JP6445863B2 - Method and apparatus for dividing plate material of brittle material - Google Patents

Description

  The present invention relates to a cutting method and a cutting apparatus for dividing a plate material made of a brittle material.

  In recent years, plate materials made of brittle materials such as glass plates and semiconductor substrates (hereinafter simply referred to as “plate materials”) are often used in flat panel displays (FPDs), building materials, the automobile industry, and the like. For this plate material, a thin plate material (for example, 1 mm or less, which is about 0.3 mm in recent years) having a very thin thickness for the purpose of weight reduction, a plate thickness having a required strength (for example, several mm) And about 3 mm).

  Such a plate material is divided into a desired size according to the purpose of use. As a general cutting method, for example, in the case of a glass plate (hereinafter, “glass plate” will be described as an example of a plate material), a mechanical cutter (diamond cutter, carbide wheel, etc.) along the cutting plan line. There is a method in which a scribe groove (cut) is formed, and a mechanical stress (bending stress) is applied along the scribe groove to divide (cleave). In this case, dusts (hereinafter referred to as “divided dust”) such as shavings and finely divided scrap (cullet) are generated to contaminate the glass surface. Therefore, a cleaning device for cleaning the divided dust is necessary, and the equipment cost increases.

  Further, the edge cut along the scribe groove causes a minute chipping or the like by the mechanical cutter to reduce the strength, so that the edge must be ground and polished. And in order to raise productivity, the scribing apparatus which forms a scribe groove | channel, and the cutting apparatus which cuts are needed, and also in this case, installation cost will raise significantly.

  As this type of prior art, the glass is moved while spraying cooling air from the side opposite to the heat ray arranged along the cutting line of the glass, and a tensile force in the cutting direction is applied to the entire glass to start from one end surface. A method of dividing a glass by causing a crack to propagate along a cutting line is shown (for example, see Patent Document 1).

  Further, as another prior art, while moving the spot heat source along the cutting line of the glass substrate, a tensile stress in the cutting direction is applied to the entire glass substrate at the same time to cause thermal stress cracks to propagate along the cutting line. There is also a method of dividing the substrate (for example, see Patent Document 2).

  Furthermore, as another prior art, a heat knife is applied to one heating surface in the thickness direction of a brittle plate, and heat is cleaved by a bending moment generated due to a thermal stress caused by a temperature difference with the other cooling surface. (For example, refer to Patent Document 3).

Japanese Patent Laid-Open No. 11-157863 JP 2011-84423 A JP 2014-65614 A

  However, in the method of Patent Document 1, the cooling air is moved in order to promote the progress of cracks, but the dividing speed is slow, and the productivity is not increased with a large glass.

  Moreover, since the method described in the said patent document 2 applies the tensile force of a cutting direction to the whole glass plate along a cutting line simultaneously with the heating by a heat ray, it is difficult to apply to plate materials like a large glass. In addition, since the moving spot heat source is used, an apparatus for moving the spot heat source becomes complicated. In addition, in the case of a cutting apparatus using laser light, the apparatus for irradiating the laser light becomes large, and management of the angle at which the laser light is irradiated is difficult. Therefore, a large installation space and a lot of costs are required.

  Furthermore, in the case of the thermal cleaving method described in Patent Document 3, it takes time to generate a bending moment capable of cleaving the brittle plate with a thermal stress caused by a temperature difference between both sides of the brittle plate, and the processing speed is high. Slow and low productivity.

  Accordingly, the present inventor firstly described a cutting method that can suppress the generation of dust when cutting a brittle material plate, increase productivity, and can be configured compactly, and a cutting device that can execute the cutting method. I applied.

  However, in dividing the plate material, the end portion is not used to divide the medium-sized and small-sized plate materials equally from a predetermined large-sized plate material, and to finish the predetermined-sized plate material to a specified size (trimming). In some cases, it was divided into equal parts, and it was found that the thermal deformation that the plate material undergoes at the time of division differs.

  Therefore, the present inventor considered the thermal deformation in the equally divided and unevenly divided plate material of the brittle material, can appropriately perform the unevenly divided, suppress the generation of divided dust at the time of dividing, and produce The cutting method that can improve the performance and can be configured compactly and the cutting device that can execute the cutting method have been intensively studied.

As a result of intensive studies, the present inventor has obtained the following knowledge.
That is, by dividing the plate material, as shown in FIG. 15A, the large plate material 100 is divided into equal parts (in this figure, divided into two equal parts) (in this specification and in the claims, In the case of dividing an equally divided position from the opposite edge of the plate material in the direction intersecting with the dividing plan line of "the equally divided part"), as shown in FIG. On the other hand, the distance a to the opposite edge of the plate member 100 is an equal distance from the dividing plan line 101. Therefore, as shown in FIG. 15C, when contact heating is performed along the cutting plan line 101 by the cutting member 110 (heating is shown in the drawing, cooling may be performed), but the plate material 100 is evenly distributed on both sides of the cutting plan line 101. A thermal deformation H (shown exaggeratedly) indicated by a dotted line is generated, and the dividing plan line 101 is held in a substantially straight line from the balance of the left and right thermal deformations.

  On the other hand, as shown in FIG. 16A, when trimming the peripheral edge of the plate 105, the edge of the plate 105 is divided into unequal parts (in this specification and in the claims, The case of dividing the unequal position from the opposite edge of the plate material in the direction intersecting the plan line is referred to as “unequal division”). In this case, as shown in FIG. 16B, the distances a and b from the division plan line 106 to the opposite edges of the plate material 105 are unequal distances from the division plan line 106. Therefore, as shown in FIG. 16C, when contact heating is performed along the cutting plan line 106 by the cutting member 110 (heating is shown in the figure, cooling may be performed), both of which sandwich the cutting plan line 106 of the plate material 105. On the side where the uniform thermal deformation is caused and the distance to the edge is short, an arc-shaped thermal deformation H (shown exaggerated) as shown by a dotted line is generated. In particular, when the difference between the distance a and the distance b is large, the arc-shaped thermal deformation H (shown exaggerated) increases due to thermal expansion at a distance a shorter from the dividing plan line 106 to the end edge. Therefore, the dividing plan line 106 is also deformed into an arc shape, and when the dividing plan line 106 is divided along the dividing plan line 106 in this state, the edge of the plate member 105 that has returned to normal temperature is curved inward (for example, about 1 to 2 mm). ), The straightness of the edge cannot be ensured. Therefore, it is difficult to ensure the straightness of the edge after the division by dividing the plate material 105 by the dividing member 110 alone.

  As described above, when the plate material is divided into equal parts, the amount of expansion or contraction of the plate material caused by heating or cooling by contact heating or contact cooling of the dividing member is balanced on both sides. When dividing in equal parts, there is a difference in the amount of expansion or contraction of the plate material caused by heating or cooling by contact heating or contact cooling of the dividing member due to the difference in the distance from the dividing line to the edge of the plate material. And the knowledge that the parting plan line may be parted in a deformed (curved) state due to the heat effect. In particular, when the distance from the dividing member to one edge of the plate material is short, such as when trimming the periphery of the plate material, a large deviation from the dividing plan line (for example, several mm at the center of the dividing plan line) It has been found that there is a case where it is divided due to a deviation.

  Therefore, the present inventor repeats experiments and the like, and in the case of dividing the plate material evenly, in addition to the heating or cooling by contact heating or contact cooling at the time of dividing the plate material by the dividing member, the plate material by the modified heating member Invented a method that can be divided by correcting the dividing line to be linear by heating or cooling.

A method for dividing a plate material of a brittle material according to the present invention is a division method for dividing a plate material made of a brittle material along a division plan line divided into unequal parts, and the first main material of the plate material on the division plan line. A wrinkle forming process for forming minute starting flaws on the surface, a pressing process for pressing the first main surface of the plate material on a line parallel to the cutting plan line on both sides of the cutting plan line, and along the cutting plan line A correction heating step that heats or cools the plate material by a correction heating member arranged in parallel with the extending dividing member at a predetermined interval, and thermally deforms the plate material so that a dividing line is linear when dividing by the dividing member; and The dividing member is heated or cooled so that the plate material is contact-heated or contact-cooled and brought into contact with the dividing plan line of the plate material to generate a tensile thermal stress on the first main surface of the plate material, and the dividing plan line Of the plate along the By applying a thickness direction of the bending force from the main surface side, it comprises a dividing step in which the bending by superimposing the tensile stress and the tensile thermal stress due to force to break along the plate material to the cutting plan lines It is characterized by. “Thermal stress” in the document of this specification and the claims refers to the stress of thermal strain generated inside the plate of the brittle material by bringing the heated or cooled parting member into contact. Further, “fine” means a wrinkle of several millimeters (for example, 5 mm) or less. Furthermore, “compression” refers to the direction toward the segmentation plan line, and “tensile” refers to the direction away from the segmentation plan line. “Applying a bending force” means to push the second main surface of the plate material on the dividing plan line while pressing the first main surface of the plate material on a pair of lines parallel to the dividing plan line, and to obtain the required plate thickness on the plate material. This refers to causing a bending deformation in the direction. Further, “thermal deformation” includes “thermal expansion” and “thermal contraction”, and “correction heating member” includes members for “heating” and “cooling”. In addition, each “step” includes a case where a part thereof overlaps at the same time.

  With this configuration, by causing the dividing member that contacts or cools the brittle material plate material to contact the plate material along the cutting plan line, compressive thermal stress is generated on the first main surface of the plate material on which the starting point flaw is formed. be able to. For example, when the dividing member that contacts and heats the second main surface of the plate material is brought into contact with the second main surface of the plate material, the second main surface of the plate material is caused by the temperature difference between the second main surface and the first main surface. Is thermally expanded along the dividing plan line, the first main surface is pulled to generate tensile thermal stress, and the second main surface generates compressive thermal stress by the reaction force. Alternatively, when the dividing member that contacts and cools the first main surface of the plate material is brought into contact with the first main surface of the plate material, the first main surface of the plate material is caused by the temperature difference between the first main surface and the second main surface. Since the thermal contraction occurs along the dividing line, the second main surface is compressed and compressive thermal stress is generated, and tensile heat stress is generated on the first main surface by the reaction force. And when heating or cooling with the dividing member in this way, the dividing line is divided into unequal parts by heating or cooling the plate with a modified heating member arranged in parallel at predetermined intervals along the dividing member. The thermal deformation of the plate material that occurs when the dividing member is contact-heated or cooled along the line is thermally deformed so that the dividing line is linear when dividing by the dividing member. After that, when a bending force in the thickness direction is applied to the second main surface of the plate along the dividing plan line, the tensile stress generated along the dividing plan line of the first main surface by the bending force and the tensile heat described above. The stress is superimposed on the first main surface of the plate material, whereby the crack progresses linearly from the starting point along the dividing line. The bending force may be applied before or after the generation of the compressive thermal stress or at the same time as the generation of the tensile thermal stress. As a result, it is possible to ensure the straightness of the edge of the plate material divided along the dividing plan line by the dividing member. According to this method, the division can be performed instantaneously to increase productivity. In addition, it is only necessary to form minute starting points on the first main surface of the plate material, and since there is no formation of mechanical grooves or mechanical division, generation of fragmentation waste can be suppressed when the plate material is divided. . Moreover, it is not necessary to clean the divided plate material, and the plate material can be divided by a very simple device.

  The dividing member is configured to contact and heat the second main surface of the plate material, which is disposed on the second main surface side of the plate material, and causes the dividing member to contact and heat the second main surface of the plate material. Generating a thermal stress on the first main surface of the plate member, and heating or cooling the plate member with the correction heating member to heat the plate member so that a dividing line is linear when divided by the dividing member. In the dividing step, the dividing member may be pressed against the plate member to apply a bending force in the plate thickness direction to the second main surface of the plate member along the dividing plan line.

  If constituted in this way, the plate material can be thermally deformed by the contact heating of the second main surface by the dividing member and the heating or cooling by the correction heating member so that the dividing line is linear when dividing by the dividing member. it can. And the tensile thermal stress of the thermal expansion by the contact heating of the dividing member and the tensile stress by the bending force are superposed along the dividing plan line of the first main surface, and the plate material is divided by these stresses along the dividing plan line. be able to. And a bending force can be provided to the 2nd main surface of a board | plate material using the dividing member which contacts and heats the 2nd main surface of a board | plate material.

  Moreover, the said correction heating member is arrange | positioned at the said 2nd main surface side, the said division | segmentation plan line becomes linear at the time of the division | segmentation by the said division member by heating the said board | plate material from the said 2nd main surface side with the said correction heating member. The plate material may be thermally deformed as described above.

  If comprised in this way, by heating or cooling a board | plate material with the correction heating member arrange | positioned at the 2nd main surface side, a board | plate material will be thermally deformed so that a division | segmentation plan line may become linear at the time of the division | segmentation by a division | segmentation member. Can do.

  The correction heating member is disposed on the first main surface side of the plate member, and the cutting plan line is linear when the plate member is heated by the correction heating member from the first main surface side and divided by the dividing member. The plate material may be thermally deformed so that

  If comprised in this way, a board | plate material can be thermally deformed so that a division plan line may become linear at the time of the division | segmentation by a division member by heating a board | plate material with the correction heating member arrange | positioned at the 1st main surface side. .

  Further, the correction heating member heats the side opposite to the side where the distance to the edge of the plate material is short with respect to the dividing member, and by heating the plate material with the correction heating member, You may make it give the thermal deformation which a center part shrink | contracts with respect to the said division | segmentation plan line to an edge.

  If comprised in this way, a board | plate material will be thermally deformed so that a division | segmentation plan line may become linear at the time of the division | segmentation by a dividing member by heating the opposite side to the edge side of a board | plate material with respect to a dividing member with a correction heating member. Can do.

  Further, the correction heating member cools the side where the distance to the edge of the plate material is short with respect to the dividing member, and by cooling the plate material by the correction heating member, the edge of the plate material is cooled. You may make it give the thermal deformation which a center part shrink | contracts with respect to the said division | segmentation plan line.

  If comprised in this way, a correction heating member will heat a board | plate material so that a division | segmentation plan line may become a straight line at the time of the division | segmentation by a division | segmentation member by cooling the short distance to the edge of a board | plate material with respect to a division | segmentation member. Can be deformed.

  The correction heating member may heat or cool the plate material from both the second main surface side and the first main surface side of the plate material.

  If comprised in this way, it can heat or cool with a correction heating member from both surfaces of a board | plate material, and can further improve the straightness of a division | segmentation plan line.

  Moreover, you may make it pull the said board | plate material in the direction orthogonal to a division | segmentation plan line at the said division | segmentation process.

  By configuring in this way, in addition to the tensile thermal stress acting on the plate material and the tensile stress due to the bending force, the tensile stress due to the tensile force is further superimposed, and the plate material is divided in a shorter time along the dividing line. Can do.

  On the other hand, the cutting apparatus for a brittle material plate material according to the present invention from one side face does not remove the plate material along a cutting plan line on which a fine starting flaw is formed on the first main surface of the brittle material plate material. A cutting device for equally dividing, a pair of pressing members for pressing the first main surface of the plate material on a pair of lines parallel to the division planned line sandwiching the division planned line, and a first main surface of the plate material The cutting member arranged on the second main surface side facing the opposite side, extending along the dividing plan line, and extending along the dividing plan line and juxtaposed with the dividing member at a predetermined interval, or heating the plate material A correction heating member that cools and thermally deforms the plate material so that a division plan line is linear when divided by the division member, and a correction heating member driving device that arranges the correction heating member at a heating or cooling position of the plate material And the plate by the modified heating member The plate member is thermally deformed by heating or cooling of the plate member, and the dividing member is brought into contact with the plate member to generate a tensile thermal stress on the first main surface of the plate member. By pressing the second main surface and applying a bending force in the plate thickness direction of the plate material, the plate material is caused to overlap with the tensile stress due to the bending force and the tensile thermal stress on the first main surface. It is provided with the parting drive machine which gives a bending force from the said 2nd main surface side so that it may parting along a line.

  With this configuration, the dividing member for heating or cooling the plate material of the brittle material is brought into contact with the plate material along the dividing plan line, and thereby the first main surface of the plate material due to the temperature difference between the second main surface and the first main surface. A tensile thermal stress is generated along the dividing line. And at the time of contact heating or contact cooling by this dividing member, by dividing or dividing the plate material equally by heating or cooling the plate material by a modified heating member arranged in parallel at predetermined intervals along the dividing member The thermal deformation of the plate material that occurs when the dividing member is contact-heated or contact-cooled is thermally deformed so that the dividing line is linear when divided by the dividing member. Therefore, when a bending force in the thickness direction is applied to the second main surface of the plate material along the dividing plan line, the tensile stress generated along the dividing plan line of the first main surface by the bending force and the tensile heat described above. The stress is superimposed on the first main surface of the plate material, whereby the crack progresses linearly from the starting point along the dividing line. As a result, the plate material divided along the dividing line by the dividing member can ensure the straightness of the divided edge even when it returns to room temperature. According to this apparatus, the division can be performed instantaneously to increase productivity. In addition, it is only necessary to form minute starting points on the first main surface of the plate material, and since there is no formation of mechanical grooves or mechanical division, generation of fragmentation waste can be suppressed when the plate material is divided. . Moreover, it is not necessary to clean the divided plate material, and the plate material can be divided by a very simple device.

  In other words, in the above configuration, even when the plate material is divided evenly, the dividing plan line can be corrected linearly by the thermal deformation of the plate material by the correction heating member and the thermal deformation of the plate material by the heat of the dividing member. . Therefore, by pressing the cutting member along the cutting plan line, tensile stress due to the tensile thermal stress and bending force acts on the first main surface of the plate material, and the plate material with these stresses generated along the cutting plan line. It is possible to divide the edge of the straight line into a straight line, and to ensure the straightness of the edge in the unequal division.

  Further, the dividing member is configured to contact and heat the second main surface of the plate material, and the correction heating member includes the heating or cooling of the plate material by the correction heating member and the contact heating of the dividing member. You may comprise so that the said board | plate material may be thermally deformed so that the said division | segmentation plan line may become linear at the time of the division | segmentation by a division member.

  If constituted in this way, the plate material can be thermally deformed by the contact heating of the second main surface by the dividing member and the heating or cooling by the correction heating member so that the dividing line is linear when dividing by the dividing member. it can. And the tensile thermal stress of the thermal expansion by the contact heating of the dividing member and the tensile stress by the bending force are superposed along the dividing plan line of the first main surface, and the plate material is divided by these stresses along the dividing plan line. be able to. And a bending force can be provided to the 2nd main surface of a board | plate material using the dividing member which contacts and heats the 2nd main surface of a board | plate material.

  In addition, the correction heating member is disposed on the opposite side to the side where the distance to the edge of the plate member is short with respect to the dividing member, and the plate member is heated by the correction heating member, so that the dividing member is divided. You may arrange | position so that the said board | plate material may be thermally deformed so that the said division | segmentation plan line may become linear form.

  If comprised in this way, a cutting plan line will become a straight line at the time of the division | segmentation by a dividing member by heating the opposite side to the side where the distance to the edge of a board | plate material is short with respect to a dividing member with a correction heating member. The plate material can be thermally deformed.

  Moreover, the said correction heating member may serve as one pressing member which presses the 1st main surface of the said board | plate material.

  If comprised in this way, the apparatus structure can be reduced and the cutting device can be made compact.

  Further, the correction heating member is disposed on a side where the distance to the edge of the plate material is short with respect to the dividing member, and the cutting plan is generated when the dividing member is divided by cooling the plate material with the correction heating member. You may arrange | position so that a thermal deformation may be given to the said board | plate material so that a line may become linear form.

  If comprised in this way, a correction heating member will heat a board | plate material so that a division | segmentation plan line may become a straight line at the time of the division | segmentation by a division | segmentation member by cooling the short distance to the edge of a board | plate material with respect to a division | segmentation member. Can be deformed.

  Moreover, the said correction heating member drive machine may be comprised so that the said correction heating member may be stopped at the predetermined distance which does not adjoin to the said board | plate material at the time of the said heating or cooling.

  If comprised in this way, since a correction heating member does not contact a board | plate material, it can prevent a surface of a board | plate material from being damaged with a correction heating member.

  Moreover, the said correction heating member may be arrange | positioned so that this board | plate material may be heated or cooled from both the 2nd main surface side and the 1st main surface side of the said board | plate material.

  If comprised in this way, it can heat or cool with a correction heating member from both surfaces of a board | plate material, and can further improve the straightness of a division | segmentation plan line.

  Moreover, you may further provide the tension machine which pulls the said board | plate material in the direction orthogonal to the said division | segmentation plan line.

  If comprised in this way, in addition to a tensile thermal stress, the tensile stress by a tensile force may be superimposed, and a board | plate material can be cut | disconnected in a short time along a cutting plan line.

  According to the present invention, even when the plate material is divided evenly, the dividing plan line is corrected to a straight line and appropriately divided to ensure the straightness of the edge, the generation of divided dust is also suppressed, and the productivity is improved. It is possible to configure a compact cutting apparatus with a small apparatus configuration that can be raised.

FIG. 1 is a perspective view showing a sheet cutting apparatus according to a first embodiment of the present invention. FIG. 2 is a side view of the cutting apparatus shown in FIG. FIG. 3A is a perspective view of a plate material showing an example of the position of the starting point ridge. FIG. 3B is a perspective view of a plate material showing another example of the position of the starting point ridge. FIG. 4A is an enlarged side view schematically showing the cutting principle of the plate material by the cutting apparatus shown in FIG. FIG. 4B is an enlarged side view schematically showing the cutting principle of the plate material following FIG. 4A. FIG. 5 is an enlarged view of the part of the parting member and the correction heating member of the parting apparatus shown in FIG. FIG. 6 is a bottom view of the part of the dividing member and the modified heating member shown in FIG. 5 and schematically shows thermal deformation of the plate material at the time of division. FIG. 7 is a side view schematically showing thermal deformation of the plate material when the plate material is divided by the cutting apparatus shown in FIG. FIG. 8 is a side view schematically showing thermal deformation of the plate material that occurs when the plate material is divided by the dividing device subsequent to FIG. 7. FIG. 9A is an enlarged side view schematically showing the cutting principle of the plate material by the cutting device according to the second embodiment of the present invention. FIG. 9B is an enlarged side view schematically showing the cutting principle of the plate material following FIG. 9A. FIG. 10A is a side view showing an arrangement example of the dividing member and the modified heating member according to the third embodiment of the present invention. FIG. 10B is a side view showing an arrangement example of the dividing member and the modified heating member according to the fourth embodiment of the present invention. FIG. 10C is a side view showing an arrangement example of the dividing member and the modified heating member according to the fifth embodiment of the present invention. FIG. 11A is a side view showing an arrangement example of the dividing member and the modified heating member according to the sixth embodiment of the present invention. FIG. 11B is a side view showing an arrangement example of the dividing member and the modified heating member according to the seventh embodiment of the present invention. FIG. 11C is a side view showing an arrangement example of the dividing member and the modified heating member according to the eighth embodiment of the present invention. FIG. 12: is a side view which shows the example of arrangement | positioning of the division member and correction heating member which concern on 9th Embodiment of this invention. FIG. 13: is a side view which shows the example of arrangement | positioning of the division member and correction heating member which concern on 10th Embodiment of this invention. FIG. 14 is a side view showing an arrangement example of the dividing member and the correction heating member according to the eleventh embodiment of the present invention. FIG. 15A is a plan view showing an example of equally dividing a plate material by a dividing device. FIG. 15B is an explanatory diagram of a cutting plan line for the plate material shown in FIG. 15A. FIG. 15C is a schematic diagram showing thermal deformation of the plate material when the cutting plan line shown in FIG. 15B is cut. FIG. 16A is a plan view showing an example of unequal division of a plate material by the division device. FIG. 16B is an explanatory diagram of a cutting plan line for the plate material shown in FIG. 16A. FIG. 16C is a schematic diagram showing thermal deformation of the plate material when the cutting plan line shown in FIG. 16B is cut.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Also in the following embodiments, the glass plate 1 will be described as an example of a plate material made of a brittle material. In addition, an explanation will be given by taking an example of an unequal division such as trimming one end portion of the glass plate 1 by a division apparatus. In addition, the main structure and its effect | action in a board | plate material parting apparatus are demonstrated, and description of a specific mechanism etc. is abbreviate | omitted.

(First embodiment)
1 and 2 is an example of dividing the glass plate 1 along the dividing line 2 by using a dividing member 11 that heats the glass plate 1 by contact. The division | segmentation plan line 2 is a plan line which divides | segments equally in the position near the one end part of the glass plate 1, as shown with a virtual line, for example.

  The glass plate 1 has the 1st main surface 1a in which the micro starting point fist 16 is formed on the division | segmentation plan line 2, and the 2nd main surface 1b facing the 1st main surface 1a. In the present embodiment, since the glass plate 1 is divided in a state parallel to the horizontal plane, the first main surface 1a is the upper surface and the second main surface 1b is the lower surface.

  The glass plate 1 is sent by the conveying device 3 in the arrangement direction J shown in the figure, and is arranged at a predetermined position. The conveying device 3 shown in the figure shows an example in which the glass plate 1 is conveyed by being floated with a gas. The transport device 3 may have another configuration using, for example, a roller.

  The glass plate 1 placed at a predetermined position in the transport device 3 is subjected to contact heating by the dividing member 11 and heating by the correction heating member 70, and then divided as will be described later. In this embodiment, the dividing member 11 and the correction heating member 70 are arranged below the second main surface 1b side of the glass plate 1 and are provided so as to intersect the arrangement direction J. The dividing member 11 of this embodiment extends along a dividing plan line 2 orthogonal to the arrangement direction J of the glass plate 1. The correction heating member 70 is disposed near the center, which is the opposite side to the side where the distance to the edge of the glass plate 1 is short with respect to the dividing member 11, and is arranged in parallel with the dividing member 11.

  The parting member 11 is configured to be advanced and retracted toward the glass plate 1 by a parting drive 12 and is driven upward or downward by the parting drive 12. The dividing member 11 is pressed toward the glass plate 1 by being driven upward by the dividing drive machine 12. The dividing drive unit 12 may be any device that accurately moves the dividing member 11 forward and backward. For example, a linear actuator or the like can be used.

  The correction heating member 70 is also configured to be advanced and retracted toward the glass plate 1 by the correction heating member driving device 71, and is driven upward or downward by the correction heating member driving device 71. The correction heating member 70 is disposed at a position close to the glass plate 1 by being driven by the correction heating member driving device 71. The correction heating member driving machine 71 may be any one that accurately moves the correction heating member 70, and a linear actuator or the like can be used. In this embodiment, the correction heating member 70 is driven up and down by the original correction heating member driving machine 71, but it may be moved up and down integrally with the dividing member 11. In this case, the correction heating member 70 is disposed slightly lower than the dividing member 11 so as not to contact the glass plate 1.

  Further, the dividing member 11 is connected to a heating device 13 for heating the vicinity of the surface of the dividing member 11 to a predetermined heating temperature. When the dividing member 11 is brought into contact with the second main surface 1b of the glass plate 1, the portion in contact with the dividing member 11 in the second main surface 1b is heated to substantially the same temperature as itself. As the dividing member 11 heated by the heating device 13, for example, a sheathed heater can be used. The predetermined heating temperature of the dividing member 11 is, for example, about 70 ° C to 400 ° C. This heating temperature is determined according to the plate material.

  The correction heating member 70 is also connected to the heating device 13 so as to heat the surface of the correction heating member 70 to a predetermined temperature. The correction heating member 70 heats the predetermined range of the glass plate 1 from the 2nd main surface 1b side by making it adjoin to the 2nd main surface 1b of the glass plate 1. FIG. For example, a sheathed heater can be used as the correction heating member 70. The temperature of the correction heating process by the correction heating member 70 is, for example, about 50 ° C. to 300 ° C. lower than the heating temperature of the dividing member 11. What is necessary is just to determine the temperature to heat according to the thickness, physical-property value, etc. of the glass plate (plate material) 1. FIG. In the case where the dividing member 11 is configured to contact-cool the glass plate 1, the temperature at which the glass plate 1 is cooled by the modified heating member 70 is set to be higher than the cooling temperature by the dividing member 11.

  On the other hand, on the upper side, which is the first main surface 1a side of the glass plate 1, a pair of pressing the first main surface 1a of the glass plate 1 on a pair of lines parallel to the dividing plan line 2 on both sides of the dividing plan line 2. Holding members 14 and 15 are provided. The holding members 14 and 15 of this embodiment are disposed so as to hold the glass plate 1 on both sides of the dividing plan line 2. The pressing members 14 and 15 are moved up and down by a driving machine (not shown). As the pressing members 14 and 15, for example, members formed in a rod shape with resin or rubber are used.

  Moreover, as shown in FIG. 1, in this embodiment, the cutting device 10 forms the wrinkle forming means 17 that forms a minute starting point scribing 16 on the first main surface 1a of the glass plate 1 on the cutting plan line 2. have. It is desirable that the starting point 16 is formed at the end of the glass plate 1. By forming the starting plate 16, the glass plate 1 can be divided so as to be divided from the end portion on the starting plate 16 side, and the glass plate 1 can be divided smoothly along the dividing line 2. Here, the “end portion of the glass plate 1” refers to both side portions when the glass plate 1 is divided into three equal parts in the extending direction of the dividing plan line 2. For example, the starting point 16 may be formed at the corner of the first main surface 1a and the end surface 1c of the glass plate 1 as shown in FIG. 3A, or slightly from the end surface 1c of the glass plate 1 as shown in FIG. 3B. You may form in the position which entered inside. The timing at which the heel forming means 17 forms the starting heel 16 may be before or after the pressing members 14 and 15 press the first main surface 1a of the glass plate 1.

  For example, the wrinkle forming means 17 may put a score line of about 1 to 2 mm as a minute starting wrinkle 16 at the end of the glass plate 1 or may put a dot-like wrinkle. In the present embodiment, as the ridge forming means 17, a cutter is used in which the starting ridge 16 is inserted from the lateral direction before the dividing plan line 2 reaches the position of the dividing member 11.

  As described above, in the cutting apparatus 10, the modified heating members 70 (heaters) are installed at a certain interval in parallel with the cutting plan line 2, separately from the cutting members 11 arranged along the cutting plan line 2. The correction heating member 70 is configured to heat the glass plate 1 simultaneously with the start of contact heating of the glass plate 1 by the dividing member 11 or at a predetermined time difference.

  Then, after heating the glass plate 1 for a predetermined time by the dividing member 11, the glass plate 1 is further pressed to generate a bending moment along the dividing plan line 2, and along the dividing plan line 2 of the first main surface 1a. Then, the tensile thermal stress (thermal strain stress) due to contact heating and the tensile stress due to bending are overlapped and divided (for details, FIGS. 4A and 4B). At this time, the dividing member 11 remains in contact with the glass plate 1. When the division of the glass plate 1 is completed, the dividing member 11 and the correction heating member 70 are retracted. The correction heating member 70 may be retracted first.

  The cross-sectional shape of the dividing member 11 may be a triangular cross section, a rectangular cross section, or the like in addition to a circular cross section. The cross-sectional shape of the dividing member 11 is set to a shape in which a portion in contact with the glass plate (plate material) 1 has a contact angle smaller than a bending angle when the glass plate 1 is divided. In addition, the cross section of the correction heating member 70 may be any shape that can be heated close to the glass plate 1. The modified heating member 70 of this embodiment has a circular cross section, but may be a rectangular cross section, a triangular cross section, or the like.

  Next, the cutting principle of the glass plate 1 by the cutting member 11 will be described first with reference to FIGS. 1 to 3 and FIGS. 4A and 4B. 4A and 4B, the description of the correction heating member 70 is omitted, the heat is indicated by an arc, and the change of the glass plate 1 is exaggerated. Moreover, according to this embodiment, bending force is provided to the 2nd main surface 1b of the glass plate 1 using the dividing member 11 which contacts and heats the 2nd main surface 1b of the glass plate 1. FIG.

  As shown in FIGS. 1 and 2, the glass plate 1 having the starting surface 16 formed on the first main surface 1 a, which is stopped at a predetermined position by the transport device 3, is transported by the press members 14 and 15. Pressed in the direction of. And in that state, as shown to FIG. 4A, the parting member 11 heated to predetermined heating temperature is made to contact the 2nd main surface 1b of the glass plate 1 along the parting plan line 2. FIG. Thereby, the glass plate 1 is contact-heated from the 2nd main surface 1b side along the dividing plan line 2, and a big temperature gradient is formed between the 2nd main surface 1b of the glass plate 1, and the 1st main surface 1a. . As a result, tensile thermal stress (indicated by arrow B) due to thermal expansion is generated on the first main surface 1a, and compressive thermal stress (indicated by arrow A) is generated on the second main surface 1b by the reaction force. To do.

  Thereafter, as shown in FIG. 4B, while the temperature difference between the first main surface 1a and the second main surface 1b of the glass plate 1 is kept large, in other words, the temperature of the first main surface 1a is increased by heat conduction. The dividing member 11 is pressed against the glass plate 1 before approaching the temperature of the second main surface 1b. Thereby, a bending force (indicated by an arrow C) in the thickness direction is given to the second main surface 1b of the glass plate 1 along the dividing plan line 2, and the second main surface 1b of the glass plate 1 is compressed. Stress (indicated by an arrow D) acts, tensile stress (indicated by an arrow E) acts on the first main surface 1a, and a maximum moment acts along the dividing line 2 of the glass plate 1.

  Therefore, along the dividing plan line 2 of the glass plate 1, in addition to the compressive thermal stress due to thermal expansion (arrow A in FIG. 4A), the compressive stress due to the bending force C (arrow D in FIG. 4B) is applied to the second main surface 1b. Is superimposed on the first main surface 1a in addition to the tensile thermal stress (B in FIG. 4A) due to the thermal expansion of the second main surface 1b and the tensile stress (E in FIG. 4B) due to the bending force C. 1 The crack progresses along the dividing line 2 from the starting surface 16 (FIG. 1) formed on the main surface 1a, whereby the glass plate 1 made of brittle material is divided along the dividing line 2 by brittle fracture. Is done. That is, the glass plate 1 is divided by the thermal stress generated by the temperature difference between the front and back surfaces due to the heating of the dividing member 11 and the stress due to the bending force C of the glass plate 1 by the dividing member 11 reaching the breaking stress. Moreover, the glass plate 1 can be divided instantaneously (for example, about 1 to 3 seconds) along the dividing line 2 by those stresses.

  Such a principle is a dividing principle of the glass plate 1. And according to the said dividing apparatus 10, in addition to this dividing principle, even when dividing | segmenting the glass plate (plate | board material) 1 by unequal division, it divides | segments by making the straightness of the dividing plan line 2 appropriate as follows. be able to.

  Based on FIGS. 5 and 6, the heating of the glass plate 1 by the modified heating member 70 in the case where the glass plate 1 is divided into unequal portions by the dividing member 11 will be described. 5 and 6, only the dividing member 11, the correction heating member 70, and the glass plate 1 are illustrated, and the thermal deformation H of the glass plate 1 is indicated by an exaggerated dotted line.

  As shown in FIG. 5, the correction heating member 70 of this embodiment is, as described above, the center on the opposite side to the side where the distance to the edge of the glass plate 1 is short with respect to the dividing member 11 (the right side in the figure). It is installed side by side. The correction heating member 70 is raised toward the glass plate 1 together with the dividing member 11, and is stopped at a position close to the second main surface 1b. In this embodiment, as described above, the correction heating member 70 is disposed slightly lower (for example, several mm) than the dividing member 11, and the correction heating member 70 is brought into contact with the second main surface 1 b of the glass plate 1. Instead, only the dividing member 11 is brought into contact with the second main surface 1b of the glass plate 1.

  And the parting member 11 is heated to predetermined temperature, and the correction heating member 70 is heated to predetermined temperature, and the vicinity including the parting plan line 2 of the glass plate 1 is heated by these. The predetermined temperature of the correction heating member 70 is set lower than the predetermined temperature of the dividing member 11 as described above.

  Thereafter, when heated for a predetermined time (for example, several seconds of about 0.5 to 5 seconds), the glass plate 1 is heated as shown in FIG. 6 by the dividing member 11 and the correction heating member 70 as shown by the dotted line in the drawing. Thermal deformation H occurs due to thermal expansion. The dotted line exaggeratedly shows the state of thermal deformation H. That is, in the division of the unequal glass plate 1, only the contact heating by the dividing member 11 increases the amount of expansion when the distance from the dividing member 11 to the edge is shorter (FIG. 16C), but the contact by the dividing member 11 In addition to heating, the glass plate 1 on the side opposite to the edge side of the dividing member 11 is heated and expanded by the modified heating member 70 arranged in parallel to the dividing member 11, so that the glass plate 1 is divided on both sides of the dividing plan line 2. The dividing plan line 2 is corrected to a straight line by causing thermal deformation H that expands at both ends in the extending direction of the member 11 and contracts the central portion of the dividing plan line 2 due to the expansion of both ends. . That is, the distortion caused by heating the glass plate 1 is corrected so that the dividing plan line 2 becomes linear when dividing by the dividing member 11 so that the distortion is generated substantially evenly with respect to the dividing plan line 2. .

  7 is a side view schematically showing the thermal stress inside the plate material when the plate material is divided by the dividing device shown in FIG. 6, and FIG. 8 is generated when the plate material is divided by the dividing device after FIG. It is a side view which shows typically the thermal stress inside a board | plate material. In these drawings, the heat is indicated by an arc, and the thermal deformation of the glass plate 1 is exaggerated.

  As shown in FIG. 7, the dividing member 11 is brought into contact with the second main surface 1b of the glass plate 1 and heated, and the glass plate 1 is also heated by the modified heating member 70 arranged on the second main surface 1b side. To do. As a result, a compressive thermal stress is applied to the second main surface 1b at the position of the dividing member 11 as a reaction force of the tensile thermal stress (indicated by arrow B) of the first main surface 1a generated by the thermal expansion of the second main surface 1b. (Indicated by arrow A) occurs. Further, at the position of the correction heating member 70, the second main surface 1b side of the glass plate 1 is thermally expanded, and a compressive thermal stress (indicated by an arrow F) is generated as a reaction force of the tensile thermal stress of the first main surface 1a. And as above-mentioned by these thermal stress, the division | segmentation plan line 2 of the glass plate 1 is corrected to linear form.

  After that, as shown in FIG. 8, by pressing the dividing member 11 along the dividing plan line 2 of the glass plate 1, the second main surface 1 b of the glass plate 1 is in the thickness direction along the dividing plan line 2. A bending force C is applied, and a maximum moment acts on the glass plate 1 along the dividing plan line 2. Thus, the tensile stress E is superimposed on the first main surface 1a of the glass plate 1 in addition to the tensile thermal stress B due to the reaction force of the thermal expansion of the second main surface 1b. From 1), the crack advances along the dividing line 2 and is instantaneously divided.

  Therefore, according to the above-described dividing apparatus 10, even when the glass plate (plate material) 1 is divided in an unequal manner, the glass plate 1 is heated (or cooled) at a predetermined temperature by the correction heating member 70 to be thermally deformed. Even if the dividing plan line 2 is curved as shown in FIG. 15C only by contact heating by the dividing member 11, the dividing plan line 2 can be corrected by being linearly divided. Therefore, the edge of the glass plate 1 after dividing can ensure an appropriate straightness along the dividing plan line 2. In addition, it is possible to suppress the generation of divided dust at the time of dividing, and it is possible to configure a compact dividing device with a small device configuration.

(Embodiment with a tensioner)
Furthermore, as shown in FIG. 1 described above, a tensioner 60 (indicated by a two-dot chain line) for pulling the glass plate (plate material) 1 in a direction orthogonal to the dividing line 2 may be provided. The tension machine 60 should just be able to pull the glass plate (plate material) 1 in the opposite directions to each other with the dividing line 2 interposed therebetween. FIG. 1 shows an example in which the end of the glass plate 1 is gripped and pulled. By this tensioning machine 60, a tensile force may be applied to the glass plate 1 before or simultaneously with the pressing of the dividing member 11 to the glass plate 1, and the glass plate 1 may be divided along the dividing plan line 2. In this case, depending on the glass plate (plate material) 1, the tensile member 60 may be used only to apply a tensile force at the same time as heating by the dividing member 11 along the dividing plan line 2. If it does in this way, in addition to the tensile thermal stress and the tensile stress by the bending force C, the tensile stress by a tensile force may be superimposed, and the glass plate 1 can be divided along the dividing plan line 2 in a shorter time.

  Further, when the glass plate 1 is pulled by the pulling device 60, the holding members 14 and 15 and the opposing member (corresponding to the conveying device 3; not shown) are configured to lightly hold the glass plate 1 with a roller containing a rolling bearing. . The holding members 14 and 15 may not only hold the glass plate 1 but only restrict the deformation of the glass plate 1 with a slight gap.

(Second Embodiment)
FIG. 9A and FIG. 9B are enlarged side views schematically showing the cutting principle of the plate material by the cutting device according to the second embodiment. The cutting device 30 according to the second embodiment is an embodiment in which the cutting member 31 is contact-cooled from the first main surface 1a side of the glass plate 1. The same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 9A, the dividing member 31 cooled to a predetermined cooling temperature is brought into contact with the first main surface 1 a of the glass plate 1 along the dividing plan line 2. Thereby, the glass plate 1 is cooled from the 1st main surface 1a side along the parting plan line 2, and a big temperature gradient is formed between the 1st main surface 1a of the glass plate 1, and the 2nd main surface 1b. As a result, compressive thermal stress A is generated on the second main surface 1b due to thermal contraction of the first main surface 1a, and tensile thermal stress B is generated on the first main surface 1a by the reaction force. When this parting member 31 is contact-cooled along the parting plan line 2, the temperature difference between the glass plate 1 and the parting member 31 is set to the same temperature difference as the contact heating.

  Moreover, also in this 2nd Embodiment, the correction heating member 70 or the correction heating member mentioned later so that the distortion which arises by cooling the glass plate 1 may generate | occur | produce substantially right and left with respect to the division | segmentation plan line 2 (refer FIG. 6). The glass plate 1 is appropriately heated or cooled by 75, and the dividing plan line 2 is corrected to be linear when dividing by the dividing member 31.

  Then, as shown in FIG. 9B, the dividing member 31 is retracted upward, and the pressing member 32 is pressed against the glass plate 1 from the second main surface 1 b side of the plate material 1. Thereby, the bending force C in the plate thickness direction is applied to the second main surface 1b of the glass plate 1 along the dividing plan line 2 that is linear. Thereby, the compressive stress D acts on the 2nd main surface 1b of the glass plate 1, and the tensile stress E acts on the 1st main surface 1a, and becomes the maximum along the division | segmentation plan line 2 of the glass plate 1. Moment acts.

  Therefore, along the division plan line 2 of the glass plate 1, in addition to the tensile thermal stress B, the tensile stress E due to the bending force C is superimposed on the first principal surface 1a, and the second principal surface 1b is compressed by thermal contraction. In addition to thermal stress A, compressive stress D due to bending force C is superimposed, so that the crack progresses along the dividing line 2 from the starting point 16 (FIG. 1) formed on the first main surface 1a, and thus brittle. The glass plate 1 made of a material is divided by a brittle fracture along a division plan line 2. That is, the glass plate 1 is divided by the thermal stress generated from the temperature difference between the front and back surfaces due to the cooling of the dividing member 31 and the stress due to the bending force C of the glass plate 1 by the dividing member 11 to reach the breaking stress. Moreover, the glass plate 1 can be divided instantaneously (for example, about 1 to 3 seconds) along the dividing line 2 by those stresses.

(Other embodiments)
The modified heating member 70 is configured to heat the opposite side to the side where the distance to the edge is short by the unequal division, or the distance if the dividing member 11 is configured to contact heat along the dividing line 2. The structure which cools the short side is used.

  FIG. 10A is a side view showing an arrangement example of the dividing member 11 and the modified heating member 70 according to the third embodiment. The correction heating member 70 of this embodiment is arrange | positioned at the 1st main surface 1a side of the glass plate 1, and is arranged in parallel by the side opposite to the edge side of the glass plate 1 with respect to the dividing member 11, and the glass plate 1 is arrange | positioned. It comes to heat. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  According to this 3rd Embodiment, by heating the glass plate 1 with the correction heating member 70 arrange | positioned at the 1st main surface 1a side, the parting plan line 2 becomes linear at the time of the division | segmentation by the parting member 11 The glass plate 1 is thermally deformed. Therefore, even when the glass plate 1 is divided evenly, the tensile thermal stress of thermal expansion caused by contact heating of the dividing member 11 and the tensile stress caused by the bending force are superposed along the dividing plan line 2, and these The glass plate 1 can be appropriately divided along the dividing line 2 by the stress.

  FIG. 10B is a side view showing an arrangement example of the dividing member 11 and the modified heating member 75 according to the fourth embodiment. The correction heating member 75 of this embodiment is arrange | positioned in parallel with the edge side of the glass plate 1 with respect to the division member 11, and is arrange | positioned in parallel with the 2nd main surface 1b side of the glass plate 1, and cools the glass plate 1. It has become. In the case of this embodiment, since the correction heating member 75 is arrange | positioned at the edge side (unnecessary part) of the glass plate 1, you may make it contact with the glass plate 1. FIG. Since the other configuration of the example is the same as that of the first embodiment, description thereof is omitted.

  According to this 4th Embodiment, by cooling with the correction heating member 75 arrange | positioned at the 2nd main surface 1b side, the glass plate 1 is made so that the division | segmentation plan line 2 becomes linear at the time of the division | segmentation by the division member 11. FIG. Heat deform. Therefore, even when the glass plate 1 is divided evenly, the tensile thermal stress of thermal expansion caused by contact heating of the dividing member 11 and the tensile stress caused by the bending force are superposed along the dividing plan line 2, and these The glass plate 1 can be appropriately divided along the dividing line 2 by the stress.

  FIG. 10C is a side view showing an arrangement example of the dividing member 11 and the modified heating members 70 and 75 according to the fifth embodiment. The modified heating members 70 and 75 of this embodiment are arranged on the second main surface 1b side of the glass plate 1 and are arranged in parallel with the dividing member 11 on the opposite side of the edge side of the glass plate 1 in parallel. A plurality of first correction heating members 70 for heating 1 and the second main surface 1b side of the glass plate 1 are arranged in parallel to the edge side of the glass plate 1 with respect to the dividing member 11 and are arranged on the glass plate 1 It becomes the 2nd correction heating member 75 which cools. This embodiment is an example in which heating by the first correction heating member 70 and cooling by the second correction heating member 75 are used in combination. Also. In this embodiment, the several 1st correction heating member 70 is arrange | positioned and the heating temperature of each 1st correction heating member 70 is changed. For example, the heating temperature may be set gradually lower toward the first correction heating member 70 moving away from the first correction heating member 70 close to the dividing member 11. In this case, you may make it the 2nd correction heating member 75 arrange | positioned at the edge side (unnecessary part) of the glass plate 1 contact with the glass plate 1. FIG. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  According to this 5th Embodiment, the division | segmentation plan line 2 at the time of the division | segmentation by the dividing member 11 by the heating by the 1st correction heating member 70 arrange | positioned at the 2nd main surface 1b side and the cooling by the 2nd correction heating member 75 is carried out. The glass plate 1 is thermally deformed so as to be linear. Therefore, even when the glass plate 1 is divided evenly, the tensile thermal stress of thermal expansion caused by contact heating of the dividing member 11 and the tensile stress caused by the bending force are superposed along the dividing plan line 2, and these The glass plate 1 can be appropriately divided along the dividing line 2 by the stress. In addition, according to the fifth embodiment, since cooling and heating are performed simultaneously, there is an effect that the temperature gradient can be increased, the generated thermal stress is increased, and bending or pulling can be reduced.

  The embodiment shown in FIGS. 11A to 11C is a modification corresponding to the embodiment shown in FIGS. 10A to 10C. Only the differences are explained. The sixth embodiment shown in FIG. 11A is an embodiment in which the modified heating members 70 in the third embodiment shown in FIG. 10A are arranged on both the first main surface 1a side and the second main surface 1b side of the glass plate 1. It is. The seventh embodiment shown in FIG. 11B is an embodiment in which the modified heating members 75 in the fourth embodiment shown in FIG. 10B are arranged on both the first main surface 1a side and the second main surface 1b side of the glass plate 1. It is. 11C arrange | positions the correction heating members 70 and 75 in 5th Embodiment shown to the said FIG. 10C on both surfaces of the 1st main surface 1a side of the glass plate 1, and the 2nd main surface 1b side. It is an embodiment.

  Thus, the straightness of the said division | segmentation plan line 2 can further be improved by arrange | positioning the correction heating members 70 or 75 on both surfaces of the glass plate 1, and heating or cooling.

  10A to 10C and FIGS. 11A to 11C are only examples, and the combination of the heating member to be heated and the heating member to be cooled depends on the thickness and physical properties of the plate material. It may be set according to the above. Moreover, you may make it provide one or both of the correction heating members heated or cooled. The arrangement position, quantity, temperature, etc. of the correction heating member are not limited.

  Moreover, although the example which contacts and heats the dividing member 11 to the glass plate 1 was demonstrated, you may comprise so that the glass plate 1 may be contact-cooled and divided. When dividing by contact cooling, the dividing member (cooling rod or the like) that cools the first main surface 1a and the second main surface 1b of the dividing line 2 of the glass plate 1 and the pressing member are arranged to face each other. .

  And after the 1st main surface 1a of the glass plate 1 is contact-cooled with a dividing member and a tensile thermal stress is applied along the dividing plan line 2, it is pressed along the dividing plan line 2 from the second main surface 1b side. By applying a bending moment by pressing with a member, a tensile stress is applied along the dividing plan line 2 on which the tensile thermal stress is applied, and the glass plate 1 is appropriately moved along the dividing plan line 2 with these stresses. Can be divided.

  That is, when the dividing member is cooled in contact with the glass plate 1 in this way, a tensile thermal stress is generated on the first main surface 1a side of the glass plate 1 and the first of the glass plate 1 along the dividing plan line 2 is generated. By applying a bending force in the thickness direction opposite to the main surface 1a to the second main surface 1b, the tensile stress acting on the first main surface 1a by this bending force and the tensile thermal stress due to the contact cooling are superimposed. Then, the glass plate 1 can be divided along the dividing line 2. The dividing member (cooling rod) may be cooled using liquid nitrogen, dry ice, or a refrigerant of a refrigeration apparatus.

  FIG. 12 is a side view illustrating an arrangement example of the dividing member and the correction heating member according to the ninth embodiment. In addition, the same code | symbol is attached | subjected to the structure same as the said 1st Embodiment, and the detailed description is abbreviate | omitted. As shown in the figure, in this embodiment, one of the pair of pressing members provided in parallel to the dividing plan line 2 has a drive device 21 that moves the pressing member 20 up and down toward the glass plate 1.

  In the case of this embodiment, the dividing member 11 is brought into contact with the second main surface 1b of the glass plate 1 and heated for a predetermined time, and then the presser member 20 is lowered by the driving machine 21 to the dividing plan line 2 at the position of the dividing member 11. A bending force is applied along. Thereby, as described above, the tensile stress and the tensile thermal stress generated along the dividing plan line 2 are superimposed on the first main surface 1 a of the glass plate 1, thereby the glass plate along the dividing plan line 2. 1 can be divided.

  FIG. 13 is a side view illustrating an arrangement example of the dividing member and the correction heating member according to the tenth embodiment. In addition, the same code | symbol is attached | subjected to the structure same as the said 1st Embodiment, and the detailed description is abbreviate | omitted. As shown in the figure, in this embodiment, one of the pair of presser members provided in parallel with the dividing plan line 2 is the correction heating member 70. The correction heating member 70 is provided in a correction heating member driver 71 that moves the correction heating member 70 up and down toward the glass plate 1.

  In this embodiment, the dividing member 11 is brought into contact with the second main surface 1b of the glass plate 1 and heated for a predetermined time, and at the same time, the correction heating member 70 is brought into contact with the first main surface 1a of the glass plate 1 and heated for a predetermined time. Then, the dividing member 11 is raised by the dividing drive machine 12 and a bending force is applied along the dividing plan line 2. Thereby, as described above, the tensile stress and the tensile thermal stress generated along the dividing plan line 2 are superimposed on the first main surface 1 a of the glass plate 1, thereby the glass plate along the dividing plan line 2. 1 can be divided.

  FIG. 14 is a side view showing an arrangement example of the dividing member and the correction heating member according to the eleventh embodiment. In addition, the same code | symbol is attached | subjected to the structure same as the said 1st Embodiment, and the detailed description is abbreviate | omitted. As shown in the figure, in this embodiment, the correction heating member 70 in the tenth embodiment is provided on both the first main surface 1a side and the second main surface 1b side of the glass plate 1.

  In this embodiment, the dividing member 11 is brought into contact with the second main surface 1b of the glass plate 1 and heated for a predetermined time, and at the same time, the correction heating member 70 is brought into contact with the first main surface 1a of the glass plate 1 and heated for a predetermined time. Then, the dividing member 11 is raised by the dividing drive machine 12 and a bending force is applied along the dividing plan line 2. Thereby, as described above, the tensile stress and the tensile thermal stress generated along the dividing plan line 2 are superimposed on the first main surface 1 a of the glass plate 1, thereby the glass plate along the dividing plan line 2. 1 can be divided. In the case of this embodiment, since it heats with the correction heating member 70 from both surfaces of the glass plate 1, the straightness of the division | segmentation plan line 2 can further be improved compared with the said 10th Embodiment.

(Summary)
As described above, according to the plate material dividing apparatus 10, thermal stress and bending force in the plate thickness direction generated by contact heating and / or contact cooling of the glass plate (plate material) 1 along the division plan line 2. It is possible to divide by superimposing the stress due to the above, and to reach the breaking stress of the glass plate (plate material) 1, and it is possible to divide while suppressing the generation of divided dust. Moreover, by suppressing the generation of divided dust, a cleaning device for cleaning the divided dust becomes unnecessary, and a scribing device is also unnecessary, so that the configuration for dividing the glass plate (plate material) 1 can be made compact, It is possible to reduce the size and cost of the apparatus.

  Further, even when the glass plate (plate material) 1 is divided at unequal positions, the glass plate 1 is thermally deformed so that the dividing plan line 2 becomes a straight line, and then the thermal stress along the dividing plan line 2. In addition, since the glass plate 1 is neatly divided by the stress caused by the bending force, the glass plate 1 after the division is free from minute chips and the glass plate 1 having high edge strength can be obtained. In addition, a chamfering process is not necessary, and in this respect also, it is possible to reduce the size and cost of the apparatus.

  Accordingly, it is possible to provide a high-quality glass plate (plate material) 1 in which the straightness of the divided edges is ensured not only in the FPD industry but also in various fields such as building materials and the automobile industry.

  In the above-described embodiment, the glass plate 1 is described as an example of the brittle material plate. However, the plate material can be applied as long as it is a brittle material and can be divided by stress due to thermal stress and bending force. The form is not limited.

  Moreover, in the said embodiment, although the example which divides the board | plate material (glass plate 1) of a brittle material with the division | segmentation plan line 2 orthogonal to the arrangement | positioning direction J was demonstrated, if the division | segmentation plan line 2 is a straight line, it will be in the arrangement | positioning direction J. On the other hand, it is possible to divide diagonally at a predetermined angle, and the dividing plan line 2 is not limited to the one perpendicular to the arrangement direction J.

  Moreover, the cutting apparatus does not necessarily need to have the ridge forming means 17, and before the glass plate 1 is sent into the cutting apparatus, the first main surface 1a of the glass plate 1 is formed by a device different from the cutting apparatus. A starting point 16 may be formed.

  In the above embodiment, the sectional member 11 and the modified heating member 70 having a circular cross section have been described as an example. However, a sheath heater (contact heating) having a circular cross section, a refrigerant pipe (contact cooling), and a metal container having a rectangular cross section. (For example, a stainless steel container: not shown) may be used. By putting a heating or cooling member in the metal container, the contact portion of the metal container with the glass plate 1 can be accurately finished by machining. In addition, the contact angle with the glass plate 1 at the time of cutting can be arbitrarily set.

  Furthermore, the said embodiment has shown an example, and various changes in the range which does not impair the summary of this invention are possible, combining each embodiment, and this invention is not limited to the said embodiment. Absent.

1 Glass plate (brittle plate)
DESCRIPTION OF SYMBOLS 1a 1st main surface 1b 2nd main surface 1c End surface 2 Dividing plan line 3 Conveyance device 10 Dividing device 11 Dividing member 12 Dividing drive machine 13 Heating device 14 Holding member 15 Holding member 16 Starting point scribing
17 forming means 30 parting device 31 parting member 32 pressing member 60 tensioning machine 70 correction heating member (heating)
71 Correcting heating member driving device 75 Correcting heating member (cooling)
A compressive thermal stress B tensile thermal stress C bending force D compressive stress E tensile stress F thermal stress G thermal stress H thermal deformation

Claims (16)

A cutting method for dividing a plate made of a brittle material along a division plan line divided into unequal parts,
A wrinkle forming step for forming a fine starting flaw on the first main surface of the plate material on the dividing plan line;
A pressing step of pressing the first main surface of the plate material on a line parallel to the cutting plan line on both sides of the cutting plan line;
The plate material is heated or cooled by a modified heating member that extends along the dividing line and is arranged in parallel with the dividing member at a predetermined interval, and the plate material is heated so that the dividing line is straight when divided by the dividing member. A modified heating process to deform,
The dividing member is heated or cooled so that the plate material is contact-heated or contact-cooled and brought into contact with the dividing plan line of the plate material to generate a tensile thermal stress on the first main surface of the plate material, and the dividing plan line By applying a bending force in the thickness direction from the second main surface side of the plate material along the direction of the plate material, the tensile stress due to the bending force and the tensile thermal stress are overlapped to cause the plate material to follow the dividing plan line. A dividing step of dividing;
A method for dividing a plate material of a brittle material, comprising: The dividing member is disposed on the second main surface side of the plate material, and contacts and heats the second main surface of the plate material,
While causing the dividing member to contact and heat the second main surface of the plate material to generate a tensile thermal stress on the first main surface of the plate material,
The plate material is heated or cooled with the modified heating member, and the plate material is thermally deformed so that a dividing plan line is linear when divided by the dividing member,
2. The brittle material according to claim 1, wherein in the dividing step, a bending force in a plate thickness direction is applied to the second main surface of the plate material along the division plan line by pressing the dividing member against the plate material. Method of cutting board material. The correction heating member is disposed on the second main surface side,
3. The brittle material according to claim 2, wherein the plate material is heated from the second main surface side by the correction heating member, and the plate material is thermally deformed so that a dividing plan line is linear when dividing by the dividing member. Method for dividing plate material. The correction heating member is disposed on the first main surface side of the plate material,
3. The brittle material according to claim 2, wherein the plate material is heated from the first main surface side by the correction heating member, and the plate material is thermally deformed so that a dividing plan line is linear when dividing by the dividing member. Method for dividing plate material. The correction heating member heats the side opposite to the side where the distance to the edge of the plate material is short with respect to the dividing member,
The brittle material according to any one of claims 2 to 4, wherein a thermal deformation in which a central portion contracts with respect to the dividing plan line is applied to an edge of the plate material by heating the plate material with the correction heating member. Method of cutting board material. The correction heating member cools the side where the distance to the edge of the plate material is short with respect to the dividing member,
The method for dividing a plate material of a brittle material according to claim 2, wherein the plate material is cooled by the correction heating member to cause thermal deformation in which a central portion contracts with respect to the division plan line on an edge of the plate material.   The method of dividing a brittle material plate material according to claim 5 or 6, wherein the correction heating member heats or cools the plate material from both the second main surface side and the first main surface side of the plate material.   The method for dividing a plate material of a brittle material according to any one of claims 1 to 7, wherein, in the dividing step, the plate material is pulled in a direction orthogonal to a division plan line. A cutting apparatus that divides the plate material in an uneven manner along a cutting plan line in which minute starting points on the first main surface of the plate material made of a brittle material are formed,
A pair of pressing members for pressing the first main surface of the plate member on a pair of lines parallel to the cutting plan line sandwiching the cutting plan line;
A cutting member disposed along the cutting plan line disposed on the second main surface side facing the first main surface of the plate;
Modification that extends along the dividing line and is arranged in parallel with the dividing member at a predetermined interval, and heats or cools the plate so that the dividing line is thermally deformed so that the dividing line is linear when divided by the dividing member. A heating member;
A correction heating member driving machine for arranging the correction heating member at a heating or cooling position of the plate member;
In the state in which the plate material is thermally deformed by heating or cooling of the plate material by the modified heating member, and the dividing member is brought into contact with the plate material to generate a tensile thermal stress on the first main surface of the plate material. By pressing the second main surface of the plate material along the line and applying a bending force in the thickness direction of the plate material, the tensile stress due to the bending force and the tensile thermal stress are superimposed on the first main surface. A cutting drive that applies bending force from the second main surface side so that the plate material is cut along the cutting plan line;
An apparatus for dividing a plate material made of a brittle material. The dividing member is configured to contact and heat the second main surface of the plate material,
The correction heating member causes the plate material to be thermally deformed by heating or cooling of the plate material by the correction heating member and contact heating of the division member so that the division plan line is linear at the time of division by the division member. The apparatus for cutting a brittle material plate according to claim 9, which is configured.   The correction heating member is disposed on the opposite side to the side where the distance to the edge of the plate material is short with respect to the dividing member, and the dividing material is heated by the correction heating member, so that the dividing is performed when the dividing member is divided. The board | plate part cutting apparatus of the brittle material of Claim 10 arrange | positioned so that a thermal deformation may be given to the said board | plate material so that a design line may become linear form.   The brittle material plate cutting apparatus according to claim 11, wherein the correction heating member also serves as one holding member that holds the first main surface of the plate.   The correction heating member is arranged on the side where the distance to the edge of the plate member is short with respect to the dividing member, and the cutting plan line is formed at the time of dividing by the dividing member by cooling the plate member with the correction heating member. The board | plate part cutting apparatus of the brittle material of Claim 10 arrange | positioned so that a thermal deformation may be given to the said board | plate material so that it may become linear form.   The said correction heating member drive machine is comprised so that the said correction heating member may be stopped at the predetermined distance which does not contact the said board | plate material at the time of the said heating or cooling, and is stopped. Cutting device for brittle material.   The said correction heating member is arrange | positioned so that this board | plate material may be heated or cooled from both surfaces of the 2nd main surface side and 1st main surface side of the said board | plate material. A device for cutting plate materials made of brittle materials.   The cutting device for a brittle material plate material according to any one of claims 9 to 15, further comprising a tension machine that pulls the plate material in a direction orthogonal to the dividing plan line.