CN111299859A - Ultrafast laser non-taper cutting system and cutting method - Google Patents
Ultrafast laser non-taper cutting system and cutting method Download PDFInfo
- Publication number
- CN111299859A CN111299859A CN202010172208.7A CN202010172208A CN111299859A CN 111299859 A CN111299859 A CN 111299859A CN 202010172208 A CN202010172208 A CN 202010172208A CN 111299859 A CN111299859 A CN 111299859A
- Authority
- CN
- China
- Prior art keywords
- laser
- cutting
- optical
- taper
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to an ultrafast laser taper-free cutting system and a cutting method. The method comprises the following steps: a laser transmission assembly for generating a laser beam for cutting; the optical processing assembly is arranged on a light path of the laser beam output by the laser transmission assembly, is used for adjusting the angle and the rotating direction of the laser beam output by the laser transmission assembly and irradiates a workpiece to be processed; the processing platform is arranged on a light path of the laser beam output by the optical processing assembly; and the computer control module is connected with the laser transmission assembly, the optical processing assembly and the processing platform, and is used for controlling the laser transmission assembly, the optical processing assembly, the switch of the output laser beam and the working parameters of the output laser beam and controlling the action of the processing platform. According to the invention, the quality of light beams is improved through the laser transmission assembly, the optical processing assembly realizes small-radius high-speed inclined rotation after laser is focused, and the non-taper cutting of any plane contour and even a space contour is realized.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to an ultrafast laser conicity-free cutting system and a cutting method.
Background
The laser cutting is to irradiate the material to be cut by utilizing a focused high-power-density laser beam, so that the material is quickly removed to form a hole, and the hole continuously forms a cutting seam with the same width along with the relative movement of the beam and the material, thereby realizing the cutting of the workpiece. Meanwhile, the processing residues are blown off by means of high-speed airflow coaxial with the light beams, and the cutting quality and efficiency are improved.
The thermal effect of the long pulse laser or the continuous laser is obvious, and the wall of the slit after cutting has the defects of a larger heat affected zone, a recast layer, microcracks and the like. The ultrafast laser is generally femtosecond laser and picosecond laser, and has the advantages of extremely short action time, extremely high laser power density, almost no thermal diffusion in the material removal process and non-hot-melting property. Therefore, ultra-fast laser cutting has been gradually applied to ensure cutting quality.
Due to the power density distribution of the laser and the characteristics of focusing processing of the laser, the cutting processing generally has a certain degree of cut taper. The ultra-fast laser pulse energy is low, generally less than 1mJ, so that the processing taper is more obvious, the processing efficiency is low, and the processing depth is limited.
Patent documents EP2868421a1, CN208408909U, CN108127270A and CN106891096A disclose a method for realizing taper-free processing of transparent materials such as gemstones and glass by laser filamentation; patent document CN106891098A discloses a method for realizing non-taper processing inside a transparent material by combining an etching method and a laser scanning path; patent document CN107030400A discloses a method for realizing zero-taper separation of splinters by using external force assistance and focused laser multipoint bursting. The method needs to focus the light beam inside the material, and is not suitable for processing opaque materials such as metal, ceramic and the like.
Patent document CN107199408A discloses that the processing taper is reduced by splitting a single laser beam into a plurality of laser beams to reduce the energy per laser beam, but the processing depth and efficiency are reduced, and non-taper processing cannot be realized. Patent document CN109434288A discloses a punching device and process capable of realizing arbitrary taper punching and adjustable aperture, but the device and process are not suitable for high-efficiency machining of porous members and cannot realize non-taper machining of complicated contour shapes except circles. Patent document No. CN107262943A discloses an apparatus and method for ultrafast laser machining of fine reverse taper hole, wherein the size and taper of the hole diameter are controlled by a rotary cutting module in an optical path system, but the apparatus is only suitable for machining micro holes and the machining efficiency is difficult to guarantee.
Disclosure of Invention
(1) Technical problem to be solved
The first aspect of the embodiment of the invention provides an ultrafast laser taper-free cutting system. The device comprises a laser transmission assembly, an optical processing assembly, a processing platform and a computer control module, and the embodiment of the invention solves the problem that the ultra-fast laser cutting taper is obvious in the prior art.
The second aspect of the embodiments of the present invention provides an ultrafast laser taper-free cutting method. The laser beam is firstly converted into circularly polarized light or elliptically polarized light, then the diameter of the light beam is enlarged, the divergence angle is reduced, and then peripheral stray light is filtered; the rotation and deflection angle adjustment of the light beam are carried out, and the cutting seam width and the cutting seam taper are controlled; the processing platform drives a workpiece to be processed on the processing platform to rotate, and the optical processing assembly guides and outputs laser beams to the workpiece to be processed through the processing head to realize non-taper cutting. Thereby realize the non-tapering of joint cutting both sides and even back taper cutting, be favorable to improving great thickness work piece ultrafast laser cutting efficiency simultaneously.
(2) Technical scheme
The first aspect of the embodiments of the present invention provides an ultrafast laser taper-free cutting system, including: the device comprises a laser transmission assembly, an optical processing assembly processing platform and a computer control module. The laser transmission assembly is used for generating a laser beam for cutting; the optical processing assembly is arranged on a light path of the laser beam output by the laser transmission assembly, and is used for adjusting the angle and the rotating direction of the laser beam output by the laser transmission assembly and irradiating the laser beam on a workpiece to be processed; the processing platform is arranged on a light path of the laser beam output by the optical processing assembly; and the computer control module is connected with the laser transmission assembly, the optical processing assembly and the processing platform and is used for controlling the laser transmission assembly, the optical processing assembly, the switch of the output laser beam and the working parameters of the output laser beam and controlling the action of the processing platform.
Further, the laser transmission assembly comprises a femtosecond laser, a polarizer, a beam expander and a diaphragm which are sequentially arranged along the transmission direction of the light path.
Further, the optical processing assembly comprises a rotary tilting module and a processing head which are arranged in sequence along the direction of optical path transmission.
Furthermore, the femtosecond laser is an ultrafast laser with the pulse width less than 15ps and adjustable wavelength.
Further, the output wavelength of the femtosecond laser is one of 1030nm, 515nm or 355 nm.
Further, the rotating and tilting module is an optical mechanism combining four optical wedges or three optical wedges.
Further, the processing head comprises a focusing lens and a coaxial blowing nozzle.
Further, the processing platform is free to move in at least two dimensions.
In a second aspect of the embodiments of the present invention, an ultrafast laser taper-free cutting method is provided, where the cutting method includes: the laser beam is firstly converted into circularly polarized light or elliptically polarized light, then the diameter of the light beam is enlarged, the divergence angle is reduced, and then peripheral stray light is filtered; the rotation and deflection angle adjustment of the light beam are carried out, and the cutting seam width and the cutting seam taper are controlled; the processing platform drives a workpiece to be processed on the processing platform to rotate, and the optical processing assembly guides and outputs laser beams to the workpiece to be processed through the processing head to realize non-taper cutting.
(3) Advantageous effects
In conclusion, the laser transmission assembly improves the quality of light beams, the optical processing assembly realizes the small-radius high-speed inclined rotation after the laser is focused, the processing platform for installing the workpiece to be processed moves in an interpolation mode to realize the relative motion of the laser and the workpiece to be processed, the non-taper cutting of any plane profile or even space profile or even the inverted taper is realized, and the small-radius high-speed inclined rotation of the focused laser is equivalent to the increase of the kerf width and the auxiliary blowing, so that the cutting efficiency is effectively improved.
In addition, compared with the prior art, the ultrafast laser non-taper cutting method and the ultrafast laser non-taper cutting system have the advantages that the material adaptability is wide, the limitation of the cutting outline shape and the molded surface is avoided, the taper of the cutting seam is adjustable, the non-taper and even inverted taper cutting of two sides of the cutting seam can be synchronously realized, and meanwhile, the ultrafast laser cutting efficiency of workpieces with larger thicknesses is favorably improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultrafast laser non-taper cutting system according to a first embodiment of the first aspect of the embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a rotating-tilting module in a first embodiment of the first aspect of the embodiment of the present invention.
Figure 3 is a schematic view of the structure of a processing head in a first embodiment of a first aspect of an embodiment of the invention.
Fig. 4 is a schematic diagram of a processing state of an ultrafast laser non-taper cutting system according to a first embodiment of the first aspect of the embodiment of the present invention.
Fig. 5 is a cross-sectional view of a slit of a steel plate cut by a cutting method according to an embodiment of the second aspect of the embodiment of the present invention.
In the figure: the device comprises a femtosecond laser 1, a polarizer 2, a beam expander 3, a diaphragm 4, a rotary inclination module 5, a first optical wedge 51, a second optical wedge 52, a third optical wedge 53, a processing head 6, a focusing lens 61, a coaxial blowing nozzle 62, a processing platform 7, a workpiece to be processed 8, a computer control module 9 and an arbitrary shape 10.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the invention and are not intended to limit the scope of the invention, i.e., the invention is not limited to the embodiments described, but covers any modifications, alterations, and improvements in the parts, components, and connections without departing from the spirit of the invention.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail with reference to the accompanying examples and figures 1-5.
Referring to fig. 1, an ultrafast laser non-taper cutting system according to a first aspect of an embodiment of the present invention includes: a laser transmission assembly, an optical processing assembly, a processing platform 7 and a computer control module 9.
Specifically, the laser transmission assembly is used for generating a laser beam for cutting; the optical processing assembly is arranged on a light path of the laser beam output by the laser transmission assembly, and is used for adjusting the angle and the rotating direction of the laser beam output by the laser transmission assembly and irradiating the laser beam on a workpiece to be processed; the processing platform 7 is arranged on the light path of the laser beam output by the optical processing assembly; and the computer control module 9 is connected with the laser transmission assembly, the optical processing assembly and the processing platform 7, and is used for controlling the laser transmission assembly, the optical processing assembly, the switch of the output laser beam and the working parameters of the output laser beam and controlling the action of the processing platform 7.
In the embodiment of the invention, the laser transmission assembly is used for generating a laser beam for cutting and realizing the setting of parameters of a switch and an output laser beam under the control of the computer control module 9, such as laser parameters of laser pulse width, frequency, power, wavelength and the like, beam expansion multiple, diaphragm aperture size and the like are set according to requirements; the optical processing assembly is arranged on a light path of the laser beam output by the laser transmission assembly and used for adjusting the angle and the rotating direction of the laser beam output by the laser transmission assembly and irradiating the laser beam on the workpiece 8 to be processed, the optical processing assembly can be controlled by the computer control module, for example, the rotating radius and the inclination angle of the light beam of the output laser beam are adjusted, the adjusted laser beam irradiates the workpiece 8 to be processed, and the computer control module 9 controls the processing platform 7 to drive the workpiece 8 to be processed to move, so that the workpiece 8 to be processed is accurately processed.
In the embodiment of the invention, the laser transmission assembly, the optical processing assembly and the processing platform 7 are controlled by the computer control module 9, so that the accurate control of the laser beam and the accurate adjustment of the posture of the workpiece to be processed are realized, and the taper of the workpiece to be processed can be effectively reduced.
Further, the laser transmission assembly includes a femtosecond laser 1, a polarizer 2, a beam expander 3, and a diaphragm 4 sequentially arranged along the optical path transmission direction. The optical processing assembly comprises a rotary tilting module 5 and a processing head 6 arranged in succession along the direction of travel of the optical path.
The computer control module 9 controls the on-off and working parameters of the laser transmission assembly and the optical processing assembly, and controls the action of the processing platform 7, wherein the working parameters comprise laser parameters such as laser pulse width, frequency, power and wavelength, beam expansion multiple, diaphragm aperture size, beam rotation radius, inclination angle and the like.
The femtosecond laser 1 is an ultrafast laser with pulse width less than 15ps and adjustable wavelength, and the output wavelength of the femtosecond laser 1 can be one of 1030nm, 515nm or 355 nm. The ultrafast laser is a solid femtosecond laser with pulse width less than 300fs and adjustable wavelength (1030nm, 515nm and 355nm), has high repetition frequency and average power, and can greatly reduce the heat affected zone by realizing nonlinear removal of material through instantaneous high temperature particularly when interacting with the material. The polarizer 2 converts the linearly polarized laser beam into a circularly polarized or elliptically polarized laser beam, and achieves the purposes of improving the quality of the processed surface and improving the consistency of the dimensions of all directions. The beam expander 3 expands the input laser beam with a smaller diameter to output a larger parallel laser beam, so as to achieve the purposes of reducing the size of a focused light spot, reducing the divergence angle of the light beam, reducing the power density, protecting an optical element and the like by expanding the beam, and preferably selects a Galileo type laser beam expander. The diaphragm 4 filters the laser beam through the position and the aperture of the opening screen, so as to achieve the purposes of filtering stray light around the light beam and improving the quality of the light beam.
The rotating and tilting module 5 is realized by adopting an optical mechanism combined by four optical wedges or three optical wedges, the adjustment of the tilting angle of the focused laser is realized by adjusting the space and the relative angle of different optical wedge groups, and the rotation of the tilting beam is realized by the rotation of the whole optical wedge group. Referring to fig. 2, the rotating and tilting module 5 of the present embodiment preferably adopts a three-wedge combination design, which is simple and portable in structure. The rotating tilting module 5 comprises a first wedge 51, a second wedge 52 and a third wedge 53, which are arranged coaxially in sequence. The beam tilt is achieved by adjusting the distance between the first wedge 51 and the second wedge 52, and the beam offset is achieved by adjusting the azimuth twist angle of the second wedge 52 and the third wedge 53.
Further, referring to fig. 3, the processing head 6 includes a focusing lens 61 and a coaxial blow nozzle 62. The coaxial blowing nozzle 62 blows protective gas flows such as nitrogen or argon at a high speed with the laser rotating shaft, so that the purposes of blowing off processing residues and cooling the processing surface to improve the cutting efficiency and the surface quality are achieved.
Further, the processing platform 7 is free to move in at least two dimensions. Referring to fig. 4, the processing platform 7 can support the workpiece 8 to be processed and at least comprises X, Y two movable coordinate axes, the moving precision is between 1 μm and 1nm, the stroke of X, Y exceeds 1m, the processing platform 7 is driven by the computer control module 9 to move the workpiece 8 to be processed and the laser relatively to complete the non-taper cutting of any shape 10 in the stroke range, and the any shape 10 can be the contour or inner hole of the workpiece 8 to be processed.
An ultrafast laser taper-free cutting method according to a second aspect of an embodiment of the present invention is applied to the ultrafast laser taper-free cutting system according to any one of the first aspect of the embodiment of the present invention, and the cutting method includes: the laser beam is firstly converted into circularly polarized light or elliptically polarized light, then the diameter of the light beam is enlarged, the divergence angle is reduced, peripheral stray light is filtered to carry out rotation and deflection angle adjustment of the light beam, and the width of a cutting seam and the taper of the cutting seam are controlled; the processing platform 7 drives the workpiece to be processed on the processing platform to rotate, and the optical processing assembly guides and outputs the laser beam to the workpiece 8 to be processed through the processing head to realize non-taper cutting.
Specifically, the femtosecond laser 1 outputs laser, linearly polarized light is converted into circularly polarized light or elliptically polarized light through the polarizer 2, then the circularly polarized light or the elliptically polarized light enters the beam expander 3 for beam expansion, peripheral stray light is filtered through the diaphragm 4, then the circularly polarized light enters the rotary tilting module 5 for beam deflection angle adjustment, the cutting slit width and the cutting seam taper are controlled, finally the laser is guided and output to a workpiece to be machined through the machining head 6, and the machining platform 7 drives the workpiece 8 on the laser to realize the zero-taper cutting of the outline or the inner hole of any shape in the stroke range.
Finally, by using the ultrafast laser non-taper cutting system according to the first aspect of the embodiment of the present invention, a 3mm thick steel plate is slit by the cutting method according to the second aspect of the embodiment of the present invention, and the slit cross section is shown in fig. 5.
In addition, compared with the prior art, the ultrafast laser non-taper cutting method and the ultrafast laser non-taper cutting system have the advantages that the material adaptability is wide, the limitation of the cutting outline shape and the molded surface is avoided, the taper of the cutting seam is adjustable, the non-taper and even inverted taper cutting of two sides of the cutting seam can be synchronously realized, and meanwhile, the ultrafast laser cutting efficiency of workpieces with larger thicknesses is favorably improved.
It should be clear that the embodiments in this specification are described in a progressive manner, and the same or similar parts in the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. For embodiments of the method, reference is made to the description of the apparatus embodiments in part. The present invention is not limited to the specific steps and structures described above and shown in the drawings. Also, a detailed description of known process techniques is omitted herein for the sake of brevity.
The above description is only an example of the present application and is not limited to the present application. Various modifications and alterations to this application will become apparent to those skilled in the art without departing from the scope of this invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (9)
1. An ultrafast laser non-taper cutting system, comprising:
a laser transmission assembly for generating a laser beam for cutting;
the optical processing assembly is arranged on a light path of the laser beam output by the laser transmission assembly, is used for adjusting the angle and the rotating direction of the laser beam output by the laser transmission assembly and irradiates a workpiece to be processed;
the processing platform is arranged on a light path of the laser beam output by the optical processing assembly;
and the computer control module is connected with the laser transmission assembly, the optical processing assembly and the processing platform, and is used for controlling the laser transmission assembly, the optical processing assembly, the switch of the output laser beam and the working parameters of the output laser beam and controlling the action of the processing platform.
2. The ultrafast laser coniformless cutting system of claim 1, wherein the laser transmission assembly comprises a femtosecond laser, a polarizer, a beam expander and a diaphragm sequentially arranged along the transmission direction of the optical path.
3. The ultrafast laser coniformless cutting system of claim 1, wherein the optical processing assembly comprises a rotary tilting module and a processing head sequentially arranged along a transmission direction of the optical path.
4. The ultrafast laser coniformless cutting system of claim 2, wherein the femtosecond laser is a wavelength tunable ultrafast laser having a pulse width less than 15 ps.
5. The ultrafast laser coniformless cutting system of claim 4, wherein the output wavelength of the femtosecond laser is one of 1030nm, 515nm or 355 nm.
6. The ultrafast laser coniformless cutting system of claim 3, wherein the rotating and tilting module is an optical mechanism with four optical wedges or a combination of three optical wedges.
7. The ultrafast laser coniformless cutting system of claim 3, wherein the processing head comprises a focusing lens and a coaxial blowing nozzle.
8. The ultrafast laser non-taper cutting system of claim 1, wherein the processing platform is free to move in at least two dimensions.
9. An ultrafast laser conicity-free cutting method applied to the ultrafast laser conicity-free cutting system of any one of claims 1 to 8, wherein the cutting method comprises the following steps:
the laser beam is firstly converted into circularly polarized light or elliptically polarized light, then the diameter of the light beam is enlarged, the divergence angle is reduced, and then peripheral stray light is filtered;
the rotation and deflection angle adjustment of the light beam are carried out, and the cutting seam width and the cutting seam taper are controlled;
the processing platform drives a workpiece to be processed on the processing platform to rotate, and the optical processing assembly guides and outputs laser beams to the workpiece to be processed through the processing head to realize non-taper cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010172208.7A CN111299859A (en) | 2020-03-12 | 2020-03-12 | Ultrafast laser non-taper cutting system and cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010172208.7A CN111299859A (en) | 2020-03-12 | 2020-03-12 | Ultrafast laser non-taper cutting system and cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111299859A true CN111299859A (en) | 2020-06-19 |
Family
ID=71153203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010172208.7A Pending CN111299859A (en) | 2020-03-12 | 2020-03-12 | Ultrafast laser non-taper cutting system and cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111299859A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111943499A (en) * | 2020-07-17 | 2020-11-17 | 中国航空工业集团公司北京长城航空测控技术研究所 | Ultrafast laser precision cutting method based on ultrasonic nitrogen jet |
| CN113231750A (en) * | 2021-03-18 | 2021-08-10 | 武汉大学 | Pulse laser punching system and punching method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056519A (en) * | 2012-12-26 | 2013-04-24 | 中科中涵激光设备（福建）股份有限公司 | Taper-controllable laser micropore machining light beam scanning device and control method thereof |
| CN104400222A (en) * | 2014-09-23 | 2015-03-11 | 中科中涵激光设备（福建）股份有限公司 | Method for adjusting initial phase of four-optical-wedge optical beam scanning device |
| DE102013227031A1 (en) * | 2013-12-20 | 2015-06-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus and method for analyzing a light beam incident on a substrate and correcting a focal length shift |
| CN206185312U (en) * | 2016-11-04 | 2017-05-24 | 苏州德龙激光股份有限公司 | Alumina ceramics's double -light -path CO2 laser beam machining device |
| CN107262943A (en) * | 2017-08-10 | 2017-10-20 | 温州大学 | Ultrafast laser processes the devices and methods therefor of superfine back taper hole |
| CN207071749U (en) * | 2017-08-10 | 2018-03-06 | 温州大学 | Ultrafast laser processes the device of superfine back taper hole |
| CN208289222U (en) * | 2018-01-08 | 2018-12-28 | 西安中科微精光子制造科技有限公司 | Lens type light-beam scanner and system for laser micropore processing |
-
2020
- 2020-03-12 CN CN202010172208.7A patent/CN111299859A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056519A (en) * | 2012-12-26 | 2013-04-24 | 中科中涵激光设备（福建）股份有限公司 | Taper-controllable laser micropore machining light beam scanning device and control method thereof |
| DE102013227031A1 (en) * | 2013-12-20 | 2015-06-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus and method for analyzing a light beam incident on a substrate and correcting a focal length shift |
| CN104400222A (en) * | 2014-09-23 | 2015-03-11 | 中科中涵激光设备（福建）股份有限公司 | Method for adjusting initial phase of four-optical-wedge optical beam scanning device |
| CN206185312U (en) * | 2016-11-04 | 2017-05-24 | 苏州德龙激光股份有限公司 | Alumina ceramics's double -light -path CO2 laser beam machining device |
| CN107262943A (en) * | 2017-08-10 | 2017-10-20 | 温州大学 | Ultrafast laser processes the devices and methods therefor of superfine back taper hole |
| CN207071749U (en) * | 2017-08-10 | 2018-03-06 | 温州大学 | Ultrafast laser processes the device of superfine back taper hole |
| CN208289222U (en) * | 2018-01-08 | 2018-12-28 | 西安中科微精光子制造科技有限公司 | Lens type light-beam scanner and system for laser micropore processing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111943499A (en) * | 2020-07-17 | 2020-11-17 | 中国航空工业集团公司北京长城航空测控技术研究所 | Ultrafast laser precision cutting method based on ultrasonic nitrogen jet |
| CN113231750A (en) * | 2021-03-18 | 2021-08-10 | 武汉大学 | Pulse laser punching system and punching method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100681390B1 (en) | A semiconductor wafer dicing and scribing system and appratus with a high speed laser beam focus positioning system to arbitrary 3D positions and laser beam diffraction system | |
| US5744780A (en) | Apparatus for precision micromachining with lasers | |
| US6057525A (en) | Method and apparatus for precision laser micromachining | |
| JP5985834B2 (en) | Laser processing apparatus and laser processing method having switchable laser system | |
| EP3266557B1 (en) | A method of laser processing of a metallic material with high dynamic control of the movement axes of the laser beam along a predermined processing path, as well as a machine and a computer program for the implementation of said method | |
| CN110722272A (en) | Ultrafast laser micro-nano cutting drilling equipment and method | |
| US20110132885A1 (en) | Laser machining and scribing systems and methods | |
| EP3272453B1 (en) | A method of laser processing of a metallic material with optical axis position control of the laser relative to an assist gas flow, and a machine and computer program for the implementation of said method | |
| TWI469841B (en) | Method and apparatus for machining workpieces using tilted laser scanning | |
| JP2004528991A (en) | Partial processing by laser | |
| JP2004528991A5 (en) | ||
| TW201434562A (en) | Coordination of beam angle and workpiece movement for taper control | |
| CN113042903B (en) | Nondestructive cutting method and nondestructive cutting apparatus | |
| CN111151892B (en) | Non-taper laser cutting method | |
| CN111299859A (en) | Ultrafast laser non-taper cutting system and cutting method | |
| KR20150112870A (en) | Laser machining strengthened glass | |
| WO2020239857A1 (en) | Laser hole drilling apparatus and method | |
| CN113102902A (en) | Burr-free laser drilling method for carbon fiber composite material | |
| CN111055028A (en) | Laser cutting device and method for expanding controllable cracks based on plasma | |
| KR20050111790A (en) | Positioning method, apparatus and a product thereof | |
| CN112192019A (en) | Laser processing drilling system | |
| CN215393264U (en) | Five-axis four-linkage punching device | |
| CN108161230B (en) | Device and method for processing spherical crown grid net in quasi-3D mode | |
| CN210548827U (en) | Laser reducing rotary-cut hole machining optical system | |
| CN216633041U (en) | Golden finger laser cutting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200619 |