TW201443521A - Detector, laser light irradiation apparatus, and apparatus for manufacturing optical member sticking workpiece - Google Patents

Abstract

A laser light irradiation apparatus includes: a table which includes a holding surface that holds a plate-like object; a laser light oscillation device which oscillates laser light; a scanner which biaxially scans the laser light in a plane parallel to the holding surface; a lighting device which illuminates the object; a first moving device which relatively moves the lighting device to the table; a second moving device which relatively moves the scanner to the table.

Description

Detection device, laser light irradiation device, and manufacturing device of optical component bonding body

The present invention relates to a manufacturing apparatus for a detecting device, a laser light irradiating device, and an optical component bonding body.

In a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate is attached to a liquid crystal panel (optical display member). Conventionally, a film having a size conforming to a display area of a liquid crystal panel is cut out from a long film composed of an optical component, and then bonded to a liquid crystal panel (for example, refer to Japanese Laid-Open Patent Publication No. 2003-255132).

In the case where the optical component is attached to the liquid crystal panel, the four corner positions of the liquid crystal panel are detected using the illumination device and the camera, and the position alignment of the liquid crystal panel and the optical component is performed. The size of the LCD panel for TV is determined by the specifications. Therefore, the lighting device, the camera, and the like also need to conform to their sizes and be fixed at the determined position. However, in recent years, with the popularization of smart phones and tablet terminals, it is required to produce various liquid crystal panels having different sizes and shapes. As a result, the demand for the production of such liquid crystal panels on the same production line is increasing. However, in the case of producing a liquid crystal panel on the same production line, the lighting device and the camera must be exchanged according to the size of the liquid crystal panel, and there will be The problem of low productivity.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a manufacturing apparatus which can illuminate a target object even if the size of a target object is changed, and can suppress a decrease in productivity, a laser beam irradiation device, and an optical component bonding body.

In order to achieve the foregoing objects, the present invention employs the following methods.

A laser light irradiation apparatus according to a first aspect of the present invention includes: a pedestal having a holding surface for holding a plate-shaped object; a laser oscillator for oscillating laser light; and a scanner for maintaining the laser light Two-dimensional scanning in a parallel plane of the surface; the illumination device illuminates the object; the first moving device moves the pedestal relative to the illuminating device; and the second moving device causes the pedestal to The scanner moves relative to each other.

The laser light irradiation device further includes: an imaging device that captures the target object; and a third moving device that moves the pedestal relative to the imaging device.

Observing from the normal direction of the holding surface, the object system is a rectangle including four corner portions; the pedestal is formed with a through opening at a position corresponding to each corner of the object; and the lighting device is opposite The pedestal is disposed on the opposite side of the holding surface, and each of the corners is illuminated through the through opening.

When the laser light oscillates the laser light, the first moving device can cause the illuminating device to exit to a position that does not overlap the through opening when viewed from the normal direction of the holding surface.

The holding surface has a first holding surface and a second holding surface disposed adjacent to the first holding surface; the lighting device is fastened in abutting extension direction adjacent to the first holding surface and the second holding surface; The first mobile device moves the illumination device in a vertical direction of the abutting direction.

The lighting device has: a first illuminating device located in the abutting extension direction; and a second illuminating device juxtaposed with the first illuminating device in a vertical direction of the abutting direction Set in the direction of the abutment extension.

The laser light irradiation device further includes a condensing lens for concentrating the laser light emitted from the scanner toward the holding surface.

A manufacturing apparatus for an optical component bonding body including an optical display member and an optical component bonded to the optical display member according to a second aspect of the present invention includes: a bonding device having an outer diameter larger than that of the optical display member Laminating the layer to the optical display member such that the layer protrudes to the outside of the bonding surface of the layer and the optical display member to form a layered laminate; and a cutting device is disposed along the bonding surface end Edge, the protruding portion of the layer is cut from the layer laminate to form an optical component corresponding to the size of the bonding surface; wherein the cutting device is constituted by the first aspect of the laser light irradiation device, The protruding portion of the layer can be cut from the layered laminate of the target object by the laser light emitted from the laser beam irradiation device.

A detecting device according to a second aspect of the present invention includes: a pedestal that holds a plate-shaped object; an illuminating device that illuminates the object; and a first moving device that moves the pedestal relative to the illuminating device.

The detecting device further includes: an imaging device that captures the target object; and a second moving device that moves the pedestal relative to the imaging device.

According to the aspect of the invention, it is possible to provide a detection device, a laser beam irradiation device, and an optical component bonding body manufacturing apparatus which can illuminate a target object even if the size of the object is changed, and can suppress the productivity.

1‧‧‧Film bonding system

5‧‧‧Roller conveyor

6‧‧‧Upstream conveyor

7‧‧‧ downstream conveyor

11‧‧‧First adsorption device

11a‧‧‧ Panel Holder

11b‧‧‧calibration camera

12‧‧‧The first dust collecting device

13‧‧‧First bonding device

15‧‧‧Reversal device

15c‧‧‧calibration camera

16‧‧‧Second dust collecting device

17‧‧‧Second fitting device

20‧‧‧Second adsorption device

22‧‧‧Transporting device

22a‧‧‧Roller Holder

22b‧‧‧Guide roller

22c‧‧‧Halves cutting device

22d‧‧‧blade

22e‧‧‧Winding Department

23‧‧‧ pinch roller

23a‧‧‧Adhesive roller

24‧‧‧Free roller conveyor

26‧‧‧Sucking tray

31‧‧‧First cut-off device

32‧‧‧Second cutting device

40‧‧‧Control Department

41‧‧‧First detection device

42‧‧‧Second detection device

100‧‧‧Laser light irradiation device

101,301‧‧‧ pedestal

101s‧‧‧ Keep face

101s1‧‧‧First holding surface

101s2‧‧‧second holding surface

102‧‧‧Laser light oscillator

103‧‧‧Lighting device

104‧‧‧First mobile device

105‧‧ ‧Scanner

105s‧‧‧Laser light processing area

106‧‧‧Second mobile device

107‧‧‧Control device

108‧‧‧ Concentrating lens

109‧‧‧Photographing device

110‧‧‧First object

111‧‧‧Abutment

Side of the 111a‧‧‧+Y direction side

Side of the 111b‧‧‧-Y direction side

112,312‧‧‧ plates

112h‧‧‧Adsorption holes

112s, 312s‧‧ ‧ adsorption surface

112s1‧‧‧First adsorption surface

112s2‧‧‧second adsorption surface

113‧‧‧ openings

113a, 213a, 313a‧‧‧ first opening

113b, 213b, 313b‧‧‧ second opening

113c, 213c, 313c‧‧‧ third opening

113d, 213d, 313d‧‧‧ fourth opening

113e, 213e, 313e‧‧‧ fifth opening

113f, 213f, 313f‧‧‧ sixth opening

113g, 213g, 313g‧‧‧ seventh opening

113h, 213h, 313h‧‧‧ eighth opening

114‧‧‧Attraction hole

115‧‧‧First conveyor belt

116‧‧‧Second conveyor belt

117,317‧‧‧ Guide groove

131‧‧‧First lighting device

132‧‧‧First light source

133‧‧‧second light source

134,138‧‧‧ Keeping Department

135‧‧‧Second lighting device

136‧‧‧ Third light source

137‧‧‧fourth light source

141‧‧‧First slide mechanism

142‧‧‧First rail

143‧‧‧First linear motor

144‧‧‧Second slide mechanism

145‧‧‧Second rail

146‧‧‧Second linear motor

151‧‧‧First illumination position adjustment device

152,155‧‧‧Mirror

153,156‧‧‧ actuator

154‧‧‧second illumination position adjustment device

161‧‧‧ Third sliding mechanism

162‧‧‧fourth sliding mechanism

171‧‧ ‧ Laser Control Department

172‧‧ 扫 Scanner Control Department

173‧‧‧Mobile Control Department

190‧‧‧ third mobile device

210‧‧‧ object

310‧‧‧ object

CL‧‧‧ transverse line

CP‧‧‧ checkpoint

EL‧‧‧ edge line

F1‧‧‧First optical component layer

F11‧‧‧First optical component

F12‧‧‧Second optical component

F1a‧‧‧Optical component body

F2‧‧‧Second optical component layer

F2a‧‧‧Adhesive layer

F3a‧‧‧Separation layer

F4a‧‧‧Surface protection film

F5‧‧‧Fitting layer

F6‧‧‧ polarizer

F7‧‧‧ first film

F8‧‧‧second film

FX‧‧‧ optical component layer

FXm‧‧‧ layer

F1X‧‧‧ optical components

G‧‧‧Border Department

Ha1, Ha2‧‧ ‧ interval

Hb1, Hb2‧‧‧ interval

L‧‧‧Laser light

L1, L2‧‧‧ cutting line

La1‧‧‧ length

La2‧‧‧ length

Lb1‧‧‧ length

Lb2‧‧‧ length

M1‧‧ symbol

N1‧‧‧Orthogonal direction

R‧‧ track

R1‧‧‧ Roller

R2‧‧‧Separation roller

S‧‧‧stop

SA1‧‧‧ straight section

SA2‧‧‧Bending section

Tr‧‧‧Laser light movement track

Tr1‧‧‧Light source movement track

Tr2‧‧‧ adjustment curve

P‧‧‧ LCD panel

P1‧‧‧ first substrate

P2‧‧‧second substrate

P3‧‧‧ liquid crystal layer

P4‧‧‧ display area

PA1‧‧‧First optical component fit

PA2‧‧‧Second optical component fit

PA3‧‧‧The third optical component fit

PA4‧‧‧Four optical component bonding body

W1, W2‧‧‧ distance

Wa1‧‧‧ outer width

Wa2‧‧‧ outer width

Wa3‧‧‧ outer width

Wa4‧‧‧ outer width

Maxmax‧‧‧maximum offset angle

Θmin‧‧‧minimum offset angle

Midmid‧‧‧average offset angle

Fig. 1 is a plan view showing a laser beam irradiation apparatus according to an embodiment of the present invention.

Fig. 2 is a plan view showing the arrangement relationship between the laser light irradiation device and the conveyor belt.

Fig. 3 is a perspective view showing a laser light irradiation device.

Figure 4 is a plan view showing the pedestal.

Figure 5 is a plan view showing the lighting device and the first moving device.

Fig. 6 is a plan view showing the illumination position of the illumination device and the photographing position of the photographing device.

Fig. 7 is a plan view showing the exit position of the lighting device and the photographing device.

Fig. 8 is a plan view showing the illumination position of the illumination device and the photographing position of the photographing device in the case where the size of the object is large.

Fig. 9 is a plan view showing the exit position of the lighting device and the photographing device in the case where the size of the object is large.

Fig. 10 is a plan view showing a first modification of the pedestal according to the embodiment.

Fig. 11 is a schematic view showing a manufacturing apparatus of an optical component bonding body according to an embodiment of the present invention.

Figure 12 is a plan view of a liquid crystal panel.

Figure 13 is a cross-sectional view taken along line A-A of Figure 12.

Figure 14 is a cross-sectional view of the optical component layer.

Fig. 15 is a schematic view showing the operation of the cutting device.

Fig. 16A is a schematic view showing an example of a method of determining the bonding position of the layer of the liquid crystal panel.

Fig. 16B is a schematic view showing an example of a method of determining the bonding position of the layer of the liquid crystal panel.

Figure 17 is a schematic diagram showing a control method for depicting a specific trajectory by laser light.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

In addition, in the following drawings, the dimensions, ratios, and the like of the respective structural elements are appropriately changed for the sake of clarity of the drawings. In the following description and drawings, the same or corresponding components The same component symbols are given, and overlapping descriptions are omitted.

(laser light irradiation device)

Fig. 1 is a plan view showing an example of a laser beam irradiation device 100 used as a cutting device for a target object.

In the following description, the XYZ orthogonal coordinate system is set according to the requirements, and the positional relationship of each component is described with reference to the XYZ orthogonal coordinate system. In the present embodiment, the X direction is a direction parallel to the holding surface of the holding target object, the Y direction is a direction orthogonal to the first direction (X direction) in the holding surface, and the Z direction is the X direction and The direction in which the Y direction is orthogonal.

As shown in Fig. 1, the laser beam irradiation apparatus 100 includes a pedestal 101, a laser oscillator 102, a scanner 105, an illumination device 103, an imaging device 109, a first mobile device 104, and a second mobile device 106 (refer to Fig. 2), a third mobile device 190, and a control device 107 for overall control of the above device (refer to Fig. 3).

A pedestal 101 (for example, three in the present embodiment) is arranged in parallel in the Y direction. The pedestal 101 has a holding surface 101s that holds a target object (first object) 110. The pedestal 101 is rectangular when viewed from the normal direction of the holding surface 101s. The holding surface 101s includes a rectangular first holding surface 101s1 having a long side in the first direction (X direction), and a second holding surface 101s2 disposed adjacent to the first holding surface 101s1 and having the same shape as the first holding surface 101s1.

The object object 110 is a rectangle as viewed from the normal direction of the holding surface 101s. The pedestal 101 is formed with an opening portion 113 (through opening portion) at a position of a corner portion of the corresponding object 110. Each of the first holding surface 101s1 and the second holding surface 101s2 is disposed at four corner positions of the corresponding target object 110, and four opening portions 113 are formed. Further, among the three pedestals 101 arranged side by side in the Y direction, one pedestal 101 at the center omits the pattern of the opening 113, the photographing device 109 above the pedestal 101, and the third moving device 190 for the sake of convenience. .

The laser light oscillator 102 is a component that oscillates the laser light L. For example, the laser oscillator 102 can use a CO ₂ laser oscillator (carbon dioxide laser oscillator), an ultraviolet (UV) laser oscillator, a semiconductor laser oscillator, a yttrium aluminum garnet (YAG) laser oscillator, An oscillator such as an excimer laser oscillator. However, the specific structure is not particularly limited. In the exemplified oscillator, the CO ₂ laser oscillator can oscillate high-output laser light suitable for cutting processing of optical components such as a polarizing film, and is therefore better than other oscillators.

Fig. 2 is a plan view showing the arrangement relationship between the laser beam irradiation apparatus 100 and the conveyor belts (the first conveyor belt 115 and the second conveyor belt 116). In the second drawing, for the sake of convenience, the pedestal 101 is indicated by a chain line, and the second moving device 106 is indicated by a solid line.

As shown in Fig. 2, the first conveyor belt 115 and the second conveyor belt 116 are provided along the direction in which the plurality of pedestals 101 are arranged. The first conveyor belt 115 and the second conveyor belt 116 are disposed to face each other across a plurality of pedestals 101.

The first conveyor belt 115 transports the target object 110 from the −Y direction side to the +Y direction side, or from the +Y direction side to the −Y direction side. The target object 110 conveyed by the first conveyor belt 115 is disposed on the holding surface 101s via a transmission mechanism not shown.

The target object 110 subjected to the specific treatment on the holding surface 101s is disposed to the second conveyor belt 116 via a transmission mechanism not shown. The second conveyor belt 116 transports the received target object 110 from the -Y direction side to the +Y direction side via a transmission mechanism (not shown), or conveys it from the +Y direction side to the -Y direction side. The object 110 transported by the second conveyor belt 116 is guided to the next project.

FIG. 3 is a perspective view showing the laser light irradiation device 100. In addition, in FIG. 3, for the sake of convenience, only one of the plurality of photographing devices 109 is depicted.

As shown in Fig. 3, the scanner 105 performs two-dimensional scanning with laser light in a parallel plane (in the XY plane) of the holding surface 101s. That is, the scanner 105 moves the laser light independently of the pedestal 101 in the X direction and the Y direction. In this way, the laser light can be irradiated with good precision. It is held at any position of the object 110 on the pedestal 101.

The scanner 105 includes a first irradiation position adjusting device 151 and a second irradiation position adjusting device 154.

The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 are constituted by scanning elements that cause the laser light emitted from the laser oscillator 102 to perform two-dimensional scanning in parallel planes of the holding surface 101s. For example, a current scanner can be used as the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. In addition, the scanning element is not limited to the use of a current scanner, and a gimbal can also be used.

The first irradiation position adjusting device 151 is provided with an actuator 153 that sets the angle between the mirror 152 and the adjusting mirror 152. The actuator 153 has a rotary axis parallel to the Z direction. The actuator 153 rotates the mirror 152 about the Z axis in accordance with the control of the control unit 107.

The second irradiation position adjusting device 154 is provided with an actuator 156 that sets the angle between the mirror 155 and the adjusting mirror 155. The actuator 156 has a rotary axis parallel to the Y direction. The actuator 156 rotates the mirror 155 about the Y axis in accordance with the control of the control unit 107.

A condensing lens 108 that condenses the laser light passing through the scanner 105 toward the holding surface 101s is disposed on the optical path between the scanner 105 and the pedestal 101.

For example, an fθ lens can be used as the collecting lens 108. Thereby, the laser light from the mirror 155 and emitted in parallel by the collecting lens 108 can be concentrated in parallel at the object object 110.

Further, the optical path between the scanner 105 and the pedestal 101 may be a configuration in which the condensing lens 108 is not disposed.

The laser light L oscillated by the laser oscillator 102 is irradiated onto the object object 110 held by the pedestal 101 via the mirror 152, the mirror 155, and the condensing lens 108.

The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 adjust the object from the laser oscillator 102 toward the pedestal 101 according to the control of the control device 107. The body 110 irradiates the laser light irradiation position.

The laser beam processing region 105s (hereinafter referred to as a scanning region) controlled by the scanner 105 has a rectangular shape when viewed from the normal direction of the holding surface 101s. In the present embodiment, the area of the scanning area 105s is smaller than the area of the first holding surface 101s1 and the second holding surface 101s2.

As shown in Fig. 1, the illuminating device 103 is disposed facing the opposite side of the holding surface 101s of the pedestal 101. The illuminating device 103 is positioned in the adjacent extending direction (Y direction) adjacent to the first holding surface 101s1 and the second holding surface 101s2. The illuminating device 103 illuminates the corner portion of the target object 110 via the opening 113 from the surface opposite to the holding surface 101s of the pedestal 101.

The photographing device 109 is disposed above the holding surface 101s of the pedestal 101. The plurality of imaging devices 109 are arranged (for example, in the present embodiment, each of the first holding surface 101s1 and the second holding surface 101s2 is four). The imaging devices 109 are disposed at positions corresponding to the respective opening portions 113 of the first holding surface 101s1 and the second holding surface 101s2. The photographing device 109 is an image of a corner portion of the subject object 110.

The first mobile device 104 moves the pedestal 101 and the illuminating device 103 relative to each other. As shown in FIG. 5, the first moving device 104 has a first slider mechanism 141 and a second slider that move the illumination device 103 in the vertical direction (X direction) of the adjacent direction of the first holding surface 101s1 and the second holding surface 101s2. Mechanism 144. The first moving device 104 operates the motor built in each of the first slider mechanism 141 and the second slider mechanism 144 to move the illumination device 103 in the X direction.

As shown in FIG. 3, the second moving device 106 relatively moves the pedestal 101 and the scanner 105. The second moving device 106 has a third slider mechanism 161 that moves the pedestal 101 in a first direction (X direction) parallel to the holding surface 101s; and a fourth slider mechanism 162 that allows the third slider mechanism 161 The movement is performed in a second direction (Y direction) parallel to the holding surface 101s and perpendicular to the first direction. The second moving device 106 operates the linear motor incorporated in each of the third slider mechanism 161 and the fourth slider mechanism 162 to move the pedestal 101 in all directions of XY.

The pulse-driven linear motor in the slider mechanism finely controls the rotation angle of the output shaft through the pulse signal supplied to the linear motor. Therefore, the position of the pedestal 101 supported by the slider mechanism in the XY directions can be controlled with higher precision. Further, the position control of the pedestal 101 is not limited to the position control using a pulse motor, and may be realized by feedback control using a servo motor or any other control method.

The third moving device 190 moves the pedestal 101 and the photographing device 109 relative to each other. The third moving device 190 moves the imaging device 109 in the first direction (X direction) parallel to the holding surface 101s and in the second direction (Y direction) parallel to the holding surface 101s and perpendicular to the first direction. . The third moving device 190 has a motor incorporated therein, and the imaging device 109 is moved in the X direction by operating the motor.

The control device 107 has: a laser control unit 171 that controls the laser light oscillator 102; a scanner control unit 172 that controls the scanner 105; and controls the first mobile device 104, the second mobile device 106, and the third mobile device 190. The movement control unit 173.

Specifically, the laser control unit 171 controls the ON/OFF of the laser oscillator 102 and the output of the laser light oscillated by the laser oscillator 102.

The scanner control unit 172 performs drive control of the actuator 153 of the first irradiation position adjusting device 151 and the actuator 156 of the second irradiation position adjusting device 154.

The movement control unit 173 performs a motor operation of each of the first slider mechanism 141 and the second slider mechanism 144, and operates a linear motor incorporated in each of the third slider mechanism 161 and the fourth slider mechanism 162. The respective controls that act on the motor housed in the third mobile device 190.

The control device 107 may include a display device such as a liquid crystal display that displays an operation state of each portion of the laser light irradiation device 100, and may be connected to the display device.

When the initial setting is completed, it is provided to the slider mechanism (the first slider mechanism 141 and the second slider mechanism 144) according to the control of the movement control unit 173 of the control device 107 (refer to the fifth The motor of FIG. 3 and the motor disposed in the third moving device 190 are actuated. Thereby, both the illuminating device 103 and the imaging device 109 are moved to a position overlapping the opening 113 (refer to FIG. 1) as viewed from the normal direction of the holding surface 101s. Therefore, both the illumination device 103 and the imaging device 109 can be disposed at a position suitable for the size of the target object 110.

Next, the motor provided in the slider mechanism (the first slider mechanism 141 and the second slider mechanism 144) (refer to FIG. 1) and the third mobile device are controlled by the movement control unit 173 of the control device 107. The 190 motor is actuated. Thereby, both the illuminating device 103 and the imaging device 109 are evacuated to a position that does not overlap the opening 113 (refer to FIG. 1) when viewed from the normal direction of the holding surface 101s.

Thereafter, the laser light is oscillated from the laser oscillator 102 in accordance with the control of the laser control unit 171 of the control device 107. At this time, the mirror constituting the scanner 105 is started to be rotationally driven by the control of the scanner control unit 172 of the control device 107. At the same time, according to the control of the movement control unit 173 of the control device 107, the motor or the like provided to the slider mechanism (the third slider mechanism 161 and the fourth slider mechanism 162) is detected by a sensor such as a rotary encoder. The speed of the shaft.

The control device 107 controls the second mobile device 106 and the scanner 105 by correcting the coordinate values in real time to cause the laser light to be emitted to the coordinates corresponding to the processing information. That is, the laser light is allowed to draw a specific trajectory according to the shape of the target object 110 (refer to FIG. 1), and the control device 107 controls the mobile device 106 and the scanner 105. For example, the specific control method performed by the control device 107 is to perform scanning of the laser light mainly through the second mobile device 106, and adjust the laser light irradiation with the control precision of the second mobile device 106 by the scanner 105. The area of the location.

Fig. 4 is a plan view showing the pedestal 101.

As shown in FIG. 4, the pedestal 101 has a plate 112 that adsorbs and holds the object 110, and a base 111 that holds the plate 112.

The plate 112 has a rectangular shape in plan view, and the size of the plate 112 and the holding surface 101s The same size. The plate 112 is detachably fixed to the base 111. The plate 112 has an adsorption surface 112s capable of adsorbing the object 110. A plurality of (for example, two in the present embodiment) object objects 110 are adsorbed and held at the sheet 112. For example, a metal such as aluminum (Al), iron (Fe), or stainless steel (SUS) can be used as the constituent material of the sheet 112.

At the plate piece 112, a rectangular frame-shaped guide groove 117 is formed along the outer periphery of the adsorption surface 112s. The guiding groove 117 is a recess that receives the laser light oscillated by the laser oscillator 102. The outer circumference of the guide groove 117 is larger than the outer circumference of the object 110.

The outer peripheral edge of the target object 110 is disposed between the outer periphery of the adsorption surface 112s and the outer periphery of the guide groove 117. By irradiating the laser light to the guiding groove 117, it is possible to suppress the laser light from being diffused on the holding surface 101s.

Four opening portions 113 (first opening portion 113a, second opening portion 113b, third opening portion 113c, and fourth opening portion) are formed at the four corner portions of the corresponding target object 110 at the first holding surface 101s1. 113d). The first opening 113a is disposed at the upper right corner of the target object 110. The second opening 113b is disposed at the upper left corner of the target object 110. The third opening 113c is disposed at a lower left corner of the target object 110. The fourth opening 113d is disposed at a lower right corner of the target object 110.

The distance between the +Y-direction side end edge of the first opening portion 113a and the Y-direction side end edge of the second opening portion 113b (hereinafter referred to as the outermost width Wa1 of the first opening portion 113a and the second opening portion 113b) The distance between the Y-direction side end edge of the third opening portion 113c and the +Y-direction side end edge of the fourth opening portion 113d (hereinafter referred to as the maximum of the third opening portion 113c and the fourth opening portion 113d) The outer width Wa2) is roughly equal.

At the second holding surface 101s2, four opening portions 113 (a fifth opening portion 113e, a sixth opening portion 113f, a seventh opening portion 113g, and an eighth opening portion) are formed at four corner portions of the corresponding target object 110. 113h). The fifth opening 113e is disposed at the upper right corner of the target object 110. The sixth opening 113f is disposed at the upper left corner of the target object 110. The seventh opening portion 113g is disposed on the object The lower left corner of the object 110. The eighth opening portion 113h is disposed at a lower right corner portion of the target object 110.

The distance between the +Y-direction side end edge of the fifth opening portion 113e and the Y-direction side end edge of the sixth opening portion 113f (hereinafter referred to as the outermost width Wa3 of the fifth opening portion 113e and the sixth opening portion 113f) The distance between the Y-direction side end edge of the seventh opening portion 113g and the +Y-direction side end edge of the eighth opening portion 113h (hereinafter referred to as the seventh opening portion 113g and the eighth opening portion 113h) The outer width Wa4) is roughly equal.

The adsorption surface 112s has a first adsorption surface 112s1 formed at a central portion of the first holding surface 101s1, and a second adsorption surface 112s2 formed at a central portion of the second holding surface 101s2. Each of the first adsorption surface 112s1 and the second adsorption surface 112s2 is formed with a plurality of adsorption holes 112h.

At a surface opposite to the holding surface 101s of the sheet piece 112, a suction hole 114 for sucking the target object 110 via a plurality of adsorption holes 112h is formed (refer to Fig. 5). In Fig. 5, only one suction hole 114 is disposed between the first adsorption surface 112s1 and the second adsorption surface 112s2. In addition, the number of the arrangement of the suction holes 114 is not limited to one, and may be plural.

The first adsorption surface 112s1 and the second adsorption surface 112s2 are each rectangular in plan view. The respective sizes of the first adsorption surface 112s1 and the second adsorption surface 112s2 are smaller than the size of the object 110. The four corner portions of the first adsorption surface 112s1 are disposed at positions corresponding to the four openings 113 (the first opening 113a, the second opening 113b, the third opening 113c, and the fourth opening 113d). The four corner portions of the second adsorption surface 112s2 are disposed at positions corresponding to the four openings 113 (the fifth opening 113e, the sixth opening 113f, the seventh opening 113g, and the eighth opening 113h).

The base 111 is rectangular in plan view, and the size of the base 111 is larger than the size of the plate 112. For example, the length of the base 111 in the short side direction (the length in the X direction) is about 350 mm, and the length in the longitudinal direction (the length in the Y direction) is about 450 mm. The illuminating device 103 and the first moving device 104 are disposed inside the base 111 (refer to FIG. 5). The illuminating device 103 is configured to illuminate a target object having a size of 4 inches to 10 inches.

FIG. 5 is a plan view showing the illumination device 103 and the first mobile device 104.

As shown in FIG. 5, the illuminating device 103 includes a first illuminating device 131 and a second illuminating device 135 which are arranged side by side with the first illuminating device 131 via the suction hole 114 in the X direction. The first illuminating device 131 and the second illuminating device 135 are each provided to extend in the Y direction.

The first illumination device 131 has a first light source 132, a second light source 133 arranged in parallel with the first light source 132 in the Y direction, and a holding portion 134 that holds the first light source 132 and the second light source 133.

As shown in FIGS. 4 and 5, the first light source 132 is illuminating and adsorbed on the first adsorption surface 112s1 from the surface on the opposite side of the first holding surface 101s1 via the first opening 113a and the second opening 113b. The corner of the object object 110. The length La1 of the first light source 132 in the longitudinal direction is larger than the outermost width Wa1 of the first opening 113a and the second opening 113b. Further, from the viewpoint of appropriately illuminating the corner portion of the target object 110, the length La1 of the first light source 132 in the longitudinal direction may be substantially equal to the outermost width Wa1 of the first opening 113a and the second opening 113b.

The second light source 133 illuminates the corner portion of the target object 110 held by the second adsorption surface 112s2 from the surface on the opposite side of the second holding surface 101s2 via the fifth opening 113e and the sixth opening 113f. The length La2 of the second light source 133 in the longitudinal direction is larger than the outermost layer Wa3 of the fifth opening 113e and the sixth opening 113f. Further, from the viewpoint of appropriately illuminating the corner portion of the target object 110, the length La2 of the second light source 133 in the longitudinal direction may be substantially equal to the outermost layer Wa3 of the fifth opening portion 113e and the sixth opening portion 113f.

As shown in FIG. 5, the second illumination device 135 has a third light source 136, a fourth light source 137 arranged in parallel with the third light source 136 in the Y direction, and a holding portion for holding the third light source 136 and the fourth light source 137. 138.

As shown in FIGS. 4 and 5, the third light source 136 is illuminating and holding the first suction from the surface on the opposite side of the first holding surface 101s1 via the third opening 113c and the fourth opening 113d. The corner of the object object 110 of the surface 112s1. The length Lb1 of the third light source 136 in the longitudinal direction is larger than the outermost width Wa2 of the third opening 113c and the fourth opening 113d. Further, from the viewpoint of appropriately illuminating the corner portion of the target object 110, the length Lb1 of the third light source 136 in the longitudinal direction may be substantially equal to the outermost width Wa2 of the third opening 113c and the fourth opening 113d.

The fourth light source 137 illuminates the corner portion of the target object 110 held by the second adsorption surface 112s2 from the surface on the opposite side of the second holding surface 101s2 via the seventh opening 113g and the eighth opening 113h. The length Lb2 of the fourth light source 137 in the longitudinal direction is larger than the outermost width Wa4 of the seventh opening 113g and the eighth opening 113h. Further, from the viewpoint of appropriately illuminating the corner portion of the target object 110, the length Lb2 of the fourth light source 137 in the longitudinal direction may be substantially equal to the outermost width Wa4 of the seventh opening portion 113g and the eighth opening portion 113h.

As shown in Fig. 5, the first moving device 104 has a first slider mechanism 141 and a second slider mechanism 144 which is arranged in parallel with the first slider mechanism 141 via the suction hole 114 in the Y direction.

The first slider mechanism 141 is disposed on the opposite side of the first holding surface 101s1. The first slider mechanism 141 has a first rail 142 and a first linear motor 143 arranged side by side with the first rail 142 in the Y direction.

The first rail 142 extends along one side of the base 111 (the side 111a on the +Y direction side). For example, the first rail 142 has a length of 270 mm.

The first rail 142 is disposed at a position partially overlapping the end portion of the holding portion 134 and the holding portion 138 on the +Y direction side. The first guide rail 142 moves the guide holding portion 134 and the holding portion 138 in the X direction.

The first linear motor 143 is extended in a parallel direction of the first rail 142.

The length of the first linear motor 143 is shorter than the length of the first rail 142. For example, the length of the first linear motor 143 is 72 mm (stroke).

The first linear motor 143 is disposed at a position partially overlapping the end portion on the −Y direction side of the third light source 136 held by the holding portion 138. The holding portion 138 is moved in the X direction by the first linear motor 143.

The second slider mechanism 144 is disposed on the opposite side of the second holding surface 101s2. The second slider mechanism 144 has a second rail 145 and a second linear motor 146 disposed side by side with the second rail 145 in the Y direction.

The second guide rail 145 is extended along one side of the base 111 (the side 111b on the -Y direction side). The length of the second rail 145 is substantially equal to the length of the first rail 142.

The second guide rail 145 is disposed at a position partially overlapping the end portion on the -Y direction side of the holding portion 134 and the holding portion 138. The second guide rail 145 moves the guide holding portion 134 and the holding portion 138 in the X direction.

The second linear motor 146 is extended in a parallel direction of the second rail 145.

The length of the second linear motor 146 is substantially equal to the length of the first linear motor 143.

The second linear motor 146 is disposed at a position partially overlapping the end portion of the second light source 133 held by the holding portion 134 at the +Y direction. The holding portion 134 is moved in the X direction by the second linear motor 146.

For example, by moving the first linear motor 143 and the second linear motor 146 in synchronization, the holding portion 134 and the holding portion 138 can be moved in synchronization in the X direction. In the present embodiment, the exit movement (movement in the -X direction) of the first illumination device 131 and the exit movement (movement in the +X direction) of the second illumination device 135 are simultaneously performed.

Hereinafter, the roles of the first mobile device 104 and the third mobile device 190 will be described using Figs. 6 to 9.

Fig. 6 is a view showing the arrangement position of the illumination device 103 when the target object 110 is illuminated. (hereinafter, referred to as an illumination position of the illumination device 103), and a plan view of an arrangement position of the imaging device 109 (hereinafter, referred to as an imaging position of the imaging device 109) when the target object 110 is imaged.

In the sixth drawing, the arrangement relationship between the illumination device 103 and the imaging device 109 of the openings 113a to 113h is used to explain the illumination position of the illumination device 103 and the imaging position of the imaging device 109. Moreover, for the sake of convenience, the drawings of the first moving device 104, the third moving device 190, and the suction hole 114 are omitted.

As shown in FIG. 6, the first illuminating device 131 is disposed at a position partially overlapping the first opening 113a, the second opening 113b, the fifth opening 113e, and the sixth opening 113f. The first illuminating device 131 illuminates the -X direction side corner portion of each of the target objects 110 via the first opening portion 113a, the second opening portion 113b, the fifth opening portion 113e, and the sixth opening portion 113f.

The second illuminating device 135 is disposed at a position partially overlapping the third opening 113c, the fourth opening 113d, the seventh opening 113g, and the eighth opening 113h. The second illumination device 135 illuminates the +X direction side corner portions of the respective target objects 110 via the third opening portion 113c, the fourth opening portion 113d, the seventh opening portion 113g, and the eighth opening portion 113h.

The imaging device 109 is disposed in the first opening 113a, the second opening 113b, the third opening 113c, the fourth opening 113d, the fifth opening 113e, the sixth opening 113f, the seventh opening 113g, and the The eight opening portions 113h have partially overlapped positions. The photographing device 109 captures an image of a corner portion of each of the target objects 110 in a state where the illumination device 103 illuminates the corners of the respective target objects 110.

Fig. 7 is a view showing the arrangement of the illumination device 103 when the laser light 102 is oscillated by the laser oscillator 102, that is, the arrangement of the illumination device 103 when the target object 110 is cut (hereinafter referred to as the exit position of the illumination device 103) and the photographing device 109. A plan view of the configuration (hereinafter, referred to as an exit position of the photographing device 109).

In Fig. 7, the illumination device 103 using the openings 113a to 113h and photography are used. The arrangement relationship of the device 109 is used to explain the exit position of the illumination device 103 and the exit position of the photographing device 109. Moreover, for the sake of convenience, the drawings of the first moving device 104, the third moving device 190, and the suction hole 114 are omitted.

As shown in FIG. 7, the first illuminating device 131 is disposed at a position that does not overlap the first opening 113a, the second opening 113b, the fifth opening 113e, and the sixth opening 113f. In other words, the first illuminating device 131 is disposed on the -X direction side of the first opening portion 113a, the second opening portion 113b, the fifth opening portion 113e, and the sixth opening portion 113f on the -X direction side edge. In this case, the light emitted by the first illumination device 131 can be shielded by the plate 112 (refer to FIG. 4) and the base 111. In addition, the first lighting device 131 can also be turned off.

The second illuminating device 135 is disposed at a position that does not overlap the third opening 113c, the fourth opening 113d, the seventh opening 113g, and the eighth opening 113h. In other words, the second illuminating device 135 is disposed on the +X direction side of each of the third opening portion 113c, the fourth opening portion 113d, the seventh opening portion 113g, and the eighth opening portion 113h on the +X direction side end edge. In this case, the light emitted by the second illumination device 135 can be shielded by the plate 112 (refer to FIG. 4) and the base 111. In addition, the second illumination device 135 can also be turned off.

The imaging device 109 is disposed not in the first opening 113a, the second opening 113b, the third opening 113c, the fourth opening 113d, the fifth opening 113e, the sixth opening 113f, and the seventh opening 113g. And a position where the eighth opening portion 113h overlaps. Specifically, in the eight imaging devices 109, the four imaging devices 109 on the -X direction side are disposed in the first opening 113a, the second opening 113b, the fifth opening 113e, and the sixth opening 113f - The X-direction side end edge is more - X direction side. In the eight imaging devices 109, four imaging devices 109 on the +X direction side are disposed on the +X direction side ends of the third opening 113c, the fourth opening 113d, the seventh opening 113g, and the eighth opening 113h. The edge is more + X direction side.

Figure 8 shows the size of the object object 210 (second object) compared to the object The case where the size of the body 110 (first object) is larger (that is, the sheet 112 holding the object 110 having a relatively small size is exchanged to hold the sheet of the object 210 having a relatively large size (switch board) After the film)), a plan view of the illumination position of the illumination device 103 and the imaging position of the imaging device 109.

In the present embodiment, the front and back of the sheet exchange are described as an example in which the sheet 112 of the target object 110 having a relatively small size is exchanged to hold the sheet of the target object 210 having a relatively large size. It is not limited to this. For example, before and after the sheet exchange: a sheet in which a sheet of a target object having a relatively large size is kept to be exchanged to a target object having a relatively small size is also applicable to the present invention.

As shown in FIG. 8, the first opening 213a, the second opening 213b, the third opening 213c, the fourth opening 213d, the fifth opening 213e, and the first opening 213a are formed in the sheet holding the target object 210. The sixth opening 213f, the seventh opening 213g, and the eighth opening 213h. Each of the openings (the first opening 213a to the eighth opening 213h) corresponds to the first opening 113a, the second opening 113b, the third opening 113c, the fourth opening 113d, and the fifth opening, respectively. 113e, a sixth opening 113f, a seventh opening 113g, and an eighth opening 113h. However, the size and arrangement of the respective opening portions (the first opening portion 213a to the eighth opening portion 213h) are suitable for the size of the target object 210.

In the eighth diagram, the arrangement relationship between the illumination device 103 and the imaging device 109 using the openings (the first opening portion 213a to the eighth opening portion 213h) is used to explain the illumination position of the illumination device 103 and the imaging position of the imaging device 109. . Moreover, for the sake of convenience, the drawings of the first moving device 104, the third moving device 190, and the suction hole 114 are omitted.

As shown in FIG. 8, the first illuminating device 131 is disposed at a position partially overlapping the first opening 213a, the second opening 213b, the fifth opening 213e, and the sixth opening 213f. The first illuminating device 131 illuminates the -X direction side corner portion of each of the target objects 210 via the first opening portion 213a, the second opening portion 213b, the fifth opening portion 213e, and the sixth opening portion 213f.

The second illumination device 135 is disposed in the third opening portion 213c and the fourth opening portion 213d, the seventh opening portion 213g and the eighth opening portion 213h have partially overlapped positions. The second illumination device 135 illuminates the +X direction side corner portions of the respective target objects 210 via the third opening portion 213c, the fourth opening portion 213d, the seventh opening portion 213g, and the eighth opening portion 213h.

The imaging device 109 is disposed in the first opening 213a, the second opening 213b, the third opening 213c, the fourth opening 213d, the fifth opening 213e, the sixth opening 213f, the seventh opening 213g, and the The eight opening portions 213h have partially overlapping positions. The photographing device 109 captures an image of a corner portion of each of the target objects 210 in a state where the illumination device 103 illuminates the corners of the respective target objects 210.

As shown in FIGS. 6 and 8, the distance between the +X direction side end edge of the first illumination device 131 and the -X direction side end edge of the second illumination device 135 (hereinafter referred to as the first illumination device 131) The spacing between the second illumination device 135 and the second illumination device 135 will change before and after the exchange of the plates. Specifically, the interval Hb1 between the first illuminating device 131 and the second illuminating device 135 after the sheet exchange (when the sheet for the target object 210 having a relatively large size is set) is earlier than the sheet exchange (the setting size is relatively small) The interval Ha1 between the first illuminating device 131 and the second illuminating device 135 at the time of the sheet 112 for the target object 110 is larger.

Fig. 9 is a plan view showing the exit position of the illumination device 103 after the exchange of the sheets and the exit position of the photographing device 109.

In the ninth diagram, the arrangement relationship between the illumination device 103 and the imaging device 109 using the openings (the first opening portion 213a to the eighth opening portion 213h) is used to explain the exit position of the illumination device 103 and the exit position of the photographing device 109. . Moreover, for the sake of convenience, the drawings of the first moving device 104, the third moving device 190, and the suction hole 114 are omitted.

As shown in FIG. 9, the first illuminating device 131 is disposed at a position that does not overlap the first opening 213a, the second opening 213b, the fifth opening 213e, and the sixth opening 213f, that is, The first opening portion 213a, the second opening portion 213b, the fifth opening portion 213e, and the sixth opening portion 213f are disposed on the -X direction side end side in the -X direction side. In this case, the first illumination device 131 shoots The light emitted can be obscured by the plate (omitted in the drawing) and the base 111. In addition, the first lighting device 131 can also be turned off.

The second illuminating device 135 is disposed at a position that does not overlap the third opening 213c, the fourth opening 213d, the seventh opening 213g, and the eighth opening 213h, that is, is disposed in the third opening 213c. The fourth opening portion 213d, the seventh opening portion 213g, and the eighth opening portion 213h are each on the +X direction side end edge in the +X direction side. In this case, the light emitted by the second illumination device 135 can be shielded by the plate (omitted from the drawing) and the base 111. In addition, the second illumination device 135 can also be turned off.

The imaging device 109 is disposed not in the first opening 213a, the second opening 213b, the third opening 213c, the fourth opening 213d, the fifth opening 213e, the sixth opening 213f, and the seventh opening 213g. And a position where the eighth opening portion 213h overlaps. Specifically, in the eight imaging devices 109, the four imaging devices 109 on the -X direction side are disposed in the first opening 213a, the second opening 213b, the fifth opening 213e, and the sixth opening 213f - The X-direction side end edge is more - X direction side. In the eight imaging devices 109, four imaging devices 109 on the +X direction side are disposed on the +X direction side ends of the third opening 213c, the fourth opening 213d, the seventh opening 213g, and the eighth opening 213h. The edge is more + X direction side.

As shown in Figs. 7 and 9, the interval between the first illumination device 131 and the second illumination device 135 is substantially equal before and after the plate exchange. Specifically, the interval Hb2 between the first illuminating device 131 and the second illuminating device 135 after the sheet exchange is substantially equal to the interval Ha2 between the first illuminating device 131 and the second illuminating device 135 before the sheet exchange.

As shown in FIGS. 6 to 9, by moving the illumination device 103 in the X direction by the first moving device 104, it is possible to illuminate the amount of light suitable for each target object 110, 210 before and after the exchange of the sheets. Moreover, since the illuminating device 103 can be shared before and after the exchange of the slabs, it is not necessary to exchange the illuminating device 103 in order to conform to the size of the target object 110, 210.

Further, by moving the photographing device 109 in the X direction by the third moving device 190, The object objects 110, 210 can be photographed at positions suitable for the size of each object 110, 210 before and after the exchange of the sheets. Further, before and after the sheet exchange, it is not necessary to exchange the photographing device 109 in order to conform to the size of the target object 110, 210, so that the photographing device 109 can be shared.

As described above, according to the laser light irradiation apparatus 100 of the present embodiment, even if the size of the target object 110 is changed, the target object 110 can be brightly illuminated, and productivity can be suppressed from being lowered.

Further, even if the size of the target object 110 is changed, the target object 110 can be photographed at an appropriate position, and productivity can be suppressed from being lowered.

Further, when the laser oscillator 102 oscillates the laser light, the first moving device 104 causes the illuminating device 103 to exit to a position where it does not overlap the opening portion 113. Therefore, it is possible to suppress the irradiation of the laser light to the illumination device 103. Therefore, damage to the illumination device 103 caused by the irradiation of the laser light can be avoided.

Further, the illumination device 103 is positioned in the adjacent extending direction (Y direction) of the first holding surface 101s1 and the second holding surface 101s2, and the first moving device 104 moves the illumination device 103 in the X direction. Therefore, the object objects 110 each held by the first holding surface 101s1 and the second holding surface 101s2 can be illuminated with good efficiency over a wide range. Therefore, even if the size of the object 110 held by each of the first holding surface 101s1 and the second holding surface 101s2 is changed, the object 110 can be easily illuminated.

Further, the illuminating device 103 has a first illuminating device 131 and a second illuminating device 135 which are arranged side by side in the X direction. Therefore, the object object 110 held by the holding surface 101s can be illuminated with good efficiency over a wide range. Therefore, even if the size of the object 110 held on the holding surface 101s is changed, the object 110 can be easily illuminated.

Further, the condensing lens 108 is disposed on the optical path between the scanner 105 and the pedestal 101. Therefore, the laser light passing through the scanner 105 can be concentrated in parallel at the object object 110. Therefore, the target object 110 can be cut with good precision.

Further, in the laser beam irradiation apparatus 100 of the present embodiment, the second movement is mainly transmitted. The device 106 performs scanning of the laser light, and the scanner 105 adjusts the region of the laser light irradiation position at which the second mobile device 106 cannot control the accuracy. Therefore, the laser light irradiation position can be controlled with good precision over a wide range as compared with the case where the laser scanning is performed only by one of the second moving device 106 or only the scanner 105.

However, in the present embodiment, the pedestal 101, the laser oscillator 102, the scanner 105, the illumination device 103, the imaging device 109, the first mobile device 104, the second mobile device 106, and the third mobile device 190 are included. The laser light irradiation device 100 will be described as an example, but is not limited thereto. For example, the laser light irradiation device may not include the imaging device 109 and the third mobile device 190, that is, the pedestal 101, the laser oscillator 102, the scanner 105, the illumination device 103, and the The structure of a mobile device 104 and a second mobile device 106.

Further, in the present embodiment, the laser light irradiation device is described as an example, but the invention is not limited thereto. For example, the pedestal including the pedestal holding the object to be held, the illuminating device that illuminates the object, the imaging device that photographs the object, the first moving device that relatively moves the pedestal and the illuminating device, and the relative movement of the pedestal and the photographic device The case of the detecting device of the second mobile device can also be applied to the present invention.

Further, the detecting device may be configured not to include the photographing device and the second moving device, that is, a configuration including the pedestal, the illuminating device, and the first moving device.

(The first variant of the pedestal)

Fig. 10 is a plan view showing a first modification of the pedestal according to the embodiment.

In the above-described embodiment, as shown in FIG. 4, the pedestal 101 has a plate piece 112 capable of adsorbing and holding the two target objects 110 as an example. On the other hand, as shown in Fig. 10, the pedestal 301 of the present modification has a plate piece 312 that sucks and holds one object object 310 (third object object). The size of the target object 310 of the present modification is larger than the size of the target object 110 of the above embodiment.

At the periphery of the adsorption surface 312s at the sheet 312 of the object object 310, A guide groove 317 having a rectangular frame shape is formed. The first opening 313a, the second opening 313b, the third opening 313c, and the fourth opening 313d are formed in the plate 312. The size and arrangement position of each of the openings (the first opening portion 313a to the third opening portion 313d) is adapted to the size of the object object 310.

With respect to the pedestal 301 of the present modification, even if the size of the target object 310 is changed, the target object 310 can be illuminated, and productivity can be suppressed from being lowered.

(Manufacturer of optical component bonding body)

Hereinafter, a film bonding system 1 for manufacturing an optical component bonding body according to an embodiment of the present invention will be described with reference to the drawings. In the film bonding system 1 of the present embodiment, the laser light irradiation device 100 constitutes a cutting device.

Fig. 11 is a schematic view showing a schematic configuration of a film bonding system 1 of the present embodiment.

In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, an antireflection film, or a light diffusing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel.

In the following description, the XYZ orthogonal coordinate system is set according to requirements, and the positional relationship of each component is described with reference to the XYZ orthogonal coordinate system. In the present embodiment, the X direction is the transport direction of the liquid crystal panel of the optical display member, and the Y direction is the direction orthogonal to the X direction in the plane of the liquid crystal panel (the width direction of the liquid crystal panel), and the Z direction is the X direction and the Y direction. The direction of the direction is orthogonal.

As shown in Fig. 11, the film bonding system 1 of the present embodiment is provided as a process for manufacturing a production line of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by the control unit 40 of the electronic control unit.

Fig. 12 is a plan view of the liquid crystal panel P as viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1. Between the second substrate P2 and the second substrate. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view, and a region located inside the outer periphery of the liquid crystal layer P3 in plan view is the display region P4.

Figure 13 is a cross-sectional view taken along line A-A of Figure 12. On the front/rear side of the liquid crystal panel P, the first optical component layer F1 and the second optical component layer F2 (refer to FIG. 11 and hereinafter collectively referred to as the optical component layer FX) are respectively bonded to each other. The first optical component F11 and the second optical component F12 (hereinafter, collectively referred to as optical component F1X). In the present embodiment, the first optical unit F11 and the second optical unit F12 which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P.

A frame portion G having a specific width such as a sealant that bonds the first and second substrates of the liquid crystal panel P is disposed on the outer side of the display region P4.

Further, the first layer F1m and the second layer sheet F2m (hereinafter, collectively referred to as a layer sheet FXm) which will be described later are formed by cutting the remaining portions on the outer side of the bonding surface to form the first optical component F11 and the second. Optical component F12. The bonding surface is described later.

Fig. 14 is a partial cross-sectional view of the optical component layer FX attached to the liquid crystal panel P. The optical component layer FX has a film-like optical module body F1a, an adhesive layer F2a provided on one side of the optical component body F1a (upper side of FIG. 14), and a layer detachable from the optical layer F2a. A separation sheet F3a on the one side of the module body F1a; and a surface protection film F4a laminated on the other side (the lower side of FIG. 14) of the optical unit body F1a. The optical module body F1a has a function of a polarizing plate across the entire area of the display area P4 of the liquid crystal panel P and its peripheral area. In addition, the hatching of each layer in Fig. 14 is omitted for the sake of convenience of the drawings.

The optical module main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a while the adhesive layer F2a is held on one surface thereof and separated from the separation layer F3a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer sheet F5.

The separation layer F3a protects the adhesive layer from the time of separation from the adhesive layer F2a. F2a and optical component body F1a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point. Further, the optical component layer FX may be a structure that does not include the surface protective film F4a, and the surface protective film F4a may be a structure that cannot be separated from the optical component body F1a.

The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and a bonding agent or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 are protective films that protect the polarizing mirror F6, for example.

Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of the present embodiment will be described in detail.

As shown in Fig. 11, the film bonding system 1 of the present embodiment includes the upstream side (+X direction side) of the liquid crystal panel P in the transport direction on the right side in the drawing, and the downstream side of the liquid crystal panel P in the transport direction on the left side in the drawing. The drive type roller conveyor 5 which conveys the liquid crystal panel P in the horizontal state until the (-X direction side).

The reversing device 15 described later on the roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7. In the upstream conveyor 6, the liquid crystal panel P is conveyed along the short side of the display area P4 as a conveyance direction. On the other hand, in the downstream side conveyor 7, the liquid crystal panel P is along the display The long side of the display area P4 is transported as a transport direction. The layer FXm (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length cut out from the strip-shaped optical component layer FX is bonded to the front/rear surface of the liquid crystal panel P.

Further, in the first adsorption device 11 to be described later, the upstream conveyor 6 is provided with a free roller conveyor 24 that is independent of the downstream side. On the other hand, in the second adsorption device 20 to be described later, the downstream conveyor 7 is provided with a free roller conveyor 24 that is independent of the downstream side.

The film bonding system 1 of the present embodiment includes a first adsorption device 11, a first dust collecting device 12, a first bonding device 13, a first detecting device 41, a first cutting device 31, and a reversing device 15. The second dust collecting device 16, the second bonding device 17, the second detecting device 42, the second cutting device 32, and the control unit 40.

The first adsorption device 11 adsorbs the liquid crystal panel P and transports it to the upstream conveyor 6, and performs position calibration (determination of position) of the liquid crystal panel P. The first adsorption device 11 includes a panel holding portion 11a, a calibration camera 11b, and a rail R.

The panel holding portion 11a is movable in the vertical direction and the horizontal direction, and holds the liquid crystal panel P of the stopper S on the downstream side by the upstream conveyor 6, and aligns the liquid crystal panel P. The panel holding portion 11a sucks and holds the upper surface of the liquid crystal panel P that is in contact with the stopper S by vacuum suction. The panel holding portion 11a moves on the rail R while the liquid crystal panel P is in the state of being sucked and held, and conveys the liquid crystal panel P. The panel holding portion 11a releases the suction holding when the conveyance is completed, and transmits the liquid crystal panel P to the free roller conveyor 24.

The calibration camera 11b captures a calibration mark or a front end shape of the liquid crystal panel P when the panel holding portion 11a is held in contact with the liquid crystal panel P of the stopper S. The photographic data of the calibration camera 11b is transmitted to the control unit 40, and the panel holding unit 11a is activated based on the photographic data, and the liquid crystal panel P is calibrated to the destination free roller conveyor 24. In other words, the liquid crystal panel P is opposed to the free roller conveyor 24, and the orthogonal direction of the conveyance direction and the conveyance direction are adjusted. The upper roller conveyer 24 is conveyed in a state in which the amount of deviation in the direction of rotation of the vertical axis of the liquid crystal panel P is rotated.

Here, the liquid crystal panel P conveyed along the rail R by the panel holding portion 11a is attached to the nip roller 23 together with the layer FXm in a state of being adsorbed to the suction tray 26.

The first dust collecting device 12 is disposed on the upstream side of the liquid crystal panel P of the nip roller 23 at the bonding position of the first bonding device 13. The first dust collecting device 12 performs static elimination and dust collection to remove dust around the liquid crystal panel P before being guided to the bonding position, in particular, dust on the lower side of the liquid crystal panel P.

The first bonding apparatus 13 is provided on the downstream side of the panel conveyance of the first adsorption device 11. The first bonding apparatus 13 is bonded to the lower side surface of the liquid crystal panel P that is guided to the bonding position, and is bonded to the bonding layer sheet F5 (corresponding to the first layer sheet F1m) of a specific size.

The first bonding apparatus 13 includes a conveying device 22 and a nip roller 23 .

The transport device 22 winds up the optical component layer FX from the roll drum R1 around which the optical component layer FX is wound, and conveys the optical component layer FX along the longitudinal direction of the optical component layer FX. The conveying device 22 conveys the bonding layer sheet F5 with the separation layer sheet F3a as a carrier. The conveying device 22 has a drum holding portion 22a, a plurality of guide rollers 22b, a half cutting device 22c, a blade 22d, and a winding portion 22e.

The roller holding portion 22a holds the roll drum R1 around which the strip-shaped optical component layer FX is wound, and winds up the optical component layer FX in the longitudinal direction of the optical component layer FX.

The plurality of guide rollers 22b guide the optical component layer FX unwound from the take-up reel R1 along a specific conveyance path to wind the optical component layer FX.

The half cutting device 22c applies a half cut to the optical component layer FX on the transport path.

The blade 22d winds the half-cut optical component layer FX at an acute angle so that the bonding layer sheet F5 is separated from the separation layer sheet F3a and the bonding layer sheet F5 is supplied to the bonding position.

The take-up portion 22e is a separation roller R2 that holds the separation layer sheet F3a that is individually wound after being passed through the blade edge 22d. Further, the separation roller R2 is a separate separation sheet F3a which is individually formed after being passed through the blade 22d.

The roller holding portion 22a located at the beginning of the conveying device 22 and the winding portion 22e located at the end of the conveying device 22 are driven in synchronization with each other, for example. Thereby, the roller holding portion 22a winds up the optical component layer FX in the conveyance direction of the optical component layer FX, and the winding portion 22e winds up the separation layer sheet F3a which passes through the blade edge 22d. In the conveyance device 22, the upstream side in the conveyance direction of the optical component layer FX (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the layer conveyance downstream side.

Each of the guide rollers 22b changes the traveling direction of the optical component layer FX during transport along the transport path, and at least a part of the plurality of guide rollers 22b is configured to adjust the tension of the optical component layer FX during transport.

Further, a tension roller (not shown) may be disposed between the roller holding portion 22a and the half cutting device 22c. The tension roller can store the optical component layer FX conveyed by the roller holding portion 22a in front of the half cutting device 22c while the optical module layer FX is being processed by the half cutting device 22c.

Fig. 15 is a schematic view showing the operation of the half cutting device 22c of the present embodiment.

As shown in Fig. 15, the half-cutting device 22c performs the thickness of the optical component layer FX after the optical component layer FX of a specific length is wound up across the entire width in the width direction orthogonal to the longitudinal direction of the optical component layer FX. One half of the direction is cut off by a half cut. The half cutting device 22c of the present embodiment moves toward the optical component layer FX from the side opposite to the surface on which the separation layer sheet F3a of the optical component layer FX is provided, and performs half cutting of the optical component layer FX. Further, the half cutting device 22c can be moved in a direction away from the opposite surface of the optical component layer FX after the half cutting.

The half cutting device 22c is set to be tensioned by the optical component layer FX, without causing the optical component layer FX (separating layer F3a) to be broken and broken (the separation layer having a specific thickness remains) F3a). In other words, it is set to adjust the front-rear position of the cutting blade of the half-cutting device 22c of the opposite optical component layer FX, and cut into a position near the interface between the adhesive layer F2 and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

In the half-cut optical component layer FX, the optical module body F1a and the surface protective film F4a are cut in the thickness direction to form cutting lines L1, L2 which span the entire width in the width direction of the optical component layer FX. The cutting lines L1, L2 are formed in a plurality of side by side in the longitudinal direction of the strip-shaped optical component layer FX. For example, in the case of a bonding step of transporting the liquid crystal panel P of the same size, a plurality of cutting lines L1, L2 are formed at equal intervals in the longitudinal direction of the optical component layer FX. The optical component layer FX divides a plurality of partitions in the longitudinal direction by a plurality of cutting lines L1, L2. In the longitudinal direction of the optical component layer FX, the partitions sandwiched by the adjacent pair of cutting lines L1, L2 are each one of the laminated layers F5. The layer FXm is set to protrude in size (beyond) outside the liquid crystal panel P. In other words, the shape of the layer FXm is larger than that of the liquid crystal panel P.

In Fig. 11, the blade 22d is disposed below the upstream conveyor 6, and is formed to extend at least the entire width of the optical module layer FX in the width direction. The side of the separation layer sheet F3a of the optical component layer FX after the half cutting is wound in a sliding contact with the blade edge 22d.

The blade 22d has a first surface that is disposed to face downward from the width direction of the optical module layer FX (the width direction of the upstream conveyor 6); and a second surface that is above the first surface from the optical component The width direction of the layer FX is arranged at an acute angle with respect to the first surface; and the front end portion is located at the intersection of the first surface and the second surface.

In the first bonding apparatus 13, the blade 22d is wound around the front end portion of the first optical component layer F1 at an acute angle. When the first optical component layer F1 is folded back at an acute angle due to the front end portion of the blade 22d, the layer sheet (the first layer sheet F1m) of the bonding layer sheet F5 is separated from the separation layer sheet F3a. The front end portion of the blade 22d is disposed on the downstream side of the panel conveyance close to the nip roller 23. The first layer sheet F1m separated from the separation layer sheet F3a by the blade edge 22d is superposed on the liquid crystal surface adsorbed to the first adsorption device 11 The lower side of the plate P is guided between the pair of bonding rolls 23a of the nip roller 23. The first layer sheet F1m has a size that protrudes outside the liquid crystal panel P. In other words, the outer shape of the first layer sheet F1m is larger than that of the liquid crystal panel P.

On the other hand, the separation layer sheet F3a separated from the bonding layer sheet F5 by the blade edge 22d faces the winding portion 22e. The winding unit 22e winds up the separated layer sheet F3a separated from the bonding layer sheet F5 and collects it.

The nip roller 23 causes the conveying device 22 to bond the first layer sheet F1m separated from the first optical unit layer F1 to the lower side surface of the liquid crystal panel P conveyed by the upstream side conveyor 6.

The nip roller 23 has a pair of bonding rolls 23a which are arranged in parallel with each other in the axial direction (the upper bonding roll 23a can move up and down). A predetermined gap is formed between the pair of bonding rolls 23a and 23a, and the bonding process of the first bonding apparatus 13 is performed in the gap.

The liquid crystal panel P and the first layer sheet F1m are superposed and introduced into the gap. The liquid crystal panel P and the first layer sheet F1m are pinched between the respective bonding drums 23a, and are sent to the downstream side of the panel conveyance of the upstream conveyor 6. In the present embodiment, the first layer sheet F1m can be bonded to the surface on the backlight side of the liquid crystal panel P by the nip roller 23 to form the first optical component bonding body PA1.

The first detecting device 41 is provided on the downstream side of the panel conveyance of the first bonding device 13. The first detecting device 41 detects the edge of the bonding surface of the liquid crystal panel P and the first layer sheet F1m (hereinafter referred to as the first bonding surface). The edge data detected by the first detecting device 41 is stored in a memory portion not shown in the drawing.

The cutting position of the first layer F1m is adjusted according to the detection result of the edge of the first bonding surface. The control unit 40 (refer to FIG. 11) obtains the edge data of the first bonding surface stored in the memory unit to determine the cutting position of the first layer F1m so that the first optical component F11 does not exceed the liquid crystal panel P. The size of the outer side (outside of the first bonding surface). The first cutting device 31 (cutting device) cuts the first layer sheet F1m at a cutting position determined by the control unit 40.

The first cutting device 31 is provided on the downstream side of the panel conveyance of the first detecting device 41. The first cutting device 31 performs laser cutting along the end edge to extend the first ply F1m (the remaining portion of the first ply F1m) from the first optical component bonding body PA1 beyond the outer portion of the first bonding surface. The cutting is performed to form an optical component (first optical component F11) corresponding to the size of the first bonding surface.

Here, "corresponding to the size of the first bonding surface" indicates the size of the outer shape of the first substrate P1. However, it is a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and includes a functional portion such as an electronic component mounting portion.

By the first cutting device 31, the remaining portion of the first layer sheet F1m is cut from the first optical unit bonding body PA1, and the first optical unit F11 is bonded to the surface of the backlight side of the liquid crystal panel P to form a second portion. The optical component is bonded to the body PA2. The remaining portion cut from the first layer sheet F1m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

The inversion device 15 reverses the front/back surface of the second optical component bonding body PA2 facing the upper side on the display surface side of the liquid crystal panel P, and causes the backlight side of the liquid crystal panel P to face the upper side, and the second bonding device 17 Perform calibration of the liquid crystal panel P.

The inverting device 15 has the same calibration function as the panel holding portion 11a of the first adsorption device 11. The reversing device 15 is provided with the same calibration camera 15c as the calibration camera 11b of the first adsorption device 11.

The inverting device 15 determines the width direction and the direction of rotation of the second optical component bonding body PA2 of the second bonding device 17 based on the optical axis direction inspection data stored in the control unit 40 and the imaging data of the calibration camera 15c. s position. In this state, the second optical component bonding body PA2 is guided to the bonding position of the second bonding device 17.

Since the second adsorption device 20 has the same configuration as that of the first adsorption device 11, the same components are denoted by the same reference numerals. The second adsorption device 20 adsorbs and transports the second optical component bonding body PA2 to the downstream side conveyor 7, and performs the second optical component bonding body PA2. Calibration (determination of position). The second adsorption device 20 includes a panel holding portion 11a, a calibration camera 11b, and a rail R.

The panel holding portion 11a is movable in the vertical direction and the horizontal direction, and holds the second optical component bonding body PA2 that is in contact with the downstream side stopper S by the downstream conveyor 7, and performs the second optical component bonding. Calibration of the fitted PA2. The panel holding portion 11a sucks and holds the upper surface of the second optical component bonding body PA2 that abuts against the stopper S by vacuum suction. The panel holding portion 11a moves on the rail R while the second optical unit bonding body PA2 is being sucked and held, and conveys the second optical unit bonding body PA2. The panel holding portion 11a releases the suction holding when the conveyance is completed, and transmits the second optical component bonding body PA2 to the free roller conveyor 24.

The calibration camera 11b picks up a calibration mark or a front end shape of the second optical component bonding body PA2 when the panel holding portion 11a is held in contact with the second optical component bonding body PA2 that abuts against the stopper S. The photographic data of the calibration camera 11b is transmitted to the control unit 40, and the panel holding unit 11a is actuated based on the photographic data, and the second optical unit bonding body PA2 is calibrated to the destination free roller conveyor 24. In other words, the second optical component bonding body PA2 is opposed to the free roller conveyor 24 in the direction in which the conveying direction is adjusted, the direction in which the conveying direction is orthogonal, and the amount of deviation in the direction of rotation about the vertical axis of the second optical component bonding body PA2. In this state, it is conveyed to the free roller conveyor 24.

The second dust collecting device 16 is provided on the upstream side in the conveying direction of the liquid crystal panel P with respect to the nip roller 23 at the bonding position of the second bonding device 17 . The second dust collecting device 16 performs static elimination and dust collection to remove dust around the second optical component bonding body PA2 before the bonding position, particularly the dust on the lower side.

The second bonding apparatus 17 is provided on the downstream side of the panel conveyance of the second dust collecting device 16. The second bonding apparatus 17 is bonded to the lower side surface of the second optical component bonding body PA2 that is guided to the bonding position, and is bonded to the bonding layer sheet F5 (corresponding to the second layer sheet F2m) of a specific size. The second bonding apparatus 17 includes the same conveying device 22 and the nip roller 23 as the first bonding device 13 .

The second optical component bonding body PA2 and the second layer sheet F2m are superposed and introduced into the gap between one of the nip rollers 23 and the bonding roller 23a (the bonding position of the second bonding device 17). The second layer F2m is a layer of the second optical component layer F2 having a larger size than the display region P4 of the liquid crystal panel P.

The second optical component bonding body PA2 and the second layer sheet F2m are pinched between the bonding rollers 23a, and are sent to the downstream side of the panel conveyance of the downstream conveyor 7. In the present embodiment, the second layer sheet F2m can be bonded to the surface on the display surface side of the liquid crystal panel P by the nip roller 23 (the first optical component F11 to which the second optical component bonding body PA2 is bonded) The opposite side of the face) to form the third optical component bonding body PA3.

The second detecting device 42 is provided on the downstream side of the panel conveyance of the second bonding device 17. The second detecting device 42 detects the edge of the bonding surface of the liquid crystal panel P and the second layer sheet F2m (hereinafter referred to as a second bonding surface). The edge data detected by the second detecting device 42 is stored in a memory portion not shown in the drawing.

The cutting position of the second layer F2m is adjusted according to the detection result of the edge of the second bonding surface. The control unit 40 (refer to FIG. 11) acquires the data of the edge of the second bonding surface stored in the memory unit to determine the cutting position of the second layer F2m so that the second optical component F12 does not exceed the liquid crystal panel P. The size of the outer side (outside of the second bonding surface). The second cutting device 32 cuts the second layer sheet F2m at the cutting position determined by the control unit 40.

The second cutting device 32 is provided on the downstream side of the panel conveyance of the second detecting device 42. The second cutting device 32 performs laser cutting along the edge of the second bonding surface. Thereby, the second ply F2m of the third optical component pasting body PA3 beyond the outer side of the second bonding face is cut to form an optical component (second optical component F12) corresponding to the size of the second bonding face. The remaining portion cut from the second layer sheet F2m is peeled off from the liquid crystal panel P by the peeling device omitted in the drawing and recovered.

The remaining portion of the second ply F2m is cut from the third optical component bonding body PA3 by the second cutting device 32 to form the fourth optical component bonding body PA4 (optical component bonding body). First The four optical component bonding body PA4 has a second optical component F12 that is bonded to the surface on the display surface side of the liquid crystal panel P, and a first optical component F11 that is bonded to the backlight side of the liquid crystal panel P.

Here, the first cutting device 31 and the second cutting device 32 are constituted by the above-described laser light irradiation device 100. The first cutting device 31 and the second cutting device 32 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the outer periphery of the bonding surface.

A bonding inspection device omitted in the drawings is provided on the downstream side of the panel conveyance of the second bonding apparatus 17. The bonding inspection device inspects the workpiece to which the film is bonded (the liquid crystal panel P) with an inspection device omitted in the drawing, for example, determines whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance range), etc. ). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

Further, in the present embodiment, the control unit 40 as an electronic control unit that integrally controls each part of the film bonding system 1 is included in a computer system. The computer system includes an arithmetic processing unit such as a central processing unit (CPU) and a memory unit such as a memory or a hard disk.

The control unit 40 of the present embodiment includes an interface that can communicate with an external device of the computer system. An input device capable of inputting an input signal can be connected to the control unit 40. The above input device includes an input device such as a keyboard or a mouse, or a communication device that can input data from an external device of the computer system. The control unit 40 may include a display device such as a liquid crystal display that displays the operation state of each part of the film bonding system 1, and may be connected to the display device.

An operating system (OS, operating system) that controls the computer system is installed in the memory unit of the control unit 40. At the memory unit of the control unit 40, the arithmetic processing unit controls each part of the film bonding system 1 to store a program for executing the process of accurately transporting the optical unit layer FX to each part of the film bonding system 1. Various pieces of information including a program stored in the memory unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may also include a control unit for executing each part of the film bonding system 1. A logic circuit such as an application specific integrated circuit (ASIC) that requires various processes.

The memory system includes: semiconductor memory such as random access memory (RAM), read only memory (ROM), or hard disk, CD-ROM read (CD-ROM) The concept of an external storage device such as a device or a disk type memory medium. In terms of functionality, the memory unit is configured to: store the first adsorption device 11, the first dust collection device 12, the first bonding device 13, the first detection device 41, the first cutting device 31, and the reverse The memory area of the program software of the control sequence of the operation of the rotating device 15, the second adsorption device 20, the second dust collecting device 16, the second bonding device 17, and the second detecting device 42; and other various memory regions.

Hereinafter, an example of a method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P will be described with reference to FIGS. 16A and 16B.

First, as shown in FIG. 16A, a plurality of checkpoints CP are set in the width direction of the optical component layer FX, and the optical axis direction of the optical component layer FX is detected at each checkpoint CP. The time at which the optical axis is detected may be the time when the roll drum R1 is manufactured, or may be the period before the half of the optical unit layer FX is unwound from the roll drum R1. The data in the optical axis direction of the optical component layer FX and the position of the optical component layer FX (the position in the longitudinal direction and the width direction of the optical component layer FX) are stored in association with the memory device omitted in the drawing.

The control unit 40 acquires the optical axis data (inspection data distributed in the in-plane of the optical axis) of each of the inspection points CP from the memory device to detect the optical component layer FX (the region divided by the transverse line CL) that cuts out the portion of the layer FXm. The average optical axis direction.

For example, as shown in FIG. 16B, the angle (offset angle) between the optical axis direction and the edge line EL of the optical component layer FX is detected at the checkpoint CP each time to offset the maximum angle (maximum offset angle). As θmax, when the minimum angle (minimum offset angle) is θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Further, the average offset angle θmid direction of the edge line EL of the optical component layer FX is detected as the average optical axis direction of the optical component layer FX. Further, the offset angle is calculated, for example, by the edge line EL of the optical component layer FX, the counterclockwise direction being a positive angle, and the clockwise direction being a negative angle.

Moreover, the average optical axis direction of the optical component layer FX detected by the above method is at a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P, and the bonding position of the layer FXm with respect to the liquid crystal panel P is determined. (relatively fitting position). For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis direction of the optical component layer FX is longer than the display region P4. The layer FXm is bonded to the liquid crystal panel P with the side or the short side at 90°.

The cutting device (the first cutting device 31 and the second cutting device 32) detects the outer peripheral edge of the display region P4 of the liquid crystal panel P by a detecting means such as a camera, and cuts the bonding continuously along the outer peripheral edge of the bonding surface. To the layer FXm of the liquid crystal panel P. The outer edge of the bonding surface is detected by photographing the edge of the bonding surface.

In the present embodiment, the laser cutting is performed by each of the cutting devices (the first cutting device 31 and the second cutting device 32) along the outer periphery of the bonding surface.

The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than the vibration amplitude (tolerance) of the cutting blade. Therefore, in the present embodiment, it is easier to cut along the outer periphery of the bonding surface than in the case where the optical module layer FX is cut by the cutting blade, and the liquid crystal panel P can be downsized and/or displayed. The size of the area P4 is large. This can be effectively applied to a high-performance mobile device that requires a display screen to be enlarged under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.

Moreover, in the case where the layer on which the optical component layer FX is integrated in the display region P4 of the liquid crystal panel P is cut and then bonded to the liquid crystal panel P, the dimensional tolerances of the layer and the liquid crystal panel P, and the like The dimensional tolerances of the relative fit positions are superimposed. Therefore, it is difficult to narrow the width of the frame portion G of the liquid crystal panel P (so that the display region is difficult to expand).

On the other hand, the layer FXm whose size exceeds the outer side of the liquid crystal panel P (the outer shape is larger than the liquid crystal panel P) is cut out from the optical component layer FX, and the cut layer FXm is attached to the liquid crystal panel P, In the case where the bonding surface is cut, only the vibration tolerance of the cutting line must be considered. Therefore, the tolerance (±0.1 mm or less) of the width of the frame portion G can be reduced. This also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).

Further, since the layer sheet FXm is cut by a laser of a non-profit blade, stress is not applied to the liquid crystal panel P at the time of cutting, so that cracks or cracks are less likely to occur at the edge of the substrate of the liquid crystal panel P. Therefore, the durability of the optical component bonding body to thermal cycling or the like can be improved. Similarly, since the liquid crystal panel P is non-contact-processed, damage to the electronic component mounting portion P5 is also small.

Fig. 17 is a view showing a rectangular scanning using laser light on the layer FXm when the laser light emitting device 100 shown in Fig. 1 is used as the cutting device to cut the layer FXm into a specific size optical module F1X. Schematic diagram of the control method.

Further, in Fig. 17, the symbol Tr indicates the movement trajectory of the laser light (a specific trajectory. Hereinafter, it is referred to as a laser light trajectory). The symbol Tr1 is a trajectory (hereinafter, referred to as a light source movement trajectory) in which the movement trajectory when the pedestal 101 and the scanner 105 are relatively moved is projected on the layer FXm. The light source moving locus Tr1 is such that the four corner portions of the laser light moving locus Tr having a rectangular shape have a curved shape. Further, the symbol SA1 is a linear section other than the corner of the laser light trajectory Tr, and the symbol SA2 is a curved section of the corner of the laser light trajectory Tr. When the symbol Tr2 indicates that the scanner 105 relatively moves on the light source movement trajectory Tr1, the first irradiation position adjusting means 151 and the second irradiation position adjusting means 154 cause the laser light irradiation position to be orthogonal to the light source movement trajectory Tr1. The degree of offset (whether it has been adjusted) curve (hereinafter referred to as the adjustment curve). The amount of deviation (adjustment amount) of the laser irradiation position is expressed as the distance between the adjustment curve Tr2 of the orthogonal direction of the light source movement trajectory Tr1 and the laser light movement trajectory Tr.

As shown in Fig. 17, the light source movement trajectory Tr1 is a slightly rectangular shape in which the corner portion is curved. The movement track. The light source movement trajectory Tr1 and the laser light movement trajectory Tr are substantially identical, and only the shape of the narrow portion at the corner portion is different. When the light source movement trajectory Tr1 has a rectangular outer shape, the scanning speed of the scanner 105 at the rectangular corner portion becomes slow, and the corner portion may be expanded or undulated due to the heat of the laser light. Therefore, in Fig. 17, the corner portion of the light source moving locus Tr1 is curved, and the moving speed of the scanner 105 is approximately constant as a whole of the light source moving locus Tr1.

When the scanner 105 is moved in the linear section SA1, since the light source movement trajectory Tr1 of the control device 107 coincides with the laser light movement trajectory Tr, the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 are not used. The laser light irradiation position is adjusted, and the laser light is directly irradiated from the scanner 105 to the layer FXm. On the other hand, when the scanner 105 moves in the bending section SA2, since the light source movement trajectory Tr1 does not coincide with the laser light movement trajectory Tr, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 control the lightning. The light irradiation position is set, and the laser light irradiation position is disposed on the laser light movement track Tr. For example, when the scanner 105 moves to the position indicated by the symbol M1, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 cause the laser light to be irradiated in the orthogonal direction N1 of the light source moving locus Tr1. The upper side is offset by the distance W1. The distance W2 between the adjustment curve Tr2 and the laser light moving locus Tr in the orthogonal direction N1 of the W1 system and the light source movement locus Tr1 is the same. The light source movement trajectory Tr1 is disposed inside the laser light movement trajectory Tr, but the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 can shift the laser light irradiation position to the outside of the laser light movement trajectory Tr, so that These deviations are pinned so that the laser light irradiation position is placed on the laser light trajectory Tr.

As described above, according to the film bonding system 1 of the present embodiment, since the first cutting device 31 and the second cutting device 32 are constituted by the above-described laser beam irradiation device, the layer sheet can be sharply cut (the first layer sheet) F1m and the second layer F2m) can suppress the problem of low cutting quality.

Further, the second mobile device 106 and the scanner 105 can be controlled by the control of the control device 107 to draw a specific trajectory (laser light moving trajectory Tr) at the layer FXm. At the knot In the configuration, the laser light irradiation interval adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only at the narrow bending portion SA2. In addition, the wider linear section SA1 scans the layer FXm with laser light by the movement of the pedestal 101 by the second moving means 106. In the present embodiment, the laser beam scanning is mainly performed by the second moving device 106, and the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 are only used to adjust the precision of the second mobile device 106 that cannot be controlled well. The area where the laser light illuminates the position. Therefore, the laser light irradiation position can be controlled with good precision over a wide range as compared with the case where the laser scanning is performed only by the second moving device 106 or only the scanner 105.

Further, in the present embodiment, the layer sheet (the first layer sheet F1m and the second layer sheet F2m) having a size beyond the outer side of the liquid crystal panel P is bonded to the liquid crystal panel P, and then the layer sheet is cut (the first layer sheet F1m, the first layer) The remaining part of the two-layer film F2m). Thereby, an optical component (the first optical component F11 and the second optical component F12) corresponding to the size of the bonding surface can be formed on the surface of the liquid crystal panel P. Therefore, the optical components (the first optical component F11 and the second optical component F12) can be provided with good precision up to the edge of the bonding surface, and the frame portion G outside the display region P4 can be reduced, and the display region can be enlarged and the device can be miniaturized. .

Further, in the present embodiment, the layer sheets (the first layer sheet F1m and the second layer sheet F2m) having a size exceeding the outer side of the liquid crystal panel P (the outer diameter is larger than the outer diameter of the liquid crystal panel P) are bonded to the liquid crystal panel P. . Thereby, even if the optical axis direction changes due to the position of the layer sheets (the first layer sheet F1m and the second layer sheet F2m), the liquid crystal panel P can be aligned and bonded in accordance with the optical axis direction. Therefore, the accuracy of the optical axis direction of the optical components (the first optical component F11 and the second optical component F12) with respect to the liquid crystal panel P can be improved, and the color degree and contrast of the optical display device can be improved.

The cutting device (the first cutting device 31 and the second cutting device 32) cuts the layer (the first layer F1m and the second layer F2m) by laser, and cuts the layer with a sharp edge (first In the case of the layer F1m and the second layer sheet F2m), stress is not applied to the liquid crystal panel P, so that cracks or cracks are less likely to occur, and the stability and durability of the liquid crystal panel P can be obtained.

Further, in the present embodiment, the configuration in which the laser beam is irradiated onto the target object and the specific processing is performed is described as a configuration in which the layer sheet is cut, but the invention is not limited thereto. For example, the layer may be divided into at least two layers, a layer that penetrates the layer by a slit, and a groove portion (cut) formed at a predetermined depth in the layer. More specifically, in the embodiment, for example, cutting (cutting), half cutting, marking processing, and the like of the end portions of the plies are performed.

Further, in the present embodiment, the case where the laser light drawing trajectory irradiated by the laser beam irradiation device has a rectangular outer shape (square shape) in plan view is described, but the present invention is not limited thereto. For example, the laser light trajectory illuminated by the laser light irradiation device may have a triangular shape in plan view, and may also have a polygonal shape above a pentagon shape in plan view. Further, the present invention is not limited thereto, and the star shape, the geometric shape, and the like may be used in the plan view. These depicted traces can be adapted to the present invention.

Further, in the present embodiment, the optical component layer FX is unwound from the roll drum, and the layer FXm having a size beyond the outer side of the liquid crystal panel P is bonded to the liquid crystal panel P, and the corresponding layer is cut out from the layer FXm. The optical module F1X of the size of the bonding surface of the liquid crystal panel P is described, but is not limited thereto. For example, a case where a single-piece optical film slice cut out beyond the outer dimension of the liquid crystal panel P is bonded to the liquid crystal panel without using a roll cylinder can also be applied to the present invention.

Although the preferred embodiments of the present embodiment have been described above with reference to the attached drawings, the present invention is not limited to the examples. The respective shapes, combinations, and the like of the respective components shown in the above examples are merely examples, and various modifications can be made according to design requirements and the like without departing from the gist of the invention.

100‧‧‧Laser light irradiation device

101‧‧‧ pedestal

101s‧‧‧ Keep face

101s1‧‧‧First holding surface

101s2‧‧‧second holding surface

102‧‧‧Laser light oscillator

103‧‧‧Lighting device

104‧‧‧First mobile device

105‧‧ ‧Scanner

109‧‧‧Photographing device

110‧‧‧First object

113‧‧‧ openings

142‧‧‧First rail

143‧‧‧First linear motor

190‧‧‧ third mobile device

Claims (10)

A laser light irradiation device includes: a pedestal having a holding surface for holding a plate-shaped object; a laser oscillator for oscillating laser light; and a scanner for aligning the laser light in a parallel plane of the holding surface Performing a two-dimensional scan; illuminating the device to illuminate the object; the first moving device moves the pedestal relative to the illuminating device; and the second moving device aligning the pedestal with the illuminator mobile. The laser light irradiation device according to claim 1, further comprising: a photographing device that photographs the object; and a third moving device that moves the pedestal relative to the photographing device. The laser light irradiation device according to the first or second aspect of the invention, wherein the object system is a rectangle including four corners as viewed from a normal direction of the holding surface; the pedestal corresponds to A through opening is formed at each corner of the target object, and the illuminating device is disposed facing the opposite side of the holding surface of the pedestal, and each of the corners is illuminated through the through opening. The laser light irradiation device of claim 3, wherein when the laser light oscillates the laser light, the first moving device can cause the illumination device to exit to a normal direction from the holding surface It is observed that it does not overlap the through opening. The laser light irradiation device according to any one of the preceding claims, wherein the holding surface has a first holding surface and a second holding surface disposed adjacent to the first holding surface; the illumination The device is positioned in an abutting extension direction adjacent to the first holding surface and the second holding surface; and the first moving device moves the lighting device in a vertical direction of the abutting direction. The laser light irradiation device of claim 5, wherein the illumination device has: a first illumination device located in the adjacent extension direction; and a second illumination device disposed in a vertical direction of the adjacent direction The upper portion is disposed side by side with the first illumination device and is located in the abutting extension direction. The laser light irradiation device according to any one of claims 1 to 6, further comprising a collecting lens for collecting the laser light emitted from the scanner toward the holding surface. An optical component bonding body manufacturing apparatus comprising: an optical display member and an optical component bonded to the optical display component, the manufacturing apparatus comprising: a bonding device, wherein the outer diameter is larger than a shape of the optical display component Bonding to the optical display member such that the layer protrudes to the outside of the bonding surface of the layer and the optical display member to form a layered laminate; and the cutting device is along the edge of the bonding surface. Cutting the protruding portion of the layer from the layer laminate to form an optical component corresponding to the size of the bonding surface; wherein the cutting device is obtained by any one of items 1 to 7 of the patent application scope The laser light irradiation device of the item is configured to cut the protruding portion of the layer from the layered laminated body of the target object by the laser light emitted from the laser light irradiation device. A detecting device includes a pedestal for holding a plate-shaped object, an illuminating device for illuminating the object, and a first moving device for relatively moving the pedestal and the illuminating device. The detecting device according to claim 9, further comprising: a photographing device that photographs the object; and a second moving device that moves the pedestal relative to the photographing device.