JP6349964B2 - Board processing system - Google Patents

Description

  The present invention relates to a plate material processing system and a plate material processing method.

  It is known that a punch press machine performs a forming process on a workpiece by attaching a molding die in addition to drilling a workpiece. In these processes, an operation is performed in which a part to be processed of the workpiece is positioned with respect to the punch position, the process is performed, and then the workpiece is moved to position and process the next part to be processed.

  In addition, it is known to perform a cutting process on a workpiece using a laser processing machine. In the laser processing machine, the workpiece is cut by moving the laser head while irradiating the workpiece held at a predetermined position with laser.

  In recent years, there has been a demand for a plate material processing system capable of performing molding processing and cutting processing with a single processing machine. For example, the structure which added the laser head to the punch press machine is known (for example, refer patent document 1).

JP-A-10-137868

  In recent years, a laser beam having a high thermal density such as a fiber laser has been used, and the workpiece can be cut even when the laser head is moved at a high speed. On the other hand, the configuration described in Patent Document 1 performs processing by moving the workpiece with respect to the laser head, and does not move the laser head. There is a problem that it cannot be used. For example, it is conceivable to process a workpiece using an independent punch press machine and a laser processing machine. In this case, the workpiece is transferred between the punch press and the laser processing machine. However, the workpiece is likely to be misaligned due to the change of the workpiece, and there is a problem in terms of machining accuracy.

  In view of the circumstances as described above, the present invention provides a plate material processing system and a plate material processing method that can make use of the advantages of cutting processing by moving a laser head and perform complex processing such as molding processing with high accuracy. Objective.

The plate material processing system according to the present invention includes a conveying device that holds a plate-like workpiece and conveys it in one direction, and a laser head that processes the workpiece held by the conveying device, and the laser head is unidirectional and unidirectional. A first machining device that can move in a direction that intersects the workpiece and a machining tool that forms a workpiece held by the transfer device at a position different from the machining position by the laser head, and the direction that intersects the machining tool in one direction A second processing device that is movable, and has a sword-shaped, saw-tooth, or wave-shaped workpiece supporting portion that supports the lower surface of the workpiece disposed in the processing region by the laser head , and is supported by the workpiece supporting portion. A brush unit having a brush on which the work can be placed on the upper surface, and the brush unit can enter between work support parts. Comprising a plurality of arm portions, the brush on the upper surface of the arm portion is arranged at a predetermined interval or one line.
The plate material processing system according to the present invention includes a conveying device that holds a plate-like workpiece and conveys it in one direction, and a laser head that processes the workpiece held by the conveying device, and the laser head is unidirectional and unidirectional. A first machining device that can move in a direction that intersects the workpiece and a machining tool that forms a workpiece held by the transfer device at a position different from the machining position by the laser head, and the direction that intersects the machining tool in one direction A second processing device that is movable, and has a sword-shaped, saw-tooth, or wave-shaped workpiece supporting portion that supports the lower surface of the workpiece disposed in the processing region by the laser head, and is supported by the workpiece supporting portion. A brush unit having a brush on which an upper surface of the workpiece can be placed, the upper and lower positions of the workpiece support portion and the brush being positioned relative to each other. It is of, and a lift drive unit for placing the workpiece on one of the workpiece support and the brush.

The second machining apparatus may include a first drive unit that moves the main body or the turret that holds a plurality of machining tools in a direction intersecting one direction, and relatively moves the workpiece and the machining tool. . Further, the second processing apparatus may move the workpiece and the processing tool relative to each other by moving the transport device in a direction crossing one direction. Also, the work supporting portion may be formed on a movable machining pallet for loading or unloading the workpiece against the processing region by the laser head. Also, the first processing device may comprise a collecting unit which products obtained by cutting a portion of the workpiece is collected by drop. Further, the collection unit may be formed at a position where the workpiece can be arranged by the conveying device and the laser head can be arranged upward.

The plate material processing system according to the present invention includes a transport device that holds a plate-shaped workpiece and transports the workpiece in one direction, and a laser head that processes the workpiece held by the transport device. A first processing device movable in a direction intersecting with one direction, a second processing device having a processing tool for forming a workpiece held by the transport device at a position different from the processing position by the laser head, and a transport device; A moving device that moves in a direction crossing one direction, and a sword-shaped, serrated, or wavy workpiece support that supports the lower surface of the workpiece in a machining area by the laser head.

  The first processing apparatus may include a frame formed so as to open a workpiece loading / unloading side with respect to the processing region and surround the processing region vertically, and the laser head may be supported by the frame.

Further, in the present invention, there is provided a plate material processing method for processing a plate-shaped workpiece, wherein the workpiece is processed by moving the laser head of the first processing apparatus while holding the workpiece, and the processing position by the laser head is The workpiece is conveyed to a different position in one direction, and the workpiece is molded by the machining tool of the second machining apparatus while holding the workpiece, and the laser head moves in one direction and in a direction intersecting with one direction. It is possible to set the machining position by the machining tool by moving the machining tool in a direction crossing one direction.

Further, in the present invention, there is provided a plate material processing method for processing a plate-shaped workpiece, wherein the workpiece is processed by moving the laser head of the first processing apparatus while holding the workpiece, and the processing position by the laser head is Conveying the workpiece to different positions in one direction and a direction crossing the one direction, and forming the workpiece by the processing tool of the second processing apparatus while holding the workpiece, and the laser head includes the one direction and the one direction. It is possible to move in a direction crossing the direction, and the processing by the first processing device is performed in a state where the lower surface of the workpiece is supported by a sword-mount, saw-tooth or wave-shaped workpiece support.

  According to the present invention, since the laser head is moved, processing by the laser head can be performed at high speed. In addition, since the first processing device and the second processing device are arranged side by side in one direction and can be processed with the laser head and the processing tool by a single workpiece holding operation by the transfer device, the operation of changing the workpiece is unnecessary. Thus, the workpiece can be machined with high accuracy. Thereby, while taking advantage of the cutting process by the movement of the laser head, it is possible to accurately perform a complex process such as a molding process.

  In addition, the second machining apparatus includes a first drive unit that moves the main body or the turret holding a plurality of machining tools in a direction intersecting one direction, and relatively moves the workpiece and the machining tool. By moving the main body or the turret relative to the workpiece, the machining position on the workpiece by the machining tool can be set. In the case where the second processing device moves the transport device in a direction crossing one direction and moves the workpiece and the processing tool relatively, the processing tool is moved by moving the transport device relative to the processing tool. The machining position on the workpiece can be set.

  Further, in the case of having a sword mountain-shaped, saw-tooth or wave-shaped workpiece support portion supporting the lower surface of the workpiece disposed in the processing region by the laser head, the contact area between the workpiece support portion and the workpiece can be reduced. Thereby, it can suppress that the process part of a workpiece | work welds to a workpiece | work support part. In addition, when the workpiece support is formed on a movable machining pallet that loads or unloads the workpiece with respect to the machining area of the laser head, the workpiece can be stably machined and the workpiece can be easily loaded. Or it can be carried out.

  Further, in the case of including a brush unit having a brush that can be moved forward and backward with respect to the lower position of the work supported by the work support portion and on which the work can be placed, Can support the workpiece. In this case, the resistance of the workpiece can be reduced and the surface of the workpiece can be prevented from being damaged. Further, in the case where the brush unit includes a plurality of arm portions that can enter between the work support portions, and the brushes are arranged on the upper surface of the arm portions at a predetermined interval or in a line, the lower portion of the work supported by the work support portions The brush unit can be easily arranged at the position. Moreover, in the thing provided with the raising / lowering drive part which changes the relative up-and-down position of a workpiece | work support part and a brush, and mounts a workpiece | work on either one of a workpiece | work support part and the said brush, a workpiece | work support part and a brush unit The workpieces can be easily transferred between the two.

  Further, when the first processing apparatus includes a recovery unit that recovers a product obtained by cutting a part of the workpiece, the product can be recovered efficiently. In addition, in the case where the collecting unit can place the workpiece by the transfer device and is formed at a position where the laser head can be arranged above, a part of the workpiece is cut above the collecting unit and the product is directly It can be dropped into the collection part.

  Further, in the present invention, the transfer device is moved in a direction intersecting one direction by the moving device, and the lower surface of the workpiece is supported in the processing region by the laser head by the sword mountain-shaped, saw-tooth or wave-shaped workpiece support portion. The contact area between the workpiece support and the workpiece can be reduced. Thereby, it can suppress that the process part of a workpiece | work welds to a workpiece | work support part.

  In addition, the first processing apparatus has a frame formed so as to open the workpiece loading / unloading side with respect to the processing region and surround the processing region vertically, and the laser head is supported by the frame. It is possible to stably support the laser head while securing a route for carrying in or taking out the laser beam.

  Moreover, in the board | plate material processing method which concerns on this invention, since the workpiece | work is processed by moving the laser head of a 1st processing apparatus, holding a workpiece | work, a workpiece | work can be processed at high speed. In addition, since the work is transported in one direction to a position different from the processing position by the laser head and the work is processed by the processing tool of the second processing apparatus while holding the work, the first processing apparatus and the second processing apparatus There is no need to change the workpiece between the two, and only one workpiece holding operation is required. For this reason, a workpiece can be processed with high accuracy.

  In the present invention, since the processing by the first processing device is performed in a state where the lower surface of the work is supported by the sword-shaped, sawtooth, or wavy work support, the contact area between the work support and the work Can be reduced. Thereby, it can suppress that the process part of a workpiece | work welds to a workpiece | work support part.

It is a perspective view which shows an example of the board | plate material processing system which concerns on 1st Embodiment. It is a figure which shows an example of a board | plate material processing system. It is a figure which shows an example of a board | plate material processing system. (A) is a figure which shows an example of a board | plate material processing system, (b) is sectional drawing which shows a part of structure of a 2nd processing apparatus. (A) And (b) is a figure which shows the flow of operation | movement of a board | plate material processing system. (A) And (b) is a figure which shows the flow of operation | movement of a board | plate material processing system. (A) And (b) is a figure which shows the flow of operation | movement of a board | plate material processing system. (A) And (b) is a figure which shows the flow of operation | movement of a board | plate material processing system. (A) And (b) is a figure which shows the flow of operation | movement of a board | plate material processing system. (A) And (b) is a figure which shows the flow of operation | movement of a board | plate material processing system. It is a figure which shows an example of the board | plate material processing system which concerns on a modification. It is a figure which shows the other example of the board | plate material processing system which concerns on a modification. (A) And (b) is a figure which shows an example of the board | plate material processing system which concerns on 2nd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to this. Further, in the drawings, in order to describe the embodiment, the scale is appropriately changed and expressed by partially enlarging or emphasizing the description. In the following drawings, directions in the drawings will be described using an XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the horizontal plane is defined as an XY plane. An arbitrary direction parallel to the XY plane is expressed as an X direction, and a direction orthogonal to the X direction is expressed as a Y direction. A direction perpendicular to the XY plane is expressed as a Z direction, and a direction around an axis parallel to the Z direction is expressed as a θZ direction. In each of the X direction, the Y direction, and the Z direction, the direction of the arrow in the figure is the + direction, and the direction opposite to the arrow direction is the − direction.

<First Embodiment>
FIG. 1 is a perspective view showing an example of a plate material processing system 100 according to the first embodiment. 2, 3, and 4 (a) are views when the plate material processing system 100 is viewed from the −Z direction, the + Y direction, and the + X direction, respectively.

  As shown in FIGS. 1 to 4A, the plate material processing system 100 is used by being placed on a horizontal floor, for example. The plate material processing system 100 performs at least cutting processing and forming processing on a rectangular plate-shaped workpiece W formed using a metal material or the like, and performs a plurality of types of processing such as tapping and punching. In the first embodiment, a plate material processing system 100 that performs a cutting process and a forming process on the workpiece W will be described as an example.

  The plate material processing system 100 includes a first processing device 10, a second processing device 20, and a transport device 30. Further, the plate material processing system 100 includes a control device (not shown) that controls the first processing device 10, the second processing device 20, and the transport device 30 in an integrated manner.

  The first processing apparatus 10 is a laser processing machine that cuts a workpiece M into a desired shape M (see FIG. 9A) by performing laser processing on the workpiece. The first processing apparatus 10 includes a laser head 11 and a head driving unit 12. The laser head 11 has an emission part (not shown) that emits laser light in the −Z direction. The laser head 11 is connected to a laser light source 11b via an optical transmission body such as an optical fiber 11a. As the laser light source 11b, for example, a solid-state laser light source such as a fiber laser is used. As a result, laser light having a higher heat density than that of, for example, a carbon dioxide laser can be obtained, so that processing can be performed at high speed.

  The laser head 11 is provided so as to be movable in the X direction, the Y direction, and the Z direction by the head driving unit 12. Note that the processing region 10a (see FIG. 2) is set by moving the laser head 11 in the X direction and the Y direction. The laser head 11 can process the workpiece W arranged in the processing area 10a.

  The head drive unit 12 includes a gantry 12a, a slider 12b, and an elevating unit 12c. The gantry 12a is formed in a rectangular column shape, and is arranged along the Y direction. The gantry 12a is disposed on the pair of guide rails 12d. The pair of guide rails 12d are arranged so as to sandwich the processing region 10a in the Y direction. The pair of guide rails 12d are arranged along the −Y side and the + Y side of the upper surface of the frame 18, respectively. The pair of guide rails 12d are arranged in parallel to each other along the X direction. The head drive unit 12 has a drive mechanism (not shown) that moves the gantry 12a in the X direction, such as a ball screw mechanism. The gantry 12a is movable in the X direction along the guide rail 12d by this drive mechanism.

  A guide 12e is provided on the + Z side surface of the gantry 12a. The guide 12e is formed along the Y direction and guides the slider 12b. The slider 12b is disposed from the + Z side surface to the −X side surface of the gantry 12a. The head drive unit 12 has a drive mechanism (not shown) that moves the slider 12b in the Y direction, such as a ball screw mechanism. The slider 12b can be moved in the Y direction along the guide 12e by this drive mechanism. A guide for guiding the slider 12b may be formed on the −X side surface of the gantry 12a.

  A guide 12f is provided on the surface on the -X side of the slider 12b. The guide 12f is formed along the Z direction and guides the elevating part 12c. The raising / lowering part 12c is arrange | positioned on the surface at the side of -X of the slider 12b. The head drive unit 12 has a drive mechanism (not shown) that moves the elevating unit 12c in the Z direction, such as a ball screw mechanism. The elevating part 12c is movable in the Z direction along the guide 12f by this drive mechanism.

  The laser head 11 is held by the elevating part 12c. As the gantry 12a moves in the X direction, the laser head 11, the slider 12b, and the elevating part 12c move together in the X direction. As the slider 12b moves in the Y direction, the laser head 11 and the elevating part 12c move together in the Y direction. The laser head 11 moves in the Z direction as the elevating part 12c moves in the Z direction. Thereby, the laser head 11 can move in the X direction, the Y direction, and the Z direction above the processing region 10a. The guide rails 12d and the guides 12e and 12f may be arranged in directions inclined with respect to the X direction, the Y direction, or the Z direction.

  A processing pallet 13 is disposed in the processing area 10a. The processing pallet 13 is carried into the position 13P shown in FIG. 2 using a carrying-in device (not shown) or the like, or is carried out from the position 13P. The processing pallet 13 carries the workpiece W into or out of the processing area 10a. The processing pallet 13 also functions as a table for supporting the workpiece W in the processing area 10a. The processing pallet 13 is placed on the placement unit 14 (see FIG. 3). The placement unit 14 may be provided with a positioning unit for positioning the processing pallet 13. The placement unit 14 is provided so as to be movable in the Z direction by a pallet driving unit 15 (see FIG. 3). The processing pallet 13 can be moved in the Z direction by moving the mounting unit 14 in the Z direction in a state where the processing pallet 13 is mounted on the mounting unit 14.

  The processing pallet 13 includes a base plate 13a and a support plate (work support portion) 13b. The base plate 13a is formed in a rectangular shape, for example. The support plate 13b supports the lower surface (the surface on the −Z side) of the workpiece W. A plurality of support plates 13b are provided on the upper surface (+ Z side surface) of the base plate 13a.

  The plurality of support plates 13b are provided in a standing state with respect to the base plate 13a, and are arranged side by side in the X direction. Each support plate 13b has a plurality of upper end portions 13c formed in a sawtooth shape, for example. Each upper end portion 13c is formed to have the same height (position in the Z direction) from the base plate 13a.

  The workpiece W is placed on the plurality of upper end portions 13c. Since the plurality of upper end portions 13c have the same height, the workpiece W is disposed in a stable posture. Further, since the upper end portion 13c is formed in a sawtooth shape, the contact area between the upper end portion 13c and the workpiece W is reduced. The upper end portion 13c is not limited to a sawtooth shape, and may be a sword mountain shape or a wave shape, for example. Further, the processing pallet 13 is not limited to using a plurality of support plates 13b. For example, a plurality of pins may be arranged on the base plate 13a.

  The processing pallet 13 is carried in from the outside in a state where the workpiece W is placed on the upper end portion 13c of the support plate 13b, and is placed in the processing region of the first processing apparatus 10 with the workpiece W placed thereon. In addition, the processing pallet 13 places the processed workpiece W thereon and is carried out to the outside. Therefore, the processing pallet 13 is configured to reciprocate between the first processing apparatus 10 and the outside.

  Further, the first processing apparatus 10 is provided with a brush unit 16. The brush unit 16 is formed so as to be able to advance and retract in the Y direction, for example, with respect to the lower position of the work W supported by the support plate 13b.

  The brush unit 16 has a base portion 16a, an arm portion 16b, and a brush portion 16c. The base portion 16a is formed in a shape extending in the X direction. The base 16a is provided so as to be movable in the Y direction by a driving device (not shown). The arm portion 16b is formed to extend in the + Y direction from the base portion 16a. A plurality of arm portions 16b are provided in the X direction. Each arm portion 16b is arranged side by side in the X direction at substantially the same pitch as the support plate 13b. The brush unit 16 is disposed at a position where each arm portion 16b can enter between the support plates 13b in the + Y direction when the base portion 16a is moved in the + Y direction.

The brush part 16c is formed using materials, such as resin, for example, and supports the workpiece | work W when conveying the workpiece | work W. FIG. A plurality of brush portions 16c are provided on the upper surface (surface on the + Z side) of each arm portion 16b, and are arranged at predetermined intervals in the Y direction. The brush part 16c is set so that the upper end part (the end part on the + Z side) in contact with the workpiece W has substantially the same height. The brush portion 16c reduces resistance when the workpiece W is conveyed, and suppresses damage to the lower surface (the surface on the −Z side) of the workpiece W. A plurality of free balls (rollable in all directions) may be used instead of the brush portion 16c. Further, as shown in FIG. 1, the brush portions 16d may be arranged uniformly in a line along the Y direction on the upper surface of the arm portion 16b .

  Further, the first processing apparatus 10 has a collection unit 17. The collection unit 17 collects a product obtained by cutting a part of the workpiece W. The collection unit 17 includes a lid portion 17a and a conveyor 17b. The lid portion 17a is disposed, for example, at the −X side end portion of the first processing apparatus 10. The lid portion 17a is formed in a rectangular plate shape and is long in the Y direction. The lid portion 17a is arranged in parallel to the horizontal plane (XY plane), and is set so that the upper surface is substantially the same height as the upper surface of the brush portion 16c. For example, as shown in FIG. 3, the lid portion 17 a is rotatable around the Y axis about the + X side end. The lid portion 17a rotates so that the end portion on the −X side is inclined toward the −Z side. By rotating the lid portion 17a, the upper surface of the lid portion 17a is inclined to the −Z side. By tilting the lid portion 17a with the product separated from the workpiece W placed on the upper surface of the lid portion 17a, the product separated from the workpiece W can be dropped to slide toward the conveyor 17b. is there.

  The lid portion 17a is disposed in a movable region (processing region 10a) of the laser head 11. A slit 17c is formed in the lid portion 17a. The slit 17c is linearly formed along the Y direction. By providing the slit 17c, in the first processing apparatus 10, it is possible to perform processing by the laser head 11 on the workpiece W placed on the lid portion 17a. In addition, arrangement | positioning of the cover part 17a is not limited to the -X side edge part of the 1st processing apparatus 10, You may arrange | position in another position.

  The conveyor 17b is arrange | positioned at the -Z side of the cover part 17a, and is provided in the position which shifted | deviated to the -X side rather than the cover part 17a. The conveyor 17b receives the product dropped from the lid portion 17a and sends it to the -Y side. The conveyor 17b is provided with a drive mechanism (not shown) that rotates the belt, and the product dropped from the lid portion 17a can be carried out of the first processing apparatus 10.

  Subsequently, the second processing apparatus 20 performs a forming process on the workpiece W by sandwiching the workpiece W from above and below. The second processing device 20 is disposed on the −X side of the first processing device 10. Therefore, the 1st processing apparatus 10 and the 2nd processing apparatus 20 are arrange | positioned along with the X direction. The second processing apparatus 20 includes a main body part 21, a main body driving part 22, and a table 23.

  For example, as shown to Fig.4 (a), the main-body part 21 has the upper frame 21a and the lower frame 21b. An upper turret 24 is held on the upper frame 21 a via a rotation shaft 26. A lower turret 25 is held on the lower frame 21 b via a rotation shaft 27.

  The upper turret 24 and the lower turret 25 are both formed in a disk shape, and are formed to be rotatable about the rotation shafts 26 and 27 by driving a driving device (not shown) such as a motor. The upper turret 24 and the lower turret 25 are arranged facing each other. On the upper turret 24, a plurality of upper molds (processing tools) 24a are mounted side by side in the circumferential direction around the rotation shaft 26. On the lower turret 25, a plurality of lower dies (processing tools) 25 a are mounted side by side in a circumferential direction around the rotation shaft 27.

  The upper turret 24 and the lower turret 25 are rotated by a driving device (not shown), and a pair of upper mold 24a and lower mold 25a to be paired is selected as the punch position P. The upper die 24 a at the punch position P is lowered by the upper elevating part 28. On the other hand, the lower mold 25 a of the punch position P is raised by the lower lifting / lowering part 29. In the 2nd processing apparatus 20, the workpiece | work W is arrange | positioned to the punch position P, and at least one of the upper side metal mold | die 24a and the lower side metal mold | die 25a raises / lowers, it shape | molds by pinching the workpiece | work W. The rotation of the upper turret 24 and the lower turret 25 and the driving of the upper mold 24a and the lower mold 25a may be controlled by a control device (not shown). You may carry out by manual operation by an operator, such as driving the lower raising / lowering part 29. FIG.

  FIG. 4B is a cross-sectional view schematically showing an example of a part of the upper mold 24a and the lower mold 25a. The configurations of the upper mold 24a and the lower mold 25a are not limited to the configurations described below. Further, in FIG. 4B, a part of the configuration of the lower mold 25a is omitted for easy understanding of the drawing. As shown in FIG. 4B, the lower mold 25 a includes a cylindrical fixing portion 56 that is inserted into the through hole 25 b of the holding base 25 c disposed in the lower turret 25. The upper part of the fixing part 56 is formed in a state where the outer diameter is increased. For example, a keyway is formed below the portion having a large outer diameter. The fixing portion 56 is positioned in the vertical direction of the through hole 25b by the key groove, and the angle in the rotational direction with respect to the lower turret 25 is positioned.

  The lower mold 25 a includes a die holder 51 and a die mold part 52. The die mold part 52 is fixed to the die holder 51 with bolts 59. The die holder 51 is slidably disposed on the inner peripheral surface 56a of the fixed portion 56, and is movable in the vertical direction with respect to the fixed portion 56 (holding base 25c). Therefore, the inner peripheral surface 56 a of the fixed portion 56 functions as a guide for the die holder 51.

  The die holder 51 inserts the bolt 53 and holds the lower part of an ejector spring 54 such as a coil spring. A protrusion 57 is attached to the −Z side end of the die holder 51. The bolt 53 is arranged so as to be movable in the vertical direction with respect to the die holder 51. An ejector plate 55 is disposed above the die holder 51. The ejector plate 55 is formed in an umbrella shape whose outer diameter is gradually increased downward from the flat portion at the center of the upper end. A die mold portion 52 is penetrated substantially at the center of the flat portion of the ejector plate 55. The ejector plate 55 is fixed at the tip of the bolt 53 and connected to the upper portion of the ejector spring 54. The ejector plate 55 is held at a predetermined position by the ejector spring 54 and the bolt 53. This predetermined position is a position where the die mold part 52 does not protrude upward from the upper surface of the ejector plate 55. The ejector plate 55 can be lowered against the elastic force of the ejector spring 54. The bolt 53 guides the movement of the ejector plate 55 in the vertical direction and defines the movement stroke. When the ejector plate 55 is lowered, the die mold portion 52 protrudes upward from the upper surface of the ejector plate 55.

  The lower elevating unit 29 includes a drive source 61 and a slider 62. As the drive source 61, for example, one using electric drive such as a servo motor or one using fluid drive using air, water, or oil may be used. The slider 62 has, on the upper surface side, a first surface 62a that is a lower plane, a second surface 62b that is an upper plane, and an inclined surface 62c formed therebetween. The first surface 62 a, the second surface 62 b, and the inclined surface 62 c are in contact with the lower end surface of the protrusion 57. The surface of the first surface 62a, the second surface 62b, the inclined surface 62c and the lower end surface of the protrusion 57 may be subjected to surface treatment for reducing frictional resistance therebetween.

  The height of the first surface 62a corresponds to the lower end surface of the protrusion 57 when the lower mold 25a is positioned below. The height of the second surface 62b corresponds to the lower end surface of the protrusion 57 when the lower mold 25a is moved upward. The difference in height between the first surface 62a and the second surface 62b corresponds to the amount of movement of the lower mold 25a. The inclination angle of the inclined surface 62c is set to an angle at which the slider 62 can slide with respect to the lower end surface of the protrusion 57 when the slider 62 moves.

  By driving the drive source 61, the slider 62 moves in the direction of the arrow in FIG. The driving of the driving source 61 may be controlled by a control unit (not shown) or the like, or may be performed manually by the operator, such as driving the driving source 61 by pressing a button. In addition, the lower raising / lowering part 29 is not limited to the said structure, For example, a cam mechanism etc. may be used.

  The main body drive unit 22 moves the main body unit 21 in the Y direction. The main body drive unit 22 includes a guide rail 22a and a drive unit 22b. The guide rail 22a is formed along the Y direction. The main body 21 is disposed on the guide rail 22a. The drive part 22b moves the main-body part 21 along the guide rail 22a.

  The table 23 supports the workpiece W. A plurality of brush parts (not shown) are arranged on the upper surface of the table 23. The brush part is the same as the brush part 16c provided in the first processing apparatus 10, and is set so that the upper end part (the end part on the + Z side) in contact with the workpiece W has almost the same height. Moreover, it replaces with a brush part and a some free ball (it can roll in all directions) may be used.

  The table 23 has a movable table 23a. The movable table 23a is formed as a rigid body that is not easily deformed or bent by an external force, for example. The movable table 23a is fixed to the lower frame 21b via, for example, a fixed member. The movable table 23a moves integrally with the main body 21 along the moving direction (Y direction) of the main body 21. When the main body portion 21 moves in the + Y direction, the + Y side end portion of the movable table 23a penetrates a carriage 31 described later and protrudes from the + Y side of the second processing apparatus 20. The carriage 31 has a through hole through which the movable table 23a passes. The movable table 23a is not limited to the above configuration, and may be a configuration having flexibility, for example. In this configuration, when the main body 21 moves in the + Y direction, the −Y side end of the movable table 23 a is wound so that the + Y side end of the movable table 23 a does not jump out of the second processing apparatus 20. Can be. In this configuration, when the main body 21 moves in the −Y direction, the wound movable table 23a may be sent out. This saves space in the Y direction.

  Subsequently, the transport device 30 transports the workpiece W in the X direction across the first processing device 10 and the second processing device 20. The conveyance device 30 is disposed on the + Y side of the first processing device 10 and the second processing device 20. The transport device 30 includes a carriage 31, a cross slide 32, a work holder 33, and a frame 34.

  The carriage 31 is fixed across the frame 18 and the frame 34. The carriage 31 is formed along the X direction from the + X side end of the first processing apparatus 10 to the −X side end of the second processing apparatus 20. The carriage 31 is provided with a guide (not shown) along the X direction. Similar to the carriage 31, the guide is formed along the X direction from the + X side end of the first processing apparatus 10 to the −X side end of the second processing apparatus 20.

  The cross slide 32 can be moved in the X direction along the guide by a driving device (not shown). Therefore, the cross slide 32 can move from the + X side end of the first processing apparatus 10 to the −X side end of the second processing apparatus 20 so as to straddle the first processing apparatus 10 and the second processing apparatus 20. ing.

  A plurality of work holders 33 are provided on the cross slide 32. Two or more (for example, three) work holders 33 are provided at intervals in the X direction. Each work holder 33 sandwiches and holds the work W, for example, in the vertical direction. The work holder 33 is provided so as to protrude from the cross slide 32 in the −Y direction.

  The conveyance device 30 conveys the workpiece W in the X direction (one direction) by the cross slide 32 moving in the X direction while the workpiece W is held by the workpiece holder 33. At this time, the cross slide 32 moves across the first machining apparatus 10 and the second machining apparatus 20, so that the workpiece W is conveyed across the first machining apparatus 10 and the second machining apparatus 20. The workpiece W held by the workpiece holder 33 is arranged in the machining area 10 a in the first machining apparatus 10 and arranged on the table 23 in the second machining apparatus 20.

Next, the operation of the plate material processing system 100 configured as described above will be described with reference to FIGS. 5-9 is a figure which shows the flow of operation | movement of the board | plate material processing system 100. FIG.
First, as shown in FIG. 5A, the workpiece W is carried into the plate material processing system 100. The work W is carried in using an external loader device (not shown) or the like. In the present embodiment, the workpiece W is carried in from the + X side end of the first processing apparatus 10. When the workpiece W is loaded, the workpiece W is first placed on the machining pallet 13 and the machining pallet 13 is carried into the first machining apparatus 10 from the outside in this state. Then, the loaded processing pallet 13 is placed on the placement unit 14. As a result, the workpiece W is arranged in the machining area 10 a of the first machining apparatus 10. At this time, the workpiece W may be aligned with the workpiece holder 33. After the workpiece W is arranged in the machining area 10a, the workpiece W is sandwiched and held by the workpiece holder 33.

  Next, laser processing is performed on the workpiece W. In the laser processing, as shown in FIG. 5B, the laser beam is emitted from the laser head 11 to the workpiece W while the head driving unit 12 moves the laser head 11 in the X direction and the Y direction. In the laser processing, a predetermined region (for example, cutting regions H1, H2: see FIG. 6A) of the workpiece W is cut. At this time, instead of cutting the entire cutting region, a part of the cutting region may be connected without cutting. Further, when forming the workpiece W after the laser processing, the outer periphery of the workpiece W is not cut by the laser processing. In this case, as will be described later, the outer periphery is cut after the forming process.

Next, the workpiece W after laser processing is conveyed to the second processing apparatus 20. Prior to the transfer of the workpiece W, the support of the workpiece W is switched from the support plate 13b of the processing pallet 13 to the brush portion 16c of the brush unit 16. Specifically, as shown in FIG. 6A, first, the brush unit 16 is moved in the + Y direction, and each arm portion 16b is disposed between the support plates 13b. At this time, as shown in FIG. 6B, the lower surface of the workpiece W is held by the upper end portion 13c of the support plate 13b and is also held by the upper end of the brush portion 16c. Next, as illustrated in FIG. 6C, the placement unit 14 is moved in the −Z direction by the pallet driving unit 15. Due to the movement of the mounting portion 14, the processing pallet 13 moves in the −Z direction, and the support of the workpiece W by the support plate 13 b is released. And the workpiece | work W is supported by the upper end of the brush part 16c. The operation of moving the workpiece W from the processing pallet 13 to the brush portion 16c is not limited to the operation of moving the mounting portion 14 in the −Z direction. For example, the workpiece W may be transferred from the processing pallet 13 to the brush portion 16c by moving the brush portion 16c side in the + Z direction. Further, the brush unit 16 may be moved in the + Z direction, and the placement unit 14 may be moved in the −Z direction.

  Next, the cross slide 32 is moved in the −X direction while the workpiece W is supported by the brush portion 16c. Since the workpiece W remains held by the workpiece holder 33, the workpiece W is conveyed in the −X direction by the movement of the cross slide 32 and is carried into the second processing apparatus 20. At this time, the workpiece W is transported while being supported by the brush portion 16c in the first processing device 10, and the workpiece W is transported while being supported by a brush (not shown) on the table 23 in the second processing device 20. For this reason, the resistance of the workpiece W during conveyance is reduced, and it is possible to suppress the lower surface of the workpiece W from being damaged.

  Next, a forming process is performed on the workpiece W. In this forming process, the upper turret 24 and the lower turret 25 are rotated, and one set of the upper mold 24a and the lower mold 25a is selected as the punch position P. Thereafter, as shown in FIG. 7A, the cross slide 32 is moved in the X direction to perform positioning in the X direction. Further, the positioning in the Y direction is performed by moving the main body 21 in the Y direction. Further, since the workpiece holder 33 can be positioned while the workpiece W is held, an operation such as picking up the workpiece W becomes unnecessary. For this reason, position shift etc. of work W can be prevented. By such positioning of the workpiece W in the Y direction, a preset region (forming region P1: see FIG. 7B, etc.) of the workpiece W is arranged at the punch position P. When the main body 21 is moved in the Y direction, the + Y side end of the movable table 23 a provided integrally with the main body 21 protrudes to the + Y side of the second processing device 20. Thereby, interference between the lower turret 25 provided in the main body 21 and the table 23 is avoided.

Thereafter, as shown in FIG. 8A, the drive source 61 of the lower elevating unit 29 is driven to advance the slider 62 (move to the right in the drawing). Thereby, the protrusion 57 contacts the second surface 62b from the first surface 62a of the slider 62 via the inclined surface 62c, and raises the die holder 51. The die holder 51 moves along the inner peripheral surface 56 a of the fixed portion 56. As a result, the die mold portion 52 and the ejector plate 55 are also raised with respect to the lower turret 25 and the workpiece W is brought into contact with the upper surface of the ejector plate 55.

  Next, as shown in FIG. 8B, the upper elevating unit 28 (see FIG. 4A) is driven to lower the upper mold 24a. While the ejector plate 55 is lowered by the upper mold 24a, the die mold part 52 protruding upward from the ejector plate 55 enters the recess 24b, whereby the workpiece W is formed. At this time, the ejector plate 55 descends against the elastic force of the ejector spring 54 with the workpiece W sandwiched between the upper die 24a. The bolt 53 moves together with the ejector plate 55 to lower the bolt head with respect to the die holder 51. Note that the die mold part 52 is supported by the slider 62 via the die holder 51 and the protrusion 57, and receives the force during molding by the slider 62.

  In this way, after lowering the lower mold 25a of the punch position P, the upper mold 24a is lowered, so that the workpiece W is sandwiched between the upper mold 24a and the lower mold 25a to perform molding processing. . Thereafter, the upper die 24 a is raised, so that the ejector plate 55 is raised by the elastic force of the ejector spring 54. The bolt 53 is also raised at the same time, and the rise of the ejector plate 55 is stopped by locking the bolt head. As the ejector plate 55 rises, the workpiece W also rises and is separated from the die mold portion 52. In this state, the die mold portion 52 is immersed in the ejector plate 55.

  Then, the drive source 61 is driven to move the slider 62 backward (move leftward in the drawing). Accordingly, the protrusion 57 moves from the second surface 62b of the slider 62 to the first surface 62a, and lowers the die holder 51. As the die holder 51 is lowered, the die mold portion 52 and the ejector plate 55 are lowered, and the workpiece W is disposed on the pass line. The molding process is completed by the series of operations described above. Thereafter, in addition to the case where another workpiece W is transported, the same workpiece W can be moved to perform molding at another location. After the molding process, the main body 21 is retracted in the -Y direction.

  Next, the molded workpiece W is conveyed to the first processing apparatus 10. In this case, the cross slide 32 is moved in the + X direction, and the workpiece W is again arranged in the machining area 10 a of the first machining apparatus 10. Prior to the transfer of the workpiece W, the brush unit 16 is disposed in the processing region 10a. When the workpiece W is conveyed to the second processing apparatus 20 after the laser processing, the brush unit 16 may be arranged as it is without returning to the outside of the first processing apparatus 10. And after conveying the workpiece | work W to the 1st processing apparatus 10, the brush unit 16 is evacuated to the exterior of the 1st processing apparatus 10. FIG.

  Next, laser processing is performed again on the workpiece W. In this laser processing, a portion that has been connected without cutting a part of the cutting region in the previous laser processing is cut, or the outer periphery of the workpiece W is cut. Specifically, as shown in FIG. 7B, the laser beam is emitted from the laser head 11 to the workpiece W while being moved by the head driving unit 12 in the X and Y directions. To do. Thereby, a product M having a desired shape (see FIG. 9A) is generated.

  Next, the processed product M is carried out. Specifically, first, the holding of the workpiece W by the workpiece holder 33 is released. Thereafter, as shown in FIG. 9A, the processing pallet 13 is unloaded from the + X side of the first processing device 10 using, for example, an external unloading device. In addition, you may carry out the process pallet 13 by the internal mechanism of the 1st processing apparatus 10, without using an external carrying-out apparatus. The product M is carried out in a state where it is placed on the processing pallet 13 together with parts other than the product M in the workpiece W.

  In addition, when carrying out the product M, it is not limited to the case where it carries out with the process pallet 13, For example, you may carry out the product M using the collection | recovery part 17. FIG. In this case, as shown in FIG. 9B, the product M is cut from the workpiece W by laser processing and directly collected by the collection unit 17. Specifically, a cut portion of the workpiece W is disposed above the lid portion 17a. Then, the gantry 12a is moved in the −X direction, and the laser head 11 is disposed above the slit 17c formed in the lid portion 17a. Thereafter, as shown in FIG. 10A, laser light is emitted from the laser head 11 to the workpiece W. Then, the laser head 11 is moved in the Y direction along the slit 17c, and the cross slide 32 is moved in the X direction to move the workpiece W in the X direction. Thus, by cutting the workpiece W while relatively moving the laser head 11 and the workpiece W in the X direction and the Y direction, the workpiece W can be cut without moving the laser head 11 in the X direction. . The cut workpiece W is placed on the lid portion 17a. In this state, the lid portion 17a is tilted as shown in FIG. By this operation, the cut product M falls onto the conveyor 17b. For example, the product M dropped on the conveyor 17b is transported in the −Y direction by the conveyor 17b and is carried out of the first processing apparatus 10.

  As described above, according to the first embodiment, since the laser head 11 is moved in the X direction and the Y direction, processing by the laser head 11 can be performed at high speed. Further, the first processing device 10 and the second processing device 20 are arranged side by side in the X direction, and the processing by the laser head 11, the upper mold 24 a, and the lower mold 25 a is performed by a single work W holding operation by the transport device 30. Therefore, the operation of changing the workpiece W is not necessary, and the workpiece W can be processed with high accuracy. This makes it possible to take advantage of the cutting process by the movement of the laser head 11 and perform a complex process such as a molding process with high accuracy.

<Modification>
Next, a modified example will be described. FIG. 11 is a diagram illustrating an example of a plate material processing system 100A according to a modification. FIG. 11 shows an example when the plate material processing system 100A is viewed in the + X direction.

  In the said 1st Embodiment, although the 2nd processing apparatus 20 gave and demonstrated as an example the structure which the main-body part 21 can move to a Y direction with respect to the workpiece | work W, it is not limited to this. For example, as shown in FIG. 11, the main body 21 may be fixed and the upper turret 24 and the lower turret 25 may be movable in the Y direction. In this case, the upper turret 24 can move in the Y direction together with the rotation shaft 26, and the lower turret 25 can move in the Y direction together with the rotation shaft 27. According to this configuration, it is possible to move the punch position P more efficiently than in the case where the entire main body 21 is moved in the Y direction.

Next, another modification will be described. FIG. 12 is a diagram illustrating an example of a plate material processing system 100B according to a modification. FIG. 12 shows an example when the plate material processing system 100B is viewed in the −Z direction.
In the first embodiment, the first processing device 10 is disposed on the carry-in side (+ X side) of the workpiece W in the plate material processing system 100, and the second processing device 20 is disposed on the −X side of the first processing device 10. Although the structure to be described has been described as an example, the present invention is not limited to this. For example, as shown in FIG. 12, the second processing device 20 may be disposed on the carry-in side of the workpiece W, and the first processing device 10 may be disposed on the −X side of the second processing device 20.

  In this configuration, the processing pallet 13 is carried into and out of the position 13Q on the table 23 using a loader device not shown. In the first embodiment, the processing pallet 13 is carried into and out of the position 13P outside (+ X side) of the first processing apparatus 10, whereas in this configuration, the processing pallet 13 is processed to a position 13Q inside the second processing apparatus 20. The pallet 13 is directly carried in and out. In this case, there is no need to provide a loading / unloading position of the processing pallet 13 outside the first processing device 10 and the second processing device 20. Therefore, the dimension of the plate material processing system 100B in the X direction can be shortened, and space can be saved.

  The second processing apparatus 20 is provided with the same brush unit 16 as in the first embodiment. The brush unit 16 is formed so as to be able to advance and retract in the Y direction, for example, with respect to the lower position of the work W supported by the support plate 13b. The brush unit 16 has a base portion 16a, an arm portion 16b, and a brush portion 16c. Since the configuration of each part is the same as that of the first embodiment, description thereof is omitted.

  Since the first processing apparatus 10 has the same configuration as that of the first embodiment except that the arrangement in the X direction is on the −X side of the second processing apparatus 20, the description thereof is omitted. Further, the plate material processing system 100B includes a drive device (not shown) that moves the processing pallet 13 in the X direction. This drive device moves the processing pallet 13 between the position 13Q and the processing region 10a of the first processing device 10, for example.

An example of the operation of the plate material processing system 100B configured as described above will be briefly described.
First, after the processing pallet 13 is carried into the position 13Q, the work W is held by the work holder 33. Next, when laser cutting is performed on the workpiece W, the workpiece W is transferred to the first processing apparatus 10.

  In this case, the brush unit 16 provided in the second processing apparatus 20 is moved in the + Y direction and is arranged at a position below the workpiece W. Then, the workpiece W is transferred from the processing pallet 13 to the brush unit 16 by raising the brush unit 16 or lowering the processing pallet 13. After the workpiece W is transferred, the machining pallet 13 is transported in the −X direction by using a driving device and arranged in the machining area 10a. Further, the brush unit 16 provided in the first processing apparatus 10 is moved in the Y direction so that the upper end of the brush portion 16c is substantially equal to the brush unit 16 of the second processing apparatus 20. The height (position in the Z direction) is adjusted.

  Thereafter, the cross slide 32 is moved in the −X direction, and the workpiece W is positioned in the machining area 10 a of the first machining apparatus 10. At this time, for example, the workpiece W is positioned at a position overlapping the processing pallet 13. Thereafter, the workpiece W is transferred from the brush unit 16 to the support plate 13b of the processing pallet 13 in the first processing apparatus 10, and after the brush unit 16 is retracted outside the first processing apparatus 10, laser cutting is performed.

  When the forming process is performed after the laser cutting process, the work W is transferred from the support plate 13b to the brush unit 16, and the work W is conveyed in the + X direction to position the work W at a predetermined punch position. Thereafter, the workpiece W is formed by using the second processing apparatus 20. When the workpiece W is moved to the position 13Q after the forming process, the machining pallet 13 arranged in the machining area 10a of the first machining apparatus 10 (not shown) is moved in the + X direction and arranged at the position 13Q. Further, the brush units 16 are arranged so that the upper ends of the brush portions 16 c are aligned in the first processing device 10 and the second processing device 20, the cross slide 32 is moved in the + X direction, and the workpiece W is moved to the processing pallet 13. Place above. Thereafter, the workpiece W is transferred from the brush unit 16 to the processing pallet 13, and the workpiece W is placed on the support plate 13b. Thereafter, the workpiece W is unloaded together with the processing pallet 13 by a loader device (not shown).

  As described above, according to the present modification, the loading / unloading position 13Q is set on the table 23 of the second processing device 20, and therefore the processing pallet 13 is placed outside the first processing device 10 and the second processing device 20. There is no need to provide a loading / unloading position. Therefore, the dimension of the plate material processing system 100B in the X direction can be shortened, and space can be saved.

  In the example shown in FIG. 12, the configuration in which the brush unit 16 on the + X side is formed in a comb-teeth shape has been described. However, the configuration is not limited to this, and a plate-like configuration movable in the Y direction is also possible. Good. In this case, the processing pallet 13 can be moved up and down at the position 13Q so that the brush unit 16 does not interfere with the processing pallet 13 when moving in the + Y direction.

Second Embodiment
Next, a second embodiment will be described. In the second embodiment, the carriage of the transport device is movable in the Y direction, and the positional relationship between the first processing device and the second processing device is different from the first embodiment. Hereinafter, the difference from the first embodiment will be mainly described.

  FIG. 13 is a diagram illustrating an example of a plate material processing system 200 according to the second embodiment. FIG. 13A shows an example when the plate material processing system 200 is viewed in the −Z direction. FIG. 13B shows an example when the plate material processing system 200 is viewed in the −X direction. However, in FIG. 13B, illustration of the second processing apparatus 220 side is omitted.

  As shown in FIG. 13, the plate material processing system 200 includes a first processing device 210, a second processing device 220, a transport device 230, a moving device 240, and a table unit 250. The first processing device 210 is a laser processing machine that performs laser processing on a workpiece. The first processing device 210 is disposed at a position away from the loading / unloading position Q of the workpiece W toward the −X side. The first processing apparatus 210 includes a laser head 211, a head driving unit 212, and a frame 215.

  The frame 215 is formed in a U-shape when viewed in the X direction, and is disposed so as to surround a processing region 210a of a laser head 211 described later vertically. The frame 215 has a ceiling part 215a, a bottom part 215b, and a side part 215c. The ceiling portion 215a is disposed above the processing region 210a (+ Z side). The bottom portion 215b is disposed below (-Z side) the processing region 210a. The side portion 215c is disposed on the side (−Y side) of the processing region 210a. The frame 215 is in a state where the + Y side of the processing area 210a is vacant. The workpiece W is carried into and out of the machining area 210a from the + Y side of the frame 215.

  The laser head 211 is disposed on the ceiling 215a of the frame 215. The laser head 211 is provided to be movable in the X direction, the Y direction, and the Z direction by the head driving unit 212. By moving the laser head 211 in the X direction and the Y direction, a processing region 210a (see FIG. 13A) is set. The laser head 211 can process the workpiece W arranged in the processing area 210a.

  The head drive unit 212 includes a gantry 212a, a slider 212b, and an elevating unit 212c. The gantry 212a is formed in a rectangular column shape, and is arranged along the Y direction. The gantry 212a is arranged in a state of being suspended from the ceiling 215a of the frame 215. The gantry 212a is movable in the X direction by a drive mechanism (not shown).

  A guide 212e is provided on the + Z side surface of the gantry 212a. The guide 212e is formed along the Y direction and guides the slider 212b. The slider 212b is arranged from the + Z side surface to the + X side surface of the gantry 212a. The slider 212b can be moved in the Y direction along the guide 212e by a drive mechanism (not shown).

  A guide 212f is provided on the + X side surface of the slider 212b. The guide 212f is formed along the Z direction and guides the elevating part 212c. The elevating part 212c is disposed on the + X side surface of the slider 212b. The elevating part 212c is movable in the Z direction along the guide 212f by a drive mechanism (not shown).

  The laser head 211 is held by the elevating part 212c. As the gantry 212a moves in the X direction, the laser head 211, the slider 212b, and the elevating part 212c move together in the X direction. As the slider 212b moves in the Y direction, the laser head 211 and the elevating unit 212c move in the Y direction. The laser head 211 moves in the Z direction as the elevating part 212c moves in the Z direction. Thereby, the laser head 211 can move in the X direction, the Y direction, and the Z direction above the processing region 210a.

  A processing pallet 213 is disposed on the bottom 215 b of the frame 215. The processing pallet 213 is carried in or out from the −X side of the frame 215. The processing pallet 213 includes a base plate 213a and a support plate (work support portion) 213b. The base plate 213a is formed in a rectangular shape, for example. The support plate 213b supports the lower surface (the surface on the −Z side) of the workpiece W. A plurality of support plates 213b are provided on the upper surface (+ Z side surface) of the base plate 213a.

  The plurality of support plates 213b are provided in a standing state with respect to the base plate 213a, and are arranged side by side in the X direction. Each support plate 213b has, for example, a plurality of upper end portions 213c formed in a sawtooth shape. Each upper end 213c is formed to have the same height (position in the Z direction) from the base plate 213a. The processing pallet 213 can be arranged so that the height of each upper end portion 213c is the same as the height of the upper surface of a fifth table 255 described later.

  The workpiece W is placed on the plurality of upper end portions 213c. Since the plurality of upper end portions 213c have the same height, the workpiece W is disposed in a stable posture. Further, since the upper end portion 213c is formed in a sawtooth shape, the contact area between the upper end portion 213c and the workpiece W is reduced. The upper end portion 213c is not limited to a sawtooth shape, and may be a sword mountain shape or a wave shape, for example. Further, the processing pallet 213 is not limited to using a plurality of support plates 213b. For example, a plurality of pins may be arranged on the base plate 213a.

  The second processing device 220 performs a forming process on the workpiece W. The second processing device 220 is disposed on the + X side of the first processing device 210. Thus, the 1st processing apparatus 210 and the 2nd processing apparatus 220 are arrange | positioned along with the X direction, and the arrangement | positioning about a X direction differs from 1st Embodiment. The second processing apparatus 220 has a main body part 221. The main body 221 is placed on the floor, and its position is fixed. The other configuration of the main body 221 is the same as that of the first embodiment, and a description thereof will be omitted.

  The transport device 230 transports the workpiece W in the X direction and the Y direction across the first processing device 210 and the second processing device 220. The conveying device 230 is disposed on the + Y side of the work W loading / unloading position Q. The transport device 230 includes a carriage 231, a cross slide 232, and a work holder 233.

  The carriage 231 is provided so as to be movable in the Y direction by a moving device 240 described later. The carriage 231 is provided with a guide along the X direction for guiding a cross slide 232 described later.

  The cross slide 232 can be moved in the X direction along the guide by a driving device (not shown). Accordingly, the cross slide 232 can move from the −X side end of the first processing device 210 to the + X side end of the second processing device 220 so as to straddle the first processing device 210 and the second processing device 220. ing. A plurality of work holders 233 are provided on the cross slide 232. Since the specific configuration of the work holder 233 is the same as that of the first embodiment, description thereof is omitted.

  The transport device 230 transports the workpiece W in the X direction by moving the cross slide 232 in the X direction while holding the workpiece W by the workpiece holder 233. At this time, the cross slide 232 moves across the first machining apparatus 210 and the second machining apparatus 220, so that the workpiece W is conveyed across the first machining apparatus 210 and the second machining apparatus 220.

  The moving device 240 moves the transport device 230 in the Y direction. The moving device 240 has a driving mechanism (not shown) such as a ball screw mechanism. The moving device 240 is connected to the carriage 231, for example, and can move the entire conveying device 230 including the cross slide 232 and the work holder 233 in the Y direction by moving the carriage 231 in the Y direction. The carriage 231 is not connected to a table unit 250 described later, and is provided as a separate body. For this reason, the carriage 231 can move independently of the table portion 250.

  The table unit 250 includes a first table 251, a second table 252, a third table 253, a fourth table 254, and a fifth table 255. On the upper surfaces (the surfaces on the + Z side) of the first table 251 to the fifth table 255, brush portions (not shown) are formed. The brush portions are arranged at predetermined intervals in the X direction and the Y direction, respectively. For example, the upper ends of the brush portions are formed so that the heights (coordinates in the Z direction) are aligned. Each of the first table 251 to the fifth table 255 is a fixed table.

  The first table 251 is disposed at the loading / unloading position Q of the workpiece W. The second table 252 is arranged on the −Y side of the first table 251. The second table 252 supports the work W so that it does not protrude in the −Y direction when the carriage 231 holds the work W and moves in the −Y direction.

  The third table 253 is arranged on the −X side of the first table 251. The fourth table 254 is arranged on the −X side of the second table 252. The third table 253 and the fourth table 254 are arranged side by side in the Y direction. The fourth table 254 is disposed between the upper frame 21 a and the lower frame 21 b in the main body 221 of the second processing apparatus 220.

  The fifth table 255 is disposed on the −X side of the third table and on the + Y side of the frame 215 of the first processing apparatus 210. A brush unit 216 is provided on the lower side (−Z side) of the fifth table 255. The brush unit 216 is formed to be able to advance and retreat in the Y direction, for example, with respect to the lower position of the work W supported by the processing pallet 213.

  The brush unit 216 has a base 216a, an arm 216b, and a brush 216c. Since the structure of each part of the brush unit 216 is the same as that of the brush unit 16 described in the first embodiment, the description thereof is omitted. The arm portions 216b of the brush unit 216 are arranged side by side in the X direction at substantially the same pitch as the support plates 213b of the processing pallet 213. The brush unit 216 is disposed at a position where each arm 216b can enter between the support plates 213b in the + Y direction when the base 216a is moved in the + Y direction.

  Further, the brush unit 216 is provided on the lower side of the processing pallet 213 so as to be movable up and down in the Z direction. With the workpiece W supported by the support plate 213b, the arm portion 216b of the brush unit 216 is inserted between the support plates 213b, and the brush unit 216 is moved in the + Z direction, whereby the workpiece W is brushed from the support plate 213b. It becomes possible to transfer to the part 216c. Further, by moving the brush unit 216 in the −Z direction while the workpiece W is supported by the brush portion 216c, the workpiece W can be transferred from the brush portion 216c to the support plate 213b. Note that the processing pallet 213 may be configured to be movable up and down in the Z direction. In this case, the workpiece W can be transferred by moving at least one of the brush unit 216 and the processing pallet 213 up and down.

  In the plate material processing system 200 having the above configuration, when the workpiece W is loaded into the loading / unloading position Q by an external loading device or the like, the workpiece W is placed on a brush portion (not shown) of the first table 251. Thereafter, for example, when performing laser processing, the work W is first held on the fifth table 255 by holding the work W with the work holder 233 and moving the cross slide 232 in the −X direction. Next, the carriage 231 is moved in the −Y direction by the moving device 240. Prior to the movement of the carriage 231, the brush unit 216 is arranged in the processing area 210a. By moving the carriage 231 in the −Y direction in this state, the carriage 231, the cross slide 232, and the work holder 233 move together with the work W in the −Y direction, and the work W moves to the ceiling 215 a and the bottom of the frame 215. 215b. Then, the workpiece W is disposed in the processing area 210a and supported by the brush unit 216. Thereafter, the workpiece W is transferred from the brush unit 216 to the machining pallet 213 by moving the machining pallet 213 to the + Z side or moving the brush unit 216 to the −Z side. Then, after retracting the brush unit 216 in the + Y direction, the workpiece W is cut by moving the laser head 211 in the X and Y directions while emitting laser light from the laser head 211 to the workpiece W.

  Further, when forming the workpiece W, the workpiece W is moved to the second processing apparatus 220. In this case, by moving the carriage 231 and the cross slide 232, respectively, the processing target position of the workpiece W is positioned with respect to the punch position of the second processing apparatus 220. After the positioning, molding is performed by the upper mold 24a and the lower mold 25a of the second processing apparatus 220.

  When processing on the workpiece W is completed, the workpiece W is carried out of the plate material processing system 200. In this case, first, the workpiece W is placed on the processing pallet 213 by moving the carriage 231 and the cross slide 232, respectively. Thereafter, the processing pallet 213 is unloaded from the −X side of the first processing apparatus 210 using, for example, an external unloading mechanism. In addition, you may carry out the process pallet 213 by the internal mechanism of the 1st processing apparatus 210, without using an external carrying-out apparatus.

  As described above, even when the carriage 231 of the transport device 230 is movable in the Y direction, the laser head 211 can process the workpiece W while moving at high speed in the X direction and the Y direction. Further, the first processing device 210 and the second processing device 220 are arranged side by side in the X direction, and by the holding operation of the workpiece W by the transport device 230 once, the laser head 211, the upper mold 24a, and the lower mold 25a are used. Since the machining can be performed, the operation of changing the workpiece W is unnecessary, and the workpiece W can be machined with high accuracy. Accordingly, it is possible to take advantage of the cutting process by the movement of the laser head 211 and perform a complex process such as a forming process and a cutting process with high accuracy.

The embodiment has been described above, but the present invention is not limited to the above description, and various modifications can be made without departing from the gist of the present invention.
For example, in the above-described embodiment, the plate material processing system has been described by taking as an example a configuration including the first processing devices 10 and 210 that perform cutting processing and the second processing devices 20 and 220 that perform at least molding processing. It is not limited to. For example, the first processing devices 10 and 210 and the second processing devices 20 and 220 may be configured to further include a mechanism that performs other processing such as a mechanism that performs tapping and a mechanism that performs punching.

  Moreover, in the said embodiment, in the 2nd processing apparatuses 20 and 220, the upper turret 24 and the lower turret 25 are provided as a structure of the tool holder holding a processing tool (the upper side metal mold | die 24a and the lower side metal mold | die 25a). However, the present invention is not limited to this, and a block-type tool holder may be used.

  Moreover, in the said embodiment, in the 2nd processing apparatus 20 and 220, the position of any one of the workpiece | work W and a processing tool (upper metal mold | die 24a, lower metal mold | die 25a) is fixed, and the other is moved to a Y direction. Thus, the case where both are moved relatively in the Y direction has been described as an example, but the present invention is not limited to this. For example, both the workpiece W and the processing tool (the upper mold 24a and the lower mold 25a) may be moved in the Y direction.

W ... Work M ... Product P ... Punch position 10, 210 ... First processing device 10a, 210a ... Processing region 11, 211 ... Laser head 12, 212 ... Head drive unit 13 ... Processing pallet 13b, 213b ... Support plate 13c ... Upper end Part 15 ... Pallet drive part 16 ... Brush unit 16c ... Brush part 17 ... Recovery part 20,220 ... Second processing device 21,221 ... Main part 22 ... Main part drive part 23,223 ... Table 24 ... Upper turret 24a ... Upper metal Die 25 ... Lower turret 25a ... Lower mold 30, 230 ... Conveyor device 31, 23 ... Carriage 32, 232 ... Cross slide 33, 233 ... Work holder 100, 100A, 100B, 200 ... Plate material processing system 213 ... Processing pallet 215 ... Frame 240 ... Moving device 25 ... table section 251 to 255 ... the first table to fifth table

Claims (7)

A conveying device that holds a plate-shaped workpiece and conveys it in one direction;
A first processing device having a laser head for processing the workpiece held by the transport device, the laser head being movable in the one direction and a direction intersecting the one direction;
A second processing device having a processing tool for forming the workpiece held by the transfer device at a position different from the processing position by the laser head, and capable of moving the processing tool in a direction crossing the one direction; , equipped with a,
A sword-shaped or serrated or wavy workpiece support that supports the lower surface of the workpiece disposed in the processing region by the laser head;
A brush unit having a brush that is formed so as to be capable of advancing and retreating with respect to a lower position of the work supported by the work support, and on which the work can be placed;
The brush unit includes a plurality of arm portions that can enter between the work support portions, and the brush is arranged on the upper surface of the arm portions at a predetermined interval or in a row . A conveying device that holds a plate-shaped workpiece and conveys it in one direction;
A first processing device having a laser head for processing the workpiece held by the transport device, the laser head being movable in the one direction and a direction intersecting the one direction;
A second processing device having a processing tool for forming the workpiece held by the transfer device at a position different from the processing position by the laser head, and capable of moving the processing tool in a direction crossing the one direction; With
A sword-shaped or serrated or wavy workpiece support that supports the lower surface of the workpiece disposed in the processing region by the laser head;
A brush unit having a brush that is formed so as to be capable of advancing and retreating with respect to a lower position of the work supported by the work support, and on which the work can be placed;
A plate material processing system comprising a lift drive unit that changes a relative vertical position between the work support unit and the brush and places the work on either the work support unit or the brush . The second machining apparatus includes a first drive unit that moves a main body or a turret that holds a plurality of the machining tools in a direction intersecting the one direction, and relatively moves the workpiece and the machining tool. The board | plate material processing system of Claim 1 or Claim 2 . Said second processing device, said conveying device is moved in a direction intersecting the one direction, according to claim 1 or claim 2 comprising a second driving unit for relatively moving said machining tool and said workpiece Plate material processing system. 5. The plate material processing system according to claim 1 , wherein the workpiece support portion is formed on a movable processing pallet that carries the workpiece in or out of the processing region by the laser head. . The plate material processing system according to any one of claims 1 to 5 , wherein the first processing device includes a recovery unit that drops and recovers a product obtained by cutting a part of the workpiece. The said recovery part is a board | plate material processing system of Claim 6 formed in the position which can arrange | position the said workpiece | work with the said conveying apparatus, and can arrange | position the said laser head upwards.

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