TWI523721B - Laser light irradiation apparatus, manufacturing apparatus of optical display device, laser light irradiation method, and manufacturing method of optical display device - Google Patents

Description

Laser light irradiation device, optical component bonding body manufacturing device, laser light irradiation method, and optical component bonding body manufacturing method

The present invention relates to a laser light irradiation device, an optical component bonding body manufacturing apparatus, a laser beam irradiation method, and a method of manufacturing an optical component bonding body.

Conventionally, there has been known a laser beam irradiation apparatus that irradiates laser light onto an object to be irradiated and performs specified processing. In the method of manufacturing a polarizing film described in Japanese Laid-Open Patent Publication No. 2003-255132, the like.

In order to use laser light to process in any area, in addition to precisely controlling the irradiation position of the laser light, it is necessary to expand the processing area. There are known nozzle methods and scanner methods for processing by laser light, but each method has advantages and disadvantages.

For example, the nozzle method is a method of fixing a laser light source, moving the object to be irradiated by the XY table, or moving the object to be irradiated, and moving the laser light source. In the nozzle method, when laser light is to be scanned in a rectangular shape, the scanning speed is slow in the corner portion of the rectangle, causing the corner portion to expand or undulate due to thermal deformation. The scanning method is a method of scanning laser light by two axes such as a current mirror (Galvanomirror), and since the range that can be scanned by a current mirror or the like is very narrow, it is impossible to perform precise processing in a wide range.

The object of the present invention is to provide a laser light irradiation device and a laser light irradiation method capable of accurately irradiating laser light over a wide range, and using the laser light irradiation device and laser light The manufacturing apparatus of the optical component bonding body of the irradiation method, and the manufacturing method of the optical component bonding body.

In order to achieve the above object, the present invention has the following aspects.

A laser light irradiation apparatus according to a first aspect of the present invention is configured to irradiate laser light onto an object to be irradiated, and includes: a table having a holding surface for holding the object to be irradiated; and a scanner capable of being in the foregoing Two-axis scanning of the laser light in a plane in which the faces are parallel; and a moving device that relatively moves the aforementioned table and the aforementioned scanner.

In the laser light irradiation apparatus of the first aspect of the present invention, the scanner preferably includes: a laser oscillating machine that oscillates the laser light; and a scanning element that can scan two axes in a plane parallel to the holding surface. a laser light that is oscillated by the laser oscillating machine; and a condensing lens that condenses the laser light emitted from the scanning element toward the object to be irradiated.

An apparatus for manufacturing an optical component bonding body according to a second aspect of the present invention is characterized in that an optical component is bonded to an optical display component, and a bonding device is attached to the optical display component to be bonded to the optical display component. a large area of the optical component sheet is formed to form a bonding sheet; and a cutting device that cuts away the opposite portion of the optical member sheet from the display region and the remaining portion on the outer side of the opposite portion. The optical member having a size corresponding to the display region is cut out from the optical member sheet, and the optical member assembly including the optical display member and the optical member superposed on the optical display member is cut out from the bonded sheet According to the laser light irradiation device of the first aspect described above, the optical component sheet of the object to be irradiated is cut by the laser light irradiated from the laser beam irradiation device.

A laser light irradiation method according to a third aspect of the present invention is directed to irradiating laser light onto an object to be irradiated, and comprising the steps of: holding the object to be irradiated on a holding surface of the table (first step); The table moves relative to the scanner, and the laser beam of the two-axis scanning is irradiated onto the object to be irradiated from the scanner in a plane parallel to the holding surface (second step).

A method of producing an optical component bonding body according to a fourth aspect of the present invention is the method of bonding an optical component to an optical display component, and comprising the step of bonding the optical display component Forming a bonding sheet (first step) than an optical component sheet having a larger display area of the optical display component; and cutting away from an opposite portion of the optical component sheet opposite to the display region and on an outer side of the opposite portion In the remaining portion, the optical member having the size corresponding to the display region is cut out from the optical member sheet, and the optical member including the optical display member and the optical member overlapping the optical display member is cut out from the bonded sheet. The optical member material is bonded to the optical member, and the optical member sheet of the object to be irradiated is cut by laser light using the laser light irradiation method of the third aspect (second step).

The present invention can provide a laser light irradiation device that can irradiate laser light over a wide range of precision, a manufacturing device of an optical component bonding body, a laser light irradiation method, and a method of manufacturing an optical component bonding body.

1‧‧‧Film bonding system

5‧‧‧Roller conveyor

11‧‧‧First aligning device

12‧‧‧First bonding device

12a‧‧‧Transportation device

12b‧‧‧ pinch roller

12c‧‧‧ Keeping Department

12d‧‧‧Recycling Department

13‧‧‧First cutting device

14‧‧‧Second alignment device

15‧‧‧Second laminating device

15a‧‧‧Transportation device

15b‧‧‧ pinch roller

15c‧‧‧ Keeping Department

15d‧‧Recycling Department

16‧‧‧Second cutting device

16a‧‧‧ camera

17‧‧‧ third alignment device

18‧‧‧ Third bonding device

18a‧‧‧Transportation device

18b‧‧‧ pinch roller

18c‧‧‧keeping department

18d‧‧Recycling Department

19‧‧‧ Third cutting device

19a‧‧‧ camera

20‧‧‧Control device

20a‧‧‧Operation Processing Department

20b‧‧‧Memory Department

30‧‧‧Laser light irradiation device

31‧‧‧Workbench

31a‧‧‧ Keep face

32‧‧‧Mobile devices

33‧‧‧Control device

160‧‧‧Laser light oscillating machine

161‧‧‧First illumination position adjustment device

161a‧‧‧Mirror

161b‧‧‧Actuator

161c‧‧‧Rotary axis

162‧‧‧second illumination position adjustment device

162a‧‧‧Mirror

162b‧‧‧Actuator

162c‧‧‧Rotary axis

163‧‧‧Condensing lens

F1, F2, F3, FX‧‧‧ optical parts

F11, F12, F13, FS‧‧‧ optical parts

F21, F22, F23‧‧‧ affixed piece

F1S‧‧‧ single film

G‧‧‧ Frontal

N1‧‧ Direction

P‧‧‧ LCD panel

P4‧‧‧ display area

P5‧‧‧Electrical Parts Installation Department

P11‧‧‧First single-sided fitting panel

P12‧‧‧Second single-sided fitting panel

P13‧‧‧Two-sided fitting panel

PX‧‧‧Optical display parts

Starting point of pt1‧‧

End point of pt2‧‧

Pf‧‧‧ protective film

Qa, Qb, Qc‧‧‧ Spotlights

R1‧‧‧First Roll Paper Roller

R2‧‧‧second roll paper roller

R3‧‧‧third roll paper roller

SA1‧‧‧ straight section

SA2‧‧‧Bending section

Tr‧‧‧Laser light movement track

Tr1‧‧‧Light source movement track

Tr2‧‧‧ adjustment curve

T‧‧‧ cut end

V1‧‧‧ first direction (X direction)

V2‧‧‧second direction (Y direction)

V3‧‧‧ third direction (Z direction)

W1, W2‧‧‧ distance

The first drawing is a schematic view showing an embodiment of a manufacturing apparatus of an optical component bonding body of the present invention.

The second drawing is a perspective view of a laser beam irradiation apparatus according to an embodiment of the apparatus for manufacturing an optical component material according to the present invention.

Fig. 3 is a perspective view showing the internal structure of a second cutting device according to an embodiment of the apparatus for manufacturing an optical component bonded body of the present invention.

Fig. 4 is a perspective view showing the vicinity of a second bonding apparatus according to an embodiment of the apparatus for manufacturing an optical component bonding material according to the present invention.

Fig. 5 is a cross-sectional view showing a first bonding sheet according to an embodiment of the apparatus for manufacturing an optical component bonded body of the present invention.

Fig. 6 is a cross-sectional view showing a second bonding sheet in a second cutting device according to an embodiment of the apparatus for manufacturing an optical component material according to the present invention.

Fig. 7 is a plan view showing a third bonding sheet in a third cutting device according to an embodiment of the apparatus for manufacturing an optical component bonded body of the present invention.

The eighth figure is a cross-sectional view of the A-A of the seventh figure.

Fig. 9 is a cross-sectional view showing a double-sided bonding panel of the manufacturing apparatus of the optical component bonding body of the present invention.

The tenth figure shows a cross-sectional view of the cut end formed by the laser attached to the optical component sheet of the liquid crystal panel.

The eleventh figure shows a cross-sectional view of the cut end formed by the laser of the optical component sheet.

Fig. 12 is a flow chart showing an embodiment of the laser light irradiation method of the present invention.

Fig. 13 is a view showing a control method for depicting a desired trajectory of laser light in an embodiment of the laser light irradiation method of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

In addition, in all of the following drawings, in order to form each component in the extent that the pattern is recognizable, the size and ratio of each component are appropriately changed from the actual one. In the following description and the drawings, the same or equivalent elements are denoted by the same reference numerals, and the description thereof will not be repeated.

In the following description, the XYZ orthogonal coordinate system is used as needed, and the positional relationship of each member is explained with reference to the XYZ orthogonal coordinate system. In the present embodiment, the width direction of the optical display component (liquid crystal panel) is set to the X direction, and the direction orthogonal to the X direction (the conveyance direction of the liquid crystal panel) in the plane of the liquid crystal panel is set to the Y direction, and X is The direction orthogonal to the direction and the Y direction is set to the Z direction.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a production system of an optical display device is exemplified as a manufacturing apparatus of an optical component bonding body, and a film bonding system constituting one part of a production system will be described.

The first figure shows a schematic configuration of a film bonding system 1 (manufacturing device for an optical component bonding body) of the present embodiment. The film bonding system 1 is, for example, a panel-shaped optical display member of a liquid crystal panel or an organic EL panel, and is bonded to a film-shaped optical member of a polarizing film, a retardation film, or a brightness-increasing film. The film bonding system 1 manufactures an optical member bonding body including the optical display part and the optical member. The film bonding system 1 uses the liquid crystal panel P as the aforementioned light Learn to display parts. Each part of the film bonding system 1 is controlled by a control device 20 as an electronic control unit.

The film bonding system 1 conveys the liquid crystal panel P from the start position to the end position of the bonding process, for example, by using the driving roller conveyor 5, and sequentially performs the specified processing on the liquid crystal panel P. The liquid crystal panel P is conveyed on the roller conveyor 5 in a state where the front and back surfaces thereof are horizontal.

In the left side (the -Y direction side) of the drawing, the upstream side of the conveyance direction of the liquid crystal panel P (hereinafter referred to as the panel conveyance upstream side) is displayed, and the right side (+Y direction side) in the figure shows the downstream side of the conveyance direction of the liquid crystal panel P (below) Called the downstream side of the panel handling).

As shown in the seventh figure, the liquid crystal panel P is formed in a rectangular shape in plan view, and has a display region P4 having a shape other than the outer peripheral edge on the inner side of the predetermined width than the outer peripheral edge thereof. The liquid crystal panel P is conveyed on the upstream side of the panel conveyance of the second alignment device 14 to be described later, and the short side of the display region P4 is conveyed substantially in the direction of the conveyance direction, and is conveyed downstream of the panel conveyance of the second alignment device 14 On the side, the long side of the display region P4 is conveyed in a direction substantially along the conveyance direction.

The first optical member sheet F1 (optical member sheet), the second optical member sheet F2 (optical member sheet), and the third optical member sheet F3 are formed in a strip shape from the front surface and the back surface of the liquid crystal panel P. (Optical member sheet) The first optical member F11 (optical member), the second optical member F12 (optical member), and the third optical member F13 (optical member) are cut. As shown in the ninth embodiment, in the present embodiment, the first optical member F11 and the third optical member F13 of the polarizing film are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P. The second optical member F12 of the brightness enhancement film is further bonded to the first optical member F11 on the surface on the backlight side of the liquid crystal panel P.

As shown in the first figure, the film bonding system 1 transports the liquid crystal panel P from the upstream process to the panel conveyance upstream side of the roller conveyor 5. The film bonding system 1 includes a first alignment device 11 , a first bonding device 12 (a bonding device), a first cutting device 13 , a second alignment device 14 , and a second bonding device 15 (a bonding device) The second cutting device 16 (scanner), the third alignment device 17, the third bonding device 18 (bonding device), and the third cutting device 19 (scanner).

The first alignment device 11 holds the liquid crystal panel P and is freely transported in the vertical direction (Z direction) and the horizontal direction (XY direction). The first alignment device 11 has, for example, a photographing liquid crystal surface The panel of the panel P carries one of the upstream side and the downstream side end to the camera. The camera data of the camera is transmitted to the control device 20. The control device 20 operates the first alignment device 11 in accordance with the aforementioned image data and inspection data in the optical axis direction stored in advance. In addition, the second aligning device 14 and the third aligning device 17 also have the aforementioned camera, and the camera data of the camera is used for alignment.

The first alignment device 11 performs alignment of the liquid crystal panel P with the first bonding device 12 by the control of the control device 20. At this time, the liquid crystal panel P is formed in a horizontal direction (X direction) orthogonal to the conveyance direction (Y direction) (hereinafter referred to as a component width direction), and a rotation direction around the vertical axis (around the Z axis) (below) The positioning is referred to as the direction of rotation. In this state, the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.

The first bonding device 12 is disposed on the downstream side of the panel transportation than the first alignment device 11. The first bonding apparatus 12 is attached to the lower surface of the first optical component sheet F1 that is introduced into the bonding position, and is attached to the upper surface (backlight side) of the liquid crystal panel P below it.

The first bonding apparatus 12 includes a conveying device 12a and a nip roller 12b. The conveying device 12a winds up the first optical component sheet F1 from the first paper roll R1 wound around the first optical component sheet F1, and conveys the first optical component sheet F1 along its longitudinal direction. The nip roller 12b is attached to the upper surface of the liquid crystal panel P conveyed by the roller conveyor 5 on the lower surface of the first optical component sheet F1 conveyed by the conveyance device 12a.

The conveying device 12a has a holding portion 12c and a collecting portion 12d. The holding portion 12c holds the first paper roll R1 around which the first optical member sheet F1 is wound, and repeatedly conveys the first optical member sheet F1 along the longitudinal direction thereof. The collection unit 12d collects the protective film pf which is superimposed on the upper surface of the first optical component sheet F1 and is conveyed back together with the first optical component sheet F1 on the downstream side of the panel conveyance of the first bonding apparatus 12. The conveying device 12a sets the first optical component sheet so that the bonding surface of the first optical component sheet F1 and the first optical component sheet F1 of the liquid crystal panel P face downward, at the bonding position of the first bonding apparatus 12 The transport path of F1.

The nip roller 12b has a pair of bonding rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rolls, and the gap becomes the bonding position of the first bonding apparatus 12. The liquid crystal panel P and the first optical component sheet F1 are superimposed and introduced into the gap. The liquid crystal panel P and the first optical component sheet F1 are sandwiched between the bonding rollers and sent to the downstream side of the panel conveyance. Thereby, forming a predetermined interval, and continuously bonding the plurality of liquid crystal panels P to the first of the strips The first bonding sheet F21 (bonding sheet) on the lower surface of the optical component sheet F1.

The first cutting device 13 is located on the downstream side of the panel conveyance than the collecting portion 12d. The first cutting device 13 forms a single piece F1S larger than the display area P4 (this embodiment is larger than the liquid crystal panel P) in order to cut the first optical component sheet F1 of the first bonding sheet F21 (refer to the sixth drawing). On the other hand, the designated portion of the first optical component sheet F1 (between the liquid crystal panels P arranged in the conveyance direction) is cut at a full width in the width direction of the part. Further, as the first cutting device 13, it is possible to use either a cutting blade or a laser cutter. By the cutting, the first single-sided bonding panel P11 (first optical component bonding body) in which the single piece F1S larger than the display region P4 is bonded to the upper surface of the liquid crystal panel P is formed.

The second alignment device 14 is provided on the downstream side of the panel conveyance than the first bonding device 12 and the first cutting device 13. The second alignment device 14 holds, for example, the first single-sided bonding panel P11 on the roller conveyor 5 so as to be rotated by 90° around the vertical axis. Thereby, the first single-sided bonding panel P11 conveyed substantially in parallel with the short side of the display region P4 is conveyed in a direction substantially parallel to the long side of the display region P4. Further, the above-described rotation is formed in the optical axis direction of the first optical component sheet F1, and is disposed at right angles to the optical axis direction of the other optical component sheet of the liquid crystal panel P.

The second alignment device 14 performs the same alignment as the first alignment device 11 described above. That is, the second alignment device 14 performs the first single-sided bonding panel P11 on the second bonding device 15 in the width direction of the component according to the inspection data stored in the optical axis direction of the control device 20 and the image data of the camera. Positioning and positioning in the direction of rotation. In this state, the first single-sided bonding panel P11 is introduced into the bonding position of the second bonding apparatus 15.

The second bonding device 15 is provided on the downstream side of the panel transportation than the second alignment device 14. The second bonding apparatus 15 is attached to the lower surface of the first one-side bonding panel P11 (the backlight side of the liquid crystal panel P) on the lower surface of the second optical component sheet F2 that is introduced into the bonding position.

The second bonding apparatus 15 includes a conveying device 15a and a nip roller 15b. The conveying device 15a winds up the second optical component sheet F2 from the second paper roll R2 wound around the second optical component sheet F2, and conveys the second optical component sheet F2 along the longitudinal direction thereof. The nip roller 15b is bonded to the upper surface of the first single-sided bonding panel P11 conveyed by the roller conveyor 5 on the lower surface of the second optical component sheet F2 conveyed by the conveying device 15a.

The conveying device 15a has a holding portion 15c and a collecting portion 15d. Holding portion 15c

The second paper roll R2 wound around the second optical component sheet F2 is held, and the second optical component sheet F2 is repeatedly fed along the longitudinal direction thereof. The recovery unit 15d collects the remaining portion of the second optical component sheet F2 that has passed through the second cutting device 16. At the bonding position of the second bonding apparatus 15, the conveying device 15a is set such that the bonding surface of the second optical component sheet F2 and the second optical component sheet F2 of the first single-sided bonding panel P11 are directed downward. The conveyance path of the second optical component sheet F2.

The nip roller 15b has a pair of bonding rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rolls, and the gap becomes the bonding position of the second bonding apparatus 15. The first single-sided bonding panel P11 and the second optical component sheet F2 are superposed and introduced into the gap. The first single-sided bonding panel P11 and the second optical component sheet F2 are sandwiched between the bonding rollers and sent to the downstream side of the panel conveyance. Thereby, a plurality of first single-sided bonding panels P11 are continuously bonded to the second bonding sheet F22 (bonding sheet) on the lower surface of the long second optical component sheet F2 at predetermined intervals.

The second cutting device 16 is located on the downstream side of the panel conveyance from the pinch roller 15b. The second cutting device 16 simultaneously cuts the single optical sheet F1 of the second optical component sheet F2 and the first optical component sheet F1 attached to the lower surface thereof (see FIG. 4). The second cutting device 16 cuts the single piece F1S of the second optical component sheet F2 and the first optical component sheet F1 endlessly along the outer periphery of the display region P4 (this embodiment is along the outer periphery of the liquid crystal panel P). . By bonding the optical component sheets F1 and F2 to the liquid crystal panel P and dicing them together, the accuracy of the optical axis directions of the optical component sheets F1 and F2 is improved, and the optical axis directions between the optical component sheets F1 and F2 are not deviated. And simplifies the cutting of the first cutting device 13.

In the present embodiment, the second optical component sheet F2 and the single sheet F1S are simultaneously cut, but the present invention is not limited to the above embodiment. For example, the present invention can be applied even in the case where only the second optical component sheet F2 is cut. Specifically, the second optical component sheet F2 may be substantially bonded to the first single-sided bonding panel P11, and then only the second optical component sheet F2 may be cut. According to this method, it is not necessary to attach the second optical component sheet F2 to the first single-sided bonding panel P11, and the front edge can be cut.

As shown in FIG. 8 , the second single-sided bonding panel P12 on which the first optical member F11 and the second optical member F12 are bonded to each other on the liquid crystal panel P is formed by the cutting of the second cutting device 16 (optical The component bonding body and the second optical component bonding body).

Further, at this time, as shown in the fourth figure, the second single-sided bonding panel P12 is separated from the respective optical component sheets F1 and F2 which are left in a frame shape with respect to the portion (the optical members F11 and F12) which are cut away from the display region P4. The remaining part. The remaining portions of the second optical component sheet F2 are connected in plurality to form a ladder shape, and the remaining portion is wound around the collecting portion 15d together with the remaining portion of the first optical component sheet F1.

Here, the "opposing portion with respect to the display region P4" refers to a region having a size larger than the size of the display region P4 and having a size smaller than the size of the liquid crystal panel P, and avoiding a functional portion such as an electrical component mounting portion. In the present embodiment, the three sides of the functional portion are removed from the rectangular liquid crystal panel P in a plan view, and the remaining portion is laser-cut along the outer periphery of the liquid crystal panel P. Further, in a position corresponding to one of the functional portions, the remaining portion of the liquid crystal panel P is appropriately cut into the display region P4 side, and the remaining portion is laser-cut.

Returning to the first figure, the third alignment device 17 is provided on the downstream side of the panel conveyance than the second bonding device 15 and the second cutting device 16. The third alignment device 17 reverses the surface and the back surface of the second single-sided bonding panel P12 on the backlight side of the liquid crystal panel P, and causes the display surface side of the liquid crystal panel P to be the lower side, and performs the first The alignment device 11 and the second alignment device 14 are aligned identically. That is, the third alignment device 17 performs the second single-sided bonding panel P12 on the third bonding device 18 in the part width direction according to the inspection data stored in the optical axis direction of the control device 20 and the camera image data of the camera. Positioning and positioning in the direction of rotation. In this state, the second single-sided bonding panel P12 is introduced into the bonding position of the third bonding apparatus 18.

The third bonding device 18 is provided on the downstream side of the panel transportation than the third alignment device 17. The third bonding apparatus 18 is attached to the lower surface of the long single optical component sheet F3 which is introduced into the bonding position, and the upper surface of the second single-sided bonding panel P12 (the display surface side of the liquid crystal panel P) is bonded and conveyed.

The third bonding device 18 includes a conveying device 18a and a nip roller 18b. The conveyance device 18a winds up the third optical component sheet F3 from the third paper roll R3 around which the third optical component sheet F3 is wound, and conveys the third optical component sheet F3 along the longitudinal direction thereof. The nip roller 18b is bonded to the upper surface of the second single-sided bonding panel P12 conveyed by the roller conveyor 5 on the lower surface of the third optical component sheet F3 conveyed by the conveying device 18a.

The conveying device 18a includes a holding portion 18c and a collecting portion 18d. The holding portion 18c holds the third paper roll R3 around which the third optical member sheet F3 is wound, and is reversed along its length direction The third optical component sheet F3 is covered. The recovery unit 18d collects the remaining portion of the third optical component sheet F3 that has passed through the third cutting device 19 on the downstream side of the panel conveyance of the nip roller 18b.

At the bonding position of the third bonding apparatus 18, the conveying device 18a is set such that the bonding surface of the third optical component sheet F3 and the third optical component sheet F3 of the second single-sided bonding panel P12 are directed downward. The conveyance path of the third optical component sheet F3.

The nip roller 18b has a pair of bonding rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rolls, and the gap becomes the bonding position of the third bonding apparatus 18. The second single-sided bonding panel P12 and the third optical component sheet F3 are superimposed and introduced in the gap. The second single-sided bonding panel P12 and the third optical component sheet F3 are sandwiched between the bonding rollers and sent out to the downstream side of the panel conveyance. Thereby, a third bonding sheet F23 (bonding sheet) in which a plurality of second single-sided bonding panels P12 are continuously bonded to the lower surface of the long third optical component sheet F3 at a predetermined interval is formed.

The third cutting device 19 is located on the downstream side of the panel conveyance from the nip roller 18b, and cuts the third optical component sheet F3. The third cutting device 19 is a laser light irradiation device similar to the second cutting device 16 (see FIG. 2 and FIG. 3). The third cutting device 19 cuts the third optical component sheet F3 endlessly along the outer periphery of the display region P4 (for example, along the outer periphery of the liquid crystal panel P).

As shown in FIG. 9 , by the cutting of the third cutting device 19 , the double-sided bonding panel P13 on which the third optical member F13 is bonded to the upper surface of the second single-sided bonding panel P12 is formed (optical component bonding) Fit, second optical component bonding body).

Further, at this time, as shown in the second figure, the remaining portion of the double-sided bonding panel P13 and the opposing portion (the third optical member F13) which is opposed to the display region P4 are separated and the remaining portion of the third optical component sheet F3 remains. The remaining portion of the third optical member sheet F3 is connected in a plurality of steps in the same manner as the remaining portion of the second optical member sheet F2, and the remaining portion is wound around the collecting portion 18d.

The double-sided bonding panel P13 passes through an inspection device (not shown), and checks for the presence or absence of defects (such as poor bonding), and then transports it to a downstream process for other processing.

As shown in FIG. 5, the liquid crystal panel P has, for example, a rectangular first substrate P1 composed of a TFT substrate, a second substrate P2 which is disposed to face the first substrate P1 and has a rectangular shape, and is sealed to the first substrate. The liquid crystal layer P3 between P1 and the second substrate P2. In addition, the map The hatching of each layer of the cross-sectional view is omitted on the expedient.

As shown in the seventh and eighth figures, the first substrate P1 has three sides of the outer periphery of the first substrate P1 along three sides corresponding to the second substrate P2, and one of the remaining sides of the outer periphery protrudes from one side corresponding to the second substrate P2. Outside. Thereby, the electrical component mounting portion P5 that protrudes outside the second substrate P2 is provided on the one side of the first substrate P1.

As shown in the sixth and eighth diagrams, the second cutting device 16 detects the outer periphery of the display region P4 by the detecting portion such as the camera 16a, and cuts the first and second optical member sheets F1 along the outer periphery of the display region P4 or the like. , F2. In the same manner, the third cutting device 19 detects the outer periphery of the display region P4 by the detecting portion such as the camera 19a, and cuts the third optical component sheet F3 along the outer periphery of the display region P4 or the like. A predetermined wide margin portion G is disposed on the outer side of the display region P4, and a sealant or the like for bonding the first substrate P1 and the second substrate P2 is disposed, and the cutting device 16 is disposed within the width of the fore edge portion G. , 19 implemented laser cutting.

As shown in Fig. 11, when the optical component sheet FX made of a resin is cut by a laser alone, the cut end t of the optical component sheet FX expands and undulates due to thermal deformation. Therefore, when the optical component sheet FX after the laser cutting is bonded to the optical display component PX, the optical component sheet FX is liable to cause poor bonding such as air intrusion or skew.

Further, as shown in FIG. 10, after the optical component sheet FX is bonded to the liquid crystal panel P, in the embodiment of the laser-cut optical component sheet FX, the cut end t of the optical component sheet FX is backed up. Since the cut end t of the optical component sheet FX does not cause swelling or undulation, etc., and the liquid crystal panel P is bonded, the above-mentioned bonding failure does not occur.

Since the vibration width (tolerance) of the cutting line formed by the laser processing machine is smaller than the vibration width of the cutting line formed by the cutting blade, the present embodiment cuts the optical member more than the cutting blade. In the case of the sheet FX, the width of the fore edge portion G can be reduced, and the size of the liquid crystal panel P and/or the enlargement of the display region P4 can be formed. Such an optical component sheet is effectively applied to, for example, a smart phone or a tablet terminal in recent years, and it is required to display a high-performance mobile phone with an enlarged display screen in a limited size of a frame.

In addition, when the optical component sheet FX is cut into a single piece integrated with the display area P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, each of the above-mentioned single piece and the liquid crystal panel P Since the dimensional tolerances and the dimensional tolerances of the relative bonding positions overlap, it is difficult to reduce the width of the fore edge portion G of the liquid crystal panel P (difficulty in expanding the display area).

In addition, when the optical component sheet FX is bonded to the liquid crystal panel P and is aligned in the alignment display region P4, it is only necessary to consider the vibration tolerance of the cutting line, and the width tolerance (±0.1 mm or less) of the fore edge portion G can be reduced. This also means that the width of the fore edge portion G of the liquid crystal panel P can be reduced (the display area can be enlarged).

Further, the optical component sheet FX is not cut by the laser beam, and the force at the time of cutting does not enter the liquid crystal panel P, and it is difficult to cause cracks or chipping at the edge of the substrate of the liquid crystal panel P, and the durability against heat cycle and the like is improved. Similarly, since the liquid crystal panel P is not touched, damage to the electrical component mounting portion P5 is also small.

Further, in the case of laser-cutting the optical component sheet FX, the thickness and configuration of the liquid crystal panel P and the optical component sheet FX should be considered to determine the energy per unit length of the laser irradiation.

In the present embodiment, when the optical component sheet FX is laser-cut, it is preferable to perform laser irradiation in a range of 0.01 to 0.11 (J/mm) per unit length. In the case of laser irradiation, when the energy per unit length is too large, the optical component sheet FX may be damaged in the case where the optical component sheet FX is laser-cut. However, by performing laser irradiation in a range of 0.01 to 0.11 (J/mm) per unit length, it is possible to prevent the optical component sheet FX from being damaged.

As shown in the seventh figure, when the laser cutting optical component sheet FX (the seventh drawing cuts the third optical component sheet F3), for example, the starting point pt1 of the laser cutting is set on the extension line of one of the long sides of the display region P4. The starting point pt1 first starts the cutting of the aforementioned long side. The end point pt2 of the laser cutting is set to one time in the laser scanning display area P4, and reaches the position on the extension line of the short side of the starting point side of the display area P4. The starting point pt1 and the end point pt2 are set such that the specified connecting tape remains in the remaining portion of the optical component sheet FX, and the tension when the optical component sheet FX is wound can be received.

Returning to the first figure, the control device 20 of the present embodiment includes a computer system. This computer system includes an arithmetic processing unit 20a such as a CPU, and a storage unit 20b such as a memory or a hard disk. The control device 20 of the present embodiment includes an interface that can perform communication with an external device of the computer system. The control device 20 can also be connected to an input device that can input an input signal. The input device includes an input device such as a keyboard or a mouse, or a communication device that can input data from an external device of the computer. The control device 20 may also include a liquid crystal display that displays the operation status of each part of the film bonding system 1. Such as display devices. It can also be connected to the display device.

An operating system (OS) for controlling the computer system is installed in the memory unit 20b of the control device 20. The memory unit 20b of the control device 20 records a program for causing each unit of the film bonding system 1 to perform a process for accurately transporting the polarizing film F by controlling the arithmetic processing unit 20a to control each unit of the film bonding system 1. The arithmetic processing unit 20a of the control device 20 can read various pieces of information including the program recorded in the storage unit 20b. The control device 20 may also include a logic circuit such as an ASIC that performs various processes required for controlling the respective portions of the film bonding system 1.

The memory unit 20b includes concepts such as a semiconductor memory such as a RAM (Random Access Memory), a ROM (Read Only Memory), an external memory device such as a hard disk, a CD-ROM reading device, and a disk type memory medium. The memory unit 20b functionally sets a memory area of the program software in which the operation of the mobile device 32 or the control operation of the first illumination position adjustment device 161 and the second illumination position adjustment device 162 (scanning element) is described; The irradiation position in the optical component sheet FX of the desired track shown in the third figure is used as the memory area of the coordinate data; and the memory area for memorizing the amount of movement of the second cutting device 16 in each direction of the XYZ in the second figure; And various other memory areas.

(laser light irradiation device)

The second drawing is a perspective view showing an example of the laser light irradiation device 30 serving as a cutting portion (cutting device) of the optical component sheet.

As shown in the second diagram, the laser beam irradiation device 30 includes a table 31, a scanner as the second cutting device 16, a moving device 32, and a control device 33. The laser beam irradiation device 30 is a device for irradiating the optical component sheet FX with laser light and cutting the optical component sheet FX into the optical member FS of a predetermined size. Further, the second drawing is described as a scanner of the second cutting device 16, but it is applicable even to the scanner as the third cutting device 19.

The table 31 has a holding surface 31a that holds the optical component sheet FX (irradiation target). The second cutting device 16 emits laser light on the optical component sheet FX in order to cut the optical component sheet FX held on the table 31.

The second cutting device 16 can scan the laser light in two planes (in the XY plane) in a plane parallel to the holding surface 31a of the table 31. That is, the second cutting device 16 can independently move the table 31 independently in the X direction and the Y direction, thereby causing the second cutting device 16 to be on the table. The arbitrary position on the 31 is moved to accurately illuminate the laser light at any position of the optical component sheet FX held on the table 31.

The mobile device 32 can relatively move the table 31 and the second cutting device 16. The moving device 32 causes the table 31 and the second cutting device 16 to be in a first direction V1 (X direction) parallel to the holding surface 31a; parallel to the holding surface 31a, and a second direction V2 orthogonal to the first direction V1 ( The Y direction); and the third direction V3 (Z direction) of the normal direction of the holding surface 31a relatively move. In the present embodiment, the moving device 32 moves only the second cutting device 16 without moving the table 31.

For example, the second cutting device 16 is provided with a slider mechanism (not shown) that can move the second cutting device 16 in all directions of XYZ. The moving device 32 operates the linear motor built in the slider mechanism to move the second cutting device 16 in all directions of XYZ. The linear motor that is pulse-driven in the slider mechanism can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Therefore, the position of the second cutting device 16 supported by the slider mechanism in the XYZ directions can be precisely controlled. Further, the position control of the second cutting device 16 is not limited to the position control using a pulse motor, and can be realized by using a feedback control of a servo motor or any other control method.

Further, the method of relative movement of the mobile device of the present invention is not limited to the above embodiment. For example, by moving the table 31 without moving the second cutting device 16, or by moving both the table 31 and the second cutting device 16, the table 31 and the second cutting are performed. The invention is still applicable when the device 16 is relatively moved.

The third diagram shows an oblique view of the internal configuration of the second cutting device (scanner) 16 in the laser light irradiation device 30. In addition, in the third figure, the illustration of the mobile device 32 and the control device 33 is omitted.

As shown in the third figure, the second cutting device 16 includes a laser oscillating machine 160, a first irradiation position adjusting device 161, a second irradiation position adjusting device 162, and a collecting lens 163.

The laser oscillating machine 160 is a component that oscillates the laser light L. For example, the laser oscillator 160 can use a CO ₂ laser oscillator (carbon dioxide laser oscillator), a UV laser oscillator, a semiconductor laser oscillator, a YAG laser oscillator, and a quasi-laser laser oscillator. However, the specific constitution is not particularly limited. In the oscillating machine exemplified above, a CO ₂ laser oscillating machine is preferably used, and for example, laser light can be oscillated at a suitable high output during the cutting process of the polarizing film.

The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 constitute scanning elements that can scan the laser light oscillated by the laser oscillator 160 in two planes in a plane parallel to the holding surface 31a. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 use, for example, a current scanner. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are sequentially disposed on the optical path of the laser light between the laser oscillator 160 and the collecting lens 163. In addition, the scanning element is not limited to a current scanner, and a gimbal can also be used.

The first irradiation position adjusting device 161 includes a mirror 161a and an actuator 161b that adjusts the installation angle of the mirror 161a. The actuator 161b has a rotation shaft 161c parallel to the Z direction. The rotating shaft 161c is coupled to the mirror 161a. The actuator 161b rotates the mirror 161a around the Z axis in accordance with the control of the control device 33.

The second irradiation position adjusting device 162 includes a mirror 162a and an actuator 162b that adjusts the installation angle of the mirror 162a. The actuator 162b has a rotation axis 162c parallel to the Y direction. The rotating shaft 162c is coupled to the mirror 162a. The actuator 162b rotates the mirror 162a around the Y-axis in accordance with the control of the control device 33.

The laser beam L oscillated by the laser oscillating machine 160 is irradiated onto the optical component sheet FX held by the table 31 via the mirror 161a, the mirror 162a, and the condensing lens 163. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 adjust the irradiation position of the laser light irradiated from the laser oscillating machine 160 to the optical component sheet FX held by the table 31 in accordance with the control of the control device 33.

The actuators 161b and 162b rotate the mirrors 161a and 162a in accordance with the control of the control unit 33 to adjust the optical path of the laser light L irradiated toward the optical component sheet FX. For example, the optical path of the laser light L is changed from the state indicated by the solid line in the third figure to the state indicated by the one-dot chain line or the state indicated by the two-dot chain line.

When the optical path of the laser light L is positioned in a solid line by the rotation of the mirror 161a and the mirror 162a, the laser light L oscillated by the laser oscillating machine 160 is condensed at the condensing point Qa.

The laser light oscillated by the laser oscillating machine 160 in the state where the optical path of the laser light L is positioned by a chain line by the rotation of the mirror 161a and the mirror 162a. The condensed spot Qb which is displaced by a specified amount from the condensing point Qa is condensed.

In a state in which the optical path of the laser light L is positioned as a two-dot chain line by the rotation of the mirror 161a and the mirror 162a, the laser light L oscillated by the laser oscillating machine 160 is condensed at the condensed spot. Qa specifies the amount of concentrated spot Qc.

With this configuration, the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 adjust the concentration of the optical member sheet FX held on the table 31 by the collecting lens 163 in accordance with the control of the control device 33. The spot position (Qa, Qb, Qc) of the laser light L.

The condensing lens 163 is disposed at a front end portion (portion opposed to the optical component sheet FX) of the second cutting device 16. The condensing lens 163 oscillates from the laser oscillating machine 160, and the laser beam L whose optical path is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 is condensed at a predetermined position of the optical component sheet FX.

For example, the condenser lens 163 uses an fθ lens. Thereby, the laser beam L indicated by the solid line, the one-dot chain line, and the two-dot chain line which are incident on the condensing lens 163 in parallel from the mirror 162a can be condensed in parallel on the optical component sheet FX.

The control device 33 controls the moving device 32, the first irradiation position adjusting device 161, and the second irradiation position adjusting device 162 to cause the laser light L emitted from the second cutting device 16 to be drawn in the optical component sheet FX held on the table 31. The trajectory of hope.

(Laser light irradiation method)

Fig. 12 is a flow chart showing an embodiment of the laser light irradiation method of the present invention.

The laser light irradiation method according to the present embodiment is a cutting method for cutting the optical component sheet FX into the optical component FS of a predetermined size by using the laser light irradiation device 30 shown in FIG. The laser light irradiation method according to the present embodiment has a first step of holding the optical component sheet FX by the holding surface 31a of the table 31; and relatively moving the table 31 and the second cutting device 16 from the second cutting device 16 The second step of irradiating the two-axis scanned laser light onto the optical component sheet FX in a plane parallel to the holding surface 31a. In the second step, the table 31 and the second cutting device 16 are placed such that the laser light irradiated from the second cutting device 16 traces a desired trajectory in the optical member sheet FX held in the table 31. Parallel to the first direction V1 of the holding surface 31a, and the second direction V2 parallel to the holding surface 31a and orthogonal to the first direction V1, and The irradiation position of the laser light irradiated to the optical component sheet FX held by the table 31 is adjusted.

Hereinafter, an operation before the optical member sheet FX is cut into the optical member FS of a predetermined size by the laser light irradiation device 30 will be described.

First, a paper roll (for example, the first paper roll R1) of the used optical member sheet (for example, the first optical member sheet F1) is loaded into the holding portion 12c. After the completion of the loading, the operator performs initial setting using an operation panel or the like (step S1 shown in Fig. 12). For example, the cutting size, the thickness, the supply speed, the output of the laser light, the depth of focus, the conveying speed of the holding portion 12c, the conveying speed of the roller conveyor 5, and the like are set by the initial setting.

When the initial setting is completed, the roller conveyor 5 starts to convey the liquid crystal panel P in accordance with the control of the control device 20 (step S2 shown in Fig. 12).

In the liquid crystal panel P, the first alignment device 11 performs alignment according to the control of the control device 20, and the first bonding device F21 is formed by the first bonding device 12, and is formed by the first cutting device 13. The first single-sided bonding panel P11 is aligned by the second alignment device 14 and the second bonding sheet F22 is formed by the second bonding device 15.

Thereafter, the liquid crystal panel P is stopped at the designated position (step S3 shown in Fig. 12). For example, the liquid crystal panel P is held by the holding surface 31a of the table 31 in accordance with the control of the control device 20.

Next, the laser beam is held on the optical component sheet FX held on the table 31, and the optical component of a predetermined size is cut out from the optical component sheet (step S4 shown in Fig. 12). In the present embodiment, the control device 33 performs the movement device 32 so that the laser light irradiated from the second cutting device 16 draws a desired trajectory in the optical component sheet FX held on the table 31 in accordance with the control of the control device 20. Control with the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162.

The thirteenth diagram is a view showing a control method for scanning the laser light on the optical component sheet FX in a rectangular shape. Further, in the thirteenth diagram, the symbol Tr is a moving trajectory of the target laser light (a desired trajectory, hereinafter referred to as a laser light moving trajectory). The symbol Tr1 displays a trajectory (hereinafter referred to as a light source movement trajectory Tr1) in which the movement trajectory in which the table 31 and the second cutting device 16 are relatively moved is projected on the optical component sheet FX. The light source movement trajectory Tr1 is a shape in which four corner portions of the laser light trajectory Tr having a rectangular shape are curved, and the symbol SA1 is a straight line interval other than the corner portion, and the symbol SA2 is the bending section of the corner. The symbol Tr2 indicates that when the second cutting device 16 relatively moves on the light source moving locus Tr1, the irradiation position of the laser light is orthogonal to the light source moving locus Tr1 by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. The degree of deviation (adjustment) of the direction deviation (hereinafter referred to as the adjustment curve). The amount of deviation (adjustment amount) of the laser irradiation position is expressed by the distance between the curve Tr2 and the laser light moving track Tr in the direction orthogonal to the light source moving locus Tr1.

As shown in the thirteenth diagram, the light source movement locus Tr1 traces the movement locus of the outline rectangle in which the corner portion is curved. The light source movement trajectory Tr1 is substantially identical to the laser light movement trajectory Tr, and the shapes of the two are different only in the narrow region of the corner portion. When the light source movement locus Tr1 forms a rectangular shape, the moving speed of the second cutting device 16 at the corner portion of the rectangle becomes slow, and the corner portion expands or undulates due to the heat of the laser light. Therefore, in the thirteenth diagram, the corner portion of the light source movement locus Tr1 is curved, and the moving speed of the second cutting device 16 is made constant in the entire light source movement locus Tr1.

When the previous nozzle method is used, when the laser light is bent in a curved shape, the cut shape also forms a curved shape. Further, when the laser light is made to travel in a rectangular shape, the cut shape is formed into a rectangular shape, but the corner portion is swollen or undulated due to thermal deformation.

When the second cutting device 16 moves in the straight section SA1, the control device 33 does not need to be adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 since the light source moving trajectory Tr1 coincides with the laser light moving trajectory Tr. The irradiation position of the laser light is irradiated to the optical component sheet from the second cutting device 16 as it is. Further, when the second cutting device 16 moves in the bending section SA2, since the light source movement trajectory Tr1 does not coincide with the laser light movement trajectory Tr, the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 control the laser light. At the irradiation position, the irradiation position of the laser light can be arranged on the laser light trajectory Tr. For example, when the second cutting device 16 moves at the position indicated by the symbol M1, the irradiation position of the laser light is orthogonal to the light source movement trajectory Tr1 by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. The direction N1 is offset by a distance W1. The distance W1 is the same as the distance W2 between the adjustment curve Tr2 in the direction N1 orthogonal to the light source movement locus Tr1 and the laser light movement locus Tr. The light source movement trajectory Tr1 is disposed on the inner side than the laser light movement trajectory Tr. However, since the irradiation position of the laser light is deflected to the outside by the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162, Therefore, these deviations are offset, and the laser can be The light irradiation position is disposed on the laser light moving track Tr.

As described above, when the laser beam irradiation device 30 and the laser beam irradiation method according to the present embodiment are used, the desired track Tr is drawn on the optical component sheet FX held by the table 31 by the control of the control device 33. In this manner, the mobile device 32 and the illumination position adjustment devices 161, 162 are controlled. In this configuration, the irradiation range of the laser light to be adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 is only the narrow bending portion SA2. In addition to the wide linear section SA1, the moving device 32 moves the second cutting device 16 to scan the optical component sheet FX for laser light. In this embodiment, the scanning device performs scanning of the laser light by the moving device 32, and only the region where the irradiation position of the laser light is not accurately controlled by the moving device 32 is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. . Thus, the irradiation position of the laser light can be controlled widely and precisely, compared to the case where only the moving device 32 or only the second cutting device 16 (scanner) scans the laser light.

Further, by laminating the liquid crystal panel P on the optical component sheets F1, F2, and F3 having a width wider than the display region P4, even when the optical axis directions are changed depending on the positions of the optical component sheets F1, F2, and F3, The liquid crystal panel P is aligned with the optical axis direction to be bonded. Thereby, the accuracy of the optical axis direction of the optical members F11, F12, and F13 to the liquid crystal panel P can be improved, and the fineness and contrast of the optical display device can be improved.

Further, after the liquid crystal panel P is bonded to the optical component sheets F1, F2, and F3 which are larger than the display region P4, the remaining portions of the optical component sheets F1, F2, and F3 are cut away to form a surface of the liquid crystal panel P. The optical members F11, F12, F13 corresponding to the size of the display region P4. Thereby, the optical members F11, F12, and F13 can be accurately placed in the display region P4, and the forehead portion G located outside the display region P4 can be reduced, and the display region can be enlarged and the size of the device can be reduced.

Then, the optical component sheets F1, F2, and F3 are conveyed toward the optical display component PX at the bonding position on the adhesive layer side, and the bonding surfaces of the optical component sheets F1, F2, and F3 can be suppressed. Damage and adhesion of impurities, etc., and inhibit the occurrence of poor bonding.

Further, in the production system of the optical display device described above, the optical display part PX is provided by the third alignment means 17 for reversing the surface and the back surface of the second single-sided bonding panel P12 conveyed on the roller conveyor 5. The two sides of the front and back sides can be easily attached to the optical component sheet FX from above.

In the present embodiment, the configuration in which the laser beam is irradiated onto the object to be irradiated and the designated processing is performed is described as an example of cutting the optical component sheet. However, the present invention is not limited to the above embodiment. For example, in addition to dividing the optical component sheet into at least two, it is also included in the present invention even if a slit penetrating through the optical component sheet is formed, or a groove of a predetermined depth is formed in the optical component sheet. More specifically, for example, cutting (cutting), half cutting, marking processing, and the like of the end portion of the optical member sheet are included.

In the present embodiment, the case where the rectangular trajectory (square shape) is viewed from the plane by the drawing trajectory of the laser light irradiated from the laser beam irradiation device will be described as an example. However, the present invention is not limited to the above embodiment. For example, the drawing trajectory of the laser light irradiated from the laser beam irradiation device may be a triangular shape in plan view or a polygonal shape in which a pentagon or more is viewed from a plane. Further, the present invention is not limited to such a shape, and may be a planar observation system star shape or a planar observation system geometric shape. Even in such a depiction trajectory, the present invention is applicable.

In the present embodiment, a roller-shaped sheet (a winding roller for winding an optical component sheet) is arranged in a line and a plurality of rows are arranged in parallel. However, the present invention is not limited to the above embodiment. For example, the present invention is applicable even in the case of a one-piece bonding method. Further, the present invention can be applied even when a wafer-like sheet is bonded. For example, after an optical component such as a polarizing film is attached to an optical display component such as a liquid crystal panel, only the optical component can be cut. According to this method, it is not necessary to pay attention to the accuracy of attaching the optical member to the optical display component, and the forehead can be cut.

The above description of the embodiments of the present invention is intended to be illustrative, and it should be understood that the present invention is not to be construed as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Accordingly, the invention is defined by the scope of the claims, and should not be

1‧‧‧Film bonding system

5‧‧‧Roller conveyor

11‧‧‧First aligning device

12‧‧‧First bonding device

12a‧‧‧Transportation device

12b‧‧‧ pinch roller

12c‧‧‧ Keeping Department

12d‧‧‧Recycling Department

13‧‧‧First cutting device

14‧‧‧Second alignment device

15‧‧‧Second laminating device

15a‧‧‧Transportation device

15b‧‧‧ pinch roller

15c‧‧‧ Keeping Department

15d‧‧Recycling Department

16‧‧‧Second cutting device

17‧‧‧ third alignment device

18‧‧‧ Third bonding device

18a‧‧‧Transportation device

18b‧‧‧ pinch roller

18c‧‧‧keeping department

18d‧‧Recycling Department

19‧‧‧ Third cutting device

20‧‧‧Control device

20a‧‧‧Operation Processing Department

20b‧‧‧Memory Department

F1, F2, F3‧‧‧ optical parts

F21, F22, F23‧‧‧ affixed piece

P‧‧‧ LCD panel

Pf‧‧‧ protective film

P11‧‧‧First single-sided fitting panel

P12‧‧‧Second single-sided fitting panel

P13‧‧‧Two-sided fitting panel

R1‧‧‧First Roll Paper Roller

R2‧‧‧second roll paper roller

R3‧‧‧third roll paper roller

Claims (8)

A laser light irradiation device for irradiating laser light onto an object to be irradiated, comprising: a table having a holding surface for holding the object to be irradiated; and a scanner capable of being parallel to the holding surface The inner two-axis scans the laser light; and the moving device is configured to relatively move the working table and the scanner; the scanner moves the trajectory of the relative movement of the working table and the scanner caused by the moving device, and The irradiation position of the laser light to be irradiated on the object to be irradiated is adjusted to be different from the deviation of the movement trajectory of the desired laser light on the object to be irradiated. The laser light irradiation device of claim 1, wherein the scanner comprises: a laser oscillating machine that oscillates the laser light; and a scanning element that can scan the two axes in a plane parallel to the holding surface a laser light that is oscillated by the laser beam oscillating device; and a condensing lens that condenses the laser beam emitted from the scanning element toward the object to be irradiated. An optical component bonding body manufacturing apparatus for bonding an optical component to an optical display component, comprising: a bonding device for bonding an optical larger than a display region of the optical display component to the optical display component; a component sheet to form a bonding sheet; and a cutting device that cuts off an opposite portion of the optical member sheet opposite to the display region and a remaining portion on an outer side of the opposite portion, by using the optical member sheet The optical member having the size corresponding to the display region is cut out, and the optical member bonding body including the optical display component and the optical member superposed on the optical display component is cut out from the bonding sheet; and the cutting device The laser beam irradiation device cuts off the optical component sheet of the object to be irradiated by the laser light irradiated by the laser beam irradiation device; and the laser beam irradiation device includes a table that holds the object to be irradiated a holding surface; the scanner is capable of scanning the laser in two axes in a plane parallel to the aforementioned holding surface ; Mobile device, which system and moveable relative to the table the scanner; the offset table for the scanner and causing the scanner of the mobile device The movement trajectory of the relative movement is adjusted to the irradiation position of the laser light irradiated to the irradiation target object by a deviation from the desired movement trajectory of the laser light on the object to be irradiated. The apparatus for manufacturing an optical component bonding body according to claim 3, wherein the scanner comprises: a laser oscillating machine that oscillates the laser light; and a scanning element that is parallel to the holding surface The inner two-axis scans the laser light oscillated by the laser oscillating machine; and the condensing lens condenses the laser light emitted from the scanning element toward the object to be irradiated. The apparatus for manufacturing an optical component bonding body according to claim 3, further comprising: an imaging device that captures the optical display component after the optical component sheet is bonded; and the cutting device according to the imaging device The image data is used to cut the optical component sheet along the periphery of the display area. A laser light irradiation method is characterized in that a laser beam is irradiated onto an object to be irradiated, and the object to be irradiated is held on a holding surface of a table, and the table and the scanner are relatively moved, and the scanner is Irradiating the laser beam of the two-axis scanning on the object to be irradiated in a plane parallel to the holding surface, the scanner is configured to offset the movement trajectory of the relative movement of the table and the scanner, and the object to be irradiated It is desirable to adjust the irradiation position of the laser beam irradiated to the object to be irradiated by the deviation of the movement trajectory of the laser light. A method for producing an optical member bonded body, wherein an optical member is bonded to an optical display member, wherein an optical member sheet having a larger display area than the optical display member is bonded to the optical display member to form a bonding member. a sheet cut away from an opposite portion of the optical member sheet opposite to the display region and a remaining portion on an outer side of the opposite portion, by cutting the optical member having a size corresponding to the display region from the optical member sheet And cutting the optical component bonding body including the optical display component and the optical component superposed on the optical display component from the bonding sheet, In the step of cutting the optical component bonding body, the optical component sheet for irradiating the object is cut by laser light by a laser light irradiation method; and the laser irradiation method is to maintain the irradiation target on the table. a surface for moving the table and the scanner relative to each other, and irradiating the laser beam from the two-axis scanning to the object to be irradiated from a plane parallel to the holding surface, the scanner for offsetting the table The movement trajectory of the relative movement of the scanner is adjusted to be different from the movement trajectory of the desired laser light on the object to be irradiated, and the irradiation position of the laser light irradiated to the object to be irradiated is adjusted. The method of producing an optical component bonding body according to the seventh aspect of the invention, wherein the optical component component after the optical component sheet is bonded is imaged by the step of cutting the optical component bonding body, and the imaging is performed based on the imaging The data is used to cut the optical component sheet along the periphery of the display area.