JP2002141363A - Electronic component bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an injection of an ultraviolet curable adhesive efficiently and suitably and to uniformly cure the injected adhesive. SOLUTION: An electronic component bonding apparatus comprises an optical pickup body 1 fixed onto a base 8, and a chip 2 with a photodiode sucked from a moving element 10 to a distal end 11a of an arm 11 extended upward of the base 8. Thus, the element 10 is moved to bring a center O1 of the photodiode into coincidence with an axial center O2 of an objective lens. The ultraviolet curable adhesive is then injected between both edges 2a of the chip 2 and both edges 5 of a chip installing surface 12a of the body 1, and an ultraviolet ray is then emitted to cure the adhesive. The axial center O3 of the distal end 11a of the arm is set to be substantially brought into coincidence with a centerline O4 extended along both the edges 5 of the surface 1a through the axial center O2 of the lens OL as seen in plane.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus for bonding an electronic component such as a chip with a photodiode to an electronic member such as an optical pickup body.

[0002]

2. Description of the Related Art FIG. 7 shows an example of an optical pickup. This is because the objective lens OL is arranged at one end of the optical pickup main body 1 and the chip 2 with the photodiode PD is bonded to the chip mounting surface 1a formed at the other end of the optical pickup main body 1 with the ultraviolet-curing adhesive 3. A polarizing beam splitter PBS is arranged between the objective lens OL and the chip 2 in the optical pickup body 1;
A semiconductor laser LD is provided on a side surface of the optical pickup main body 1. A laser beam is projected from the semiconductor laser LD to a disk D via a polarizing beam splitter PBS and an objective lens OL, and the reflected light is received by a photodiode PD. By doing so, the information recorded on the disk D is read.

As shown in FIG. 8, the chip 2 is formed in a substantially rectangular shape, a protruding portion 4 is integrally formed at the end of both side edges 2a, and both side edges 5 of the chip mounting surface 1a are formed.
A pair of left and right protrusions 6 are provided so as to protrude. The chip 2 is adhered to the chip mounting surface 1a by curing the two UV-curable adhesives 3 injected between them.

Conventionally, as a technique for bonding the chip 2 to the optical pickup main body 1, there is a technique described in Japanese Patent Application Laid-Open No. 2000-174042, and an example thereof is shown in FIGS. This is because the base 8 and the fastening fixture 9 for fixing the optical pickup main body 1 and the vertical directions a and b, the horizontal directions c and d, and the vertical directions e and f arranged on the sides of the base 8. A movable body 10 that can move three-dimensionally, an arm 11 extending from the movable body 10 to above the base 8, and a magnet 12 provided on a lower surface 19 of a tip 11 a of the arm 11
And an adhesive injector 13 for injecting the ultraviolet-curable adhesive 3 and two ultraviolet irradiators 14 for curing the ultraviolet-curable adhesive 3. Reference numeral 15 denotes a cable connected to a connector 17 provided on a printed board 16 of the optical pickup body 1.

The bonding procedure will be described with reference to the above structure. The optical pickup main body 1 is fixed to a predetermined position on a base 8 by a fastener 9, and the chip 2 is attracted to the magnet 12 of the arm 11, and the movable body 10 Is moved to project the laser light from the semiconductor laser LD onto the disk D with the chip 2 approaching the chip mounting surface 1a, the reflected light is received by the photodiode PD, and the received electric signal is transmitted through the cable 15. Then, the movable body 10 is finely adjusted so that the center O1 of the photodiode PD coincides with the axis O2 of the objective lens OL (see FIGS. 7 and 8). And both side edges 2a of the chip 2
And an adhesive injector 1 between both sides 5 of the chip mounting surface 1a.
After injecting the ultraviolet curable adhesive 3 with the arm 3, the arm 1
The adhesive 3 is hardened by irradiating ultraviolet rays from two sides of 1 with two ultraviolet irradiators 14, and the movable body 10 is raised.
Then, the arm tip 11a may be separated from the chip 2.

[0006]

In the above-mentioned conventional configuration,
As shown in FIG. 9, the axis O3 of the arm tip 11a is
A center line O4 extending along both side edges 5 of the chip mounting surface 1a through the axis O2 of the objective lens OL intersects in a plan view, and both side edges 2a of the chip 2 and the chip mounting surface 1
Since both side edges 5a are covered from above by the arm tip 11a, the arm tip 11a becomes an obstacle, making it difficult to properly inject the ultraviolet curable adhesive 3 and to prevent The irradiation amount of the ultraviolet rays by the ultraviolet irradiator 14 becomes non-uniform, so that the curing speed of the two ultraviolet-curable adhesives 3 is not constant, whereby the chip 2 is pulled toward the previously cured ultraviolet-curable adhesive 3. As a result, the center O1 of the photodiode PD may be displaced from the axis O2 of the objective lens OL. Further, since two ultraviolet irradiators 14 are used, the manufacturing cost is high.

In view of the above-mentioned conventional disadvantages, the present invention can efficiently and appropriately inject an ultraviolet-curable adhesive, and can evenly cure both of the injected ultraviolet-curable adhesives. It is another object of the present invention to provide an electronic component bonding apparatus that can be manufactured at low cost.

[0008]

In order to achieve the above object, according to the present invention, an optical pickup main body is fixed on a base, and a movable body disposed on a side of the base is used to move the optical pickup body. A chip with a photodiode is attracted to the lower surface of the tip of the arm extending upward, and the movable body is moved to bring the chip closer to the chip mounting surface of the optical pickup body, so that the center of the photodiode is at the axis of the objective lens. Then, after injecting an ultraviolet curable adhesive between both side edges of the chip and both side edges of the chip mounting surface, the adhesive is cured by irradiating ultraviolet light, and the movable body is raised by raising the arm. In an electronic component bonding apparatus in which a tip is separated from a chip, an axis of the arm tip extends through an axis of an objective lens and extends along both side edges of the chip mounting surface. And a magnet for adsorbing the chip is provided at the center of the lower surface of the tip of the arm, and a horizontal direction and a vertical direction of the chip are provided on the periphery of the lower surface of the tip. A plurality of positioning pins are provided for positioning of the arm, and a pair of left and right recesses are formed on both side surfaces of the tip end of the arm so as to oppose both side edges of the chip, and the width between the two recesses is set on both sides of the chip. The distance between the edges is set to be substantially the same, the upper part on both sides of the tip of the arm is a tapered inclined surface, and one ultraviolet irradiator is provided above the tip of the arm. Features.

According to the above configuration, the axial center of the tip of the arm is set so as to substantially coincide with the chip installation surface and the center line of the chip positioned thereon in plan view, and both side edges of the chip and the chip Since both side edges of the installation surface are opened along both side surfaces of the arm tip, the work of injecting the ultraviolet curable adhesive can be performed appropriately and efficiently,
The ultraviolet curable adhesive can be uniformly cured by irradiating ultraviolet rays uniformly from both sides of the arm tip, and the displacement of the chip due to uneven curing as in the conventional case can be prevented.

Further, since the chip is temporarily and accurately fixed at a predetermined position on the lower surface of the tip of the arm by the magnet and the plurality of positioning pins, the chip can be accurately positioned with respect to the chip mounting surface.

Further, the injection of ultraviolet curable adhesive and the irradiation of ultraviolet light can be appropriately and efficiently performed through a pair of left and right concave portions formed on both side surfaces of the arm tip.

Moreover, since the ultraviolet rays emitted from the ultraviolet irradiator provided above the tip of the arm are evenly split into two hands along the inclined upper inclined surface of the tip of the arm, the ultraviolet rays split into two hands Can be uniformly irradiated from both sides of the arm tip toward both UV-curable adhesives, and only one UV irradiator need be provided.
Production costs are low.

According to a second aspect of the present invention, in the first aspect of the present invention, the plurality of positioning pins include a plurality of horizontal positioning pins inserted through a plurality of through holes provided through the chip, and a surface of the chip. And a plurality of height positioning pins abutting on the upper surface.

According to the above arrangement, the plurality of horizontal positioning pins are inserted into the plurality of through-holes of the chip, and the plurality of height positioning pins are brought into contact with the surface of the chip. It can be temporarily temporarily fixed at a predetermined position on the lower surface.

According to a third aspect of the present invention, in the second aspect of the present invention, an appropriate one of the plurality of horizontal positioning pins is integrally formed with a positioning portion to be in contact with the surface of the chip. It is characterized by.

According to the above construction, the horizontal positioning pins integrally formed with the positioning portions are also used for positioning in the horizontal direction and the vertical direction, and the number of height positioning pins can be reduced by the number of times of the double use. , The production cost is cheap.

According to a fourth aspect of the present invention, an electronic member is fixed on a base, and an electronic component is attracted to a lower surface of a distal end of an arm extending from a movable body arranged on a side of the base to above the base. Moving the movable body to bring the electronic component closer to the component mounting surface of the electronic member so that the center of the electronic component coincides with the center of the component mounting surface; An electronic component in which an ultraviolet-curing adhesive is injected between both side edges of the surface, and then the adhesive is cured by irradiating ultraviolet rays, and the movable body is raised to separate the tip of the arm from the electronic component. In the bonding apparatus, an axis of the arm tip is set so as to substantially coincide with a center line extending through both sides of the component mounting surface through the center of the component mounting surface in plan view. Features.

According to the above construction, the axial center of the arm tip is set so as to substantially coincide with the component mounting surface and the center line of the electronic component positioned thereon in plan view. And since both side edges of the component installation surface are opened along both side surfaces of the arm tip, the work of injecting the ultraviolet curable adhesive can be performed appropriately and efficiently,
The ultraviolet curable adhesive can be evenly cured by irradiating ultraviolet rays uniformly from both sides of the arm tip, and the displacement of the electronic component due to uneven curing can be prevented as in the related art.

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, a magnet for attracting the electronic component is provided at a center of a lower surface of the arm tip and a peripheral edge of the lower surface of the tip is provided. A plurality of positioning pins for positioning the electronic component in the horizontal direction and the vertical direction are provided.

According to the above configuration, since the electronic component is temporarily temporarily fixed to the predetermined position on the lower surface of the arm tip by the magnet and the plurality of positioning pins, the electronic component is precisely positioned with respect to the component mounting surface. can do.

According to a sixth aspect of the present invention, in the fifth aspect of the invention, the plurality of positioning pins include a plurality of horizontal positioning pins inserted through a plurality of through holes formed through the electronic component; And a plurality of height positioning pins that are in contact with the surface of the head.

According to the above arrangement, the plurality of horizontal positioning pins are inserted into the plurality of through holes of the electronic component, and the plurality of height positioning pins are brought into contact with the surface of the electronic component, and the electronic component is armed. It can be temporarily temporarily fixed at a predetermined position on the lower surface of the tip portion.

According to a seventh aspect of the present invention, in the sixth aspect of the invention, an appropriate one of the plurality of horizontal positioning pins is integrally formed with a positioning portion that is in contact with the surface of the electronic component. It is characterized by:

According to the above configuration, the horizontal positioning pins integrally formed with the positioning portions are also used for positioning in the horizontal direction and the vertical direction, and the number of height positioning pins can be reduced by the number of the functions. , The production cost is cheap.

According to an eighth aspect of the present invention, in the invention according to any one of the fourth to seventh aspects, a pair of left and right concave portions are formed on both side surfaces of the arm tip so as to face both side edges of the electronic component. The width between the two concave portions is set substantially equal to the interval between both side edges of the electronic component.

According to the above configuration, the injection of the ultraviolet curable adhesive and the irradiation of the ultraviolet light can be appropriately and efficiently performed through the pair of left and right concave portions formed on both side surfaces of the arm tip.

According to a ninth aspect of the present invention, in the invention according to any one of the fourth to eighth aspects, upper portions of both side surfaces of the arm tip end are tapered slopes. It is characterized in that one ultraviolet irradiator is provided above.

According to the above construction, the ultraviolet light emitted from the ultraviolet irradiator provided above the tip of the arm is evenly split into two hands along the inclined upper inclined surface of the tip of the arm. UV rays can be uniformly irradiated from both sides of the arm tip toward both UV curable adhesives, and only one UV irradiator is required, so that the manufacturing cost is low.

The invention according to claim 10 is the invention according to claims 4 to 9
In the invention described in any one of the above, the electronic member is formed of an optical pickup main body, and the electronic component is formed of a chip with a photodiode.

According to the above configuration, the chip with the photodiode can be precisely adhered to the chip mounting surface of the optical pickup body in a predetermined manner.

[0031]

1 to 5 show an electronic component bonding apparatus according to an embodiment of the present invention, in which a distal end portion 11a of an arm 11 is bent in a substantially rectangular shape in plan view. As a result, the axis O3 of the tip 11a substantially coincides with the center line O4 extending along the side edges 5 of the chip mounting surface (component mounting surface) 1a through the axis O2 of the objective lens OL in plan view. The magnet 12 for adsorbing the chip (electronic component) 2 is provided at the center of the lower surface 19 of the arm tip 11a.
a four positioning pins 20 to 23 for positioning the chip 2 in the horizontal and vertical directions on the periphery of the lower surface 19 of FIG.
Is provided. The same components as those shown in FIGS. 7 to 11 are denoted by the same reference numerals in the configuration other than the above, and description thereof will be omitted.

As shown in FIGS. 3 to 5, the four positioning pins 20 to 23 are inserted into two diagonally extending through holes 24 at both corners of the chip 2 so as to be inserted into two horizontal holes 24. Positioning pins 20 and 21 and 2 which are in contact with the surface of chip 2
There are two height positioning pins 22 and 23, and a positioning portion 21 a that is in contact with the surface of the chip 2 is integrally formed on one horizontal positioning pin 21.

According to the above configuration, the two horizontal positioning pins 20, 21 are inserted into the through holes 24 of the chip 2, and the two height positioning pins 22, 23 and one positioning portion 21a are connected to the chip 2. The chip 2 can be temporarily temporarily fixed at a predetermined position on the lower surface 19 of the arm end portion 11a simply by making contact with the front surface.
The horizontal positioning pin 21 integrally formed with a is also used for positioning in the horizontal and vertical directions, and the number of the height positioning pins 22 and 23 can be reduced by the number of the dual purpose, so that the manufacturing cost is low. .

As shown in FIG. 3 to FIG.
A pair of left and right concave portions 26 are formed on both side surfaces of the chip 1 so as to face both side edges 2a of the chip 2, and a width h between the two concave portions 26 is set to be substantially the same as a distance H between both side edges 2a of the chip 2. Accordingly, the injection of the ultraviolet-curable adhesive 3 and the irradiation of the ultraviolet light can be appropriately and efficiently performed through the two concave portions 26.

As shown in FIGS. 4 and 5, upper portions of both side surfaces of the arm tip portion 11a are formed as an inclined surface 27 having an upwardly tapering shape, and an ultraviolet irradiator 14 is provided above the arm tip portion 11a.
(See FIG. 2). In this case, the ultraviolet rays emitted from the ultraviolet ray irradiator 14 provided above the arm tip 11a are evenly and evenly distributed along the inclined surface 27 of the upper part. Since the two parts are separated, the two separated ultraviolet rays can be evenly irradiated from both sides of the arm tip portion 11a toward both the ultraviolet curable adhesives 3 and only one ultraviolet irradiator 14 needs to be provided. , The production cost is cheap.

The bonding procedure will be described with reference to the above configuration. As shown in FIGS. 1 and 2, the optical pickup main body (electronic member) 1 is fixed to a predetermined position on the base 8 by a fastener 9, and a magnet The through hole 24 of the chip 2 sucked to the chip 12 is fitted to the horizontal positioning pins 20 and 21 and the surface of the chip 2 is brought into contact with the height positioning pins 22 and 23 and the positioning portion 21a, and the chip 2 is moved. Arm tip 1
Temporarily fixed to the lower surface 19 of 1a. Next, the movable body 10 is moved to bring the chip 2 close to the chip mounting surface 1a as shown in FIG. 6 (a), and the laser light from the semiconductor laser LD is disc-shaped as shown in FIG. 6 (b). D, the reflected light is received by the photodiode PD, and the received electric signal is input to an oscilloscope (not shown) via the cable 15 to thereby obtain the center O1 of the photodiode PD (the center of the electronic component). Finely adjusts the movable body 10 so that the center of the movable lens 10 coincides with the axis of the objective lens OL (the center of the component installation surface) O2 (see FIGS. 1 and 2). Next, both side edges 2a of the chip 2 and the chip installation surface 1a After the ultraviolet curable adhesive 3 is injected between the two side edges 5 by an adhesive injector 13, FIG.
As shown in FIG. 6C, the adhesive 3 is cured by irradiating ultraviolet rays by the ultraviolet irradiator 14, and as shown in FIG. Should be kept away from.

According to the above configuration, the axial center O3 of the arm tip 11a is set so as to substantially coincide with the center line O4 of the chip mounting surface 1a and the chip 2 positioned thereon in plan view. 2 are opened along both side surfaces of the arm tip 11a, so that the work of injecting the ultraviolet curable adhesive 3 can be performed properly and efficiently. The ultraviolet curable adhesives 3 can be uniformly cured by irradiating ultraviolet rays uniformly from both sides of the arm tip 11a, thereby preventing displacement of the chip 2 due to uneven curing as in the conventional case. it can.

The magnet 12 and the four positioning pins 20
23, the chip 2 is accurately and temporarily fixed at a predetermined position on the lower surface 19 of the arm tip 11a, so that the chip 2 can be precisely positioned with respect to the chip mounting surface 1a.

In the above-described embodiment, the case where the chip 2 with the photodiode PD is bonded to the optical pickup body 1 has been described as an example. However, the present invention is not limited to this, and various electronic components may be used as electronic members. The present invention can also be applied to the case where the adhesive is adhered to.

[0040]

According to the first aspect of the present invention, the axial center of the tip of the arm is set so as to substantially coincide with the chip mounting surface and the center line of the chip positioned thereon in plan view. Since both side edges of the chip and both side edges of the chip mounting surface are opened along both side surfaces of the arm tip, the work of injecting the ultraviolet curable adhesive can be performed appropriately and efficiently, and both sides of the arm tip. The ultraviolet curable adhesive can be uniformly cured by irradiating ultraviolet rays uniformly from the other side, and the displacement of the chip due to non-uniform curing can be prevented as in the related art.

Further, since the chip is accurately temporarily fixed at a predetermined position on the lower surface of the tip of the arm by the magnet and the plurality of positioning pins, the chip can be precisely positioned with respect to the chip mounting surface.

Further, the injection of the ultraviolet curable adhesive and the irradiation of the ultraviolet light can be appropriately and efficiently performed through the pair of left and right concave portions formed on both side surfaces of the arm tip.

Moreover, since the ultraviolet rays emitted from the ultraviolet irradiator provided above the tip of the arm are evenly divided into two hands along the inclined upper inclined surface of the end of the arm, the ultraviolet rays divided into two hands Can be evenly irradiated from both sides of the arm tip toward both UV-curable adhesives, and it is only necessary to provide one UV irradiator.
Production costs are low.

According to the second aspect of the present invention, a plurality of horizontal positioning pins are inserted into a plurality of through holes of the chip, and the plurality of height positioning pins are brought into contact with the surface of the chip. The arm can be temporarily temporarily fixed at a predetermined position on the lower surface of the tip of the arm.

According to the third aspect of the present invention, the horizontal positioning pin integrally formed with the positioning portion is used for both horizontal and vertical positioning, and the number of height positioning pins is reduced by the number of the dual purpose. Because you can
Production costs are low.

According to the fourth aspect of the present invention, the axis of the arm tip is set so as to substantially coincide with the center line of the component mounting surface and the electronic component positioned thereon in plan view. Since both side edges of the component and both side edges of the component installation surface are opened along both side surfaces of the arm tip, the work of injecting the ultraviolet curable adhesive can be performed appropriately and efficiently, and both sides of the arm tip. Thus, the ultraviolet curable adhesive can be evenly cured by irradiating ultraviolet rays uniformly from the other side, and the displacement of the electronic component due to uneven curing can be prevented as in the related art.

According to the fifth aspect of the present invention, the electronic component is accurately temporarily fixed to the predetermined position on the lower surface of the arm tip by the magnet and the plurality of positioning pins. And can be positioned precisely.

According to the sixth aspect of the present invention, the plurality of horizontal positioning pins are inserted into the plurality of through holes of the electronic component, and the plurality of height positioning pins are brought into contact with the surface of the electronic component. The electronic component can be temporarily temporarily fixed at a predetermined position on the lower surface of the arm tip.

According to the seventh aspect of the present invention, the horizontal positioning pins integrally formed with the positioning portions are also used for positioning in the horizontal and vertical directions, and the number of height positioning pins is reduced by the same number of times. Because you can
Production costs are low.

According to the eighth aspect of the present invention, the injection of the ultraviolet curable adhesive and the irradiation of the ultraviolet light can be appropriately and efficiently performed through the pair of left and right concave portions formed on both side surfaces of the arm tip.

According to the ninth aspect of the present invention, the ultraviolet rays emitted from the ultraviolet irradiator provided above the tip of the arm are evenly split into two hands along the inclined upper inclined surface of the tip of the arm. Therefore, it is possible to uniformly irradiate the two divided ultraviolet rays from both sides of the arm tip toward both ultraviolet curable adhesives, and it is only necessary to provide one ultraviolet irradiator. Cheap.

According to the tenth aspect of the present invention, the chip with the photodiode can be precisely adhered to the chip mounting surface of the optical pickup body in a predetermined manner.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic front view of the same.

FIG. 3 is a plan view of the main part.

FIG. 4 is a front view of the main part.

FIG. 5 is an exploded perspective view of the main part.

FIGS. 6A to 6D are longitudinal sectional views of a main part showing a bonding procedure.

FIG. 7 is a schematic longitudinal sectional view showing the principle of an optical pickup.

FIG. 8 is a perspective view showing a main part of the optical pickup.

FIG. 9 is a schematic plan view showing a conventional example.

FIG. 10 is a schematic front view of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical pick-up main body (electronic member) 1a Chip mounting surface (component mounting surface) 2 Chip (electronic component) 2a Both side edges of chip 3 UV curable adhesive 5 Both side edges of chip mounting surface 8 Base 10 Movable body 11 Arm 11a Arm tip 12 Magnet 13 Adhesive injector 14 UV irradiator 19 Lower surface of arm tip 20 Horizontal positioning pin 21 Horizontal positioning pin 21a Positioning section 22 Height positioning pin 23 Height positioning pin 24 Chip through hole 26 Arm tip 27 The inclined surface at the tip of the arm OL Objective lens PD Photodiode O1 The center of the photodiode (the center of the electronic component) O2 The axis of the objective lens (the center of the component installation surface) O3 The axis of the arm tip O4 The center line H Spacing between both edges of chip h Width between both recesses

Claims (10)

[Claims] 1. An optical pickup main body is fixed on a base,
A chip with a photodiode is adsorbed to the lower surface of the tip of the arm extending from the movable body arranged to the side of the base to above the base, and the movable body is moved to move the chip to the chip mounting surface of the optical pickup body. The center of the photodiode is made to coincide with the axis of the objective lens by approaching, and then an ultraviolet curable adhesive is injected between both side edges of the chip and both side edges of the chip mounting surface, and then irradiated with ultraviolet light. In the electronic component bonding apparatus, the adhesive is hardened to raise the movable body to separate the tip of the arm from the chip, the axis of the tip of the arm passes through the axis of the objective lens, and A magnet is provided so as to substantially coincide with a center line extending along both side edges of the installation surface in plan view, and a magnet for adsorbing the chip is provided at the center of the lower surface of the arm tip. In addition, a plurality of positioning pins for positioning the chip in the horizontal and vertical directions are provided on a peripheral edge of a lower surface of the tip, and on both sides of the arm tip, opposing to both sides of the chip. A pair of left and right recesses are formed, the width between the two recesses is set to be substantially the same as the interval between both side edges of the chip, and the upper portions on both side surfaces of the tip of the arm are tapered inclined surfaces, An electronic component bonding apparatus, wherein one ultraviolet irradiator is provided above the tip of the arm. 2. The method according to claim 1, wherein the plurality of positioning pins include a plurality of horizontal positioning pins inserted into a plurality of through holes penetrating the chip, and a plurality of height positioning pins abutting on the surface of the chip. The electronic component bonding apparatus according to claim 1, wherein: 3. The electronic component bonding apparatus according to claim 2, wherein a positioning portion abutting on a surface of the chip is integrally formed with an appropriate one of the plurality of horizontal positioning pins. 4. An electronic member is fixed on a base, and an electronic component is attracted to a lower surface of a distal end portion of an arm extending above the base from a movable body arranged on a side of the base, and the movable body is attached to the electronic member. The center of the electronic component is made to coincide with the center of the component mounting surface by moving the electronic component closer to the component mounting surface of the electronic member, and then the both sides of the electronic component and the both side edges of the component mounting surface are moved. In an electronic component bonding apparatus, an ultraviolet curable adhesive is injected between the substrates, the adhesive is cured by irradiating ultraviolet rays, and the movable body is raised to separate the tip of the arm from the electronic component. An electronic component bonding apparatus, wherein an axial center of the tip portion is set so as to substantially coincide with a center line extending through both sides of the component mounting surface through the center of the component mounting surface in plan view. apparatus. 5. A magnet for attracting the electronic component is provided at the center of the lower surface of the arm tip, and for positioning the electronic component in the horizontal and vertical directions on the periphery of the lower surface of the tip. 5. An electronic component bonding apparatus according to claim 4, wherein a plurality of positioning pins are provided. 6. The electronic device according to claim 6, wherein the plurality of positioning pins include a plurality of horizontal positioning pins inserted through a plurality of through holes provided through the electronic component and a plurality of height positioning pins abutting on a surface of the electronic component. The electronic component bonding apparatus according to claim 5, wherein 7. An electronic component bonding apparatus according to claim 6, wherein an appropriate one of the plurality of horizontal positioning pins is integrally formed with a positioning portion that is in contact with a surface of the electronic component. . 8. A pair of left and right concave portions are formed on both side surfaces of the arm tip portion so as to face both side edges of the electronic component, and a width between the two concave portions is substantially equal to a distance between both side edges of the electronic component. The electronic component bonding apparatus according to claim 4, wherein the electronic component bonding apparatus is set to: 9. The apparatus according to claim 4, wherein upper portions of both side surfaces of said arm tip portion are inclined upwards, and one ultraviolet irradiator is provided above said arm tip portion. 9. The electronic component bonding apparatus according to any one of claims 1 to 8. 10. The electronic component bonding apparatus according to claim 4, wherein said electronic member comprises an optical pickup main body, and said electronic component comprises a chip with a photodiode.