JPS6063937A - Assembling device for electronic component - Google Patents

Assembling device for electronic component

Info

Publication number
JPS6063937A
JPS6063937A JP13715284A JP13715284A JPS6063937A JP S6063937 A JPS6063937 A JP S6063937A JP 13715284 A JP13715284 A JP 13715284A JP 13715284 A JP13715284 A JP 13715284A JP S6063937 A JPS6063937 A JP S6063937A
Authority
JP
Japan
Prior art keywords
frame
lead frame
cutting
pellet
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13715284A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
巳亦　力
Takeshi Shimizu
猛 清水
Masakazu Ozawa
小沢　正和
Osamu Sumiya
修 角谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13715284A priority Critical patent/JPS6063937A/en
Publication of JPS6063937A publication Critical patent/JPS6063937A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Abstract

PURPOSE:To offer the titled device with a lead frame fit for integrated working by a method wherein the titled device is equipped with a cutting device cutting the frame to fixed lengths and a bonding mechanism to fix electronic elements on the frame. CONSTITUTION:The lead frame 1a of continuous length wound around a reel is continuously let out by means of a film loader 2, and then cut to medium lengths by means of a cutting press 4. The tab surface of the frame is coated with Ag paste by operation of an Ag paster 5. Chips are taken out individually and placed on a transfer line for the frame, a pellet bonder 6 being operated, and pellets being then positioned to the tab surface in the frame one by one, resulting in pellet attachment. Wires are attached between the upper electrodes and corresponding leads by operation of a pair of wire bonders 7a and 7b. The frame is set in the upper and lower molds of a forming device 10 and then molded with resin. Next, it is cut to frames of short length by means of a cutting press 11.

Description

【発明の詳細な説明】 この発明は半導体装置、特にＩＣ，ＬＳＩの一貫組立法
におけるリードフレームの供給に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the supply of lead frames for integrated assembly of semiconductor devices, particularly ICs and LSIs.

たとえば、フープ状の連続リードフレームを用いＣ、ペ
レットボンディング、ワイヤボンディングＪ６よび封止
を行なう技術は特開昭５０−７９２６４号、！特開昭５
２−１０６６８５号およびｔ特開昭５３−２６６７ｉＪ
号に示めされている。For example, a technique for performing C, pellet bonding, wire bonding J6, and sealing using a hoop-shaped continuous lead frame is disclosed in Japanese Patent Application Laid-Open No. 50-79264! Japanese Patent Application Publication No. 5
No. 2-106685 and t JP-A-53-2667iJ
It is shown in the number.

撮脂封止型半導体装置の組立方法においては、半導体ウ
ェハ状態で素子領域を加工し、分断したペレット単体（
チップ）に対して複数のリードを一体に形成したリード
フレームを用意し、各リードフレーム上にペレットをボ
ンディングし、このペレットの電極とリードとをワイヤ
ボンディングし、さらにペレットとリードの一部を封止
する樹脂モールドを行なう一連の紹Ｖ工程を必要とし、
従来はこれら組立作業を各工程ごとに独立した自動機械
により行なっている。近年、上記組立工程間を連続させ
組立作業の一貫化が図られているが、その場合各組型工
程におけるリードフレームの供給方法が問題となる。In the method of assembling a resin-sealed semiconductor device, an element region is processed in a semiconductor wafer state, and individual pellets (
A lead frame with multiple leads integrally formed for the chip (chip) is prepared, a pellet is bonded onto each lead frame, the electrodes of this pellet are wire-bonded to the leads, and a portion of the pellet and leads are sealed. It requires a series of steps to perform a resin mold to stop the process.
Conventionally, these assembly operations have been performed by independent automatic machines for each process. In recent years, attempts have been made to integrate the assembly operations by making the above assembly processes continuous, but in this case, the method of supplying the lead frame in each molding process becomes a problem.

一般に組立機械へのリードフレームの供給手段として（
１）リードフレームを複数のペレット単体に対応する適
当１よ長さに切断した短尺フレームとして供給する、（
２）フープ状の連続フレームとして連続供給する等の２
種の方法がある。上記ｆｌ＋はフレーム供給作業の自動
化に困難が伴う、上記（２１はフレームが連続体である
ため作業の中断１品種交換が必要な場合に対処できず、
全工程を一貫した場合に工程間のストックをとりにくい
等の点でそれぞれ欠点があった。Generally used as a means of supplying lead frames to assembly machines (
1) Supply the lead frame as a short frame cut into an appropriate length corresponding to a plurality of single pellets (
2) Continuous supply as a hoop-shaped continuous frame, etc.
There is a seed method. The fl+ mentioned above has difficulty in automating the frame supply work, and the above (21) has a continuous frame, so it cannot deal with the case where the work is interrupted and one product needs to be replaced.
Each method has its drawbacks, such as the difficulty of keeping stock between processes when all processes are consistent.

本発明は上記した従来技術の問題点を解消するべくなさ
ねたもので、その目的は半導体装置の組立作業の一貫化
のために適合したリードフレームによる電子部品の組立
装置を提供することにある。The present invention has been made to solve the above-mentioned problems of the prior art, and its purpose is to provide an apparatus for assembling electronic components using a lead frame that is suitable for unifying the assembly work of semiconductor devices. .

上記目的を達成するための本発明の一実施例は、リード
フレームを供給する初期段階では連続フレームの状態で
連続移送し１、次の段階では組立作業に応じた適当な長
さにフレームを切断した定尺フレームの状態で連続移送
することを要旨とする。One embodiment of the present invention to achieve the above object is to continuously transport lead frames in the form of a continuous frame in the initial stage of supplying the lead frame, and then cut the frame into an appropriate length according to the assembly work in the next stage. The main idea is to continuously transport the fixed length frame.

第１図は本発明の対象となる樹脂封止型ＩＣ組立プロセ
スを示し、第２図はそれに使用する一貫組立装置を示す
。FIG. 1 shows a resin-sealed IC assembly process to which the present invention is applied, and FIG. 2 shows an integrated assembly apparatus used therein.

（５）　フレームローディング。第３図１ａに示すごと
きリールに巻いた長尺のリードフレーム１ａをアレーン
・ローダ２により連続的に繰出し、−貫組立装置の水平
なフレーム移送面にそって２列に配列しながらフレーム
ｌステーションごとに間欠的に移送する。(5) Frame loading. A long lead frame 1a wound on a reel as shown in FIG. Transfer intermittently.

（Ｂｌ　タブ下げ。第４図１１１ｔｂｌを参照し、リー
ドフレ　ムームにおけるベレット付は部となるタブＴを
り−　゛ド面よりも低くなるようにフレームの間欠的移
送に従ってタブ下げプレス３を動作させてタブリードの
一部を曲げることでタブ下けを行なう。(Bl Tab lowering. Refer to Fig. 4, 111tbl, and operate the tab lowering press 3 according to the intermittent movement of the frame so that the tab T, which is the part of the lead frame with the beret, is lower than the lead surface. Lower the tab by bending a portion of the tab lead.

（Ｃ）　フレーム切断Ｉ。連続リードフレーム１を切断
プレス４により定尺、例えば第３図１ｂに示すような３
５連の中尺に切断する。この長尺のリードフレームはフ
レーム間欠移送装置により一貫組立装置のフレーム移送
面にそってフレーム１ステーシヨンごとに間欠的移送さ
れる。(C) Frame cutting I. The continuous lead frame 1 is cut into a fixed length by a cutting press 4, for example, as shown in FIG.
Cut into 5 medium length pieces. This long lead frame is intermittently transferred by the frame intermittent transfer device along the frame transfer surface of the integrated assembly device for each frame station.

（Ｄ　銀ペースト付け。間欠移送されるフレームのタブ
面に対し、銀ペースト付は装置５を動作させて銀ペース
トを塗布する。(D. Applying silver paste. For applying silver paste, operate the device 5 to apply silver paste to the tab surface of the frame that is intermittently transferred.

（ｐ　ペレット取出し。半導体ウニノ・をスクライブし
て、各素子を含む単体チップに分割したものを用意し、
この中から、チップ（ベレット）を個々に取出してリー
ドフレームの移送ラインにのせる。(p Pellet extraction. Scribe the semiconductor unit and prepare the chips that are divided into single chips containing each element.
Chips (bellets) are taken out individually and placed on the transfer line of the lead frame.

（Ｄ　ベレットボンディング。ベレットボンダ６を動作
し、ベレットを１個ずつフレームにおけるタブ面に位置
決めし、「こすり付け」及び加熱によりベレット付けを
行なう。(D. Bullet bonding. The bullet bonder 6 is operated, the bullets are positioned one by one on the tab surface of the frame, and the bullets are bonded by "rubbing" and heating.

（０ワイヤボンディング。フレーム上におけるベレット
の上部電極と対応リードとの間を１対のワイヤボンダ７
ａ、７ｂを動作してワイヤ付けを行なう。(0 wire bonding. A pair of wire bonders 7 is connected between the upper electrode of the pellet on the frame and the corresponding lead.
Operate steps a and 7b to attach the wire.

０」　バッファ。ベレット付は及びワイヤ付ケの完ｆし
た長尺のフレーム（３５連）を１個ごと上下に動作する
ストッカ８に送入し、複数段に収納するとともに、一方
で長尺のフレームを１個ごと次の工程のピッチに合せて
送出する。0” buffer. Complete long frames (35 frames) with bullets and wires are fed one by one into the stocker 8 that moves up and down and stored in multiple stages, while one long frame is Each process is sent out in accordance with the pitch of the next process.

（１）予備加熱。プレヒータ９により長尺のフレームを
樹脂モールドに適合する温度まで加熱する。(1) Preheating. A preheater 9 heats the long frame to a temperature compatible with the resin mold.

ｆＪｌ　樹脂モールド。予備加熱さハたフレームを成形
装置１０の上下型内にセントし、上下型を閉じ°〔樹脂
を圧力導入しベレットを包含する樹脂モールドを行ない
、その後型を開いてモールド品を取出す。fJl resin mold. The preheated frame is inserted into the upper and lower molds of the molding device 10, and the upper and lower molds are closed.[Resin is introduced under pressure to form a resin mold that includes the pellets, and then the mold is opened to take out the molded product.

卸　フレーム切断Ｉｔ　０モールドされた長尺のフレー
ムを切断プレス１１によりさらに短い定尺、例えば第３
図１ｃに示すような７連の短尺フレームに切断する。こ
の後、フレームローダにより短尺フレームを複数段の状
態でマガジンに収容する。Wholesale frame cutting It 0 The molded long frame is cut into a shorter fixed length by cutting press 11, for example, the third
Cut into 7 short frames as shown in Figure 1c. Thereafter, the short frames are stored in a magazine in multiple stages using a frame loader.

以上実施例で述べた構成によれば、■程Ａ−Ｂを連続フ
レームの状態、■程Ｃ−Ｊを長尺のフレームの状態、Ｋ
以後を短尺のフレームの状態で組立作業が行われるよう
になっている。According to the configuration described in the embodiment above, ■ the interval A-B is a continuous frame state, ■ the interval C-J is a long frame state, and the interval K
From then on, assembly work is carried out using the short frame.

ここで従来の分割フレーム方式と連続フレーム方式をＩ
Ｃの組立〜モールドー貫化における各作業項目について
その適不適を比較した表を掲げる。Here, the conventional divided frame method and continuous frame method are
A table comparing the suitability and suitability of each work item in C assembly to mold penetration is listed below.

このようＶこ作業項目によって連続フレームと定尺フレ
ームとでそれぞれ一長一短があるが、本発明の構成によ
れば、汚染の少な℃・状態での保存供給自動化の容易な
連続フレームと個々の作業性やストックの面で有利な長
短穴の定尺フレームの両方の利点を得ることができ、ペ
レット付はワイヤ付は及び樹脂モールドを含む一貫装置
を使用する複雑なラインにおいて高度な信頼性と作業性
とが実現できると期待される。Continuous frames and fixed-length frames each have their advantages and disadvantages depending on the work item, but according to the configuration of the present invention, continuous frames that can be easily stored and supplied automatically in less contaminating °C conditions and individual workability can be used. You can obtain the advantages of both fixed length frames with long and short holes, which are advantageous in terms of stock and stock, and the pellet type with wire type and resin mold type have a high degree of reliability and workability in complex lines that use integrated equipment including resin molding. It is hoped that this can be achieved.

本発明は前記実施例に限定されるものではない。The present invention is not limited to the above embodiments.

例えばリードフレームの長・短尺の長さは組立作業の内
容に応じて最も適当な長さに規定すればよい。For example, the length and short length of the lead frame may be determined to be the most appropriate length depending on the content of the assembly work.

本発明はリードフレームの供給、それ自体に対する加工
、リードフレームへのベレット等を組込み、その状態で
の加工を含む連続一貫作業に適用できるものである。The present invention can be applied to continuous integrated work including supplying a lead frame, processing the lead frame itself, incorporating a pellet into the lead frame, and processing in that state.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明による一実施例の一貫組立プロセスを示
すブロック線図、第２図は本発明の一貫組立装置な示す
斜視図、第３図は本発明におけるリードフレームの形態
を示し、ｌａｌは正面図、（ｂ）。 ｉｃｌは平面図、第４図はリードフレームを拡大した形
態を示し、ｌａｌは平面図、ｌｂｌは断面図である。 １・・・リードフレーム、２・・・フレームローダ、３
°゛タブ下げプレス、４・・・切断プレス、５・・・銀
ベースト付１［，６・・・ベレットポンダ、７ａ、７ｂ
・・・ワイヤポンダ、８・・・ストッカ、９・・・プレ
ヒータ、１０・・・樹脂成形機、１１・・・切断プレス
。 Ａ・・・フレームローディング、Ｂ・・・タブ下げ、Ｃ
・・・フレーム切断１、Ｄ・・・銀ペースト付け、Ｅ・
・・ベレット取出し、Ｆ・・・ベレットボンディング、
Ｇ・・・ワイヤボンディング、Ｈ・・・バッファ、■・
・予備加熱、Ｊ・・・樹脂モールド、Ｋ・・・フレーム
切断■。 代理人　弁理士　高　橋　明　夫FIG. 1 is a block diagram showing an integrated assembly process according to an embodiment of the present invention, FIG. 2 is a perspective view showing an integrated assembly apparatus of the present invention, and FIG. 3 shows the form of a lead frame in the present invention. is a front view, (b). icl is a plan view, FIG. 4 shows an enlarged form of the lead frame, lal is a plan view, and lbl is a sectional view. 1... Lead frame, 2... Frame loader, 3
°゛Tab lowering press, 4... Cutting press, 5... With silver base 1 [, 6... Bullet ponder, 7a, 7b
... wire ponder, 8 ... stocker, 9 ... preheater, 10 ... resin molding machine, 11 ... cutting press. A... Frame loading, B... Tab down, C
... Frame cutting 1, D... Silver paste attachment, E.
...Bellet removal, F...Bellet bonding,
G...Wire bonding, H...Buffer, ■・
・Preheating, J...Resin mold, K...Frame cutting■. Agent Patent Attorney Akio Takahashi

Claims (1)

【特許請求の範囲】 １、　１ａ＋　リードフレームの連続供給機構とｉｂｌ
　−１，：記す−ドフｌ／　−Ａを複数のリードフレー
ム・セルを含む所定の長さに切断する切断装置と ｌｃｌ　上記所定の長さにされたリードフレーム上に電
子素子を固着するためのボンディング機構 よりなる電子部品の組立装置。[Claims] 1. 1a+ Lead frame continuous supply mechanism and ibl
-1,: A cutting device for cutting Doff L/-A into a predetermined length including a plurality of lead frame cells and an lcl for fixing an electronic element on the lead frame made into a predetermined length. Electronic component assembly equipment consisting of a bonding mechanism.
JP13715284A 1984-07-04 1984-07-04 Assembling device for electronic component Pending JPS6063937A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13715284A JPS6063937A (en) 1984-07-04 1984-07-04 Assembling device for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13715284A JPS6063937A (en) 1984-07-04 1984-07-04 Assembling device for electronic component

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP15854878A Division JPS5586124A (en) 1978-12-25 1978-12-25 Assembly method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6063937A true JPS6063937A (en) 1985-04-12

Family

ID=15192032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13715284A Pending JPS6063937A (en) 1984-07-04 1984-07-04 Assembling device for electronic component

Country Status (1)

Country Link
JP (1) JPS6063937A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01211931A (en) * 1988-02-19 1989-08-25 Toshiba Corp Apparatus for assembling semiconductor device
US5549716A (en) * 1991-09-02 1996-08-27 Tdk Corporation Process for manufacturing integrated circuits using an automated multi-station apparatus including an adhesive dispenser and apparatus therefor
US6156078A (en) * 1991-09-16 2000-12-05 Sgs-Thomson Microelectronics Sdn. Bhd. Testing and finishing apparatus for integrated circuit package units

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01211931A (en) * 1988-02-19 1989-08-25 Toshiba Corp Apparatus for assembling semiconductor device
JP2602876B2 (en) * 1988-02-19 1997-04-23 株式会社東芝 Semiconductor device assembly equipment
US5549716A (en) * 1991-09-02 1996-08-27 Tdk Corporation Process for manufacturing integrated circuits using an automated multi-station apparatus including an adhesive dispenser and apparatus therefor
US6156078A (en) * 1991-09-16 2000-12-05 Sgs-Thomson Microelectronics Sdn. Bhd. Testing and finishing apparatus for integrated circuit package units

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