CN105945422A - Ultrafast laser micro-machining system - Google Patents
Ultrafast laser micro-machining system Download PDFInfo
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- CN105945422A CN105945422A CN201610408296.XA CN201610408296A CN105945422A CN 105945422 A CN105945422 A CN 105945422A CN 201610408296 A CN201610408296 A CN 201610408296A CN 105945422 A CN105945422 A CN 105945422A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides an ultrafast laser micro-machining system. The ultrafast laser micro-machining system comprises a machine tool, a three-dimensional movement platform installed on the machine tool, a laser transmission module installed on the machine tool, a machining head module and a control system. The machine tool comprises a base and a stand column, wherein one side of the base extends upwards to form the stand column. The three-dimensional movement platform comprises a Y-axis movement platform installed on the base, an X-axis movement platform installed on the Y-axis movement platform, and a Z-axis movement platform installed on one side of the stand column and located above the X-axis movement platform. A clamp used for clamping a to-be-machined product is arranged on the X-axis movement platform. The ultrafast laser micro-machining system can conduct micro machining on various types of materials.
Description
Technical field
The application relates to field of laser processing.
Background technology
Since laser instrument comes out, people begin to carry out the research of Reciprocity of Laser & Materials, through 50
Development for many years, in order to meet different needs, various laser instrument arise at the historic moment and are widely used in industry
Processing and medical field.Optical maser wavelength covers the most infrared to extreme ultraviolet waveband, and pulse width is also reduced to several
The individual photoperiod.
Laser Processing there is lot of advantages, as noncontact procession, relatively low to environmental requirement, can process the most crisp
High with dense material and machining accuracy, enjoy favor in industrial processes field.Continuously and Long Pulse LASER master
Relying on the high temperature focusing on generation to carry out ablator, thermal diffusion scope is big, and machining accuracy is limited；Quasi-molecule arteries and veins
Impulse light can realize the Precision Machining of micron order yardstick with its shorter wavelength and pulse width, but it needs
Use corrosive gas, and Ultra-Violet Laser is opaque to most of materials, thus be restricted on using.
Currently, the fast development of micro-fabrication technology proposes challenge to processing yardstick and precision needs to process essence
Degree extends to submicron even nanometer scale, and realizes 3 D stereo micro Process truly.Utilize
Ultrafast laser micro-processing technology is expected to all difficulties overcoming above-mentioned conventional laser process technology to be faced, and it can
To break through the restriction brought to machining accuracy in optics micro-processing method due to diffraction limit, and have the ability directly
Real three-dimensional microstructures is processed inside transparent material.
Summary of the invention
In consideration of it, be necessary to provide one can close at metal, semi-conducting material, transparent hard brittle material, high temperature
The ultrafast laser microfabrication system of retrofit is carried out on metal working part.
For solving above-mentioned technical problem, this application provides a kind of ultrafast laser microfabrication system, including machine
Bed, control system, the three-dimensional mobile platform being installed on described lathe, the laser that is installed on described lathe
Transmission module and the processing head module that is installed in described three-dimensional mobile platform, described lathe include base,
And the column of formation is upwardly extended from described base side, described three-dimensional mobile platform includes being installed on the described end
Y-axis mobile platform on seat, the X-axis mobile platform being installed on described Y-axis mobile platform and installation
Being positioned at the Z axis mobile platform above described X-axis mobile platform in described column side, described X-axis moves
Platform is provided with the fixture for clamping processed product.
Preferably, described base is provided with Y-axis guide rail, and described Y-axis mobile platform slides on described Y-axis
On guide rail；Described Y-axis mobile platform is provided with X-axis guide rail, and described X-axis mobile platform slides on described
On X-axis guide rail；What described column was positioned at described X-axis mobile platform side is arranged over Z axis guide rail, described
Z axis mobile platform slides on described Z axis guide rail.
Preferably, described lathe also include the support being located on described column and be located at described column upper end and
It is positioned at the gripper shoe above described three-dimensional mobile platform.
Preferably, described Z axis guide rail between described gripper shoe and described X-axis mobile platform, described Z
Axle mobile platform moves between described gripper shoe and described X-axis mobile platform along described Z axis guide rail.
Preferably, on the support that described Laser Transmission module is installed on described column and gripper shoe.
Preferably, described Laser Transmission module includes ultrafast laser, beam expander, polarization device, light
Bundle Shaping Module and optical processing module, the ultra-short pulse laser bundle of described ultrafast laser output enters described
After beam expander, described beam expander by ultra-short pulse laser bundle process after transmit to polarization device, described partially
Line polarized light is converted into circularly polarized light by the reforming unit that shakes, at described circularly polarized light conduction to light beam shaping module
Conduct after reason to learning processing module processing workpiece described in light.
Preferably, described Laser Transmission module includes ultrafast laser, beam expander, polarization device, light
Bundle Shaping Module, beam splitter and optical processing module, described optical processing module include rotary-cut optics module,
At least one in scanning galvanometer module, multi-beam parallel processing module, surpassing of described ultrafast laser output
Short pulse laser beam enters after described beam expander, described beam expander transmit after ultra-short pulse laser bundle is processed to
Polarization device, line polarized light is converted into conduction extremely described light after circularly polarized light by described polarization device
Bundle Shaping Module, described circularly polarized light laser beam after described light beam shaping module will process exports to institute
Stating beam splitter, laser beam is divided into two-way output to enter product to two optical processing modules by described beam splitter
Row processing.
Preferably, described Laser Transmission module also includes that some reflecting mirrors and focus lamp, described reflecting mirror are used for
Changing the conduction orientation of light beam, described focus lamp is installed under described rotary-cut optics module, and described focus lamp is used
In laser beam is converged as high-energy-density hot spot.
Preferably, the less laser beam of laser instrument is exported by described beam expander diameter is by two groups of optics units
Part, expands to the laser beam being relatively large in diameter, it is achieved amplifies beam diameter, reduce beam divergence angle, reduction merit
Rate density, to protect optical element, reduces focal beam spot diameter, the purpose of raising machining accuracy.
Preferably, the linear distributing laser beam of wave that laser instrument is exported by described polarization device
It is converted into that wave is rounded or the laser beam of elliptic systems.
The super block laser assisted microprocessing system of the application is by by integrated to three-dimensional mobile platform, Laser Transmission module
On lathe, system is made to have more preferable integrated performance, can be at solid material (semi-conducting material, glass material
Material, metal material ceramic material, polymeric material, nonmetallic materials etc.) and fluent material (gel, gold
Belong to deionized water solution, the organic solution such as optical resin) etc. carry out on the plane of multiple material, inclined-plane, curved surface
Straight hole, inclined hole, shoulder hole, tapered hole, irregularly-shaped hole, micro-nano structure, the preparation on bionics surface, micro-company
The micro Process such as connect, possess the multiple processing merit such as boring, special-shaped cutting, blind slot scanning, lithography, splicing
Energy.Can be widely applied in the fields such as quasiconductor, electronics, automobile, medical treatment, Aeronautics and Astronautics all kinds of zero
The fine manufacture of part, the feature serious relative to the thermal diffusion of conventional laser processing, have irreplaceable excellent
Gesture.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing further understanding of the present application, constitutes of the application
Point, the schematic description and description of the application is used for explaining the application, is not intended that to the application not
Work as restriction.In the accompanying drawings:
Fig. 1 is the axonometric chart of the application ultrafast laser microfabrication system；
Fig. 2 is the optic path module schematic diagram of the application ultrafast laser microfabrication system；
Fig. 3 is the flow process chart of the application ultrafast laser microfabrication system.
Detailed description of the invention
For making the purpose of the application, technical scheme and advantage clearer, specifically real below in conjunction with the application
Execute example and technical scheme is clearly and completely described by corresponding accompanying drawing.Obviously, described
Embodiment is only some embodiments of the present application rather than whole embodiments.Based on the enforcement in the application
Example, the every other enforcement that those of ordinary skill in the art are obtained under not making creative work premise
Example, broadly falls into the scope of the application protection.
Below in conjunction with accompanying drawing, describe the technical scheme that each embodiment of the application provides in detail.
Referring to shown in Fig. 1, the application ultrafast laser microfabrication system includes lathe 100, is installed on institute
State the three-dimensional mobile platform 200 on lathe 100, the Laser Transmission module 300 being installed on described lathe 100,
And it is installed on the processing head module 400 in described three-dimensional mobile platform 200 and control system (not shown).
Described lathe 100 includes column 101, extends vertical described column from described column 101 1 side bottom
101 extend formed base 102, be located at the support 103 of described column 101 opposite side and be located at described vertical
Post 101 top and be positioned at the gripper shoe 104 above described base 102.
Described three-dimensional mobile platform 200 includes the Y-axis guide rail being located on the base 102 of described lathe 100
201, can on described Y-axis guide rail 201 the Y-axis mobile platform 202 of movement, be located at described Y-axis and move
The X-axis guide rail 203 of platform 202 upper surface, the X-axis of movement can move on described X-axis guide rail 203
Platform 204, the Z axis guide rail 205 being located on described column 101 and can be on described Z axis guide rail 205
The Z axis mobile platform 206 of movement.Described Z axis guide rail 205 is positioned at the side of described column 101 and is positioned at
Between described gripper shoe 104 and described X-axis mobile platform 204, described Z axis mobile platform 206 is along institute
State Z axis guide rail 205 to move between described gripper shoe 104 and described X-axis mobile platform 204.
Described X-axis mobile platform 204, as processing platform, which is provided with the folder for clamping processed product
Tool 207.Make the range of work can be in the three dimensions in given area by described three-dimensional mobile platform 200
It is adjusted optimizing.
The position of described support 103 is not limited to the outside of described column 101, it is also possible to be positioned at described column 101
Top.
In one embodiment, the base 102 of described lathe 100 installs rotating mechanism additional so that described product to be processed
Product rotate the system that the promotes range of work to product about the z axis.
Described three-dimensional mobile platform 200 has the highest positioning precision and repetitive positioning accuracy, can pass through straight line
Motor and ball-screw drive, and for improving positioning precision, are furnished with grating scale if desired in order to detection and localization and tune
Whole reference.Three-dimensional mobile platform 200 has the highest translational speed, can press desired trajectory and drive workpiece motion s,
Realize the most mobile of workpiece and location.
Further referring to shown in Fig. 2, described Laser Transmission module 300 is installed on propping up of described lathe 100
On frame 103 and gripper shoe 104.Described Laser Transmission module 300 includes ultrafast laser 301, beam expander
302, polarization device 303, reflecting mirror 304,305,308,311, light beam shaping module 306, point
Light device 307, rotary-cut optics module 309, scanning galvanometer module 312, focus lamp 310.Described Laser Transmission
The operation principle of module 300 is as follows: the ultra-short pulse laser bundle (femtosecond of described ultrafast laser 301 output
Laser) enter described beam expander 302 after, described beam expander 302 by ultra-short pulse laser bundle process after transmit
To polarization device 303, line polarized light being converted into circularly polarized light, circularly polarized light is via reflecting mirror 304,305
Reflection after conduct to light beam shaping module 306 be processed into meet particular spatial distribution require after export to light splitting
Device 307, laser beam is divided into two-way to export by described beam splitter 307, and a road laser beam is via reflecting mirror 308
Conduct to being that high-energy-density hot spot pivots reality through being converged by focus lamp 310 after rotary-cut optics module 309
The scanning machinings such as now boring；Another road laser beam via reflecting mirror 311 conduct to scanning galvanometer module 312 with
Carry out X-Y scheme scanning machining.
In one embodiment, described rotary-cut optics module 309, scanning galvanometer module 312 add for different optics
Work module, can be replaced by other processing module, it is also possible to optionally one of them, if only existing a light
When learning processing module, described beam splitter 307 is then no longer necessary to.
Described processing head module 400 is installed on the outside of described Z axis mobile platform 206, described processing head mould
Group 400 is for installing the optical processing module of described Laser Transmission module 300, described processing head module 400
Add including rotary-cut optics module 309, the multi-beam parallel of being located at described rotary-cut optics module 309 side parallel
Work module 313 and scanning galvanometer module 312 and be located at the focus lamp below described rotary-cut optics module 309
310.Described focus lamp 310 for the laser beam being relatively large in diameter that laser instrument exports is converted into diameter the least,
The laser spots that energy density is the highest.Described focus lamp 310 can divide monolithic or multiple-piece focus lamp, f-theta field
Mirror, diffraction optics focus lamp etc..Described processing head module 400 can also increase other processing module, and
Be not limited to rotary-cut optics module 309, multi-beam parallel processing module 313 and scanning galvanometer module 312 this three
Kind.
Described control system is for making the types of functionality assembly in laser-processing system suitable according to specific logic
Sequence, response speed, by a series of relevant action, the method realizing specific objective.At ultrafast laser
In system of processing, control system can carry out each functional parameter of ultrafast laser and carry out comprehensive and independent control,
Such as the start and stop of laser instrument, delay, power, repetition rate etc..Processing head module 400 is carried out by control system
Control, such as scanning start and stop, scanning speed, sweep limits, scan data, scan position etc. comprehensively.Control
Three-dimensional mobile platform 200 is controlled by system comprehensively, as motion start and stop, movement velocity, target location,
Sequence of motion etc..
Described beam expander 302 is first by two groups of optics for the laser beam that the diameter by laser instrument output is less
Part, expands to the laser beam being relatively large in diameter, be realised in that amplification beam diameter, reduce beam divergence angle,
Reduce power density protect optical element, reduce focal beam spot diameter (reduction diffracting effect), raising add
The purpose of work precision.
Described ultrafast laser 301 provides energy source, it is possible to continual and steady generation ultra-short pulse laser,
The pulse width (pulse duration) of this ultrashort pulse is less than 10 psecs；This laser has outstanding light
Beam quality, its beam quality factor M2 is less than 1.3；The output of described ultrafast laser 301 is permissible
Carry out the regulation in the range of maximum nominal power.Described ultrafast laser 301 exports the laser of a kind of wavelength (again
Claim fundamental frequency light), join or during built-in frequency multiplication module in increasing, fundamental frequency light wavelength 1/2,1/3 or 1/4 can be exported
The laser of wavelength, it is possible to simultaneously export the laser of above-mentioned several wavelength.
Described reflecting mirror 304,305,308,311 is for changing the direction of propagation of laser beam, so that laser
Bundle can be transmitted according to specific path, depending on its quantity and position can be according to light path layouts.
Described beam splitter 307 is mainly used at the laser comprising at least two wavelength, or at least two processing
The situation of head, its Main Function is to be combined into by the laser beam of different wave length (general different outgoing positions are different)
One tunnel transmission, Huo Jiang mono-road laser is divided into multiple-channel output, so that laser beam conduction is to different processing heads.
Described polarization device 303 is to be turned by the linear distributing laser beam of wave that laser instrument exports
Turn to that wave is rounded or a kind of device of the laser beam of elliptic systems.
Described light beam shaping module 306 is can to adjust the spatial distribution of laser intensity according to specific requirement
The device of system.
The optical element of above-mentioned each module is respectively provided with the highest damage threshold (bearing power or energy density),
The material of optical element uses the material that pulse width broadening is minimum, such as fused quartz etc., at actual light path system
In, one or more above-mentioned modules can be chosen according to particular demands, it can root in installation site and sequence
Determine according to concrete demand.If desired, optic path module needs to do sealing protection process, also known as light path
Protection, the main purpose of protection is that the superlaser spilling preventing laser beam from producing causes damage to external world, with
And prevent the dust outside this module, greasy dirt etc. from polluting optic path environment.
The application also includes auxiliary processing module (not shown), and described auxiliary processing module is used for auxiliary laser
The course of processing and result, be the combination of the particular module with complete function.Described auxiliary processing module includes:
Auxiliary inflatable device, blows in workpiece process to be added, is divided into coaxial air blowing and paraxonic
Blowing, the valve of the metal material of coaxial " loudspeaker " shape bottom perforate of blowing completes, paraxonic blow by
One or more stingy mouths have combined, and blowing action typically enables in the course of processing, and the composition of gas can
For compressed air, nitrogen and oxygen etc., play slagging-off, protection, the effect such as combustion-supporting, one can be selected according to demand
Plant or multiple gases is blown simultaneously.If desired, the built-in air pressure of system, flow control system, it is achieved pressure is certainly
Dynamicization regulates.
Dust arrester, discharges processing district with the dust that will produce in the course of processing, granule etc..
Z-direction range unit, is installed on described Z axis mobile platform 206, by laser range sensor etc.
Mode, in order to the distance accurately measured and control between processing head module and workpiece to be added.
Paraxonic image detection device, adds Chinese musical scale by the camera installed on non-laser transmission path to workpiece
Very little, processing effect, Working position measure, and can realize the second positioning of workpiece.
Coaxial image monitoring device, by installing spectroscope, by the course of processing and adding on laser emission path
The state of the workpiece after work stopping is exported, in order to realize workpiece process with the form of image by camera
Feature observation and the purpose of processing result preliminary surveying.
Terminal monitoring device, (by being arranged on position sensor below processing head module or has power and declines
Subtract the imageing sensor of function) receive laser facula, in order to realize the device of laser spot test and location.
Optical parameter supervising device, by the optical element being arranged in laser delivery optics, to the power of laser,
The device that the position of laser beam, inclination etc. are monitored and correct.
Illuminator, is used for processing floor light, working area illumination.
The operation principle of the application ultrafast laser microfabrication system is as follows: described ultrafast laser 301 is defeated
The ultra-short pulse laser gone out via Laser Transmission module 300, complete shaping, expand, polarization state conversion etc.
Conducting after reason to processing head module 400, described processing head module 400 carries out High-speed Control to laser beam, complete
Become accurate scan, by focus lamp 310 by the focus Voice segment of ultra high energy density on workpiece, described
Processing head module 400 can control laser focal spot and remove material according to specific track and speed, whole during
The concrete function parameter of each parts is carried out, according to given technological parameter, the collaborative control that links by described control system
System.When effect laser pulse width, spot separation, spot diameter, light spot energy intensity and material damage threshold
When value meets certain relation, thermal diffusion region is minimum, can realize the processing of " without heat effect ".
Refer to shown in Fig. 3, will introduce the processing method of the ultrafast laser microfabrication system of the application:
S101, ultrafast laser microfabrication System self-test.
This step includes ultrafast laser 301 self-inspection, such as state, shutter, temperature, electric current, power, weight
Complex frequency etc.；Three-dimensional mobile platform 200 self-inspection, such as state, back to zero etc.；Processing head module 400 self-inspection,
Such as state, initial position, temperature etc.；Auxiliary processing module self-inspection.
S102, laser facula coordinate setting.
This step refers to move under focus lamp the terminal monitoring device being arranged in three-dimensional mobile platform 200
Side, opens laser instrument, obtains laser point coordinates, export coordinate to control system in terminal monitoring module.
S103, workpiece coordinate position.
Being arranged on fixture by workpiece, move to below described Z-direction range unit, Z-direction range unit is to workpiece
Machined surface is measured, and obtains coordinate information, exports to control system after being converted into system coordinate information.
S104, Working position position.
Working position information is inputted described control system, and described control system is according to the machining position confidence of input
Breath and workpiece coordinate location information calculate Working position information, and assign instruction to described three-dimensional mobile platform
Workpiece is moved to Working position, prepares processing.
After S105, machined parameters confirm, processing starts.
Described control system requires to choose to add technological parameter according to workpiece material, the range of work etc., and by technique
Parameter passes to participate in each module of processing, after each module is ready to complete, starts processing.
The monitoring of S106, the course of processing and judgement.
After processing starts, machining state is monitored by system, and machining state is fed back to control system enters
Row judge: if it is determined that process qualified after, complete processing, by described three-dimensional mobile platform 200；If it is determined that add
Work is defective, then jump to step S104 and continue processing, until processing is qualified or processing is scrapped.
Those skilled in the art are it should be appreciated that embodiments of the invention can be provided as method, system or meter
Calculation machine program product.Therefore, the present invention can use complete hardware embodiment, complete software implementation or knot
The form of the embodiment in terms of conjunction software and hardware.And, the present invention can use and wherein wrap one or more
Computer-usable storage medium containing computer usable program code (include but not limited to disk memory,
CD-ROM, optical memory etc.) form of the upper computer program implemented.
Also, it should be noted term " includes ", " comprising " or its any other variant are intended to non-row
Comprising, so that include that the process of a series of key element, method, commodity or equipment not only include of his property
Those key elements, but also include other key elements being not expressly set out, or also include for this process,
The key element that method, commodity or equipment are intrinsic.In the case of there is no more restriction, statement " include
One ... " key element that limits, it is not excluded that including the process of described key element, method, commodity or setting
Other identical element is there is also in Bei.
The foregoing is only embodiments herein, be not limited to the application.For this area skill
For art personnel, the application can have various modifications and variations.All institutes within spirit herein and principle
Any modification, equivalent substitution and improvement etc. made, within the scope of should be included in claims hereof.
Claims (10)
1. a ultrafast laser microfabrication system, it is characterised in that include lathe, control system, peace
The Laser Transmission module be loaded on the three-dimensional mobile platform on described lathe, being installed on described lathe and installation
Processing head module in described three-dimensional mobile platform, described lathe includes base and from described base side
Upwardly extending the column of formation, it is flat that described three-dimensional mobile platform includes that the Y-axis being installed on described base moves
Platform, the X-axis mobile platform being installed on described Y-axis mobile platform and be installed on position, described column side
Z axis mobile platform above described X-axis mobile platform, described X-axis mobile platform is provided with for filling
The fixture of folder processed product.
2. ultrafast laser microfabrication system as claimed in claim 1, it is characterised in that described base
Being provided with Y-axis guide rail, described Y-axis mobile platform slides on described Y-axis guide rail；Described Y-axis moves
Platform is provided with X-axis guide rail, and described X-axis mobile platform slides on described X-axis guide rail；Described column
Be positioned at described X-axis mobile platform side is arranged over Z axis guide rail, and described Z axis mobile platform slides on
On described Z axis guide rail.
3. ultrafast laser microfabrication system as claimed in claim 2, it is characterised in that described lathe
Also include the support being located on described column and be located at described column upper end and be positioned at described three-dimensional mobile platform
The gripper shoe of top.
4. ultrafast laser microfabrication system as claimed in claim 3, it is characterised in that described Z axis
Guide rail is between described gripper shoe and described X-axis mobile platform, and described Z axis mobile platform is along described Z
Axis rail moves between described gripper shoe and described X-axis mobile platform.
5. ultrafast laser microfabrication system as claimed in claim 3, it is characterised in that described laser
The transmission support that is installed on described column of module with in gripper shoe.
6. ultrafast laser microfabrication system as claimed in claim 1, it is characterised in that described laser
Transmission module includes ultrafast laser, beam expander, polarization device, light beam shaping module and optical manufacturing
Module, after the ultra-short pulse laser bundle of described ultrafast laser output enters described beam expander, described beam expander
Transmitting to polarization device after being processed by ultra-short pulse laser bundle, described polarization device is by line polarized light
Being converted into circularly polarized light, the conduction of described circularly polarized light is conducted after processing to light beam shaping module to learning described in light and is added
Work module processing workpiece.
7. ultrafast laser microfabrication system as claimed in claim 1, it is characterised in that described laser
Transmission module include ultrafast laser, beam expander, polarization device, light beam shaping module, beam splitter and
Optical processing module, described optical processing module includes rotary-cut optics module, scanning galvanometer module, multiple beam
At least one in parallel fabrication module, the ultra-short pulse laser bundle of described ultrafast laser output enters described
After beam expander, described beam expander by ultra-short pulse laser bundle process after transmit to polarization device, described partially
Line polarized light is converted into conduction extremely described light beam shaping module after circularly polarized light by the reforming unit that shakes, and described circle is inclined
Shake light laser beam output after described light beam shaping module will process to described beam splitter, described beam splitter
Laser beam is divided into two-way output be processed product to two optical processing modules.
Ultrafast laser microfabrication system the most as claimed in claims 6 or 7, it is characterised in that described
Laser Transmission module also includes some reflecting mirrors and focus lamp, and described reflecting mirror is for changing the conduction side of light beam
To, described focus lamp is installed under described rotary-cut optics module, and described focus lamp for being converged by laser beam is
High-energy-density hot spot.
Ultrafast laser microfabrication system the most as claimed in claims 6 or 7, it is characterised in that described
The less laser beam of diameter that laser instrument is exported by beam expander, by two groups of optical elements, expands to be relatively large in diameter
Laser beam, it is achieved amplify beam diameter, reduce beam divergence angle, reduce power density with protection optics unit
Part, reduces focal beam spot diameter, the purpose of raising machining accuracy.
Ultrafast laser microfabrication system the most as claimed in claims 6 or 7, it is characterised in that described
The linear distributing laser-beam transformation of wave that laser instrument is exported by polarization device is wave
Rounded or the laser beam of elliptic systems.
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| CN111390556A (en) * | 2020-05-07 | 2020-07-10 | 岭南师范学院 | Multifunctional micro machining tool |
| CN111958107A (en) * | 2020-06-30 | 2020-11-20 | 北京航天控制仪器研究所 | Laser fine processing equipment |
| CN112935594A (en) * | 2021-04-08 | 2021-06-11 | 无锡科技职业学院 | Novel superfine hole laser drilling system and process |
| CN113319424B (en) * | 2021-05-31 | 2022-07-08 | 中国科学院西安光学精密机械研究所 | Three-dimensional shape accurate control processing system and processing method |
| CN113319424A (en) * | 2021-05-31 | 2021-08-31 | 中国科学院西安光学精密机械研究所 | Three-dimensional shape accurate control processing system and processing method |
| CN113828927A (en) * | 2021-09-27 | 2021-12-24 | 浙江师范大学 | Processing device and processing method for micro-nano structure on surface of solar thin film battery |
| CN114248017A (en) * | 2021-12-30 | 2022-03-29 | 深圳市易安锐智能装备有限责任公司 | Double-vision positioning double-laser cloth cutting device and cloth cutting method thereof |
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