JPS62199285U - - Google Patents

Info

Publication number
JPS62199285U
JPS62199285U JP1986084712U JP8471286U JPS62199285U JP S62199285 U JPS62199285 U JP S62199285U JP 1986084712 U JP1986084712 U JP 1986084712U JP 8471286 U JP8471286 U JP 8471286U JP S62199285 U JPS62199285 U JP S62199285U
Authority
JP
Japan
Prior art keywords
workpiece
laser processing
processing machine
view
carries
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986084712U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986084712U priority Critical patent/JPS62199285U/ja
Publication of JPS62199285U publication Critical patent/JPS62199285U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例に係るレーザ加工
システムの側面図、第2図はワークレーザ加工後
のワーク搬送テーブルが第1図の場合と入れ替わ
つている状態を示す側面図、第3図は第1図の平
面図、第4図は第1の従来例を示すレーザ加工機
の側面図、第5図は同平面図、第6図は第2の従
来例を示すワーク搬送装置を備えたレーザ加工機
の側面図、第7図は同平面図である。 図において、1はレーザ加工機、5a,5bは
ワーク、6,8はワーク搬送テーブルである。な
お、図中、同一符号は同一または相当部分を示す
Fig. 1 is a side view of a laser processing system according to an embodiment of this invention, Fig. 2 is a side view showing a state in which the workpiece conveyance table after laser processing of the workpiece is replaced with that in Fig. 1, and Fig. 3 The figure is a plan view of Fig. 1, Fig. 4 is a side view of a laser processing machine showing a first conventional example, Fig. 5 is a plan view of the same, and Fig. 6 is a workpiece conveying device showing a second conventional example. A side view of the provided laser processing machine, and FIG. 7 is a plan view thereof. In the figure, 1 is a laser processing machine, 5a and 5b are workpieces, and 6 and 8 are workpiece conveyance tables. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] レーザ加工機にワークを搬入・搬出するレーザ
加工機のワーク搬送装置において、上記レーザ加
工機のワーク加工位置とワーク待機位置とに交互
に同期走行する2セツトのワーク搬送テーブルを
設けたことを特徴とするレーザ加工機のワーク搬
送装置。
A workpiece transfer device for a laser processing machine that carries a workpiece into and out of the laser processing machine is characterized in that two sets of workpiece transfer tables are provided that alternately travel synchronously at a workpiece processing position and a workpiece standby position of the laser processing machine. Workpiece conveyance device for laser processing machines.
JP1986084712U 1986-06-05 1986-06-05 Pending JPS62199285U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986084712U JPS62199285U (en) 1986-06-05 1986-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986084712U JPS62199285U (en) 1986-06-05 1986-06-05

Publications (1)

Publication Number Publication Date
JPS62199285U true JPS62199285U (en) 1987-12-18

Family

ID=30939457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986084712U Pending JPS62199285U (en) 1986-06-05 1986-06-05

Country Status (1)

Country Link
JP (1) JPS62199285U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014125993A1 (en) * 2013-02-14 2014-08-21 住友化学株式会社 Cutting device, cutting method, and method of manufacturing laminate optical member
EP2633941A4 (en) * 2010-10-25 2017-12-06 Amada Company, Limited Laser processing device and laser processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2633941A4 (en) * 2010-10-25 2017-12-06 Amada Company, Limited Laser processing device and laser processing method
WO2014125993A1 (en) * 2013-02-14 2014-08-21 住友化学株式会社 Cutting device, cutting method, and method of manufacturing laminate optical member

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