CN106006545A - Conical micro-pore array and preparation method thereof - Google Patents
Conical micro-pore array and preparation method thereof Download PDFInfo
- Publication number
- CN106006545A CN106006545A CN201610370690.9A CN201610370690A CN106006545A CN 106006545 A CN106006545 A CN 106006545A CN 201610370690 A CN201610370690 A CN 201610370690A CN 106006545 A CN106006545 A CN 106006545A
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- micro holes
- tapered micro
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- preparation
- holes array
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- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000011148 porous material Substances 0.000 title abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 41
- 229910052755 nonmetal Inorganic materials 0.000 claims description 33
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003937 drug carrier Substances 0.000 claims description 2
- 238000012805 post-processing Methods 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 6
- 238000005553 drilling Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 238000000018 DNA microarray Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004429 Calibre Substances 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000747 cardiac effect Effects 0.000 description 1
- 238000013153 catheter ablation Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/04—Networks or arrays of similar microstructural devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Laser Beam Processing (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention discloses a preparation method of a conical micro-pore array, comprising the steps of: making a graphic file of the conical micro-pore array; designing a micro-pore inlet graphic diameter to be 20-50 [mu]m; making a pulse laser focus fall on a surface of a nonmetallic film; and then carrying out scan-drilling along a circumferential direction according to the graphic file of the conical micro-pore array, i.e., preparing a conical micro-pore array on the nonmetallic film, wherein the inlet diameter after laser processing is 50-100 [mu]m, the pore depth is 0.1-0.5 mm, and the outlet diameter is 1-10 [mu]m. The preparation method provided by the invention uses the pulse laser to process the nonmetallic film to obtain the conical micro-pore array. The method has high processing precision, controllable micro-pore size and good application prospects.
Description
Technical field
The invention belongs to materials processing technology field, relate to a kind of tapered micro holes array and preparation method thereof.
Technical background
Along with constantly improving and perfect of nonmetal film preparation method, improving constantly of film quality, for nonmetal
The extensively application of thin film creates condition, and different requirement thied apply nonmetal film in different field is also promoting
Enter development and the maturation of film preparing technology.The advantage of nonmetal film includes the highest hardness, has
Extraordinary physics, chemical property, such as low-friction coefficient and high thermoconductivity.According to this characteristic, some are high
Hardness thin-film material is widely used.
On the other hand, nonmetal film also has extraordinary biocompatibility.Such as some non-metallic films are permissible
Do glucose sensor, cardiac catheter ablation, the material of retina microchip package, particularly Preliminary Survey On The Biology
Or the immobilized biomolecule masterplate material of biosensor application.Utilize these characteristics that some are nonmetal thin
Tapered array micropore got by membrane material pulse laser, is applied to biochip, and its lowest calibre reaches
1-10 μm controlled range, can as fields such as filtration, micro-nozzle, biochip, heat conduction and heat radiation devices,
But at present on nonmetal film, processing obtains the mode of tapered micro holes array there is not been reported.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the present invention provides a kind of tapered micro holes array and preparation method thereof, should
Method is to be processed obtaining tapered micro holes array on nonmetal film with pulse laser, the processing essence of the method
Degree is high, pore size is controlled, has good application prospect.
The purpose of the present invention is achieved through the following technical solutions:
The preparation method of a kind of tapered micro holes array, described tapered micro holes array is to punch on nonmetal film
Arrive, comprise the following steps:
Making tapered micro holes array pattern file, design micropore portal graphical aperture is 20-50 μm, makes pulse
Laser spot falls within the surface of nonmetal film, then according to tapered micro holes array pattern file circumferentially
Scanning punching, i.e. prepares tapered micro holes array on nonmetal film；
Described pulse laser wavelength is 980-1064nm, and power is 20-100w, and laser frequency is 20-50KHz,
Pulsewidth is 20-200ns, and scanning times is 500-1000 time.
Preferably, arranging micropore centreline spacing in described tapered micro holes array pattern file is 100-500 μm.
Preferably, the thickness of described nonmetal film is 0.1-0.5mm, and surface roughness is in 0.1-1 μm.Can
With by the upper and lower surface of nonmetal film being ground polishing, regulate the surface roughness of thin film.
The material of described nonmetal film is not particularly limited, it is preferred that described nonmetal film is thin diamond
Film or silicon chip.
Preferably, re-use after described nonmetal film is carried out, specifically by nonmetal film ethanol
Soak ultrasonic cleaning 10-20min, remove impurity and the greasy dirt of attachment, be drying to obtain.
Described pulse laser is the fiber pulse laser that fiber pulse laser produces.Preferably, described pulse swashs
The laser single-pulse energy of light is at 200-400 μ J, and scanning speed is at 300-500mm/s.Pulse energy too low or
The too high formation on tapered micro holes affects bigger.
In the preparation method of the present invention, according to the feature that tapered micro holes is wide at the top and narrow at the bottom, pulse laser punching uses picture
The mode of circular scan punching, laser spot circumferentially scans, and gradually central-region material is removed, and
Non-it is parked in circular hole region percussion drilling, beneficially control pass.
Preferably, the nonmetal film with tapered micro holes array is carried out post processing, is specifically dipped in ethanol
Carry out ultrasonic cleaning 10-20min, remove impurity and the greasy dirt of attachment, be dried.
A kind of tapered micro holes array, is prepared by approach described above, and in described tapered micro holes array, taper is micro-
The entrance hole diameter in hole is 50-100 μm, and hole depth is 0.1-0.5mm, and outlet aperture is 1-10 μm.
Preferably, in described tapered micro holes array, the top cone angle of tapered micro holes is at 50 °-60 °, bottom cone angle
At 0 °-10 °.
The application of described tapered micro holes array, is used as pharmaceutical carrier or for preparing human body chip.
Technical scheme has the advantages that
The pulse laser used in the preparation method of the present invention belongs to ultra-short pulse laser, and laser cold working is to micropore
Carbonized region around surface is minimum, the least to film of high hardness damage, therefore has the non-of tapered micro holes array
Metallic film compares with the nonmetal film not punched, and hardness and the biocompatibility of thin film are not affected, right
Film integrity can affect not quite.
The cross section, hole looking into tapered micro holes array is seen, it can be seen that taper is similar horn mouth shape by SEM,
Shrinking by certain radian from top to bottom, be retracted within 10 μm during close to bottom is small-bore, at bottom section
Amount of contraction is little, is seeing along inlet diameter cross section state, and top cone angle is at 50 °-60 °, and bottom cone angle is at 0 °
-10°。
Accompanying drawing explanation
Fig. 1 is tapered micro holes array axonometric chart, and wherein 1 is thin film, and 2 is tapered micro holes；
Fig. 2 is the front view after preparing tapered micro holes array on nonmetal film, and wherein 3 is micropore entrance,
4 is pore openings；
Fig. 3 is the rearview after preparing tapered micro holes array on nonmetal film；
Fig. 4 is tapered micro holes array schematic cross-section；D is micropore entrance hole diameter, and L is adjacent cells centrage
Spacing；
Fig. 5 is single tapered micro holes schematic cross-section, and wherein 5 is micropore entrance, and 6 is pore openings, and 7 are
Tapered micro holes top cone angle；
Fig. 6 is the sectional view of the tapered micro holes array of preparation in embodiment.
Detailed description of the invention
The present invention can pass through examples below further instruction, but embodiment is not to scope
Restriction.Be necessary it is pointed out here that be the graphic designs size that used of this example and laser parameter be served only for right
The present invention is further elaborated, it is impossible to be interpreted as limiting the scope of the invention.
Embodiment
Choosing diamond thin is nonmetal film, a size of 5x5mm, and thickness is 0.2mm；Nonmetal thin
Before film processing, film upper and lower surface is ground polishing, makes surface roughness in 0.1-1 μm, then use wine
Essence is soaked ultrasonic cleaning 20min and is removed impurity and the greasy dirt of attachment, is then dried, obtains nonmetal film, treats
With；
Making microwell array graphic file, utilizing graphic design software design micropore portal graphical aperture is 20 μm,
Micropore centreline spacing is 100 μm, opens fiber pulse laser (Chinese leads to HT-20F model laser equipment),
Nonmetal film is placed on workbench, laser instrument is focused, make laser spot fall within film surface, lead
Entering graphic file, arranging fiber pulse laser wavelength is 1064nm, power 20w, arranges laser parameter:
Laser frequency is 20KHz, and pulse width is 100ns, and laser single-pulse energy is 400 μ J, and process velocity is
500mm/s, processing number of times is 500 times, and pulse laser i.e. uses the side of circular arc scanning machining according to type file
Formula, carries out circular scanning punching, and laser spot along the circumferential direction scans, and gradually central-region material is removed,
On nonmetal film, i.e. prepare tapered micro holes array, the nonmetal film after punching is dipped in ethanol and surpasses
Sound wave cleans 20min, is dried.
Observe the tapered micro holes structure of film surface by SEM (HITACHI S-3400N (II)) and break
Face cell morphology, is shown in Fig. 6, it is seen that micropore prepared by the present invention has significant tapered feature, and entrance hole diameter is
50-55 μm, hole depth is 0.2mm, and outlet aperture is 1-10 μm, and top tapering is 55 °, and bottom tapering is
3°。
It is last it should be noted that, above example is only in order to illustrate technical scheme rather than to the present invention
The restriction of protection domain.If it will be understood by those of skill in the art that and technical scheme can being carried out
Dry deduction or equivalent, without deviating from the spirit and scope of technical solution of the present invention.
Claims (9)
1. a preparation method for tapered micro holes array, described tapered micro holes array is to beat on nonmetal film
Hole obtains, and comprises the following steps:
Making tapered micro holes array pattern file, design micropore portal graphical aperture is 20-50 μm；Make pulse
Laser spot falls within the surface of nonmetal film, then according to tapered micro holes array pattern file circumferentially
Scanning punching, i.e. prepares tapered micro holes array on nonmetal film；
Described pulse laser wavelength is 980-1064nm, and power is 20-100w, and laser frequency is 20-50KHz,
Pulsewidth is 20-200ns, and scanning times is 500-1000 time.
2. preparation method as claimed in claim 1, it is characterised in that described tapered micro holes array pattern literary composition
Arranging micropore centreline spacing in part is 100-500 μm.
3. preparation method as claimed in claim 1 or 2, it is characterised in that the thickness of described nonmetal film
Degree is 0.1-0.5mm, and surface roughness is in 0.1-1 μm.
4. preparation method as claimed in claim 3, it is characterised in that described nonmetal film is diamond
Thin film or silicon chip.
5. preparation method as claimed in claim 1 or 2, it is characterised in that the laser of described pulse laser
Single pulse energy is at 200-400 μ J, and scanning speed is at 300-500mm/s.
6. preparation method as claimed in claim 1 or 2, it is characterised in that to having tapered micro holes array
Nonmetal film carry out post processing, be specifically dipped in ethanol and carry out ultrasonic cleaning 10-20min, be dried.
7. a tapered micro holes array, is prepared by method as claimed in claim 1, described tapered micro holes
In array, the entrance hole diameter of tapered micro holes is 50-100 μm, and hole depth is 0.1-0.5mm, and outlet aperture is 1-10
μm。
8. tapered micro holes array as claimed in claim 7, it is characterised in that in described tapered micro holes array
The top cone angle of tapered micro holes is at 50 °-60 °, and bottom cone angle is at 0 °-10 °.
9. the application of tapered micro holes array as claimed in claim 7, is used as pharmaceutical carrier or for preparing people
Body chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610370690.9A CN106006545B (en) | 2016-05-27 | 2016-05-27 | A kind of tapered micro holes array and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610370690.9A CN106006545B (en) | 2016-05-27 | 2016-05-27 | A kind of tapered micro holes array and preparation method thereof |
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| Publication Number | Publication Date |
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| CN106006545A true CN106006545A (en) | 2016-10-12 |
| CN106006545B CN106006545B (en) | 2018-03-13 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111043689A (en) * | 2019-12-27 | 2020-04-21 | 广东思威特智能科技股份有限公司 | Atomizing sheet and processing method thereof |
| CN112086474A (en) * | 2020-08-28 | 2020-12-15 | 清华大学深圳国际研究生院 | Image sensor for fluorescence detection |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006093127A1 (en) * | 2005-03-01 | 2006-09-08 | Kyoto University | Nano-pore cyclic arrangement manufacturing method and device thereof |
| CN103172015A (en) * | 2011-12-23 | 2013-06-26 | 罗伯特·博世有限公司 | Method for producing silicon microneedle arrays with holes and microneedle array |
| CN104607808A (en) * | 2014-12-11 | 2015-05-13 | 西北工业大学 | Method for machining micro holes in ceramic matrix composite through femtosecond lasers |
| CN204434602U (en) * | 2015-01-23 | 2015-07-01 | 中国科学院重庆绿色智能技术研究院 | A kind of planktonic algae cell microwell array culture apparatus |
| CN104844814A (en) * | 2015-05-29 | 2015-08-19 | 北京化工大学 | Microneedle template and preparation method thereof |
| CN105081564A (en) * | 2015-08-31 | 2015-11-25 | 大族激光科技产业集团股份有限公司 | Processing method and device for inner hole of tempered glass |
| CN105271106A (en) * | 2015-09-16 | 2016-01-27 | 广东工业大学 | Laser implantation preparation method for multi-dimensional continuous fine structure |
-
2016
- 2016-05-27 CN CN201610370690.9A patent/CN106006545B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006093127A1 (en) * | 2005-03-01 | 2006-09-08 | Kyoto University | Nano-pore cyclic arrangement manufacturing method and device thereof |
| CN103172015A (en) * | 2011-12-23 | 2013-06-26 | 罗伯特·博世有限公司 | Method for producing silicon microneedle arrays with holes and microneedle array |
| CN104607808A (en) * | 2014-12-11 | 2015-05-13 | 西北工业大学 | Method for machining micro holes in ceramic matrix composite through femtosecond lasers |
| CN204434602U (en) * | 2015-01-23 | 2015-07-01 | 中国科学院重庆绿色智能技术研究院 | A kind of planktonic algae cell microwell array culture apparatus |
| CN104844814A (en) * | 2015-05-29 | 2015-08-19 | 北京化工大学 | Microneedle template and preparation method thereof |
| CN105081564A (en) * | 2015-08-31 | 2015-11-25 | 大族激光科技产业集团股份有限公司 | Processing method and device for inner hole of tempered glass |
| CN105271106A (en) * | 2015-09-16 | 2016-01-27 | 广东工业大学 | Laser implantation preparation method for multi-dimensional continuous fine structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111043689A (en) * | 2019-12-27 | 2020-04-21 | 广东思威特智能科技股份有限公司 | Atomizing sheet and processing method thereof |
| CN112086474A (en) * | 2020-08-28 | 2020-12-15 | 清华大学深圳国际研究生院 | Image sensor for fluorescence detection |
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| Publication number | Publication date |
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| CN106006545B (en) | 2018-03-13 |
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