CN114161003A - UTG laser drilling device and drilling method thereof - Google Patents
UTG laser drilling device and drilling method thereof Download PDFInfo
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- CN114161003A CN114161003A CN202111327730.9A CN202111327730A CN114161003A CN 114161003 A CN114161003 A CN 114161003A CN 202111327730 A CN202111327730 A CN 202111327730A CN 114161003 A CN114161003 A CN 114161003A
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- 238000005553 drilling Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 36
- 241001270131 Agaricus moelleri Species 0.000 claims abstract description 105
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- 239000011521 glass Substances 0.000 description 11
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
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- Laser Beam Processing (AREA)
Abstract
The invention discloses an UTG laser drilling device and a drilling method thereof, and solves the technical problems that the aperture cannot be smaller than 25 mu m, the thermal influence width around the hole cannot be reduced, and the blind hole depth cannot be controlled in the prior art when UTG laser is used for drilling. UTG laser drilling device comprises an operation table, UTG product, laser, collimation and beam expansion unit, beam shaping mechanism and focusing mechanism; the drilling method is that 4mm laser beam emitted by a laser is split and then sequentially expanded, shaped and focused into a 20-micron round flat-top beam, and the beam is injected into UTG products for drilling. The invention has simple structure, scientific and reasonable design and convenient use, shapes the Gaussian beam into the round flat-top beam firstly, ensures that the energy distribution of the beam is in the shape of a round cap, can effectively improve the heat influence around a drill hole after processing, can effectively control the depth of a blind hole, and can drill a micropore with the diameter less than 25 mu m.
Description
Technical Field
The invention belongs to the technical field of ultrathin glass drilling, and particularly relates to an UTG laser drilling device and a drilling method thereof.
Background
Due to the high light transmittance, high temperature resistance (600 ℃), high strength and good bending performance of the ultrathin glass (i.e. UTG) material, the ultrathin glass is mainly used for products such as folding smart phones and folding display panels at present, and with the continuous updating of the technology, the ultrathin glass material can be used in semiconductor industries such as PCB (printed circuit board) carrier plates and the like.
The ultra-thin glass (namely UTG) often needs to be drilled in the use process, the existing glass drilling mainly comprises mechanical drilling and laser drilling, the unique characteristics of non-contact, non-edge breakage, capability of processing precise micropores and the like of the laser drilling are widely applied, but the heat influence around the hole processed by the existing mature laser drilling technology is large, the hole can be strengthened only after the process flows of cleaning, etching and the like are carried out, the size of the hole is limited (only micropores with the diameter of more than or equal to 25 mu m can be processed), the product utilization rate cannot be improved, and in addition, the depth of the blind hole cannot be effectively controlled when the UTG blind hole is processed.
At present, most of the industry uses an ultrashort pulse laser, a high-speed scanning galvanometer is matched with a short-focus telecentric lens to carry out a drilling process on UTG, an ultrasonic cleaning machine is used for cleaning, etching, cleaning, strengthening and cleaning the laser, and finally a strengthened UTG finished product is obtained to carry out a subsequent process, wherein the laser drilling effect is shown in fig. 7. It can be seen that the thermal influence around the hole processed by the prior art is wide, the diameter of the hole must be larger than 25 μm, and the micro-hole with smaller diameter cannot be processed, and in addition, because UTG is thinner (<0.1mm), if the blind hole is processed, the depth of the processed blind hole cannot be effectively controlled when UTG is processed by the conventional laser drilling technology.
The second drilling process in the industry is a mode of utilizing a circular flat-top light beam shaping element to shape Gaussian light into circular flat-top light, focusing by utilizing a high-speed scanning galvanometer and a telecentric field lens, and scanning and processing a circular hole, and compared with the mode 1, the mode improves the process effect around the hole, but is still limited by the size of the hole, and the efficiency is lower.
Therefore, it is a technical problem to be solved by those skilled in the art to design an UTG laser drilling apparatus and a drilling method thereof to drill smaller micro holes, effectively control the depth of a blind hole, and effectively reduce the width of a thermal influence around the hole.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: an UTG laser drilling device and a drilling method thereof are provided to solve at least some of the above technical problems.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
an UTG laser drilling device, comprising:
an operation table for placing UTG products to be drilled;
the laser is used for emitting Gaussian laser beams with the pulse width of ps or fs;
the collimation and beam expansion unit is used for expanding and enlarging laser beams emitted by the laser;
the beam shaping mechanism is used for shaping the expanded laser beam into a plurality of circular flat-top beams which are distributed in an array;
and the focusing mechanism is used for focusing the circular flat-top light beam and then striking the circular flat-top light beam on UTG products so as to drill UTG products.
The laser device further comprises a spectroscope which is used for splitting a laser beam emitted by the laser into a reflection path beam and a transmission path beam which have the same power, and a collimation and beam expansion unit, a beam shaping mechanism, a focusing mechanism and an operation table provided with UTG products are sequentially arranged on a reflection path beam light path and a transmission path beam light path.
Furthermore, a first reflecting mirror is further arranged on the light path of the transmission path light beam, and the first reflecting mirror is used for reflecting the transmission path light beam coming out of the spectroscope to the collimation and beam expansion unit on the light path of the transmission path light beam.
Further, the collimating beam expanding unit is a 1-3X variable-magnification beam expanding mirror, and preferably, the magnification times are all 2.5X.
Further, the beam shaping mechanism includes:
the round flat-top light shaping unit is used for shaping the laser beam expanded and enlarged by the collimation and beam expansion unit into a primary round flat-top beam with uniform energy distribution;
and the beam mask is used for generating a plurality of circular flat-top beams with the same energy and distributed in an array from the primary circular flat-top beam.
Furthermore, the circular flat top light shaping unit is a diffraction optical element, the size of the light beam mask is 9mm x 9mm, the size of the circular holes on the light beam mask is 0.2mm, and the distance between the circular holes is 0.3 mm.
Further, the focusing mechanism comprises an optical path adjusting mechanism for adjusting the direction of the round flat-top light beam and a 50-time infrared focusing objective lens for focusing the round flat-top light beam with the adjusted direction and driving the round flat-top light beam into UTG products.
Further, the optical path adjusting mechanism comprises a second reflecting mirror and a third reflecting mirror, and the circular flat-topped light beam is reflected by the second reflecting mirror and the third reflecting mirror in sequence and then is incident into the 50-time infrared focusing objective lens.
Further, still include the industrial computer that is connected with the laser instrument to the operation panel is connected with the operation panel operation drive device that is used for driving the operation of operation panel, and operation panel operation drive device is connected with the industrial computer.
A hole drilling method of UTG laser hole drilling device, the laser sends 4mm laser beam to spectroscope beam split as reflection path beam and transmission path beam with the same power, the reflection path beam expands into 10mm reflection path laser beam through the collimation beam expanding unit on the reflection path, the 10mm reflection path laser beam is sent into the circular flat top beam shaping unit on the reflection path to shape into 10mm reflection path primary circular flat top beam and then sent into the beam mask on the reflection path to generate 15 x 15 round flat top beam with the same energy and array distribution, the circular flat top beam is sent into the 50 times infrared focusing objective lens on the reflection path to focus into 20 μm round flat top beam to send into UTG product on the reflection path to drill hole;
the light beam of the transmission path is reflected to a collimation and beam expansion unit on the transmission path through a first reflector on the transmission path and expanded into a laser beam of the 10mm transmission path, the laser beam of the 10mm transmission path is shaped into a primary round flat top beam of the 10mm transmission path through a round flat top beam shaping unit on the transmission path and then is sent into a beam mask on the transmission path to generate round flat top beams which are 15 × 15 in number, have the same size and energy and are distributed in an array, and the round flat top beams are sequentially adjusted in incidence direction through a second reflector and a third reflector on the transmission path and then are sent into a 50-time infrared focusing objective lens on the transmission path to be focused into a round flat top beam of 20 microns to be sent into UTG products on the transmission path to drill the products.
Compared with the prior art, the invention has the following beneficial effects:
the invention has simple structure, scientific and reasonable design and convenient use, shapes the Gaussian beam into a round flat-top beam, ensures that the energy distribution of the beam is in a round cap shape, and can effectively improve the heat influence around the drill hole after processing.
The invention firstly splits the light beam into two beams, then utilizes the mask designed in advance to integrate the single light beam into a plurality of beams on the basis of the single round flat-top light beam, so that the efficiency is greatly improved, the aperture size and the aperture spacing can be changed along with the design of the mask, and if a blind hole is processed, the laser processing parameters are controlled to realize the laser processing, thereby improving the flexibility of the process.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
FIG. 2 is a fragmentary view of a 20 μm diameter micropore on a product 160 of UTG of the present invention.
FIG. 3 is a topographical view of a single focused spot focused by a 50-fold IR focusing objective lens according to the present invention.
FIG. 4 is a diagram of the energy distribution of a single focused spot focused by a 50-fold IR focusing objective according to the present invention.
Fig. 5 is a graph of a prior art single focused spot energy profile for a conventional laser drilling technique.
FIG. 6 is a prior art single focused spot topography for conventional laser drilling techniques.
FIG. 7 is a diagram showing the effect of the micro-holes after the conventional laser drilling technique in the prior art, such as drilling, cleaning, etching, cleaning, strengthening, and cleaning (the diameter of the micro-hole is 62.80 μm).
Wherein, the names corresponding to the reference numbers are:
100-laser, 110-spectroscope, 120-first reflector, 121-second reflector, 122-third reflector, 130-collimation and beam expanding unit, 140-beam shaping mechanism, 141-round flat-top light shaping unit, 142-beam mask, 150-50 times infrared focusing objective, 160-UTG product and 170-operation table.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-4, the UTG laser drilling device provided by the invention has the advantages of simple structure, scientific and reasonable design and convenient use, the Gaussian beam is firstly shaped into the round flat-top beam, the energy distribution of the beam is in the shape of a round cap, and the thermal influence around the drilled hole can be effectively improved after processing. The device comprises an operation table 170, UTG products 160, a laser 100, a collimation and beam expansion unit 130, a beam shaping mechanism 140, a focusing mechanism, a beam splitter 110 and an industrial personal computer.
The inventive station 170 is used to position UTG products 160 to be drilled.
The laser 100 of the present invention is used to emit a gaussian laser beam with a pulse width of ps or fs.
The collimation and beam expansion unit 130 of the present invention is used for expanding and enlarging the laser beam emitted by the laser 100; the collimating and beam expanding unit 130 is a 1-3X variable-magnification beam expander, and the expansion times are all 2.5X.
The beam shaping mechanism 140 of the present invention is used for shaping the expanded laser beam into a plurality of circular flat-top beams distributed in an array. The beam shaping mechanism 140 includes a circular flat-top light shaping unit 141 and a beam mask 142, the circular flat-top light shaping unit 141 is used for shaping the laser beam expanded and enlarged by the collimation and beam expansion unit 130 into a primary circular flat-top beam with uniform energy distribution, and the circular flat-top light shaping unit 141 is a diffractive optical element; the beam mask 142 is used for generating a plurality of circular flat-top beams with the same size and energy and distributed in an array from the primary circular flat-top beam, the size of the beam mask 142 is 9mm by 9mm, the size of the circular holes on the beam mask is 0.2mm, and the distance between the circular holes is 0.3 mm.
The focusing mechanism of the present invention is used to focus a circular flat-topped beam of light onto UTG product 160 to drill UTG product 160. The focusing mechanism comprises an optical path adjusting mechanism for adjusting the direction of the round flat-top light beam and a 50-time infrared focusing objective lens 150 for focusing and driving the round flat-top light beam with the adjusted direction onto UTG products 160. The optical path adjusting mechanism comprises a second reflector 121 and a third reflector 122, and the circular flat-topped light beam is reflected by the second reflector 121 and the third reflector 122 in sequence and then enters the 50-time infrared focusing objective 150.
The beam splitter 110 of the present invention is used for splitting the laser beam emitted by the laser 100 into a reflection path beam and a transmission path beam with the same power, and a collimation and beam expansion unit 130, a beam shaping mechanism 140, a focusing mechanism and an operation table 170 with UTG products 160 are sequentially arranged on the reflection path beam light path and the transmission path beam light path. The first reflecting mirror 120 is further disposed on the light path of the transmission path light beam, and the first reflecting mirror 120 is configured to reflect the transmission path light beam coming out of the beam splitter 110 to the collimation and beam expansion unit 130 on the light path of the transmission path light beam.
The industrial personal computer is connected with the laser 100, the operation table 170 is connected with operation table operation driving equipment for driving the operation table 170 to operate, and the operation table operation driving equipment is connected with the industrial personal computer.
The invention firstly splits the light beam into two beams, then utilizes the mask designed in advance to integrate the single light beam into a plurality of beams on the basis of the single round flat-top light beam, so that the efficiency is greatly improved, the aperture size and the aperture spacing can be changed along with the design of the mask, and if a blind hole is processed, the laser processing parameters are controlled to realize the laser processing, thereby improving the flexibility of the process.
The invention provides a drilling method of an UTG laser drilling device, wherein a laser emits 4mm laser beams to a spectroscope to be split into a reflection path beam and a transmission path beam with the same power, the reflection path beam is expanded into a laser beam with the size of 10mm through a collimation and beam expansion unit on a reflection path, a circular flat-top light shaping unit which is used for shaping the laser beam with the reflection path with the size of 10mm on a reflection path is a primary circular flat-top beam with the reflection path with the size of 10mm, then the laser beam is sent into a beam mask on the reflection path to generate circular flat-top beams with the number of 15 x 15, the size of the circular flat-top beams are the same and are distributed in an array, and the circular flat-top beams are sequentially sent into a second reflecting mirror and a third reflecting mirror on the reflection path to be focused into a circular flat-top beam with the size of 20 mu m through an infrared focusing objective lens which is 50 times of the incidence direction and then sent into a UTG product on the reflection path to drill the circular flat-top beam;
the invention discloses a laser beam drilling device, which is characterized in that a light beam of a transmission path is reflected to a collimation and beam expansion unit on the transmission path through a first reflector on the transmission path to be expanded into a laser beam of the transmission path with the size of 10mm, a circular flat-top light shaping unit, into which the laser beam of the transmission path with the size of 10mm is injected, on the transmission path shapes the laser beam into a primary circular flat-top light beam of the transmission path with the size of 10mm, then the primary circular flat-top light beam is injected into a light beam mask on the transmission path to generate circular flat-top light beams which are 15 × 15 in number, have the same size and energy and are distributed in an array, the circular flat-top light beam is injected into a 50-time infrared focusing objective lens on the transmission path after being adjusted in the injection direction through a second reflector and a third reflector on the transmission path in sequence, and then the circular flat-top light beam with the size of 20 μm is injected into UTG products on the transmission path to drill the circular flat-top light beam.
The technical scheme of the invention provides an UTG laser drilling device and a drilling method thereof, which solve the technical problems that the size and the depth of a hole are limited in the traditional laser glass drilling process, and splashes and wider heat influence are caused at the edge of the hole. The UTG laser drilling device comprises a laser 100, a beam splitter 110, a collimation and beam expansion unit 130, a first reflector 120, a beam shaping mechanism 140, a second reflector 121, a third reflector 122, a 150-50 times infrared focusing objective lens, a UTG product 160, an operation table 170, a circular flat-top light shaping unit 141 and a beam mask 142.
The laser is an ultrashort pulse laser and is used for emitting Gaussian laser beams with pulse width ps or fs.
The device of the spectroscope divides the equal energy of a single laser beam into two beams with the same power.
The collimation beam expanding unit has two structures of Galileo type and Kepler type, after a Gaussian beam emitted by laser passes through the collimation beam expanding unit, the size of a light spot can be enlarged or reduced, and the light spot is collimated, and a 1-3X variable magnification beam expanding lens is preferred.
The first reflector is arranged on the same side of the laser and the spectroscope along the same horizontal axis and is used for transmitting the laser beam of the transmission path behind the spectroscope to the beam shaping mechanism;
the beam shaping mechanism comprises a circular flat-top light shaping unit 141 and a beam mask 142, wherein a Gaussian beam with a certain size passes through the circular flat-top light shaping unit 141 to generate a circular flat-top light beam with uniform energy distribution, and then the beam mask 142 generates a plurality of circular flat-top lights from a single light spot according to the layout on the beam mask; it is worth noting that the circular flat-top light shaping unit can be a single diffraction optical element or a group of shaping lens groups, and both can achieve the effect of shaping light beams into circular flat-top light; in addition, a 2 mm-2 mm mask is adopted to shape a single circular flat-top beam into a plurality of circular flat-top beams, and a user can customize the beam mask according to requirements, so that circular flat-top beams with different numbers and different light spot layouts can be generated.
The second reflector and the third reflector are used for transmitting the shaped light beam to the focusing mechanism, the second reflector, the light beam shaping mechanism and the first reflector are coaxially distributed from bottom to top, and the third reflector and the second reflector are distributed along the same horizontal line; the focusing mechanism focuses a plurality of circular flat-top light spots on the ultrathin glass (UTG), and achieves the process effect of UTG drilling by adjusting proper process parameters.
The preferred scheme of the invention is to adopt a femtosecond infrared laser with the pulse width of less than 500fs, the original emergent light of the femtosecond infrared laser is Gaussian beam, the beam is expanded and collimated by a beam expander, the divergence angle of a light spot is reduced, the size of the light spot reaches about 10mm, the Gaussian beam is shaped into a plurality of beams of round flat-top light by a beam shaping mechanism, and finally the round flat-top light spot with the size of about 20 mu m is formed by focusing by a lens, so that the focused light spot carries out the drilling process on UTG.
In addition, for the processing of UTG ultra-thin glass (the thickness is less than 0.1mm), if a blind hole needs to be processed, the depth of the hole cannot be effectively controlled; in another mode of the traditional laser drilling technology, although the heat influence effect around the small hole is improved, the traditional laser drilling technology is limited by the size of the hole (more than or equal to 25 microns), the efficiency is low, the flexibility is not enough, and the control of the aperture depth is difficult when the blind hole is processed. The technology of the invention can effectively overcome the defects.
As shown in fig. 1, the UTG laser drilling device provided by the present invention includes an operation table 170, a product 160 UTG, a laser 100, a collimation and beam expansion unit 130, a beam shaping mechanism 140, a focusing mechanism, a beam splitter 110, and an industrial personal computer. The laser 100 is an ultrashort pulse femtosecond infrared laser, and certainly includes other picosecond infrared lasers, picosecond green lasers and picosecond ultraviolet lasers; the beam splitter can divide the laser beam into two paths of beams with the same power and process the beams simultaneously; the collimation beam expanding unit 130 is a 1-3X variable-magnification beam expander, and the size of a light spot is changed by controlling the beam expanding multiple; the beam shaping mechanism 140 comprises a circular flat-top light shaping unit 141 and a beam mask 142, the circular flat-top light shaping unit 141 selects a diffractive optical element and also comprises other shaping lens combinations, the beam mask 142 has a size of 9mm by 9mm, can generate 15 by 15 array light spots, and then is reflected by the second reflector 121 and the third reflector 122 to enter the focusing mechanism;
the ultrashort pulse laser 100 of the invention emits an ultrashort pulse laser beam, the original size of the laser spot is a gaussian beam of 4mm, the laser beam passes through a beam splitter 110 along the beam propagation direction, the beam is split into two paths by one path, the reflected path beam passes through a beam expanding and collimating unit 130, then passes through a round flat-top light shaping unit 141 and a beam mask 142 in sequence, and the transmitted path beam enters the beam expanding and collimating unit 130, the round flat-top light shaping unit 141 and the beam mask 142 in sequence after being reflected by a first reflector 120; when the two beams enter the corresponding collimation and beam expansion units 130 respectively, the amplification factor of the collimation and beam expansion unit 130 is set to be 2.5X, the size of the emergent light spot of the two beams reaches about 10mm, the circular flat-top light shaping unit 141 shapes the 10mm Gaussian beam into the circular flat-top light beam with the same size of about 10mm and uniform energy distribution, the light beam mask 142 (the size is 9mm, the diameter of the circular hole is 0.2mm, the distance is 0.3mm) shapes the single circular flat-top light beam into a circular flat-top light array with the size of 0.2mm and the quantity of 15 mm, the circular flat-top light array is reflected by the second reflector 121 and the third reflector 122 and then enters the 50-time infrared focusing objective 150, and the circular flat-top light array is arranged above the UTG product 160 and the operation platform 170, the multiple round flat-topped light spots focused by the 50-time infrared focusing objective lens 150 are processed on UTG products 160 in a mode that multiple pulses are dotted at the same position, the processing of the entire sheet UTG of products 160 is completed by the movement of the operating table 170 in the X-Y direction; it should be noted that the two beams split by the beam splitter will simultaneously laser process UTG products 160 on two operation platforms 170, and in the single optical path, when processing micro-holes at a single position, the drilling depth can be controlled by changing the number of pulses and laser energy of the dotting, and the drilling size and position layout can be controlled by modifying the size and design of the beam mask 142; in the specific example, the layout of the focusing light spots on UTG products 160 is shown in fig. 2, the number of the focusing light spots is 15 × 15, the light spot spacing is 0.06mm, the morphology and the energy distribution of a single focusing light spot are respectively shown in fig. 3 and fig. 4, the size of the single focusing light spot is about 20 μm, the transverse energy distribution is uniform, and due to the high-frequency characteristic of the laser, the processing of the through holes or the blind holes with high efficiency and small edge heat influence is realized by setting the number of dotting pulses;
the ultra-thin glass (UTG) laser drilling device also comprises two operation tables 170, wherein the platform is connected with the ultra-short pulse laser 100 and the X-Y linear motion platform in a driving way, and the platform drives the laser to control the number of single dotting pulses of the laser and the motion position of the linear motion platform according to a user instruction or a preset instruction of a user so as to meet the requirements of processing through holes or blind holes of different products; it is noted that the industrial personal computer and the operation platform operation driving device control the two operation platforms to move simultaneously in the sample processing process.
In one mode of the traditional laser drilling technology, Gaussian beam energy distribution and focused light spot morphology are shown in FIGS. 5 and 6, the energy of the Gaussian beam energy distribution is in a Gaussian distribution, and when a material is processed, the energy is lower than 1 ^ 42(1/50 in FIG. 5)2Field size 50mm, and ordinate is irradiance per unit area) would also act on the material, so a large heat affected zone would appear around the hole. According to the technical scheme, the Gaussian beam is firstly shaped into the round flat-topped beam, so that the energy distribution of the beam is in a round cap shape, and the heat influence around the hole is effectively improved after the Gaussian beam is processed.
The other mode of the traditional laser drilling technology is to process a small hole by a single round flat-top beam, but the aperture of the processed small hole is changed along with the change of a light path system, the aperture size is limited by the minimum precision (only being more than or equal to 25 mu m) of a galvanometer, the efficiency of the single processing mode is low, and the production capacity requirement of a product cannot be met in micropore processing. The technical scheme of the invention firstly divides the light beam into two beams by light splitting, then utilizes the mask plate which is designed in advance on the basis of a single round flat-top light beam to integrate the single light beam into a plurality of beams, so that the efficiency is greatly improved, the aperture size and the aperture spacing can be changed along with the design of the mask plate, and if a blind hole is processed, the laser processing parameters can be controlled to realize the processing, thereby improving the flexibility of the process.
The invention is suitable for the optical device of the laser drilling process of the ultrathin glass (UTG), mainly made up of laser, beam shaping system, focusing unit, the device shapes a single Gauss light beam into a plurality of round flat-topped beams that the energy distributes evenly; when the round flat-top light beam processes the round hole in a pulse dotting mode, the round flat-top light beam has the characteristic of uniform energy distribution, so that the heat influence around the processed hole is small, and the time of subsequent cleaning, etching and other processes is reduced; by utilizing the high-frequency characteristic of the ultrashort pulse laser, through setting the number of dotting pulses and processing a plurality of small holes at one time, the depth of the holes during blind hole processing can be controlled while the compatibility of two processes of through holes and blind holes is realized, and the efficiency is also improved; through designing a beam mask and replacing different focusing units, processing of micro holes with different sizes and different distances can be realized, so that the sizes of the micro holes and the distances among the micro holes can be made smaller; if the circular flat-top light shaping unit adopts an optical diffraction element, the design of the circular flat-top light shaping unit should be as close as possible to a light beam mask and a focusing unit, so that the condition of uneven light beam edge energy is avoided; the invention changes the light path structure, and utilizes the new light path scheme to realize better effect and faster efficiency in the ultra-thin glass UTG drilling process.
The laser can be replaced by picosecond infrared light, picosecond green light, picosecond ultraviolet light and the like from femtosecond infrared light; the first beam shaping element (circular flat-top shaping unit) in the beam shaping mechanism can be an optical diffraction element or a combined lens, and the effect can be realized by shaping the Gaussian beam into a circular flat-top beam. The second beam shaping element in the beam shaping mechanism can be a mask or a set of spatial light modulation system, and the effect of shaping a single round flat-top beam into a plurality of array round flat-top beams can be realized.
The collimation beam expanding unit expands and collimates the Gaussian beam to enable the size of a laser spot to reach a target value, and the focal depth and the size of a focused spot can be finely adjusted by adjusting the beam expanding multiple or the divergence angle of the beam expanding unit; UTG the product, the operation table and the focusing system are arranged along the same optical axis in the Y direction, and UTG the product is placed on the operation table and moves synchronously along the X-Y direction along with the operation table; the operating platform further comprises a driving controller which is connected with the laser and the operating platform, and the number of single dotting pulses of the laser and the movement position of the linear movement platform are controlled according to a user instruction or a user preset instruction, so that through holes or blind holes of different products can be machined.
Finally, it should be noted that: the above embodiments are only preferred embodiments of the present invention to illustrate the technical solutions of the present invention, but not to limit the technical solutions, and certainly not to limit the patent scope of the present invention; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention; that is, the technical problems to be solved by the present invention, which are not substantially changed or supplemented by the spirit and the concept of the main body of the present invention, are still consistent with the present invention and shall be included in the scope of the present invention; in addition, the technical scheme of the invention is directly or indirectly applied to other related technical fields, and the technical scheme is included in the patent protection scope of the invention.
Claims (10)
1. An UTG laser drilling device, comprising:
an operating table (170) for placing UTG products (160) to be drilled;
a laser (100) for emitting a gaussian laser beam having a pulse width of ps or fs;
a collimation and beam expanding unit (130) for expanding and enlarging the laser beam emitted by the laser (100);
the beam shaping mechanism (140) is used for shaping the expanded laser beam into a plurality of circular flat-top beams which are distributed in an array;
and the focusing mechanism is used for focusing the circular flat-top light beam and then striking UTG products (160) so as to drill UTG products (160).
2. The UTG laser drilling device according to claim 1, further comprising a beam splitter (110) for splitting the laser beam emitted from the laser (100) into a reflected beam and a transmitted beam having the same power, wherein a collimating and beam expanding unit (130), a beam shaping mechanism (140), a focusing mechanism and a console (170) with UTG products (160) are sequentially disposed on the reflected beam optical path and the transmitted beam optical path.
3. An UTG laser drilling device according to claim 2, wherein a first reflecting mirror (120) is further disposed on the optical path of the transmission path, the first reflecting mirror (120) being configured to reflect the transmission path beam from the beam splitter (110) to the collimating and beam expanding unit (130) on the optical path of the transmission path beam.
4. UTG laser drilling device according to claim 1, wherein the collimated beam expanding unit (130) is a 1-3X variable beam expander, preferably with an expansion factor of 2.5X.
5. UTG laser drilling device according to claim 1, wherein the beam shaping mechanism (140) comprises:
the round flat-top light shaping unit (141) is used for shaping the laser beam expanded and enlarged by the collimation and beam expansion unit (130) into a primary round flat-top beam with uniform energy distribution;
and the beam mask (142) is used for generating a plurality of circular flat-top beams with the same size and energy and distributed in an array from the primary circular flat-top beams.
6. An UTG laser drilling device according to claim 5, wherein the circular flat-top light shaping unit (141) is a diffractive optical element, the beam mask (142) has a size of 9mm by 9mm, the size of the circular holes is 0.2mm, and the distance between the circular holes is 0.3 mm.
7. An UTG laser drilling device according to claim 1, wherein the focusing mechanism includes an optical path adjustment mechanism for adjusting the direction of the circular flat-top beam, and a 50-fold infrared focusing objective (150) for focusing the circular flat-top beam with the adjusted direction onto the UTG product (160).
8. UTG laser drilling device according to claim 7, wherein the optical path adjusting mechanism comprises a second reflector (121) and a third reflector (122), the circular flat-topped beam is reflected by the second reflector (121) and the third reflector (122) in sequence and then enters the 50-fold infrared focusing objective (150).
9. An UTG laser drilling device according to claim 1, further comprising an industrial personal computer connected to the laser (100), wherein the console (170) is connected to a console operation driving device for driving the console (170) to operate, and the console operation driving device is connected to the industrial personal computer.
10. The method of claim UTG as claimed in any one of claims 1-9, the laser is characterized in that a laser emits a 4mm laser beam to a spectroscope to split the beam into a reflection path beam and a transmission path beam with the same power, the reflection path beam is expanded into a 10mm reflection path laser beam through a collimation and beam expansion unit on a reflection path, the 10mm reflection path laser beam is shaped into a 10mm reflection path primary circular flat top beam through a circular flat top beam shaping unit on the reflection path, the 10mm reflection path laser beam is then sent into a light beam mask on the reflection path to generate a circular flat top beam with the number of 15, the size and the energy being the same and the array distribution, the circular flat top beam is sequentially sent into a 50-time infrared focusing objective lens on the reflection path after the incidence direction is adjusted through a second reflecting mirror and a third reflecting mirror on the reflection path, and then the circular flat top beam is sent into UTG products on the reflection path to be drilled;
the light beam of the transmission path is reflected to a collimation and beam expansion unit on the transmission path through a first reflector on the transmission path and expanded into a laser beam of the 10mm transmission path, the laser beam of the 10mm transmission path is shaped into a primary round flat top beam of the 10mm transmission path through a round flat top beam shaping unit on the transmission path and then is sent into a beam mask on the transmission path to generate round flat top beams which are 15 × 15 in number, have the same size and energy and are distributed in an array, and the round flat top beams are sequentially adjusted in incidence direction through a second reflector and a third reflector on the transmission path and then are sent into a 50-time infrared focusing objective lens on the transmission path to be focused into a round flat top beam of 20 microns to be sent into UTG products on the transmission path to drill the products.
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