JPS5753950A - Pellet bonding device - Google Patents

Pellet bonding device

Info

Publication number
JPS5753950A
JPS5753950A JP12991280A JP12991280A JPS5753950A JP S5753950 A JPS5753950 A JP S5753950A JP 12991280 A JP12991280 A JP 12991280A JP 12991280 A JP12991280 A JP 12991280A JP S5753950 A JPS5753950 A JP S5753950A
Authority
JP
Japan
Prior art keywords
pellet
deltay
deltax
cavity
calculated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12991280A
Other languages
Japanese (ja)
Inventor
Haruo Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12991280A priority Critical patent/JPS5753950A/en
Publication of JPS5753950A publication Critical patent/JPS5753950A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Abstract

PURPOSE:To enable precise positioning of a pellet without damage by a method wherein the position of the pellet transported to a transit position and the position of cavity in a pakage are detected optically, and the discrepancy of position is adjusted by driving and controlling stages. CONSTITUTION:The pellet 13 on a tray 12 is transported by a vacuum chuck 65, and is put on the rotary table 14 at the transit position. The position of the pellet is photographed in a TV camera TC1, the discrephancies DELTAX, DELTAY, DELTAQ from the reference position are calculated, and after the table 14 is rotated according to a signal sent from a control part 63 to make DELTAQ to zero, the discrepancies DELTAX', DELTAY' after adjustment are photographed and are calculated. The XY table 17 is driven according to this data, an arm 16 consisted of a link mechanism is positioned precisely on the pellet, and the pellet 13 is sucked to a collet 18. At this time, the position of the cavity 21 is detected by a camera TC2 at the same time, the discrepancies DELTAx'', DELTAy'' thereof are calculated, and transferring quantity of the table 17 is adjusted to position the collet 18 precisely to the cavity 21. Accordingly positioning of bonding can be performed with no touch.
JP12991280A 1980-09-17 1980-09-17 Pellet bonding device Pending JPS5753950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12991280A JPS5753950A (en) 1980-09-17 1980-09-17 Pellet bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12991280A JPS5753950A (en) 1980-09-17 1980-09-17 Pellet bonding device

Publications (1)

Publication Number Publication Date
JPS5753950A true JPS5753950A (en) 1982-03-31

Family

ID=15021461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12991280A Pending JPS5753950A (en) 1980-09-17 1980-09-17 Pellet bonding device

Country Status (1)

Country Link
JP (1) JPS5753950A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216428A (en) * 1982-06-11 1983-12-16 Toshiba Corp Semiconductor chip supply apparatus
JPS5968936A (en) * 1982-10-14 1984-04-19 Toshiba Seiki Kk Pellet bonding method
JPS5972735A (en) * 1982-10-20 1984-04-24 Toshiba Corp Pellet mount device
JPS59229828A (en) * 1983-06-11 1984-12-24 New Japan Radio Co Ltd Method for bonding semiconductor chip
JPS6080231A (en) * 1983-10-07 1985-05-08 Tokyo Sokuhan Kk Lead frame automatic feeding positioning mechanism in semiconductor element bonding apparatus
JPS60121733A (en) * 1984-07-31 1985-06-29 Shinkawa Ltd Inner lead bonder
JPS615531A (en) * 1984-06-20 1986-01-11 Akita Denshi Kk Semiconductor assembling device
JPS6130240U (en) * 1984-07-26 1986-02-24 富士通株式会社 die bonder
JPS6158245A (en) * 1984-08-29 1986-03-25 Toshiba Corp Ic chip positioning device
JPS6373930U (en) * 1986-10-30 1988-05-17
JPH01149429A (en) * 1987-12-04 1989-06-12 Nec Corp Mounting of semiconductor pellet
JPH02146832U (en) * 1990-05-10 1990-12-13
WO2007033701A1 (en) * 2005-09-16 2007-03-29 Alphasem Ag Method and device for depositing electronic components on a substrate

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216428A (en) * 1982-06-11 1983-12-16 Toshiba Corp Semiconductor chip supply apparatus
JPS5968936A (en) * 1982-10-14 1984-04-19 Toshiba Seiki Kk Pellet bonding method
JPS5972735A (en) * 1982-10-20 1984-04-24 Toshiba Corp Pellet mount device
JPS59229828A (en) * 1983-06-11 1984-12-24 New Japan Radio Co Ltd Method for bonding semiconductor chip
JPH04383B2 (en) * 1983-06-11 1992-01-07 Japan Radio Co Ltd
JPS6080231A (en) * 1983-10-07 1985-05-08 Tokyo Sokuhan Kk Lead frame automatic feeding positioning mechanism in semiconductor element bonding apparatus
JPH045266B2 (en) * 1983-10-07 1992-01-30
JPS615531A (en) * 1984-06-20 1986-01-11 Akita Denshi Kk Semiconductor assembling device
JPH0584054B2 (en) * 1984-06-20 1993-11-30 Akita Denshi Kk
JPS6130240U (en) * 1984-07-26 1986-02-24 富士通株式会社 die bonder
JPH0525235Y2 (en) * 1984-07-26 1993-06-25
JPH0151055B2 (en) * 1984-07-31 1989-11-01 Shinkawa Kk
JPS60121733A (en) * 1984-07-31 1985-06-29 Shinkawa Ltd Inner lead bonder
JPS6158245A (en) * 1984-08-29 1986-03-25 Toshiba Corp Ic chip positioning device
JPS6373930U (en) * 1986-10-30 1988-05-17
JPH01149429A (en) * 1987-12-04 1989-06-12 Nec Corp Mounting of semiconductor pellet
JPH02146832U (en) * 1990-05-10 1990-12-13
WO2007033701A1 (en) * 2005-09-16 2007-03-29 Alphasem Ag Method and device for depositing electronic components on a substrate

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