JP2013152456A - Laser beam irradiation device, manufacturing device of optical member laminate, laser beam irradiation method, and manufacturing method of optical member laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam irradiation device capable of cutting and processing an object to be cut appropriately in a desired size.SOLUTION: A laser beam irradiation device of the present invention irradiates an irradiation object with a laser beam, and includes a table having a holding surface for holding the irradiation object, a scanner capable of two-axis scanning of a laser beam on a plain surface parallel with the holding surface, and a mobile device capable of moving the table relatively with respect to the scanner.

Description

  The present invention relates to a laser beam irradiation apparatus, an optical member bonding body manufacturing apparatus, a laser beam irradiation method, and an optical member bonding body manufacturing method.

  2. Description of the Related Art Conventionally, a laser light irradiation apparatus that performs predetermined processing by irradiating an irradiation object with laser light is known. Utilization of the laser beam irradiation apparatus for film cutting and the like has been studied. For example, application to a method for producing a polarizing film as described in Patent Document 1 is expected.

JP 2003-255132 A

  In order to perform processing in an arbitrary region using laser light, it is necessary not only to control the irradiation position of the laser light with high accuracy but also to expand the processing region. As a method of processing using laser light, a nozzle method and a scanner method are known, but each has advantages and disadvantages.

  For example, in the nozzle method, the laser light source is fixed and the irradiation target is moved on an XY table, or the irradiation target is fixed and the laser light source is moved. In the nozzle method, when laser light is scanned in a rectangular shape, the scanning speed becomes slow at the corners of the rectangle, and the corners may swell or wave due to thermal deformation. In the scanner method, laser light is scanned biaxially with a galvanometer mirror or the like, but since the range that can be scanned with a galvanometer mirror or the like is very narrow, it is not possible to perform high-precision processing over a wide range.

  An object of the present invention is to provide a laser light irradiation apparatus and a laser light irradiation method capable of accurately irradiating laser light over a wide range, and an optical member pasting using such a laser light irradiation apparatus and laser light irradiation method. It is providing the manufacturing method of a united manufacturing apparatus and an optical member bonding body.

  In order to achieve the above object, a laser beam irradiation apparatus of the present invention is a laser beam irradiation apparatus that irradiates an irradiation object with laser light, the table having a holding surface that holds the irradiation object, It includes a scanner capable of biaxial scanning with laser light in a plane parallel to the holding surface, and a moving device capable of relatively moving the table and the scanner.

  In the present invention, the scanner includes: a laser beam oscillator that oscillates the laser beam; and a scanning element that can scan the laser beam oscillated from the laser beam oscillator in a plane parallel to the holding surface. And a condensing lens that condenses the laser light emitted from the scanning element toward the irradiation object.

  The manufacturing apparatus of the optical member bonding body of this invention is a manufacturing apparatus of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: It is larger than the display area of the said optical display component in the said optical display component. A bonding device that bonds the optical member sheet to form a bonding sheet, and separates the facing portion of the optical member sheet from the display region and the surplus portion outside the facing portion, from the optical member sheet to the display region A cutting device that cuts out the optical member having a size corresponding to the optical member, and cuts out the optical member bonded body including the optical member that overlaps the optical display component and the optical display component from the bonding sheet, and The cutting device is configured by the laser light irradiation device according to claim 1 or 2, and is an object to be irradiated by the laser light irradiated from the laser light irradiation device. Wherein the Faculty sheet is cut.

  The laser light irradiation method of the present invention is a laser light irradiation method for irradiating an irradiation object with laser light, the first step of holding the irradiation object on a holding surface of a table, and the table and the scanner relative to each other. And a second step of irradiating the object to be irradiated with laser light that is biaxially scanned in a plane parallel to the holding surface while moving the scanner.

  The manufacturing method of the optical member bonding body of this invention is a manufacturing method of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: It is larger than the display area of the said optical display component in the said optical display component. A first step of laminating the optical member sheet to form a bonded sheet, and a portion of the optical member sheet facing the display region and a surplus portion outside the facing portion are separated, and the display from the optical member sheet A second step of cutting out the optical member bonded body including the optical display component and the optical member overlapping the optical display component from the bonding sheet by cutting out the optical member having a size corresponding to a region; In addition, as the second step, the optical member sheet as an irradiation object is cut by the laser beam using the laser beam irradiation method according to claim 4.

That is, this invention has the following aspects.
The laser light irradiation apparatus according to the first aspect of the present invention is a laser light irradiation apparatus that irradiates an irradiation object with laser light, a table having a holding surface that holds the irradiation object, and a parallel to the holding surface. A scanner capable of two-axis scanning with laser light in a plane; and a moving device capable of relatively moving the table and the scanner.

  In the laser beam irradiation apparatus according to the first aspect of the present invention, the scanner includes a laser beam oscillator that oscillates the laser beam, and a plane parallel to the holding surface that emits the laser beam oscillated by the laser beam oscillator. It is preferable that a scanning element capable of two-axis scanning and a condensing lens that condenses the laser light emitted from the scanning element toward the irradiation target.

  The manufacturing apparatus of the optical member bonding body of the 2nd aspect of this invention is a manufacturing apparatus of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: Display of the said optical display component on the said optical display component A bonding apparatus that forms a bonding sheet by laminating an optical member sheet that is larger than the area, and a facing part of the optical member sheet that faces the display area and a surplus part that is located outside the facing part are separated. The optical member bonding body including the optical member overlapping the optical display component and the optical display component from the bonding sheet by cutting out the optical member having a size corresponding to the display area from the optical member sheet. The optical unit which is cut out and configured by the laser light irradiation device of the first aspect described above, and is an object to be irradiated by the laser light irradiated from the laser light irradiation device Including a cutting device for cutting the sheet.

  The laser beam irradiation method of the third aspect of the present invention is a laser beam irradiation method for irradiating an irradiation object with laser light, holding the irradiation object on a holding surface of a table (first step), While the table and the scanner are relatively moved, the irradiation object is irradiated with laser light that has been biaxially scanned in a plane parallel to the holding surface from the scanner (second step).

  The manufacturing method of the optical member bonding body of the 4th aspect of this invention is a manufacturing method of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: Display of the said optical display component on the said optical display component An optical member sheet that is larger than the region is bonded to form a bonding sheet (first step), an opposing portion of the optical member sheet that faces the display region, and a surplus portion that is positioned outside the opposing portion; The optical member including the optical member overlapping the optical display component and the optical display component from the bonding sheet by cutting out the optical member having a size corresponding to the display area from the optical member sheet The bonded body is cut out, and the optical member sheet that is the irradiation object is cut with laser light using the laser light irradiation method of the third aspect described above (second step).

  ADVANTAGE OF THE INVENTION According to this invention, providing the laser beam irradiation apparatus which can irradiate a laser beam accurately over a wide range, the manufacturing apparatus of an optical member bonding body, the laser beam irradiation method, and the manufacturing method of an optical member bonding body. it can.

It is a schematic diagram which shows one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is a perspective view of the laser beam irradiation apparatus in one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is a perspective view which shows the internal structure of the 2nd cutting device in one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is a perspective view which shows the 2nd bonding apparatus periphery in one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is sectional drawing which shows the 1st bonding sheet | seat in one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is sectional drawing which shows the 2nd bonding sheet | seat in the 2nd cutting device in one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is a top view which shows the 3rd bonding sheet | seat in the 3rd cutting device in one Embodiment of the manufacturing apparatus of the optical member bonding body of this invention. It is AA sectional drawing of FIG. It is sectional drawing which shows the double-sided bonding panel which passed through the manufacturing apparatus of the optical member bonding body of this invention. It is sectional drawing which shows the cut end formed with the laser of the optical member sheet | seat bonded to the liquid crystal panel. It is sectional drawing which shows the cutting end formed with the laser of the optical member sheet single-piece | unit. It is a flowchart which shows one Embodiment of the laser beam irradiation method of this invention. In one Embodiment of the laser beam irradiation method of this invention, it is a figure which shows the control method for a laser beam to draw a desired locus | trajectory.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

  In all the following drawings, the dimensions and ratios of the respective components are appropriately changed from the actual ones in order to make the respective components large enough to be recognized on the drawings. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

  In the following description, an XYZ orthogonal coordinate system is set as necessary, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the present embodiment, the width direction of the optical display component (liquid crystal panel) is the X direction, and the direction orthogonal to the X direction (the transport direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to the Z direction is taken as the Z direction.

  Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the production system of an optical display device is illustrated as a manufacturing apparatus of an optical member bonding body, and the film bonding system which comprises a part of production system is demonstrated.

  FIG. 1: shows schematic structure of the film bonding system 1 (manufacturing apparatus of an optical member bonding body) of this embodiment. The film bonding system 1 bonds a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel. The film bonding system 1 manufactures an optical member bonding body including the optical display component and the optical member. In the film bonding system 1, a liquid crystal panel P is used as the optical display component. Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.

The film bonding system 1 sequentially performs a predetermined process on the liquid crystal panel P while transporting the liquid crystal panel P from the start position to the end position of the bonding process using, for example, a driving roller conveyor 5. The liquid crystal panel P is conveyed on the roller conveyor 5 with its front and back surfaces being horizontal.
In the drawing, the left side (−Y direction side) is the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side), and the right side in the diagram (+ Y direction side) is the downstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as “the transport side”). , Referred to as the panel conveyance downstream side).

  As shown in FIG. 7, the liquid crystal panel P has a rectangular shape in a plan view, and a display region P <b> 4 having an outer shape along the outer peripheral edge is formed inside the outer peripheral edge by a predetermined width. The liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport with respect to the second alignment device 14 to be described later, and the panel transport downstream of the second alignment device 14. On the side, the display area P4 is transported in a direction substantially along the transport direction.

  The first optical member sheet F1 (optical member sheet), the second optical member sheet F2 (optical member sheet), and the third optical member sheet F3 (optical member sheet) having a long strip shape with respect to the front and back surfaces of the liquid crystal panel P. ), The first optical member F11 (optical member), the second optical member F12 (optical member), and the third optical member F13 (optical member) cut out from each other are appropriately bonded. As shown in FIG. 9, in the present embodiment, the first optical member F <b> 11 and the third optical member F <b> 13 as polarizing films are bonded to both surfaces located on the backlight side and the display surface side of the liquid crystal panel P, respectively. The On the surface of the liquid crystal panel P located on the backlight side, a second optical member F12 as a brightness enhancement film is further bonded to the first optical member F11.

  As shown in FIG. 1, the film bonding system 1 conveys liquid crystal panel P on the panel conveyance upstream side of the roller conveyor 5 from an upstream process. The film bonding system 1 includes a first alignment device 11, a first bonding device 12 (bonding device), a first cutting device 13, a second alignment device 14, a second bonding device 15, and a first bonding device 15. 2 is provided with a cutting device 16 (scanner), a third alignment device 17, a third bonding device 18, and a third cutting device 19 (scanner).

  The first alignment device 11 holds the liquid crystal panel P and freely conveys it in the vertical direction (Z direction) and the horizontal direction (XY direction). The first alignment apparatus 11 has a pair of cameras that image the upstream and downstream ends of the liquid crystal panel P, for example. The imaging data of the camera is sent to the control device 20. The control device 20 operates the first alignment device 11 based on the imaging data and the inspection data in the optical axis direction stored in advance. Similarly, the second alignment device 14 and the third alignment device 17 have the camera, and use image data of the camera for alignment.

  The first alignment device 11 performs alignment of the liquid crystal panel P with respect to the first bonding device 12 under the control of the control device 20. At this time, the liquid crystal panel P is positioned in a horizontal direction (X direction) (hereinafter referred to as a component width direction) orthogonal to the transport direction (Y direction), and a turning direction (hereinafter referred to as Z axis). Positioning in the swivel direction). In this state, the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.

  The 1st bonding apparatus 12 is provided in the panel conveyance downstream rather than the 1st alignment apparatus 11. FIG. The 1st bonding apparatus 12 bonds the upper surface (backlight side) of liquid crystal panel P conveyed below the lower surface of the elongate 1st optical member sheet | seat F1 introduced into the bonding position. .

  The 1st bonding apparatus 12 is provided with the conveying apparatus 12a and the pinching roll 12b. The conveying device 12a conveys the first optical member sheet F1 along the longitudinal direction while unwinding the first optical member sheet F1 from the first raw roll R1 around which the first optical member sheet F1 is wound. The pinching roll 12b bonds the upper surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the lower surface of the first optical member sheet F1 conveyed by the conveying device 12a.

  The transport device 12a includes a holding unit 12c and a collection unit 12d. The holding portion 12c holds the first original fabric roll R1 around which the first optical member sheet F1 is wound, and feeds the first optical member sheet F1 along its longitudinal direction. The collection unit 12d collects the protection film pf which is overlapped on the upper surface of the first optical member sheet F1 and is fed out together with the first optical member sheet F1, on the downstream side of the panel transfer of the first bonding apparatus 12. The conveying device 12a is a bonding position in the first bonding device 12, so that the bonding surface of the first optical member sheet F1 on which the first optical member sheet F1 and the liquid crystal panel P are bonded faces downward. A conveyance path for the first optical member sheet F1 is set.

  The pinching roll 12b has a pair of laminating rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the first bonding device 12. The liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced into the gap. The liquid crystal panel P and the first optical member sheet F1 are sent out to the downstream side of the panel conveyance while being pressed between the bonding rollers. Thereby, the 1st bonding sheet | seat F21 (bonding sheet | seat) which bonded several liquid crystal panels P continuously to the lower surface of the elongate 1st optical member sheet | seat F1 at predetermined intervals is formed.

  The 1st cutting device 13 is located in the panel conveyance downstream rather than the collection | recovery part 12d. The 1st cutting device 13 cut | disconnects the 1st optical member sheet | seat F1 of the 1st bonding sheet | seat F21, and is larger than the display area P4 (this embodiment is larger than liquid crystal panel P) sheet piece F1S (refer FIG. 6). Therefore, a predetermined portion (between the liquid crystal panels P arranged in the transport direction) of the first optical member sheet F1 is cut over the entire width in the component width direction. It does not matter whether a cutting blade or a laser cutter is used as the first cutting device 13. By the said cutting | disconnection, the 1st single-sided bonding panel P11 (1st optical member bonding body) by which the said sheet piece F1S larger than the display area P4 was bonded on the upper surface of liquid crystal panel P is formed.

  The 2nd alignment apparatus 14 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 12 and the 1st cutting device 13. FIG. The second alignment device 14 holds, for example, the first single-sided bonding panel P11 on the roller conveyor 5 and turns 90 ° around the vertical axis. Thereby, the 1st single-sided bonding panel P11 currently conveyed substantially parallel to the short side of the display area P4 changes direction so that it may be conveyed substantially parallel to the long side of the display area P4. In addition, the said turning is made | formed when the optical axis direction of the other optical member sheet | seat bonded to liquid crystal panel P is arrange | positioned at right angle with respect to the optical axis direction of the 1st optical member sheet | seat F1.

  The second alignment device 14 performs the same alignment as the first alignment device 11. That is, the second alignment device 14 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera C, and the component width direction of the first single-sided bonding panel P11 with respect to the second bonding device 15. And positioning in the turning direction. In this state, the first single-sided bonding panel P <b> 11 is introduced into the bonding position of the second bonding device 15.

  The 2nd bonding apparatus 15 is provided in the panel conveyance downstream rather than the 2nd alignment apparatus 14. FIG. The 2nd bonding apparatus 15 is the upper surface (of liquid crystal panel P of the 1st single-sided bonding panel P11 conveyed below that with respect to the lower surface of the elongate 2nd optical member sheet | seat F2 introduced into the bonding position. Paste the backlight side.

  The 2nd bonding apparatus 15 is provided with the conveying apparatus 15a and the pinching roll 15b. The conveying device 15a conveys the second optical member sheet F2 along the longitudinal direction while unwinding the second optical member sheet F2 from the second original roll R2 around which the second optical member sheet F2 is wound. The pinching roll 15b bonds the upper surface of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the lower surface of the 2nd optical member sheet | seat F2 which the conveying apparatus 15a conveys.

  The transport device 15a includes a holding unit 15c and a collection unit 15d. The holding portion 15c holds the second original roll R2 around which the second optical member sheet F2 is wound, and feeds the second optical member sheet F2 along its longitudinal direction. The collection unit 15d collects an excess portion of the second optical member sheet F2 that has passed through the second cutting device 16. The conveying apparatus 15a is the bonding position in the 2nd bonding apparatus 15, and the bonding surface of the 2nd optical member sheet | seat F2 with which the 2nd optical member sheet | seat F2 and 1st single-sided bonding panel P11 are bonded is downward. The conveyance path of the second optical member sheet F2 is set so as to face.

  The pinching roll 15b has a pair of bonding rollers arranged with the axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the second bonding device 15. The first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced into the gap. These 1st single-sided bonding panels P11 and the 2nd optical member sheet | seat F2 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 2nd bonding sheet | seat F22 (bonding sheet | seat) which continuously bonded the some 1st single-sided bonding panel P11 on the lower surface of the elongate 2nd optical member sheet | seat F2 at predetermined intervals formed. Is done.

  The 2nd cutting device 16 is located in the panel conveyance downstream rather than the pinching roll 15b. The 2nd cutting device 16 cut | disconnects the 2nd optical member sheet | seat F2 and the sheet piece F1S of the 1st optical member sheet | seat F1 of the 1st single-sided bonding panel P11 bonded to the lower surface at that time (refer FIG. 4). The second cutting device 16 moves the second optical member sheet F2 and the sheet piece F1S of the first optical member sheet F1 along the outer peripheral edge of the display region P4 (in this embodiment, along the outer peripheral edge of the liquid crystal panel P). Cut endlessly. By cutting the optical member sheets F1 and F2 together after being bonded to the liquid crystal panel P, the accuracy in the optical axis direction of the optical member sheets F1 and F2 is increased, and the opticalness between the optical member sheets F1 and F2 is increased. The axial displacement is eliminated, and the cutting with the first cutting device 13 is simplified.

  In addition, in this embodiment, although the case where the 2nd optical member sheet | seat F2 and the sheet piece F1S are cut | disconnected at that time is mentioned, this invention is not limited to embodiment mentioned above. For example, the present invention can be applied even when only the second optical member sheet F2 is cut. Specifically, only the second optical member sheet F2 can be cut after the second optical member sheet F2 is bonded to the first single-sided bonding panel P11 in a larger size. According to this method, the pasting accuracy at the time of pasting the 2nd optical member sheet F2 on the 1st single side pasting panel P11 becomes unnecessary, and it also becomes possible to cut a picture frame.

  As shown in FIG. 8, by cutting the second cutting device 16, a second single-sided bonding panel P12 (optical member) in which the first optical member F11 and the second optical member F12 are overlapped and bonded to the upper surface of the liquid crystal panel P. A bonding body and a 2nd optical member bonding body) are formed.

Moreover, at this time, as shown in FIG. 4, each optical member sheet | seat F1, F2 which the opposing part (each optical member F11, F12) of 2nd single-sided bonding panel P12 and the display area P4 is cut off, and remains in frame shape. Are separated from the surplus part. A plurality of surplus portions of the second optical member sheet F2 are connected in a ladder shape, and the surplus portions are wound around the recovery portion 15d together with the surplus portions of the first optical member sheet F1.
Here, the “part facing the display region P4” is a region having a size not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and functions such as an electrical component mounting portion. Indicates the area that avoids the part. In the present embodiment, the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the three sides excluding the functional portion in the rectangular liquid crystal panel P in plan view. In addition, on one side corresponding to the functional portion, the surplus portion is laser-cut at a position where it appropriately enters the display region P4 side from the outer peripheral edge of the liquid crystal panel P.

  Returning to FIG. 1, the third alignment device 17 is provided on the panel transport downstream side of the second bonding device 15 and the second cutting device 16. The third alignment device 17 inverts the front and back surfaces of the second single-sided bonding panel P12 with the backlight side of the liquid crystal panel P as the upper surface so that the display surface side of the liquid crystal panel P is the upper surface, and the first Alignment similar to the alignment device 11 and the second alignment device 14 is performed. That is, the 3rd alignment apparatus 17 is based on the inspection data of the optical axis direction memorize | stored in the control apparatus 20, and the imaging data of the said camera in the component width direction of the 2nd single-sided bonding panel P12 with respect to the 3rd bonding apparatus 18. FIG. And positioning in the turning direction. In this state, the second single-sided bonding panel P <b> 12 is introduced into the bonding position of the third bonding device 18.

  The 3rd bonding apparatus 18 is provided in the panel conveyance downstream rather than the 3rd alignment apparatus 17. FIG. The 3rd bonding apparatus 18 is the upper surface of 2nd single-sided bonding panel P12 conveyed below with respect to the lower surface of the elongate 3rd optical member sheet | seat F3 introduced into the bonding position (of liquid crystal panel P). Adhere the display surface side).

  The 3rd bonding apparatus 18 is provided with the conveying apparatus 18a and the pinching roll 18b. The conveyance device 18a conveys the third optical member sheet F3 along the longitudinal direction while unwinding the third optical member sheet F3 from the third original roll R3 around which the third optical member sheet F3 is wound. The pinching roll 18b bonds the upper surface of the 2nd single-sided bonding panel P12 which the roller conveyor 5 conveys to the lower surface of the 3rd optical member sheet | seat F3 which the conveying apparatus 18a conveys.

  The transport device 18a includes a holding unit 18c and a collection unit 18d. The holding portion 18c holds the third original fabric roll R3 around which the third optical member sheet F3 is wound, and feeds the third optical member sheet F3 along its longitudinal direction. The collection unit 18d collects an excess portion of the third optical member sheet F3 that has passed through the third cutting device 19 positioned on the downstream side of the panel conveyance with respect to the pinching roll 18b.

  The conveying apparatus 18a is the bonding position in the 3rd bonding apparatus 18, and the bonding surface of the 3rd optical member sheet | seat F3 on which the 3rd optical member sheet | seat F3 and the 2nd single-sided bonding panel P12 are bonded is downward. A conveyance path of the third optical member sheet F3 is set so as to face.

  The pinching roll 18b has a pair of pasting rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18. In the gap, the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced. These 2nd single-sided bonding panels P12 and the 3rd optical member sheet | seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 3rd bonding sheet | seat F23 (bonding sheet | seat) which continuously bonded several 2nd single-sided bonding panel P12 on the lower surface of the elongate 3rd optical member sheet | seat F3 forming predetermined space | interval is formed. Is done.

  The 3rd cutting device 19 is located in a panel conveyance downstream rather than the pinching roll 18b, and cut | disconnects the 3rd optical member sheet | seat F3. The third cutting device 19 is a laser beam irradiation device similar to the second cutting device 16 (see FIGS. 2 and 3). The third cutting device 19 cuts the third optical member sheet F3 endlessly along the outer peripheral edge of the display region P4 (for example, along the outer peripheral edge of the liquid crystal panel P).

  As shown in FIG. 9, the double-sided bonding panel P13 (the optical member bonding body, the second optical material) in which the third optical member F13 is bonded to the upper surface of the second single-sided bonding panel P12 by cutting the third cutting device 19 is used. Member bonding body) is formed.

  Moreover, at this time, as shown in FIG. 2, the surplus part of the 3rd optical member sheet | seat F3 which a double-sided bonding panel P13 and the opposing part (3rd optical member F13) of display area P4 are cut off, and remain in frame shape, Are separated. Similar to the surplus portion of the second optical member sheet F2, a plurality of surplus portions of the third optical member sheet F3 are connected in a ladder shape, and the surplus portions are wound around the collection unit 18d.

  After the double-sided bonding panel P13 is inspected for defects (such as poor bonding) through a defect inspection device (not shown), it is transported to the downstream process and subjected to other processes.

  As shown in FIG. 5, the liquid crystal panel P includes, for example, a rectangular first substrate P1 made of, for example, a TFT substrate, a second substrate P2 having the same rectangular shape disposed opposite to the first substrate P1, and a first substrate. A liquid crystal layer P3 sealed between P1 and the second substrate P2 is included. For convenience of illustration, hatching of each layer in the cross-sectional view may be omitted.

  As shown in FIGS. 7 and 8, the first substrate P1 has three outer peripheral edges along the corresponding three sides of the second substrate P2, and the remaining one of the outer peripheral edges corresponds to the second substrate P2. Project outside of one side. As a result, an electrical component mounting portion P5 that projects outward from the second substrate P2 is provided on the one side of the first substrate P1.

  As shown in FIGS. 6 and 8, the second cutting device 16 detects the outer peripheral edge of the display area P4 with a detecting means such as a camera 16a, and the first and second optical elements along the outer peripheral edge of the display area P4. The member sheets F1 and F2 are cut. Further, the third cutting device 19 similarly cuts the third optical member sheet F3 along the outer peripheral edge and the like of the display area P4 while detecting the outer peripheral edge of the display area P4 by a detecting means such as a camera 19a. Outside the display area P4, a frame portion G having a predetermined width for arranging a sealant or the like for bonding the first substrate P1 and the second substrate P2 is provided, and each cutting device 16, 19 is within the width of the frame portion G. Laser cutting is done.

  As shown in FIG. 11, when the resin-made optical member sheet FX is laser-cut alone, the cut end t may swell or wave due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.

  On the other hand, as shown in FIG. 10, in this embodiment in which the optical member sheet FX is laser-cut after the optical member sheet FX is bonded to the liquid crystal panel P, the cut end t of the optical member sheet FX is the glass surface of the liquid crystal panel P. Therefore, the cut end t of the optical member sheet FX is not swollen or undulated, and the bonding failure cannot occur because it is after bonding to the liquid crystal panel P.

  The runout width (tolerance) of the cutting line formed by the laser processing machine is smaller than the runout width of the cutting line formed by the cutting blade. Therefore, in this embodiment, the optical member sheet FX is cut using the cutting blade. As compared with the above, the width of the frame portion G can be reduced, and the liquid crystal panel P can be downsized and / or the display area P4 can be enlarged. Such an optical member sheet is effective for application to a high-function mobile device that requires an enlargement of the display screen while the size of the housing is limited, such as a recent smartphone or tablet terminal.

  In addition, when the optical member sheet FX is cut into a sheet piece aligned with the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and their relative bonding Since the positional dimensional tolerances overlap, it is difficult to reduce the width of the frame portion G of the liquid crystal panel P (it is difficult to enlarge the display area).

  On the other hand, when the optical member sheet FX is bonded to the liquid crystal panel P and then cut in accordance with the display region P4, only the runout tolerance of the cutting line needs to be considered, and the width tolerance of the frame portion G can be reduced. (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

Further, by cutting the optical member sheet FX with a laser instead of a blade, the cutting force is not input to the liquid crystal panel P, and it becomes difficult for cracks and chips to occur at the edge of the substrate of the liquid crystal panel P, such as a heat cycle. The durability against is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion P5.
In the case where the optical member sheet FX is cut with a laser, the energy per unit length of laser irradiation is preferably determined in consideration of the thickness and configuration of the liquid crystal panel P and the optical member sheet FX.
In the present embodiment, when the optical member sheet FX is cut with a laser, it is preferable to perform laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length. If the energy per unit length is too large in laser irradiation, the optical member sheet FX may be damaged when the optical member sheet FX is cut with a laser. However, it is possible to prevent the optical member sheet FX from being damaged by performing laser irradiation within an energy range of 0.01 to 0.11 (J / mm) per unit length.

  As shown in FIG. 7, when laser cutting the optical member sheet FX (the third optical member sheet F3 in FIG. 7), for example, a laser cut start point pt1 is set on the extension of one long side of the display area P4, and this First, the cutting of the one long side is started from the starting point pt1. The end point pt2 of the laser cut is set at a position where the laser goes around the display area P4 and reaches the extension of the short side on the start point side of the display area P4. The start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.

  Returning to FIG. 1, the control device 20 of the present embodiment includes a computer system. This computer system includes an arithmetic processing unit 20a such as a CPU and a storage unit 20b such as a memory or a hard disk. The control device 20 of the present embodiment includes an interface capable of executing communication with a device external to the computer system. An input device that can input an input signal may be connected to the control device 20. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control device 20 may include a display device such as a liquid crystal display that indicates the operation status of each part of the film bonding system 1, or may be connected to the display device.

  An operating system (OS) that controls the computer system is installed in the storage unit 20b of the control device 20. The storage unit 20b of the control device 20 causes the arithmetic processing unit 20a to control each unit of the film bonding system 1, thereby causing the respective units of the film bonding system 1 to perform processing for accurately conveying the polarizing film F. The program is recorded. Various types of information including programs recorded in the storage unit 20b can be read by the arithmetic processing unit 20a of the control device 20. The control device 20 may include a logic circuit such as an ASIC that executes various processes required for controlling each part of the film bonding system 1.

  The storage unit 20b is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium. Functionally, the storage unit 20b stores program software describing a control procedure for the operation of the moving device 32 and the operations of the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 (scanning element). Area, a storage area for storing the irradiation position in the optical member sheet FX for realizing the desired locus shown in FIG. 3 as coordinate data, and an amount of movement of the second cutting device 16 in each direction of XYZ in FIG. Is set, and other various storage areas are set.

(Laser beam irradiation device)
FIG. 2 is a perspective view showing an example of a laser beam irradiation device 30 used as a cutting portion (cutting device) of the optical member sheet.

  As shown in FIG. 2, the laser light irradiation device 30 includes a table 31, a scanner as the second cutting device 16, a moving device 32, and a control device 33. The laser beam irradiation device 30 is a device for irradiating the optical member sheet FX with laser light and cutting the optical member sheet FX into optical members FS having a predetermined size. In FIG. 2, a scanner as the second cutting device 16 will be described. However, the scanner can be applied as the third cutting device 19.

  The table 31 has a holding surface 31a that holds the optical member sheet FX (irradiation target). The second cutting device 16 emits laser light to the optical member sheet FX in order to cut the optical member sheet FX held on the table 31.

  The second cutting device 16 is capable of biaxial scanning with laser light in a plane parallel to the holding surface 31a of the table 31 (in the XY plane). That is, the second cutting device 16 can be moved relative to the table 31 independently in the X direction and the Y direction, thereby moving the second cutting device 16 to an arbitrary position on the table 31, It is possible to irradiate the laser beam with high accuracy to an arbitrary position of the optical member sheet FX held on the table 31.

  The moving device 32 can relatively move the table 31 and the second cutting device 16. The moving device 32 moves the table 31 and the second cutting device 16 in a first direction V1 (X direction) parallel to the holding surface 31a, and a second direction parallel to the holding surface 31a and orthogonal to the first direction V1. V2 (Y direction) is relatively moved in the third direction V3 (Z direction) which is the normal direction of the holding surface 31a. In the present embodiment, the moving device 32 moves only the second cutting device 16 without moving the table 31.

  For example, the second cutting device 16 is provided with a slider mechanism (not shown) that allows the second cutting device 16 to move in each direction of XYZ. The moving device 32 operates the linear motor built in the slider mechanism to move the second cutting device 16 in each direction of XYZ. The linear motor that is pulse-driven in the slider mechanism can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Therefore, the position in each direction of XYZ of the 2nd cutting device 16 supported by the slider mechanism can be controlled with high precision. Note that the position control of the second cutting device 16 is not limited to position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.

  The relative movement method by the moving device is not limited to the above-described embodiment. For example, the table 31 and the second cutting device 16 are moved relative to each other by moving only the table 31 without moving the second cutting device 16 or by moving both the table 31 and the second cutting device 16. Even in this case, the present invention can be applied.

  FIG. 3 is a perspective view showing an internal configuration of the second cutting device (scanner) 16 in the laser light irradiation device 30. In FIG. 3, illustration of the moving device 32 and the control device 33 is omitted for the sake of convenience.

  As shown in FIG. 3, the second cutting device 16 includes a laser beam oscillator 160, a first irradiation position adjustment device 161, a second irradiation position adjustment device 162, and a condenser lens 163.

The laser beam oscillator 160 is a member that oscillates the laser beam L. For example, the laser oscillator 160 may be a CO ₂ laser oscillator (carbon dioxide laser oscillator), a UV laser oscillator, a semiconductor laser oscillator, a YAG laser oscillator, an excimer laser oscillator, or the like. Although an oscillator can be used, a specific configuration is not particularly limited. Among the above-described examples, the CO ₂ laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for, for example, cutting of a polarizing film.

  The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 constitute a scanning element capable of biaxially scanning the laser beam oscillated from the laser beam oscillator 160 in a plane parallel to the holding surface 31a. . As the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162, for example, a galvano scanner is used. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are arranged in this order on the optical path of the laser light between the laser light oscillator 160 and the condenser lens 163. The scanning element is not limited to a galvano scanner, and a gimbal can be used.

  The first irradiation position adjusting device 161 includes a mirror 161a and an actuator 161b that adjusts the installation angle of the mirror 161a. The actuator 161b has a rotation shaft 161c parallel to the Z direction. The rotating shaft 161c is connected to the mirror 161a. The actuator 161b rotates the mirror 161a around the Z axis based on the control of the control device 33.

  The 2nd irradiation position adjustment apparatus 162 is provided with the mirror 162a and the actuator 162b which adjusts the installation angle of the mirror 162a. The actuator 162b has a rotation shaft 162c parallel to the Y direction. The rotating shaft 162c is connected to the mirror 162a. The actuator 162b rotates the mirror 162a around the Y axis based on the control of the control device 33.

  The laser beam L oscillated from the laser beam oscillator 160 is applied to the optical member sheet FX held on the table 31 via the mirror 161a, the mirror 162a, and the condenser lens 163. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are laser beams irradiated toward the optical member sheet FX held on the table 31 from the laser beam oscillator 160 based on the control of the control device 33. Adjust the irradiation position.

  Based on the control of the control device 33, the actuators 161b and 162b rotate the mirrors 161a and 162a to adjust the optical path of the laser light L emitted toward the optical member sheet FX. For example, the optical path of the laser beam L is changed from the state indicated by the solid line in FIG. 3 to the state indicated by the one-dot chain line or the state indicated by the two-dot difference line.

  When the optical path of the laser beam L is positioned in a state indicated by a solid line by the rotation of the mirror 161a and the mirror 162a, the laser beam L oscillated from the laser beam oscillator 160 is collected at the condensing point Qa. .

  When the optical path of the laser beam L is positioned in the state indicated by the alternate long and short dash line by the rotation of the mirror 161a and the mirror 162a, the laser beam L oscillated from the laser beam oscillator 160 is displaced by a predetermined amount from the condensing point Qa. The light is condensed on the condensing point Qb.

  When the optical path of the laser light L is positioned in a state indicated by a two-dot chain line by the rotation of the mirror 161a and the mirror 162a, the laser light L oscillated from the laser light oscillator 160 is a predetermined amount from the condensing point Qa. It is condensed on the displaced condensing point Qc.

  With such a configuration, the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are focused on the optical member sheet FX held on the table 31 by the focusing lens 163 based on the control of the control device 33. The condensing point position (Qa, Qb, Qc) of the laser beam L to be adjusted is adjusted.

  The condensing lens 163 is disposed at the tip of the second cutting device 16 (the portion facing the optical member sheet FX). The condensing lens 163 condenses the laser light L, which is oscillated from the laser light oscillator 160 and whose optical path is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, at a predetermined position of the optical member sheet FX. To do.

  For example, as the condenser lens 163, an fθ lens is used. Accordingly, the laser beam L indicated by the solid line, the one-dot chain line, and the two-dot chain line input in parallel to the condenser lens 163 from the mirror 162a can be condensed in parallel to the optical member sheet FX.

  The control device 33 moves the moving device 32, the first irradiation position adjusting device 161, the first irradiation position so that the laser beam L emitted from the second cutting device 16 draws a desired locus on the optical member sheet FX held on the table 31. 2 The irradiation position adjusting device 162 is controlled.

(Laser light irradiation method)
FIG. 12 is a flowchart showing an embodiment of the laser beam irradiation method of the present invention.
The laser light irradiation method of this embodiment is a cutting method for cutting the optical member sheet FX into optical members FS of a predetermined size using the laser light irradiation device 30 shown in FIG. In the laser beam irradiation method of the present embodiment, the first step of holding the optical member sheet FX on the holding surface 31a of the table 31, and the table 31 and the second cutting device 16 are held from the second cutting device 16 while being relatively moved. And a second step of irradiating the optical member sheet FX with laser light that has been biaxially scanned in a plane parallel to the surface 31a. In the second step, the table 31 and the second cutting device 16 are held so that the laser beam emitted from the second cutting device 16 draws a desired locus on the optical member sheet FX held on the table 31. Irradiate the optical member sheet FX held relative to the first direction V1 parallel to the surface 31a and the second direction V2 parallel to the holding surface 31a and perpendicular to the first direction V1 and held on the table 31 The irradiation position of the laser beam to be adjusted is adjusted.
Hereinafter, an operation until the optical member sheet FX is cut into an optical member FS having a predetermined size using the laser beam irradiation device 30 will be described.

  First, an original fabric roll (for example, first original fabric roll R1) of an optical member sheet (for example, first optical member sheet F1) to be used is loaded into the holding portion 12c. After this loading is completed, the operator makes initial settings using the operation panel or the like (step S1 shown in FIG. 12). For example, the cutting size, thickness, supply speed, laser light output and depth of focus, feeding speed of the holding unit 12c, transport speed of the roller conveyor 5, and the like are set by the initial setting.

  When the initial setting is completed, the roller conveyor 5 starts conveying the liquid crystal panel P based on the control of the control device 20 (step S2 shown in FIG. 12).

  In the liquid crystal panel P, the alignment by the first alignment device 11 is performed based on the control of the control device 20, the first bonding sheet F <b> 21 is formed by the first bonding device 12, and the first cutting device 13. The 1st single-sided bonding panel P11 by is formed, alignment by the 2nd alignment apparatus 14 is performed, and formation of the 2nd bonding sheet | seat F22 by the 2nd bonding apparatus 15 is performed.

  Thereafter, the liquid crystal panel P is stopped at a predetermined position (step S3 shown in FIG. 12). For example, the liquid crystal panel P is held on the holding surface 31 a of the table 31 based on the control of the control device 20.

  Next, the optical member sheet FX held on the table 31 is irradiated with laser light to cut out an optical member of a predetermined size from the optical member sheet (step S4 shown in FIG. 12). In the present embodiment, the control device 33 draws a desired locus on the optical member sheet FX held by the table 31 based on the control of the control device 20 so that the laser light emitted from the second cutting device 16 is drawn on the table 31. The moving device 32, the first irradiation position adjusting device 161, and the second irradiation position adjusting device 162 are controlled.

  FIG. 13 is a diagram illustrating a control method for scanning laser light in a rectangular shape on the optical member sheet FX. In FIG. 13, symbol Tr is a target laser beam movement locus (desired locus; hereinafter, referred to as laser beam movement locus). Reference numeral Tr <b> 1 indicates a trajectory (hereinafter sometimes referred to as a light source movement trajectory) obtained by projecting a movement trajectory due to relative movement between the table 31 and the second cutting device 16 onto the optical member sheet FX. The light source movement trajectory Tr1 has a shape in which four corners of the laser movement trajectory Tr having a rectangular shape are curved, the symbol SA1 is a straight section other than the corner, and the symbol SA2 is a bent section of the corner. Reference numeral Tr2 indicates that the irradiation position of the laser beam is orthogonal to the light source movement locus Tr1 by the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162 when the second cutting device 16 is relatively moving on the light source movement locus Tr1. It shows a curve (hereinafter sometimes referred to as an adjustment curve) that indicates how much the direction is shifted (adjusted). The deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.

  As shown in FIG. 13, the light source movement trajectory Tr1 depicts a substantially rectangular movement trajectory with curved corners. The light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area. When the light source movement trajectory Tr1 has a rectangular shape, the moving speed of the second cutting device 16 becomes slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser beam. Therefore, in FIG. 13, the corner of the light source movement locus Tr1 is curved so that the moving speed of the second cutting device 16 is substantially constant over the entire light source movement locus Tr1.

  If the conventional nozzle method is used, if the laser beam is caused to travel in a curved shape, the cut shape also becomes a curved shape. In addition, when the laser beam travels in a rectangular shape, the cut shape becomes a rectangular shape, but the corner portion is swollen or waved due to thermal deformation.

  When the second cutting device 16 is moving in the straight section SA1, the control device 33 sets the laser light irradiation position to the first irradiation position because the light source movement locus Tr1 and the laser light movement locus Tr coincide with each other. Without adjusting by the adjusting device 161 and the second irradiation position adjusting device 162, the optical member sheet is irradiated with laser light as it is from the second cutting device 16. On the other hand, when the second cutting device 16 is moving in the bending section SA2, the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so the first irradiation position adjustment device 161 and the second irradiation position adjustment device 162. Thus, the irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr. For example, when the second cutting device 16 is moving at the position indicated by the symbol M1, the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 make the irradiation position of the laser beam orthogonal to the light source movement locus Tr1. The distance W1 is shifted to N1. The distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1. The light source movement trajectory Tr1 is arranged inside the laser light movement trajectory Tr, but the irradiation position of the laser light is outside the laser light movement trajectory Tr by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. Therefore, these deviations cancel each other, and the irradiation position of the laser beam is arranged on the laser beam irradiation locus Tr.

  As described above, according to the laser light irradiation device 30 and the laser light irradiation method in the present embodiment, a desired locus Tr is drawn on the optical member sheet FX held on the table 31 by the control of the control device 33. The moving device 32 and the irradiation position adjusting devices 161 and 162 are controlled. In this configuration, the laser light irradiation section to be adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 is only the narrow bending section SA2. In the other wide linear section SA1, the laser beam is scanned on the optical member sheet FX by the movement of the second cutting device 16 by the moving device 32. In the present embodiment, laser beam scanning is mainly performed by the moving device 32, and only the region where the laser beam irradiation position cannot be accurately controlled by the moving device 32 is adjusted by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. doing. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 32 or only the second cutting device 16 (scanner).

  Moreover, when the liquid crystal panel P is bonded to the optical member sheets F1, F2, and F3 wider than the display region P4, the optical axis direction changes according to the positions of the optical member sheets F1, F2, and F3. However, the liquid crystal panel P can be aligned and bonded in accordance with this optical axis direction. Thereby, the precision of the optical axis direction of the optical members F11, F12, and F13 with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be increased.

  Moreover, after bonding liquid crystal panel P to optical member sheet | seat F1, F2, F3 larger than the display area P4, by separating the excess part of the optical member sheet | seat F1, F2, F3, the size corresponding to the display area P4 is obtained. The optical members F11, F12, and F13 can be formed on the surface of the liquid crystal panel P. As a result, the optical members F11, F12, and F13 can be accurately provided up to the display region P4, and the frame portion G positioned outside the display region P4 can be narrowed to enlarge the display area and downsize the device. it can.

  And each optical member sheet | seat F1, F2, F3 is conveyed so that the bonding surface by the side of the adhesion layer may face downward at the bonding position with optical display component PX. Scratches on the bonding surface of F3, adhesion of foreign matters, and the like can be suppressed, and occurrence of bonding failure can be suppressed.

  Moreover, the production system of the optical display device includes the third alignment device 17 that reverses the front surface and the back surface of the second single-sided bonding panel P12 conveyed on the roller conveyor 5, so that the optical display component PX The optical member sheet FX can be easily bonded from above to both the front and back surfaces.

  In the present embodiment, the configuration in which the optical member sheet is cut is described as an example of the configuration for performing the predetermined processing by irradiating the irradiation target with the laser beam. However, the present invention is applied to the above-described embodiment. Not exclusively. For example, in addition to dividing the optical member sheet into at least two parts, it is also possible to make a cut through the optical member sheet and to form a groove (cut) with a predetermined depth in the optical member sheet. Is included. More specifically, for example, cutting (cutting off) an end of the optical member sheet, half cutting, marking processing, and the like are included.

  Further, in the present embodiment, the case where the drawing locus of the laser light emitted from the laser light irradiation device has a rectangular shape (square shape) in plan view has been described as an example, but the present invention is not limited thereto. For example, the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape that is a pentagon or more in plan view. In addition, the present invention is not limited to such a shape, and may be a star shape in plan view or a geometric shape in plan view. The present invention can also be applied to such a drawing trajectory.

  Further, in the present embodiment, a method in which a plurality of roll-shaped sheets (raw rolls wound with optical member sheets) are arranged in-line has been described as an example, but the present invention is limited to the above-described embodiments. Absent. For example, the present invention can be applied to a single wafer bonding method. Further, the present invention can be applied even when a chip-shaped sheet is bonded. For example, it is possible to cut only the optical member after an optical member such as a polarizing film is bonded to an optical display component such as a liquid crystal panel. According to this method, the bonding accuracy when the optical member is bonded to the optical display component becomes unnecessary, and the frame can be cut.

  While preferred embodiments of the present invention have been described and described above, it should be understood that these are exemplary of the invention and are not to be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is limited by the scope of the claims.

DESCRIPTION OF SYMBOLS 1 ... Film bonding system (manufacturing apparatus of an optical member bonding body), 12 ... 1st bonding apparatus (bonding apparatus), 15 ... 2nd bonding apparatus (bonding apparatus), 16 ... 2nd cutting apparatus (scanner) ), 18 ... third bonding device (bonding device), 19 ... third cutting device (scanner), 30 ... laser light irradiation device, 31 ... table, 32 ... moving device, 33 ... control device, 160 ... laser light Oscillator 161 ... First irradiation position adjusting device (scanning element) 162 ... Second irradiation position adjusting device (scanning element), 163 ... Condensing lens, P ... Liquid crystal panel (optical display component), P4 ... Display area, F1 ... 1st optical member sheet (optical member sheet), F2 ... 2nd optical member sheet (optical member sheet), F3 ... 3rd optical member sheet (optical member sheet), F11 ... 1st optical member (optical member), F12 ... second optical member (optical member) F13 ... 3rd optical member (optical member), F21 ... 1st bonding sheet (bonding sheet), F22 ... 2nd bonding sheet (bonding sheet), F23 ... 3rd bonding sheet (bonding sheet) , P11 ... 1st single-sided bonding panel (1st optical member bonding body), P12 ... 2nd single-sided bonding panel (optical member bonding body, 2nd optical member bonding body), P13 ... Double-sided bonding panel (optical member bonding) Combined, second optical member bonded)

Claims (5)

A laser light irradiation apparatus for irradiating an irradiation object with laser light,
A table having a holding surface for holding the irradiation object;
A scanner capable of biaxial scanning with laser light in a plane parallel to the holding surface;
A moving device capable of relatively moving the table and the scanner;
A laser beam irradiation apparatus comprising: The scanner
A laser beam oscillator for oscillating the laser beam;
A scanning element capable of two-axis scanning the laser beam oscillated by the laser beam oscillator in a plane parallel to the holding surface;
A condensing lens that condenses the laser light emitted from the scanning element toward the irradiation object;
The laser beam irradiation apparatus according to claim 1, comprising: It is a manufacturing apparatus of an optical member bonding body formed by bonding an optical member to an optical display component,
A bonding apparatus that forms a bonding sheet by bonding an optical member sheet larger than the display area of the optical display component to the optical display component;
By separating the facing portion of the optical member sheet facing the display region and the surplus portion located outside the facing portion, and cutting out the optical member having a size corresponding to the display region from the optical member sheet. The optical member bonded body including the optical display component and the optical member overlapping the optical display component is cut out from the bonding sheet, configured by the laser beam irradiation device according to claim 1, and the laser beam irradiation. A cutting device for cutting the optical member sheet which is an irradiation object by laser light irradiated from the device;
The manufacturing apparatus of the optical member bonding body characterized by including. A laser light irradiation method for irradiating an irradiation object with laser light,
Holding the irradiation object on a holding surface of a table;
A laser light irradiation method comprising: irradiating the irradiation object with laser light that is biaxially scanned in a plane parallel to the holding surface from the scanner while relatively moving the table and the scanner. It is a manufacturing method of an optical member bonding body formed by bonding an optical member to an optical display component,
Bonding an optical member sheet larger than the display area of the optical display component to the optical display component to form a bonding sheet,
By separating the facing portion of the optical member sheet facing the display region and the surplus portion located outside the facing portion, and cutting out the optical member having a size corresponding to the display region from the optical member sheet. The said optical member bonding body containing the said optical member which overlaps with the said optical display component and the said optical display component is cut out from the said bonding sheet | seat, It is an irradiation target object with a laser beam using the laser beam irradiation method of Claim 4. The said optical member sheet | seat is cut | disconnected. The manufacturing method of the optical member bonding body characterized by the above-mentioned.

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