JPWO2014024803A1 - Optical display device production system and optical display device production method - Google Patents

Abstract

The production system for an optical display device includes a bonding apparatus that bonds an optical member sheet (F1) larger than the display area of the optical display component (P) to the optical display component (P), and an optical in the bonded body. A cutting device (16) that separates the facing portion of the member sheet (F1) from the display region and the excess portion outside the facing portion and forms an optical member having a size corresponding to the display region from the optical member sheet (F1); , And the cutting device (16) emits laser light for cutting toward the cutting portion (S) between the facing portion and the surplus portion of the optical member sheet (F1) in the bonded body. The irradiation device (30) and the laser beam irradiation axis (C1) in the laser beam irradiation device (30) are orthogonal to the bonding surface for bonding the optical member sheet (F1) in the optical display component (P). To C0) comprises tilting device tilting so as to be directed from the outer portion facing inward and (34), the.

Description

The present invention relates to an optical display device production system and an optical display device production method.
This application claims priority based on Japanese Patent Application No. 2012-176000 filed in Japan on August 8, 2012 and Japanese Patent Application No. 2013-104401 filed in Japan on May 16, 2013. The contents are incorporated here.

  Conventionally, in a production system for an optical display device such as a liquid crystal display, an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is formed from a long film into a sheet piece having a size matching the display area of the liquid crystal panel. After being cut out, it is bonded to a liquid crystal panel (for example, see Patent Document 1).

Japanese Unexamined Patent Publication No. 2003-255132

  However, in the conventional configuration described above, a sheet piece slightly larger than the display area is cut out in consideration of variation in dimensions of the liquid crystal panel and the sheet piece, and bonding variation (positional deviation) of the sheet piece to the liquid crystal panel. . Therefore, there is a problem that an extra area (frame part) is formed around the display area, and downsizing of the device is hindered.

In patent document 1, the method of cutting out an optical member from an optical member sheet | seat is employ | adopted by the cutting process using a cutter. On the other hand, instead of cutting using a cutter, a method of cutting an optical member from an optical member sheet by cutting using laser light is also conceivable. The cutting process using laser light has a smaller runout width (tolerance) of the cutting line than the cutting process using a cutter such as a cutter, and can improve the cutting accuracy.
When laser cutting the optical member sheet, it is desirable to efficiently cut the optical member sheet by focusing the laser beam on the optical member sheet in order to suppress thermal deformation of the cut end of the optical member sheet. However, when the laser beam irradiation is narrowed down, a tapered cut surface extending toward the laser beam irradiation device side is formed at the cut portion of the optical member sheet. Therefore, there exists a problem of narrowing the effective area of an optical member.

  Aspects of the present invention reduce the frame portion around the display area to enlarge the display area and downsize the device, and also increase the effective area of the optical member by suppressing the inclination of the cut surface of the optical member due to laser cutting. An object of the present invention is to provide an optical display device production system and an optical display device production method.

  In order to achieve the above object, one embodiment of the present invention is an optical display device production system configured by bonding an optical member to an optical display component, the optical display component including the optical display component. A pasting device that pastes an optical member sheet larger than the display area to form a pasted body, and a facing portion of the optical member sheet in the pasting body and a surplus portion outside the facing portion are separated from the facing portion, A cutting device that forms the optical member having a size corresponding to the display area from the optical member sheet, and the cutting device includes the facing portion and the surplus portion of the optical member sheet in the bonded body. A laser beam irradiation device for irradiating a laser beam for cutting processing toward the cutting portion in between, and an irradiation axis line of the laser beam in the laser beam irradiation device on the optical display component To kick the direction orthogonal to the lamination surface for bonding the optical member sheet, having a tilting device for tilting so as to be directed from the outside to the inside of the facing portion.

According to the said structure, after bonding the optical member sheet | seat larger than the display area of an optical display component to an optical display component, the optical member of the magnitude | size corresponding to a display area is cut off by separating the excess part of this optical member sheet | seat. It can be accurately formed on the surface of the optical display component. Therefore, the frame portion outside the display area can be narrowed to enlarge the display area and downsize the device.
In addition, cutting using laser light is more accurate than cutting using a cutting blade, and the frame portion around the display area can be narrower than when using a cutting blade.
And the taper angle (angle with respect to the direction orthogonal to a bonding surface) which arises in the cut end of an optical member sheet | seat by laser cutting can be made small by the inclination of an irradiation axis line. Therefore, the effective area of the optical member sheet (optical member) to be left on the optical display component can be increased, which can contribute to further narrowing the frame of the device.
In addition, the “part facing the display area” in the above configuration is an area that is not less than the size of the display area and not more than the size of the outer shape (contour shape in plan view) of the optical display component, and the electrical component mounting portion. The area where functional parts such as are avoided is shown. That is, the said structure includes the case where the surplus part is laser-cut along the outer periphery of an optical display component.
In addition, the “size corresponding to the display area” in the above configuration is a size not less than the size of the display area and not more than the size of the outer shape (contour shape in plan view) of the optical display component, and It refers to a size that avoids a functional part such as an electric part mounting part in an optical display part.

  In said aspect, the said bonding body is further equipped with the detection means to detect the outer periphery of the said bonding surface of the said optical member sheet | seat and the said optical display component, The said cutting part is set along the said outer periphery. May be.

The “bonding surface between the optical member sheet and the optical display component” in the above configuration refers to a surface facing the optical member sheet of the optical display component.
In addition, the “outer peripheral edge of the bonding surface” in the above configuration specifically refers to the outer peripheral edge of the substrate on the side where the optical member sheet is bonded in the optical display component.

  Another aspect of the present invention is a method for producing an optical display device configured by bonding an optical member to an optical display component, the optical member sheet being larger than the display area of the optical display component on the optical display component And bonding the bonding step to form a bonded body, and separating the facing portion of the bonded member from the display region of the optical member sheet and the surplus portion outside the facing portion, from the optical member sheet to the display region A cutting step of forming the optical member having a size corresponding to the cutting direction, the cutting step toward the cut portion between the facing portion and the surplus portion of the optical member sheet in the bonded body, A laser beam irradiation process for irradiating a laser beam for cutting, and an irradiation axis of the laser beam in the laser beam irradiation process are pasted on the optical member sheet in the optical display component. With respect to the direction perpendicular to the Waseru lamination surface, including a tilting step of tilting so as to be directed from the outer side of the opposed portion to the inside.

  In the above aspect, prior to the cutting step, the bonding body further includes a detection step of detecting an outer peripheral edge of the bonding surface between the optical member sheet and the optical display component, and the cutting portion includes the outer portion. You may set along a periphery.

  According to the aspect of the present invention, the frame area around the display area is reduced to enlarge the display area and downsize the device, and the effective area of the optical member is reduced by suppressing the inclination of the cut surface of the optical member due to laser cutting. Can be spread.

It is a schematic block diagram of the film bonding system of the optical display device in embodiment of this invention. It is a perspective view of the 2nd cutting device periphery of the said film bonding system. It is a perspective view equivalent to FIG. 2 which shows the internal structure of the said 2nd cutting device. It is a perspective view of the 2nd bonding apparatus periphery of the said film bonding system. It is sectional drawing of the 1st bonding sheet | seat in the said film bonding system. It is sectional drawing of the 2nd bonding sheet | seat in the 2nd cutting device periphery in the said film bonding system. It is a top view of the 3rd bonding sheet | seat in the 3rd cutting device periphery in the said film bonding system. It is AA sectional drawing of FIG. It is sectional drawing of the double-sided bonding panel which passed through the said film bonding system. It is explanatory drawing which shows the 1st effect | action at the time of carrying out laser cutting of the bonding sheet bonded by the liquid crystal panel and the liquid crystal panel. It is explanatory drawing which shows the comparative example of FIG. It is explanatory drawing which shows the 2nd effect | action at the time of carrying out laser cutting of the bonding sheet bonded by the liquid crystal panel and the liquid crystal panel. It is a schematic diagram of the 1st detection means which detects the outer periphery of the bonding surface. It is a schematic diagram which shows the modification of the 1st detection means which detects the outer periphery of the bonding surface. It is a top view which shows the position which detects the outer periphery of the bonding surface. It is a schematic diagram of the 2nd detection means which detects the outer periphery of the bonding surface.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment demonstrates the film bonding system which comprises some optical display devices as a production system of an optical display device. In each figure, an XYZ orthogonal coordinate system is set. The X direction indicates the width direction of the optical display component (liquid crystal panel). The Y direction indicates the conveyance direction of the optical display component. The Z direction indicates a direction orthogonal to the X direction and the Y direction.

  FIG. 1 shows a schematic configuration of a film bonding system (production system for an optical display device) 1 of the present embodiment. The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel. The film bonding system 1 manufactures an optical member bonding body including an optical display component and an optical member. In the film bonding system 1, the liquid crystal panel P is used as an optical display component. Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.

The film bonding system 1 sequentially performs a predetermined process on the liquid crystal panel P while transporting the liquid crystal panel P from the start position to the end position of the bonding process using, for example, a driving roller conveyor 5. The liquid crystal panel P is conveyed on the roller conveyor 5 with the front and back surfaces of the liquid crystal panel P being horizontal.
In the drawing, the left side shows the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side). The right side in the figure shows the downstream side of the liquid crystal panel P in the transport direction (hereinafter referred to as the panel transport downstream side).

  As shown in FIGS. 7 to 9, the liquid crystal panel P has a rectangular shape in plan view. The liquid crystal panel P has a display region P4 having an outer shape along the outer peripheral edge of the liquid crystal panel P, inside a predetermined width from the outer peripheral edge of the liquid crystal panel P. The liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport with respect to the second alignment device 14 described later. The liquid crystal panel P is transported in a direction in which the long side of the display region P4 is substantially along the transport direction on the downstream side of the panel transport with respect to the second alignment device 14.

  With respect to the front and back surfaces of the liquid crystal panel P, the first optical member F11, the second optical member F12, and the first optical member sheet F1, the second optical member sheet F2, and the third optical member sheet F3, which are long strips. The third optical member F13 is appropriately bonded. In the present embodiment, a first optical member (optical member) F11 and a third optical member (optical member) F13 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively. . On the surface of the liquid crystal panel P on the backlight side, a second optical member (optical member) F12 as a brightness enhancement film is further bonded to the first optical member F11.

  As shown in FIG. 1, the film bonding system 1 includes a first alignment device 11 that transports the liquid crystal panel P from the upstream process to the panel transport upstream side of the roller conveyor 5 and aligns the liquid crystal panel P. The 1st bonding apparatus (bonding apparatus) 12 provided in the panel conveyance downstream rather than the alignment apparatus 11, the 1st cutting apparatus 13 provided in proximity to the 1st bonding apparatus 12, and the 1st bonding apparatus 12 And a second alignment device 14 provided on the downstream side of the panel conveyance with respect to the first cutting device 13.

  Moreover, the film bonding system 1 is the 2nd bonding apparatus (bonding apparatus) 15 provided in the panel conveyance downstream rather than the 2nd alignment apparatus 14, and the 2nd provided in proximity to the 2nd bonding apparatus 15. A cutting device (cutting device) 16, a third alignment device 17 provided on the downstream side of the panel transport relative to the second bonding device 15 and the second cutting device 16, and a downstream side of the panel transport relative to the third alignment device 17 The 3rd bonding apparatus (bonding apparatus) 18 and the 3rd cutting apparatus (cutting apparatus) 19 provided in proximity to the 3rd bonding apparatus 18 are provided.

  The first alignment device 11 holds the liquid crystal panel P and freely conveys it in the vertical direction and the horizontal direction. The first alignment device 11 has a camera (not shown) that images the upstream and downstream ends of the liquid crystal panel P, for example. The imaging data of this camera is sent to the control device 20. The control device 20 activates the first alignment device 11 based on the imaging data of the camera and the inspection data in the optical axis direction stored in advance. Note that a second alignment device 14 and a third alignment device 17 to be described later also have a camera, and use image data of this camera for alignment.

  The first alignment device 11 is controlled by the control device 20 and aligns the liquid crystal panel P with respect to the first bonding device 12. At this time, the liquid crystal panel P is positioned in a horizontal direction (hereinafter referred to as a component width direction) orthogonal to the transport direction and in a rotation direction around the vertical axis (hereinafter simply referred to as a rotation direction). In this state, the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.

  The 1st bonding apparatus 12 of liquid crystal panel P conveyed below the 1st optical member sheet | seat F1 with respect to the lower surface of the elongate 1st optical member sheet | seat (optical member sheet | seat) F1 introduced into the bonding position. The upper surface (backlight side) is bonded (see FIG. 5). The 1st bonding apparatus 12 is provided with the conveying apparatus 12a and the pinching roll 12b.

  The conveying device 12a unwinds the first optical member sheet F1 from the first raw roll R1 around which the first optical member sheet F1 is wound, and the first optical member sheet F1 in the longitudinal direction of the first optical member sheet F1. Convey along. The transport device 12a includes a roll holding unit 12c and a pf collection unit 12d. The roll holding unit 12c holds the first original roll R1 around which the first optical member sheet F1 is wound, and feeds the first optical member sheet F1 along the longitudinal direction of the first optical member sheet F1. The pf collection | recovery part 12d collects the protection film pf which overlap | superposed on the upper surface of the 1st optical member sheet | seat F1 and was drawn out with the 1st optical member sheet | seat F1 in the panel conveyance downstream of the 1st bonding apparatus 12. FIG.

  The pinching roll 12b bonds the upper surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the lower surface of the first optical member sheet F1 conveyed by the conveying device 12a. The pinching roll 12b has a pair of laminating rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap becomes the bonding position of the first bonding apparatus 12. In this gap, the liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced. The liquid crystal panel P and the first optical member sheet F1 are sent out to the downstream side of the panel conveyance while being pressed between the pair of bonding rollers. Thereby, the 1st bonding sheet | seat F21 by which the some liquid crystal panel P was continuously bonded on the lower surface of the elongate 1st optical member sheet | seat F1 at predetermined intervals is formed.

  The 1st cutting device 13 is located in the panel conveyance downstream rather than pf collection | recovery part 12d. The 1st cutting device 13 cut | disconnects the 1st optical member sheet | seat F1 of the 1st bonding sheet | seat F21, and is larger than the display area P4 (this embodiment is larger than liquid crystal panel P) sheet piece F1S (refer FIG. 6). Therefore, a predetermined portion (between the liquid crystal panels P arranged in the transport direction) of the first optical member sheet F1 is cut over the entire width of the liquid crystal panel P in the component width direction. It does not matter whether the first cutting device 13 uses a cutting blade or a laser cutter. By the cutting | disconnection of the 1st cutting device 13, the 1st single-sided bonding panel (optical display component) P11 by which the sheet piece F1S larger than the display area P4 was bonded on the upper surface of liquid crystal panel P is formed (refer FIG. 6). .

  In the sheet piece F1S, the size of the portion that protrudes outside the liquid crystal panel P (the size of the surplus portion of the sheet piece F1S) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece F1S is applied to a medium-sized liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece F1S and one side of the liquid crystal panel P is 2 mm on each side of the sheet piece F1S. Set to a length in the range of ~ 5 mm.

  The second alignment device 14 is arranged so that the first single-sided bonding panel P11 that has been transported substantially parallel to the short side of the display region P4 is transported substantially parallel to the long side of the display region P4. Convert. This direction change is made when the optical axis direction of another optical member sheet bonded to the liquid crystal panel P is arranged at a right angle with respect to the optical axis direction of the first optical member sheet F1.

  The second alignment device 14 performs the same alignment as the first alignment device 11. That is, the second alignment device 14 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera in the component width direction of the first single-sided bonding panel P11 with respect to the second bonding device 15. Positioning and positioning in the rotation direction are performed. In this state, the first single-sided bonding panel P <b> 11 is introduced into the bonding position of the second bonding device 15.

  The 2nd bonding apparatus 15 is the 1st single side | surface conveyed below the 2nd optical member sheet | seat F2 with respect to the lower surface of the elongate 2nd optical member sheet | seat (optical member sheet | seat) F2 introduced into the bonding position. The upper surface of the bonding panel P11 (the backlight side of the liquid crystal panel P) is bonded. The 2nd bonding apparatus 15 is provided with the conveying apparatus 15a and the pinching roll 15b.

  The conveying device 15a unwinds the second optical member sheet F2 from the second original fabric roll R2 around which the second optical member sheet F2 is wound, and the second optical member sheet F2 in the longitudinal direction of the second optical member sheet F2. Convey along. The transport device 15a includes a roll holding unit 15c and a second recovery unit 15d. The roll holding unit 15c holds the second original fabric roll R2 around which the second optical member sheet F2 is wound, and feeds the second optical member sheet F2 along the longitudinal direction of the second optical member sheet F2. The second collection unit 15d collects an excess portion of the second optical member sheet F2 that has passed through the second cutting device 16 that is located on the downstream side of the panel conveyance with respect to the pinching roll 15b.

  The pinching roll 15b bonds the upper surface of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the lower surface of the 2nd optical member sheet | seat F2 which the conveying apparatus 15a conveys. The pinching roll 15b has a pair of bonding rollers arranged with the axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap becomes the bonding position of the second bonding apparatus 15. In this gap, the first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced. These 1st single-sided bonding panels P11 and the 2nd optical member sheet | seat F2 are sent out to a panel conveyance downstream, being pinched between a pair of bonding rollers. Thereby, the 2nd bonding sheet | seat F22 by which the some 1st single-sided bonding panel P11 was continuously bonded on the lower surface of the elongate 2nd optical member sheet | seat F2 is formed at predetermined intervals.

  The 2nd cutting device 16 is located in a panel conveyance downstream rather than the pinching roll 15b. The 2nd cutting device 16 is the sheet piece F1S (refer FIG. 6) of the 1st optical member sheet | seat F1 of the 1st single-sided bonding panel P11 bonded to the lower surface of the 2nd optical member sheet | seat F2 and the 2nd optical member sheet | seat F2. Disconnect at the same time. The second cutting device 16 is, for example, a CO2 laser cutter. The second cutting device 16 cuts the second optical member sheet F2 and the sheet piece F1S endlessly along the outer peripheral edge of the display region P4 (in the present embodiment, along the outer peripheral edge of the liquid crystal panel P). By bonding the first optical member sheet F1 and the second optical member sheet F2 to the liquid crystal panel P and cutting them together, the accuracy in the optical axis direction of the first optical member sheet F1 and the second optical member sheet F2 is increased. . Further, there is no deviation in the optical axis direction between the first optical member sheet F1 and the second optical member sheet F2. Furthermore, the cutting by the first cutting device 13 is simplified. Details of the second cutting device 16 will be described later.

  By the cutting | disconnection of the 2nd cutting device 16, the 2nd single-sided bonding panel (optical display component) P12 by which the 1st optical member F11 and the 2nd optical member F12 overlapped and bonded on the upper surface of liquid crystal panel P is formed ( (See FIG. 8). At this time, as shown in FIG. 4, the first optical member that remains in the frame shape by cutting off the facing portion (the first optical member F11 and the second optical member F12) between the second single-sided bonding panel P12 and the display region P4. The surplus portion Y of the member sheet F1 and the surplus portion Y ′ of the second optical member sheet F2 are separated. A plurality of surplus portions Y ′ of the second optical member sheet F2 are connected in a ladder shape (see FIG. 4). This surplus portion Y ′ is wound around the second collection portion 15d together with the surplus portion Y of the first optical member sheet F1.

Here, the “part facing the display area P4” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and avoids a functional part such as an electrical component mounting portion. Indicates. In the present embodiment, the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on three sides excluding the functional portions in the liquid crystal panel P having a rectangular shape in plan view. On one side corresponding to the functional portion, the surplus portion is laser-cut at a position appropriately entering the display region P4 side from the outer peripheral edge of the liquid crystal panel P.
In addition, in this embodiment, although the structure which cut | disconnects the 2nd optical member sheet | seat F2 and the sheet piece F1S of the 1st optical member sheet | seat F1 simultaneously is mentioned, it is not restricted to this. For example, there may be a configuration in which only the sheet piece F1S of the first optical member sheet F1 or only the second optical member sheet F2 is cut.

  As shown in FIG. 1, the third alignment device 17 reverses the front and back of the second single-sided bonding panel P12 with the backlight side of the liquid crystal panel P as the upper surface, and sets the display surface side of the liquid crystal panel P as the upper surface. The same alignment as the first alignment device 11 and the second alignment device 14 is performed. That is, the third alignment device 17 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera in the component width direction of the second single-sided bonding panel P12 with respect to the third bonding device 18. Positioning and positioning in the rotation direction are performed. In this state, the second single-sided bonding panel P <b> 12 is introduced into the bonding position of the third bonding device 18.

  The 3rd bonding apparatus 18 is the 2nd single side | surface conveyed below the 3rd optical member sheet | seat F3 with respect to the lower surface of the elongate 3rd optical member sheet | seat (optical member sheet | seat) F3 introduced into the bonding position. The upper surface (the display surface side of the liquid crystal panel P) of the bonding panel P12 is bonded. The 3rd bonding apparatus 18 is provided with the conveying apparatus 18a and the pinching roll 18b.

  The conveying device 18a unwinds the third optical member sheet F3 from the third original roll R3 around which the third optical member sheet F3 is wound, and the third optical member sheet F3 in the longitudinal direction of the third optical member sheet F3. Convey along. The transport device 18a includes a roll holding unit 18c and a third recovery unit 18d. The roll holding unit 18c holds the third original roll R3 around which the third optical member sheet F3 is wound, and feeds the third optical member sheet F3 along the longitudinal direction of the third optical member sheet F3. The third recovery unit 18d recovers the surplus portion of the third optical member sheet F3 that has passed through the third cutting device 19 located on the downstream side of the panel conveyance with respect to the pinching roll 18b.

  The pinching roll 18b bonds the upper surface of the second single-sided bonding panel P12 conveyed by the roller conveyor 5 to the lower surface of the third optical member sheet F3 conveyed by the conveying device 18a. The pinching roll 18b has a pair of pasting rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap becomes the bonding position of the third bonding apparatus 18. In this gap, the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced. These 2nd single-sided bonding panels P12 and the 3rd optical member sheet | seat F3 are sent out to a panel conveyance downstream, being pinched between a pair of bonding rollers. Thereby, the 3rd bonding sheet | seat F23 by which the several 2nd single-sided bonding panel P12 was continuously bonded on the lower surface of the elongate 3rd optical member sheet | seat F3 is formed, keeping predetermined space | interval.

  The 3rd cutting device 19 is located in the panel conveyance downstream rather than the pinching roll 18b. The third cutting device 19 cuts the third optical member sheet F3. The third cutting device 19 is a laser processing machine similar to the second cutting device 16. The third cutting device 19 cuts the third optical member sheet F3 endlessly along the outer peripheral edge of the display region P4 (for example, along the outer peripheral edge of the liquid crystal panel P).

By the cutting | disconnection of the 3rd cutting device 19, the double-sided bonding panel (optical display device) P13 by which the 3rd optical member F13 was bonded to the upper surface of the 2nd single-sided bonding panel P12 is formed (refer FIG. 9).
Moreover, at this time, the surplus part (not shown) of the 3rd optical member sheet | seat F3 which the opposing part (3rd optical member F13) of the double-sided bonding panel P13 and the display area P4 is cut off, and remains in frame shape isolate | separates. Is done. The surplus portion of the third optical member sheet F3 has a ladder-like shape that is continuous with the surplus portion Y ′ of the second optical member sheet F2. This surplus portion is taken up by the third recovery portion 18d.

  After the double-sided bonding panel P13 is inspected for defects (such as poor bonding) through a defect inspection device (not shown), it is transported to the downstream process and subjected to other processes.

  Hereinafter, the first optical member sheet F1, the second optical member sheet F2, and the third optical member sheet F3 may be collectively referred to as an optical member sheet FX. The liquid crystal panel P, the first single-sided bonding panel P11, and the second single-sided bonding panel P12 that are bonded to the first optical member sheet F1, the second optical member sheet F2, and the third optical member sheet F3 are referred to as an optical display component PX. Sometimes referred to generically. The first optical member F11, the second optical member F12, and the third optical member F13 may be collectively referred to as an optical member FS.

  The polarizer film constituting the optical member sheet FX is formed, for example, by uniaxially stretching a PVA film dyed with a dichroic dye. The polarizer film has a difference in the optical axis direction between the inner side in the width direction and the outer side in the width direction of the optical member sheet FX due to unevenness in the thickness of the PVA film during stretching or uneven coloring in the dichroic dye. Tend to occur.

  Therefore, in the present embodiment, alignment of the optical display component PX to be bonded to the optical member sheet FX is performed based on the inspection data of the in-plane distribution of the optical axis in each part of the optical member sheet FX stored in advance in the control device 20. Above, the optical display component PX is bonded to the optical member sheet FX. Note that the optical axis direction may be detected while the optical member sheet FX is unwound, and the optical display component PX may be aligned based on the detection data.

As shown in FIG. 5, the liquid crystal panel P includes a first substrate P1, a second substrate P2, and a liquid crystal layer P3.
The first substrate P1 is a rectangular substrate made of, for example, a TFT substrate. The second substrate P2 is a rectangular substrate disposed to face the first substrate P1. The liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. For convenience of illustration, hatching of each layer is omitted.

  As shown in FIGS. 7 and 8, the three sides of the outer periphery of the first substrate P1 are set along the corresponding three sides of the second substrate P2, and the remaining one side of the outer periphery of the first substrate P1 is set to the second substrate. It protrudes outside the corresponding side of P2. Thereby, the electrical component attachment part P5 which protrudes outside the 2nd board | substrate P2 is provided in the remaining one side of the outer periphery of the 1st board | substrate P1.

  As shown in FIG. 6, the second cutting device 16 detects the outer peripheral edge of the display region P4 with a detection unit such as a camera 16a, and the first optical member sheet F1 and the first optical member sheet F1 along the outer peripheral edge of the display region P4. The two optical member sheet F2 is cut. As shown in FIG. 8, the third cutting device 19 cuts the third optical member sheet F3 along the outer periphery of the display area P4 and the like while detecting the outer periphery of the display area P4 with a detecting means such as a camera 19a. To do. As shown in FIGS. 6 and 8, a frame portion G having a predetermined width is provided outside the display area P <b> 4 to arrange a sealant or the like that joins the first substrate P <b> 1 and the second substrate P <b> 2. Laser cutting is performed by the first cutting device 16 and the second cutting device 19 within the width of the frame portion G.

  When the resin-made optical member sheet FX is laser-cut alone, the cut end of the optical member sheet FX may swell or wave due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.

  On the other hand, in this embodiment in which the optical member sheet FX is laser-cut after the optical member sheet FX is bonded to the liquid crystal panel P, the cut end of the optical member sheet FX is backed up on the glass surface of the liquid crystal panel P. Therefore, it is difficult for the cut end of the optical member sheet FX to swell or wave. Moreover, since it is after bonding to liquid crystal panel P, it is hard to produce the bonding defect.

  The deflection width (tolerance) of the cutting line of the laser processing machine is smaller than the deflection width (tolerance) of the cutting line of a cutting blade such as a cutter. Therefore, in this embodiment, compared with the case where the optical member sheet FX is cut using a cutting blade, the width of the frame portion G can be reduced, and the liquid crystal panel P can be reduced in size and / or the display area P4. Larger size is possible. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

  Further, when the optical member sheet FX is cut into a sheet piece aligned with the display area P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the sheet piece and the liquid crystal panel P Dimensional tolerances of relative bonding positions overlap. Therefore, it becomes difficult to narrow the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

  On the other hand, when the optical member sheet FX is bonded to the liquid crystal panel P and then cut in accordance with the display region P4, only the runout tolerance of the cutting line needs to be considered. Therefore, the tolerance of the width of the frame part G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

  Furthermore, the cutting force is not input to the liquid crystal panel P by cutting the optical member sheet FX with a laser instead of a blade. This makes it difficult for cracks and chips to occur at the edge of the substrate of the liquid crystal panel P, and improves durability against heat cycles and the like. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion P5.

  As shown in FIG. 7, when laser cutting the optical member sheet FX (third optical member sheet F3 in FIG. 7), for example, a laser cut start point pt1 is set on the extension of one long side of the display area P4, and this First, cutting of one long side of the display area P4 is started from the start point pt1. The end point pt2 of the laser cut is set at a position where the laser goes around the display area P4 and reaches the extension of the short side on the start point side of the display area P4. The start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.

  FIG. 2 is a perspective view showing an example of a laser beam irradiation device 30 used as a cutting means for the optical member sheet FX of the first single-sided bonding panel P11 and the second single-sided bonding panel P12. In addition, although application to the second cutting device 16 is shown as an example in FIG. 2, the same configuration can be applied to the third cutting device 19.

As shown in FIG. 2, the laser light irradiation device 30 includes a table 31, a scanner as the second cutting device 16, a moving device 32, and a control device 33.
The laser beam irradiation device 30 operates each part based on the control of the control device 33 as an electronic control device. The laser light irradiation device 30 irradiates the optical member sheet FX (second optical member sheet F2 and sheet piece F1S) of the first single-sided bonding panel P11 (see FIG. 6) with the laser light L, and applies the optical member sheet FX to the optical member sheet FX. Cut into optical members FS of a predetermined size.

The table 31 has a holding surface 31a that holds the first single-sided bonding panel P11 (irradiation target).
In order to cut | disconnect the optical member sheet | seat FX of the 1st single-sided bonding panel P11 hold | maintained at the table 31, the 2nd cutting device 16 (scanner) inject | emits the laser beam L to this optical member sheet | seat FX.

  The second cutting device 16 can scan the laser light L biaxially in a plane parallel to the holding surface 31a of the table 31 (in the XY plane). That is, the second cutting device 16 can move relative to the table 31 independently in the X direction and the Y direction. Thereby, it is possible to move the second cutting device 16 to an arbitrary position on the table 31 and irradiate the laser beam L with high accuracy to an arbitrary position of the optical member sheet FX held on the table 31.

  The moving device 32 enables relative movement between the table 31 and the second cutting device 16. The moving device 32 moves the table 31 and the second cutting device 16 in a first direction V1 (X direction) parallel to the holding surface 31a, and a second direction parallel to the holding surface 31a and orthogonal to the first direction V1. V2 (Y direction) is relatively moved in a third direction V3 (Z direction) which is a normal direction of the holding surface 31a. The moving device 32 operates, for example, a linear motor of a slider mechanism provided in the second cutting device 16 (both not shown) to move the second cutting device 16 in each direction of XYZ.

  Although the said structure moves the 2nd cutting device 16 with the moving apparatus 32, it is not restricted to this. For example, the table 31 may be moved by the same moving device as described above, or both the table 31 and the second cutting device 16 may be moved.

FIG. 3 is a perspective view showing an internal configuration of the second cutting device 16 (scanner) in the laser light irradiation device 30. In FIG. 3, illustration of the moving device 32 and the control device 33 is omitted.
As shown in FIG. 3, the second cutting device 16 includes a laser beam oscillator 160, a first irradiation position adjustment device 161, a second irradiation position adjustment device 162, and a condenser lens 163.

  The laser beam oscillator 160 is a device that oscillates the laser beam L in pulses. In the present embodiment, a CO2 laser light oscillator (carbon dioxide laser light oscillator) is used as the laser light oscillator 160. Examples of the laser beam oscillator 160 include, but are not particularly limited to, a UV laser beam oscillator, a semiconductor laser beam oscillator, a YAG laser beam oscillator, and an excimer laser beam oscillator. A CO2 laser oscillator is preferable because it can oscillate laser light at a high output suitable for, for example, cutting of a polarizing film.

The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 constitute a scanning element capable of biaxial scanning the laser beam L oscillated from the laser beam oscillator 160 in a plane parallel to the holding surface 31a.
As the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, for example, a galvano scanner, a gimbal, or the like is used. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are arranged on the optical path of the laser light L between the laser light oscillator 160 and the condenser lens 163 from the laser light oscillator 160 side. The adjusting device 161 and the second irradiation position adjusting device 162 are arranged in this order.

The first irradiation position adjusting device 161 includes a mirror 161a and an actuator 161b. The actuator 161b has a rotating shaft 161c parallel to the Z direction, and a mirror 161a is coupled to the rotating shaft 161c. The actuator 161b adjusts the installation angle of the mirror 161a.
The second irradiation position adjusting device 162 includes a mirror 162a and an actuator 162b. The actuator 162b has a rotation shaft 162c parallel to the Y direction, and connects the mirror 162a to the rotation shaft 162c. The actuator 162b adjusts the installation angle of the mirror 162a.

  The laser beam L oscillated from the laser beam oscillator 160 is irradiated onto the optical member sheet FX held on the table 31 through the mirror 161a, the mirror 162a, and the condenser lens 163 in this order. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 adjust the installation angles of the mirror 161a and the mirror 162a by driving the actuator 161b and the actuator 162b based on the control of the control device 33. Thereby, the irradiation position of the laser beam L irradiated toward the optical member sheet FX on the table 31 is biaxially scanned.

  When the optical path of the laser beam L is positioned in the state indicated by the solid line in the figure, the laser beam L oscillated from the laser beam oscillator 160 is focused on the focusing point Qa on the optical member sheet FX. . Similarly, when the optical path of the laser beam L is positioned in the state indicated by the alternate long and short dash line in the figure, the laser beam L is condensed at the condensing point Qb. When the optical path of the laser beam L is positioned in a state indicated by a two-dot chain line in the drawing, the laser beam L is condensed at the condensing point Qc.

  In this embodiment, the condensing lens 163 is disposed between the second irradiation position adjusting device 162 and the optical member sheet FX. The condensing lens 163 condenses the laser light L, whose optical path is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, at a predetermined position of the optical member sheet FX. The condensing lens 163 is, for example, an fθ lens. The condensing lens 163 can condense the laser light L indicated by each line in the drawing inputted in parallel to the condensing lens 163 from the mirror 162a in parallel with the optical member sheet FX.

The control device 33 moves the laser light L that has passed through the condenser lens 163 so as to draw a desired trajectory on the optical member sheet FX held on the table 31 and the first irradiation position adjustment device. 161 and the second irradiation position adjusting device 162 are controlled to operate.
In the present embodiment, the laser beam oscillator 160 and the optical member sheet FX are relatively moved by a nozzle method using the moving device 32 to enable laser cutting over a wide range. Further, the laser beam L is biaxially scanned by a scanner method using the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, and high-precision laser cutting can be performed in detail.

  FIG. 10 is an explanatory diagram showing an action when laser processing is performed on the bonded body in a state where the first optical member sheet F1 is bonded to the liquid crystal panel P by the second cutting device 16 described above. Hereinafter, the case where laser cutting is performed in a state where only the first optical member sheet F1 is bonded to the liquid crystal panel P will be described as an example. However, the same configuration can be applied to laser cutting in a state in which the second optical member sheet F2 is bonded to the first optical member sheet F1 and laser cutting of the third optical member sheet F3.

  The first optical member sheet F1 is laser-cut by the second cutting device 16 in a state of being bonded to the bonding surface T1 of the liquid crystal panel P. The 2nd cutting device 16 is the cutting | disconnection part between the opposing part (1st optical member F11) and the surplus part Y with respect to the display area P4 of the liquid crystal panel P in the 1st optical member sheet | seat F1 bonded by liquid crystal panel P. The laser beam L is irradiated along the irradiation axis C1 toward S.

  The laser beam irradiation device 30 including the second cutting device 16 tilts the irradiation axis C1 of the second cutting device 16 with respect to a direction orthogonal to the holding surface 31a of the table 31 (a direction along the orthogonal line C0 in the drawing). . The laser beam irradiation device 30 includes a tilting device 34 that tilts the second cutting device 16 with respect to the table 31. In FIG. 10, the irradiation axis C <b> 1 of the second cutting device 16 is an orthogonal line C <b> 0 (this is the state in which the table 31 is level with the holding surface 31 a and the bonding surface T <b> 1 of the liquid crystal panel P on the holding surface 31 a in the conveying posture. In the case, it is inclined with respect to the vertical direction). The orthogonal line C0 is also an orthogonal line of the bonding surface T1 of the liquid crystal panel P.

  By the operation of the tilting device 34, the irradiation axis C1 of the second cutting device 16 is in a direction along the bonding surface T1 as the distance from the bonding surface T1 toward the first optical member sheet F1 in the direction orthogonal to the holding surface 31a. It inclines with respect to orthogonal line C0 so that it may leave | separate from the opposing part (1st optical member F11) with respect to display area P4 of liquid crystal panel P.

  In the cutting part S of the first optical member sheet F1, the cutting end Sa of the first optical member sheet F1 has a tapered cutting surface Sa that spreads toward the second cutting device 16 by laser cutting with the laser beam L narrowed down. Is formed. The width (taper width) x in the direction along the bonding surface T1 in the cut surface Sa on the first optical member F11 side is desirably narrowed so as not to affect the effective area of the first optical member F11. That is, it is desirable that the angle (taper angle) θ with respect to the bonding surface T1 in the cut surface Sa on the first optical member F11 side is close to a right angle.

  In the present embodiment shown in FIG. 10, by the operation of the tilting device 34, the irradiation axis C1 of the second cutting device 16 is tilted with respect to the orthogonal line C0 as described above. At this time, if the thickness t of the first optical member sheet F1 is 250 μm, the taper angle θ needs to be about 68 ° or more in order to set the taper width x to 100 μm or less, for example.

  In the comparative example shown in FIG. 11, the second cutting device 16 irradiates the laser beam L with the irradiation axis C1 along the orthogonal line C0. At this time, the taper angle θ ′ of the cut surface Sa on the first optical member F11 side decreases with respect to the taper angle θ of FIG. 10 (about 45 °), and the taper width x ′ is smaller than the taper width x of FIG. (About 250 μm). For this reason, the effective area of the first optical member F11 is narrowed.

On the other hand, in the present embodiment, the tapered cut surface Sa is also inclined in the same manner as the irradiation axis C1.
For this reason, the taper angle θ of the cut surface Sa on the first optical member F11 side in the first optical member sheet F1 approaches a right angle, and the taper width x in the direction along the bonding surface T1 of the cut surface Sa decreases. Therefore, it is possible to ensure a wide effective area of the first optical member F11. Note that the taper width of the cut surface Sa on the surplus portion Y side is increased, so that the surplus portion Y can be easily cut off.

  In the modification of this embodiment shown in FIG. 12, a tilting device 35 that tilts the table 31 with respect to the second cutting device 16 is provided instead of the tilting device 34. By the operation of the tilting device 35, the irradiation axis C1 of the second cutting device 16 is tilted with respect to the direction orthogonal to the holding surface 31a of the table 31, as in FIG. In FIG. 12, the holding surface 31a of the table 31 and the bonding surface T1 of the liquid crystal panel P on the holding surface 31a are inclined with respect to the horizontal direction with the second cutting device 16 having the irradiation axis C1 along the vertical direction. To do.

By the operation of the tilting device 35, the irradiation axis C1 of the second cutting device 16 is bonded to the first optical member sheet F1 side in the direction orthogonal to the holding surface 31a in the direction orthogonal to the holding surface 31a. It inclines with respect to the orthogonal line C0 so that it may leave | separate from the opposing part with the display area P4 of liquid crystal panel P in the direction in alignment with T1. As a result, the tapered cut surface Sa is also inclined in the same manner as the irradiation axis C1, and the taper width x of the cut surface Sa is reduced. Therefore, it is possible to ensure a wide effective area of the first optical member F11.
The irradiation axis C1 may be tilted with respect to the direction orthogonal to the table 31 and the liquid crystal panel P by tilting the second cutting device 16 and the table 31 together.

As described above, according to the production system 1 of the optical display device in the embodiment, after the optical member sheet FX larger than the display area P4 of the liquid crystal panel P is bonded to the liquid crystal panel P, the optical member sheet FX. By cutting off the surplus portion, the optical member FS having a size corresponding to the display region P4 can be accurately formed on the surface of the liquid crystal panel P. Therefore, the frame part G outside the display area P4 can be narrowed to enlarge the display area and downsize the device.
Further, the cutting using the laser beam L has higher accuracy than the cutting using the cutting blade. Therefore, the frame part G around the display area P4 can be narrowed compared with the case where a cutting blade is used.

  And the laser beam irradiation apparatus 30 which cut | disconnects the optical member sheet | seat FX is optical member from the bonding surface T1 in this orthogonal direction with respect to the direction orthogonal to the bonding surface T1 which bonds the optical member sheet | seat FX in liquid crystal panel P. The taper angle θ generated at the cut end of the optical member sheet FX by laser cutting by inclining the irradiation axis C1 so as to move away from the optical member FS in the direction along the bonding surface T1 as the distance to the sheet FX side increases. The angle with respect to the direction orthogonal to the plane T1 can be reduced by the inclination of the irradiation axis C1. Therefore, the effective area of the optical member sheet FX (optical member FS) to be left on the liquid crystal panel P can be increased, which can contribute to further narrowing of the device frame.

  The present invention is not limited to the above-described embodiment and modification examples. For example, in the present embodiment, the configuration in which the optical member sheet is cut into a frame shape is described as an example of the configuration in which the irradiation target is irradiated with laser light and the predetermined processing is performed, but the configuration is not limited thereto. For example, the structure may be such that the optical member sheet is divided into at least two parts, a cut is formed through the optical member sheet, or a groove (cut) having a predetermined depth is formed in the optical member sheet. Specifically, for example, there are cutting (cutting off), half-cutting, marking processing and the like of the end of the optical member sheet.

  Moreover, in the said embodiment, the 2nd cutting device 16 detects the outer periphery of the display area P4 with detection means, such as the camera 16a, and the 1st optical member sheet | seat F1 and the outer periphery of the display area P4, etc. The second optical member sheet F2 was cut. The 3rd cutting device 19 decided to cut the 3rd optical member sheet | seat F3 along the outer periphery of the display area P4, etc., detecting the outer periphery of the display area P4 with detection means, such as the camera 19a. However, the configuration of the detection means is not limited to this.

  Specifically, the film bonding system 1 detects the outer periphery of the bonding surface of the first optical member sheet F1, the second optical member sheet F2, and the liquid crystal panel P in the second bonding sheet F22. It is good also as cutting the cutting line SX set along the outer periphery of the bonding surface. Moreover, in the 3rd bonding sheet | seat F23, the film bonding system 1 has a detection means to detect the outer periphery of the bonding surface of the 3rd optical member sheet | seat F3 and liquid crystal panel P, and the outer periphery of a bonding surface The cutting line SX set along the line may be cut.

  The detection of the outer peripheral edge of the bonding surface and the cutting by the cutting device are performed in detail as follows. Hereinafter, the modification of the film bonding system 1 is demonstrated using FIGS.

FIG. 13 is a schematic diagram of the first detection means 61 that detects the outer periphery of the bonding surface. The first detection means 61 included in the film bonding system 1 of the present embodiment includes an imaging device 63, an illumination light source 64, and a control unit 65.
The imaging device 63 captures an image of the outer peripheral edge ED of the bonding surface (hereinafter sometimes referred to as the first bonding surface SA1) between the liquid crystal panel P and the sheet piece F1S in the second bonding sheet F22. . The illumination light source 64 illuminates the outer peripheral edge ED. The control unit 65 stores an image captured by the imaging device 63 and performs a calculation for detecting the outer peripheral edge ED based on the image.

  Such first detection means 61 is provided on the upstream side of the panel conveyance of the second cutting device 16 in FIG. 1 and is provided between the pinching roll 15 b and the second cutting device 16.

  The imaging device 63 is fixed and arranged inside the first bonding surface SA1 rather than the outer peripheral edge ED. The imaging device 63 is inclined such that the normal line of the first bonding surface SA1 and the normal line of the imaging surface 63a of the imaging device 63 form an angle θ (hereinafter referred to as an inclination angle θ of the imaging device 63). It is a posture. The imaging device 63 directs the imaging surface 63a to the outer peripheral edge ED, and captures an image of the outer peripheral edge ED from the side where the sheet piece F1S is bonded in the second bonding sheet F22.

  The inclination angle θ of the imaging device 63 may be set so that the outer peripheral edge of the first substrate P1 that forms the first bonding surface SA1 can be reliably imaged. For example, when the liquid crystal panel P is formed by so-called multiple chamfering, in which the mother panel is divided into a plurality of liquid crystal panels, the liquid crystal panel P is shifted to the outer peripheral edge of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P. May occur, and the end surface of the second substrate P2 may be displaced outward from the end surface of the first substrate P1. In such a case, the inclination angle θ of the imaging device 63 may be set so that the outer peripheral edge of the second substrate P2 does not enter the imaging field of the imaging device 63.

  In such a case, the inclination angle θ of the imaging device 63 is a distance H between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as the height H of the imaging device 63). It may be set to fit. For example, when the height H of the imaging device 63 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 63 may be set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 63 and the inclination angle θ of the imaging device 63 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 63 is set to 78 mm, and the inclination angle θ of the imaging device 63 is set to 10 °.

  The inclination angle θ of the imaging device 63 may be 0 °. FIG. 14 is a schematic diagram showing a modified example of the first detection means 61, and is an example when the inclination angle θ of the imaging device 63 is 0 °. In this case, each of the imaging device 63 and the illumination light source 64 may be disposed at a position overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.

  A distance H1 between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as a height H1 of the imaging device 63) detects the outer peripheral edge ED of the first bonding surface SA1. It may be set at an easy position. For example, the height H1 of the imaging device 63 may be set in a range of 50 mm or more and 150 mm or less.

  The illumination light source 64 is fixed and arranged on the opposite side to the side where the sheet piece F1S in the second bonding sheet F22 is bonded. The illumination light source 64 is arrange | positioned rather than the outer periphery ED on the outer side of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 are parallel.

  In addition, the illumination light source 64 may be arrange | positioned at the side (namely, the same side as the imaging device 63) by which the sheet piece F1S in the 2nd bonding sheet | seat F22 was bonded.

  If the outer peripheral edge ED imaged by the imaging device 63 is illuminated by the illumination light emitted from the illumination light source 64, the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 intersect. It may be.

  FIG. 15 is a plan view showing a position for detecting the outer peripheral edge of the bonding surface. Inspection area | region CA is set on the conveyance path | route of the 2nd bonding sheet | seat F22 shown in FIG. Inspection area | region CA is set in the position corresponding to the outer periphery ED of 1st bonding surface SA1 in liquid crystal panel P conveyed. In FIG. 15, inspection area | region CA is set to four places corresponding to the four corners of 1st bonding surface SA1 of planar view rectangle, and the corner | angular part of 1st bonding surface SA1 is detected as outer periphery ED. It is the composition to do. In FIG. 15, the hook-shaped part corresponding to a corner | angular part is shown as outer periphery ED among the outer periphery of 1st bonding surface SA1.

13 detects the outer peripheral edge ED in the four inspection areas CA.
Specifically, an imaging device 63 and an illumination light source 64 are arranged in each inspection area CA. The 1st detection means 61 images the corner | angular part of 1st bonding surface SA1 for every conveyed liquid crystal panel P, and detects the outer periphery ED based on imaging data. The detected data of the outer peripheral edge ED is stored in the control unit 65 shown in FIG.

  In addition, if the outer periphery of 1st bonding surface SA1 is detectable, the setting position of test | inspection area | region CA is not restricted to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1. In this case, each side (four sides) of the first bonding surface SA1 is detected as an outer peripheral edge.

  Moreover, the imaging device 63 and the illumination light source 64 are not limited to the configuration arranged in each inspection area CA, but are configured to be able to move along a movement path that is set along the outer peripheral edge ED of the first bonding surface SA1. It may be. In this case, the imaging device 63 and the illumination light source 64 are configured to detect the outer peripheral edge ED when the imaging device 63 and the illumination light source 64 are positioned in each inspection area CA, so that one imaging device 63 and one illumination light source 64 are provided. In this case, the outer periphery ED can be detected.

  The cutting line about the sheet piece F1S and the second optical member sheet F2 by the second cutting device 16 is set based on the detection result of the outer peripheral edge ED of the first bonding surface SA1.

  For example, based on the memorized data of the outer peripheral edge ED of the first bonding surface SA1, the control unit 65 of the first detection means 61 determines that the first optical member F11 is outside the liquid crystal panel P (first bonding surface SA1. The cutting line of the sheet piece F1S and the second optical member sheet F2 can be set so as not to protrude outside. The setting of the cutting line is not necessarily performed by the control unit 65 of the first detection unit 61. The setting of the cutting line may be performed by using the data of the outer peripheral edge ED detected by the first detecting means 61 and setting the cutting line along the outer peripheral edge of the bonding surface using a separate calculating means.

  The 2nd cutting device 16 cut | disconnects the sheet piece F1S and the 2nd optical member sheet | seat F2 in the cutting line set along the outer periphery ED of the bonding surface.

  Returning to FIG. 1, the second cutting device 16 is provided on the downstream side of the panel conveyance with respect to the first detection means 61. The 2nd cutting device 16 is a sheet | seat piece F1S bonded by liquid crystal panel P, and the 2nd optical member sheet | seat F2, and the opposing part with the display area P4 (refer FIG. 6), and the excess part of the outer side of an opposing part. Then, the first optical member F11 and the second optical member F12 (see FIG. 9) having a size corresponding to the display area P4 are cut out along a cutting line set based on the detected outer peripheral edge ED. Thereby, the 2nd single-sided bonding panel P12 in which the 1st optical member F11 and the 2nd optical member F12 were piled up and bonded on the upper surface of liquid crystal panel P is formed.

  In the present embodiment, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P at three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, and the liquid crystal panel P at one side corresponding to the functional portion. It is possible to adopt a configuration in which the surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge. For example, when the first substrate P1 is a TFT substrate, it is possible to adopt a configuration in which a cut is made at a position shifted from the outer peripheral edge of the liquid crystal panel P to the display region P4 side by a predetermined amount so as to exclude the functional portion on one side corresponding to the functional portion.

  FIG. 16 is a schematic diagram of the second detection means 62 for detecting the outer peripheral edge of the bonding surface. The 2nd detection means 62 with which the film bonding system 1 of this embodiment is provided has the imaging device 63, the illumination light source 64, and the control part 65. FIG. The second detection means 62 has the same configuration as the first detection means 61 described above. The imaging device 63 is an image of the outer peripheral edge ED of the bonding surface (hereinafter sometimes referred to as the second bonding surface SA2) between the liquid crystal panel P and the third optical member sheet F3 in the third bonding sheet F23. Image. The illumination device 64 illuminates the outer peripheral edge ED. The control unit 65 stores an image captured by the imaging device 63 and performs a calculation for detecting the outer peripheral edge ED based on the image.

  Such second detection means 62 is provided on the upstream side of the panel conveyance of the third cutting device 19 in FIG. 1 and is provided between the pinching roll 18 b and the third cutting device 19. The 2nd detection means 62 detects outer periphery ED of 2nd bonding surface SA2 similarly to the above-mentioned 1st detection means 61 in the test | inspection area | region set on the conveyance path | route of the 3rd bonding sheet | seat F23.

  The cutting line about the 3rd optical member sheet | seat F3 by the 3rd cutting device 19 is set based on the detection result of the outer periphery ED of 2nd bonding surface SA2.

  For example, based on the stored data of the outer peripheral edge ED of the second bonding surface SA2, the control unit 65 of the second detection means 62 causes the third optical member F13 to be outside the liquid crystal panel P (second bonding surface SA2). The cutting line of the third optical member sheet F3 can be set so that the size does not protrude outside. The setting of the cutting line is not necessarily performed by the control unit 65 of the second detection unit 62. The setting of the cutting line may be performed by using the data of the outer peripheral edge ED detected by the second detecting means 62 and setting the cutting line along the outer peripheral edge of the bonding surface using a separate calculating means.

  The 3rd cutting device 19 cut | disconnects the 3rd optical member sheet | seat F3 in the cutting line set along the outer periphery ED of the bonding surface.

The 3rd cutting device 19 detected the opposing part with the display area P4 (refer FIG. 8) among the 3rd optical member sheets F3 bonded by liquid crystal panel P, and the excess part of the outer side of an opposing part. The third optical member F13 (see FIG. 9) having a size corresponding to the display area P4 is cut out along a cutting line set based on the outer peripheral edge ED. Thereby, the double-sided bonding panel P13 by which the 3rd optical member F13 was bonded by the upper surface of the 2nd single-sided bonding panel P12 is formed.
Even in the film laminating system according to the modified example as described above, the frame portion around the display area is reduced to enlarge the display area and downsize the device, and suppress the inclination of the cut surface of the optical member due to laser cutting. Thus, the effective area of the optical member can be expanded.

  Moreover, although the said embodiment demonstrated that the whole 2nd cutting device 16 containing the laser beam oscillator 160 moved relatively with respect to the table 31, it is not restricted to this structure. For example, when the laser beam oscillator 160 is large and unsuitable for moving, the laser beam oscillator 160 is fixed and the scanning elements (the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162) are moved. A configuration in which the table 31 is moved relative to the table 31 can be employed. In this case, the condenser lens 163 may be moved following the scanning element.

  In the film bonding system of the said embodiment, the outer periphery of the bonding surface was detected for every some liquid crystal panel P using a detection means, and it bonded for every liquid crystal panel P based on the detected outer periphery. The cutting positions of the sheet piece F1S, the second optical member sheet F2, and the third optical member sheet 3 are set. Thereby, an optical member having a desired size can be separated regardless of individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S. Therefore, quality variations due to individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S can be eliminated, and the frame portion around the display area can be reduced to enlarge the display area and downsize the device.

  The configurations in the above-described embodiments and modifications are examples of the present invention, and various modifications can be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (production system of an optical device), 12 ... 1st bonding apparatus (bonding apparatus), 15 ... 2nd bonding apparatus (bonding apparatus), 18 ... 3rd bonding apparatus (bonding) Device), 16 ... second cutting device (cutting device), 19 ... third cutting device (cutting device), 30 ... laser light irradiation device, 34, 35 ... tilting device, 61 ... first detection means (detection means), 62 ... second detection means (detection means), P ... liquid crystal panel (optical display component), P4 ... display area, F1 ... first optical member sheet (optical member sheet), F2 ... second optical member sheet (optical member sheet) ), F3 ... Third optical member sheet (optical member sheet), F11 ... First optical member (optical member, opposing portion), F12 ... Second optical member (optical member, opposing portion), F13 ... Third optical member ( Optical member, facing part), P11 ... first single-sided panel Optical display component, bonding body), P12 ... second single-sided bonding panel (optical display component, bonding body), P13 ... double-sided bonding panel (optical display device), PX ... optical display component, FS ... optical member, FX ... Optical member sheet, Y, Y '... surplus part, S ... cutting part, L ... laser beam, T1 ... bonding surface, C1 ... irradiation axis, ED ... outer periphery, SA1 ... first bonding surface (bonding surface) , SA2 ... second bonding surface (bonding surface)

Claims (4)

An optical display device production system configured by bonding an optical member to an optical display component,
A laminating device for laminating an optical member sheet larger than the display area of the optical display component to the optical display component,
The cutting | disconnection which cut | disconnects the opposing part with the said display area of the said optical member sheet | seat in the said bonding body, and the excess part of the outer side of the said opposing part, and forms the said optical member of the magnitude | size corresponding to the said display area from the said optical member sheet | seat. Equipment,
With
A laser beam irradiation device that irradiates a laser beam for cutting processing toward the cutting portion between the facing portion and the surplus portion of the optical member sheet in the bonded body, the cutting device;
A tilting device that tilts an irradiation axis of laser light in the laser light irradiation device from the outside to the inside of the facing portion with respect to a direction orthogonal to a bonding surface on which the optical member sheet in the optical display component is bonded. When,
An optical display device production system comprising: In the bonding body, further comprising a detecting means for detecting an outer peripheral edge of the bonding surface of the optical member sheet and the optical display component,
Setting the cutting portion along the outer periphery;
The production system of the optical display device according to claim 1. It is a production method of an optical display device configured by bonding an optical member to an optical display component,
A bonding step in which an optical member sheet larger than the display area of the optical display component is bonded to the optical display component to form a bonded body,
The cutting | disconnection which cut | disconnects the opposing part with the said display area of the said optical member sheet | seat in the said bonding body, and the excess part of the outer side of the said opposing part, and forms the said optical member of the magnitude | size corresponding to the said display area from the said optical member sheet | seat. Process,
Including
A laser beam irradiation step in which the cutting step irradiates a laser beam for cutting processing toward a cut portion between the facing portion and the surplus portion of the optical member sheet in the bonded body, and
A tilting step of inclining an irradiation axis of laser light in the laser light irradiation step so as to be directed from the outside to the inside of the facing portion with respect to a direction orthogonal to a bonding surface on which the optical member sheet in the optical display component is bonded. When,
A method for producing an optical display device. Prior to the cutting step, the bonding body further includes a detection step of detecting an outer peripheral edge of the bonding surface of the optical member sheet and the optical display component,
Setting the cutting portion along the outer periphery;
A method for producing the optical display device according to claim 3.

Images