CN112935592A - Method for laser processing through hole for preventing molten metal from splashing - Google Patents
Method for laser processing through hole for preventing molten metal from splashing Download PDFInfo
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- CN112935592A CN112935592A CN202110079098.4A CN202110079098A CN112935592A CN 112935592 A CN112935592 A CN 112935592A CN 202110079098 A CN202110079098 A CN 202110079098A CN 112935592 A CN112935592 A CN 112935592A
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- laser beam
- hole
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a method for laser processing a through hole for preventing molten metal from splashing, which comprises the steps of sticking an isolating film on the surface to be processed of a workpiece to be processed; setting the initial frequency and the initial output power of a laser beam, and adjusting the focus of the laser beam to be positioned on the surface of a workpiece to be processed; maintaining the laser beam irradiating the surface for a first period of time such that the machining plane is located at about one-half of the depth of the through-hole; increasing the frequency of the laser beam, adjusting the focus of the laser beam to be positioned on the processing plane, and keeping the laser beam irradiating the processing plane for a second time period until a through hole is formed; and reducing the frequency of the laser beam, adjusting the focus of the laser beam to be positioned at the position from the surface of the workpiece to one fourth of the depth of the through hole, and keeping the laser beam irradiation for the third time period to obtain the through hole with the consistent upper and lower diameters. The method can prevent molten metal from splashing and avoid slag adhesion, can obtain the through holes with the diameters consistent up and down, and improves the processing precision of the through holes.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a method for processing a through hole by laser, which can prevent molten metal from splashing.
Background
In the laser processing technology, the laser processing of the metal processing piece is often accompanied with the splashing or adhesion of molten metal, the adhered metal slag is easy to damage the plate when more, and the splashed slag easily affects the personal safety of operators.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention mainly aims to provide a method for processing a through hole by laser, which prevents molten metal from splashing and avoids slag adhesion by adjusting laser frequency, and can realize the consistency of the diameter of the through hole up and down by combining with the adjustment of the focal position, thereby improving the precision of processing the through hole. Based on the purpose, the invention at least provides the following technical scheme:
a method of laser machining a via hole to prevent molten metal splattering, comprising the steps of:
sticking an isolation film on the surface to be processed of the workpiece to be processed;
setting the initial frequency and the initial output power of a laser beam, and adjusting the focus of the laser beam to be positioned on the surface of a workpiece to be processed;
maintaining the laser beam irradiating the surface for a first period of time such that the machining plane is located at about one-half of the depth of the through-hole;
increasing the frequency of the laser beam, adjusting the focus of the laser beam to be positioned on the processing plane, and keeping the laser beam irradiating the processing plane for a second time period until a through hole is formed;
and reducing the frequency of the laser beam, adjusting the focus of the laser beam to be positioned at the position from one third to one fourth of the depth of the through hole on the surface of the workpiece, and keeping the laser beam irradiation for the third time period to obtain the through hole with the consistent upper and lower diameters.
Preferably, the pulse is a rectangular wave pulse.
Preferably, the first time period is greater than the second time period.
Preferably, the first period of time is equal to the second period of time.
Preferably, the third time period is less than the first time period and greater than the second time period.
Preferably, before keeping the laser beam irradiating for the third time period, the focus of the laser beam is adjusted to be positioned at the position of one fourth of the depth of the through hole from the surface of the workpiece.
Preferably, the frequency of the laser beam in the third time period is greater than said initial frequency.
Preferably, the second time period and the third time period start the air draft of the intermittent operation mode.
Preferably, the depth of the through hole is 1-1.5 cm.
Drawings
Fig. 1 is a flowchart of a method for laser processing a via hole according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, other embodiments obtained by persons of ordinary skill in the art without any creative effort belong to the protection scope of the present invention.
The present invention will be described in further detail below, in which a method of processing a through hole is performed on a metal plate material, and in this embodiment, a steel plate is used as an example of a plate material to be processed. An embodiment of the present invention provides a method for laser processing a through hole to prevent molten metal from splashing, wherein the depth of the through hole processed by the method is 1-1.5 cm. In this embodiment, the processing depth of the through-hole is 1 cm. The method specifically comprises the following steps:
the method comprises the steps of providing a workpiece to be processed, and attaching an isolating film to the surface of the workpiece to be processed, wherein specifically, the isolating film can also be arranged on the surface of the workpiece to be processed in a coating mode. The molten metal produced in the subsequent piercing process will adhere to the barrier film rather than directly to the surface of the part to be machined.
Setting the initial frequency and the initial output power of the laser beam, and adjusting the focal point of the laser beam to be positioned on the surface of the workpiece to be processed. At the moment, the highest laser energy density on the surface of the workpiece to be processed is beneficial to opening the hole.
And keeping the laser beam irradiating the surface of the workpiece to be processed for a first time period, so that the processing plane continuously moves downwards to a position about one half of the depth of the through hole. In the process, the focal position of the laser beam is always kept on the initial surface of the workpiece, namely the focal position is always kept to move above the processing plane except the initial processing position, so that the melting of slag generated in the processing process is facilitated.
After the machining plane is moved down to a position about one-half of the depth of the through hole, the frequency of the laser beam is increased, that is, the initial frequency is increased, the output power of a single pulse is reduced, the focal point of the laser beam is adjusted to be positioned on the machining plane at the moment, that is, the focal point is positioned at a position about one-half of the depth of the through hole, and the laser beam is kept irradiating the machining plane for a second time period until the through hole is drilled. In the process, the frequency is improved by adjusting the perforation condition, so that the output power of single pulse is reduced, and the amount of slag is effectively reduced.
The frequency of the laser beam is reduced, in this embodiment the frequency of the laser beam in this step is greater than the initial frequency. And adjusting the focal point of the laser beam to be positioned at the position from one third to one fourth of the depth of the through hole from the surface of the workpiece, in a preferable scheme, the focal point is positioned at the position from one fourth of the depth of the through hole from the surface of the workpiece, and keeping the laser beam irradiating for the third time period to obtain the through hole with consistent upper and lower diameters. In the process, the laser beam frequency is adjusted and the focus position is moved upwards, so that the slag is further removed, the diameter of the through hole can be ensured to be uniform from top to bottom, and the processing accuracy is improved.
In a preferred embodiment, the pulses of the laser beam are preferably square wave pulses. The first time period is greater than the second time period, the third time period is less than the first time period, and the third time period is greater than the second time period. In another preferred embodiment, the first period of time is equal to the second period of time.
In a preferred scheme, the air draft of the intermittent operation mode is started in the second time period and the third time period, so that the collection of slag, smoke and the like is facilitated, and the physical health of operation workers is facilitated.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (9)
1. A method of laser machining a through hole to prevent molten metal from splashing, comprising the steps of:
sticking an isolation film on the surface to be processed of the workpiece to be processed;
setting the initial frequency and the initial output power of a laser beam, and adjusting the focus of the laser beam to be positioned on the surface of a workpiece to be processed;
maintaining the laser beam irradiating the surface for a first period of time such that the machining plane is located at about one-half of the depth of the through-hole;
increasing the frequency of the laser beam, adjusting the focus of the laser beam to be positioned on the processing plane, and keeping the laser beam irradiating the processing plane for a second time period until a through hole is formed;
and reducing the frequency of the laser beam, adjusting the focus of the laser beam to be positioned at the position from one third to one fourth of the depth of the through hole on the surface of the workpiece, and keeping the laser beam irradiation for the third time period to obtain the through hole with the consistent upper and lower diameters.
2. The method of claim 1, wherein the pulse is a square wave pulse.
3. The method of claim 1 or 2, wherein the first time period is greater than the second time period.
4. The method of claim 1 or 2, wherein the first time period is equal to the second time period.
5. The method of claim 3, wherein the third time period is less than the first time period and greater than the second time period.
6. The method according to claim 1 or 2, wherein the focus of the laser beam is adjusted to be located at a position of one-quarter of the depth of the through-hole from the surface of the workpiece before the irradiation of the laser beam is maintained for the third period of time.
7. A method according to claim 1 or 2, characterized in that the frequency of the laser beam in the third period of time is greater than said initial frequency.
8. The method of claim 1, wherein the second and third periods of time turn on an intermittent operating mode of ventilation.
9. The method of claim 1, wherein the depth of the through-hole is 1 to 1.5 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110079098.4A CN112935592A (en) | 2021-01-21 | 2021-01-21 | Method for laser processing through hole for preventing molten metal from splashing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110079098.4A CN112935592A (en) | 2021-01-21 | 2021-01-21 | Method for laser processing through hole for preventing molten metal from splashing |
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| Publication Number | Publication Date |
|---|---|
| CN112935592A true CN112935592A (en) | 2021-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110079098.4A Pending CN112935592A (en) | 2021-01-21 | 2021-01-21 | Method for laser processing through hole for preventing molten metal from splashing |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014165249A (en) * | 2013-02-22 | 2014-09-08 | Fujikura Ltd | Method of manufacturing substrate with micropores |
| CN105171251A (en) * | 2015-10-19 | 2015-12-23 | 无锡清杨机械制造有限公司 | Laser punching process |
| CN106312334A (en) * | 2016-10-25 | 2017-01-11 | 宇龙计算机通信科技(深圳)有限公司 | PCB board drilling method and numerical-control machine tool system |
| CN110014237A (en) * | 2019-04-10 | 2019-07-16 | 无锡洲翔激光设备有限公司 | The quick piercing process of thick stainless steel plate in one kind |
| CN111390393A (en) * | 2020-04-23 | 2020-07-10 | 广州大学 | Method for processing micro-holes of atomization sheet by laser |
-
2021
- 2021-01-21 CN CN202110079098.4A patent/CN112935592A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014165249A (en) * | 2013-02-22 | 2014-09-08 | Fujikura Ltd | Method of manufacturing substrate with micropores |
| CN105171251A (en) * | 2015-10-19 | 2015-12-23 | 无锡清杨机械制造有限公司 | Laser punching process |
| CN106312334A (en) * | 2016-10-25 | 2017-01-11 | 宇龙计算机通信科技(深圳)有限公司 | PCB board drilling method and numerical-control machine tool system |
| CN110014237A (en) * | 2019-04-10 | 2019-07-16 | 无锡洲翔激光设备有限公司 | The quick piercing process of thick stainless steel plate in one kind |
| CN111390393A (en) * | 2020-04-23 | 2020-07-10 | 广州大学 | Method for processing micro-holes of atomization sheet by laser |
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Application publication date: 20210611 |