JP2000103031A - Apparatus for printing solder on wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a screen printing of solder, etc., on a water by providing a means for sensing easily an identification mark of a wafer and by using an existing screen printing machine. SOLUTION: This apparatus includes a screen printing machine 1 provided with a carrying and chucking device 6 wherein a wafer D on which solder is to be printed is chucked and is carried in on a printing table 3 and the wafer D after solder printing is finished is chucked and carried out, a rotating and detecting device 7 provided with a perceiving tool S which is provided in the neighborhood of an opening part through which the carrying and chucking device 6 of the case body 2 moves back and forth and detects an identification mark displayed on the wafer during rotation of a rotating receiving plate 49 when the wafer D is transferred and the rotating receiving plate 49 receiving it is rotated, a carrying hand device 8 which takes out the water D by means of a robot hand 66 from a cassette C for carrying-in and transfers it to the rotating and detecting device 7 and stores the wafer D transferred to the rotating and detecting device 7 by means of the carrying and chucking device 6 after screen printing is finished into the cassette C for carrying-out, and a controller for controlling them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder printing apparatus for wafers, and more particularly, to print solder on a wafer with an existing screen printer, removes the wafer from a carry-in carrier cassette containing wafers in multiple stages. For a wafer equipped with a wafer print positioning and transport mechanism for detecting the recognition mark, confirming the printing position, transporting it to an existing screen printing machine, collecting the wafer after printing, and storing it in a carrier cassette for unloading The present invention relates to a solder printing apparatus.

[0002]

2. Description of the Related Art In screen printing, a screen plate having a pattern hole of an electronic circuit formed thereon is mounted on a surface of an electronic substrate or the like fixed on a printing table, and a squeegee device moves on the upper surface of the screen plate to form a solder paste. The printing material such as is placed on the electronic substrate from the pattern hole.

In this screen printing machine, when an electronic substrate is placed on a printing table, the printing table moves to a lower portion of the screen plate, and a camera recognizes a recognition mark on the electronic substrate and recognizes x, y of the printing table. , Θ (rotation) direction, the printing table descends, comes into close contact with the screen plate, and the squeegee device moves on the upper surface of the screen plate.

A transfer chuck device for mounting an electronic substrate on a printing table is a robot hand or the like, and a pulley is supported at both ends of a bar, a pulley belt is wrapped around the pulley, and the pulley belt is fixed to a fixing portion. The movable unit of the transfer device that reciprocates the bar by connecting the movable unit and the movable unit reciprocates between the printing table and the loading / unloading table. The air chuck device is an air chuck device that is supported by the movable portion and holds at least two or four sides of the electronic substrate because the electronic substrate is rectangular.

[0005]

However, in screen printing of solder or the like on an electronic substrate, since the electronic substrate is rectangular, the x and y dimensions from the corners are set in advance to recognize the image of the recognition mark. Since scanning is performed, the positioning accuracy in the x and y directions on the printing table can be maintained high, and high-precision screen printing can be performed. However, when screen printing of solder or the like is performed on the wafer, the wafer becomes disc-shaped. Since there is no corner to be used as a reference and it is impossible to confirm the positions in the x and y directions, printing cannot be performed as it is with an existing screen printing machine.

In other words, several other wafers are stored in the carrier cassette and are sent for screen printing. However, since the position of the wafer stored in the carrier cassette is not constant in the carrier cassette, Even if a wafer is taken out of the carrier cassette by a robot or the like, the position of the recognition mark is varied, so that it is impossible to confirm the position of the image recognition scanning in the x and y directions.

SUMMARY OF THE INVENTION It is an object of the present invention to provide means for easily detecting a recognition mark on a wafer and to enable screen printing of solder or the like on a wafer by an existing screen printing machine.

[0008]

According to a first aspect of the present invention, there is provided a wafer solder printing apparatus for positioning a wafer mounted on a printing table at a predetermined angle in a screen printing machine. A rotation detecting device.

Therefore, it is possible to perform the solder printing on the wafer by the conventional screen printing machine.

Further, as set forth in claim 2, a screen printing machine provided with a transport chuck device for chucking a wafer and carrying the wafer onto a printing table, and a screen near the opening of the housing where the transport chuck device advances and retreats. A rotation detecting device provided with a sensor that detects a recognition mark displayed on the wafer when the wafer is transferred and the rotation receiving plate rotates upon receiving the wafer, and removes the wafer from the loading carrier cassette And a transfer hand device for transferring the rotation to the rotation detecting device, and an automatic controller for controlling the transfer hand device.

[0011] Therefore, the rotation detecting device can detect the recognition mark of the wafer and perform positioning, and the wafer can be mounted on the printing table in the positioned state.

According to a third aspect of the present invention, there is provided a screen provided with a transfer chuck device for chucking a wafer and carrying it on a printing table, and for chucking and carrying out the wafer after solder printing. A printing machine, provided near the opening where the transfer chuck device of the housing advances and retreats,
The rotation receiving plate which receives the wafer is rotated and the rotation receiving plate is rotated, and the rotation detecting device provided with a sensor for detecting a recognition mark displayed on the wafer at the time of the rotation, and the wafer is taken out from the loading carrier cassette and the rotation is detected. A transfer hand device that transfers the wafer transferred to the rotation detection device by the transfer chuck device after the screen printing to the detection device, and stores the wafer in the unloading carrier cassette, and an automatic controller that controls these devices. It is characterized by consisting of.

Therefore, the wafer is taken out of the carry-in carrier cassette and placed on the rotation detecting device. The rotation detecting device rotates the wafer, and the sensor detects the recognition mark of the wafer, and the rotation detecting device is turned at a predetermined angle. stop. Thereafter, the rotation detecting device is raised, the air chuck device of the transport chuck device holds the wafer on the rotation detecting device, and the transport chuck device moves the air chuck device to the printing table and places the wafer on the printing table. . After that, the camera moves to a predetermined position, performs image recognition of the recognition mark of the wafer within the field of view, and adjusts the position / angle of the printing table to the screen plate position / angle previously recognized by the camera. Move to and print.

Further, as set forth in claim 4, an outer peripheral guide having a tapered portion with which the outer peripheral edge of the wafer abuts is radially disposed around the upper portion of the rotation receiving plate in the rotation detecting device, and the wafer is centered. Characterized in that it falls on the rotary receiving plate.

Therefore, even if the wafers are stored in the carrier cassette in a discrete manner, the position of the sensor becomes substantially constant when the wafers are transferred to the rotation detecting device. There is no need to make adjustments, and since the recognition marks on each wafer are located at approximately the same position, a simple system such as a fiber sensor can be adopted without using a complicated image recognition system.

According to a fifth aspect of the present invention, in the transfer chuck device, the wafer chucking mechanism holds the outer peripheral edges of the wafer at the ends of an odd number of arms that can advance and retreat by an air-driven actuator. The air chuck device is provided with a catcher.

Therefore, the odd number of catchers chuck the wafer, so that the center position of the wafer is brought closer to the chuck center, the variation in the wafer position on the printing table is reduced, and the image recognition is made more reliable.

According to a sixth aspect of the present invention, the hand in the transfer hand device is characterized in that a projection is formed on a plate having a substantially Y-shape in plan view, with which the outer peripheral edge of the wafer abuts. I do.

Therefore, at the stage of taking out the wafer from the carrier cassette by the robot hand, the outer peripheral edge of the wafer is brought into contact with the projection of the hand, so that the center position of the wafer housed in the carrier cassette in a random manner is roughly obtained. Since the recognition mark of each wafer is almost at the same position because of the accurate determination, a simple system such as a fiber sensor can be adopted without using a complicated image recognition system. .

[0020]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, the screen printing machine 1 includes a housing 2 in which a printing table 3 is horizontally supported, a screen plate 4 is fixedly supported on the printing table 3, and The squeegee device 5 is supported so as to be movable up and down and horizontally. And
A transport chuck device 6 for mounting a wafer on the print table 3 is supported near an opening provided on one side of the housing 2. In this opening, a rotation detecting device 7 which faces the lower part of the transport chuck device 6 and mounts the wafer and rotates to detect the recognition mark is provided. Also, the rotation detecting device 7
A transfer hand device 8 for supplying a wafer to the printer and receiving the wafer after printing is disposed adjacent to the housing 2 as an independent device facing the rotation detection device 7.

The housing 2 is provided with a panel having a touch panel 9, a camera monitor 10, an FDD entrance / exit 11, an in-machine temperature display 12, an in-squeegee temperature controller 13, and the like at the upper part, and a camera for performing image recognition scanning of recognition marks. 14 (see FIG. 2) and a controller are built in the housing 2, and the screen printing machine 1 is already known in the world. Therefore, the transport chuck device 6 is a known type of a type in which a pulley is pivotally supported at both ends of a bar, a pulley belt is wrapped around the pulley, the pulley belt is connected to a fixed portion and a movable portion, and the bar is reciprocated. However, since the air chuck device 29 targets a circular wafer, it has a different configuration from the conventional one.

That is, the transport chuck device 6 is configured as shown in FIGS.
As shown in FIG. 6, a slide block 21 is connected to and suspended from the lower surface of the fixed support body 20 on the housing 2 side via an attachment plate 20 a, and the movable bar 22 is attached to the slide block 21.
Of the air cylinder 23 is slidably engaged, and one end of the air cylinder 23 is fixed to the mounting plate 20a with a bracket 25 and extends in parallel with the movable bar 22. The piston rod 24 engaged with the air cylinder 23 is L-shaped. The movable bar 22 is connected to one end of the movable bar 22 by a metal fitting 25a.

A slide block 21a is slidably engaged with the lower part of the movable bar 22.
Pulleys 26 and 26a are rotatably supported at both ends of the pulley 2, respectively, and a pulley belt 27 is wound therearound.
6 and 26a, the supporting member 20 and the slide block 21a are respectively pressed against the pulley belt 27 by press contact blocks 28 and 28a.
Are respectively connected. One end of a horizontal bar 22a is fixed to the slide block 21a in parallel with the movable bar 22,
An air chuck device 29 hangs down from the horizontal bar 22a and is fixed.

Therefore, as shown in FIG. 6, the transport chuck device 6
6 is shown by a solid line in FIG.
As shown in (A), while the air chuck device 29 is positioned directly above the rotation detecting device 7 and the piston rod 24 is extended from the air cylinder 23, the movable bar 22
Slides the slide block 21 and pulley 2
6 and 26a drive the pulley belt 27 to rotate, and as shown in phantom lines in FIG. 1 and as shown in FIG.
The air chuck device 29 is moved to the inside of the housing 2 from the movable bar 22 to position the air chuck device 29 right above the print table 3.

The air chuck device 29 is provided with a substantially Y-shaped support plate 30 parallel to the movable bar 22, and a known air chuck body 31 is fixed at a substantially central portion of the support plate 30, and is radially formed from the chuck body 31. A catcher 33 is attached to each of the ends of the three arms 32 projecting downward. The catchers 33 advance and retreat at the same time from the air chuck body 31 via the arms 32 on the lower surface of the support board 30, and are guided and supported by the support board 30 by appropriate guide members 34.

The air chuck body 31 has a rotary disk driven by a rotary actuator which rotates by a predetermined angle when air flows into the cylindrical body. Provided (not shown), a pin 32a that engages with the long hole is connected to the end of the arm 32, and the rotary actuator rotates forward to move the three arms 32 radially from the air chuck body 31 to the peripheral edge. This is a reciprocating device that moves forward and grips the wafer D, the rotary actuator rotates in reverse, and the three arms 32 centripetalally move back from the peripheral edge toward the air chuck body 31 to release the wafer D. In addition, in addition to the rotary actuator, a conical actuator coupled with a piston in a cylinder driven by air expands or contracts the same three arms radially biased in one direction by a spring. Since things are provided, you may use them.

As shown in FIGS. 7A and 7B, the catcher 33 is a substantially L-shaped member in which a concave portion 33a for engaging the peripheral portion of the wafer D is formed at one end on both sides, and is shown in FIGS. 8A and 8B. As described above, this member is detached by the screw or the bolt 36,
The inner and outer mounting positions can be set in opposite directions with respect to the arm 32, so that the present invention can be applied even when the diameter size of the wafer D is different such as 6 inches or 8 inches.

Next, as shown in FIGS. 9 to 11, the rotation detecting device 7 includes an elevating device 4 such as an air cylinder in a housing 40.
1 is fixed, and a rotating bearing 4 is
3 is fixed, the lower end of the shaft 45 of the ball spline 44 is supported by the rotary bearing 43, and an air suction pipe 47 is connected via a rotary joint 46. A timing pulley 48 is provided at the upper end of the shaft 45.
And the rotation receiving plate 49 is horizontally mounted on the shaft.

The rotation receiving plate 49 has a through hole 45a (FIG.
1) and communicates with the shaft 45.
Is hollow and can suck and hold the wafer D placed on the rotation receiving plate 49 by the air suction of the air suction pipe 47. A timing belt 50 is wound around the timing pulley 48, and the timing belt 50 is rotated by an output wheel 52 of a drive source 51 such as a stepping motor. Outer peripheral guides 54 are radially arranged at substantially constant intervals around a rotation receiving plate 49 on a table 53 formed on the upper surface of the housing 40, and the outer periphery of the wafer D contacts the upper inner side of the outer peripheral guide 54 to be centripetal. A taper portion 54a is formed to slide down on the rotation receiving plate 49 so that the center position of the wafer coincides with the axis of the rotation receiving plate 49. Outer circumference guide 5
4 is when the diameter of the wafer D is 6 inches, and 8
In inches, change the position of each
It can be fixed to.

As shown in FIGS. 11 and 12, a guide rail 55 is fixed on the table 53 in a radial direction near the outer peripheral edge of the wafer D by a block 56 at a predetermined height. A mounting plate 58 for mounting a sensor of the recognition mark coupled to a slide block 57 slidably slidably engaging with the slide block 57 slidably reciprocates in the centripetal and centrifugal directions. The parts are combined, the piston rod 59 is engaged with the air cylinder 60, and the air cylinder 60 is appropriately fixed to the table 53 or the block 61. In addition, the blocks 61 are arranged on the table 53 in parallel with the guide rails 55.
Is fixed, and a stopper bolt 62 is
Is fixed with a screw so as to be able to advance and retreat.
The head end of 2 can abut on a part of the recognition mark mounting plate 58. The sensor S is mounted on the mounting plate 58.

Therefore, in the state shown by the solid line in which the piston rod 59 is contracted in the air cylinder 60, the mounting plate 58 comes into contact with the stopper bolt 62 and stops, and the sensor S is located just above the outer peripheral edge of the wafer D. Located in. And
When the piston rod 59 is extended from the air cylinder 60 by a predetermined distance, as shown in the phantom line, the mounting plate 58 can move in the centrifugal direction apart from the stopper bolt 62. Therefore, the wafer D is placed on the outer peripheral guide 54 on the rotation receiving plate 49.
The mounting plate 58 can be retracted so as not to be an obstacle when dropped between the stopper bolts 62 and the stopper bolt 62
Can be dealt with when the diameter of the wafer D is 6 inches (shown by a solid line) and when it is 8 inches (shown by a virtual line).

Next, as shown in FIGS. 13 and 14, the transport hand device 8 has a robot hand 66 fixed on a support base 65 which can move independently of the screen printing machine 1. Carrier fixed frame 6 for loading cassette C
7, and a carrier fixing frame 68 displaced about 90 degrees therefrom are mounted and fixed on mounting tables 69, 70 having predetermined heights, respectively. Robot hand 66 is arm 7
An arm 74 is rotatably supported on the arm 71 so as to be rotatable about a shaft 73, and a hand 75 having a substantially Y-shape in plan view is provided at the tip of the arm 74. Are connected horizontally. The robot hand 66 is controlled and driven by a robot hand controller 76.

As shown in FIG. 14, the robot hand controller 76 scoops the wafer D in the cassette C fixed to the carry-in carrier fixing frame 67 with the hand 75, and
1 and 74, the wafer D on the hand 75 is placed between the outer peripheral guides 54 on the rotation receiving plate 49 of the rotation detecting device 7,
When the wafer D on which printing has been completed is mounted again on the rotary receiving plate 49 by the air chuck device 29, the wafer D is picked up again by the hand 75 and the arms 71 and 7 are moved.
4 is rotated and housed in the cassette C in the carrier fixing frame 68 for carrying out.

As shown in FIG. 15, the hand 75 is a yoke made of a plate and has yoke tips 76, 76.
Can be easily inserted between the wafers D stored sharply in the cassette C. On the upper surface of the hand 75, a projection 77 is provided on which the peripheral portion of the wafer D contacts. The diameter of the wafer D is 6
Since the difference is different between the case of inches and the case of 8 inches, the hand 75 itself is replaced to deal with the difference. 7
Reference numeral 8 denotes a screw hole for attaching and fixing the hand 75 to the arm 74.

The cassette C is a well-known cassette in which rack portions R having substantially the same size as the thickness of the wafer D are formed on both left and right sides of the inner surface of the box. Although the case is a case where the wafer D is stored in multiple stages in R, the wafer D is transported in a vertical state until it is mounted on the mounting table 69. Therefore, each wafer D often rotates at random due to vibration or the like at the time of transport of the cassette C, and the situation where all the wafers D are stored in the cassette C in the same state does not occur.

The operation of the solder printing apparatus for a wafer according to the above configuration will be described. The robot hand 66 operates to pick up one wafer D from the cassette C of the loading cassette frame 67 by the hand 75, By inserting D into a substantially circular surface surrounded by the outer peripheral guide 54 of the rotation detecting device 7, the wafer D is centrifugally dropped on the rotation receiving plate 49 by the interference at the tapered portion 54a, and the air suction pipe The wafer D is sucked and fixed to the rotation receiving plate 49 by the suction operation of the wafer 47. Then, the rotation receiving plate 49
Is rotated, the sensor S of the mounting plate 58 recognizes the recognition mark displayed at a specific position on the wafer D, the rotation of the rotation receiving plate 49 is stopped, and the lifting device 41 is driven to drive the shaft 4.
As the number 5 rises, the rotation receiving plate 49 lifts the wafer D above the outer peripheral guide 54 (see FIG. 9).

When the rotation receiving plate 49 is lifted, the transfer chuck device 6 is started, the wafer D is chucked by the air chuck device 29 and transferred to the printing table 3.
Placed on top. After that, the print table 3 moves to the wafer printing position (X in FIG. 2) and is located on the lower surface of the screen plate 4, the wafer D is confirmed by the camera 14, and the print table 3 can be moved to x, y, θ. Determine the exact printing position.
When the position of the printing table 3 is fixed, the printing table 3 rises toward and adheres to the screen plate 4, and the squeegee device 5 moves on the screen plate 4 to perform solder printing on the wafer D.

After the solder printing is completed, the print table 3 returns to the original position, the wafer D is again chucked and moved by the air chuck device 29 of the transfer chuck device 6, and the rotation detecting device 7 is in the raised state. Is placed on the rotation receiving plate 49. Then, the robot hand 66 operates again to pick up the wafer D on the rotary receiving plate 49 by the hand 75, and the arms 71 and 74 rotate to transfer the wafer D on the hand 75 to the cassette C in the unloading carrier fixing frame 68. Rack part R
To end. All of these operations are performed by an automatic controller, and the automatic control is performed by ordinary techniques that can be conceived in various ways.

Thus, by repeating the above operation, solder printing of a large number of wafers D stored in multiple stages in the cassette C in the carry-in cassette frame 67 is performed. Therefore, the wafer D is chucked by the air chuck device 31 at the rotation position of the wafer D where the recognition mark is recognized on the rotation detecting device 7 and is conveyed to the print table 3, and the position of the print table 3 is recognized by the camera 14. Corrected and accurate screen printing can be performed on the wafer D.

In the above embodiment, the wafer D after the printing is not returned to the rotation receiving plate 49 of the rotation detecting device 7 again, but from the side of the housing 2 facing the rotation receiving plate 49 in the same manner as the transfer hand device. The transfer may be carried out by a device, and the transfer hand device 8 may be another transfer device that can be used instead.

[0041]

According to the present invention described above, an apparatus for placing a disc-shaped wafer on a printing table of a screen printing machine so as to be at a predetermined angle is configured. Can be specified, and the image recognition scanning of the recognition mark can be speeded up. In addition, it is not necessary to perform the trouble of transferring the wafer to the print table by the transfer chuck device after aligning the angle of the wafer with another device, and it is possible to prevent the displacement that may occur in that case.

Also, since the air chuck device holds the wafer with an odd number of catchers, the print table on which the wafer is mounted only needs a small notch for the chuck, and it is possible to improve the printing finish. it can. Further, since the wafer is gripped by an odd number of catchers, the center of the wafer is brought closer to the chuck center when the wafer is gripped, so that variations in the position of the wafer on the printing table are reduced and image recognition is further ensured. .

Further, since the outer peripheral guide is provided with a tapered portion for bringing the center position of the wafer to the axis of the rotation receiving plate, the center position of the wafer becomes substantially constant when the wafer is placed on the rotation receiving plate. It is not necessary to adjust the position of the vessel for each wafer, and the efficiency is improved. In addition, since the recognition mark is almost at the same position, there is an economical advantage that the sensor can be performed by a fiber sensor or the like without complicated image processing.

Since the projection of the hand of the transfer hand device is provided, the center position of the wafer can be determined to a certain extent when the robot hand operates and picks up the wafer with the hand, and the wafer is placed on the rotary receiving plate. Since the center position of the wafer is substantially constant at the time of placing, it can contribute to the specification of the wafer position in combination with the outer peripheral guide, and the image recognition scanning of the recognition mark can be further assured.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing an overall configuration of the present invention.

FIG. 2 is a plan view schematically showing an overall configuration of the present invention.

FIG. 3 is an enlarged front view of the transport chuck device shown in FIGS. 1 and 2;

FIG. 4 is a plan view of the transport chuck device.

FIG. 5 is a side view of the transport chuck device.

FIGS. 6A and 6B are explanatory diagrams of the operation of the transport chuck device.

FIG. 7 is a front view of the air chuck device.

FIGS. 8A and 8B are front views of main parts of the air chuck device, respectively.

FIG. 9 is a schematic vertical sectional front view showing the configuration of the rotation detecting device.

FIG. 10 is a schematic vertical sectional side view showing a configuration of a rotation detecting device.

FIG. 11 is a plan view of the rotation detecting device.

FIG. 12 is a front view of a main part of the rotation detecting device.

FIG. 13 is a front view of the transfer hand device.

FIG. 14 is a plan view of the transfer hand device.

FIG. 15A is a plan view showing a robot hand, and FIG. 15B is a front view thereof.

[Explanation of symbols]

C: Cassette D: Wafer R: Rack S: Detector 1: Screen printing machine 2: Housing 3: Printing table 4: Screen plate 5: Squeegee device 6: Transfer chuck device 7: Rotation detecting device 8: Transfer hand device 29 ... Air chuck device 31 ... Air chuck body (rotary actuator) 32 ... Arm 32a ... Pin 33 ... Catcher 49 ... Rotation receiving plate 54 ... Outer periphery guide 54a ... Tapered part 66 ... Robot hand 67 ... Carrier fixed frame 68 for carrying out Carrier fixing frame 75 ... Hand 77 ... Protrusion

Claims (6)

[Claims] 1. A solder printing apparatus for a wafer, comprising: a screen printing machine having a rotation detecting device for positioning a wafer mounted on a printing table at a predetermined angle. 2. A screen printing machine having a transfer chuck device for chucking a wafer and carrying the wafer onto a printing table, and a screen is provided near an opening of the housing where the transfer chuck device advances and retreats. The rotation receiving plate rotates upon receiving the rotation, and a rotation detecting device having a sensor for detecting a recognition mark displayed on the wafer at the time of the rotation, and a transfer for taking out the wafer from the loading carrier cassette and transferring the wafer to the rotation detecting device A solder printing apparatus for a wafer, comprising: an apparatus; and an automatic controller for controlling the apparatus. 3. A screen printing machine provided with a transfer chuck device for chucking a wafer and loading it onto a printing table, and chucking and unloading the wafer after solder printing, and transferring the housing of the screen printing machine. A rotation detecting device provided near the opening where the chuck device advances and retreats, the rotation receiving plate on which the wafer is transferred and receiving it rotates, and a sensor for detecting a recognition mark displayed on the wafer at the time of rotation; ,
A transfer hand device that takes out the wafer from the carry-in carrier cassette and transfers the wafer to the rotation detection device, and stores the wafer transferred to the rotation detection device by the transfer chuck device after the screen printing, in the carry-out carrier cassette; , And an automatic controller for controlling them. 4. An outer peripheral guide having a tapered portion with which the outer peripheral edge of the wafer comes into contact is radially arranged around the upper portion of the rotation receiving plate in the rotation detecting device, and the wafer centripetally falls on the rotation receiving plate. The solder printing apparatus for a wafer according to any one of claims 1 to 3, wherein: 5. A mechanism for chucking a wafer in the transfer chuck device is an air chuck device in which a catcher for holding an outer peripheral edge of a wafer is attached to an end of an odd number of arms which can be moved forward and backward by an air-driven actuator. The wafer solder printing apparatus according to claim 2 or 3, wherein: 6. The hand in the transport hand device,
The wafer solder printing apparatus according to any one of claims 3 to 5, wherein a projection is formed on a plate body having a substantially Y-shape in plan view so that an outer peripheral edge of the wafer abuts.