WO2014185099A1

WO2014185099A1 - System for manufacturing optical display device

Info

Publication number: WO2014185099A1
Application number: PCT/JP2014/052084
Authority: WO
Inventors: 大充田中; 伸彦西原; 和範岸▲崎▼
Original assignee: 住友化学株式会社
Priority date: 2013-05-17
Filing date: 2014-01-30
Publication date: 2014-11-20
Also published as: JPWO2014185099A1; KR20160009557A; CN105229718B; TW201508348A; CN105229718A; TWI609202B; JP6223439B2

Abstract

A system for manufacturing an optical display device, which is constituted by bonding an optical member to an optical display component, is provided with: a first supply unit (81) that unrolls a band-shaped optical member sheet (F1) with a width corresponding to a display region of an optical display component along with a separator sheet from a stock material roll (R1), cuts the optical member sheet (F1) while leaving the separator sheet to form an optical member (F11), and supplies the optical member (F11); a second supply unit (82) that transports a sheet-fed optical member (F1b) with a size corresponding to the display region of the optical display component; and a bonding unit that selects any one of the optical member (F11) supplied by the first supply unit (81) and the optical member (F1b) supplied by the second supply unit (82), attaches the same to a retaining surface, and also bonds the optical member held by the retaining surface to the optical display component.

Description

Optical display device production system

The present invention relates to an optical display device production system.
This application claims priority based on Japanese Patent Application No. 2013-105583 filed on May 17, 2013, the contents of which are incorporated herein by reference.

There are two known methods of bonding an optical member such as a polarizing plate to an optical display component such as a liquid crystal panel, a roll-to-panel method and a chip-to-panel method. The roll-to-panel method is a method in which an optical member sheet unwound from an original fabric roll is bonded to an optical display component while being cut into a predetermined size (see Patent Document 1). The chip-to-panel method is a method in which an optical member cut into a single wafer is bonded to an optical display component (see Patent Document 2).

Since the roll-to-panel method does not require chip packing work, there is an advantage that the operation cost can be reduced compared to the chip-to-panel method. On the other hand, the chip-to-panel method is more costly than the roll-to-panel method, but has the advantage of being able to handle the supply of chips, and therefore has the advantage of being continuously employed.

Japanese Patent No. 4307510 JP 2003-255132 A

In order to take advantage of both advantages, it is conceivable to install two types of systems, a roll-to-panel system and a chip-to-panel system. However, enormous equipment costs are required to install these two types of systems. In addition, it is inconvenient to use two types of methods in combination, and each method is inferior and adaptability is poor.

An aspect of the present invention has been made in view of such circumstances, and is a system for producing an optical display device that is easy to use, has excellent adaptability, and is capable of diversifying supply methods. The purpose is to provide.

In order to achieve the above object, the present invention employs the following configuration.
(1) A first aspect of the present invention is an optical display device production system configured by bonding an optical member to an optical display component, and has a band-like shape corresponding to the display area of the optical display component. The optical member sheet is unwound together with the separator sheet from the raw roll, the optical member sheet is cut to leave the separator sheet to be the optical member, and the optical member is supplied to the first supply unit, and the optical display component A second supply unit that conveys and supplies a sheet-like optical member having a size corresponding to the display area, the optical member supplied by the first supply unit, and the second supply unit. And a bonding unit that bonds and holds the optical member held on the holding surface to the optical display component. Yes.

(2) In the production system for an optical display device according to (1), the second supply unit unwinds a carrier sheet from a raw roll, and bonds the sheet-like optical member onto the carrier sheet. And may be conveyed.

(3) In the production system for an optical display device according to (2), the first supply unit includes a first peeling unit that peels the optical member from the separator sheet, and the second supply unit. May include a second peeling portion for peeling the optical member from the carrier sheet.

(4) A second aspect of the present invention is an optical display device production system configured by bonding an optical member to an optical display component, and includes a long side and a short side of a display region of the optical display component. A belt-shaped optical member sheet having a width wider than the length of one of the two sides is unwound together with the separator sheet from the raw roll, and the optical member sheet is left between the long side and the short side of the display region, leaving the separator sheet. A sheet piece cut by a length longer than the length of one of the other sides, a first supply unit for supplying the sheet piece, and a width wider than the length of one side of the display area of the optical display component And a second supply unit that conveys and supplies a sheet piece having a length longer than the length of the other side of the display area, the sheet piece supplied by the first supply unit, and the second piece Sheet supplied by the supply unit And affixing the sheet piece held on the holding surface to the optical display component, and affixing to the optical display component A cutting device that cuts off an excess portion disposed outside the portion corresponding to the bonding surface from the combined sheet pieces and forms the optical member having a size corresponding to the bonding surface.
In addition, the "bonding surface" in the said structure refers to the surface facing the sheet piece of an optical display component, and specifically, "the outer periphery of a bonding surface" is a sheet piece in an optical display component. It refers to the outer peripheral edge of the bonded substrate.
Further, the “part corresponding to the bonding surface” of the sheet piece means that the outer shape of the optical display component (contour shape in plan view) is not less than the size of the display area of the optical display component facing the sheet piece. Is a region that is smaller than the size of the optical display component and avoids a functional portion such as an electrical component mounting portion in the optical display component. Similarly, the “size corresponding to the bonding surface” refers to a size not less than the size of the display area of the optical display component and not more than the size of the outer shape (contour shape in plan view) of the optical display component.

(5) The optical display device production system according to (4) further includes a detection device that detects an outer peripheral edge of a bonding surface between the optical display component on which the sheet piece is bonded and the sheet piece. The cutting device may cut the sheet piece along an outer peripheral edge of the bonding surface between the optical display component and the sheet piece detected by the detection device.

(6) In the production system for an optical display device according to (4) or (5), the second supply unit unwinds a carrier sheet from an original roll, and the sheet-like sheet is placed on the carrier sheet. You may paste and convey a piece.

(7) In the production system for an optical display device according to (6), the first supply unit includes a first peeling unit that peels the sheet piece from the separator sheet, and the second supply unit. May include a second peeling portion for peeling the sheet piece from the carrier sheet.

According to the aspect of the present invention, it is possible to provide an optical display device production system that is easy to use, has excellent adaptability, and can be used in various ways.

It is a schematic block diagram of the film bonding system which concerns on 1st embodiment. It is a top view of a liquid crystal panel. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. It is sectional drawing of the optical member sheet | seat which concerns on 1st embodiment. It is sectional drawing of the optical member chip | tip which concerns on 1st embodiment. It is a top view of the film bonding system which concerns on 1st embodiment. It is a schematic plan view of the 1st bonding apparatus which concerns on 1st embodiment. It is a schematic perspective view of the 1st bonding apparatus which concerns on 1st embodiment. It is a schematic side view of a 1st supply part. It is a schematic side view of a 2nd supply part. It is a schematic block diagram of the film bonding system which concerns on 2nd embodiment. It is a top view of the film bonding system which concerns on 2nd embodiment. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a figure which shows an example of the determination method of the bonding position of the sheet piece with respect to a liquid crystal panel. It is a schematic plan view of the 1st bonding apparatus which concerns on 3rd embodiment. It is a schematic diagram of the bonding apparatus applied to a film bonding system. It is a schematic diagram of the bonding apparatus applied to a film bonding system. It is a top view which shows the detection process of the edge of a bonding surface. It is a schematic diagram of a detection apparatus. It is a schematic diagram which shows the modification of a detection apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. This embodiment demonstrates the film bonding system which comprises the one part as a production system of an optical display device.

FIG. 1 is a schematic configuration diagram of a film bonding system 1 of the present embodiment. The film bonding system 1 is for bonding a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel. It is configured as a part of a production system for producing an optical display device including an optical member. In the film bonding system 1, the liquid crystal panel P is used as an optical display component. In FIG. 1, for convenience of illustration, the film bonding system 1 is illustrated in two upper and lower stages.

FIG. 2 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a relatively small rectangular shape disposed to face the first substrate P1, a first substrate P1, and a second substrate. And a liquid crystal layer P3 sealed between the substrate P2. The liquid crystal panel P has a rectangular shape that conforms to the outer shape of the first substrate P1 in a plan view, and a region that fits inside the outer periphery of the liquid crystal layer P3 in a plan view is a display region P4.

FIG. 3 is a cross-sectional view taken along the line AA in FIG. A first optical member F11, a second optical member F12, and a third optical member F13 (hereinafter, may be collectively referred to as an optical member F1X) are appropriately bonded to the front and back surfaces of the liquid crystal panel P.

Although details will be described later, the optical member F1X is supplied by the optical member F1X supplied by the first supply unit 81 (see FIG. 7) and the second supply unit 82 (see FIG. 7) supplied in a chip form. Any one of the optical members F1X selected is bonded to the liquid crystal panel P. The first supply unit 81 is a belt-shaped first optical member sheet F1, a second optical member sheet F2, and a third optical member sheet F3 (refer to FIG. 1, hereinafter collectively referred to as an optical member sheet FX) supplied in a roll form. Is cut into the size of the liquid crystal panel P and supplied as the first optical member F11, the second optical member F12, and the third optical member F13. The second supply unit 82 includes a first optical member chip F1b, a second optical member chip F2b, and a third optical member chip F3b (hereinafter referred to as optical members), which are sheet-like optical members that have been cut into the size of the liquid crystal panel P in advance. The chip FXb may be collectively referred to as a carrier sheet or the like.

In this embodiment, polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively. The first optical member F11 is bonded to the surface of the liquid crystal panel P on the backlight side as a polarizing film. A third optical member F13 is bonded to the display surface side surface of the liquid crystal panel P as a polarizing film. On the surface on the backlight side of the liquid crystal panel P, a second optical member F12 as a brightness enhancement film is further bonded to the first optical member F11.

FIG. 4 is a partial cross-sectional view of the optical member sheet FX. The optical member sheet FX includes a film-shaped optical member main body F1a, an adhesive layer F2a provided on one surface (the upper surface in FIG. 4) of the optical member main body F1a, and one of the optical member main bodies F1a via the adhesive layer F2a. The separator sheet F3a is detachably stacked on the surface, and the surface protection film F4a is stacked on the other surface (the lower surface in FIG. 4) of the optical member body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and the peripheral area of the display area P4. For convenience of illustration, hatching of each layer in FIG. 4 is omitted.

The optical member main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator sheet F3a is separated while leaving the adhesive layer F2a on one surface of the optical member main body F1a. Hereinafter, the part remove | excluding the separator sheet F3a from the optical member sheet | seat FX is called the bonding sheet | seat F5.

The separator sheet F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a. The surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a. The surface protective film F4a is separated from the optical member main body F1a at a predetermined timing. The optical member sheet FX may not include the surface protective film F4a. The structure which is not isolate | separated from the optical member main body F1a may be sufficient as the surface protection film F4a.

The optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. And a second film F8. The first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.

The optical member body F1a may have a single-layer structure composed of a single optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other. The optical layer may be a retardation film, a brightness enhancement film, or the like in addition to the polarizer F6. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment that provides an effect such as anti-glare including hard coat treatment and anti-glare treatment for protecting the outermost surface of the liquid crystal display element. The optical member body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator sheet F3a may be bonded to one surface of the optical member body F1a via the adhesive layer F2a.

FIG. 5 is a cross-sectional view of the optical member chip FXb. The optical member chip FXb is disposed on one surface of the optical member main body F1c via the optical member main body F1c, an adhesive layer F2c provided on one surface (the upper surface in FIG. 5) of the optical member main body F1c, and the adhesive layer F2c. Separator F3c laminated | stacked so that isolation | separation was possible, and the surface protection film F4c laminated | stacked on the other surface (FIG. 5 lower surface) of the optical member main body F1c. For convenience of illustration, hatching of each layer in FIG. 5 is omitted.

The optical member body F1c includes a polarizer F6c, a first film F7c bonded to one surface of the polarizer F6c with an adhesive or the like, and a second film bonded to the other surface of the polarizer F6c with an adhesive or the like. F8c.

The optical member main body F1c is bonded to the liquid crystal panel P via the adhesive layer F2c in a state where the separator F3c is separated while leaving the adhesive layer F2c on one surface of the optical member main body F1c. A portion obtained by removing the separator F3c from the optical member chip FXb is an optical member F1X.

The optical member chip FXb has a layer structure similar to that of the optical member sheet FX. For example, the optical member chip FXb is obtained by cutting out from the optical member sheet FX into a size corresponding to the display area P4 of the liquid crystal panel P.

FIG. 6 is a plan view (top view) of the film bonding system 1. Hereinafter, the film bonding system 1 will be described with reference to FIGS. In the figure, an arrow F indicates the transport direction of the liquid crystal panel P. In the following description, the upstream side of the liquid crystal panel P in the transport direction is referred to as the panel transport upstream side, and the downstream side of the liquid crystal panel P in the transport direction is referred to as the panel transport downstream side.

The film bonding system 1 sets the predetermined position of the main conveyor 5 as the start point 5a and the end point 5b of the bonding process. The film laminating system 1 includes the first sub conveyor 6 and the second sub conveyor 7 extending from the main conveyor 5 in the direction perpendicular to the starting point 5 a, and the liquid crystal panel P from the starting point 5 a to the first starting position 6 a of the first sub conveyor 6. A first transport device 8 for transporting, a cleaning device 9 provided on the first sub-conveyor 6, a first rotary index 11 provided on the panel transport downstream side of the first sub-conveyor 6, and a first of the first sub-conveyor 6 A second transport device 12 that transports the liquid crystal panel P from the first arrival position 6b to the first rotary start position 11a of the first rotary index 11, the first bonding device 13 provided around the first rotary index 11, and the second The bonding apparatus 15 and the film peeling apparatus 14 are provided.

Moreover, the film bonding system 1 includes a second rotary index 16 provided on the panel transport downstream side of the first rotary index 11 and a second rotary index 16 from the first rotary terminal position 11 b of the first rotary index 11. A third transport device 17 that transports the liquid crystal panel P to the rotary starting position 16a, a third bonding device 18 and an inspection device 19 provided around the second rotary index 16, and a panel transport downstream side of the second rotary index 16 A second conveyor 7 provided on the second rotary conveyor 16, a fourth conveyor device 21 for conveying the liquid crystal panel P from the second rotary end position 16b of the second rotary index 16 to the second starting position 7a of the second sub conveyor 7, From the second terminal position 7b of the sub-conveyor 7 to the end point 5b of the main conveyor 5, the liquid crystal panel P And a fifth transport device 22 for transporting.

The film laminating system 1 conveys the liquid crystal panel P using the lines formed by the drive-type main conveyor 5, the first sub-conveyor 6, the second sub-conveyor 7, and the first rotary index 11 and the second rotary index 16. However, predetermined processing is sequentially performed on the liquid crystal panel P. The liquid crystal panel P is conveyed on the line with the front and back surfaces of the liquid crystal panel P being horizontal.
The liquid crystal panel P is conveyed, for example, in the main conveyor 5 with the short side of the display area P4 along the conveying direction, and in the first sub conveyor 6 and the second sub conveyor 7 orthogonal to the main conveyor 5, the display area P4 is displayed. In the first rotary index 11 and the second rotary index 16, the long side of the display area P4 is set along the radial direction of the first rotary index 11 and the second rotary index 16. It is transported in the opposite direction. Reference numeral 5c in the figure indicates a rack that flows on the main conveyor 5 in correspondence with the liquid crystal panel P.

On the front and back surfaces of the liquid crystal panel P, a sheet piece (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-like optical member sheet FX, and a separator F3c from the sheet-like optical member chip FXb. Any one optical member F1X selected from the peeled sheet-like optical member F1X is bonded. Each part of the film bonding system 1 is comprehensively controlled by a control device 25 as an electronic control device.

The first transport device 8 holds the liquid crystal panel P and transports it freely in the vertical and horizontal directions.
For example, the first transport device 8 transports the liquid crystal panel P held by suction to the first starting position 6a (the left end portion in FIG. 6) of the first sub-conveyor 6 in a horizontal state, and sucks at the first starting position 6a. The liquid crystal panel P is released and transferred to the first sub-conveyor 6.

The cleaning device 9 is, for example, a water-washing type that performs brushing and rinsing of the front and back surfaces of the liquid crystal panel P and then drains the front and back surfaces of the liquid crystal panel P. The cleaning device 9 may be a dry type that performs static electricity removal and dust collection on the front and back surfaces of the liquid crystal panel P.
The second transport device 12 holds the liquid crystal panel P and transports it freely in the vertical and horizontal directions. For example, the second transport device 12 transports the liquid crystal panel P held by suction to the first rotary starting position 11a of the first rotary index 11 in a horizontal state, releases the suction at the first rotary starting position 11a, and releases the liquid crystal panel. P is transferred to the first rotary index 11.

The first rotary index 11 is a disk-shaped rotary table having a rotation axis along the vertical direction, and is driven to rotate clockwise with the left end portion in plan view of FIG. 6 as the first rotary starting position 11a. The 1st rotary index 11 makes the position (upper end part of FIG. 6) rotated 90 degrees clockwise from the 1st rotary starting position 11a the 1st bonding carrying in / out position 11c.

At the first bonding carry-in / out position 11c, the liquid crystal panel P is carried into the first bonding apparatus 13 by a transport robot (not shown). In the liquid crystal panel P, the first optical member F11 on the backlight side is bonded by the first bonding device 13. The liquid crystal panel P to which the first optical member F11 is bonded is carried into the first bonding carry-in / out position 11c of the first rotary index 11 from the first bonding device 13 by a transport robot (not shown).

The 1st rotary index 11 makes the film peeling position 11e the position rotated 45 degrees clockwise from the 1st bonding carrying in / out position 11c (upper right end part of FIG. 6). At the film peeling position 11e, the film peeling device 14 peels the surface protective film F4a of the first optical member F11.
The 1st rotary index 11 makes the position (right end position of FIG. 6) rotated 45 degrees clockwise from the film peeling position 11e the 2nd bonding carrying in / out position 11d.

At the second bonding carry-in / out position 11d, the liquid crystal panel P is carried into the second bonding apparatus 15 by a transport robot (not shown). The liquid crystal panel P is bonded to the second optical member F12 on the backlight side by the second bonding device 15. The liquid crystal panel P on which the second optical member F12 is bonded is carried into the second bonding carry-in / out position 11d of the first rotary index 11 from the second bonding device 15 by a transport robot (not shown).

The 1st rotary index 11 makes the position (lower end part of FIG. 6) rotated 90 degrees clockwise from the 2nd bonding carrying in / out position 11d the 1st rotary terminal position 11b. Carrying out by the third conveying device 17 is performed at the first rotary terminal position 11b.
The third transport device 17 holds the liquid crystal panel P and transports the liquid crystal panel P freely in the vertical direction and the horizontal direction. The third transport device 17 transports, for example, the liquid crystal panel P held by suction to the second rotary starting position 16a of the second rotary index 16, and reverses the front and back of the liquid crystal panel P during this transport, so that the second rotary starting position The suction is released at 16 a and the liquid crystal panel P is transferred to the second rotary index 16.

The second rotary index 16 is a disk-shaped rotary table having a rotation axis along the vertical direction, and rotates clockwise with the upper end portion in plan view of FIG. 6 as the second rotary starting position 16a. The 2nd rotary index 16 makes the position (right end part of FIG. 6) rotated 90 degrees clockwise from the 2nd rotary initial position 16a the 3rd bonding carrying in / out position 16c.

At the third bonding carry-in / out position 16c, the liquid crystal panel P is carried into the third bonding apparatus 18 by a transport robot (not shown). The liquid crystal panel P is bonded to the third optical member F13 on the display surface side by the third bonding device 18. The liquid crystal panel P on which the third optical member F13 is bonded is carried into the third bonding carry-in / out position 16c of the second rotary index 16 from the third bonding device 18 by a transport robot (not shown).

The 2nd rotary index 16 makes the position (lower end part of FIG. 6) rotated 90 degrees clockwise from the 3rd bonding carrying in / out position 16c the bonding inspection position 16d. Inspection at the bonding inspection position 16d by the inspection device 19 of the workpiece (liquid crystal panel P) on which film bonding has been performed (whether the position of the optical member F1X is appropriate (whether the positional deviation is within the tolerance range) ) Etc.) is performed.
The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

The 2nd rotary index 16 makes the position (left end part of Drawing 6) rotated 90 degrees clockwise from pasting inspection position 16d the 2nd rotary termination position 16b. Carrying out by the fourth conveying device 21 is performed at the second rotary terminal position 16b.

The fourth transport device 21 holds the liquid crystal panel P and transports the liquid crystal panel P freely in the vertical and horizontal directions. For example, the fourth transport device 21 transports the liquid crystal panel P held by suction to the second starting position 7a of the second sub-conveyor 7, releases the suction at the second starting position 7a, and moves the liquid crystal panel P to the second sub-conveyor. Pass to 7.

The fifth transport device 22 holds the liquid crystal panel P and transports the liquid crystal panel P freely in the vertical and horizontal directions. For example, the fifth transport device 22 transports the liquid crystal panel P held by suction to the end point 5b of the main conveyor 5, releases the suction at the end point 5b, and delivers the liquid crystal panel P to the main conveyor 5. Thus, the bonding process by the film bonding system 1 is completed.

Hereinafter, the details of the first bonding apparatus 13 will be described with reference to FIGS. FIG. 7 is a schematic plan view of the first bonding apparatus 13. FIG. 8 is a schematic perspective view of the first bonding apparatus 13. In addition, the 2nd bonding apparatus 15 and the 3rd bonding apparatus 18 are abbreviate | omitting the detailed description as what has the same structure.
The 1st bonding apparatus 13 is the sheet piece (1st optical member F11) of the bonding sheet | seat F5 cut into the predetermined size in the 1st optical member sheet | seat F1 with respect to the upper surface of liquid crystal panel P, and a sheet-like 1st. One of the sheet-like first optical members F11 from which the separator F3c is peeled off from the optical member chip F1b is selected, and the selected first optical member F11 is bonded.

As shown in FIG.7 and FIG.8, the 1st bonding apparatus 13 is the supply apparatus 80, the adsorption | suction stage 41, the bonding head 32 (bonding part), the moving apparatus 70, and the rotation apparatus 75. Prepare.

The supply device 80 unwinds the first optical member sheet F1 from the raw roll R1 together with the separator sheet F3a, cuts the first optical member sheet F1 leaving the separator sheet F3, thereby forming the first optical member F11. The 1st supply part 81 which supplies member F11, and the 2nd supply part 82 which conveys and supplies the sheet-like 1st optical member F11 are provided.

FIG. 9 is a schematic side view of the first supply unit 81.
As shown in FIG. 9, the 1st supply part 81 conveys the bonding sheet | seat F5 by using the separator sheet F3a as a carrier, and hold | maintains the original fabric roll R1 which wound the strip | belt-shaped 1st optical member sheet | seat F1. And the unwinding part 81a which pays out the 1st optical member sheet | seat F1 along the longitudinal direction of the 1st optical member sheet | seat F1, and the cut part 81b which performs a half cut on the 1st optical member sheet | seat F1 unwound from the original fabric roll R1 The first separation member 81c that separates the bonding sheet F5 from the separator sheet F3a by winding the half-cut first optical member sheet F1 at an acute angle, and the separator separated by itself through the first separation portion 81c A winding portion 81d that holds a separator roll R2 that winds up the sheet F3a.

In addition, although illustration is abbreviate | omitted, the 1st supply part 81 has a some guide roller which winds the 1st optical member sheet | seat F1 along a predetermined | prescribed conveyance path | route. The first optical member sheet F1 is a horizontal direction (sheet width direction) orthogonal to the conveying direction of the first optical member sheet F1, and the width of the display area P4 of the liquid crystal panel P (the short side length of the display area P4 in this embodiment). Equivalent to the width).

The unwinding unit 81a positioned at the start point of the first supply unit 81 and the winding unit 81d positioned at the end point of the supply device 80 are driven in synchronization with each other, for example. Thereby, the winding-up part 81d winds up the separator sheet F3a which passed through the 1st peeling part 81c, unwinding the 1st optical member sheet | seat F1 in the conveyance direction of the 1st optical member sheet | seat F1. Hereinafter, the upstream side in the transport direction of the first optical member sheet F1 (separator sheet F3a) in the first supply unit 81 is referred to as the upstream side of the sheet transport, and the downstream side in the transport direction is referred to as the downstream side of the sheet transport.

The cut part 81b cuts a part in the thickness direction of the first optical member sheet F1 over the entire width in the sheet width direction of the first optical member sheet F1 (half-cut).

The cut portion 81b is cut so that the first optical member sheet F1 (separator sheet F3a) is not broken by the tension acting during the conveyance of the first optical member sheet F1 (so that a predetermined thickness remains on the separator sheet F3a). The advancing / retreating position of the blade is adjusted, and half cutting is performed to the vicinity of the interface between the adhesive layer F2a and the separator sheet F3a. In addition, you may use the laser apparatus replaced with a cutting blade.

In the first optical member sheet F1 after the half cut, the optical member main body F1a and the surface protection film F4a are cut in the thickness direction of the first optical member sheet F1, so that the sheet width direction of the first optical member sheet F1 is cut. A score line is formed over the full width of the. The first optical member sheet F1 is divided into sections having a length corresponding to the long side length of the display region P4 in the longitudinal direction by a cutting line. Each of these sections becomes one sheet piece in the bonding sheet F5. The configuration of the cut portion 81b can be changed as appropriate so that the dimension (depth) of the cut line in the thickness direction of the first optical member sheet F1 and the position of the cut line in the sheet conveyance direction can be controlled. is there.

The first peeling portion 81c is located below the first optical member sheet F1 conveyed substantially horizontally from the left side to the right side in FIG. 9, and at least the first optical element in the sheet width direction of the first optical member sheet F1. It extends over the entire width of the member sheet F1. The 1st peeling part 81c winds the 1st optical member sheet | seat F1 so that it may slide-contact with the separator sheet F3a side of the 1st optical member sheet | seat F1 after a half cut.

The 1st peeling part 81c winds the 1st optical member sheet | seat F1 at an acute angle around the acute-angled front-end | tip part of the 1st peeling part 81c. The first optical member sheet F1 peels the separator sheet F3a from the bonding sheet F5 when it is folded at an acute angle at the tip of the first peeling part 81c. At this time, the adhesion layer F2a (bonding surface with the liquid crystal panel P) of the bonding sheet F5 faces downward. Immediately below the tip of the first peeling portion 81c is a separator peeling position 81e. The surface protective film F4a (surface opposite to the bonding surface) of the sheet piece of the bonding sheet F5 is bonded by the holding surface 32a of the bonding head 32 coming into contact with the tip of the first peeling portion 81c from above. Affixed to the holding surface 32 a of the head 32.

FIG. 10 is a schematic side view of the second supply unit 82.
As shown in FIG. 10, the 2nd supply part 82 unwinds the carrier sheet F9 from the original fabric roll R3, bonds and conveys the sheet-like 1st optical member chip | tip F1b on the carrier sheet F9. The second supply unit 82 includes a first set unit 83 (see FIGS. 7 and 8) on which the first optical member chip F1b is placed, and a second set unit 84 ( 7 and FIG. 8), an unwinding portion 82a for holding the original roll R3 around which the belt-shaped carrier sheet F9 is wound and feeding the carrier sheet F9 along the longitudinal direction of the carrier sheet F9, and an original roll R3 The carrier sheet F9 unwound from the separator F3c is wound together with the second peeling portion 82c for separating the first optical member F11 from the separator F3c and the carrier sheet F9 alone through the second peeling portion 82c. A winding portion 82d for holding a carrier roll R4.

In addition, although illustration is abbreviate | omitted, the 2nd supply part 82 has a some guide roller which winds the carrier sheet F9 along a predetermined | prescribed conveyance path | route. The carrier sheet F9 is in the horizontal direction (sheet width direction) orthogonal to the conveyance direction of the carrier sheet F9 and is equal to the width of the display area P4 of the liquid crystal panel P (corresponding to the short side length of the display area P4 in this embodiment). Have a width of

7 and 8, the first optical member chip F1b placed on the first set part 83 is supplied onto the carrier sheet F9 along the first supply line C1. The first optical member chip F1b placed on the second set unit 84 is supplied onto the carrier sheet F9 along the second supply line C2 adjacent to the first supply line C1. For example, the first optical member chip F1b placed on the first set part 83 and the first optical member chip F1b placed on the second set part 84 are supplied alternately on the carrier sheet F9. The first optical member chip F1b is supplied onto the carrier sheet F9 with the separator F3c side facing downward.

As a configuration for supplying the first optical member chip F1b from the first set portion 83 and the second set portion 84 onto the carrier sheet F9, the first set portion 83, the second set portion 84, and the carrier sheet F9 are used. There can be exemplified a configuration in which a temporary stopping place for temporarily stopping the supply of the first optical member chip F1b is provided, and the first optical member chip F1b is sucked and supplied to the carrier sheet F9 by the robot at the temporary stopping place.

As shown in FIG. 10, the unwinding part 82a located at the start point of the second supply part 82 and the winding part 82d located at the end point of the second supply part 82 are driven in synchronization with each other, for example. As a result, the unwinding portion 82a unwinds the carrier sheet F9 that has passed through the second peeling portion 82c while the unwinding portion 82a unwinds the carrier sheet F9 in the conveying direction of the carrier sheet F9. Hereinafter, the upstream side in the transport direction of the carrier sheet F9 in the second supply unit 82 is referred to as the upstream side of the sheet transport, and the downstream side in the transport direction is referred to as the downstream side of the sheet transport.

The second peeling portion 82c is located below the carrier sheet F9 conveyed substantially horizontally from the left side to the right side in FIG. 10, and extends at least over the entire width of the carrier sheet F9 in the sheet width direction of the carrier sheet F9. .

The second peeling portion 82c winds the carrier sheet F9 at an acute angle around the acute-angled tip portion of the second peeling portion 82c. The carrier sheet F9 peels the separator F3c from the first optical member chip F1b when it is folded at an acute angle at the tip of the second peeling portion 82c. At this time, the adhesive layer F2c (bonding surface with the liquid crystal panel P) of the first optical member chip F1b faces downward. Immediately below the tip of the second peeling portion 82c is a separator peeling position 82e. When the holding surface 32a of the bonding head 32 comes into contact with the tip of the second peeling portion 82c from above, the surface protective film F4c (the surface opposite to the bonding surface) of the first optical member F11 is bonded to the bonding head 32. Is attached to the holding surface 32a.

In the present embodiment, the second supply unit 82 includes two set units, a first set unit 83 and a second set unit 84, but the number of set units is not limited thereto. For example, the number of set portions may be only one, or may be three or more. The number of set portions can be appropriately changed as necessary. Further, the supply line can be changed as appropriate according to the number of set portions.

7 and 8, in the present embodiment, each of the first peeling portion 81 c and the second peeling portion 82 c is a part of one knife edge 31. The first peeling portion 81c is a portion of the knife edge 31 around which the first optical member sheet F1 is wound. The second peeling portion 82c is a portion of the knife edge 31 around which the carrier sheet F9 is wound.

In addition, in this embodiment, each of the 1st peeling part 81c and the 2nd peeling part 82c shares one knife edge 31, However, It is not restricted to this. For example, the first peeling portion 81c and the second peeling portion 82c may be provided separately and independently. That is, a first knife edge may be provided as the first peeling portion 81c, and a second knife edge may be provided as the second peeling portion 82c.

The suction stage 41 is disposed at a position adjacent to the knife edge 31 along the sheet conveyance direction. The suction stage 41 sucks and holds the liquid crystal panel P at the time of bonding. The suction stage 41 has a suction surface 41a that sucks and holds the liquid crystal panel P.

The bonding head 32 selects and holds one of the first optical member F11 supplied by the first supply unit 81 and the first optical member F11 supplied by the second supply unit 82. The first optical member F11 held on the holding surface 32a is bonded to the liquid crystal panel P while being attached to and held on the surface 32a.

The pasting head 32 has an arc-shaped holding surface 32a that is parallel to the sheet width direction and convex downward. The holding surface 32a has, for example, a weaker bonding force than the bonding surface (adhesive layer F2c) of the first optical member F11, and is configured to be capable of repeatedly bonding and peeling the surface protective film F4c of the first optical member F11. .

The pasting head 32 tilts so as to be parallel to the sheet width direction and follow the curvature of the holding surface 32a so as to be centered on the axis along the sheet width direction above the knife edge 31. Tilt of the bonding head 32 is appropriately performed when the first optical member F11 is bonded and held and when the first optical member F11 bonded and held is bonded to the liquid crystal panel P.

The bonding head 32 is inclined so that the holding surface 32a faces downward and the curved one end side (right side in FIG. 8) of the holding surface 32a is on the lower side, and the curved one end side of the holding surface 32a is the knife edge 31. The tip of the first optical member F11 at the separator peeling position 81e and the separator peeling position 82e (see FIGS. 9 and 10) is stuck to the holding surface 32a. Thereafter, the laminating head 32 is tilted while the first optical member F11 is fed out (inclined so that the curved other end side (left side in FIG. 8) of the holding surface 32a is on the lower side). The whole sheet piece of one optical member F11 is stuck.

The bonding head 32 can be moved up and down by a predetermined amount above the separator peeling position 81e, the separator peeling position 82e (see FIGS. 9 and 10), and the first bonding carry-in / out position 11c (see FIG. 6). It can be appropriately moved between the position 81e, the separator peeling position 82e, and the first bonding carry-in / out position 11c. The pasting head 32 is connected to an arm portion 71b (see FIG. 8) as a driving device that can be driven when moving up and down, moving, and tilting.

When the bonding head 32 adheres the bonding sheet F5 to the holding surface 32a, for example, after the tip of the first optical member F11 is bonded to the holding surface 32a, the engagement with the arm portion 71b is cut. In this state, the first optical member F11 is passively tilted. When the bonding head 32 tilts until the entire first optical member F11 is bonded to the holding surface 32a, the tilting is locked by, for example, engaging the arm portion 71b in this tilted posture, and the first bonding is performed in this state. It moves above the loading / unloading position 11c.

When bonding the first optical member F11 bonded and held to the liquid crystal panel P, the bonding head 32 is actively tilted by the operation of the arm portion 71b, for example, and the liquid crystal panel along the curve of the holding surface 32a. The 1st optical member F11 is pressed on the upper surface of P, and it bonds together reliably.

In the present embodiment, both the bonding head 32 and the suction stage 41 are each provided as a whole system, but the present invention is not limited to this. For example, the bonding head 32 may be provided one by one (two in total) corresponding to the first supply unit 81 and the second supply unit 82. That is, it is sufficient that at least one suction stage 41 is provided as a whole system. However, from the viewpoint of simplifying the apparatus configuration, only one each of the bonding head 32 and the suction stage 41 can be provided as the entire system.

The moving device 70 moves the bonding head 32 between the knife edge 31 and the liquid crystal panel P. As shown in FIG. 8, the moving device 70 includes a first moving device 71, a second moving device 72, and a third moving device 73.

The first moving device 71 moves the bonding head 32 along a first direction V1 parallel to the normal direction of the suction surface 41a. The first moving device 71 includes a power unit 71a such as an actuator, and an arm unit 71b that can be moved along the first direction V1 by the power unit 71a. The bonding head 32 is attached to the tip of the arm portion 71b.

The second moving device 72 moves the bonding head 32 between the knife edge 31 and the liquid crystal panel P along a second direction V2 parallel to the sheet conveying direction. The second moving device 72 includes a guide rail 72a that extends along the second direction V2, and a moving portion 72b that can move along the guide rail 72a.

The third moving device 73 moves the bonding head 32 between the first supply unit 81 and the second supply unit 82 along a third direction V3 parallel to the direction orthogonal to the sheet conveying direction. The third moving device 73 includes a guide rail 73a extending along the third direction V3 and a moving portion 73b movable along the guide rail 73a.

The guide rail 73a is attached to the side opposite to the guide rail 72a side of the moving part 72b. The power unit 71a is attached to the side of the moving unit 73b opposite to the guide rail 73a.

The rotation device 75 rotates the suction stage 41 in a horizontal plane based on the imaging result of the second detection camera 35, and the liquid crystal panel P held by the suction stage 41 and the bonding sheet F5 held by the bonding head 32, Adjust the relative bonding position. For example, the rotation device 75 includes a motor having a rotation axis parallel to the normal direction of the suction surface 41 a of the suction stage 41 and a transmission mechanism that transmits the rotational force of the motor to the suction stage 41. The suction stage 41 is attached to the transmission mechanism.

In addition, in this embodiment, although the rotation apparatus 75 adjusts the relative bonding position of liquid crystal panel P and the bonding sheet | seat F5 hold | maintained at the bonding head 32 by the adsorption | suction stage 41 side, it is not restricted to this. For example, the mechanism of the rotation device 75 may be provided on the bonding head 32 side.

The 2nd moving apparatus 72 moves the bonding head 32 to the front-end | tip part of the knife edge 31 which is a peeling position of the separator sheet F3a. The first moving device 71 lowers the bonding head 32 from above the separator peeling position 81e and the separator peeling position 82e, thereby pressing the holding surface 32a against the tip portion of the knife edge 31 from above, so that the separator peeling position 81e and separator The tip of the first optical member F11 at the peeling position 82e is stuck to the holding surface 32a.

In the present embodiment, a first detection camera 34 for detecting the front end of the first optical member F11 at the downstream side of the sheet conveyance at this portion is provided below the front end of the knife edge 31. The detection data of the first detection camera 34 is sent to the control device 25. For example, when the first detection camera 34 detects the downstream end of the first optical member F <b> 11, the control device 25 temporarily stops the supply device 80, and then lowers the bonding head 32 to reduce the bonding head 32. The front end portion of the first optical member F11 is adhered to the holding surface 32a.

When the first detection camera 34 detects the downstream end of the bonding sheet F5 in the first supply unit 81 and temporarily stops the supply device 80, the control device 25 cuts the bonding sheet F5 by the cutting unit 81b. To implement. That is, the distance along the sheet conveyance path between the detection position by the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cut position by the cut portion 81b (the cutting blade advance / retreat position of the cut portion 81b). This corresponds to the length of the sheet piece of the bonding sheet F5.

The cut unit 81b is movable along the sheet conveyance path, and the distance along the sheet conveyance path between the detection position by the first detection camera 34 and the cut position by the cut unit 81b is changed by this movement. The movement of the cut portion 81b is controlled by the control device 25. For example, when the cut sheet 81b is cut by the cut portion 81b for one sheet piece after the cut, the cut end is a predetermined reference. In the case of deviation from the position, this deviation is corrected by the movement of the cut portion 81b. In addition, you may respond | correspond to the cutting of the bonding sheet | seat F5 from which length differs by the movement of the cut part 81b.

When the first optical member F11 moves from the separator peeling position 81e and the separator peeling position 82e to the first bonding carry-in / out position 11c, for example, the proximal end of the first optical member F11 stuck and held on the holding surface 32a with respect to the distal end portion Both corners of the image are respectively imaged by the pair of second detection cameras 35. Detection data of each second detection camera 35 is sent to the control device 25. For example, based on the imaging data of each second detection camera 35, the control device 25 is configured to move the first optical member F11 in the horizontal direction relative to the bonding head 32 (the moving direction of the bonding head 32 and its orthogonal direction and the rotation direction about the vertical axis). ) Position. When there is a shift in the relative position between the bonding head 32 and the first optical member F11, the bonding head 32 performs alignment so that the position of the first optical member F11 is a predetermined reference position.

For the alignment of the liquid crystal panel P and the first optical member F11 performed by the first bonding device 13, the control device 25 as the first alignment device is based on the detection data of the first detection camera 34 to the fifth detection camera 38. Thus, the relative bonding position of the first optical member F11 with respect to the liquid crystal panel P is determined so that the arrangement direction of the pixel rows of the liquid crystal panel P and the polarization direction of the first optical member (polarizing film) F11 are coincident with each other.

Specifically, a pair of third detection cameras 36 for performing horizontal alignment of the liquid crystal panel P on the first bonding carry-in / out position 11 c at the first bonding carry-in / out position 11 c of the first rotary index 11. Is provided. Similarly, a pair of fourth detection cameras 37 for performing horizontal alignment on the third bonding carry-in / out position 16c of the liquid crystal panel P are provided at the third bonding carry-in / out position 16c of the second rotary index 16. It is done. Each third detection camera 36 images, for example, both corners on the left side in FIG. 6 of the glass substrate (first substrate P1) of the liquid crystal panel P. Each fourth detection camera 37 images, for example, both corners on the left side in FIG. 6 of the glass substrate of the liquid crystal panel P.

The third bonding carry-in / out position 16c of the second rotary index 16 is provided with a pair of fifth detection cameras 38 for performing horizontal alignment on the third bonding carry-in / out position 16c of the liquid crystal panel P. Each fifth detection camera 38 images, for example, both corners on the left side in FIG. 6 of the glass substrate of the liquid crystal panel P. Detection data of the first detection camera 34 to the fifth detection camera 38 is sent to the control device 25. It should be noted that a sensor in place of the first detection camera 34 to the fifth detection camera 38 can be used.

On the first rotary index 11 and the second rotary index 16, there is provided an alignment table on which the liquid crystal panel P is placed and the first rotary index 11 and the second rotary index 16 can be aligned in the horizontal direction. The alignment table is driven and controlled by the control device 25 based on the detection data of the first detection camera 34 to the fifth detection camera 38. Thereby, alignment of liquid crystal panel P with respect to the 1st rotary index 11 and the 2nd rotary index 16 (1st bonding carrying in / out position 11c, 3rd bonding carrying in / out position 16c) is performed.

By bonding the optical member F1X that has been aligned by the bonding head 32 to the liquid crystal panel P, the bonding variation of the optical member F1X is suppressed, and the accuracy in the optical axis direction of the optical member F1X with respect to the liquid crystal panel P To improve the clarity and contrast of the optical display device. In addition, the optical member F1X can be accurately provided up to the display area P4, and the frame area G (see FIG. 3) outside the display area P4 can be narrowed to enlarge the display area and downsize the device.

Moreover, in this embodiment, the 1st bonding apparatus 13 is provided above the adsorption | suction stage 41 which is a bonding position, and a pair of 3rd detection cameras 36 for performing horizontal alignment of liquid crystal panel P are provided. (See FIGS. 6 and 7).

Also in the 2nd bonding apparatus 15, a pair of 4th detection camera 37 for performing horizontal alignment of liquid crystal panel P is similarly provided above the adsorption | suction stage 41 which is a bonding position (FIG. 6). reference). Each third detection camera 36 images, for example, both corners on the left side in FIG. 6 of the glass substrate (first substrate P1) of the liquid crystal panel P. Each fourth detection camera 37 images, for example, both corners on the left side in FIG. 6 of the glass substrate of the liquid crystal panel P.

Also in the 3rd bonding apparatus 18, a pair of 5th detection camera 38 for performing horizontal alignment of liquid crystal panel P is similarly provided above the adsorption | suction stage 41 which is a bonding position (FIG. 6). reference). Each fifth detection camera 38 images, for example, both corners on the left side in FIG. 6 of the glass substrate of the liquid crystal panel P. Detection information of the first detection camera 34 to the fifth detection camera 38 is sent to the control device 25. It should be noted that a sensor in place of the first detection camera 34 to the fifth detection camera 38 can be used.

The suction stage 41 in the first bonding device 13, the second bonding device 15, and the third bonding device 18 is driven and controlled by the control device 25 based on the detection information of the first detection camera 34 to the fifth detection camera 38. . Thereby, alignment of liquid crystal panel P with respect to the bonding head 32 in each bonding position is performed.

By bonding the bonding sheet F5 from the bonding head 32 that has been aligned to the liquid crystal panel P, the bonding variation of the optical member F1X is suppressed, and the optical axis direction of the optical member F1X with respect to the liquid crystal panel P is reduced. The accuracy is improved and the clarity and contrast of the optical display device are increased.

The control device 25 of the present embodiment includes a computer system. This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk. The control device 25 of the present embodiment includes an interface that can execute communication with an external device of the computer system. An input device capable of inputting an input signal may be connected to the control device 25. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system. The control device 25 may include a display device such as a liquid crystal display that indicates the operation status of each part of the film bonding system 1, or may be connected to the display device.

An operating system (OS) that controls the computer system is installed in the storage unit of the control device 25. Supplying the first optical member F11 by the first supply unit 81 to each unit of the film bonding system 1 by causing the calculation unit to control each unit of the film bonding system 1 in the storage unit of the control device 25. A program for executing a switching process with the supply of the first optical member F11 by the second supply unit 82 is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control device 25. The control device 25 may include a logic circuit such as an ASIC that executes various processes required for controlling each part of the film bonding system 1.

As described above, the film bonding system 1 in the embodiment is configured by bonding the optical member F1X to the liquid crystal panel P, and has a band-shaped optical member sheet FX having a width corresponding to the display region P4 of the liquid crystal panel P. Is unwound together with the separator sheet F3a from the raw roll R1, and the optical member sheet FX is cut to leave the separator sheet F3a to be the optical member F1X, and the first supply unit 81 for supplying the optical member F1X; A second supply unit 82 that conveys and supplies the sheet-like optical member F1X having a size corresponding to the display region P4, the optical member F1X supplied by the first supply unit 81, and the second supply unit 82. One of the optical members F1X supplied by the optical member F1X is selected and affixed to the holding surface 32a and held, and the optical held on the holding surface 82a It includes a laminating head 32 to be bonded to wood F1X on the liquid crystal panel P, and. Furthermore, the 2nd supply part 82 unwinds the carrier sheet F9 from the original fabric roll R3, bonds and conveys the sheet-like optical member F1X on the carrier sheet F9. Moreover, the 1st supply part 81 contains the 1st peeling part 81c which peels the optical member F1X from the separator sheet F3a. The second supply part 82 includes a second peeling part 82c that peels the optical member F1X from the carrier sheet F9.

According to this configuration, two types of methods, a roll-to-panel method and a chip-to-panel method, can be used together in one facility. Therefore, it is not necessary to provide both the bonding head 32 and the suction stage 41 for each method, and it is sufficient to provide only one each for the entire system, and the apparatus configuration can be simplified. Therefore, it is easy to use, has excellent adaptability, and can diversify the supply system. Moreover, equipment cost can be suppressed.
Furthermore, since the sheet-like optical member F1X is bonded and conveyed on the carrier sheet F9, the sheet-like optical member F1X can be supplied smoothly.
Moreover, since the 1st supply part 81 contains the 1st peeling part 81c and the 2nd supply part 82 contains the 2nd peeling part 82c, it is optical from the 1st supply part 81 and the 2nd supply part 82. The peeling operation for obtaining the member F1X can be performed smoothly.

Moreover, in the film bonding system 1, the strip | belt-shaped optical member sheet | seat FX of the width | variety corresponding to the display area P4 is cut into predetermined length, it is set as the optical member F1X, and the optical member F1X is set to the holding surface 32a of the bonding head 32. While holding, the optical member F1X is bonded to the liquid crystal panel P, thereby suppressing the dimensional variation and bonding variation of the optical member F1X, and reducing the frame portion G around the display region P4 to enlarge the display area and Miniaturization can be achieved.
Moreover, since it is the structure which affixes on the liquid crystal panel P, after transferring the optical member F1X to the bonding head 32, positioning of the bonding head 32 and the liquid crystal panel P can be performed accurately.
Therefore, the bonding accuracy between the optical member F1X and the liquid crystal panel P can be increased.

Moreover, in the film bonding system 1, the continuous bonding of the optical member F1X becomes easy, and the production efficiency of the optical display device can be increased. Further, since the bonding head 32 having the arc-shaped holding surface 32a is used, the optical member F1X can be smoothly held by the tilt of the arc-shaped holding surface 32a and the tilt of the arc-shaped holding surface 32a. The optical member F1X can be reliably bonded to the liquid crystal panel P.

Moreover, in the film bonding system 1, the knife edge 31 peels the optical member F1X from the separator sheet F3a with the bonding surface with the liquid crystal panel P facing downward, and the bonding head 32 is opposite to the bonding surface. The upper surface of is attached to and held on the holding surface 32a and moved between the peeling position and the bonding position with the bonding surface facing downward. Therefore, the optical member sheet FX will be conveyed with the bonding surface on the adhesive layer F2a side facing downward, and the bonding surface of the optical member sheet FX will be prevented from being scratched or adhered with foreign matter, etc. Can be suppressed.

Moreover, the film bonding system 1 carries the liquid crystal panel P into the carry-in position (first rotary first position 11a, second rotary first position 16a), bonding position (each suction stage 41), and carry-out position (first rotary terminal position 11b). , The

rotary index

11, 16 is moved to the second rotary end position 16b), so that the transport direction of the liquid crystal panel P is efficiently switched, and the first rotary index 11 and the second rotary index 16 are also part of the line. The length can be reduced, and the degree of freedom of system installation can be increased.

(Second embodiment)
Then, the structure of the film bonding system which concerns on 2nd embodiment is demonstrated. FIG. 11 is a schematic configuration diagram of the film bonding system 2 of the present embodiment. In FIG. 11, for convenience of illustration, the film bonding system 2 is described in two upper and lower stages. Hereinafter, the same reference numerals are given to components common to the first embodiment, and detailed description thereof is omitted.

In the first embodiment, the case where the width and length of the optical member F1X bonded by the bonding head 32 is equivalent to that in the display region P4 of the liquid crystal panel P is taken as an example. On the other hand, in this embodiment, after pasting a sheet piece larger than the display region P4 (width and length) to the liquid crystal panel P, a cutting device for cutting off an excess portion of the sheet piece is provided. In this respect, it differs greatly from the first embodiment.

In this embodiment, as shown in FIG. 11, the film bonding system 2 has a long strip-shaped first optical member sheet F1, second optical member sheet F2, and third optical member sheet on the front and back surfaces of the liquid crystal panel P. F3 (optical member sheet FX) is selected from one of the optical member (the optical member supplied by the first supply unit 81) and the optical member supplied by the second supply unit 82. The first optical member F11, the second optical member F12, and the third optical member F13 (see FIG. 3, optical member F1X) are bonded together.

In the present embodiment, the first optical member F11, the second optical member F12, and the third optical member F13 are a first sheet piece F1, a second sheet piece F2m, and a third sheet piece F3m (hereinafter referred to as sheet pieces). It is formed by cutting off the surplus part of the outer side of the bonding surface of the liquid crystal panel P to which the sheet piece FXm is bonded and the sheet piece FXm.

FIG. 12 is a plan view (top view) of the film bonding system 2. Hereinafter, the film bonding system 2 will be described with reference to FIGS. In the figure, an arrow F indicates the transport direction of the liquid crystal panel P. In the following description, as in the first embodiment, the upstream side in the transport direction of the liquid crystal panel P is referred to as the upstream side of the panel transport, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the downstream side of the panel transport.

The film bonding system 2 sets the predetermined position of the main conveyor 5 as the start point 5a and the end point 5b of the bonding process. The film bonding system 2 includes a first sub conveyor 6 and a second sub conveyor 7, a first conveying device 8, a cleaning device 9, a first rotary index 11, a second conveying device 12, and a first bonding. The apparatus 13 and the 2nd bonding apparatus 15, the film peeling apparatus 14, and the 1st cutting device 51 are provided.

Furthermore, the film bonding system 2 includes a second rotary index 16 provided on the panel transport downstream side of the first rotary index 11, a third transport device 17, a third bonding device 18, and a second cutting device 52. The second sub-conveyor 7, the fourth transport device 21, and the fifth transport device 22 are provided.

The film bonding system 2 conveys the liquid crystal panel P using the lines formed by the drive-type main conveyor 5, the first sub-conveyor 6, the second sub-conveyor 7, the first rotary index 11, and the second rotary index 16. Meanwhile, predetermined processing is sequentially performed on the liquid crystal panel P. The liquid crystal panel P is conveyed, for example, in the main conveyor 5 with the short side of the display area P4 along the conveying direction, and in the first sub conveyor 6 and the second sub conveyor 7 orthogonal to the main conveyor 5, the display area P4 is displayed. In the first rotary index 11 and the second rotary index 16, the long side of the display area P4 is set along the radial direction of the first rotary index 11 and the second rotary index 16. It is transported in the opposite direction.

The film bonding system 2 has a sheet piece FXm (sheet piece FXm supplied by the first supply unit 81) cut out to a predetermined length from the belt-shaped optical member sheet FX on the front and back surfaces of the liquid crystal panel P, and A sheet piece FXm (corresponding to the optical member F1X) selected from any one of the sheet pieces FXm supplied by the second supply unit 82 is bonded.

In the present embodiment, the first supply unit 81 unwinds the belt-shaped optical member sheet FX having a width wider than the length of the short side of the display region P4 of the liquid crystal panel P together with the separator sheet F3a from the raw roll R1. The member sheet FX is cut with a length longer than the long side of the display area P4 leaving the separator sheet F3a to form a sheet piece FXm, and this sheet piece FXm is supplied.

In the present embodiment, the second supply unit 82 conveys a sheet piece FXm having a width wider than the short side length of the display area P4 of the liquid crystal panel P and longer than the long side length of the display area P4. Supply.

The first rotary index 11 is driven to rotate clockwise with the carry-in position from the second transport device 12 (left end portion in plan view in FIG. 12) as the first rotary starting position 11a. The 1st rotary index 11 makes the position (upper end part of FIG. 12) rotated 90 degrees clockwise from the 1st rotary first departure position 11a the 1st bonding carrying in / out position 11c.

At the first bonding carry-in / out position 11c, the liquid crystal panel P is carried into the first bonding apparatus 13 by a transport robot (not shown). In this embodiment, the 1st bonding apparatus 13 bonds the 1st sheet piece F1m by the side of the backlight in liquid crystal panel P. As shown in FIG.

The first sheet piece F1m is a sheet piece having a size larger than the display area P4 of the liquid crystal panel P, and is supplied by the first sheet piece F1m supplied by the first supply unit 81 and the second supply unit 82. It is a sheet piece selected from any one of the made first sheet pieces F1m.

1st optical member bonding body PA1 is formed by the 1st sheet | seat piece F1m being bonded by the 1st bonding apparatus 13 on the surface of the front and back of liquid crystal panel P. As shown in FIG. 1st optical member bonding body PA1 is carried in from the 1st bonding apparatus 13 to the 1st bonding carrying in / out position 11c of the 1st rotary index 11 by the conveyance robot not shown.

The 1st rotary index 11 makes the film peeling position 11e the position (upper right end part of Drawing 12) rotated 45 degrees clockwise from the 1st pasting carrying in / out position 11c. At the film peeling position 11e, the film peeling device 14 peels the surface protective film F4a of the first sheet piece F1m.

The 1st rotary index 11 makes the position (right end position of FIG. 12) rotated 45 degrees clockwise from the film peeling position 11e the 2nd bonding carrying in / out position 11d.
At this second bonding carry-in / out position 11d, the liquid crystal panel P is carried into the second bonding apparatus 15 by a transport robot (not shown). In this embodiment, the 2nd bonding apparatus 15 bonds the 2nd sheet piece F2m by the side of the backlight in liquid crystal panel P. As shown in FIG.

The second sheet piece F2m is a sheet piece having a size larger than the display area of the liquid crystal panel P, and is supplied by the second sheet piece F2m supplied by the first supply unit 81 and the second supply unit 82. The second sheet piece F2m is a sheet piece selected from any one of them.

The second optical member bonding body PA2 is formed by bonding the second sheet piece F2m to the surface of the first optical member bonding body PA1 on the first sheet piece F1m side by the second bonding apparatus 15. 2nd optical member bonding body PA2 is carried in from the 2nd bonding apparatus 15 to the 2nd bonding carrying in / out position 11d of the 1st rotary index 11 by the conveyance robot not shown.

The 1st rotary index 11 makes the position (lower end part of Drawing 12) rotated 90 degrees clockwise from the 2nd bonding carrying in / out position 11d the 1st rotary termination position (1st cutting position) 11b.

In the present embodiment, the first rotary terminal position 11b is a first cutting position at which the first sheet piece F1m and the second sheet piece F2m are cut by the first cutting device 51.

Moreover, the film bonding system 2 is provided with the 1st detection apparatus 91 (refer FIG. 17). The 1st detection apparatus 91 is provided in a panel conveyance downstream rather than the 2nd bonding carrying in / out position 11d. The 1st detection apparatus 91 detects the edge of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m.

This will be described with reference to FIGS. 16, 17 and 18. In FIG. 16, FIG. 17, and FIG. 18, the illustration of the second sheet piece F2m is omitted for convenience.
For example, as illustrated in FIG. 16, the first detection device 91 includes the edge ED (of the bonding surface) of the first bonding surface SA <b> 1 in the four inspection areas CA installed on the conveyance path of the first sub-conveyor 6. Outer periphery) is detected. Each inspection area | region CA is arrange | positioned in the position corresponding to four corner | angular parts of 1st bonding surface SA1 which has a rectangular shape. The edge ED is detected for each liquid crystal panel P conveyed on the line. The edge ED data detected by the first detection device 91 is stored in the storage device 24 (see FIG. 11).

In addition, the arrangement position of the inspection area CA is not limited to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1.

FIG. 17 is a schematic diagram of the first detection device 91.
As shown in FIG. 17, the first detection device 91 has an illumination light source 94 that illuminates the edge ED, and the first bonding surface SA1 rather than the edge ED with respect to the normal direction of the first bonding surface SA1. And an image pickup device 93 that is arranged in an inwardly inclined posture and picks up an image of the edge ED from the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded.

The illumination light source 94 and the imaging device 93 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.

An angle θ (hereinafter referred to as an inclination angle θ of the imaging device 93) formed by the normal line of the first bonding surface SA1 and the normal line of the imaging surface 93a of the imaging device 93 is divided into panels within the imaging field of the imaging device 93. It can be set so that time lag and burrs do not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle θ of the imaging device 93 is such that the edge of the second substrate P2 enters the imaging field of the imaging device 93. Set to not.

The inclination angle θ of the imaging device 93 is set so as to match the distance H between the first bonding surface SA1 and the center of the imaging surface 93a of the imaging device 93 (hereinafter referred to as the height H of the imaging device 93). it can. For example, when the height H of the imaging device 93 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 93 can be set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 93 and the inclination angle θ of the imaging device 93 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 93 is set to 78 mm, and the inclination angle θ of the imaging device 93 is set to 10 °.

The illumination light source 94 and the imaging device 93 are fixedly arranged in each inspection area CA.

In addition, the illumination light source 94 and the imaging device 93 may be arrange | positioned so that a movement is possible along the edge ED of 1st bonding surface SA1. In this case, it is only necessary to provide one illumination light source 94 and one imaging device 93 each. Thereby, the illumination light source 94 and the imaging device 93 can be moved to a position where the edge ED of the first bonding surface SA1 can be easily imaged.

The illumination light source 94 is arrange | positioned on the opposite side to the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded. The illumination light source 94 is arrange | positioned with the attitude | position which inclined outside the 1st bonding surface SA1 rather than the edge ED with respect to the normal line direction of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 94 and the normal line of the imaging surface 93a of the imaging device 93 are parallel.

In addition, the illumination light source may be arrange | positioned at the side by which the 1st sheet piece F1m of 1st optical member bonding body PA1 was bonded.

Further, the optical axis of the illumination light source 94 and the normal line of the imaging surface 93a of the imaging device 93 may slightly cross each other.

Moreover, as shown in FIG. 18, each of the imaging device 93 and the illumination light source 94 may be arrange | positioned in the position which overlaps with the edge ED along the normal line direction of 1st bonding surface SA1. A distance H1 between the first bonding surface SA1 and the center of the imaging surface 93a of the imaging device 93 (hereinafter referred to as a height H1 of the imaging device 93) detects the edge ED of the first bonding surface SA1. It can be set at an easy position. For example, the height H1 of the imaging device 93 can be set in a range of 50 mm to 150 mm.

The cut position of the first sheet piece F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control device 25 (see FIG. 11) acquires the data of the edge ED of the first bonding surface SA1 stored in the storage device 24 (see FIG. 11), and the first optical member F11 is outside the liquid crystal panel P (see FIG. 11). The cut position of the 1st sheet piece F1m is determined so that it may become the magnitude | size which does not protrude on the outer side of 1st bonding surface SA1. The first cutting device 51 cuts the first sheet piece F1m at the cutting position determined by the control device 25.

11 and 12, the first cutting device 51 is provided on the downstream side of the panel conveyance with respect to the first detection device 91. The 1st cutting device 51 puts together the excess part arrange | positioned on the outer side of the part corresponding to 1st bonding surface SA1 from each of the 1st sheet piece F1m bonded to liquid crystal panel P, and the 2nd sheet piece F2m. Separate the first optical member F11 composed of the first optical member sheet F1 and the second optical member F12 composed of the second optical member sheet F2 as an optical member having a size corresponding to the first bonding surface SA1. Form.

Here, the “size corresponding to the first bonding surface SA1” is not less than the size of the display area P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. Refers to

By laminating the first sheet piece F1m and the second sheet piece F2m to the liquid crystal panel P and then cutting them together, there is no positional deviation between the first optical member F11 and the second optical member F12, and the first bonding surface. The first optical member F11 and the second optical member F12 that match the shape of the outer peripheral edge of SA1 are obtained. Moreover, the cutting process of the 1st sheet piece F1m and the 2nd sheet piece F2m is also simplified.

The first optical device F11 and the first optical member F11 and the second surface piece of the liquid crystal panel P are separated from the first and second surfaces of the liquid crystal panel P by separating the excess portions of the first sheet piece F1m and the second sheet piece F2m from the second optical member bonding body PA2 by the first cutting device 51. 3rd optical member bonding body PA3 comprised by bonding the 2 optical member F12 is formed. At this time, the part (first optical member F11, second optical member F12) corresponding to the third optical member bonding body PA3 and the first bonding surface SA1 is cut off, and the first sheet piece F1m remaining in a frame shape, The surplus portion of the second sheet piece F2m is separated.

Here, the “part corresponding to the first bonding surface SA1” is a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and a functional part such as an electrical component mounting portion. Indicates the area that was avoided. In the present embodiment, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P at three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, and the liquid crystal panel P at one side corresponding to the functional portion. The surplus portion is laser-cut at a position that appropriately enters the display area P4 side from the outer peripheral edge of. For example, when the portion corresponding to the first bonding surface SA1 is a bonding surface of a TFT (Thin Film Transistor) substrate, the display region P4 side from the outer peripheral edge of the liquid crystal panel P so as to exclude the functional portion on one side corresponding to the functional portion Is cut at a position shifted by a predetermined amount.
In addition, it is not restricted to bonding a sheet piece to the area | region (for example, the whole liquid crystal panel P) including the functional part in liquid crystal panel P. For example, a sheet piece is pasted in a region that avoids the functional part in the liquid crystal panel P in advance, and then surplus along the outer peripheral edge of the liquid crystal panel P on the three sides excluding the functional part in the rectangular liquid crystal panel P in plan view The part may be laser cut.

The surplus part cut off from the first sheet piece FX1 and the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected. 3rd optical member bonding body PA3 is carried out by the 3rd conveying apparatus 17 in the 1st rotary terminal position 11b.

3rd conveyance apparatus 17 hold | maintains liquid crystal panel P (3rd optical member bonding body PA3), and conveys it freely in a vertical direction and a horizontal direction. The third transport device 17 transports, for example, the liquid crystal panel P held by suction to the second rotary starting position 16a of the second rotary index 16, and reverses the front and back of the liquid crystal panel P during this transport, so that the second rotary starting position The suction is released at 16 a and the liquid crystal panel P is transferred to the second rotary index 16.

The second rotary index 16 is rotated in the clockwise direction with the carry-in position from the third transport device 17 (the upper end portion in plan view in FIG. 12) as the second rotary initial position 16a. The 2nd rotary index 16 makes the position (right end part of FIG. 12) rotated 90 degrees clockwise from the 2nd rotary starting position 16a the 3rd bonding carrying in / out position 16c.

At the third bonding carry-in / out position 16c, the liquid crystal panel P is carried into the third bonding apparatus 18 by a transport robot (not shown). In this embodiment, the 3rd bonding apparatus 18 bonds the 3rd sheet piece F3m by the side of a display surface.

The third sheet piece F3m is a sheet piece having a size larger than the display area of the liquid crystal panel P, and is supplied by the third sheet piece F3m supplied by the first supply unit 81 and the second supply unit 82. The third sheet piece F3m is a sheet piece selected from one of them.

The third bonding device 18 changes the surface of the liquid crystal panel P to the other surface (the surface opposite to the surface on which the first optical member F11 and the second optical member F12 of the third optical member bonding body PA3 are bonded). The fourth optical member bonding body PA4 is formed by bonding the three sheet pieces F3m. 4th optical member bonding body PA4 is carried in from the 3rd bonding apparatus 18 to the 3rd bonding carrying in / out position 16c of the 2nd rotary index 16 by the conveyance robot not shown.

In this embodiment, the 2nd rotary index 16 makes the position (lower end part of FIG. 12) rotated 90 degrees clockwise from the 3rd bonding carrying in / out position 16c the 2nd cutting position 16e. At the second cutting position 16e, the third sheet piece F3m is cut by the second cutting device 52.

Moreover, the film bonding system 2 is provided with the 2nd detection apparatus 92 (refer FIG. 17). The 2nd detection apparatus 92 is provided in the panel conveyance downstream rather than the 3rd bonding carrying in / out position 16c. The 2nd detection apparatus 92 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 3rd sheet piece F3m. The edge data detected by the second detection device 92 is stored in the storage device 24 (see FIG. 11).

The cut position of the third sheet piece F3m is adjusted based on the detection result of the edge of the second bonding surface. The control device 25 (see FIG. 11) acquires the edge data of the second bonding surface stored in the storage device 24 (see FIG. 11), and the third optical member F13 is outside the liquid crystal panel P (second The cut position of the 3rd sheet piece F3m is determined so that it may become the magnitude | size which does not protrude to the outer side of the bonding surface. The second cutting device 52 cuts the third sheet piece F3m at the cutting position determined by the control device 25.

The second cutting device 52 is provided on the downstream side of the panel conveyance with respect to the second detection device 92. The 2nd cutting device 52 cut | disconnects the excess part arrange | positioned outside the part corresponding to a 2nd bonding surface from the 3rd sheet piece F3m bonded by liquid crystal panel P, and the magnitude | size corresponding to a 2nd bonding surface. The optical member (third optical member F13) is formed.

Here, the “size corresponding to the second bonding surface” is not less than the size of the display region P4 of the liquid crystal panel P and not more than the size of the outer shape (contour shape in plan view) of the liquid crystal panel P. Point to.

The third optical member F13 is bonded to the other side of the front and back surfaces of the liquid crystal panel P by separating the excess portion of the third sheet piece F3m from the fourth optical member bonding body PA4 by the second cutting device 52, and the liquid crystal The 5th optical member bonding body PA5 comprised by bonding the 1st optical member F11 and the 2nd optical member F12 on the surface one side of the panel P is formed. At this time, the 5th optical member bonding body PA5 and the excess part of the 3rd sheet piece F3m which a part (3rd optical member F13) corresponding to a 2nd bonding surface is cut off, and remain in frame shape are isolate | separated. The surplus part cut off from the third sheet piece F3m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).

Here, the “part corresponding to the second bonding surface” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and avoids a functional part such as an electrical component mounting portion. Indicates the area. In the present embodiment, the surplus portions are laser-cut along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P having a rectangular shape in plan view. For example, when the portion corresponding to the second bonding surface is the bonding surface of the CF (Color Filter) substrate, there is no portion corresponding to the functional portion, so along the outer peripheral edge of the liquid crystal panel P on the four sides of the liquid crystal panel P. Cut.

In this embodiment, the 1st cutting device 51 is the 1st along the outer periphery of the bonding surface (1st bonding surface SA1) of liquid crystal panel P and the 1st sheet piece F1m which the 1st detection apparatus 91 detected. Each of the one sheet piece F1m and the second sheet piece F2m is cut. The 2nd cutting device 52 cut | disconnects the 3rd sheet piece F3m along the outer periphery of the bonding surface (2nd bonding surface) of liquid crystal panel P and the 3rd sheet piece F3m which the 2nd detection apparatus 92 detected. To do.

Here, the first cutting device 51 and the second cutting device 52 are, for example, CO2 laser cutters. In addition, the structure of the 1st and

2nd cutting devices

51 and 52 is not limited to this, For example, it is also possible to use other cutting means, such as a cutting blade.

The 1st cutting device 51 and the 2nd cutting device 52 are the sheet piece FXm along the outer periphery of the bonding surface of liquid crystal panel P and sheet piece FXm which the 1st detection apparatus 91 and the 2nd detection apparatus 92 detected. Cut endlessly. The first cutting device 51 and the second cutting device 52 are connected to the same laser output device 53. The first cutting device 51, the second cutting device 52, and the laser output device 53 cut off the surplus portion arranged outside the portion corresponding to the bonding surface from the sheet piece FXm, and have an optical size corresponding to the bonding surface. Cutting means for forming the member sheet FX is configured. Since the laser output required for cutting the first sheet piece F1m, the second sheet piece F2m, and the third sheet piece F3m is not so large, the high-power laser beam output from the laser output device 53 is branched into two. You may supply to the 1st cutting device 51 and the 2nd cutting device 52. FIG.

In the present embodiment, the second rotary index 16 has a position (left end portion in FIG. 12) rotated 90 ° clockwise from the second cutting position 16e as a second rotary terminal position 16b. The 5th optical member bonding body PA5 is carried out by the 4th conveying apparatus 21 in the 2nd rotary terminal position 16b.

The 4th conveyance apparatus 21 hold | maintains liquid crystal panel P (5th optical member bonding body PA5), and conveys it freely in a perpendicular direction and a horizontal direction. For example, the fourth transport device 21 transports the liquid crystal panel P held by suction to the second starting position 7a of the second sub-conveyor 7, releases the suction at the second starting position 7a, and moves the liquid crystal panel P to the second sub-conveyor. Pass to 7.

The fifth transport device 22 holds the liquid crystal panel P (fifth optical member bonding body PA5) and transports it freely in the vertical and horizontal directions. For example, the fifth transport device 22 transports the liquid crystal panel P held by suction to the end point 5b of the main conveyor 5, releases the suction at the end point 5b, and delivers the liquid crystal panel P to the main conveyor 5.

A bonding inspection position (not shown) is installed on the transport path of the liquid crystal panel P (fifth optical member bonding body PA5) after the second rotary terminal position 16b. At this bonding inspection position, film bonding is performed. The workpiece (liquid crystal panel P) subjected to the inspection is inspected by an inspection device (not shown) (inspection of whether or not the position of the optical member F1X is appropriate (whether the positional deviation is within the tolerance range)). The work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.

Thus, the bonding process by the film bonding system 2 is completed.

Hereinafter, the first bonding apparatus 13 will be described with an example of the bonding process of the bonding sheet F5 to the liquid crystal panel P. In addition, description about the bonding process by the 2nd bonding apparatus 15 and the 3rd bonding apparatus 18 which have the same structure as the 1st bonding apparatus 13 is abbreviate | omitted.

In this embodiment, the 1st bonding apparatus 13 is a sheet piece cut out to the predetermined length from the 1st optical member sheet | seat F1 (1st sheet piece F1m supplied by the 1st supply part 81), and 2nd. One of the first sheet pieces F1m supplied by the supply unit 82 is selected, and the selected first sheet piece F1m is held on the holding surface 32a of the bonding head 32 and held on the holding surface 32a. Bonding is performed by pressing the first sheet piece F1m pressed against the liquid crystal panel P.

The suction stage 41 is driven and controlled by the control device 25 based on detection information from the first detection camera 34 to the fifth detection camera 38. Thereby, alignment of liquid crystal panel P with respect to the bonding head 32 in each bonding position is performed.

By bonding the sheet piece FXm from the bonding head 32 that has been aligned to the liquid crystal panel P, the bonding variation of the optical member F1X is suppressed, and the optical axis direction of the optical member F1X with respect to the liquid crystal panel P is reduced. The accuracy is improved and the clarity and contrast of the optical display device are increased.

Here, the polarizer film constituting the optical member sheet FX is formed, for example, by uniaxially stretching a PVA film dyed with a dichroic dye. In this case, variations in the optical axis direction may occur in the plane of the optical member sheet FX due to unevenness in the thickness of the PVA film during stretching, uneven coloring in the dichroic dye, and the like.

Therefore, in the present embodiment, the control device 25 uses the liquid crystal panel for the optical member sheet FX based on the inspection data of the in-plane distribution of the optical axis in each part of the optical member sheet FX stored in advance in the storage device 24 (see FIG. 11). P bonding position (relative bonding position) is determined. And the 1st bonding apparatus 13, the 2nd bonding apparatus 15, and the 3rd bonding apparatus 18 align the liquid crystal panel P with respect to the sheet piece FXm according to this bonding position, and liquid crystal panel to the sheet piece FXm. P is pasted.

The determination method of the bonding position (relative bonding position) of the sheet piece FXm to the liquid crystal panel P is, for example, as follows. Hereinafter, an example of the sheet piece FXm supplied by the first supply unit 81 will be described with reference to FIG. 13A.

First, as shown in FIG. 13A, a plurality of inspection points CP are set in the width direction of the optical member sheet FX, and the direction of the optical axis of the optical member sheet FX is detected at each inspection point CP. The timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical member sheet FX is unwound from the original fabric roll R1 and half cut. Data in the optical axis direction of the optical member sheet FX is stored in the storage device 24 (see FIG. 11) in association with the position of the optical member sheet FX (the position in the longitudinal direction and the position in the width direction of the optical member sheet FX). .

The control device 25 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each inspection point CP from the storage device 24 (see FIG. 11), and the optical member sheet FX at the portion where the sheet piece FXm is cut out. The direction of the average optical axis of the (region partitioned by the cut line CL) is detected.

For example, as shown in FIG. 13B, the angle (deviation angle) formed between the direction of the optical axis and the edge line EL of the optical member sheet FX is detected for each inspection point CP, and the largest of the deviation angles (maximum deviation angle). ) Is θmax, and the smallest angle (minimum deviation angle) is θmin, the average value θmid (= (θmax + θmin) / 2) of the maximum deviation angle θmax and the minimum deviation angle θmin is detected as the average deviation angle. Then, the direction that forms the average deviation angle θmid with respect to the edge line EL of the optical member sheet FX is detected as the average direction of the optical axis of the optical member sheet FX. The deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical member sheet FX and the clockwise direction being negative.

Then, the direction of the average optical axis of the optical member sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specifications, the average optical axis of the optical member sheet FX is set. The sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.

The first cutting device 51 and the second cutting device 52 described above are the sheet piece FXm along the outer peripheral edge of the bonding surface between the liquid crystal panel P and the sheet piece FXm detected by the first detection device 91 and the second detection device 92. Disconnect. Outside the display area P4, a frame portion G (see FIG. 3) having a predetermined width for arranging a sealant or the like for bonding the first and second substrates of the liquid crystal panel P is provided. The sheet piece FXm is cut by the first cutting device 51 and the second cutting device 52.

In addition, the detection method of the direction of the average optical axis in the surface of the optical member sheet FX is not limited to the above method. For example, one or a plurality of inspection points CP is selected from a plurality of inspection points CP (see FIG. 13A) set in the width direction of the optical member sheet FX, and the direction of the optical axis is selected for each selected inspection point CP. And the angle (deviation angle) formed by the edge line EL of the optical member sheet FX is detected. Then, the average value of the deviation angles in the optical axis direction of the selected one or a plurality of inspection points CP is detected as the average deviation angle, and the direction forming the average deviation angle with respect to the edge line EL of the optical member sheet FX is determined as the optical member. You may detect as the direction of the average optical axis of the sheet FX.

As described above, the film bonding system 2 in the present embodiment is configured by bonding the optical member F1X to the liquid crystal panel P, and either one of the long side and the short side of the display region P4 of the liquid crystal panel P. The strip-shaped optical member sheet FX having a width wider than the side length of the sheet is unwound together with the separator sheet F3a from the raw roll R1, and the optical member sheet FX is left out of the long side and the short side of the display region P4 leaving the separator sheet F3a. A sheet piece FXm is cut by a length longer than the length of one of the other sides, the first supply unit 81 supplying the sheet piece FXm, and wider than the length of one side of the display area P4 of the liquid crystal panel P A second supply unit 82 that conveys and supplies a sheet piece FXm having a width that is longer than the length of the other side of the display area P4, and a sheet piece F supplied by the first supply unit 81. m and the sheet piece FXm supplied by the second supply unit 82 are selected and affixed to the holding surface 32a and held, and the sheet piece FXm held on the holding surface 32a is liquid crystal panel The excess part arrange | positioned on the outer side of the part corresponding to the bonding surface is separated from the bonding part 32 bonded to P and the sheet piece FXm bonded to the liquid crystal panel P, and has a size corresponding to the bonding surface. And cutting

devices

51 and 52 for forming the optical member F1X. Furthermore, the film bonding system 2 includes a first detection device 91 and a second detection device 92 that detect the outer peripheral edge of the bonding surface of the liquid crystal panel P and the sheet piece FXm on which the sheet piece FXm is bonded. The one cutting device 51 and the second cutting device 52 cut the sheet piece FXm along the outer peripheral edge of the bonding surface of the liquid crystal panel P and the sheet piece FXm detected by the first detection device 91 and the second detection device 92. To do. Moreover, the 2nd supply part 82 unwinds the carrier sheet F9 from the original fabric roll R3, bonds and conveys the sheet-like sheet piece FXm on the carrier sheet F9. The first supply unit 81 includes a first peeling unit 81c that peels the sheet piece FXm from the separator sheet F3a, and the second supply unit 82 is a second piece that peels the sheet piece FXm from the carrier sheet F9. The peeling part 82c is included.

According to this configuration, two types of methods, a roll-to-panel method and a chip-to-panel method, can be used together in one facility. Therefore, it is not necessary to provide both the bonding head 32 and the suction stage 41 for each method, and it is sufficient to provide only one each for the entire system, and the apparatus configuration can be simplified. Therefore, it is easy to use, has excellent adaptability, and can diversify the supply system. Moreover, equipment cost can be suppressed.
Furthermore, since the sheet-like sheet piece FXm is bonded and conveyed on the carrier sheet F9, the sheet-like sheet piece FXm can be supplied smoothly.
Moreover, since the 1st supply part 81 contains the 1st peeling part 81c and the 2nd supply part 82 contains the 2nd peeling part 82c, it is a sheet | seat from the 1st supply part 81 and the 2nd supply part 82. The peeling operation for obtaining the piece FXm can be performed smoothly.

Further, in the film bonding system 2, the optical member F1X can be accurately provided up to the display area P4, and the frame area G (see FIG. 3) outside the display area P4 is narrowed to expand the display area and equipment. Can be reduced in size.

Moreover, in the film bonding system 2, the 1st cutting device 51 and the 2nd cutting device 52 are laser cutters, the 1st cutting device 51 and the 2nd cutting device 52 are connected to the same laser output device 53, The laser output from the laser output device 53 may be branched and supplied to the first cutting device 51 and the second cutting device 52. In this case, as compared with the case where separate laser output devices are connected to the first cutting device 51 and the second cutting device 52, the production system of the optical display device can be downsized.

In addition, the size of the surplus portion of the sheet piece FXm (the size of the portion that protrudes outside the liquid crystal panel P) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece FXm is applied to a medium-sized liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece FXm and one side of the liquid crystal panel P is 2 mm on each side of the sheet piece FXm. Set to a length in the range of ~ 5 mm.

(Third embodiment)
Then, the structure of the 1st bonding apparatus which concerns on 3rd embodiment is demonstrated. FIG. 14 is a schematic side view of the first bonding apparatus 113 according to the present embodiment. In addition, the 2nd bonding apparatus and the 3rd bonding apparatus abbreviate | omit the detailed description as what has the same structure. In the following description, the same reference numerals are given to components common to the first embodiment, and detailed description thereof is omitted.

As shown in FIG. 14, the suction stage 41 has a third direction parallel to a direction in which the bonding head 32 moves between the first supply unit 81 and the second supply unit 82 (a direction orthogonal to the sheet conveyance direction). In the direction V3). For example, the suction stage 41 is disposed at a position overlapping the guide rail 73a (see FIG. 8) extending along the third direction V3 in plan view.

According to this configuration, the movement of the bonding head 32 between the first supply unit 81, the second supply unit 82, and the suction stage 41 can be made linear. Therefore, the moving axis of the bonding head 32 by the moving device 70 can be reduced and the optical member F1X can be made smoother than the configuration in which the suction stage 41 is disposed adjacent to the knife edge 31 along the sheet conveying direction. Can be pasted.

(Fourth embodiment)
15A and 15B are schematic views of a bonding apparatus applied to the film bonding system 1 and the film bonding system 2 of the above embodiment.
FIG. 15A is a diagram illustrating a state in which the sheet piece FXm is held by the bonding head 60. FIG. 15B is a diagram illustrating a state where the sheet piece FXm is bonded to the liquid crystal panel P.

In this embodiment, the difference from the first embodiment is that the bonding apparatus of the first embodiment uses a bonding head 32 having an arc-shaped holding surface 32a, whereas the bonding apparatus of the present embodiment is a flat surface. It is the point which uses the bonding head 60 which has the holding surface 60a of a shape. Therefore, it demonstrates centering around the structure of the bonding head 60 here, about the component which is common in 1st embodiment, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

The bonding apparatus of the present embodiment tilts the bonding head 60, the bonding roller 62, the guide bar 61 that supports the bonding head 60 and the bonding roller 62, and the guide bar 61 with respect to the liquid crystal panel P. And a driving device 63 that horizontally moves in the state. Although not shown, the bonding apparatus of this embodiment is provided with the same unwinding part, cutting part and knife edge (peeling part) as those shown in FIG.

The pasting head 60 has a flat holding surface 60a for holding the sheet piece FXm peeled from the separator sheet. The holding surface 60a is inclined with respect to the liquid crystal panel P when the guide bar 61 is inclined. The sheet piece FXm is positioned so that one end of the sheet piece FXm protrudes outside the holding surface 60a, and is adsorbed to the holding surface 60a. The adsorbing force of the sheet piece FXm is weak, and the sheet piece FXm can be moved in the horizontal direction while sliding on the holding surface 60a while being held by the holding surface 60a.

The laminating roller 62 is disposed on the side of the laminating head 60, and the sheet piece FXm protruding from the holding surface 60a of the laminating head 60 is pressed against the liquid crystal panel P to be adhered. When the guide bar 61 is moved in the horizontal direction by the driving device 63 in this state, the bonding head 60 and the bonding roller 62 are connected to the liquid crystal panel P in the state where one end of the sheet piece FXm is bonded to one end of the sheet piece FXm. It moves horizontally from the part side toward the other end part side. Thereby, the sheet piece FXm is gradually bonded to the liquid crystal panel P from the one end side by the bonding roller 62.

The bonding head 60 aligns the sheet piece FXm held on the holding surface 60a in the horizontal direction in the head moving direction, in the orthogonal direction, and in the rotating direction. As in the first embodiment, the bonding position (relative bonding position) between the sheet piece FXm and the liquid crystal panel P is based on the inspection data in the optical axis direction of the optical member sheet FX (see FIG. 1). Will be determined. The bonding head 60 bonds the sheet piece FXm held on the holding surface 60a to the liquid crystal panel P based on the relative bonding position determined by the control device 25.

Therefore, also in the present embodiment, it is possible to provide an optical display device production system capable of reducing the frame portion around the display area to enlarge the display area and downsize the device.

In addition, in the film bonding system of the said embodiment, the outer periphery of the bonding surface is detected for every some liquid crystal panel P using a detection apparatus, and it pastes for every liquid crystal panel P based on the detected outer periphery. You may set the cutting position of the joined sheet piece. Thereby, since the optical member of a desired size can be cut off regardless of the individual difference of the size of the liquid crystal panel P or the sheet piece, the quality variation due to the individual difference of the size of the liquid crystal panel P or the sheet piece is eliminated, The frame portion around the display area can be reduced to enlarge the display area and downsize the device.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention, including the component configuration, structure, shape, size, number, arrangement, and the like.

DESCRIPTION OF

SYMBOLS

1,2 ... Film bonding system (production system of an optical display device), 13 ... 1st bonding apparatus (bonding apparatus), 15 ... 2nd bonding apparatus (bonding apparatus), 18 ... 3rd bonding apparatus (Bonding device), 81a ... unwinding part, 32 ... bonding head (bonding part), 32a ... holding surface, 51 ... first cutting device (cutting device), 52 ... second cutting device (cutting device), 81 ... first supply unit, 81c ... first peeling unit, 82 ... second supply unit, 82c ... second peeling unit, 91 ... first detection device (detection device), 92 ... second detection device ( Detection device), P ... Liquid crystal panel (optical display component), P4 ... Display area, F1 ... First optical member sheet (optical member sheet), F2 ... Second optical member sheet (optical member sheet), F3 ... Third optical Member sheet (optical member sheet), FX ... optical member sheet, FXm ... sheet piece, F3a ... Lator sheet, F9 ... carrier sheet, F11 ... first optical member (optical member), F12 ... second optical member (optical member), F13 ... third optical member (optical member), F1X ... optical member, R1 ... raw fabric Roll, R3 ... Raw fabric roll, SA1 ... First bonding surface (bonding surface), ED ... Edge of first bonding surface (outer peripheral edge of bonding surface).

Claims

An optical display device production system configured by bonding an optical member to an optical display component,
A belt-shaped optical member sheet having a width corresponding to the display area of the optical display component is unwound together with a separator sheet from a raw roll, and the optical member sheet is cut to leave the separator sheet as the optical member, and the optical member A first supply section for supplying,
A second supply unit that conveys and supplies a sheet-like optical member having a size corresponding to the display area of the optical display component;
One of the optical member supplied by the first supply unit and the optical member supplied by the second supply unit is selected and held on the holding surface, and the holding surface A bonding part for bonding the optical member held in the optical display component;
Optical display device production system equipped with.
2. The optical display device production system according to claim 1, wherein the second supply unit unwinds a carrier sheet from a raw fabric roll, and bonds and transports the sheet-like optical member on the carrier sheet.
The first supply unit includes a first peeling unit that peels the optical member from the separator sheet,
The optical display device production system according to claim 2, wherein the second supply unit includes a second peeling unit that peels the optical member from the carrier sheet.
An optical display device production system configured by bonding an optical member to an optical display component,
A strip-shaped optical member sheet having a width wider than the length of either one of the long side and the short side of the display area of the optical display component is unwound together with the separator sheet from the raw roll, and the optical member sheet is removed from the separator. A first supply unit that leaves the sheet and cuts it into a sheet piece that is longer than the length of the other side of the long side and the short side of the display region, and supplies the sheet piece,
A second supply unit that conveys and supplies a sheet piece that is wider than the length of one side of the display area of the optical display component and longer than the length of the other side of the display area;
While selecting and affixing any one of the sheet piece supplied by said 1st supply part, and the sheet piece supplied by said 2nd supply part to a holding surface, the said holding surface A bonding part for bonding the sheet piece held on the optical display component;
A cutting device that cuts off an excess portion disposed outside the portion corresponding to the bonding surface from the sheet piece bonded to the optical display component, and forms the optical member having a size corresponding to the bonding surface; ,
Optical display device production system equipped with.
A detection device for detecting an outer peripheral edge of a bonding surface between the optical display component and the sheet piece to which the sheet piece is bonded;
The optical cutting device production system according to claim 4, wherein the cutting device cuts the sheet piece along an outer peripheral edge of the bonding surface between the optical display component and the sheet piece detected by the detection device. .
6. The optical display device production system according to claim 4, wherein the second supply unit unwinds the carrier sheet from the raw fabric roll, and bonds and transports the sheet-like sheet piece on the carrier sheet. .
The first supply unit includes a first peeling unit that peels the sheet piece from the separator sheet,
The optical display device production system according to claim 6, wherein the second supply unit includes a second peeling unit that peels the sheet piece from the carrier sheet.