JPH07335723A - Positioning device - Google Patents
Positioning deviceInfo
- Publication number
- JPH07335723A JPH07335723A JP6151566A JP15156694A JPH07335723A JP H07335723 A JPH07335723 A JP H07335723A JP 6151566 A JP6151566 A JP 6151566A JP 15156694 A JP15156694 A JP 15156694A JP H07335723 A JPH07335723 A JP H07335723A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- photosensitive substrate
- stage
- amount
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は位置決め装置に関し、例
えば液晶表示装置の製造に用いられる露光装置の位置決
め装置に適用し得る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning device, and can be applied to, for example, a positioning device for an exposure device used for manufacturing a liquid crystal display device.
【０００２】[0002]
【従来の技術】従来、露光装置には複数の感光基板が挿
入されている収納キヤリアから１枚の感光基板をスライ
ドアームで取り出し、露光ステージ上に搬送する搬送装
置がある。この搬送経路内には位置決め装置が設けられ
ており、感光基板が露光ステージ上の基準位置に大まか
に位置決めして載置されるように感光基板の位置を補正
するようになされている。2. Description of the Related Art Conventionally, as an exposure apparatus, there is a transfer apparatus which takes out one photosensitive substrate from a storage carrier in which a plurality of photosensitive substrates are inserted by a slide arm and transfers it onto an exposure stage. A positioning device is provided in the transport path to correct the position of the photosensitive substrate so that the photosensitive substrate is roughly positioned and placed at the reference position on the exposure stage.
【０００３】この補正の方法として、図６に示すように
移載機構１上で感光基板２の位置を補正する方法等があ
る。この補正方法は、感光基板２が基準位置と平行にな
るように、複数のピンで感光基板２を滑らせるものであ
る。ここで、ピン３Ａ〜３Ｃは固定ピンであり、ピン５
Ａ、５Ｂは可動ピンである。スライドアーム６上に感光
基板２を載置したままの状態で可動ピン５Ａを動かし、
次に可動ピン５Ｂを順に動かす。これにより感光基板２
の側壁はピン３Ｂ及び３Ｃとピン３Ａとの順に押し付け
られ、感光基板２のおおよその位置が位置決めされる。
このため搬送経路内で感光基板２を基準位置と平行にな
るように位置決めすることができる。As a method of this correction, there is a method of correcting the position of the photosensitive substrate 2 on the transfer mechanism 1 as shown in FIG. In this correction method, the photosensitive substrate 2 is slid with a plurality of pins so that the photosensitive substrate 2 is parallel to the reference position. Here, the pins 3A to 3C are fixed pins, and the pin 5
A and 5B are movable pins. Move the movable pin 5A with the photosensitive substrate 2 still mounted on the slide arm 6,
Next, the movable pin 5B is sequentially moved. As a result, the photosensitive substrate 2
The side wall of is pressed in order of the pins 3B and 3C and the pin 3A, and the approximate position of the photosensitive substrate 2 is positioned.
Therefore, the photosensitive substrate 2 can be positioned in the transport path so as to be parallel to the reference position.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上記の補正
の方法においては、感光基板２に直接外力を与え、かつ
スライドアーム６の表面に沿つて感光基板２を滑らすよ
うに移動させることにより感光基板２の位置を位置決め
している。このため感光基板２が破損したり、ダストが
発生するという問題があつた。また感光基板２の材質が
スライドアーム６の表面に対して滑り難い材質の場合、
このような方法では感光基板２の裏面と感光基板２を搭
載する部材６との間に発生する摩擦によつて、感光基板
２を可動ピン５Ａ及び５Ｂで確実に押し付けることがで
きないという問題がある。In the correction method described above, an external force is directly applied to the photosensitive substrate 2 and the photosensitive substrate 2 is slid along the surface of the slide arm 6 so as to slide. Position 2 is set. Therefore, there are problems that the photosensitive substrate 2 is damaged and dust is generated. When the material of the photosensitive substrate 2 is a material that is hard to slip on the surface of the slide arm 6,
In such a method, there is a problem that the photosensitive substrate 2 cannot be reliably pressed by the movable pins 5A and 5B due to the friction generated between the back surface of the photosensitive substrate 2 and the member 6 on which the photosensitive substrate 2 is mounted. .
【０００５】本発明は以上の点を考慮してなされたもの
で、基板と基板を搭載する部材との間に摩擦を生じさせ
ず、また、基板の端面に機械的な接触を行なわずに、非
接触で基板を位置決めすることができる位置決め装置を
提案しようとするものである。The present invention has been made in consideration of the above points, and does not cause friction between the substrate and a member for mounting the substrate, and does not make mechanical contact with the end face of the substrate. It is intended to propose a positioning device that can position a substrate in a non-contact manner.
【０００６】[0006]
【課題を解決するための手段】かかる課題を解決するた
め本発明においては、基板（２）を載置してステージ
（１１）まで搬送する搬送手段（１２）と、該搬送手段
（１２）上に載置された基板（２）のエツジの位置を搬
送中に非接触で検出するエツジ検出手段（１７Ａ、１７
Ｂ、１７Ｃ）と、エツジ検出手段（１７Ａ、１７Ｂ、１
７Ｃ）の検出結果に基づき、位置決めすべき基準位置に
対する基板（２）の位置のずれ量を求める演算手段（２
１）と、演算手段（２１）で求めたずれ量に基づき、搬
送手段（１２）を回転することにより、搬送手段（１
２）に載置されている基板（２）の位置の基準位置に対
する回転ずれを補正する第１の補正手段（２２Ａ）と、
演算手段（２１）で求めたずれ量に基づき、ステージ
（１１）の２次元方向の位置を補正し、基板（２）を基
準位置と平行になるように補正する第２の補正手段（２
２Ｂ）とを設けるようにする。In order to solve such a problem, in the present invention, a transfer means (12) for mounting a substrate (2) and transferring it to a stage (11), and on the transfer means (12). Edge detection means (17A, 17A) for non-contact detection of the position of the edge of the substrate (2) placed on the substrate during transportation.
B, 17C) and edge detection means (17A, 17B, 1)
Calculation means (2) for obtaining the amount of displacement of the position of the board (2) from the reference position to be positioned based on the detection result of (7C).
1) and the shift amount obtained by the calculation means (21), the transport means (12) is rotated to move the transport means (1
First correction means (22A) for correcting the rotation deviation of the position of the substrate (2) mounted on the second position with respect to the reference position;
Second correction means (2) for correcting the position of the stage (11) in the two-dimensional direction based on the shift amount obtained by the calculation means (21) so that the substrate (2) is parallel to the reference position.
2B) and are provided.
【０００７】[0007]
【作用】エツジ検出手段（１７Ａ、１７Ｂ、１７Ｃ）を
用いて基板（２）の位置を搬送中に非接触で検出し、位
置決めすべき基準位置に対する基板（２）の位置のずれ
量を求め、基板（２）のずれ量に基づき、第１の補正手
段（２２Ａ）によつて搬送手段（１２）を回転させ、第
２の補正手段（２２Ｂ）によつてステージ（１１）をＸ
−Ｙ方向に移動させることによつて基板（２）の位置を
補正するため、基板（２）の裏面と基板（２）を搭載す
る部材（６）との間に摩擦を生じることなく、また基板
（２）の端面に損傷を与えることなく、位置決めでき
る。The edge detecting means (17A, 17B, 17C) is used to detect the position of the substrate (2) in a non-contact manner during conveyance, and the amount of deviation of the position of the substrate (2) from the reference position to be positioned is calculated. Based on the displacement amount of the substrate (2), the transport means (12) is rotated by the first correction means (22A), and the stage (11) is moved by the second correction means (22B).
Since the position of the substrate (2) is corrected by moving in the −Y direction, no friction occurs between the back surface of the substrate (2) and the member (6) on which the substrate (2) is mounted, and Positioning can be performed without damaging the end surface of the substrate (2).
【０００８】[0008]
【実施例】以下図面について、本発明の一実施例を詳述
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.
【０００９】図１は本発明の位置決め装置１０であり、
感光基板２を載置するステージ１１、感光基板２をステ
ージ１１まで搬送する搬送部１２、搬送する際に感光基
板２の位置を補正するための制御部１３からなつてい
る。FIG. 1 shows a positioning device 10 of the present invention.
It comprises a stage 11 on which the photosensitive substrate 2 is placed, a transport unit 12 for transporting the photosensitive substrate 2 to the stage 11, and a control unit 13 for correcting the position of the photosensitive substrate 2 during transport.
【００１０】図２に搬送部１２の側面図を示す。この搬
送部１２は、スライドアーム６と、任意の回転角に応じ
て回転可能な回転部１４と、回転部１４の上面にスライ
ドアーム６を固定する支持部１５とからなつている。こ
のスライドアーム６は、感光基板２を載置し、保持し、
少なくともステージ１１の中心Ｐと搬送部１２における
理想基板位置１６ａの中心Ｑとの距離Ｌ（ストローク
Ｌ）の搬送が可能である。FIG. 2 shows a side view of the transport section 12. The transport unit 12 includes a slide arm 6, a rotating unit 14 that can rotate according to an arbitrary rotation angle, and a support unit 15 that fixes the slide arm 6 on the upper surface of the rotating unit 14. The slide arm 6 mounts and holds the photosensitive substrate 2,
It is possible to carry at least a distance L (stroke L) between the center P of the stage 11 and the center Q of the ideal substrate position 16a in the carrying unit 12.
【００１１】このスライドアーム６上に載置された感光
基板２と搬送部１２における理想基板位置１６ａとのず
れ量を検出するため、感光基板２の端の近傍に３つのエ
ツジセンサ１７Ａ、１７Ｂ及び１７Ｃを配置する。ここ
でエツジセンサ１７Ａ及び１７Ｂは、ステージ１１上に
おける感光基板２の基準位置とスライドアーム６上に載
置される感光基板２の位置との回転ずれ量と、回転ずれ
補正後のＹ軸方向のずれ量とを求めるために、基板の４
辺のうちスライドアーム６の進行方向（Ｘ軸方向）と平
行な一辺に任意量ＬX の間隔を有して配置する。またエ
ツジセンサ１７Ｃは、感光基板２の回転ずれ補正後のＸ
軸方向のずれ量を求めるために、感光基板２のＹ軸方向
と平行な一辺に配置する。In order to detect the amount of deviation between the photosensitive substrate 2 placed on the slide arm 6 and the ideal substrate position 16a in the transport section 12, three edge sensors 17A, 17B and 17C are provided near the edge of the photosensitive substrate 2. To place. Here, the edge sensors 17A and 17B detect the rotational displacement between the reference position of the photosensitive substrate 2 on the stage 11 and the position of the photosensitive substrate 2 mounted on the slide arm 6, and the displacement in the Y-axis direction after the rotational displacement correction. 4 of the board to find the quantity and
Among the sides, one side parallel to the moving direction (X-axis direction) of the slide arm 6 is arranged with an interval of an arbitrary amount L X. In addition, the edge sensor 17C is an X sensor after the rotation deviation of the photosensitive substrate 2 is corrected.
In order to obtain the shift amount in the axial direction, the photosensitive substrate 2 is arranged on one side parallel to the Y-axis direction.
【００１２】ここでエツジセンサ１７Ａ〜１７Ｃは、Ｃ
ＣＤ（Charge Coupled Device ）ラインセンサでなる。
また各エツジセンサ１７Ａ〜１７Ｃは、図３（Ａ）に示
すように、感光基板２を挟んで対向位置に配置された発
光部１８と受光部１９とでなる。この受光部１９は複数
の受光素子の集合体でなり、各受光素子から感光基板２
の位置に応じた信号レベルのエツジ検出信号Ｓ１（Ｓ
２、Ｓ３）を位置検出回路２０Ａ（２０Ｂ、２０Ｃ）に
出力するようになされている。この発光部１８からの光
束は感光基板２によつて一部遮光される。このため、遮
光される領域に位置する受光素子は信号レベルの低いエ
ツジ検出信号Ｓ１（Ｓ２、Ｓ３）を位置検出回路２０Ａ
（２０Ｂ、２０Ｃ）に出力し、遮光されない領域に位置
する受光素子は信号レベルの高いエツジ検出信号Ｓ１
（Ｓ２、Ｓ３）を位置検出回路２０Ａ（２０Ｂ、２０
Ｃ）に出力する。よつて、図３（Ｂ）に示すような波形
が得られる。ここで位置検出回路２０Ａ（２０Ｂ、２０
Ｃ）はコンパレータでなつており、しきい値とエツジ検
出信号Ｓ１（Ｓ２、Ｓ３）とを比較することで、感光基
板２の位置を検出できる。Here, the edge sensors 17A to 17C are C
It consists of a CD (Charge Coupled Device) line sensor.
As shown in FIG. 3A, each of the edge sensors 17A to 17C is composed of a light emitting portion 18 and a light receiving portion 19 which are arranged at opposite positions with the photosensitive substrate 2 interposed therebetween. The light receiving unit 19 is an assembly of a plurality of light receiving elements, and each light receiving element is connected to the photosensitive substrate 2
Edge detection signal S1 (S1) having a signal level corresponding to the position of
2, S3) is output to the position detection circuit 20A (20B, 20C). The light flux from the light emitting portion 18 is partially blocked by the photosensitive substrate 2. Therefore, the light receiving element located in the light shielded area receives the edge detection signal S1 (S2, S3) having a low signal level from the position detection circuit 20A.
(20B, 20C), and the light receiving element located in the non-shielded area receives the edge detection signal S1 having a high signal level.
(S2, S3) is the position detection circuit 20A (20B, 20
Output to C). Therefore, the waveform as shown in FIG. 3B is obtained. Here, the position detection circuit 20A (20B, 20
C) is a comparator, and the position of the photosensitive substrate 2 can be detected by comparing the threshold value with the edge detection signal S1 (S2, S3).
【００１３】またスライドアーム６上に載置された感光
基板２の搬送先であるステージ１１は、搬送部１２によ
る回転ずれ補正後のＸ−Ｙ方向の各ずれ量を補正するた
め、Ｘ軸及びＹ軸方向に移動可能である。The stage 11, which is the destination of the photosensitive substrate 2 placed on the slide arm 6, corrects each shift amount in the XY directions after the rotation shift is corrected by the transport unit 12, so that the X-axis and It can be moved in the Y-axis direction.
【００１４】さらに制御部１３は、感光基板２の位置を
各エツジセンサ１７Ａ〜１７Ｃからのエツジ検出信号Ｓ
１〜Ｓ３で検出する位置検出回路２０Ａ〜２０Ｃと、位
置検出回路２０Ａ〜２０Ｃで検出された各位置信号Ｓ４
〜Ｓ６により感光基板２の各ずれ量を求める演算部２１
と、搬送部１２でずれ量を補正させる駆動センサ２２Ａ
と、ステージ１１側でずれ量を補正させる駆動センサ２
２Ｂとからなつている。Further, the control unit 13 controls the edge detection signal S from the edge sensors 17A to 17C to determine the position of the photosensitive substrate 2.
Position detection circuits 20A to 20C detected by 1 to S3, and position signals S4 detected by the position detection circuits 20A to 20C
Calculation unit 21 that obtains each shift amount of the photosensitive substrate 2 through S6
And a drive sensor 22A for correcting the deviation amount in the transport unit 12
And the drive sensor 2 for correcting the amount of deviation on the stage 11 side.
It consists of 2B.
【００１５】以上の構成において、エツジセンサ１７
Ａ、１７Ｂは、スライドアーム６上における感光基板２
の理想位置１６ａに対するずれ量をそれぞれ検出する。
このとき、図４に示すように、エツジセンサ１７Ａ、１
７Ｂで検出されたずれ量をそれぞれｙ1 、ｙ2 とする
と、求める感光基板２の傾き、即ち回転ずれ量θは、次
式In the above structure, the edge sensor 17
A and 17B are photosensitive substrates 2 on the slide arm 6.
The amount of deviation from the ideal position 16a is detected.
At this time, as shown in FIG. 4, the edge sensors 17A, 1A
Assuming that the deviation amounts detected in 7B are y 1 and y 2 , respectively, the desired inclination of the photosensitive substrate 2, that is, the rotation deviation amount θ is
【数１】 で表される。[Equation 1] It is represented by.
【００１６】次に、基準位置とスライドアーム６上の感
光基板２の位置とが平行、即ち、ずれ量ｙ1 、ｙ2 が等
しくなるように、回転部１４を（１）式で求められた回
転ずれ量θに応じて回転移動させる。このとき回転部１
４と共に、感光基板２が載置されるスライドアーム６も
回転移動するため、感光基板２の回転ずれ量θが補正さ
れる。Next, the rotating portion 14 is obtained by the equation (1) so that the reference position and the position of the photosensitive substrate 2 on the slide arm 6 are parallel to each other, that is, the displacement amounts y 1 and y 2 are equal. It is rotated according to the rotation deviation amount θ. At this time, the rotating unit 1
4, the slide arm 6 on which the photosensitive substrate 2 is mounted also rotates, so that the rotational deviation amount θ of the photosensitive substrate 2 is corrected.
【００１７】感光基板２の回転ずれ量θの補正後、図５
に示すように、エツジセンサ１７Ａ、１７Ｂで、理想基
板位置１６ａと回転ずれ量θの補正後の感光基板２の位
置とにおけるＹ軸方向に対するずれ量ｙ′を検出し、エ
ツジセンサ１７ＣでＸ軸方向のずれ量ｘ′を検出する。
このずれ量ｘ′、ｙ′と回転ずれ量θ、及び所定値のス
トロークＬにより、ステージ１１のＸ軸及びＹ軸方向の
移動量を、次式After correction of the rotation deviation amount θ of the photosensitive substrate 2, FIG.
As shown in FIG. 7, the edge sensors 17A and 17B detect the deviation amount y ′ in the Y-axis direction between the ideal substrate position 16a and the position of the photosensitive substrate 2 after the correction of the rotation deviation amount θ, and the edge sensor 17C detects the deviation amount y ′ in the X-axis direction. The shift amount x'is detected.
By using the shift amounts x ′ and y ′, the rotation shift amount θ, and the stroke L having a predetermined value, the movement amount of the stage 11 in the X-axis and Y-axis directions is calculated by the following equation.
【数２】 [Equation 2]
【数３】 から、それぞれ求める。[Equation 3] From each.
【００１８】ステージ１１は、スライドアーム６から感
光基板２を受け渡される際、ステージ１１上の基準位置
と載置される感光基板２の位置とが一致するように、
（２）式、（３）式から求められた各移動量Ｘ、Ｙに応
じて移動し、Ｘ−Ｙ方向のずれ量を補正する。この後、
スライドアーム６がストロークＬ移動し、載置されてい
る感光基板２を補正後のステージ１１′上へ受渡す。こ
のとき、既に回転ずれ量θ及びＸ−Ｙ方向のずれ量は補
正されているため、ステージ１１′上の基準位置と感光
基板２の位置とは一致する。When the photosensitive substrate 2 is transferred from the slide arm 6 to the stage 11, the reference position on the stage 11 and the position of the photosensitive substrate 2 to be placed are aligned with each other.
It moves according to the movement amounts X and Y obtained from the equations (2) and (3), and corrects the shift amount in the XY direction. After this,
The slide arm 6 moves by the stroke L, and transfers the mounted photosensitive substrate 2 onto the corrected stage 11 '. At this time, since the rotational shift amount θ and the shift amount in the XY directions have already been corrected, the reference position on the stage 11 ′ and the position of the photosensitive substrate 2 match.
【００１９】以上の構成によれば、感光基板２のずれ量
を非接触にて検出し、搬送部１２とステージ１１とをず
れ量に応じて移動させ、補正することにより、感光基板
２の端面にピンを押し付けることで生じる破損を防ぎ、
感光基板２の裏面と感光基板２を搭載するスライドアー
ム６との間に摩擦を生じさせることなく位置決めができ
る。According to the above configuration, the amount of displacement of the photosensitive substrate 2 is detected in a non-contact manner, and the transport unit 12 and the stage 11 are moved and corrected in accordance with the amount of displacement to correct the end surface of the photosensitive substrate 2. Prevent the damage caused by pressing the pin to
Positioning can be performed without causing friction between the back surface of the photosensitive substrate 2 and the slide arm 6 on which the photosensitive substrate 2 is mounted.
【００２０】また上述の実施例においては、スライドア
ーム６上に載置された感光基板２の位置をエツジセンサ
１７Ａ〜１７Ｃを用いて検出するものについて述べた
が、本発明はこれに限らず、複数の小型テレビカメラを
感光基板２のエツジ位置に配置する等、エツジセンサ以
外の位置検出センサを用いることで感光基板２の位置を
検出するようにしても良い。In the above-described embodiment, the position of the photosensitive substrate 2 placed on the slide arm 6 is detected by using the edge sensors 17A to 17C, but the present invention is not limited to this, and a plurality of plural sensors can be used. The position of the photosensitive substrate 2 may be detected by using a position detection sensor other than the edge sensor, such as disposing the small television camera at the edge position of the photosensitive substrate 2.
【００２１】さらに上述の実施例においては、回転部１
４と共にスライドアーム６を回転させることで感光基板
２の回転ずれ量θを補正するものについて述べたが、本
発明はこれに限らず、感光基板２をスライドアーム６か
ら離した回転ずれ量θを補正し、補正後、感光基板２を
スライドアーム６上に載置し、ステージ１１に搬送する
ようにしても良い。Further, in the above embodiment, the rotating part 1
Although the rotation deviation amount θ of the photosensitive substrate 2 is corrected by rotating the slide arm 6 together with 4, the present invention is not limited to this, and the rotation deviation amount θ when the photosensitive substrate 2 is separated from the slide arm 6 is corrected. After the correction, the photosensitive substrate 2 may be placed on the slide arm 6 and conveyed to the stage 11.
【００２２】さらに上述の実施例においては、エツジセ
ンサ１７Ａ〜１７Ｃを用いて感光基板２を位置決めをす
るものについて述べたが、本発明はこれに限らず、ガラ
ス基板等のように透過性を有する基板を位置決めする場
合においても同様の効果を得ることができる。この場
合、コンパレータのしきい値を変えることにより、エツ
ジセンサ１７Ａ〜１７Ｃで基板のずれ量を検出すること
ができる。Further, in the above-mentioned embodiment, the case where the photosensitive substrate 2 is positioned by using the edge sensors 17A to 17C has been described, but the present invention is not limited to this, and a transparent substrate such as a glass substrate. The same effect can be obtained when positioning is performed. In this case, the amount of displacement of the substrate can be detected by the edge sensors 17A to 17C by changing the threshold value of the comparator.
【００２３】[0023]
【発明の効果】上述のように本発明によれば、エツジ検
出手段を用いて非接触で基板の位置を検出し、この検出
結果に基づき、第１の補正手段で搬送手段を回転移動さ
せ、第２の補正手段でステージを２次元方向に移動させ
ることで基板の位置を補正するようにしたことにより、
基板と基板を搭載する部材との間に摩擦を生じさせず、
基板の端面に機械的な接触を行なわずに基板を位置決め
することができる。As described above, according to the present invention, the position of the substrate is detected in a non-contact manner by using the edge detecting means, and the conveying means is rotationally moved by the first correcting means based on the detection result. By moving the stage in the two-dimensional direction by the second correction means to correct the position of the substrate,
Does not cause friction between the board and the member that mounts the board,
The substrate can be positioned without making mechanical contact with the end face of the substrate.
【図１】本発明の一実施例における位置決め装置を示す
略線図である。FIG. 1 is a schematic diagram showing a positioning device according to an embodiment of the present invention.
【図２】図１の位置決め装置における搬送部を示す側面
図である。FIG. 2 is a side view showing a carrying section in the positioning device of FIG.
【図３】エツジセンサと信号波形を示す略線図である。FIG. 3 is a schematic diagram showing an edge sensor and a signal waveform.
【図４】本発明の位置決め装置による回転ずれ量の補正
の説明に供する略線図である。FIG. 4 is a schematic diagram used for explaining the correction of the rotation deviation amount by the positioning device of the present invention.
【図５】本発明の位置決め装置によるＸ−Ｙ方向のずれ
量の補正の説明に供する略線図である。FIG. 5 is a schematic diagram for explaining the correction of the displacement amount in the XY directions by the positioning device of the present invention.
【図６】従来の位置決め装置の説明に供する略線図であ
る。FIG. 6 is a schematic diagram for explaining a conventional positioning device.
１……移載機構、２……感光基板、３Ａ〜３Ｃ……ピ
ン、５Ａ、５Ｂ……可動ピン、６……スライドアーム、
１０……位置決め装置、１１……ステージ、１２……搬
送部、１３……制御部、１７Ａ〜１７Ｃ……エツジセン
サ、１８……発光部、１９……受光部。1 ... Transfer mechanism, 2 ... Photosensitive substrate, 3A to 3C ... Pins, 5A, 5B ... Movable pin, 6 ... Slide arm,
10 ... Positioning device, 11 ... Stage, 12 ... Transport section, 13 ... Control section, 17A to 17C ... Edge sensor, 18 ... Light emitting section, 19 ... Light receiving section.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/027 // Ｂ２３Ｑ 15/22 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 21/027 // B23Q 15/22
Claims (1)
決めする位置決め装置において、 前記基板を載置して前記ステージまで搬送する搬送手段
と、 該搬送手段上に載置された前記基板のエツジの位置を前
記搬送中に非接触で検出するエツジ検出手段と、 前記エツジ検出手段の検出結果に基づき、位置決めすべ
き前記基準位置に対する前記基板の位置のずれ量を求め
る演算手段と、 前記演算手段で求めた前記ずれ量に基づき、前記搬送手
段を回転することにより、前記搬送手段に載置されてい
る前記基板の位置の前記基準位置に対する回転ずれを補
正する第１の補正手段と、 前記演算手段で求めた前記ずれ量に基づき、前記ステー
ジの２次元方向の位置を補正し、前記基板の位置を前記
基準位置と平行になるように補正する第２の補正手段と
を具えることを特徴とする位置決め装置。1. A positioning device for positioning a substrate with respect to a reference position on a stage, wherein the substrate is placed on the substrate and transported to the stage, and the edge of the substrate placed on the transportation device. Edge detecting means for non-contact detection of the position of the substrate, and calculating means for obtaining the amount of displacement of the position of the substrate with respect to the reference position to be positioned based on the detection result of the edge detecting means; First correction means for correcting the rotation deviation of the position of the substrate placed on the transfer means with respect to the reference position by rotating the transfer means based on the amount of deviation obtained in step A; A second correction hand for correcting the position of the stage in the two-dimensional direction based on the displacement amount obtained by the means, and correcting the position of the substrate so as to be parallel to the reference position. Positioning device characterized in that it comprises and.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6151566A JPH07335723A (en) | 1994-06-08 | 1994-06-08 | Positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6151566A JPH07335723A (en) | 1994-06-08 | 1994-06-08 | Positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07335723A true JPH07335723A (en) | 1995-12-22 |
Family
ID=15521338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6151566A Pending JPH07335723A (en) | 1994-06-08 | 1994-06-08 | Positioning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07335723A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319612A (en) * | 2001-04-20 | 2002-10-31 | Shin Etsu Handotai Co Ltd | Wafer transfer apparatus, vapor phase growth system, and method of transferring wafer |
| WO2005004227A1 (en) * | 2003-07-07 | 2005-01-13 | Rorze Corporation | Thin sheet-like article displacement detection method and displacement correction method |
| JP2005199197A (en) * | 2004-01-16 | 2005-07-28 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus and substrate transport method |
| JP2007057813A (en) * | 2005-08-24 | 2007-03-08 | Hitachi Kokusai Electric Inc | Positioning method of substrate, and sample stage using same, and dimension measuring device or substrate processing device |
| JP2008082748A (en) * | 2006-09-26 | 2008-04-10 | Yamatake Corp | Edge sensor, position detection method, and alignment method |
| JP2009051672A (en) * | 2002-04-18 | 2009-03-12 | Olympus Corp | Substrate conveying device |
| JP2012032805A (en) * | 2010-06-30 | 2012-02-16 | Nsk Technology Co Ltd | Exposure unit |
| JP2012178423A (en) * | 2011-02-25 | 2012-09-13 | Nsk Technology Co Ltd | Exposure unit and prealignment method of wafer |
-
1994
- 1994-06-08 JP JP6151566A patent/JPH07335723A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319612A (en) * | 2001-04-20 | 2002-10-31 | Shin Etsu Handotai Co Ltd | Wafer transfer apparatus, vapor phase growth system, and method of transferring wafer |
| JP2009051672A (en) * | 2002-04-18 | 2009-03-12 | Olympus Corp | Substrate conveying device |
| WO2005004227A1 (en) * | 2003-07-07 | 2005-01-13 | Rorze Corporation | Thin sheet-like article displacement detection method and displacement correction method |
| KR100981078B1 (en) * | 2003-07-07 | 2010-09-08 | 로제 가부시키가이샤 | Thin sheet-like article displacement detection method and displacement correction method |
| JP2005199197A (en) * | 2004-01-16 | 2005-07-28 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus and substrate transport method |
| JP2007057813A (en) * | 2005-08-24 | 2007-03-08 | Hitachi Kokusai Electric Inc | Positioning method of substrate, and sample stage using same, and dimension measuring device or substrate processing device |
| JP2008082748A (en) * | 2006-09-26 | 2008-04-10 | Yamatake Corp | Edge sensor, position detection method, and alignment method |
| JP2012032805A (en) * | 2010-06-30 | 2012-02-16 | Nsk Technology Co Ltd | Exposure unit |
| JP2012178423A (en) * | 2011-02-25 | 2012-09-13 | Nsk Technology Co Ltd | Exposure unit and prealignment method of wafer |
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