JP5523916B2 - Polarizing film laminating apparatus and liquid crystal display manufacturing system having the same - Google Patents

Description

  The present invention relates to a polarizing film laminating apparatus and a liquid crystal display manufacturing system including the same.

  Conventionally, liquid crystal display devices have been widely manufactured. In general, a polarizing film is bonded to a substrate (liquid crystal panel) used in a liquid crystal display device in order to control transmission or blocking of light. The polarizing film is bonded so that the absorption axes thereof are orthogonal.

  As a method of bonding the polarizing film to the substrate, a so-called chip to panel method in which the polarizing film is bonded to the substrate after being cut into a size corresponding to the substrate can be mentioned. However, this method has a disadvantage that the production efficiency is low because the polarizing films are bonded to the substrate one by one. On the other hand, as another method, there is a so-called roll to panel method in which a polarizing film is supplied to a conveyor roll and continuously bonded to a substrate. According to this method, bonding can be performed with high production efficiency.

  As an example of the roll to panel method, Patent Document 1 discloses an optical display device manufacturing system. The said manufacturing system rotates a board | substrate after bonding an optical film (polarizing film) on the upper surface of a board | substrate, and bonds a polarizing film from a lower surface.

Japanese Patent No. 4307510 (issued on August 5, 2009)

  However, the conventional apparatus has the following problems.

  First, when a polarizing film is bonded to a substrate, work is usually performed in a clean room in order to prevent foreign matters such as dust from entering the bonding surface. In the clean room, air is rectified. This is because it is necessary to bond the polarizing film in a state in which rectification is performed on the substrate in a downflow in order to suppress the yield reduction due to the foreign matter.

  In this regard, the manufacturing system of Patent Document 1 has a configuration in which a polarizing film is bonded to the substrate from the upper surface and the lower surface. However, when bonding is performed from the upper surface of the polarizing film, there is a demerit that the airflow (downflow) is hindered by the polarizing film and the rectification environment to the substrate is deteriorated. As an example of pasting from the upper surface of the polarizing film, FIGS. 11 (a) and 11 (b) show air velocity vectors in the top-paste type manufacturing system. In FIG. 11, region A is a region where an unwinding part for unwinding the polarizing film is installed, region B is a region through which the polarizing film mainly passes, and region C is peeled off from the polarizing film. This is an area in which a take-up unit or the like for winding the film is installed.

  Also, clean air is supplied from a HEPA (High Efficiency Particulate Air) filter 40. In FIG. 11A, since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41. On the other hand, in FIG. 11B, since the grating 41 is not installed, the airflow moves along the floor after contacting the floor at the bottom of FIG. 11B.

  In FIGS. 11A and 11B, the areas A to C are arranged in the 2F (second floor) portion, and the clean air from the HEPA filter 40 is blocked by the polarizing film. Therefore, it is difficult to generate an airflow in the vertical direction with respect to the substrate passing through the 2F portion. On the other hand, the airflow vector in the horizontal direction is large (vector density is high). That is, it can be said that the rectification environment has deteriorated.

  This invention is made | formed in view of the said conventional problem, Comprising: The objective is to provide the manufacturing system of a polarizing film bonding apparatus and a liquid crystal display device provided with the same which do not disturb a rectification environment. is there.

  In order to solve the above problems, the polarizing film laminating apparatus of the present invention transports a rectangular substrate with a long side or a short side along the transport direction, and the first substrate. A first bonding unit that bonds a polarizing film to the lower surface of the substrate in the transport mechanism; a reversing mechanism that reverses the substrate transported by the first substrate transport mechanism and places the substrate in the second substrate transport mechanism; A second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction, and a second bonding unit for bonding a polarizing film to the lower surface of the substrate in the second substrate transport mechanism; The first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction, and the reversing mechanism includes an adsorbing unit that adsorbs the substrate, and Invert the substrate through the suction part A substrate reversing unit coupled to the suction unit, and the substrate reversing unit includes: (1) the long side or the short side of the substrate is perpendicular to the substrate transport direction of the second substrate transport mechanism. The substrate is moved to the second substrate transfer mechanism, and (2) the substrate is inverted by moving the surface side of the substrate toward the second substrate transfer mechanism.

  According to said invention, while sticking a polarizing film to the lower surface of a board | substrate by the 1st bonding part and rotating along the inversion axis | shaft of the board inversion part in a inversion mechanism, while reversing a board | substrate, the long side with respect to a conveyance direction And the short side can be changed. Then, a polarizing film can be bonded to the lower surface of a board | substrate by a 2nd bonding part. That is, since a polarizing film can be bonded from the lower surface to both surfaces of the substrate, the rectifying environment is not hindered. Further, since the operation of the reversing mechanism is a simple two operation, the tact time is short. Therefore, it is possible to realize bonding with a short tact time. Further, the first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and is excellent in area efficiency.

  In the polarizing film laminating device of the present invention, in the above (1), the substrate reversing unit moves the substrate so that the surface side of the substrate faces the substrate transport direction in the second substrate transport mechanism. It is preferable to make it.

  As described above, when the front surface side of the substrate 5 is moved in the transport direction D2 in the operation (1), the substrate is moved in the direction of the substrate transport direction in the second substrate transport mechanism by the operation (2). It can be moved more. For this reason, the reversed board | substrate can be rapidly conveyed to a 2nd bonding part, and a shorter tact time can be implement | achieved.

  In the polarizing film bonding apparatus of the present invention, the first substrate transport mechanism and the second substrate transport mechanism are arranged in a straight line, and at the end of the first substrate transport mechanism on the second substrate transport mechanism side. The substrate mounting portion and the reversing mechanism are provided in two pairs along both directions parallel to the transport direction of the first substrate transport mechanism at the end portion, and the end portion includes the substrate from the end portion to the substrate. It is preferable that transport means for transporting the substrate to the placement unit is provided, and the reversing mechanism reverses the substrate transported to each of the substrate placement units and places it on the second substrate transport mechanism.

  According to the above configuration, since two reversing mechanisms are provided, it is possible to perform reversal processing of twice as many substrates per unit time. Thereby, since many substrates can be reversed per unit time, the tact time is shortened. Furthermore, since the 1st board | substrate conveyance mechanism and the 2nd board | substrate conveyance mechanism are arrange | positioned on the straight line, the bonding apparatus of the structure excellent in area efficiency can be provided.

  Moreover, in the bonding apparatus of the polarizing film of this invention, the 1st film conveyance mechanism and 2nd film conveyance mechanism which convey a polarizing film are provided, and the said 1st film conveyance mechanism was protected by the peeling film. A plurality of unwinding sections for unwinding the polarizing film, a cutting section for cutting the polarizing film, a removing section for removing the release film from the polarizing film, and a plurality of winding sections for winding the removed release film are provided. The second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the peeling film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding units for winding the removed release film, wherein the first substrate transport mechanism and the second substrate transport mechanism are the first film transport machine. And the first film transport mechanism and the first substrate transport mechanism are provided at the upper part of the second film transport mechanism, and the first bonding section that bonds the polarizing film from which the release film has been removed to the substrate. It is preferable that the 2nd bonding part which bonds the polarizing film from which the said peeling film was removed to the board | substrate in between is provided between the said 2nd film conveyance mechanism and the 2nd board | substrate conveyance mechanism, respectively.

  Thereby, since the unwinding part and the winding part are provided in plural, when the remaining amount of the original film of the polarizing film in one unwinding part decreases, the other unwinding part is provided in the original film. It is possible to connect raw materials. As a result, the operation can be continued without stopping the unwinding of the polarizing film, and the production efficiency can be increased.

  Moreover, in the polarizing film bonding apparatus of the present invention, before the polarizing film is bonded to the lower surface of the substrate by the first bonding portion, the first film transporting mechanism includes a cleaning unit for cleaning the substrate. It is preferable to transport the substrate with the short side of the substrate along the transport direction.

  Accordingly, the substrate can be cleaned by the cleaning unit in a state where the long sides of the substrate are orthogonal to the substrate transport direction. That is, since the distance of the substrate along the transport direction can be reduced, the tact time required for cleaning can be further shortened. As a result, it is possible to provide a polarizing film laminating apparatus that is further excellent in production efficiency.

  Moreover, in the polarizing film bonding apparatus of the present invention, the first film transport mechanism and the second film transport mechanism detect a defect display attached to the polarizing film unwound from the first unwinding section. It is preferable to have a defect detection unit, a bonding avoidance unit that discriminates the defect display and stops the conveyance of the substrate, and a recovery unit that recovers the polarizing film from which bonding with the substrate is avoided.

  According to the above-mentioned fault detection part, pasting avoidance part, and recovery part, since a pasting with a polarizing film and a substrate which has a fault can be avoided, a yield can be raised.

  The manufacturing system of the liquid crystal display device of this invention is equipped with the bonding apparatus of the said polarizing film, and the sticking | shift detection apparatus which test | inspects the sticking gap in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part. is there.

  Thereby, it is possible to inspect the sticking deviation which arose on the board | substrate which bonded the polarizing film.

  Further, in the liquid crystal display manufacturing system of the present invention, the presence / absence of sticking misalignment is determined based on the inspection result of the sticking misalignment inspection apparatus, and the substrate on which the polarizing film is bonded is classified based on the determination result. It is preferable to provide a transport device.

  Thereby, when the sticking shift | offset | difference has arisen in the board | substrate with which the polarizing film was bonded, it can classify | categorize a defective product quickly and can shorten a tact time.

  Moreover, in the manufacturing system of the liquid crystal display device of this invention, the bonding foreign material automatic which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the bonding apparatus of a polarizing film and the 2nd bonding part in the said bonding apparatus. It is preferable to provide an inspection device.

  Thereby, it is possible to inspect the foreign matter mixed in the liquid crystal panel to which the polarizing film is bonded.

  Moreover, in the manufacturing system of the liquid crystal display device of this invention, the presence or absence of a foreign material is determined based on the inspection result by the said bonded foreign material automatic test | inspection apparatus, and the board | substrate with which the polarizing film was bonded is performed based on the said determination result. It is preferable to provide a sorting and conveying device.

  Thereby, when the foreign material is mixed in the liquid crystal panel which bonded the polarizing film, it can classify | categorize a defective product rapidly and can shorten a tact time.

  Moreover, in the manufacturing system of the liquid crystal display device of this invention, it has the bonding foreign material automatic test | inspection apparatus which test | inspects the foreign material in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part, and test | inspected by the said sticking | shift detection apparatus. Based on the result and an inspection result by the bonded foreign matter automatic inspection device, a determination is made as to whether or not there is a sticking deviation and a foreign matter, and based on the determination result, there is provided a sorting and conveying device that sorts the substrate on which the polarizing film is bonded. It is preferable.

  As a result, when the liquid crystal panel bonded with the polarizing film is stuck or mixed with foreign matter, defective products can be quickly sorted, and the tact time can be shortened.

  As described above, the polarizing film bonding apparatus of the present invention includes the first substrate transport mechanism, the first bonding portion, the second substrate transport mechanism, and the second bonding portion, and the first substrate transport mechanism. And the second substrate transport mechanism transports the substrate in the same direction, and the reversing mechanism includes a suction unit that sucks the substrate and a substrate connected to the suction unit that reverses the substrate through the suction unit. The substrate reversing unit includes: (1) a second substrate transport mechanism that positions the substrate so that a long side or a short side of the substrate is orthogonal to a substrate transport direction of the second substrate transport mechanism. (2) The substrate is reversed by moving the surface side of the substrate toward the second substrate transport mechanism.

  Therefore, the substrate can be reversed by the reversing mechanism, and the long side and the short side with respect to the transport direction can be changed. Thereby, since a polarizing film can be bonded from the lower surface with respect to both surfaces of a board | substrate, a rectification environment is not prevented. Moreover, since the operation of the reversing mechanism is a simple operation, the tact time is short. Therefore, it is possible to realize bonding with a short tact time. Further, the first substrate transport mechanism and the second substrate transport mechanism transport the substrate in the same direction. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus according to the present invention is very simple to install and also has an effect of being excellent in area efficiency.

It is sectional drawing which shows one Embodiment of the manufacturing system which concerns on this invention. It is sectional drawing which shows the peripheral part of the nip roll in the manufacturing system of FIG. It is sectional drawing which shows the velocity vector of the airflow in the underlay type manufacturing system similar to this invention. It is a perspective view which shows the inversion mechanism which concerns on this invention. It is a perspective view which shows the process in which a board | substrate is reversed by the inversion mechanism which concerns on this invention. It is a top view which shows the process in which a board | substrate is reversed by the inversion mechanism based on this invention. It is a top view which shows the modification of the bonding apparatus which concerns on this invention. It is a block diagram which shows the structure of a reversing mechanism. It is a block diagram which shows the relationship of each member with which the manufacturing system of the liquid crystal display device which concerns on this invention is provided. It is a flowchart which shows operation | movement of the manufacturing system of the liquid crystal display device which concerns on this invention. It is sectional drawing which shows the velocity vector of the airflow in an upper sticking type manufacturing system.

  One embodiment of the present invention will be described below with reference to FIGS. 1 to 10, but the present invention is not limited to this. First, the structure of the manufacturing system (liquid crystal display device manufacturing system) according to the present invention will be described below. The manufacturing system includes a bonding apparatus according to the present invention.

  FIG. 1 is a cross-sectional view showing a manufacturing system. As shown in the figure, the manufacturing system 100 has a two-stage structure, the 1F (first floor) portion is a film transport mechanism 50, and the 2F (second floor) portion is a substrate transport mechanism (first substrate transport mechanism and It becomes the bonding apparatus 60 containing a 2nd board | substrate conveyance mechanism).

<Film transport mechanism>
First, the film transport mechanism 50 will be described. The film transport mechanism 50 plays the role of unwinding the polarizing film (polarizing plate) and transporting it to the nip rolls 6 · 6a and 16 · 16a and winding up the peeling film that is no longer needed. On the other hand, the bonding device 60 plays a role of bonding the polarizing film unwound by the film transport mechanism 50 to the substrate (liquid crystal panel) 5.

  The film transport mechanism 50 includes a first film transport mechanism 51 and a second film transport mechanism 52. The 1st film conveyance mechanism 51 conveys a polarizing film to the nip roll 6 * 6a which bonds a polarizing film to the lower surface of the board | substrate 5 first. On the other hand, the second film transport mechanism 52 transports the polarizing film to the bottom surface of the inverted substrate 5.

  The first film transport mechanism 51 includes a first unwinding unit 1, a second unwinding unit 1a, a first winding unit 2, a second winding unit 2a, a half cutter 3, a knife edge 4, and a defect film winding roller. 7 · 7a. The first unwinding unit 1 is provided with a polarizing film original, and the polarizing film is unwound. A known polarizing film may be used as the polarizing film. Specifically, a polyvinyl alcohol film is dyed with iodine or the like, and a film stretched in a uniaxial direction can be used. Although it does not specifically limit as thickness of the said polarizing film, A polarizing film 5 micrometers or more and 400 micrometers or less can be used preferably.

  In the original film of the polarizing film, the direction of the absorption axis is located in the flow direction (MD direction). The polarizing film has a pressure-sensitive adhesive layer protected by a release film. As the release film (also referred to as a protective film or a separator), a polyester film, a polyethylene terephthalate film, or the like can be used. Although it does not specifically limit as thickness of the said peeling film, The peeling film of 5 micrometers or more and 100 micrometers or less can be used preferably.

  Since the manufacturing system 100 includes two unwinding portions and two unwinding portions corresponding to the unwinding portions, the first unwinding portion 1 has a low remaining amount of raw material. It is possible to connect the original fabric provided in the two unwinding portions 1 a to the original fabric of the first unwinding portion 1. As a result, it is possible to continue the operation without stopping the unwinding of the polarizing film. With this configuration, production efficiency can be increased. Of course, a plurality of unwinding sections and winding sections may be provided, and three or more winding sections may be provided.

  The half cutter (cutting unit) 3 half-cuts the polarizing film (film laminate composed of the polarizing film, the pressure-sensitive adhesive layer and the peeling film) protected by the peeling film, and cuts the polarizing film and the pressure-sensitive adhesive layer. As the half cutter 3, a known member may be used. Specifically, a cutter, a laser cutter, etc. can be mentioned. After the polarizing film and the pressure-sensitive adhesive layer are cut by the half cutter 3, the release film is removed from the polarizing film by the knife edge (removal part) 4.

  An adhesive layer is applied between the polarizing film and the release film, and after the release film is removed, the adhesive layer remains on the polarizing film side. The pressure-sensitive adhesive layer is not particularly limited, and examples thereof include acrylic, epoxy, and polyurethane pressure-sensitive adhesive layers. Although the thickness in particular of an adhesive layer is not restrict | limited, Usually, it is 5-40 micrometers.

  On the other hand, the 2nd film conveyance mechanism 52 is the structure similar to the 1st film conveyance mechanism 51, and is the 1st unwinding part 11, the 2nd unwinding part 11a, the 1st winding part 12, and the 2nd winding part 12a. , Half cutter 13, knife edge 14 and defect film winding rollers 17 and 17 a. About the member which attached | subjected the same member name, the effect | action same as the member in the 1st film conveyance mechanism 51 is shown.

  As a preferred embodiment, the manufacturing system 100 includes a cleaning unit 71. The cleaning unit 71 cleans the substrate 5 before the polarizing film is bonded to the lower surface of the substrate 5 by the nip rolls 6 and 6a. As the cleaning unit 71, a known cleaning unit composed of a nozzle and a brush for injecting a cleaning liquid may be used. By cleaning the substrate 5 immediately before the bonding by the cleaning unit 71, the bonding can be performed in a state where there are few adhered foreign substances on the substrate 5.

  Next, the knife edge 4 will be described with reference to FIG. FIG. 2 is a cross-sectional view showing a peripheral portion of the nip rolls 6 and 6a in the manufacturing system 100. FIG. FIG. 2 shows a situation where the substrate 5 is conveyed from the left direction and the polarizing film 5a having an adhesive layer (not shown, the same hereinafter) is conveyed from the lower left direction. The polarizing film 5a is provided with a release film 5b. The polarizing film 5a and the pressure-sensitive adhesive layer are cut by the half cutter 3, and the release film 5b is not cut (half cut).

  A knife edge 4 is provided on the release film 5b side. The knife edge 4 is an edge-shaped member for peeling the peeling film 5b, and the polarizing film 5a and the peeling film 5b having a low adhesive force are peeled off along the knife edge 4.

  Thereafter, the release film 5b is wound around the first winding portion 2 in FIG. In addition, it can replace with a knife edge and can also use the structure which winds up a peeling film using an adhesion roller. In that case, the winding efficiency of a peeling film can be improved by providing an adhesive roller in two places similarly to a winding part.

  Next, the bonding apparatus 60 will be described. The bonding apparatus 60 conveys the board | substrate 5, and bonds the polarizing film conveyed by the film conveyance mechanism 50 to a board | substrate. Although not shown, clean air is supplied to the upper surface of the substrate 5 in the bonding apparatus 60. That is, downflow rectification is performed. Thereby, it is possible to perform conveyance and bonding of the substrate 5 in a stable state.

<Bonding device>
The bonding device 60 is provided on the upper part of the film transport mechanism 50. Thereby, space saving of the manufacturing system 100 can be achieved. Although not shown, a substrate transport mechanism including a conveyor roll is installed in the laminating apparatus 60, whereby the substrate 5 is transported in the transport direction (first substrate transport mechanism 61 and second described later in FIG. 6). The substrate transport mechanism 62 corresponds to the substrate transport mechanism).

  In the manufacturing system 100, the substrate 5 is transported from the left side, and then transported from the right side in the drawing, that is, from the top of the first film transport mechanism 51 to the top of the second film transport mechanism 52. Between the film conveyance mechanism 50 and the bonding apparatus 60, the nip rolls 6 * 6a (1st bonding part) and the nip rolls 16 * 16a (2nd bonding part) which are bonding parts are each provided. The nip rolls 6, 6 a and 16, 16 a are members that serve to bond the polarizing film from which the release film has been removed to the lower surface of the substrate 5. In addition, since a polarizing film is bonded to both surfaces of the substrate 5 from the lower surface, the substrate 5 is reversed by the reversing mechanism 65 after being bonded by the nip rolls 6 and 6a. The reversing mechanism 65 will be described later.

  The polarizing film conveyed to the nip rolls 6 and 6a is bonded to the lower surface of the substrate 5 through an adhesive layer. As the nip rolls 6 and 6a, known configurations such as a pressure roll and a pressure roll can be employed. Moreover, what is necessary is just to adjust the pressure and temperature at the time of bonding in the nip rolls 6 and 6a suitably. The configuration of the nip rolls 16 and 16a is the same. Although not shown, in the manufacturing system 100, as a preferable configuration, a defect display (mark) detection unit is provided between the first unwinding unit 1 and the half cutter, and a polarizing film having a defect is detected. It has a configuration.

  In addition, the said defect display is provided at the time of the 1st unwinding part 11 or the 2nd unwinding part 11a rather than a defect display detection part by performing the detection at the time of original film production of a polarizing film, and providing a defect display. It attaches | subjects to a polarizing film by a fault display provision part. The defect display imparting unit includes a camera, an image processing device, and a defect display forming unit. First, a polarizing film is imaged by the camera, and the presence or absence of a defect can be inspected by processing the imaging information. Specific examples of the drawback include foreign matters such as dust and fish eyes. When a defect is detected, a defect display is formed on the polarizing film by the defect display forming unit. A mark such as ink is used as the defect display.

  Further, a bonding avoiding unit (not shown) discriminates the mark with a camera and transmits a stop signal to the bonding apparatus 60 to stop the conveyance of the substrate 5. Thereafter, the polarizing film in which the defect is detected is not bonded by the nip rolls 6 and 6a and is wound by the defect film winding roller (collecting unit) 7 and 7a. Thereby, pasting with substrate 5 and a polarizing film which has a fault can be avoided. If such a series of structures is provided, it is possible to avoid the bonding between the polarizing film having a defect and the substrate 5, so that the yield can be increased, which is preferable. A publicly known inspection sensor can be used suitably as a fault detection part and a pasting avoidance part.

  As shown in FIG. 1, after the substrate 5 is reversed by the reversing mechanism 65, the substrate 5 is conveyed to the nip rolls 16 and 16a. Then, a polarizing film is bonded to the lower surface of the substrate 5. As a result, the polarizing film is bonded to both surfaces of the substrate 5, and the two polarizing films are bonded to both surfaces of the substrate 5 with different absorption axes. Thereafter, if necessary, the both sides of the substrate 5 are inspected for misalignment. For the inspection, it is possible to adopt a configuration that is usually made by an inspection unit equipped with a camera.

  Thus, in the manufacturing system 100, when the polarizing film is bonded to the substrate 5, the bonding is performed from the lower surface of the substrate 5, and the rectifying environment to the substrate 5 is not hindered. For this reason, foreign matter mixing into the bonding surface of the substrate 5 can be prevented, and more accurate bonding can be performed.

  FIG. 3A and FIG. 3B show the velocity vector of the airflow in the under-paste type manufacturing system similar to the present invention. Regions A in FIGS. 3 (a) and 3 (b) are regions where the unwinding part is installed, region B is a region through which the polarizing film mainly passes, and region C is a region where the winding unit and the like are installed. It is. Further, clean air is supplied from the HEPA filter 40. In FIG. 3A, since the grating 41 through which clean air can pass is installed, the airflow can move in the vertical direction via the grating 41. On the other hand, in FIG. 3B, since the grating 41 is not installed, the airflow moves along the floor after contacting the floor.

  Since the manufacturing system shown in FIGS. 3 (a) and 3 (b) is a bottom-attached type, the air current from the HEPA filter 40 is not hindered by the polarizing film, as shown in FIGS. 11 (a) and 11 (b). For this reason, the direction of the airflow vector is almost directed toward the substrate, and it can be said that a preferable rectification environment is realized in the clean room. In FIG. 3 (a), the grating 41 is installed and not installed in FIG. 3 (b), but both drawings show the same preferable state. In FIGS. 3 and 11, the substrate transport mechanism is formed horizontally, but is not installed as a series of structures. For this reason, the airflow can pass between the substrate transport mechanisms. After the substrate is held by a reversing mechanism to be described later, the substrate is transferred between the substrate transport mechanisms.

  Moreover, in the manufacturing system 100, the board | substrate 5 is first conveyed by a long side opening (a long side is orthogonal to a conveyance direction), and is conveyed by a short side opening (a short side is orthogonal to a conveyance direction) after that. It has become.

<Reversing mechanism>
The reversing mechanism 65 changes the arrangement of the substrate 5 whose short side or long side is along the transport direction to a state where the long side or short side is along the transport direction and reversed. That is, the front surface and the back surface are reversed, and the direction of the substrate along the transport direction is switched. First, the basic structure of the reversing mechanism 65 will be described with reference to FIG.

  FIG. 4 is a perspective view showing the reversing mechanism 65. The reversing mechanism 65 includes a suction part 66, a support part (substrate reversing part) 67, and a lifting / lowering rotating part (substrate reversing part) 68. The adsorption unit 66 is a member that adsorbs to the surface of the substrate 5. The surface of the substrate 5 is held by the suction unit 66 by the suction of the suction unit 66. As the adsorption unit 66, a known adsorption unit can be used, and for example, an air suction type adsorption unit can be used. In FIG. 4, the adsorbing portion 66 includes a pipe-shaped air suction portion and an adsorbing portion, but is not limited to this configuration. Moreover, the adsorption | suction part 66 should just be able to adsorb | suck to the board | substrate 5, and can increase / decrease the number of the adsorption | suction parts of the adsorption | suction part 66 according to adsorption power. The configuration can be changed as appropriate, for example, by concentrating the installation location of the suction portion of the suction portion 66 on the central portion of the substrate 5 or changing it to the periphery of the end portion of the substrate 5.

  The support part 67 supports the suction part 66 and is connected to the suction part 66. Further, the support part 67 is also connected to the lifting / lowering rotating part 68. The support part 67 and the lifting / lowering rotating part 68 are connected via a movable part, and the supporting part 67 is rotatable with respect to the lifting / lowering rotating part 68. In FIG. 4, the movable part is a rotating member on a cylinder, and is made by a driving device such as a motor (not shown). However, the raising / lowering rotation part 68 should just be able to rotate the support part 67, and is not limited to the structure which has the said rotation member.

  The up-and-down rotation unit 68 can move up and down the support unit 67 and has a rotatable structure. The support part 67 is raised and lowered by bending of the raising / lowering rotating part 68. That is, the up-and-down rotating part 68 has an arm shape having a bent part, and the support part 67 can be raised by reducing the angle of the arm. On the other hand, the support portion 67 can be lowered by increasing the angle of the arm.

  In FIG. 4, the substrate reversing unit is described as being configured of the support unit 67 and the lifting / lowering rotating unit 68. . That is, the substrate reversing unit may be configured to be able to lift and rotate the substrate 5. As another configuration example, the substrate reversing unit may be a robot arm having a plurality of movable units. Similar to the support portion 67, the robot arm is connected to the suction portion 66 and can move the substrate 5 up and down and rotate.

  Next, the operation of the reversing mechanism 65 will be described. FIG. 5 is a perspective view showing a process of reversing the substrate 5 by the reversing mechanism 65 according to the present invention. FIG. 5 is for explaining the locus 69 of the substrate 5, and only the substrate 5 and the locus 69 are shown so that the drawing is not complicated.

  FIG. 5A shows a state where the substrate 5 is transported by the first substrate transport mechanism 61, and the operation by the reversing mechanism 65 is not performed. The surface of the substrate 5 is marked with x, but this is for convenience of explanation. The back surface of the substrate 5 is not marked at all.

  According to the present invention, the substrate 5 in the above state is moved by the reversing mechanism 65 and moved to the second substrate transport mechanism 62. In addition, the top view corresponding to Fig.5 (a)-(d) was shown to Fig.6 (a)-(d). The positions of the first substrate transport mechanism 61 and the second substrate transport mechanism 62 are as shown in FIGS.

  The operation of the reversing mechanism 65 will be described below. The reversing mechanism 65 according to the present invention transports a substrate having a long side or a short side along the transport direction in the first substrate transport mechanism. (1) The long side or the short side of the substrate 5 is the second side. The substrate 5 is moved to the second substrate transfer mechanism 62 so as to be orthogonal to the transfer direction D2 of the substrate 5 of the substrate transfer mechanism 62, and (2) the surface side of the substrate 5 is moved toward the second substrate transfer mechanism. The substrate 5 is inverted.

  In FIG. 5, the short side of the substrate 5 is along the transport direction D1 of the first substrate transport mechanism, and the long side of the substrate 5 is in the state along the transport direction D2 of the second substrate transport mechanism by reversal. As will be described, even when the long side and the short side are interchanged, the substrate 5 can be similarly reversed by the operations (1) and (2).

  First, the operation (1) will be described. In FIG. 5, the substrate 5 is moved so that the short side of the substrate 5 is orthogonal to the transport direction D <b> 2 in order to change the substrate 5 having the long side opening to the short side opening. In FIG. 5, the substrate 5 is moved along a curved locus 69 by the reversing mechanism 65 from FIG. 5 (a) to FIG. 5 (b) and from FIG. 5 (b) to FIG. 5 (c).

  As shown in FIG. 5C, the position that is the end point of the substrate 5 in the operation of (1) is along the orthogonal direction D3. In FIG. 5A, after the surface of the substrate 5 is adsorbed by the adsorbing unit 66, the substrate 5 is rotated upward after being moved upward by the up-and-down rotating unit 68. Therefore, the substrate 5 along the orthogonal direction D3 is It is located above the substrate 5 in FIG.

  However, the end point of the substrate 5 in the operation of (1) is not limited to the position shown in FIG. 5C, and may be a position where the short side of the substrate 5 is orthogonal to the transport direction D2. That is, the orthogonal direction D3 may be included in the surface including the substrate 5 of the first substrate transport mechanism 61. In FIG. 5C, the substrate 5 of the first substrate transport mechanism 61 and the substrate 5 of the second substrate transport mechanism 62 are located on the same plane, but the position of the substrate 5 after movement is It only needs to be on a plane orthogonal to the substrate 5 before movement. For example, the substrate 5 after movement may be located on a plane passing through the center of the substrate 5 before movement.

  Next, the inversion of the substrate 5 is completed by the operation (2). That is, the surface side of the substrate 5 is moved toward the second substrate transport mechanism 62 as shown in FIG. Since the substrate 5 is rotated counterclockwise in the process from FIG. 5A to FIG. 5C, the surface side of the substrate 5 is moved toward the transport direction D2 of the second substrate transport mechanism 62. It becomes. As described above, the reversing mechanism 65 can change the direction of the short side and the long side of the substrate 5 in the transport direction and can reverse the substrate 5.

  As described above, according to the reversing mechanism 65 according to the present invention, the substrate 5 is reversed by the operations (1) and (2) after the adsorption of the substrate 5 by the adsorption unit 66 and the substrate 5 with respect to the transport direction. The long side and the short side of can be changed. Before the reversing operation, a polarizing film is bonded to the lower surface of the substrate 5, and after performing the reversing operation, a polarizing film can be further bonded to the lower surface of the reversed substrate 5. . 1. Thus, a polarizing film can be bonded to both surfaces of the substrate 5 from the lower surface. The inversion operation is a relatively simple rotation operation, and the tact time is short because of the second operation. Therefore, it is possible to realize bonding with a short tact time without disturbing the rectification environment.

  The reversing operation of the support part 67 is the operation of 2. However, even if the operation of raising and lowering the substrate 5 and / or the operation of adjusting the position of the support part 67 is included before and after each operation, the present invention Are included in the operation of the reversing mechanism 65.

  Further, in FIG. 5D, by moving the surface side of the substrate 5 toward the transport direction D2, the short side above the substrate 5 is further moved in the transport direction D2. That is, the substrate 5 is moved further in the transport direction D2. Therefore, the inverted substrate 5 can be moved to the nip rolls 16 and 16a more quickly, and a shorter tact time can be realized. Therefore, this configuration can be said to be a more preferable embodiment from the viewpoint of tact time.

  On the other hand, when the substrate 5 in FIG. 5A is rotated clockwise by the rotation operation of (1), when the surface side of the substrate 5 is moved toward the second substrate transport mechanism 62 side, The substrate 5 moves in the direction opposite to the direction of the transport direction D2 by the operation of 2). In this case, the movement time of the substrate 5 to the nip rolls 16 and 16a is required to be longer than the former. However, there are cases where the nip rolls 16 and 16a are installed in the vicinity of the reversing mechanism 65 and the reversing position of the substrate 5 is desired to be away from the nip rolls 16 and 16a. In such a case, the latter form can be preferably used.

  Further, the substrate 5 moved by the operation (1) is in a state of being inclined by 90 ° with respect to the surface of the substrate 5 in the first substrate transport mechanism 61. With such an inclination, the locus 69 when the substrate 5 moves is shortened. Since the operation (1) is more complicated than the operation (2), the inclination of the substrate 5 after the movement is preferably 90 ° or close to 90 ° as described above. A specific preferable range is 85 ° or more and 95 ° or less.

  FIG. 6 is a plan view showing the rotation process of the substrate 5 corresponding to FIG. FIG. 6 illustrates the first substrate transport mechanism 61 and the second substrate transport mechanism 62. Although not shown, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 are provided with conveyor rolls arranged perpendicular to the transport direction of the substrate 5. The substrate 5 is transported in the transport direction by the conveyor roll. Of course, conveyance means other than the conveyor roll may be used.

  The first substrate transport mechanism 61 and the second substrate transport mechanism 62 transport the substrate 5 in the same direction. That is, the transport directions D1 and D2 are in the same direction. For this reason, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 have linear shapes along the transport directions D1 and D2, respectively. That is, it does not have a complicated structure such as an L shape. Therefore, the bonding apparatus 60 according to the present invention is very simple to install and has a structure with excellent area efficiency.

  The locus 69 of rotation of the substrate 5 has been described with reference to the perspective view of FIG. 5, and the rotation process of the substrate 5 from different angles will be described with reference to the plan view of FIG. Each of FIGS. 6A to 6D corresponds to FIGS. 5A to 5D.

  The substrate 5 in FIG. 6A is transported along the transport direction D <b> 1 and is transported to the suction position where it is sucked by the suction unit 6. Until the substrate 5 is transported, the reversing mechanism 65 is in a standby state. The suction unit 66 in the standby state is disposed above the substrate 5 at the suction position so as not to contact the substrate 5. When the substrate 5 is transported to the suction position, the support part 67 is lowered by the lifting / lowering rotating part 68 and the suction part 66 is also lowered. Then, the substrate 5 is adsorbed by the adsorption unit 66.

  Thereafter, the substrate 5 is lifted by the lifting / lowering rotation unit 68, and the substrate 5 is rotated by the support unit 67 and the lifting / lowering rotation unit 68 so that the short side of the substrate 5 on the first substrate transport mechanism 61 side is along the orthogonal direction D3. The The substrate 5 is moved as shown in FIGS. 6A to 6C by the operation (1) of the support portion 67 and the lifting / lowering rotation portion 68. Furthermore, the substrate 5 is moved toward the second substrate transport mechanism 62 by the operations (2) of the support portion 67 and the lifting / lowering rotation portion 68, and is inverted as shown in FIG. 6 (d). When the substrate 5 is reversed, the substrate 5 is disposed on a conveyor roll (not shown), and the conveyor roll is disposed so as not to contact the support portion 67. For this reason, when the substrate 5 is reversed, the reversing mechanism 65 is positioned below the substrate 5.

  Further, after the substrate 5 is inverted, the air adsorption of the adsorption unit 66 is released, and thereafter, the support unit 67 is moved downward by the up-and-down rotation unit 68 and the adsorption unit 66 is separated from the substrate 5. Thereby, the holding of the substrate 5 is released, and the substrate 5 is transferred by the second substrate transfer mechanism 62. Then, the reversing mechanism 65 returns to the position of FIG. 6A and reverses the other substrates 5 that are sequentially transported by the same operation.

  FIG. 7 is a plan view showing a modification of the bonding apparatus 60. Changes in the modification include (1) two reversing mechanisms 65, (2) two substrate mounting portions 61 a on both sides of the first substrate transport mechanism 61, and (3 ) The first substrate transport mechanism 61 and the second substrate transport mechanism 62 are arranged on a straight line. The first substrate transport mechanism 61 and the second substrate transport mechanism 62 are the same in that the substrate 5 is transported in the same direction.

  The substrate platform 61a and the reversing mechanism 65 are arranged at both ends of the first substrate transport mechanism 61 on the second substrate transport mechanism 62 side, which are horizontal with respect to the transport direction of the first substrate transport mechanism 61 at the end. Are provided along. The reversing mechanism 65 is the same as the structure described in FIGS. Further, the end region 61b is provided with transport means for transporting the substrate 5 to the substrate platform 61a, and may be configured to be controlled by the control unit 70 described later. Specific examples of the conveying means include a conveyor roll.

  The substrate mounting portion 61a is a place where the substrate 5 is placed by the suction portion 66. According to the modification, the substrates 5 transported to the first substrate transport mechanism 61 are transported alternately to the two substrate platforms 61a. Since two pairs of the substrate platform 61a and the reversing mechanism 65 are provided, the substrate 5 transported to the substrate platform 61a is inverted by the reversing mechanism 65 by one operation.

  In this modification, the two substrate platforms 61 a are provided along both horizontal directions of the first substrate transport mechanism 61, and the inverted substrate 5 is along the transport direction of the first substrate transport mechanism 61. Will be placed. Therefore, the first substrate transport mechanism 61 and the second substrate transport mechanism 62 can be arranged on a straight line.

  According to the modification, (1) since two reversing mechanisms 65 are provided, the substrate 5 can be processed twice per unit time. Thereby, since many substrates 5 can be reversed per unit time, the tact time is shortened. (2) Furthermore, since the 1st board | substrate conveyance mechanism 61 and the 2nd board | substrate conveyance mechanism 62 are arrange | positioned on the straight line, the bonding apparatus of the structure excellent in area efficiency can be provided. Especially in a clean room, since the area efficiency is required, the bonding apparatus is very preferable.

  A configuration example of the reversing mechanism 65 is shown in FIG. FIG. 8 is a block diagram showing the configuration of the reversing mechanism 65 and the interface unit 165 connected to the reversing mechanism 65. The configuration shown in FIG. 8 is merely an example, and the reversing mechanism 65 is not limited to this example. As shown in FIG. 8, the reversing mechanism 65 is further connected to the interface unit 165. The interface unit 165 receives an operation input from an operator and transmits input data to the display and inversion mechanism 65. The reversing mechanism 65 is provided with a suction part 66, a support part 67, and an elevating / rotating part 68, which are connected to a control part 70 in the interface part. On the other hand, the interface unit 165 includes an input unit 166, a display unit 167, a storage unit 168, and a control unit 70. The input unit 166 transmits information on the substrate 5 and the like to the storage unit 168. As each information of the board | substrate 5, the length of the long side and the short side of the board | substrate 5, thickness, a conveyance speed, and the conveyance number of sheets per unit time are mentioned. Other information includes the positions of the first substrate transport mechanism 61 and the second substrate transport mechanism 62 and the positions of the conveyor rolls included in these, the settings of the transport directions D1 and D2, and the orthogonal direction D3, and (1) and (2) For example, the setting of the locus 69 of the substrate 5 in the operation may be mentioned. The interface unit 165 includes an input device (not shown). The input device may be any device that allows an operator to input various types of information, and may be configured with, for example, an input key or a touch panel. The display unit 167 displays the contents of various information input by the input unit 166, and can be configured by a known liquid crystal display or the like.

  The storage unit 168 is connected to the control unit 70 and the input unit 166. The storage unit 168 stores information input from the input unit. For example, the storage unit 168 includes a storage device such as a RAM (random access memory) and an HDD (hard disk drive), and stores various data and various programs. Is.

  The control unit 70 controls the adsorption unit 66, the support unit 67, and the lifting / lowering rotation unit 68 based on the information received from the storage unit 168. According to this configuration, for example, the change information of the conveyance speed of the substrate 5 can be transmitted from the input unit 166 to the storage unit 168 and easily reflected in the operation of the reversing mechanism 65. The control unit 70 includes a CPU (central processing unit), a ROM (read only memory) that stores the program, a RAM that expands the program, a storage device (recording medium) such as a memory that stores the program and various data, and the like. It can be set as the structure provided.

<Other incidental configurations>
Furthermore, as a preferable form, the manufacturing system 100 includes a control unit 70, a cleaning unit 71, a sticking misalignment inspection device 72, a bonded foreign matter automatic inspection device 73, and a sorting and conveying device 74. The sticking deviation inspection device 72, the bonding foreign substance automatic inspection device 73, and the sorting and conveying device 74 perform processing such as inspection on the substrate 5 after bonding, that is, the liquid crystal display device.

  FIG. 9 is a block diagram showing the relationship of each member provided in the liquid crystal display device manufacturing system, and FIG. 10 is a flowchart showing the operation of the liquid crystal display device manufacturing system. Hereinafter, the operation of the liquid crystal display device will be described together with the description of each member.

  The control unit 70 is connected to the cleaning unit 71, the bonding deviation inspection device 72, the bonded foreign matter automatic inspection device 73, and the sorting and conveying device 74, and controls them by transmitting control signals thereto. The control unit 70 is mainly configured by a CPU (Central Processing Unit), and includes a memory or the like as necessary.

  In the case where the cleaning unit 71 is provided in the manufacturing system 100, the substrate 5 in the first substrate transport mechanism 61 is transported to the cleaning unit 71 at the front edge of the long side in order to reduce the tact time in the cleaning unit 71. Is preferred. Usually, since the cleaning in the cleaning unit 71 takes a long time, this configuration is very effective from the viewpoint of shortening the tact time.

  Next, although the bonding process (including the reversing operation of the substrate 5) for bonding the polarizing film to both surfaces of the substrate 5 is performed (S2 in FIG. 10), this process will be described with reference to FIGS. That's right.

  The sticking deviation inspection device 72 inspects the presence or absence of sticking deviation of the polarizing film in the bonded substrate 5. The sticking displacement inspection device 72 is constituted by a camera and an image processing device, and the camera is installed at the bonding position of the substrate 5 on which the polarizing film is bonded by the nip rolls 16 and 16a. The substrate 5 is photographed by the camera, and the photographed image information is processed, whereby it is possible to inspect whether or not there is a sticking deviation on the substrate 5 (sticking deviation inspection step, S3 in FIG. 10). Note that as the misalignment inspection apparatus 72, a conventionally known misalignment inspection apparatus can be used.

  The bonded foreign matter automatic inspection device 73 inspects the presence or absence of foreign matters in the bonded substrate 5. The bonded foreign matter automatic inspection device 73 is configured by a camera and an image processing device, like the misalignment inspection device 72, and transports the second substrate of the substrate 5 after the polarizing film is bonded by the nip rolls 16 and 16a. The camera is installed in the mechanism (bonding device 60). The board | substrate 5 is image | photographed with the said camera, and the presence or absence of the bonding foreign material to the board | substrate 5 can be test | inspected by processing the image | photographed image information (bonding foreign material inspection process, S4). Examples of the foreign matter include foreign matters such as dust, fish eyes, and the like. In addition, as the bonding foreign material automatic inspection apparatus 73, a conventionally well-known bonding foreign material inspection apparatus can be used.

  S3 and S4 may be performed in the reverse order or simultaneously. One step can be omitted.

  The sorting and conveying device 74 determines the presence or absence of sticking misalignment and foreign matter based on the inspection results from the sticking misalignment inspection device 72 and the bonded foreign matter automatic inspection device 73. The sorting and conveying device 74 only needs to receive an output signal based on the inspection result from the sticking misalignment inspection device 72 and the bonding foreign matter automatic inspection device 73 and can sort the bonded substrates 5 into non-defective products or defective products. . Therefore, a conventionally known sorting and conveying system can be used.

  In the manufacturing system of the liquid crystal display device, as a preferred mode, both the misalignment and foreign matter are detected. When it is determined that the misalignment or foreign matter has been inspected (YES), the bonded substrate 5 is not used. Sorted as good (S7). On the other hand, when it is determined that neither sticking deviation nor foreign matter is detected (NO), the bonded substrates 5 are classified as non-defective products (S6).

  According to the manufacturing system of the liquid crystal display device provided with the sorting and conveying device 74, the non-defective product and the defective product can be sorted quickly, and the tact time can be shortened. When only the sticking misalignment inspection device 72 or the bonded foreign matter automatic inspection device 73 is provided, the sorting and conveying device 74 may be configured to determine the presence / absence of only one of the sticking misalignment and the foreign matter.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Such embodiments are also included in the technical scope of the present invention.

  The polarizing film bonding apparatus according to the present invention can be used in the field of bonding a polarizing film to a substrate.

DESCRIPTION OF SYMBOLS 1 1st unwinding part 1a 2nd unwinding part 2 1st winding part 2a 2nd winding part 3 Half cutter 4 Knife edge 5 Substrate 5a Polarizing film 5b Release film 6 * 6a Nip roll (1st bonding part)
7.7a Defect film winding roller 11 First unwinding portion 11a Second unwinding portion 12 First winding portion 12a Second winding portion 13 Half cutter 14 Knife edge 16 · 16a Nip roll (second bonding portion)
17.17a Defect film winding roller 40 HEPA filter 41 Grating 50 Film transport mechanism 51 First film transport mechanism 52 Second film transport mechanism 60 Bonding device (polarizing film bonding device)
61 First substrate transport mechanism 61a Substrate placement unit 62 Second substrate transport mechanism 65 Reversing mechanism 66 Adsorption unit 67 Support unit 68 Elevating and rotating unit 70 Control unit 71 Cleaning unit 72 Inspection device 73 Bonding foreign matter automatic inspection device 74 Transfer device 100 Manufacturing system (Liquid crystal display manufacturing system)
165 Interface unit 166 Input unit 167 Display unit 168 Storage unit D1 Transport direction D2 Transport direction D3 Orthogonal direction

Claims (11)

A first substrate transport mechanism for transporting a rectangular substrate with a long side or a short side along the transport direction;
A first bonding unit for bonding a polarizing film to the lower surface of the substrate in the first substrate transport mechanism;
A reversing mechanism for inverting the substrate transported by the first substrate transporting mechanism and placing it on the second substrate transporting mechanism;
A second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction;
A polarizing film laminating apparatus comprising: a second laminating unit that laminates the polarizing film on the lower surface of the substrate in the second substrate transport mechanism,
The first substrate transport mechanism and the second substrate transport mechanism transport substrates in the same direction,
The reversing mechanism includes a suction part that sucks the substrate;
A substrate reversing unit connected to the adsorption unit, which inverts the substrate through the adsorption unit,
The substrate inversion part is
(1) The substrate is moved to the second substrate transport mechanism so that the long side or the short side of the substrate is orthogonal to the substrate transport direction of the second substrate transport mechanism,
(2) inverting the substrate by moving the surface side of the substrate toward the second substrate transport mechanism ;
The first substrate transport mechanism and the second substrate transport mechanism are arranged on a straight line,
At the end portion of the first substrate transport mechanism on the second substrate transport mechanism side, two pairs of substrate mounting portions and reversing mechanisms are provided along both directions parallel to the transport direction of the first substrate transport mechanism at the end portion. One by one,
The end portion is provided with a transport means for transporting the substrate from the end portion to the substrate mounting portion.
The polarizing film bonding apparatus, wherein the reversing mechanism reverses the substrate transported to each of the substrate mounting portions and arranges it on the second substrate transporting mechanism .   2. The polarized light according to claim 1, wherein, in (1), the substrate reversing unit moves the substrate so that the surface side of the substrate is directed in the substrate transport direction in the second substrate transport mechanism. Film bonding device. A first film transport mechanism and a second film transport mechanism for transporting the polarizing film;
The first film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the release film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding sections for winding the release film,
The second film transport mechanism includes a plurality of unwinding sections for unwinding the polarizing film protected by the release film, a cutting section for cutting the polarizing film, and a removing section for removing the peeling film from the polarizing film. And a plurality of winding sections for winding the release film,
The first substrate transport mechanism and the second substrate transport mechanism are provided above the first film transport mechanism and the second film transport mechanism,
The first bonding portion for bonding the polarizing film from which the release film has been removed to the substrate is between the first film transport mechanism and the first substrate transport mechanism, and the polarizing film from which the release film has been removed is the substrate. The bonding apparatus of the polarizing film of Claim 1 or 2 with which the 2nd bonding part bonded together is provided between the said 2nd film conveyance mechanism and the 2nd board | substrate conveyance mechanism, respectively. . Before the polarizing film is bonded to the lower surface of the substrate by the first bonding unit, a cleaning unit for cleaning the substrate is provided,
The said 1st board | substrate conveyance mechanism conveys a board | substrate in the state in which the short side of the board | substrate followed the conveyance direction, The bonding apparatus of the polarizing film of any one of Claims 1-3 characterized by the above-mentioned. In the first film transport mechanism and the second film transport mechanism, a defect detection unit that detects a defect display attached to the polarizing film unwound from the first unwinding unit;
A bonding avoidance unit that determines the defect display and stops the conveyance of the substrate,
It has a collection | recovery part which collect | recovers the polarizing films by which the bonding with a board | substrate was avoided, The bonding apparatus of the polarizing film of Claim 3 characterized by the above-mentioned. A polarizing film bonding apparatus according to any one of claims 1 to 5 ,
The manufacturing system of the liquid crystal display device provided with the sticking deviation test | inspection apparatus which test | inspects the sticking deviation in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part. A first substrate transport mechanism for transporting a rectangular substrate with a long side or a short side along the transport direction;
A first bonding unit for bonding a polarizing film to the lower surface of the substrate in the first substrate transport mechanism;
A reversing mechanism for inverting the substrate transported by the first substrate transporting mechanism and placing it on the second substrate transporting mechanism;
A second substrate transport mechanism for transporting the substrate in a state where the short side or the long side is along the transport direction;
A polarizing film laminating apparatus comprising: a second laminating unit that laminates the polarizing film on the lower surface of the substrate in the second substrate transport mechanism,
The first substrate transport mechanism and the second substrate transport mechanism transport substrates in the same direction,
The reversing mechanism includes a suction part that sucks the substrate;
A substrate reversing unit connected to the adsorption unit, which inverts the substrate through the adsorption unit,
The substrate inversion part is
(1) The substrate is moved to the second substrate transport mechanism so that the long side or the short side of the substrate is orthogonal to the substrate transport direction of the second substrate transport mechanism,
(2) A polarizing film laminating device, wherein the substrate is reversed by moving the surface side of the substrate toward the second substrate transport mechanism;
The manufacturing system of the liquid crystal display device provided with the sticking deviation test | inspection apparatus which test | inspects the sticking deviation in the board | substrate with which the polarizing film was bonded by the said 2nd bonding part. 7. The apparatus according to claim 6, further comprising: a sorting and conveying device that determines whether or not there is a pasting error based on an inspection result by the pasting error inspection device, and sorts the substrate on which the polarizing film is bonded based on the determination result. 8. A manufacturing system of a liquid crystal display device according to 7. A polarizing film bonding apparatus according to any one of claims 1 to 5 ,
A manufacturing system for a liquid crystal display device, comprising: a bonded foreign matter automatic inspection device that inspects foreign matter on a substrate on which a polarizing film has been bonded by the second bonding portion in the bonding device.   10. A sorting / conveying device that judges the presence / absence of a foreign substance based on an inspection result by the bonded foreign substance automatic inspection apparatus and sorts a substrate on which a polarizing film is bonded based on the determination result. A manufacturing system of a liquid crystal display device according to 1. It is equipped with a bonded foreign matter automatic inspection device that inspects foreign matters on the substrate on which the polarizing film has been bonded by the second bonding portion,
Based on the inspection result by the pasting inspection device and the inspection result by the pasting foreign matter automatic inspection device, the presence or absence of pasting and foreign matter is determined, and the substrate on which the polarizing film is pasted is determined based on the determination result. The manufacturing system of the liquid crystal display device of Claim 6 or 7 provided with the sorting conveyance apparatus which performs this.

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