JPH0151055B2 - - Google Patents

Description

[Detailed Description of the Invention] (Field of Application of the Invention) The present invention relates to carrier tape (hereinafter referred to as tape)
This invention relates to an inner lead bonder for bonding a die to leads provided in advance at equal intervals.

(Prior art) In a conventional inner lead bonder, a wafer consisting of a plurality of dies divided at equal intervals is positioned and placed on a table that is driven in the XYZ directions, and a tape that is intermittently transferred is placed above the table. A bonding tool placed above the tape directly presses the tape against the die for bonding.

(Problems with the Prior Art) However, in this method, the die and the lead are imaged overlappingly using the same optical axis, and recognition processing for alignment is performed. For this reason, depending on the degree of light reflection on the die surface, the plating and material of the leads, and the material of the tape itself that forms the leads,
There were problems in that it was very difficult to set the conditions for recognition, and when the sample (die or tape) was changed, the equipment had to be stopped for a long time to make adjustments.

In addition, the wafer is attached to a plate made of ceramic or glass with a low-melting adhesive and is divided into equal intervals, so the method of bonding by pressing the tape directly onto the wafer as described above is
During bonding, the heat from the bonding tool is applied to the dies surrounding the bonded die, melting the adhesive and easily shifting the position of the die, as well as melting the adhesive from the slicing line of the adjacent die and causing the adjoining die to become separated due to capillary action, etc. It may rise to the surface of the die and contaminate the die.

In addition, in order to prevent the inner leads of the bonding tape from touching the pads of the adjacent dies, the inner leads near the bonding tool must be curved away from the die, which may have a negative impact on the tape. affect

(Object of the Invention) An object of the present invention is to provide an inner lead bonder that can eliminate the drawbacks of the above techniques.

(Embodiments of the Invention) The present invention will be described below with reference to illustrated embodiments.
FIG. 1 is an overall perspective view showing an embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a view taken from the arrow 3 in FIG.
- It is a side explanatory view of 3 parts. On both sides of the bonding head 11 having the bonding tool 10, a tape loader section 12 and a tape unloader section 13 are respectively disposed on a pedestal 14. A reel 15 is rotatably supported on the tape loader section 12, and a tape 16 having leads provided at equal intervals and a spacer tape 17 for protecting the leads of this tape are superimposed on the reel 15. It is wrapped. A reel 18 for overlapping and winding the tape 16 and spacer tape 17 is rotatably supported on the tape unloader section 13, and this reel 18 is driven by a reel driving motor (not shown). Ru.

Further, in order to guide the tape 16 wound around the reel 15 below the bonding tool 10 and toward the reel 18, tape guide rollers 20, 21, 22, and 23 rotate in the tape loader section 12 and the tape unloader section 13, respectively. It is freely arranged. Furthermore, tape guide rollers 24 and 25 are provided on both sides of the bonding tool 10, and sprocket foils 26 and 27 that engage with sprocket holes formed on both sides of the tape 16 are further provided on both sides of the tape guide rollers 24 and 25. Tape guide rollers 2 are installed on both sides of the sprocket wheels 26 and 27.
8 and 29 are each rotatably attached to the tape position adjustment plate 30. The tape position adjustment plate 30 is fixed to an XY table 31 that is driven in the XY directions. Further, the one sprocket wheel 27 is rotationally driven in one direction by a stepping motor (not shown). In order to guide the spacer tape 17 wound around the reel 15 toward the reel 18, spacer tape guide rollers 32 and 33 are rotatably attached to the tape loader section 12 and the tape unloader section 13, respectively.

Below the bonding tool 10, a rotary table 40 that rotates and is driven up and down is arranged with its center of rotation deviated from the bonding tool 10, and the rotary table 40 is an XY table that is driven in the XY direction. It is installed on 41.
In addition, the rotary table 40 has a bonding tool 1.
Die mounting tables 42A and 42B are fixed directly below 0 and concentrically with the position directly below this. A pair of opposing die positioning claws 43A, 43B are provided above the die mounting base 42B.
These die positioning claws 43A, 43B are opened and closed by a drive mechanism (not shown).

A wafer mounting XY table 50 is provided in front of the die positioning claws 43A, 43B (on the opposite side from the bonding tool 10). A wafer 52 consisting of a plurality of dies 51
A wafer substrate 53 on which is fixed is positioned and fixed. Also, XY table 50 for wafer placement.
Inside is this XY table 5 for placing the wafer.
A plunger 54 for vacuum suctioning the back side of the wafer 52 of the wafer substrate 53 positioned at
A push-up needle 55 for pushing up one die 51 is disposed within the die 4 so as to be movable up and down. Between the die positioning claws 43A, 43B and the wafer mounting XY table 50, one die 51 on the wafer mounting XY table 50 is vacuum-adsorbed and positioned at the die positioning claws 43A, 43B. A die transfer lever 56 that can move up and down and swing is disposed on the die mounting table 42B.

Above the push-up needle 55, that is, above the die pick-up position 60, a die defect detection camera 61 for detecting chips, defective marks, etc. on the die 51 is disposed, and a pair of die positioning claws 43 are provided.
A die position pattern detection camera 63 for detecting the position pattern of the die 51 is disposed above the die positioning position 62, above the tape 16 and above the bonding tool 10, that is, above the die positioning position 62. A lead position pattern detection camera 65 for detecting the lead position pattern of the tape 16 is disposed above the position 64, and these cameras 61, 63, 65
is fixed to a camera holder 66 fixed to the frame 14.

Next, the effect will be explained. Wafer substrate 53
When the wafer substrate 53 is placed on the wafer placement XY table 50, the wafer substrate 53 is positioned and fixed on the wafer placement XY table 50 by a positioning mechanism (not shown). Next, the wafer mounting XY table 50 is driven in the XY direction by a drive mechanism (not shown), and after the inclination between the die 51 and the axis of the XY table 50 is corrected by a θ motor, the picked up die 51 is used for die defect detection. It is moved to a die pick-up position 60 directly below the camera 61. Then, the die defect detection camera 61 detects whether the die 51 is good or defective. If a die 51 is defective, the next die 51 is moved to the die pick-up position 60 and detected in the same manner. If the die 51 is a good product, the plunger 54 rises, and the vacuum of the plunger 54 acts to vacuum-adsorb the wafer 52. At the same time, the die transfer lever 56 is rotated by a drive mechanism (not shown) directly above the die pick-up position 60, and then lowered. As a result, the die transfer lever 56
A vacuum suction collet 57 fixed to the tip of the die 51 comes into contact with the detected good die 51, and the vacuum of the vacuum suction collet 57 works to suction the die 51. Next, at the same time as the die transfer lever 56 rises, the push-up needle 55 rises and pushes the die 51 up. As a result, the die 51 is attracted to the vacuum suction collet 57 and picked up. The die transfer lever 56 is then rotated above the die positioning position 62 and then lowered. As a result, the die 51 adsorbed by the vacuum suction collet 57 comes into contact with the die mounting table 42B, and the vacuum of the vacuum suction collet 57 is cut off. Next, the die transfer lever 56 moves the die 5
1 on the die mounting table 42B, and then rotates and returns to the original starting position. Further, as described above, the vacuum suction collet 57 of the die transfer lever 56
When the die 51 is picked up from the wafer mounting XY table 50 by the detected.

When the die 51 is placed on the die mounting table 42B as described above, the die positioning claws 43A and 43B are moved in the closing direction by a drive mechanism (not shown), and the positions of the die 51 in the X direction and the θ direction are corrected. be done. Thereafter, the die positioning claws 43A, 43B are moved in the opening direction. When the position of the die 51 in the X direction is corrected, a positional shift of the pattern of the die 51 in the XY direction is detected by the die position pattern detection camera 63 and stored in a storage device (not shown). Thereafter, the rotary table 40 is rotated 180 degrees, and at the same time as the rotation, the XY table 41 corrects the positional deviation, and the die mounting table 42B on which the die 51 is mounted is located at the bonding position 62.

On the other hand, each time the sprocket wheel 27 is intermittently driven by a drive mechanism (not shown), the tape 16 wound around the reel 15 is moved to the tape guide rollers 20, 2.
1, 28, a sprocket wheel 26, and a tape guide roller 24, and the lead of the tape 16 is sent to a bonding position 64. Further, the slack tape 16 between the sprocket wheel 27 and the reel 18 is detected by a detection means (not shown), and the reel 18 is thereby driven by a drive mechanism (not shown), and the tape 16 is wound onto the reel 18. At the same time, the spacer tape 17 wound around the reel 15 is moved by the spacer tape guide roller 32,
33, and is wound onto the reel 18 together with the tape 16. In this state, the bonding tool 10 is located at a position retracted rearward from directly above the bonding position 64.

In this way, tape 16 is fed, and tape 1
When the lead No. 6 is located at the bonding position, the tape position adjustment plate 30 is driven in the XY direction, and the detection position of the lead of the tape 16 is moved below the lead position pattern detection camera 65 to detect the lead of the tape 16. The position is detected. Then, the positional deviation of the lead pattern of the tape 16 with respect to the pattern of the die 51 detected by the die position pattern detection camera 63 as described above is calculated by an arithmetic device (not shown). Then, the tape position adjustment plate 30 is moved to the XY table 3 again.
1 in the XY directions to position the lead of the tape 16 at the calculated and corrected position. When the XY table 31 is driven in the XY directions, the sprocket wheels 26 and 27 are moved via the tape position adjustment plate 30. Since the claws of the sprocket wheels 26 and 27 engage with the sprocket holes of the tape 16, when the sprocket wheels 26 and 27 are moved as described above, the tape 16 between the sprocket wheels 26 and 27 is moved. Parts can also be moved. As a result, the lead pattern of the tape 16 at the bonding position 64 is aligned with the pattern of the die 51.

Next, the rotary table 40 is raised and the die 51 is pressed against the leads of the tape 16. At the same time, the bonding head 11 is driven to move the bonding tool 10 directly above the bonding position 64, and then descend to bond the die 51 to the leads of the tape 16. Thereafter, the bonding tool 10 is raised and retreated, and the rotary table 40 is lowered. This completes one cycle of die bonding. Thereafter, the above operation is repeated to sequentially bond the die 51 to the leads of the tape 16.

In this way, the position pattern of the die 51 positioned at the die positioning position 62 is recognized by the die position pattern detection camera 63, and the position pattern of the die 51 positioned at the bonding position 64 is recognized by the die position pattern detection camera 63.
Since the lead position pattern is recognized by the lead position pattern detection camera 65, recognition conditions such as lighting, lens magnification, camera, amplifier circuit, etc. can be set separately to suit each, and the condition setting is very easy. Further, since it is not necessary to recognize the complicated pattern in which the leads of the die 51 and the tape 16 overlap, adjustments can be made in a short time when changing the sample.

Furthermore, since the dies 51 are sent one by one to the die positioning position 62 for positioning and then sent to the bonding position 64, high-precision bonding can be performed without adversely affecting other dies or leads near the bonding position. .

(Effects of the Invention) As is clear from the above description, according to the present invention, the die and the tape lead are recognized separately by separate cameras, so the recognition conditions are determined separately to suit each. It is very easy to set conditions, and adjustments can be made in a short time when changing types. Furthermore, since the dies are sent one by one to the bonding position, highly accurate bonding can be performed without adversely affecting other dies and leads.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a plan view of Fig. 1, and Fig. 3 is the view from arrow 3- in Fig. 2.
It is a side explanatory view of three parts. 10...Bonding tool, 16...Carrier tape, 40...Rotary table, 51...Die, 56...Die transfer lever, 60...Die pick-up position, 61...Die defect detection camera, 62... Die positioning position, 63...
...Camera for detecting die position pattern, 64...Bonding position, 65...Camera for detecting lead position pattern.

Claims (1)

[Claims] 1 Pick up the dies one by one from the die pick-up position and send them to the die positioning position for positioning, and send the positioned dies to the bonding position, while sending the carrier tape lead to the bonding position and positioning them. In an inner lead bonder that is positioned above the die and presses and bonds the lead of the carrier tape to the die using a bonding tool, die defect detection detects die chips, defective marks, etc. above the die pick-up position. A die position pattern detection camera is disposed above the die positioning position to detect a die position pattern, and a die position pattern detection camera is disposed above the bonding position to detect a lead position pattern of the carrier tape. An inner lead bonder that is equipped with a position pattern detection camera and that recognizes the die and lead separately using separate recognition systems.