TWI599428B - Production method for optical display device and production system for optical display device - Google Patents

Description

Production method of optical display device and production system of optical display device

The present invention relates to a method of producing an optical display device and a production system of the optical display device.

The present invention claims priority based on Japanese Patent Application No. 2012-176512, filed on Jan. 8, 2012, and Japanese Patent Application No. 2013-104403, filed on Jan. And quote its contents here.

Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate attached to a liquid crystal panel (optical display member) is cut out from the strip of the optical component to be substantially rectangular and conforms to the liquid crystal panel. After the display area, the optical component is attached to the liquid crystal panel (for example, refer to Patent Document 1).

Patent Document 1 employs a method of cutting an optical component from an optical component layer by performing a cutting process using a cutter. Further, in recent years, a method of cutting an optical component from an optical component layer by using a laser cutting process instead of a cutting process using a cutter is employed. Compared with the cutting process using a sharp blade such as a cutter, foreign matter such as film scrap is less likely to be generated by cutting using laser light. Therefore, the use of laser cutting can achieve the purpose of improving product yield.

Incidentally, to ensure the performance of optical display devices, optical components must cover optical The entire surface of the display area of the display member is bonded. Therefore, the optical component must be cut to a shape conforming to the display area of the optical display member with better precision.

Patent Document 1: Japanese Patent Laid-Open No. 2003-255132.

However, the following problems exist in the method of cutting out an optical component from an optical component layer using laser light.

First, there is a method of continuously scanning with laser light along the shape of the formed optical component to cut the optical component from the optical component layer. However, in this method, since the laser scanning speed is slow when forming the corners of the optical component, the laser light irradiation time for the corners of the optical component is long.

Moreover, there is a type in which two sides of the intersection of the corners of the optical component are formed, and after the laser light is scanned along one side thereof, the laser light is scanned along the other side to make the laser light. The cutting line intersects at the corners to cut the optical component from the optical component layer. However, in this method, since the laser light repeatedly illuminates the corner portion of the optical component, the laser light irradiation time for the corner portion of the optical component is long.

In any of the foregoing methods, since the energy of the laser light is concentrated at the corner of the optical component, the corner of the optical component is bent into an R shape due to heat or the like. Therefore, when the optical component is attached to the display region of the optical display component to form an optical display device, for example, light leakage or the like is caused from the display region of the optical display component, the performance of the optical display device cannot be ensured.

An object of the aspect of the present invention is to provide a production method of an optical display device capable of suppressing an angle of an optical component from being changed into an R shape, and a production system of the optical display device, when the optical component is cut out from the optical component layer.

In order to achieve the foregoing object, one aspect of the present invention is to attach an optical component to an optical display. a method of producing a component for forming an optical display device, comprising: a bonding step of bonding an optical component layer larger than a display area of the optical display component to the optical display component to form a bonding body; and a cutting step And cutting off the opposite portion of the display region of the optical component layer in the bonded body and the remaining portion of the opposite portion of the opposite portion, and forming an optical component corresponding to the size of the display region from the optical component layer; wherein the cutting The step includes: a first scanning step of scanning the laser light along the first direction on the optical component layer, cutting the optical component layer; and a second scanning step of allowing the lightning on the optical component layer The scanning light scans in a second direction crossing the first direction to cut the optical component layer; and at the intersection of the first direction and the second direction, the first scanning step scans The first trajectory of the laser light and the second trajectory of the laser light scanned by the second scanning step do not cross each other.

In the foregoing aspect, at the intersection of the first direction and the second direction, the distance between the first trajectory and the second trajectory is set to be larger than the radius of the laser spot of the laser light, and the ray is Below the spot diameter.

In the above aspect, the detecting step further includes detecting the outer peripheral edge of the bonding surface of the optical component layer and the optical display component in the bonding body before the cutting step; and in the cutting step, Between the opposing portion and the remaining portion of the optical component layer in the bonded body, the cutting positions of the optical component layers disposed along the outer peripheral edge overlap each other to scan with the laser light.

Another aspect of the present invention is a production system for bonding an optical component to an optical display component to form an optical display device, comprising: a bonding device for bonding an optical component layer larger than a display area of the optical display component And the cutting device is configured to cut the opposing portion of the display region of the optical component layer and the remaining portion of the opposite portion of the optical component layer in the bonded body, and form a corresponding portion from the optical component layer An optical component sized to the display area; wherein the cutting device is attached to the optical component layer to scan the laser light along the first direction, cutting the optical component layer, and the light The laser beam is scanned in a second direction crossing the first direction to cut the optical component layer; and the intersection of the first direction and the second direction is along the first The first trajectory of the directionally scanned laser light and the second trajectory of the laser light scanned along the second direction do not cross each other.

In the above aspect, the detection mechanism further includes: detecting the outer peripheral edge of the bonding surface of the optical component layer and the optical display component in the bonding body; and the cutting device is attached to the optical component layer in the bonding body Between the opposing portion and the remaining portion, the cutting positions of the optical component layers disposed along the outer periphery overlap each other to scan with the laser light.

According to an aspect of the present invention, the first trajectory of the laser light of the first scanning step and the second trajectory of the laser light of the second scanning step are not at the intersection of the first direction and the second direction Interdigitating, it is possible to suppress repeated exposure of the laser light to the corners of the optical components near the intersection. Thereby, it is possible to suppress the energy of the laser light from being concentrated on the corners of the optical component. Therefore, when the opposite portion of the display portion of the optical component layer in the bonded body and the remaining portion of the opposite portion of the opposite portion are cut, and the optical component having the corner portion is cut out from the optical component layer, the heat of the corner portion of the optical component can be suppressed. It is bent into an R shape.

In addition, the above-mentioned "opposing portion with the display area" means an area which is larger than the display area and smaller than the outer shape of the optical display member (the outline shape in the plan view), and is an area which avoids the functional part such as the electronic component mounting portion. . That is, the above-described structure includes a case where the remaining portion is cut by laser along the outer periphery of the optical display member.

Further, in the above configuration, "the size corresponding to the display area" means a size larger than the display area and smaller than the outer shape of the optical display member (the outline shape in the plan view), and the electronic component mounting portion in the optical display member is avoided. The size of the functional part.

Further, in the above configuration, "the bonding surface of the optical component layer and the optical display member" means the surface of the optical component layer facing the optical display member. Further, specifically, "the outer periphery of the bonding surface" means an optical display member The outer periphery of the substrate on the side to which the optical component layer is attached.

1‧‧‧Film bonding system

5‧‧‧Roller conveyor

11‧‧‧First calibration device

12‧‧‧First bonding device

12a‧‧‧Transporting device

12b‧‧‧ pinch roller

12c‧‧‧Roller Keeping Department

12d‧‧‧Protective film recycling department

13‧‧‧First cutting device

14‧‧‧Second calibration device

15‧‧‧Second laminating device

15a‧‧‧Transporting device

15b‧‧‧ pinch roller

15c‧‧‧Roller Keeping Department

15d‧‧‧Second Recycling Department

16‧‧‧Second cutting device

16a‧‧‧ camera

17‧‧‧ Third calibration device

18‧‧‧ Third bonding device

18a‧‧‧Transporting device

18b‧‧‧ pinch roller

18c‧‧‧Roller Keeping Department

18d‧‧‧ Third Recycling Department

19‧‧‧ Third cutting device

19a‧‧‧ camera

20‧‧‧Control device

61‧‧‧First testing agency

62‧‧‧Second inspection agency

63‧‧‧Photographing device

63a‧‧‧Photographing surface

64‧‧‧Light source

65‧‧‧Control Department

C‧‧‧ camera

C1‧‧‧ first corner

C2‧‧‧second corner

C3‧‧‧ third corner

C4‧‧‧Four Corner

CA‧‧‧ inspection area

D‧‧‧diameter

ED‧‧‧ outer periphery

F1‧‧‧First optical component layer

F2‧‧‧Second optical component layer

F3‧‧‧ third optical component layer

F11‧‧‧First optical component

F12‧‧‧Second optical component

F13‧‧‧ Third optical component

F1S‧‧‧ layer

F21‧‧‧ first bonding layer

F22‧‧‧Second bonding layer

F23‧‧‧ third bonding layer

FX‧‧‧ optical component layer

G‧‧‧Border Department

H‧‧‧ Height

Ha‧‧‧ Height

H1, H3‧‧‧ short side

H2, H4‧‧‧ long side

K1, k2‧‧‧ separation distance

L1, L3‧‧‧ track

L2, L4‧‧‧ track

Lz‧‧‧Laser light

P‧‧‧ LCD panel

P1‧‧‧ first substrate

P11‧‧‧First single-sided fitting panel

P12‧‧‧Second single-sided fitting panel

P13‧‧‧ double-sided fitting panel

P2‧‧‧second substrate

P3‧‧‧ liquid crystal layer

P4‧‧‧ display area

P5‧‧‧Electronic Component Installation Department

Pt1, pt3‧‧‧ starting point

Pt2, pt4‧‧‧ end point

PX‧‧‧Optical display parts

R1‧‧‧First roll drum

R2‧‧‧second roll drum

R3‧‧‧ third roll

S10‧‧‧ fitting steps

S20‧‧‧cutting steps

S20A‧‧‧First scanning step

S20B‧‧‧Second scanning step

SA1‧‧‧ first fit surface

SA2‧‧‧ second fit surface

T‧‧‧ cut end

z, z1, z2‧‧‧ intersection

Fig. 1 is a schematic configuration diagram of a film bonding system of an optical display device in an embodiment of the present invention.

Fig. 2 is a perspective view showing the periphery of a second bonding apparatus of the film bonding system.

Fig. 3 is a perspective view showing the optical axis direction of the optical component layer of the film bonding system and the optical display member bonded to the optical component layer.

Figure 4 is a cross-sectional view of the first bonding layer in the film bonding system.

Fig. 5 is a cross-sectional view showing a second bonding layer in the second cutting device of the film bonding system.

Fig. 6 is a plan view showing a third bonding layer in the third cutting device of the film bonding system.

Figure 7 is a cross-sectional view taken along line A-A of Figure 6.

Figure 8 is a cross-sectional view of the double-sided bonding panel through the aforementioned film bonding system.

Fig. 9 is a cross-sectional view showing the laser cut end of the optical component layer which has been bonded to the liquid crystal panel.

Figure 10 is a cross-sectional view showing the laser cut end of the optical component layer unit.

Fig. 11 is a flow chart showing a method of producing an optical display device in the embodiment.

Fig. 12 is an explanatory view of the cutting step.

Figure 13 is a schematic view of the first detecting mechanism for detecting the outer periphery of the bonding surface.

Fig. 14 is a schematic view showing a modification of the first detecting mechanism for detecting the outer periphery of the bonding surface.

Fig. 15 is a plan view showing the position of the outer periphery of the bonding surface.

Figure 16 is a schematic view of a second detecting mechanism for detecting the outer periphery of the bonding surface.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Hereinafter, in a production system of an optical display device such as a liquid crystal display, a description will be given of a method of producing an optical display device after explaining a film bonding system.

(production system of optical display device)

Fig. 1 shows a schematic configuration of a film bonding system 1 (production system of an optical device) of the present embodiment. In the film bonding system 1 , a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel. An optical display device such as a liquid crystal display is formed. The film bonding system 1 manufactures an optical component bonding panel including the optical display member and the optical component. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. Each part of the film bonding system 1 is integrally controlled by a control device 20 as an electronic control unit.

The film bonding system 1 transports the liquid crystal panel P from the start position to the final position of the bonding step, for example, using a driving type roller conveyor 5, and sequentially applies a specific process to the liquid crystal panel P. The liquid crystal panel P is transported on the roller conveyor 5 while the front/rear surfaces of the liquid crystal panel P are horizontal.

In addition, the left side of the figure is the upstream side of the conveyance direction of the liquid crystal panel P (it is hereafter called a panel conveyance upstream side). The right side of the drawing is the downstream side of the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport downstream side).

As shown in FIGS. 6 to 8, the liquid crystal panel P has a rectangular shape in plan view. The liquid crystal panel P is a display region P4 having an outer shape along the outer periphery of the liquid crystal panel P from the inner side of the outer periphery of the liquid crystal panel P at a specific width. When the liquid crystal panel P is transported to the upstream side of the panel of the second calibration device 14 to be described later, the short side H1 and the short side H3 of the display region P4 are approximately moved along the transport direction. Line transfer. When the liquid crystal panel P is transported to the downstream side of the panel of the second calibration device 14, the long side H2 and the long side H4 of the display region P4 are conveyed approximately in the transport direction.

As shown in FIG. 1, the front/rear surface of the liquid crystal panel P is appropriately bonded to the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3. The first optical component F11, the second optical component F12, and the third optical component F13. In the present embodiment, the first optical component F11 (optical component) and the third optical component F13 (optical component) which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P. Further, a second optical component F12 (optical component) overlapping the first optical component F11 is attached to the surface of the backlight side of the liquid crystal panel P as a luminance increasing film.

The film bonding system 1 includes a first calibration device 11 that transports the liquid crystal panel P from the upstream process to the panel transfer upstream side of the roller conveyor 5, and performs calibration of the liquid crystal panel P; the first bonding device 12 ( The bonding device is disposed on the downstream side of the panel transport of the first calibration device 11; the first cutting device 13 is disposed adjacent to the first bonding device 12; and the second calibration device 14 is disposed at the first The bonding device 12 and the panel of the first cutting device 13 transport the downstream side.

Further, the film bonding system 1 includes a second bonding device 15 (bonding device) provided on the panel transport downstream side of the second calibration device 14, and a second cutting device 16 (cutting device). Close to the second bonding device 15; the third calibration device 17 is disposed on the panel transport downstream side of the second bonding device 15 and the second cutting device 16, and the third bonding device 18 (bonding device), The third cutting device 19 is disposed on the downstream side of the panel transporting device; and the third cutting device 19 (cutting device) is disposed adjacent to the third bonding device 18.

The first calibration device 11 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The first calibration device 11 has a pair of cameras C for capturing, for example, the surface of the liquid crystal panel P The plate conveys the upstream side and the downstream side end (refer to Fig. 3). The photographic data of the camera C is transmitted to the control device 20.

The control device 20 activates the first calibration device 11 based on the photographic data of the camera C and the pre-stored optical axis direction inspection data. However, the second calibration device 14 and the third calibration device 17 described later also have the camera C, and the photographic data of the camera C is used for calibration.

The first calibration device 11 is controlled by the operation of the control device 20 to perform calibration of the liquid crystal panel P with respect to the first bonding device 12. At this time, the position of the liquid crystal panel P in the horizontal direction (hereinafter referred to as the member width direction) of the vertical conveyance direction and the rotation direction of the vertical axis (hereinafter, simply referred to as the rotation direction) are determined. In this state, the liquid crystal panel P is guided to the bonding position of the first bonding apparatus 12.

The first bonding apparatus 12 is directed to the upper side surface of the long-length first optical component layer F1 (optical component layer) guided to the bonding position, and the lower side of the liquid crystal panel P that conveys the upper side of the first optical component layer F1 ( The backlight side is attached. The first bonding apparatus 12 includes a conveying device 12a and a nip roller 12b.

The conveying device 12a winds the first optical component layer F1 from the first roll drum R1 around which the first optical component layer F1 is wound, and conveys the first optical component layer F1 along the longitudinal direction of the first optical component layer F1. . The conveying device 12a has a drum holding portion 12c and a protective film collecting portion 12d. The roller holding portion 12c supports the first roll drum R1 around which the first optical component layer F1 is wound, and winds up the first optical component layer F1 in the longitudinal direction of the first optical component layer F1. The protective film collecting portion 12d collects the protective film pf which is superposed on the lower surface of the first optical module layer F1 and is wound up together with the first optical component layer F1, and is collected on the downstream side of the panel transfer of the first bonding apparatus 12.

The nip roller 12b is a lower side of the liquid crystal panel P to which the roller conveyor 5 is transported It is bonded to the upper side surface of the first optical component layer F1 conveyed by the conveyance device 12a. The nip roller 12b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers. The gap is the bonding position of the first bonding device 12. The liquid crystal panel P and the first optical component layer F1 are superposed and guided into the gap. The liquid crystal panel P and the first optical component layer F1 are pinched between a pair of bonding rollers, and are sent to the downstream side of the panel conveyance. Thereby, the first bonding layer F21 (bonding body) in which a plurality of liquid crystal panels P are continuously bonded to the upper surface of the long first optical component layer F1 at a predetermined interval can be formed.

The first cutting device 13 is located on the downstream side of the panel conveyance of the protective film collecting portion 12d. The first cutting device 13 is cut at a predetermined portion of the first optical component layer F1 (between the liquid crystal panels P arranged in the transport direction), and the entire width is cut along the width direction of the liquid crystal panel P, and the first sticker is cut. The first optical component layer F1 of the layer F21 is laminated to form a layer F1S larger than the display region P4 (in the present embodiment, larger than the liquid crystal panel P) (refer to FIG. 5). However, the first cutting device 13 is not limited to use a cutting blade or use a laser cutting machine. By the cutting step of the first cutting device 13, the first single-sided bonding panel P11 having the layer F1S larger than the display region P4 is bonded to the lower surface of the liquid crystal panel P (refer to FIG. 5).

Further, regarding the layer F1S, the size of the portion protruding toward the outside of the liquid crystal panel P (the size of the remaining portion of the layer sheet F1S) can be appropriately set in accordance with the size of the liquid crystal panel P. For example, when the layer F1S is applied to a small-sized and small-sized liquid crystal panel P of 5 吋 to 10 ,, at each side of the layer F1S, the interval between one side of the layer F1S and one side of the liquid crystal panel P is spaced. It can be set to a length ranging from 2 mm to 5 mm.

The second aligning device 14 is, for example, a first single-sided bonding panel P11 on the nip roller conveyor 5 and is rotated by 90° about a vertical axis. Thereby, the short side H1 and the short side H3 of the display area P4 (refer to Fig. 6 is a view showing a first single-sided bonding panel P11 that is actually transported in parallel, and is transferred in parallel with the long side H2 and the long side H4 (see Fig. 6) of the display area P4. . Further, the direction conversion is relative to the optical axis direction of the first optical component layer F1 so that the optical axis direction of the other optical component layers bonded to the liquid crystal panel P is disposed at a right angle.

The second calibration device 14 performs the same calibration as the first calibration device 11. That is, the second calibration device 14 determines the first single-sided bonding panel with respect to the second bonding device 15 based on the inspection data stored in the optical axis direction of the control device 20 and the photographic data of the camera C (refer to FIG. 3). The position of the part of P11 in the width direction and the direction of rotation. In this state, the first single-sided bonding panel P11 is guided to the bonding position of the second bonding apparatus 15.

The second bonding apparatus 15 is a first single-sided bonding panel that is conveyed above the second optical component layer F2 with respect to the upper side surface of the long second optical component layer F2 (optical component layer) guided to the bonding position. The lower side of P11 (the backlight side of the liquid crystal panel P) is bonded. The second bonding apparatus 15 includes a conveying device 15a and a nip roller 15b.

The conveying device 15a winds the second optical component layer F2 from the second reel roller R2 around which the second optical component layer F2 is wound, and conveys the second optical component layer F2 along the longitudinal direction of the second optical component layer F2. . The conveying device 15a has a drum holding portion 15c and a second collecting portion 15d. The roller holding portion 15c supports the second roll drum R2 around which the second optical component layer F2 is wound, and winds up the second optical component layer F2 in the longitudinal direction of the second optical component layer F2. The second recovery unit 15d collects the remaining portion of the second optical module layer F2 after passing through the second cutting device 16 on the downstream side of the panel of the nip roller 15b.

The nip roller 15b is attached to the upper side surface of the second optical component layer F2 conveyed by the conveyance device 15a by the lower surface of the 1st single-sided bonding panel P11 conveyed by the roller conveyor 5. Clamping roller 15b is a pair of bonding rolls which are arrange|positioned mutually parallel in the axial direction. A predetermined gap is formed between the pair of bonding rollers. The gap is the bonding position of the second bonding device 15. The first single-sided bonding panel P11 and the second optical component layer F2 are superposed and guided into the gap. The first single-sided bonding panel P11 and the second optical component layer F2 are pinched between the pair of bonding rollers and sent to the downstream side of the panel conveyance. Thereby, the second bonding layer F22 (bonding body) in which the plurality of first single-sided bonding panels P11 are continuously bonded to the upper surface of the long second optical component layer F2 at a predetermined interval can be formed.

The second cutting device 16 is located on the downstream side of the panel conveyance of the pinch roller 15b. The second cutting device 16 simultaneously cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 of the first single-sided bonding panel P11 bonded to the upper side of the second optical component layer F2 (refer to Figure 5). The second cutting device 16 is, for example, a carbon dioxide (CO ₂ ) laser cutting machine. The second cutting device 16 cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 without interruption along the outer peripheral edge of the display region P4 (this embodiment is along the outer peripheral edge of the liquid crystal panel P). The optical axis direction accuracy of the first optical component layer F1 and the second optical component layer F2 can be improved by bonding the first optical component layer F1 and the second optical component layer F2 to the liquid crystal panel P and then cutting them together. . Further, the optical axis direction deviation between the first optical component layer F1 and the second optical component layer F2 can be eliminated. Furthermore, the cutting step in the first cutting device 13 can be simplified.

The second single-sided bonding panel P12 in which the first optical component F11 and the second optical component F12 are bonded to the lower surface of the liquid crystal panel P is formed by the cutting step of the second cutting device 16 (refer to FIG. 7). ). Moreover, at this time, as shown in FIG. 2, the second single-sided bonding panel P12 and the opposing portion (the first optical component F11 and the second optical component F12) of the cut-off display region P4 are left in a frame shape. The remaining portions of the first optical component layer F1 and the second optical component layer F2 can be separated from each other. The remaining portion of the second optical component layer F2 may be in the form of a plurality of ladders (refer to Fig. 2). The rest will be The remaining portion of the first optical component layer F1 is taken up to the second recovery portion 15d.

Here, the "opposing portion with the display region P4" refers to a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region that avoids a functional portion such as the electronic component mounting portion P5.

That is, the above structure includes a case where the remaining portion is laser-cut along the outer periphery of the liquid crystal panel P.

As shown in FIG. 1 , the third calibration device 17 reverses the front/reverse side of the second single-sided bonding panel P12 on the display side of the liquid crystal panel P toward the upper side, so that the backlight side of the liquid crystal panel P faces the upper side. The same calibration as the first calibration device 11 and the second calibration device 14 is performed. That is, the third calibration device 17 determines the width direction and the rotation of the member of the second single-sided bonding panel P12 of the third bonding device 18 based on the optical axis direction inspection data stored in the control device 20 and the imaging data of the camera C. The position in the direction. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding apparatus 18.

The third bonding apparatus 18 is a second single-sided bonding panel that is conveyed above the third optical component layer F3 with respect to the upper side surface of the elongated third optical component layer F3 (optical component layer) guided to the bonding position. The lower side of P12 (the display surface side of the liquid crystal panel P) is bonded. The third bonding apparatus 18 includes a conveying device 18a and a nip roller 18b.

The conveying device 18a winds the third optical component layer F3 from the third roll drum R3 around which the third optical component layer F3 is wound, and conveys the third optical component layer along the longitudinal direction of the third optical component layer F3. F3. The conveying device 18a has a drum holding portion 18c and a third collecting portion 18d. The roller holding portion 18c supports the third roll drum R3 around which the third optical component layer F3 is wound, and winds up the third optical component layer F3 along the longitudinal direction of the third optical component layer F3. The third recovery unit 18d collects the remaining portion of the third optical module layer F3 after passing through the third cutting device 19 positioned on the downstream side of the panel of the nip roller 18b.

The nip roller 18b is bonded to the upper side surface of the third optical component layer F3 conveyed by the conveyance device 18a by the lower surface of the 2nd single-sided bonding panel P12 conveyed by the roller conveyor 5. The nip roller 18b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers. The gap is the bonding position of the third bonding device 18. The second single-sided bonding panel P12 and the third optical component layer F3 are superposed and guided into the gap. The second single-sided bonding panel P12 and the third optical component layer F3 are pinched between the pair of bonding rollers and sent to the downstream side of the panel conveying. Thereby, the third bonding layer F23 which continuously bonds the plurality of second single-sided bonding panels P12 to the upper side of the elongated third optical component layer F3 at a predetermined interval can be formed (corresponding to the patent application scope) "Fixed body").

The third cutting device 19 is located on the downstream side of the panel conveyance of the pinch roller 18b. The third cutting device 19 cuts off the third optical component layer F3. The third cutting device 19 is the same laser processing machine as the second cutting device 16. The third cutting device 19 cuts the third optical component layer F3 without interruption along the outer periphery of the display region P4 (for example, along the outer periphery of the liquid crystal panel P).

The double-sided bonding panel P13 (refer to FIG. 8) in which the third optical component F13 is bonded to the lower surface of the second single-sided bonding panel P12 is formed by the cutting step of the third cutting device 19. Further, at this time, the remaining portions of the third optical component layer F3 remaining in the frame shape after the double-sided bonding panel P13 and the opposing portion (the third optical component F13) of the cut-off display region P4 can be separated from each other. Like the rest of the second optical component layer F2, the remaining portion of the third optical component layer F3 may be in the form of a plurality of ladders connected. This remaining portion is taken up to the third recovery portion 18d.

Here, the "opposing portion with the display region P4" is the same as the cutting step of the second cutting device 16, and refers to a region larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and avoids the electrons. The area of the functional part such as the component mounting portion P5. That is, the above structure includes remaining along the outer periphery of the liquid crystal panel P Partially for laser cutting.

The double-sided bonding panel P13 is conveyed to a downstream process for further processing by detecting a defect (a poor bonding or the like) by a defect inspection device not shown in the drawings.

As shown in FIG. 4, the liquid crystal panel P has a first substrate P1, a second substrate P2, and a liquid crystal layer P3. The first substrate P1 is a rectangular substrate composed of, for example, a thin film transistor (TFT) substrate. The second substrate P2 is a rectangular substrate that is disposed on the first substrate P1. The liquid crystal layer P3 is sealed between the first substrate P1 and the second substrate P2. In addition, for the sake of convenience of the drawings, the cross-sectional lines of the respective layers in the cross-sectional view are omitted.

As shown in FIGS. 6 and 7, the three sides of the outer periphery of the first substrate P1 are disposed along the three sides corresponding to the second substrate P2, and one side of the outer periphery of the first substrate P1 is left. Then, one side corresponding to the second substrate P2 protrudes outward. Thereby, the electronic component mounting portion P5 extending to the outside of the second substrate P2 can be provided at one side of the outer periphery of the first substrate P1.

As shown in FIG. 5, the second cutting device 16 detects the outer periphery of the display region P4 by a detecting mechanism such as the camera 16a, and cuts the first optical component layer F1 and the second optical component along the outer periphery of the display region P4 or the like. Layer F2. As shown in FIG. 7, the third cutting device 19 detects the outer periphery of the display region P4 by a detecting mechanism such as the camera 19a, and cuts the third optical component layer F3 along the outer periphery of the display region P4 or the like. As shown in FIGS. 5 and 7, a frame portion G of a specific width for attaching a sealant such as the first substrate P1 and the second substrate P2 to the outside of the display region P4 is provided. The laser cutting of the second cutting device 16 and the third cutting device 19 is performed within the width of the frame portion G.

As shown in Fig. 10, when the resin optical component layer FX is separately subjected to laser cutting, the cut end t of the optical component layer FX may be expanded or undulated by thermal deformation. Therefore, when the optical component layer FX after the laser cutting is bonded to the optical display member PX, it is easy to produce the optical component layer FX. Poor adhesion problems such as raw air mixing or deformation.

On the other hand, as shown in Fig. 9, in the embodiment in which the optical component layer FX is bonded to the liquid crystal panel P and the optical component layer FX is cut by laser, the cut end t of the optical component layer FX is subjected to The support of the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical component layer FX is less likely to form an expansion or a wave shape. Moreover, since it is performed after bonding to the liquid crystal panel P, it is difficult to produce the problem of a poor bonding.

The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than the vibration amplitude (tolerance) of the cutting line of the cutting blade. Therefore, in the present embodiment, the width of the frame portion G can be made narrower than in the case where the optical module layer FX is cut by the dicing blade, and the miniaturization and/or display area of the liquid crystal panel P (machine) can be achieved. The size of P4 is large. At this point, it can be effectively applied to a high-performance mobile device that needs to enlarge the display screen under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.

Moreover, in the case where the layer on which the optical component layer FX is integrated in the display region P4 of the liquid crystal panel P is cut and then bonded to the liquid crystal panel P, the dimensional tolerances of the layer and the liquid crystal panel P, and the like The dimensional tolerances of the relative fit positions are superimposed. Therefore, it is difficult to make the width of the frame portion G of the liquid crystal panel P narrow (it is difficult to enlarge the display region).

On the other hand, in the case where the optical component layer FX is bonded to the liquid crystal panel P and the cutting is performed in accordance with the display region P4, only the vibration tolerance of the cutting line must be considered. Therefore, the tolerance (±0.1 mm or less) of the width of the frame portion G can be reduced. This also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).

Further, since the optical component layer FX is cut by a non-profit laser, stress is not applied to the liquid crystal panel P at the time of cutting. Thereby, cracks or cracks are less likely to occur at the edge of the substrate of the liquid crystal panel P, and durability against thermal cycling or the like can be improved. Similarly, the liquid crystal panel P is non-contact processed, so the electrons are The damage of the component mounting portion P5 is also small.

(Production method of optical display device)

Next, an embodiment of an optical display device production method using the production apparatus of the aforementioned optical display device will be described.

Fig. 11 is a flow chart showing a method of producing the optical display device of the embodiment.

As shown in Fig. 11, the production method of the optical display device of the present embodiment has a bonding step S10 and a cutting step S20. Hereinafter, the bonding step by the third bonding apparatus 18 will be described as an example of the bonding step S10. The cutting step S20 will be described by taking the cutting step performed by the third cutting device 19 as an example. The bonding step by the second bonding apparatus 15 and the cutting step by the second cutting apparatus 16 are also performed in accordance with the following description.

(Fitting step)

As shown in Fig. 6, the bonding step S10 is to bond the third optical component layer F3 larger than the display region P4 of the liquid crystal panel P to form a third bonding layer F23 (refer to Fig. 1).

As shown in FIG. 1, in the bonding step S10, the lower surface of the second single-sided bonding panel P12 (the display surface side of the liquid crystal panel P) is bonded to the upper surface of the third optical component layer F3.

First, the second single-sided bonding panel P12 and the third optical component layer F3 are conveyed in a state of being overlapped with each other by the conveying device 18a of the third bonding apparatus 18, and guided to the bonding roller of the nip roller 18b. Everywhere. Next, the second single-sided bonding panel P12 and the third optical component layer F3 are sandwiched by the bonding roller of the nip roller 18b. Thereby, the third bonding layer F23 to which the second single-sided bonding panel P12 and the third optical component layer F3 are bonded is formed.

(cutting step)

Fig. 12 is an explanatory view of the cutting step S20.

Next, the cutting step S20 is performed. As shown in Fig. 12, the cutting step S20 cuts the opposite portion of the display portion P4 of the third optical component layer F3 in the third bonding layer F23 (refer to Fig. 1) and the remaining portion of the opposite portion of the opposite portion. Broken to form a third optical component F13 corresponding to the size of the display area from the third optical component layer F3. The cutting step S20 has a first scanning step S20A and a second scanning step S20B (refer to FIG. 11).

In the first scanning step S20A, the laser light Lz is placed along the short side H1 of the display region P4 on the third optical component layer F3 (corresponding to the "first direction" of the patent application range. Hereinafter referred to as the "first direction") Scanning is performed to cut the third optical component layer F3.

As shown in Fig. 6, the outer side of the display region P4 in the first direction is set as the starting point pt1 of the laser cut. Further, on the opposite side of the start point pt1 in the first direction, the outer side of the display area P4 is set as the end point pt2 of the laser cut.

Then, in the first scanning step S20A, the laser light Lz is scanned in the first direction from the start point pt1 to the end point pt2 (refer to FIG. 12), and the third optical component layer F3 is cut.

Thereby, as shown in Fig. 12, the third optical component layer F3 is cut along the short side H1 of the display region P4.

Similarly, the first scanning step S20A is completed by scanning the laser beam Lz along the short side H3 of the display region P4 and cutting off the third optical component layer F3.

Next, in the second scanning step S20B, as shown in FIG. 12, the laser light Lz is placed on the third optical component layer F3 along the long side H4 of the display region P4 (corresponding to the "second direction" of the patent application scope" In the following, referred to as "second direction", scanning is performed to cut the third optical component layer F3.

As shown in Fig. 6, the short side H3 of the display region P4 in the second direction is further inside, and is set as the starting point pt3 of the laser cutting. Thereby, as shown in FIG. 12, the starting point pt3 of the laser cutting is set to be the first In the scanning step S20A, the laser light Lz locus L3 (corresponding to the "first trajectory" of the patent application range) when the third optical module layer F3 is cut along the short side H3 is separated by a distance k1.

Further, as shown in Fig. 6, the short side H1 of the display region P4 in the second direction is further inside, and is set to the end point pt4 of the laser cut. Thereby, as shown in Fig. 12, the end point pt4 of the laser cutting is set to the locus L1 of the laser light Lz when the third optical component layer F3 is cut along the short side H1 in the first scanning step S20A ( The "first trajectory" equivalent to the scope of the patent application is separated by a distance k2.

Then, in the second scanning step S20B, the laser light Lz is scanned in the second direction from the start point pt3 to the end point pt4 to cut the third optical component layer F3. Thereby, the third optical component layer F3 can be cut along the long side H4 of the display region P4. Further, the start point pt3 and the end point pt4 of the laser cut are respectively equivalent to the end portion of the locus L4 (corresponding to the "second track" of the patent application range) in which the laser light Lz is scanned in the second direction.

Here, in general, the diameter D of the laser spot of the laser light Lz represents the wavelength by λ, the focal length of the objective lens by d, the beam diameter incident to the objective lens with w0, and the quality mode by M2 (Mode Quality). (or Mode Squared), the relationship is as follows (1): D = 4λdM2 / πw0 (1)

Then, the distance L1 between the locus L3 of the laser light Lz scanned by the first scanning step S20A and the locus L4 of the laser light Lz scanned by the second scanning step S20B, and the diameter D of the laser spot are set to Satisfy the following formula (2): D/2<k1≦D (2)

That is, the distance L1 between the trajectory L3 of the laser light Lz scanned by the first scanning step S20A and the trajectory L4 of the laser light Lz scanned by the second scanning step S20B is set to be larger than that of the laser light Lz. The spot radius (D/2) is larger and is below the diameter D of the laser spot.

Moreover, the distance L1 between the locus L1 of the laser light Lz scanned by the first scanning step S20A and the locus L4 of the laser light Lz scanned by the second scanning step S20B, and the diameter D of the laser spot are set. To satisfy the following formula (3): D/2<k2≦D (3)

That is, the distance L2 between the trajectory L1 of the laser light Lz scanned by the first scanning step S20A and the trajectory L4 of the laser light Lz scanned by the second scanning step S20B is set to be larger than that of the laser light Lz. The spot radius (D/2) is larger and is below the diameter D of the laser spot.

By setting the separation distance k1 and the separation distance k2 to satisfy the equations (2) and (3), for the intersection z formed in the first direction and the second direction (for example, the trajectory L1 and the trajectory in FIG. 12) The first corner portion C1 and the fourth corner portion C4 of the third optical component F13 in the vicinity of the intersection z1 of L4 and the intersection z3 of the track L3 and the track L4 do not contact the scan of the second scanning step S20B. The outer edge of the laser spot of the laser light Lz. Therefore, repeated irradiation of the laser light Lz to the first corner portion C1 and the fourth corner portion C4 of the third optical component F13 can be suppressed.

Similarly, the laser beam Lz is scanned in the second direction on the long side H2 (see FIG. 6) of the display region P4, and the third optical component layer F3 is cut along the track L2 (refer to FIG. 6). As described above, the second scanning step S20B is ended. Although the detailed description is omitted, the repeated irradiation of the laser light Lz with respect to the second corner portion C2 and the third corner portion C3 (refer to FIG. 6) can be suppressed in the same manner.

The second scanning step S20B is ended, and the cutting step S20 is ended when the third optical module F13 is cut from the third optical component layer F3.

Thereafter, as shown in Fig. 1, the remaining portion of the third optical module layer F3 is recovered by the third collecting portion 18d, thereby forming the double-sided bonding panel P13.

(effect)

In this embodiment, at the intersection z of the first direction and the second direction, the trajectories L1, L3 (first trajectory) of the laser light Lz in the first scanning step S20A and the laser light in the second scanning step S20B The trajectories L2, L4 (second trajectories) do not cross each other, and the interval is set to be larger than the laser spot radius (D/2) and within the range of the diameter D of the laser spot. Therefore, repeated irradiation of the first light portion C1 to the fourth corner portion C4 of the third optical component F13 near the intersection portion z by the laser light Lz can be suppressed. Thereby, it is possible to suppress the energy of the laser light Lz from being concentrated on the first to fourth corner portions C1 to C4 of the third optical unit F13. Therefore, when the third optical component F13 having the first corner portion C1 to the fourth corner portion C4 is cut out from the third optical component layer F3, the first corner portion C1 to the fourth corner portion of the third optical component F13 can be suppressed. C4 is bent into an R shape due to heat or the like.

(Modification)

Further, in the above-described embodiment, the second cutting device 16 detects the outer periphery of the display region P4 by a detecting mechanism such as the camera 16a, and cuts the first optical component layer F1 and the second along the outer periphery of the display region P4. Optical component layer F2. The third cutting device 19 detects the outer periphery of the display region P4 by a detecting mechanism such as the camera 19a, and cuts the third optical component layer F3 along the outer periphery of the display region P4 or the like. However, the structure of the detecting mechanism is not limited to this.

The film bonding system may have a detecting mechanism for detecting the outer peripheral edge of the bonding surface of the first optical component layer F1 and the second optical component layer F2 and the liquid crystal panel P at the second bonding layer F22. In the film bonding system, the detecting means may be used to set the cutting position of the first optical component layer F1 and the second optical component layer F2 along the outer periphery of the detected bonding surface, and the second cutting device The laser light can also be scanned in an overlapping manner at the set cutting position to cut the first optical component layer F1 and the second optical component layer F2.

Moreover, the film bonding system 1 can also have a third detection layer at the third bonding layer F23. A detecting mechanism for the outer peripheral edge of the bonding surface of the optical component layer F3 and the liquid crystal panel P. In the film bonding system, the detecting means may be used to set the cutting position of the third optical component layer F3 along the outer peripheral edge of the bonding surface to be detected, and the third cutting device 19 may also be cut in the setting. At the break position, the laser light is scanned in an overlapping manner, and the third optical component layer F3 is cut.

Thus, the detection of the outer periphery of the bonding surface and the cutting step of the cutting device are performed as detailed below. Hereinafter, a modification of the film bonding system 1 will be described using Figs. 13 to 16 .

Figure 13 is a schematic view of the first detecting mechanism 61 for detecting the outer periphery of the bonding surface. The first detecting mechanism 61 included in the film bonding system 1 of the present embodiment includes an imaging device 63, an illumination light source 64, and a control unit 65. The photographing device 63 captures a screen of the outer peripheral edge ED of the bonding surface of the liquid crystal panel P and the layer F1S in the second bonding layer F22 (hereinafter referred to as the first bonding surface SA1). The illumination source 64 is used to illuminate the outer periphery ED. The control unit 65 stores a screen imaged by the imaging device 63, and performs calculation for detecting the outer periphery ED based on the screen.

The first detecting mechanism 61 is provided between the nip roller 15b on the upstream side of the panel conveyance of the second cutting device 16 in Fig. 1 and the second cutting device 16.

The photographing device 63 is fixed and disposed inside the first bonding surface SA1 of the outer peripheral edge ED. The photographing device 63 is inclined, and the normal line of the first bonding surface SA1 is at an angle θ (hereinafter referred to as the tilt angle θ of the photographing device 63) to the normal line of the photographing surface 63a of the photographing device 63. The photographing device 63 causes the photographing surface 63a to face the outer peripheral edge ED, and photographs the outer peripheral edge ED from the side of the second bonding layer F22 where the layer sheet F1S is bonded.

The inclination angle θ of the photographing device 63 is set so that the outer periphery of the first substrate P1 constituting the first bonding surface SA1 can be surely captured. For example, the liquid crystal panel P divides the main panel into a plurality of liquid crystal panels, and is a case where a multilayer panel is formed, and the first substrate P1 and the second substrate constituting the liquid crystal panel P are formed. A deviation occurs in the outer periphery of the plate P2, and the end surface of the second substrate P2 is offset to the outer side of the end surface of the first substrate P1. In the foregoing case, the inclination angle θ of the photographing device 63 can be set such that the outer periphery of the second substrate P2 does not enter the photographing field of view of the photographing device 63.

In the above case, the inclination angle θ of the photographing device 63 can be set in accordance with the distance H between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as the height H of the imaging device 63). For example, when the height H of the imaging device 63 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 63 can be set to an angle in the range of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 63 and the tilt angle θ of the photographing device 63 can be obtained from the amount of deviation. In the present embodiment, the height H of the imaging device 63 is set to 78 mm, and the inclination angle θ of the imaging device 63 is set to 10°.

The tilt angle θ of the photographing device 63 may also be 0°. Fig. 14 is a view showing a modification of the first detecting mechanism 61, which is an example in which the inclination angle θ of the photographing device 63 is 0°. In this case, the imaging device 63 and the illumination light source 64 may be disposed at positions overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.

The distance Ha between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as the height Ha of the imaging device 63) can be set to a position where it is easy to detect the outer periphery ED of the first bonding surface SA1. For example, the height Ha of the photographing device 63 can be set in a range of 50 mm or more and 150 mm or less.

The illumination light source 64 is fixed and disposed on the opposite side of the second bonding layer F22 to which the side of the layer F1S is bonded. The illumination light source 64 is disposed outside the first bonding surface SA1 of the outer peripheral edge ED. In the present embodiment, the optical axis of the illumination source 64 is parallel to the normal line of the imaging surface 63a of the imaging device 63.

In addition, the illumination source 64 may be disposed in the second bonding layer F22 and laminated with the layer. The side of F1S (i.e., the same side as the photographing device 63).

Further, as long as the illumination light emitted from the illumination light source 64 can illuminate the outer periphery ED of the imaging device 63, the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 can also intersect each other.

Fig. 15 is a plan view showing the position of the outer periphery of the bonding surface. An inspection area CA is set on the conveyance path of the second bonding layer F22 shown in Fig. 15 . The inspection area CA is set on the liquid crystal panel P to be conveyed, and corresponds to the position of the outer periphery ED of the first bonding surface SA1. In Fig. 15, the inspection area CA is set at four positions corresponding to the four corner portions of the first bonding surface SA1 having a rectangular shape in plan view to detect the corner portion (outer peripheral edge ED) of the first bonding surface SA1. Structure. In Fig. 15, in the outer periphery of the first bonding surface SA1, the hook portion of the corresponding corner portion is shown as the outer peripheral edge ED.

The first detecting mechanism 61 of Fig. 15 detects the outer peripheral edge ED in the inspection area CA at four positions.

Specifically, each of the inspection areas CA is provided with an imaging device 63 and an illumination light source 64. The first detecting unit 61 captures a corner portion of the first bonding surface SA1 of each of the liquid crystal panels P to be transported, and detects the outer peripheral edge ED based on the photographic data. The data of the outer periphery ED to be detected is stored in the control unit 65 shown in Fig. 13.

In addition, as long as the outer periphery of the first bonding surface SA1 can be detected, the setting position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side). In this case, the structure of each side (four side edges, ie, the outer circumference) of the first bonding surface SA1 is detected.

Further, the imaging device 63 and the illumination light source 64 are not limited to being disposed in each of the inspection areas CA, and may be configured to move along a movement route set along the outer periphery ED of the first bonding surface SA1. In this case, since the photographing device 63 and the illumination light source 64 are configured to detect the outer peripheral edge ED when they are located in each of the inspection areas CA, it is possible to detect the outer circumference by providing each of the photographing device 63 and the illumination light source 64. ED.

The cutting position of the layer F1S and the second optical component layer F2 of the second cutting device 16 is the first optical set in the second bonding layer F22 according to the detection result of the outer peripheral edge ED of the first bonding surface SA1. The component layer F1 and the second optical component layer F2 are located between the opposite portion of the display region P4 and the remaining portion of the opposite portion of the opposite portion.

For example, the control unit 65 of the first detecting mechanism 61 sets the cutting positions of the layer F1S and the second optical component layer F2 based on the stored data of the outer peripheral edge ED of the first bonding surface SA1, so that the first optical component F11 is formed so as not to protrude outside the liquid crystal panel P (outside of the first bonding surface SA1). Further, the setting of the cutting position is not necessarily performed by the control unit 65 of the first detecting mechanism 61. The setting of the cutting position can also be performed using the data of the outer circumference ED detected by the first detecting mechanism 61, using an additional setting calculation mechanism.

The second cutting device 16 scans the laser beam so as to overlap the laser beam along the outer peripheral edge ED of the bonding surface to cut the layer F1S and the second optical component layer F2.

The second cutting device 16 cuts off the display region P4 attached to the layer F1S of the liquid crystal panel P and the second optical component layer F2 along the cutting position set by the outer periphery ED of the detection (refer to the fifth The opposite portion of the opposite portion of the opposite portion of the opposite portion is cut to the first optical component F11 and the second optical component F12 corresponding to the size of the display region P4 (refer to Fig. 8).

For example, as shown in the shape of the cut position, the starting point of the laser cut as described above is set along the side of the short side H1 and the short side H3 (see Fig. 6) of the display area P4. Pt1, end point pt2 (refer to Fig. 6), the laser light Lz is scanned from the starting point pt1 to the end point pt2. borrow Thereby, the laser light Lz is superimposed on the cutting position to perform scanning to cut the layer F1S and the second optical component layer F2.

Similarly, as shown in the shape of the cut position, the laser cut as described above is set along the side of the long side H2 and the long side H4 (see Fig. 6) of the display area P4. Starting point pt3, end point pt4 (refer to Fig. 6), the laser light Lz is scanned from the starting point pt3 to the end point pt4. Thereby, the laser beam Lz can be scanned while being superimposed on the cutting position to cut the layer F1S and the second optical component layer F2.

By the above operation steps, the second single-sided bonding panel P12 in which the first optical component F11 and the second optical component F12 are bonded to each other can be formed on the upper surface of the liquid crystal panel P.

In the present embodiment, in the liquid crystal panel P having a rectangular shape in plan view, the remaining portions may be cut by laser along the outer periphery of the liquid crystal panel P at three sides other than the functional portion, which is equivalent to one of the functional portions. At the side, the remaining portion can be cut by laser from a peripheral edge of the liquid crystal panel P to a position deeper toward the display region P4 side. For example, in the case where the first substrate P1 is a TFT substrate, a certain distance from the outer periphery of the liquid crystal panel P (excluding the functional portion) to the display region P4 side may be offset at a side corresponding to the functional portion. Cut at the position.

Fig. 16 is a schematic view showing the second detecting mechanism 62 for detecting the outer periphery of the bonding surface. The second detecting mechanism 62 including the film bonding system 1 of the present embodiment includes an imaging device 63, an illumination light source 64, and a control unit 65. The second detecting mechanism 62 has the same structure as the above-described first detecting mechanism 61. The photographing device 63 captures a screen of the outer peripheral edge ED of the bonding surface of the liquid crystal panel P and the third optical component layer F3 in the third bonding layer F23 (hereinafter referred to as the second bonding surface SA2). The illumination source 64 is used to illuminate the outer periphery ED. The control unit 65 stores a screen imaged by the imaging device 63, and performs calculation for detecting the outer periphery ED based on the screen.

The second detecting mechanism 62 is provided between the nip roller 18b on the panel transport upstream side of the third cutting device 19 in Fig. 1 and the third cutting device 19. The second detecting means 62 is located at the inspection area set on the transport path of the third bonding layer F23, and detects the outer peripheral edge ED of the second bonding surface SA2 in the same manner as the first detecting means 61.

The cutting position of the third optical component layer F3 of the third cutting device 19 is set to the third optical component layer F3 in the third bonding layer F23 according to the detection result of the outer peripheral edge ED of the second bonding surface SA2. The opposite portion of the display portion P4 and the remaining portion outside the opposite portion are displayed.

For example, the control unit 65 of the second detecting mechanism 62 can set the cutting position of the third optical component layer F3 according to the stored data of the outer peripheral edge ED of the second bonding surface SA2, so that the third optical component F13 is not formed. The size of the outer side of the liquid crystal panel P (outside of the second bonding surface SA2) is protruded. Further, the setting of the cutting position does not have to be performed by the control unit 65 of the second detecting unit 62. The setting of the cutting position can also be performed using the data of the outer circumference ED detected by the second detecting mechanism 62, using an additional setting calculation mechanism.

The third cutting device 19 scans the laser beam so as to overlap the laser beam along the outer peripheral edge ED of the bonding surface to cut the third optical component layer F3.

The third cutting device 19 cuts off the display region P4 attached to the third optical component layer F3 of the liquid crystal panel P along the set cutting position according to the detected peripheral edge ED (refer to FIG. 7). The opposite portion of the opposite portion and the opposite portion of the opposite portion is cut to cut out the third optical component F13 corresponding to the size of the display region P4 (refer to Fig. 8).

For example, as shown in the shape of the cut position, the starting point of the laser cut as described above is set along the side of the short side H1 and the short side H3 (see Fig. 6) of the display area P4. Pt1, end point pt2 (refer to Fig. 6), the laser light Lz is scanned from the starting point pt1 to the end point pt2. borrow Thereby, the laser light Lz is superimposed on the cutting position to perform scanning to cut the third optical component layer F3.

Similarly, as shown in the shape of the cut position, the laser cut as described above is set along the side of the long side H2 and the long side H4 (see Fig. 6) of the display area P4. Starting point pt3, end point pt4 (refer to Fig. 6), the laser light Lz is scanned from the starting point pt3 to the end point pt4. Thereby, the laser beam Lz can be scanned while being superimposed on the cutting position to cut the third optical component layer F3.

By the above operation steps, the double-sided bonding panel P13 to which the third optical component F13 is bonded can be formed on the upper side surface of the second single-sided bonding panel P12.

The film bonding system according to the modification described above can reduce the frame portion around the display area, achieve the purpose of expanding the display area, and miniaturize the device, and can suppress the inclination of the cut surface of the optical component at the time of laser cutting. Expand the effective area of the optical components.

In the film bonding system of the above-described embodiment, the outer peripheral edge of the bonding surface is detected for each of the plurality of liquid crystal panels P by using the detecting means, and the layer F1S bonded to each of the liquid crystal panels P is set based on the detected outer periphery. The cutting position of the second optical component layer F2 and the third optical component layer 3. Thereby, regardless of the individual difference in the size of the liquid crystal panel P or the layer F1S, an optical component of a desired size can be cut. Therefore, there is no difference in quality due to individual differences in the size of the liquid crystal panel P or the layer F1S, and the frame portion around the display area can be reduced, and the display area can be enlarged and the size of the machine can be reduced.

Although the preferred embodiment of the embodiment has been described above with reference to the drawings, it is needless to say that the invention is not limited thereto. The various shapes and combinations of the various structural components shown in the above are exemplified, and various modifications may be made in accordance with the design requirements and the like without departing from the spirit of the invention.

C1. . . First corner

C4. . . Fourth corner

D. . . diameter

F13. . . Third optical component

F3. . . Third optical component layer

H1, H3. . . Short side

H4. . . The long side

K1,k2. . . Interval distance

L1, L3. . . Trajectory

L4. . . Trajectory

Lz. . . laser

P4. . . Display area

Pt1, pt3. . . starting point

Pt4. . . end

z,z1,z2. . . Intersection

Claims (5)

A method for producing an optical display device, which is a method for producing an optical display device by bonding an optical component to an optical display device, comprising: a bonding step of optical component layers having a larger display area than the optical display component Bonding to the optical display member to form a bonded body; and cutting step of cutting off the opposite portion of the display portion of the optical component layer and the remaining portion of the opposite portion of the optical component layer from the optical component layer Forming an optical component corresponding to the size of the display area; wherein the cutting step comprises: a first scanning step of scanning the laser light along the first direction on the optical component layer to cut the optical component layer; And a second scanning step of scanning the laser light in a second direction crossing the first direction on the optical component layer to cut the optical component layer; and the first direction and the second direction At the intersection, the first trajectory of the laser light scanned by the first scanning step and the second trajectory of the laser light scanned by the second scanning step do not cross each other. The method for producing an optical display device according to claim 1, wherein at the intersection of the first direction and the second direction, the distance between the first track and the second track is set to be higher than The laser spot of the laser light has a larger radius and is below the diameter of the laser spot. The method for producing an optical display device according to claim 1 or 2, further comprising a detecting step of detecting the optical component layer and the optical in the bonded body before the cutting step Displaying an outer peripheral edge of the bonding surface of the component; and in the cutting step, between the opposite portion and the remaining portion of the optical component layer in the bonding body, the optical component layer is cut along the outer peripheral edge The broken positions overlap each other and are scanned with the laser light. A production system for an optical display device, which is a production system for bonding an optical component to an optical display component to form an optical display device, comprising: a bonding device, which is an optical component layer that is larger than a display area of the optical display component Bonding to the optical display member to form a bonded body; and cutting device for cutting the opposing portion of the display region of the optical component layer and the remaining portion of the opposite portion of the optical component layer from the optical component layer Forming an optical component corresponding to the size of the display area; wherein the cutting device is attached to the optical component layer to scan the laser light along the first direction, cutting the optical component layer, and on the optical component layer Having the laser light scanned in a second direction crossing the first direction to cut the optical component layer; and at the intersection of the first direction and the second direction, scanning along the first direction The first trajectory of the laser light and the second trajectory of the laser light scanned along the second direction do not cross each other. The production system of the optical display device of claim 4, further comprising a detecting mechanism, wherein the outer peripheral edge of the bonding surface of the optical component layer and the optical display component is detected in the bonding body; The cutting device is disposed between the opposite portion and the remaining portion of the optical component layer in the bonding body, and the cutting positions of the optical component layers disposed along the outer circumferential edge overlap each other by the laser light Scan.