JPS60234336A - Inner lead bonder - Google Patents

Abstract

PURPOSE:To enable to prevent the positional deviations of a die and the lead of a carrier tape by a method wherein the die is positioned on a rotary table, and the positioned die is located at a bonding location by rotating the rotary table. CONSTITUTION:A rotary table 40 of the size in which a die positioning location 82 and a bonding location 84 can be contained is provided and after a die 51 has been positioned at a die-positioning location 82, the rotary table 40 is rotated. Consequently, as the positioned die 51 is positioned at the bonding location 84, the position of the die 51 at the bonding location 84 can be determined by the accuracy of rotation of the rotary table 40, the die 51 can be positioned at the bonding location 84 without having positional deviation, thereby enabling to perform a highly precise bonding work.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an inner lead bonder for bonding a die to leads provided in advance at equal intervals on a carrier tape.

(Prior Art) Conventionally, two methods are known for inner lead bonding. In the first method, a wafer consisting of a plurality of dies divided at equal intervals is positioned and placed on a table driven in the XYZ directions, and a carrier tape is placed above the table to be transferred intermittently. Then, the carrier tape is directly pressed onto the die using a bonding tool placed above the carrier tape to form a C-bond ink.

However, this method uses a camera placed above the carrier tape to detect the overlapping pattern of the die and leads to align the die and leads, so it has the disadvantage that it is difficult to detect misalignment of the die pattern. have

Also, since the wafer is attached to a plate made of ceramic or glass with a low melting point adhesive and divided into equal intervals, the method of bonding by pressing the carrier tape directly onto the wafer as described above is During bonding, the heat from the bonding tool is transmitted to the surrounding dies of the bonded die, melting the adhesive and easily shifting the position of the die. At the same time, the adhesive melts from the slicing line of the adjacent die, causing capillary action, etc. may climb onto the surface of the die and contaminate the die, making it impossible to detect the die. In addition, the warp, flatness, and heat resistance of the plate greatly affect the die and leads after bonding.

In addition, in order to prevent the inner leads of the carrier tape to be bonded from touching the pads of the die to be bonded and the adjacent die, the inner leads near the bonding tool must be curved away from the die, and the carrier tape must have a benevolent influence.

The second method is to place a table on which the wafer is placed and driven in the X and Y directions at a position away from the bonding position of the carrier tape, and use a positioning claw to position the die between the bonding position and the table. A die positioning position is provided, and a first transfer arm vacuum-chucks one die from the wafer, transfers it to the die positioning position, and positions it using a positioning claw. Next, a second transfer arm vacuum-chucks the positioned die and transfers it to a bonding position. Thereafter, the carrier tape is pressed onto the die using a bonding tool from above the carrier tape to perform bonding.

This method has the advantage that the die is positioned away from the bonding position, so the camera placed just above the bonding position only needs to detect the lead of the carrier tape. Since it is sucked by the arm and transferred by "C", there is a drawback that the position of the die is shifted by one die when sucking and releasing the suction.

On the other hand, in the case of carrier tape, it is necessary to precisely position one lead of the carrier tape with respect to one die. For this reason, the detection position of the positioned lead is moved below the detection camera, the lead position of the carrier tape is automatically recognized and corrected, and the lead is moved to the bonding position again.

Conventionally, as such carrier tape positioning devices, for example, Japanese Patent Publication No. 57-53972 and Japanese Patent Application Laid-open No. 58-1
The one shown in Publication No. 41y is known.

However, in the conventional film carrier positioning device, the lead section positioned by the positioning claw is simply pressed against the guide plate by the tensilon of the tape. When a tape that has been positioned is moved by one step, the position of the lead of the positioned tape may be shifted due to vibration, resulting in a disadvantage that the bonding position accuracy of the lead to the pellet deteriorates.

(Object of the Invention) An object of the present invention is to provide an inner lead bonder that can prevent die positional displacement, which is a drawback of the second method, and also prevent Ifffl displacement of the leads of a carrier tape. There is a particular thing.

(Example of the invention) Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 1 is an overall phase view showing one embodiment of the present invention, FIG. 2 is a cross-sectional view of FIG. 1, and FIG. 3 is a (
f (11th explanatory diagram, Figures 4 and 5 are front views of the vicinity of the bonding sole in Figure 1, Figure 6 is a sectional view of the main part taken along line 6-6 in Figure 4, Figure 7 is a wafer It is a side view of a suction plate part.

As shown in FIGS. 1 and 2, a bonding tool 10
A tape loader section 12 and a tape unloader section 13 are respectively disposed on a pedestal 14 on both sides of the bonding ink head 11.

A reel J5 is rotatably supported on the tape loader section 12, and this reel 15 has a carrier tape 16 with leads provided at equal intervals and a carrier tape 16.
A spacer tape 17 for protecting the leads is overlapped and wound.

The carrier tape 1 is placed in the tape unloader section 13.
A reel 18 for overlapping and winding the spacer tape 17 and the spacer tape 17 is rotatably supported, and this reel 18 is driven by a reel driving e-tater (not shown).

Further, in order to guide the carrier tape 16 wound around the reel 15 below the bonding tool 10 and to the reel 18 side, a carrier tape guide roller 20.
1.22.23 is rotatably arranged. Further, below the bonding tool 10 is a guide plate 24, and on both sides of this guide plate 24 are guide rollers 25 and 26.
Furthermore, sprocket wheels 27 and 28 that engage with sprocket holes formed on both sides of the carrier tape 16 are rotatably attached to the tape position adjustment plate 29 on both sides of the guide roller 25 and 26. ing.

The tape position adjustment plate 29 is driven in the XY direction.
It is fixed to the table 30. Further, the one sprocket wheel 28 is rotationally driven in one direction by a stepping motor (not shown).

Further, in order to guide the spacer tape 17 wound around the reel 15 toward the reel 18, subena tape guide rollers 31 and 32 are rotatably mounted on the tape loader section 12 and the tape unloader section 13, respectively. There is.

As shown in FIGS. 1, 2, and 3, below the bonding sole 10, there is a rotary table 40 that rotates and is driven up and down. The cast is on a rotating table of 40
is mounted on an X and Y table 41 that is driven in the X and Y directions. Furthermore, die mounting stands 42A and 42B are fixed on the rotary table 40 directly below the bonding tool 10 and concentrically with the position directly below this. A pair of opposing die positioning claws 4 are provided above the i dimension die mounting table 42B.
The die positioning claws 43A and 43B are opened and closed by a drive mechanism (not shown).

The die positioning claw 43A, 4. An XY table 50 for placing a wafer is arranged in front of the jB (on the opposite side to the bonding tool 10).
On the table 50 are a plurality of dies 51 divided at equal intervals.
A wafer substrate 53 having a wafer 52 fixed thereon is positioned and fixed. Further, inside the wafer mounting XY table 50, there is a plunger 54 that positions the wafer mounting XY table 50 and vacuum sucks the back surface of the wafer 52 of the wafer substrate 53 mounted thereon.
A push-up needle 55 for pushing up one die 51 is arranged in the plunger 54 so as to be able to move up and down. Between the die positioning claws 43A, 43B and the wafer mounting XY table 50, one die 51 on the wafer mounting XY table 50 is vacuum-suctioned and positioned at the die positioning claws 43A, 43B. A die transfer lever 56 that can move up and down and swing is disposed on the die mounting table 42B.

On both sides 1 of the wafer mounting XY table 50, a
- A wafer substrate cassette 60 on the loader side and a wafer substrate cassette 61 on the unloader side are provided. The O-der side wafer substrate cassette 60 is driven up and down once C.
A plurality of wafer substrates 53 to which wafers 52 are fixed are housed vertically at equal intervals. In addition, the wafer substrate cassette 60 on the loader side is the XY table 5 for placing wafers.
The 0 side is open, and the wafer mounting XY table 5 is inserted through this open part from inside the a-da side wafer cassette 60.
A conveyor 62 extending from the zero side is provided. The unloader side wafer substrate cassette 61 is a U-shaped box with only the upper and right sides open, and the wafer substrate cassette 61 is a U-shaped box with only the upper and right sides open.
3 is directly stacked on top of each other.

Above the conveyor 62 and above the unloader side wafer substrate cassette 61, a wafer suction plate 63A,
63B are respectively disposed, and these wafer suction plates 63A and 63B are respectively 7-464A and 64Bi.
This is fixed. Arms 64A and 64B are conveyor 6
It is fixed to sliding bodies 6f5A and 66B that are slidably and rotatably attached to a guide rod 65 that extends from the side of the unloader side T-board cassette 61 from the side of the unloader side. is on the conveyor 62 and the XY for wafer placement.
The other sliding body 66B is driven by a drive device (not shown) to reciprocate between the wafer mounting XY table 50 and the unloader side wafer substrate cassette 61. There is.

As shown in FIG. 7, a plurality of suction cups 70 for vacuum suctioning the wafer substrate 53 are attached to the wafer suction plates 63A and 63B. The suction cup 70 has an arm 64A,
The vacuum hole 7h formed in 64B is connected via a vibrator 72, and the Makabe hole 71 is connected via a vacuum device 1 (not shown) via a vibrator.

Further, above the push-up needle 55, that is, above the die pickup position 80, a die defect detection camera 81 for detecting chips, defective marks, etc. on the die 51 is disposed. A die position pattern detection camera 83 for detecting the 1σ position pattern of the die 51 is disposed above the die positioning position 82 , above the carrier tape 16 and above the bonding tool 10 . That is, above the bonding position 84, a lead position pattern detection camera 85 for detecting the lead position (four patterns) of the carrier tape 16 is disposed, and these cameras 81, 83
．． 85 is fixed to a camera holder 86 which is fixed to a pedestal 141.

As shown in FIGS. 1 and 4, a positioning pawl lever 90 is provided between the bonding position 84 and the guide roller 26 and has a positioning pawl 90a at one end thereof that engages with a sprocket hole of the carrier tape 16. It is being The positioning claw lever 90 is rotatably supported by an eccentric shaft 91 near the upper part of the positioning claw 90a, and the other end is pulled around the outer periphery of a fulcrum shaft 92 fixed to the tape position adjustment plate 29. It is urged by a coil spring 93 and is always in slidable contact. Further, the eccentric shaft 91 is configured to reciprocate approximately 90 degrees by a driving means (not shown).

A clamper 100 having spring properties is disposed at a bonding position 84 below the guide plate 24, and this clamper 100 is attached to a clamp arm 101. The clamp arm 101 is rotatably supported on a shaft 102 on which the guide roller 25 is rotatably supported.

The clamper 100 and the clamp arm 101 are each provided with a window at a portion corresponding to the bonding portion of the lead portion of the carrier tape 16.

Further, the shaft 1 on which the guide roller 26 is rotatably supported
A spring guide 104 is fixed to 03, and the spring 10 disposed on this spring guide 104
5, the clamp arm 101 is connected to the clamper 100.
The guide plate 241 is urged to come into pressure contact with the guide plate 241. Further, a clamp release lever 106 is fixed to the eccentric shaft 91, which presses the clamp arm 101 downward once when the positioning pawl 90a of the positioning lever 90 is located away from the sprocket hole of the carrier tape 16.

(Action) Next, the first action will be explained. When the loader-side wafer substrate cassette 60 is lowered one pitch by a vertical drive mechanism (not shown), the lowest wafer substrate 53 is transferred to the conveyor 62.
placed on top. Next, the conveyor '7'60 is operated by a drive mechanism (not shown), and the wafer substrate 53 is moved to the
It is transferred to the Y table 50 side. Next, the arm 64A is rotated downward, and the suction cup 70 fixed to the wafer suction plate 63A comes into contact with the wafer 52. In this state, a vacuum device (not shown) operates, and the vacuum hole 71 of the arm 64A
becomes a vacuum, and the 'C suction cup 70 suctions the wafer 52 via the vibrator 72. Thereafter, the arm 64A rotates upward, and the wafer 52 is moved along with the wafer substrate 53 from the conveyor 62. Next, the sliding body 66A moves in the direction of the wafer mounting XY table 50, and the wafer substrate 53 is transferred above the wafer mounting XY table 50. Subsequently, the arm 64A is rotated downward, and the wafer substrate 53 is placed on the wafer mounting XY table 5.
Position it above 0. At the same time, the vacuum of the wafer suction plate 63A is cut off, and the arm 64A rotates upward, leaving one wafer substrate 53 on the wafer mounting XY table 50.
Continuing (first, it is moved to one side of the conveyor 62).

When the wafer substrate 53 is placed on the wafer placement XY table 50 as described above, the wafer substrate 53 is positioned and fixed on the wafer placement XY table 50 by a positioning mechanism (not shown).

Next, the wafer mounting XY table 50 is driven in the XY direction by a drive mechanism (not shown), and after correcting the axis tilt of the die 51 and the XY table 50 by a θ motor, the die 51 is pink-amplified and a die defect is detected. True F of camera 81
The die pin amplifier position 801 is moved. Then, the die defect detection camera 81 detects the C die 5.
1 good and bad are detected. If the die 51 is defective,
The next die 51 is moved to the die pick-up position 80 and similarly detected. When the die 51 is a good product, the plunger 54 rises, and the vacuum of the plunger 54 acts to vacuum-adsorb the wafer 52. At the same time, the die transfer lever 56 is rotated by a drive mechanism (not shown) directly above the die pickup position 80, and then lowered 'C'. This 1 Koyotsu die transfer lever 56
A vacuum suction collet 57 fixed to the tip of the C die 51 comes into contact with the detected non-defective die 51, and the vacuum of the vacuum suction collet 57 works to suction the C die 51. At the same time as the next die transfer lever 56 rises, the push-up needle 55 rises and pushes the die 51 up. As a result, the die 51 is attracted by the vacuum suction current 571 and pinked up.

After that, the die transfer lever 56 is moved to the die positioning position 8.
2, and is then moved down one turn.

As a result, the vacuum-adsorbed cholera 1-57+ die 51 comes into contact with the four parts on the die mounting table 42B, and the vacuum of the vacuum-adsorbed collet 57 is cut off. Next, the die transfer lever 56 moves up leaving the die 51 on the die mounting table 42B, and then rotates and returns to the original starting position. Further, when the die 51 is transferred as described above and the die 51 is picked up from the wafer placement XY table 50 by the vacuum suction collet 57 of the bar 56, the wafer placement XY table 50 is
The die 51 that is driven in the Y direction and then picked up is detected by the die defect detection camera 81.

When the die 51 is placed on the die mounting table 42B as described above, the die positioning claws 43A and 43B are moved in the closing direction by a drive mechanism (not shown), and the positions of the die 51 in the X direction and the θ direction are adjusted. be done.

After that, the die positioning claw 43A143B is moved in the opening direction. When the position of the die 51 in the X direction is adjusted,
A positional shift in the Y direction of the pattern of the die 51 is detected by the die position pattern detection camera 83 and stored in a storage device (not shown). After that, the rotary table 40
is rotated 180 degrees, and at the same time as the rotation, the positional deviation is corrected by the XY table 41, and the die mounting table 42B on which the die 51 is mounted is located at the bonding position 82.

On the other hand, every time the sprocket wheel 28 is intermittently driven by a drive mechanism (not shown), the carrier tape 16 wound around the reel 15 moves through the carrier tape guides 20, 21,
The lead of the carrier tape 16 is sent through the sprocket wheel 27 and the carrier tape guide roller 25 to the bonding position 84 . Also, the carrier tape 1 is slack between the sprocket wheel 28 and the reel 18.
6 is detected by a detection means (not shown), whereby the reel 18 is driven by the sliding mechanism bottle (not shown), and the carrier tape 16 is wound onto the reel 18I.

At the same time, the spacer tape 17 wound around Lee A/151 moves the spacer tape guide roller 31, 32 to g'C.
The reel 18 and the carrier tape 16 are stacked together and wound up. In this state, the bonding tool 10 is located at a position immediately above the bonding position 84 and retracted backward.

When the carrier tape 16 is fed in this way and the leads of the carrier tape 16 are roughly positioned at the bonding position, the eccentric shaft 91 is then rotated approximately 90 degrees, and the positioning claw lever 90 is in the state shown in FIG. The carrier tape 1 is moved from the position shown in Fig. 4 and is roughly positioned.
6 sprocket hole, and carrier tape 16
Transfer another small amount of carrier tape 16, stop
position accurately.

Furthermore, when the eccentric shaft 91 rotates approximately 90 degrees as described above, the clamp release lever 106 also rotates from the state shown in FIG. 5 to the state shown in FIG. , the clamp 100 presses the carrier tape 16 against the guide plate 24.

In this state, the tape position adjustment plate 29 is driven in the X and Y directions to move the lead detection position of the carrier tape 16 below the die position pattern detection camera 83, thereby detecting the lead detection position of the carrier tape 16. . and,
As described above, the positional deviation of the lead pattern of the carrier tape 16 with respect to the pattern of the die 51 detected by the die position pattern detection camera 83 is calculated by an arithmetic device (not shown). Then, t1, the tape position adjustment plate 29 is driven again in the XY direction by the XY table 30, and the calculated and corrected position of the carrier tape 1 is
The operation of positioning the lead No. 6 is performed. When the XY table 30 is driven in the XY directions, the sprocket wheels 27 and 28 are moved via the tape fill plate 29. Since the claws of the sprocket wheels 27 and 28 are aligned with the four sprocket holes of the carrier tape 16,
When the sprocket wheels 27, 28 are moved as described above, the portion of the carrier tape 6 between the sprocket wheels 27, 28 is also moved. As a result, the carrier tape 16 at the bonding position 84
The pattern of the leads is aligned with the pattern of the die 51 (C).

Next, the rotary table 100 rises and the die 51 is removed.

It is pressed against the lead of the carrier tape 16. At the same time, the bonding tool 11 is driven to move the bonding tool 10 directly above the bonding position 84, and then descends to bond the die 51 to the leads of the carrier tape 16. After that, the bonding two/I/10 moves up and back, and the rotary table 40
F descends.

When the bonding is completed, the eccentric shaft 91 rotates about 90 degrees in the opposite direction, and the positioning pawl 92a moves from the state shown in FIG. 4 to the state shown in FIG. At the same time, the clamp release lever 106 pushes down the clamp arm 101, and the clamper 100 separates from the carrier tape 16.
One cycle of die bonding is completed. Thereafter, the above operation is repeated to sequentially bond the die 51 to the leads of the carrier tape 16.

In this way, C die bonding is performed for I1M,
When the good die 51 of the wafer 53 positioned and placed on the wafer placement XY table 50 runs out, the sliding body 6
6B is for wafer mounting, l (Y) is moved in the direction of the table 50, and the wafer suction plate 63B is located above the die pickup position 80. Then, the arm 64B
is rotated downward, and the suction cup 70 fixed to the wafer suction plate 63B comes into contact with the sea urchin crucian substrate 53. In this state, a vacuum device (not shown) operates, and the vacuum hole 71 of the arm 64B becomes vacuum, and the "C suction cup 70"
attracts the wafer substrate 53. Thereafter, the arm 64B moves upward one turn and picks up the wafer substrate 53 onto the wafer mounting XY table 50. Next, the sliding body 66B moves toward the unloader side wafer substrate cassette 61, and the wafer substrate 53 is transported above the unloader side wafer substrate cassette 61. The vacuum of the C1 wafer suction plate 63B is cut off, and the wafer substrate 53 is stored in the wafer substrate cassette 61 on the unloader side. In this way, when the wafer mounting XY table 50 and the wafer substrate 53 are removed, the above-described operation is performed.
C: The wafer substrate 53 with the wafer 52 in the wafer substrate cassette 60 on the loader side is again transferred onto the XY table 50 for wafer placement, positioned and placed thereon, and the above-described bonding cycle is sequentially repeated.

In this way, the rotary table 40 is provided with a size that includes the tie positioning position 82 and the bonding position 84, and after positioning the die 51 at the die positioning position 82 on the rotary table 40, the positioning is performed by rotating the rotary table 40. Since the die 51 placed in the bonding position 841 is determined by the rotation accuracy of the rotary table 40, the die 51 is placed in the bonding position 84 without any positional deviation, and the die 51 is placed in the bonding position 84 with high accuracy. bonding is performed.

In addition, since the positioning device is moved in the XY directions with the C carrier tape 16 pressed against the guide plate 24 by the clamper 100, the carrier tape 16 will not be misaligned due to vibrations caused by the movement of the device, and the carrier tape 16 will not be misaligned. Finish bonding the 16 positioned lead parts.
This improves bonding position accuracy. Also, at the time of bonding, the area around the bonding part of the lead of the carrier tape 16 is clamped with the clamper 100.
Since the lead is pressed, the shape of the lead becomes uniform, there is no edge short between the lead and the pellet, and the yield is increased.

In the above embodiment, the wafer 52 is supplied to the wafer mounting XY table 50, but it is also possible to supply a tray containing separated dies. In addition, two die mounting tables 42A and 42B were provided on the rotary table 40,
Three or more die mounting tables may be provided and rotated at a rotation angle of 10 depending on the number of die mounting tables. Further, the rotary table 40 does not need to be formed into a circular shape, and the die mounting table 42A
, 42B may be connected. Further, it is also possible to directly place one die on the rotary table 40 without providing the die mounting tables 42A and 42B.

Further, in the above embodiment, C is the clamp release lever 106.
Although the eccentric shaft 911 is fixed to the clamp release lever 106, it is also possible to separately fix the clamp release lever 106 with #1]. Further, the positioning of the carrier tape 16 was performed by a positioning pawl 90a formed on a positioning pawl lever 90 rotatably supported on an eccentric shaft 91.
As shown in the publication, a pawl member having an inclined portion at the tip is slidable up and down on a guide block and is biased downward by a spring, so that the pawl member is secured to the sprocket toll of the tape and performs C positioning. Nishi C is also good.

(Effects of the Invention) As is clear from the above description, according to the present invention, a die is positioned on a rotary table, and the positioned die is positioned at a bonding position by rotating the rotary table, so that high accuracy is achieved. bonding is performed.

In addition, in the die positioning position, the C1 die is positioned in the X direction and the θ direction, and the deviation in the Y direction is recognized and corrected. It is less necessary to replace the die positioning claws, and the usability of the dies and work efficiency are significantly improved.

Furthermore, since the tape is pressed against the guide member by a clamper and the clamp release member releases the pressure of the clamper once when the tape is fed, bonding accuracy and yield are improved.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing one embodiment of the present invention, and Fig. 2 is a perspective view showing one embodiment of the invention.
3 is a side view of the portion shown by arrow 3-3 in FIG. 2, FIGS. 4 and 5 show the vicinity of the bonding tool in FIG. 1, and FIG. Front view, 5th
The figure is an iE view of the clamper in the lowered state, and Figure 6 is 6 in Figure 4.
Main parts of line -6 (!j Ding City Figure 1 and Figure 7 are side views of the wafer adsorption plate part. 10...Bodding tool, 16...Carrier tape, 24...Ide plate, 40...Rotary table, 51...〃°a, 56...Die transfer lever, 8
2...Die positioning position, 84...Bonding position, 100...Clamper, 101...
・Clamp arm, 106...Clamp release lever. Figure 3 41 Figure 4 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] The dies are sent one by one to the guide positioning position for positioning, and the positioned dies are sent to the bonding position, while the leads of the carrier tape are sent to the lower surface of the guide member provided at the bonding position. The inner lead bonder uses a bonding tool to press and bond the leads of the carrier tape against the die.
a drive mechanism that drives in the Y and Z axis directions, and a die position correction mechanism that has a pawl that is provided in the goo positioning position section above the rotary table and that corrects the inclination in the θ direction of the die sent to the die positioning position; An inner lead bonder comprising: a clamper that suppresses the carrier tape against the guide member; and a clamp release member that releases the suppression of the clamper when feeding the carrier tape.