TWI599823B - Manufacturing system, manufacturing method and recording medium for optical member laminated body - Google Patents

Description

Manufacturing system, manufacturing method and storage medium of optical component bonding body

The present invention relates to a manufacturing system, a manufacturing method, and a storage medium for an optical component bonding body in which an optical component is bonded to an optical display component.

The present invention claims priority based on Japanese Patent Application No. 2013-104151, filed on Jan.

Conventionally, a production system of an optical display device such as a liquid crystal display is known. This production system is to be bonded to an optical component such as a polarizing plate of a liquid crystal panel (optical display member), and a laminate which conforms to the size of the display region of the liquid crystal panel is cut out from the long film. Thereafter, the optical component is attached to the liquid crystal panel (for example, refer to Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2003-255132.

In general, the above-mentioned long film (optical film) is produced by extending a resin film impregnated with a dichroism dye in one direction. The optical axis direction of the long film is substantially the same as the extending direction of the resin film. Therefore, it is traditionally designed based on the extension direction. The cutting angle of the long film.

However, the optical axis of the long film is not the same in the whole of the long film, and there are some differences in the surface of the long film. Therefore, in the case where the polarizing plate (optical module) is cut out from the long film, the optical axis of the cut polarizing plate is deviated due to the influence of the optical axis difference in the surface of the long film.

The above optical axis difference is also produced in the case where the film-shaped optical component is bonded to the optical display component. Therefore, there is a need to improve the accuracy of the optical axis direction of the optical components of the optical display member.

In view of the above, the present invention provides a manufacturing system, a manufacturing method, and a storage medium for an optical component bonding body which can improve the optical axis direction accuracy of an optical film bonded to an optical display member.

(1) A manufacturing system for an optical component bonding body according to one aspect of the present invention includes: a control device that determines the optical display component based on inspection data indicating an optical axis direction of an optical component layer that is larger than a display region of the optical display component And a relative bonding position of the optical component layer; the calibration device performs calibration with respect to the optical display component of the optical component layer according to the relative bonding position determined by the control device; and a bonding device that laminates the optical component layer An optical display component calibrated to the calibration device; the detecting device detects an outer periphery of the bonding surface of the optical component layer and the optical display component in the optical component layer to which the bonding device is attached; and cuts a device, along the outer periphery of the bonding surface, cutting a first region of the region of the optical component layer corresponding to the optical component layer detected by the detecting device and a first region of the optical component layer The second area of the area.

In the above configuration, the "bonding surface of the optical display member and the optical component layer" means the surface of the optical component layer facing the optical display member; the "outer peripheral edge of the bonding surface" means, in particular, optical In the display member, the outer periphery of the substrate on the side of the optical component layer is bonded.

Further, the "first region (corresponding to the bonding surface region)" of the optical component layer means that the optical component layer is larger than the display region of the optical component layer and the opposite optical display component and is larger than the outer shape of the optical display component ( a small area in the outline view in plan view, and avoiding electronic components in the optical display part The area of the functional part such as the installation section.

(2) In the aspect of the above (1), the cutting device preferably cuts an optical component layer corresponding to the size of the bonding surface from the optical component layer, thereby cutting the optical display component and the optical component layer. Optical component bonding body.

Further, the "corresponding bonding surface size" in the above structure means a region which is larger than the display region of the optical display member and smaller than the outer shape of the optical display member (the contour shape in the plan view).

(3) In the aspect of the above (1), the control device preferably has a reference axis of the optical display member parallel to an optical axis direction of the optical component layer indicated by the inspection material to determine the relative bonding position.

(4) In the aspect of the above (3), the control device preferably uses the long-axis direction axis passing through the center of the plane of the optical display member as the reference axis.

(5) In the aspect of (1) above, the calibration device preferably arranges the optical component layer and the optical display component to a relative bonding position determined by the control device to perform calibration of the optical display component.

(6) In the aspect of the above (1), preferably, the calibration device is moved by the first transfer device in a direction perpendicular to a direction in which the optical display member is transported, and the first transfer device is transported around the optical display member. The vertical axis of the direction is rotated to transport the optical display member to the relative bonding position.

(7) In the aspect of the above (1), the calibration device preferably performs the optical display member reversely, and performs an optical display member with respect to the optical component layer according to the relative bonding position determined by the control device. calibration.

(8) In the aspect of the above (1), the bonding apparatus preferably uses, as the first region, a region larger than the display region and smaller than the outer shape of the optical display member.

(9) In the aspect of the above (1), the cutting device preferably uses a laser to cut the optical component layer.

(10) In the above aspect (1), preferably, the photographing device is further provided to photograph the position of the optical display member; wherein the control device determines the position based on the inspection data and the position of the optical display member photographed by the photographing device Relatively fitting position.

(11) In the aspect of the above (1), preferably, the first transport device is further provided, and the optical display member is transported in the order of the calibration device, the bonding device, and the cutting device.

(12) In the aspect of the above (1), preferably, the second transfer device is further provided, and the optical component layer is transported to the bonding device.

(13) In the aspect of the above (12), the second conveying device preferably includes a collecting portion that collects the remaining portion cut by the cutting device.

(14) A method of manufacturing an optical component bonding body according to one aspect of the present invention, comprising: determining an optical display component and the optical based on inspection data indicating an optical axis direction of an optical component layer larger than a display region of the optical display component a relative bonding position of the component layer; performing calibration of the optical display component relative to the optical component layer according to the determined relative bonding position; bonding the optical component layer to the calibrated optical display component; In the component layer, detecting an outer peripheral edge of the optical component layer and the bonding surface of the optical display component; and cutting the corresponding optical component layer in the region of the detected optical component layer along the outer peripheral edge of the bonding surface a first region of the mating face region and a second region of the outer region of the first region of the optical component layer.

(15) A computer-readable storage medium according to one aspect of the present invention, wherein a program for performing an operation of determining an optical data axis direction of an optical component layer larger than a display area of the optical display component is stored The optical display member and the relative bonding position of the optical component layer; performing calibration of the optical display component relative to the optical component layer according to the determined relative bonding position; bonding the optical component layer to the calibrated optical display component Detecting an outer peripheral edge of the optical component layer and the bonding surface of the optical display component in the bonded optical component layer; and cutting the region of the detected optical component layer along the outer peripheral edge of the bonding surface The first of the matching surface areas of the optical component layer a second region of the region and the outer region of the first region of the optical component layer.

Further, an aspect of the present invention is directed to a method of manufacturing an optical component by bonding an optical component to an optical display component, comprising: a process of bonding the optical component layer, which is larger than a display area of the optical display component The optical component layer is bonded to the optical display component to form a bonding layer; the process of determining the relative bonding position is performed according to the optical axis direction of the optical component layer before the optical component layer is bonded to the optical component component Checking the data to determine the relative bonding position of the optical display component and the optical component layer; and the calibration process, before the optical component layer is attached to the optical display component, according to the relative bonding position determined by the control device, Aligning the optical display component of the optical component layer; and cutting the process, after bonding the optical component layer to the optical display component, detecting the bonding surface of the optical component layer and the optical display component in the bonding layer The outer periphery, and in the bonding layer, along the outer periphery of the bonding surface, the portion of the bonding surface corresponding to the optical component layer and the outer side thereof are cut The remaining portion, the cutting out of the optical element layer to be attached to the optical assembly bonding surface size, thereby cutting out of the bonding layer comprises a single optical display assembly components of the optical assembly and overlaps the bonded body.

As is apparent from the aspect of the present invention, after the calibration is performed based on the inspection data indicating the optical axis direction of the optical component layer, the optical component layer is bonded to the optical display member. Thereby, even if the optical axis direction changes due to the position of the optical component layer, the optical display member can be aligned with the optical axis direction and bonded to the optical component layer. Thereby, the accuracy with respect to the optical axis direction of the optical component of the optical display member can be improved. Moreover, the color and contrast of the optical display device can be improved. Moreover, it is also possible to manufacture an optical component bonding body having an arbitrary optical axis direction.

5‧‧‧Roller conveyor

11‧‧‧First calibration device

12‧‧‧First bonding device

12’‧‧‧First bonding device

12a‧‧‧Transporting device

12a’‧‧‧Transporting device

12b‧‧‧ pinch roller

12c‧‧‧Roller Keeping Department

12d‧‧‧Protective film recycling department

12c‧‧‧First Recycling Department

13‧‧‧First cutting device

13’‧‧‧First cut-off device

14‧‧‧Second calibration device

15‧‧‧Second laminating device

15a‧‧‧Transporting device

15b‧‧‧ pinch roller

15c‧‧‧Roller Keeping Department

15d‧‧‧Second Recycling Department

16‧‧‧Second cutting device

17‧‧‧ Third calibration device

17'‧‧‧ third calibration device

18‧‧‧ Third bonding device

18’‧‧‧ Third bonding device

18a‧‧‧Transporting device

18b‧‧‧ pinch roller

18c‧‧‧Roller Keeping Department

18d‧‧‧ Third Recycling Department

19‧‧‧ Third cutting device

20‧‧‧Control device

41‧‧‧First detection device

42‧‧‧Second detection device

43‧‧‧Photographing device

43a‧‧‧Photographing surface

44‧‧‧Light source

45‧‧‧Control Department

C‧‧‧ camera

CA‧‧‧ inspection area

ED‧‧‧ outer periphery

F1‧‧‧First optical component layer

F2‧‧‧Second optical component layer

F3‧‧‧ third optical component layer

F11‧‧‧First optical component

F12‧‧‧Second optical component

F13‧‧‧ Third optical component

F1S‧‧‧ layer

F21‧‧‧ first bonding layer

F22‧‧‧Second bonding layer

F23‧‧‧ third bonding layer

FX‧‧‧ optical component layer

G‧‧‧Border Department

H‧‧‧ Height

H1‧‧‧ Height

P‧‧‧ LCD panel

P1‧‧‧ first substrate

P2‧‧‧second substrate

P3‧‧‧ liquid crystal layer

P4‧‧‧ display area

P5‧‧‧Electronic Component Installation Department

P11‧‧‧First single-sided fitting panel

P12‧‧‧Second single-sided fitting panel

P13‧‧‧ double-sided fitting panel

Pf‧‧‧protective film

Starting point of pt1‧‧

End point of pt2‧‧

PX‧‧‧Optical display parts

R1‧‧‧First roll drum

R2‧‧‧second roll drum

R3‧‧‧ third roll

SA1‧‧‧ first fit surface

SA2‧‧‧ second fit surface

T‧‧‧ cut end

Θ‧‧‧ tilt angle

Fig. 1 is a schematic configuration diagram of a film bonding system of an optical display device in an embodiment of the present invention.

Fig. 2 is a perspective view showing the periphery of a second bonding apparatus of the above film bonding system.

Fig. 3 is a perspective view showing an optical display member in which the optical axis direction of the optical component layer of the film bonding system is bonded thereto.

Figure 4 is a cross-sectional view of the first bonding layer in the above film bonding system.

Fig. 5 is a cross-sectional view showing a second bonding layer in the second cutting device of the film bonding system.

Fig. 6 is a plan view showing a third bonding layer in the third cutting device of the above film bonding system.

Figure 7 is a cross-sectional view taken along line A-A of Figure 6.

Figure 8 is a cross-sectional view of the double-sided bonding panel through the above film bonding system.

Fig. 9 is a cross-sectional view showing the laser cut end of the optical component layer which has been bonded to the liquid crystal panel.

Figure 10 is a cross-sectional view showing the laser cut end of the optical component layer unit.

Fig. 11 is a schematic structural view showing a modification of the periphery of the first bonding apparatus of the above film bonding system.

Fig. 12 is a schematic structural view showing a modification of the periphery of the third bonding apparatus of the above film bonding system.

Figure 13 is a schematic view showing the first detecting means for detecting the outer periphery of the bonding surface.

Fig. 14 is a view showing a modification of the first detecting device for detecting the outer periphery of the bonding surface.

Fig. 15 is a plan view showing the position of the outer peripheral edge of the detecting bonding surface.

Figure 16 is a schematic view showing a second detecting means for detecting the outer periphery of the bonding surface.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a film bonding system including a manufacturing apparatus of an optical component bonding body will be described.

Fig. 1 is a view showing a schematic configuration of a film bonding system 1 of the present embodiment. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel.

The film bonding system manufactures an optical component bonding body including the optical display member and the optical component. In the film bonding system 1, a liquid crystal panel P is used as the optical display member.

Each part of the film bonding system 1 is integrally controlled by a control device 20 as an electronic control unit.

The film bonding system 1 transports the liquid crystal panel P from the start position to the end position of the bonding process, for example, by using the driving type drum conveyor 5, and sequentially applies specific processing to the liquid crystal panel P. The liquid crystal panel P is conveyed on the drum conveyor 5 with its front/reverse surface in a horizontal state.

In addition, the left side of the paper surface of the first drawing shows the upstream side in the conveyance direction of the liquid crystal panel P (hereinafter referred to as the panel conveyance upstream side). The right side of the paper surface of the first drawing shows the downstream side of the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport downstream side).

The description will be made with reference to Figs. 6 to 8. In addition, in FIG. 7 and FIG. 8, the upper side of the paper surface of the liquid crystal panel P is the display surface side, and the lower side of the paper surface is the backlight side. The plan view of the liquid crystal panel P is rectangular (refer to Fig. 6). A display region P4 having a shape along the outer periphery is formed from the outer periphery of the liquid crystal panel P from the inner side of the specific width (refer to Fig. 6). When the panel of the second calibration device 14 is transported to the upstream side, the short side of the display region P4 is transported about the transport panel in the transport direction. When the panel of the second calibration device 14 is transported to the downstream side, the long side of the display region P4 is caused to convey the liquid crystal panel P approximately along the transport direction.

The first optical component F11 and the second optical component F12 cut out by the elongated first optical component layer F1, the second optical component layer F2, and the third optical component layer F3 for the front and back surfaces of the liquid crystal panel P And the third optical component F13 is appropriately attached to the liquid crystal panel P (refer to the eighth Figure). In the present embodiment, the first optical component F11 and the third optical component F13 which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P (refer to FIG. 8). On the side of the backlight side of the liquid crystal panel P, a second optical component F12 as a luminance increasing film (refer to FIG. 8) overlapping the first optical component F11 is further bonded.

As shown in FIG. 1, the film bonding system 1 includes a first calibration device 11, a first bonding device 12, a first cutting device 13, and a second calibration device 14.

The first aligning device 11 transports the liquid crystal panel P from the upstream process to the panel transport upstream side of the drum conveyor 5, and simultaneously calibrates the liquid crystal panel P. The first bonding apparatus 12 is provided on the downstream side of the panel conveyance of the first calibration apparatus 11. The first cutting device 13 is disposed adjacent to the first bonding device 12. The second calibration device 14 is provided on the panel transfer downstream side of the first bonding device 12 and the first cutting device 13.

Further, the film bonding system 1 includes a second bonding device 15, a second cutting device 16, a third calibration device 17, a third bonding device 18, and a third cutting device 19.

The second bonding device 15 is provided on the panel transport downstream side of the second calibration device 14. The second cutting device 16 is disposed adjacent to the second bonding device 15. The third calibration device 17 is provided on the panel transfer downstream side of the second bonding device 15 and the second cutting device 16.

The third bonding device 18 is provided on the downstream side of the panel transport of the third calibration device 17.

The third cutting device 19 is disposed adjacent to the third bonding device 18.

Further, as will be described later, on the panel transport upstream side of the second cutting device 16, a detecting device for defining a cutting position at the second cutting device 16 and a panel transporting upstream of the third cutting device 19 are provided. On the side, a detecting device is provided for specifying the cutting position of the third cutting device 19.

The first calibration device 11 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. Moreover, the first calibration device 11 has a panel for photographing the liquid crystal panel P. A pair of cameras C at the ends of the swim side and the downstream side (refer to Fig. 3). The photographic data of the camera C is transmitted to the control device 20.

The control device 20 activates the first calibration device 11 based on the photographic data and the inspection data in the optical axis direction stored in advance. However, the second calibration device 14 and the third calibration device 17 described later also have the camera C, and the photographic data of the camera C is used for calibration.

The first calibration device 11 is controlled by the control device 20 to perform calibration with respect to the liquid crystal panel P of the first bonding device 12. At this time, the position of the liquid crystal panel P in the horizontal direction (hereinafter referred to as the member width direction) in the vertical conveyance direction and the position in the rotation direction about the vertical axis (hereinafter referred to as the rotation direction) are determined. In this state, the liquid crystal panel P is guided to the bonding position of the first bonding apparatus 12.

The first bonding apparatus 12 bonds the lower side surface (backlight side) of the liquid crystal panel P that is transported along the upper side of the long first optical component layer F1 that is guided to the bonding position. The first bonding apparatus 12 includes a conveying device 12a and a nip roller 12b.

The conveying device 12a winds the first optical module layer F1 from the first roll drum R1 around which the first optical component layer F1 is wound, and conveys the first optical component layer F1 in the longitudinal direction thereof. The nip roller 12b bonds the lower surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the upper side surface of the 1st optical component layer F1 conveyed by the conveyance apparatus 12a.

The conveying device 12a includes a drum holding portion 12c and a protective film collecting portion 12d. The roller holding portion 12c holds the first roll drum R1 around which the first optical component layer F1 is wound, and winds up the first optical component layer F1 in the longitudinal direction thereof. The protective film collecting portion 12d collects the protective film pf which is superposed on the lower side surface of the first optical component layer F1 and is unwound with the first optical component layer F1, and is collected on the downstream side of the panel transfer of the first bonding apparatus 12.

The nip roller 12b has a pair of bonding drums arranged in parallel with each other in the axial direction. A specific gap is formed between the pair of bonding rollers, and the gap of the first bonding device 12 is the gap in the gap. Set. The liquid crystal panel P and the first optical component layer F1 are superposed into the gap. The liquid crystal panel P and the first optical component layer F1 are pinched between the bonding rollers and sent to the downstream side of the panel transport. Thereby, the first bonding layer F21 in which the plurality of liquid crystal panels P are continuously bonded to the upper surface of the elongated first optical component layer F1 at a predetermined interval can be formed.

The description will be made with reference to Fig. 4 and Fig. 5 together. In the fourth and fifth figures, the upper side of the paper surface of the liquid crystal panel P is the backlight side, and the lower side of the paper surface is the display surface side. The first cutting device 13 is located on the downstream side of the panel conveyance of the protective film collecting portion 12d. The first cutting device 13 cuts off the entire width in the width direction of the member at a specific portion of the first optical component layer F1 (between the liquid crystal panels P arranged in the transport direction). Thereby, the first cutting device 13 cuts the first optical component layer F1 of the first bonding layer F21, and is a layer F1S which is larger than the display region P4 (larger than the liquid crystal panel P in the present embodiment). However, the first cutting device 13 preferably uses a cutting blade, and a laser cutting machine can also be used. By this cutting, the first single-sided bonding panel P11 is formed, and a layer sheet F1S larger than the display region P4 is bonded to the lower side surface of the liquid crystal panel P.

Further, in the layer sheet F1S, the size of the outer portion of the liquid crystal panel P (the remaining portion of the layer F1S) is appropriately set in accordance with the size of the liquid crystal panel P. For example, when the layer F1S is applied to a small-sized and medium-sized liquid crystal panel P of 5 to 10 inches, one side of the layer F1S and one side of the liquid crystal panel P are formed on each side of the layer F1S. The interval between the two is set to a length ranging from 2 mm to 5 mm.

This will be described with reference to Fig. 1. The second aligning device 14 is, for example, capable of holding the first single-sided bonding panel P11 on the drum conveyor 5 and rotating it by 90° about the vertical axis. Thereby, the first single-sided bonding panel P11 conveyed in a direction slightly parallel to the short side of the display region P4 is conveyed in a direction slightly parallel to the long side of the display region P4. However, the above-described rotation is a case where the optical axis direction of the other optical component layer bonded to the liquid crystal panel P is disposed at a right angle with respect to the optical axis direction of the first optical component layer F1.

The second calibration device 14 performs the same calibration as the first calibration device 11. That is, the second calibration device 14 determines the width direction of the member of the first single-sided bonding panel P11 of the second bonding device 15 based on the inspection data stored in the optical axis direction of the control device 20 and the imaging data of the camera C. The position in the direction of rotation. In this state, the first single-sided bonding panel P11 is guided to the bonding position of the second bonding apparatus 15.

The second bonding apparatus 15 is directed to the upper side of the elongated second optical component layer F2 that is guided to the bonding position, and the lower side of the first single-sided bonding panel P11 that is carried along the upper side thereof (the backlight of the liquid crystal panel P) Side) for fitting. In other words, in order to bring the layer F1S and the second optical component layer F2 on the backlight side of the liquid crystal panel P bonded to the first single-sided bonding panel P11, the first single-sided bonding panel P11 and the second optical are bonded. Component layer F2.

The second bonding apparatus 15 includes a conveying device 15a and a nip roller 15b.

The conveying device 15a winds up the second optical component layer F2 from the second reel roller R2 around which the second optical component layer F2 is wound, and conveys the second optical component layer F2 in the longitudinal direction thereof. The nip roller 15b bonds the lower surface of the first single-sided bonding panel P11 conveyed by the drum conveyor 5 to the upper surface of the second optical component layer F2 conveyed by the conveying device 15a.

The conveying device 15a includes a drum holding portion 15c and a second collecting portion 15d.

The roller holding portion 15c holds the second take-up roll R2 around which the second optical component layer F2 is wound, and winds up the second optical component layer F2 in the longitudinal direction thereof. The second recovery unit 15d collects the remaining portion of the second optical module layer F2 after being transported by the second cutting device 16 on the downstream side of the panel of the nip roller 15b.

The nip roller 15b has a pair of bonding drums arranged in parallel with each other in the axial direction. A specific gap is formed between the pair of bonding rollers, and the gap is the bonding position of the second bonding device 15. The first single-sided bonding panel P11 and the second optical component layer F2 are superposed and introduced into the gap. The first single-sided bonding panel P11 and the second optical component layer F2 are pinched between the bonding rollers, and are sent Carry the downstream side to the panel. Thereby, the second bonding layer F22 in which the plurality of first single-sided bonding panels P11 are continuously bonded to the upper surface of the elongated second optical component layer F2 at a predetermined interval can be formed.

The description will be made with reference to Fig. 2 and Fig. 5 together. The second cutting device 16 is located on the downstream side of the panel conveyance of the nip roller 15b. The second cutting device 16 simultaneously cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 of the first single-sided bonding panel P11 attached to the upper side thereof. The second cutting device 16 is, for example, a carbon dioxide (CO ₂ ) laser cutting machine. The second cutting device 16 cuts the second optical component layer F2 and the first optical unit continuously along the outer periphery of the bonding surface of the laminate and the liquid crystal panel P (in the present embodiment, along the outer periphery of the liquid crystal panel P). A laminate of the layer F1S of the component layer F1. After the optical component layers (the first optical component layer F1 and the second optical component layer F2) are bonded to the liquid crystal panel P and then cut together, the optical component layers (the first optical component layer F1 and the second optical component) can be improved. The accuracy of the optical axis direction of layer F2). Moreover, the deviation of the optical axis directions between the respective optical component layers (the first optical component layer F1 and the second optical component layer F2) can be eliminated. Furthermore, the cutting in the first cutting device 13 can be simplified.

The second single-sided bonding panel P12 is formed by the cutting of the second cutting device 16, and the first optical component F11 and the second optical component F12 are laminated on the lower side of the liquid crystal panel P (refer to the seventh Figure). At this time, the second single-sided bonding panel P12 and the portions (the first optical component F11 and the second optical component F12) that are cut off corresponding to the bonding surface are left in a frame-like optical component layer (the first optical component layer F1). The remaining portions of the second optical component layer F2) can be separated from each other.

The remaining portion of the second optical component layer F2 may be in the form of a plurality of ladders connected. The remaining portion is co-wound with the remaining portion of the first optical component layer F1 to the second recovery portion 15d.

In addition, the part corresponding to a bonding surface is mentioned later.

This will be described with reference to Fig. 1. The third calibration device 17 performs forward/reverse inversion of the second single-sided bonding panel P12 on the display surface side of the liquid crystal panel P toward the upper side, so that the backlight side of the liquid crystal panel P faces the upper side. The third calibration device 17 performs the first calibration device 11 and the second calibration device 14 same calibration. That is, the third calibration device 17 determines the width direction and the rotation of the member of the second single-sided bonding panel P12 with respect to the third bonding device 18 based on the optical axis direction inspection data stored in the control device 20 and the imaging data of the camera C. The position in the direction. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding device 18.

The third bonding apparatus 18 is directed to the upper side of the elongated third optical component layer F3 that is guided to the bonding position, and the lower side of the second single-sided bonding panel P12 that is transported along the upper side thereof (the display of the liquid crystal panel P) Face side). The third bonding apparatus 18 includes a conveying device 18a and a nip roller 18b.

The conveying device 18a winds up the third optical component layer F3 from the third winding drum R3 around which the third optical component layer F3 is wound, and conveys the third optical component layer F3 in the longitudinal direction thereof. The nip roller 18b bonds the lower surface of the second single-sided bonding panel P12 conveyed by the drum conveyor 5 to the upper side surface of the third optical component layer F3 conveyed by the conveying apparatus 18a.

The conveying device 18a includes a drum holding portion 18c and a third collecting portion 18d.

The roller holding portion 18c holds the third roll drum R3 around which the third optical component layer F3 is wound, and winds up the third optical component layer F3 in the longitudinal direction thereof. The third recovery unit 18d collects the remaining portion of the third optical module layer F3 after passing through the third cutting device 19 on the downstream side of the panel of the nip roller 18b.

The nip roller 18b has a pair of bonding rollers arranged parallel to each other in the axial direction. A specific gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18. The second single-sided bonding panel P12 and the third optical component layer F3 are superposed into the gap. The second single-sided bonding panel P12 and the third optical component layer F3 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. Thereby, the third bonding layer F23 in which the plurality of second single-sided bonding panels P12 are continuously bonded to the upper surface of the elongated third optical component layer F3 at a predetermined interval can be formed.

The third cutting device 19 is located on the downstream side of the panel conveyance of the nip roller 18b, and is cut off. The third optical component layer F3. The third cutting device 19 has the same laser processing machine as the second cutting device 16, and the outer peripheral edge of the bonding surface along the third optical component layer F3 and the liquid crystal panel P (for example, along the outer periphery of the liquid crystal panel P) The third optical component layer F3 is cut without interruption.

By the cutting of the third cutting device 19, the double-sided bonding panel P13 is formed, and the third optical component F13 is attached to the lower side surface of the second single-piece bonding panel P12 (refer to Fig. 8). At this time, the remaining portions of the third optical component layer F3, which has a frame shape after the double-sided bonding panel P13 and the portion (the third optical component F13) from which the corresponding bonding surface is cut, can be separated from each other. The remaining portion of the third optical component layer F3 is in the form of a ladder connected in plural as in the remaining portion of the second optical component layer F2 (refer to FIG. 2). This remaining portion is taken up to the third recovery portion 18d.

The double-sided bonding panel P13 is inspected by a defect inspection device (not shown) to check whether there is a defect (a poor bonding or the like), and then transferred to a downstream process for other processing.

Here, a general elongated optical film (corresponding to each optical component layer (first optical component layer F1, second optical component layer F2, third optical component layer F3)) is dyed by a dichroic dye. The resin film is produced by extending to one axis, and the optical axis direction of the optical film substantially coincides with the extending direction of the resin film. However, since the entire optical film is not the same, the optical axis of the optical film may be slightly different in the width direction of the optical film.

For this reason, in the case where a plurality of optical display members are attached to the optical film in the width direction thereof, the alignment of the optical display member is performed in accordance with the optical axis direction of the optical film.

Thereby, it is effective to suppress the optical axis deviation of the optical display device unit to improve the chromaticity and contrast.

The optical film as a polarizing film is dyed with, for example, iodine or a dichroic dye in order to block light other than the light that vibrates in one direction. However, a peeling film or a protective film may be further laminated on the optical film.

The inspection device for inspecting the optical axis direction of the optical film includes a light source and an analyzer.

The light source is disposed on one side of the front/back side of the optical film. The analyzer is placed on the other side of the front/back of the optical film. The analyzer receives light that is irradiated from the light source and transmitted through the optical film, and detects the intensity of the light to thereby detect the optical axis of the optical film. The analyzer can be moved, for example, in the width direction of the optical film. The inspection device detects the optical axis of the optical film by the analyzer while moving the analyzer in the width direction of the optical film. Thereby, the inspection device inspects the optical axis of the optical film at a plurality of inspection positions in the width direction of the optical film. Further, the configuration in which the analyzer is moved in the width direction of the optical film is not necessarily required, and the configuration may be such that a plurality of analyzers are provided in the width direction of the optical film.

A plurality of checkpoints are set in the width direction of the optical film, and the analyzer is movable in the direction in which the plurality of checkpoints are arranged. The inspection device transports the optical film while moving the analyzer to check the optical axis direction at each of the inspection points. The optical axis data of the optical film detected by the inspection device is stored in the storage device in association with the position of the optical film (the position in the longitudinal direction of the optical film and the position in the width direction). The optical film inspected by the inspection device is taken up in a roll shape to form a roll drum.

In the case of the present embodiment, the inspection data of each optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) obtained by the inspection apparatus is optical and axial. The longitudinal direction position and the width direction position of the component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) are stored in the memory of the control device 20. After this inspection, each of the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) is taken up to form each of the roll rolls (the first roll roll R1, the second roll) Roller drum R2, third roll drum R3).

Hereinafter, each of the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) may be collectively referred to as an optical component layer FX, and is bonded to each optical component layer (first optical component layer F1) The liquid crystal panel P, the first single-sided bonding panel P11, and the second single-sided bonding panel P12 of the second optical component layer F2 and the third optical component layer F3) may be collectively referred to as an optical display component PX.

Here, the polarizing film constituting the optical component layer FX is formed, for example, by a polyvinyl alcohol (PVA) film dyed with a dichroic dye and extended toward one axis. The problem that the thickness of the PVA film is uneven or the dyeing of the dichroic dye is uneven during the stretching of the polarizing film causes a problem that the optical axis direction of the optical component layer FX in the width direction and the width direction are different.

In this embodiment, the inspection position data is distributed in the optical axis plane in each of the optical component layers FX of the control device 20, and the bonding position of the optical display member PX with respect to the optical component layer FX is determined. Position)). Then, in the present embodiment, after the alignment of the optical display member PX with respect to the optical component layer FX is performed, the optical display member PX is bonded to the optical component layer FX.

Specifically, first, the reference axis of the optical display member PX aligned in the member width direction of the optical component layer FX (for example, the longitudinal direction axis passing through the center position of the plan view shape) is obtained.

Then, the optical axis direction at a position overlapping with the reference axis of the optical display member PX in the optical component layer FX is estimated based on the in-plane distribution data by appropriate correction processing or the like.

Next, the bonding position of the optical display member PX is corrected based on the estimated optical axis direction to determine the relative bonding position of the optical display member PX and the optical component layer FX. Thereafter, the calibration of the optical display part PX is performed.

Thereby, even when the optical display member PX is bonded to the position different from the width direction of the optical component layer FX, the optical axis direction deviation of the optical component layer FX with respect to the reference position of the optical display component PX can be suppressed. According to the present embodiment, the optical axis tolerance can be almost 0 (the tolerance is ±0.25).

However, the optical axis direction can also be detected while the optical component layer FX is being unwound, and the optical display component PX can be calibrated based on the detection data. Further, the above various calibration methods are not limited to the case where the optical axis direction of the optical component layer FX is 0° and 90°, and may be applied to any angle. Happening.

Fig. 3 is an example in which three optical display members PX are juxtaposed in the width direction of the wider optical component layer FX. However, the present invention is not limited thereto, and two or less or four or more optical display members PX may be laminated in parallel in the width direction of the optical module layer FX. Further, a plurality of narrow optical component layers FX may be arranged in a plurality of width directions, and each of the optical display members PX may be attached.

This will be explained with reference to Fig. 4. The liquid crystal panel P includes a first substrate P1, a second substrate P2, and a liquid crystal layer P3.

The first substrate P1 is a rectangular substrate made of, for example, a thin film transistor (TFT) substrate. The second substrate P2 is a rectangular substrate that is disposed on the first substrate P1. The liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. However, for convenience of illustration, the cross-sectional lines of the respective layers in the cross-sectional view are omitted.

Description will be made with reference to Fig. 6 and Fig. 7. The three sides of the outer periphery of the first substrate P1 are disposed along three sides corresponding to the second substrate P2, and one of the remaining sides of the outer periphery extends to the outer side of one side of the second substrate P2. Thereby, an electronic component mounting portion P5 that extends to the outside of the second substrate P2 is provided at one side of the first substrate P1.

Description will be made with reference to Fig. 5 and Fig. 7. After the second cutting device 16 detects the detecting device described later, the first optical component layer F1 is cut along the outer peripheral edge of the bonding surface of the second optical component layer F2 and the layer F1S and the bonding surface of the liquid crystal panel P. And a second optical component layer F2. In Fig. 5, the photographing device 43 constituting the detecting device is displayed. After the third cutting device 19 detects the detecting device described later, the third optical component layer F3 is cut along the outer peripheral edge of the bonding surface of the third optical component layer F3 and the liquid crystal panel P. In Fig. 7, the photographing device 43 constituting the detecting device is shown. A frame portion G having a specific width for the sealant or the like that joins the first substrate P1 and the second substrate P2 is provided on the outer side of the display region P4. Within the width of the frame portion G, the second cutting device 16 and the third The cutting device 19 performs laser cutting.

The detection of the outer periphery of the bonding surface and the cutting of the cutting device will be described in detail below.

Figure 13 is a schematic view showing the first detecting means 41 for detecting the outer periphery of the bonding surface. In Fig. 13, for convenience, the side of the liquid crystal panel P to which the layer sheet F1S is bonded is the upper side, and the structure of the first detecting device 41 is shown as being vertically opposite.

The first detecting device 41 included in the film bonding system 1 of the present embodiment includes an imaging device 43 that captures a bonding surface of the liquid crystal panel P and the layer F1S in the second bonding layer sheet F22 (hereinafter referred to as first The screen of the outer peripheral edge ED of the bonding surface SA1); the illumination light source 44 illuminates the outer peripheral edge ED; and the control unit 45 stores the image captured by the imaging device 43 or the calculation for detecting the outer peripheral edge ED based on the screen.

The first detecting device 41 is disposed between the nip roller 15b on the upstream side of the panel transporting of the second cutting device 16 in the first drawing and the second cutting device 16.

The photographing device 43 is fixed and disposed on the inner side of the first bonding surface SA1 of the outer peripheral edge ED, and is inclined so that the normal line of the first bonding surface SA1 is at an angle θ with the normal line of the imaging surface 43a of the photographing device 43 ( Hereinafter, it is referred to as an inclination angle θ) of the photographing device 43. The photographing device 43 faces the outer peripheral edge ED with the imaging surface 43a, and photographs the outer peripheral edge ED from the side of the second bonding layer F22 where the layer sheet F1S is bonded.

The inclination angle θ of the photographing device 43 is set so that the outer periphery of the first substrate P1 constituting the first bonding surface SA1 can be surely captured. For example, the liquid crystal panel P divides the main board into a plurality of liquid crystal panels, which is a case where a multi-layered panel is formed, and a deviation occurs in the outer periphery of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P, and the second substrate P2 The end faces are offset to the outside of the end faces of the first substrate P1. In the above case, the inclination angle θ of the photographing device 43 can be set such that the outer periphery of the second substrate P2 does not enter the photographing field of view of the photographing device 43.

In the above case, the inclination angle θ of the imaging device 43 can be set in accordance with the distance H between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as the height H of the imaging device 43). For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 can be set to an angle of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 43 and the tilt angle θ of the photographing device 43 can be obtained from the amount of deviation. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10°.

The tilt angle θ of the photographing device 43 may also be 0°. Fig. 14 is a view showing a modification of the first detecting device 41, and is an example in which the inclination angle θ of the photographing device 43 is 0°. In the case of Fig. 14, for the sake of convenience, the side of the liquid crystal panel P to which the layer sheet F1S is bonded is the upper side, and the structure of the first detecting device 41 is displayed upside down. As shown in Fig. 14, the photographing device 43 and the illumination light source 44 can be disposed at positions overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.

The distance H1 between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as the height H1 of the imaging device 43) can be set to easily detect the position of the periphery ED outside the first bonding surface SA1. . For example, the height H1 of the photographing device 43 can be set in a range of 50 mm or more and 150 mm or less.

The illumination light source 44 is fixed and disposed on the opposite side of the side of the second bonding layer F22 to which the layer sheet F1S is bonded. The illumination light source 44 is disposed outside the first bonding surface SA1 in an inclined posture, and is located outside the outer peripheral edge ED of the first bonding surface SA1 in the normal direction. In the present embodiment, the optical axis of the illumination light source 44 is parallel to the normal line of the imaging surface 43a of the imaging device 43.

Further, the illumination light source 44 may be disposed on the side of the second bonding layer F22 to which the layer sheet F1S is bonded (that is, on the same side as the photographing device 43).

Moreover, as long as the illumination light emitted by the illumination source 44 can be illuminated, the illumination is illuminated. The peripheral edge ED of the device 43 is photographed, and the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may also intersect each other.

Fig. 15 is a plan view showing the position at which the outer periphery of the bonding surface is detected. An inspection area CA is set on the conveyance path of the second bonding layer F22 as shown in Fig. 15 . The inspection area CA is set on the liquid crystal panel P to be conveyed, and corresponds to the position of the outer periphery ED of the first bonding surface SA1. In Fig. 15, the inspection area CA is set at four positions corresponding to the four corner portions of the first bonding surface SA1 having a rectangular shape in plan view to detect the corner portion of the first bonding surface SA1 (i.e., the outer circumference) The structure of ED). In Fig. 15, in the outer periphery of the first bonding surface SA1, the hook portion of the corresponding corner portion is shown as the outer peripheral edge ED.

The first detecting means 41 of Fig. 13 detects the outer peripheral edge ED in the inspection area CA at four positions.

Specifically, each of the inspection areas CA is provided with an imaging device 43 and an illumination light source 44, and the first detection device 41 captures a corner portion of the first bonding surface SA1 of each of the liquid crystal panels P that are transported, and detects the outer circumference based on the image data. Edge ED. The data of the detected peripheral ED is stored in the control unit 45 shown in Fig. 13.

Further, as long as the outer periphery of the first bonding surface SA1 can be detected, the setting position of the inspection region CA is not limited thereto. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side). In this case, the structure of each side (four sides, that is, the outer circumference) of the first bonding surface SA1 is detected.

Further, the photographing device 43 and the illumination light source 44 are not limited to being disposed in each of the inspection regions CA, and may be configured to be movable along a movement route set by the outer periphery ED of the first bonding surface SA1. In this case, a set of the imaging device 43 and the illumination light source 44 may be provided.

The cutting position of the layer F1S and the second optical component layer F2 of the second cutting device 16 is adjusted based on the detection result of the outer periphery ED of the first bonding surface SA1. Control as shown in Figure 14 The portion 45 sets the cutting position of the layer F1S and the second optical component layer F2 based on the data of the outer peripheral edge ED of the first bonding surface SA1 stored, so that the first optical component F11 is formed so as not to protrude outside the liquid crystal panel P (the The size of the outer surface of a fitting surface SA1). The second cutting device 16 cuts the layer sheet F1S and the second optical module layer F2 at the cutting position determined by the control unit 45.

Returning to Fig. 1, the second cutting device 16 is provided on the downstream side of the panel conveyance of the first detecting device 41. The second cutting device 16 cuts the portion of the layer F1S and the second optical component layer F2 that are bonded to the liquid crystal panel P corresponding to the first bonding surface SA1 along the outer periphery ED, and the remaining portion thereof The first optical component F11 and the second optical component F12 corresponding to the size of the first bonding surface SA1 are cut out (refer to FIG. 8). Thereby, the second single-sided bonding panel P12 in which the first optical component F11 and the second optical component F12 are bonded to each other on the upper surface of the liquid crystal panel P is formed.

Here, the "portion corresponding to the first bonding surface SA1" means that the display area of the opposite liquid crystal panel P is larger than that of the liquid crystal panel P in the layer F1S and the second optical component layer F2 (planar) The outline of the outline in the view is a small area, and is an area in the liquid crystal panel P that avoids a functional part such as an electronic component mounting portion.

In the present embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portions are cut off by laser along the outer periphery of the liquid crystal panel P at three sides except the functional portion, which is equivalent to the function. On one side of the portion, the remaining portion is cut by laser from a position outside the outer periphery of the liquid crystal panel P toward the display region P4 side. For example, in the case where the first substrate P1 is a thin film transistor (TFT) substrate, in a side opposite to the functional portion, in addition to the functional portion, from the periphery of the liquid crystal panel P toward the display region The P4 side is offset by a certain amount of position.

Figure 16 is a schematic view showing the second detecting means 42 for detecting the outer periphery of the bonding surface. In Fig. 16, for the sake of convenience, the side of the liquid crystal panel P to which the third optical component layer F3 is attached is the upper side, and the structure of the second detecting device 42 is shown to be vertically opposite. Film bonding of this embodiment The second detecting device 42 included in the system 1 includes an imaging device 43 that captures a bonding surface of the liquid crystal panel P and the third optical component layer F3 in the third bonding layer F23 (hereinafter referred to as a second bonding surface SA2). The screen of the outer peripheral edge ED; the illumination light source 44 illuminates the outer peripheral edge ED; and the control unit 45 stores the screen imaged by the photographing device 43, and detects the calculation for the outer peripheral edge ED based on the screen. The second detecting device 42 has the same structure as the above-described first detecting device 41.

Such a second detecting device 42 is provided between the nip roller 18b on the upstream side of the panel transporting of the third cutting device 19 in the first drawing and the third cutting device 19. The second detecting device 42 detects the outer peripheral edge ED of the second bonding surface SA2 in the same manner as the first detecting device 41 in the inspection region set on the transport path of the third bonding layer F23.

The cutting position of the third optical component layer F3 of the third cutting device 19 is adjusted in accordance with the detection result of the outer peripheral edge ED of the second bonding surface SA2. The control unit 45 as shown in FIG. 13 sets the cutting position of the third optical component layer F3 based on the stored data of the outer peripheral edge ED of the second bonding surface SA2, so that the third optical component F13 is formed not to protrude from the liquid crystal. The size of the outer side of the panel P (outside of the second bonding surface SA2). The third cutting device 19 cuts the third optical module layer F3 at the cutting position determined by the control unit 45.

The third cutting device 19 cuts off the portion of the third optical component layer F3 of the liquid crystal panel P corresponding to the second bonding surface SA2 and the remaining portion thereof along the detected outer peripheral edge ED, thereby cutting out The third optical component F13 corresponding to the size of the second bonding surface SA2 (refer to FIG. 8). Thereby, the double-sided bonding panel P13 is formed, and the third optical component F13 is attached to the upper surface of the second single-sided bonding panel P12.

Here, the "portion corresponding to the second bonding surface SA2" means that in the third optical component layer F3, the display area of the opposite liquid crystal panel P is larger than the liquid crystal panel P (the outline in the plan view) The area of the liquid crystal panel P is a region that avoids a functional portion such as an electronic component mounting portion.

As shown in Fig. 10, when the optical component layer FX made of resin is subjected to laser cutting alone, the cut end t may be expanded or wavy due to thermal deformation. Therefore, in the case where the laser-cut optical component layer FX is bonded to the optical display member PX, the optical component layer FX is liable to cause a problem of poor adhesion such as air incorporation or deformation.

On the other hand, in the present embodiment, as shown in FIG. 9, after the optical component layer FX is bonded to the liquid crystal panel P, the optical component layer FX is cut by laser. In the present embodiment, the cut end t of the optical component layer FX is supported by the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical component layer FX does not swell or wavy, and after the liquid crystal panel P is bonded, the bonding failure does not occur.

The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in the present embodiment, the width of the frame portion G can be made narrower than in the case where the optical module layer FX is cut by the dicing blade. Further, the size of the liquid crystal panel P and/or the enlargement of the display region P4 can be achieved. This can be applied to a high-performance mobile device that needs to enlarge a display screen under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.

Further, in the case where the layer of the display unit P4 of the liquid crystal panel P is diced after the optical component layer FX is diced, the dimensional tolerance of each of the layer and the liquid crystal panel P, and the like The dimensional tolerances of the relative fit positions are superimposed. Therefore, it is difficult to reduce the width of the frame portion G of the liquid crystal panel P. In other words, the display area is difficult to expand.

On the other hand, in the case where the optical component layer FX is bonded to the liquid crystal panel P and the cutting is performed in accordance with the display region P4, only the vibration tolerance of the cutting line must be considered. Therefore, the tolerance (±0.1 mm or less) of the width of the frame portion G can be reduced. This feature also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).

Furthermore, the optical component layer FX is cut by a non-profit laser, and no force is applied to the liquid crystal panel P during the cutting, so that the edge of the substrate of the liquid crystal panel P is less likely to be cracked or broken. Cracking, improving durability against thermal cycling and the like. Similarly, since the liquid crystal panel P is not touched, damage to the electronic component mounting portion P5 is also small.

Further, in the case where the optical component layer FX is cut by laser, the energy per unit length of the laser irradiation is preferably determined in consideration of the thickness structure of the liquid crystal panel P or the optical component layer FX.

In the present embodiment, in the case where the optical component layer FX is cut by laser, the energy per unit length is preferably irradiated in a range of 0.01 to 0.11 (J/mm). In the case of laser irradiation, when the energy per unit length is excessively large, the optical component layer FX may be damaged by the laser cutting of the optical component layer FX. However, since the energy per unit length is laser-irradiated in the range of 0.01 to 0.11 (J/mm), the optical component layer FX can be prevented from being damaged.

As shown in Fig. 6, in the case where the optical component layer FX (the third optical component layer F3 in Fig. 6) is cut by laser, for example, the extension of the long side of one of the display regions P4 is set as laser cutting. Starting point pt1. Next, the cutting operation of the long side is started from the starting point pt1. The end point pt2 of the laser cutting is set to a position on the extension of the short side of the starting point side of the display area P4 after the laser surrounds the display area P4 one turn. The starting point pt1 and the end point pt2 are set such that the remaining portion of the optical component layer FX still retains a specific splicing portion and can withstand the tension when the optical component layer FX is taken up.

As described above, in the manufacturing system of the optical component bonding body of the above embodiment, the optical component (the first optical component F11 and the second optical component F12) is bonded to the liquid crystal panel P to form the second single-sided bonding panel P12. In the manufacturing system, the control device 20 is configured to determine the optical axis direction of the optical component layer (the first optical component layer F1 and the second optical component layer F2) which is larger than the display region P4 of the liquid crystal panel P. The relative position of the liquid crystal panel P and the optical component layer (the first optical component layer F1 and the second optical component layer F2); the calibration device (the first calibration device 11 and the second calibration device 14) according to the control device Aligning the liquid crystal panel P with respect to the optical component layer (the first optical component layer F1 and the second optical component layer F2) with respect to the relative bonding position determined by 20; the bonding device (the first bonding device 12, the second Fitting device 15), the optical component layer (first optical component layer F1 The second optical component layer F2) is sequentially attached to the optical display component calibrated according to the calibration device (the first calibration device 11 and the second calibration device 14) as the second bonding layer F22; the detecting device (first The detecting device 41) detects the optical component layer (the first optical component layer F1 and the second optical component layer F2) to which the bonding device (the first bonding device 12 and the second bonding device 15) is attached The optical component layer (first optical component layer F1) and an outer peripheral edge of the first bonding surface SA1 of the liquid crystal panel P; and a cutting device (first cutting device 16) along the first bonding surface SA1 The outer periphery of the optical component layer (the first optical component layer F1 and the second optical component layer F2) detected by the detecting device (the first detecting device 41) corresponds to the optical component layer (the first optical component) a first region of the first bonding surface SA1 of the layer F1) and a second region of the outer region of the first region of the optical component layer.

Similarly, in the manufacturing system of the optical component bonding body in the above embodiment, in the manufacturing system in which the optical component (third optical component F13) is bonded to the second single-sided bonding panel P12 to form the double-sided bonding panel P13, A bonding device (third bonding device 18) is provided, and an optical component layer (third optical component layer F3) larger than a display region P4 of the liquid crystal panel P is bonded to the second single-sided bonding panel P12. The opposite side of the optical component (the first optical component F11, the second optical component F12) serves as the third bonding layer F23; the control device 20 is bonded to the optical component layer (the third optical component layer F3) to Before the second single-sided bonding panel P12, the relative stickers of the liquid crystal panel P and the second single-sided bonding panel P12 are determined according to the inspection data of the optical axis direction of the optical component layer (the third optical component layer F3). a positional alignment device (third calibration device 17), before the optical component layer (third optical component layer F3) is attached to the second single-sided bonding panel P12, according to the relative sticker determined by the control device 20 Positioning with respect to the optical component layer (third optical component layer F3) The calibration of the two single-sided bonding panel P12; the detecting device (the second detecting device 42) is attached to the second single-sided bonding panel P12 after the optical component layer (the third optical component layer F3) is attached to the sticker In the optical component layer (third optical component layer F3) to which the bonding device (third bonding device 18) is attached, the optical component layer (third optical component layer F3) and the second bonding of the liquid crystal panel P are detected. The outer periphery of the surface SA2; and the cutting device (the third cutting device 19) along the second sticker The outer periphery of the joint surface SA2 cuts off the optical component layer (third optical component layer F3) in the region of the optical component layer (third optical component layer F3) detected by the detecting device (second detecting device 42). a first region of the second bonding surface SA2 region and a second region of the outer region of the first region of the optical component layer (third optical component layer F3) are cut out from the optical component layer (third optical component layer F3) An optical component (third optical component F13) corresponding to the size of the second bonding surface SA2, thereby cutting out a single liquid crystal panel P and an optical component (the third optical component F13) overlapping the same from the third bonding layer F23 Double-sided fitting panel P13.

In this embodiment, as described above, the cutting device (second cutting device 16) is preferably cut out from the optical component layer (the first optical component layer F1 and the second optical component layer F2). The optical component layer (the first optical component layer F1 and the second optical component layer F2) of the size of the bonding surface SA1 is formed to cut the liquid crystal panel P and the optical component layer (the first optical component layer F1 and the second optical component) The second bonding layer F22 (optical component bonding body) of the layer F2).

Moreover, in the present embodiment, the control device 20 preferably optically controls the reference axis of the liquid crystal panel P and the optical component layer (the first optical component layer F1 and the second optical component layer F2) indicated by the inspection material. The axial directions are parallel to determine the relative fit position.

Further, in the present embodiment, as described above, the control device 20 preferably uses the longitudinal axis of the center of the plane of the liquid crystal panel P as the reference axis.

Moreover, in the embodiment, the calibration device (the first calibration device 11 and the second calibration device 14) preferably has the optical component layer (the first optical component layer F1 and the second optical component layer F2) and the liquid crystal panel. P is disposed to the relative bonding position determined by the control device 20 to perform calibration of the liquid crystal panel P.

Further, in the present embodiment, as described above, the calibration device (the first calibration device 11 and the second calibration device 14) is preferably conveyed toward the liquid crystal panel P by the roller conveyor 5 (first conveying device). The liquid crystal panel P is transported to the relative bonding position by moving in the vertical direction and by the roller conveyor 5 rotating about the vertical axis of the liquid crystal panel P conveyance direction.

Further, in the present embodiment, as described above, the calibration device (the first calibration device 11 and the second calibration device 14) is preferably a relative sticker determined by the control device 20 after the liquid crystal panel P is inverted. At the position, the alignment of the liquid crystal panel P with respect to the optical component layer (the first optical component layer F1 and the second optical component layer F2) is performed.

Further, in the present embodiment, as described above, the bonding apparatus (the first bonding apparatus 12 and the second bonding apparatus 15) is preferably a region larger than the display area and smaller than the outer shape of the liquid crystal panel P. Come as the first area.

Further, in the present embodiment, as described above, the cutting device (second cutting device 16) preferably uses a laser to cut the optical component layer (first optical component layer F1, second optical component layer F2) ).

Further, in the present embodiment, as described above, it is preferable to further include a camera C (photographing device) that captures the position of the liquid crystal panel P, wherein the control device 20 and the liquid crystal panel P photographed by the camera C based on the inspection data The position determines the relative fit position.

Further, in the present embodiment, as described above, it is preferable to further include the drum conveyor 5 (first conveying device), and the liquid crystal panel P is used as the calibration device (the first calibration device 11 and the second calibration device 14). The bonding device (the first bonding device 12 and the second bonding device 15) and the cutting device (the second cutting device 16) are sequentially transported.

Further, in the present embodiment, as described above, it is preferable to further include the transport device 12a (second transport device), and transport the optical component layer (the first optical component layer F1 and the second optical component layer F2) to the sticker. The device (the first bonding device 12 and the second bonding device 15).

Further, in the present embodiment, as described above, the conveying device 12a preferably includes the second collecting portion 15d, and collects the optical component layer (the first optical component layer F1, which is cut by the second cutting device 16) A second region of the second optical component layer F2).

In this structure, according to the optical component layer (first optical component layer F1, second optical group) The inspection data of the optical axis direction of the member layer F2 and the third optical component layer F3) are calibrated, and then bonded to the liquid crystal panel P. Thereby, even if the optical axis direction is changed in response to the position of the optical component layer (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3), the liquid crystal can be calibrated according to the optical axis direction. Panel P fits together. Thereby, the accuracy of the optical axis direction of the optical components (the first optical component F11, the second optical component F12, and the third optical component F13) with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be improved. Moreover, it is also possible to manufacture an optical component bonding body having an arbitrary optical axis direction.

Further, in the film bonding system of the above-described embodiment, the outer peripheral edge of the bonding surface of each of the plurality of liquid crystal panels P is detected by the detecting device, and the outer peripheral edge of the plurality of liquid crystal panels P can be set to be bonded to each of the liquid crystal panels P. The cutting position of the optical component layer. Thereby, regardless of the individual difference in the size of the liquid crystal panel P or the optical component layer, the optical component of the required size can be cut, and the quality difference due to the individual difference in the size of the liquid crystal panel P or the optical component layer can be reduced. The frame portion around the display area is displayed to achieve the expansion of the display area and the miniaturization of the machine.

Here, in the method of manufacturing the optical module bonding body according to the above embodiment, the optical axis direction of the optical component layer (the first optical component layer F1 and the second optical component layer F2) which is larger than the display region P4 of the liquid crystal panel P is displayed. Checking the data, determining the relative bonding position of the liquid crystal panel P and the optical component layer (the first optical component layer F1 and the second optical component layer F2); and performing the relative optical component layer according to the determined relative bonding position Calibration of the liquid crystal panel P of the first optical component layer F1 and the second optical component layer F2; the optical component layer (the first optical component layer F1 and the second optical component layer F2) is sequentially attached to the calibration The optical display member is used as the second bonding layer F22, and the optical component layer (the first optical component layer F1) and the first bonding surface SA1 of the liquid crystal panel P are detected in the second bonding layer F22. In the outer peripheral edge, in the second bonding layer F22, along the outer peripheral edge of the first bonding surface SA1, the first bonding surface SA1 region corresponding to the optical component layer (first optical component layer F1) is cut. First region and the optical component layer (first optical component layer F1) A first region of the outer region.

Similarly, the manufacturing method of the optical component bonding body in the above embodiment includes a process of bonding the third optical component layer F3 and a third optical component larger than the display region P4 of the second single-sided bonding panel P12. The layer F3 is bonded to the surface on the opposite side of the optical component (the first optical component F11 and the second optical component F12) of the second single-sided bonding panel P12 as the third bonding layer F23; the relative bonding position is determined. And the inspection data according to the optical axis direction of the optical component layer (third optical component layer F3) before the optical component layer (third optical component layer F3) is attached to the second single-sided bonding panel P12 Determining a relative bonding position of the liquid crystal panel P and the second single-sided bonding panel P12; and aligning the optical component layer (the third optical component layer F3) to the second single-sided bonding panel P12 Pre-alignment of the second single-sided bonding panel P12 with respect to the optical component layer (third optical component layer F3) according to the relative bonding position determined by the control device 20; the detection process is performed on the optical component layer ( The third optical component layer F3) is attached to the second single-sided bonding After the panel P12, the optical component layer (third optical component layer F3) and the liquid crystal are detected in the optical component layer (third optical component layer F3) to which the bonding apparatus (third bonding apparatus 18) is attached. The outer peripheral edge of the second bonding surface SA2 of the panel P; and the cutting process, along the outer peripheral edge of the second bonding surface SA2, cut the area of the detected optical component layer (third optical component layer F3) a first region of the second bonding surface SA2 region of the optical component layer (third optical component layer F3) and a second region of the outer region of the first region of the optical component layer (third optical component layer F3), The optical component layer (third optical component layer F3) cuts an optical component (third optical component F13) corresponding to the size of the second bonding surface SA2, thereby cutting out a single liquid crystal panel P from the third bonding layer F23 And a double-sided bonding panel P13 of the optical component (third optical component F13) overlapping therewith.

In addition, Fig. 11 shows a modification of the film bonding system 1. In contrast to the configuration of Fig. 1, there is a difference between the first bonding device 12' in place of the first bonding device 12 and the first cutting device 13' in place of the first cutting device 13. In the other portions, the same components as those in the above-described embodiments are denoted by the same reference numerals, and their detailed description is omitted.

The first bonding apparatus 12' is provided with a conveying apparatus 12a' instead of the conveying apparatus 12a. move The feeding device 12a' has a first collecting portion 12e in addition to the roller holding portion 12c and the protective film collecting portion 12d as compared with the conveying device 12a. The first collecting portion 12e winds up the remaining portion of the first optical component layer F1 which is cut by the first cutting device 13' and which is cut into a ladder shape.

The first cutting device 13' is located on the panel transport downstream side of the protective film collecting portion 12d, and is located on the panel transport upstream side of the first collecting portion 12e. The first cutting device 13' cuts the first optical component layer F1 in order to cut a layer larger than the display region P4 from the first optical component layer F1. The first cutting device 13' has the same laser processing machine as the second cutting device 16 and the third cutting device 19. The first cutting device 13' cuts the first optical component layer F1 uninterrupted along a specific side line outside the display region P4.

The first single-sided bonding panel P11' is formed by cutting the first cutting device 13', and is attached to the lower surface of the liquid crystal panel P with a layer of the first optical component layer F1 larger than the display region P4. sheet. At this time, the first single-sided bonding panel P11' is separated from the remaining portion of the first optical component layer F1 in which the cutting residual is ladder-shaped, and the remaining portion of the first optical component layer F1 is taken up to the first collecting portion 12e.

Fig. 12 shows another modification of the film bonding system 1. In contrast to the configuration of Fig. 1, there is a difference between the third calibration device 17' and the third bonding device 18' in place of the third calibration device 17 and the third bonding device 18. In the other portions, the same components as those in the above-described embodiments are denoted by the same reference numerals, and their detailed description is omitted.

Compared with the third calibration device 17, the third calibration device 17' has a simpler structure, has no panel forward/reverse rotation function, and has only the same calibration function as the first calibration device 11 and the second calibration device 14. . That is, the third calibration device 17' determines the component width of the second single-sided bonding panel P12 with respect to the third bonding device 18' based on the inspection data stored in the optical axis direction of the control device 20 and the photographic data of the camera C. Position in the direction and direction of rotation. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding device 18'.

Compared with the third bonding device 18, the third bonding device 18' is attached to the lower side of the elongated third optical component layer F3 that is guided to the bonding position, and the second single-sided sticker that is transported along the lower side thereof The upper side of the panel P12 (the display surface side of the liquid crystal panel P) is bonded. The third bonding apparatus 18' has a structure in which the conveying device 18a and the nip roller 18b are turned upside down. Thereby, the bonding surface of the third optical component layer F3 is bonded downward, and adhesion of foreign matter such as scratches or dust on the bonding surface can be suppressed.

Further, the present invention is not limited to the above-described embodiments and modifications. For example, similarly to the third bonding apparatus 18', the first bonding apparatus 12 and the second bonding apparatus 15 may be turned upside down. Further, the respective bonding devices that are upside down may be combined with the first bonding device 12' and the first cutting device 13' as appropriate.

Further, in addition to the structure in which the optical display member is attached to the optical component layer that is unwound from the roll, a plurality of optical display members may be appropriately bonded to the structure of the large-sized optical component layer.

The configurations of the above-described embodiments and modifications are merely examples of the invention, and various changes are possible without departing from the scope of the invention.

The above control device 20 has a computer system inside. Then, the operations of the above devices are stored in a computer-readable storage medium in a program format, and the read program is executed by the computer to perform the above processing. Here, the computer readable storage medium refers to a magnetic disk, a magneto-optical disk, a CD-ROM, a DVD-ROM, a semiconductor memory, or the like. Moreover, it is preferable that the computer program is transmitted to the computer via a communication line, and the program is executed by the computer that receives the data.

Moreover, the above program may preferably be used to implement some of the aforementioned functions.

Furthermore, it is preferable to combine the programs already stored in the computer system to achieve the aforementioned functions, that is, a so-called difference file.

The present invention is applicable to a manufacturing system, a manufacturing method, a storage medium, and the like of an optical component bonding body which can improve the optical axis direction accuracy of an optical film bonded to an optical display member.

5‧‧‧Roller conveyor

11‧‧‧First calibration device

12‧‧‧First bonding device

12a‧‧‧Transporting device

12b‧‧‧ pinch roller

12c‧‧‧Roller Keeping Department

12d‧‧‧Protective film recycling department

13‧‧‧First cutting device

14‧‧‧Second calibration device

15‧‧‧Second laminating device

15a‧‧‧Transporting device

15b‧‧‧ pinch roller

15c‧‧‧Roller Keeping Department

15d‧‧‧Second Recycling Department

16‧‧‧Second cutting device

17‧‧‧ Third calibration device

18‧‧‧ Third bonding device

18a‧‧‧Transporting device

18b‧‧‧ pinch roller

18c‧‧‧Roller Keeping Department

18d‧‧‧ Third Recycling Department

19‧‧‧ Third cutting device

20‧‧‧Control device

F1‧‧‧First optical component layer

F2‧‧‧Second optical component layer

F3‧‧‧ third optical component layer

F21‧‧‧ first bonding layer

F22‧‧‧Second bonding layer

F23‧‧‧ third bonding layer

P‧‧‧ LCD panel

P11‧‧‧First single-sided fitting panel

P12‧‧‧Second single-sided fitting panel

P13‧‧‧ double-sided fitting panel

Pf‧‧‧protective film

R1‧‧‧First roll drum

R2‧‧‧second roll drum

R3‧‧‧ third roll

Claims (14)

A manufacturing system for an optical component bonding body, comprising: a control device that determines a relative fit of the optical display component and the optical component layer based on inspection data indicating an optical axis direction of the optical component layer that is larger than a display area of the optical display component; a calibration device that aligns with the optical display component of the optical component layer according to the relative bonding position determined by the control device; a bonding device that bonds the optical component layer to the optical device calibrated by the calibration device a display unit; the detecting device detects an outer peripheral edge of the bonding surface of the optical component layer and the optical display component in the optical component layer to which the bonding device is attached; and a cutting device along the bonding surface The outer periphery cuts a first region of the region of the bonding surface region corresponding to the optical component layer and a second region of the outer region of the first region of the optical component layer in the region of the optical component layer detected by the detecting device. The manufacturing system of the optical component bonding body according to the first aspect of the invention, wherein the cutting device cuts an optical component layer corresponding to the size of the bonding surface from the optical component layer, thereby cutting the optical display component and The optical component of the optical component layer is bonded to the body. The manufacturing system of the optical component bonding body according to claim 1, wherein the control device makes the reference axis of the optical display component parallel to the optical axis direction of the optical component layer indicated by the inspection data to determine the Relatively fitting position. The manufacturing system of the optical component bonding body according to claim 3, wherein the control device uses the long-axis direction axis passing through the center of the plane of the optical display member as the reference axis. The manufacturing system of the optical component bonding body according to claim 1, wherein the calibration device arranges the optical component layer and the optical display component to a relative bonding position determined by the control device to perform the optical display. Calibration of the components. The manufacturing system of the optical component bonding body according to the first aspect of the invention, wherein the calibration device performs the relative optical component on the optical component, and the optical component layer is opposite to the bonding position determined by the control device. Calibration of the optical display components. The manufacturing system of the optical component bonding body according to the first aspect of the invention, wherein the bonding device uses a region larger than the display region and smaller than an outer shape of the optical display member as the first region. The manufacturing system of the optical component bonding body according to the first aspect of the invention, wherein the cutting device uses a laser to cut the optical component layer. The manufacturing system of the optical component bonding body according to claim 1, further comprising a photographing device for photographing the position of the optical display component; wherein the control device is based on the inspection data and the optical display component photographed by the photographing device Position determines the relative fit position. The manufacturing system of the optical component bonding body according to the first aspect of the invention is further provided with a first conveying device, and the optical display member is conveyed in the order of the calibration device, the bonding device, and the cutting device. A manufacturing system of an optical component bonding body according to the first aspect of the invention, further comprising a second conveying device, wherein the optical component layer is conveyed to the bonding device. The manufacturing system of the optical component bonding body as described in claim 11, wherein the second conveying device includes a collecting portion, and the remaining portion cut by the cutting device is recovered. A method for manufacturing an optical component bonding body, comprising: Determining a relative bonding position of the optical display member and the optical component layer according to inspection data showing an optical axis direction of the optical component layer larger than a display area of the optical display component; and performing relative positioning according to the determined relative bonding position Aligning the optical display component of the optical component layer; bonding the optical component layer to the calibrated optical display component; detecting the bonding surface of the optical component layer and the optical display component in the bonded optical component layer a peripheral edge; and an outer peripheral edge of the bonding surface, the first region of the region of the optical component layer corresponding to the optical component layer and the outer region of the first region of the optical component layer in the region of the detected optical component layer The second area. A computer readable storage medium storing a program for performing an operation of determining an optical display component and an optical component layer according to inspection data indicating an optical axis direction of an optical component layer larger than a display area of the optical display component a relative bonding position; performing calibration of the optical display member relative to the optical component layer according to the determined relative bonding position; bonding the optical component layer to the calibrated optical display component; and bonding the optical component layer Detecting an outer peripheral edge of the bonding surface of the optical component layer and the optical display component; and cutting the corresponding optical component layer in the region of the detected optical component layer along the outer peripheral edge of the bonding surface a first region of the face region and a second region of the outer region of the first region of the optical component layer.