KR102120507B1 - Detection apparatus, method for manufacturing optical member-bonded body, and method for manufacturing optical member-bonded body - Google Patents

Abstract

The detection device 41 is a sheet piece bonding body PA1 constituted by bonding sheet pieces F1m having a size protruding outside the optical display parts P1 and P2 to the optical display parts P1 and P2. The illumination light source 44 which illuminates the edge ED of the bonding surface SA1 of the optical display components P1, P2 and the sheet piece F1m, and the edge part on the side of the sheet piece F1m It includes the imaging device 43 arrange|positioned in the space inside the (ED), and images the image of the edge part ED.

Description

DETECTION APPARATUS, METHOD FOR MANUFACTURING OPTICAL MEMBER-BONDED BODY, AND METHOD FOR MANUFACTURING OPTICAL MEMBER-BONDED BODY}

The present invention relates to a detection device, an apparatus for manufacturing an optical member bonding body, and a method for manufacturing an optical member bonding body.

This application claims priority based on Japanese Patent Application No. 2012-227074 for which it applied to Japan on October 12, 2012, and uses the content here.

Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical member such as a polarizing plate bonded to a liquid crystal panel (optical display component) is cut out from a long film into a sheet piece sized to fit the display area of the liquid crystal panel, and then It is bonded to a liquid crystal panel (for example, refer patent document 1).

However, in this method, an operation such as wrapping or unpacking a sheet piece occurs, and problems such as defective products occur with these operations. Therefore, in order to solve such a problem, the method described in Patent Document 2 has been proposed. In the method of patent document 2, a film with a long width corresponding to the length of a long side or a short side of a liquid crystal panel is unwound from a fabric roll, and after bonding this long film to a liquid crystal panel, the length of the short side or long side of the liquid crystal panel Is to cut it.

Japanese Patent Publication 2003-255132 JP Japanese Patent No. 4628488

The liquid crystal panel is formed by bonding two substrates with a liquid crystal layer interposed therebetween. As a method of manufacturing a liquid crystal panel, a method of manufacturing a liquid crystal panel by dividing a mother panel engraved with a scribe line is known. In the mother panel, two mother substrates having a size of a plurality of liquid crystal panels are bonded with a liquid crystal layer interposed therebetween. A scribe line is formed on each of the two mother substrates, and the two mother substrates are sequentially divided along the scribe line. In this case, a burn-up during panel dividing or a shift in the position of the edge of the edge between the upper and lower substrates (shift in the split position) may occur on the end face of the liquid crystal panel.

When the film is bonded to the liquid crystal panel using the method of Patent Document 2, the edge of the bonding surface of the liquid crystal panel is detected beyond the film, and the film is cut along the edge of the bonding surface. In this case, if there is a misalignment of the edge position between the burrs and the upper and lower substrates on the end face of the liquid crystal panel, the burr lower substrate (substrate on the opposite side from the bonding side) different from the original bonding surface when the bonding surface is seen over the film. In some cases, the edge is visually recognized together with the bonding surface, and the end edge of the original bonding surface may not be recognized. For this reason, there has been a demand for a means capable of detecting only the bonding surface with high precision, excluding the influence of the displacement of the edge position between the burrs and the upper and lower substrates when detecting the bonding surface over the film.

The form of this invention was made|formed in view of such circumstances, and it aims at providing the detection apparatus which can detect the edge of a joint surface with high precision, and the manufacturing apparatus of an optical member bonding body.

In order to achieve the above object, the detection device according to the aspect of the present invention and the manufacturing device for the optical member bonding body adopt the following structures.

(1) The detection device according to one embodiment of the present invention includes the optical display component and the optical component of the sheet piece assembly formed by bonding a sheet piece having a size protruding outward from the optical display component with respect to the optical display component. It is a detection device which detects the end edge of the bonding surface of a sheet piece, and it is arrange|positioned in the position inclined inward of the bonding surface with respect to the normal direction of the bonding surface with the illumination light source illuminating the said edge, And an imaging device that captures an image of the edge of the end of the sheet piece joined body on the side where the sheet piece is joined.

(2) In the detection device according to (1), the illumination light source may be disposed on the opposite side to the side where the sheet piece is joined to the sheet piece bonding body.

(3) In the detection device according to (2), the illumination light source may be disposed at a position inclined outside the bonding surface with respect to the normal direction of the bonding surface, rather than at the edge of the end.

(4) In the detection device according to any one of (1) to (3), the illumination light source and the imaging device are respectively arranged at positions corresponding to four corner portions of the bonding surface having a rectangular shape. It may be.

(5) In the detection device according to any one of (1) to (4) above, the optical display component may be formed by joining two substrates.

(6) An apparatus for manufacturing an optical member bonding body according to another aspect of the present invention is an apparatus for manufacturing an optical member bonding body formed by bonding an optical member to an optical display component, and the optical display component is outside the optical display component. (1) to (5) detecting an edge of a bonding device for forming a sheet piece bonding body by joining a sheet piece having a protruding size, and an end edge of the bonding surface of the sheet display, the optical display component and the sheet piece. ), by performing laser cutting along the edge of the end with the detection device described in any one of the above, to separate the sheet piece of the portion protruding outward of the bonding surface from the sheet piece bonding body, corresponding to the bonding surface It includes a cutting device for forming the optical member having a size.

According to the aspect of the present invention, the edge of the end of the joint surface can be detected with high precision.

1 is a schematic diagram showing an apparatus for manufacturing an optical member bonding body according to an embodiment of the present invention.
2 is a plan view of the liquid crystal panel.
3 is a cross-sectional view taken along line AA of FIG. 2.
4 is a cross-sectional view of the optical sheet.
5 is a view showing the operation of the cutting device.
Fig. 6 is a plan view showing an end edge detection process of a bonding surface.
7 is a schematic view of a detection device.
8A is a view showing an example of a method for determining a bonding position of a sheet piece to a liquid crystal panel.
8B is a view showing an example of a method for determining a bonding position of a sheet piece to a liquid crystal panel.
9 is a perspective view for explaining the operation of the detection device according to the comparative example.
10 is a cross-sectional view for explaining the operation of the detection device according to the comparative example.
11 is a perspective view for explaining the operation of the detection device according to the embodiment of the present invention.
12 is a cross-sectional view for explaining the operation of the detection device according to the embodiment of the present invention.
It is sectional drawing for demonstrating the operation|movement of the detection apparatus which concerns on one Embodiment of this invention when the modification of the sheet piece bonding body is applied.

Hereinafter, although embodiment of this invention is described, referring drawings, this invention is not limited to the following embodiment.

In addition, in all the following drawings, in order to make the drawings easy to see, the dimensions, ratios, and the like of each component are appropriately different. In addition, in the following description and drawings, the same reference numerals are assigned to the same or equivalent elements, and overlapping descriptions are omitted.

In the following description, the XYZ Cartesian coordinate system is set as necessary, and the positional relationship of each member will be described with reference to the XYZ Cartesian coordinate system. In this embodiment, the conveyance direction of the liquid crystal panel which is an optical display component is set to the X direction, and the direction orthogonal to the X direction (width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to is set to the Z direction.

Hereinafter, the film bonding system 1 which is the manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention is demonstrated with reference to drawings.

1 is a diagram showing a schematic configuration of the film bonding system 1 of this embodiment.

The film bonding system 1 bonds a film-like optical member, such as a polarizing film, an antireflection film, and a light diffusion film, to an optical display component on a panel, such as a liquid crystal panel or an organic EL panel, for example.

1, the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of the liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is collectively controlled by the control part 40 as an electronic control device.

2 is a plan view of the liquid crystal panel P as viewed from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a relatively small rectangular shape disposed opposite to the first substrate P1, and a first substrate P1. A liquid crystal layer P3 encapsulated between the substrate P1 and the second substrate P2 is provided. The liquid crystal panel P has a rectangular shape that follows the outer shape of the first substrate P1 in plan view. In the liquid crystal panel P, an area accommodated inside the outer periphery of the liquid crystal layer P3 as viewed from a plane is referred to as a display area P4.

3 is a cross-sectional view taken along line A-A in FIG. 2. On the front and back surfaces of the liquid crystal panel P, each of the first optical sheet F1 and the second optical sheet F2 (see FIG. 1, hereinafter referred to as the optical sheet FX in some cases) in the form of a long band is respectively provided. The cut first optical member F11 and the second optical member F12 (hereinafter sometimes referred to collectively as the optical member F1X) are appropriately bonded. In this embodiment, the 1st optical member F11 and the 2nd optical member F12 as a polarizing film are bonded to both surfaces of the backlight side and the display surface side of the liquid crystal panel P, respectively.

A frame portion G having a predetermined width is disposed outside the display area P4 to arrange a sealing agent or the like for bonding the first substrate P1 and the second substrate P2 of the liquid crystal panel P.

Note that the first optical member F11 and the second optical member F12 may be collectively referred to as a first sheet piece F1m and a second sheet piece F2m (hereinafter referred to as a sheet piece FXm), which will be described later. ) Is formed by separating the excess portion on the outside of the bonding surface of the liquid crystal panel P and the sheet piece FXm, respectively. The bonding surface will be described later.

The liquid crystal panel P according to the present embodiment is produced by a method of manufacturing a liquid crystal panel by dividing a mother panel engraved with a scribe line. In the mother panel, two mother substrates having a size of a plurality of liquid crystal panels are bonded with a liquid crystal layer interposed therebetween. A scribe line is formed on each of the two mother substrates, and the two mother substrates are sequentially divided along the scribe line. In this case, a burn-up during panel dividing, a shift in the position of the edge of the edge between the upper and lower substrates (a shift in the split position), etc. may occur on the end face of the liquid crystal panel.

In addition, the shifts between the substrates and the burrs during panel division will be described later.

4 is a partial cross-sectional view of the optical sheet FX bonded to the liquid crystal panel P. The optical sheet FX includes a film-shaped optical member main body F1a, an adhesive layer F2a formed on one surface (the upper surface in FIG. 4) of the optical member main body F1a, and an optical member through the adhesive layer F2a It has a separator F3a stacked detachably on one side of the main body F1a, and a surface protection film F4a laminated on the other side (lower surface in Fig. 4) of the optical member main body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire area of the display area P4 of the liquid crystal panel P and the peripheral area of the display area P4. In addition, hatching of each layer in FIG. 4 is omitted for reasons of illustration.

The optical member main body F1a is bonded to the liquid crystal panel P through the adhesive layer F2a while separating the separator F3a while leaving the adhesive layer F2a on one side of the optical member main body F1a. do. Hereinafter, the part excluding the separator F3a from the optical sheet FX may be called a bonding sheet F5.

The separator F3a protects the adhesive layer F2a and the optical member body F1a while being separated from the adhesive layer F2a. The surface protection film F4a is bonded to the liquid crystal panel P together with the optical member main body F1a. The surface protection film F4a is disposed on the opposite side to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protection film F4a is separated from the optical member body F1a at a predetermined timing. Further, the optical sheet FX may be of a configuration that does not include the surface protection film F4a, or the surface protection film F4a may be of a configuration that is not separated from the optical member body F1a.

The optical member main body F1a is bonded to a sheet-shaped polarizer F6, a first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and an adhesive or the like to the other surface of the polarizer F6. It has a second film (F8). The 1st film F7 and the 2nd film F8 are protective films which protect the polarizer F6, for example.

Further, the optical member main body F1a may be a single-layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film, a brightness enhancing film, or the like. At least one of the first film (F7) and the second film (F8) may be subjected to a surface treatment to obtain an effect such as a hard coating process that protects the outermost surface of the liquid crystal display device or antiglare treatment including anti-glare treatment. have. The optical member main body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member body F1a through the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is explained in full detail.

As shown in FIG. 1, the film bonding system 1 of this embodiment is a liquid crystal panel P on the left side in the drawing from an upstream side (+X direction side) in the conveying direction of the liquid crystal panel P on the right side in the figure. On the downstream side (-X-direction side) of the conveying direction of, a driving roller conveyor 5 for conveying the liquid crystal panel P in a horizontal state is provided.

Hereinafter, the conveyance direction upstream side of the liquid crystal panel P (or the optical member bonding body mentioned later) in the film bonding system 1 may be called the panel conveyance downstream side, and the conveyance direction downstream side may be called the panel conveyance downstream side.

The roller conveyor 5 is divided into an upstream-side conveyor 6 and a downstream-side conveyor 7 with the inversion device 15 described later as a boundary. On the upstream side conveyor 6, the liquid crystal panel P is conveyed by making the short side of the display area P4 follow the conveying direction. On the other hand, in the downstream-side conveyor 7, the liquid crystal panel P is conveyed along the long side of the display area P4 along the conveying direction. The sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out from the band-shaped optical sheet FX to a predetermined length is bonded to the front and back surfaces of the liquid crystal panel P.

Further, the upstream conveyor 6 is provided with a free roller conveyor 24 independent of the downstream side in the first adsorption device 11 described later. On the other hand, the downstream-side conveyor 7 is provided with an independent free-roller conveyor 24 on the downstream side in the second adsorption device 20 described later.

The film bonding system 1 of the present embodiment includes a first adsorption device 11, a first dust collection device 12, a first bonding device 13, a first detection device 41, and a first cutting device 31. , An inverting device 15, a second dust collecting device 16, a second bonding device 17, a second detecting device 42, a second cutting device 32 and a control unit 40.

The 1st adsorption apparatus 11 adsorbs the liquid crystal panel P, conveys it to the upstream side conveyor 6, and performs alignment (positioning) of the liquid crystal panel P. The 1st adsorption apparatus 11 has the panel holding part 11a, the alignment camera 11b, and the rail R.

The panel holding portion 11a maintains the liquid crystal panel P in contact with the stopper S on the downstream side by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and of the liquid crystal panel P. Alignment is performed. The panel holding portion 11a adsorbs and holds the top surface of the liquid crystal panel P in contact with the stopper S by vacuum adsorption. The panel holding portion 11a moves on the rail R in a state where the liquid crystal panel P is adsorbed and held to convey the liquid crystal panel P. The panel holding part 11a releases the adsorption holding after conveyance is completed, and delivers the liquid crystal panel P to the free roller conveyor 24.

The alignment camera 11b holds the liquid crystal panel P in contact with the stopper S, and the panel holding unit 11a holds the liquid crystal panel P, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in an elevated state. The imaging data by the alignment camera 11b is transmitted to the control part 40, and based on this imaging data, the panel holding part 11a is operated and the liquid crystal panel P for the free roller conveyor 24 of the conveyance destination The alignment is made. That is, the liquid crystal panel P is free roller conveyor 24 in the state of adding a shift in the conveying direction to the free roller conveyor 24, a direction orthogonal to the conveying direction, and a turning direction around the vertical axis of the liquid crystal panel P. ).

Here, the liquid crystal panel (P) conveyed on the rail (R) by the panel holding portion (11a) in the state adsorbed to the adsorption pad (26) with the sheet piece (FXm), the front end portion to the pinching pressure roll (23) Is pinched.

The 1st dust collecting apparatus 12 is provided in the panel conveyance upstream side of the pinching pressure roll 23 which is the bonding position of the 1st bonding apparatus 13. The first dust collecting device 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.

The 1st bonding apparatus 13 is provided in the downstream side of panel conveyance rather than the 1st adsorption apparatus 11. The 1st bonding apparatus 13 bonds the bonding sheet|seat F5 (equivalent to the 1st sheet piece F1m) cut to the predetermined size with respect to the lower surface of the liquid crystal panel P introduce|transduced at the bonding position.

The 1st bonding apparatus 13 is equipped with the conveying apparatus 22 and the pinching pressure roll 23.

The conveying apparatus 22 conveys the optical sheet FX along its longitudinal direction, unwinding the optical sheet FX from the raw roll R1 in which the optical sheet FX was wound. The conveying apparatus 22 conveys the bonding sheet|seat F5 using separator F3a as a carrier. The conveying device 22 has a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding portion 22a holds the fabric roll R1 wound around the belt-shaped optical sheet FX and releases the optical sheet FX along its longitudinal direction.

The plurality of guide rollers 22b wind the optical sheet FX to guide the optical sheet FX unwound from the raw roll R1 along a predetermined conveying path.

The cutting device 22c half-cuts the optical sheet FX on a conveyance path.

The knife edge 22d winds the half-cut optical sheet FX at an acute angle to separate the bonding sheet F5 from the separator F3a, while bonding the bonding sheet F5 separated from the separator F3a to the bonding position. To supply.

The winding-up part 22e holds the separator roll R2 which winds up the separator F3a which became individual through the knife edge 22d.

The roll holding part 22a located at the starting point of the conveying device 22 and the winding part 22e located at the end point of the conveying device 22 are driven in synchronization with each other, for example. Thereby, the roll holding part 22a unwinds the optical sheet FX in the conveyance direction of the optical sheet FX, and the winding-up part 22e winds up the separator F3a which passed through the knife edge 22d. Hereinafter, the upstream side of the conveyance direction of the optical sheet FX (separator F3a) in the conveyance apparatus 22 may be referred to as the sheet conveyance downstream side of the sheet conveyance upstream side.

Each guide roller 22b changes the traveling direction of the optical sheet FX during transportation along the transportation path, and at least a part of the plurality of guide rollers 22b adjusts the tension of the optical sheet FX during transportation. To do it.

Further, a dancer roller (not shown) may be disposed between the roll holding portion 22a and the cutting device 22c. The dancer roller absorbs the output amount of the optical sheet FX conveyed from the roll holding portion 22a while the optical sheet FX is cut by the cutting device 22c.

5 is a diagram showing the operation of the cutting device 22c of the present embodiment.

As shown in Fig. 5, the cutting device 22c extends over the entire width of the optical sheet FX in the width direction orthogonal to the longitudinal direction of the optical sheet FX when the optical sheet FX is unwound at a predetermined length. FX) is cut in half to cut a portion in the thickness direction. The cutting device 22c of this embodiment is provided so that the optical sheet FX can move back and forth toward the optical sheet FX from the side opposite to the separator F3a.

The cutting device 22c prevents the optical sheet FX (separator F3a) from breaking due to tension acting during conveyance of the optical sheet FX (so that a predetermined thickness remains on the separator F3a), the cutting blade The advancing and retreating positions are adjusted to half-cut to the vicinity of the interface between the adhesive layer F2 and the separator F3a. Further, a laser device can be used instead of the cutting blade.

In the optical sheet FX after the half cut, the optical member main body F1a and the surface protection film F4a are cut in the thickness direction of the optical sheet FX, so that the section covering the entire width in the width direction of the optical sheet FX The infeed line L1 and the infeed line L2 are formed. The cut line L1 and the cut line L2 are formed so as to be arranged in plural in the longitudinal direction of the belt-shaped optical sheet FX. For example, in the case of a bonding process for conveying the liquid crystal panel P having the same size, a plurality of cut lines L1 and cut lines L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX. The optical sheet FX is divided into a plurality of sections in the longitudinal direction by a plurality of cut lines L1 and cut lines L2. In the optical sheet FX, the sections sandwiched by a pair of adjacent cutting lines L1 and cut lines L2 in the longitudinal direction are each one sheet piece FXm in the bonding sheet F5. do. The sheet piece FXm is a sheet piece of the optical sheet FX having a size protruding outside the liquid crystal panel P.

1, the knife edge 22d is disposed below the upstream conveyor 6 and extends at least over its entire width in the width direction of the optical sheet FX. The knife edge 22d winds the optical sheet FX after the half-cut so as to slide into contact with the separator F3a side of the optical sheet FX after the half-cut.

The knife edge 22d includes the first surface disposed in a prone position viewed from the width direction of the optical sheet FX (the width direction of the upstream conveyor 6), and the optical sheet FX above the first surface. It has a 2nd surface arrange|positioned at an acute angle with respect to a 1st surface seen from the width direction, and the front end part which the 1st surface and a 2nd surface intersect.

In the 1st bonding apparatus 13, the knife edge 22d winds the 1st optical sheet F1 at an acute angle to the tip end of the knife edge 22d. The first optical sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when retracting at an acute angle at the tip of the knife edge 22d. The tip end of the knife edge 22d is disposed close to the panel conveying downstream side of the pinching pressure roll 23. The 1st sheet piece F1m separated from the separator F3a by the knife edge 22d overlaps the lower surface of the liquid crystal panel P in the state adsorbed by the 1st adsorption apparatus 11, and the pinching pressure roll 23 ) Is introduced between the pair of bonding rollers 23a. The first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size protruding outward from the liquid crystal panel P.

On the other hand, the separator F3a separated from the bonding sheet F5 by the knife edge 22d faces the winding portion 22e. The winding-up part 22e winds up the separator F3a separated from the bonding sheet F5, and collects it.

The pinching pressure roll 23 joins the first sheet F1m from which the conveying device 22 is separated from the first optical sheet F1 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6. do. Here, the pinching pressure roll 23 corresponds to the bonding apparatus described in the claims.

The pinching pressure roll 23 has a pair of bonding rollers 23a and bonding rollers 23a arranged parallel to each other in the axial direction (the upper bonding rollers 23a are inverted up and down). A predetermined gap is formed between the pair of bonding rollers 23a and 23a, and this gap becomes the bonding position of the first bonding device 13.

The liquid crystal panel P and the first sheet piece F1m are overlapped and introduced into the gap. The liquid crystal panel P and the first sheet piece F1m are sent out to the panel conveying downstream side of the upstream side conveyor 6 while being pressed against each bonding roller 23a. In this embodiment, the 1st optical member bonding body PA1 is formed by bonding the 1st sheet piece F1m to the surface of the backlight side of the liquid crystal panel P by the pinching pressure roll 23. Here, the 1st optical member bonding body PA1 is corresponded to the sheet piece bonding body described in a claim.

The 1st detection apparatus 41 is provided in the downstream side of a panel conveyance rather than the 1st bonding apparatus 13. The first detection device 41 detects the end edge (end edge portion) of the bonding surface (hereinafter referred to as the first bonding surface) of the liquid crystal panel P and the first sheet piece F1m.

6 is a plan view showing a detection process of the edge ED of the first bonding surface SA1.

The first detection device 41 has, for example, an end edge of the first bonding surface SA1 in four inspection areas CA formed on the transport path of the upstream conveyor 6 as shown in FIG. 6. (ED) is detected. Each inspection area CA is arranged at a position corresponding to four corner portions of the first bonding surface SA1 having a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The data of the end edge ED detected by the first detection device 41 is stored in a storage unit (not shown).

The position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side).

7 is a schematic view of the first detection device 41.

In FIG. 7, for convenience, the side where the first sheet piece F1m of the first optical member bonding body PA1 is bonded is set to the upper side, and the configuration of the first detection device 41 is shown upside down.

As shown in FIG. 7, the 1st detection apparatus 41 is more than the edge ED with respect to the illumination light source 44 which lights up the edge ED, and the normal direction of the 1st bonding surface SA1. An imaging device disposed at a position inclined inwardly of the first bonding surface SA1, and imaging an image of the end edge ED from the side where the first sheet piece F1m of the first optical member bonding body PA1 is bonded. (43).

In other words, the imaging device 43 is disposed in a space inside the edge ED of the first sheet piece F1m, and captures an image of the edge ED.

The illumination light source 44 and the imaging device 43 are arrange|positioned at the four inspection areas CA shown in FIG. 6 (positions corresponding to the four corner portions of the first bonding surface SA1), respectively.

The angle θ (hereinafter referred to as the inclination angle θ of the imaging device 43) between the normal of the first bonding surface SA1 and the normal of the imaging surface 43a of the imaging device 43 is referred to as imaging of the imaging device 43 It is also possible to set so that no deviation, burrs, etc., when dividing the panel within the field of view are drawn in. For example, when the end surface of the second substrate P2 is shifted outward than the end surface of the first substrate P1, the inclination angle θ of the imaging device 43 is within the imaging field of view of the imaging device 43 The end edge of the second substrate P2 is set so that it does not enter.

The inclination angle θ of the imaging device 43 is the distance H between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as the height H of the imaging device 43). It may be set to suit. For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 may be set to an angle in a range of 5° or more and 20° or less. However, when the amount of misalignment is known empirically, the height H of the imaging device 43 and the inclination angle θ of the imaging device 43 may be determined based on the amount of misalignment that is empirically known. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10°.

The illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.

In addition, the illumination light source 44 and the imaging device 43 may be arrange|positioned so that a movement is possible along the edge ED of 1st bonding surface SA1. In this case, only one illumination light source 44 and one imaging device 43 should be provided. In addition, by this, the illumination light source 44 and the imaging device 43 can be moved to the position where the edge ED of 1st bonding surface SA1 is easy to image.

The illumination light source 44 is arrange|positioned on the opposite side to the side to which the 1st sheet piece F1m of the 1st optical member bonding body PA1 was bonded. The illumination light source 44 is arrange|positioned in the position inclined outside the 1st bonding surface SA1 from the edge ED with respect to the normal direction of the 1st bonding surface SA1. In this embodiment, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.

Moreover, the illumination light source may be arrange|positioned at the side by which the 1st sheet piece F1m of the 1st optical member bonding body PA1 was bonded.

In addition, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may intersect slightly.

The cut position of the 1st sheet piece F1m is adjusted based on the detection result of the edge ED of 1st bonding surface SA1. The control unit 40 (see FIG. 1) acquires data of the edge ED of the first bonding surface SA1 stored in the storage unit, and the first optical member F11 is outside the liquid crystal panel P The cut position of the first sheet piece F1m is determined so as to have a size that does not stick out (outside of the first bonding surface SA1). The first cutting device 31 cuts the first sheet piece F1m at the cut position determined by the control unit 40.

Returning to FIG. 1, the first cutting device 31 is provided on the downstream side of the panel transport than the first detection device 41. The 1st cutting device 31 is the 1st sheet piece of the part which protruded outward of the 1st bonding surface SA1 from the 1st optical member bonding body PA1 by performing a laser cut along the edge ED. (F1m) (the surplus portion of the first sheet piece F1m) is separated to form an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1. Here, the 1st cutting device 31 is corresponded to the cutting device described in a claim.

Here, "the size corresponding to the first bonding surface SA1" indicates the size of the outer shape of the first substrate P1. However, it is an area that is equal to or larger than the size of the display area P4 and less than or equal to the size of the outer shape of the liquid crystal panel P, but also includes an area that avoids functional parts such as an electrical component installation unit.

The surplus part of the first sheet piece F1m is separated from the first optical member bonding body PA1 by the first cutting device 31, so that the first optical member F11 is attached to the surface of the backlight side of the liquid crystal panel P. The 2nd optical member bonding body PA2 comprised by this bonding is formed. The excess portion separated from the first sheet piece F1m is separated from the liquid crystal panel P by a peeling device (not shown) and collected.

The inverting device 15 front-reversely reverses the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the top surface, and sets the backlight side of the liquid crystal panel P to the top surface, and the second bonding device. The liquid crystal panel P is aligned with respect to (17).

The inversion device 15 has an alignment function similar to that of the panel holding portion 11a of the first adsorption device 11. The inversion device 15 is provided with an alignment camera 15c similar to the alignment camera 11b of the first adsorption device 11.

The inverting device 15 is based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c, the second optical member bonding body PA2 to the second bonding device 17 The positioning in the width direction of the component and positioning in the rotation direction are performed. In this state, the second optical member bonding body PA2 is introduced at the bonding position of the second bonding device 17.

Since the 2nd adsorption apparatus 20 has the same structure as the 1st adsorption apparatus 11, it demonstrates by attaching the same code|symbol to the same part. The 2nd adsorption apparatus 20 adsorbs the 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of the 2nd optical member bonding body PA2. The 2nd adsorption apparatus 20 has the panel holding part 11a, the alignment camera 11b, and the rail R.

The panel holding portion 11a holds the second optical member bonding body PA2 in contact with the stopper S on the downstream side by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction, and the second optical The member bonding body PA2 is aligned. The panel holding portion 11a adsorbs and holds the upper surface of the second optical member bonding body PA2 in contact with the stopper S by vacuum adsorption. The panel holding portion 11a moves on the rail R in a state where the second optical member bonding body PA2 is adsorbed and held to convey the second optical member bonding body PA2. The panel holding part 11a releases the adsorption holding after conveyance is finished, and transmits the second optical member bonding body PA2 to the free roller conveyor 24.

The alignment camera 11b holds the second optical member bonding body PA2 in contact with the stopper S by the panel holding portion 11a and, in an elevated state, the alignment mark or tip of the second optical member bonding body PA2. Shape and the like are imaged. The imaging data by the alignment camera 11b is transmitted to the control part 40, and based on this imaging data, the panel holding part 11a operates and the 2nd optical member bonding body to the free roller conveyor 24 of a conveyance destination (PA2) is aligned. That is, the 2nd optical member bonding body PA2 added the shift|offset|difference in the conveying direction with respect to the free roller conveyor 24, the direction orthogonal to a conveying direction, and the turning direction around the vertical axis of the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24 in a state.

The 2nd dust collecting device 16 is arrange|positioned at the panel conveyance upstream side of the pinching pressure roll 23 which is a bonding position of the 2nd bonding device 17. As shown in FIG. The second dust collecting device 16 removes static electricity and collects dust in order to remove dust around the second optical member bonding body PA2 before being introduced into the bonding position, particularly dust on the lower surface side.

The second joining device 17 is provided on the downstream side of the panel transport than the second dust collecting device 16. The second bonding device 17 joins the bonding sheet F5 (corresponding to the second sheet piece F2m) cut to a predetermined size with respect to the lower surface of the second optical member bonding body PA2 introduced at the bonding position. Do it. The 2nd bonding apparatus 17 is equipped with the conveying apparatus 22 similar to the 1st bonding apparatus 13, and the pinching pressure roll 23.

In the gap between the pair of bonding rollers 23a of the pinching pressure roll 23 (the bonding position of the second bonding device 17), the second optical member bonding body PA2 and the second sheet piece F2m are provided. It is introduced overlapping. The second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

These 2nd optical member bonding body PA2 and the 2nd sheet piece F2m are sent out to the panel conveyance downstream side of the downstream-side conveyor 7, while being pinched by each bonding roller 23a. In this embodiment, the surface on the display surface side of the liquid crystal panel P by the pinching pressure roll 23 (a surface opposite to the surface on which the first optical member F11 of the second optical member bonding body PA2 is bonded) The 2nd sheet piece F2m is bonded to, and the 3rd optical member bonding body PA3 is formed.

The second detection device 42 is provided on the downstream side of the panel transport rather than the second bonding device 17. The 2nd detection device 42 detects the edge of the edge part of the bonding surface of the liquid crystal panel P and the 2nd sheet piece F2m (it may be called a 2nd bonding surface hereafter). Data at the edge of the edge detected by the second detection device 42 is stored in a storage unit (not shown).

The cut position of the 2nd sheet piece F2m is adjusted based on the end edge detection result of the 2nd bonding surface. The control unit 40 (see FIG. 1) acquires end edge data of the second bonding surface stored in the storage unit, and the second optical member F12 is outside the liquid crystal panel P (outside the second bonding surface). ) To determine the cut position of the second sheet piece (F2m) so as not to be pushed out. The second cutting device 32 cuts the second sheet piece F2m at the cut position determined by the control unit 40.

The second cutting device 32 is provided on the downstream side of the panel transport than the second detection device 42. The 2nd cutting device 32 performs the laser cut along the edge of the 2nd bonding surface, and the 2nd sheet piece of the part which protruded outside the 2nd bonding surface from the 3rd optical member bonding body PA3 ( F2m) (the surplus portion of the second sheet piece F2m) is separated to form an optical member (second optical member F12) having a size corresponding to the second bonding surface.

By the second cutting device 32, the surplus portion of the second sheet piece F2m is separated from the third optical member bonding body PA3, so that the second optical member F12 is attached to the surface of the liquid crystal panel P on the display surface side. While is bonded, a fourth optical member bonding body PA4 (optical member bonding body) formed by bonding the first optical member F11 to the surface of the backlight side of the liquid crystal panel P is formed. The surplus portion separated from the second sheet piece F2m is separated from the liquid crystal panel P and recovered by a peeling apparatus not shown.

Here, the first cutting device 31 and second cutting device 32, for example a CO ₂ laser cutter. The first cutting device 31 and the second cutting device 32 cut the sheet piece FXm bonded to the liquid crystal panel P along the outer circumferential edge of the bonding surface in an endless manner.

A bonding inspection device, not shown, is provided on the downstream side of the panel transport than the second bonding device 17. The bonding inspection device is inspected by an inspection device in which the illustration of the work (liquid crystal panel P) on which the film is bonded is omitted (whether the position of the optical member F1X is appropriate (whether the positional shift is within the tolerance range). ) And so on). The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by means of removal not shown.

In addition, in this embodiment, the control part 40 as an electronic control device which collectively controls each part of the film bonding system 1 is comprised including the computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory or a hard disk.

The control unit 40 of the present embodiment includes an interface capable of performing communication with an external device of the computer system. An input device capable of inputting an input signal may be connected to the control unit 40. The input device includes an input device such as a keyboard and a mouse, or a communication device capable of inputting data from an external device of a computer system. The control unit 40 may include a display device, such as a liquid crystal display display, which indicates the operation state of each part of the film bonding system 1, or may be connected to the display device.

An operating system (OS) for controlling the computer system is installed in the storage unit of the control unit 40. In the storage section of the control section 40, a program that executes processing for conveying the optical sheet F to each section of the film bonding system 1 with high accuracy is recorded by controlling each section of the film bonding system 1 in the calculation processing section. have. Various types of information including programs recorded in the storage unit can be read by the calculation processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that performs various processes required for controlling each unit of the film bonding system 1.

The storage unit is a concept including a semiconductor memory such as a random access memory (RAM), a read only memory (ROM), or an external storage device such as a hard disk, a CD-ROM reading device, or a disk-shaped storage medium. The storage unit is functionally the first adsorption device 11, the first dust collecting device 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the inverting device 15 ), a program in which control procedures of operations of the second adsorption device 20, the second dust collection device 16, the second bonding device 17, the second detection device 42, and the second cutting device 32 are described. A storage area for storing software and various other storage areas are set.

Hereinafter, an example of a method of determining a bonding position (relative bonding position) of the sheet piece FXm with respect to the liquid crystal panel P will be described with reference to FIGS. 8A and 8B.

First, as shown in FIG. 8A, a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the direction of the optical axis of the optical sheet FX is detected at each inspection point CP. . The timing for detecting the optical axis may be at the time of manufacture of the far-end roll R1, or may be during the time from the far-end roll R1 until the optical sheet FX is unwound and half-cut. The data in the optical axis direction of the optical sheet FX is stored in a storage section in which the illustration is omitted in association with the position of the optical sheet FX (position in the longitudinal direction and position in the width direction of the optical sheet FX).

The control unit 40 acquires data of the optical axis of each inspection point CP (inspection data of the in-plane distribution of the optical axis) from the storage unit, and the optical sheet FX (section) of the portion where the sheet piece FXm is cut off The direction of the average optical axis of the area defined by the vertical line CL is detected.

For example, as shown in FIG. 8B, the angle (displacement angle) formed between the direction of the optical axis and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest angle among the displacement angles When (maximum deviation angle) is set to θmax and the smallest angle (minimum deviation angle) is set to θmin, the average deviation angle of θmid(=(θmax+θmin)/2) is the average value of maximum deviation angle θmax and minimum deviation angle θmin. It detects as Then, the direction forming the average deviation angle θmid with respect to the edge line EL of the optical sheet FX is detected as the direction of the average optical axis of the optical sheet FX. In addition, the shift angle is calculated, for example, with the direction of the left rotation being positive with respect to the edge line EL of the optical sheet FX, and the direction of the right rotation being negative.

Then, the liquid crystal panel P is such that the average optical axis direction of the optical sheet FX detected by the above-described method forms a desired angle with respect to the long side or short side of the display area P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm with respect to is determined. For example, when the direction of the optical axis of the optical member F1X is set in a direction that forms 90° with respect to the long side or short side of the display area P4 according to the design specifications, the average of the optical sheet FX The sheet piece FXm is bonded to the liquid crystal panel P such that the direction of the optical axis is 90° with respect to the long side or the short side of the display area P4.

The above-described cutting devices 31 and 32 detect the outer circumferential edge of the display area P4 of the liquid crystal panel P with a detection means such as a camera, and bond the sheet piece FXm bonded to the liquid crystal panel P with a bonding surface. Cut along the outer periphery of the endlessly. The outer peripheral edge of the bonding surface is detected by imaging the edge of the bonding surface. In this embodiment, laser cutting is performed by the respective cutting devices 31 and 32 along the outer circumferential edge of the bonding surface.

The swing width (tolerance) of the cutting line of the laser processing machine is smaller than the swing width (tolerance) of the cutting line of the cutting blade. Therefore, in the present embodiment, it is possible to easily cut along the outer circumferential edge of the bonding surface, and to reduce the size and/or display area of the liquid crystal panel P, compared to the case where the optical sheet FX is cut using a cutting blade. (P4) can be enlarged. This is effective for application to high-performance mobiles, which require enlargement of the display screen while the size of the housing is limited, such as a recent smartphone or tablet terminal.

In addition, when the optical sheet FX is cut into a sheet piece that matches the display area P4 of the liquid crystal panel P, and then bonded to the liquid crystal panel P, the dimensional tolerance of each of the sheet piece and the liquid crystal panel P And, since the dimensional tolerances of the relative bonding positions of the sheet piece and the liquid crystal panel P overlap, it becomes difficult to narrow the width of the frame portion G of the liquid crystal panel P (the enlargement of the display area becomes difficult).

On the other hand, the sheet piece FXm of the optical sheet FX having a size protruding from the optical sheet FX to the outside of the liquid crystal panel P is cut out, and the cut sheet piece FXm is cut out by the liquid crystal panel P. In the case of cutting according to the bonding surface after bonding to, only the swing tolerance of the cutting line needs to be considered, and the tolerance of the width of the frame portion G can be reduced (±0.1 mm or less). Also in this point, the width of the frame portion G of the liquid crystal panel P can be narrowed (the display area can be enlarged).

In addition, by cutting the sheet piece FXm with a laser rather than a blade, the force at the time of cutting is not input to the liquid crystal panel P, so that cracks or cuts are less likely to occur at the edge of the substrate of the liquid crystal panel P. , Durability for heat cycles and the like is improved. Likewise, since it is non-contact to the liquid crystal panel P, there is little damage to the electrical component mounting portion.

9 is a perspective view for explaining the operation of the detection device according to the comparative example.

10 is a cross-sectional view for explaining the operation of the detection device according to the comparative example.

11 is a perspective view for explaining the operation of the detection device according to the present embodiment.

12 is a cross-sectional view for explaining the operation of the detection device according to the present embodiment.

9 to 12, for convenience, the side where the first sheet piece F1m of the first optical member bonding body PA1 is bonded is shown as an upper side.

9 to 12, when the end surface of the second substrate P2 is shifted outward than the end surface of the first substrate P1, the first sheet piece F1m of the first optical member bonding body PA1 An example of imaging the edge ED of the first bonding surface SA1 from this bonded side will be described. 9 to 12, reference numeral VL denotes the imaging direction of the imaging device (normal direction of the imaging surface of the imaging device). 9 to 12, the illustration of the illumination light source and the imaging device constituting the detection device is omitted for convenience.

9, in the detection device according to the comparative example, the imaging direction VL of the imaging device is perpendicular to the first bonding surface SA1. In this case, as shown in Fig. 10, the end edge of the second substrate P2 is drawn into the imaging field of view of the imaging device. Then, when the edge ED of the 1st bonding surface SA1 is detected beyond the 1st sheet piece F1m, the edge edge of the 2nd board|substrate P2 is misdetected. That is, the imaging device may image the edge image of the 2nd board|substrate P2 rather than the edge ED of 1st bonding surface SA1. As a result, the edge ED of the 1st bonding surface SA1 cannot be detected with high precision.

On the other hand, as shown in Fig. 11, in the detection device according to the present embodiment, the imaging direction VL of the imaging device intersects at an angle to the normal direction of the first bonding surface SA1. Specifically, as shown in FIG. 12, the imaging direction VL of the imaging device is inclined inward than the edge ED. That is, the imaging direction VL of the imaging device is set so that the edge of the edge of the second substrate P2 does not enter within the imaging field of view of the imaging device. Therefore, when detecting the edge ED of the 1st bonding surface SA1 beyond the 1st sheet piece F1m, the edge of the 1st bonding surface ( Only the edge ED of SA1) can be detected. Therefore, the edge ED of 1st bonding surface SA1 can be detected with high precision.

9 to 12, when the end surface of the second substrate P2 is shifted outward than the end surface of the first substrate P1, the first sheet piece of the first optical member bonding body PA1 ( Although F1m) was described as an example of imaging the edge ED of the first bonding surface SA1 from the bonded side, it is not limited to this.

13 is a cross-sectional view for explaining the operation of the detection device according to the present embodiment when a modification of the first optical member bonding body is applied.

In FIG. 13, for convenience, the side in which the 1st sheet piece F1m of the 1st optical member bonding body PA1' was bonded is shown as an upper side.

For example, as shown in FIG. 13, when the burr at the time of dividing the panel exists on the end surface of the liquid crystal panel P', the first sheet piece F1m of the first optical member bonding body PA1' In the example of imaging the edge ED of the first bonding surface SA1 over the first sheet piece F1m from the joined side, it is possible to apply the detection device according to the present embodiment.

Moreover, according to the film bonding system 1 of this embodiment, each of the sheet piece F1m and sheet piece F2m which has a size protruding outward of the liquid crystal panel P is bonded to the liquid crystal panel P. Later, by separating the surplus portions of each of the sheet piece F1m and the sheet piece F2m, each of the optical member F11 and the optical member F12 having a size corresponding to the bonding surface is placed on the surface of the liquid crystal panel P. Can form. Thereby, each of the optical member F11 and the optical member F12 can be provided with high precision to the vicinity of the bonding surface, and the frame portion outside the display area P4 can be narrowed to enlarge the display area and downsize the device. .

In addition, each sheet piece (F1m) and sheet piece (F2m) having a size protruding outward from the liquid crystal panel (P) are joined to the liquid crystal panel (P), so that the sheet piece (F1m) and the sheet piece (F2m) are respectively. Even if the optical axis direction of each of the sheet piece F1m and the sheet piece F2m changes depending on the position of the liquid crystal panel P, the liquid crystal panel P can be aligned and bonded to the optical axis direction. Thereby, the precision of the optical axis direction of each of the optical member F11 and the optical member F12 with respect to the liquid crystal panel P can be improved, and the appearance and contrast of an optical display device can be improved.

In addition, when the cutting device 31 and the cutting device 32 laser cut the sheet piece F1m and the sheet piece F2m, respectively, to cut the sheet piece F1m and the sheet piece F2m with a blade. On the other hand, since the force is not exerted on the liquid crystal panel P, cracks and cuts are less likely to occur, and stable durability of the liquid crystal panel P can be obtained.

The preferred embodiments of the present embodiment have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to the examples. Various shapes, combinations, and the like of the respective constituent members shown in the above-described examples are examples, and various changes are possible based on design requirements and the like without departing from the spirit of the present invention.

1: Film bonding system (manufacturing apparatus of optical member bonding body)
23: pinching pressure roll (bonding device)
31: first cutting device
32: second cutting device
41: first detection device
42: second detection device
43: imaging device
44: illumination light source
P: Liquid crystal panel (optical display parts)
P1: first substrate
P2: second substrate
FX: Optical sheet
FXm: seat
F1X: Optical member
PA1: 1st optical member bonding body (sheet piece bonding body)
PA4: 4th optical member bonding body (optical member bonding body)
SA1: first joint surface
ED: End edge

Claims (11)

It is a detection apparatus which detects the edge edge of the bonding surface of the said sheet|seat piece bonding body of the sheet piece bonding body comprised by bonding the sheet piece which has a size protruding outward of the said optical display part with respect to an optical display part,
An illumination light source illuminating the edge of the end;
And an imaging device arranged at a position inclined inward of the bonding surface with respect to the normal direction of the bonding surface, and capturing an image of the edge at the side where the sheet piece of the sheet piece bonding body is joined. , Detection device. The detection device according to claim 1, wherein the illumination light source is disposed on a side opposite to the side where the sheet piece is joined to the sheet piece assembly. The detection device according to claim 2, wherein the illumination light source is disposed at a position inclined outside the bonding surface with respect to the normal direction of the bonding surface, rather than the edge of the end. The detection device according to any one of claims 1 to 3, wherein the illumination light source and the imaging device are respectively disposed at positions corresponding to four corner portions of the bonding surface having a rectangular shape. The detection device according to any one of claims 1 to 3, wherein the optical display component is formed by bonding two substrates. The detection device according to claim 4, wherein the optical display component is formed by bonding two substrates. It is a manufacturing apparatus of the optical member bonding body comprised by bonding an optical member to an optical display component,
A bonding device for forming a sheet piece bonding body by bonding a sheet piece having a size protruding outward of the optical display part with respect to the optical display part;
The detection device according to any one of claims 1 to 3, which detects an end edge of the sheet piece bonding body, the bonding surface of the optical display component and the sheet piece,
Cutting to form the optical member having a size corresponding to the bonding surface by separating the sheet piece of the portion protruding outward from the bonding surface from the sheet piece bonding body by performing laser cutting along the edge of the end. An apparatus for manufacturing an optical member bonding body, comprising an apparatus. It is a manufacturing apparatus of the optical member bonding body comprised by bonding an optical member to an optical display component,
A bonding device for forming a sheet piece bonding body by bonding a sheet piece having a size protruding outward of the optical display part with respect to the optical display part;
The detection device according to claim 4, which detects an end edge of the sheet display bonding body, the bonding surface of the optical display component and the sheet fragment,
Cutting to form the optical member having a size corresponding to the bonding surface by separating the sheet piece of the portion protruding outward from the bonding surface from the sheet piece bonding body by performing laser cutting along the edge of the end. An apparatus for manufacturing an optical member bonding body, comprising an apparatus. It is a manufacturing apparatus of the optical member bonding body comprised by bonding an optical member to an optical display component,
A bonding device for forming a sheet piece bonding body by bonding a sheet piece having a size protruding outward of the optical display part with respect to the optical display part;
The detection device according to claim 5, which detects an end edge of the bonding surface of the sheet piece bonding body between the optical display component and the sheet piece,
Cutting to form the optical member having a size corresponding to the bonding surface by separating the sheet piece of the portion protruding outward from the bonding surface from the sheet piece bonding body by performing laser cutting along the edge of the end. An apparatus for manufacturing an optical member bonding body, comprising an apparatus. It is a manufacturing apparatus of the optical member bonding body comprised by bonding an optical member to an optical display component,
A bonding device for forming a sheet piece bonding body by bonding a sheet piece having a size protruding outward of the optical display part with respect to the optical display part;
The detection device according to claim 6, which detects an edge of the sheet piece bonding body, the end portion of the bonding surface of the optical display component and the sheet piece,
Cutting to form the optical member having a size corresponding to the bonding surface by separating the sheet piece of the portion protruding outward from the bonding surface from the sheet piece bonding body by performing laser cutting along the edge of the end. An apparatus for manufacturing an optical member bonding body, comprising an apparatus. It is a method of manufacturing an optical member bonding body by bonding an optical member to an optical display component,
A bonding step of forming a sheet piece bonding body by bonding a sheet piece having a size protruding outward of the optical display part to the optical display part,
The sheet piece bonding body in a direction inclined toward the inside of the bonding surface with respect to the normal direction of the bonding surface while illuminating the edge of the bonding surface of the sheet piece bonding body with the optical display component and the sheet piece. A detection step of obtaining an image at the edge of the end on the side where the sheet piece is bonded, and detecting a bonding surface between the optical display component and the sheet piece from the obtained image;
Cutting to form the optical member having a size corresponding to the bonding surface by separating the sheet piece of the portion protruding outward from the bonding surface from the sheet piece bonding body by performing laser cutting along the edge of the end. The manufacturing method of an optical member bonding body containing a process.

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