KR102180386B1 - Laser irradiation device and manufacturing device of laminate optical member - Google Patents

Abstract

An object of the present invention is to provide a laser light irradiation device capable of sharply cutting an object and suppressing a decrease in cut quality, and an optical member assembly manufacturing device, and a laser oscillator that emits laser light and , A condensing lens 141 for condensing the laser light emitted from the laser oscillator, an aperture member 143 for tightening the laser light condensed by the condensing lens, and the laser light tightened by the diaphragm member are parallel It includes a collimating lens 145 to be converted.

Description

TECHNICAL FIELD The manufacturing apparatus of a laser light irradiation apparatus and an optical member bonding body TECHNICAL FIELD

The present invention relates to a laser light irradiation device and an optical member bonding body manufacturing device. This application claims priority based on Japanese Patent Application 2013-26096 for which it applied on February 13, 2013, and uses the content here.

BACKGROUND ART Conventionally, a laser light irradiation apparatus is known that irradiates a target object with laser light to perform predetermined processing. The use of a laser light irradiation device for cutting a film or the like is being investigated, and application is expected to a method for producing a polarizing film as described in Patent Document 1, for example.

Japanese Patent Publication No. 2003-255132

In general, the intensity of the laser light is strong at the center of the beam and small at the outer periphery of the beam. When the laser light intensity of the outer peripheral portion of the beam decreases, the outer peripheral portion of the beam does not contribute to cutting the object. Therefore, when a laser light having such an intensity distribution is used, the object cannot be sharply cut, and the cut quality may be poor.

An aspect of the present invention has been made in view of such circumstances, and an object thereof is to provide a laser light irradiation device capable of sharply cutting an object and suppressing a decrease in cut quality, and an optical member bonding body manufacturing device.

In order to achieve the above object, the laser light irradiation apparatus and the optical member bonding body manufacturing apparatus according to the embodiments of the present invention adopt the following configurations.

(1) A laser light irradiation apparatus according to a first aspect of the present invention includes a laser oscillator that emits laser light, a condensing lens that condenses the laser light emitted from the laser oscillator, and the condensing lens condensed by the condensing lens. It includes a diaphragm member for tightening the laser light, and a collimating lens for parallelizing the laser light tightened by the diaphragm member.

(2) In the laser light irradiation apparatus according to (1) above, the diaphragm member may be disposed in the vicinity of the rear focal point of the condensing lens.

(3) A laser light irradiation apparatus according to a second aspect of the present invention includes a table having a holding surface for holding an object, a laser oscillator for emitting laser light, and the laser light emitted from the laser oscillator. A first condensing lens, a diaphragm member for tightening the laser light condensed by the first condensing lens, a collimating lens for parallelizing the laser light condensed by the diaphragm member, and parallel by the collimating lens And a scanner for biaxially scanning the converted laser light in a plane parallel to the holding surface, and a moving device for moving the table and the scanner relative to each other.

(4) The laser light irradiation apparatus according to the above (3) may include a second condensing lens that condenses the laser light parallelized by the collimating lens toward the holding surface.

(5) An optical member bonding body manufacturing apparatus according to a third aspect of the present invention is a manufacturing apparatus for an optical member bonding body configured by bonding an optical member to an optical display component, wherein the optical member bonding body is attached to the optical display component to the outside of the optical display component. A bonding device for forming a sheet piece bonded body by bonding sheet pieces of protruding size, and the bonding from the sheet piece bonded body along an edge of the bonding surface between the optical display component of the sheet piece bonded body and the sheet piece. And a cutting device for cutting the sheet piece at a portion protruding outward of the surface, and forming the optical member having a size corresponding to the bonding surface, wherein the cutting device includes one of (1) to (4) above. It is constituted by the laser light irradiation apparatus according to any one of claims, and the sheet piece as an object is cut by the laser light irradiated from the laser light irradiation apparatus.

According to the aspect of the present invention, it is possible to provide a laser light irradiation device and an optical member bonding body manufacturing device capable of sharply cutting an object and suppressing a decrease in cut quality.

1 is a perspective view showing a laser light irradiation apparatus according to a first embodiment of the present invention.
2 is a diagram showing the configuration of an EBS.
3 is a perspective view showing the internal configuration of an IOR.
4 is a side cross-sectional view showing an arrangement configuration of a first condensing lens, a diaphragm member, and a collimating lens.
5 is a diagram showing a configuration of a control system of a laser light irradiation device.
6A to 6D are diagrams for explaining the action of EBS.
7A to 7D are diagrams focused on one pulse of laser light in FIG. 6.
8 is a diagram for explaining the action of IOR.
9 is an enlarged view of a cut surface when a polarizing plate as an object is cut using the laser light irradiation apparatus according to a comparative example.
10 is an enlarged view of a cut surface when a polarizing plate as an object is cut by using the laser light irradiation device according to the present embodiment.
11 is a schematic diagram showing an apparatus for manufacturing an optical member bonding body according to the first embodiment of the present invention.
12 is a plan view of a liquid crystal panel.
13 is an AA cross-sectional view of FIG. 12.
14 is a cross-sectional view of an optical sheet.
15 is a diagram showing the operation of the cutting device.
16 is a plan view showing a step of detecting an edge of a bonding surface.
17 is a schematic diagram of a detection device.
18A is a diagram showing an example of a method of determining a bonding position of a sheet piece to a liquid crystal panel.
18B is a diagram showing an example of a method of determining a bonding position of a sheet piece to a liquid crystal panel.
19 is a diagram showing a control method for drawing a desired trajectory of the laser light.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

In addition, in all the following drawings, in order to make the drawing easy to see, the dimensions, ratios, etc. of each constituent element are suitably different. In addition, in the following description and drawings, the same reference numerals are assigned to the same or corresponding elements, and overlapping descriptions are omitted.

(Laser light irradiation device)

1 is a perspective view showing an example of a laser light irradiation device 100 used as an object cutting device.

In the following description, the XYZ rectangular coordinate system is set as necessary, and the positional relationship of each member is described with reference to this XYZ rectangular coordinate system. In this embodiment, the direction parallel to the holding surface that holds the object is set as the X direction, and the direction orthogonal to the first direction (X direction) within the plane of the holding surface is the Y direction, the X direction, and The direction orthogonal to the Y direction is set as the Z direction.

As shown in Fig. 1, the laser light irradiation device 100 comprises a table 101, a laser oscillator 102, and an EBS 130 (electric beam shaping; Electrical Beam Shaping: see Fig. 2). An acousto-optic element 103, an IOR 104 (Imaging Optics Rail), a scanner 105, a moving device 106, and a control device 107 for collectively controlling these devices are provided. have.

The table 101 has a holding surface 101s for holding the object 110. The table 101 is rectangular when viewed from the normal direction of the holding surface 101s. The holding surface 101s is disposed adjacent to the rectangular first holding surface 101s1 having a long side in the first direction (X direction) and the first holding surface 101s1, and further supports the first holding surface. It has a second holding surface 101s2 having the same shape as the surface 101s1.

The laser oscillator 102 is a member that emits laser light L. For example, as the laser oscillator 102, oscillators such as a CO ₂ laser oscillator (carbon dioxide laser oscillator), a UV laser oscillator, a semiconductor laser oscillator, a YAG laser oscillator, and an excimer laser oscillator can be used, but the specific configuration is not particularly limited. Does not. Among the above oscillators, the CO ₂ laser oscillator can emit high-power laser light capable of cutting an optical member such as a polarizing film, for example.

2 is a diagram showing the configuration of the EBS 130.

As shown in FIG. 2, the EBS 130 includes an acousto-optic element 103 disposed on an optical path of laser light emitted from the laser oscillator 102, and a driving driver electrically connected to the acoustooptic element 103. It has 131 and a control device 107 (corresponding to the laser control part 171 mentioned later) which controls the timing at which the laser light passes through the acousto-optic element 103.

The EBS 130 shields the laser light until the output of the laser light is stabilized.

The acousto-optic element 103 is an optical element for shielding laser light emitted from the laser oscillator 102.

The acousto-optic element 103 is a piezoelectric element bonded to an acousto-optic medium made of glass or single crystal such as tellurium dioxide (TeO ₂ ) or lead molybdate (PbMoO ₄ ). By applying an electric signal to the piezoelectric element to generate ultrasonic waves, and propagating the ultrasonic waves into the acousto-optic medium, the passage and non-passing (shielding) of the laser light can be controlled.

In addition, in this embodiment, although the acousto-optic element 103 is used as a constituent member of the EBS 130, it is not limited to this. Other optical elements may be used as long as the laser light emitted from the laser oscillator 102 can be shielded.

The drive driver 131 supplies an electric signal (control signal) for generating ultrasonic waves to the acousto-optic element 103 based on the control of the control device 107, and transmits the laser light by the acousto-optic element 103. Adjust the shielding time.

The control device 107 controls the timing at which the laser light passes through the acoustooptic element 103 so that the rising portion and the falling portion of the laser beam emitted from the laser oscillator 102 are removed, for example.

In addition, the timing control by the control device 107 is not limited to this. For example, the control device 107 may control the timing at which the laser light passes through the acousto-optic element 103 so that the rising portion of the laser light radiated from the laser oscillator 102 is selectively removed.

In particular, when the width (time) of the descending portion of the laser light emitted from the laser oscillator 102 is sufficiently shorter than the width (time) of the rising portion of the laser light, the effective blade for removing the falling portion of the laser light is small. Therefore, in such a case, only the rising portion of the laser light emitted from the laser oscillator 102 may be selectively removed.

With this configuration, the EBS 130 emits the laser light emitted from the laser oscillator 102 in a state where the output is stable, based on the control of the control device 107.

The IOR 104 removes the hem portion that does not contribute to the cutting of the object 110 in the intensity distribution of the laser light.

3 is a perspective view showing the internal configuration of the IOR 104.

As shown in FIG. 3, the IOR 104 has a first condensing lens 141 that condenses laser light emitted from the EBS 130 and a first holding lens that holds the first condensing lens 141 The frame 142, the diaphragm member 143 for tightening the laser light condensed by the first condensing lens 141, the holding member 144 for holding the diaphragm member 143, and the diaphragm member 143 The collimating lens 145 which parallelizes the laser beam struck by and the second holding frame 146 holding the collimating lens 145, the first holding frame 142, and the holding member ( It has a moving mechanism 147 which moves 144 and the 2nd holding frame 146 relative.

4 is a side cross-sectional view showing the arrangement configuration of the first condensing lens 141, the diaphragm member 143, and the collimating lens 145. As shown in FIG.

As shown in FIG. 4, the diaphragm member 143 is formed with a pin hole 143h for tightening the laser light condensed by the first condensing lens 141. The centers of each of the first condensing lens 141, the pin hole 143h and the collimating lens 145 are disposed at a position overlapping the optical axis CL of the laser light emitted from the EBS 130.

The diaphragm member 143 may be disposed near the rear focal point of the first condensing lens 141.

Here, "near the focus of the rear side of the first condensing lens 141" means the arrangement position in a range in which the arrangement position of the diaphragm member 143 is not significantly shifted from the rear focus of the first condensing lens 141. It means that you can make a little different. For example, the distance K1 from the center of the first condensing lens 141 to the rear focal point of the first condensing lens 141 and the pinhole of the aperture member 143 from the center of the first condensing lens 141 If the ratio (K1/K2) of the distance K2 to the center of (143h) is in the range of 0.9/1 or more and 1.1/1 or less, the diaphragm member 143 is near the rear focal point of the first condensing lens 141 It can be said that it is placed in. Within this range, it is possible to effectively tighten the laser light condensed by the first condensing lens 141.

Further, the diaphragm member 143 may be disposed in the vicinity of the rear focal point of the first condensing lens 141, but the disposition position of the diaphragm member 143 is not necessarily limited to this position. The arrangement position of the diaphragm member 143 may be on the optical path between the first condensing lens 141 and the collimating lens 145, and is not limited to the vicinity of the rear focal point of the first condensing lens 141.

Returning to Fig. 3, the moving mechanism 147 moves each of the first holding frame 142, the holding member 144, and the second holding frame 146 in a direction parallel to the advancing direction of the laser light. It has a slider mechanism 148 and a holding base 149 which holds the slider mechanism 148.

For example, by moving the first holding frame 142 and the second holding frame 146 in a direction parallel to the advancing direction of the laser light in a state in which the holding member 144 is disposed The 1 holding frame 142, the holding member 144, and the 2nd holding frame 146 are mutually positioned. Specifically, the diaphragm member 143 is disposed at the front focal position of the collimating lens 145 and at the rear focal position of the first condensing lens 141.

Returning to Fig. 1, the scanner 105 biaxially scans the laser beam in a plane parallel to 101s of the holding surface (in the XY plane). That is, the scanner 105 independently moves the laser light relative to the table 101 in the X and Y directions. Thereby, it becomes possible to irradiate the laser beam with high precision to an arbitrary position of the object 110 held by the table 101.

The scanner 105 includes a first irradiation position adjustment device 151 and a second irradiation position adjustment device 154.

The first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 perform a scanning element that biaxially scans the laser beam emitted from the IOR 104 in a plane parallel to the holding surface 101s. Make up. As the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154, a galvano scanner is used, for example. In addition, the scanning element is not limited to a galvano scanner, and a gimbal can also be used.

The first irradiation position adjustment device 151 includes a mirror 152 and an actuator 153 that adjusts an installation angle of the mirror 152. The actuator 153 has a rotation axis parallel to the Z direction. The actuator 153 rotates the mirror 152 in the Z-axis direction based on the control of the control device 107.

The second irradiation position adjustment device 154 includes a mirror 155 and an actuator 156 that adjusts the installation angle of the mirror 155. The actuator 156 has a rotation axis parallel to the Y direction. The actuator 156 rotates the mirror 155 in the Y-axis direction based on the control of the control device 107.

On the optical path between the scanner 105 and the table 101, a second condensing lens 108 for condensing the laser beam passing through the scanner 105 toward the holding surface 101s is disposed.

For example, as the second condensing lens 108, an f? lens is used. Thereby, the laser light emitted from the mirror 155 in parallel to the second condensing lens 108 can be condensed in parallel to the object 110.

Further, a configuration in which the second condensing lens 108 is not disposed on the optical path between the scanner 105 and the table 101 may be employed.

The laser light L emitted from the laser oscillator 102 passes through the acousto-optic element 103, the IOR 104, the mirror 152, the mirror 155, and the second condensing lens 108, and the table ( The object 110 held by 101) is irradiated. The first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 are based on the control of the control device 107, the object 110 held by the laser oscillator 102 on the table 101 Adjust the irradiation position of the laser light to be irradiated toward.

The laser beam processing area 105s (hereinafter referred to as a scan area) under the control of the scanner 105 is a rectangle when viewed from the normal direction of the holding surface 101s. In this embodiment, the area of the scan area 105s is smaller than the area of each of the first holding surface 101s1 and the second holding surface 101s2.

The moving device 106 moves the table 101 and the scanner 105 relative. The moving device 106 holds the first slider mechanism 161 and the first slider mechanism 161 to move the table 101 in a first direction (X direction) parallel to the holding surface 101s. It has a second slider mechanism 162 which moves in a second direction (Y direction) parallel to the surface 101s and orthogonal to the first direction. The moving device 106 moves the table 101 in each XY direction by operating a linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162.

The linear motor pulse-driven in the slider mechanism can precisely control the rotation angle of the output shaft by a pulse signal supplied to the linear motor. Therefore, the position of the table 101 supported by the slider mechanism in each XY direction can be controlled with high precision. In addition, the position control of the table 101 is not limited to position control using a pulse motor, and may be realized by feedback control using a servo motor or any other control method.

The control device 107 includes a laser control unit 171 that controls the laser oscillator 102 and the acoustooptic element 103 (drive driver 131), a scanner control unit 172 that controls the scanner 105, It has a slider control unit 173 that controls the moving device 106.

Specifically, the laser control unit 171, the ON/OFF of the laser oscillator 102, the output of the laser light emitted from the laser oscillator 102, and the laser light L emitted from the laser oscillator 102 is an acousto-optic element. The timing passing through (103) and the control of the driving driver 131 are performed.

The scanner control unit 172 performs drive control of the actuator 153 of the first irradiation position adjustment device 151 and the actuator 156 of the second irradiation position adjustment device 154, respectively.

The slider control unit 173 controls the operation of a linear motor incorporated in each of the first slider mechanism 161 and the second slider mechanism 162.

5 is a diagram showing a configuration of a control system of the laser light irradiation apparatus 100.

As shown in Fig. 5, an input device 109 capable of inputting an input signal is connected to the control device 107. The input device 109 includes an input device such as a keyboard and a mouse, or a communication device capable of inputting data from an external device. The control device 107 may include a display device such as a liquid crystal display that shows the operation state of each unit of the laser light irradiation device 100, or may be connected to the display device.

When the initial setting is completed by the user inputting the processing data into the input device 109, the laser light is emitted from the laser oscillator 102 based on the control of the laser control unit 171 of the control device 107. . At this time, based on the control of the scanner control unit 172 of the control device 107, rotational driving of the mirrors constituting the scanner 105 is started. At the same time, based on the control of the slider control unit 173 of the control device 107, the number of rotations of a drive shaft such as a motor installed in the first slider mechanism 161 and the second slider mechanism 162 is determined by a sensor such as a rotary encoder. Is detected by

The control device 107 corrects each coordinate value in real time so that the laser light is emitted at the coordinates that match the processing data, that is, the laser light draws a desired trajectory on the object 110 (see Fig. 1), It controls the mobile device 106 and the scanner 105. The control device 107, for example, mainly scans the laser beam by the moving device 106, and adjusts the area where the irradiation position of the laser beam cannot be controlled with the moving device 106 with high precision by the scanner 105. .

6A to 6D are views for explaining the operation of the EBS 130.

6A shows a control signal of the laser light emitted from the laser oscillator 102.

6B shows the output characteristics of the laser light emitted from the laser oscillator 102, that is, the output characteristics of the laser light before the laser light emitted from the laser oscillator 102 passes through the acousto-optic element 103. Represents.

6C shows the control signal of the acousto-optic element 103.

6D shows the output characteristics of the laser light after the laser light emitted from the laser oscillator 102 passes through the acousto-optic element 103.

In each of (b) and (d) of FIG. 6, the horizontal axis represents time and the vertical axis represents the intensity of laser light.

7A to 7D are diagrams focused on one pulse of laser light in FIGS. 6A to 6D.

In the following description, "the control signal of the laser light emitted from the laser oscillator 102" is referred to as a "control signal of the laser light". The "laser light output characteristic before the laser light radiated from the laser oscillator 102 passes through the acousto-optical element 103" is referred to as "output characteristic of the laser light before passing through the acoustic optical element 103". "The output characteristic of the laser light after the laser light emitted from the laser oscillator 102 passes through the acousto-optical element 103" is referred to as "output characteristic of the laser light after passing through the acoustic-optical element 103".

As shown in Figs. 6A and 7A, the pulse Ps1 of the control signal of the laser light is a rectangular pulse. As shown in Fig. 6A, the control signal of the laser light is a so-called clock pulse that generates a plurality of pulses Ps1 by periodically switching the ON/OFF signal to the laser oscillator 102.

6(a) and 7(a), the high part of the pulse Ps1 is a state in which an ON signal is sent to the laser oscillator 102, that is, the laser light is emitted from the laser oscillator 102. State. The valley portion of the pulse Ps1 is a state in which an OFF signal is sent to the laser oscillator 102, that is, an OFF state in which no laser light is emitted from the laser oscillator 102.

As shown in Fig. 6A, three pulses Ps1 are arranged at short intervals to form one collective pulse PL1. The three collective pulses PL1 are arranged at intervals longer than the arrangement intervals of the three pulses Ps1. For example, an interval between two adjacent pulses Ps1 is 1 millisecond, and an interval between two adjacent pulses PL1 is 10 milliseconds.

In addition, in the present embodiment, an example in which one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals is described, but is not limited thereto. For example, one collective pulse may be formed by arranging two or four or more pulses at short intervals.

In addition, a configuration in which a plurality of pulses is formed periodically is not limited, and one pulse may be formed in a long width. That is, the laser light having a constant intensity from the ON signal to the OFF signal to the laser oscillator may be radiated for a predetermined time.

6B and 7B, the pulse Ps2 of the output characteristic of the laser light before passing through the acousto-optic element 103 has a rising portion G1 and a falling portion G2. It is a waveform pulse.

Here, the rising portion G1 means a portion of the pulse Ps2 in the period from 0 to the intensity contributing to cutting the object. The falling part G2 means a part in the period from the intensity|strength of the laser light intensity|strength which contributes to cutting of an object to zero among the pulse Ps2 of the output characteristic of laser light. The intensity that contributes to cutting the object varies depending on the material or thickness of the object, and the output value of the laser light, but as an example, as shown in Fig. 7B, the intensity of 50% of the peak intensity (100%) of the laser light To

As shown in Figs. 6B and 7B, the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2. That is, the time of the rising portion G1 of the laser light radiated from the laser oscillator 102 is longer than the time of the falling portion G2 of the laser light.

For example, the width of the rising portion G1 is 45 microseconds, and the width of the falling portion G2 is 25 microseconds.

In addition, in this embodiment, although the width of the rising part G1 of the pulse Ps2 is longer than the width of the falling part G2, it is demonstrated, but is not limited to this. For example, when the width of the rising portion G1 of the pulse Ps2 is approximately equal to the width of the falling portion G2, the width of the rising portion G1 of the pulse Ps2 is greater than the width of the falling portion G2. Even in a short case, the present invention can be applied.

As shown in Fig. 6(b), three pulses Ps2 are arranged at positions corresponding to the three pulses Ps1 shown in Fig. 6(a), thereby forming one collective pulse PL2. . The three collective pulses PL2 are arranged at positions corresponding to the three collective pulses PL1 shown in Fig. 6A.

6C and 7C, the pulse Ps3 of the control signal of the acousto-optic element 103 is a rectangular pulse. As shown in (c) of FIG. 6, the control signal of the acousto-optic element 103 is a control signal for the driving driver 131 so that the timing at which the laser light passes through the acoustooptic element 103 is periodically switched. It is a so-called clock pulse that generates a plurality of pulses Ps3 by periodically switching.

In Figs. 6C and 7C, the high portion of the pulse Ps3 is a state in which the laser light is passed, that is, a light-transmitting state in which the laser light is transmitted. The valley portion of the pulse Ps3 is a state in which the laser light does not pass, that is, a light-shielding state to shield the laser light.

As shown in (c) of FIG. 6, the valley portion of each pulse Ps3 overlaps both the rising portion G1 and the falling portion G2 of each pulse Ps2 shown in FIG. 6(b). It is placed.

As shown in Fig. 7C, when paying attention to one pulse Ps3, the width of the front valley portion V1 of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2. Also, the width of the rear valley portion V2 of the pulse Ps3 is substantially equal to the width of the falling portion of the pulse Ps2. For example, the width of the front valley portion V1 of the pulse Ps3 is 45 microseconds, and the width of the rear valley portion V2 of the pulse Ps3 is 25 microseconds. As such, the EBS 130 has a switch function having a fast response characteristic.

Thereby, the rising portion G1 and the falling portion G2 of the laser light are removed, and a portion in which the intensity of the laser light contributes to the cutting of the object can be selectively taken out of the pulse Ps2 of the output characteristic of the laser light.

As a result, as shown in Figs. 6D and 7D, the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic element 103 is the rising portion G1 and the falling portion G2. It becomes a sharply protruding pulse that does not have ).

In this embodiment, the width of the front valley portion V1 of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the rear valley portion V2 of the pulse Ps3 An example where the width of is substantially equal to the width of the falling portion of the pulse Ps2 is described, but is not limited thereto.

For example, the width of the front valley portion V1 of the pulse Ps3 is substantially equal to the width of the rising portion G1 of the pulse Ps2, or of the rear valley portion V2 of the pulse Ps3. The width can be appropriately adjusted as necessary, such as making the width larger than the width of the falling portion of the pulse Ps2.

8 is a diagram for explaining the operation of the IOR 104.

The figure at the left end of FIG. 8 is a figure showing the laser light intensity distribution before passing through the pinhole 143h. The view at the upper left end of FIG. 8 is a plan view. A view of the middle end of the left end of FIG. 8 is a perspective view. 8 is a diagram showing the horizontal axis as a position and the vertical axis as strength.

The figure at the right end of FIG. 8 is a figure showing the laser light intensity distribution after passing through the pinhole 143h. 8 is a plan view at the top of the right end. A view of the middle end of the right end of FIG. 8 is a perspective view. 8 is a diagram showing the horizontal axis as the position and the vertical axis as the strength.

9 is an enlarged view of a cut surface when a polarizing plate as an object is cut using the laser light irradiation apparatus according to a comparative example.

Here, the laser light irradiation device according to the comparative example is a laser light irradiation device that uses the laser light before passing through the pinhole 143h as it is, that is, a laser light irradiation device without the IOR 104.

10 is an enlarged view of a cut surface when a polarizing plate as an object is cut using the laser light irradiation device 100 according to the present embodiment.

As shown in the diagram at the left end of Fig. 8, the intensity distribution of the laser light before passing through the pinhole 143h has an intensity distribution having a strong intensity at the center of the beam and a weak intensity at the outer periphery of the beam. When the intensity of the laser light at the outer periphery of the beam decreases, the outer periphery of the beam does not contribute to cutting the object.

In this case, as shown in FIG. 9, in the laser light irradiation apparatus according to the comparative example, it is confirmed that the cut surface of the polarizing plate is tapered. This is considered to be the cause of the fact that when cutting the polarizing plate, a portion other than the cut region of the polarizing plate is melted by applying a thermal effect to a portion of the outer peripheral portion of the beam diameter of the laser light along the cutting line.

In contrast, as shown in the diagram at the right end of Fig. 8, the intensity distribution of the laser light after passing through the pinhole 143h is, by removing a portion of the lower end that does not contribute to cutting of the polarizing plate among the intensity distribution of the laser light, The intensity distribution of the laser light becomes an ideal Gaussian distribution. The half-value width of the intensity distribution of the laser light after passing through the pinhole 143h is narrower than the half-value width of the intensity distribution of the laser light before passing through the pinhole 143h.

In this case, as shown in FIG. 10, in the laser light irradiation apparatus 100 including the IOR 104 according to the present embodiment, it is confirmed that the cut surface of the polarizing plate is perpendicular to the holding surface. This is considered to be due to the fact that when the polarizing plate is cut, a portion contributing to the cutting of the polarizing plate among the intensity distribution of the laser light is irradiated to the polarizing plate, thereby selectively melting the cut region of the polarizing plate.

As described above, according to the laser light irradiation apparatus 100 according to the present embodiment, the object 110 can be sharply cut, and a decrease in cut quality can be suppressed.

In general, laser light has a longer optical path when the range to be cut is widened. If so, the beam diameter of the laser light changes, thereby distorting the outer periphery of the beam diameter, thereby changing the cut quality.

In contrast, according to the laser light irradiation apparatus 100 according to the present embodiment, the laser light incident by the first condensing lens 141 is condensed, and the beam diameter of the laser light condensed by the pinhole 143h is By removing the outer periphery, the laser beam from which the outer periphery of the beam diameter is removed can be parallelized by the collimating lens 145. Therefore, even if the optical path of the laser beam is lengthened, the cut quality can be maintained.

Further, since the diaphragm member 143 is disposed in the vicinity of the rear focal point of the first condensing lens 141, it passes through the pinhole 143h while the laser light is sufficiently condensed. Accordingly, a portion of the hem that does not contribute to cutting of the object 110 among the intensity distribution of the laser light can be removed with high precision.

In addition, since the second condensing lens 108 is disposed on the optical path between the scanner 105 and the table 101, the laser light passing through the scanner 105 can be condensed parallel to the object 110. Thus, the object 110 can be cut with high precision.

In addition, in the laser light irradiation apparatus 100 of the present embodiment, the laser beam is mainly scanned by the moving device 106, and the area where the laser beam irradiation position cannot be controlled with high precision in the moving device 106 is covered by the scanner ( 105). Therefore, compared with the case of scanning the laser beam only with the moving device 106 or only the scanner 105, the irradiation position of the laser beam can be controlled with high precision over a wide range.

In addition, in this embodiment, as an example, the laser light irradiation apparatus 100 is a table 101, a laser oscillator 102, a first condensing lens 141, a diaphragm member 143, and a collimating lens. Although the configuration including 145, the scanner 105, and the mobile device 106 has been described as an example, it is not limited to this. For example, the laser light irradiation apparatus may have a configuration including a laser oscillator, a condensing lens, a diaphragm member, and a collimating lens. That is, the laser light irradiation device may have a configuration not provided with a table, a scanner, and a moving device.

(Optical member bonding body manufacturing apparatus)

Hereinafter, a film bonding system 1 which is an apparatus for manufacturing an optical member bonding body according to an embodiment of the present invention will be described with reference to the drawings. In the film bonding system 1 according to the present embodiment, the cutting device is configured by the laser light irradiation device 100 described above.

11 is a diagram showing a schematic configuration of the film bonding system 1 of the present embodiment.

The film bonding system 1 bonds a film-like optical member such as a polarizing film, an antireflection film, or a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel, for example.

In the following description, the XYZ rectangular coordinate system is set as necessary, and the positional relationship of each member is described with reference to this XYZ rectangular coordinate system. In this embodiment, the conveyance direction of the liquid crystal panel which is an optical display component is the X direction, and the direction (width direction of the liquid crystal panel) perpendicular to the X direction within the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction. The direction orthogonal to is set as the Z direction.

As shown in FIG. 11, the film bonding system 1 of this embodiment is installed as one process of the manufacturing line of liquid crystal panel P. Each part of the film bonding system 1 is collectively controlled by the control part 40 as an electronic control device.

12 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. FIG. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a relatively small rectangular shape disposed opposite to the first substrate P1, and A liquid crystal layer P3 enclosed between the first substrate P1 and the second substrate P2 is provided. The liquid crystal panel P has a rectangular shape that follows the outer shape of the first substrate P1 when viewed in a plan view, and an area accommodated inside the outer periphery of the liquid crystal layer P3 when viewed in a plan view is designated as the display area P4. do.

13 is a cross-sectional view taken along line A-A of FIG. 12. On the front and back surfaces of the liquid crystal panel P, cut out from the first optical sheet F1 and the second optical sheet F2 in a long strip shape (see FIG. 11, hereinafter may be collectively referred to as optical sheet FX). The first optical member F11 and the second optical member F12 (hereinafter, referred to as optical member F1X in some cases) are properly bonded. In this embodiment, a polarizing film is bonded to both surfaces of the liquid crystal panel P, respectively. The first optical member F11 is bonded as a polarizing film to the backlight side surface of the liquid crystal panel P. The second optical member F12 is bonded as a polarizing film to the display surface side surface of the liquid crystal panel P.

Outside the display area P4, a frame portion G having a predetermined width is provided in which a sealant for bonding the first substrate P1 and the second substrate P2 of the liquid crystal panel P is disposed.

In addition, the first optical member F11 and the second optical member F12 may be referred to as a first sheet piece F1m and a second sheet piece F2m (hereinafter, collectively referred to as sheet piece FXm) to be described later. ), each is formed by cutting the outer excess portion of the bonding surface. The bonding surface will be described later.

14 is a partial cross-sectional view of the optical sheet FX bonded to the liquid crystal panel P. Optical sheet FX is optical through the film-shaped optical member main body F1a, the adhesive layer F2a provided on one surface (the upper surface in FIG. 14) of the optical member main body F1a, and the adhesive layer F2a. It has a separator F3a laminated separably on one side of the member main body F1a, and a surface protective film F4a laminated on the other side (lower surface in FIG. 14) of the optical member main body F1a. The optical member main body F1a functions as a polarizing plate, and is bonded over the entire area of the display area P4 of the liquid crystal panel P and the peripheral area of the display area P4. In addition, hatching of each layer in FIG. 14 is omitted for the sake of illustration.

The optical member main body F1a is bonded to the liquid crystal panel P through the adhesive layer F2a while the separator F3a is separated while leaving the adhesive layer F2a on one side of the optical member main body F1a. do. Hereinafter, the portion excluding the separator F3a from the optical sheet FX is referred to as a bonding sheet F5.

The separator F3a protects the adhesive layer F2a and the optical member main body F1a while it is separated from the adhesive layer F2a. The surface protection film F4a is bonded to the liquid crystal panel P together with the optical member main body F1a. The surface protection film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member main body F1a to protect the optical member main body F1a. The surface protection film F4a is separated from the optical member main body F1a at a predetermined timing. Further, the optical sheet FX may have a configuration in which the surface protection film F4a is not included. A configuration in which the surface protection film F4a is not separated from the optical member main body F1a may be used.

The optical member main body F1a includes a sheet-shaped polarizer F6, a first film F7 bonded to one side of the polarizer F6 with an adhesive, and an adhesive or the like on the other side of the polarizer F6. It has the 2nd film F8 to be bonded. The 1st film F7 and the 2nd film F8 are protective films which protect the polarizer F6, for example.

In addition, the optical member main body F1a may have a single-layer structure including one optical layer, or a laminated structure in which a plurality of optical layers are stacked on each other. In addition to the polarizer F6, the optical layer may be a retardation film or a brightness improving film. At least one of the first film (F7) and the second film (F8) is subjected to a surface treatment capable of obtaining an effect such as a hard coating treatment to protect the outermost surface of a liquid crystal display device or an anti-glare treatment, such as anti-glare treatment. May be. The optical member main body F1a does not have to include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of this embodiment is demonstrated in detail.

As shown in FIG. 11, the film bonding system 1 of this embodiment is the liquid crystal panel P on the left side in a drawing from the conveyance direction upstream side (+X direction side) of the right liquid crystal panel P in a figure. It reaches the downstream side in the conveyance direction of (-X direction side) and is equipped with the drive type roller conveyor 5 which conveys the liquid crystal panel P in a horizontal state.

The roller conveyor 5 is divided into an upstream side conveyor 6 and a downstream side conveyor 7 on the border of a reversing device 15 described later. In the upstream conveyor 6, the liquid crystal panel P is conveyed by making the short side of the display area P4 follow a conveyance direction. On the other hand, in the downstream conveyor 7, the liquid crystal panel P is conveyed by making the long side of the display area P4 follow a conveyance direction. A sheet piece FXm (equivalent to the optical member F1X) of the bonding sheet F5 cut out from the strip-shaped optical sheet FX to a predetermined length is bonded to the front and back surfaces of the liquid crystal panel P.

Further, the upstream conveyor 6 is provided with an independent pre-roller conveyor 24 on the downstream side in the first adsorption device 11 described later. On the other hand, the downstream conveyor 7 is provided with the independent pre-roller conveyor 24 on the downstream side in the 2nd adsorption apparatus 20 mentioned later.

The film bonding system 1 of the present embodiment includes a first adsorption device 11, a first dust collector 12, a first bonding device 13, a first detection device 41, and a first cutting device 31. ), a reversing device 15, a second dust collecting device 16, a second bonding device 17, a second detection device 42, a second cutting device 32, and a control unit 40.

The first adsorption device 11 adsorbs the liquid crystal panel P, conveys it to the upstream conveyor 6, and performs alignment (positioning) of the liquid crystal panel P. The first adsorption device 11 has a panel holding portion 11a, an alignment camera 11b, and a rail R.

The panel holding portion 11a holds the liquid crystal panel P in contact with the stopper S on the downstream side by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction. Alignment is performed. The panel holding portion 11a adsorbs and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum adsorption. The panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is adsorbed and held, and conveys the liquid crystal panel P. When the conveyance is finished, the panel holding part 11a releases the adsorption holding|maintenance and delivers the liquid crystal panel P to the pre-roller conveyor 24.

The alignment camera 11b holds the liquid crystal panel P in contact with the stopper S by the panel holding portion 11a, and captures an image of an alignment mark or a tip shape of the liquid crystal panel P in an elevated state. The imaging data by the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding portion 11a is operated, and the liquid crystal panel P for the pre-roller conveyor 24 at the transfer destination. Alignment is performed. That is, the liquid crystal panel P is a pre-roller conveyor in a state in which the deviation in the conveying direction with respect to the pre-roller conveyor 24, the direction orthogonal to the conveying direction, and the turning direction around the vertical axis of the liquid crystal panel P is added. 24).

The liquid crystal panel P conveyed along the top of the rail R by the panel holding part 11a is held together with the sheet piece FXm in the state of being adsorbed by the adsorption pad 26, and the tip of the liquid crystal panel P is clamped by the clamping roll 23. .

The 1st dust collecting device 12 is provided on the conveyance upstream side of the liquid crystal panel P of the clamping roll 23 which is the bonding position of the 1st bonding device 13. The first dust collecting device 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced into the bonding position, particularly dust on the lower surface side.

The 1st bonding device 13 is provided on the panel conveyance downstream side than the 1st adsorption device 11. The first bonding device 13 bonds the bonding sheet F5 (corresponding to the first sheet piece F1m) cut to a predetermined size with respect to the lower surface of the liquid crystal panel P introduced to the bonding position.

The 1st bonding device 13 is equipped with the conveyance device 22 and the pinching roll 23.

The conveying device 22 conveys the optical sheet FX along the longitudinal direction of the optical sheet FX while unwinding the optical sheet FX from the original roll R1 on which the optical sheet FX was wound. The conveying device 22 conveys the bonding sheet F5 using the separator F3a as a carrier. The conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.

The roll holding part 22a holds the original roll R1 which wound up the strip-shaped optical sheet FX, and feeds out the optical sheet FX along the longitudinal direction of the optical sheet FX.

The plurality of guide rollers 22b wind up the optical sheet FX so as to guide the optical sheet FX unwound from the original roll R1 along a predetermined conveyance path.

The cutting device 22c performs half-cutting on the optical sheet FX on the conveyance path.

The knife edge 22d supplies the bonding sheet F5 to the bonding position, starting to wind the half-cut optical sheet FX at an acute angle and separating the bonding sheet F5 from the separator F3a.

The winding part 22e holds the separator roll R2 which winds up the independent separator F3a via the knife edge 22d.

The roll holding part 22a located at the start point of the conveyance device 22 and the winding part 22e located at the end point of the conveyance device 22 are driven in synchronization with each other, for example. Thereby, while the roll holding part 22a feeds out the optical sheet FX in the conveyance direction of the optical sheet FX, the winding part 22e winds up the separator F3a which passed the knife edge 22d. Hereinafter, the upstream side in the conveyance direction of the optical sheet FX (separator F3a) in the conveyance device 22 is referred to as a sheet conveyance upstream side, and the downstream side in the conveyance direction is referred to as a sheet conveyance downstream side.

Each guide roller 22b changes the traveling direction of the optical sheet FX during conveyance along the conveyance path, and at least a part of the plurality of guide rollers 22b adjusts the tension of the optical sheet FX during conveyance. I work to do it.

Further, a dancer roller (not shown) may be disposed between the roll holding portion 22a and the cutting device 22c. The dancer roller absorbs the feeding amount of the optical sheet FX conveyed from the roll holding part 22a while the optical sheet FX is cut by the cutting device 22c.

15 is a diagram showing the operation of the cutting device 22c of the present embodiment.

As shown in FIG. 15, when the optical sheet FX is fed to a predetermined length, the cutting device 22c extends the entire width of the optical sheet FX in the width direction orthogonal to the length direction of the optical sheet FX. A half cut is performed by cutting a part in the thickness direction of ). The cutting device 22c of the present embodiment is provided with respect to the optical sheet FX so that it can advance and retreat from the side opposite to the separator F3a toward the optical sheet FX.

The cutting device 22c is a cutting blade so that the optical sheet FX (separator F3a) is not broken by the tension acting during the conveyance of the optical sheet FX (so that a predetermined thickness remains in the separator F3a). The advancing and retreating positions of are adjusted, and half-cut is performed to the vicinity of the interface between the adhesive layer F2a and the separator F3a. Moreover, you may use a laser device instead of a cutting blade.

In the optical sheet FX after half-cut, the optical member main body F1a and the surface protection film F4a are cut in the thickness direction of the optical sheet FX, so that the cut line over the entire width in the width direction of the optical sheet FX (L1), a cut line L2 is formed. The cutting line L1 and the cutting line L2 are formed so as to be arranged in plural in the longitudinal direction of the strip-shaped optical sheet FX. For example, in the case of the bonding process of conveying the liquid crystal panel P of the same size, a plurality of cut lines L1 and a plurality of cut lines L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX. The optical sheet FX is divided into a plurality of divisions in the longitudinal direction by a plurality of cut lines L1 and a plurality of cut lines L2. The divisions sandwiched between the pair of cutting lines L1 and the cutting line L2 adjacent in the longitudinal direction in the optical sheet FX become one sheet piece FXm in the bonding sheet F5, respectively. The sheet piece FXm is a sheet piece of the optical sheet FX of the size protruding outward of the liquid crystal panel P.

Returning to FIG. 11, the knife edge 22d is disposed below the upstream conveyor 6 and extends at least over the entire width of the optical sheet FX in the width direction of the optical sheet FX. The knife edge 22d winds up the optical sheet FX so that sliding contact may be made to the separator F3a side of the optical sheet FX after half-cutting.

The knife edge 22d is a first surface disposed in a prone position when viewed from the width direction of the optical sheet FX (the width direction of the upstream conveyor 6), and the optical sheet FX from the upper side of the first surface. It has a second surface disposed at an acute angle with respect to the first surface when viewed in the width direction of, and a tip portion at which the first and second surfaces intersect.

In the 1st bonding apparatus 13, the knife edge 22d winds up the 1st optical sheet F1 at an acute angle to the tip end of the knife edge 22d. When the first optical sheet F1 is folded at an acute angle at the tip end of the knife edge 22d, the sheet piece (first sheet piece F1m) of the bonding sheet F5 is separated from the separator F3a. The tip end of the knife edge 22d is disposed close to the panel conveyance downstream side of the clamping roll 23. The first sheet piece F1m separated from the separator F3a by the knife edge 22d overlaps the lower surface of the liquid crystal panel P in a state adsorbed by the first adsorption device 11, while the pinching roll 23 ) Is introduced between a pair of bonding rollers 23a. The first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size protruding outward of the liquid crystal panel P.

On the other hand, the separator F3a separated from the bonding sheet F5 by the knife edge 22d faces the winding portion 22e. The winding part 22e winds up and collects the bonding sheet F5 and the separated separator F3a.

The pinching roll 23 bonds the first sheet piece F1m separated from the first optical sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6 do. Here, the pinching roll 23 corresponds to a bonding device.

The pinching roll 23 has a pair of bonding rollers 23a arranged in parallel with each other in the axial direction. The bonding roller on the upper side of the pair of bonding rollers 23a is movable up and down. A predetermined gap is formed between the pair of bonding rollers 23a. The inside of this gap becomes the bonding position of the 1st bonding apparatus 13.

In the gap, the liquid crystal panel P and the first sheet piece F1m overlap and are introduced. The liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being pinched by the pair of bonding rollers 23a. In this embodiment, the 1st optical member bonding body PA1 is formed by bonding the 1st sheet piece F1m to the backlight side surface of the liquid crystal panel P by the clamping roll 23.

The 1st detection device 41 is provided on the panel conveyance downstream side than the 1st bonding device 13. The first detection device 41 detects the edge of the bonding surface (hereinafter referred to as first bonding surface SA1) between the liquid crystal panel P and the first sheet piece F1m.

16 is a plan view showing a detection process of the edge ED of the first bonding surface SA1.

The first detection device 41 is, for example, as shown in FIG. 16, at the end of the first bonding surface SA1 in four inspection areas CA provided on the conveyance path of the upstream conveyor 6. The edge (ED) is detected. Each inspection area CA is disposed at a position corresponding to the four corner portions of the first bonding surface SA1 having a rectangular shape. The edge edge ED is detected for each liquid crystal panel P conveyed along a line. The data of the edge ED detected by the first detection device 41 is stored in a storage unit (not shown).

In addition, the arrangement position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side).

17 is a schematic diagram of the first detection device 41.

In FIG. 17, for convenience, the side to which the first sheet piece F1m of the first optical member bonding body PA1 is bonded is set as an upper side, and the configuration of the first detection device 41 is shown inverted up and down.

As shown in Fig. 17, the first detection device 41 is more than the edge edge ED with respect to the normal direction of the illumination light source 44 that illuminates the edge edge ED and the first bonding surface SA1. An imaging device that is disposed at an inclined position inside the first bonding surface SA1 and captures an image of the edge ED from the side to which the first sheet piece F1m of the first optical member bonding body PA1 is bonded. It has (43).

The illumination light source 44 and the imaging device 43 are respectively arrange|positioned in the four inspection areas CA shown in FIG. 16 (positions corresponding to the four corners of the 1st bonding surface SA1).

The angle θ (hereinafter referred to as the inclination angle θ of the imaging device 43) formed by the normal line of the first bonding surface SA1 and the normal line of the imaging surface 43a of the imaging device 43 is the imaging device ( It can be set so that a shift at the time of division of a panel, a burr, etc. does not enter in the imaging field of 43). For example, when the end surface of the second substrate P2 is offset outside the end surface of the first substrate P1, the inclination angle θ of the imaging device 43 is the image pickup of the imaging device 43 It is set so that the edge of the second substrate P2 is not drawn into the field of view.

The inclination angle θ of the imaging device 43 is the distance H between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter, the height of the imaging device 43 ( H) can be set appropriately. For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 can be set to an angle in the range of 5° or more and 20° or less. However, when the deviation amount is known empirically, the height H of the imaging device 43 and the inclination angle θ of the imaging device 43 can be calculated based on the deviation amount. In this embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10°.

The illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area|region CA.

Moreover, the illumination light source 44 and the imaging device 43 may be arrange|positioned so that it can move along the edge ED of 1st bonding surface SA1. In this case, the illumination light source 44 and the imaging device 43 should just be provided one by one. Thereby, the illumination light source 44 and the imaging device 43 can be moved to the position where the edge ED of 1st bonding surface SA1 is easy to image.

The illumination light source 44 is disposed on the side opposite to the side to which the first sheet piece F1m of the first optical member bonding body PA1 was bonded. The illumination light source 44 is disposed at a position inclined outside the first bonding surface SA1 than the edge ED with respect to the normal direction of the first bonding surface SA1. In this embodiment, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.

Moreover, the illumination light source may be arrange|positioned on the side to which the 1st sheet piece F1m of the 1st optical member bonding body PA1 was bonded.

In addition, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may cross slightly obliquely.

The cut position of the 1st sheet piece F1m is adjusted based on the detection result of the edge ED of 1st bonding surface SA1. The control unit 40 (see FIG. 11) acquires data of the edge ED of the first bonding surface SA1 stored in the storage unit, and the first optical member F11 is outside the liquid crystal panel P. The cut position of the first sheet piece F1m is determined so that the size does not protrude (outside of the first bonding surface SA1). The first cutting device 31 cuts the first sheet piece F1m at the cut position determined by the control unit 40.

Returning to FIG. 11, the 1st cutting device 31 is provided on the panel conveyance downstream side than the 1st detection device 41. The first cutting device 31 is a first sheet piece of a portion protruding from the first optical member bonding body PA1 to the outside of the first bonding surface SA1 by performing laser cutting along the edge ED. (F1m) (the surplus portion of the first sheet piece F1m) is cut off to form an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1. The first cutting device 31 corresponds to a cutting device.

Here, "the size corresponding to the first bonding surface SA1" indicates the size of the outer shape of the first substrate P1. However, a region that is equal to or larger than the size of the display region P4 and equal to or smaller than the size of the external shape of the liquid crystal panel P includes a region excluding a functional part such as an electric component mounting portion.

By cutting the excess portion of the first sheet piece F1m from the first optical member bonding body PA1 by the first cutting device 31, the first optical member F11 is formed on the backlight side surface of the liquid crystal panel P. The second optical member bonding body PA2 formed by bonding is formed. The excess portion cut off from the first sheet piece F1m is peeled off from the liquid crystal panel P by a peeling device (not shown) and recovered.

The inversion device 15 reverses the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the top surface, and makes the backlight side of the liquid crystal panel P the top surface, and the second bonding device The liquid crystal panel P is aligned with respect to (17).

The reversing device 15 has an alignment function similar to that of the panel holding portion 11a of the first adsorption device 11. The reversing device 15 is provided with an alignment camera 15c similar to the alignment camera 11b of the first adsorption device 11.

The reversing device 15 is based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c, the second optical member bonding body PA2 to the second bonding device 17 Positioning in the width direction of the component and positioning in the rotational direction are performed. In this state, the second optical member bonding body PA2 is introduced into the bonding position of the second bonding device 17.

Since the 2nd adsorption device 20 has the same structure as the 1st adsorption device 11, the same code|symbol is attached|subjected to the same part, and it demonstrates. The second adsorption device 20 adsorbs the second optical member bonding body PA2 and conveys it to the downstream conveyor 7 and performs alignment (positioning) of the second optical member bonding body PA2. The second adsorption device 20 includes a panel holding portion 11a, an alignment camera 11b, and a rail R.

The panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction. 2 The optical member bonding body PA2 is aligned. The panel holding portion 11a adsorbs and holds the upper surface of the second optical member bonding body PA2 in contact with the stopper S by vacuum adsorption. The panel holding part 11a conveys the 2nd optical member bonding body PA2 by moving on the rail R in the state which adsorbed and held the 2nd optical member bonding body PA2. When this conveyance is completed, the panel holding part 11a releases the said adsorption holding|maintenance and transfers the 2nd optical member bonding body PA2 to the pre-roller conveyor 24.

The alignment camera 11b holds the second optical member bonding body PA2 in contact with the stopper S, and the panel holding portion 11a holds the alignment mark and the tip of the second optical member bonding body PA2 in an elevated state. The shape and the like are imaged. The imaging data by the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding part 11a is operated and the 2nd optical member bonding body to the pre-roller conveyor 24 of a conveyance destination Alignment of (PA2) is performed. That is, the 2nd optical member bonding body PA2 added the deviation in the conveyance direction with respect to the pre-roller conveyor 24, the direction orthogonal to the conveyance direction, and the turning direction around the vertical axis of the 2nd optical member bonding body PA2. It is conveyed to the pre-roller conveyor 24 in the state.

The 2nd dust collecting device 16 is arrange|positioned on the conveyance direction upstream side of the liquid crystal panel P of the clamping roll 23 which is the bonding position of the 2nd bonding device 17. The second dust collecting device 16 removes static electricity and collects dust in order to remove dust around the second optical member bonding body PA2 before being introduced into the bonding position, particularly dust on the lower surface side.

The 2nd bonding device 17 is provided on the panel conveyance downstream side than the 2nd dust collecting device 16. The 2nd bonding device 17 joins the bonding sheet F5 (corresponding to the 2nd sheet piece F2m) cut to a predetermined size with respect to the lower surface of the 2nd optical member bonding body PA2 introduced at the bonding position Do. The 2nd bonding device 17 is provided with the conveyance device 22 and the pinching roll 23 similar to the 1st bonding device 13.

In the gap between the pair of bonding rollers 23a of the clamping roll 23 (the bonding position of the 2nd bonding apparatus 17), the 2nd optical member bonding body PA2 and the 2nd sheet piece F2m are superimposed, Is introduced. The second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.

The 2nd optical member bonding body PA2 and the 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by a pair of bonding rollers 23a. In the present embodiment, a second side surface of the liquid crystal panel P (a surface opposite to the surface to which the first optical member F11 of the second optical member bonding body PA2 is bonded) is applied by the pinching roll 23. The 3rd optical member bonding body PA3 is formed by bonding the sheet piece F2m.

The 2nd detection device 42 is provided on the panel conveyance downstream side than the 2nd bonding device 17. The second detection device 42 detects the edge of the bonding surface (hereinafter referred to as the second bonding surface) between the liquid crystal panel P and the second sheet piece F2m. The edge data detected by the second detection device 42 is stored in a storage unit (not shown).

The cut position of the 2nd sheet piece F2m is adjusted based on the edge detection result of the 2nd bonding surface. The control unit 40 (see Fig. 11) acquires the edge data of the second bonding surface stored in the storage unit, and the second optical member F12 is placed outside the liquid crystal panel P (outside the second bonding surface). Determine the cut position of the second sheet piece (F2m) so that the size does not protrude. The 2nd cutting device 32 cuts the 2nd sheet piece F2m at the cut position determined by the control part 40.

The 2nd cutting device 32 is provided on the panel conveyance downstream side than the 2nd detection device 42. The 2nd cutting device 32 performs a laser cut along the edge of the 2nd bonding surface, and the 2nd sheet piece of the part protruding from the 3rd optical member bonding body PA3 to the outside of the 2nd bonding surface ( F2m) (excess portion of the second sheet piece F2m) is cut off to form an optical member (second optical member F12) having a size corresponding to the second bonding surface.

By cutting the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, the second optical member F12 is formed on the display surface side surface of the liquid crystal panel P. The fourth optical member bonding body PA4 (optical member bonding body) formed by bonding and bonding the first optical member F11 to the backlight side surface of the liquid crystal panel P is formed. The excess portion cut off from the second sheet piece F2m is peeled from the liquid crystal panel P by a peeling device (not shown) and recovered.

The 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation device 100 mentioned above. The first cutting device 31 and the second cutting device 32 cut the sheet piece FXm bonded to the liquid crystal panel P in an endless shape along the outer periphery of the bonding surface.

A bonding inspection device (not shown) is provided on the panel conveyance downstream of the second bonding device 17. The bonding inspection device is an inspection of the film-bonded work (liquid crystal panel P) by an inspection device not shown (whether the position of the optical member F1X is appropriate (whether the position shift is within the tolerance range), etc.) Inspection) is performed. The work determined that the position of the optical member F1X relative to the liquid crystal panel P is not appropriate is discharged to the outside of the system by a dispensing means (not shown).

In addition, in this embodiment, the control part 40 as an electronic control device which collectively controls each part of the film bonding system 1 is comprised including a computer system. This computer system includes an arithmetic processing unit such as a CPU, and a storage unit such as a memory or a hard disk.

The control unit 40 of this embodiment includes an interface that enables communication with an external device of the computer system. An input device capable of inputting an input signal may be connected to the control unit 40. The above-described input device includes an input device such as a keyboard and a mouse, or a communication device capable of inputting data from an external device of a computer system. The control unit 40 may include a display device such as a liquid crystal display that shows the operation state of each unit of the film bonding system 1 or may be connected to the display device.

In the storage unit of the control unit 40, an operating system (OS) for controlling a computer system is installed. In the storage unit of the control unit 40, a program that executes processing for conveying the optical sheet FX to each unit of the film bonding system 1 with high precision by controlling each unit of the film bonding system 1 to an operation processing unit Is recorded. Various types of information including a program recorded in the storage unit can be read by the operation processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that executes various processes required for control of each unit of the film bonding system 1.

The storage unit includes a semiconductor memory such as a random access memory (RAM) or a read only memory (ROM), or an external storage device such as a hard disk, a CD-ROM reading device, and a disk-type storage medium. The storage unit functionally includes a first adsorption device 11, a first dust collecting device 12, a first bonding device 13, a first detection device 41, a first cutting device 31, and a reversing device 15. ), the second adsorption device 20, the second dust collecting device 16, the second bonding device 17, the second detection device 42, the program software describing the operation control procedure of the second cutting device 32 A storage area for storing the data and various other storage areas are set.

Hereinafter, an example of a method of determining the bonding position (relative bonding position) of the sheet piece FXm to the liquid crystal panel P will be described with reference to FIGS. 18A and 18B.

First, as shown in FIG. 18A, a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the optical axis direction of the optical sheet FX is detected at each inspection point CP. The timing at which the optical axis is detected may be at the time of manufacture of the original roll R1, or may be between until the optical sheet FX is unwound from the original roll R1 and half-cut. The data in the optical axis direction of the optical sheet FX is stored in a storage device not shown in relation to the position of the optical sheet FX (the position in the length direction and the position in the width direction of the optical sheet FX).

The control unit 40 acquires the optical axis data (inspection data of the distribution in the optical axis plane) of each inspection point CP from the storage device, and the optical sheet FX of the portion where the sheet piece FXm is cut The average direction of the optical axis of the area partitioned by the incoming line CL is detected.

For example, as shown in FIG. 18B, the angle (shift angle) formed by the optical axis direction and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest angle among the deviation angles When (maximum deviation angle) is set as θmax and the smallest angle (minimum deviation angle) is set as θmin, the average value (θmid) of the maximum deviation angle (θmax) and the minimum deviation angle (θmin) (=(θmax+θmin)/ 2) is detected as the average deviation angle. Then, the direction forming the average shift angle θmid with respect to the edge line EL of the optical sheet FX is detected as the average optical axis direction of the optical sheet FX. In addition, the deviation angle is calculated, for example, by making the counterclockwise direction positive with respect to the edge line EL of the optical sheet FX and making the clockwise direction negative.

Then, the liquid crystal panel P is applied so that the average optical axis direction of the optical sheet FX detected by the above method achieves a desired angle with respect to the long or short side of the display area P4 of the liquid crystal panel P. The bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the optical axis direction of the optical member F1X is set to 90° with respect to the long or short side of the display area P4 according to the design specifications, the average of the optical sheet FX The sheet piece FXm is bonded to the liquid crystal panel P so that the typical optical axis direction is 90° with respect to the long or short side of the display area P4.

The first cutting device 31 and the second cutting device 32 described above detect the outer periphery of the display area P4 of the liquid crystal panel P with a detection means such as a camera, and are bonded to the liquid crystal panel P. The formed sheet piece (FXm) is cut into an endless shape along the outer periphery of the bonding surface. The outer periphery of the bonding surface is detected by imaging the edge of the bonding surface.

In this embodiment, laser cutting by each of the first cutting device 31 and the second cutting device 32 is performed along the outer periphery of the bonding surface.

The oscillation width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting edge. Therefore, in this embodiment, compared to the case of cutting the optical sheet FX using a cutting blade, it is possible to easily cut along the outer periphery of the bonding surface, and the size and/or display of the liquid crystal panel P The area P4 can be enlarged. This is effective for application to a high-performance mobile device requiring enlargement of a display screen while the size of a housing is limited, such as a recent smartphone or tablet terminal.

In addition, when the optical sheet FX is cut into a sheet piece that matches the display area P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerance of the sheet piece and the liquid crystal panel P , And the dimensional tolerances of the relative bonding positions of the sheet pieces and the liquid crystal panel P overlap, it becomes difficult to narrow the width of the frame portion G of the liquid crystal panel P (expansion of the display area becomes difficult).

On the other hand, a sheet piece (FXm) of the optical sheet (FX) of the size protruding from the optical sheet (FX) to the outside of the liquid crystal panel (P) is cut out, and the cut sheet piece (FXm) is bonded to the liquid crystal panel (P). In case of cutting according to the joint surface after cutting, only the tolerance of rotation of the cutting line needs to be considered, and the tolerance of the width of the frame part (G) can be reduced (±0.1mm or less). Also in this regard, the width of the frame portion G of the liquid crystal panel P can be narrowed (the display area can be enlarged).

In addition, by cutting the sheet piece FXm with a laser rather than a blade, the force at the time of cutting is not input to the liquid crystal panel P, and cracks or notches are less likely to occur in the edge of the substrate of the liquid crystal panel P. The durability against heat cycles and the like is improved. Similarly, since it is not in contact with the liquid crystal panel P, the damage to the electric component mounting portion is also small.

FIG. 19 shows, when cutting the sheet piece FXm into an optical member F1X of a predetermined size using the laser light irradiation device 100 shown in FIG. 1 as a cutting device, the laser light is cut on the sheet piece FXm. It is a figure showing a control method for scanning in a rectangular shape.

In Fig. 19, symbol Tr is a movement trajectory of a target laser light (a desired trajectory, hereinafter may be referred to as a laser light movement trajectory), and a symbol Tr1 indicates a relative movement between the table 101 and the scanner 105. It is a trajectory (hereinafter sometimes referred to as a light source movement trajectory) projected on the sheet piece FXm. The light source movement trajectory Tr1 is a shape obtained by curved four corners of the laser light movement trajectory Tr having a rectangular shape, the symbol SL1 is a straight section other than the corner portion, and the symbol SL2 is a curved section of the corner portion. Symbol Tr2 denotes a light source movement trajectory by the first irradiation position adjusting device 151 and the second irradiating position adjusting device 154 when the scanner 105 is moving relative to the light source movement trajectory Tr1. It is a curve (hereinafter referred to as an adjustment curve in some cases) indicating how far away (adjusted) in the direction orthogonal to (Tr1). The shift amount (adjustment amount) of the laser irradiation position is expressed as the distance between the adjustment curve Tr2 and the laser beam movement trace Tr in a direction orthogonal to the light source movement trace Tr1.

As shown in Fig. 19, the light source movement trajectory Tr1 is a substantially rectangular movement trajectory in which the corner portions are curved. The light source movement trajectory Tr1 and the laser light movement trajectory Tr substantially coincide, and the shapes of both are different only in a narrow area at the corner portion. When the light source movement trajectory Tr1 has a rectangular shape, the moving speed of the scanner 105 at the rectangular corner portion is slow, and the corner portion may be swollen or waved by the heat of the laser beam. For this reason, in FIG. 19, the corner part of the light source movement trajectory Tr1 is curved so that the moving speed of the scanner 105 becomes substantially constant throughout the light source movement trajectory Tr1.

When the scanner 105 is moving in the linear section SL1, the control device 107 first irradiates the irradiation position of the laser beam, since the light source movement trajectory Tr1 and the laser beam movement trajectory Tr coincide. Without adjustment by the position adjustment device 151 and the second irradiation position adjustment device 154, the sheet piece FXm is irradiated with laser light from the scanner 105 as it is. On the other hand, when the scanner 105 is moving in the bending section SL2, since the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not match, the first irradiation position adjustment device 151 and the second irradiation The position adjustment device 154 controls the irradiation position of the laser light, and the irradiation position of the laser light is arranged on the laser light movement trajectory Tr. For example, when the scanner 105 is moving the position indicated by the symbol M1, the irradiation position of the laser light by the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 is the light source movement trajectory ( It is shifted by the distance W1 in the direction N1 orthogonal to Tr1). The distance W1 is equal to the distance W2 of the adjustment curve Tr2 and the laser beam movement trace Tr in the direction N1 orthogonal to the light source movement trace Tr1. The light source movement trajectory Tr1 is arranged to be offset inside the laser beam movement trajectory Tr, but the irradiation position of the laser beam is adjusted to compensate for this deviation, the first irradiation position adjustment device 151 and the second irradiation position adjustment device ( By 154), since the light source movement trace Tr1 is shifted outward, the irradiation position of the laser light is arranged on the laser light movement trace Tr.

As described above, according to the film bonding system 1 of the present embodiment, since the first cutting device 31 and the second cutting device 32 are constituted by the above-described laser light irradiation device, the first sheet piece (F1m) and the 2nd sheet piece (F2m) can be cut sharply, and the fall of cut quality can be suppressed.

Further, by the control of the control device 107, the moving device 106 and the scanner 105 are controlled so that a desired trajectory Tr is drawn on the sheet piece FXm. In this configuration, the irradiation section of the laser beam to be adjusted by the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 is only the narrow bending section SL2. In the other wide linear section SL1, the laser light is scanned on the sheet piece FXm by the movement of the table 101 by the moving device 106. In the present embodiment, the laser beam is mainly scanned by the moving device 106, and only the area where the laser beam irradiation position cannot be controlled with the moving device 106 with high precision is the first irradiation position adjustment device 151 and the second. The irradiation position of the laser beam is adjusted by the irradiation position adjusting device 154. Therefore, compared with the case of scanning the laser beam only with the moving device 106 or only the scanner 105, the irradiation position of the laser beam can be controlled with high precision over a wide range.

In addition, the imaging direction of the imaging device 43 obliquely intersects with the normal direction of the 1st bonding surface SA1. That is, the imaging direction of the imaging device 43 is set so that the edge of the 2nd board|substrate P2 does not lead into the imaging field of view of the imaging device 43. Therefore, when detecting the edge edge ED of the first bonding surface SA1 over the first sheet piece F1m, the edge edge of the second substrate P2 is not erroneously detected, and the first bonding Only the edge ED of the surface SA1 can be detected. Accordingly, the edge ED of the first bonding surface SA1 can be detected with high precision.

Further, after bonding the first sheet piece (F1m) and the second sheet piece (F2m) of the size protruding outward of the liquid crystal panel (P) to the liquid crystal panel (P), the first sheet piece (F1m), 2 By cutting the excess part of the sheet piece F2m, the 1st optical member F11 and the 2nd optical member F12 of sizes corresponding to the bonding surface can be formed on the surface of the liquid crystal panel P. Accordingly, the first optical member F11 and the second optical member F12 can be installed with high precision to the vicinity of the bonding surface, and the outer frame portion G of the display area P4 is narrowed to enlarge the display area and Miniaturization can be achieved.

In addition, by bonding the first sheet piece (F1m) and the second sheet piece (F2m) of the size protruding to the outside of the liquid crystal panel (P) to the liquid crystal panel (P), the first sheet piece (F1m), the second Even when the optical axis directions of the first sheet piece (F1m) and the second sheet piece (F2m) change depending on the position of the sheet piece (F2m), the liquid crystal panel (P) can be aligned and bonded according to the optical axis direction. have. Thereby, the precision of the optical axis direction of the 1st optical member F11 and the 2nd optical member F12 with respect to the liquid crystal panel P can be improved, and the static and contrast of an optical display device can be improved.

In addition, by laser cutting the 1st sheet piece F1m and the 2nd sheet piece F2m by the 1st cutting device 31 and the 2nd cutting device 32, the 1st sheet piece F1m, the 2nd sheet piece Compared to the case where (F2m) is cut with a blade, the liquid crystal panel P is not subjected to force, and cracks and notches are less likely to occur, and stable durability of the liquid crystal panel P can be obtained.

In addition, in the present embodiment, as a configuration in which a target object is irradiated with a laser beam to perform predetermined processing, a configuration in which a sheet piece is cut has been described as an example, but it is not limited thereto. For example, it is assumed that, in addition to dividing the sheet piece into at least two, inserting a perforation line penetrating the sheet piece, forming a groove (cut) of a predetermined depth in the sheet piece, etc. More specifically, it is assumed that, for example, cutting (cutting out) of an end portion of a sheet piece, half-cutting, marking processing, and the like are also included.

In addition, in this embodiment, although the case where the drawing trajectory of the laser beam irradiated from the laser beam irradiation apparatus is a rectangular shape (square shape) in plan view was mentioned as an example, it is not limited to this. For example, the drawing trajectory of the laser light irradiated from the laser light irradiation apparatus may be a triangular shape when viewed in a plan view, or may be a polygonal shape of a pentagon or more when viewed in a plan view. In addition, the present invention is not limited to this, and may be a star shape when viewed in a plan view or a geometric shape when viewed in a plan view. It is possible to apply the present invention to such a drawing trajectory.

In addition, in this embodiment, after the optical sheet FX is taken out from the roll original fabric, and the sheet piece FXm of the size protruding outward of the liquid crystal panel P is bonded to the liquid crystal panel P, the sheet Although the case of cutting out from the piece FXm to the optical member F1X of a size corresponding to the bonding surface of the liquid crystal panel P was described as an example, it is not limited to this. For example, the present invention can be applied even when a sheet-shaped optical film chip cut to a size protruding outward of the liquid crystal panel P is bonded to the liquid crystal panel without using a roll fabric.

In the above, examples of preferred embodiments according to the present embodiment have been described with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to these examples. All shapes, combinations, and the like of each constituent member shown in the above-described examples are examples, and various changes can be made based on design requirements and the like without departing from the gist of the present invention.

1: Film bonding system (manufacturing apparatus of optical member bonding body)
23: pinching roll (joining device)
31: first cutting device
32: second cutting device
100: laser light irradiation device
101: table
101s: holding surface
102: laser oscillator
105: scanner
106: moving device
108: second condensing lens
141: first condensing lens
143: no aperture
145: collimated lens
P: Liquid crystal panel (optical display part)
P1: first substrate
P2: second substrate
FX: Optical sheet
FXm: sheet edition
F1X: Optical member
PA1: 1st optical member bonding body (sheet piece bonding body)
PA4: 4th optical member bonding body (optical member bonding body)
SA1: first bonding surface
ED: End border

Claims (5)

A laser oscillator that emits laser light,
A condensing lens for condensing the laser light radiated from the laser oscillator,
A diaphragm member for tightening the laser light condensed by the condensing lens,
A collimating lens that parallelizes the laser light tightened by the diaphragm member,
An acousto-optic element disposed on an optical path of the laser light between the laser oscillator and the condensing lens,
Control device for controlling timing at which the laser light passes through the acousto-optic element so that the rising portion and the falling portion of the laser beam radiated from the laser oscillator are removed
Including,
The control device,
A scanner for biaxially scanning the laser beam parallelized by the collimating lens in a plane parallel to a holding surface for holding the object, so as to draw a predetermined trajectory on the object, and the holding surface Controls a moving device that moves the scanner relative to the table having,
Controlling the moving device so that the laser light scans a straight section in the trajectory,
Controlling the scanner so that the laser light scans a curved section narrower than the linear section in the trajectory
Laser light irradiation device. The laser light irradiation apparatus according to claim 1, wherein the diaphragm member is disposed in the vicinity of a rear focal point of the condensing lens. A table having a holding surface for holding an object,
A laser oscillator that emits laser light,
A first condensing lens for condensing the laser light radiated from the laser oscillator,
An aperture member for tightening the laser light condensed by the first condensing lens,
A collimating lens that parallelizes the laser light tightened by the diaphragm member,
A scanner for biaxially scanning the laser beam parallelized by the collimating lens in a plane parallel to the holding surface,
A moving device that moves the table and the scanner relative to each other;
An acousto-optic element disposed on an optical path of the laser light between the laser oscillator and the first condensing lens,
Control device for controlling timing at which the laser light passes through the acousto-optic element so that the rising portion and the falling portion of the laser beam radiated from the laser oscillator are removed
Including,
The control device,
Controlling the moving device and the scanner to draw a predetermined trajectory on the object,
Controlling the moving device so that the laser light scans a straight section in the trajectory,
Controlling the scanner so that the laser light scans a curved section narrower than the linear section in the trajectory
Laser light irradiation device. The laser light irradiation apparatus according to claim 3, comprising a second condensing lens that condenses the laser light parallelized by the collimating lens toward the holding surface. An apparatus for manufacturing an optical member bonded body constituted by bonding an optical member to an optical display component,
A bonding device for forming a sheet piece bonded body by bonding a sheet piece of a size protruding outward of the optical display component to the optical display component,
Along the edge of the edge of the bonding surface between the optical display component and the sheet piece of the sheet piece bonding body, the sheet piece of the portion protruding from the sheet piece bonding body to the outside of the bonding surface is cut off, and on the bonding surface A cutting device for forming the optical member of a corresponding size,
The cutting device is configured by the laser light irradiation device according to any one of claims 1 to 4, and the sheet piece as an object is cut by the laser light irradiated from the laser light irradiation device. Manufacturing device.

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