted from the laser light oscillator 102.

As shown in FIG. 12A, three collective pulses PL1 are formed by arranging three pulses Ps1 at short intervals. The three collective pulses PL1 are arranged at intervals longer than the arrangement interval of the three pulses Ps1. For example, the interval between two adjacent pulses Ps1 is 1 ms, and the interval between two adjacent collective pulses PL1 is 10 ms.

In the present embodiment, an example in which one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals is described, but the present invention is not limited to this. For example, one collective pulse may be formed by arranging a plurality of two or four or more pulses at short intervals.
Further, the configuration is not limited to the plurality of pulses being periodically formed, and one pulse may be formed with a long width. That is, a configuration in which a laser beam having a certain intensity from the ON signal to the OFF signal to the laser beam oscillator is emitted for a predetermined time may be employed.

As shown in FIGS. 12B and 13B, the pulse Ps2 of the output characteristic of the laser light before passing through the acoustooptic device 103 is a waveform pulse having a rising portion G1 and a falling portion G2.

Here, the rising portion G1 means a portion of the pulse Ps2 in the period from when the intensity of the laser beam reaches zero to an intensity that contributes to the cutting of the object. The falling portion G2 means a portion in the period from the intensity at which the intensity of the laser light contributes to the cutting of the object to zero, among the pulses Ps2 of the output characteristics of the laser light. The intensity that contributes to the cutting of the object varies depending on the material and thickness of the object and the output value of the laser beam. As an example, as shown in FIG. 13B, 50% of the peak intensity (100%) of the laser beam. % Strength.

As shown in FIGS. 12B and 13B, the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2. That is, the time of the rising portion G1 of the laser light emitted from the laser light oscillator 102 is longer than the time of the falling portion G2 of the laser light. For example, the width of the rising portion G1 is 45 μs, and the width of the falling portion G2 is 25 μs.

In this embodiment, the example in which the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2 is described, but the present invention is not limited to this. For example, when the width of the rising portion G1 of the pulse Ps2 is substantially equal to the width of the falling portion G2, the width of the rising portion G1 of the pulse Ps2 is shorter than the width of the falling portion G2. The form is applicable.

As shown in FIG. 12B, one collective pulse PL2 is formed by arranging the three pulses Ps2 at positions corresponding to the three pulses Ps1 shown in FIG.
The three collective pulses PL2 are arranged at positions corresponding to the three collective pulses PL1 shown in FIG.

As shown in FIGS. 12C and 13C, the control signal pulse Ps3 of the acoustooptic device 103 is a rectangular pulse. As shown in FIG. 12C, the control signal of the acoustooptic device 103 is a so-called clock pulse. The control signal of the acoustooptic device 103 is a signal for periodically switching the timing at which the laser light passes through the acoustooptic device 103. The plurality of pulses Ps3 in the control signal of the acoustooptic device 103 are generated by periodically switching the control signal to the drive driver 131.

12 (c) and 13 (c), the peak portion of the pulse Ps3 is in a state where laser light is transmitted, that is, a light-transmitting state where laser light is transmitted. The valley portion of the pulse Ps3 is in a state where laser light is not passed, that is, in a light shielding state where the laser light is shielded.

As shown in FIG. 13C, the valley portion of each pulse Ps3 is arranged so as to overlap both the rising portion G1 and the falling portion G2 of each pulse Ps2 shown in FIG.

As shown in FIG. 13C, when focusing on one pulse Ps3, the width of the valley portion V1 on the front side of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the rear side of the pulse Ps3 The width of the valley portion V2 is substantially equal to the width of the falling portion of the pulse Ps2. For example, the width of the valley portion V1 on the front side of the pulse Ps3 is 45 μs, and the width of the valley portion V2 on the rear side of the pulse Ps3 is 25 μs. As described above, the EBS 130 has a switch function having a quick response characteristic.

As a result, the rising portion G1 and the falling portion G2 of the laser beam can be removed, and the portion of the laser beam output characteristic pulse Ps2 in which the intensity of the laser beam contributes to the cutting of the object can be selectively extracted. .

As a result, as shown in FIGS. 12D and 13D, the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic device 103 does not have a rising portion G1 and a falling portion G2. It becomes a pulse protruding to

In the present embodiment, the width of the front valley portion V1 of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the width of the rear valley portion V2 of the pulse Ps3 is the rising edge of the pulse Ps2. Although an example that is substantially equal to the width of the falling portion is described, the present invention is not limited to this.
For example, the width of the valley portion V1 on the front side of the pulse Ps3 is substantially equal to the width of the rising portion G1 of the pulse Ps2, or the width of the valley portion V2 on the rear side of the pulse Ps3 is set to the width of the falling portion of the pulse Ps2. It can be adjusted as needed, such as making it larger than the width.

FIG. 14 is a diagram for explaining the operation of the IOR 104.
The diagram on the left side of FIG. 14 is a diagram showing the intensity distribution of the laser light before passing through the pinhole 143h. The upper left diagram in FIG. 14 is a plan view. FIG. 14 is a perspective view of the middle left stage. In the lower left diagram of FIG. 14, the horizontal axis indicates the position, and the vertical axis indicates the strength.
The diagram on the right side of FIG. 14 shows the intensity distribution of the laser light after passing through the pinhole 143h. The upper right diagram in FIG. 14 is a plan view. The right middle part of FIG. 14 is a perspective view. In the lower right diagram of FIG. 14, the horizontal axis indicates the position and the vertical axis indicates the strength.
FIG. 15 is an enlarged view of a cut surface when a polarizing plate, which is an object, is cut using the laser light irradiation apparatus according to the comparative example.
Here, the laser beam irradiation apparatus according to the comparative example is a laser beam irradiation apparatus that uses the laser beam before passing through the pinhole 143 h as it is, that is, a laser beam irradiation apparatus that does not include the IOR 104.
FIG. 16 is an enlarged view of a cut surface when a polarizing plate that is an object is cut using the laser beam irradiation apparatus 100 according to the present embodiment.

As shown in the diagram on the left side of FIG. 14, the intensity distribution of the laser light before passing through the pinhole 143h has a strong intensity distribution at the center of the beam and a low intensity distribution at the outer periphery of the beam. . When the intensity of the laser beam at the outer periphery of the beam is reduced, the outer periphery of the beam does not contribute to the cutting of the object.

In this case, as shown in FIG. 15, in the laser light irradiation apparatus according to the comparative example, it is confirmed that the cut surface of the polarizing plate has a tapered shape. This is considered to be due to the fact that when the polarizing plate was cut, the outer peripheral portion of the laser beam diameter affected the portion along the cut line, thereby dissolving the portion other than the polarizing plate cut region. .

On the other hand, as shown in the diagram on the right side of FIG. 14, the intensity distribution of the laser light after passing through the pinhole 143h has a skirt portion that does not contribute to the cutting of the polarizing plate in the intensity distribution of the laser light. By being removed, the intensity distribution of the laser light becomes an ideal Gaussian distribution. The half width of the intensity distribution of the laser light after passing through the pinhole 143h is narrower than the half width of the intensity distribution of the laser light before passing through the pinhole 143h.

In this case, as shown in FIG. 16, in the laser beam irradiation apparatus 100 including the IOR 104 according to this embodiment, it is confirmed that the cut surface of the polarizing plate is perpendicular to the holding surface. This is because when the polarizing plate is cut, the portion of the laser light intensity distribution that contributes to the cutting of the polarizing plate is irradiated to the polarizing plate, so that the cut region of the polarizing plate can be selectively fused. Conceivable.

8, the moving device 106 moves the table 101 and the scanner 105 relative to each other. The moving device 106 includes a first slider mechanism 161 and a second slider mechanism 162. The first slider mechanism 161 is a mechanism for moving the table 101 in a first direction (X direction) parallel to the holding surface 101s. The second slider mechanism 162 is a mechanism for moving the first slider mechanism 161 in a second direction (Y direction) parallel to the holding surface 101s and perpendicular to the first direction.

Based on such a configuration, the moving device 106 includes a linear motor (hereinafter referred to as slider mechanism 161 or 162) incorporated in each of the first slider mechanism 161 and the second slider mechanism 162. It is possible to move the table 101 in each of the X direction and the Y direction by actuating (not shown).

The linear motor that is pulse-driven in the

slider mechanisms

161 and 162 can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Therefore, each position of the table 101 supported by the slider mechanism 161 in the X direction and the Y direction can be controlled with high accuracy. Note that the position control of the table 101 is not limited to the position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.

The control device 107 includes a laser control unit 171 that controls the laser light oscillator 102 and the acoustooptic device 103 (drive driver 131), a scanner control unit 172 that controls the scanner 105, and a slider control unit 173 that controls the moving device 106. Have.

Specifically, the laser controller 171 turns the laser light oscillator 102 on / off, the output of the laser light emitted from the laser light oscillator 102, and the laser light LB emitted from the laser light oscillator 102 causes the acoustooptic device 103 to The timing of passing and the control of the drive driver 131 are performed.
The scanner control unit 172 controls driving of the actuator 153 of the first irradiation position adjustment device 151 and the actuator 156 of the second irradiation position adjustment device 154.
The slider control unit 173 controls the operation of the linear motor built in each of the

slider mechanisms

161 and 162.

FIG. 17 is a diagram illustrating a configuration of a control system of the laser light irradiation apparatus 100.
As shown in FIG. 17, an input device 109 capable of inputting an input signal is connected to the control device 107. The input device 109 includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. The control device 107 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the laser light irradiation device 100, or may be connected to the display device.

When the user inputs the processing data to the input device 109 and the initial setting is completed, the laser light is emitted from the laser light oscillator 102 based on the control of the laser control unit 171 of the control device 107. At this time, based on the control of the scanner control unit 172 of the control device 107, rotation driving of the mirrors constituting the scanner 105 is started. At the same time, based on the control of the slider control unit 173 of the control device 107, the rotational speed of a drive shaft such as a motor provided in the

slider mechanisms

161 and 162 is detected by a sensor such as a rotary encoder.

The control device 107 corrects each coordinate value in real time so that the laser beam is emitted to the coordinate that matches the machining data, that is, the laser beam draws a desired locus on the object 110 (see FIG. 8). Thus, the moving device 106 and the scanner 105 are controlled. For example, the scanning of the laser light is mainly performed by the moving device 106, and an area where the irradiation position of the laser light cannot be accurately controlled by the moving device 106 is adjusted by the scanner 105.

FIG. 18 is a diagram for explaining the operation of the table 101 by the moving device 106.
As shown in FIG. 18, the table 101 is moved in the second direction (Y by the second slider mechanism 162 between the standby position WP1 and the cutting position WP2 where the laser beam is cut by the control of the scanner 105. Direction). Here, the standby position WP1 refers to a loading standby position when the object 110 to be cut from the outside is carried onto the holding surface 101s of the table 101, or a holding surface for the object 110 that has been subjected to the cutting process. Also serves as an unloading standby position for unloading from the top of 101s.

Note that the cutting position WP2 refers to at least a part of the object 110 held on the holding surface 101s and at least a part of the scan region 105s (see FIG. 8) by the scanner 105 when viewed in plan from the Z direction. A position in the second direction (Y direction) of the table 101 that is in an overlapping state.

Based on such a configuration, after the two objects 110 are carried into the holding surface 101s (the first holding surface 101s1 and the second holding surface 101s2) at the standby position WP1, as shown in FIG. The two objects 110 held on the holding surface 101s are moved to the cutting position WP2. The table 101 moves the object 110 that has been subjected to the predetermined cutting process at the cutting position WP2 to the standby position WP1, and then carries the object 110 to the outside at the standby position WP1.

The cutting process using the table 101 includes a carry-in step for carrying the object 110 at the standby position WP1, a forward movement step for moving the object 110 carried at the standby position WP1 to the cutting position WP2, and a cutting position WP2. A cutting step for performing a predetermined cutting process, a return path moving step for moving the object 110 from the cutting position WP2 to the standby position WP1 after the cutting step, and an unloading for discharging the object 110 from the standby position WP1 after the return path moving step Steps.

FIG. 19 is a diagram showing an operation flow of a cutting process using the table 101 as a cutting process by the laser beam irradiation apparatus 100. FIG. 20 is a diagram conceptually showing the operation of the cutting process using the table 101.

First, the table 101 carries the object 110 from the carry-in device 115 (see FIGS. 18 and 20) at the standby position WP1 (carry-in step S1 shown in FIG. 19). Note that the carry-in device 115 may be a part of the constituent elements of the laser light irradiation apparatus 100 or may be a part of the constituent elements of the apparatus other than the laser light irradiation apparatus 100.

In the present embodiment, before the table 101 moves from the standby position WP1 to the cutting position WP2, an alignment process is performed in which the relative position of the object 110 with respect to the cutting position WP2 is detected and the relative position is corrected based on the detection result. (Alignment step S2 shown in FIG. 19).

After the alignment, the table 101 moves the object 110 carried in at the standby position WP1 to the cutting position WP2 (cutting position movement step (outward movement step) S3 shown in FIG. 19).
After the movement to the cutting position WP2, a predetermined cutting process as described later is performed on the object 110 on the holding surface 101s (cutting step S4 shown in FIG. 19). After the cutting process, the table 101 moves to the standby position WP1 where the object 110 that has been subjected to the cutting process is carried out by the carrying-out device 116 (see FIGS. 18 and 20) (the carrying-out position moving step (return path moving step shown in FIG. 19)). ) S5). The carry-out device 116 may be a part of the constituent elements of the laser light irradiation apparatus 100 or may be a part of the constituent elements of the apparatus other than the laser light irradiation apparatus 100.

After moving to the standby position WP1, the object 110 is unloaded from the holding surface 101s of the table 101 by the unloading device 116 (unloading step S6 shown in FIG. 19).

In the carry-in step S1, as shown in FIG. 20 (a), the carry-in device 115 carries the object 110 onto the holding surface 101s of the table 101 at the standby position WP1. The carry-in device 115 includes a carry-in conveyor unit 115b and a holding unit 115a that sucks and holds the object 110 on the carry-in conveyor unit 115b. The holding part 115a can be transferred to the holding surface 101s (the first holding surface 101s1 and the second holding surface 101s2) while holding the two objects 110 at the same time. The carry-in conveyor unit 115b is configured by, for example, a belt conveyor.

After the carry-in step S1, in the alignment step S2, as shown in FIG. 20B, the object detection device 117 detects the object 110 before the table 101 moves from the standby position WP1 to the cutting position WP2. To do. The object detection device 117 includes a detection camera 117a that images the object 110, and detects the relative position of the object 110 with respect to the cutting position WP2 by using the detection camera 117a. The alignment step S2 is not always necessary and may be omitted, for example, when the carry-in device 115 has a very high carry-in accuracy to the holding surface 101s. In this case, since the object detection device 117 is not required, the device configuration can be simplified and the cost can be reduced.

The detection camera 117a detects the object 110 held on the first holding surface 101s1 on the cutting position WP2 side of the holding surface 101s. The object detection device 117 transmits the detection result of the detection camera 117a to the control device 107 (see FIG. 17). Based on the detection result from the detection camera 117a, the control device 107 performs alignment processing for correcting the position of the target object 110 when the target object 110 is displaced from the cutting position WP2 (scanner 105). The control device 107 drives the position correction unit to correct the position of the object 110 held on the holding surface 101s. The position correction unit corrects the position of the object 110 held on the holding surface 101s by bringing a plurality of pins into contact with at least three side surfaces of the object 110, for example. Note that when the position of the object 110 is corrected, the table 101 stops moving.

After the alignment of the object 110 held on the first holding surface 101s1 on the cutting position WP2 side is completed, the table 101 moves to the cutting position WP2 side. The detection camera 117a detects the object 110 held on the second holding surface 101s2 opposite to the cutting position WP2, and transmits the detection result to the control device 107. Based on the detection result from the detection camera 117a, the control device 107 performs an alignment process for correcting the position of the object 110 when the object 110 is displaced from the cutting position WP2 (scanner 105). Similarly, the control device 107 drives a position correction unit (not shown) to correct the position of the object 110 held on the holding surface 101s.

In the present embodiment, the case where the alignment step S2 is performed when the table 101 is positioned at the standby position WP1 has been described as an example. However, the present invention is not limited to this, and the alignment step S2 is performed when the table 101 is disconnected from the standby position WP1. You may make it perform in the middle before moving to position WP2.

After the alignment step S2, in the cutting position moving step S3, the table 101 moves to the cutting position WP2 as shown in FIG. 20 (c). Thereafter, in a cutting step S4, a predetermined cutting process as described later is performed on the object 110 on the holding surface 101s by irradiating the laser beam through the scanner 105. In the cutting step S4, the table 101 moves so that the cutting process is performed in the order of the object 110 held on the first holding surface 101s1 and the object 110 held on the second holding surface 101s2.

After the cutting step S4, in the unloading position moving step S5, the table 101 moves to the standby position WP1 as shown in FIG. 20 (d). Thereafter, in the unloading step S6, as shown in FIG. 20 (e), the unloading device 116 unloads the object 110 from the holding surface 101s of the table 101 at the standby position WP1. The carry-out device 116 includes a holding unit 116a that sucks, holds, and conveys the object 110, and a receiving unit 116b that receives the object 110 carried out from the holding surface 101s by the holding unit 116a. The holding unit 116a can carry out the two objects 110 from the holding surface 101s (the first holding surface 101s1 and the second holding surface 101s2) while holding the two objects 110 at the same time. The receiving unit 116b is configured by a belt conveyor or the like, for example, and can transport the object 110 received from the holding unit 116a in a predetermined direction.

FIG. 21 is a schematic diagram of the first detection device 41.
As illustrated in FIG. 21, the first detection device 41 includes an imaging device 43 that captures an image of the object 110 and an illumination device 44 that illuminates the object 110 from the opposite side of the imaging device 43 with the object 110 interposed therebetween. And.

FIGS. 22A and 22B are schematic diagrams illustrating a state in which the object 110 is imaged using the imaging device 43. FIG. First, as shown in FIG. 22A, the periphery of the liquid crystal panel P in the object 110 is imaged using the imaging device 43.

The scanner 105 (cutting device) separates the sheet piece FXm included in the object 110 into an optical member F1X that is a portion facing the display area included in the liquid crystal panel P and an extra portion outside the optical member F1X. The control device 107 (see FIG. 17) controls the scanner 105 based on the image captured by the imaging device 43.

The object 110 has a liquid crystal panel P and a sheet piece FXm bonded to the liquid crystal panel P. The liquid crystal panel P has a liquid crystal layer P3 (see FIG. 2) sandwiched and supported by the second substrate P2 and the first substrate P1. Further, in the liquid crystal panel P, the second substrate P2 has a smaller area in plan view than the first substrate P1, and one end side of the first substrate P1 is exposed in plan view when the two are overlapped.
A terminal portion P6 is provided in the exposed region P5 of the first substrate P1.

FIG. 22B is a partial plan view of the liquid crystal panel P. In FIG. 22B, for convenience, the side EA is shown among the four sides EA, EB, EC, ED of the second substrate P2. The liquid crystal panel P of this embodiment is manufactured by multi-chamfering. Therefore, as shown in FIG. 22B, burrs and chips are generated in the vicinity of the corners (for example, corners C1 and C2 at both ends of the side EA) EA1 and EA2 of the second substrate P2 as compared to the center EA3 of the side EA. It is not straight. The lengths of the neighborhoods EA1 and EA2 are empirically about 5 mm in a liquid crystal panel for a 4-inch display, for example. Note that the lengths of the neighborhoods EA1 and EA2 are not limited to this.

The sheet piece FXm is bonded to the surface of the second substrate P2. In the object 110 shown in the drawing, the sheet piece FXm has a rectangular shape in plan view, and has a larger area than the second substrate P2 in plan view.

For such an object 110, the imaging device 43 is used to image the imaging area AR including the second substrate P2. The imaging device 43 has a plurality of arrays arranged in a direction (first direction) parallel to the side EC (or side EA) along the terminal portion P6 among the four sides EA, EB, EC, ED of the second substrate P2. A line camera including an image sensor. For example, the image sensor is a CCD (Charge Coupled Device). The imaging device 43 moves in a direction (second direction) parallel to the side EB (or side ED) adjacent to the side EC and includes an image including the second substrate P2 in plan view (hereinafter referred to as a counter substrate image). ).

In addition, the moving direction of the imaging device 43 is not limited to this. For example, the imaging device 43 includes a plurality of imaging elements arranged in a direction parallel to the side EB (or side ED), and moves and faces in a direction parallel to the side EC (or side EA) adjacent to the side EB. A substrate image may be taken. That is, the imaging device 43 includes a plurality of imaging elements arranged in the second direction when viewed from the normal direction of the surface of the second substrate P2, and moves in the first direction orthogonal to the second direction. It is sufficient that the counter substrate image is captured.

At that time, the illumination device 44 shown in FIG. 21 is used to illuminate the object 110 by irradiating light L from the opposite side of the imaging device 43 with the object 110 interposed therebetween. Thereby, compared with the case where the target object 110 is illuminated from the same side as the imaging device 43, the halation caused by the reflected light generated in the sheet piece FXm can be suppressed, and an image suitable for analysis described later can be captured.

The image data of the image captured by the imaging device 43 is input to the control device 40, and the next processing (image processing, calculation) is performed.

(First process)
First, as a first process, an outline of the second substrate P2 is applied to image data obtained by observing the liquid crystal panel P of the object 110 in a plan view from the second substrate P2 side shown in FIG. 22A. Perform emphasis processing.

For example, when the object 110 is observed in plan view, the region where the second substrate P2 and the sheet piece FXm overlap (first region) and the region of only the sheet piece FXm protruding from the second substrate P2 (second region) In the captured image, the second region is brighter than the first region. Therefore, when the captured image is binarized, the first area becomes a bright area (white), the second area becomes a dark area (black), and the outline of the second substrate P2 becomes clear as a light / dark boundary.

Note that the threshold value of the gradation value for binarization varies depending on the type of sheet piece FXm to be bonded, the structure of the liquid crystal panel P at the position to be imaged, etc. To set.

(Second process)
FIG. 23 is a schematic diagram illustrating the vicinity of a corner portion of the image captured by the imaging device 43 in FIG. 22A. In FIG. 23, for the sake of convenience, the vicinity of the corner including the side EA and the side EB is shown. In FIG. 23, the first area is indicated by a symbol AR1, and the second area is indicated by a symbol AR2. As the second processing, as shown in FIG. 23, based on the image data binarized in the first image processing (hereinafter referred to as binarized data), the outline (side) of the second substrate P2 and The coordinates of a plurality of overlapping points D are detected.

First, a first portion that does not satisfy a predetermined criterion is excluded (determined) from the outline of the second substrate P2 obtained from the counter substrate image captured by the imaging device 43. Specifically, near the corners EA1 and EB1 (first portion) shown in FIG. 23, the second substrate P2 is burred or chipped, and each side (sides EA and EB in FIG. 23) is linear. is not. Therefore, when the point D is detected, the vicinity EA1, EB1 (a range predetermined as the vicinity of the corner) is set not to be included in the detection range. The ranges of the neighborhoods EA1 and EB1 to be excluded from the detection range can be appropriately set according to values obtained empirically or experimentally.

Next, in each of the sides (sides EA and EB in FIG. 23), the second substrate is used for the central portions EA3 and EB3 (second portion) excluding the vicinity EA1 and EB1 in the outline of the second substrate P2. The coordinates of a plurality of points D overlapping the contour line of P2 are detected.

As the coordinate axes of the coordinates to be detected, for example, the X axis is set with the upper left corner of the binarized data as the origin, the right direction of the image as the + direction, and the Y direction with the down direction of the image as the + direction. In the image captured by the imaging device 43, when two sides (contour lines) sandwiching the corner of the second substrate P2 are not substantially parallel to the outer peripheral side of the image to be captured, A process (trimming process) that appropriately cuts out an arbitrary area suitable for analysis from image data (or binarized data) may be performed, and the second process may be performed on the processed image.

When detecting the coordinates of the point D, for example, when the gradation is detected in the + Y direction from the upper end at an arbitrary position (x1) in the X-axis direction of the image based on the binarized data, the white (first The coordinates (x1, y1) of the point D can be obtained from the position (y1) in the Y direction of the position changing from black (second area) to black (second area). Such processing is performed on each of the four sides EA, EB, EC, and ED of the second substrate P2, and the coordinates of a plurality of points D that overlap the sides are detected on each side.

It is desirable that the number of points D to be detected be large, but it is preferable to set the number so that the processing load of the arithmetic processing described later is not excessive. For example, 100 points D may be detected in each of four sides EA, EB, EC, and ED. Note that the number of points D to be detected is not limited to this.

(Third process)
As a third process, a straight line corresponding to the side overlapping the point D is approximated from the coordinates of the plurality of points D detected in the second process. As the approximation, a generally known statistical method can be used. For example, an approximation method for obtaining a regression line (approximate line) using the least square method can be given.

FIG. 24 is a graph showing the approximate straight line L1 obtained in the third process, and shows the approximate straight line L1 as Y = 0. In FIG. 24, for convenience, an approximate straight line L1 obtained at the side EA is shown.

In FIG. 24, the point D1 plotted on the + y side and the point D2 plotted on the −y side have a larger separation distance from the approximate line L1 than the other points D, and are large in the calculation result of the approximate line L1. It is thought to have influenced. In such a case, the approximate straight line may be obtained again using the remaining points excluding the points D1 and D2.

Further, the number of points D to be excluded is not limited to two as shown in FIG. A threshold is determined for the distance between the approximate line L1 and the point D (the absolute value of the Y coordinate of the point D in FIG. 24), and the approximate line is obtained again by excluding the point D whose absolute value of the Y coordinate is greater than the threshold. It does not matter.
About a threshold value, it can set suitably according to the value calculated | required empirically or experimentally.

The approximate straight line thus obtained is performed for each of the four sides EA, EB, EC, and ED included in the captured image. In the following description, the approximate straight line obtained at the side EA may be referred to as L1, the approximate straight line obtained at the side EB as L2, the approximate straight line obtained at the side EC as L3, and the approximate straight line obtained at the side ED as L4.

(Fourth process)
As a fourth process, the approximate straight lines L1, L2, L3, and L4 are obtained by connecting the approximate straight lines L1, L2, L3, and L4 obtained for the four sides included in the counter substrate image captured by the imaging device 43, respectively. The figure to be obtained is obtained as an outline (approximate outline) of the second substrate P2.

FIG. 25 is a schematic diagram showing the approximate contour OL.
As shown in FIG. 25, the approximate contour OL can be obtained by connecting the approximate straight lines L1, L2, L3, and L4 obtained in the third process.

FIG. 26 is a schematic diagram showing a state in which the sheet piece FXm of the object 110 is cut using the scanner 105. The control device 40 controls the scanner 105, emits the laser beam LB based on the approximate contour OL obtained as described above, cuts the sheet piece FXm, and separates the optical member F1X and the surplus portion FY.

The size of the surplus portion FY of the sheet piece FXm (the size of the portion protruding outside the liquid crystal panel P) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece FXm is applied to a medium-sized liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece FXm and one side of the liquid crystal panel P is 2 mm on each side of the sheet piece FXm. Set to a length in the range of ~ 5 mm. The interval between one side of the sheet piece FXm and one side of the liquid crystal panel P is not limited to this.

FIG. 27 is a diagram showing an operation flow of a cutting process using the scanner 105 and the table 101 as a cutting process. The operation flow shown in FIG. 27 is a specific operation flow of the cutting step S4 in the operation flow shown in FIG.

First, the object 110 is fixed to the holding surface 101s (step S41 shown in FIG. 27). Next, a counter substrate image is taken for the object 110 on the holding surface 101s (step S42 shown in FIG. 27). Next, an approximate contour OL is created based on the captured counter substrate image (step S43 shown in FIG. 27). Next, cutting processing is performed based on the approximate contour OL (step S44 shown in FIG. 27). The cutting process is performed in conjunction with the scanner 105 and the table 101. That is, while controlling the scanner 105 (step S441 shown in FIG. 27) and controlling the table 101 (step S442 shown in FIG. 27), the cutting process of the sheet piece FXm in the object 110 is performed.

FIG. 28 is a diagram illustrating a control method for scanning a laser beam in a rectangular shape on the sheet piece FXm when the sheet piece FXm is cut into an optical member F1X having a predetermined size using the laser beam irradiation apparatus 100 as a cutting device. It is.

In FIG. 28, symbol Tr is a target laser beam movement locus (desired locus; hereinafter referred to as laser beam movement locus), and symbol Tr1 is a movement locus caused by relative movement between the table 101 and the scanner 105. A trajectory projected on the sheet piece FXm (hereinafter, also referred to as a light source movement trajectory). The light source movement trajectory Tr1 has a shape in which four corners of the laser light movement trajectory Tr having a rectangular shape are curved, the symbol K1 is a straight section other than the corner, and the symbol K2 is a bent section of the corner. Reference numeral Tr2 indicates that the irradiation position of the laser beam is perpendicular to the light source movement locus Tr1 by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 when the scanner 105 is relatively moving on the light source movement locus Tr1. It is a curve (hereinafter also referred to as an adjustment curve) indicating how much is shifted (adjusted).
The deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.

As shown in FIG. 28, the light source movement locus Tr1 is a substantially rectangular movement locus with curved corners. The light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area. If the light source movement locus Tr1 has a rectangular shape, the moving speed of the scanner 105 is slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser light. Therefore, in FIG. 28, the corners of the light source movement locus Tr1 are curved so that the moving speed of the scanner 105 is substantially constant over the entire light source movement locus Tr1.

Since the light source movement locus Tr1 and the laser beam movement locus Tr coincide with each other when the scanner 105 moves in the straight section K1, the control device 107 sets the irradiation position of the laser beam to the first irradiation position adjusting device 151. And without adjusting by the 2nd irradiation position adjustment apparatus 154, a laser beam is irradiated to the sheet piece FXm from the scanner 105 as it is. On the other hand, when the scanner 105 is moving in the bending section K2, the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so that the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 perform laser light. The irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr. For example, when the scanner 105 is moving at the position indicated by the symbol M1, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 move the laser beam irradiation position in the direction N1 perpendicular to the light source movement locus Tr1. Shifted by W1. The distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1. The light source movement trajectory Tr1 is displaced inward from the laser light movement trajectory Tr, and the irradiation position of the laser light is set to the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 so as to cancel out the deviation. Therefore, the irradiation position of the laser beam is arranged on the laser beam movement track Tr.

Hereinafter, the effect of the cutting process according to the present embodiment will be described with reference to FIGS. 29 (a) and 29 (b) and FIGS. 30 (a) and 30 (b).
FIGS. 29A and 29B are explanatory diagrams of the cutting process according to the comparative example. FIGS. 30A and 30B are explanatory diagrams of the cutting process according to the present embodiment.
29 (a), (b) and FIGS. 30 (a), (b), for convenience, the illustration of the sheet piece FXm constituting the object 110 is omitted, and only the liquid crystal panel P is illustrated. .

As shown in FIG. 29 (a), in the comparative example, first, as a method for detecting the outer peripheral shape, each of the areas CA1, CA2, CA3, CA4 including the four corners (corner portions) of the liquid crystal panel P in plan view is used. Take an image. Next, as shown in FIG. 29B, the four corners of the liquid crystal panel P are obtained based on the imaging result, and the rectangle OLx connecting the obtained four corners is set as the outer peripheral shape of the liquid crystal panel P.
Therefore, if burrs or chips are generated at the corners of the liquid crystal panel P, the liquid crystal panel P is easily affected by burrs or chips when detecting the outer peripheral shape of the liquid crystal panel P. As a result, as shown in FIG. 29B, the cut line (rectangular OLx) is greatly deviated from the actual outline of the substrate P. For example, if burrs are remarkably generated in the areas CA1 and CA3, the burrs may be recognized as corners of the liquid crystal panel P in the areas CA1 and CA3. In this case, the trapezoid (rectangular OLx) connecting the obtained four corners becomes the outer peripheral shape of the liquid crystal panel P.

On the other hand, in this embodiment, as shown in FIG. 30A, a line camera is used as the imaging device 43, and the imaging device 43 is moved in the direction V to capture the counter substrate image. Next, a first portion (corner where burrs or chips are generated) that do not satisfy a preset criterion is excluded from the outline of the second substrate P2 obtained from the counter substrate image imaged by the imaging device 43 ( decide). Next, in each of the sides, the coordinates of a plurality of points overlapping the outline of the second substrate P2 are detected for the second portion (the central portion where no burr or chipping occurs). Next, approximate straight lines L1, L2, L3, and L4 are obtained from the detected coordinates of the plurality of points. Then, as shown in FIG. 30B, the approximate contour OL is obtained by connecting the approximate straight lines L1, L2, L3, and L4.
Therefore, even if burrs or chips are generated at the corners of the liquid crystal panel P, the liquid crystal panel P is not easily affected by the burrs or chips when detecting the outer peripheral shape of the liquid crystal panel P. As a result, as shown in FIG. 30B, the cut line (approximate contour line OL) can be prevented from greatly deviating from the actual contour line.

As described above, according to the film bonding system 1 of the present embodiment of the present embodiment, the cut line (approximate contour) is based on the portion of the contour line of the second substrate P2 excluding the portion that does not satisfy the standard in advance. Since the line OL) is created, it is possible to suppress the shift of the cut line from the actual contour line. As a result, it is possible to detect the outer peripheral shape of the liquid crystal panel P excluding the influence of burrs and chips on the peripheral edge, and to process the optical member F1X in accordance with the outer peripheral shape.
Further, it is possible to easily produce a narrow frame optical display device.

Moreover, since the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus mentioned above, the sheet piece FXm (1st sheet piece F1m, 2nd sheet piece F2m) can be cut | disconnected sharply, and cut A reduction in quality can be suppressed.

Further, under the control of the control device 107, the moving device 106 and the scanner 105 are controlled so as to draw a desired laser beam movement trajectory Tr in the sheet piece FXm. In this configuration, the laser beam irradiation section to be adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only a narrow bending section K2. In the other wide straight section K1, the laser beam is scanned on the sheet piece FXm by the movement of the table 101 by the moving device 106. In the present embodiment, the scanning of the laser beam is mainly performed by the moving device 106, and only the region where the moving position of the laser beam irradiation position cannot be accurately controlled by the moving device 106 is adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. is doing. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.

Moreover, after bonding the sheet piece FXm (F1m, F2m) of the size which protrudes on the outer side of liquid crystal panel P to liquid crystal panel P, the optical member of the size corresponding to the bonding surface is cut off by separating the excess part of sheet piece FXm. F1X (F11, F12) can be formed on the surface of the liquid crystal panel P. Thereby, the optical member F1X can be provided with high accuracy up to the bonding surface, and the frame area outside the display region P4 can be narrowed to enlarge the display area and downsize the device.

Moreover, even when the optical axis direction of the sheet piece FXm changes according to the position of the sheet piece FXm by bonding the sheet piece FXm (F1m, F2m) of a size that protrudes outside the liquid crystal panel P to the liquid crystal panel P. The liquid crystal panel P can be aligned and bonded in accordance with the optical axis direction of the sheet piece FXm. Thereby, the precision of the optical axis direction of the optical member F1X (F11, F12) with respect to the liquid crystal panel P can be improved, and the fineness and contrast of an optical display device can be improved.

Further, the cutting devices 31 and 32 laser cut the sheet pieces FXm (F1m, F2m), so that the force is not exerted on the liquid crystal panel P as compared with the case where the sheet pieces FXm are cut with a blade, and there is no crack or chipping. It becomes difficult to occur, and the stable durability of the liquid crystal panel P can be obtained.

Further, the sheet piece FXm can be cut substantially along the edge of the second substrate P2, and the optical member F1X can be suitably bonded to the liquid crystal panel P having a narrow frame. Furthermore, if necessary, a plurality of types of optical members can be bonded to the liquid crystal panel P using the apparatus described above, and an optical display device formed by bonding the optical members to the liquid crystal panel P can be obtained.

In addition, since a configuration in which a plurality of (two in this embodiment) objects 110 are held on the holding surface 101s of the table 101 is adopted, the plurality of objects 110 can be sequentially supplied to the cutting position WP2. Thereby, the cutting process with respect to the target object 110 can be performed efficiently, and a processing amount can be increased.

In the present embodiment, the sheet piece FXm is cut along the approximate contour line OL. However, the present invention is not limited to this, and is, for example, a region inside the approximate contour OL and the frame of the liquid crystal panel P. The sheet piece FXm may be cut at a position overlapping the portion. In that case, the control device 40 calculates, based on the calculated approximate contour, a shape that is smaller than the shape drawn by the approximate contour as a true cut portion, The scanner 105 may be controlled so as to cut the sheet piece FXm along.

The shape showing the true cut portion may be a similar shape obtained by reducing the shape drawn by the approximate contour OL at a predetermined scale, and only a predetermined width from the shape drawn by the approximate contour OL. The shape shrunk inward may be sufficient.

In the present embodiment, the imaging device 43 is used to illustrate and explain that the liquid crystal panel P included in the object 110 is taken as a plan view from the second substrate P2 side. However, the present invention is not limited thereto. Absent.

When the liquid crystal panel P is formed by multi-chamfering, the position of the end portion may be shifted between the upper and lower substrates constituting the liquid crystal panel P. When the liquid crystal panel P shown in FIG. 3 has such a shift and the edge of the first substrate P1 farther from the image pickup device 43 than the edge of the second substrate P2 close to the image pickup device 43 is arranged outside. When a plane view image is captured using the imaging device 43, the edge of the first substrate P1 is mistaken as the edge of the second substrate P2, and it is difficult to obtain an approximate contour line along the contour line of the second substrate P2. It becomes.

In such a case, the imaging device 43 may be inclined to the inside of the second substrate P2 with respect to the normal line of the second substrate P2, and an image of the second substrate P2 may be taken from the inside of the second substrate P2. . When imaging is performed in this way, the first substrate P1 is imaged in a state of being hidden by the second substrate P2, so that the edge of the first substrate P1 is not mistaken as the edge of the second substrate P2, and the second substrate P2 An image can be reliably captured.

The inclination angle of the imaging device 43 may be changed each time according to the amount of deviation between the second substrate P2 and the first substrate P1 in each liquid crystal panel P. In addition, when the maximum value of the deviation amount is empirically known, an inclination angle that can hide the first substrate P1 by the second substrate P2 is obtained even if the maximum deviation occurs, and the obtained inclination angle is obtained. It is preferable that the image pickup device 43 be tilted to take an image.

Moreover, in this embodiment, although demonstrated as an example the structure which cut | disconnects a sheet piece as a structure which irradiates a target object with a laser beam and performs a predetermined process, it is not restricted to this. For example, in addition to dividing the sheet piece into at least two parts, it also includes making a cut through the sheet piece and forming a groove (cut) of a predetermined depth in the sheet piece. To do.
More specifically, for example, cutting (cutting off) an end portion of a sheet piece, half cutting, marking processing, and the like are included.

In the present embodiment, the optical member sheet FX is pulled out from the roll, and a sheet piece FXm of a size that protrudes outside the liquid crystal panel P is bonded to the liquid crystal panel P, and then the liquid crystal panel P is pasted from the sheet piece FXm. Although the case where it cut out to the optical member F1X of the magnitude | size corresponding to a mating surface was mentioned and demonstrated was demonstrated, it is not restricted to this. For example, the embodiment of the present invention can be applied to the case where a single-wafer optical film chip cut out to the outside of the liquid crystal panel P is bonded to the liquid crystal panel without using the roll.

Further, in the present embodiment, the case where the drawing locus of the laser light emitted from the laser light irradiation device is a rectangular shape (square shape) in plan view has been described as an example, but the present invention is not limited thereto. For example, the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape of pentagon or more in plan view. The shape is not limited to this, and may be a star shape in a plan view and a geometric shape in a plan view. Moreover, the shape containing curves, such as circular and an ellipse, may be sufficient by planar view. The embodiment of the present invention can also be applied to such a drawing trajectory.

In the present embodiment, the example in which the table 101 holds the two objects 110 has been described. However, the present invention is not limited to this. For example, the structure which can hold | maintain the one target object 110 may be sufficient as a table, and the structure which can hold | maintain the three or more target objects 110 may be sufficient.

The preferred embodiments according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to these examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (production system of an optical display device), 23 ... Cinch roll (bonding device), 31 ... 1st cutting device (cutting device), 32 ... 2nd cutting device (cutting device), 43 ... Imaging device 44 ... illumination device 100 ... laser light irradiation device (cutting device) 107 ... control device 110 ... object (laminated body) D ... point overlapping outline, EA1, EB1 ... near (first) Part), EA3, EB3 ... center part (second part), P ... liquid crystal panel (optical display component), P1 ... first substrate (substrate), P2 ... second substrate (substrate), P4 ... display region, FX ... Optical member sheet, FXm ... Sheet piece, F1X ... Optical member, FY ... Surplus part, OL ... Approximate contour line, PA1 ... First optical member bonding body (laminate), PA3 ... Third optical member bonding body (laminate) ), PA4 ... fourth optical member bonded body (optical table) Device).

Claims

An optical display device production system formed by bonding an optical member to an optical display component,
An imaging device that captures an image including the substrate in a plan view of a laminate formed by laminating an optical member sheet wider than the surface on the surface of the substrate included in the optical display component;
A cutting device for separating the optical member sheet into the optical member that is a portion facing the display area of the optical display component, and an excess portion outside the optical member;
A control device that obtains an approximate contour line that approximates a contour line in plan view of the substrate based on the image and controls the cutting device to cut the optical member sheet based on the approximate contour line; Including
The control device determines a first portion that does not satisfy a preset criterion from among the contour lines obtained based on the image captured by the imaging device, and determines the first portion of the contour lines. The coordinates of a plurality of points overlapping the contour line are detected for the removed second portion, the line corresponding to the contour line is approximated from the coordinates of the plurality of points, and the figure obtained by the approximated line is represented by the approximate contour line And a production system for an optical display device that controls the cutting device to cut the optical member sheet based on the approximate contour line.
2. The line imaging apparatus according to claim 1, wherein the imaging device is a line camera that includes a plurality of imaging elements arranged in a first direction and moves in a second direction orthogonal to the first direction to capture the image. Optical display device production system.
3. The optical display device production system according to claim 1, further comprising an illuminating device that illuminates the multilayer body from a side opposite to the imaging device across the multilayer body.
The first portion is a predetermined portion as a vicinity of a corner portion of the substrate in a plan view, and the control device excludes the first portion in each of two sides sandwiching the corner portion. The optical display device production system according to claim 1, wherein coordinates of the plurality of points are detected.
The optical display device as described in any one of Claim 1 to 4 including the bonding apparatus which bonds the said optical member sheet | seat on the surface of the said optical display component conveyed on a line, and forms the said laminated body. Production system.