CN113414507A - Micropore processing method for polyimide film atomization sheet - Google Patents
Micropore processing method for polyimide film atomization sheet Download PDFInfo
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- CN113414507A CN113414507A CN202110793664.8A CN202110793664A CN113414507A CN 113414507 A CN113414507 A CN 113414507A CN 202110793664 A CN202110793664 A CN 202110793664A CN 113414507 A CN113414507 A CN 113414507A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The invention relates to the technical field of atomization sheet processing, and discloses a micropore processing method of a polyimide film atomization sheet, which comprises the following steps: (1) punching the polyimide film by using laser, wherein the pulse energy of the laser is 0.9J, the number of pulses is 3/s, the pulse width is 1.1ms, the repetition frequency is 45Hz, and the defocusing amount is +0.5 mm; (2) after punching, the taper α of the hole is arctan [ (d1-d2)/h ] when the upper hole diameter d1, the lower hole diameter d2 and the hole depth h are measured. The invention takes polyimide film material as material, adopts orthogonal experiment method to carry out pulse punching experiment research, and the system analysis process parameters are as follows: the method comprises the following steps of obtaining the optimal process combination parameters of laser drilling by five factors of pulse energy, pulse number, pulse width, repetition frequency and defocusing amount and the influence degree on the micropore forming quality, aperture and taper.
Description
Technical Field
The invention relates to the technical field of atomization sheet processing, in particular to a micropore processing method of a polyimide film atomization sheet.
Background
The atomizing sheet is a core part of the atomizer and is used for scattering a liquid water molecule structure to generate naturally elegant water mist, so that atomization is generated and is sprayed out of micropores of the atomizing sheet. The atomizing sheet is provided with a plurality of micropores, most of the micropores are in a conical structure, and the size of the cone angle of the micropores has decisive influence on the size of the atomized liquid drops and the stability of the whole atomizing process.
The processing method of the micro-holes of the atomizing sheet comprises laser ablation or chemical etching. Micron-scale micropore processing, which is usually selected from laser processing, wherein infrared laser is used to heat and vaporize substances on the surface of a material to remove the material, but the diameter of a processed micropore is at least 4 μm; and secondly, ultraviolet laser is used for directly breaking molecular bonds of the material to separate molecules from the object, nano-scale micropores are processed, and the taper is extremely small.
At present, the laser drilling of the polyimide film atomized sheet is influenced by one or two factors which are considered separately. For example, chinese patent CN106493032A discloses a composite atomizing sheet and a method for manufacturing the same, wherein laser drilling defines three factors, namely, the number of pulses and the pulse energy. Chinese patent CN111390393A discloses a method for laser processing micro-holes of an atomizing sheet, wherein laser drilling defines laser pulse width and repetition frequency, the diameter of each layer of a conical hole section 103 to be processed is d, the hole depth is h, and a nonlinear relationship is formed between the hole diameter d, the hole depth h and pulse energy E. These patents consider the effect of one or two process parameters on pore quality independently, and do not consider the interaction between the parameters, the degree of effect on pore formation quality, pore size and taper.
Therefore, it is highly desirable to develop a method for processing micropores of a polyimide atomization sheet.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a method for processing micropores in a polyimide film atomized sheet. The invention takes polyimide film material as material, adopts orthogonal experiment method to carry out pulse punching experiment research, and the system analysis process parameters are as follows: the method comprises the following steps of obtaining the optimal process combination parameters of laser drilling by five factors of pulse energy, pulse number, pulse width, repetition frequency and defocusing amount and the influence degree on the micropore forming quality, aperture and taper.
In order to achieve the purpose, the invention adopts the following technical scheme:
a micropore processing method of a polyimide film atomization sheet comprises the following steps:
(1) punching the polyimide film by using laser, wherein the pulse energy of the laser is 0.9J, the number of pulses is 3/s, the pulse width is 1.1ms, the repetition frequency is 45Hz, and the defocusing amount is +0.5 mm;
(2) after punching, the taper α of the hole is arctan [ (d1-d2)/h ] when the upper hole diameter d1, the lower hole diameter d2 and the hole depth h are measured.
Preferably, the performance indexes of the polyimide film are as follows: the long-term heat resistance temperature is more than or equal to 280 ℃, the thickness is 25-125 mu m, the thickness deviation is +/-2-4, the longitudinal tensile strength is more than or equal to 140MPa, the transverse tensile strength is more than or equal to 115MPa, the elongation at break is more than or equal to 40%, the shrinkage rate at 150 ℃ is less than or equal to 1.0%, the shrinkage rate at 400 ℃ is less than or equal to 3.0%, and the surface resistivity is more than or equal to 1.0 multiplied by 1013Omega, volume resistivity is more than or equal to 1.0 multiplied by 1010Omega, m, relative dielectric constant of 3.5 +/-0.4, dielectric loss factor not more than 4.0X 10_ 3The density is 1.420 +/-20 kg/m3。
Preferably, when the thickness of the polyimide film is 25-50 μm, the average power frequency electric intensity is not less than 150MV/m, and the individual power frequency electric intensity is not less than 100 MV/m.
Preferably, when the thickness of the polyimide film is 75-100 μm, the average power frequency electric intensity is not less than 130MV/m, and the individual power frequency electric intensity is not less than 80 MV/m.
Preferably, when the thickness of the polyimide film is 100-125 μm, the average power frequency electric intensity is greater than or equal to 110MV/m, and the individual power frequency electric intensity is greater than or equal to 70 MV/m.
Compared with the prior art, the invention has the following beneficial effects:
the invention takes polyimide film material as material, adopts orthogonal experiment method to carry out pulse punching experiment research, and the system analysis process parameters are as follows: the method comprises the following steps of obtaining the optimal process combination parameters of laser drilling by five factors of pulse energy, pulse number, pulse width, repetition frequency and defocusing amount and the influence degree on the micropore forming quality, aperture and taper.
Description of the drawings
FIG. 1 is a schematic representation of the structure of a processed microwell of the present invention.
Wherein d 1-upper aperture, d 2-lower aperture, h-hole depth, alpha-taper.
Detailed Description
The present invention will be further described with reference to the following examples.
The invention discloses a micropore processing method of a polyimide film atomizing sheet, which comprises the following steps:
(1) punching the polyimide film by using laser, wherein the pulse energy of the laser is 0.9J, the number of pulses is 3/s, the pulse width is 1.1ms, the repetition frequency is 45Hz, and the defocusing amount is +0.5 mm;
(2) after punching, the upper hole diameter d1, the lower hole diameter d2 and the hole depth h are measured, and as shown in fig. 1, the taper α of the hole is arctan [ (d1-d2)/h ].
The performance indexes of the polyimide film are as follows: the long-term heat resistance temperature is more than or equal to 280 ℃, the thickness is 25-125 mu m, the thickness deviation is +/-2-4, the longitudinal tensile strength is more than or equal to 140MPa, the transverse tensile strength is more than or equal to 115MPa, the elongation at break is more than or equal to 40%, the shrinkage rate at 150 ℃ is less than or equal to 1.0%, the shrinkage rate at 400 ℃ is less than or equal to 3.0%, and the surface resistivity is more than or equal to 1.0 multiplied by 1013Omega, volume resistivity is more than or equal to 1.0 multiplied by 1010Omega, m, relative dielectric constant of 3.5 +/-0.4, dielectric loss factor not more than 4.0X 10_ 3The density is 1.420 +/-20 kg/m3. When the thickness of the polyimide film is 25-50 mu m, the average value of the power frequency electric intensity is more than or equal to 150MV/m, and the individual value of the power frequency electric intensity is more than or equal to 100 MV/m. When the thickness of the polyimide film is 75-100 mu m, the average value of the power frequency electric intensity is more than or equal to 130MV/m, and the individual value of the power frequency electric intensity is more than or equal to 80 MV/m. When the thickness of the polyimide film is 100-125 mu m, the average value of the power frequency electric intensity is more than or equal to 110MV/m, and the individual value of the power frequency electric intensity is more than or equal to 70 MV/m.
The invention takes polyimide film material as material, adopts orthogonal experiment method to carry out pulse punching experiment research, and the system analysis process parameters are as follows: and the influence degree of the pulse energy A, the pulse number B, the pulse width C, the repetition frequency D and the defocusing amount E on the micropore forming quality, the aperture and the taper is obtained, and the optimal process combination parameters of the laser drilling are obtained. The method comprises the following specific steps:
for five factors of pulse energy A, pulse number B, pulse width C, repetition frequency D and defocusing amount E, 5 levels (1-5) are set under each factor, and the levels of orthogonal factors are shown in table 1:
TABLE 1 orthogonal factor horizon
| Serial number | Pulse energy/J | Number of B pulses | C pulse width/ms | D repetition frequency/Hz | E defocus/mm |
| 1 | 0.9 | 3 | 0.5 | 30 | -1 |
| 2 | 1.3 | 6 | 0.7 | 35 | -0.5 |
| 3 | 1.7 | 9 | 0.9 | 40 | 0 |
| 4 | 2.1 | 12 | 1.1 | 45 | +0.5 |
| 5 | 2.5 | 15 | 1.3 | 50 | +1 |
In the above orthogonal factor horizontal range, the upper and lower apertures and taper are selected as the test indexes, and six columns of five factors, five levels and 25 sets of experiments are adopted, as shown in table 2:
TABLE 2 orthogonal experimental methods
Based on the range data of the upper and lower wells, the optimal combination parameters were obtained as shown in tables 3 and 4.
For this factor of pulse energy a, there are a total of five levels: a1, a2, A3, a4 and a5, as shown in table 1, the five levels of experimental environment are the same, and assuming that the factor a has no influence on the final result of the experimental index, KA1, KA2, KA3, KA4 and KA5 should be the same (Ki is the average value of the result indexes of the ith level of each factor), otherwise, the change of the factor a has an effect on the experimental result. And then the influence of A1, A2, A3, A4 and A5 on the index of the experimental result can be analyzed according to the sizes of KA1, KA2, KA3, KA4 and KA 5. If a smaller index value is to be obtained, the smaller Ki is better, whereas the larger Ki is better. Following the same rationale, it is possible to calculate and determine that the factor B, C, D, E is close to the desired value level (merit level), and combine the merit levels of the factor A, B, C, D, E, F to yield the optimum level combination for the experiment. Calculating the sum of the results of each level experiment, namely K1, K2, K3 and K4 on columns 1, 2, 3, 4 and 5 by pole difference analysis, obtaining R values (pole differences) of K1, K2, K3, K4 and K (the K values represent experiment times), wherein R is Kmax-Kmin, selecting the optimal level combination from five groups of parameters of pulse energy, pulse number, pulse width, repetition frequency and defocusing amount according to the calculation results, and selecting the most level combination (namely the best experiment parameter) according to the magnitude of R values and the sequence of significance of factors, and comparing the K values.
For the upper and lower apertures, the optimized combination of the levels of the factors is A3B1C4D4E6 (Table 2), i.e. the pulse energy is 0.9J, the number of pulses is 3/s, the pulse width is 1.1ms, the repetition frequency is 45Hz, and the defocus amount is +0.5 mm.
TABLE 3 pore size range analysis
TABLE 4 lower aperture range analysis
The numbers I/5 to V/5 in tables 3 and 4 each represent an optimal set of parameters within one level five of each factor.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (5)
1. A micropore processing method of a polyimide film atomizing sheet is characterized by comprising the following steps:
(1) punching the polyimide film by using laser, wherein the pulse energy of the laser is 0.9J, the number of pulses is 3/s, the pulse width is 1.1ms, the repetition frequency is 45Hz, and the defocusing amount is +0.5 mm;
(2) after drilling, the taper of the hole, α = arctan [ (d1-d2)/h ], is measured as upper hole diameter d1, lower hole diameter d2, and hole depth h.
2. The micropore processing method of the polyimide film atomizing sheet as claimed in claim 1, wherein the performance indexes of the polyimide film are as follows: the long-term heat resistance temperature is more than or equal to 280 ℃, the thickness is 25-125 mu m, the thickness deviation is +/-2-4, the longitudinal tensile strength is more than or equal to 140MPa, the transverse tensile strength is more than or equal to 115MPa, the elongation at break is more than or equal to 40%, the shrinkage rate at 150 ℃ is less than or equal to 1.0%, the shrinkage rate at 400 ℃ is less than or equal to 3.0%, and the surface resistivity is more than or equal to 1.0 multiplied by 1013Omega, volume resistivity is more than or equal to 1.0 multiplied by 1010Omega, m, relative dielectric constant of 3.5 +/-0.4, dielectric loss factor not more than 4.0X 10_3The density is 1.420 +/-20 kg/m3。
3. The method for processing the micropores of the atomized polyimide film as claimed in claim 2, wherein when the thickness of the polyimide film is 25-50 μm, the average power frequency electrical strength is not less than 150MV/m, and the individual power frequency electrical strength is not less than 100 MV/m.
4. The method for processing the micropores of the atomized polyimide film as claimed in claim 1, wherein when the thickness of the polyimide film is 75-100 μm, the average power frequency electrical strength is not less than 130MV/m, and the individual power frequency electrical strength is not less than 80 MV/m.
5. The method for processing the micropores of the atomized polyimide film as claimed in claim 1, wherein when the thickness of the polyimide film is 100-125 μm, the average power frequency electrical strength is not less than 110MV/m, and the individual power frequency electrical strength is not less than 70 MV/m.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114558208A (en) * | 2022-03-02 | 2022-05-31 | 南京一正医疗科技有限公司 | Portable micro-grid atomizer with low liquid medicine residue |
| CN114769845A (en) * | 2022-04-20 | 2022-07-22 | 华东师范大学 | Laser rotary cutting drill device based on burst mode and drilling method |
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| JP2013202409A (en) * | 2012-10-25 | 2013-10-07 | Tanaka Kikinzoku Kogyo Kk | Method for manufacturing mesh for nebulizer |
| CN105057895A (en) * | 2015-08-17 | 2015-11-18 | 华南师范大学 | Micropore molding and taper improving method for steel foil with ultrashort pulse laser |
| CN105171251A (en) * | 2015-10-19 | 2015-12-23 | 无锡清杨机械制造有限公司 | Laser punching process |
| CN106493032A (en) * | 2016-12-30 | 2017-03-15 | 杭州艾新医疗科技有限公司 | A kind of Composite atomization piece and preparation method thereof |
| CN106735944A (en) * | 2016-12-16 | 2017-05-31 | 江苏大学 | A kind of modified laser micropore manufacture experimental technique based on penetration-detection technology |
| CN108038297A (en) * | 2017-12-07 | 2018-05-15 | 广东正业科技股份有限公司 | A kind of method, apparatus and system for calculating laser-processing system technological parameter |
| CN111390393A (en) * | 2020-04-23 | 2020-07-10 | 广州大学 | Method for processing micro-holes of atomization sheet by laser |
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2021
- 2021-07-12 CN CN202110793664.8A patent/CN113414507A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013202409A (en) * | 2012-10-25 | 2013-10-07 | Tanaka Kikinzoku Kogyo Kk | Method for manufacturing mesh for nebulizer |
| CN105057895A (en) * | 2015-08-17 | 2015-11-18 | 华南师范大学 | Micropore molding and taper improving method for steel foil with ultrashort pulse laser |
| CN105171251A (en) * | 2015-10-19 | 2015-12-23 | 无锡清杨机械制造有限公司 | Laser punching process |
| CN106735944A (en) * | 2016-12-16 | 2017-05-31 | 江苏大学 | A kind of modified laser micropore manufacture experimental technique based on penetration-detection technology |
| CN106493032A (en) * | 2016-12-30 | 2017-03-15 | 杭州艾新医疗科技有限公司 | A kind of Composite atomization piece and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114558208A (en) * | 2022-03-02 | 2022-05-31 | 南京一正医疗科技有限公司 | Portable micro-grid atomizer with low liquid medicine residue |
| CN114769845A (en) * | 2022-04-20 | 2022-07-22 | 华东师范大学 | Laser rotary cutting drill device based on burst mode and drilling method |
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Application publication date: 20210921 |