WO2014126140A1

WO2014126140A1 - Laser irradiation device and manufacturing method of laminate optical member

Info

Publication number: WO2014126140A1
Application number: PCT/JP2014/053304
Authority: WO
Inventors: 幹士藤井; ソンウクミン; チヨンソン
Original assignee: 住友化学株式会社; ハードラムカンパニーリミテッド
Priority date: 2013-02-13
Filing date: 2014-02-13
Publication date: 2014-08-21
Also published as: JP2016013557A; TW201431632A

Abstract

Laser intensity is different before and after switching an ON/OFF signal to the laser oscillator, and is low until the output of the laser has stabilized: a fixed time is required until the output of the laser stabilizes, and if the laser intensity is low during that interval, the laser no longer contributes to cutting. When using such a laser, it is in some cases not possible to cut sharply, reducing cutting quality. In order to solve this problem, a laser irradiation device is provided which has a shielding unit which shields the laser until output of the laser has stabilized; also provided is a manufacturing method of laminate optical member which uses said laser irradiation device as a cutting device.

Description

Laser light irradiation apparatus and optical member bonding body manufacturing apparatus

The present invention relates to a laser beam irradiation apparatus and an apparatus for manufacturing an optical member bonded body.
This application claims priority based on Japanese Patent Application No. 2013-26097 filed on Feb. 13, 2013, the contents of which are incorporated herein by reference.

Conventionally, there has been known a laser light irradiation apparatus that performs predetermined processing by irradiating a target with laser light. Utilization of the laser beam irradiation apparatus for film cutting and the like has been studied. For example, application to a method for producing a polarizing film as described in Patent Document 1 is expected.

Japanese Unexamined Patent Publication No. 2003-255132

The intensity of the laser beam is different before and after switching the ON / OFF signal to the laser oscillator, and is small until the output of the laser beam is stabilized. A certain time is required until the output of the laser beam is stabilized. If the intensity of the laser beam is low during that period, the laser beam does not contribute to the cutting of the object. Therefore, when such a laser beam is used, the object cannot be cut sharply, and the cut quality may deteriorate.

The aspect of the present invention has been made in view of such circumstances, and a laser beam irradiation apparatus and an optical member bonded body manufacturing apparatus capable of sharply cutting an object and suppressing a reduction in cut quality. The purpose is to provide.

In order to achieve the above object, the laser beam irradiation apparatus and the optical member bonding apparatus according to the aspect of the present invention employ the following configurations.
(1) The laser beam irradiation apparatus according to the first aspect of the present invention includes a laser oscillator that emits laser beam and a shielding unit that blocks the laser beam until the output of the laser beam is stabilized.

(2) In the laser beam irradiation apparatus according to (1), the shielding unit may include an acousto-optic element and a control device that controls a timing at which the laser beam passes through the acousto-optic element. Good.

(3) In the laser beam irradiation apparatus described in (2) above, the control device may control the timing so that a rising portion of the laser beam is removed.

(4) In the laser beam irradiation apparatus according to (2) or (3), the control unit may control the timing so that a falling portion of the laser beam is removed.

(5) The laser beam irradiation apparatus according to the second aspect of the present invention includes a table having a holding surface for holding an object, a laser oscillator for emitting laser light, and the laser in a plane parallel to the holding surface. A scanner that performs biaxial scanning of light, a moving device that relatively moves the table and the scanner, and a shielding unit that shields the laser light until the output of the laser light is stabilized may be included.

(6) In the laser beam irradiation apparatus according to (5), the shielding unit may include an acoustooptic device and a control device that controls the timing at which the laser beam passes through the acoustooptic device. Good.

(7) The laser light irradiation apparatus according to (5) or (6) may include a condensing lens that condenses the laser light emitted from the scanner toward the holding surface.

(8) The manufacturing apparatus of the optical member bonding body which concerns on the 3rd aspect of this invention is a manufacturing apparatus of the optical member bonding body comprised by bonding an optical member to an optical display component, Comprising: The said optical display component A bonding device that forms a sheet piece bonded body by bonding a sheet piece of a size that protrudes outside the optical display component, and a bonding surface between the optical display component and the sheet piece of the sheet piece bonded body A cutting device that cuts off the sheet piece of the portion that protrudes outside the bonding surface from the sheet piece bonding body along the edge of the sheet, and forms the optical member having a size corresponding to the bonding surface; The cutting device is configured by the laser light irradiation device according to any one of (1) to (7), and is the object by the laser light emitted from the laser light irradiation device. The sheet piece is cut That.

According to the aspect of the present invention, it is possible to provide a laser beam irradiation apparatus and an optical member bonded body manufacturing apparatus capable of cutting an object sharply and suppressing a reduction in cut quality.

It is a perspective view which shows the laser beam irradiation apparatus which concerns on one Embodiment of this invention. It is a figure which shows the structure of EBS. It is a perspective view which shows the internal structure of IOR. It is a sectional side view which shows the arrangement configuration of a condensing lens, a diaphragm member, and a collimating lens. It is a figure which shows the structure of the control system of a laser beam irradiation apparatus. It is a figure for demonstrating the effect | action of IOR. (A)-(d) It is a figure for demonstrating the effect | action of EBS. (A) to (d) FIG. 7 is a diagram focusing on one pulse of laser light. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut | disconnected using the laser beam irradiation apparatus which concerns on a comparative example. It is an enlarged view of a cut surface when the polarizing plate which is a target object is cut using the laser beam irradiation apparatus concerning this embodiment. It is a schematic diagram which shows the manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention. It is a top view of a liquid crystal panel. FIG. 13 is a cross-sectional view taken along line AA in FIG. 12. It is sectional drawing of an optical sheet. It is a figure which shows operation | movement of a cutting device. It is a top view which shows the detection process of the edge of a bonding surface. It is a schematic diagram of a detection apparatus. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows the control method for a laser beam to draw a desired locus | trajectory.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

In all of the following drawings, the dimensions and ratios of the constituent elements are appropriately changed in order to make the drawings easy to see. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

(Laser beam irradiation device)
FIG. 1 is a perspective view showing an example of a laser beam irradiation apparatus 100 used as an object cutting apparatus.

In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the first direction parallel to the holding surface that holds the object is defined as the X direction, and the direction orthogonal to the X direction in the plane of the holding surface is orthogonal to the Y direction, the X direction, and the Y direction. The direction is the Z direction.

As shown in FIG. 1, a laser beam irradiation apparatus 100 includes a table 101, a laser oscillator 102, an acoustooptic device 103 that constitutes an EBS 130 (Electrical Beam Shaping: see FIG. 2), an IOR 104 (Imaging Optics Rail), A scanner 105, a moving device 106, and a control device 107 that performs overall control of these devices are provided.
Here, the EBS 130 corresponds to a shielding means (shielding portion).

The table 101 has a holding surface 101s for holding the object 110. The table 101 is rectangular when viewed from the normal direction of the holding surface 101s. The holding surface 101s is a rectangular first holding surface 101s1 having a long side in the first direction (X direction), and a second shape that is disposed adjacent to the first holding surface 101s1 and has the same shape as the first holding surface 101s1. Holding surface 101s2.

The laser oscillator 102 is a member that emits laser light L. For example, as the laser oscillator 102, an oscillator such as a CO ₂ laser oscillator (carbon dioxide laser oscillator), a UV laser oscillator, a semiconductor laser oscillator, a YAG laser oscillator, or an excimer laser oscillator can be used. It is not limited. Among the above oscillators, the CO ₂ laser oscillator can emit a high-power laser beam capable of cutting an optical member such as a polarizing film.

FIG. 2 is a diagram illustrating the configuration of the EBS 130.
As shown in FIG. 2, the EBS 130 includes an acoustooptic element 103 disposed on the optical path of laser light emitted from the laser oscillator 102, a drive driver 131 electrically connected to the acoustooptic element 103, and laser light. Has a control device 107 (corresponding to a laser control unit 171 to be described later) for controlling the timing of passing through the acousto-optic element 103.
The EBS 130 shields the laser light until the output of the laser light is stabilized.

Acousto-optic element 103 is an optical element for shielding laser light emitted from laser oscillator 102.

The acoustooptic element 103 is obtained by bonding a piezoelectric element to an acoustooptic medium made of single crystal or glass such as tellurium dioxide (TeO ₂ ) or lead molybdate (PbMoO ₄ ). By applying an electrical signal to the piezoelectric element to generate an ultrasonic wave and propagating the ultrasonic wave into the acousto-optic medium, the passage and non-passing (shielding) of the laser light can be controlled.

In this embodiment, the acousto-optic element 103 is used as a constituent member of the EBS 130, but the present invention is not limited to this. Other optical elements may be used as long as the laser light emitted from the laser oscillator 102 can be shielded. A high-speed shutter may be used as a shielding means (shielding portion) that shields the laser light.

The drive driver 131 supplies an electrical signal (control signal) for generating an ultrasonic wave to the acoustooptic device 103 based on the control of the control device 107, and adjusts the shielding time of the laser beam by the acoustooptic device 103.

The control device 107 controls the timing at which the laser light passes through the acousto-optic element 103 so that, for example, the rising and falling portions of the laser light emitted from the laser oscillator 102 are removed.

The timing control by the control device 107 is not limited to this. For example, the control device 107 may control the timing at which the laser light passes through the acoustooptic device 103 so that the rising portion of the laser light emitted from the laser oscillator 102 is selectively removed.
In particular, when the width (time) of the falling portion of the laser light emitted from the laser oscillator 102 is sufficiently shorter than the width (time) of the rising portion of the laser light, the benefit of removing the falling portion of the laser light. Is small. Therefore, in such a case, only the rising portion of the laser light emitted from the laser oscillator 102 may be selectively removed.

With such a configuration, the EBS 130 emits the laser light emitted from the laser oscillator 102 with a stable output based on the control of the control device 107.

The IOR 104 removes the skirt portion that does not contribute to the cutting of the object 110 in the intensity distribution of the laser light.

FIG. 3 is a perspective view showing the internal configuration of the IOR 104.
As shown in FIG. 3, the IOR 104 is condensed by the condenser lens 141 that condenses the laser light emitted from the EBS 130, the first holding frame 142 that holds the condenser lens 141, and the condenser lens 141. A diaphragm member 143 that squeezes the laser light, a holding member 144 that holds the diaphragm member 143, a collimator lens 145 that collimates the laser light squeezed by the diaphragm member 143, and a second holding frame 146 that holds the collimator lens 145 A moving mechanism 147 for relatively moving the first holding frame 142, the holding member 144, and the second holding frame 146.

FIG. 4 is a side sectional view showing an arrangement configuration of the condenser lens 141, the diaphragm member 143, and the collimator lens 145.

As shown in FIG. 4, the aperture member 143 is formed with a pinhole 143h for focusing the laser beam condensed by the condenser lens 141. The centers of the condensing lens 141, the pinhole 143 h and the collimating lens 145 are arranged at positions overlapping the optical axis CL of the laser light emitted from the EBS 130.

The diaphragm member 143 can be disposed in the vicinity of the rear focal point of the condenser lens 141.

Here, “in the vicinity of the rear focal point of the condensing lens 141” may be slightly different from the arrangement position of the diaphragm member 143 within a range in which the arrangement position of the diaphragm member 143 is not greatly displaced from the rear focal point of the condensing lens 141. Means that. For example, the ratio K1 / K2 between the distance K1 from the center of the condenser lens 141 to the rear focal point of the condenser lens 141 and the distance K2 from the center of the condenser lens 141 to the center of the pinhole 143h of the aperture member 143 is 0. If it is in the range of not less than .9 / 1 and not more than 1.1 / 1, it can be said that the diaphragm member 143 is disposed in the vicinity of the rear focal point of the condenser lens 141. If it is such a range, the laser beam condensed by the condensing lens 141 can be narrowed down effectively.

The diaphragm member 143 can be arranged in the vicinity of the rear focal point of the condenser lens 141, but the arrangement position of the diaphragm member 143 is not necessarily limited to this position. The arrangement position of the diaphragm member 143 may be on the optical path between the condenser lens 141 and the collimator lens 145, and is not limited to the vicinity of the rear focal point of the condenser lens 141.

Returning to FIG. 3, the moving mechanism 147 moves the first holding frame 142, the holding member 144, and the second holding frame 146 in a direction parallel to the traveling direction of the laser light, and the slider mechanism 148. Holding base 149 for holding.

For example, the first holding frame 142 and the holding member 144 are moved by moving the first holding frame 142 and the second holding frame 146 in a direction parallel to the traveling direction of the laser beam in a state where the holding member 144 is arranged at a fixed position. And the mutual positioning of the 2nd holding frame 146 is performed. Specifically, the diaphragm member 143 is disposed at the position of the front focal point of the collimating lens 145 and the position of the rear focal point of the condenser lens 141.

Referring back to FIG. 1, the scanner 105 scans the laser beam biaxially in a plane parallel to the holding surface 101s (in the XY plane). That is, the scanner 105 moves the laser light relative to the table 101 independently in the X direction and the Y direction. Thereby, it is possible to accurately irradiate the laser beam to an arbitrary position of the object 110 held on the table 101.

The scanner 105 includes a first irradiation position adjustment device 151 and a second irradiation position adjustment device 154.

The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 constitute a scanning element that biaxially scans the laser light emitted from the IOR 104 in a plane parallel to the holding surface 101s. As the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154, for example, a galvano scanner is used. The scanning element is not limited to a galvano scanner, and a gimbal can be used.

The first irradiation position adjusting device 151 includes a mirror 152 and an actuator 153 that adjusts the installation angle of the mirror 152. The actuator 153 has a rotation axis parallel to the Z direction. The actuator 153 rotates the mirror 152 around the Z axis based on the control of the control device 107.

The second irradiation position adjusting device 154 includes a mirror 155 and an actuator 156 that adjusts the installation angle of the mirror 155. The actuator 156 has a rotation axis parallel to the Y direction. The actuator 156 rotates the mirror 155 around the Y axis based on the control of the control device 107.

On the optical path between the scanner 105 and the table 101, a condenser lens 108 that condenses the laser light passing through the scanner 105 toward the holding surface 101s is disposed.

For example, an fθ lens is used as the condensing lens 108. Thereby, the laser beam emitted in parallel to the condenser lens 108 from the mirror 155 can be condensed in parallel to the object 110.

It should be noted that the condensing lens 108 may not be disposed on the optical path between the scanner 105 and the table 101.

The laser beam L emitted from the laser oscillator 102 is applied to the object 110 held on the table 101 via the acoustooptic device 103, the IOR 104, the mirror 152, the mirror 155, and the condenser lens. The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 are the irradiation positions of the laser beams irradiated from the laser oscillator 102 toward the object 110 held on the table 101 based on the control of the control device 107. Adjust.

A laser beam processing region 105s (hereinafter referred to as a scan region) controlled by the scanner 105 is rectangular when viewed from the normal direction of the holding surface 101s. In the present embodiment, the area of the scan region 105s is smaller than the areas of the first holding surface 101s1 and the second holding surface 101s2.

The moving device 106 moves the table 101 and the scanner 105 relative to each other. The moving device 106 moves the table 101 in a first direction (X direction) parallel to the holding surface 101s, and the first slider mechanism 161 is parallel to the holding surface 101s and orthogonal to the first direction. And a second slider mechanism 162 that moves in the second direction (Y direction). The moving device 106 operates the linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162 to move the table 101 in each direction of XY.

The linear motor that is pulse-driven in the slider mechanism can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Therefore, the position of the table 101 supported by the slider mechanism in each direction of XY can be controlled with high accuracy. Note that the position control of the table 101 is not limited to the position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.

The control device 107 includes a laser control unit 171 that controls the laser oscillator 102 and the acoustooptic device 103 (drive driver 131), a scanner control unit 172 that controls the scanner 105, a slider control unit 173 that controls the moving device 106, Have

Specifically, the laser control unit 171 turns on / off the laser oscillator 102, the output of the laser light emitted from the laser oscillator 102, and the timing at which the laser light L emitted from the laser oscillator 102 passes through the acoustooptic device 103. The drive driver 131 is controlled.
The scanner control unit 172 controls driving of the actuator 153 of the first irradiation position adjustment device 151 and the actuator 156 of the second irradiation position adjustment device 154.
The slider control unit 173 controls the operation of the linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162.

FIG. 5 is a diagram illustrating a configuration of a control system of the laser light irradiation apparatus 100.
As shown in FIG. 5, an input device 109 capable of inputting an input signal is connected to the control device 107. The input device 109 includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. The control device 107 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the laser light irradiation device 100, or may be connected to the display device.

When the user inputs the processing data to the input device 109 and the initial setting is completed, the laser light is emitted from the laser oscillator 102 based on the control of the laser control unit 171 of the control device 107. At this time, based on the control of the scanner control unit 172 of the control device 107, rotation driving of the mirrors constituting the scanner 105 is started. At the same time, based on the control of the slider control unit 173 of the control device 107, the number of rotations of a drive shaft such as a motor provided in the first slider mechanism 161 and the second slider mechanism 162 is detected by a sensor such as a rotary encoder. The

The control device 107 corrects each coordinate value in real time so that the laser light is emitted at coordinates that match the machining data, that is, the laser light draws a desired locus on the object 110 (see FIG. 1). Thus, the moving device 106 and the scanner 105 are controlled. For example, the control device 107 scans the laser beam mainly by the moving device 106, and adjusts the region where the laser device irradiation position cannot be controlled with the moving device 106 with the scanner 105.

FIG. 6 is a diagram for explaining the operation of the IOR 104.
The diagram on the left side of FIG. 6 is a diagram showing the intensity distribution of the laser light before passing through the pinhole 143h. The upper left diagram in FIG. 6 is a plan view. 6 is a perspective view. 6 is a diagram showing the horizontal axis as the position and the vertical axis as the intensity.
The diagram on the right side of FIG. 6 shows the intensity distribution of the laser light after passing through the pinhole 143h. The diagram on the upper right side of FIG. 6 is a plan view. 6 is a perspective view. 6 is a diagram showing the horizontal axis as the position and the vertical axis as the intensity.

As shown in the diagram on the left side of FIG. 6, the intensity distribution of the laser beam before passing through the pinhole 143h is an intensity distribution having a high intensity at the center of the beam and a low intensity at the outer periphery of the beam. .

On the other hand, as shown in the diagram on the right side of FIG. 6, the intensity distribution of the laser light after passing through the pinhole 143h has a tail portion that does not contribute to the cutting of the polarizing plate in the intensity distribution of the laser light. By being removed, the intensity distribution of the laser light becomes an ideal Gaussian distribution. The half width of the intensity distribution of the laser light after passing through the pinhole 143h is narrower than the half width of the intensity distribution of the laser light before passing through the pinhole 143h.

FIGS. 7A to 7D are diagrams for explaining the operation of the EBS 130. FIG.
FIG. 7A shows a control signal of laser light emitted from the laser oscillator 102.
FIG. 7B shows the output characteristics of the laser light itself emitted from the laser oscillator 102, that is, the output characteristics of the laser light before the laser light emitted from the laser oscillator 102 passes through the acoustooptic device 103. .
FIG. 7C shows a control signal of the acoustooptic device 103.
FIG. 7D shows the output characteristics of the laser light after the laser light emitted from the laser oscillator 102 passes through the acousto-optic element 103.
In each of FIGS. 7B and 7D, the horizontal axis represents time, and the vertical axis represents the intensity of laser light.
FIGS. 8A to 8D are diagrams focusing on one pulse of laser light in FIGS. 7A to 7D.
In the following description, the “control signal for laser light emitted from the laser oscillator 102” is referred to as “control signal for laser light”. “Output characteristics of laser light before the laser light emitted from the laser oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light before passing through the acousto-optic element 103”. “Output characteristics of laser light after the laser light emitted from the laser oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light after passing through the acousto-optic element 103”.

As shown in FIGS. 7A and 8A, the pulse Ps1 of the laser light control signal is a rectangular pulse. As shown in FIG. 7A, the control signal of the laser beam is a so-called clock pulse that generates a plurality of pulses Ps1 when the ON / OFF signal to the laser oscillator 102 is periodically switched.

7A and 8A, the peak portion of the pulse Ps1 is a state where an ON signal is sent to the laser oscillator 102, that is, an ON state where laser light is emitted from the laser oscillator 102. The valley portion of the pulse Ps1 is a state in which an OFF signal is sent to the laser oscillator 102, that is, an OFF state in which laser light is not emitted from the laser oscillator 102.

As shown in FIG. 7A, one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals. The three collective pulses PL1 are arranged at intervals longer than the arrangement interval of the three pulses Ps1. For example, the interval between two adjacent pulses Ps1 is 1 millisecond, and the interval between two adjacent collective pulses PL1 is 10 milliseconds.

In the present embodiment, an example in which one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals is described, but the present invention is not limited to this. For example, one collective pulse may be formed by arranging a plurality of two or four or more pulses at short intervals.
Further, the configuration is not limited to the plurality of pulses being periodically formed, and one pulse may be formed with a long width. That is, a configuration in which laser light having a certain intensity from the ON signal to the OFF signal to the laser oscillator is emitted for a predetermined time may be employed.

As shown in FIGS. 7B and 8B, the pulse Ps2 of the output characteristic of the laser light before passing through the acoustooptic device 103 is a waveform pulse having a rising portion G1 and a falling portion G2.

Here, the rising portion G1 means a portion of the pulse Ps2 in the period from when the intensity of the laser beam reaches zero to an intensity that contributes to the cutting of the object. The falling portion G2 means a portion in the period from the intensity at which the intensity of the laser light contributes to the cutting of the object to zero, among the pulses Ps2 of the output characteristics of the laser light. The intensity that contributes to the cutting of the object varies depending on the material and thickness of the object and the output value of the laser beam. As an example, as shown in FIG. 8B, 50% of the peak intensity (100%) of the laser beam. % Strength.

As shown in FIGS. 7B and 8B, the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2. That is, the time of the rising portion G1 of the laser light emitted from the laser oscillator 102 is longer than the time of the falling portion G2 of the laser light.
For example, the width of the rising portion G1 is 45 microseconds, and the width of the falling portion G2 is 25 microseconds.

In this embodiment, the example in which the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2 is described, but the present invention is not limited to this. For example, when the width of the rising portion G1 of the pulse Ps2 is substantially equal to the width of the falling portion G2, the present invention can be applied even when the width of the rising portion G1 of the pulse Ps2 is shorter than the width of the falling portion G2. is there.

As shown in FIG. 7B, one set pulse PL2 is formed by arranging the three pulses Ps2 at positions corresponding to the three pulses Ps1 shown in FIG. 7A. The three collective pulses PL2 are arranged at positions corresponding to the three collective pulses PL1 shown in FIG.

As shown in FIGS. 7C and 8C, the control signal pulse Ps3 of the acoustooptic device 103 is a rectangular pulse. As shown in FIG. 7C, the control signal for the acoustooptic device 103 is periodically switched so that the timing at which the laser beam passes through the acoustooptic device 103 is periodically switched. This is a so-called clock pulse that generates a plurality of pulses Ps3.

7 (c) and 8 (c), the peak portion of the pulse Ps3 is in a state where the laser light is transmitted, that is, a light transmitting state where the laser light is transmitted. The valley portion of the pulse Ps3 is in a state where laser light is not passed, that is, in a light shielding state where the laser light is shielded.

As shown in FIG. 7C, the valley portion of each pulse Ps3 is disposed so as to overlap both the rising portion G1 and the falling portion G2 of each pulse Ps2 shown in FIG. 7B.

As shown in FIG. 8C, when focusing on one pulse Ps3, the width of the valley portion V1 on the front side of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the rear side of the pulse Ps3. The width of the valley portion V2 is substantially equal to the width of the falling portion of the pulse Ps2. For example, the width of the valley portion V1 on the front side of the pulse Ps3 is 45 microseconds, and the width of the valley portion V2 on the rear side of the pulse Ps3 is 25 microseconds. As described above, the EBS 130 has a switch function having a quick response characteristic.

As a result, the rising portion G1 and the falling portion G2 of the laser beam can be removed, and the portion of the laser beam output characteristic pulse Ps2 in which the intensity of the laser beam contributes to the cutting of the object can be selectively extracted. .

As a result, as shown in FIG. 7D and FIG. 8D, the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic device 103 does not have a rising portion G1 and a falling portion G2. It becomes a pulse protruding to

In this embodiment, the width of the front valley portion V1 of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the width of the rear valley portion V2 of the pulse Ps3 is the rising edge of the pulse Ps2. Although an example that is substantially equal to the width of the falling portion is described, the present invention is not limited to this.
For example, the width of the valley portion V1 on the front side of the pulse Ps3 is made substantially equal to the width of the rising portion G1 of the pulse Ps2, or the width of the valley portion V2 on the rear side of the pulse Ps3 is made larger than the width of the falling portion of the pulse Ps2. It can be appropriately adjusted as necessary, for example, by increasing the size.

FIG. 9 is an enlarged view of a cut surface when a polarizing plate which is an object is cut using the laser beam irradiation apparatus according to the comparative example.
Here, the laser light irradiation apparatus according to the comparative example is a laser light irradiation apparatus that uses the laser light before passing through the acousto-optic element 103 as it is, that is, a laser light irradiation apparatus that does not include the EBS 130.
FIG. 10 is an enlarged view of a cut surface when a polarizing plate, which is an object, is cut using the laser beam irradiation apparatus 100 according to the present embodiment.

As shown in FIGS. 7B and 8B, the intensity of the laser light differs before and after switching the ON / OFF signal to the laser oscillator 102, and is small until the output of the laser light is stabilized.
A certain time is required until the output of the laser beam is stabilized. If the intensity of the laser beam is low during that time, the laser beam does not contribute to the cutting of the polarizing plate.

In this case, as shown in FIG. 9, in the laser beam irradiation apparatus according to the comparative example, it is confirmed that the cut surface of the polarizing plate has a tapered shape. This is considered to be because when the polarizing plate was cut, the rising portion of the laser beam thermally affected the portion along the cut line, so that the portion other than the cut region of the polarizing plate was dissolved.

On the other hand, as shown in FIG. 7D and FIG. 8D, the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic device 103 is the rising part G1 and the falling part of the laser light. By removing G2, a sharply protruding pulse is obtained. The full width of the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic device 103 is narrower than the full width of the pulse Ps2 of the output characteristic of the laser light before passing through the acoustooptic device 103.

In this case, as shown in FIG. 10, in the laser beam irradiation apparatus 100 provided with the EBS 130 according to the present embodiment, it is confirmed that the cut surface of the polarizing plate is perpendicular to the holding surface. This is because when the polarizing plate is cut, the portion of the output characteristics of the laser light that contributes to the cutting of the polarizing plate is irradiated to the polarizing plate, so that the cut region of the polarizing plate can be selectively blown. Conceivable.

As described above, according to the laser beam irradiation apparatus 100 according to the present embodiment, the object 110 can be cut sharply, and a reduction in cut quality can be suppressed.

In addition, since the EBS 130 using the acoustooptic device 103 has a switching function having a quick response characteristic, even when the laser light is emitted from the laser oscillator 102 with a short period, the rising portion G1 of the laser light. In addition, the falling portion G2 can be selectively removed.

Further, since the condensing lens 108 is disposed on the optical path between the scanner 105 and the table 101, the laser light passing through the scanner 105 can be condensed in parallel with the object 110. Therefore, the object 110 can be cut with high accuracy.

Further, in the laser beam irradiation apparatus 100 of the present embodiment, the scanning of the laser beam is mainly performed by the moving device 106, and an area where the irradiation position of the laser beam cannot be accurately controlled by the moving device 106 is adjusted by the scanner 105. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.

In this embodiment, as an example, the laser light irradiation apparatus 100 includes a table 101, a laser oscillator 102, an EBS 130 as a shielding unit (shielding unit), a scanner 105, and a moving device 106. Although it has been described above, it is not limited to this. For example, the laser beam irradiation apparatus may be configured to include a laser oscillator and EBS. That is, the laser light irradiation device may be configured not to include a table, a scanner, and a moving device.

(Manufacturing device for optical member bonded body)
Hereinafter, the film bonding system 1 which is a manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention is demonstrated with reference to drawings. The film bonding system 1 which concerns on this embodiment is comprised by the laser beam irradiation apparatus 100 which the cutting device mentioned above.

FIG. 11 is a diagram illustrating a schematic configuration of the film bonding system 1 of the present embodiment.
The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, an antireflection film, and a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.

In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the transport direction of the liquid crystal panel, which is an optical display component, is the X direction, and the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

As shown in FIG. 11, the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by the control part 40 as an electronic control apparatus.

FIG. 12 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a relatively small rectangular shape disposed opposite to the first substrate P1, a first substrate P1, and a second substrate. And a liquid crystal layer P3 sealed between the substrate P2. The liquid crystal panel P has a rectangular shape that conforms to the outer shape of the first substrate P1 in plan view, and a region that fits inside the outer periphery of the liquid crystal layer P3 in plan view is defined as a display region P4.

FIG. 13 is a cross-sectional view taken along the line AA in FIG. On the front and back surfaces of the liquid crystal panel P, a first optical member cut out from each of a long strip-shaped first optical sheet F1 and second optical sheet F2 (see FIG. 11, hereinafter may be collectively referred to as an optical sheet FX). F11 and the second optical member F12 (hereinafter may be collectively referred to as an optical member F1X) are appropriately bonded. In the present embodiment, polarizing films are bonded to both surfaces of the liquid crystal panel P, respectively. The first optical member F11 is bonded to the surface of the liquid crystal panel P on the backlight side as a polarizing film. The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P as a polarizing film.

Outside the display area P4, a frame portion G having a predetermined width for arranging a sealant or the like for joining the first substrate P1 and the second substrate P2 of the liquid crystal panel P is provided.

In addition, the 1st optical member F11 and the 2nd optical member F12 are respectively the bonding surface from the 1st sheet piece F1m and the 2nd sheet piece F2m (henceforth a sheet piece FXm) mentioned later. It is formed by cutting off the excess part on the outside. The bonding surface will be described later.

FIG. 14 is a partial cross-sectional view of the optical sheet FX to be bonded to the liquid crystal panel P. The optical sheet FX includes a film-like optical member main body F1a, an adhesive layer F2a provided on one surface (upper surface in FIG. 14) of the optical member main body F1a, and one of the optical member main bodies F1a via the adhesive layer F2a. Separator F3a laminated | stacked on the surface so that isolation | separation was possible, and the surface protection film F4a laminated | stacked on the other surface (FIG. 14 lower surface) of the optical member main body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and the peripheral area of the display area P4. For convenience of illustration, hatching of each layer in FIG. 14 is omitted.

The optical member main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface of the optical member main body F1a. Hereinafter, the part remove | excluding the separator F3a from the optical sheet FX is called the bonding sheet | seat F5.

The separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical sheet FX may be configured not to include the surface protective film F4a. The structure which is not isolate | separated from the optical member main body F1a may be sufficient as the surface protection film F4a.

The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. And a second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

The optical member body F1a may have a single-layer structure composed of a single optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancement film, or the like. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.
As shown in FIG. 11, the film laminating system 1 according to the present embodiment is configured such that the liquid crystal panel P on the right side in the drawing direction (+ X direction side) to the downstream side in the carrying direction of the liquid crystal panel P on the left side in FIG. X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.

The roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary. On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P <b> 4 is along the transport direction. On the other hand, on the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P <b> 4 along the transport direction. A sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical sheet FX is bonded to the front and back surfaces of the liquid crystal panel P.

In addition, the upstream conveyor 6 is provided with the independent free roller conveyor 24 in the downstream in the 1st adsorption | suction apparatus 11 mentioned later. On the other hand, the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.

The film bonding system 1 of this embodiment is the 1st adsorption | suction apparatus 11, the 1st dust collector 12, the 1st bonding apparatus 13, the 1st detection apparatus 41, the 1st cutting device 31, the inversion apparatus 15, and 2nd collection. The dust device 16, the 2nd bonding apparatus 17, the 2nd detection apparatus 42, the 2nd cutting device 32, and the control part 40 are provided.

The first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P. The first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

The panel holding unit 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P. The panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P. When the conveyance is finished, the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.

In the alignment camera 11b, the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state. Imaging data from the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding unit 11a operates to align the liquid crystal panel P with the free roller conveyor 24 at the transport destination. In other words, the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the shift in the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the turning direction about the vertical axis of the liquid crystal panel P. .
The liquid crystal panel P conveyed on the rail R by the panel holding portion 11a is nipped by the pinching roll 23 with the sheet piece FXm while being adsorbed by the suction pad 26.

The 1st dust collector 12 is provided in the conveyance upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13. FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.

The 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption | suction apparatus 11. FIG. The 1st bonding apparatus 13 bonds the bonding sheet | seat F5 (equivalent to 1st sheet piece F1m) cut into the predetermined size with respect to the lower surface of liquid crystal panel P introduced into the bonding position.

The 1st bonding apparatus 13 is provided with the conveying apparatus 22 and the pinching roll 23. FIG.

The conveying device 22 conveys the optical sheet FX along the longitudinal direction of the optical sheet FX while unwinding the optical sheet FX from the original roll R1 around which the optical sheet FX is wound. The conveying apparatus 22 conveys the bonding sheet | seat F5 by using separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding unit 22a holds the original roll R1 around which the belt-shaped optical sheet FX is wound and feeds the optical sheet FX along the longitudinal direction of the optical sheet FX.
The plurality of guide rollers 22b wind the optical sheet FX so as to guide the optical sheet FX unwound from the original roll R1 along a predetermined conveyance path.
The cutting device 22c performs a half cut on the optical sheet FX on the conveyance path.
The knife edge 22d feeds the bonding sheet F5 to the bonding position while winding the optical sheet FX subjected to the half cut at an acute angle to separate the bonding sheet F5 from the separator F3a.
The winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.

The roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example. Thereby, the winding unit 22e winds up the separator F3a that has passed through the knife edge 22d while the roll holding unit 22a feeds the optical sheet FX in the conveyance direction of the optical sheet FX. Hereinafter, the upstream side in the transport direction of the optical sheet FX (separator F3a) in the transport device 22 is referred to as a sheet transport upstream side, and the downstream side in the transport direction is referred to as a sheet transport downstream side.

Each guide roller 22b changes the traveling direction of the optical sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b is movable so as to adjust the tension of the optical sheet FX being conveyed. .

A dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical sheet FX conveyed from the roll holding unit 22a while the optical sheet FX is cut by the cutting device 22c.

FIG. 15 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
As shown in FIG. 15, when the optical sheet FX is fed out by a predetermined length, the cutting device 22c applies a part in the thickness direction of the optical sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical sheet FX. Make a half-cut to cut. The cutting device 22c of the present embodiment is provided so as to be able to advance and retreat from the side opposite to the separator F3a with respect to the optical sheet FX toward the optical sheet FX.

The cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical sheet FX (so that a predetermined thickness remains in the separator F3a), Half-cut to the vicinity of the interface between the adhesive layer F2a and the separator F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

In the optical sheet FX after the half cut, the optical member main body F1a and the surface protective film F4a are cut in the thickness direction of the optical sheet FX, so that the cut lines L1 and the cuts extend over the entire width in the width direction of the optical sheet FX. A line L2 is formed. A plurality of the cut lines L1 and the cut lines L2 are formed so as to be arranged in the longitudinal direction of the belt-shaped optical sheet FX. For example, in the case of the bonding process which conveys the liquid crystal panel P of the same size, the plurality of cut lines L1 and the plurality of cut lines L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX. The optical sheet FX is divided into a plurality of sections in the longitudinal direction by a plurality of cut lines L1 and a plurality of cut lines L2. A section sandwiched between a pair of cut lines L1 and L2 adjacent in the longitudinal direction in the optical sheet FX is a sheet piece FXm in the bonding sheet F5. The sheet piece FXm is a sheet piece of the optical sheet FX having a size that protrudes outside the liquid crystal panel P.

11, the knife edge 22d is disposed below the upstream conveyor 6 and extends at least over the entire width of the optical sheet FX in the width direction of the optical sheet FX. The knife edge 22d winds the optical sheet FX so as to be in sliding contact with the separator F3a side of the optical sheet FX after the half cut.

The knife edge 22d is seen from the width direction of the optical sheet FX above the first surface, and the first surface arranged in an inclined position when viewed from the width direction of the optical sheet FX (width direction of the upstream conveyor 6). It has the 2nd surface arrange | positioned at an acute angle with respect to a 1st surface, and the front-end | tip part where a 1st surface and a 2nd surface cross.

In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical sheet F1 at an acute angle around the front-end | tip part of the knife edge 22d. The first optical sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d is introduced between the pair of bonding rollers 23a of the pinching roll 23 while overlapping the lower surface of the liquid crystal panel P in a state of being sucked by the first suction device 11. Is done. The first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size that protrudes outside the liquid crystal panel P.

On the other hand, the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d. The winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.

The pinching roll 23 bonds the first sheet piece F1m separated from the first optical sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6. Here, the pinching roll 23 corresponds to a bonding apparatus.

The pinching roll 23 has a pair of laminating rollers 23a arranged in parallel with each other in the axial direction. Of the pair of bonding rollers 23a, the upper bonding roller is movable up and down. A predetermined gap is formed between the pair of bonding rollers 23a. The inside of this gap becomes the bonding position of the first bonding apparatus 13.

In the gap, the liquid crystal panel P and the first sheet piece F1m are overlapped and introduced. Liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being pinched by a pair of bonding roller 23a. In this embodiment, 1st optical member bonding body PA1 is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG.

The 1st detection apparatus 41 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13. FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth 1st bonding surface SA1) of liquid crystal panel P and 1st sheet piece F1m.

FIG. 16 is a plan view showing a step of detecting the edge ED of the first bonding surface SA1.
For example, as illustrated in FIG. 16, the first detection device 41 detects the edge ED of the first bonding surface SA <b> 1 in the four inspection areas CA installed on the transport path of the upstream conveyor 6. Each inspection area | region CA is arrange | positioned in the position corresponding to four corner | angular parts of 1st bonding surface SA1 which has a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The data of the edge ED detected by the first detection device 41 is stored in a storage unit (not shown).

In addition, the arrangement position of the inspection area CA is not limited to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1.

FIG. 17 is a schematic diagram of the first detection device 41.
In FIG. 17, for convenience, the configuration of the first detection device 41 is shown upside down with the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded as the upper side.

As illustrated in FIG. 17, the first detection device 41 includes an illumination light source 44 that illuminates the edge ED, and the first bonding surface SA1 rather than the edge ED with respect to the normal direction of the first bonding surface SA1. The image pickup device 43 is disposed at a position inclined inward and picks up an image of the edge ED from the side where the first sheet piece F1m of the first optical member bonding body PA1 is bonded.

The illumination light source 44 and the imaging device 43 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.

An angle θ between the normal line of the first bonding surface SA1 and the normal line of the image pickup surface 43a of the image pickup device 43 (hereinafter referred to as an inclination angle θ of the image pickup device 43) is divided into panels within the image pickup field of the image pickup device 43. It can be set so that time lag and burrs do not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle θ of the imaging device 43 is such that the edge of the second substrate P2 enters the imaging field of the imaging device 43. Set to not.

The inclination angle θ of the imaging device 43 is set to match the distance H (hereinafter referred to as the height H of the imaging device 43) between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43. it can. For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 can be set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 43 and the inclination angle θ of the imaging device 43 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10 °.

The illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.

In addition, the illumination light source 44 and the imaging device 43 may be arrange | positioned so that a movement is possible along the edge ED of 1st bonding surface SA1. In this case, the illumination light source 44 and the imaging device 43 should each be provided one each. Thereby, the illumination light source 44 and the imaging device 43 can be moved to the position where the edge ED of 1st bonding surface SA1 is easy to image.

The illumination light source 44 is arrange | positioned on the opposite side to the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded. The illumination light source 44 is arrange | positioned in the position which inclined outside the 1st bonding surface SA1 rather than the edge ED with respect to the normal line direction of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.

In addition, the illumination light source may be arrange | positioned at the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded.

Further, the optical axis of the illumination light source 44 and the normal line of the image pickup surface 43a of the image pickup device 43 may slightly cross each other.

The cutting position of the first sheet piece F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control part 40 (refer FIG. 11) acquires the data of the edge ED of 1st bonding surface SA1 memorize | stored in the memory | storage part, and the 1st optical member F11 is outside the liquid crystal panel P (1st bonding surface SA1). The cutting position of the first sheet piece F1m is determined so as not to protrude beyond the outer side. The first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control unit 40.

Referring back to FIG. 11, the first cutting device 31 is provided on the downstream side of the panel conveyance from the first detection device 41. The 1st cutting device 31 performs the laser cut along edge ED, and is the 1st sheet piece F1m (1st sheet | seat) of the part which protruded outside 1st bonding surface SA1 from 1st optical member bonding body PA1. The surplus portion of the piece F1m) is cut off, and an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1 is formed. The first cutting device 31 corresponds to a cutting device.

Here, “the size corresponding to the first bonding surface SA1” indicates the size of the outer shape of the first substrate P1. However, it includes a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and that avoids a functional part such as an electrical component mounting portion.

The 1st optical member F11 is bonded by the surface of the backlight side of liquid crystal panel P, and the 1st optical member bonding body PA1 is cut | disconnected from 1st optical member bonding body PA1 by the 1st cutting device 31, and is comprised. 2nd optical member bonding body PA2 is formed. The surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

The reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.

The reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11. The reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.

The reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce | transduced into the bonding position of the 2nd bonding apparatus 17. FIG.

Since the second adsorption device 20 has the same configuration as the first adsorption device 11, the same parts are denoted by the same reference numerals and described. The 2nd adsorption | suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2. The second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.

The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2. Do. The panel holding | maintenance part 11a adsorbs and hold | maintains the upper surface of 2nd optical member bonding body PA2 contact | abutted to the stopper S by vacuum suction. The panel holding | maintenance part 11a moves on the rail R in the state which adsorbed and hold | maintained 2nd optical member bonding body PA2, and conveys 2nd optical member bonding body PA2. When this conveyance is finished, the panel holding unit 11a releases the suction holding and transfers the second optical member bonding body PA2 to the free roller conveyor 24.

The alignment camera 11b holds the second optical member bonding body PA2 in contact with the stopper S by the panel holding portion 11a, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state. Imaging data from the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with respect to the free roller conveyor 24 at the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.

The 2nd dust collector 16 is arrange | positioned in the conveyance direction upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 2nd bonding apparatus 17. FIG. The second dust collecting device 16 performs static electricity removal and dust collection in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side.

The 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16. FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position. Do. The 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13. FIG.

2nd optical member bonding body PA2 and 2nd sheet piece F2m are overlapped and introduce | transduced in the clearance gap (bonding position of the 2nd bonding apparatus 17) between a pair of bonding rollers 23a of the pinching roll 23. FIG. The second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

2nd optical member bonding body PA2 and 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by a pair of bonding roller 23a. In this embodiment, it is a 2nd sheet | seat on the surface (surface on the opposite side to the surface where the 1st optical member F11 of 2nd optical member bonding body PA2 was bonded) of the liquid crystal panel P by the pinching roll 23. By bonding the piece F2m, the third optical member bonding body PA3 is formed.

The 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17. FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

The cut position of the second sheet piece F2m is adjusted based on the detection result of the edge of the second bonding surface. The control part 40 (refer FIG. 11) acquires the data of the edge of the 2nd bonding surface memorize | stored in the memory | storage part, and the 2nd optical member F12 is the outer side of the liquid crystal panel P (outside of a 2nd bonding surface). The cutting position of the second sheet piece F2m is determined so as not to protrude. The second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control unit 40.

The second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42. The 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) of the magnitude | size corresponding to a 2nd bonding surface is formed.

The second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and The 4th optical member bonding body PA4 (optical member bonding body) comprised by bonding the 1st optical member F11 to the surface at the side of the backlight of liquid crystal panel P is formed. The surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.

The first cutting device 31 and the second cutting device 32 are constituted by the laser beam irradiation device 100 described above. The 1st cutting device 31 and the 2nd cutting device 32 cut | disconnect endlessly the sheet piece FXm bonded by liquid crystal panel P along the outer periphery of the bonding surface.

A bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17. The bonding inspection device is an inspection (not shown whether the position of the optical member F1X is within the tolerance range) by the inspection device (not shown) of the workpiece (liquid crystal panel P) on which the film bonding is performed. ) Etc.) is performed. The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

In addition, in this embodiment, the control part 40 as an electronic control apparatus which carries out overall control of each part of the film bonding system 1 is comprised including the computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk.
The control unit 40 of the present embodiment includes an interface that can execute communication with an external device of the computer system. An input device that can input an input signal may be connected to the control unit 40. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control unit 40 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the film bonding system 1 or may be connected to the display device.

An operating system (OS) that controls the computer system is installed in the storage unit of the control unit 40. The storage unit of the control unit 40 includes a program that causes each unit of the film bonding system 1 to execute processing for accurately conveying the optical sheet FX by causing the arithmetic processing unit to control each unit of the film bonding system 1. It is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each unit of the film bonding system 1.

The storage unit includes a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. The storage unit functionally includes the first adsorption device 11, the first dust collector 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the reversing device 15, and the second adsorption device 20. , Second dust collector 16, second bonding device 17, second detection device 42, storage area for storing program software in which the control procedure of the operation of second cutting device 32 is described, and other various storage areas are set Is done.

Hereinafter, with reference to FIG. 18A and 18B, an example of the determination method of the bonding position (relative bonding position) of the sheet piece FXm with respect to liquid crystal panel P is demonstrated.

First, as shown in FIG. 18A, a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the direction of the optical axis of the optical sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical sheet FX is stored in a storage device (not shown) in association with the position of the optical sheet FX (position in the longitudinal direction and position in the width direction of the optical sheet FX).

The control unit 40 acquires the optical axis data (inspection data on the in-plane distribution of the optical axis) of each inspection point CP from the storage device, and partitions the optical sheet FX (cut line CL) into the portion where the sheet piece FXm is cut out. The direction of the average optical axis of the region to be detected is detected.

For example, as shown in FIG. 18B, an angle (deviation angle) formed between the direction of the optical axis and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest angle (maximum deviation angle) among the deviation angles. Is θmax and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is detected as the average deviation angle. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical sheet FX is detected as the direction of the average optical axis of the optical sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical sheet FX and the clockwise direction being negative.

And the direction of the average optical axis of the optical sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis of the optical sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

The first cutting device 31 and the second cutting device 32 described above detect the outer peripheral edge of the display area P4 of the liquid crystal panel P by a detection means such as a camera, and paste the sheet piece FXm bonded to the liquid crystal panel P to the bonding surface. Cut endlessly along the outer periphery. The outer peripheral edge of the bonding surface is detected by imaging the edge of the bonding surface.
In this embodiment, the laser cutting by each of the 1st cutting device 31 and the 2nd cutting device 32 is performed along the outer periphery of the bonding surface.

¡The deflection width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in this embodiment, compared with the case where the optical sheet FX is cut using a cutting blade, it can be easily cut along the outer peripheral edge of the bonding surface, and the liquid crystal panel P can be downsized and / or ) The display area P4 can be enlarged. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

Further, when the optical sheet FX is cut into a sheet piece aligned with the display area P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the sheet piece and the liquid crystal panel P Therefore, it becomes difficult to reduce the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).

On the other hand, when cutting out the sheet piece FXm of the optical sheet FX of a size that protrudes from the optical sheet FX to the outside of the liquid crystal panel P, and pasting the cut sheet piece FXm on the liquid crystal panel P and cutting it according to the bonding surface, cutting Only the run-out tolerance of the line needs to be considered, and the tolerance of the width of the frame G can be reduced (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

Further, by cutting the sheet piece FXm with a laser instead of a blade, the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion.

FIG. 19 shows a control for scanning a laser beam in a rectangular shape on the sheet piece FXm when the sheet piece FXm is cut into an optical member F1X having a predetermined size using the laser beam irradiation apparatus 100 shown in FIG. 1 as a cutting device. It is a figure which shows a method.

In FIG. 19, reference numeral Tr denotes a target laser beam movement locus (desired locus; hereinafter referred to as laser light movement locus), and reference numeral Tr <b> 1 denotes movement due to relative movement between the table 101 and the scanner 105. This is a trajectory obtained by projecting the trajectory onto the sheet piece FXm (hereinafter also referred to as a light source movement trajectory). The light source movement trajectory Tr1 has a shape in which four corners of the laser light movement trajectory Tr having a rectangular shape are curved, the symbol SL1 is a straight section other than the corner, and the symbol SL2 is a bent section of the corner. Reference numeral Tr2 indicates that the irradiation position of the laser beam is perpendicular to the light source movement locus Tr1 by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 when the scanner 105 is relatively moving on the light source movement locus Tr1. It is a curve (hereinafter also referred to as an adjustment curve) indicating how much is shifted (adjusted). The deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.

As shown in FIG. 19, the light source movement locus Tr1 is a substantially rectangular movement locus with curved corners. The light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area. If the light source movement locus Tr1 has a rectangular shape, the moving speed of the scanner 105 is slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser light. For this reason, in FIG. 19, the corners of the light source movement locus Tr1 are curved so that the moving speed of the scanner 105 is substantially constant over the entire light source movement locus Tr1.

Since the light source movement locus Tr1 and the laser beam movement locus Tr coincide with each other when the scanner 105 is moving in the straight section SL1, the control device 107 sets the irradiation position of the laser beam to the first irradiation position adjusting device 151. And without adjusting by the 2nd irradiation position adjustment apparatus 154, a laser beam is irradiated to the sheet piece FXm from the scanner 105 as it is. On the other hand, when the scanner 105 is moving in the bending section SL2, the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 perform laser light. The irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr. For example, when the scanner 105 is moving at the position indicated by the symbol M1, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 move the laser beam irradiation position in the direction N1 perpendicular to the light source movement locus Tr1. Shifted by W1. The distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1. The light source movement trajectory Tr1 is displaced inward from the laser light movement trajectory Tr, and the irradiation position of the laser light is set to the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 so as to cancel out the deviation. Therefore, the irradiation position of the laser beam is arranged on the laser beam movement track Tr.

As explained above, according to the film bonding system 1 of this embodiment, since the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus mentioned above, 1st sheet piece F1m, The 2nd sheet piece F2m can be cut | disconnected sharply, and the fall of cut quality can be suppressed.

Further, under the control of the control device 107, the moving device 106 and the scanner 105 are controlled so as to draw a desired trajectory Tr in the sheet piece FXm. In this configuration, the laser beam irradiation section to be adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only the narrow bending section SL2. In the other wide straight section SL1, the laser beam is scanned on the sheet piece FXm by the movement of the table 101 by the moving device 106. In the present embodiment, laser beam scanning is mainly performed by the moving device 106, and the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 perform laser only in an area where the irradiation position of the laser beam cannot be accurately controlled by the moving device 106. The light irradiation position is adjusted. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.

Moreover, the imaging direction of the imaging device 43 crosses diagonally with respect to the normal direction of the first bonding surface SA1. That is, the imaging direction of the imaging device 43 is set so that the edge of the second substrate P2 does not enter the imaging field of view of the imaging device 43. Therefore, when the edge ED of the first bonding surface SA1 is detected over the first sheet piece F1m, the edge of the second substrate P2 is not erroneously detected, and the first bonding surface SA1 is not detected. Only the edge ED can be detected. Therefore, the edge ED of the first bonding surface SA1 can be detected with high accuracy.

Moreover, after bonding the 1st sheet piece F1m and the 2nd sheet piece F2m of the size which protrudes on the outer side of the liquid crystal panel P to the liquid crystal panel P, the excess part of the 1st sheet piece F1m and the 2nd sheet piece F2m is cut off. The first optical member F11 and the second optical member F12 having a size corresponding to the bonding surface can be formed on the surface of the liquid crystal panel P. Thereby, the 1st optical member F11 and the 2nd optical member F12 can be provided accurately to the time of a pasting surface, the frame part G outside the display field P4 is narrowed, and an enlargement of a display area and size reduction of an apparatus are carried out. Can be planned.

Also, by sticking the first sheet piece F1m and the second sheet piece F2m of a size that protrudes outside the liquid crystal panel P to the liquid crystal panel P, the first sheet piece F1m and the second sheet piece F2m are arranged in accordance with the positions of the first sheet piece F1m and the second sheet piece F2m. Even when the optical axis direction of the 1 sheet piece F1m and the 2nd sheet piece F2m changes, the liquid crystal panel P can be aligned and bonded according to the optical axis direction. Thereby, the precision of the optical axis direction of the 1st optical member F11 and the 2nd optical member F12 with respect to liquid crystal panel P can be improved, and the clarity and contrast of an optical display device can be improved.

Moreover, the 1st cutting device 31 and the 2nd cutting device 32 cut the 1st sheet piece F1m and the 2nd sheet piece F2m with a blade by laser-cutting the 1st sheet piece F1m and the 2nd sheet piece F2m. As compared with the above, the liquid crystal panel P is not exerted with force, cracks and chips are less likely to occur, and the liquid crystal panel P can have a stable durability.

In addition, in this embodiment, although demonstrated as an example the structure which cut | disconnects a sheet piece as a structure which irradiates a target object with a laser beam and performs a predetermined process, it is not restricted to this. For example, in addition to dividing the sheet piece into at least two parts, cutting a sheet penetrating the sheet piece and forming a groove (cut) with a predetermined depth in the sheet piece are also included. To do. More specifically, for example, cutting (cutting off) an end portion of a sheet piece, half cutting, marking processing, and the like are included.

In the present embodiment, the case where the drawing locus of the laser beam emitted from the laser beam irradiation device is a rectangular shape (square shape) in plan view has been described as an example, but the present invention is not limited thereto. For example, the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape that is a pentagon or more in plan view. Moreover, not only this but a planar-view star shape and planar-view geometric shape may be sufficient. The present invention can also be applied to such a drawing trajectory.

In the present embodiment, the optical sheet FX is pulled out from the original roll, and a sheet piece FXm of a size that protrudes outside the liquid crystal panel P is bonded to the liquid crystal panel P, and then the liquid crystal panel P is bonded from the sheet piece FXm. Although the case where it cut out to the optical member F1X of the magnitude | size corresponding to a surface was mentioned and demonstrated was demonstrated, it is not restricted to this. For example, the present invention can also be applied to the case where a sheet-like optical film chip cut out to the outside of the liquid crystal panel P is bonded to the liquid crystal panel without using the roll.

As described above, the preferred embodiment according to the present embodiment has been described with reference to the accompanying drawings, but the present invention is not limited to the example. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (manufacturing apparatus of an optical member bonding body), 23 ... Nipping roll (bonding apparatus), 31 ... 1st cutting device, 32 ... 2nd cutting device, 100 ... Laser beam irradiation apparatus, 101 ... Table, 101s ... holding surface, 102 ... laser oscillator, 103 ... acousto-optic element, 105 ... scanner, 106 ... moving device, 107 ... control device, 108 ... condensing lens, 130 ... EBS (shielding means, shielding unit), 171 DESCRIPTION OF SYMBOLS Laser control part, P ... Liquid crystal panel (optical display component), P1 ... 1st board | substrate, P2 ... 2nd board | substrate, FX ... Optical sheet, FXm ... Sheet piece, F1X ... Optical member, PA1 ... 1st optical member bonding body (Sheet piece bonding body), PA4 ... 4th optical member bonding body (optical member bonding body), SA1 ... 1st bonding surface, ED ... edge.

Claims

A laser oscillator that emits laser light;
A shielding part that shields the laser light until the output of the laser light is stabilized;
Including laser beam irradiation device.
The shielding part is
An acousto-optic element;
A control device for controlling the timing at which the laser light passes through the acoustooptic device;
The laser beam irradiation apparatus according to claim 1 comprising:
The laser light irradiation apparatus according to claim 2, wherein the control device controls the timing so that a rising portion of the laser light is removed.
4. The laser light irradiation device according to claim 2, wherein the control device controls the timing so that a falling portion of the laser light is removed.
A table having a holding surface for holding an object;
A laser oscillator that emits laser light;
A scanner that biaxially scans the laser beam in a plane parallel to the holding surface;
A moving device for relatively moving the table and the scanner;
A shielding part that shields the laser light until the output of the laser light is stabilized;
Including laser beam irradiation device.
The shielding part is
An acousto-optic element;
A control device for controlling the timing at which the laser light passes through the acoustooptic device;
The laser beam irradiation apparatus of Claim 5 containing.
The laser light irradiation apparatus according to claim 5 or 6, comprising a condensing lens that condenses the laser light emitted from the scanner toward the holding surface.
It is a manufacturing apparatus of an optical member bonding body configured by bonding an optical member to an optical display component,
A bonding apparatus that forms a sheet piece bonded body by bonding a sheet piece of a size that protrudes outside the optical display component to the optical display component;
Along the edge of the bonding surface between the optical display component of the sheet piece bonding body and the sheet piece, the sheet piece of the portion protruding from the sheet surface bonding body to the outside of the bonding surface is cut off, A cutting device for forming the optical member having a size corresponding to the bonding surface,
The said cutting device is comprised by the laser beam irradiation apparatus as described in any one of Claim 1-7, and the said sheet piece which is a target object is cut | disconnected by the laser beam irradiated from the said laser beam irradiation device. The manufacturing apparatus of an optical member bonding body.