CN210451368U - Laser scanning system and laser engraving system with same - Google Patents
Laser scanning system and laser engraving system with same Download PDFInfo
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- CN210451368U CN210451368U CN201921152971.2U CN201921152971U CN210451368U CN 210451368 U CN210451368 U CN 210451368U CN 201921152971 U CN201921152971 U CN 201921152971U CN 210451368 U CN210451368 U CN 210451368U
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Abstract
The utility model provides a laser scanning system and have its laser engraving system. The laser scanning system includes: a Z-axis unit, which is positioned on the optical axis of the laser beam, is used for changing the position of the focus in the Z-axis direction and defines the optical axis as a first optical axis; the laser beam is deflected to a second optical axis from the first optical axis after passing through the galvanometer component, and the galvanometer component is used for changing the positions of the focus in the x-axis direction and the y-axis direction; the field lens is positioned on a second optical axis between the galvanometer component and the workpiece and used for focusing the laser beam deflected by the galvanometer component to form a focus; and the imaging unit is used for acquiring the illumination light beam reflected by the workpiece to carry out imaging. The utility model discloses increased the imaging element in the triaxial galvanometer, through the image information who acquires workpiece surface, conveniently observe the work piece and carry out the work piece location based on the image to add the advantage that to have that the depth of processing is big, the machining precision is high and the machining accuracy is high man-hour to the work piece.
Description
Technical Field
The utility model relates to the field of optical technology, particularly, relate to a laser scanning system and have its laser engraving system.
Background
The laser engraving technology is that laser beams generated by a laser source are deflected by a scanning galvanometer for a certain angle, and then are focused by a field lens to realize engraving and cutting of workpieces by the focused laser beams. However, the biaxial galvanometer cannot achieve longitudinal in-plane motion, i.e., cannot achieve dynamic focusing. Especially when the great work piece of depth of needs processing or carry out the curved surface sculpture, along with laser to the glyptic degree of depth increase of work piece, the focus position of laser is kept away from gradually to the processing position, then can't realize the accurate sculpture of laser this moment, leads to the processing effect poor, and machining efficiency is low.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a laser scanning system and laser engraving system having the same, so as to solve the problem that the laser engraving technique in the prior art cannot realize the accurate engraving of laser.
In order to achieve the above object, according to one aspect of the present invention, there is provided a laser scanning system, wherein a laser beam forms a focal point on a workpiece by the laser scanning system, defining that the workpiece is located in a three-dimensional coordinate system composed of an x-axis, a y-axis and a Z-axis, the laser scanning system comprises a Z-axis unit located on an optical axis of the laser beam for changing a divergence angle of the laser beam, thereby changing a focus position of the laser beam in a Z-axis direction, defining the optical axis as a first optical axis; the laser beam is deflected to a second optical axis from the first optical axis after passing through the galvanometer component, and the galvanometer component is used for changing the positions of the focus in the x-axis direction and the y-axis direction; the field lens is positioned on a second optical axis between the galvanometer component and the workpiece and used for focusing the laser beam deflected by the galvanometer component to form a focus; and the imaging unit is used for acquiring the illumination light beam reflected by the workpiece to carry out imaging.
Further, the first optical axis is perpendicular to the second optical axis.
Further, the galvanometer assembly includes: the x-axis vibrating mirror is positioned on one side of the field lens, which is far away from the workpiece, the first optical axis is deflected into a third optical axis after passing through the x-axis vibrating mirror, and the x-axis vibrating mirror is used for reflecting the laser beam so as to change the position of the focus in the x-axis direction; and the third optical axis is deflected to a second optical axis after passing through the y-axis vibrating mirror, and the y-axis vibrating mirror is used for further reflecting the laser beam so as to change the position of the focus in the y-axis direction.
Further, mirror assembly shakes still includes first motor and second motor, and first motor shakes with the x axle and is connected for the control x axle shakes the deflection angle of mirror, and the second motor shakes with the y axle and is connected for the control y axle shakes the deflection angle of mirror, and the Z axle unit includes: the beam expander is positioned on the optical axis of the laser beam and is used for expanding the laser beam and changing the divergence angle of the laser beam; and the controller is respectively connected with the first motor and the second motor and is used for controlling the position of the focus in the three-dimensional coordinate system.
Further, the imaging unit includes: the beam combiner is positioned on a first optical axis between the galvanometer component and the Z-axis unit and used for reflecting the illumination light beam, the beam combiner is close to a first mirror surface of the Z-axis unit and penetrates through the laser beam, and the beam combiner is close to a second mirror surface of the galvanometer component and reflects the illumination light beam and penetrates through the laser beam; and the imaging module is positioned on one side of the beam combining mirror and is used for collecting the illumination light beams reflected by the beam combining mirror to image.
Further, an included angle between the mirror surface of the beam combining mirror and the first optical axis is 45 degrees.
Further, the imaging module includes: the imaging objective lens is positioned at one side of the beam combiner and is used for focusing the illumination light beam reflected by the second mirror surface; and the CCD camera is positioned on one side of the imaging objective lens, which is far away from the beam combining lens, and is used for collecting the focused illumination light beam for imaging.
Further, the laser scanning system also comprises a laser light source which is positioned on one side of the Z-axis unit away from the galvanometer component and used for emitting a laser beam with a first optical axis.
Furthermore, the laser scanning system also comprises an illumination light source which is a laser lamp with the wavelength of 635 nm.
According to the utility model discloses a further aspect provides a laser engraving system, has foretell laser scanning system, and the laser beam passes through laser scanning system and carves on to the work piece.
Use the technical scheme of the utility model, a laser scanning system is provided, this laser scanning system increases a Z axle unit on the basis of conventional 2D galvanometer and field lens, a divergence angle for changing the laser beam, thereby change the position of focus in the Z axle direction, move and corresponding change with the removal of ensureing the focus position of laser beam to follow the processing position, the realization is to the real-time dynamic compensation of focusing error, the imaging element has been increased in the triaxial galvanometer simultaneously, through the image information who acquires workpiece surface, conveniently observe the work piece, thereby make above-mentioned laser scanning system add man-hour to the work piece, can have that depth of processing is big, the machining precision is high and the high advantage of the machining accuracy. Furthermore, a certain functional relationship exists between the focal length of the imaging objective lens in the imaging unit and the movement in the z-axis direction, and the imaging objective lens can perform corresponding zooming processing when the z-direction moves, so that the real-time acquisition of the laser processing position image is realized, and the processing precision and accuracy are further improved.
Drawings
The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without unduly limiting the scope of the invention. In the drawings:
fig. 1 is a schematic diagram illustrating a structural principle of a laser scanning system provided by the present invention;
fig. 2 shows a schematic perspective view of a laser engraving system provided by the present invention.
Wherein the figures include the following reference numerals:
1. a Z-axis unit; 2. an imaging unit; 3. a galvanometer component; 4. a field lens; 5. an imaging objective lens; 6. a CCD camera; 7. a beam combining mirror; 8. and (5) a workpiece.
Detailed Description
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances for purposes of describing the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Just as introduced in the background art, when a workpiece with a large depth needs to be machined or a curved surface is carved in the prior art, along with the increase of the carving depth of the workpiece by laser, the machining position is gradually far away from the focal position of the laser, and at the moment, the accurate carving of the laser cannot be realized, so that the machining effect is poor, and the machining efficiency is low.
The inventor of the present invention has studied in view of the above problems and proposed a laser scanning system, as shown in fig. 1, a laser beam forms a focus on a workpiece 8 through the laser scanning system, and defines that the workpiece 8 is located in a three-dimensional coordinate system composed of an x axis, a y axis and a Z axis, the laser scanning system includes a Z axis unit 1, a galvanometer component 3, a field lens 4 and an imaging unit 2, the Z axis unit 1 is located on an optical axis of the laser beam and is used for changing a divergence angle of the laser beam, thereby changing a focusing position of the laser beam in the Z axis direction, and defining the optical axis as a first optical axis; the galvanometer component 3 is positioned on a first optical axis on one side of the Z-axis unit 1, a laser beam is deflected to a second optical axis from the first optical axis after passing through the galvanometer component 3, and the galvanometer component 3 is used for changing the positions of a focus in the x-axis direction and the y-axis direction; the field lens 4 is positioned on a second optical axis between the galvanometer component 3 and the workpiece 8 and is used for focusing the laser beam deflected by the galvanometer component 3 to form a focus; the imaging unit 2 is used to collect the illumination beam reflected by the workpiece 8 for imaging.
On the basis of a conventional 2D galvanometer and a field lens in the prior art, a Z-axis unit is added before laser enters the galvanometer and is used for changing the divergence angle of a laser beam so as to change the position of a focus in the Z-axis direction, and the focus is moved in the Z-axis direction through the Z-axis unit so as to ensure that the focus position of the laser beam is correspondingly changed along with the movement of a processing position to realize real-time dynamic compensation of a focusing error.
Meanwhile, the imaging unit is additionally arranged in the three-axis galvanometer, and the workpiece is conveniently observed by acquiring the image information of the surface of the workpiece, so that the laser scanning system has the advantages of large processing depth, high processing precision and high processing accuracy when the workpiece is processed.
Furthermore, a certain functional relationship exists between the focal length of the imaging objective lens in the imaging unit and the movement in the z-axis direction, and the imaging objective lens can perform corresponding zooming processing when the z-direction moves, so that the real-time acquisition of the laser processing position image is realized, and the processing precision and accuracy are further improved.
The utility model discloses an among the above-mentioned laser scanning system, preferably, first optical axis is perpendicular with the second optical axis, when the laser beam when shaking mirror subassembly 3 before for the horizontal direction, is deflected for vertical direction and focuses on work piece 8 through field lens 4 after shaking mirror subassembly 3 to be applied to laser engraving with above-mentioned laser scanning system, just can realize the degree of depth sculpture to work piece 8 through placing work piece 8 level.
In the above-mentioned laser scanning system of the utility model, as shown in fig. 1, the laser beam can deflect through the mirror subassembly 3 that shakes earlier, then focuses on work piece 8 through field lens 4, and above-mentioned mirror subassembly 3 that shakes is the back focus scanning mirror that shakes (Post-Scan) this moment, scans the back focus promptly.
The workpiece 8 is defined to be located in a three-dimensional coordinate system composed of an x-axis, a y-axis and a z-axis, and the position of the focal point on the workpiece 8 in the x-axis direction and the y-axis direction can be adjusted by the galvanometer unit 3. As shown in fig. 1, the galvanometer assembly 3 may include an x-axis galvanometer and a y-axis galvanometer, the x-axis galvanometer is located on a side of the field lens 4 away from the workpiece 8, the first optical axis is deflected to a third optical axis after passing through the x-axis galvanometer, and the x-axis galvanometer is used for reflecting the laser beam to change a position of the focal point in the x-axis direction; the third optical axis is deflected to a second optical axis by a y-axis galvanometer, and the y-axis galvanometer is used for further reflecting the laser beam to change the position of the focus in the y-axis direction.
The mirror vibration assembly 3 can further comprise a first motor and a second motor, the first motor is connected with the x-axis mirror vibration and used for controlling the deflection angle of the x-axis mirror vibration, and the second motor is connected with the y-axis mirror vibration and used for controlling the deflection angle of the y-axis mirror vibration.
Specifically, the x-axis galvanometer and the y-axis galvanometer are driven by the motor to rotate back and forth along the axis at a high speed respectively so as to achieve the purpose of changing the path of the laser beam, and the laser beam deflects under the action of the rotating x-axis galvanometer and is reflected to the rotating y-axis galvanometer so as to be further reflected to the field lens 4, and then the focus on the workpiece 8 is realized through the field lens 4.
In the above laser scanning system of the present invention, the Z-axis unit 1 can adjust the position of the focus on the workpiece 8 in the Z-axis direction, and preferably, the Z-axis unit 1 includes a beam expander and a controller, the beam expander is located on the optical axis of the laser beam and is used for expanding the laser beam and changing the divergence angle of the laser beam; the controller is respectively connected with the first motor and the second motor and is used for controlling the position of the focus in the three-dimensional coordinate system. The z-axis unit 1 is controlled by a controller (galvanometer control card), so that the engraving positions of the focus on the workpiece in the x-axis direction and the y-axis direction can be controlled in the machining process, and the engraving positions of the focus on the workpiece can be changed along with the engraving positions of the workpiece in the z-axis direction in the machining process, so that real-time dynamic focusing is realized.
In the above laser scanning system of the present invention, as shown in fig. 1, preferably, the imaging unit 2 includes a beam combiner 7 and an imaging module, as shown in fig. 1, the beam combiner 7 is located on a first optical axis between the galvanometer component 3 and the Z-axis unit 1, and is configured to reflect the illumination light beam, the beam combiner 7 transmits the laser beam near a first mirror surface of the Z-axis unit 1, and the beam combiner 7 reflects the illumination light beam and transmits the laser beam near a second mirror surface of the galvanometer component 3; the imaging module is located at one side of the beam combiner 7 and is used for collecting the illumination light beam reflected by the beam combiner 7 to perform imaging.
The first mirror surface and the second mirror surface of the beam combining mirror 7 can both carry laser beams, so that the transmission of the laser beams from the Z-axis unit 1 to the galvanometer component 3 which is positioned on the first optical axis is not influenced.
The illumination light beam reflected by the beam combining mirror 7 enters the imaging module for imaging to form an image of the surface of the workpiece 8 to be processed, and the imaging principle may include: the illumination light beam with the second optical axis is irradiated onto the workpiece 8 and reflected by the workpiece 8, and the reflected illumination light beam passes through the field lens 4, is deflected by the galvanometer assembly 3 into a laser beam with the first optical axis and is reflected to the imaging unit 2 for imaging through the second mirror surface of the beam combiner 7 on the first optical axis.
Preferably, an angle between the mirror surface of the beam combiner 7 and the first optical axis is 45 °. When the illumination light beam passes through the galvanometer component 3 and is in the horizontal direction, the illumination light beam is deflected to the vertical direction through the beam combiner 7 to enter the imaging unit 2 above the beam combiner 7, so that the surface image information of the workpiece 8 is acquired.
Preferably, the imaging module comprises an imaging objective lens 5 and a CCD camera 6, the imaging objective lens 5 is located at one side of the beam combiner 7 and is used for focusing the illumination beam reflected by the second mirror surface; the CCD camera 6 is located on the side of the imaging objective 5 far away from the beam combiner 7 and is used for collecting the focused illumination light beam for imaging. By adding the CCD visual imaging system between the Z-axis unit 1 and the galvanometer component 3, the illumination light source is reflected by the surface of a workpiece 8, deflected by the field lens 4 and the galvanometer component 3, reflected by the beam combiner 7 and focused by the imaging objective lens 5 onto the CCD camera 6 to form an image of the surface of the workpiece to be processed.
Further, when the Z-axis unit 1 moves back and forth to change the laser focus position, the imaging objective 5 simultaneously performs corresponding zooming processing according to a certain functional relationship, so that the imaging position of the CCD camera 6 is ensured to be consistent with the laser processing position, a real-time image of the processing position can be obtained, and the processing effect can be observed.
The utility model discloses an above-mentioned laser scanning system can also include laser light source, and laser light source is located Z axle unit 1 and keeps away from one side of galvanometer subassembly 3 for the laser beam that the transmission has first optical axis.
The utility model discloses an above-mentioned laser scanning system still includes light source, and technical personnel in the field can rationally select above-mentioned light source's kind according to actual demand, can be for the radium-shine lamp that the wavelength is 635nm as above-mentioned light source.
According to another aspect of the present invention, there is provided a laser engraving system, as shown in fig. 2, the laser engraving system has the above laser scanning system, and the laser beam engraves on the workpiece 8 through the laser scanning system.
The laser engraving system comprises a Z-axis unit 1, a galvanometer component 3, a field lens 4 and an imaging unit 2, wherein the Z-axis unit 1 is positioned on the optical axis of a laser beam and used for changing the position of a focus in the Z-axis direction, and the optical axis is defined as a first optical axis; the galvanometer component 3 is positioned on a first optical axis on one side of the Z-axis unit 1, a laser beam is deflected to a second optical axis from the first optical axis after passing through the galvanometer component 3, and the galvanometer component 3 is used for changing the positions of a focus in the x-axis direction and the y-axis direction; the field lens 4 is positioned on a second optical axis between the galvanometer component 3 and the workpiece 8 and is used for focusing the laser beam deflected by the galvanometer component 3 to form a focus; the imaging unit 2 is used to collect the illumination beam reflected by the workpiece 8 for imaging.
The utility model discloses an among the above-mentioned laser engraving system owing to on the basis of conventional 2D mirror and the field lens that shakes among the prior art, laser entering shakes and increases a Z axle unit before the mirror for change the focus in the position of Z axle direction, the triaxial mirror system that shakes of constitution adds the depth of processing greatly, the machining precision height man-hour to the work piece, is fit for the dark carving processing of work piece.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:
1. the focus is moved in the Z-axis direction through the Z-axis unit, so that the focus position of the laser beam is ensured to be correspondingly changed along with the movement of the light spot to realize the real-time dynamic compensation of the focusing error, the dynamic focusing function is realized, and the formed three-axis galvanometer system has the advantages of large processing depth and high processing precision when processing a workpiece, and is suitable for deep engraving and processing of the workpiece;
2. the workpiece can be conveniently observed by acquiring the image information of the surface of the workpiece, so that the laser scanning system has the advantages of large processing depth, high processing precision and high processing accuracy when processing the workpiece;
3. by enabling the focal length of the imaging objective lens in the imaging unit to have a certain functional relationship with the movement in the z-axis direction, the imaging objective lens can perform corresponding zooming processing when the movement is generated in the z-axis direction, so that the real-time acquisition of the laser processing position image is realized, and the processing precision and accuracy are further improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A laser scanning system by which a laser beam forms a focal point on a workpiece (8), characterized in that the workpiece (8) is defined in a three-dimensional coordinate system consisting of an x-axis, a y-axis and a z-axis, the laser scanning system comprising:
a Z-axis unit (1) located on an optical axis of the laser beam, for changing a divergence angle of the laser beam, thereby changing a focus position of the laser beam in a Z-axis direction, defining the optical axis as a first optical axis;
the galvanometer assembly (3) is positioned on the first optical axis on one side of the Z-axis unit (1), the laser beam is deflected to a second optical axis from the first optical axis after passing through the galvanometer assembly (3), and the galvanometer assembly (3) is used for changing the positions of the focus in the x-axis direction and the y-axis direction;
a field lens (4) located on the second optical axis between the galvanometer assembly (3) and the workpiece (8) for focusing the laser beam deflected by the galvanometer assembly (3) to form the focal point;
an imaging unit (2) for acquiring the illumination beam reflected by the workpiece (8) for imaging.
2. The laser scanning system of claim 1, wherein the first optical axis is perpendicular to the second optical axis.
3. A laser scanning system according to claim 1 or 2, wherein the galvanometer assembly (3) comprises:
the x-axis vibrating mirror is positioned on one side, far away from the workpiece (8), of the field lens (4), the first optical axis is deflected to be a third optical axis after passing through the x-axis vibrating mirror, and the x-axis vibrating mirror is used for reflecting the laser beam so as to change the position of the focus in the x-axis direction;
and the y-axis vibrating mirror is used for further reflecting the laser beam so as to change the position of the focus in the y-axis direction.
4. The laser scanning system according to claim 3, wherein the galvanometer assembly (3) further comprises a first motor and a second motor, the first motor is connected with the x-axis galvanometer for controlling a deflection angle of the x-axis galvanometer, the second motor is connected with the y-axis galvanometer for controlling a deflection angle of the y-axis galvanometer, the Z-axis unit (1) comprises:
a beam expander, located on an optical axis of the laser beam, for expanding the laser beam and changing a divergence angle of the laser beam;
and the controller is respectively connected with the first motor and the second motor and is used for controlling the position of the focus in the three-dimensional coordinate system.
5. The laser scanning system according to claim 1, characterized in that the imaging unit (2) comprises:
the beam combiner (7) is located on the first optical axis between the galvanometer assembly (3) and the Z-axis unit (1) and used for reflecting the illumination light beam, the beam combiner (7) is close to a first mirror surface of the Z-axis unit (1) and penetrates through the laser beam, and the beam combiner (7) is close to a second mirror surface of the galvanometer assembly (3) and reflects the illumination light beam and penetrates through the laser beam;
and the imaging module is positioned at one side of the beam combining mirror (7) and is used for collecting the illumination light beams reflected by the beam combining mirror (7) to carry out imaging.
6. The laser scanning system according to claim 5, characterized in that the angle between the mirror surface of the beam combining mirror (7) and the first optical axis is 45 °.
7. The laser scanning system of claim 5, wherein the imaging module comprises:
an imaging objective (5) located at one side of the beam combiner (7) for focusing the illumination beam reflected by the second mirror;
and the CCD camera (6) is positioned on one side of the imaging objective lens (5) far away from the beam combiner (7) and is used for collecting the focused illumination light beams for imaging.
8. A laser scanning system according to claim 1 or 2, further comprising a laser light source located at a side of the Z-axis unit (1) remote from the galvanometer assembly (3) for emitting the laser beam having the first optical axis.
9. The laser scanning system of claim 1, further comprising an illumination source, wherein the illumination source is a laser lamp with a wavelength of 635 nm.
10. A laser engraving system, characterized by having a laser scanning system according to any one of claims 1 to 9, through which a laser beam engraves on the workpiece (8).
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| CN201921152971.2U CN210451368U (en) | 2019-07-22 | 2019-07-22 | Laser scanning system and laser engraving system with same |
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| CN201921152971.2U CN210451368U (en) | 2019-07-22 | 2019-07-22 | Laser scanning system and laser engraving system with same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421253A (en) * | 2019-07-22 | 2019-11-08 | 廊坊西波尔钻石技术有限公司 | Laser scanning system and laser engraving system with it |
| CN113070586A (en) * | 2021-04-09 | 2021-07-06 | 昆山联滔电子有限公司 | Laser processing carrier, laser processing device and laser processing method |
| WO2022142476A1 (en) * | 2020-12-31 | 2022-07-07 | 武汉华工激光工程有限责任公司 | Galvanometer-based three-dimensional scanning, imaging, and machining device, and machining method |
-
2019
- 2019-07-22 CN CN201921152971.2U patent/CN210451368U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421253A (en) * | 2019-07-22 | 2019-11-08 | 廊坊西波尔钻石技术有限公司 | Laser scanning system and laser engraving system with it |
| WO2022142476A1 (en) * | 2020-12-31 | 2022-07-07 | 武汉华工激光工程有限责任公司 | Galvanometer-based three-dimensional scanning, imaging, and machining device, and machining method |
| CN113070586A (en) * | 2021-04-09 | 2021-07-06 | 昆山联滔电子有限公司 | Laser processing carrier, laser processing device and laser processing method |
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