JP2785484B2 - Inner lead bonding apparatus and inner lead bonding method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an inner lead bonding apparatus and an inner lead bonding method, and relates to an operation for forming a bump on a chip and an inner for bonding the bump to a lead of a film carrier. The lead bonding operation can be performed by the same device.

(Prior art) The manufacturing process of an electronic component known as the TAB method is a process of forming a bump on a chip, an inner lead bonding process of bonding the bump to a lead of a film carrier, and punching out the film carrier. And an outer lead bonding step of bonding the leads to the substrate. The bumps are formed by plating means, stud bump means using a capillary tool, or the like.

Conventionally, the formation of the bump on the chip and the inner lead bonding are separately and independently performed by separate devices, and the bump is formed after forming the bump on the chip in advance by plating means or stud bump means. The chips are stored in a tray or the like, and the tray is set in an inner lead bonding apparatus to perform inner lead bonding.

(Problems to be Solved by the Invention) However, the above-mentioned conventional means requires two devices, a bump forming device and an inner lead bonding device, so that the production line becomes large and the equipment cost increases. Since it is necessary to manage two devices, there is a problem in that maintenance and management are troublesome.

Therefore, an object of the present invention is to provide a means that can perform bump formation and inner lead bonding with one apparatus.

(Means for Solving the Problems) The present invention relates to a supply reel on which a film carrier is wound, a take-up reel for winding the film carrier, a pitch feeding means for feeding the film carrier at a pitch, and an XY table. A horn that is driven and moves in the XY direction above the film carrier, a capillary tool and a pressing tool that are exchangeably held by the horn, and a wire supply unit that supplies a wire to the capillary tool,
An inner lead bonding apparatus is composed of a pickup head mounted on a chip supply unit for transferring chips to a chip stage and a moving table for moving the chip stage in a horizontal direction.

(Operation) In the above configuration, in forming the bump on the chip, the film carrier is removed and the horn holds the capillary tool. Then, the chip in the chip supply unit is mounted on the chip stage by the pickup head, and the chip stage is moved directly below the capillary tool. Then, while the wire is led out, the capillary tool is moved in a horizontal direction relative to the chip. ,
A bump is formed on the surface of the chip. The chip on which the bumps are formed in this way is returned to the chip supply unit by the pickup head.

After bumps are formed on the chip as described above,
Subsequently, inner lead bonding is performed. In performing inner lead bonding, the capillary tool is detached from the horn, and the pressing tool is held by the horn. In addition, the film carrier is set, and the film carrier is pitch-fed.

In addition, the chip of the chip supply unit is mounted on the chip stage by the pickup head, and the moving table is driven.
The chip is moved directly below the film carrier, and the bumps of the chip are joined to the leads of the film carrier. Then, while moving the pressing tool in the horizontal direction relative to the chip, the leads are pressed against the bumps by the pressing tool to perform inner lead bonding.
Such inner lead bonding is performed one after another while feeding the film carrier at a pitch, and the film carrier on which the inner lead bonding has been completed is taken up on a take-up reel.

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is an overall perspective view of the inner lead bonding apparatus. Reference numeral 1 denotes a main body box, on which components described below are arranged. Reference numerals 2 and 3 denote a supply reel and a take-up reel disposed on both sides of the main body box 1, respectively. A film carrier 4 and an interlayer paper 5 are wound around the supply reel 2. Guide rollers 6, 7 and sprockets 8, 9 as pitch feed means are provided between the two reels 2, 3, and the film carrier 4 derived from the supply reel 2 circulates around the rollers 6, Further, it is pitch-fed by the sprockets 8 and 9 and wound up on the take-up reel 3. The interlayer paper 5 circulates around the rollers 7 and travels below the film carrier 4, and is then wound up on the take-up reel 3 together with the film carrier 4. M1 is a drive motor for driving the take-up reel 3.

In FIGS. 1 and 3, reference numeral 11 denotes an XY table as a moving table provided on the main body box 1;
It comprises a table 12, a Y table 13, an X motor MX1, and a Y motor (not shown). Base plate on Y table 13
A tray 15 is mounted on the base plate 14 as a chip supply unit. This tray 15 contains
Chips have been transferred. On the side of the Y table 13, a chip stage 16 on which chips are transferred is provided. Mθ is a motor for rotating the cam 46. Cam46
Is rotated, the lever 47 supporting the chip stage 16 is rotated, and the chip stage 16 is rotated by θ (horizontal rotation).
Reference numeral 45 denotes a cylinder as a lifting / lowering means for lifting / lowering the chip stage 16.

Reference numeral 20 denotes a pickup head, and a bracket 21
A camera 22 and a pickup nozzle 23 are mounted. At the rear of the bracket 21, a block 24 is mounted. The block 24 is mounted on a vertical guide shaft 25 so as to be able to move up and down. When the motor MZ1 is driven, the pickup head 20 moves up and down along the guide shaft 25. That is, the block 24, the guide shaft 25, and the motor MZ1 constitute a Z table 26 that moves the pickup nozzle 23 up and down.

The XY table 11 is driven to move a predetermined chip stored in the tray 15 horizontally just below the camera 22 and observe the chip with the camera 22 to detect the presence or absence of the chip. Also, the XY table 11 is driven, and this chip is picked up by the pickup nozzle 23.
And drives the motor MZ1 to move up and down the pickup nozzle 23 to pick up the chip P (see FIG. 3). Next, the XY table 11 is driven to move the chip stage 16 directly below the chip adsorbed by the pickup nozzle 23, and the motor MZ1 is driven to move the pickup nozzle 23 up and down, thereby mounting the chip on the chip stage 16. (See FIG. 4).

Next, the XY table 11 is driven to horizontally move the chip P on the chip stage 16 directly below the camera 22, and the positional shift of the chip P in the XYθ direction is detected. The displacement in the XY direction is corrected by adjusting the movement stroke of the XY table 11. The displacement in the θ direction is determined by the motor Mθ
Is driven and the chip stage 16 is rotated by θ to make a correction. By correcting the displacement of the chip P in the XYθ direction in this manner, the bumps of the chip can be accurately aligned with the leads of the film carrier 4 and joined.

In FIGS. 1 and 3, reference numeral 31 denotes a second XY table, which is an X table 32, a Y table 33, an X motor MX2,
It consists of Y motor MY2. A head section 34 is provided on the Y table 33. 38 is a main body case. The head section 34 is provided with a horn 35. The horn 35 extends above the film carrier 4 and has a capillary tool 51 (see FIG. 2) at its tip.
And the pressing tool 52 (see FIG. 3) are interchangeably mounted. MZ2 is a motor for moving the horn 35 up and down. Inside the main body case 38, means for causing the horn 35 to oscillate in the US is housed. Also, the head 36 has a wire 36
Is wound around the spool 37. This wire
36 is supplied to the capillary tool 51. Reference numeral 39 denotes a camera for observing the leads of the film carrier 4 and the chip P.

3, 6, and 7, reference numeral 40 denotes a suction stage. An opening 41 is opened at the center of the suction stage 40. Around the opening 41, a suction hole 42 is provided.
Is opened. 43 is a suction tube. With the pitch feed of the film carrier 4 stopped, the upper surface of the film carrier 4 is sucked and fixed by the suction holes 42. Further, in this state, the chip stage 16 on which the chip P is mounted moves directly below the opening 41, and the bump B (see FIG. 2) formed on the upper surface of the chip P is pressed against the lead of the film carrier 4. I do. In the present embodiment, the suction stage 40
Is provided above the film carrier 4, but may be provided below the film carrier 4 to fix the lower surface of the film carrier 4 by suction.

The present apparatus has the above configuration, and the operation will be described next.

Prior to performing inner lead bonding, bumps B are formed on the chip P. In this case, the supply reel 2 and the take-up reel 3 are removed from the apparatus, the film carrier 4 is removed from the suction stage 40, and the horn 35 holds the capillary tool 51 as shown in FIG.

In this state, pick up the chips on tray 15
Transfer to the chip stage 16 by 23. Next, the chip P is moved to a position immediately below the camera 22, and the camera 22 detects a position shift of the chip P in the XYθ direction. Then XY
By driving the table 11, the tip P is inserted into the capillary tool 51.
To move directly below. At this time, the displacement of the chip P in the XYθ direction is corrected by the above-described means. Next, the bump B is formed on the chip P while the XY table 31 is driven to move the capillary tool 51 in the XY direction (the second step).
See figure).

When the formation of the bump B is completed, the XY table 11 is driven, the chip stage 16 moves to the pickup nozzle 23 side, and the chip P on the chip stage 16 is picked up by the pickup nozzle 23 and collected on the tray 15. You.
By repeating the above operation, the bumps B are formed on all the chips P provided on the tray 15.

Next, inner lead bonding is performed. In this case, the pressing tool 52 is held by the horn 35 instead of the capillary tool 51. Also, the supply reel 2 and the take-up reel 3 are set, and the film carrier 4 is attached to the suction stage 40.
Located below.

Now, as shown in FIG. 3, the XY table 11 is driven so that a desired chip P in the tray 15 is picked up by the pickup nozzle.
The chip P is moved to a position immediately below 23 to pick up the chip P. In this case, before the chip P is sucked by the pickup nozzle 23 and picked up, the chip P is
The chip P is moved to a position immediately below 22 and the presence or absence of the chip P and whether or not the chip P is a non-defective product are checked in advance.

Next, the XY table 11 is driven to move the chip stage 16 directly below the pickup nozzle 23, and the chip P adsorbed by the pickup nozzle 23 is transferred to the chip stage 16 (see FIG. 4). Next, the chip P mounted on the chip stage 16 is moved to a position immediately below the camera 22, and the chip P
XYθ direction is detected. The observation of the chip P may be performed by the other camera 39. Then
The XY table 11 is driven to move the chip stage 16 directly below the suction stage 40 as shown in FIG. At this time, the displacement of the chip P in the XYθ direction is corrected by the above-described means. Next, the cylinder 45 is driven to raise the chip stage 16 so that the bumps B of the chip P are joined to the leads of the film carrier 4. The bump B and the lead may be joined by lowering the film carrier 4 by lowering the sprockets 8 and 9 without raising the chip stage 16.

Next, the XY table 31 is driven to move the pressing tool 52 in the XY direction, and the lead of the film carrier 4 is pressed against the bump B by the pressing tool 52 to bond the lead to the bump B. When the inner lead bonding is completed in this manner, the film carrier 4 is pitch-fed by the sprockets 8 and 9, and
The next inner lead bonding is performed. By repeating such an operation, inner lead bonding is performed one after another.

(Effects of the Invention) According to the present invention, the operation of forming a bump on a chip and the operation of inner lead bonding for bonding a lead of a film carrier to the bump by exchanging a capillary tool and a pressing tool held by a horn are performed. Can be performed with the same device.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an inner lead bonding apparatus, FIG. 2 is a perspective view during bump formation, FIG. 3, FIG. 4 and FIG. FIG. 6 is a perspective view during lead bonding, FIG. 6 is a plan view of the suction stage, and FIG. 7 is a front view thereof. 2 Supply reel 3 Take-up reel 4 Film carrier 8, 9 Pitch feeding means 11 XY table 15 Chip supply unit 16 Chip stage 20 Pickup head 31 XY table 35 ... Horn 36 ... Wire 37 ... Wire supply means 51 ... Capillary tool 52 ... Pressing tool

Continuation of front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 21/60 311

Claims (2)

(57) [Claims] A feed reel on which a film carrier is wound; a take-up reel for winding the film carrier; pitch feed means for feeding the film carrier in pitch; A horn that moves in the XY direction, a capillary tool and a pressing tool that are exchangeably held by the horn, and a wire supply unit that supplies a wire to the capillary tool,
An inner lead bonding apparatus comprising: a pickup head mounted on a chip supply unit for transferring chips to a chip stage; and a moving table for moving the chip stage in a horizontal direction. 2. A step of picking up a chip provided in a chip supply unit by a nozzle of a pickup head and mounting the chip on a chip stage, and moving a capillary tool held by a horn horizontally relative to the chip. A step of forming a bump on an electrode of a chip by a wire inserted into the capillary tool, a step of picking up and recovering the chip on which the bump is formed by a nozzle of a pickup head, and a step of removing the capillary tool from the horn. Removing the horn to hold the pressing tool, arranging a film carrier below the pressing tool, picking up the collected chips with a nozzle of a pickup head, and mounting the chips on a chip stage; Insert the bumps of the chip on the stage A step of positioning the chip below the film carrier is aligned to the rear of the lead,
Pressing the leads of the film carrier against the bumps of the chip with the pressing tool and bonding while horizontally moving the pressing tool relative to the chip on the chip stage. Method.