CN111390393A - Method for processing micro-holes of atomization sheet by laser - Google Patents
Method for processing micro-holes of atomization sheet by laser Download PDFInfo
- Publication number
- CN111390393A CN111390393A CN202010331415.2A CN202010331415A CN111390393A CN 111390393 A CN111390393 A CN 111390393A CN 202010331415 A CN202010331415 A CN 202010331415A CN 111390393 A CN111390393 A CN 111390393A
- Authority
- CN
- China
- Prior art keywords
- laser
- hole section
- processing
- taper
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of atomization sheet processing, and discloses a method for processing micropores of an atomization sheet by laser, which comprises the following steps: s1, pre-dividing the conical hole section of the micropore into at least three layers along the direction from the large diameter to the small diameter; s2, setting parameters of a laser device respectively when the taper hole section of each layer is processed, enabling the laser device to emit infrared laser beams, adjusting the focus of the infrared laser beams, and processing the taper hole sections of each pre-layer in sequence; and S3, adjusting parameters of the laser, enabling the laser to emit ultraviolet laser beams, adjusting the focus of the ultraviolet laser beams to the straight hole section of the atomizing sheet, and processing the straight hole section of the micropore. Adjusting the infrared laser beam according to the hole depth and the diameter of the conical hole section of each layer, processing the conical hole sections layer by layer, and ensuring the large-taper forming of the conical hole sections; processing a straight hole section by using an ultraviolet laser beam, and ensuring that the aperture of the straight hole section is less than 3 mu m; and (3) carrying out segmented and layered processing on the micropores, and simultaneously processing the micropores containing the taper holes with large taper angles and the straight holes with small diameters by utilizing the properties of different lasers.
Description
Technical Field
The invention relates to the technical field of atomization sheet processing, in particular to a method for processing micropores of an atomization sheet by laser.
Background
Miniature atomizer mainly comprises transducer, the silver absorbs water, drive power supply and shell, and miniature atomizer's core spare part is the transducer, the transducer is also micropore atomizing piece, micropore atomizing piece generally comprises sheetmetal and piezoceramics, piezoceramics takes place piezoelectric effect and produces high frequency oscillation under drive power supply's effect, metal oscillation through the high frequency breaks up liquid hydrone structure and produces the elegant water smoke of nature, thereby produce the atomizing and spout from the micropore, compare the heating atomization mode, the energy obtains great saving.
Micron-scale micropore processing, which is usually laser processing, mainly comprises two types of micropore processing, namely, infrared laser is used for heating and vaporizing (evaporating) substances on the surface of a material to remove the material, but the diameter of the processed micropore is at least 4 μm; and secondly, ultraviolet laser is used to directly break molecular bonds of the material to enable molecules to be separated from the object, and the processed nano-scale micropores have small taper.
The application publication No. CN105057895A application publication No. 2015.11.18 of Chinese invention patent application discloses a method for forming micropores of an ultrashort pulse laser steel foil and improving the taper, and the laser generation step comprises the following steps: generating infrared laser by adopting a femtosecond laser; laser drilling: after being attenuated, infrared laser is focused on the surface of the steel foil through a focusing lens, and micropores are prepared on the surface of the steel foil through a contour detour method; the focusing light spot of the infrared laser gradually moves downwards to feed along with the increase of the depth of the micropore; surface cleaning: cleaning the surface of the steel foil after the micropore preparation is finished; wherein, the infrared laser is a fundamental mode laser. The method for forming the micro-holes and improving the taper of the ultrashort pulse laser steel foil processes the micro-holes in a mode that femtosecond infrared laser roundly passes through the contour and simultaneously downwards moves into a focusing plane, and the diameter of the micro-holes processed by the method is more than 10 mu m.
An atomizing sheet for an atomizer has a plurality of micropores, and the micropore is mostly the toper structure, and the size of its cone angle has decisive influence to the liquid droplet size after atomizing and the stability of whole atomization process. In order to pursue the best atomization effect of the atomizer, as shown in fig. 1, the micropores 102 on the atomization sheet 101 are formed by connecting a taper hole section 103 and a straight hole section 104, and when the taper hole section is a large taper angle of 40-90 degrees and the diameter of the straight hole section is less than 3 μm, the atomization effect is the best. However, in the conventional laser processing method, no matter infrared laser or ultraviolet laser is used, when the micro-hole is processed, the micro-hole simultaneously comprising the taper hole with the large taper angle and the straight hole with the small diameter cannot be processed.
Disclosure of Invention
The purpose of the invention is: the method for processing the micropores of the atomizing sheet by the laser is provided to solve the problem that the laser processing method in the prior art cannot process the micropores simultaneously containing the taper holes with large taper angles and the straight holes with small diameters.
In order to achieve the above object, the present invention provides a method for laser processing micro-holes of an atomized sheet, comprising the steps of: s1, pre-dividing the taper hole section of the micropore into at least three layers along the direction from the large diameter to the small diameter according to the taper and the hole depth of the taper hole section of the micropore on the atomizing sheet to be processed; s2, setting parameters of a laser respectively when the taper hole section of each layer is processed according to the hole depth and the diameter of the divided taper hole section of each layer, wherein the laser emits infrared laser beams, the focus of the infrared laser beams is adjusted according to the number of layers of the taper hole section to be processed, and each pre-layered taper hole section is processed in sequence from the large diameter to the small diameter of the taper hole section; and S3, adjusting parameters of the laser, enabling the laser to emit ultraviolet laser beams, adjusting the focus of the ultraviolet laser beams to the straight hole section of the atomizing sheet, and processing the straight hole section of the micropore.
Preferably, in step S2, the parameters of the laser include a laser pulse width, a working power, a scanning speed, and a repetition frequency, the laser pulse width is 290fs to 10ps, the working power is 0 to 40W, the scanning speed is 0 to 2000mm/S, the repetition frequency is 1 to 600kHz, the parameters of the laser further include a pulse frequency or a pulse wavelength, the pulse wavelength is greater than 0.7 μm, and the laser emits an infrared laser beam.
Preferably, the parameters of the laser further include pulse energy, defining the pulse energy as E, the diameter of each layer of the taper hole section to be processed as d, the hole depth as h, and the relationship between the hole diameter, the hole depth and the pulse energy satisfies:
wherein, LBVaporization heat volume heating value for material to be processed in the atomizing sheet, LMThe volume heat value of the melting heat of the material, and theta is a divergence half angle of the infrared laser beam when irradiating the surface of the material.
Preferably, the pulse frequency or pulse wavelength among the parameters of the laser is varied, the pulse wavelength being less than 0.4 μm, the laser emitting an ultraviolet laser beam.
Preferably, in step S2 or S3, the focus of the infrared laser beam or the ultraviolet laser beam is adjusted by adjusting an optical system including a double separation lens, a diaphragm, and a focusing objective lens arranged in this order along the optical path of the laser, and the focus positions of the double separation lens and the focusing objective lens are changed to adjust the focus of the infrared laser beam or the ultraviolet laser beam.
Preferably, in step S2 or S3, a nozzle is disposed above the atomized sheet to be processed, and the gas is injected to the micropores of the atomized sheet through the nozzle while the conical section and the straight section are processed, so as to remove the slag.
Preferably, the gas ejected from the nozzle is nitrogen or CO2And the injection pressure of the gas is not more than 1 MPa.
Compared with the prior art, the method for processing the micropores of the atomizing sheet by using the laser has the beneficial effects that: dividing the taper hole section into a plurality of layers according to the large taper requirement of the taper hole section of the micropore of the atomizing sheet, adjusting the infrared laser beam according to the hole depth and the diameter of the taper hole section of each layer to adapt to the taper of each layer of the taper hole section, processing the taper hole section layer by layer, and ensuring the large taper forming of the taper hole section; simultaneously, processing a straight hole section by utilizing an ultraviolet laser beam, and ensuring that the aperture of the straight hole section is less than 3 mu m; and (3) carrying out segmented and layered processing on the micropores, and simultaneously processing the micropores containing the taper holes with large taper angles and the straight holes with small diameters by using the properties of different lasers.
Drawings
FIG. 1 is a schematic structural view of a conventional atomizing plate and atomizing holes;
FIG. 2 is a schematic view of a layered configuration of the tapered bore section of the atomizing plate of the present invention;
FIG. 3 is a schematic view of a processing state of the method of laser processing the minute hole of the atomizing sheet of the present invention;
fig. 4 is a schematic structural view of an optical system of the method of laser processing micro-holes of an atomizing sheet of fig. 3.
In the figure, 1, a laser; 2. a laser beam; 3. an optical system; 31. a double separation lens; 32. a diaphragm; 33. a focusing objective lens; 4. a nozzle; 5. a clamp; 6. a work table; 101. an atomizing sheet; 102. micropores; 103. a tapered bore section; 104. a straight hole section.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the preferred embodiment of the method for processing the micro-holes of the laser atomization sheet of the invention, as shown in fig. 2 to 4, the micro-holes 102 on the atomization sheet 101 are formed by connecting a conical hole section 103 and a straight hole section 104, the conical hole section has a large taper angle of 40-90 degrees, the diameter of the straight hole section is less than 3 μm, the large diameter of the conical hole section faces upwards, and the straight hole section is positioned at the lower side of the conical hole section.
The method for processing the micropores of the atomization sheet by the laser comprises the following steps:
s1, arranging the atomizing sheet 101 to be processed on a fixture 5, fixing the atomizing sheet 101 by the fixture 5, mounting and fixing the fixture 5 on a worktable 6, arranging a nozzle 4, a laser 1 and an optical system 3 above the atomizing sheet 101, arranging the nozzle 4 laterally above to avoid affecting the laser beam 2 emitted by the laser 1, arranging the optical system 3 between the laser 1 and the atomizing sheet 101, and arranging the optical system 3 including a double-separating lens 31, a diaphragm 32 and a focusing objective lens 33, the double-separating lens 31, the diaphragm 32 and the focusing objective lens 33 in sequence along the optical path of the laser beam 2.
According to the taper and the hole depth of the taper hole section 103 of the micro hole 102 on the atomizing sheet 101 to be processed, the taper hole section 103 is pre-divided into three layers along the direction from the large diameter to the small diameter, and the diameter and the hole depth of the taper hole section 103 of each layer are determined;
s2, respectively setting parameters of the laser 1 when the taper hole section 103 of each layer is processed according to the hole depth and the diameter of the divided taper hole section 103 of each layer, wherein the parameters of the laser 1 comprise laser pulse width, working power, scanning speed and repetition frequency, the laser pulse width is 290 fs-10 ps, the working power is 0-40W, the scanning speed is 0-2000 mm/S, and the repetition frequency is 1-600 kHz; the parameters of the laser 1 also include pulse frequency or pulse wavelength, the pulse wavelength of the laser 1 is adjusted to be more than 0.7 μm, and the laser 1 emits infrared laser beams.
The parameters of the laser 1 further include pulse energy, defining the pulse energy as E, the diameter of each layer of the taper hole segment 103 to be processed as d, the hole depth as h, and a nonlinear relationship among the hole diameter d, the hole depth h, and the pulse energy E, where the relationship satisfies:
wherein, LBFor vaporization heat volume heating value of material to be processed of the atomizing sheet 101, LMThe volume heat value of the melting heat of the material, and theta is a divergence half angle when the infrared laser beam irradiates the surface of the material;
preferably, the pulse energy of the infrared laser beam machining cone surface decreases layer by layer along the direction from the large diameter to the small diameter of the taper hole section 103.
When the conical hole section 103 of each layer is processed, the focal positions of the double separation lens 31 and the focusing objective lens 33 of the optical system 3 are respectively adjusted, and the focal positions of the infrared laser beams are adjusted by changing the focal positions of the double separation lens 31 and the focusing objective lens 33, so that the focusing plane of the infrared laser beams emitted by the laser 1 is moved to the position to be processed of the conical hole section 103 on the atomizing sheet 101, and the conical hole section 103 of each layer is respectively processed.
Meanwhile, gas is sprayed to the micropores 102 of the atomizing sheet 101 by using the nozzle 4, and slag generated by infrared laser beam processing is removed; the gas to be injected is nitrogen or CO2The injection pressure of the gas is not more than 1 MPa; preferably, the injection pressure is 0.8 MPa.
The infrared laser beam sequentially processes each pre-layered taper hole section 103 layer by layer from the large diameter to the small diameter of the taper hole section 103 until all the taper hole sections 103 of the micropore 102 are processed;
and S3, adjusting parameters of the laser 1, changing the pulse frequency or pulse wavelength of the laser beam 2 emitted by the laser 1, wherein the pulse wavelength is less than 0.4 μm, and enabling the laser 1 to emit ultraviolet laser beams.
The focal positions of the double separation lens 31 and the focusing objective lens 33 of the optical system 3 are adjusted, and the focal positions of the double separation lens 31 and the focusing objective lens 33 are changed to adjust the focal point of the ultraviolet laser beam, so that the focal plane of the ultraviolet laser beam emitted by the laser 1 is moved to the position to be processed of the straight hole section 104 on the atomizing sheet 101, and the straight hole section 104 is processed.
Meanwhile, gas is sprayed to the micropores 102 of the atomizing sheet 101 by using the nozzle 4, and slag generated by processing of ultraviolet laser beams is removed; the gas to be injected is nitrogen or CO2The injection pressure of the gas is not more than 1 MPa; preferably, the injection pressure is 0.8 MPa.
In this embodiment, the same laser 1 is adopted to emit a laser beam 2, and the laser 1 is made to emit an infrared laser beam or an ultraviolet laser beam by adjusting the pulse wavelength, where the laser 1 may be a free electron laser 1, a titanium sapphire laser 1, a dye laser 1, or the like; in other embodiments, different lasers 1 may be used, with different lasers 1 being dividedRespectively emitting infrared laser beam or ultraviolet laser beam, and the commonly used infrared laser 1 comprises Nd, YAG laser 1, CO2The laser 1, the ultraviolet laser 1 comprises a UV-YAG laser 1 and an excimer laser 1.
To sum up, the embodiment of the present invention provides a method for laser processing a micropore of an atomizing sheet, which divides a taper hole section into a plurality of layers according to the large taper requirement of the taper hole section of the micropore of the atomizing sheet, adjusts an infrared laser beam according to the hole depth and the diameter of the taper hole section of each layer, so as to adapt to the taper of each layer of the taper hole section, processes the taper hole section layer by layer, and ensures the large taper forming of the taper hole section; simultaneously, processing a straight hole section by utilizing an ultraviolet laser beam, and ensuring that the aperture of the straight hole section is less than 3 mu m; and (3) carrying out segmented and layered processing on the micropores, and simultaneously processing the micropores containing the taper holes with large taper angles and the straight holes with small diameters by using the properties of different lasers.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (7)
1. A method for processing micropores of an atomized sheet by laser is characterized by comprising the following steps: s1, pre-dividing the taper hole section of the micropore into at least three layers along the direction from the large diameter to the small diameter according to the taper and the hole depth of the taper hole section of the micropore on the atomizing sheet to be processed; s2, setting parameters of a laser respectively when the taper hole section of each layer is processed according to the hole depth and the diameter of the divided taper hole section of each layer, wherein the laser emits infrared laser beams, the focus of the infrared laser beams is adjusted according to the number of layers of the taper hole section to be processed, and each pre-layered taper hole section is processed in sequence from the large diameter to the small diameter of the taper hole section; and S3, adjusting parameters of the laser, enabling the laser to emit ultraviolet laser beams, adjusting the focus of the ultraviolet laser beams to the straight hole section of the atomizing sheet, and processing the straight hole section of the micropore.
2. The method for processing the micropore of the atomizing sheet by using the laser as claimed in claim 1, wherein in step S2, the parameters of the laser comprise laser pulse width, working power, scanning speed and repetition frequency, the laser pulse width is 290 fs-10 ps, the working power is 0-40W, the scanning speed is 0-2000 mm/S, the repetition frequency is 1-600 kHz, the parameters of the laser further comprise pulse frequency or pulse wavelength, the pulse wavelength is more than 0.7 μm, and the laser emits infrared laser beam.
3. A method for laser machining a micro-hole of an atomized sheet according to claim 2, wherein the parameters of the laser further include pulse energy, the pulse energy is defined as E, each layer of the taper hole section to be machined has a diameter d and a hole depth h, and the relationship between the hole diameter, the hole depth and the pulse energy satisfies:
wherein, LBVaporization heat volume heating value for material to be processed in the atomizing sheet, LMThe volume heat value of the melting heat of the material, and theta is a divergence half angle of the infrared laser beam when irradiating the surface of the material.
4. The method for laser processing micro holes of an atomizing sheet according to claim 2, wherein in step S3, the pulse frequency or pulse wavelength among the parameters of the laser is changed, the pulse wavelength is less than 0.4 μm, and the laser emits the ultraviolet laser beam.
5. The method for laser processing fine holes of an atomizing plate according to any one of claims 1 to 4, wherein the focus of the infrared laser beam or the ultraviolet laser beam is adjusted by adjusting an optical system including a double separation lens, a diaphragm and a focusing objective lens arranged in this order along the optical path of the laser beam in step S2 or S3, and the focus positions of the double separation lens and the focusing objective lens are changed to adjust the focus of the infrared laser beam or the ultraviolet laser beam.
6. The method for laser processing micro-holes of an atomized sheet according to any of the claims 1 to 4, wherein in step S2 or S3, a nozzle is arranged above the atomized sheet to be processed, and the gas is injected to the micro-holes of the atomized sheet through the nozzle to remove the slag while the conical hole section and the straight hole section are processed.
7. The method for laser processing micro-holes of an atomizing sheet as claimed in claim 6, wherein the gas sprayed from the nozzle is nitrogen or CO2And the injection pressure of the gas is not more than 1 MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010331415.2A CN111390393A (en) | 2020-04-23 | 2020-04-23 | Method for processing micro-holes of atomization sheet by laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010331415.2A CN111390393A (en) | 2020-04-23 | 2020-04-23 | Method for processing micro-holes of atomization sheet by laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111390393A true CN111390393A (en) | 2020-07-10 |
Family
ID=71426166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010331415.2A Pending CN111390393A (en) | 2020-04-23 | 2020-04-23 | Method for processing micro-holes of atomization sheet by laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111390393A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774741A (en) * | 2020-08-14 | 2020-10-16 | 长春理工大学 | Laser drilling method of composite hole based on tip bright spot guiding |
| CN112192325A (en) * | 2020-10-09 | 2021-01-08 | 北京理工大学 | Method for machining micro-nano scale through hole in transparent hard and brittle material by femtosecond laser |
| CN112935592A (en) * | 2021-01-21 | 2021-06-11 | 华清创智光电科技(清远)有限公司 | Method for laser processing through hole for preventing molten metal from splashing |
| CN113146075A (en) * | 2020-12-02 | 2021-07-23 | 温锦华 | Manufacturing method of atomization structure |
| CN113414507A (en) * | 2021-07-12 | 2021-09-21 | 深圳来福士雾化医学有限公司 | Micropore processing method for polyimide film atomization sheet |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101398507A (en) * | 2007-09-29 | 2009-04-01 | 光宝科技股份有限公司 | Light conducting plate for forming laser processing pattern on light incidence plane and method for producing the same |
| DE102014200967A1 (en) * | 2014-01-21 | 2015-07-23 | Robert Bosch Gmbh | Method for producing an electrically conductive via on a circuit carrier and assembly with a circuit carrier |
| CN105436718A (en) * | 2014-08-26 | 2016-03-30 | 安捷利电子科技（苏州）有限公司 | UV laser drilling method for preparing blind holes controllable in taper |
| CN106363306A (en) * | 2016-12-05 | 2017-02-01 | 清华大学 | Machining method and system for oil nozzle spray hole |
| CN110877161A (en) * | 2019-11-20 | 2020-03-13 | 清华大学 | Special-shaped hole machining system based on space shaping femtosecond laser layered scanning |
-
2020
- 2020-04-23 CN CN202010331415.2A patent/CN111390393A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101398507A (en) * | 2007-09-29 | 2009-04-01 | 光宝科技股份有限公司 | Light conducting plate for forming laser processing pattern on light incidence plane and method for producing the same |
| DE102014200967A1 (en) * | 2014-01-21 | 2015-07-23 | Robert Bosch Gmbh | Method for producing an electrically conductive via on a circuit carrier and assembly with a circuit carrier |
| CN105436718A (en) * | 2014-08-26 | 2016-03-30 | 安捷利电子科技（苏州）有限公司 | UV laser drilling method for preparing blind holes controllable in taper |
| CN106363306A (en) * | 2016-12-05 | 2017-02-01 | 清华大学 | Machining method and system for oil nozzle spray hole |
| CN110877161A (en) * | 2019-11-20 | 2020-03-13 | 清华大学 | Special-shaped hole machining system based on space shaping femtosecond laser layered scanning |
Non-Patent Citations (3)
| Title |
|---|
| 左敦稳: "《现代加工技术实验教程》", 31 August 2014 * |
| 杨质苍: "《精密机械制造工艺学》", 31 August 1988 * |
| 雷仕湛: "《激光智能制造技术》", 30 June 2018 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774741A (en) * | 2020-08-14 | 2020-10-16 | 长春理工大学 | Laser drilling method of composite hole based on tip bright spot guiding |
| CN112192325A (en) * | 2020-10-09 | 2021-01-08 | 北京理工大学 | Method for machining micro-nano scale through hole in transparent hard and brittle material by femtosecond laser |
| CN113146075A (en) * | 2020-12-02 | 2021-07-23 | 温锦华 | Manufacturing method of atomization structure |
| CN112935592A (en) * | 2021-01-21 | 2021-06-11 | 华清创智光电科技(清远)有限公司 | Method for laser processing through hole for preventing molten metal from splashing |
| CN113414507A (en) * | 2021-07-12 | 2021-09-21 | 深圳来福士雾化医学有限公司 | Micropore processing method for polyimide film atomization sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111390393A (en) | Method for processing micro-holes of atomization sheet by laser | |
| US11713271B2 (en) | Device and method for cutting out contours from planar substrates by means of laser | |
| CN107073653B (en) | For riving or the laser processing of cutting substrate | |
| TWI460043B (en) | Method and apparatus for laser drilling holes with gaussian pulses | |
| US10233112B2 (en) | Laser processing of slots and holes | |
| TWI584906B (en) | Method and apparatus for non-abaltive, photoaccoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses | |
| US7294807B2 (en) | Method and device for drilling holes in workpieces by means of laser beams | |
| JP5276699B2 (en) | Laser processing method and laser processing apparatus for piercing | |
| TW201805100A (en) | Laser processing apparatus and method | |
| TW201605569A (en) | Systems and methods for processing transparent materials using adjustable laser beam focal lines | |
| WO2017043460A1 (en) | Laser processing method and laser processing device for minimizing incidence of self-burning | |
| CN101811227A (en) | Method and device for laser punching | |
| WO2022222411A1 (en) | Pcb short-wavelength pulse laser drilling method and related apparatus | |
| CN207656103U (en) | A kind of high refractive index, low-rigidity transparent material laser cutter device | |
| CN213224728U (en) | Annular light spot manufacturing device and laser processing device | |
| CN106541213A (en) | A kind of water jet and laser coupled timber cutting method | |
| US6600132B2 (en) | Method and apparatus to generate orifice disk entry geometry | |
| He et al. | Recast-free helical drilling of fused silica using SHG picosecond laser pulses | |
| JP2009241119A (en) | Dividing method of crystalline material, and its apparatus | |
| JP2008296266A (en) | Laser cutting apparatus | |
| US6635847B2 (en) | Method of forming orifices and chamfers by collimated and non-collimated light | |
| CN112139679A (en) | LTCC (Low temperature Co-fired ceramic) green ceramic ultrafast laser drilling system and method | |
| CN110818241A (en) | Glass cutting method | |
| CN115555741A (en) | Method for processing micro-hole of atomizing sheet by ultrafast laser | |
| TW201446378A (en) | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200710 |
|
| RJ01 | Rejection of invention patent application after publication |