WO2014125993A1

WO2014125993A1 - Cutting device, cutting method, and method of manufacturing laminate optical member

Info

Publication number: WO2014125993A1
Application number: PCT/JP2014/052764
Authority: WO
Inventors: 幹士藤井; 盛旭蔡
Original assignee: 住友化学株式会社
Priority date: 2013-02-14
Filing date: 2014-02-06
Publication date: 2014-08-21
Also published as: TW201440941A

Abstract

This cutting device is provided with a cutting unit which cuts a processing target, a first table which can move the processing target between a first position and a cutting position, and a second table which can move the processing target between the cutting position and a second position, which is opposite of the first position with respect to the cutting position, wherein the first position and the second position double as a loading position where, before cutting processing, the processing target is loaded from outside onto the first table or second table, and an unloading position where, after completing the cutting processing, the processing target is unloaded from the first table or the second table to the outside.

Description

CUTTING DEVICE, CUTTING METHOD, AND OPTICAL MEMBER BONDING MANUFACTURING DEVICE

The present invention relates to a cutting device for cutting an optical member sheet bonded to an optical display device such as a liquid crystal display, a cutting method, and an apparatus for manufacturing an optical member bonded body.
This application claims priority based on Japanese Patent Application No. 2013-026951 filed on Feb. 14, 2013, the contents of which are incorporated herein by reference.

Conventionally, in a production system for an optical display device such as a liquid crystal display, an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is formed from a long film into a sheet piece having a size matching the display area of the liquid crystal panel After being cut out, packed and transported to another line, it may be bonded to a liquid crystal panel (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2003-255132

However, in the conventional configuration described above, a sheet piece slightly larger than the display area is cut out in consideration of variation in dimensions of the liquid crystal panel and the sheet piece, and bonding variation (positional deviation) of the sheet piece to the liquid crystal panel. . Therefore, there is a problem that an extra area (frame part) is formed around the display area, and downsizing of the device is hindered. Therefore, in order to reduce the size of the device, a sheet piece slightly larger than the display area is pasted on the liquid crystal panel, and a cutting process for cutting an extra area (frame part) around the display area may be separately performed. Conceivable. However, if such a cutting process is performed, the work time (tact time) of the entire system increases, which may reduce the production efficiency. It has been clarified by the inventor that shortening the time of the cutting process leads to a reduction in tact time.

The aspect of the present invention has been made in view of the above circumstances, and provides a cutting apparatus, a cutting method, and an optical member bonded body manufacturing apparatus that can improve productivity by reducing tact time.

In order to achieve the above object, the present invention employs the following means.
(1) The cutting device according to the first aspect of the present invention includes a cutting unit that performs a predetermined cutting process on a processing target, a first position, and a cutting position where the cutting unit performs the cutting process. The processing object can be moved between a first table that can move the processing object between, a second position opposite to the first position with respect to the cutting position, and the cutting position. A second table, and the first position and the second position carry the processing object from the outside into the first table or the second table before the cutting process is performed. And a carry-in position where the processing target is carried out from the first table or the second table after the cutting process is performed.

(2) In the above aspect (1), the first table and the second table may be configured to hold a plurality of the processing targets.

(3) In the aspect of the above (1) or (2), the cutting portion is at least one between the first position and the cutting position and between the second position and the cutting position. The structure provided with the detection part which detects the relative position of the said process target may be sufficient.

(4) In the above aspect (3), a configuration may further include a position correction unit that corrects a relative position of the processing target with respect to the cutting unit based on a detection result of the detection unit.

(5) In the aspect according to any one of (1) to (4) above, the carry-in timing of the processing target with respect to the first table and the carry-out timing of the processing target from the second table are synchronized. The structure performed by doing may be sufficient.

(6) In the aspect according to any one of (1) to (5), each of the first position, the second position, and the cutting position is set on a straight line. Also good.

(7) In the aspect according to any one of (1) to (6), the cutting unit may be configured to perform the cutting process with a laser beam.

(8) In the cutting method according to the second aspect of the present invention, the processing object carried in at the first position is moved to the cutting position to perform a predetermined cutting process, and then the processing object is carried out from the first position. A first cutting step to perform, and a second cutting step to move the processing object carried in at the second position to the cutting position and perform the predetermined cutting process, and then to carry out the processing object from the second position. The first cutting step includes a first carry-in step for carrying in the processing object at the first position, and a first moving step for moving the processing object carried in at the first position to the cutting position. A first forward moving step, a first cutting step for performing the cutting process at the cutting position, and a first backward moving step for moving the processing object from the cutting position to the first position after the first cutting step. And a first unloading step for unloading the object to be processed from the first position after the first return path moving step, and the second cutting step performs the process at the second position. A second carry-in step for carrying in the object; a second forward movement step for moving the processing object carried in at the second position to the cutting position; and a second cutting step for carrying out the cutting process at the cutting position. And after the second cutting step, the second return path moving step for moving the processing target from the cutting position to the second position, and after the second return path moving step, the processing target is moved to the second position. A second unloading step for unloading the first cutting step and the second cutting step so that the first cutting step and the second cutting step are alternately performed at the cutting position. Is performed with a portion of each of the steps have been overlapped.

(9) In the aspect of the above (8), at least one of the first cutting step and the second cutting step is performed at the cutting position in the middle of at least one of the first outward movement step and the second outward movement step. The structure which further has the detection step which detects the relative position of the said process target with respect to may be sufficient.

(10) In the above aspect (8) or (9), in the first cutting step, the first carry-in step and the first carry-out step are executed synchronously at the first position, and the second The cutting process may be configured such that the second carry-in step and the second carry-out step are executed in synchronization at the second position.

(11) In the aspect according to any one of (8) to (10), in the first forward movement step, the first backward movement step, the second forward movement step, and the second backward movement step, the processing target is The structure which each moves on the same straight line may be sufficient.

(12) The manufacturing apparatus of the optical member bonding body according to the third aspect of the present invention is an apparatus for manufacturing an optical member bonding body formed by bonding an optical member to an optical display component. A bonding device that forms a sheet piece bonded body by bonding a sheet piece of a size protruding to the outside to the optical display component, and a bonding surface of the optical display component and the sheet piece in the sheet piece bonded body. A cutting device that cuts off the sheet piece of the portion protruding outside the bonding surface from the sheet piece bonding body along the edge, and forms the optical member having a size corresponding to the bonding surface. The cutting device includes the cutting device according to any one of the above (1) to (7).

According to the aspect of the present invention, it is possible to provide a cutting apparatus, a cutting method, and an optical member bonded body manufacturing apparatus that can improve productivity by reducing the tact time.

It is a perspective view which shows an example of the laser beam irradiation apparatus of this embodiment. It is a figure which shows the structure of EBS. It is a perspective view which shows the internal structure of IOR. It is a sectional side view which shows the arrangement configuration of a 1st condensing lens, an aperture member, and a collimating lens. It is a figure for demonstrating the effect | action of EBS. In FIG. 5, it is the figure which paid its attention to one pulse of a laser beam. It is a figure for demonstrating the effect | action of IOR. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut | disconnected using the laser beam irradiation apparatus which concerns on a comparative example. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut | disconnected using the laser beam irradiation apparatus of this embodiment. It is a figure which shows the structure of a control system. It is a figure for demonstrating operation | movement of a table. It is a figure which shows the operation | movement flow of the cutting process by a laser beam irradiation apparatus. It is the figure which showed notionally the operation | movement of the cutting process. It is a figure which shows the outline | summary of the whole operation | movement in the cutting process of a laser beam irradiation apparatus. It is a figure which shows the flow of operation | movement of a cutting process. It is a figure which shows the structure which concerns on the modification of a carrying-in apparatus and a carrying-out apparatus. It is a figure which shows schematic structure of the film bonding system of this embodiment. It is a top view of a liquid crystal panel. It is AA sectional drawing of FIG. It is a fragmentary sectional view of the optical sheet bonded to a liquid crystal panel. It is a figure which shows operation | movement of a cutting device. It is a top view which shows the detection process of the edge of a bonding surface. It is a schematic diagram of a detection apparatus. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows the control method for a laser beam to draw a desired locus | trajectory.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments. In all the drawings below, the dimensions and ratios of the constituent elements are appropriately changed in order to make the drawings easy to see. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

(Cutting device)
FIG. 1 is a perspective view showing an example of a laser beam irradiation apparatus 100 used as a cutting apparatus.

In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the first direction parallel to the holding surface that holds the object is defined as the X direction, and the direction orthogonal to the X direction in the plane of the holding surface is orthogonal to the Y direction, the X direction, and the Y direction. The direction is the Z direction.

As shown in FIG. 1, the laser beam irradiation apparatus 100 includes two tables (first table and second table) 111 and 112, a laser beam oscillator 102, and an EBS 130 (Electrical Beam Shaping: see FIG. 2). Are provided with an acousto-optic element 103, an IOR 104 (Imaging / Optics / Rail), a scanner 105, a moving device 106, and a control device 107 that performs overall control of these devices.

The table 111 has a holding surface 111s for holding an object (processing object) 110 to be cut. The table 111 is rectangular when viewed from the normal direction of the holding surface 111s. The holding surface 111 s is a rectangular first holding surface 111 s 1 having a length in the first direction (X direction), and a second holding having the same shape as the first holding surface 111 s 1 disposed adjacent to the first holding surface 111 s 1. And a surface 111s2. That is, the table 111 has the first holding surface 111s1 and the second holding surface 111s2, so that the two objects 110 can be simultaneously held.

The table 112 has the same configuration as the table 111, and has a holding surface 112s that is rectangular when viewed from the normal direction. The holding surface 112s is a rectangular first holding surface 112s1 having a length in the first direction (X direction), and a second holding having the same shape as the first holding surface 112s1 is disposed adjacent to the first holding surface 112s1. Surface 112s2. That is, the table 112 has the first holding surface 112s1 and the second holding surface 112s2, and thus can hold the two objects 110 at the same time.

The laser beam oscillator 102 is a member that oscillates the laser beam L. For example, as the laser beam oscillator 102, a CO ₂ laser beam oscillator (carbon dioxide laser beam oscillator), a UV laser beam oscillator, a semiconductor laser beam oscillator, a YAG laser beam oscillator, an excimer laser beam oscillator, etc. Although an oscillator can be used, a specific configuration is not particularly limited. Among the above-described oscillators, a CO ₂ laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for cutting an optical member such as a polarizing film.

FIG. 2 is a diagram illustrating the configuration of the EBS 130.
As shown in FIG. 2, the EBS 130 includes an acoustooptic element 103 disposed on the optical path of the laser beam oscillated from the laser beam oscillator 102, a drive driver 131 electrically connected to the acoustooptic element 103, And a control device 107 (corresponding to a laser control unit 171 described later) for controlling the timing at which the laser light passes through the acoustooptic device 103.
The EBS 130 shields the laser light until the output of the laser light is stabilized.

Acousto-optic element 103 is an optical element for shielding laser light oscillated from laser light oscillator 102.

The acoustooptic element 103 is obtained by bonding a piezoelectric element to an acoustooptic medium made of single crystal or glass such as tellurium dioxide (TeO ₂ ) or lead molybdate (PbMoO ₄ ). By applying an electrical signal to the piezoelectric element to generate an ultrasonic wave and propagating the ultrasonic wave into the acousto-optic medium, the passage and non-passing (shielding) of the laser light can be controlled.

In this embodiment, the acousto-optic element 103 is used as a constituent member of the EBS 130, but is not limited thereto. Other optical elements may be used as long as the laser light oscillated from the laser light oscillator 102 can be shielded.

The drive driver 131 supplies an electrical signal (control signal) for generating an ultrasonic wave to the acoustooptic device 103 based on the control of the control device 107, and adjusts the shielding time of the laser beam by the acoustooptic device 103.

The control device 107 controls the timing at which the laser light passes through the acousto-optic device 103 so that, for example, the rising and falling portions of the laser light oscillated from the laser light oscillator 102 are removed.

Note that the timing control by the control device 107 is not limited to this. For example, the control device 107 may control the timing at which the laser light passes through the acousto-optic element 103 so that the rising portion of the laser light oscillated from the laser light oscillator 102 is selectively removed. In particular, when the width (time) of the falling portion of the laser light oscillated from the laser light oscillator 102 is sufficiently shorter than the width (time) of the rising portion of the laser light, the falling portion of the laser light is removed. The profit to do is small. Therefore, in such a case, only the rising portion of the laser beam oscillated from the laser beam oscillator 102 may be selectively removed.

With such a configuration, the EBS 130 emits the laser light oscillated from the laser light oscillator 102 in a state where the output is stable based on the control of the control device 107.

The IOR 104 removes the skirt portion that does not contribute to the cutting of the object 110 in the intensity distribution of the laser light.

FIG. 3 is a perspective view showing the internal configuration of the IOR 104.
As shown in FIG. 3, the IOR 104 includes a first condenser lens 141 that condenses the laser light emitted from the EBS 130, a first holding frame 142 that holds the first condenser lens 141, and a first condenser lens. A diaphragm member 143 that squeezes the laser light condensed by the lens 141, a holding member 144 that holds the diaphragm member 143, a collimator lens 145 that collimates the laser light squeezed by the diaphragm member 143, and a collimator lens 145 are held. It has the 2nd holding frame 146 and the moving mechanism 147 which moves the 1st holding frame 142, the holding member 144, and the 2nd holding frame 146 relatively.

FIG. 4 is a side sectional view showing an arrangement configuration of the first condenser lens 141, the diaphragm member 143, and the collimator lens 145.

As shown in FIG. 4, the aperture member 143 is formed with a pinhole 143h for condensing the laser beam condensed by the first condenser lens 141. The centers of the first condenser lens 141, the pinhole 143 h and the collimator lens 145 are arranged at positions overlapping the optical axis C of the laser light emitted from the EBS 130.

The diaphragm member 143 is preferably disposed in the vicinity of the rear focal point of the first condenser lens 141.

Here, “near the rear focal point of the first condenser lens 141” means that the arrangement position of the diaphragm member 143 is slightly different from the rear focal point of the first condenser lens 141 so that the arrangement position is slightly different. It means that it may be allowed. For example, the distance K ₁ from the center of the first condenser lens 141 to the rear focal point of the first condenser lens 141 and the distance K ₂ from the center of the first condenser lens 141 to the center of the pinhole 143 h of the aperture member 143. If the ratio K ₁ / K ₂ is in the range of 0.9 / 1 to 1.1 / 1, it can be said that the diaphragm member 143 is disposed in the vicinity of the rear focal point of the first condenser lens 141. . If it is such a range, the laser beam condensed by the 1st condensing lens 141 can be narrowed down effectively.

The diaphragm member 143 is preferably disposed in the vicinity of the rear focal point of the first condenser lens 141, but the arrangement position of the diaphragm member 143 is not necessarily limited to this position. The arrangement position of the aperture member 143 may be on the optical path between the first condenser lens 141 and the collimator lens 145, and is not limited to the vicinity of the rear focal point of the first condenser lens 141.

Returning to FIG. 3, the moving mechanism 147 moves the first holding frame 142, the holding member 144, and the second holding frame 146 in a direction parallel to the traveling direction of the laser light, and the slider mechanism 148. Holding base 149 for holding.

For example, the first holding frame 142 and the holding member 144 are moved by moving the first holding frame 142 and the second holding frame 146 in a direction parallel to the traveling direction of the laser beam in a state where the holding member 144 is arranged at a fixed position. And the mutual positioning of the 2nd holding frame 146 is performed. Specifically, the diaphragm member 143 is disposed at the position of the front focal point of the collimating lens 145 and at the position of the rear focal point of the first condenser lens 141.

Referring back to FIG. 1, the scanner 105 scans the laser beam two-dimensionally in a plane parallel to the holding surface 101s (in the XY plane). That is, the scanner 105 moves the laser light relative to the tables 111 and 112 independently in the X direction and the Y direction. Thereby, it is possible to irradiate the laser beam with high accuracy to any position of the object 110 held on the tables 111 and 112.

The scanner 105 includes a first irradiation position adjustment device 151 and a second irradiation position adjustment device 154.

The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 constitute a scanning element that two-dimensionally scans the laser light emitted from the IOR 104 within a plane parallel to the holding surface 101s. As the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154, for example, a galvano scanner is used. The scanning element is not limited to a galvano scanner, and a gimbal can be used.

The first irradiation position adjusting device 151 includes a mirror 152 and an actuator 153 that adjusts the installation angle of the mirror 152. The actuator 153 has a rotation axis parallel to the Z direction. The actuator 153 rotates the mirror 152 around the Z axis based on the control of the control device 107.

The second irradiation position adjusting device 154 includes a mirror 155 and an actuator 156 that adjusts the installation angle of the mirror 155. The actuator 156 has a rotation axis parallel to the Y direction. The actuator 156 rotates the mirror 155 around the Y axis based on the control of the control device 107.

On the optical path between the scanner 105 and the table 111 or 112, a second condensing lens 108 that condenses the laser light passing through the scanner 105 toward the holding surface 101s is disposed.

For example, an fθ lens is used as the second condenser lens 108. Thereby, the laser beam emitted in parallel to the second condenser lens 108 from the mirror 155 can be condensed in parallel to the object 110. Here, the scanner 105 and the second condenser lens 108 correspond to a cutting unit described in the claims.

Note that the second condenser lens 108 may not be disposed on the optical path between the scanner 105 and the table 111 or the table 112. In this case, the scanner 105 corresponds to the cutting unit described in the claims.

The laser light L oscillated from the laser light oscillator 102 passes through the acousto-optic device 103, the IOR 104, the mirror 152, the mirror 155, and the second condenser lens 108, and is applied to the object 110 held on the table 111 or the table 112. Irradiated. The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 are irradiated from the laser light oscillator 102 toward the object 110 held on the table 111 or the table 112 based on the control of the control device 107. Adjust the laser beam irradiation position.

A laser beam processing region 105s (hereinafter referred to as a scan region) controlled by the scanner 105 is rectangular when viewed from the normal direction of the holding surface 101s. In the present embodiment, the area of the scan region 105s is smaller than the areas of the first holding surface 101s1 and the second holding surface 101s2.

5A to 5D are diagrams for explaining the operation of the EBS 130. FIG.
FIG. 5A shows a control signal for laser light oscillated from the laser light oscillator 102.
FIG. 5B shows the output characteristics of the laser light itself oscillated from the laser light oscillator 102, that is, the output characteristics of the laser light before the laser light oscillated from the laser light oscillator 102 passes through the acoustooptic device 103. Is shown.
FIG. 5C shows a control signal for the acousto-optic element 103.
FIG. 5D shows the output characteristics of the laser light after the laser light oscillated from the laser light oscillator 102 passes through the acoustooptic device 103.
In each of FIGS. 5B and 5D, the horizontal axis represents time, and the vertical axis represents the intensity of laser light.
FIGS. 6A to 6D are diagrams focusing on one pulse of laser light in FIGS. 5A to 5D.
In the following description, the “control signal for laser light oscillated from the laser light oscillator 102” is referred to as “control signal for laser light”. “Output characteristics of laser light before the laser light oscillated from the laser light oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light before passing through the acousto-optic element 103”. “Output characteristics of laser light after the laser light oscillated from the laser light oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light after passing through the acousto-optic element 103”.

As shown in FIG. 5A and FIG. 6A, the pulse Ps1 of the laser light control signal is a rectangular pulse. As shown in FIG. 5A, the laser light control signal is a so-called clock pulse that generates a plurality of pulses Ps1 by periodically switching the ON / OFF signal to the laser light oscillator 102.

In FIG. 5A and FIG. 6A, the peak portion of the pulse Ps1 is a state where an ON signal is sent to the laser light oscillator 102, that is, an ON state where laser light is oscillated from the laser light oscillator 102. It is. The valley portion of the pulse Ps1 is a state where an OFF signal is sent to the laser beam oscillator 102, that is, an OFF state where no laser beam is oscillated from the laser beam oscillator 102.

As shown in FIG. 5A, one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals. The three collective pulses PL1 are arranged at intervals longer than the arrangement interval of the three pulses Ps1. For example, the interval between two adjacent pulses Ps1 is 1 ms, and the interval between two adjacent collective pulses PL1 is 10 ms.

In the present embodiment, an example in which one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals is described, but the present invention is not limited to this. For example, one collective pulse may be formed by arranging a plurality of two or four or more pulses at short intervals.
Further, the configuration is not limited to the plurality of pulses being periodically formed, and one pulse may be formed with a long width. That is, a configuration in which laser light having a certain intensity from an ON signal to an OFF signal to the laser light oscillator is oscillated for a predetermined time may be employed.

As shown in FIG. 5B and FIG. 6B, the pulse Ps2 of the output characteristic of the laser light before passing through the acoustooptic device 103 is a waveform pulse having a rising portion G1 and a falling portion G2.

Here, the rising portion G1 means a portion of the pulse Ps2 in the period from when the intensity of the laser beam reaches zero to an intensity that contributes to the cutting of the object. The falling portion G2 means a portion in the period from the intensity at which the intensity of the laser light contributes to the cutting of the object to zero, among the pulses Ps2 of the output characteristics of the laser light. The intensity that contributes to the cutting of the object varies depending on the material and thickness of the object and the output value of the laser beam. As an example, as shown in FIG. 6B, 50% of the peak intensity (100%) of the laser beam. % Strength.

As shown in FIGS. 5B and 6B, the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2. That is, the time of the rising portion G1 of the laser light oscillated from the laser light oscillator 102 is longer than the time of the falling portion G2 of the laser light.
For example, the width of the rising portion G1 is 45 μs, and the width of the falling portion G2 is 25 μs.

In the present embodiment, an example is described in which the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2, but this is not limitative. For example, when the width of the rising portion G1 of the pulse Ps2 is substantially equal to the width of the falling portion G2, the present invention can be applied even when the width of the rising portion G1 of the pulse Ps2 is shorter than the width of the falling portion G2. is there.

As shown in FIG. 5 (b), one set pulse PL2 is formed by arranging the three pulses Ps2 at positions corresponding to the three pulses Ps1 shown in FIG. 6 (a). The three collective pulses PL2 are arranged at positions corresponding to the three collective pulses PL1 shown in FIG.

As shown in FIGS. 5 (c) and 6 (c), the control signal pulse Ps3 of the acoustooptic device 103 is a rectangular pulse. As shown in FIG. 5C, the control signal for the acousto-optic element 103 is periodically switched so that the timing at which the laser beam passes through the acousto-optic element 103 is periodically switched. This is a so-called clock pulse that generates a plurality of pulses Ps3.

5 (c) and 6 (c), the peak portion of the pulse Ps3 is in a state where the laser beam is transmitted, that is, a light transmitting state where the laser beam is transmitted. The valley portion of the pulse Ps3 is in a state where laser light is not passed, that is, in a light shielding state where the laser light is shielded.

As shown in FIG. 5C, the valley portions of the respective pulses Ps3 are arranged so as to overlap both the rising portion G1 and the falling portion G2 of each pulse Ps2 shown in FIG.

As shown in FIG. 6C, when focusing on one pulse Ps3, the width of the valley portion V1 on the front side of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the rear side of the pulse Ps3. The width of the valley portion V2 is substantially equal to the width of the falling portion of the pulse Ps2. For example, the width of the valley portion V1 on the front side of the pulse Ps3 is 45 μs, and the width of the valley portion V2 on the rear side of the pulse Ps3 is 25 μs. As described above, the EBS 130 has a switch function having a quick response characteristic.

As a result, the rising portion G1 and the falling portion G2 of the laser beam can be removed, and the portion of the laser beam output characteristic pulse Ps2 in which the intensity of the laser beam contributes to the cutting of the object can be selectively extracted. .

As a result, as shown in FIGS. 5D and 6D, the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic device 103 has no rising portion G1 and no falling portion G2, and is sharp. It becomes a pulse protruding to

In this embodiment, the width of the front valley portion V1 of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the width of the rear valley portion V2 of the pulse Ps3 is the rising edge of the pulse Ps2. Although an example that is substantially equal to the width of the falling portion is described, the present invention is not limited to this. For example, the width of the valley portion V1 on the front side of the pulse Ps3 is made substantially equal to the width of the rising portion G1 of the pulse Ps2, or the width of the valley portion V2 on the rear side of the pulse Ps3 is made larger than the width of the falling portion of the pulse Ps2. It can be appropriately adjusted as necessary, for example, by increasing the size.

FIG. 7 is a diagram for explaining the operation of the IOR 104.
The diagram on the left side of FIG. 7 shows the intensity distribution of the laser light before passing through the pinhole 143h. The upper left diagram in FIG. 7 is a plan view, the middle left diagram in FIG. 7 is a perspective view, and the lower left diagram in FIG. 7 is a diagram in which the horizontal axis indicates the position and the vertical axis indicates the strength.
The diagram on the right side of FIG. 7 shows the intensity distribution of the laser light after passing through the pinhole 143h. The upper right diagram in FIG. 7 is a plan view, the middle diagram in the right diagram in FIG. 7 is a perspective view, and the lower right diagram in FIG. 7 is a diagram in which the horizontal axis indicates the position and the vertical axis indicates the strength.

FIG. 8 is an enlarged view of a cut surface when a polarizing plate, which is an object, is cut using a laser beam irradiation apparatus according to a comparative example.
Here, the laser beam irradiation apparatus according to the comparative example is a laser beam irradiation apparatus that uses the laser beam before passing through the pinhole 143 h as it is, that is, a laser beam irradiation apparatus that does not include the IOR 104.

FIG. 9 is an enlarged view of a cut surface when a polarizing plate, which is an object, is cut using the laser beam irradiation apparatus 100 according to the present embodiment.

As shown on the left side of FIG. 7, the intensity distribution of the laser light before passing through the pinhole 143h is an intensity distribution having a high intensity at the center of the beam and a low intensity at the outer periphery of the beam. When the intensity of the laser beam at the outer periphery of the beam is reduced, the outer periphery of the beam does not contribute to the cutting of the object.

In this case, as shown in FIG. 8, in the laser beam irradiation apparatus according to the comparative example, it is confirmed that the cut surface of the polarizing plate has a tapered shape. This is considered to be due to the fact that when the polarizing plate was cut, the outer peripheral portion of the laser beam diameter affected the portion along the cut line, thereby dissolving the portion other than the polarizing plate cut region. .

On the other hand, as shown in the diagram on the right side of FIG. 7, the intensity distribution of the laser light after passing through the pinhole 143h is removed from the tail part that does not contribute to the cutting of the polarizing plate in the intensity distribution of the laser light. As a result, the intensity distribution of the laser light becomes an ideal Gaussian distribution. The half width of the intensity distribution of the laser light after passing through the pinhole 143h is narrower than the half width of the intensity distribution of the laser light before passing through the pinhole 143h.

In this case, as shown in FIG. 9, in the laser beam irradiation apparatus 100 including the IOR 104 according to this embodiment, it is confirmed that the cut surface of the polarizing plate is perpendicular to the holding surface. This is because when the polarizing plate is cut, the portion of the laser light intensity distribution that contributes to the cutting of the polarizing plate is irradiated to the polarizing plate, so that the cut region of the polarizing plate can be selectively fused. Conceivable.

Referring back to FIG. 1, the moving device 106 moves the tables 111 and 112 and the scanner 105 relatively. The moving device 106 includes a first slider mechanism 161, a second slider mechanism 162, and a third slider mechanism 163. The first slider mechanism 161 is for moving the table 111 in a first direction (X direction) parallel to the holding surface 111s. The second slider mechanism 162 is for moving the table 112 in a first direction (X direction) parallel to the holding surface 112s. The third slider mechanism 163 is for moving the first slider mechanism 161 and the second slider mechanism 162 in a second direction (Y direction) parallel to the holding

surfaces

111 s and 112 s and perpendicular to the first direction. .

Based on such a configuration, the moving device 106 includes a first slider mechanism 161, a second slider mechanism 162, and a third slider mechanism 163 (hereinafter, these may be collectively referred to as

slider mechanisms

161, 162, and 163). It is possible to move the tables 111 and 112 in each direction of XY by operating a linear motor (not shown) incorporated in each of the above.

The linear motor that is pulse-driven in the

slider mechanisms

161, 162, and 163 can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Accordingly, the positions of the tables 111 and 112 supported by the

slider mechanisms

161, 162, and 163 in the XY directions can be controlled with high accuracy. The position control of the tables 111 and 112 is not limited to the position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.

The control device 107 includes a laser control unit 171 that controls the laser light oscillator 102 and the acoustooptic device 103 (drive driver 131), a scanner control unit 172 that controls the scanner 105, and a slider control unit 173 that controls the moving device 106. And having.

Specifically, the laser controller 171 turns on / off the laser beam oscillator 102, the output of the laser beam oscillated from the laser beam oscillator 102, and the laser beam L oscillated from the laser beam oscillator 102 is acousto-optic. The timing of passing through the element 103 and the drive driver 131 are controlled.
The scanner control unit 172 controls driving of the actuator 153 of the first irradiation position adjustment device 151 and the actuator 156 of the second irradiation position adjustment device 154.
The slider control unit 173 controls the operation of the linear motor incorporated in each of the

slider mechanisms

161, 162, and 163.

FIG. 10 is a diagram illustrating a configuration of a control system of the laser light irradiation apparatus 100.
As shown in FIG. 10, an input device 109 capable of inputting an input signal is connected to the control device 107. The input device 109 includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. The control device 107 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the laser light irradiation device 100, or may be connected to the display device.

When the initial setting is completed by the user inputting processing data to the input device 109, laser light is oscillated from the laser light oscillator 102 based on the control of the laser control unit 171 of the control device 107. At this time, based on the control of the scanner control unit 172 of the control device 107, rotation driving of the mirrors constituting the scanner 105 is started. At the same time, based on the control of the slider control unit 173 of the control device 107, the rotational speed of a drive shaft such as a motor provided in the

slider mechanisms

161, 162, and 163 is detected by a sensor such as a rotary encoder.

The control device 107 corrects each coordinate value in real time so that the laser light is emitted at coordinates that match the machining data, that is, the laser light draws a desired locus on the object 110 (see FIG. 1). Thus, the moving device 106 and the scanner 105 are controlled. For example, the scanning of the laser light is mainly performed by the moving device 106, and an area where the irradiation position of the laser light cannot be accurately controlled by the moving device 106 is adjusted by the scanner 105.

FIG. 11 is a diagram for explaining the operation of the tables 111 and 112 by the moving device 106.
As shown in FIG. 11, the table 111 includes a third slider mechanism between a first standby position (first position) WP1 and a cutting position WP3 where laser beam cutting is performed under the control of the scanner 105. 163 moves along the second direction (Y direction). Here, the first standby position WP1 refers to the carry-in standby position when carrying the object 110 to be cut from the outside onto the holding surface 111s of the table 111, or the object 110 to which the cutting process has been applied. It also serves as an unloading standby position for unloading from the holding surface 111s.

Further, the table 112 is moved along the second direction (Y direction) by the third slider mechanism 163 between the second standby position (second position) WP2 and the cutting position WP3. Here, the second standby position WP2 refers to the carry-in standby position when carrying the object 110 to be cut from the outside onto the holding surface 112s of the table 112, or the object 110 to which the cutting process has been performed. It also serves as an unloading standby position for unloading from the holding surface 112s.

The cutting position WP3 is a state in which at least a part of the object 110 held on the holding surfaces 111s and 112s and at least a part of the scan area 105s by the scanner 105 overlap when viewed in plan from the Z direction. The positions of the tables 111 and 112 in the second direction (Y direction).

Based on such a configuration, the table 111 has two objects 110 carried into the holding surface 111s (the first holding surface 111s1 and the second holding surface 111s2) at the first standby position WP1 as shown in FIG. Thereafter, the two objects 110 held on the holding surface 111s are moved to the cutting position WP3.

The table 111 moves the object 110 that has been subjected to the predetermined cutting process at the cutting position WP3 to the first standby position WP1, and then carries the object 110 to the outside at the first standby position WP1.

Similarly, as shown in FIG. 11, after the two objects 110 are carried into the holding surface 112s (the first holding surface 112s1 and the second holding surface 112s2) at the second standby position WP2, the table 112 holds the holding surface. The two objects 110 held at 112s are moved to the cutting position WP3.

The table 112 moves the object 110 that has been subjected to the predetermined cutting process at the cutting position WP3 to the second standby position WP2, and then carries the object 110 to the outside at the second standby position WP2.

In the present embodiment, the first standby position WP1, the second standby position WP2, and the cutting position WP3 are arranged on the same straight line in the second direction (Y direction).

In the present embodiment, the second standby position WP2 and the first standby position WP1 are in a relationship in which they face each other via the cutting position WP3 in the second direction (Y direction). Therefore, the movement directions of the tables 111 and 112 toward the cutting position WP3 are opposite to each other. As shown in FIG. 11, the operating range A1 of the table 111 and the operating range A2 of the table 112 are equal at the cutting position WP3. The parts are overlapped (overlapped).

In this embodiment, the cutting process by the laser beam irradiation apparatus 100 includes a first cutting process and a second cutting process. The first cutting step is a step of moving the object 110 carried in at the first standby position WP1 to the cutting position WP3 and carrying it out from the first standby position WP1 after a predetermined cutting process. The second cutting step is a step of moving the object 110 carried in at the second standby position WP2 to the cutting position WP3 and carrying it out from the second standby position WP2 after the cutting process.

The cutting process (first cutting process) using the table 111 includes a first carry-in step for carrying the object 110 at the first standby position WP1, and the object 110 carried at the first standby position WP1 at the cutting position. A first forward movement step of moving to WP3, a first cutting step of performing a predetermined cutting process at the cutting position WP3, and after the first cutting processing step, the object 110 is moved from the cutting position WP3 to the first cutting step. A first return movement step of moving to the standby position WP1, and a first unloading step of unloading the object 110 from the first standby position WP1 after the first return path movement step.

Similarly, the cutting process (second cutting process) using the table 112 includes a second carry-in step of carrying in the object 110 at the second standby position WP2, and an object 110 carried in at the second standby position WP2. After the second forward movement step of moving to the cutting position WP3, the second cutting step of performing a predetermined cutting process at the cutting position WP3, and the second cutting process step, the object 110 is moved from the cutting position WP3. A second return path movement step of moving to the second standby position WP2, and a second unloading step of unloading the object 110 from the second standby position WP2 after the second return path movement step.

FIG. 12 is a diagram showing an operation flow of a cutting process using the table 111 as a cutting process by the laser beam irradiation apparatus 100. FIG. 13 is a diagram conceptually showing the operation of the cutting process using the table 111. 12 and 13, since the basic operation of the cutting process using the table 112 is the same, the cutting process using the table 111 will be described as an example, and the details of the operation of the table 112 will be omitted. .

First, the table 111 carries the object 110 from the carry-in device 115 (see FIGS. 11 and 13) at the first standby position WP1 (carry-in step (first carry-in step or second carry-in step) S1 shown in FIG. 12). Note that the carry-in device 115 may be a part of the constituent elements of the laser light irradiation apparatus 100 or may be a part of the constituent elements of the apparatus other than the laser light irradiation apparatus 100.

In the present embodiment, before the table 111 moves from the first standby position WP1 to the cutting position WP3, the relative position of the object 110 with respect to the cutting position WP3 is detected, and the relative position is corrected based on the detection result. Is performed (alignment step (detection step) S2 shown in FIG. 12).

After the alignment, the table 111 moves the object 110 carried in at the first standby position WP1 to the cutting position WP3 (cutting position moving step (first outward moving step or second outward moving step) S3 shown in FIG. 12). .

After the movement to the cutting position WP3, a predetermined cutting process as described later is performed on the object 110 on the holding surface 111s (cutting step (first cutting step or second cutting step) S4 shown in FIG. 12).

After the cutting process, the table 111 moves to the first standby position WP1 where the object 110 subjected to the cutting process is carried out by the carry-out device 116 (see FIGS. 11 and 13) (unloading position moving step (first step shown in FIG. 12). 1 return path moving step or 2nd return path moving step) S5). The carry-out device 116 may be a part of the constituent elements of the laser light irradiation apparatus 100 or may be a part of the constituent elements of the apparatus other than the laser light irradiation apparatus 100.

After moving to the first standby position WP1, the object 110 is unloaded from the holding surface 111s of the table 111 by the unloading device 116 (unloading step (first unloading step or second unloading step) S6 shown in FIG. 12).

In the carry-in step S1, as shown in FIG. 13A, the carry-in device 115 carries the object 110 onto the holding surface 111s of the table 111 at the first standby position WP1. The carry-in device 115 includes a carry-in conveyor unit 115b and a holding unit 115a that sucks and holds the object 110 on the carry-in conveyor unit 115b. The holding part 115a can be transferred to the holding surface 111s (the first holding surface 111s1 and the second holding surface 111s2) while holding the two objects 110 at the same time. The carry-in conveyor unit 115b is configured by, for example, a belt conveyor.

After the carry-in step S1, in the alignment step S2, as shown in FIG. 13B, prior to moving from the first standby position WP1 to the cutting position WP3, the object detection device (detection unit) 117 is operated by the object 110. Is detected. The object detection device 117 includes a detection camera 117a that images the object 110, and detects the relative position of the object 110 with respect to the cutting position WP3 using the detection camera 117a.

Note that the alignment step S2 is not necessarily required, for example, when the accuracy of carrying in the holding surface 111s by the carry-in device 115 is extremely high, and may be omitted. According to this, the object detection device 117 is not necessary. As a result, simplification of the device configuration and cost reduction can be realized. Further, the alignment step S2 may be provided only in one of the first cutting step by the table 111 and the second cutting step by the table 112.

First, the detection camera 117a detects the object 110 held on the first holding surface 111s1 on the cutting position WP3 side in the holding surface 111s. The object detection device 117 transmits the detection result of the detection camera 117a to the control device 107 (see FIG. 10). Based on the detection result from the detection camera 117a, the control device 107 performs an alignment process for correcting the position of the object 110 when the object 110 is displaced from the cutting position WP3 (scanner 105).

The control device 107 drives the position correction unit to correct the position of the object 110 held on the holding surface 111s. The position correction unit corrects the position of the object 110 held on the holding surface 111s by bringing a plurality of pins into contact with at least three side surfaces of the object 110, for example. When correcting the position of the object 110, the table 111 stops moving.

After the alignment of the object 110 held on the first holding surface 111s1 on the cutting position WP3 side is completed, the table 111 is moved to the cutting position WP3 side. The detection camera 117a detects the object 110 held on the second holding surface 111s2 opposite to the cutting position WP3, and transmits the detection result to the control device 107.

The control device 107 performs alignment processing for correcting the position of the object 110 when the object 110 is displaced from the cutting position WP3 (scanner 105) based on the detection result from the detection camera 117a. Similarly, the control device 107 drives a position correction unit (not shown) to correct the position of the object 110 held on the second holding surface 111s2.

In the present embodiment, the case where the alignment step S2 is performed when the table 111 is located at the first standby position WP1 is described as an example, but the present invention is not limited to this.
The alignment step S2 may be performed halfway until the table 111 moves from the first standby position WP1 to the cutting position WP3.

After the alignment step S2, in the cutting position moving step S3, the table 111 is moved to the cutting position WP3 as shown in FIG. Thereafter, in the cutting step S4, a predetermined cutting process as described later is performed on the object 110 on the holding surface 111s by irradiating the laser beam through the scanner 105. In the cutting step S4, the table 111 moves so that the cutting process is performed in the order of the object 110 held on the first holding surface 111s1 and the object 110 held on the second holding surface 111s2.

After the cutting step S4, in the unloading position moving step S5, the table 111 moves to the first standby position WP1 as shown in FIG. 13 (d).

Thereafter, in the unloading step S6, as shown in FIG. 13 (e), the unloading device 116 unloads the object 110 from the holding surface 111s of the table 111 at the first standby position WP1. The carry-out device 116 includes a holding unit 116a that sucks, holds, and conveys the object 110, and a receiving unit 116b that receives the object 110 carried out from the holding surface 111s by the holding unit 116a. The holding unit 116a can be carried out from the holding surface 111s (the first holding surface 111s1 and the second holding surface 111s2) while holding the two objects 110 at the same time. The receiving unit 116b is configured by a belt conveyor or the like, for example, and can transport the object 110 received from the holding unit 116a in a predetermined direction.

FIG. 14 is a diagram showing an outline of the entire operation in the cutting process of the laser beam irradiation apparatus 100. In FIG. 14, numbers (# 1, # 2, # 3, # 4) given to the object 110 mean an example of the order in which the cutting process is performed. Further, in FIG. 14, the object 110 to be subjected to the first cutting process is the object 110a, the object 110 to be subjected to the second cutting process is the object 110b, and the third cutting process is performed. The target object 110 to be processed is the target object 110c, and the target object 110 to be subjected to the fourth cutting process is the target object 110d.

As shown in FIG. 14, the laser beam irradiation apparatus 100 cuts the

objects

110a and 110b carried into the holding surface 111s of the table 111 from the carry-in device 115 at the first standby position WP1 according to the procedure described in FIGS. A predetermined cutting process is performed at the position WP3. Thereafter, the material is unloaded from the holding surface 111s to the unloading device 116 at the first standby position WP1. Thereby, a series of cutting processes (first cutting process) by moving the table 111 between the first standby position WP1 and the cutting position WP3 is completed. That is, while moving the table 111 between the first standby position WP1 and the cutting position WP3, the laser beam irradiation apparatus 100 carries in the loading step S1, the alignment step S2, the cutting position moving step S3, the cutting step S4, and the unloading position moving step. S5 and carry-out step S6 are performed in this order.

Subsequently, similarly to the procedure described in FIGS. 12 and 13, the laser beam irradiation apparatus 100 moves the

objects

110c and 110d carried into the holding surface 112s of the table 112 from the carry-in device 115 to the cutting position WP3 at the second standby position WP2. Then, a predetermined cutting process is performed. Then, it is carried out from the holding surface 112s to the carry-out device 116 at the second standby position WP2. Thereby, a series of cutting steps (second cutting step) by the table 112 moving between the first standby position WP1 and the cutting position WP3 is completed. That is, while moving the table 112 between the second standby position WP2 and the cutting position WP3, the laser beam irradiation apparatus 100 carries in the loading step S1, the alignment step S2, the cutting position moving step S3, the cutting step S4, and the unloading position moving step. S5 and carry-out step S6 are performed in this order.

In this embodiment, the laser beam irradiation apparatus 100 performs the first cutting step by the table 111 and the second cutting step by the table 112 at the cutting position WP3, the first cutting step (cutting step S4 by the table 111) and the first The two cutting steps (cutting step S4 based on the table 112) are performed in a state in which a part of each process is overlapped so as to be alternately performed.

FIG. 15 is a diagram showing a flow of operations in each of the tables 111 and 112.
In the present embodiment, as shown in FIG. 15, the second cutting step by the table 112 is started while the first cutting step by the table 111 is being performed. Thereby, for example, at the timing when the cutting step S4 is performed at the cutting position WP3 in the first cutting process, the conveyance of the object 110 from the carry-in device 115 to the table 112 in the second cutting process is started. Further, the cutting position movement step (second forward movement step S3 by the table 112) of the second cutting process is started at the timing when the unloading step S6 is performed at the first standby position WP1 in the first cutting process.

The timing of starting the first cutting step by the table 111 and the second cutting step by the table 112 is the timing at which one of the table 111 and the table 112 is performing the cutting step S4 at the cutting position WP3, and the other table is cutting. Any timing may be used as long as it does not move to the position WP3.
For example, the table 112 may be moved to the cutting position WP3 in the second cutting step at the timing when the table 111 starts moving from the cutting position WP3 in the first cutting step. That is, the timing for carrying in the object 110 with respect to the table 111 and the timing for carrying out the object 110 from the table 112 may be synchronized. In this way, since the tables 111 and 112 are sequentially moved to the cutting position WP3, the cutting process can be efficiently performed on the object 110 on the holding surfaces 111s and 112s of the tables 111 and 112. .

In the above description, the case where the carry-in device 115 and the carry-out device 116 each have the holding

units

115a and 116a is taken as an example, but the present invention is not limited to this.

For example, as shown in FIG. 16, a common holding unit 118 may be provided between the carry-in device 115 and the carry-out device 116. In this case, the holding unit 118 sucks and holds the object 110 from the carry-in conveyor unit 115b of the carry-in device 115, and holds the holding surface 111s of the table 111 at the first standby position WP1, or the table 112 at the second standby position WP2. The object 110 is sucked and held from the holding surface 112s.

The holding unit 118 moves in the first direction (X direction) while holding the object 110 to carry the object 110 held by the carry-in conveyor unit 115b into the table 111 or the table 112. The object 110 that has been subjected to the cutting process can be carried out from the holding surface 111 s of the table 111 or the holding surface 112 s of the table 112 to the receiving unit 116 b of the carry-out device 116. Thus, the first cutting step is executed in synchronization with the first carry-in step and the first carry-out step at the first standby position WP1, and the second cutting step is carried out at the second standby position WP2 The second carry-out step will be executed synchronously. That is, it is possible to simultaneously carry in and carry out the object 110 with respect to the tables 111 and 112.

Thereby, since the target object 110 can be efficiently supplied to the cutting position WP3, the time (tact time) required for a series of cutting processes of the laser light irradiation apparatus 100 can be shortened, and the production amount can be increased. Can do.

As described above, according to the laser beam irradiation apparatus 100 according to the present embodiment, since the two tables 111 and 112 are provided, the object 110 can be sequentially conveyed to the cutting position WP3. Since the first standby position WP1 and the second standby position WP2 which are the starting points of the movement of the tables 111 and 112 serve as both the carry-in position where the object 110 is carried in and the carry-out position where the object 110 is carried out, the table 111 , 112 can be reduced. Thereby, the laser beam irradiation apparatus 100 can perform the cutting process with respect to the target object 110 efficiently, and can increase a processing amount.

In the present embodiment, the tables 111 and 112 employ a configuration in which a plurality of (two in this embodiment) objects 110 are held on the holding surfaces 111s and 112s, respectively. Therefore, a plurality of objects 110 can be sequentially supplied to the cutting position WP3. Therefore, the cutting process with respect to the target object 110 can be performed efficiently, and the amount of processing can be increased.

In the present embodiment, the first standby position WP1, the second standby position WP2, and the cutting position WP3 to which the table 111 or the table 112 moves are arranged on the same straight line. Further, the first standby position WP1 and the second standby position WP2 are respectively arranged on the opposite sides with respect to the cutting position WP3 (see FIG. 11). Therefore, the operation range A1 of the table 111 and the operation range A2 of the table 112 can be partially overlapped (overlapped) at the cutting position WP3. Therefore, since the moving stroke between the cutting position WP3 and the standby positions WP1 and WP2 in the tables 111 and 112 is shortened, the object 110 is transported to the cutting position WP3 in a short time, and the cutting process for the object 110 is performed. The amount of processing can be increased by efficiently performing the above.

Moreover, in this embodiment, the target object detection apparatus 117 which detects the relative position of the target object 110 with respect to the cutting position WP3 is provided. Therefore, the object 110 can be accurately conveyed with respect to the cutting position WP3. Therefore, the cutting process can be performed with high accuracy.

In the present embodiment, the first cutting step (cutting step S4 by the table 111) and the second cutting step (cutting step S4 by the table 112) are alternately performed at the cutting position WP3. Since the process is executed in a state where the parts overlap, the object 110 can be efficiently supplied to the cutting position WP3.

Moreover, according to this embodiment, the target object 110 can be cut | disconnected sharply and the fall of cut quality can be suppressed. In general, the optical path of a laser beam becomes long when the cutting range is widened. If it does so, the beam diameter of a laser beam will change, Thereby, the outer peripheral part of a beam diameter will be distorted, and cut quality will change.
On the other hand, according to the laser beam irradiation apparatus 100 according to the present embodiment, the laser beam incident by the first condenser lens 141 is collected and the outer peripheral portion of the beam diameter of the laser beam collected by the pinhole 143h. And the collimating lens 145 can collimate the laser light from which the outer periphery of the beam diameter has been removed. Therefore, even if the optical path of the laser beam becomes long, the cut quality can be maintained.

In addition, since the aperture member 143 is disposed in the vicinity of the rear focal point of the first condenser lens 141, the laser beam passes through the pinhole 143h in a sufficiently condensed state. Therefore, the skirt portion that does not contribute to the cutting of the object 110 in the intensity distribution of the laser light can be removed with high accuracy.

Further, the second condenser lens 108 is disposed on the optical path between the scanner 105 and the tables 111 and 112. Therefore, it is possible to collect the laser light that has passed through the scanner 105 in parallel with the object 110. Therefore, the object 110 can be cut with high accuracy.

Further, in the laser beam irradiation apparatus 100 of the present embodiment, the scanning of the laser beam is mainly performed by the moving device 106, and an area where the irradiation position of the laser beam cannot be accurately controlled by the moving device 106 is adjusted by the scanner 105. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.

In the present embodiment, as an example, the laser beam irradiation apparatus 100 includes the tables 111 and 112, the laser beam oscillator 102, the first condenser lens 141, the aperture member 143, the collimator lens 145, and the scanner 105. However, the present invention is not limited to this. For example, the laser beam irradiation apparatus may include a laser beam oscillator, a condenser lens, a diaphragm member, and a collimator lens. That is, the laser light irradiation device may be configured not to include a table, a scanner, and a moving device.

(Manufacturing device for optical member bonded body)
Hereinafter, the film bonding system 1 which is a manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention is demonstrated with reference to drawings. The film bonding system 1 which concerns on this embodiment is comprised by the laser beam irradiation apparatus 100 which the cutting device mentioned above.

FIG. 17 is a diagram illustrating a schematic configuration of the film bonding system 1 of the present embodiment.
The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, an antireflection film, and a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.

In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the transport direction of the liquid crystal panel, which is an optical display component, is the X direction, and the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

As shown in FIG. 17, the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by the control part 40 as an electronic control apparatus.

FIG. 18 is a plan view of the liquid crystal panel P as viewed from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 that has a rectangular shape in plan view, a second substrate P2 that has a relatively small rectangular shape that is disposed to face the first substrate P1, a first substrate P1, and a second substrate. And a liquid crystal layer P3 sealed between the substrate P2. The liquid crystal panel P has a rectangular shape that follows the outer shape of the first substrate P1 in a plan view, and a region that fits inside the outer periphery of the liquid crystal layer P3 in a plan view is a display region P4.

FIG. 19 is a cross-sectional view taken along the line AA in FIG. On the front and back surfaces of the liquid crystal panel P, a first optical member cut out from the first optical sheet F1 and the second optical sheet F2 having a long strip shape (see FIG. 17, hereinafter may be collectively referred to as an optical sheet FX). F11 and the second optical member F12 (hereinafter may be collectively referred to as an optical member F1X) are appropriately bonded. In the present embodiment, the first optical member F11 and the second optical member F12 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively.

Outside the display area P4, a frame portion G having a predetermined width for arranging a sealant or the like for joining the first and second substrates of the liquid crystal panel P is provided.

In addition, the 1st optical member F11 and the 2nd optical member F12 are the 1st sheet piece F1m and 2nd sheet piece F2m (henceforth a sheet piece FXm hereafter) mentioned later, respectively. It is formed by cutting off the excess part on the outside. The bonding surface will be described later.

FIG. 20 is a partial cross-sectional view of the optical sheet FX bonded to the liquid crystal panel P. The optical sheet FX includes a film-like optical member main body F1a, an adhesive layer F2a provided on one surface (upper surface in FIG. 20) of the optical member main body F1a, and one optical member main body F1a via the adhesive layer F2a. Separator F3a laminated | stacked on the surface so that isolation | separation was possible, and the surface protection film F4a laminated | stacked on the other surface (FIG. 20 lower surface) of the optical member main body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and its peripheral area. For convenience of illustration, hatching of each layer in FIG. 20 is omitted.

The optical member body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface thereof. Hereinafter, the part remove | excluding the separator F3a from the optical sheet FX is called the bonding sheet | seat F5.

The separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical sheet FX may be configured not to include the surface protective film F4a, or the surface protective film F4a may be configured not to be separated from the optical member body F1a.

The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. And a second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

The optical member body F1a may have a single-layer structure composed of a single optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancement film, or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.
As shown in FIG. 17, the film laminating system 1 of the present embodiment is arranged such that the right side of the liquid crystal panel P in the drawing direction (+ X direction side) to the left side of the drawing in the drawing direction of the liquid crystal panel P (− X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.

The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary. On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P <b> 4 is along the transport direction. On the other hand, on the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P <b> 4 along the transport direction. On the front and back surfaces of the liquid crystal panel P, a sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical sheet FX is bonded.

The upstream conveyor 6 includes an independent free roller conveyor 24 on the downstream side in the first suction device 11 described later. On the other hand, the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.

The film bonding system 1 of this embodiment is the 1st adsorption | suction apparatus 11, the 1st dust collector 12, the 1st bonding apparatus 13, the 1st detection apparatus 41, the 1st cutting device 31, the inversion apparatus 15, and 2nd collection. The dust device 16, the 2nd bonding apparatus 17, the 2nd detection apparatus 42, the 2nd cutting device 32, and the control part 40 are provided.

The first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P. The first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

The panel holding unit 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P. The panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P. When the conveyance is finished, the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.

In the alignment camera 11b, the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state. Image data obtained by the alignment camera 11b is transmitted to the control unit 40. Based on the image data, the panel holding unit 11a is operated to align the liquid crystal panel P with the free roller conveyor 24 as a transport destination. In other words, the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the shift in the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the turning direction about the vertical axis of the liquid crystal panel P. .
Here, the liquid crystal panel P conveyed on the rail R by the panel holding unit 11a is nipped by the pressure roll 23 together with the sheet piece FXm while being adsorbed by the adsorption pad 26.

The 1st dust collector 12 is provided in the conveyance upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13. FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.

The 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption | suction apparatus 11. FIG. The 1st bonding apparatus 13 bonds the bonding sheet | seat F5 (equivalent to 1st sheet piece F1m) cut into the predetermined size with respect to the lower surface of liquid crystal panel P introduced into the bonding position.

The 1st bonding apparatus 13 is provided with the conveying apparatus 22 and the pinching roll 23. FIG.

The conveying device 22 conveys the optical sheet FX along the longitudinal direction while unwinding the optical sheet FX from the original roll R1 around which the optical sheet FX is wound. The conveying apparatus 22 conveys the bonding sheet | seat F5 by using separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding unit 22a holds the original roll R1 around which the belt-shaped optical sheet FX is wound and feeds the optical sheet FX along the longitudinal direction thereof.
The plurality of guide rollers 22b wind the optical sheet FX so as to guide the optical sheet FX unwound from the original roll R1 along a predetermined conveyance path.
The cutting device 22c performs a half cut on the optical sheet FX on the conveyance path.
The knife edge 22d supplies the bonding sheet F5 to the bonding position while separating the bonding sheet F5 from the separator F3a by winding the optical sheet FX subjected to the half cut at an acute angle.
The winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.

The roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example. Thereby, the winding unit 22e winds the separator F3a having passed through the knife edge 22d while the roll holding unit 22a feeds the optical sheet FX in the transport direction. Hereinafter, the upstream side in the transport direction of the optical sheet FX (separator F3a) in the transport device 22 is referred to as a sheet transport upstream side, and the downstream side in the transport direction is referred to as a sheet transport downstream side.

Each guide roller 22b changes the traveling direction of the optical sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b is movable so as to adjust the tension of the optical sheet FX being conveyed.

It should be noted that a dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical sheet FX conveyed from the roll holding unit 22a while the optical sheet FX is cut by the cutting device 22c.

FIG. 21 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
As shown in FIG. 21, when the optical sheet FX is fed out by a predetermined length, the cutting device 22c applies a part in the thickness direction of the optical sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical sheet FX. Make a half-cut to cut. The cutting device 22c of the present embodiment is provided so as to be able to advance and retreat from the side opposite to the separator F3a with respect to the optical sheet FX toward the optical sheet FX.

The cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical sheet FX (so that a predetermined thickness remains in the separator F3a), Half-cut to the vicinity of the interface between the adhesive layer F2a and the separator F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

In the optical sheet FX after the half cut, the optical member main body F1a and the surface protection film F4a are cut in the thickness direction, thereby forming cut lines L1 and L2 extending over the entire width in the width direction of the optical sheet FX. . The cut lines L1 and L2 are formed so as to be aligned in the longitudinal direction of the belt-shaped optical sheet FX. For example, in the case of the bonding process which conveys the liquid crystal panel P of the same size, the plurality of cut lines L1 and L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX. The optical sheet FX is divided into a plurality of sections in the longitudinal direction by a plurality of cut lines L1, L2. A section sandwiched between a pair of cutting lines L1 and L2 adjacent in the longitudinal direction in the optical sheet FX is a sheet piece FXm in the bonding sheet F5. The sheet piece FXm is a sheet piece of the optical sheet FX having a size that protrudes outside the liquid crystal panel P.

Referring back to FIG. 17, the knife edge 22d is disposed below the upstream conveyor 6 and extends at least over its entire width in the width direction of the optical sheet FX. The knife edge 22d is wound so as to be in sliding contact with the separator F3a side of the optical sheet FX after the half cut.

The knife edge 22d is seen from the width direction of the optical sheet FX above the first surface, and the first surface arranged in an inclined position when viewed from the width direction of the optical sheet FX (width direction of the upstream conveyor 6). It has the 2nd surface arrange | positioned at an acute angle with respect to a 1st surface, and the front-end | tip part where a 1st surface and a 2nd surface cross.

In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical sheet F1 to an acute angle at the front-end | tip part. The first optical sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d is introduced between the pair of bonding rollers 23a of the pinching roll 23 while overlapping the lower surface of the liquid crystal panel P in a state of being sucked by the first suction device 11. Is done. The first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size that protrudes outside the liquid crystal panel P.

On the other hand, the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d. The winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.

The pinching roll 23 bonds the first sheet piece F1m separated from the first optical sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6. Here, the pinching roll 23 is equivalent to the bonding apparatus as described in a claim.

The pinching roll 23 has a pair of

bonding rollers

23a and 23a arranged in parallel with each other in the axial direction (the upper bonding roller 23a moves up and down). A predetermined gap is formed between the pair of

bonding rollers

23 a and 23 a, and the inside of this gap is the bonding position of the first bonding apparatus 13.

In the gap, the liquid crystal panel P and the first sheet piece F1m are overlapped and introduced. These liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being clamped by each bonding roller 23a. In this embodiment, 1st optical member bonding body PA1 (sheet piece bonding body) is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG. .

The 1st detection apparatus 41 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m.

FIG. 22 is a plan view showing a step of detecting the edge ED of the first bonding surface SA1.
For example, as illustrated in FIG. 22, the first detection device 41 detects the edge ED of the first bonding surface SA <b> 1 in the four inspection areas CA installed on the transport path of the upstream conveyor 6. Each inspection area | region CA is arrange | positioned in the position corresponding to four corner | angular parts of 1st bonding surface SA1 which has a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The data of the edge ED detected by the first detection device 41 is stored in a storage unit (not shown).

Note that the arrangement position of the inspection area CA is not limited to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1.

FIG. 23 is a schematic diagram of the first detection device 41.
In FIG. 23, for the sake of convenience, the configuration of the first detection device 41 is shown upside down with the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded as the upper side.

As shown in FIG. 23, the 1st detection apparatus 41 is the illumination light source 44 which illuminates edge ED, and 1st bonding surface SA1 rather than edge ED with respect to the normal line direction of 1st bonding surface SA1. The image pickup device 43 is disposed at a position inclined inward and picks up an image of the edge ED from the side where the first sheet piece F1m of the first optical member bonding body PA1 is bonded.

The illumination light source 44 and the imaging device 43 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.

An angle θ between the normal line of the first bonding surface SA1 and the normal line of the image pickup surface 43a of the image pickup device 43 (hereinafter referred to as an inclination angle θ of the image pickup device 43) is divided into panels within the image pickup field of the image pickup device 43. It is preferable to set so that time lag, burrs and the like do not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle θ of the imaging device 43 is such that the edge of the second substrate P2 enters the imaging field of the imaging device 43. Set to not.

The inclination angle θ of the imaging device 43 is set to match the distance H (hereinafter referred to as the height H of the imaging device 43) between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43. It is preferred that For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 is preferably set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 43 and the inclination angle θ of the imaging device 43 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10 °.

The illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.

In addition, the illumination light source 44 and the imaging device 43 may be arrange | positioned so that a movement is possible along the edge ED of 1st bonding surface SA1. In this case, the illumination light source 44 and the imaging device 43 should each be provided one each. Thereby, the illumination light source 44 and the imaging device 43 can be moved to a position where the edge ED of the first bonding surface SA1 can be easily imaged.

The illumination light source 44 is arrange | positioned on the opposite side to the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded. The illumination light source 44 is arrange | positioned in the position which inclined outside the 1st bonding surface SA1 rather than the edge ED with respect to the normal line direction of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.

In addition, the illumination light source may be arrange | positioned at the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded.

Further, the optical axis of the illumination light source 44 and the normal line of the image pickup surface 43a of the image pickup device 43 may slightly cross each other.

The cutting position of the first sheet piece F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control part 40 (refer FIG. 17) acquires the data of the edge ED of 1st bonding surface SA1 memorize | stored in the memory | storage part, and the 1st optical member F11 is outside the liquid crystal panel P (1st bonding surface SA1). The cutting position of the first sheet piece F1m is determined so as not to protrude beyond the outer side. The first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control unit 40.

Returning to FIG. 17, the first cutting device 31 is provided on the downstream side of the panel conveyance from the first detection device 41. The 1st cutting device 31 performs the laser cut along edge ED, and is the 1st sheet piece F1m (1st sheet | seat) of the part which protruded outside 1st bonding surface SA1 from 1st optical member bonding body PA1. The surplus portion of the piece F1m) is cut off, and an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1 is formed. Here, the 1st cutting device 31 is corresponded to the cutting device as described in a claim. That is, the 1st cutting device 31 makes the 1st sheet piece F1m the target object 110, cuts off the excess part of this 1st sheet piece F1m, and the optical member (1st optical) of the magnitude | size corresponding to 1st bonding surface SA1. A cutting process for forming the member F11) is performed.

Here, “the size corresponding to the first bonding surface SA1” indicates the size of the outer shape of the first substrate P1. However, it includes a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and that avoids a functional part such as an electrical component mounting portion.

The first optical member F11 is bonded to the surface on the backlight side of the liquid crystal panel P by cutting off the excess portion of the first sheet piece F1m from the first optical member bonding body PA1 by the first cutting device 31. Optical member bonding body PA2 is formed. The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

The reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.

The reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11. The reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.

The reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce | transduced into the bonding position of the 2nd bonding apparatus 17. FIG.

Since the second adsorption device 20 has the same configuration as the first adsorption device 11, the same parts are denoted by the same reference numerals and described. The 2nd adsorption | suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2. The second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2. Do. The panel holding | maintenance part 11a adsorbs and hold | maintains the upper surface of 2nd optical member bonding body PA2 contact | abutted to the stopper S by vacuum suction. The panel holding | maintenance part 11a moves on the rail R in the state which adsorbed and hold | maintained 2nd optical member bonding body PA2, and conveys 2nd optical member bonding body PA2. When the conveyance is finished, the panel holding unit 11a releases the suction holding and transfers the second optical member bonding body PA2 to the free roller conveyor 24.

The alignment camera 11b holds the second optical member bonding body PA2 in contact with the stopper S by the panel holding portion 11a, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state. Imaging data from the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with respect to the free roller conveyor 24 as the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.

The second dust collecting device 16 is arranged on the upstream side in the transport direction of the liquid crystal panel P with respect to the pinching roll 23 which is the bonding position of the second bonding device 17. The second dust collecting device 16 performs static electricity removal and dust collection in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side.

The 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16. FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position. Do. The 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13. FIG.

2nd optical member bonding body PA2 and 2nd sheet piece F2m are overlapped and introduce | transduced in the clearance gap (bonding position of the 2nd bonding apparatus 17) between a pair of bonding rollers 23a of the pinching roll 23. FIG. The second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

These 2nd optical member bonding body PA2 and the 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by each bonding roller 23a. In this embodiment, it is a 2nd sheet | seat on the surface (surface on the opposite side to the surface where the 1st optical member F11 of 2nd optical member bonding body PA2 was bonded) of the liquid crystal panel P by the pinching roll 23. By bonding the piece F2m, the third optical member bonding body PA3 is formed.

The 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

The cut position of the second sheet piece F2m is adjusted based on the detection result of the edge of the second bonding surface. The control part 40 (refer FIG. 17) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 2nd optical member F12 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the second sheet piece F2m is determined so as not to protrude. The second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control unit 40. Here, the 2nd cutting device 32 is corresponded to the cutting device as described in a claim.

The second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42. The 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) of the magnitude | size corresponding to a 2nd bonding surface is formed. That is, the 2nd cutting device 32 makes 2nd sheet piece F2m the target object 110, cuts off the excess part of this 2nd sheet piece F2m, and the optical member (2nd optical member) of the magnitude | size corresponding to a 2nd bonding surface. A cutting process for forming F12) is performed.

The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and The first optical member F11 is bonded to the backlight side surface of the liquid crystal panel P to form a fourth optical member bonded body PA4 (optical member bonded body). The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

Here, the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus 100 mentioned above. The 1st cutting device 31 and the 2nd cutting device 32 cut | disconnect endlessly the sheet piece FXm bonded by liquid crystal panel P along the outer periphery of the bonding surface.

A bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17. The bonding inspection apparatus is an inspection (not shown whether the position of the optical member F1X is appropriate (whether the position deviation is within the tolerance range)) by the inspection apparatus (not shown) of the workpiece (liquid crystal panel P) on which the film is bonded. Etc.). The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

In addition, in this embodiment, the control part 40 as an electronic control apparatus which performs overall control of each part of the film bonding system 1 is comprised including the computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk.

The control unit 40 of the present embodiment includes an interface capable of executing communication with an external device of the computer system. An input device that can input an input signal may be connected to the control unit 40. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control unit 40 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the film bonding system 1 or may be connected to the display device.

An operating system (OS) that controls the computer system is installed in the storage unit of the control unit 40. The storage unit of the control unit 40 includes a program that causes the arithmetic processing unit to control each unit of the film bonding system 1 to execute processing for causing each unit of the film bonding system 1 to accurately convey the optical sheet F. It is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each unit of the film bonding system 1.

The storage unit is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), and an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. The storage unit functionally includes the first adsorption device 11, the first dust collector 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the reversing device 15, and the second adsorption device 20. , Second dust collector 16, second bonding device 17, second detection device 42, storage area for storing program software in which the control procedure of the operation of second cutting device 32 is described, and other various storage areas are set Is done.

Hereinafter, an example of a method for determining the bonding position (relative bonding position) of the sheet piece FXm with respect to the liquid crystal panel P will be described with reference to FIG.

First, as shown in FIG. 24A, a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the direction of the optical axis of the optical sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical sheet FX is stored in a storage device (not shown) in association with the position of the optical sheet FX (position in the longitudinal direction and position in the width direction of the optical sheet FX).

The control unit 40 acquires the optical axis data (inspection data on the in-plane distribution of the optical axis) of each inspection point CP from the storage device, and partitions the optical sheet FX (cut line CL) into the portion where the sheet piece FXm is cut out. The direction of the average optical axis of the region to be detected is detected.

For example, as shown in FIG. 24B, an angle (deviation angle) formed between the direction of the optical axis and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest of the deviation angles (maximum) When the deviation angle is θmax and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is detected as the average deviation angle. To do. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical sheet FX is detected as the direction of the average optical axis of the optical sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical sheet FX and the clockwise direction being negative.

And the direction of the average optical axis of the optical sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis of the optical sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

The first cutting device 31 and the second cutting device 32 described above detect the outer peripheral edge of the display area P4 of the liquid crystal panel P with a detection means such as a camera, and paste the sheet piece FXm bonded to the liquid crystal panel P to the bonding surface. Cut endlessly along the outer periphery. The outer peripheral edge of the bonding surface is detected by imaging the edge of the bonding surface.
In this embodiment, the laser cutting by each cutting device 31 and 32 is made along the outer periphery of the bonding surface.

The runout width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in this embodiment, compared with the case of cutting the optical sheet FX using the cutting blade, the outer peripheral edge of the bonding surface The liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

In addition, when the optical sheet FX is cut into a sheet piece that matches the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the relative bonding positions thereof Dimensional tolerances overlap. Therefore, it becomes difficult to narrow the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

On the other hand, when cutting out the sheet piece FXm of the optical sheet FX of a size protruding from the optical sheet FX to the outside of the liquid crystal panel P, and pasting the cut sheet piece FXm on the liquid crystal panel P, the sheet piece FXm is cut according to the bonding surface. Only the run-out tolerance of the cutting line needs to be considered, and the tolerance of the width of the frame G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

Further, by cutting the sheet piece FXm with a laser instead of a blade, the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion.

FIG. 25 shows a control for scanning the laser beam in a rectangular shape on the sheet piece FXm when the sheet piece FXm is cut into an optical member F1X having a predetermined size using the laser beam irradiation apparatus 100 shown in FIG. 1 as a cutting device. It is a figure which shows a method.

In FIG. 25, reference numeral Tr denotes a target laser beam movement locus (desired locus; hereinafter referred to as laser light movement locus). Reference numeral Tr1 is a trajectory (hereinafter sometimes referred to as a light source movement trajectory) obtained by projecting a movement trajectory due to relative movement between the table 111 and the scanner 105 onto the sheet piece FXm. The light source movement locus Tr1 has a shape in which four corners of the laser light movement locus Tr having a rectangular shape are curved. Reference sign K1 is a straight section other than the corner, and reference sign K2 is a bent section of the corner. Reference numeral Tr2 indicates that the irradiation position of the laser beam is orthogonal to the light source movement trajectory Tr1 by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 when the scanner 105 is relatively moving on the light source movement trajectory Tr1. It is a curve (hereinafter, sometimes referred to as an adjustment curve) indicating how much it is shifted (adjusted) in the direction of movement. The deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.

As shown in FIG. 25, the light source movement locus Tr1 is a substantially rectangular movement locus having a curved corner. The light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area. If the light source movement locus Tr1 has a rectangular shape, the moving speed of the scanner 105 is slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser light. For this reason, in FIG. 25, the corner of the light source movement locus Tr1 is curved so that the moving speed of the scanner 105 is substantially constant over the entire light source movement locus Tr1.

Since the light source movement locus Tr1 and the laser beam movement locus Tr coincide with each other when the scanner 105 moves in the straight section K1, the control device 107 sets the irradiation position of the laser beam to the first irradiation position adjusting device 151. And without adjusting by the 2nd irradiation position adjustment apparatus 154, a laser beam is irradiated to the sheet piece FXm from the scanner 105 as it is. On the other hand, when the scanner 105 is moving in the bending section K2, the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so that the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 perform laser light. The irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr. For example, when the scanner 105 is moving at the position indicated by the symbol M1, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 move the laser beam irradiation position in the direction N1 perpendicular to the light source movement locus Tr1. Shifted by W1. The distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1. The light source movement trajectory Tr1 is arranged inside the laser light movement trajectory Tr, but the irradiation position of the laser light is outside the laser light movement trajectory Tr by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. Therefore, these deviations cancel out, and the irradiation position of the laser beam is arranged on the laser beam movement locus Tr.

As described above, according to the film bonding system 1 of the present embodiment of the present embodiment, the first cutting device 31 and the second cutting device 32 are configured by the laser light irradiation device described above. Therefore, productivity can be improved by reducing the tact time by efficiently performing the cutting process on the sheet pieces F1m and F2m. Moreover, the sheet pieces F1m and F2m can be cut sharply, and the deterioration of the cut quality can be suppressed.

Further, under the control of the control device 107, the moving device 106 and the scanner 105 are controlled so as to draw a desired laser beam movement trajectory Tr in the sheet piece FXm. In this configuration, the laser beam irradiation section to be adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only a narrow bending section K2. In the other wide linear section K1, the laser beam is scanned on the sheet piece FXm by the movement of the table 111 by the moving device 106. In the present embodiment, the scanning of the laser beam is mainly performed by the moving device 106, and only the region where the moving position of the laser beam irradiation position cannot be accurately controlled by the moving device 106 is adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. is doing. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.

Moreover, the imaging direction of the imaging device 43 crosses diagonally with respect to the normal direction of the first bonding surface SA1. That is, the imaging direction of the imaging device 43 is set so that the edge of the second substrate P2 does not enter the imaging field of view of the imaging device 43. Therefore, when the edge ED of the first bonding surface SA1 is detected over the first sheet piece F1m, the edge of the second substrate P2 is not erroneously detected, and the first bonding surface SA1 is not detected. Only the edge ED can be detected. Therefore, the edge ED of the first bonding surface SA1 can be detected with high accuracy.

Moreover, after bonding the sheet pieces F1m and F2m of a size that protrudes outside the liquid crystal panel P to the liquid crystal panel P, the excess part of the sheet pieces F1m and F2m is cut off, whereby the optical member F11 having a size corresponding to the bonding surface. , F12 can be formed on the surface of the liquid crystal panel P. Thereby, the optical members F11 and F12 can be accurately provided up to the bonding surface, and the frame area outside the display area P4 can be narrowed to enlarge the display area and downsize the device.

Even if the optical axis direction of the sheet pieces F1m and F2m changes depending on the position of the sheet pieces F1m and F2m by bonding the sheet pieces F1m and F2m of a size protruding outside the liquid crystal panel P to the liquid crystal panel P. The liquid crystal panel P can be aligned and bonded in accordance with the direction. Thereby, the precision of the optical axis direction of the optical members F11 and F12 with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be increased.

In addition, the cutting devices 31 and 32 laser cut the sheet pieces F1m and F2m, so that the force is not exerted on the liquid crystal panel P as compared with the case where the sheet pieces F1m and F2m are cut with a blade, and cracks and chips occur. It becomes difficult, and the stable durability of the liquid crystal panel P can be obtained.

In the present embodiment, the configuration in which the sheet piece is cut is described as an example of the configuration in which the object is irradiated with the laser beam and the predetermined processing is performed, but the configuration is not limited thereto. For example, in addition to dividing the sheet piece into at least two parts, it also includes making a cut through the sheet piece and forming a groove (cut) of a predetermined depth in the sheet piece. To do.
More specifically, for example, cutting (cutting off) an end portion of a sheet piece, half cutting, marking processing, and the like are included.

In the present embodiment, the case where the drawing locus of the laser beam emitted from the laser beam irradiation device is a rectangular shape (square shape) in plan view has been described as an example, but the present invention is not limited thereto. For example, the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape that is a pentagon or more in plan view. Moreover, not only this but a planar-view star shape and planar-view geometric shape may be sufficient. The present invention can also be applied to such a drawing trajectory.

In the present embodiment, the optical sheet FX is pulled out from the original roll, and a sheet piece FXm of a size that protrudes outside the liquid crystal panel P is bonded to the liquid crystal panel P, and then the liquid crystal panel P is bonded from the sheet piece FXm. Although the case where it cut out to the optical member F1X of the magnitude | size corresponding to a surface was mentioned and demonstrated was demonstrated, it is not restricted to this. For example, the present invention can also be applied to the case where a sheet-like optical film chip cut out to the outside of the liquid crystal panel P is bonded to the liquid crystal panel without using the roll.

As described above, the preferred embodiment according to the present embodiment has been described with reference to the accompanying drawings, but the present invention is not limited to the example. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (manufacturing apparatus of an optical member bonding body), 23 ... Nipping roll (bonding apparatus), 31 ... 1st cutting device, 32 ... 2nd cutting device, 100 ... Laser beam irradiation apparatus, 101 ... Table: 101s ... Holding surface, 102 ... Laser oscillator, 105 ... Scanner, 106 ... Moving device, 108 ... Second condenser lens, 110 ... Object (target), 141 ... First condenser lens, 143 ... Diaphragm member, 145 ... collimating lens, P ... liquid crystal panel (optical display component), P1 ... first substrate, P2 ... second substrate, FX ... optical sheet, FXm ... sheet piece, F1X ... optical member, PA1 ... first optical Member bonding body (sheet piece bonding body), PA4 ... 4th optical member bonding body (optical member bonding body), SA1 ... 1st bonding surface, ED ... Edge

Claims

A cutting unit that performs a predetermined cutting process on the processing target;
A first table capable of moving the processing object between a first position and a cutting position at which the cutting unit performs the cutting process;
A second table that is movable with respect to the cutting position between the second position opposite to the first position and the cutting position; and
The first position and the second position are a carry-in position where the processing target is carried into the first table or the second table from the outside before the cutting process is performed, and the cutting process is performed. A cutting apparatus that also serves as an unloading position for unloading the processing target from the first table or the second table after being broken.
The cutting apparatus according to claim 1, wherein the first table and the second table can hold a plurality of the processing objects.
A detection unit that detects a relative position of the processing object with respect to the cutting unit is provided between the first position and the cutting position and at least one of the second position and the cutting position. The cutting device according to claim 1.
The cutting apparatus according to claim 3, further comprising a position correction unit that corrects a relative position of the processing target with respect to the cutting unit based on a detection result of the detection unit.
The cutting apparatus according to claim 1, wherein the processing target carry-in timing with respect to the first table and the processing target carry-out timing from the second table are performed in synchronization.
The cutting device according to claim 1, wherein the first position, the second position, and the cutting position are each set on a straight line.
The cutting apparatus according to claim 1, wherein the cutting unit performs the cutting process with a laser beam.
A first cutting step of carrying out the processing object from the first position after moving the processing object carried in at the first position to the cutting position and performing a predetermined cutting process;
A second cutting step of carrying out the predetermined cutting process after moving the processing object carried in at a second position to the cutting position, and carrying out the processing object from the second position;
The first cutting step includes
A first carry-in step of carrying in the processing object at the first position;
A first forward movement step of moving the processing object carried in at the first position to the cutting position;
A first cutting step of performing the cutting process at the cutting position;
After the first cutting step, a first return path moving step for moving the processing object from the cutting position to the first position;
A first unloading step of unloading the processing object from the first position after the first return path moving step;
The second cutting step includes
A second carry-in step of carrying in the processing object at the second position;
A second forward movement step of moving the processing object carried in at the second position to the cutting position;
A second cutting step for performing the cutting process at the cutting position;
After the second cutting step, a second return path moving step for moving the processing object from the cutting position to the second position;
A second unloading step of unloading the processing object from the second position after the second return path moving step;
The first cutting step and the second cutting step are executed in a state where a part of each step overlaps so that the first cutting step and the second cutting step are alternately performed at the cutting position. Cutting method.
At least one of the first cutting step and the second cutting step is detection of detecting a relative position of the processing object with respect to the cutting position in the middle of at least one of the first forward movement step and the second forward movement step. The cutting method according to claim 8, further comprising a step.
In the first cutting step, the first carry-in step and the first carry-out step are executed synchronously at the first position,
The cutting method according to claim 8, wherein in the second cutting step, at the second position, the second carry-in step and the second carry-out step are executed in synchronization.
The cutting method according to claim 8, wherein in the first outward movement step, the first backward movement step, the second outward movement step, and the second backward movement step, the processing objects move on the same straight line.
An apparatus for manufacturing an optical member bonded body formed by bonding an optical member to an optical display component,
A bonding apparatus that forms a sheet piece bonded body by bonding a sheet piece of a size protruding outside the optical display component to the optical display component;
Along the edge of the bonding surface between the optical display component and the sheet piece in the sheet piece bonded body, the sheet piece of the portion protruding outside the bonding surface is cut off from the sheet piece bonded body, A cutting device for forming the optical member having a size corresponding to the bonding surface,
The said cutting device is a manufacturing apparatus of the optical member bonding body comprised by the cutting device of Claim 1.