JP2016145123A - Method for producing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing an electronic device which sticks a glass film and a support glass with sufficient strength and easily peels the glass film and the support glass even after production processing involving heating.SOLUTION: There is provided a method for producing an electronic device which comprises: a glass film laminate formation step S1 of laminating a glass film 11 and a support glass 12 via a heat resistant sheet material 13 to form a glass film laminate 10; a production process step S2 of subjecting the glass film laminate 10 to production processing involving heating; and a separation step S3 of separating the glass film 11 from the glass film laminate 10, wherein in the glass film laminate formation step S1, the glass film 11 and the support glass 12 are laminated so as to be directly contacted with each other around the heat resistant sheet material 13.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method for manufacturing an electronic device using a glass film.

  A glass substrate used for an electronic device is required to be thin and have high flexibility. In recent years, a glass film having a thickness of about 200 μm has been proposed. This kind of glass substrate is subjected to various processes related to the manufacture of electronic devices such as processing and cleaning. However, when a thin glass film is used for a glass substrate used in an electronic device, the glass film is a brittle material and breaks due to a slight change in stress. There is a problem that handling is very difficult. In addition, since a glass film having a thickness of about 200 μm is rich in flexibility, it is difficult to perform positioning during processing, and has a problem that, for example, displacement occurs during patterning.

  Therefore, in order to improve the handleability of the glass film, in recent years, a glass film laminate is formed by placing the glass film on a supporting glass, and various manufacturing processes are performed on the glass film. . About a glass film laminated body, it can form by sticking a glass film and support glass with a smooth surface (patent document 1), or laminating | stacking through a peelable resin layer (patent document 2). Proposed.

JP 2010-215436 A JP 2007-326358 A

  By the way, in manufacturing various electronic devices, for example, a manufacturing process such as a transparent conductive film forming process or a sealing process is performed on the surface of the glass film of the glass film laminate. Therefore, after performing a manufacturing process, it is necessary to peel the glass film by which the manufacturing process was performed from support glass, and to isolate | separate from a glass film laminated body. Moreover, these manufacturing processes are accompanied by a heating and a heating is performed with respect to the whole glass film laminated body.

  As shown in Patent Document 1, when a glass film having a smooth surface and a supporting glass are brought into close contact with each other, a razor blade or a resin sheet is inserted into the contact interface between the glass film and the supporting glass to peel off the glass film. It has been tried to do. However, skill is required to peel the glass film whose entire surface is in close contact with the supporting glass without being damaged, and it takes a long time. In addition, it is known that the adhesion between the glass film and the supporting glass increases as the temperature increases. Therefore, when a glass film laminated body is heated in the case of a manufacturing process, peeling of a glass film will become still more difficult.

  On the other hand, as shown in Patent Document 2, when a peelable resin layer is provided between the glass film and the support glass, the resin layer may be deteriorated by heat depending on the heating temperature during the manufacturing process. .

  The present invention made in view of the above circumstances allows the glass film and the supporting glass to adhere to each other with sufficient strength and easily peels the glass film and the supporting glass even after a manufacturing process involving heating. An object of the present invention is to provide a method of manufacturing an electronic device that can be used.

  The present invention, which was created to solve the above problems, includes a glass film laminate forming step of forming a glass film laminate by laminating a glass film and a supporting glass via a heat-resistant sheet material, and a glass film laminate. And a separation process for separating the glass film from the glass film laminate, and in the glass film laminate formation process, the glass is formed around the heat-resistant sheet material. The film and the supporting glass are laminated so that they are in direct contact with each other.

  According to such a structure, the glass film laminated body formed in a glass film laminated body formation process has a contact area | region where a glass film and support glass contact directly around a heat-resistant sheet material. In this contact region, the glass film and the supporting glass are brought into close contact by intermolecular force. Moreover, since the heat resistant sheet material has heat resistance, even if the glass film laminate is heated in the manufacturing process, the glass film and the supporting glass are not bonded within the region of the heat resistant sheet material. Therefore, when peeling a glass film like the past, only the area | region where the glass film and support glass are contacting directly should just be peeled, and peeling work is easy. As described above, the glass film laminate can be adhered with sufficient strength because the glass film and the supporting glass are in close contact with each other around the heat-resistant sheet material, and the glass film and the supporting glass can be easily peeled off. can do. Therefore, in the separation step, the glass film that has been subjected to the manufacturing process can be easily separated from the glass film laminate. In addition, since the heat-resistant sheet material and the supporting glass can be easily peeled after the glass film is separated, the heat-resistant sheet and the supporting glass can be easily reused.

  Further, in the manufacturing process step, a pair of glass film laminates are arranged so that the glass films face each other through a gap, the element is sealed in the gap, and the pair in which the manufacturing process is performed in the separation step Each glass film of the glass film laminate may be separated from each glass film laminate. Here, as mentioned above, each glass film laminated body can isolate | separate the glass film in which the manufacturing process was performed easily. Therefore, even if it is a case where a manufacturing process is performed using a pair of glass film laminated body, each glass film can be easily isolate | separated in a isolation | separation process. Thereby, an electronic device can be manufactured efficiently.

  At this time, the separation step may include a cutting step for cutting the glass film on which the manufacturing process has been performed. Thereby, a glass film can be easily isolate | separated from a glass film laminated body by cut | disconnecting the glass film in which the manufacturing process was performed in the manufacturing process process.

  Furthermore, you may cut | disconnect a glass film within the area | region of a heat-resistant sheet material in a cutting process. Thereby, a glass film is cut | disconnected in the area | region which is not in contact with support glass. Here, the heat-resistant sheet material does not adhere to any of the glass film and the supporting glass even when a manufacturing process involving heating is performed. Therefore, the cut | disconnected glass sheet can be peeled from a heat resistant sheet material immediately by cut | disconnecting a glass film in the area | region of a heat resistant sheet material. In this way, the glass film that has been subjected to the production process can be easily separated from the glass film laminate. The glass film is preferably cut by laser cleaving.

  The glass film laminate has a space where the glass film and the supporting glass are not in contact between the end face of the heat-resistant sheet material and the contact portion between the glass film and the supporting glass. The film may be cut in the area where the space is formed. Here, since the heat-resistant sheet material is a member having a thickness, when the glass film and the support glass are laminated with the heat-resistant sheet material interposed, the end face of the heat-resistant sheet material, the glass film and the support glass A space where the glass film and the supporting glass are not in contact is formed between the contact portions. When the glass film is cut in the area where this space is formed, the glass film is cut in the area that is not in contact with the supporting glass in the same manner as described above. Therefore, the cut glass film is immediately removed from the heat-resistant sheet material. Can be peeled off. The glass film may be cut by laser cutting or by cutting.

  At this time, you may cut | disconnect support glass with a glass film in a cutting process. Thereby, the glass film laminate can be easily cut and the glass film can be easily separated.

  The heat-resistant sheet material is preferably a polyimide resin film. The polyimide resin film has excellent heat resistance and is easy to handle. Therefore, by forming a glass film laminate by using a polyimide resin film, even if a manufacturing process involving heating is performed, the region where the process is performed without being bonded to either the glass film or the supporting glass The glass film containing can be easily separated from the glass film laminate.

  As described above, the glass film and the supporting glass are brought into close contact with each other with sufficient strength, and the glass film and the supporting glass can be easily peeled even after a manufacturing process involving heating.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows the glass film laminated body formed in the manufacturing method of the electronic device which concerns on one Embodiment of this invention, Comprising: (a) is a perspective view, (b) is AA sectional view. . It is a top view which shows the cutting location of the glass film laminated body shown in FIG. (A) is a top view which shows the other example of the cut location of the glass film laminated body shown in FIG. 1, (b) is a BB sectional drawing. It is a schematic diagram which shows each process of the manufacturing method of the electronic device which concerns on one Embodiment of this invention. It is a schematic sectional drawing which shows the glass film laminated body in the middle of manufacture of the electronic device manufactured in the manufacturing method of the electronic device which concerns on one Embodiment of this invention. (A) is a principal part enlarged view which shows the cutting location in FIG. 5, (b) is a principal part enlarged view which shows the other cutting location in FIG. It is a top view which shows the other example of a glass film laminated body, and a cutting location.

  Hereinafter, an electronic device manufacturing method according to an embodiment of the present invention will be described with reference to the accompanying drawings.

  A glass film laminate 10 formed when an electronic device is manufactured by the method for manufacturing an electronic device according to the present embodiment supports the glass film 11 and the entire surface of the glass film 11 as shown in FIG. It comprises a possible supporting glass 12 and a heat-resistant sheet material 13 interposed between the glass film 11 and the supporting glass 12.

  As shown in FIG. 1B, in the glass film laminate 10, the heat-resistant sheet material 13 having an area smaller than the area of the glass film 11 is placed on the support glass 12 so as to cover the heat-resistant sheet material 13. A glass film 11 is laminated on the substrate. Therefore, around the heat-resistant sheet material 13, the glass film 11 and the supporting glass 12 are in direct contact (indicated by the contact region R). Further, a space 14 in which the glass film 11 and the supporting glass 1 are not in contact is formed between the end face of the heat-resistant sheet material 13 and the contact region R.

  As the glass film 11 and the support glass 12, borosilicate glass or soda lime glass is used. If the glass film 11 and the supporting glass 12 are made of the same material, there is no difference in thermal expansion coefficient, and therefore, there is no fear of breakage due to a difference in expansion and contraction in a manufacturing process step involving heating described later.

  As the glass film 11 and the supporting glass 12, glass manufactured by a float method, a downdraw method, an updraw method, a press method, or the like can be used. In this case, the manufactured glass may be used as it is, or a redraw or a polished surface may be used. In consideration of surface smoothness and waviness, it is preferable to manufacture by a downdraw method, particularly an overflow downdraw method.

  It is preferable that the thickness dimension of the glass film 11 shall be 20 micrometers-300 micrometers. When the thickness dimension of the glass film 11 is less than 20 μm, it is difficult to manufacture the glass film 11 and it is difficult to handle it. On the other hand, when the thickness dimension is 300 μm or more, it can be handled sufficiently by an ordinary single-wafer method, and therefore the necessity for forming the glass film laminate 10 is poor. In addition, 30 micrometers-250 micrometers may be sufficient as the thickness dimension of the glass film 11, and it is more preferable that they are 50 micrometers-200 micrometers.

  On the other hand, the thickness dimension of the support glass 12 is preferably larger than the thickness dimension of the glass film 11, and is preferably 400 μm or more. When the thickness of the support glass 12 is less than 400 μm, there is a possibility that a problem may occur in terms of strength when the support glass 12 is handled alone. In addition, as for the thickness dimension of the support glass 12, it is more preferable that they are 400 micrometers-700 micrometers. Thereby, the support glass 12 can support the glass film 11 reliably.

  Moreover, it is preferable that the surface roughness Ra of the glass film 11 and the support glass 12 is 0.5 nm or less. Thereby, since the contact surfaces of the glass film 11 and the support glass 12 in the contact region R are in close contact with each other, they can be in close contact with each other with sufficient strength by using only direct contact without using an adhesive. Therefore, it can prevent that the contact part of the glass film 11 and the support glass 12 slip | deviates, or the glass film 11 peels in the case of handling of the glass film laminated body 10, the time of packing, etc. In addition, it is thought that the adhesive force of the glass film 11 and the support glass 12 originates in intermolecular forces, such as a hydrogen bond and van der Waals force. Here, the surface roughness Ra is measured under the conditions of a scan size of 10 μm, a scan frequency of 0.5 Hz, and a sample line 256 using S-Image manufactured by SII (Nano Technology).

  As the heat-resistant sheet material 13, a material that does not cause foaming, carbonization, softening, or the like can be used even at a heating temperature at which an electronic device manufacturing process is performed. In this embodiment, a polyimide resin film Kapton (registered trademark: manufactured by Toray DuPont) was used as the heat-resistant sheet material 13. As a result, the heat-resistant sheet material 13 does not adhere to either the glass film 11 or the support glass 12 even if a manufacturing process involving heating is performed. Further, the heat-resistant sheet material 13 preferably has a thickness dimension of 5 μm to 200 μm. If the heat-resistant sheet material 13 has a thickness dimension of less than 5 μm, wrinkles are likely to occur, making it difficult to handle. On the other hand, when the thickness dimension is 200 μm or more, the space 14 (see FIG. 1B) around the heat-resistant sheet material 13 is increased, and the adhesion force in the contact region R between the glass film 11 and the support glass 12 is reduced. When the glass film laminate 10 is handled, the glass film 11 may be peeled off from the support glass 12.

  The surface roughness of the heat-resistant sheet material 13 is not particularly limited. However, when the surface is rough, there is a possibility that bubbles are generated on the contact surface with the glass film 11 or the support glass 12, so the heat-resistant sheet material 13 is A smooth surface is preferred. Moreover, the area of the heat-resistant sheet material 13 is smaller than the glass film 11 and the support glass 12, as shown in FIG.

  In FIG.2 and FIG.3, the cutting location of the glass film laminated body 10 is shown. The glass film 11 is separated from the glass film laminate 10 after the manufacturing process involving heating is performed on the glass film laminate 10. Here, in the manufacturing process, for example, a process involving heating such as a known TFT process or a film forming process is performed on the entire surface of the glass film 11 or in a specific region. The glass film laminate 10 may be cut only on the glass film 11 or the glass film 11 and the supporting glass 12 may be cut together.

  The glass film 11 may be cut within the region of the heat-resistant sheet material 13 as shown in FIG. In this case, the glass film laminate 10 is preferably cut by laser cleaving. Laser cleaving is performed by irradiating a glass body with a laser beam and then developing the initial cracks formed on the surface of the glass body by the tensile stress generated by rapidly cooling the heating part with a refrigerant or the like. Is a method of cutting. In the present embodiment, the manufacturing process is performed by cutting the glass film 11 by performing laser cleaving along the planned cutting location (shown by the planned cutting line C1 in FIG. 2) on the glass film laminate 10. The glass film 11 can be cut out. Here, since the glass film 11 and the heat-resistant sheet material 13 are not bonded in the cut out region, the glass film 11 and the heat-resistant sheet 13 can be peeled off immediately after cutting.

  When the glass film laminate 10 is cleaved by laser, the laser beam may be irradiated from the glass film 11 side or from the support glass 12 side. When laser cutting is performed by irradiating a laser beam from the glass film 11 side, the glass film 11 and the supporting glass 12 may be cut together, and only the glass film 11 is cut without cutting the supporting glass 12. It may be cut. On the other hand, when laser cutting is performed by irradiating a laser beam from the support glass 12 side, the support glass 12 and the glass film 11 are cut together.

  Moreover, you may perform the cutting | disconnection of the glass film 11 in the area | region where the space 14 is formed around the heat-resistant sheet material 13, as shown to Fig.3 (a), (b). In this case, the glass film laminate 10 may be cut by laser cutting or may be cut by folding. In the case of cutting by laser cleaving, since it is the same as above, detailed description is omitted. Folding is a method in which a scribe line is formed on the surface of one surface of the glass body in advance with a cutter, a laser beam, or the like, and the scribe line is cut by applying a bending stress. In the illustrated example, the manufacturing process is performed by forming a scribe line along the planned cutting portion (indicated by the cutting planned line C2) of the glass film laminate 10 and cutting the glass film 11 by performing folding. The broken glass film 11 can be cut out. Here, the scribe line is preferably formed on the support glass 12 side. At this time, the bending stress may be applied from the surface side on which the scribe line is formed, or may be applied from the opposite surface side.

  In addition, you may cut | disconnect the glass film 11 in the contact area | region R in which the glass film 11 and the support glass 12 are contacting directly (it shows by the cutting projected line C3). In this case, similarly to the above, the glass film laminate 10 may be cut by laser cutting or may be cut by folding. When cutting by folding, the scribe line may be formed on the glass film 11 side or may be formed on the support glass 12 side.

  Here, when the glass film laminate 10 is cut in the contact region R, the glass film 11 and the supporting glass are cut after the cutting because the glass film 11 and the supporting glass 12 are cut inclusively. 12 need to be peeled off. At this time, since the area | region where the glass film 11 and the support glass 12 contact | adhered is narrow, peeling of the glass film 11 can be easily performed by a well-known method.

  Next, based on FIG. 4, the manufacturing method of the electronic device 1 including the formation process of said glass film laminated body 10 is demonstrated. The manufacturing method of the electronic device 1 which concerns on this embodiment is a glass film laminated body formation process S1 which forms the glass film laminated body 10, and the manufacturing process with a heating with respect to the surface of the glass film 11 of the glass film laminated body 10. And a separation step S3 for separating the glass film 11 subjected to the manufacturing process from the glass film laminate 10. In addition, the separation step S3 includes a cutting step S3a for cutting the glass film 11 subjected to the manufacturing process, and a peeling step S3b for peeling the glass film 11 cut by the cutting from the support glass 12 and the heat-resistant sheet material 13. I have. Details of each step will be described below. In the drawing, the thickness dimensions of the glass film 11, the supporting glass 12, and the heat-resistant sheet material 13, the distance between the opposing glass films 11, 11A, and the like are exaggerated.

  In glass film laminated body formation process S1, the heat resistant sheet material 13 is mounted on the support glass 12, and the glass film laminated body 10 is formed by covering with the glass film 11 from the upper direction of the heat resistant sheet material 13. At this time, since the area of the heat-resistant sheet material 13 is smaller than that of the glass film 11, the glass film 11 and the supporting glass 12 are disposed around the heat-resistant sheet material 13 through the space 14 (see FIG. 1B). Are in direct contact (see contact region R in FIG. 1B). In the contact region R, the glass film 11 and the support glass 12 are in close contact with each other without using an adhesive or the like. In addition, since the contact area | region R is formed in the perimeter of the heat-resistant sheet material 13, the glass film laminated body 10 may apply | coat a liquid to the surface or may be immersed in a liquid in manufacturing process process S2. However, no liquid or the like enters the contact interface between the glass film 11 and the support glass 12 or the space 14.

  In manufacturing process S2, another glass film laminated body 10A formed similarly by glass film laminated body formation process S1 with respect to glass film laminated body 10 formed by glass film laminated body formation process S1 is a figure. As shown in FIG. 5, the glass films 11 and 11 </ b> A are arranged so as to face each other via the gap 15, and the element of the electronic device 1 is sealed in the gap 15.

  Here, an example of manufacturing a liquid crystal panel will be described as an example of the electronic device 1 manufactured in the manufacturing process step S2. In this case, a spacer 16 is disposed in the gap 15 to seal the liquid crystal element 17 as an element of the electronic device 1. Specifically, a known TFT process is performed on the surface of the glass film 11 (not shown), a color filter is formed on the glass film 11A of the upper glass film laminate 10A, and then the spacer 16 is used as a seal member. The liquid crystal element 17 is sealed with the glass film 11A. In FIG. 5, the thickness dimensions of the glass film laminates 10 and 10A and the spacer 16, the gap 15 between the glass films 11 and 11A, and the like are exaggerated.

  Further, an organic EL panel may be manufactured as the electronic device 1 in the manufacturing process step S2. Although illustration is omitted, in this case, the anode film, the hole transport layer, the light emitting layer, the electron transport layer, the cathode are formed in the manufacturing process region of the glass film 11 by a known film forming process such as a CVD method or a sputtering method. An organic EL element is formed by stacking layers in order. Then, by bonding the glass film 11A of the upper glass film laminate 10A by a known method, the organic EL element is sealed and the electronic device 1 is manufactured.

  When these electronic devices 1 are manufactured, in the manufacturing process step S2, the glass film laminates 10 and 10A are subjected to heat treatment. Here, the heating temperature is about 150 ° C. to 450 ° C., and is heated to 300 ° C. to 400 ° C. or more, for example, during TFT processing. The heat-resistant sheet material 13 does not adhere to either the glass film 11 or the support glass 12 even when heated to these temperatures.

  In the cutting step S3a (see FIG. 4) of the separation step S3, the glass films 11, 11A subjected to the manufacturing process are cut out by cutting the glass films 11, 11A. In this embodiment, as shown in FIG. 4, it irradiates from the laser irradiation device 20 arrange | positioned above the glass film laminated body 10 and 10A, ie, the support glass 12A side of 10 A of upper glass film laminated bodies. Cutting by laser cutting with a laser beam.

  Here, the laser irradiator 20 is a device including a known laser light source, and cuts the glass film laminates 10 and 10A. At this time, the laser irradiator 20 is moved in the transport direction of the glass film laminates 10 and 10A and in the direction orthogonal to the transport direction, thereby cutting the glass film laminates 10 and 10A fixed at predetermined positions. A part (any one of the planned cutting lines C1 to C3 shown in FIGS. 6A and 6B and FIG. 3B) is cut. The laser irradiator 20 can be moved only in the direction orthogonal to the transport direction of the glass film laminates 10 and 10A, and the glass film laminates 10 and 10A are transported in the transport direction of the glass film laminates 10 and 10A. You may cut while doing. A plurality of laser irradiators 20 may be provided.

  In FIG. 6, the scheduled cutting location of the glass film laminated body 10 and 10A cut | disconnected by cutting process S3a is shown. FIG. 6A shows an example in which the inside of the heat-resistant sheet materials 13 and 13A is cut (indicated by a planned cutting line C1). In this case, a laser beam is irradiated from the support glass 12A side of the upper glass film laminate 10A by the laser irradiator 20 (see FIG. 4), and the glass film 11A and the glass film 11 are cut. At this time, the laser irradiator 20 irradiates a region within the heat resistant sheet material 13, 13 </ b> A and outside the spacer 16 with a laser beam. In addition, as shown to Fig.6 (a), since the glass film 11 should just be cut | disconnected in the lower glass film laminated body 10, the support glass 12 does not need to be cut | disconnected completely.

  In addition, as shown in FIG.6 (b), the cutting | disconnection of the glass films 11 and 11A in cutting process S3a is the circumference | surroundings of the heat-resistant sheet materials 13 and 13A, Comprising: Glass films 11 and 11A and support glass 12 and 12A are You may carry out in the area | region (it shows by the cutting scheduled line C2) in which the space 14 and 14A (refer FIG. 5) which is not contacting is formed. In this case, similarly to the above, it may be cut by laser cutting or may be cut by folding. When the glass films 11 and 11A are cut by folding, a scribe line 18 is formed on the back side of the support glass 12A of the upper glass film laminate 10A as shown in the drawing, and the lower glass film laminate is formed. By applying a pressing force (indicated by a white arrow F) from the back side of the support glass 12 of the body 10, the glass film laminate 10, 10A is folded. Although detailed description is omitted, the cutting of the glass films 11 and 11A is performed in the regions where the glass films 11 and 11A and the supporting glasses 12 and 12A are in contact with each other (indicated by the contact regions R and RA in FIG. 5). May be.

  In peeling process S3b, the glass films 11 and 11A containing the area | region where the manufacturing process was performed cut | disconnected in cutting process S3a are peeled from the support glass 12, 12A or the heat-resistant sheet materials 13 and 13A, respectively. In this step, when the glass films 11 and 11A are cut in the region of the heat-resistant sheet materials 13 and 13A or in the region where the spaces 14 and 14A are formed, the cut glass films 11 and 11A are Since they are not bonded to the heat-resistant sheet materials 13 and 13A, they can be easily peeled off.

  When the glass films 11 and 11A are cut in the contact region R, the glass film laminates 10 and 10A include a region in which the glass films 11 and 11A and the supporting glasses 12 and 12A are in close contact with each other. Therefore, the glass films 11 and 11A after cutting and the supporting glasses 12 and 12A are peeled off by a known method. Even in this case, the glass films 11 and 11A and the heat-resistant sheet material 13 are not bonded, and the regions where the glass films 11 and 11A and the supporting glasses 12 and 12A are in close contact with each other are narrow. The glass films 11 and 11A can be easily peeled off. In this way, the glass films 11 and 11A can be separated from the glass film laminates 10 and 10A by cutting and peeling.

  The electronic device 1 (see FIG. 4) can be manufactured by the electronic device manufacturing method as described above. The manufactured electronic device 1 is further processed into a finished product of the electronic device 1 through a cutting and cleaning process.

  As described above, according to the method for manufacturing an electronic device of the present invention, in the glass film laminate forming step S1, by laminating the glass film 11 and the supporting glass 12 via the heat-resistant sheet material 13, The electronic film 1 is manufactured by forming the glass film laminate 10, performing a production process with heating in the heat treatment step S2, and separating the glass film 11 from the glass film laminate 10 in the separation step S3. At this time, in the glass film laminate 10, the glass film 11 and the support glass 12 are in direct contact with each other around the heat-resistant sheet material 13. Moreover, since the heat-resistant sheet material 13 has heat resistance, the glass film 11 and the supporting glass are within the region of the heat-resistant sheet material 13 even after the glass film laminate 10 is subjected to a manufacturing process involving heating. No 12 is adhered. Therefore, the glass film laminated body 10 adhere | attaches the glass film 11 and the support glass 12 with sufficient intensity | strength in the circumference | surroundings of the heat resistant sheet material 13, and the glass film 11 by which the manufacturing process was performed from the glass film laminated body 10. It can be easily separated.

  In the above embodiment, in the separation step S3, the cutting step S3a for cutting the glass films 11 and 11A is performed, but the cutting step S3a is not necessarily an essential step. In the glass film laminates 10 and 10A manufactured and processed in the manufacturing process step S2, only the peeling step S3b for peeling the glass films 11 and 11A and the supporting glasses 12 and 12A is performed, and the glass films 11 and 11A are laminated to the glass film. You may isolate | separate from the body 10 and 10A, respectively. Even in this case, the glass films 11 and 11A and the supporting glasses 12 and 12A are only in close contact with each other in the contact region R around the heat-resistant sheet materials 13 and 13A. There is no adhesion in the area. Therefore, it is only necessary to peel off the contact region R around the heat-resistant sheet materials 13 and 13A, and the glass film 11 can be easily compared with the case where the entire surfaces of the glass films 11 and 11A and the supporting glasses 12 and 12A are in close contact with each other. 11A can be peeled off. Here, a known method can be used for peeling the glass films 11 and 11A. For example, a thin plate-like peeling member such as a razor or a resin sheet may be inserted into the contact interface between the glass films 11 and 11A and the supporting glass 12 and 12A, respectively, and the corners of the glass films 11 and 11A may be peeled off. A hole, a notch, or the like may be formed in advance at a predetermined position of the supporting glass 12 or 12A corresponding to the portion, and then peeled from the hole.

  A plurality of electronic devices 1 may be manufactured from the glass film laminate 10. In this case, after manufacturing the electronic device 1 by forming the glass film laminate 10 through the single heat-resistant sheet material 13 (see FIG. 2), it may be cut into a plurality of electronic devices 1. In advance, the heat-resistant sheet material 13 is partially placed to form the glass film laminate 10, the manufacturing process is performed in the region of each heat-resistant sheet material 13, and the glass film 11 in the region where the manufacturing process has been performed. It may be cut out to manufacture individual electronic devices 1. In the latter case, as shown in FIG. 7, the heat-resistant sheet material 13 (shown by 13a to 13d) is placed at a plurality of locations (four locations in the illustrated example) on the support glass 12, and all the heat-resistant sheet materials are placed. A glass film laminate 10 is formed by laminating a glass film 11 so as to cover 13. At this time, the glass film 11 and the supporting glass 12 are not only the area (contact area R1) around each heat-resistant sheet material 13 and near the periphery of the glass film 11, but also between the adjacent heat-resistant sheet materials 13 (contact). Direct contact is also made in region R2).

  Furthermore, in said embodiment, in cutting | disconnection process S3a, the area | region (space 14 is formed in the area | region (cutting line C1 of FIG. 2) of the heat-resistant sheet material 13 and the area outside the heat-resistant sheet material 13). An example of cutting at any one of the planned cutting line C2 in FIG. 3A and the region where the glass film 11 and the support glass 12 are in direct contact (the planned cutting line C3 in FIG. 3B). Although shown, it is not restricted to this, You may cut | disconnect in the some area | region among these. For example, in the example shown in FIG. 7, in the vicinity of the periphery of the glass film 11, the region of the heat-resistant sheet material 13 (scheduled cutting line C <b> 1) is cut, and in the vicinity of the center of each side of the glass film 11, the glass film. You may cut | disconnect the inside of contact area | region R2 where 11 and the support glass 12 are contacting directly.

  Moreover, in the said embodiment, although the polyimide resin film was used as the heat-resistant sheet material 13, it is not restricted to this, Even if it is under the heating temperature at the time of manufacturing processing with respect to the glass film 11, it is glass Any material having heat resistance that does not adhere to either the film 11 or the support glass 12 can be used as appropriate. For example, a heat-resistant sheet material using other resin films such as polyamide, PEEK (polyetheretherketone), glass fiber cloth, metal or the like may be used.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  Below, the experimental result which confirmed the application effect of the manufacturing method of the electronic device which concerns on this invention is demonstrated. Specifically, the glass film laminate formed under the following conditions was subjected to heat treatment, and the peeled state between the glass film and the heat-resistant sheet material was evaluated. In addition, as for support glass, all used that whose thickness dimension is 500 micrometers.

  As Example 1, a polyimide resin film having a thickness of 5 μm is placed on a supporting glass as a heat-resistant sheet material, and is covered with a glass film having a larger area than the heat-resistant sheet material and having a thickness dimension of 50 μm. Thus, a glass film laminate was formed. Similarly, the thickness dimension of the glass film and the heat-resistant sheet material (polyimide resin film) was changed to form various glass film laminates shown in Examples 2 to 6 in Table 1. The glass film laminate thus formed was subjected to heat treatment for 20 minutes when the heating temperature was 200 ° C. and when the heating temperature was 400 ° C., respectively.

  After performing the heat treatment on each glass film laminate formed under the above conditions, a predetermined region of the glass film is cut out from the glass film laminate, and the peeling state between the glass film and the heat-resistant sheet material is determined. confirmed. The evaluation results of the peeled state are shown in Table 1.

  As indicated by ○ in Table 1, the glass film was peelable from the heat-resistant sheet material under any conditions. As a result, when a polyimide resin film was used as the heat-resistant sheet material, it became clear that it could be used without being bonded to the glass film and the supporting glass under a heat treatment condition of 200 ° C. to 400 ° C.

DESCRIPTION OF SYMBOLS 1 Electronic device 10 Glass film laminated body 11 Glass film 12 Support glass 13 Heat-resistant sheet material S1 Glass film laminated body formation process S2 Manufacturing processing process S3 Separation process

Claims (7)

A glass film laminate forming step of forming a glass film laminate by laminating a glass film and a supporting glass via a heat-resistant sheet material;
A manufacturing process step for performing a manufacturing process with heating on the glass film laminate,
A separation step of separating the glass film from the glass film laminate,
In the said glass film laminated body formation process, it laminates | stacks so that the said glass film and the said support glass may contact directly around the said heat-resistant sheet material, The manufacturing method of the electronic device characterized by the above-mentioned. In the manufacturing process, a pair of the glass film laminates are arranged so that the glass films face each other through a gap, and the element is sealed in the gap.
2. The electronic device according to claim 1, wherein in the separation step, the glass films of the pair of glass film laminates subjected to the manufacturing process are separated from the glass film laminates. Production method.   The method of manufacturing an electronic device according to claim 1, wherein the separation step includes a cutting step of cutting the glass film on which the manufacturing process has been performed.   The method for manufacturing an electronic device according to claim 3, wherein in the cutting step, the glass film is cut within a region of the heat-resistant sheet material. In the glass film laminate, a space where the glass film and the support glass are not in contact is formed between the end face of the heat-resistant sheet material and the contact portion between the glass film and the support glass.
The method for manufacturing an electronic device according to claim 3, wherein in the cutting step, the glass film is cut in a region where the space is formed.   The method for manufacturing an electronic device according to claim 3, wherein the supporting glass is cut together with the glass film in the cutting step.   The said heat-resistant sheet material is a polyimide resin film, The manufacturing method of the electronic device of any one of Claims 1-6 characterized by the above-mentioned.

Images