JP3278952B2 - How to take out electronic components - Google Patents
How to take out electronic componentsInfo
- Publication number
- JP3278952B2 JP3278952B2 JP03458393A JP3458393A JP3278952B2 JP 3278952 B2 JP3278952 B2 JP 3278952B2 JP 03458393 A JP03458393 A JP 03458393A JP 3458393 A JP3458393 A JP 3458393A JP 3278952 B2 JP3278952 B2 JP 3278952B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- center
- gravity
- image
- taping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【0001】[0001]
【産業上の利用分野】本発明は、テーピング等により順
次搬送される電子部品を一定位置で保持するための電子
部品の取り出し方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of taking out an electronic component for holding electronic components sequentially conveyed by taping or the like at a fixed position.
【0002】[0002]
【従来の技術】パッケージにて封止された半導体装置や
チップ部品等から成る電子部品は、テーピング等の収納
容器に収納され、ユーザー側にまとめて出荷される。テ
ーピングとは、長尺状のテープに所定間隔で複数の凹部
が形成されたもので、この各凹部内にそれぞれ電子部品
を収納できるようになっている。2. Description of the Related Art Electronic components such as semiconductor devices and chip components sealed in a package are stored in a storage container such as taping, and are shipped together to a user. The taping is a long tape in which a plurality of concave portions are formed at predetermined intervals, and each of the concave portions can accommodate an electronic component.
【0003】このテーピングに電子部品が収納されてい
る場合の電子部品の取り出し方法について説明する。先
ず、ユーザー側でこのテーピングを搬送機構に装着す
る。テーピングの両側部には一定間隔で複数のスプロケ
ットホールが設けられており、このスプロケットホール
に搬送機構の歯車の歯をかみ合わせることでテーピング
を搬送する。そして、予め配置された真空吸着器等の取
り出し機構の下方に電子部品を配置してテーピングを停
止し、この取り出し機構を下降して電子部品を例えば吸
着保持する。この状態で取り出し機構を所定の位置まで
移動して、電子部品を目的の位置、例えば、実装する基
板上まで搬送する。A method of taking out an electronic component when the electronic component is stored in the taping will be described. First, the user attaches the taping to the transport mechanism. A plurality of sprocket holes are provided at regular intervals on both sides of the taping, and the taping is transported by engaging the teeth of the gears of the transport mechanism with the sprocket holes. Then, the electronic component is disposed below a take-out mechanism such as a vacuum suction device which is arranged in advance, and taping is stopped. Then, the take-out mechanism is lowered to suction-hold the electronic component, for example. In this state, the takeout mechanism is moved to a predetermined position, and the electronic component is conveyed to a target position, for example, on a board to be mounted.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな電子部品の取り出し方法には、次のような問題があ
る。すなわち、搬送機構で搬送されるテーピングの位置
決め誤差や、テーピングの凹部内における電子部品の収
納位置のばらつきにより、取り出し機構を下降させた
際、電子部品の重心からずれた位置を保持してしまうこ
とになる。このため、取り出し機構による電子部品の保
持が不安定となったり、このずれが大きい場合には、電
子部品の取り出しが不可能となってしまう。よって、本
発明は確実に電子部品の重心を保持できる電子部品の取
り出し方法を提供することを目的とする。However, such a method for taking out an electronic component has the following problems. That is, when the take-out mechanism is lowered, a position shifted from the center of gravity of the electronic component is held due to a positioning error of the taping conveyed by the transport mechanism or a variation in a storage position of the electronic component in the concave portion of the taping. become. For this reason, if the holding of the electronic component by the take-out mechanism becomes unstable, or if this deviation is large, it becomes impossible to take out the electronic component. Accordingly, an object of the present invention is to provide a method for taking out an electronic component that can reliably hold the center of gravity of the electronic component.
【0005】[0005]
【課題を解決するための手段】本発明は、このような課
題を解決するために成された電子部品の取り出し方法で
ある。すなわち、搬送機構により順次送られる電子部品
を所定の取り出し機構にて取り出す方法であり、収納容
器に収納された状態で搬送される電子部品の上方の一定
位置に配置したカメラを用いて前記電子部品の反射光を
含む画像を検出する工程と、カメラによる検出画像に基
づいて、該検出画像の基準位置と前記電子部品の反射光
の画像から求まる該電子部品の重心位置との位置ずれを
算出する工程と、カメラを前記電子部品の上方から退避
させる工程と、位置ずれの算出結果に基づいて前記取り
出し機構を前記電子部品の重心位置の上方に移動する工
程と、取り出し機構を下降させ、電子部品を取り出す工
程とを備えている。SUMMARY OF THE INVENTION The present invention is a method for taking out an electronic component which has been made to solve such a problem. That is, a method of retrieving electronic components are sequentially fed by the transfer mechanism at a predetermined take-out mechanism, housed volume
Detecting an image including reflected light of the electronic component using a camera arranged at a fixed position above the electronic component conveyed in a state housed in the container , and detecting the image based on an image detected by the camera. Reference position and reflected light of the electronic component
Calculating a position shift from the center of gravity of the electronic component obtained from the image of the electronic component, retracting the camera from above the electronic component, and setting the takeout mechanism to the center of gravity of the electronic component based on the calculation result of the position shift. The method includes a step of moving the electronic component upward, and a step of lowering the takeout mechanism to take out the electronic component.
【0006】[0006]
【作用】このような本発明では、収納容器に収納された
状態で搬送機構により送られ、所定の位置にて停止した
電子部品の画像の反射光を、その電子部品の上方の一定
位置に配置したカメラにて読み取る。そして、このカメ
ラによる検出画像に基づいて、検出画像の基準位置と電
子部品の画像から求まる重心位置との位置ずれを算出す
ることで、電子部品の停止位置のずれ量を得ることがで
きる。すなわち、搬送機構の位置決め誤差や、テーピン
グの凹部内での電子部品の収納位置のばらつきに基づき
電子部品の停止位置のずれ量が得られる。その後、カメ
ラを電子部品の上方から退避し、算出したずれ量に基づ
いて、取り出し機構の移動量に補正を加えることで、電
子部品の重心位置を確実に保持することができる。According to the present invention as described above, it is stored in the storage container.
The reflected light of the image of the electronic component, which is sent by the transport mechanism in the state and stopped at a predetermined position, is read by a camera arranged at a certain position above the electronic component. And this turtle
Based on the detected image by La, by calculating the positional deviation between the reference position and the position of the center of gravity obtained from the electronic components of the image of the detected image, it is possible to obtain a shift amount of the stop position of the electronic component. That is, the shift amount of the stop position of the electronic component can be obtained based on the positioning error of the transport mechanism and the variation of the storage position of the electronic component in the concave portion of the taping. Then turtle
By retracting the electronic component from above the electronic component and correcting the amount of movement of the take-out mechanism based on the calculated shift amount, the position of the center of gravity of the electronic component can be reliably held.
【0007】[0007]
【実施例】以下に、本発明の電子部品の取り出し方法を
図に基づいて説明する。図1は、本発明の電子部品の取
り出し方法を説明する流れ図である。先ず、光学読み取
り装置の移動1aを行い、搬送された電子部品の上方の
一定位置に光学読み取り装置を配置する。そして、電子
部品の画像取り込み1bとして、光学読み取り装置にて
電子部品の検出画像を取り込む。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a method for taking out an electronic component according to the present invention. FIG. 1 is a flowchart illustrating a method for taking out an electronic component according to the present invention. First, the optical reader is moved 1a, and the optical reader is arranged at a fixed position above the transported electronic component. Then, as an image capturing 1b of the electronic component, a detection image of the electronic component is captured by the optical reading device.
【0008】画像取り込み1bは、図2の斜視図に示す
ように、搬送されるテーピング1の凹部11に収納され
た電子部品2の検出画像をCCDカメラ等の光学読み取
り装置3を用いて取り込むものである。すなわち、テー
ピング1は、図示しない搬送機構に装着されており、搬
送機構の歯車をテーピング1のスプロケットホール12
に合わせることで順次搬送されている。そして、凹部1
1内に収納された所定の電子部品2の上方に光学読み取
り装置3を配置し、電子部品2の検出画像を取り込む。
この際、光学読み取り装置3の配置位置は常に一定であ
り、この位置が基準となる。As shown in the perspective view of FIG. 2, the image capture 1b captures a detected image of the electronic component 2 housed in the concave portion 11 of the transported taping 1 by using an optical reading device 3 such as a CCD camera. It is. That is, the taping 1 is mounted on a transport mechanism (not shown), and the gears of the transport mechanism are connected to the sprocket holes 12 of the taping 1.
Are transported one after another. And recess 1
An optical reading device 3 is arranged above a predetermined electronic component 2 housed in the electronic component 1, and captures a detection image of the electronic component 2.
At this time, the arrangement position of the optical reading device 3 is always constant, and this position serves as a reference.
【0009】次に、この電子部品2の検出画像に基づい
て、電子部品2の重心位置の算出1cを行う。すなわ
ち、図2に示す光学読み取り装置3にて取り込んだ電子
部品2の検出画像はモニタ4に写し出されるとともに、
その信号が中央演算装置5に送られる。そして、この中
央演算装置5にて電子部品2の重心位置を算出する。つ
まり、図3に示すように、検出画像4aにはテーピング
1の凹部11に収納された電子部品2の全体が写し出さ
れている。この検出画像4aから電子部品2の重心位置
Gを算出するには、先ず、検出画像4aを例えば2値化
処理し、その信号から電子部品2の外形を認識する。2
値化処理の条件(スレッシュレベル等)や種々の電子部
品2の外形寸法等の情報は、予めメモリ6(図2参照)
に記憶されており、これらの情報から必要なものを参照
して電子部品2の外形を認識する。Next, based on the detected image of the electronic component 2, calculation of the center of gravity of the electronic component 2 is performed 1c. That is, the detection image of the electronic component 2 captured by the optical reading device 3 shown in FIG.
The signal is sent to the central processing unit 5. Then, the central processing unit 5 calculates the position of the center of gravity of the electronic component 2. That is, as shown in FIG. 3, the entirety of the electronic component 2 housed in the recess 11 of the taping 1 is shown in the detection image 4a. In order to calculate the position G of the center of gravity of the electronic component 2 from the detected image 4a, first, for example, the detected image 4a is binarized, and the outer shape of the electronic component 2 is recognized from the signal. 2
Information such as the conditions of the binarization process (threshold level and the like) and the external dimensions of various electronic components 2 are stored in a memory 6 (see FIG. 2) in advance.
The external shape of the electronic component 2 is recognized by referring to necessary information from these information.
【0010】そして、この認識した電子部品2の外形か
ら重心位置Gを算出する。重心位置Gの算出は、電子部
品2の外形から計算により求めてもよいが、メモリ6に
予め記憶された外形寸法に対する重心位置Gの座標を参
照して求めてもよい。次いで、この電子部品2の重心位
置Gと検出画像4aの基準位置(例えば、中心O)との
ずれ量Δを求める。つまり、テーピング1の位置決め誤
差や、凹部11に対する電子部品2の収納位置のずれ等
により、一定位置(基準となる位置)に配置された光学
読み取り装置3で取り込んだ検出画像4aの中心Oと電
子部品2の重心位置Gとの間のずれ量Δが求められるこ
とになる。Then, the center of gravity G is calculated from the recognized outer shape of the electronic component 2. The center of gravity G may be calculated from the outer shape of the electronic component 2 by calculation, or may be obtained by referring to the coordinates of the center of gravity G with respect to the outer dimensions stored in the memory 6 in advance. Next, the amount of deviation Δ between the position G of the center of gravity of the electronic component 2 and the reference position (for example, the center O) of the detected image 4a is determined. That is, due to a positioning error of the taping 1 or a displacement of the storage position of the electronic component 2 with respect to the concave portion 11, the center O of the detection image 4a captured by the optical reading device 3 arranged at a fixed position (reference position) and the electronic The deviation amount Δ from the position G of the center of gravity of the component 2 is obtained.
【0011】ずれ量Δを求めたら、次に、光学読み取り
装置退避1dを行い、取り出し機構移動1eを行う。す
なわち、光学読み取り装置3を電子部品2の上方から退
避した後、図4の斜視図に示すように、真空チャック等
の取り出し機構7を電子部品2の上方に移動する。この
際、中央演算装置5から取り出し機構7に対して、先に
算出したずれ量Δを位置補正情報として与え、取り出し
機構7の停止位置の補正を行う。これにより、テーピン
グ1の凹部11に対する電子部品2の収納位置がずれて
いても、そのずれ量Δが算出されているため、電子部品
2の重心位置Gの真上に取り出し機構7を配置できるこ
とになる。After the deviation amount Δ is obtained, next, the optical reading device is retracted 1d, and the takeout mechanism is moved 1e. That is, after retracting the optical reading device 3 from above the electronic component 2, the take-out mechanism 7 such as a vacuum chuck is moved above the electronic component 2 as shown in the perspective view of FIG. At this time, the previously calculated deviation amount Δ is given from the central processing unit 5 to the take-out mechanism 7 as position correction information, and the stop position of the take-out mechanism 7 is corrected. Accordingly, even if the storage position of the electronic component 2 with respect to the concave portion 11 of the taping 1 is shifted, the shift amount Δ is calculated, so that the take-out mechanism 7 can be disposed directly above the center of gravity G of the electronic component 2. Become.
【0012】次に、電子部品取り出し1fを行う。すな
わち、図5の斜視図に示すように、停止位置の補正が成
された取り出し機構7を下降して電子部品2を保持し、
所定高さまで持ち上げる。この際、取り出し機構7によ
り電子部品2の重心位置Gを正確に保持できるため、電
子部品2を安定した状態で持ち上げることができる。そ
して、この状態で所定の位置、例えば実装する基板上ま
で移送する、電子部品マウント動作1gを行う。Next, electronic component take-out 1f is performed. That is, as shown in the perspective view of FIG. 5, the take-out mechanism 7 in which the stop position is corrected is lowered to hold the electronic component 2,
Lift up to the specified height. At this time, since the center of gravity G of the electronic component 2 can be accurately held by the take-out mechanism 7, the electronic component 2 can be lifted in a stable state. Then, in this state, an electronic component mounting operation 1g of transferring the electronic component to a predetermined position, for example, onto a substrate to be mounted is performed.
【0013】ここまでの一連の動作を繰り返して、テー
ピング1にて順次搬送される電子部品2を各凹部11か
ら取り出していく。各電子部品2は、それぞれの凹部1
1に対してずれた収納位置に収納されているため、毎回
中央演算装置5から取り出し機構7に対して与えられる
位置補正情報が異なる場合もあるが、このように取り出
し機構7の位置を補正することにより、毎回それぞれの
電子部品2の重心位置Gを正確に保持することができる
ようになる。なお、本実施例では、電子部品2として平
面視略四角形のものを用いたが、本発明はこのような形
状に限定されない。すなわち、重心位置Gが偏っている
電子部品2を取り出す場合であっても、その重心位置G
を確実に保持することができ、安定して取り出しを行う
ことができる。By repeating a series of operations up to this point, the electronic components 2 sequentially conveyed by the taping 1 are taken out from the respective recesses 11. Each electronic component 2 has its own recess 1
The position correction information given from the central processing unit 5 to the take-out mechanism 7 may be different each time because it is stored in the storage position shifted from the position 1, but the position of the take-out mechanism 7 is corrected in this way. Thus, the center of gravity G of each electronic component 2 can be accurately maintained each time. In this embodiment, the electronic component 2 has a substantially rectangular shape in plan view, but the present invention is not limited to such a shape. That is, even when the electronic component 2 having the deviated center of gravity G is taken out, the position of the center of gravity G
Can be reliably held, and stable removal can be performed.
【0014】[0014]
【発明の効果】以上説明したように、本発明の電子部品
の取り出し方法によれば、次のような効果がある。すな
わち、テーピングの位置決め誤差や、テーピングの凹部
内における電子部品の収納位置のずれがあっても、取り
出し機構により電子部品の重心位置を確実に保持するこ
とができる。このため、電子部品を安定して保持でき、
所定の位置まで確実に移送することができる。特に、大
きな凹部に小さな電子部品が収納されている場合には、
電子部品の収納位置のずれが大きくなるが、このような
場合であっても確実に電子部品の重心位置を保持するこ
とが可能となる。As described above, according to the method for taking out an electronic component of the present invention, the following effects can be obtained. That is, even if there is a positioning error of the taping or a displacement of the storage position of the electronic component in the concave portion of the taping, the position of the center of gravity of the electronic component can be reliably held by the takeout mechanism. For this reason, electronic components can be stably held,
It can be reliably transported to a predetermined position. In particular, when a small electronic component is stored in a large recess,
Although the displacement of the storage position of the electronic component increases, the center of gravity position of the electronic component can be reliably maintained even in such a case.
【図1】本発明の電子部品の取り出し方法を説明する流
れ図である。FIG. 1 is a flowchart illustrating a method for taking out an electronic component according to the present invention.
【図2】画像取り込みを説明する斜視図である。FIG. 2 is a perspective view illustrating image capture.
【図3】検出画像を示す図である。FIG. 3 is a diagram showing a detected image.
【図4】取り出し機構の位置補正を説明する斜視図であ
る。FIG. 4 is a perspective view illustrating position correction of a take-out mechanism.
【図5】電子部品の取り出しを説明する斜視図である。FIG. 5 is a perspective view illustrating removal of an electronic component.
1 テーピング 2 電子部品 3 光学読み取り装置 4 モニタ 5 中央演算装置 6 メモリ 11 凹部 12 スプロケッ
トホールDESCRIPTION OF SYMBOLS 1 Taping 2 Electronic component 3 Optical reading device 4 Monitor 5 Central processing unit 6 Memory 11 Concavity 12 Sprocket hole
フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 13/02 Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 13/02
Claims (1)
所定の取り出し機構にて取り出す方法において、収納容器に収納された状態で搬送される 前記電子部品の
上方の一定位置に配置したカメラを用いて前記電子部品
の反射光を含む画像を検出する工程と、前記カメラによる 検出画像に基づいて、該検出画像の基
準位置と前記電子部品の反射光の画像から求まる該電子
部品の重心位置との位置ずれを算出する工程と、 前記カメラを前記電子部品の上方から退避させる工程
と、 前記位置ずれの算出結果に基づいて前記取り出し機構を
前記電子部品の重心位置の上方に移動する工程と、 前記取り出し機構を下降させ、前記電子部品を取り出す
工程と から成ることを特徴とする電子部品の取り出し方法。In a method for taking out electronic components sequentially sent by a transport mechanism by a predetermined take-out mechanism, a camera disposed at a fixed position above the electronic components transported in a state of being stored in a storage container is used. Detecting an image including the reflected light of the electronic component; and, based on the image detected by the camera, a position between a reference position of the detected image and a position of the center of gravity of the electronic component determined from the image of the reflected light of the electronic component. Calculating the displacement; retracting the camera from above the electronic component; moving the takeout mechanism above the center of gravity of the electronic component based on the calculation result of the displacement; Lowering the mechanism and removing the electronic component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03458393A JP3278952B2 (en) | 1993-01-29 | 1993-01-29 | How to take out electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03458393A JP3278952B2 (en) | 1993-01-29 | 1993-01-29 | How to take out electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06232594A JPH06232594A (en) | 1994-08-19 |
JP3278952B2 true JP3278952B2 (en) | 2002-04-30 |
Family
ID=12418350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03458393A Expired - Fee Related JP3278952B2 (en) | 1993-01-29 | 1993-01-29 | How to take out electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3278952B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022052995A (en) * | 2020-09-24 | 2022-04-05 | セイコーエプソン株式会社 | Robot control method and robot system |
-
1993
- 1993-01-29 JP JP03458393A patent/JP3278952B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH06232594A (en) | 1994-08-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100664469B1 (en) | Transfer robot and inspection method for thin substrate | |
JP4733001B2 (en) | Component mounting apparatus, component mounting method, and program | |
JPH07122900A (en) | Component-data recording device for electronic component and conveying and assembling device for electronic component using recording device thereof | |
US6519502B2 (en) | Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system | |
JPH07153818A (en) | Semiconductor wafer recognition equipment | |
JP3278952B2 (en) | How to take out electronic components | |
JP4122170B2 (en) | Component mounting method and component mounting apparatus | |
JPH07335723A (en) | Positioning device | |
JPH11289199A (en) | Electronic parts recognizing device | |
US6380000B1 (en) | Automatic recovery for die bonder wafer table wafermap operations | |
JP2000315896A (en) | Surface mounting part-fitting machine | |
JP2000013097A (en) | Part mounting system | |
JP5219765B2 (en) | Method for measuring height of electronic component mounting position | |
JP3310882B2 (en) | Electronic component mounting device | |
JPH08316288A (en) | Automatic conveyor | |
JPH10173030A (en) | Substrate carrier and exposure apparatus using the same | |
JP3445681B2 (en) | Chip mounter | |
JP2004356376A (en) | Component mounting apparatus and method of mounting component | |
JPH1163951A (en) | External appearance inspection device | |
KR940002759B1 (en) | Inner lead bonding apparatus | |
JPH10150298A (en) | Compensation angle correcting method of electronic component and electronic component using the method | |
JP7437654B2 (en) | Component mounting equipment and lead terminal height measurement method | |
TWI825943B (en) | Substrate transport robot and control method for substrate transport robot | |
JPH11163037A (en) | Method and device for bonding inner lead | |
JPH04154144A (en) | Substrate carrying-in and taking-out mechanism |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080222 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090222 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100222 Year of fee payment: 8 |
|
LAPS | Cancellation because of no payment of annual fees |