JPS5715434A - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
JPS5715434A
JPS5715434A JP9011480A JP9011480A JPS5715434A JP S5715434 A JPS5715434 A JP S5715434A JP 9011480 A JP9011480 A JP 9011480A JP 9011480 A JP9011480 A JP 9011480A JP S5715434 A JPS5715434 A JP S5715434A
Authority
JP
Japan
Prior art keywords
chip
holder
container
deviation
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9011480A
Other languages
Japanese (ja)
Inventor
Toru Tachikawa
Toshinobu Banjo
Koichi Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9011480A priority Critical patent/JPS5715434A/en
Publication of JPS5715434A publication Critical patent/JPS5715434A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Abstract

PURPOSE:To enhance the positioning accuracy in a flip chip type apparatus by detecting a chip position in a moving path of a holder adsorbing a chip and controlling the relative position of the chip and a container according to the deviation in the position being compouted. CONSTITUTION:A chip 4 positioned at the holding position A is adsorbed with a holder 7 at a holding section 1. An XY table 8 is driven to move the holder 7 to the joining position B where a container is positioned. Once the holder 7 is stopped at the detecting position, a detector 10 with a TV camera, for instance, detects the relative position between the chip 4 and the holder 7 and an arithmetic device 10 calculated the deviation in the position of the chip 4 from the detection signal. Based on the results, while the movement of the table 8 is controlled (or the position of the container is corrected), the chip 4 is carried to the joining position B and joined with the container. This enables the correction of any deviation during the adsorption of the chip thereby accomplishing a highly accurate bonding with a correct positioning.
JP9011480A 1980-06-30 1980-06-30 Bonding apparatus Pending JPS5715434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9011480A JPS5715434A (en) 1980-06-30 1980-06-30 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9011480A JPS5715434A (en) 1980-06-30 1980-06-30 Bonding apparatus

Publications (1)

Publication Number Publication Date
JPS5715434A true JPS5715434A (en) 1982-01-26

Family

ID=13989479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9011480A Pending JPS5715434A (en) 1980-06-30 1980-06-30 Bonding apparatus

Country Status (1)

Country Link
JP (1) JPS5715434A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972145A (en) * 1982-10-19 1984-04-24 Shinkawa Ltd Device and method for flip chip bonding
JPS6128826A (en) * 1984-04-27 1986-02-08 リ−ロイ　ジ−　ハゲンブツク Device and method responding to loading type measurement of rear deck load for truck
JPS6235641A (en) * 1985-08-09 1987-02-16 Fujitsu Ltd Chip positioning system
JPS62249438A (en) * 1986-04-23 1987-10-30 Hitachi Tokyo Electron Co Ltd Bonding device
JPH01149429A (en) * 1987-12-04 1989-06-12 Nec Corp Mounting of semiconductor pellet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method
JPS5510507A (en) * 1978-07-08 1980-01-25 Nippon Telegr & Teleph Corp <Ntt> Test transfer device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method
JPS5510507A (en) * 1978-07-08 1980-01-25 Nippon Telegr & Teleph Corp <Ntt> Test transfer device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972145A (en) * 1982-10-19 1984-04-24 Shinkawa Ltd Device and method for flip chip bonding
JPH0212024B2 (en) * 1982-10-19 1990-03-16 Shinkawa Kk
JPS6128826A (en) * 1984-04-27 1986-02-08 リ−ロイ　ジ−　ハゲンブツク Device and method responding to loading type measurement of rear deck load for truck
JPS6235641A (en) * 1985-08-09 1987-02-16 Fujitsu Ltd Chip positioning system
JPH0525178B2 (en) * 1985-08-09 1993-04-12 Fujitsu Ltd
JPS62249438A (en) * 1986-04-23 1987-10-30 Hitachi Tokyo Electron Co Ltd Bonding device
JPH0691122B2 (en) * 1986-04-23 1994-11-14 日立東京エレクトロニクス株式会社 Bonding device
JPH01149429A (en) * 1987-12-04 1989-06-12 Nec Corp Mounting of semiconductor pellet

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