JPS6464334A - Apparatus for mounting semiconductor wafer - Google Patents

Apparatus for mounting semiconductor wafer

Info

Publication number
JPS6464334A
JPS6464334A JP62221689A JP22168987A JPS6464334A JP S6464334 A JPS6464334 A JP S6464334A JP 62221689 A JP62221689 A JP 62221689A JP 22168987 A JP22168987 A JP 22168987A JP S6464334 A JPS6464334 A JP S6464334A
Authority
JP
Japan
Prior art keywords
frame
wafer
chucker
bonding
aligning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62221689A
Other languages
Japanese (ja)
Other versions
JP2560042B2 (en
Inventor
Matsuro Kanehara
Akira Ishihara
Toshiyuki Sekido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP62221689A priority Critical patent/JP2560042B2/en
Publication of JPS6464334A publication Critical patent/JPS6464334A/en
Application granted granted Critical
Publication of JP2560042B2 publication Critical patent/JP2560042B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To mount a semiconductor wafer in an accurately aligned state without displacement by previously bonding the wafer to an adhesive tape, correcting the position of a frame chucker to accurately align a mounting frame on the wafer, and then bonding the frame to the tape. CONSTITUTION:A frame aligning mechanism 1 for aligning a mounting frame F, a wafer aligning mechanism 2 for aligning an orientation flat part OF, a wafer bonding mechanism 3 for bonding a semiconductor wafer A on an adhesive tape B, an image sensor 4 for sensing the element pattern of the wafer A, a frame chucker 5 for attracting to hold the frame F, and a frame chucker moving mechanism 6 for moving it to a bonding position P for positioning the wafer A are provided. Further, discriminating means 7 for discriminating a sample image mostly similar to a reference image, calculating means 8 for calculating the relative displacement of the sample image and the sensor 4, position correcting means 9 for controlling to drive the mechanism 6 to correct it by the displacement, and a frame chucker elevating mechanism 10 for moving down the chucker 5 for holding the frame F are provided.
JP62221689A 1987-09-04 1987-09-04 Semiconductor wafer mounting device Expired - Fee Related JP2560042B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62221689A JP2560042B2 (en) 1987-09-04 1987-09-04 Semiconductor wafer mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62221689A JP2560042B2 (en) 1987-09-04 1987-09-04 Semiconductor wafer mounting device

Publications (2)

Publication Number Publication Date
JPS6464334A true JPS6464334A (en) 1989-03-10
JP2560042B2 JP2560042B2 (en) 1996-12-04

Family

ID=16770737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62221689A Expired - Fee Related JP2560042B2 (en) 1987-09-04 1987-09-04 Semiconductor wafer mounting device

Country Status (1)

Country Link
JP (1) JP2560042B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02178948A (en) * 1988-12-29 1990-07-11 Disco Abrasive Syst Ltd Pre-alignment method of wafer loading frame
JPH0338051A (en) * 1989-06-29 1991-02-19 Applied Materials Inc Handling method and device for semiconductor wafer
KR100441128B1 (en) * 1996-11-28 2004-10-08 앰코 테크놀로지 코리아 주식회사 Wafer mounting method and apparatus for semiconductor package to cutting easily each of patterns of wafer
JP2012238856A (en) * 2011-05-12 2012-12-06 Semiconductor Technologies & Instruments Pte Ltd System and method using plural configuration frame handler constituted to process and move configuration frame
CN104396003A (en) * 2012-05-02 2015-03-04 盛美半导体设备（上海）有限公司 Apparatus and method for detecting position of wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02178948A (en) * 1988-12-29 1990-07-11 Disco Abrasive Syst Ltd Pre-alignment method of wafer loading frame
JPH0338051A (en) * 1989-06-29 1991-02-19 Applied Materials Inc Handling method and device for semiconductor wafer
KR100441128B1 (en) * 1996-11-28 2004-10-08 앰코 테크놀로지 코리아 주식회사 Wafer mounting method and apparatus for semiconductor package to cutting easily each of patterns of wafer
JP2012238856A (en) * 2011-05-12 2012-12-06 Semiconductor Technologies & Instruments Pte Ltd System and method using plural configuration frame handler constituted to process and move configuration frame
CN104396003A (en) * 2012-05-02 2015-03-04 盛美半导体设备（上海）有限公司 Apparatus and method for detecting position of wafer

Also Published As

Publication number Publication date
JP2560042B2 (en) 1996-12-04

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