CN110871322A - Double-laser-beam drilling system - Google Patents
Double-laser-beam drilling system Download PDFInfo
- Publication number
- CN110871322A CN110871322A CN201811012875.8A CN201811012875A CN110871322A CN 110871322 A CN110871322 A CN 110871322A CN 201811012875 A CN201811012875 A CN 201811012875A CN 110871322 A CN110871322 A CN 110871322A
- Authority
- CN
- China
- Prior art keywords
- laser
- laser beam
- processing module
- plano
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Abstract
The invention provides a double-laser beam drilling system, which comprises: the device comprises a laser, a light splitting assembly, a first processing module and a second processing module; the laser is used for emitting laser beams; the light splitting component comprises a light beam shaping unit and a light splitter which are sequentially arranged along the direction of a light path; the beam shaping unit changes the laser beam emitted by the laser into a flat-topped laser beam so as to enable the cross-section energy density distribution of the laser beam to be uniform; the beam splitter divides the flat-topped laser beam into two laser beams with equal energy, and the two laser beams are respectively used as laser sources of the first processing module and the second processing module; and the laser beams of the first processing module and the second processing module respectively act on a processed workpiece for laser drilling processing. According to the technical scheme, the two laser beams are simultaneously applied to laser drilling processing, the laser drilling processing efficiency is improved, the consistency of the two laser beams is ensured, and the laser drilling quality is high in uniformity and good in quality.
Description
Technical Field
The invention relates to the technical field of laser processing equipment, in particular to a double-laser-beam drilling processing system.
Background
Miniaturization and high-density packaging of electronic products have required high-density multi-level packaging of Printed Circuit Boards (PCBs). With this trend, it is necessary to drill more blind or through holes with small hole diameter and small pitch on a Printed Circuit Board (PCB).
Disclosure of Invention
In view of this, the present invention provides a dual laser beam drilling system, which aims to improve the working efficiency of drilling and ensure the quality of drilling so as to meet the requirements of the drilling process.
The technical scheme adopted by the invention is as follows: a dual laser beam drilling system comprising: the device comprises a laser, a light splitting assembly, a first processing module and a second processing module;
the laser is used for emitting laser beams;
the light splitting component comprises a light beam shaping unit and a light splitter which are sequentially arranged along the direction of a light path;
the beam shaping unit changes the laser beam emitted by the laser into a flat-topped laser beam so as to enable the cross-section energy density distribution of the laser beam to be uniform;
the beam splitter divides the flat-topped laser beam into two laser beams with equal energy, and the two laser beams are respectively used as laser sources of the first processing module and the second processing module;
and the laser beams of the first processing module and the second processing module respectively act on a processed workpiece for laser drilling processing.
Furthermore, the beam shaping unit comprises a plano-concave lens and a first plano-convex lens which are sequentially arranged along the direction of the light path; the plane of the plano-concave lens and the plane of the first plano-convex lens are arranged in a deviating mode, and the concave surface of the plano-concave lens and the convex surface of the first plano-convex lens are arranged in an opposite mode.
Furthermore, the beam splitting assembly further comprises a beam expanding and collimating unit and a diaphragm which are sequentially arranged along the direction of the light path;
the beam expanding and collimating unit is used for expanding and collimating the flat-topped laser beam emitted from the beam shaping unit and comprises a second plano-convex lens and a third plano-convex lens which are sequentially arranged along the direction of a light path; the convex surface of the second plano-convex lens is arranged opposite to the convex surface of the third plano-convex lens, and the plane of the second plano-convex lens is arranged opposite to the plane of the third plano-convex lens;
the diaphragm is provided with a diaphragm hole and used for limiting the diameter of the laser beam emitted from the beam expanding and collimating unit and enabling the emitted laser beam to be incident to the light splitter.
Further, the distance between the second plano-convex lens and the third plano-convex lens is adjustable.
Further, the double-laser beam drilling system also comprises a controller; the laser, the first processing module and the second processing module are respectively connected with the controller, and the working states of the laser, the first processing module and the second processing module are controlled by the controller;
the first processing module comprises a first galvanometer scanning unit, a first processing platform and a first positioning unit; the first processing platform is movably arranged and used for fixedly placing a processed workpiece; the first positioning unit is used for acquiring the position of a processed workpiece on the first processing platform and feeding the position back to the controller, and the controller controls the first galvanometer scanning unit to perform laser drilling processing on the processed workpiece according to the position of the processed workpiece;
the second processing module comprises a second galvanometer scanning unit, a second processing platform and a second positioning unit; the second processing platform is movably arranged and used for fixedly placing a processed workpiece; the second positioning unit is used for acquiring the position of a workpiece to be machined on the second machining platform and feeding the position back to the controller, and the controller controls the second galvanometer scanning unit to perform laser drilling machining on the workpiece to be machined according to the position of the workpiece to be machined.
Further, the first galvanometer scanning unit moves along an X axis and a Y axis for scanning and processing, and the first processing platform can move along the X axis and the Y axis;
the second galvanometer scanning unit moves along the X axis and the Y axis for scanning and processing, and the second processing platform can move along the X axis and the Y axis.
Further, the first processing module further comprises a first position detector; the first position detector is used for detecting the position movement amount of the first processing platform and feeding back the position movement amount to the controller;
the second processing module further comprises a second position detector; the second position detector is used for detecting the position movement amount of the second processing platform and feeding back the position movement amount to the controller.
Further, the double-laser-beam drilling system also comprises a dust removal module; the dust removal module is used for removing dust generated in the laser drilling process in time.
Further, the first positioning unit comprises a CCD camera, a coaxial light source and an annular light source; the CCD camera is used for acquiring the position of a processed workpiece on the first processing platform and feeding back the position to the controller, and the coaxial light source and the annular light source provide light sources for the CCD camera so as to identify the position of the processed workpiece;
the second positioning unit comprises a CCD camera, a coaxial light source and an annular light source; the CCD camera is used for acquiring the position of the workpiece to be machined on the second machining platform and feeding back the position to the controller, and the coaxial light source and the annular light source provide light sources for the CCD camera so as to be capable of identifying the position of the workpiece to be machined.
Furthermore, the first galvanometer scanning unit comprises a focusing mirror, and the focusing mirror is used for focusing the laser beam of the first galvanometer scanning unit and applying a focusing point on a processed workpiece; the second galvanometer scanning unit comprises a focusing mirror and is used for focusing the laser beam of the second galvanometer scanning unit and applying a focusing point on a processed workpiece.
In the technical scheme of the invention, the laser beam emitted by the laser is changed into the flat-top laser beam through the beam shaping unit so as to enable the energy density of the laser beam to be uniformly distributed, and the flat-top laser beam is divided into two laser beams with equal energy which are used for respectively acting on a workpiece to be processed to realize laser drilling processing. The two laser beams are simultaneously applied to laser drilling processing, on one hand, the laser drilling processing efficiency is improved, and on the other hand, the energy density distribution of the two laser beams is uniform and the energy is equal, so that the consistency of the two laser beams is ensured, the uniformity of the laser drilling quality is strong, and the quality is good.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the structures shown in the drawings without inventive labor.
FIG. 1 is a schematic structural diagram of a dual laser beam drilling system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a beam shaping unit according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a beam expanding and collimating unit and a diaphragm according to an embodiment of the present invention.
Wherein the main reference signs illustrate:
| |
Light splitting assembly 20 | |
| Plano- |
First plano- |
Expanded |
| Second plano- |
The third plano- |
|
| |
Optical |
|
| First |
Second |
Focusing |
| |
|
|
| |
|
|
| |
|
|
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. If there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.
Referring to fig. 1-3, an embodiment of the invention provides a dual laser beam drilling system, as shown in fig. 1, including a laser 10, a light splitting assembly 20, a first processing module and a second processing module, where the first processing module includes a first galvanometer scanning unit 31, a first processing platform 61 and a first positioning unit 51, and the second processing module includes a second galvanometer scanning unit 32, a second processing platform 62 and a second positioning unit 52.
The laser 10 is used to emit a laser beam that acts on a work piece 70 to perform laser drilling processing. Optionally, the laser 10 is a carbon dioxide laser emitting a laser beam with a wavelength belonging to the infrared band, preferably with a wavelength of 9.2 μm, 9.4 μm or 10.6 μm.
In this embodiment, as shown in fig. 1 to 3, the light splitting assembly 20 includes a beam shaping unit 21, a beam expanding and collimating unit 22, a diaphragm 223, and a light splitter 23, which are sequentially arranged along the optical path direction.
Referring to fig. 1 and 2, the beam shaping unit 21 changes the laser beam a emitted from the laser 10 into a flat-topped laser beam b to make the cross-sectional energy density distribution of the laser beam uniform.
Optionally, the beam shaping unit 21 includes a plano-concave lens 211 and a first plano-convex lens 212 (fig. 2) sequentially arranged along the optical path direction. The plane of the plano-concave lens 211 and the plane of the first plano-convex lens 212 are arranged in a deviating manner, and the concave surface of the plano-concave lens 211 and the convex surface of the first plano-convex lens 212 are arranged in an opposite manner. The beam shaping unit 21 formed by combining the plano-concave lens 211 and the first plano-convex lens 212 has a simple structure, is easy to regulate and control laser beams, and is easy to implement.
Referring to fig. 1 and 3, the beam expanding and collimating unit 22 expands and collimates the flat-topped laser beam b emitted from the beam shaping unit 21, and includes a second plano-convex lens 221 and a third plano-convex lens 222 sequentially arranged along the optical path direction. The convex surface of the second plano-convex lens 221 and the convex surface of the third plano-convex lens 222 are disposed away from each other, and the plane of the second plano-convex lens 221 and the plane of the third plano-convex lens 222 are disposed opposite to each other. Optionally, the distance between the second plano-convex lens 221 and the third plano-convex lens 222 is adjustable.
In this embodiment, the beam expanding and collimating unit 22 uses the second plano-convex lens 221 and the third plano-convex lens 222 to cooperate with each other, so as to implement beam expanding and collimating of the laser beam. In particular, the second plano-convex lens 221 and the third plano-convex lens 222 are adjustably arranged, and when the distance between the second plano-convex lens 221 and the third plano-convex lens 222 is shortened, the diameter of the laser beam emitted from the third plano-convex lens 222 becomes smaller; when the distance between the second plano-convex lens 221 and the third plano-convex lens 222 increases, the diameter of the laser beam emitted from the third plano-convex lens 222 increases, and beam expansion and collimation of the laser beam are realized.
Referring to fig. 3, the diaphragm 223 has a diaphragm hole for limiting the diameter of the laser beam emitted from the beam expanding and collimating unit 22 and making the emitted laser beam c incident on the beam splitter 23. Optionally, the iris 223 has a plurality of iris holes with different sizes. In the specific operation process, an operator can select diaphragm holes with different apertures according to the requirement so as to obtain a laser beam c with a certain diameter. Further, the diaphragm 223 includes a rotary light screen, and the rotary light screen has various diaphragm holes with different sizes, and the various diaphragm holes are circumferentially disposed on the rotary light screen. In a specific operation process, the rotary light screen is rotated, so that different diaphragm holes are arranged on a laser beam light path, and the diameter of a laser beam can be limited.
The beam splitter 23 splits the flat-topped laser beam into two laser beams having equal energy, and the two laser beams are respectively used as laser sources of the first processing module and the second processing module. Specifically, the laser beam c is incident on the beam splitter 23, and the beam splitter 23 splits the laser beam c into two branched laser beams with equal energy, namely, a branched laser beam d and a branched laser beam e. In this embodiment, optionally, the beam splitter 23 is a beam splitter.
The branched laser beam d and the branched laser beam e are respectively incident to the first processing module and the second processing module through a plane mirror 25 to be used as laser sources for a laser drilling process. The laser beams of the first processing module and the second processing module respectively act on the processed workpiece 70 to realize laser drilling processing.
Each functional unit module is used for changing the attribute of the laser beam so as to obtain better laser drilling effect. In the optical path system, the positions of the functional unit modules may be changed according to specific situations, for example, in another embodiment, the beam expanding and collimating unit 22, the beam shaping unit 21, the diaphragm 223, and the beam splitter 23 are sequentially arranged along the optical path direction.
Of course, it should be understood by those skilled in the art that the dual laser beam drilling system further includes an optical path transmission unit 24. Specifically, in the present embodiment, the optical path transmission unit 24 is an optical fiber, and the optical fiber can transmit the laser beam emitted from the laser 10 and make the laser beam incident on the beam shaping unit 21, so that the transmission of the laser beam can be realized. Further, in the optical path system, the optical path transmission unit 24 is further configured to transmit the branched laser beam d and the branched laser beam e to the first galvanometer scanning unit 31 and the second galvanometer scanning unit 32, respectively, so as to implement laser beam transmission.
In the technical scheme of the invention, the laser beam emitted by the laser 10 is changed into a flat-top laser beam through the beam shaping unit 21, so that the energy density distribution of the laser beam is uniform, and the flat-top laser beam is divided into two branch laser beams with equal energy, which are used for respectively acting on a workpiece to be processed to realize laser drilling processing. The two laser beams are simultaneously applied to laser drilling processing, on one hand, the laser drilling processing efficiency is improved, and on the other hand, the energy density distribution of the two laser beams is uniform and the energy is equal, so that the consistency of the two laser beams is ensured, the uniformity of the laser drilling quality is strong, and the quality is good.
Further, with continued reference to fig. 1, the dual laser beam drilling system further includes a controller 40. The laser 10, the first processing module and the second processing module are respectively connected to the controller 40, and are controlled by the controller 40 to operate in different states.
Specifically, the laser 10 is configured to emit a laser beam that is applied to the work 70 to perform laser drilling processing. The controller 40 controls the working state of the laser 10, for example, the laser 10 is turned on or off, and the laser beam parameters output by the laser 10 specifically include energy, frequency, pulse width, and the like.
In this embodiment, the first processing module includes a first galvanometer scanning unit 31, a first processing platform 61, and a first positioning unit 51. The first processing platform 61 is movably arranged and used for fixedly placing a processed workpiece 70. Alternatively, the first processing platform 61 is a vacuum adsorption processing platform, and the vacuum adsorption processing platform can adsorb the workpiece 70, so that the workpiece 70 can be fixedly placed.
The first positioning unit 51 is used for acquiring the position of the workpiece 70 on the first processing platform 61 and feeding the position back to the controller 40. The controller 40 controls the first galvanometer scanning unit 31 to perform laser drilling on the workpiece 70 according to the position of the workpiece 70.
Specifically, the first positioning unit 51 includes a ccd (charge coupled device) camera, a coaxial light source and a ring light source. The CCD camera is used for acquiring the position of the workpiece 70 on the first processing platform 61 and feeding back to the controller 40, and the coaxial light source and the annular light source provide light sources for the CCD camera so as to be able to identify the position of the workpiece 70. The annular light source is equipped to recognize the outer target better, the coaxial light source is equipped to recognize the inner target better, and the two kinds of light sources can meet the requirements under various conditions. The first positioning unit 51 can accurately determine the position of the workpiece 70 and feed the position back to the controller 40, so as to realize automatic and controlled laser drilling.
Further, the first galvanometer scanning unit 31 moves along the X axis and the Y axis for scanning and processing, and the first processing platform 61 can move along the X axis and the Y axis. In the present embodiment, the X-axis and the Y-axis are perpendicular to each other and in the same plane.
In this embodiment, when the first galvanometer scanning unit 31 moves along the X axis and the Y axis for scanning, the laser beam spot acting point deviates from the original position by a certain distance S, and the first processing platform 61 can move in the opposite directions along the X axis and the Y axis to compensate the distance S between the laser beam spot acting point in the first galvanometer scanning unit 31 and the original position, so that the first galvanometer scanning unit 31 repeatedly performs multiple laser drilling processes on the processing point on the same workpiece 70.
Specifically, one laser scanning drilling process on the same processing point of the workpiece 70 is not enough to meet the drilling process requirement, and therefore, the embodiment of the present invention provides a method: the machining point of the same workpiece 70 is subjected to laser scanning drilling machining for a plurality of times so as to meet the drilling machining requirement. In multiple laser scanning drilling processes, precise and repeated positioning of the machining point of the workpiece 70 is of critical importance, especially in high-density, fine drilling processes.
Therefore, the first processing module in the embodiment of the present invention further includes a first position detector 81. The first position detector 81 is configured to detect a position movement amount of the first processing platform 61 and feed back the position movement amount to the controller 40, and the controller 40 may control the first galvanometer scanning unit 31 to perform laser drilling on the workpiece 70 on the first processing platform 61 according to the position movement amount of the first processing platform 61.
In one embodiment, when the linear driving mechanism drives the first processing platform 61 to move along the X-axis and the Y-axis, the linear encoder outputs a pulse every time the first processing platform 61 moves by a minute distance unit, and the first position detector 81 counts the pulse and feeds back the counted value to the controller 40, thereby detecting the amount of position movement of the first processing platform 61.
Of course, in another embodiment, when the servo motor changes the rotational motion into the linear motion to drive the first processing platform 61 to move along the X-axis and the Y-axis, each time the servo motor rotates by a minute angle unit, the rotary encoder outputs a pulse, and the first position detector 81 counts the pulse and feeds back the counted value to the controller 40, thereby detecting the position and movement amount of the first processing platform 61.
In a specific system configuration, other types of position detectors may be used to detect the amount of position movement of the first processing platform 61.
In this embodiment, the first position detector 81 is added to the first processing module to detect the position movement of the first processing platform 61, so that the controller 40 can better control the first galvanometer scanning unit 31 to repeatedly perform multiple laser drilling processes on a processing point on the same workpiece 70, thereby achieving precise laser drilling processes.
Similarly, the second processing module includes a second galvanometer scanning unit 32, a second processing platform 62 and a second positioning unit 52. The second processing platform 62 is movably disposed for fixedly placing a workpiece 70. Alternatively, the second processing platform 62 is a vacuum adsorption processing platform, which can adsorb the workpiece 70, so that the workpiece 70 can be fixedly placed.
The second positioning unit 52 is configured to acquire a position of the workpiece 70 on the second processing platform 62 and feed the position back to the controller 40. The controller 40 controls the second galvanometer scanning unit 32 to perform laser drilling on the workpiece 70 according to the position of the workpiece 70.
Specifically, the second positioning unit 52 includes a ccd (charge coupled device) camera, a coaxial light source and an annular light source. The CCD camera is used to acquire the position of the workpiece 70 on the second processing platform 62 and feed back the position to the controller 40, and the coaxial light source and the annular light source provide light sources for the CCD camera so as to be able to identify the position of the workpiece 70. The annular light source is equipped to recognize the outer target better, the coaxial light source is equipped to recognize the inner target better, and the two kinds of light sources can meet the requirements under various conditions. The second positioning unit 52 can accurately determine the position of the workpiece 70 and feed the position back to the controller 40, so as to realize automatic and controlled laser drilling.
Further, the second galvanometer scanning unit 32 moves for scanning and processing along the X axis and the Y axis, and the second processing platform 62 can move along the X axis and the Y axis. Optionally, the X-axis and the Y-axis are perpendicular to each other. In this embodiment, when the second galvanometer scanning unit 32 moves along the X axis and the Y axis for scanning, the laser beam spot acting point deviates from the original position by a certain distance S, and the second processing platform 62 can move in the opposite directions along the X axis and the Y axis to compensate the distance S between the laser beam spot acting point in the second galvanometer scanning unit 32 and the original position, so that the second galvanometer scanning unit 32 can repeatedly perform multiple laser drilling processes on the processing point on the same workpiece 70.
Further, the second processing module further comprises a second position detector 82. The second position detector 82 is configured to detect a position movement amount of the second processing platform 62 and feed back the position movement amount to the controller 40, and the controller 40 may control the second galvanometer scanning unit 32 to perform laser drilling on the workpiece 70 on the second processing platform 62 according to the position movement amount of the second processing platform 62.
Referring to the implementation manner of the first position detector 81, the second position detector 82 is configured to detect the position and movement amount of the second processing platform 62 and feed back the detected position and movement amount to the controller 40, and the implementation process is not repeated here.
In this embodiment, the second position detector 82 is added to the second processing module to detect the position movement of the second processing platform 62, so that the controller 40 can better control the second galvanometer scanning unit 32 to repeatedly perform multiple laser drilling processes on a processing point on the same workpiece 70, thereby achieving precise laser drilling processes.
Further, in the present embodiment, as shown in fig. 1, the dual laser beam drilling system further includes a dust removal module 90. The dust removal module 90 is used for removing dust generated in the laser drilling process in time. Optionally, the dust removal module 90 is a dust suction device, and dust generated in the laser drilling process is timely drawn out and filtered out through air pressure difference, so as to ensure the laser drilling quality. Dust generated in the laser drilling process can affect the first positioning unit 51 or the second positioning unit 52 to accurately position the workpiece 70, and affect the laser beam to perform laser drilling, which is not beneficial to the laser beam to perform drilling with fine apertures.
Optionally, the dust removal module 90 is disposed on the first processing platform 61, and when the laser beam performs laser drilling processing on the processed workpiece 70 on the first processing platform 61, the dust removal module 90 can extract dust in time and filter and remove the dust. The second processing platform 62 is provided with the dust removal module 90, and when laser beams perform laser drilling processing on the processed workpiece 70 on the second processing platform 62, the dust removal module 90 can extract dust in time and filter and remove the dust.
Further, in the present embodiment, as shown in fig. 1, the first galvanometer scanning unit 31 includes a focusing mirror 33 for focusing the laser beam of the first galvanometer scanning unit 31 and applying a focusing point on the workpiece 70. The second galvanometer scanning unit 32 includes a focusing mirror 33, and is configured to focus the laser beam of the second galvanometer scanning unit 32 and apply a focusing point on the workpiece 70.
Specifically, the focusing lens 33 is a flat-field focusing lens (f-theta). The focusing mirror 33 can focus the laser beam, so that the energy density of a laser beam focusing point is high, and the laser drilling processing quality is ensured.
Further, in this embodiment, the first galvanometer scanning unit 31 and the second galvanometer scanning unit 32 are three-dimensional scanning modules, and can move three-dimensionally, so that the movement is convenient, and the laser beam drilling process is flexible.
In summary, the controller 40 connects the overall structure of the dual laser beam drilling system into an organic whole, and the controller 40 receives the input parameter setting, and implements automatic control according to the control instruction, thereby precisely drilling.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. A dual laser beam drilling system, comprising: the device comprises a laser, a light splitting assembly, a first processing module and a second processing module;
the laser is used for emitting laser beams;
the light splitting component comprises a light beam shaping unit and a light splitter which are sequentially arranged along the direction of a light path;
the beam shaping unit changes the laser beam emitted by the laser into a flat-topped laser beam so as to enable the cross-section energy density distribution of the laser beam to be uniform;
the beam splitter divides the flat-topped laser beam into two laser beams with equal energy, and the two laser beams are respectively used as laser sources of the first processing module and the second processing module;
and the laser beams of the first processing module and the second processing module respectively act on a processed workpiece for laser drilling processing.
2. The dual laser beam drilling system according to claim 1, wherein the beam shaping unit comprises a plano-concave lens and a first plano-convex lens sequentially arranged along the optical path direction; the plane of the plano-concave lens and the plane of the first plano-convex lens are arranged in a deviating mode, and the concave surface of the plano-concave lens and the convex surface of the first plano-convex lens are arranged in an opposite mode.
3. The dual-laser-beam drilling system according to claim 2, wherein the beam splitting assembly further comprises a beam expanding and collimating unit and a diaphragm sequentially arranged along the optical path direction;
the beam expanding and collimating unit is used for expanding and collimating the flat-topped laser beam emitted from the beam shaping unit and comprises a second plano-convex lens and a third plano-convex lens which are sequentially arranged along the direction of a light path; the convex surface of the second plano-convex lens is arranged opposite to the convex surface of the third plano-convex lens, and the plane of the second plano-convex lens is arranged opposite to the plane of the third plano-convex lens;
the diaphragm is provided with a diaphragm hole and used for limiting the diameter of the laser beam emitted from the beam expanding and collimating unit and enabling the emitted laser beam to be incident to the light splitter.
4. The dual laser beam drilling system of claim 3, wherein a distance between the second plano-convex lens and the third plano-convex lens is adjustably set.
5. The dual laser beam drilling system of claim 1 or 4, further comprising a controller; the laser, the first processing module and the second processing module are respectively connected with the controller, and the working states of the laser, the first processing module and the second processing module are controlled by the controller;
the first processing module comprises a first galvanometer scanning unit, a first processing platform and a first positioning unit; the first processing platform is movably arranged and used for fixedly placing a processed workpiece; the first positioning unit is used for acquiring the position of a processed workpiece on the first processing platform and feeding the position back to the controller, and the controller controls the first galvanometer scanning unit to perform laser drilling processing on the processed workpiece according to the position of the processed workpiece;
the second processing module comprises a second galvanometer scanning unit, a second processing platform and a second positioning unit; the second processing platform is movably arranged and used for fixedly placing a processed workpiece; the second positioning unit is used for acquiring the position of a workpiece to be machined on the second machining platform and feeding the position back to the controller, and the controller controls the second galvanometer scanning unit to perform laser drilling machining on the workpiece to be machined according to the position of the workpiece to be machined.
6. The dual laser beam drilling system of claim 5, wherein the first galvanometer scanning unit moves along X and Y axes for scanning and processing, and the first processing platform can move along X and Y axes;
the second galvanometer scanning unit moves along the X axis and the Y axis for scanning and processing, and the second processing platform can move along the X axis and the Y axis.
7. The dual laser beam drilling system of claim 6, wherein the first processing module further comprises a first position detector; the first position detector is used for detecting the position movement amount of the first processing platform and feeding back the position movement amount to the controller;
the second processing module further comprises a second position detector; the second position detector is used for detecting the position movement amount of the second processing platform and feeding back the position movement amount to the controller.
8. The dual laser beam drilling system of claim 7, further comprising a dust removal module; the dust removal module is used for removing dust generated in the laser drilling process in time.
9. The dual laser beam drilling system of claim 5, wherein the first positioning unit comprises a CCD camera, a coaxial light source and a ring light source; the CCD camera is used for acquiring the position of a processed workpiece on the first processing platform and feeding back the position to the controller, and the coaxial light source and the annular light source provide light sources for the CCD camera so as to identify the position of the processed workpiece;
the second positioning unit comprises a CCD camera, a coaxial light source and an annular light source; the CCD camera is used for acquiring the position of the workpiece to be machined on the second machining platform and feeding back the position to the controller, and the coaxial light source and the annular light source provide light sources for the CCD camera so as to be capable of identifying the position of the workpiece to be machined.
10. The dual laser beam drilling system according to claim 5, wherein the first galvanometer scanning unit comprises a focusing mirror for focusing the laser beam of the first galvanometer scanning unit and applying a focusing point on the workpiece; the second galvanometer scanning unit comprises a focusing mirror and is used for focusing the laser beam of the second galvanometer scanning unit and applying a focusing point on a processed workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811012875.8A CN110871322B (en) | 2018-08-31 | 2018-08-31 | Double-laser-beam drilling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811012875.8A CN110871322B (en) | 2018-08-31 | 2018-08-31 | Double-laser-beam drilling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110871322A true CN110871322A (en) | 2020-03-10 |
| CN110871322B CN110871322B (en) | 2023-01-31 |
Family
ID=69715491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811012875.8A Active CN110871322B (en) | 2018-08-31 | 2018-08-31 | Double-laser-beam drilling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110871322B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111451629A (en) * | 2020-04-20 | 2020-07-28 | 中国科学院合肥物质科学研究院 | Excimer laser rear-end optical path system |
| CN111707359A (en) * | 2020-05-12 | 2020-09-25 | 固高科技(深圳)有限公司 | Laser processing detection system and method |
| CN114161003A (en) * | 2021-11-10 | 2022-03-11 | 成都拓米电子装备制造有限公司 | UTG laser drilling device and drilling method thereof |
| CN114185121A (en) * | 2021-11-24 | 2022-03-15 | 四川橙科通信技术研究院有限责任公司 | Double-station femtosecond laser system for efficiently manufacturing grating |
| CN114309991A (en) * | 2022-01-21 | 2022-04-12 | 深圳市易安锐智能装备有限责任公司 | Laser automatic cutting control system and control method thereof |
| CN114799541A (en) * | 2021-01-19 | 2022-07-29 | 深圳市大族数控科技股份有限公司 | Multi-axis micro blind hole machining method and system based on ultrafast laser |
| CN114951967A (en) * | 2021-02-19 | 2022-08-30 | 深圳市大族数控科技股份有限公司 | Ultrafast laser-based micro-through hole machining method and system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103513426A (en) * | 2013-10-11 | 2014-01-15 | 江苏大学 | Method of improving laser processing efficiency by optimizing light beam quality |
| CN104570363A (en) * | 2015-02-03 | 2015-04-29 | 大族激光科技产业集团股份有限公司 | Gauss laser beam shaping method and device and precise laser micropore processing device |
| CN105945422A (en) * | 2016-06-12 | 2016-09-21 | 西安中科微精光子制造科技有限公司 | Ultrafast laser micro-machining system |
| CN106312323A (en) * | 2016-11-02 | 2017-01-11 | 广东工业大学 | Laser peening straightening method and device for deformed blade |
| CN106956084A (en) * | 2017-05-19 | 2017-07-18 | 苏州镭明激光科技有限公司 | Low k material lasers remove technique and its equipment |
| CN107309556A (en) * | 2016-04-14 | 2017-11-03 | 大族激光科技产业集团股份有限公司 | A kind of laser hole drilling system and method |
-
2018
- 2018-08-31 CN CN201811012875.8A patent/CN110871322B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103513426A (en) * | 2013-10-11 | 2014-01-15 | 江苏大学 | Method of improving laser processing efficiency by optimizing light beam quality |
| CN104570363A (en) * | 2015-02-03 | 2015-04-29 | 大族激光科技产业集团股份有限公司 | Gauss laser beam shaping method and device and precise laser micropore processing device |
| CN107309556A (en) * | 2016-04-14 | 2017-11-03 | 大族激光科技产业集团股份有限公司 | A kind of laser hole drilling system and method |
| CN105945422A (en) * | 2016-06-12 | 2016-09-21 | 西安中科微精光子制造科技有限公司 | Ultrafast laser micro-machining system |
| CN106312323A (en) * | 2016-11-02 | 2017-01-11 | 广东工业大学 | Laser peening straightening method and device for deformed blade |
| CN106956084A (en) * | 2017-05-19 | 2017-07-18 | 苏州镭明激光科技有限公司 | Low k material lasers remove technique and its equipment |
Non-Patent Citations (2)
| Title |
|---|
| 胡传炘等: "《特种加工手册》", 30 April 2001 * |
| 隋修武等: "《机械电子工程原理与系统设计》", 31 January 2014 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111451629A (en) * | 2020-04-20 | 2020-07-28 | 中国科学院合肥物质科学研究院 | Excimer laser rear-end optical path system |
| CN111707359A (en) * | 2020-05-12 | 2020-09-25 | 固高科技(深圳)有限公司 | Laser processing detection system and method |
| CN114799541A (en) * | 2021-01-19 | 2022-07-29 | 深圳市大族数控科技股份有限公司 | Multi-axis micro blind hole machining method and system based on ultrafast laser |
| CN114951967A (en) * | 2021-02-19 | 2022-08-30 | 深圳市大族数控科技股份有限公司 | Ultrafast laser-based micro-through hole machining method and system |
| CN114161003A (en) * | 2021-11-10 | 2022-03-11 | 成都拓米电子装备制造有限公司 | UTG laser drilling device and drilling method thereof |
| CN114185121A (en) * | 2021-11-24 | 2022-03-15 | 四川橙科通信技术研究院有限责任公司 | Double-station femtosecond laser system for efficiently manufacturing grating |
| CN114309991A (en) * | 2022-01-21 | 2022-04-12 | 深圳市易安锐智能装备有限责任公司 | Laser automatic cutting control system and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110871322B (en) | 2023-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110871322B (en) | Double-laser-beam drilling system | |
| KR102027621B1 (en) | Laser processing apparatus | |
| US11135772B2 (en) | Additive-manufacturing head and manufacturing machine | |
| CN101432094B (en) | Laser processing method and laser processing apparatus | |
| CN103406665A (en) | Laser processing device | |
| CN108098147B (en) | Double-sided laser processing method for PCB array micropores | |
| CN105269154B (en) | A kind of precise laser cutting head hunting gear and its control method | |
| KR20150138827A (en) | Method for manufacturing chip | |
| CN102642082A (en) | Laser processing device with switchable laser assembly and laser processing method | |
| KR101582455B1 (en) | Multi modal laser machining system | |
| CN110722272A (en) | Ultrafast laser micro-nano cutting drilling equipment and method | |
| CN102271857B (en) | Laser beam working machine | |
| CN105163897A (en) | Coordination of beam angle and workpiece movement for taper control | |
| CN107116308B (en) | Waveguide micro/nano processing system and processing method | |
| JP2003225786A (en) | Laser beam machining unit and machining device equipped therewith | |
| CN201693290U (en) | Laser processing device | |
| KR102272649B1 (en) | Laser cleaning device having a function of checking cleaning quality and method thereof | |
| CN104084698A (en) | Laser cutting machine | |
| CN217370913U (en) | Device and machine tool for correcting path deviation when laser direction is changed | |
| CN105252144B (en) | A kind of high-precision laser is servo-actuated cutting head and its monitoring and automatic focus searching method | |
| CN101522357A (en) | Laser working apparatus | |
| CN203853681U (en) | Ultraviolet laser-beam drilling machine | |
| TWI595955B (en) | A laser machining method | |
| JP2020078805A (en) | Galvano-scanner optical system | |
| EP3556509B1 (en) | Combined processing machine with a laser beam splitter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200618 Address after: 518000 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000, No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Applicant before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Applicant before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |