JP2010149176A - Method for dividing base material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for dividing a base material, capable of preventing any crack caused by the mechanical stress applied to a substrate even when a thin substrate is used. <P>SOLUTION: Two first layered products 10, 110 with small functional film pieces 12a, 12a... being arrayed on a supporting body 11 are affixed to a surface side and a back side of a second layered product 20 to be divided so that the functional film pieces 12a, 12a... are opposite to the surface side and the back side of the second layered product 20, respectively, and the second layered product 20 is divided without via any functional film piece 12a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a substrate dividing method for dividing a laminate in which a plurality of substrates are laminated and functional films are attached to both surfaces.

Conventionally, as a laminate in which a plurality of base materials are laminated and a functional film is stuck on both sides, a polarizing plate is stuck as the functional film on both sides of the laminate in which liquid crystal is sealed between a pair of substrates. A liquid crystal panel is mentioned. As a method for manufacturing this liquid crystal panel, for example, a technique described in Patent Document 1 is known.
According to Patent Document 1, it is disclosed that a plurality of liquid crystal panels are manufactured through the following steps. That is, a step of attaching a polarizing plate to the outer surface of the glass substrate, a step of cutting a part of the polarizing plate into a strip shape, and exposing the glass substrate into a strip shape, along the strip-shaped region of the exposed glass substrate A step of forming a dividing scribe groove, and a step of dividing the glass substrate along the scribe groove.
International Publication No. 03/40049 Pamphlet

However, in the technique described in Patent Document 1, since the polarizing plate is cut in a state in which a base material (glass substrate) and a polarizing plate are laminated, the mechanical force that is pressed against the base material from the polarizing plate. A pressing pressure, which is a stress, acts. Therefore, when the base material is a thin plate, the base material may be broken when the polarizing plate is cut.
The present invention has been made paying attention to the above points, and a substrate dividing method capable of obtaining a laminate by dividing the substrate without applying pressing pressure even when the substrate is thin. It is intended to provide.

In order to achieve the above object, a base material dividing method according to a first embodiment includes a first step of forming a first laminate by laminating a functional film on a support,
A second step of irradiating the functional film with a first laser beam and arranging a plurality of fragmented functional film pieces on the support;
A third step of attaching the two first laminates to the both surfaces of the second laminate formed by laminating a plurality of substrates so that the functional film pieces are opposed to each other;
And a fourth step of forming a modified region by multiphoton absorption inside the substrate by irradiating the surface of the second laminate with a second laser beam through the support,
The second stacked body is divided at a portion where the modified region is formed to form a plurality of third stacked bodies.

According to the first embodiment, the base material is divided by attaching the first laminated body in which the functional membranes that have been segmented in advance on the support are attached to the base material, so that the base material is thin. However, since the pressing pressure is not generated, the base material is hardly broken.
Further, in the base material dividing method according to the second aspect, after the second laminated body is divided to form a plurality of third laminated bodies, one of both surfaces of the plurality of third laminated bodies is formed. The first attached to the face side of
And a step of peeling the support of the laminate.

According to the second embodiment, the end material generated by forming the plurality of third laminated bodies peels off the support body while adhering to the support body. Can be reduced. In addition, since the number of times of cleaning the end material and the like is reduced, the cracking of the substrate due to the cleaning pressure can be reduced.
Further, in the base material dividing method according to the third aspect, the plurality of the third laminated bodies are separated from the support of the first laminated body attached to one surface side of both surfaces of the plurality of third laminated bodies, and then the plurality of the plurality of third laminated bodies are separated. A step of separating each of the plurality of third laminates from the support of the first laminate attached to the other side of both surfaces of the third laminate.

According to the third embodiment, the fragmented third laminated body is held by the support body without falling apart, and therefore, alignment and the like at the time of adhesion of the FPC in the subsequent process can be easily performed at one time. be able to.
Further, the base material dividing method according to the fourth aspect is the method according to any one of the first to third aspects, wherein the functional film is attached to a surface facing the base material in the third step. It has 1 protective film, The process of peeling a said 1st protective film is included between the said 2nd process and the said 3rd process, It is characterized by the above-mentioned.

According to this 4th form, when the polarizing plate 12 is cut | disconnected, the 1st protective film piece 13a, 13a, ... debris adhering on each 1st protective film piece 13a, 13a, ...・
.. can be removed together, and the number of times of cleaning the debris can be reduced In addition, since the number of times that the debris is cleaned is reduced, cracking of the substrate due to cleaning pressure can also be reduced.
Furthermore, in the base material dividing method according to the fifth aspect, in any one of the first to fourth aspects, the functional film is affixed to a surface facing the support in the first step. 2nd
The adhesive force between the support and the second protective film is greater than the adhesive force between the functional film and the second protective film.

According to the fifth embodiment, the cullet generated in the fifth step can be removed together by peeling the second protective film, and the number of times the cullet is washed can be reduced. Further, since the number of times of cleaning the cullet is reduced, the cracking of the substrate due to the cleaning pressure can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, a substrate dividing method for dividing a substrate that is a material of a liquid crystal panel and manufacturing a plurality of liquid crystal panels will be described.

First, the liquid crystal panel produced by the substrate dividing method of this embodiment will be described.
(LCD panel)
FIG. 1 is a perspective view showing a liquid crystal panel.
As shown in FIG. 1, the liquid crystal panel includes a liquid crystal cell 1, a pair of polarizing plate pieces 12 a and 112 a, and an FPC (Flexible Print Circuit) 60. A pair of polarizing plate pieces 12a and 11
Of 2a, the polarizing plate piece 12a is attached to one surface of the liquid crystal cell 1 as a functional film. Of the pair of polarizing plate pieces 12a and 112a, the polarizing plate piece 112a is attached to the other surface of the liquid crystal cell 1 as a functional film.

The liquid crystal cell 1 includes a CF (Color Filter) substrate 21a and a TFT (T
hin Film Transistor) substrate 22a, sealing member 23a arranged along the outer shape of CF substrate 21a, and liquid crystal 50 enclosed in a space formed by both substrates 21a, 22a and sealing member 4 (FIG. 3C ))).
The CF substrate 21a has CF on either the front surface or the back surface of the base substrate.

The TFT substrate 22a has an external terminal (not shown) for controlling the alignment state of the liquid crystal or the potential of the external terminal configured in the form of TFT on either the front surface or the back surface of the base substrate. It has a switching element or the like for controlling.
The main surface of the TFT substrate 22a is wider than the CF substrate 21a and has a portion that overlaps the CF substrate 21a and a portion that does not overlap the CF substrate 21a. Among these, the external terminal is disposed in a portion that does not overlap the CF substrate 21a (hereinafter referred to as the ear portion 22b). The FPC 60 is connected to this external terminal.

Next, a specific procedure of the substrate dividing method of the present embodiment will be described based on the drawings.
(First step)
A 1st process is a process of forming a 1st laminated body using a 1st protective film, a 2nd protective film, and a polarizing plate.
Fig.2 (a) is a perspective view which shows the 1st laminated body used for the base-material division | segmentation method of this embodiment. As shown in FIG. 2A, the first laminate 10 includes a support 11 and a polarizing plate 12 and protective films 13 and 14 attached to one surface of the support 11.

The support 11 is a flexible film. The material of the support 11 is not particularly limited as long as it has elasticity that transmits the first laser light L ₁ used in the second step described later and does not break in the fifth step described later. Although it selects suitably according to this, a transparent expanded film is mentioned, for example.
The size of the surface of the support 11 is equal to or greater than the size of the surface of a second laminate 20 (hereinafter referred to as a bonded substrate 20), which will be described later, and is approximately the same as the size of the surface of the bonded substrate 20. Preferably they are the same.

The polarizing plate 12 is a functional film having linear polarization characteristics that allows only light that vibrates in a specific vibration direction to pass therethrough. The polarizing plate 12 has a property of absorbing the _first laser light L ₁ described later and transmitting the _second laser light L ₂ described later. Moreover, the magnitude | size of the surface of the polarizing plate 12 should just be substantially the same as the magnitude | size of the surface of the bonding base material 20 mentioned later.
Moreover, the 1st protective film 13 is affixed on the one surface 12a of the polarizing plate 12 through an adhesive layer (not shown). A second protective film 14 is affixed to the other surface 12 b of the polarizing plate 12. As the 1st protective film 13 and the 2nd protective film 14, the film which is transparent and can ensure the adhesiveness with the polarizing plate 12 is used.

FIG. 2A and FIG. 2B are perspective views for explaining the first step.
In the first step, as shown in FIG. 2A, the polarizing plate 12 having the first protective film 13 and the second protective film 14 attached to both surfaces is attached to the support 11 to form the first laminate. Form body 10. Here, in the drawing, the size of the surface of the polarizing plate 12 is substantially the same as the size of the surface of the laminated substrate 20. Moreover, when the polarizing plate 12 is affixed on the support body 11, it affixes so that the support body 11 and the 2nd protective film 14 may oppose.

Similarly, in the first step, as shown in FIG. 2B, the first protective film 1 is used.
The polarizing plate 112 with the 13 and the second protective film 114 attached to both surfaces is used as the support 11.
1 to form a first stacked body 110. The first protective film 13 and the first protective film 113 are the same. Further, the second protective film 14 and the second protective film 114 are the same. Further, the polarizing plate 12 and the polarizing plate 112 are the same. Further, the support 11 and the support 111 are the same.

(Second step)
A 2nd process is a process of arrange | positioning the polarizing plate piece which divided the polarizing plate on the support body.
FIG. 2C is a perspective view for explaining the second step.
As shown in FIG. 2C, in the second step, the first laser beam L ₁ is irradiated in a lattice shape toward the polarizing plate 12 of the first laminate 10 to make the polarizing plate 12 smaller. Individual polarizing plate pieces 12a
, 12a,... Are formed on the support 11 in a matrix. Similarly, the first laminated body 110 is irradiated with the first laser beam L ₁ in a lattice shape toward the polarizing plate 112, thereby polarizing plate 1.
.. Are formed in a matrix on the support 111.

Here, as the first laser light L ₁ , a pulse laser having a property that the polarizing plate 12 can easily absorb is used. An example of the first laser beam L ₁ is a YAG laser.
In addition, on the polarizing plate 12, a planned dividing line (not shown) is set along the outer shape of the surface of each CF substrate 21 a that is divided from the base material 21 for the CF substrate. As described above, the first plurality of polarizing plates 12 by laser light L ₁ of the polarizing plate pieces 12a, 12a, when to fragment the ... are, a polarizing plate 12 is divided along these dividing lines The Similarly, the polarizing plate 11
2, a planned division line (not shown) is set along the outer shape of the surface of each TFT substrate 22a divided from the substrate 22 for TFT substrate. The first plurality of polarizing plates 112 by the laser beam L ₁ of the polarizing plate pieces 112a, 112a, when to fragment the ... are, a polarizing plate 112 is divided along these dividing lines.

In this way, the polarizing plate piece 12a, the first protective film piece 13a, and the second protective film piece 14a, which are divided into the same size along the planned dividing line, are laminated in this order. The laminated body is arranged in a matrix on the support 11. On the other hand, on the support 111, the polarizing plate pieces 112 that are divided into the same size along the planned dividing lines.
a, a laminated body in which the first protective film piece 113a and the second protective film piece 114a are laminated in this order is arranged in a matrix.

Thereafter, each of the first protective film pieces 13a, 13a,. Thereby, first the first when cutting the polarizing plate 12 by irradiating a laser beam L ₁ of the protective film pieces 13a, 13a, debris deposited on ... the (deblis) can be removed. Similarly, the first protective film pieces 113a, 113a,. Thereby, first the first when cutting the polarizing plate 112 by irradiating a laser beam L ₁ of the protective film pieces 113a, 113a, debris deposited on ... it can be removed.

(Third step)
A 3rd process is a process of affixing two 1st laminated bodies to the outer surface of a bonding base material, respectively.
Here, the bonded base material 20 will be described.
FIG. 3A is a perspective view showing the bonded base material 20.
As shown in FIG. 3A, the bonded base material 20 is a large substrate in which the liquid crystal cells 1 are connected in a matrix. Specifically, the bonding substrate 20 includes a CF substrate substrate 21, a TFT substrate substrate 22, a liquid crystal 50 (see FIG. 3C) disposed between both substrates 21, 22, and a liquid crystal. And a sealing member 23 for enclosing 50 between the base materials 21 and 22.

The CF substrate base 21 is a large substrate in which a plurality of CF substrates 21 are connected in a matrix as a first base. Further, the TFT substrate 22 has a plurality of TFs as the second substrate.
The T substrate 22 is a large substrate connected in a matrix.
Further, the sealing member 23 is an individual CF substrate 2 set on the base material 21 for the CF substrate.
A plurality of shapes are formed so as to surround a region where liquid crystal is sealed along the outer shape of 1a.

As both the base materials 21 and 22, those made of a transparent brittle material such as quartz or borosilicate glass can be used. Examples include Pyrex (registered trademark), AN-100, OA-10.
Etc.
FIG. 3B is a perspective view for explaining the third step, and FIG. 3C is a view 3c of FIG.
It is sectional drawing in the surface containing -3c line.

As shown in FIG. 3B and FIG. 3C, in the third step, the fragmented polarizing plate pieces 12a, 12a,... Face the surface of the CF substrate base 21. The 1st laminated body 10 is affixed on. Similarly, on the surface of the TFT substrate 22, small pieces of polarizing plate pieces 112 a, 1
The first laminated body 110 is pasted so that 12a,.
Here, since the 1st laminated bodies 10 and 110 are affixed on both surfaces of the bonding base material 20, even if the base material 21 for CF substrates and the base material 22 for TFT substrates are thin, a bonding base The impact applied to the material 20 is alleviated by the first laminated bodies 10 and 110, and the handling of the bonded base material 20 becomes easy.

(Fourth process)
The fourth step is a step of forming a modified layer in each of the CF substrate base material and the TFT substrate base material.
FIG. 4A is a perspective view for explaining the fourth step, and FIG. 4B is a perspective view of 4b of FIG.
It is sectional drawing in the surface containing -4b line.
As shown in FIGS. 4 (a) and 4 (b), in the fourth step, the support 11 is permeated to form C.
The surface of the F substrate base material 21 is irradiated with the _second laser light L ₂ to form a modified layer inside the CF substrate base material 21. Similarly, the support 111 is transmitted and the surface of the TFT substrate 22 is irradiated with the _second laser light L ₂ to form a modified layer inside the TFT substrate 22.
Here, when the modified layer is formed in the CF substrate 21, the modified layer is formed in the CF substrate 21 along the respective planned division lines d _{1 to} d ₁₅ set on the support 11. The second laser beam L ₂ is sequentially irradiated. Each of these division lines d _{1 to} d ₁₅ is set along the outer shape of the CF substrate 21a.
Since the CF substrate 21a is arranged in a matrix in the CF substrate base 21, CF
Each of the planned dividing lines d _{1 to} d ₁₅ set along the outer shape of the substrate 21a has a lattice shape. Each dividing line d ₁ to d ₁₅ is set at the same interval and size as dividing lines set on the polarizing plate 12 in the second step described above.

Similarly, when the modified layer is formed in the TFT substrate 22, the modified layer is formed in the TFT substrate 22 along each planned dividing line (not shown) set on the support 111. 2 laser light L ₂
Are sequentially irradiated. Each division line set on the support 111 is set along the outer shape of the TFT substrate 22a. In the TFT substrate 22, the TFT substrates 22 a are arranged in a matrix, so that each division line set along the outer shape of the TFT substrate 22 a has a lattice shape. Moreover, each division | segmentation planned line is set with the same space | interval and dimension as the division | segmentation planned line set on the polarizing plate 112 in the above-mentioned 2nd process.

Further, as the second laser light L ₂ , a pulse laser having a property of being easily transmitted through the supports 11 and 111 and easily absorbed by the CF substrate base material 21 and the TFT substrate base material 22 is used. An example of the second laser beam L ₂ is a femtosecond laser. The polarization plane of the second laser light L ₂ is preferably set in the same direction as the polarizing plate pieces 12 a and 112 a and the polarization plane. As a result, the second laser light L ₂ reaches the CF substrate 21 without being blocked by the polarizing plate piece 12. Similarly, the second laser light L ₂ reaches the TFT substrate 22 without being blocked by the polarizing plate piece 112a.

Thus, in the present embodiment, the support 11 is transmitted and the polarizing plate pieces 12a, 12a,
The CF substrate base material 21 was irradiated with the _second laser light L ₂ through the gap to form a modified region in the CF substrate base material 21. Further, the second laser beam L is transmitted through the support 111 and passed through the polarizing plate pieces 112a, 112a,...
₂ was irradiated to form a modified region in the TFT substrate 22. That is, CF
The base material 21 for CF substrate in a state where the base material 21 for substrate and the polarizing plate pieces 12a, 12a,.
It is possible to suppress the pressing pressure from being applied to the CF substrate base 21 when forming the starting point portion that becomes the starting point of the division. When the TFT substrate 22 and the polarizing plate pieces 112a, 112a,... Are stacked, the TFT substrate 22 is formed with a starting point serving as a starting point for division.
It can suppress that the pressing pressure is applied to the base material 22 for substrates.

(Fifth step)
The fifth step is a step of dividing the bonded base material into a plurality of liquid crystal cells.
FIG. 5A is a perspective view for explaining the fifth step, and FIG. 5B is a perspective view of 5b in FIG.
It is sectional drawing in the surface containing -5b line.
As shown in FIGS. 5A and 5B, in the fifth step, a load is applied to the portion corresponding to the modified region in the base material 21 for the CF substrate from above the support 11, and the CF The CF substrate base 21 is connected to each CF substrate 21 along the planned division lines d _{1 to} d ₁₅ (see FIG. 4A) set on the substrate base 21.
It is divided into a, 21a,. Similarly, by applying a load from above the support 111 to the portion corresponding to the modified region in the TFT substrate 22, a division line (not shown) set on the TFT substrate 22 is shown. ) To turn the TFT substrate 22 into each TFT substrate 22a, 22a,.
Divide into

As described above, the CF substrate 21 is divided into the CF substrates 21a, 21a,... And the TFT substrate 22 is divided into the TFT substrates 22a, 22a,. A plurality of liquid crystal cells 1, 1,... Formed by stacking the CF substrate 21a and the TFT substrate 22a through the seal member 23 are formed. The plurality of liquid crystal cells 1, 1,... Are polarizing plate pieces 12 a, 12 a,... Affixed to the support 11 and polarizing plate pieces 112 a, 112 a,. Will be held. Further, the end material facing the ear portion 22b and separated from the CF substrate base material 21 in this step is in a state of being held by the support 11.

(Sixth step)
The sixth step is a step of peeling the support 11.
FIG. 6A is a perspective view for explaining the sixth step, and FIG. 6B is a view 6b of FIG.
It is sectional drawing in the surface containing -6b line.
As shown in FIGS. 6A and 6B, in the sixth step, the support 11 is peeled off and a plurality of polarizing plate pieces 12a, 12a,. Peel at once. As described above, since the plurality of pieces of polarizing plates 12a, 12a,..., Which are fragmented, are affixed to the single support 11, the second protective film 14 can be removed simply by peeling off the support 11. The labor of peeling one by one can be reduced. At this time, the end material separated from the CF substrate base material 21 in the fifth step is also removed by the support 11 together with the second protective film 14. Here, the adhesive force between the support 11 and the second protective film 14 is set to be stronger than the adhesive force between the polarizing plate 12 and the second protective film 14. By doing in this way, the 2nd protective film 14 is peeled by this support body 11 without peeling from the support body 11. FIG.

(Seventh step)
The seventh step is a step of mounting the FPC on the liquid crystal cell.
FIG. 7 is a perspective view for explaining the seventh step.
As shown in FIG. 7, in the seventh step, external terminals (on the ears 22b of the liquid crystal cell 1) (
The FPC 60 is mounted on (not shown). At this time, since the liquid crystal cell 1 is held by the support 111, the FPCs 60, 6 are placed on the liquid crystal cells 1, 1, 1,.
0, ... can be implemented at once. In addition, the liquid crystal cell 1 located in the foremost row
Since 1, 1,... Are held on the support 111, alignment and the like when mounting the FPC 60 can be facilitated, and automation is promoted.

(Eighth step)
The eighth step is a step of individually separating the liquid crystal cells on which the FPC is mounted.
FIG. 8 is a perspective view for explaining the eighth step.
As shown in FIG. 8, in the eighth step, the liquid crystal cell 1 that has been fragmented and mounted with the FPC 60 is provided.
Is picked up from the support 111 by a jig (not shown). The liquid crystal cell 1 separated in this way is placed in a case as it is as a liquid crystal panel (see FIG. 1), and flows to a subsequent process. After that, the liquid crystal cells 1, 1, 1,... Are separated from the liquid crystal cells 1, 1, 1,. In the same manner, the FPC 60 is applied to the liquid crystal cells 1, 1, 1,...
, 60,... Are repeated. As described above, by separating each column, the FPC 60 can be mounted on the liquid crystal cells 1, 1, 1,... It is.

As described above, according to the present invention, the polarizing plate piece 12a that has been fragmented in advance is used as the support 11.
Since the first laminated body 10 arranged above is stuck to the base material 21 and the base material 21 is divided, the pressing pressure generated when the base material 21 and the polarizing plate 12 are split and overlapped does not occur. as a result,
Even if the base material 21 is thin, it is difficult to break when divided. This leads to a reduction in the cost (failure cost) for the occurrence of defective products. In addition, even if debris or cullet generated in each process adheres to the first protective film 13 or the second protective film 14,
By removing the first protective film 13 and the second protective film 14, the number of times of cleaning is reduced, and the manufacturing cost can be reduced.

(Other embodiments)
In the above-described embodiment, the mode in which the first protective film 13 and the second protective film 14 are provided on both surfaces of the polarizing plate 12 has been described. On the other hand, as another embodiment of the substrate dividing method according to the present invention, the polarizing plate 12 may lack at least one of the first protective film 13 and the second protective film 14. . For example, when neither the first protective film 13 nor the second protective film 14 is provided on the polarizing plate 12, only the support 11 is polarized in the “sixth step” of the above-described embodiment. It will peel from board piece 12a, 12a, .... In this case, since the first protective film 13 is not provided,
The labor for peeling off the first protective film 13 can be reduced before performing the “third step”. This embodiment is suitable when it is not necessary to consider the occurrence of debris and the like in the “second step” and the occurrence of cullet and the like in the “fifth step”.

In addition, when only the first protective film 13 is provided on one surface of the polarizing plate 12, “
In the “sixth step”, only the support 11 is peeled off from the polarizing plate pieces 12a, 12a,. This embodiment corresponds to the case where the second protective film 14 is not provided in the above embodiment. This embodiment is suitable when it is not necessary to consider the occurrence of cullet or the like in the “fifth step”.

In addition, when only the second protective film 14 is provided on the other surface of the polarizing plate 12, “
It is not necessary to peel off the individual first protective films 13 before performing the “third step”. This embodiment corresponds to the case where the first protective film 13 is not provided in the above embodiment. In addition, this embodiment is suitable when it is not necessary to consider the occurrence of debris or the like in the “second step”.

In this embodiment, in the “third step”, the first laminates 10 and 110 are pasted on both surfaces of the bonded base material 20, but the polarizing plate may be only on one side of the bonded base material 20. For example, the polarizing plate 112 of the first stacked body 110 may be omitted.
Moreover, in this embodiment, although the polarizing plate was taken as an example as a functional film, this functional film is provided in the outer surface of the bonding base material 20, and has an effect with respect to the bonding base material 20. If it is a film | membrane which has a function, there will be no restriction | limiting in particular, According to the objective, it selects suitably. For example, the functional film is not limited to a polarizing plate having an optical function, and may be a film that protects the outer surface of the bonded substrate 20 such as a protective film.

It is a perspective view of the liquid crystal panel produced by the base-material division | segmentation method of this embodiment. It is a perspective view explaining a 1st process and a 2nd process. It is a figure explaining a 3rd process. It is a figure explaining a 4th process. It is a figure explaining a 5th process. It is a figure explaining a 6th process. It is a perspective view explaining a 7th process. It is a perspective view explaining an 8th process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal cell 10, 110 ... 1st laminated body, 111, 111 ... Support body, 12, 112 ...
Polarizing plate (functional film), 12a, 112a ... polarizing plate piece (functional film piece), 13, 113 ... first
Protective film, 14, 114 ... second protective film, 20 ... laminated base material (second laminate), 21 ... base material for CF substrate (first base material), 21a ... CF substrate, 22 ... TFT substrate (second substrate), 22a ... TFT substrate, 23 ... sealing member, 60 ... FPC

Claims (5)

A first step of laminating a functional film on a support to form a first laminate;
A second step of irradiating the functional film with a first laser beam and arranging a plurality of fragmented functional film pieces on the support;
A third step of sticking the two first laminates to both surfaces of the second laminate formed by laminating a plurality of base materials so that the functional film pieces are opposed to each other;
And a fourth step of forming a modified region by multiphoton absorption inside the substrate by irradiating the surface of the second laminate with a second laser beam through the support,
Dividing the second laminated body at a portion where the modified region is formed to form a plurality of third laminated bodies. Supporting the first laminate pasted on one side of both surfaces of the plurality of third laminates after dividing the second laminate to form a plurality of third laminates The base material dividing method according to claim 1, further comprising a step of peeling the body. After peeling the support of the first laminated body attached to one surface side of both surfaces of the plurality of third laminated bodies, the other surface of both surfaces of the plurality of third laminated bodies The base material dividing method according to claim 2, further comprising a step of separating each of the plurality of third laminated bodies from a support of the first laminated body attached to the side. The functional film has a first protective film that is attached to the surface facing the substrate in the third step, and between the second step and the third step, The substrate dividing method according to any one of claims 1 to 3, further comprising a step of peeling the first protective film. The functional film has a second protective film that is attached to the surface facing the support in the first step, and the adhesive force between the support and the second protective film is: 5. The substrate dividing method according to claim 1, wherein the substrate dividing method is greater than an adhesive force between the functional film and the second protective film.

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